JP5928268B2 - Conductive film, touch panel, and display device - Google Patents

Description

  The present invention relates to a conductive film, a touch panel, and a display device, and particularly relates to a conductive film suitable for thinning, a touch panel including the conductive film, and a display device.

  A touch panel has been developed as an input device capable of inputting information such as text and graphics, and is attached to a display surface of a flat panel display device such as a liquid crystal display device, an organic EL display, a plasma display, and an electronic notebook.

  Types of touch panels are classified into a resistive film method (Resistive), a capacitance method (Capacitive), an electromagnetic method (Electro-Magnetic), a surface acoustic wave method (SAW), and an infrared method (Infrared). Such various types of touch panels have signal amplification problems, resolution differences, difficulty of design and processing technology, optical characteristics, electrical characteristics, mechanical characteristics, environmental resistance characteristics, input characteristics, durability and economy. In consideration of the characteristics, it is used in electronic products. Currently, the most widely used method is a resistive touch panel and a capacitive touch panel.

  In general, the transparent conductive film for a touch panel used for manufacturing a resistive film type touch panel or a capacitive touch panel generally uses a transparent conductive layer formed by sputtering ITO on glass. However, the transparent conductive layer in which ITO is formed on glass has a limit in reducing resistance, and a further low resistance conductive film for improving touch sensitivity is desired.

In addition, with recent increases in display size and display flexibility, touch panels are also required to be thinner, lighter, and more flexible. For this reason, a method of forming an ITO conductive film on a transparent plastic substrate such as PET instead of glass is disclosed (see, for example, Patent Document 1 and Patent Document 2).
Moreover, the technique of the transparent conductive film using the low resistance and highly durable silver thin film is disclosed (for example, refer patent document 3 and patent document 4).
However, even in this technique, the transmittance, the resistance value, the image visibility, and the stability over time are not compatible.

International Publication No. 04/070737 Pamphlet JP-A-11-245344 JP 2000-329934 A JP 2000-238169 A

However, in the method of forming an ITO conductive film on a transparent plastic substrate, there are problems in compatibility between resistance value and transparency and visibility when combined with a display. In addition, the ITO conductive film requires uneven resistance in the width direction during continuous production in the process, and high heat treatment is required, so that the plastic substrate is damaged, and the aging stability in the roll state (damp heat resistance) ) Is inferior and is not preferred.
Moreover, even in the technique of a transparent conductive film using a silver thin film, the transmittance, resistance value, image visibility, and stability over time cannot be achieved at the same time.

  In order to solve the above-described problems, the present invention provides a conductive film, a touch panel, and a display device that have low resistance and high transmittance and are excellent in stability over time.

The conductive film of the present invention comprises a substrate made of a thermoplastic resin having a plane direction retardation (R0) value satisfying +50 nm ≧ R0 ≧ −50 nm, and a transparent conductive layer mainly composed of silver formed on the substrate. Prepare.
The touch panel of this invention is equipped with the said electroconductive film as an electrode.
The display device of the present invention includes the above touch panel and a display panel disposed on the touch panel.

According to the conductive film of the present invention, a conductive film having a high transmittance can be formed by using, as the substrate, a thermoplastic resin having a plane direction retardation (R0) value satisfying +50 nm ≧ R0 ≧ −50 nm. In addition, by using a transparent conductive layer containing silver as a main component, a low-resistance conductive film can be obtained without performing an annealing process during electrode formation. In addition, since the annealing process is not required when forming the transparent conductive layer, it is possible to prevent damage to the thermoplastic resin due to heat, and to have excellent temporal stability without affecting the surface direction retardation of the thermoplastic resin. A conductive film can be formed.
Further, by providing this conductive film, it is possible to configure a touch panel and a display device that have low resistance and high transmittance and are excellent in stability over time.

  According to the present invention, it is possible to provide a conductive film, a touch panel, and a display device that have low resistance and high transmittance and are excellent in stability over time.

It is sectional drawing which shows schematic structure of the electroconductive film of embodiment. It is sectional drawing which shows schematic structure of the modification of an electroconductive film. It is a perspective view which shows schematic structure of the touchscreen using an electroconductive film. It is a top view of two transparent electrodes which shows the electrode structure of a touch panel. It is a plane schematic diagram of the electrode part of a touch panel. It is a cross-sectional schematic diagram equivalent to the AA cross section shown in FIG. It is a cross-sectional schematic diagram for demonstrating the modification of a touchscreen. It is a cross-sectional schematic diagram for demonstrating the modification of a touchscreen. It is a cross-sectional schematic diagram for demonstrating the modification of a touchscreen. It is a perspective view which shows the structure of the display apparatus of embodiment.

Hereinafter, embodiments of the present invention will be described in the following order based on the drawings.
1. 1. Conductive film Modified example of conductive film (example with intermediate layer)
3. Touch panel (configuration with two transparent conductive layers on a transparent substrate)
4). Modification 1 of touch panel (configuration using two transparent substrates)
5. Modification 2 of touch panel (configuration in which transparent electrodes are provided on each side of a transparent substrate)
6). Modification 3 of touch panel (configuration in which two patterns of transparent electrodes are provided on the same plane of a transparent substrate)
7). Display device (configuration using touch panel)

<1. Conductive film>
Hereinafter, specific embodiments of the conductive film of the present invention will be described.
In FIG. 1, the schematic block diagram (sectional drawing) of the electroconductive film of this Embodiment is shown. As shown in FIG. 1, the conductive film 10 has a configuration in which a transparent conductive layer is provided as a transparent electrode 12 on a substrate 11.

[substrate]
The board | substrate 11 may serve as the front board of the display panel, for example. As such a transparent substrate 11, a resin film made of a thermoplastic resin can be used.
For the substrate 11, a thermoplastic resin whose surface direction retardation (R0 value) satisfies the following formula (1) is used.
+50 nm ≧ R0 ≧ −50 nm (1)
Preferably, a thermoplastic resin having a plane direction retardation (R0 value) satisfying the following formula (2) is used.
+20 nm ≧ R0 ≧ −20 nm (2)
More preferably, a thermoplastic resin whose surface direction retardation (R0 value) satisfies the following formula (2) is used.
+5 nm ≧ R0 ≧ −5 nm (2)

The plane direction retardation value is R0 = when the refractive index in the slow axis direction of the substrate is nx, the refractive index in the fast axis direction is ny, and the thickness of the substrate is d (nm) at a wavelength of 590 nm. It is a value represented by (nx−ny) · d (nm).
Although the in-plane retardation value of a board | substrate can be measured using an automatic birefringence measuring apparatus (Oji Scientific Instruments Co., Ltd. make, brand name KOBRA-21ADH), it is not limited to this.

Examples of the material of the thermoplastic resin film whose surface direction retardation (R0 value) satisfies the above formula (1) include cellulose diacetate (DAC), cellulose triacetate (TAC), cellulose acetate butyrate (CAB), cellulose acetate pro Cellulose acylate resins such as pionate (CAP), cellulose acetate phthalate (TAC), cellulose nitrate or derivatives thereof, Arton (trade name, manufactured by JSR), Appel (trade name, manufactured by Mitsui Chemicals), Topas (polyplastic) Norbornene resins such as cyclic olefin resins (manufactured by Seisaku), polycarbonate resins such as pure ace (manufactured by Teijin), and (meth) acrylic resins, amorphous polyarylate, polyether sulfone, polysulfone, etc. It is.
Of these, cellulose acylate resins, polycarbonate resins, cyclic olefin resins, and norbornene resins are preferable.
The cellulose acylate resin preferably has an average acyl group substitution degree of 2.6 or more and 3.0 or less.

The substrate 11 preferably has a thickness of 60 μm to 20 μm. The substrate 11 is preferably a resin film having a thickness within the above range by stretching the thermoplastic resin in the width direction and the transport direction.
Moreover, the dimension of the width direction of a resin film can be 0.3 m or more, and the dimension of a longitudinal direction can be 200 m or more. For this reason, it can be set as a roll-shaped electroconductive film by winding an electroconductive film in a longitudinal direction.

