JP5925666B2 - Component mounting apparatus and backup pin insertion position data creation method - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting a component by holding a substrate at a plurality of substrate holding positions using an existing backup pin, and a backup pin insertion position data creation method used for this component mounting apparatus.

A conventional general component mounting apparatus includes a substrate transfer path for transferring a component mounting substrate and a head unit for mounting an electronic component (hereinafter simply referred to as a component) on the substrate. The substrate transport path has a function of holding the substrate at a predetermined substrate holding position. The substrate is held at the substrate holding position while being supported by a plurality of backup pins from below.
When components are mounted on the lower surface of the substrate in advance, the backup pin is arranged so as to support a position avoiding the components on the lower surface of the substrate, as described in Patent Document 1, for example.

The head unit includes a suction nozzle that sucks a component, and is configured to be movable between the component supply device and the substrate transport path. In many cases, only one head unit is provided, but the component mounting apparatus described in Patent Document 2 is provided with a total of two on the upstream side and the downstream side.
The component mounting apparatus disclosed in Patent Document 2 can mount components using two head units on a single substrate held in a substrate conveyance path.
By the way, in recent years, along with the increase in size of electronic equipment, a long substrate having a size exceeding the range in which components can be mounted by a head unit has been produced. In order to mount an electronic component on such a long substrate, two head units are used, and after the component is mounted on the upstream head unit, the holding position of the substrate is changed, and the downstream head unit is mounted. It is conceivable to perform component mounting with.

Japanese Patent No. 4402920 Japanese Patent No. 3818029

  However, when mounting components on a long substrate, if component mounting is performed multiple times, there is a problem that mounting efficiency is lowered when the components are previously mounted on the lower surface of the substrate. This is because if the board holding position changes, components on the lower surface of the board may hit the backup pins. That is, in order to avoid interference between the component and the backup pin, it is necessary to change the position of the backup pin to a position where the component does not hit the component when changing the substrate holding position, so that the mounting efficiency is lowered.

  The present invention has been made to solve such a problem, and provides a component mounting apparatus capable of mounting components with high mounting efficiency on the upper surface of a long substrate having components mounted on the lower surface. This is the first purpose. It is a second object of the present invention to provide a backup pin insertion position data creation method in which backup pins can be arranged at positions that do not interfere with components on the lower surface of the board at any of a plurality of board holding positions. And

  In order to achieve this object, the component mounting apparatus according to the present invention includes a substrate transfer path formed to be able to transfer a substrate for mounting components and to be held at a plurality of substrate holding positions in the transfer direction, and the board transfer path. A plurality of upstream head units for mounting components on the substrate on the upstream side, downstream head units for mounting components on the substrate on the downstream side of the substrate transport path, and a plurality of backup pins for supporting the substrate. A backup pin support plate in which an insertion hole is formed and disposed below the plurality of substrate holding positions; and a control device that controls movement of the substrate on the substrate conveyance path and component mounting by the both head units. The board has a first board area where components are mounted by the upstream head unit and components are mounted by the downstream head unit. A second board region is set, components are pre-mounted on the lower surface of the board, and the board transport path can be mounted on the board using the upstream head unit. An area and a second mountable area on which the component can be mounted on the board using the downstream head unit, and the control device includes a position, a shape, and a position of the board mounted on the lower surface of the board. A first condition relating to the presence / absence of the backup pin, and the position of the backup pin, the board mounting data including the shape, and the backup pin position data including the position of the backup pin on the current backup pin support plate The predetermined mounting control is started after the second condition and the third condition relating to the substrate holding position are satisfied, and the first condition is The backup pin inserted into the insertion hole is present, and the second condition is that the substrate is arranged at the substrate holding position, the components on the lower surface of the substrate based on the substrate mounting data, and the backup The backup pin that does not interfere with the backup pin based on the pin position data and that contacts the lower surface of the substrate is present, and the third condition is a substrate holding position that satisfies the second condition. A first substrate holding position where the substrate can be held such that the first substrate region is located within the first mountable region, and the second substrate region is within the second mountable region. And the second substrate holding position where the substrate can be held so as to be positioned, and the predetermined mounting control is started, so that the first substrate holding position is reached. The substrate is held and the component is mounted on the first substrate region by the upstream head unit, and then the substrate is held at the second substrate holding position and the component is mounted on the second substrate region by the downstream head unit. It is characterized by being.

  In addition, the component mounting apparatus according to the present invention includes a substrate transport path formed so as to be capable of transporting a component mounting board and capable of being held at a plurality of board holding positions in the transport direction, and the board on the upstream side of the board transport path. An upstream head unit for mounting components, a downstream head unit for mounting components on the substrate on the downstream side of the substrate transport path, and a plurality of insertion holes for inserting backup pins for supporting the substrate. A backup pin support plate disposed below the plurality of substrate holding positions, and a control device that controls movement of the substrate on the substrate conveyance path and component mounting by the two head units. A first substrate area where components are mounted only by the upstream head unit, and a second region where components are mounted only by the downstream head unit. A board region and a third substrate region where components are mounted by both the upstream head unit and the downstream head unit are set, and components are mounted in advance on the lower surface of the substrate, and the substrate transport path Is a first mountable region where components can be mounted on the substrate using the upstream head unit, and a second mountable region where components can be mounted on the substrate using the downstream head unit, A third mountable area in which components can be mounted on the board using both the upstream head unit and the downstream head unit, and the control device positions components mounted on the lower surface of the board. Board mounting data including shape and board shape, and backup pin position data including the position of the backup pin on the current backup pin support plate, and The predetermined mounting control is started after the first condition relating to the presence or absence of the up pin, the second condition relating to the position of the backup pin, and the third condition relating to the substrate holding position are satisfied, The first condition is that a backup pin inserted into the insertion hole is present, and the second condition is based on the board mounting data on the assumption that a board is arranged at the board holding position. The back-up pin that does not interfere with the back-up pin based on the back-up pin position data and the component on the bottom surface of the substrate is present, and the third condition is the second condition The first substrate holding position where the substrate can be held such that the first substrate region is located in the first mountable region at the substrate holding position that satisfies the condition A second substrate holding position capable of holding the substrate such that the second substrate region is located in the second mountable region, and the third substrate region is in the third mountable region. All the substrate holding positions with the third substrate holding position capable of holding the substrate so as to be positioned at the position, and the first substrate holding is started when the predetermined mounting control is started. The board is held at a position, and the component is mounted on the first board area by the upstream head unit. Subsequently, the board is held at the third board holding position, and the upstream head unit and the downstream are placed on the third board area. The component is mounted by both the side head unit and the substrate is held at the second substrate holding position, and then the component is mounted by the downstream head unit on the second substrate region.