In general, polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), which are applied to a conductive film substrate, have a large surface direction retardation (R0 value) and generate interference fringes with other components of the device. . This interference fringe deteriorates the visibility of a device including a conductive film.
In addition, conductive films are often used in touch screens for car navigation, portable image display devices called smartphones and tablets, and the like. Such a touch panel is often used outdoors, and the display surface is reflected to reduce visibility. For this reason, in order to suppress reflection of the touch panel surface, a polarizing film or the like is often used. However, polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) have a large surface direction retardation (R0 value), and there is a problem that color unevenness occurs on the touch panel surface screen viewed through the polarizing film.
For this reason, when a substrate such as PET is used, an optical functional film such as a λ / 4 wavelength plate is provided in accordance with the conductive film for the purpose of eliminating color unevenness. By using such an optical functional film, the visibility of the device is improved.

  On the other hand, in the case of a conductive film using a substrate having a plane direction retardation (R0 value) of ± 50 nm or less, preferably ± 20 nm or less, even when this conductive film is applied to a device, interference fringes and color unevenness are observed. There is no occurrence. For this reason, the visibility of devices such as a touch panel and a display device using a conductive film is improved without providing an optical functional film such as a λ / 4 wavelength plate.

There may be a barrier layer or a hard coat layer on the surface of the substrate 11. As the barrier layer or the hard coat layer, a film made of an inorganic material or an organic material, or a hybrid film combining these films may be formed. Such coatings and hybrid coatings have a water vapor transmission rate (25 ± 0.5 ° C., relative humidity 90 ± 2% RH) of 0.01 g / (measured by a method according to JIS-K-7129-1992. m ² · 24 hours) or less of a barrier film (also referred to as a barrier film or the like) is preferable. Furthermore, the oxygen permeability measured by a method according to JIS-K-7126-1987 is 10 ⁻³ ml / (m ² · 24 hours · atm) or less, and the water vapor permeability is 10 ⁻⁵ g / (m ⁽² · 24 hours) or less is preferable.

  The material for forming the barrier film as described above may be any material that has a function of suppressing intrusion of elements that cause deterioration of elements such as moisture and oxygen. For example, silicon oxide, silicon dioxide, silicon nitride, or the like is used. be able to. Furthermore, in order to improve the brittleness of the barrier film, it is more preferable to have a laminated structure of these inorganic layers and layers (organic layers) made of an organic material. Although there is no restriction | limiting in particular about the lamination | stacking order of an inorganic layer and an organic layer, It is preferable to laminate | stack both alternately several times.

  The method for forming the barrier film is not particularly limited. For example, the vacuum deposition method, the sputtering method, the reactive sputtering method, the molecular beam epitaxy method, the cluster ion beam method, the ion plating method, the plasma polymerization method, the atmospheric pressure plasma weighting. A combination method, a plasma CVD method, a laser CVD method, a thermal CVD method, a coating method, or the like can be used, but an atmospheric pressure plasma polymerization method described in JP-A-2004-68143 is particularly preferable.

  The surface of the substrate 11 is preferably cleaned by surface activation treatment. Examples of such surface activation treatment include corona treatment, plasma treatment, and flame treatment.

[Transparent conductive layer]
The transparent conductive layer 12 is an extremely thin metal film to such an extent that the light transmission can be maintained and the irradiated light is not lost to plasmon. Further, the transparent conductive layer is a metal film that is continuous to the extent that it has conductivity. Specifically, the light transmittance at a wavelength of 550 nm is preferably 60% or more, particularly preferably 80% or more, and the total light transmittance is preferably 80% or more. The film thickness is 1 to 30 nm, preferably 1 to 20 nm, and the sheet resistance is 0.0001 to 50Ω / □, preferably 0.01 to 40Ω / □. When the film thickness is not more than the above range, the absorption component or reflection component of the layer can be suppressed low, and the light transmittance is maintained, which is preferable. Moreover, electroconductivity is ensured because a film thickness is more than the said range.

  The transparent conductive layer is a layer formed using silver or an alloy containing silver as a main component, and is a layer formed on the substrate 11. As a method of forming such a transparent conductive layer, a method using a wet process such as a coating method, an inkjet method, a coating method, a dip method, a vapor deposition method (resistance heating, EB method, etc.), a sputtering method, a CVD method, etc. Examples include a method using a dry process. Of these, the vapor deposition method is preferably applied. In addition, the transparent conductive layer is sufficiently conductive even if there is no high-temperature annealing after formation.

  When the transparent conductive layer is composed of silver, the purity of silver is preferably 99% or more. Further, palladium (Pd), copper (Cu), gold (Au), or the like may be added in order to ensure the stability of silver.

  When the transparent conductive layer is composed of an alloy containing silver as a main component, the silver content is preferably 50% or more. Examples of such alloys include silver magnesium (AgMg), silver copper (AgCu), silver palladium (AgPd), silver palladium copper (AgPdCu), silver indium (AgIn), silver gold (AgAu), silver aluminum (AgAl) , Silver zinc (AgZn), silver tin (AgSn), silver platinum (AgPt), silver titanium (AgTi), silver bismuth (AgBi), and the like.

  Further, the transparent conductive layer as described above may have a configuration in which silver or an alloy layer mainly composed of silver is divided into a plurality of layers as necessary. That is, a configuration in which silver layers and alloy layers are alternately stacked a plurality of times may be used, or a configuration in which a plurality of layers of different alloys are stacked may be used.

<2. Modification Example of Conductive Film>
Next, a modified example of the conductive film will be described.
The schematic block diagram (sectional drawing) of the electroconductive film of a modification is shown in FIG. As shown in FIG. 2, the conductive film 10 has a configuration in which a transparent electrode 12 is provided on a substrate 11. The transparent electrode 12 includes an intermediate layer 13 and a transparent conductive layer 14 provided on the intermediate layer 13. In addition, the modification of the electroconductive film shown in FIG. 2 is the structure similar to embodiment of the above-mentioned electroconductive film except providing the intermediate | middle layer 13. As shown in FIG. For this reason, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment, and detailed description is abbreviate | omitted.

[Middle layer]
The intermediate layer 13 is composed of an adhesive layer, a nitrogen-containing layer, and the like. The intermediate layer 13 is preferably configured to include either an adhesive layer or a nitrogen-containing layer. Moreover, you may be comprised including both the contact bonding layer and the nitrogen containing layer. In addition, in the case where the transparent conductive layer is configured to be divided into a plurality of layers, the conductive layer and the intermediate layer may be alternately stacked a plurality of times.

  By forming the transparent conductive layer 14 on the intermediate layer 13, the silver atoms constituting the transparent conductive layer 14 interact with the intermediate layer 13, and the diffusion distance of silver atoms on the surface of the intermediate layer 13 is reduced. Is suppressed. Therefore, in general, a silver thin film that is easily isolated in an island shape by film growth of a nuclear growth type (Volume-Weber: VW type) is a single-layer growth type (Frank-van der Merwe: FM type). A silver thin film having a uniform film thickness is obtained. Therefore, the transparent conductive layer 14 having a uniform film thickness can be obtained even though the film thickness is small.

(Adhesive layer)
The adhesive layer is a layer made of a compound containing atoms such as titanium, platinum, palladium, cobalt, nickel, molybdenum, and is provided adjacent to the transparent electrode layer 14 or the nitrogen-containing layer. The adhesive layer is formed by a method using a wet process such as a coating method, an ink jet method, a coating method, or a dip method, or a method using a dry process such as a vapor deposition method (resistance heating, EB method, etc.), a sputtering method, or a CVD method. Is done. Among these, it is preferable to use titanium oxide and form by vapor deposition.

(Nitrogen-containing layer)
The nitrogen-containing layer is a layer configured using a compound containing a nitrogen atom, and is provided adjacent to the transparent conductive layer 14. When the nitrogen-containing layer is formed on the substrate 11, a method using a wet process such as a coating method, an inkjet method, a coating method, a dip method, a vapor deposition method (resistance heating, EB method, etc.), a sputtering method, a CVD method, or the like. It is formed by a method using a dry process such as. Of these, the vapor deposition method is preferably applied.