  The present invention further includes a display device according to the invention, and the control device simultaneously arranges the substrates at the plurality of substrate holding positions when the first condition or the second condition is not satisfied. It is assumed that these substrates, components mounted on the lower surfaces of these substrates, and a plurality of insertion holes of the backup pin support plate are superimposed on the display device as a perspective view in a state viewed from above. In the perspective view, among the plurality of insertion holes, an insertion hole that does not overlap with the part and overlaps with a part where no part exists on the substrate is displayed so as to be distinguishable from other insertion holes. It is characterized by being.

  The present invention further provides a backup pin holding part for storing and holding a plurality of backup pins, and a backup pin for conveying the backup pin from the backup pin holding part and inserting the backup pin into the insertion hole where no backup pin exists. An implanting device, wherein the control device assumes that the substrates are simultaneously arranged at the plurality of substrate holding positions when the first condition is not satisfied, and faces the components on the lower surface of the substrates. And detecting the insertion hole at a position facing the lower surface of the substrate, and transporting and inserting the backup pin from the backup pin holding portion into the insertion hole by the backup pin transplanter. Features.

  The backup pin insertion position data creation method according to the present invention is a backup pin insertion position data creation method implemented by the component mounting apparatus, wherein the plurality of board holding positions and the plurality of insertion hole position data, and the board A virtual placement step that assumes that a board is placed at each of a plurality of board holding positions at the same time based on the board mounting data including the position of the component mounted on the lower surface of the board and the board shape, and the plurality of insertion holes. Among them, a selection step for selecting an insertion hole that does not overlap with the component when viewed from above and overlaps a portion where no component exists on the substrate, and data for creating the position of the insertion hole selected by the selection step as data And a creation step.

In the present invention, since component mounting is performed at two locations, the first substrate holding position and the second substrate holding position, it is possible to mount components on a long substrate. Since there are two board holding positions, the time during which mounting is interrupted is minimized, and it is not necessary to change the position of the back-up pin when changing the board, so that parts can be mounted with high mounting efficiency. it can.
Therefore, according to the present invention, it is possible to provide a component mounting apparatus capable of mounting components with high mounting efficiency on the upper surface of a long substrate having components mounted on the lower surface.

  Further, by adopting a configuration in which components are mounted on a substrate using both head units in a third mountable region where components can be mounted by two head units, a component mounting apparatus with even higher mounting efficiency is provided. be able to.

  According to the backup pin insertion position data creation method according to the present invention, position data indicating the position of the backup pin that does not come into contact with the components on the lower surface of the board at all board holding positions can be obtained with high accuracy.

It is a top view of the component mounting apparatus which concerns on this invention. It is a block diagram which shows the structure of the component mounting apparatus which concerns on this invention. It is a schematic diagram for demonstrating a 1st board | substrate holding position. It is a schematic diagram for demonstrating a 2nd board | substrate holding position. It is a flowchart for demonstrating a mounting preparation program. It is a schematic diagram which shows the state by which 2nd conditions are satisfy | filled. It is a flowchart for demonstrating a mounting program. 4 is a flowchart for explaining a backup pin insertion position data creation method according to the present invention. The figure which shows a board | substrate and a backup pin support plate, the same figure (A) shows the state by which the virtual board | substrate and the backup pin support plate are displayed on the display apparatus, and the same figure (B) shows the virtual board | substrate. FIG. 10C shows a state in which a component on the lower surface is added. FIG. 10C shows a state in which a virtual substrate is added to the second substrate holding position. FIG. Indicates the selected state. FIG. 6A is a schematic diagram for explaining the second embodiment, and FIG. 5A shows a state where the first substrate region is located in the first mountable region, and FIG. A state in which the third substrate region is located in the third mountable region is shown, and FIG. 10C shows a state in which the second substrate region is located in the second mountable region. It is a flowchart which shows the other example of a mounting program. 10 is a flowchart for explaining another example of a method for determining an optimum second substrate holding position. FIG. 5A is a schematic diagram for explaining another example of a method for determining an optimal second substrate holding position, and FIG. 5A shows a state in which the substrate is located at the first substrate holding position. (B) shows a state in which the substrate is located at the first second substrate holding position, and FIG. 6 (C) shows a state in which the substrate is located at the second second substrate holding position. Show.

(First embodiment)
Hereinafter, an embodiment of a component mounting apparatus and a backup pin insertion position data creation method according to the present invention will be described in detail with reference to FIGS.
A component mounting apparatus 1 shown in FIG. 1 is configured by mounting various devices to be described later on a base 2 formed in a square shape in a plan view. A substrate transport path 3 extending in the left-right direction (hereinafter, this direction is referred to as the X direction) in FIG. 1 is provided at the center of the base 2 shown in FIG. 1 in the vertical direction (hereinafter, this direction is referred to as the Y direction). ing. This board conveyance path 3 is for carrying the electronic component mounting board 4 from the right side to the left side in FIG.

The substrate transport path 3 is constituted by a conveyor device 5 having a pair of transport belts 3a and 3b that support both ends of the substrate 4 in the Y direction. The substrate 4 is placed on the conveyor belts 3a and 3b, and moves in the horizontal direction as the belts 3a and 3b rotate.
The substrate transport path 3 is provided with a plurality of substrate stoppers 6 to 13 for holding the substrate 4 at a plurality of substrate holding positions in the X direction.

The substrate 4 comes into contact with any one of the plurality of substrate stoppers 6 to 13, so that the movement toward the downstream side in the transport direction is restricted and stopped. This stopped position becomes the substrate holding position. That is, there are as many substrate holding positions as the substrate stoppers 6 to 13. For example, as shown in FIG. 1, eight substrate holding positions can be provided in one substrate transport path 3. Hereinafter, when one of these substrate holding positions is specified, it is expressed as, for example, “first substrate holding position from the upstream side”.
The operations of the conveyor device 5 and the substrate stoppers 6 to 13 are controlled by a control device 14 (see FIG. 2) described later.

  A substrate clamping device 15 is provided in the vicinity of the substrate transport path 3 in order to fix the substrate 4 to the base 2 at the substrate holding position. The substrate clamping device 15 has a function of pushing the substrate 4 upward from the transfer belts 3a and 3b and a function of fixing both ends of the substrate 4 in the Y direction vertically. The function that the substrate clamping device 15 pushes the substrate 4 upward is realized by using a backup pin support plate 16 disposed below the substrate holding position.