The compound containing a nitrogen atom constituting the nitrogen-containing layer is not particularly limited as long as it is a compound containing a nitrogen atom in the molecule, but a compound having a heterocycle having a nitrogen atom as a heteroatom is preferable. Examples of the heterocycle having a nitrogen atom as a hetero atom include aziridine, azirine, azetidine, azeto, azolidine, azole, azinane, pyridine, azepan, azepine, imidazole, pyrazole, oxazole, thiazole, imidazoline, pyrazine, morpholine, thiazine, indole, Examples include isoindole, benzimidazole, purine, quinoline, isoquinoline, quinoxaline, cinnoline, pteridine, acridine, carbazole, benzo-C-cinnoline, porphyrin, chlorin, choline and the like.
Moreover, the following compounds 1-3 are illustrated as a compound containing a nitrogen atom.

(Compound-1)
As an example of the compound constituting the nitrogen-containing layer, among the nitrogen atoms contained in the compound, an unshared electron pair of a nitrogen atom that is stably bonded to silver, which is the main material constituting the transparent conductive layer 14, in particular [ [Effective unshared electron pair], and a compound in which the content of [effective unshared electron pair] is within a predetermined range is preferably used.

  Here, “effective unshared electron pair” means an unshared electron pair that is not involved in aromaticity and is not coordinated to a metal among the unshared electron pairs of the nitrogen atom contained in the compound. And The aromaticity here refers to an unsaturated cyclic structure in which atoms having π electrons are arranged in a ring, and is aromatic according to the so-called “Hückel's rule”. The condition is that the number is “4n + 2” (n = 0 or a natural number).

[Effective unshared electron pair] as described above refers to an unshared electron pair possessed by a nitrogen atom regardless of whether or not the nitrogen atom itself provided with the unshared electron pair is a hetero atom constituting an aromatic ring. Is selected depending on whether or not is involved in aromaticity. For example, even if a nitrogen atom is a heteroatom constituting an aromatic ring, if the nitrogen atom has an unshared electron pair that does not participate in aromaticity, the unshared electron pair is [effective unshared electron. It is counted as one of the pair.
In contrast, even if a nitrogen atom is not a heteroatom that constitutes an aromatic ring, if all of the non-shared electron pairs of the nitrogen atom are involved in aromaticity, the nitrogen atom is not shared. An electron pair is not counted as a [valid unshared electron pair]. In each compound, the number n of [effective unshared electron pairs] described above matches the number of nitrogen atoms having [effective unshared electron pairs].

Particularly in the present embodiment, the number n of [effective unshared electron pairs] with respect to the molecular weight M of such a compound is defined as, for example, the effective unshared electron pair content [n / M]. The nitrogen-containing layer is preferably composed of a compound selected such that [n / M] is 2.0 × 10 ⁻³ ≦ [n / M]. Further, the nitrogen-containing layer is more preferable if the effective unshared electron pair content [n / M] defined as described above is in the range of 3.9 × 10 ⁻³ ≦ [n / M].

  Further, the nitrogen-containing layer only needs to be configured using a compound whose effective unshared electron pair content [n / M] is in the predetermined range described above, or may be configured only with such a compound, Further, such a compound and another compound may be mixed and used. The other compound may or may not contain a nitrogen atom, and the effective unshared electron pair content [n / M] may not be within the predetermined range described above.

  When the nitrogen-containing layer is composed of a plurality of compounds, for example, based on the mixing ratio of the compounds, the molecular weight M of the mixed compound obtained by mixing these compounds is obtained, and [effective non-sharing with respect to this molecular weight M is obtained. The total number n of [electron pairs] is obtained as an average value of the effective unshared electron pair content [n / M], and this value is preferably within the predetermined range described above. That is, the effective unshared electron pair content [n / M] of the nitrogen-containing layer itself is preferably within a predetermined range.

  If the nitrogen-containing layer is composed of a plurality of compounds and the composition ratio (content ratio) of the compounds is different in the film thickness direction, the nitrogen on the side in contact with the transparent conductive layer 14 The effective unshared electron pair content [n / M] in the surface layer of the containing layer is preferably within a predetermined range.

Specific examples of compounds that satisfy the above-described effective unshared electron pair content [n / M] of 2.0 × 10 ⁻³ ≦ [n / M] (No. 1) To No. 40). Each compound No. 1-No. 40 is marked with a circle with respect to a nitrogen atom having [effective unshared electron pair]. Table 1 below shows these compound Nos. 1-No. The molecular weight M of 40, the number n of [effective unshared electron pairs], and the effective unshared electron pair content [n / M] are shown. In the copper phthalocyanine of the following compound 33, unshared electron pairs that are not coordinated to copper among the unshared electron pairs of the nitrogen atom are counted as [effective unshared electron pairs].

  Table 1 shows the corresponding general formulas when these exemplary compounds belong to any one of the general formulas (1) to (6) representing [Compound-2] described below.

(Compound-2)
As other examples of the compound constituting the nitrogen-containing layer, in addition to the compound having the above-mentioned effective unshared electron pair content [n / M] within the predetermined range described above, from the viewpoint of its formability, the following description will be given. The compounds represented by the general formulas (1) to (6) are used.

  Among the compounds represented by the general formulas (1) to (6), there are also compounds that fall within the range of the effective unshared electron pair content [n / M] described above. It is preferably used alone as a compound constituting the nitrogen-containing layer (see Table 1 above). On the other hand, if the compound represented by the following general formulas (1) to (6) is a compound that does not fall within the above-mentioned range of the effective unshared electron pair content [n / M], the effective unshared electron pair content [ n / M] is preferably used as a compound constituting the nitrogen-containing layer by mixing with a compound in the above-described range.

  In the general formula (1), E101 to E108 each represent -C (R12) = or -N =, and at least one of E101 to E108 is -N =. Moreover, R11 in General formula (1) and said R12 represent a hydrogen atom or a substituent.