  As shown in FIG. 1, the backup pin support plate 16 is formed in a size that is positioned below all substrate holding positions, and is supported by a lifting device (not shown). The backup pin support plate 16 is provided with a large number of insertion holes 18 in the entire region in the X direction and the Y direction, and a large number of backup pins 17 are removably inserted into the large number of insertion holes 18 from above. It is provided upright in a state extending in the vertical direction. Although the backup pin 17 shown in FIG. 1 is provided only on a part of the backup pin support plate 16, it can be provided in the entire X direction and Y direction of the backup pin support plate 16.

  The plurality of insertion holes 18 are provided in a state of being spaced apart with a predetermined interval in the X direction and the Y direction. Further, the positions of these many insertion holes 18 are recorded as insertion hole position data 20 in a backup pin insertion hole position data holding unit 19 (see FIG. 2) of the control device 14 to be described later. The positions of the backup pins 17 inserted into these insertion holes 18 are recorded as backup pin position data 22 in the backup pin insertion position data holding unit 21 of the control device 14.

  Component supply devices 23 and 23 for supplying electronic components (hereinafter simply referred to as components) are provided at both ends in the Y direction of the base 2 shown in FIG. The component supply devices 23 and 23 are configured by arranging a large number of tape feeders 24 side by side in the X direction. The components are sucked by a suction nozzle (not shown) of a component moving device 25 (to be described later) in these tape feeders 24 and transferred onto the substrate 4 on the substrate transport path 3 by the component moving device 25. Component recognition cameras 26 and 26 are provided between the component supply devices 23 and 23 and the board conveyance path 3. The component recognition cameras 26 and 26 are for imaging the component moved by the component moving device 25 from below. The operations of the component recognition cameras 26 and 26 are controlled by the control device 14 described later.

  Of the two component supply devices 23, 23, a backup pin is provided between the component supply device 23 positioned on the front side of the base 2 in FIG. Holding parts 27 are provided. These backup pin holders 27 and 27 are for storing and holding a plurality of backup pins 17. The backup pin holders 27 and 27 hold a plurality of backup pins 17 so that they can be attached and detached from above in a state of extending in the vertical direction.

  As shown in FIG. 1, the component moving device 25 includes a pair of Y rail units 31 and 31 provided on both ends of the base 2 in the X direction, and the Y rail units 31 and 31 in the Y direction. The X rail unit 32 is movably supported, and the upstream head unit 33 and the downstream head unit 34 are supported by the X rail unit 32 so as to be movable in the X direction.

The X rail unit 32 moves in the Y direction by being driven by a Y axis driving device 35 provided in one Y rail unit 31.
The upstream head unit 33 and the downstream head unit 34 are respectively composed of a plurality of suction heads 36, a Z-axis drive device 37 (see FIG. 2), an R-axis drive device 38, an X-axis drive device 39, and a substrate camera. 40, a pin transplanter 41, and the like.

The suction head 36 includes a suction nozzle (not shown) for sucking parts, and is supported by both head units 33 and 34 so as to be movable in the vertical direction, and is also supported so as to be rotatable around an axis in the vertical direction. Has been.
The Z-axis drive devices 37 and 37 are used to raise and lower the suction head 36 individually.
The R-axis drive devices 38, 38 rotate the suction head 36 individually about the vertical axis.

The X-axis drive devices 39 and 39 are for independently moving the head units 33 and 34 along the X rail unit 32 in the X direction.
The substrate cameras 40 and 40 are for imaging each substrate 4 held at a plurality of substrate holding positions from above. The plurality of image data obtained by the substrate cameras 40 and 40 are sent to the control device 14 and used to detect the position of each substrate 4 held at the plurality of substrate holding positions by the control device 14.

  The pin transplanting devices 41 and 41 are for moving the backup pin 17 between the backup pin support plate 16 and the backup pin holding portions 27 and 27. The pin transplanting devices 41 and 41 have a function of holding one backup pin 17 from above. In this embodiment, the pin transplanter 41, 41 constitutes a “backup pin transplanter” according to the invention of claim 4. The pin transplanting devices 41 and 41 and the substrate cameras 40 and 40 are provided at both ends of the head units 33 and 34 in the X direction, respectively.

The operation of each device and board camera 40, 40 provided in the component moving device 25 is controlled by the control device 14.
As shown in FIG. 2, the control device 14 is connected to the above-described devices, the input device 42, the output device 43, and the like, and has a functional unit 44 that realizes various functions. The input device 42 is for an operator (not shown) to input predetermined data, and is configured by a keyboard, a mouse, and the like, although not shown in detail.
The output device 43 includes a display device 45, an alarm device (not shown), and the like. The display device 45 displays the operating state of the component mounting apparatus 1, the operation status of the control device 14, the work contents to be performed by the worker, and the like.

The functional unit 44 of the control device 14 includes a conveyor control unit 46, a board stopper control unit 47, a board clamping device control unit 48, a component moving device control unit 49, an image processing unit 50, and a calculation calculation unit 51. A calculation program holding unit 52, a data holding unit 53, and the like.
The conveyor control unit 46 controls the operation of the conveyor device 5. The substrate stopper controller 47 controls the operation of the substrate stoppers 6 to 13.

  The substrate clamp device controller 48 controls the operation of the substrate clamp device 15. The component moving device control unit 49 controls the operation of the component moving device 25. The image processing unit 50 performs image processing on the imaging data obtained by the component recognition camera 26 to obtain data indicating the presence / absence of a component, a suction position, a suction state, and the like. Further, the image processing unit 50 performs image processing on each imaging data obtained by the substrate cameras 40 and 40 and the component recognition cameras 26 and 26 to indicate the position of each substrate 4 and each component suction position with respect to each suction head 36. Get the data.

  The calculation calculation unit 51 executes a mounting preparation program 54 recorded in the calculation program holding unit 52 and a mounting program 55 for mounting components on the board 4. Although the details will be described later, the mounting preparation program 54 enables component mounting without changing the position of the backup pin 17 as much as possible when the component mounting board 4 changes. It is a program for. By executing the mounting preparation program 54, an optimal board holding position is determined when components are mounted on one board 4 by the upstream head unit 33 and the downstream head unit 34.

  The optimal board holding position here means that the components mounted in advance on the lower surface of the board 4 do not interfere with the backup pins 17 that are already erected on the backup pin support plate 16, and the backup pins The position 17 is in contact with the lower surface of the substrate 4. As the board holding position, as shown in FIG. 3, the first board holding position P1 for mounting the component by the upstream head unit 33 and the component mounting by the downstream head unit 34 as shown in FIG. A second substrate holding position P2 to be set is set.