  Examples of this substituent include alkyl groups (for example, methyl group, ethyl group, propyl group, isopropyl group, tert-butyl group, pentyl group, hexyl group, octyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group). Etc.), cycloalkyl groups (for example, cyclopentyl group, cyclohexyl group, etc.), alkenyl groups (for example, vinyl group, allyl group, etc.), alkynyl groups (for example, ethynyl group, propargyl group, etc.), aromatic hydrocarbon groups (aromatic Also called group carbocyclic group, aryl group, etc., for example, phenyl group, p-chlorophenyl group, mesityl group, tolyl group, xylyl group, naphthyl group, anthryl group, azulenyl group, acenaphthenyl group, fluorenyl group, phenanthryl group, indenyl group , Pyrenyl group, biphenylyl group), aromatic heterocyclic group (for example, Furyl group, thienyl group, pyridyl group, pyridazinyl group, pyrimidinyl group, pyrazinyl group, triazinyl group, imidazolyl group, pyrazolyl group, thiazolyl group, quinazolinyl group, carbazolyl group, carbolinyl group, diazacarbazolyl group (carbolinyl group carboline) A structure in which one of the carbon atoms constituting the ring is replaced by a nitrogen atom), a phthalazinyl group, etc.), a heterocyclic group (eg, pyrrolidyl group, imidazolidyl group, morpholyl group, oxazolidyl group, etc.), an alkoxy group (eg, Methoxy group, ethoxy group, propyloxy group, pentyloxy group, hexyloxy group, octyloxy group, dodecyloxy group, etc.), cycloalkoxy group (for example, cyclopentyloxy group, cyclohexyloxy group, etc.), aryloxy group (for example, , Fe Xy group, naphthyloxy group, etc.), alkylthio group (eg, methylthio group, ethylthio group, propylthio group, pentylthio group, hexylthio group, octylthio group, dodecylthio group, etc.), cycloalkylthio group (eg, cyclopentylthio group, cyclohexylthio group) Etc.), arylthio groups (eg, phenylthio group, naphthylthio group, etc.), alkoxycarbonyl groups (eg, methyloxycarbonyl group, ethyloxycarbonyl group, butyloxycarbonyl group, octyloxycarbonyl group, dodecyloxycarbonyl group, etc.), aryl Oxycarbonyl group (eg, phenyloxycarbonyl group, naphthyloxycarbonyl group, etc.), sulfamoyl group (eg, aminosulfonyl group, methylaminosulfonyl group, dimethylaminosulfonyl) Group, butylaminosulfonyl group, hexylaminosulfonyl group, cyclohexylaminosulfonyl group, octylaminosulfonyl group, dodecylaminosulfonyl group, phenylaminosulfonyl group, naphthylaminosulfonyl group, 2-pyridylaminosulfonyl group, etc.), acyl group (for example, Acetyl group, ethylcarbonyl group, propylcarbonyl group, pentylcarbonyl group, cyclohexylcarbonyl group, octylcarbonyl group, 2-ethylhexylcarbonyl group, dodecylcarbonyl group, phenylcarbonyl group, naphthylcarbonyl group, pyridylcarbonyl group, etc.), acyloxy group ( For example, acetyloxy group, ethylcarbonyloxy group, butylcarbonyloxy group, octylcarbonyloxy group, dodecylcarbonyloxy group, phenyl Sulfonyloxy group, etc.), amide groups (for example, methylcarbonylamino group, ethylcarbonylamino group, dimethylcarbonylamino group, propylcarbonylamino group, pentylcarbonylamino group, cyclohexylcarbonylamino group, 2-ethylhexylcarbonylamino group, octylcarbonyl) Amino group, dodecylcarbonylamino group, phenylcarbonylamino group, naphthylcarbonylamino group, etc.), carbamoyl group (for example, aminocarbonyl group, methylaminocarbonyl group, dimethylaminocarbonyl group, propylaminocarbonyl group, pentylaminocarbonyl group, cyclohexyl) Aminocarbonyl group, octylaminocarbonyl group, 2-ethylhexylaminocarbonyl group, dodecylaminocarbonyl group, phenylaminocarbonyl Nyl group, naphthylaminocarbonyl group, 2-pyridylaminocarbonyl group, etc.), ureido group (for example, methylureido group, ethylureido group, pentylureido group, cyclohexylureido group, octylureido group, dodecylureido group, phenylureido group naphthylureido) Group, 2-pyridylaminoureido group, etc.), sulfinyl group (for example, methylsulfinyl group, ethylsulfinyl group, butylsulfinyl group, cyclohexylsulfinyl group, 2-ethylhexylsulfinyl group, dodecylsulfinyl group, phenylsulfinyl group, naphthylsulfinyl group, 2 -Pyridylsulfinyl group etc.), alkylsulfonyl group (for example, methylsulfonyl group, ethylsulfonyl group, butylsulfonyl group, cyclohexylsulfonyl group, 2- Ethylhexylsulfonyl group, dodecylsulfonyl group, etc.), arylsulfonyl group or heteroarylsulfonyl group (eg, phenylsulfonyl group, naphthylsulfonyl group, 2-pyridylsulfonyl group, etc.), amino group (eg, amino group, ethylamino group, dimethyl) Amino group, butylamino group, cyclopentylamino group, 2-ethylhexylamino group, dodecylamino group, anilino group, naphthylamino group, 2-pyridylamino group, piperidyl group (also called piperidinyl group), 2,2,6,6- Tetramethylpiperidinyl group, etc.), halogen atoms (eg, fluorine atom, chlorine atom, bromine atom, etc.), fluorinated hydrocarbon groups (eg, fluoromethyl group, trifluoromethyl group, pentafluoroethyl group, pentafluorophenyl) Group), cyano group, di B, hydroxy group, mercapto group, silyl group (eg, trimethylsilyl group, triisopropylsilyl group, triphenylsilyl group, phenyldiethylsilyl group, etc.), phosphate ester group (eg, dihexyl phosphoryl group, etc.), phosphorous acid An ester group (for example, diphenylphosphinyl group etc.), a phosphono group etc. are mentioned.

  Some of these substituents may be further substituted with the above substituents. In addition, a plurality of these substituents may be bonded to each other to form a ring.

  The general formula (2) is also an embodiment of the general formula (1). In the general formula (2), Y21 represents a divalent linking group composed of an arylene group, a heteroarylene group, or a combination thereof. E201 to E216 and E221 to E238 each represent -C (R21) = or -N =, and R21 represents a hydrogen atom or a substituent. However, at least one of E221 to E229 and at least one of E230 to E238 represent -N =. k21 and k22 represent an integer of 0 to 4, but k21 + k22 is an integer of 2 or more.

  In the general formula (2), examples of the arylene group represented by Y21 include o-phenylene group, p-phenylene group, naphthalenediyl group, anthracenediyl group, naphthacenediyl group, pyrenediyl group, naphthylnaphthalenediyl group, and biphenyldiyl. Groups (for example, [1,1′-biphenyl] -4,4′-diyl group, 3,3′-biphenyldiyl group, 3,6-biphenyldiyl group, etc.), terphenyldiyl group, quaterphenyldiyl group And kinkphenyldiyl group, sexiphenyldiyl group, septiphenyldiyl group, octiphenyldiyl group, nobiphenyldiyl group, deciphenyldiyl group and the like.

  In the general formula (2), examples of the heteroarylene group represented by Y21 include a carbazole ring, a carboline ring, a diazacarbazole ring (also referred to as a monoazacarboline ring, and one of carbon atoms constituting the carboline ring). Derived from the group consisting of triazole ring, pyrrole ring, pyridine ring, pyrazine ring, quinoxaline ring, thiophene ring, oxadiazole ring, dibenzofuran ring, dibenzothiophene ring, indole ring) And the like.

  As a preferred embodiment of the divalent linking group consisting of an arylene group, heteroarylene group or a combination thereof represented by Y21, among the heteroarylene groups, a condensed aromatic heterocycle formed by condensation of three or more rings. A group derived from a condensed aromatic heterocyclic ring formed by condensing three or more rings is preferably included, and a group derived from a dibenzofuran ring or a dibenzothiophene ring is preferable. Are preferred.

  In the general formula (2), when R21 of —C (R21) ═ represented by E201 to E216 and E221 to E238 is a substituent, examples of the substituent include R11 of the general formula (1), The substituents exemplified as R12 apply similarly.

  In General formula (2), it is preferable that 6 or more of E201-E208 and 6 or more of E209-E216 are each represented by -C (R21) =.

  In the general formula (2), it is preferable that at least one of E225 to E229 and at least one of E234 to E238 represent -N =.

  Furthermore, in General formula (2), it is preferable that any one of E225-E229 and any one of E234-E238 represent -N =.

  Moreover, in General formula (2), it is mentioned as a preferable aspect that E221-E224 and E230-E233 are each represented by -C (R21) =.

  Further, in the compound represented by the general formula (2), it is preferable that E203 is represented by -C (R21) = and R21 represents a linking site, and E211 is also represented by -C (R21) =. And R21 preferably represents a linking site.

  Further, E225 and E234 are preferably represented by -N =, and E221 to E224 and E230 to E233 are each preferably represented by -C (R21) =.

  The general formula (3) is also an embodiment of the general formula (1). In the general formula (3), E301 to E312 each represent —C (R31) ═, and R31 represents a hydrogen atom or a substituent. Y31 represents a divalent linking group composed of an arylene group, a heteroarylene group, or a combination thereof.

  In the general formula (3), when R31 in —C (R31) ═ represented by E301 to E312 is a substituent, examples of the substituent are exemplified as R11 and R12 in the general formula (1). The same substituents apply as well.

  Moreover, in General formula (3), as a preferable aspect of the bivalent coupling group which consists of an arylene group represented by Y31, heteroarylene group, or those combinations, the structure similar to Y21 of General formula (2) is mentioned. .

  The general formula (4) is also a form of the general formula (1). In the general formula (4), E401 to E414 each represent -C (R41) =, and R41 represents a hydrogen atom or a substituent. Ar41 represents a substituted or unsubstituted aromatic hydrocarbon ring or aromatic heterocyclic ring. Furthermore, k41 represents an integer of 3 or more.

  In the general formula (4), when R41 in —C (R41) ═ represented by E401 to E414 is a substituent, examples of the substituent are R11 and R12 in the general formula (1). The same substituents apply as well.

  In the general formula (4), when Ar41 represents an aromatic hydrocarbon ring, examples of the aromatic hydrocarbon ring include a benzene ring, a biphenyl ring, a naphthalene ring, an azulene ring, an anthracene ring, a phenanthrene ring, a pyrene ring, Chrysene ring, naphthacene ring, triphenylene ring, o-terphenyl ring, m-terphenyl ring, p-terphenyl ring, acenaphthene ring, coronene ring, fluorene ring, fluoranthrene ring, naphthacene ring, pentacene ring, perylene ring, Examples include a pentaphen ring, a picene ring, a pyrene ring, a pyranthrene ring, and an anthraanthrene ring. These rings may further have the substituents exemplified as R11 and R12 in the general formula (1).

  In the general formula (4), when Ar41 represents an aromatic heterocycle, the aromatic heterocycle includes a furan ring, a thiophene ring, an oxazole ring, a pyrrole ring, a pyridine ring, a pyridazine ring, a pyrimidine ring, and a pyrazine ring. , Triazine ring, benzimidazole ring, oxadiazole ring, triazole ring, imidazole ring, pyrazole ring, thiazole ring, indole ring, benzimidazole ring, benzothiazole ring, benzoxazole ring, quinoxaline ring, quinazoline ring, phthalazine ring, carbazole Ring, azacarbazole ring and the like. The azacarbazole ring has a structure in which one or more carbon atoms of the benzene ring constituting the carbazole ring are replaced with nitrogen atoms. These rings may further have the substituents exemplified as R11 and R12 in the general formula (1).

  In the general formula (5), at least one of E501 and E502 is a nitrogen atom, at least one of E511 to E515 is a nitrogen atom, and at least one of E521 to E525 is Nitrogen atom. R51 represents a substituent.

  In the general formula (5), when R51 represents a substituent, the substituents exemplified as R11 and R12 in the general formula (1) are similarly applied as examples of the substituent.

  In the general formula (6), E601 to E612 each represent —C (R61) ═ or —N═, and R61 represents a hydrogen atom or a substituent. Ar61 represents a substituted or unsubstituted aromatic hydrocarbon ring or aromatic heterocyclic ring.

  In the general formula (6), when R61 of —C (R61) ═ represented by E601 to E612 is a substituent, examples of the substituent include R11 and R12 of the general formula (1). The same substituents apply as well.

  In General Formula (6), the substituted or unsubstituted aromatic hydrocarbon ring or aromatic heterocyclic ring represented by Ar 61 has the same configuration as Ar 41 in General Formula (4).

(Compound-3)
As still another example of the compound constituting the nitrogen-containing layer, in addition to the compounds represented by the general formulas (1) to (6) as described above, compounds 1 to 118 shown below as specific examples are exemplified. These compounds are preferable since the stability of the compounds is high. In addition, these compounds 1-118 include compounds that fall within the range of the effective unshared electron pair content [n / M] described above, and such compounds constitute a nitrogen-containing layer alone. It is preferably used as a compound. Further, among these compounds 1-118, there are compounds that fall under the general formulas (1)-(6) described above.

[Examples of compound synthesis]
Specific examples of the synthesis of compound 5 are shown below as typical synthesis examples of the compound, but are not limited thereto.

Step 1: (Synthesis of Intermediate 1)
Under a nitrogen atmosphere, 2,8-dibromodibenzofuran (1.0 mol), carbazole (2.0 mol), copper powder (3.0 mol), potassium carbonate (1.5 mol), DMAc (dimethylacetamide) 300 ml Mixed in and stirred at 130 ° C. for 24 hours. The reaction solution thus obtained was cooled to room temperature, 1 L of toluene was added, washed with distilled water three times, the solvent was distilled off from the washed product under a reduced pressure atmosphere, and the residue was subjected to silica gel flash chromatography (n-heptane: Purification was performed using toluene = 4: 1 to 3: 1), and Intermediate 1 was obtained with a yield of 85%.

Step 2: (Synthesis of Intermediate 2)
Intermediate 1 (0.5 mol) was dissolved in 100 ml of DMF (dimethylformamide) at room temperature under air, NBS (N-bromosuccinimide) (2.0 mol) was added, and the mixture was stirred overnight at room temperature. The resulting precipitate was filtered and washed with methanol, yielding intermediate 2 in 92% yield.

Step 3: (Synthesis of Compound 5)
Under a nitrogen atmosphere, intermediate 2 (0.25 mol), 2-phenylpyridine (1.0 mol), ruthenium complex [(η ₆ -C ₆ H ₆ ) RuCl ₂ ] ₂ (0.05 mol), triphenyl Phosphine (0.2 mol) and potassium carbonate (12 mol) were mixed in 3 L of NMP (N-methyl-2-pyrrolidone) and stirred at 140 ° C. overnight.

After cooling the reaction solution to room temperature, 5 L of dichloromethane was added, and the reaction solution was filtered. Next, the solvent was distilled off from the filtrate under reduced pressure (800 Pa, 80 ° C.), and the residue was purified by silica gel flash chromatography (CH ₂ Cl ₂ : Et ₃ N = 20: 1 to 10: 1).

  After distilling off the solvent from the purified product under reduced pressure, the residue was dissolved again in dichloromethane and washed three times with water. The material obtained by washing was dried over anhydrous magnesium sulfate, and the solvent was distilled off from the dried material in a reduced-pressure atmosphere to obtain Compound 5 in a yield of 68%.

[Method for forming nitrogen-containing layer]
When the nitrogen-containing layer as described above is formed on the substrate 11, the forming method includes a method using a wet process such as a coating method, an ink jet method, a coating method, a dip method, a vapor deposition method (resistance heating, EB method, etc.), a method using a dry process such as a sputtering method and a CVD method. Of these, the vapor deposition method is preferably applied.

  In particular, in the case of forming a nitrogen-containing layer using a plurality of compounds, co-evaporation in which a plurality of compounds are simultaneously supplied from a plurality of evaporation sources is applied. If a polymer material is used as the compound, a coating method is preferably applied. In this case, a coating solution in which the compound is dissolved in a solvent is used. The solvent in which the compound is dissolved is not limited. Furthermore, if the nitrogen-containing layer is formed using a plurality of compounds, a coating solution may be prepared using a solvent that can dissolve the plurality of compounds.

(Aluminum layer)
The intermediate layer 13 as described above may be provided with an aluminum (Al) layer on the interface between the nitrogen-containing layer and the transparent conductive layer 14. The aluminum layer is formed with a thickness that does not hinder the interaction between the transparent electrode 14 and the nitrogen-containing layer. Further, the aluminum layer may be a layer having an island shape or a hole instead of a continuous film. In this case, a part of the silver layer is provided adjacent to the nitrogen-containing layer. Thus, the structure which pinched | interposed another metal between the nitrogen containing layer and the film | membrane which has silver as a main component may be sufficient. In this case, an alloy layer is formed between silver constituting the transparent conductive layer 14 or an alloy containing silver as a main component and an aluminum layer provided on the nitrogen-containing layer. Also good.

(Surface protective layer)
Further, a surface protective layer (not shown) may be provided on the transparent conductive layer 14 described above. The surface protective layer is preferably a continuous film, and may be a film formed from a curable composition of an acrylic monomer or oligomer, or a metal compound and a nitrogen compound used in the intermediate layer.

  In addition, in embodiment and the modification of the above-mentioned electroconductive film, although the example which comprises a transparent electrode using a transparent conductive layer is demonstrated, the structure of a transparent conductive layer is not limited to a transparent electrode, Other than a transparent electrode It is good also as what comprises.