  These first and second substrate holding positions P 1 and P 2 are recorded as substrate holding position data 57 in the calculated substrate holding position data holding unit 56 of the control device 14. The substrate holding position data 57 includes data that can specify the other six substrate holding positions on the substrate transport path 3 in addition to the data that can specify the first and second substrate holding positions P1 and P2. It is included.

The first substrate holding position P1 and the second substrate holding position P2 are set so that components can be mounted over the entire area of the elongated substrate 4 using the upstream head unit 33 and the downstream head unit 34. Yes. Here, the long shape means that the length of the substrate 4 in the X direction is longer than the length of the first mountable region A1 shown in FIG. 3 or the second mountable region A2 shown in FIG. 4 in the X direction. Say.
The first mountable area A <b> 1 is an area where components can be mounted on the board conveyance path 3 using the upstream head unit 33.
The second mountable area A <b> 2 is an area where components can be mounted on the board conveyance path 3 using the downstream head unit 34. These first and second mountable areas A 1 and A 2 are recorded as mountable area data 59 in the mountable area data holding unit 58 of the control device 14.

  The shape including the dimensions of the substrate 4 is recorded as the substrate mounting data 61 in the substrate mounting data holding unit 60 of the control device 14. The board mounting data 61 includes, in addition to the board 4 data, the shape, mounting position and mounting direction of the component mounted on the lower surface of the substrate 4, the type of component mounted on the upper surface of the substrate 4, the shape of the component, The mounting position, mounting direction, etc. are also recorded.

  As shown in FIGS. 3 and 4, the substrate 4 according to this embodiment has a first board region B1 in which components are mounted by the upstream head unit 33 and a component in which components are mounted by the downstream head unit 34. Two substrate regions B2 are set. These first and second substrate regions B 1 and B 2 are recorded as substrate region data 63 in the substrate region data holding unit 62 of the control device 14.

As shown in FIG. 3, the first substrate holding position P1 described above is set so that the first substrate region B1 falls within the first mountable region A1.
Further, as shown in FIG. 4, the second substrate holding position P2 is set so that the second substrate region B2 falls within the second mountable region A2.

  Here, the mounting preparation program 54 will be described in detail based on the flowchart shown in FIG. The mounting preparation program 54 removes all the backup pins 17 used for the board 4 before switching from the insertion hole 18 when the board 4 to be mounted is switched and switching is performed, and after switching. It was used for the substrate 4 before switching, instead of replacing the backup pin 17 which takes many steps and time, such as arranging a large number of backup pins 17 in a position suitable for the substrate 4. Of the large number of backup pins 17, the backup pins 17 at usable positions are used as they are without being removed from the insertion holes 18 so as to improve the efficiency of the setup change.

  When the mounting preparation program 54 is executed, first, as shown in step S1 of the flowchart shown in FIG. 5, the board mounting data 61 and the machine data are read. The machine data is data indicating the current state of the mounting apparatus 1. That is, the machine data includes insertion hole position data 20, backup pin position data 22, board holding position data 57, mountable area data 59, board area data 63, and the like.

Next, as shown in step S2, it is determined whether or not the first condition regarding the presence or absence of the backup pin 17 is satisfied. The first condition is that the backup pin 17 inserted into the insertion hole 18 exists. If there is no backup pin 17 inserted into the insertion hole 18, the process proceeds to a backup pin mounting step S3 described later.
If the backup pin 17 has already been inserted into the insertion hole 18, the variable n is set to 1 in step S4, and the process proceeds to step S5.

  In step S5, it is determined whether or not the second condition regarding the position of the backup pin 17 is satisfied for the nth substrate holding position counted from the upstream side among the plurality of substrate holding positions of the substrate transport path 3. Is done. This second condition assumes that the substrate 4 is arranged at the nth substrate holding position from the upstream side, and the components mounted on the lower surface of the virtual substrate 4 do not interfere with the backup pin 17. In addition, there are backup pins 17 in contact with the lower surface of the substrate 4. The position of the component on the lower surface of the board is specified based on the board mounting data 61. The position of the backup pin 17 is specified based on the backup pin position data 22.

  The second condition is satisfied, for example, as shown in FIG. In FIG. 6, the backup pin 17 attached to the backup pin support plate 16 is illustrated by a black circle. The backup pin 17 shown in FIG. 6 does not exist at a position where the backup pin 17 interferes with the component 71 mounted on the lower surface of the substrate 4 and exists in a void in the substrate 4 where the component 71 is not provided.

  If it is determined in step S5 that the second condition is not satisfied, the process proceeds to step S7 described later. When it is determined that the second condition is satisfied, in step S6, the type of the substrate holding position is determined in association with the position specified by the value of the variable n, and the calculated substrate holding position data holding unit 56 is recorded as provisional registration.

  As the type of the substrate holding position, the first substrate region B1 of the substrate 4 held at the substrate holding position is the first substrate holding position P1 located in the first mountable region A1, or the substrate holding position. There are three types of the second substrate region B2 of the substrate 4 held in the second substrate holding position P2 located in the second mountable region A2, or an unnecessary substrate holding position that is neither of them, Two types of first substrate holding position P1 and second substrate holding position P2 are provisionally registered in association with the position specified by the value of the variable n. FIG. 3 shows an example of the first substrate holding position P1 where the first substrate region B1 of the substrate 4 is located in the first mountable region A1. FIG. 4 shows an example of the second substrate holding position P2 where the second substrate region B2 of the substrate 4 is located in the second mountable region A2.

  Next, as shown in step S7, it is determined whether or not the variable n is smaller than 8. The numerical value “8” is the total number of substrate holding positions that can be set on the substrate transport path 3. If the variable n is smaller than 8, 1 is added to the variable n in step S8, and the process returns to step S5 to determine whether or not the second substrate holding position satisfies the second condition. In step S7, when it is determined that the value of the variable n is not smaller than 8, that is, after determining whether or not each of the eight substrate holding positions satisfies the second condition, step S9 is performed. As shown in FIG. 4, it is determined whether or not the total number of temporarily held substrate holding positions is 2 or more.

  If the provisional registration number is less than 2, the process proceeds to step S10, and a character or a pattern indicating that the backup pin 17 is removed from the insertion hole 18 is displayed on the display device 45. The operator sees this display and pulls out all the backup pins 17, or operates the head unit pin transplanter 41 to remove the backup pins 17, and then proceeds to a backup pin mounting step S 3 described later.