[process]
In the formation process of the conductive film 11, the transparent electrode 12 is formed on a substrate made of a thermoplastic resin whose plane direction retardation (R0 value) satisfies +50 nm ≧ R0 ≧ −50 nm. At this time, it is preferable that the formation process of the transparent conductive layer 14 and the intermediate layer 13 does not exceed the glass transition temperature (Tg) of the transparent substrate 11. The formation process temperature is preferably 20 ° C. or more lower than the glass transition temperature (Tg) of the transparent substrate 11, and more preferably 40 ° C. or less.
By making the temperature of the transparent substrate lower than the glass transition point of the thermoplastic resin during the process, damage to the thermoplastic resin due to heat can be prevented. For this reason, the conductive film which is excellent in transparency and temporal stability can be formed, without affecting the surface direction retardation of a thermoplastic resin. Further, by forming a transparent conductive layer containing silver as a main component, a low-resistance conductive film can be formed at a temperature not higher than the glass transition point of the thermoplastic resin.

<3. Touch panel>
Next, an embodiment of the touch panel will be described.
In FIG. 3, the perspective view of schematic structure of the touchscreen using the above-mentioned electroconductive film is shown.
FIG. 4 is a plan view of two transparent electrodes showing the electrode configuration of the touch panel. FIG. 5 shows a schematic plan view of the electrode portion of the touch panel shown in FIGS. 3 and 4. FIG. 6 is a schematic cross-sectional view corresponding to the AA cross section shown in FIG.
In addition, the structure which applied the electroconductive film provided with the above-mentioned nitrogen containing layer as an intermediate layer is demonstrated to the touch panel of this example.

The touch panel 20 shown in these drawings is a projected capacitive touch panel. In the touch panel 20, a first transparent electrode 22 and a second transparent electrode 23 are arranged in this order on one main surface of a substrate 21, and an upper portion thereof is covered with a front plate 24. The substrate 21, the first transparent electrode 22, and the second transparent electrode 23 have a configuration in which two layers of the transparent electrode 12 are stacked in the conductive film described with reference to FIG. Therefore, the first transparent electrode 22 has a configuration in which the first nitrogen-containing layer 25 and the first transparent conductive layer 26 are laminated in this order. Similarly, the second transparent electrode 23 has a configuration in which a second nitrogen-containing layer 27 and a second transparent conductive layer 28 are laminated in this order.
Hereinafter, details of each main layer constituting the touch panel 20 will be described in order from the substrate 21 side. Here, description will be made with reference to FIGS. 3 and 4 and a schematic plan view of the electrode portion of FIG. 5 and a schematic cross-sectional view of FIG. 6 corresponding to the AA cross section. Further, the same components as those described in FIG. 2 are denoted by the same reference numerals, and redundant description is omitted.

[Substrate 21]
The substrate 21 shown in FIGS. 3 and 5 is a substrate having a surface direction retardation (R0 value) of ± 50 nm, preferably ± 20 nm, as described in the above-described embodiment of the conductive film.

[First Nitrogen-Containing Layer 25 (First Transparent Electrode 22)]
The first nitrogen-containing layer 25 is the nitrogen-containing layer described in the above-described modification of the conductive film, and is formed on the substrate 21. Here, as an example, the first nitrogen-containing layer 25 is provided so as to cover the entire surface of the substrate 21, but is patterned in the same shape as a first transparent conductive layer 26 described below. Also good.
Transparent conductive layer [first transparent conductive layer 26 (first transparent electrode 22)]
The first transparent conductive layer 26 is the transparent conductive layer described in the embodiment of the conductive film described above, and a plurality of x electrode patterns x1, x2,... Patterned on the first nitrogen-containing layer 25. It is configured as. Each of the x electrode patterns x1, x2,... Is arranged in parallel with an interval between each other, with each extending in the x direction. Each of these x electrode patterns x1, x2,... Has, for example, a shape in which rhombus pattern portions arranged in the x direction are linearly connected in the x direction in the vicinity of the apex of the rhombus.

  Moreover, x wiring 29x is connected to each edge part to each x electrode pattern x1, x2, .... These x wirings 29 x are wired in the peripheral region on the substrate 21 and are drawn out to the edge of the substrate 21. Each of such x wirings 29x may be configured as the first transparent conductive layer 26 mainly composed of silver, as in the case of the x electrode patterns x1, x2,. It may be composed of an electrode layer.

[Second Nitrogen-Containing Layer 27 (Second Transparent Electrode 23)]
The second nitrogen-containing layer 27 is the nitrogen-containing layer described in the above-described modification of the conductive film, and is formed on the substrate 21. Here, as an example, the second nitrogen-containing layer 27 is provided in a state in which the terminal portion of the x wiring 29x is exposed and the other portion covers the entire surface of one main surface of the substrate 21. It may be patterned in the same shape as the second transparent conductive layer 28 described in (1).

[Second Transparent Conductive Layer 28 (Second Transparent Electrode 23)]
The second transparent conductive layer 28 is the electrode layer described in the above-described embodiment of the conductive film, and as a plurality of y electrode patterns y1, y2,... Patterned on the second nitrogen-containing layer 27. It is configured. The y electrode patterns y1, y2,... Are arranged in parallel while being spaced apart from each other in a state of extending in the y direction orthogonal to the x electrode patterns x1, x2,. Each of these y electrode patterns y1, y2,... Has, for example, a shape in which rhombus pattern portions arranged in the y direction are linearly connected in the y direction in the vicinity of the apex of the rhombus.

  Here, as shown in FIG. 5, the rhombus pattern portions constituting the respective y electrode patterns y1, y2,... Are in contrast to the rhombus pattern portions forming the x electrode patterns x1, x2,. It is arranged at a position that does not overlap in plan view, and has a shape that occupies as large a range as possible without overlapping. As a result, in the central region of the substrate 21, the x electrode patterns x 1, x 2,... Constituted by the first transparent conductive layer 26 and the y electrode pattern constituted by the second transparent conductive layer 28. y1, y2,... are hardly visible.

  Each of the y electrode patterns y1, y2,... Is stacked with each of the x electrode patterns x1, x2,. Since the second nitrogen-containing layer 27 is sandwiched between these laminated portions, insulation between the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,.

  Moreover, y wiring 29y is connected to each edge part to each y electrode pattern y1, y2, .... These y wirings 29y are wired in the peripheral region on the substrate 21, and are drawn out to the edge of the substrate 21 so as to be aligned with the x wirings 29x. Each of the y wirings 29y may be configured as the second transparent conductive layer 28 mainly composed of silver, as in the case of the y electrode patterns y1, y2,. It may be composed of an electrode layer.

  A flexible printed circuit board or the like is connected to the x wiring 29x and the y wiring 29y drawn to the edge of the substrate 21.

[Front plate 24]
The front plate 24 illustrated in FIGS. 3 and 6 is a plate material on which a portion corresponding to the input position on the touch panel 20 is pressed. The front plate 24 is made of a light-transmitting plate material like the substrate 21. Further, the front plate 24 may be used by selecting a material having optical characteristics as required. Such a front plate 24 is bonded to the second transparent electrode 23 side by, for example, an adhesive layer 31 (see FIG. 6). The material of the adhesive layer 31 is not particularly limited as long as it has optical transparency.

  Further, the front plate 24 is provided with a light-shielding film that covers the periphery of the substrate 21, from the x wiring 29 x drawn from the x electrode patterns x 1, x 2,... And the y electrode patterns y 1, y 2,. The drawn out y wiring 29y is prevented from being visually recognized from the front plate 24 side.

[Touch panel operation]
When operating the touch panel 20 as described above, the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,... From the flexible printed circuit board connected to the x wiring 29x and the y wiring 29y. In contrast, a voltage is applied. When a finger or a touch pen touches the surface of the front plate 24 with a voltage applied, the capacitance of each part existing in the touch panel 20 changes, and the x electrode patterns x1, x2,... And the y electrode patterns y1, y2 It appears as a change in voltage. This change differs depending on the distance from the position touched by the finger or touch pen, and is greatest at the position touched by the finger or touch pen. For this reason, the position designated by the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,. .

[Effect of touch panel]
The touch panel 20 as described above uses, as the two-layer transparent electrodes 22 and 23, a conductive film having sufficient conductivity as well as light transmittance. Thereby, the voltage drop at the time of enlarging an electroconductive film can be suppressed, maintaining the visibility of the display image of a foundation | substrate, and the enlargement of the touch panel 20 is attained.