  If the temporary registration number is 2 or more, as shown in step S11, it is determined whether or not the third condition relating to the substrate holding position is satisfied. The third condition is that among the substrate holding positions satisfying the second condition described above, the first substrate holding position P1 as shown in FIG. 3 and the second substrate holding position P2 as shown in FIG. Both are present.

  If this third condition is not satisfied, the process proceeds to step S10. When the third condition is satisfied, as shown in step S12, the first substrate holding position P1 and the second substrate holding position P2 are recorded in the calculated substrate holding position data holding unit 56 as the main registration. At this time, when one or both of the first substrate holding position P1 and the second substrate holding position P2 are two or more, the substrate held at that position among the plurality of first substrate holding positions P1. 4, the first board holding position closest to the component recognition camera 26 is selected and registered, and among the plurality of second board holding positions P 2, the center of the board 4 is held at that position. By selecting and registering the second board holding position closest to the recognition camera 26, the movement distance of the head units 33 and 34 after component recognition at the time of mounting is shortened so as to improve efficiency. Thereafter, as shown in step S13, component mounting is performed. This component mounting is performed based on the mounting program 55.

  The mounting program 55 is configured as shown in the flowchart of FIG. When the mounting program 55 is executed, first, as shown in step S100 of the flowchart shown in FIG. 7, the substrate 4 is transported and fixed to the first substrate holding position P1 (see FIG. 3). Then, as shown in step S <b> 101, components are mounted on the first board region B <b> 1 of the board 4 by the upstream head unit 33.

  Next, as shown in step S102, the substrate 4 is transported to the second substrate holding position P2 and fixed (see FIG. 4). Then, as shown in step S <b> 103, components are mounted on the second board region B <b> 2 of the board 4 by the downstream head unit 34. After component mounting is completed in this way, the substrate 4 is sent to the downstream end of the substrate conveyance path 3 and carried out as shown in step S104. The component mounting apparatus 1 mounts components on the plurality of long substrates 4 by repeating the above steps S100 to S104.

  The backup pin attaching step S3 is executed as shown in the flowchart of FIG. Although details will be described later in the backup pin mounting step S3, the lower surface of the substrate 4 is displayed on the display device 45 for each of a plurality of substrate holding positions, and the backup pins 17 that do not interfere with components at all the substrate holding positions. The target position is determined. Thereafter, the backup pin 17 is actually arranged at the target position.

  In the backup pin mounting step S3, first, as shown in step S200 of the flowchart shown in FIG. 8, board mounting data 61 and machine data are read. These board mounting data 61 and machine data are the same data as the data read in step S1 of the flowchart shown in FIG.

  Then, as shown in step S201, the number of times a substrate is fixed a is calculated. The board fixing frequency a is calculated based on the lengths of the first mountable area A1 and the second mountable area A2 in the X direction and the length of the board 4 in the X direction. For example, when the length in the X direction of the substrate 4 does not reach twice the length in the X direction of the first mountable region A1 or the second mountable region A2, that is, as shown in FIGS. In this case, the number of times of substrate fixation a is 2.

  Next, as shown in step S202, the variable m used for counting the number of drawing is initialized, and the variable m is set to 1. The number of times of drawing is the number of times that the lower surface of the virtual substrate 4 is displayed on the display device 45. Although the details will be described later, the lower surface of the virtual substrate 4 is displayed on the display device 45 by the number of times the substrate is fixed, changing the position in the X direction each time.

Thereafter, as shown in step S203, substrate data on the lower surface of the substrate 4 (external shape, dimensions, component position, shape, etc.) of the substrate 4 is read from the substrate mounting data 61. In step S204, the display device 45 reads the substrate 4 into the display device 45. A graphic view showing the shape of is displayed.
After the virtual substrate 4 is displayed on the display device 45 in this way, as shown in step S205, it is determined whether there is a substrate holding position that is not displayed. That is, in step S205, it is determined whether or not the variable m is equal to or less than the number of times of fixing the substrate.

  In step S205, when the variable m is equal to or less than the number of times of fixing the substrate, as shown in step S206, display is performed in a state where the substrate data on the lower surface is turned upside down (the substrate is viewed from above so that the lower surface is seen through) Displayed on the device 45. At this time, as shown in FIG. 9A, the display device 45 is a perspective view of the outer shape of the virtual substrate 4 and the insertion hole 18 into which the backup pin 17 is inserted as viewed from above. Overlaid and displayed.

  At this time, the display is performed in a state where the substrate 4 is located at the substrate holding position corresponding to the value of the variable m. For example, when the variable m is 1, it is displayed in a state where the substrate 4 is located at the first substrate holding position. The first substrate holding position here is a substrate holding position at which the first substrate region B1 of the substrate 4 is located within the first mountable region A1, as shown in FIG.

Next, as shown in step S <b> 207, the components on the lower surface of the substrate 4 positioned at the m-th substrate holding position are displayed on the display device 45. At this time, as shown in FIG. 9B, the lower surface component 71 is added to the substrate 4 already displayed on the display device 45 and displayed.
Thereafter, as shown in step S208, 1 is added to the variable m, and the process returns to step S205. The loop processing including these steps S205 to S208 is repeatedly executed until the components 71 on the lower surface of the substrate 4 located at all the substrate holding positions are displayed on the display device 45. That is, assuming that the substrates 4 are simultaneously arranged at a plurality of substrate holding positions, these substrates 4, the components 71 mounted on the lower surface of these substrates 4, and the plurality of insertion holes of the backup pin support plate 16. 18 are superimposed on each other as a perspective view as viewed from above and displayed on the display device 45.

  When the number of times of fixing the substrate is 2, for example, by executing this loop processing, as shown in FIG. 9C, the virtual substrate 4 located at the first substrate holding position and the component 71 on the lower surface , The virtual substrate 4A located at the second substrate holding position, the image of the component 71A on the lower surface of the substrate 4A, and the insertion hole 18 are displayed. Note that the substrate 4A and the component 71A are drawn by broken lines in FIG. 9C. The second substrate holding position here is a substrate holding position at which the second substrate region B2 of the substrate 4 is located in the second mountable region A2, as shown in FIG. In this embodiment, the “virtual placement step” referred to in the invention according to claim 5 is constituted by the loop processing comprising step S205 to step S208.