  In particular, the touch panel 20 is a projection capacitive type having x electrode patterns x1, x2,... And y electrode patterns y1, y2,. Therefore, the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,. In the touch panel of this example, the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,... Are transparent conductive layers mainly composed of silver. Is possible. Therefore, the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,.

<3. Modification Example 1 of Touch Panel>
(Configuration using two transparent substrates)
FIG. 7 is a schematic cross-sectional view for explaining a modification of the touch panel of the embodiment, and corresponds to a cross section taken along line AA in FIG. 5. The touch panel 30 shown in this figure has a configuration in which the first transparent electrode 22 and the second transparent electrode 23 are provided on one main surface of the two substrates 21A and 21B. It is the same as the form. For this reason, the same code | symbol is attached | subjected to the structure similar to the touch panel of the above-mentioned embodiment, and the overlapping description is abbreviate | omitted.

  In other words, the touch panel 30 according to the modification includes a first substrate 21A provided with the first transparent electrode 22 and a second substrate 21B provided with the second transparent electrode 23. These substrates 21A and 21B have the first transparent electrode 22 and the second transparent electrode 23 formed in the same direction with the first transparent electrode 22 formed on the first transparent electrode 22 formed on the first substrate 21A. The substrates 21B are arranged so as to be positioned.

  The first substrate 21A and the second substrate 21B are the same substrates 21 as the conductive film described above. The first transparent electrode 22 and the second transparent electrode 23 have the same configuration as that of the above-described embodiment, respectively, and the nitrogen-containing layers 25 and 27 and the transparent conductive layer on the substrates 21A and 21B, respectively. 26 and 28 are stacked in this order.

  Further, the configuration of each of the transparent conductive layers 26 and 28 is the same as that of the above-described embodiment, and the x electrode patterns x1, x2,... Configured by the first transparent conductive layer 26, and the second transparent conductive layer. The y electrode patterns y1, y2,... However, insulation between the first transparent conductive layer 26 and the second transparent conductive layer 28 is ensured by the second substrate 21 </ b> B and the second nitrogen-containing layer 27.

  Further, the laminated first substrate 21A and second substrate 21B are bonded together by an adhesive layer (not shown), and the first transparent conductive layer 26 and the second substrate 21B are also bonded by this adhesive layer. The two transparent conductive layers 28 are insulated.

  Even the touch panel 30 as described above can be operated in the same manner as the touch panel of the above-described embodiment.

[Effect of touch panel]
Even in the touch panel 30 of such a modified example, the use of a conductive film having sufficient light conductivity as well as light transmission can be increased in size as with the touch panel of the above-described embodiment. Deterioration of the visibility of the display image via 30 can be prevented.

<4. Modification Example 2 of Touch Panel>
(Configuration with transparent electrodes on both sides of the transparent substrate)
FIG. 8 is a schematic cross-sectional view for explaining a modification of the touch panel of the embodiment, and corresponds to a cross section taken along the line AA of FIG. The touch panel 32 shown in this figure has a configuration in which the first transparent electrode 22 and the second transparent electrode 23 are provided on both surfaces of the substrate 21, and the other configuration is the same as that of the above-described embodiment. For this reason, the same code | symbol is attached | subjected to the structure similar to the touch panel of the above-mentioned embodiment, and the overlapping description is abbreviate | omitted.

  The touch panel 32 shown in FIG. 8 includes a single substrate 21, a first transparent electrode 22 provided on one main surface side of the substrate 21, and a second transparent electrode provided on the other main surface side of the substrate 21. 23. Among these, the 1st transparent electrode 22 is the structure by which the nitrogen containing layer 25 and the transparent conductive layer 26 were laminated | stacked on the one main surface of the board | substrate 21 in this order. On the other hand, the 2nd transparent electrode 23 is the structure by which the nitrogen containing layer 27 and the transparent conductive layer 28 were laminated | stacked on the other main surface of the board | substrate 21 in this order.

  The substrate 21 is the same as that described for the conductive film. Moreover, each said layer which comprises the 1st transparent electrode 22 and the 2nd transparent electrode 23 is the same as that of the above-mentioned embodiment.

Further, the configuration of each of the transparent conductive layers 26 and 28 is the same as that of the above-described embodiment, and the x electrode patterns x1, x2,... Configured by the first transparent conductive layer 26, and the second transparent conductive layer. The y electrode patterns y1, y2,... However, insulation between the first transparent conductive layer 26 and the second transparent conductive layer 28 is ensured by the first nitrogen-containing layer 25, the substrate 21, and the second nitrogen-containing layer 27.
The touch panel 32 as described above can be operated in the same manner as the touch panel of the above-described embodiment.

[Effect of touch panel]
Even in the touch panel 32 of Modification 2 as described above, it is possible to increase the size as in the touch panel of the above-described embodiment by using a conductive film having sufficient conductivity as well as light transmittance. Deterioration of the visibility of the display image via the touch panel 32 can be prevented.

<5. Modification Example 3 of Touch Panel>
(Configuration with two patterns of transparent electrodes on the same plane of the transparent substrate)
FIG. 9 is a schematic cross-sectional view for explaining a modified example of the touch panel of the embodiment, and corresponds to a cross section taken along the line BB in FIG. 5. However, the laminated structure of the touch panel 40 of Modification 3 and the laminated structure of the touch panel 20 shown in FIG. 5 are different as described below. That is, the touch panel 40 shown in this figure includes a transparent conductive layer 26 having x electrode patterns x1, x2,... And a transparent conductive layer having y electrode patterns y1, y2,. 28, and the other configuration is the same as that of the above-described embodiment. For this reason, the same code | symbol is attached | subjected to the structure similar to the touch panel of the above-mentioned embodiment, and the overlapping description is abbreviate | omitted.

  That is, the touch panel 40 of Modification 3 includes the substrate 21, the nitrogen-containing layer 25 and the transparent conductive layers 26 and 28 that are sequentially stacked on the substrate 21. Further, an interlayer insulating film 41 and a connection electrode 42 are sequentially stacked on the transparent conductive layers 26 and 28. Among these, the transparent conductive layers 26 and 28 have x electrode patterns x1, x2,... And y electrode patterns y1, y2,... Provided on the nitrogen-containing layer 25 so as to be insulated from each other. It is characteristic.

(Substrate, nitrogen-containing layer)
The board | substrate 21 and the nitrogen-containing layer 25 are the structures similar to having demonstrated with the above-mentioned electroconductive film, respectively. Further, the nitrogen-containing layer 25 is provided as an example so as to cover the entire surface of one main surface of the substrate 21, but is patterned in the same shape as the transparent conductive layers 26 and 28 as in the above-described embodiment. May be.

(Transparent conductive layer)
The transparent conductive layers 26 and 28 are the electrode layers described in the above conductive film, and a plurality of x electrode patterns x1, x2,... Patterned on the nitrogen-containing layer 25 and a plurality of y electrode patterns y1, y2, and so on.

  Each of the x electrode patterns x1, x2,... Is arranged in parallel with an interval between each other, with each extending in the x direction. Each of these x electrode patterns x1, x2,... Has a shape in which rhombus pattern portions arranged in the x direction are linearly connected in the x direction in the vicinity of the apex of the rhombus, for example.

  The y electrode patterns y1, y2,... Are arranged in parallel while being spaced apart from each other in a state of extending in the y direction orthogonal to the x electrode patterns x1, x2,. Each of these y electrode patterns y1, y2,... Is composed of a plurality of patterns arranged in the y direction.

  The y electrode pattern is, for example, a rhombus, and is arranged with an interval enough to maintain an insulating state without overlapping with the x electrode patterns x1, x2,. Accordingly, the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,. In addition, the y electrode pattern has a shape that occupies as large a range as possible within a range having an interval sufficient to maintain an insulation state with the x electrode patterns x1, x2,. Thus, the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,.

  Further, each of the x electrode patterns x1, x2,... And each of the y electrode patterns y1, y2,. Has been.