  If it is determined in step S205 that all the substrate holding positions have been displayed on the display device 45, as shown in step S209, the pin positions that are not in contact with the lower surface components 71 and 71A (insertion holes 18). The tweezers flag is set to That is, the insertion hole 18 that is not opposed to the components 71 and 71A on the lower surface of each substrate 4 positioned at the plurality of substrate holding positions described above and is positioned to face the lower surfaces of these substrates 4 is detected.

  In this embodiment, this step S209 constitutes the “selection step” in the invention according to claim 5. At this time, as shown in FIG. 9D, the perspective view displayed on the display device 45 does not overlap with the components 71 and 71A among the plurality of insertion holes 18 and on the substrates 4 and 4A. An insertion hole 18 (hereinafter, this insertion hole 18 is simply referred to as “selected insertion hole 18”) that overlaps with a portion where the components 71 and 71A do not exist is displayed so as to be distinguishable from other insertion holes 18. ing. FIG. 9D is drawn in black so that the selected insertion hole 18 can be identified.

  After the insertion holes 18 are thus selected, data is stored as shown in step S210. More specifically, in step S210, position data indicating the position of the insertion hole 18 in which the tweezers flag is set is created and stored in the backup pin position data holding unit 21. In this embodiment, this “step S210” constitutes the “data creation step” referred to in the invention according to claim 5.

  Next, as shown in step S <b> 211, the backup pin 17 is attached to the backup pin support plate 16. This attachment is performed by the operator looking at the “selected insertion hole 18” displayed on the display device 45, or by the pin transplantation device 41 of the upstream head unit 33 and the pin transplantation of the downstream head unit 34. Using the device 41. When these pin transplant devices 41 are used, the backup pins 17 are transported from the backup pin holder 27 to the backup pin support plate 16 by these pin transplant devices 41 and inserted into the selected insertion holes 18. .

  After the backup pin 17 is attached to the backup pin support plate 16, component mounting is performed as shown in step S212. This component mounting is performed based on the mounting program 55 shown in FIG.

  In the component mounting apparatus 1 configured as described above, component mounting is performed at two locations of the first substrate holding position P1 and the second substrate holding position P2. Components can be mounted on the second board regions B1 and B2. Since there are two substrate holding positions, the time during which the mounting is interrupted is minimized, and when the existing backup pin 17 can be used, the backup pin 17 is used for mounting, which is high. Components can be mounted with mounting efficiency.

Therefore, according to this embodiment, it is possible to provide the component mounting apparatus 1 capable of mounting components with high mounting efficiency on the upper surface of the elongated substrate 4 having components mounted on the lower surface.
Further, according to this embodiment, the position data indicating the position of the backup pin 17 that does not come into contact with the components on the lower surface of the board at all board holding positions can be obtained with high accuracy.

The control device 14 according to this embodiment assumes that the substrates 4 are simultaneously arranged at a plurality of substrate holding positions when the first condition or the second condition is not satisfied, and these virtual substrates are 4, the components 71 and 71 </ b> A mounted on the lower surface of the substrate 4, and the plurality of insertion holes 18 of the backup pin support plate 16 are superimposed and displayed on the display device 45 as a perspective view as viewed from above. . In the perspective view, among the plurality of insertion holes 18, the insertion holes 18 that do not overlap with the parts 71 and 71 </ b> A and overlap with the parts where the parts 71 and 71 </ b> A do not exist in the substrate 4 are the other insertion holes. 18 is displayed in an identifiable manner.
For this reason, according to this embodiment, the position of the backup pin 17 that does not interfere with the components 71 and 71A on the lower surface of the board is easily detected at all the board holding positions even though there are a plurality of board holding positions. can do.

In this embodiment, a backup pin holding part 27 for storing and holding a plurality of backup pins 17, and the backup pin 17 is conveyed from the backup pin holding part 27 and inserted into the insertion hole 18 where the backup pin 17 does not exist. And a pin transplanter 41.
Further, the control device 14 according to this embodiment assumes that the substrate 4 is simultaneously arranged at a plurality of substrate holding positions when the first condition is not satisfied, and the components 71 on the lower surface of these substrates 4. , 71 </ b> A is detected, and the insertion hole 18 located at a position facing the lower surface of the substrate 4 is detected. The control device 14 is configured to convey and insert the backup pin 17 from the backup pin holding portion 27 into the insertion hole 18 by the pin transplanting device 41.

For this reason, according to this embodiment, since the function for arranging the backup pin 17 is provided to the component mounting apparatus 1, the operator can arrange the backup pin 17 more accurately than when the operator arranges the backup pin 17. it can.
The first condition “the presence of the backup pin 17 inserted into the insertion hole 18” in this embodiment means that the effective condition used to support the substrate 4 in the mounting before the setup change. This means that there are a number of backup pins 17, and for example, one or several backup pins 17 are not inserted into the insertion holes 18.

(Second Embodiment)
As shown in FIGS. 10A to 10C, the substrate holding positions can be set at three locations. 10A to 10C, members that are the same as or equivalent to those described with reference to FIGS. 1 to 9 are given the same reference numerals, and detailed descriptions thereof are omitted as appropriate.
In the substrate 4 shown in FIGS. 10A to 10C, first to third substrate regions B1 to B3 are set. The first board region B1 is a region where components are mounted only by the upstream head unit 33. The second board region B2 is a region where components are mounted only by the downstream head unit 34. The third board region B3 is a region where components are mounted by both the upstream head unit 33 and the downstream head unit 34.

In this embodiment, an area where components can be mounted on the board conveyance path 3 using both the upstream head unit 33 and the downstream head unit 34 is set as the third mountable area A3. .
The substrate holding position according to this embodiment includes the first substrate holding position P1 shown in FIG. 10A, the third substrate holding position P3 shown in FIG. 10B, and the first substrate holding position P3 shown in FIG. 2 substrate holding positions P2 are set. The first substrate holding position P1 is a substrate holding position at which the first substrate region B1 is located in the first mountable region A1. The second substrate holding position P2 is a substrate holding position at which the second substrate region B2 is located in the second mountable region A2. The third substrate holding position is a substrate holding position at which the third substrate region B3 is located in the third mountable region A3.

  When performing component mounting, the control device 14 according to this embodiment executes the mounting preparation program 54 and then executes the mounting program 55 in the same manner as the control device 14 described in the first embodiment. The third condition of the mounting preparation program 54 according to this embodiment is different from that when the first embodiment is adopted. The third condition according to this embodiment is that all of the first to third substrate holding positions P1 to P3 exist among the plurality of substrate holding positions that satisfy the second condition.

  In addition, as shown in FIG. 11, the mounting program 55 according to this embodiment has two mounting programs 55 on the board 4 held at the third board holding position P3 in the mounting program 55 when the first embodiment is adopted. A step of mounting parts using the head units 33 and 34 is added. In FIG. 11, members that are the same as or equivalent to those described with reference to FIG. 7 are given the same reference numerals, and detailed descriptions thereof are omitted as appropriate.

That is, in the mounting program 55 according to this embodiment, step S300 and step S301 are provided between step S101 and step 102, as shown in FIG.
In step S300, the substrate 4 is transported to the third substrate holding position P3 and fixed.
In step S <b> 301, components are mounted on the third board region B <b> 3 of the board 4 by the upstream head unit 33 and the downstream head unit 34.

  According to this embodiment, components are mounted on the substrate 4 using the upstream head unit 33 and the downstream head unit 34 in the third mountable area A3 in which components can be mounted by the two head units 33 and 34. Is done. The two head units 33 and 34 are both supported by the common X rail unit 32 so as to be movable in the X direction. For this reason, when the components adsorbed from above the component supply device 23 to above the substrate 4 are transported, More parts can be conveyed by the plurality of suction heads 36 of both the two head units 33 and 34. Therefore, according to this embodiment, it is possible to provide a component mounting apparatus with high mounting efficiency in which the number of times of movement of components from above the component supply device 23 to above the substrate 4 is reduced.

  As another embodiment, the two head units 33 and 34 are separately mounted on two X rail units that are movable in the Y direction, and the component mounting apparatus is supported so as to be movable in the X direction. When the invention of the second embodiment is applied, at the third substrate holding position, when one head unit performs an operation different from the component mounting, for example, the component is picked up by the other head unit. Can be implemented. Therefore, according to this embodiment, it is possible to provide a component mounting apparatus with higher mounting efficiency.

(Third embodiment)
The second substrate holding position P2 where the existing backup pins 17 can be used can be determined based on the number of effective backup pins 17 as shown in FIG. 12, members identical or equivalent to those described with reference to FIGS. 1 to 11 are given the same reference numerals, and detailed description thereof is omitted as appropriate.

  When the second substrate holding position determination method shown in the flowchart of FIG. 12 is executed, first, the substrate mounting data 61 and machine data are read as shown in step S400 of the same drawing. Then, as shown in step S401, it is determined whether or not the board 4 on which the component is mounted is a long one. The elongate board | substrate 4 here is a board | substrate formed so that it may extend over 1st mountable area | region A1 and 2nd mountable area | region A2, Comprising: Component mounting is performed in several board | substrate holding positions. This is an essential substrate.

  If it is determined in step S401 that the substrate is not a long substrate, the program ends. If it is determined in step S401 that the substrate is a long substrate, a first substrate holding position P1 is determined and a virtual substrate held at the first substrate holding position P1 as shown in step S402. 4 and the existing backup pin 17 are displayed on the display device 45.

As shown in FIG. 13A, the first substrate holding position P1 is a position where the upstream end 4a of the substrate 4 in the transport direction enters the first mountable area A1, and the existing backup pin 17 is a position where the backup pin 17 does not interfere with the component 71 on the lower surface of the substrate and the backup pin 17 contacts the lower surface of the substrate 4.
Next, as shown in step S403, the second substrate holding position P2 is determined, the component 71A on the lower surface of the virtual substrate 4 held at the second substrate holding position P2, and the existing backup pin 17 Is displayed on the display device 45. Step S403 is a step executed at the beginning of a loop process to be described later. As shown in FIG. 13B, the second substrate holding position P2 when step S403 is first executed is such that the downstream end 4b in the transport direction of the substrate 4 is within the second mountable area A2. It is a position to enter. In FIG. 13B, the component 72 mounted on the upper surface of the substrate 4 is indicated by a two-dot chain line.

  Thereafter, the number of effective backup pins 17 that support the virtual substrate 4 held at the second substrate holding position P2 is counted. The effective backup pin 17 includes both the component 71 on the lower surface of the substrate 4 held at the first substrate holding position P1 and the component 71A on the lower surface of the substrate 4 held at the second substrate holding position P2. The backup pin 17 is in contact with the substrate 4 without interfering with the substrate 4. In FIG. 13B, the effective backup pin 17 is hatched. The number of effective backup pins 17 in the case shown in FIG. 13B is six. Then, as shown in step S <b> 405, the second substrate holding position P <b> 2 and the number of valid backup pins 17 are recorded in the calculated substrate holding position data holding unit 56.

After the data is recorded in this way, the substrate holding position is offset upstream in the transport direction by a predetermined distance D as shown in step S406. That is, as shown in FIG. 13C, the position of the virtual substrate 4 moves to the upstream side in the transport direction by a distance D with respect to the first second substrate holding position P2.
Next, as shown in step S407, it is determined whether or not the offset position exceeds the allowable range of the second substrate holding position P2. If the offset position does not exceed the allowable range, steps S403 to S407 are executed again, and the process returns to step S407. By repeatedly executing the loop process including steps S403 to S407, the number of effective backup pins 17 is detected at each of the plurality of second substrate holding positions P2. As the substrate 4 moves to the upstream side in the transport direction by the distance D as shown in FIG. 13C, the number of effective backup pins 17 becomes eight.

After the loop processing is executed until the offset position exceeds the allowable range of the second substrate holding position P2, as shown in step S408, the substrate holding with the largest number of pins among the plurality of recorded substrate holding positions is performed. A position is selected. Then, as shown in step S409, the offset amount of the substrate holding position with the largest number of pins is recorded in the calculated substrate holding position data holding unit 56. That is, the substrate holding position having the largest number of effective backup pins 17 is finally set to the second substrate holding position P2. After the second substrate holding position P2 is determined in this way, this program ends.
Thus, the board | substrate 4 is hold | maintained in the 2nd board | substrate holding position P2 in which the number of effective backup pins 17 becomes the largest, and when the component 72 is mounted on the upper surface of the board | substrate 4, the mounting position of the board | substrate 4 is supported. The backup pins 17 are increased as much as possible. Therefore, by implementing this method, it is possible to provide a component mounting apparatus that can more reliably perform component mounting.

  DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus, 4 ... Board | substrate, 3 ... Board | substrate conveyance path, 14 ... Control apparatus, 16 ... Backup pin support plate, 17 ... Backup pin, 18 ... Insertion hole, 22 ... Backup pin position data, 27 ... Backup pin Holding unit, 33 ... upstream head unit, 34 ... downstream head unit, 41 ... pin transplanter, 61 ... board mounting data, 71, 71A ... parts, A1 ... first mountable area, A2 ... second mounting Possible region, A3 ... third mountable region, B1 ... first substrate region, B2 ... second substrate region, B3 ... third substrate region, P1 ... first substrate holding position, P2 ... second substrate holding position , P3 ... Third substrate holding position.

Claims (5)

A board conveyance path formed so that a board for mounting electronic components can be conveyed and held at a plurality of board holding positions in the conveyance direction;
An upstream head unit for mounting components on the board on the upstream side of the board conveyance path;
A downstream head unit for mounting components on the substrate on the downstream side of the substrate transport path;
A plurality of insertion holes into which backup pins for supporting the substrate are inserted, and a backup pin support plate disposed below the plurality of substrate holding positions;
A control device for controlling movement of the board on the board conveyance path and component mounting by the both head units;
The substrate is set with a first substrate region where components are mounted by the upstream head unit and a second substrate region where components are mounted by the downstream head unit,
Components are pre-mounted on the lower surface of the substrate,
The board transport path includes a first mountable area where components can be mounted on the board using the upstream head unit, and a second mounting where components can be mounted on the board using the downstream head unit. Has a possible area,
The control device has board mounting data including the position and shape of the component mounted on the lower surface of the board and the board shape, and backup pin position data including the current backup pin position on the backup pin support plate. In addition, predetermined mounting control is started after the first condition relating to the presence or absence of the backup pin, the second condition relating to the position of the backup pin, and the third condition relating to the substrate holding position are satisfied. Is,
The first condition is that there is a backup pin inserted into the insertion hole,
The second condition is based on the assumption that a board is arranged at the board holding position, and the components on the lower surface of the board based on the board mounting data do not interfere with the backup pin based on the backup pin position data. The backup pin in contact with the lower surface of the substrate is present,
The third condition is that the substrate holding position that satisfies the second condition is a first substrate holding capable of holding the substrate so that the first substrate region is located in the first mountable region. There is both a position and a second substrate holding position capable of holding the substrate such that the second substrate region is located in the second mountable region,
When the predetermined mounting control is started, the board is held at the first board holding position, and the component is mounted on the first board area by the upstream head unit, and then the second board holding. A component mounting apparatus, wherein a substrate is held at a position and a component is mounted on the second substrate region by a downstream head unit. A board conveyance path formed so that a board for mounting electronic components can be conveyed and held at a plurality of board holding positions in the conveyance direction;
An upstream head unit for mounting components on the board on the upstream side of the board conveyance path;
A downstream head unit for mounting components on the substrate on the downstream side of the substrate transport path;
A plurality of insertion holes into which backup pins for supporting the substrate are inserted, and a backup pin support plate disposed below the plurality of substrate holding positions;
A control device for controlling movement of the board on the board conveyance path and component mounting by the both head units;
On the board, a first board area where components are mounted only by the upstream head unit, a second board area where parts are mounted only by the downstream head unit, the upstream head unit, and the downstream side A third board area on which components are mounted is set by both the head unit,
Components are pre-mounted on the lower surface of the substrate,
The board transport path includes a first mountable area where components can be mounted on the board using the upstream head unit, and a second mounting where components can be mounted on the board using the downstream head unit. And a third mountable region where components can be mounted on the board using both the upstream head unit and the downstream head unit.
The control device has board mounting data including the position and shape of the component mounted on the lower surface of the board and the board shape, and backup pin position data including the current backup pin position on the backup pin support plate. In addition, predetermined mounting control is started after the first condition relating to the presence or absence of the backup pin, the second condition relating to the position of the backup pin, and the third condition relating to the substrate holding position are satisfied. Is,
The first condition is that there is a backup pin inserted into the insertion hole,
The second condition is based on the assumption that a board is arranged at the board holding position, and the components on the lower surface of the board based on the board mounting data do not interfere with the backup pin based on the backup pin position data. The backup pin in contact with the lower surface of the substrate is present,
The third condition is that the substrate holding position that satisfies the second condition is a first substrate holding capable of holding the substrate so that the first substrate region is located in the first mountable region. A position, a second substrate holding position where the substrate can be held such that the second substrate region is located in the second mountable region, and the third substrate region is in the third mountable region. There are all substrate holding positions with a third substrate holding position capable of holding the substrate so as to be located at
When the predetermined mounting control is started, the board is held at the first board holding position, and the component is mounted on the first board area by the upstream head unit, and then the third board holding. A substrate is held at a position, and a component is mounted on the third substrate area by both the upstream head unit and the downstream head unit. Subsequently, the substrate is held at the second substrate holding position, and the second substrate holding position. A component mounting apparatus, wherein a component is mounted on a board region by a downstream head unit. The component mounting apparatus according to claim 1 or 2, further comprising a display device,
When the first condition or the second condition is not satisfied, the control device assumes that the substrates are simultaneously arranged at the plurality of substrate holding positions, and these substrates and the lower surfaces of these substrates. The components mounted on and a plurality of insertion holes of the backup pin support plate are displayed on the display device as a perspective view in a state seen from above,
In the perspective view, among the plurality of insertion holes, an insertion hole that does not overlap with the part and overlaps with a part where no part exists on the board is displayed so as to be distinguishable from the other insertion holes. A component mounting apparatus characterized by that. 3. The component mounting apparatus according to claim 1 or 2, further comprising a backup pin holding unit for storing and holding a plurality of backup pins, and a backup pin transported from the backup pin holding unit, wherein the backup pin does not exist. A backup pin transplanter to be inserted into the hole,
When the first condition is not satisfied, the control device assumes that the substrates are simultaneously arranged at the plurality of substrate holding positions, and does not face components on the lower surface of these substrates. Detect the insertion hole at the position facing the lower surface of the
A component mounting apparatus, wherein a backup pin is transported and inserted into the insertion hole from the backup pin holder by the backup pin transplanter. A backup pin insertion position data creation method implemented by the component mounting apparatus according to claim 3,
Data of multiple substrate holding positions and multiple insertion hole positions;
A virtual placement step that assumes that the board is placed at a plurality of board holding positions simultaneously based on the board mounting data including the position of the component mounted on the lower surface of the board and the board shape;
Of the plurality of insertion holes, a selection step of selecting an insertion hole that does not overlap with the component when viewed from above and overlaps with a portion where no component exists on the board;
A backup pin insertion position data creation method comprising: a data creation step of creating, as data, the position of the insertion hole selected in the selection step.

Images