(Interlayer insulation film, connection electrode)
The connection electrode 42 is connected in a straight line in the y direction in the vicinity of the apex of, for example, a rhombus y electrode pattern that constitutes each y electrode pattern. The connection electrode 42 is disposed at each position where the connection electrode 42 intersects the portion connecting the rhombic patterns of the x electrode patterns x1, x2,. In these intersecting portions, the interlayer insulating film 41 covers the portion connecting the rhombic patterns of the x electrode patterns x1, x2,..., And the connection electrode 42 is interlayer insulating on the x electrode patterns x1, x2,. They are stacked via the film 41. Therefore, the insulation between the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,. The connection electrode 42 may be made of a general electrode material such as silver, or an electrode material having optical transparency such as ITO. From the viewpoint of the visibility of the underlying display image via the touch panel 40, Preferably, an electrode material having optical transparency is used.

  The example in which the connection electrode 42 is provided in the upper layer of the transparent conductive layers 26 and 28 has been described above. However, the connection electrode 42 may be provided in the lower layer of the transparent conductive layers 26 and 28. At this time, the connection electrode 42 is disposed at each position where the connection electrode 42 intersects the portion connecting the rhombic patterns of the x electrode patterns x1, x2,. At these intersecting portions, at least the nitrogen-containing layer 25 is sandwiched between the connection electrode 42 and the portion connecting the rhombic patterns of the x electrode patterns x1, x2,. Therefore, in the example in which the connection electrode 42 is provided below the transparent conductive layers 26 and 28, the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,. Insulation is ensured.

  Even the touch panel 40 as described above can be operated in the same manner as the touch panel of the above-described embodiment.

[Effect of touch panel]
The touch panel 40 of the above-described modification 3 can be enlarged in the same manner as the touch panel of the above-described embodiment by using a conductive film having sufficient conductivity as well as light transmittance. The deterioration of the visibility of the displayed image can be prevented.

  The touch panel of the present invention is not limited to the configurations of the above-described embodiments and modifications, and can be widely applied as long as the configuration uses a transparent electrode. For example, in the case of a projected capacitive touch panel, the x electrode patterns x1, x2,... And the y electrode patterns y1, y2,. The putter shape is not limited. Further, the touch panel may be a resistance film type in which two transparent electrodes 22 and 23 each having a solid film-like transparent conductive layer 26 and 28 are arranged with a spacer interposed therebetween. A formula may be sufficient and the effect of enlargement can be obtained similarly.

<6. Display device>
[Configuration using touch panel]
Next, an embodiment of a display device using the touch panel described above will be described. FIG. 10 is a perspective view of the configuration of the display device of this embodiment. The display device 50 shown in this figure is a display device with an information input function in which a touch panel 51 is provided on the display surface of the display panel 52. As the touch panel 51 of the display device 50, the touch panel of the above-described embodiment and the modified example can be applied.

  The display panel 52 is not particularly limited. For example, a flat display panel such as a liquid crystal display panel or a display panel using an organic electroluminescent element, or a CRT (Cathode Ray Tube) display can be used. . The display panel 52 is not limited to a display panel that displays a moving image, and may be a display panel for a still image.

  In the display panel 52, the touch panel 51 is disposed so as to cover the display surface on the image display surface. The touch panel 51 and the display panel 52 are further accommodated in a frame-shaped case member 53 as necessary. Furthermore, a front plate made of a transparent plate material may be provided on the case member 53.

  Thus, the user can input the position information of the contact portion to the touch panel 51 by bringing a finger or a touch pen into contact with a part of the display image displayed on the display panel 52 via the touch panel 51. .

[Effect of display device]
According to the display device 50 of the present embodiment, it is possible to reduce the thickness and increase the size by using the above-described embodiment and the touch panel 51 of each modification.

  EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

[Example 1]
<Preparation of conductive film>
(Preparation of transparent substrate)
The transparent substrate used for an Example was prepared as follows.
In addition, the film thickness of each transparent substrate shown below was measured using the contact-type film thickness meter DIGIMICRO MH-15M (made by Nikon Corporation). Also, the in-plane retardation value (R0 value) is determined based on the automatic birefringence measuring device (manufactured by Oji Scientific Instruments) after leaving each transparent substrate for 24 hours or more in an environment of a temperature of 23 ° C. and a relative humidity of 55% RH No. KOBRA-21ADH) and measured at a wavelength of 590 nm.

(Transparent substrate 101)
Cosmo Shine A4300 (manufactured by Toyobo) was prepared as a polyethylene terephthalate film. The film thickness was 50 μm and the R0 value was 4200 nm.

(Transparent substrate 102)
Pure Ace C110-100 (manufactured by Teijin Ltd.) was prepared as a polycarbonate film. The film thickness was 100 μm and the R0 value was 10 nm.

(Transparent substrate 103)
Arton (manufactured by JSR) was prepared as a cyclic olefin film. The film thickness was 50 μm and the R0 value was 4 nm.

(Transparent substrate 104)
As a cycloolefin film, Zeonore ZF14 (manufactured by Zeon Corporation) was prepared. The film thickness was 100 μm and the R0 value was 3 nm.

(Transparent substrate 105)
As a triacetyl cellulose film, Konica Minolta Tac KC-4UY (manufactured by Konica Minolta) was prepared. The film thickness was 40 μm and the R0 value was 4 nm. The acyl substitution degree of the resin was 2.90.

(Transparent substrate 106)
As an acrylic film, acryloprene HBS006 (manufactured by Mitsubishi Rayon Co., Ltd.) was prepared. The film thickness was 50 μm and the R0 value was 3 nm.

(Transparent substrate 107)
The transparent substrate 105 was cut into a 20 cm square, and biaxial stretching of 1.4 times in length and 1.4 times in width was performed at 180 ° C. using a film biaxial stretching machine (manufactured by Hirano Tech Seed). The film thickness was 23 μm and the R0 value was 5 nm.

(Transparent substrates 108 to 113)
The following hard coat layer coating solution was applied to both surfaces of the transparent substrates 102 to 107 with a die coater to form a coating film to be a hard coat layer. After drying the coating film at 70 ° C., with a nitrogen purge so that the oxygen concentration is below the ambient 1.0% by volume, using a UV lamp, the illuminance of the irradiation unit is 300 mW / cm ^2, irradiation amount 0. The coating film was cured as 3 J / cm ² , and further, heat treatment was performed at 130 ° C. for 5 minutes in the heat treatment zone to produce transparent substrates 108 to 113. In addition, the film thickness of the hard-coat layer after hardening was 5 micrometers each.

(Preparation of hard coat layer coating solution)
The following constituent materials were mixed, stirred and dissolved to prepare a hard coat layer coating solution.
Hard coat layer coating solution Pentaerythritol tetraacrylate 30 parts by weight Dipentaerythritol hexaacrylate 60 parts by weight Dipentaerythritol pentaacrylate 50 parts by weight Irgacure 184 (BASF) 5 parts by weight Irgacure 907 (BASF) 5 parts by weight ZX -212 (fluorine-siloxane graft polymer, manufactured by T & K Toka)
5 parts by mass Seahoster KEP-50 (powdered silica particles, average particle size 0.47 to 0.61 μm, manufactured by Nippon Shokubai Co., Ltd.) 24.3 parts by mass Propylene glycol monomethyl ether 20 parts by mass Methyl acetate 40 parts by mass Methyl ethyl ketone 60 Parts by mass

  Table 2 shows the film thicknesses and R0 values of the transparent substrates 101 to 113.

(Preparation of conductive film 201)
On one side of the transparent substrate 101, the compound Nos. 10 was used to form an intermediate layer 13 (film thickness of 25 nm) by a vapor deposition method, and subsequently, an electrode layer 5 (film thickness of 8 nm) made of silver (Ag) was formed by a vapor deposition method. Subsequently, a surface protective layer (thickness 30 nm) made of titanium oxide (TiO ₂ ) was formed by vapor deposition. Thereby, the electroconductive film 201 which has the transparent electrode of 3 layer structure of an intermediate | middle layer, a transparent conductive layer, and a surface protective layer was produced.

At this time, first, the transparent substrate 101 was fixed to a base material holder of a commercially available vacuum deposition apparatus. In addition, Compound No. 1 in Table 1 was used. 10 was placed in a resistance heating boat made of tantalum. These substrate holder and heating boat were attached to the first vacuum chamber of the vacuum deposition apparatus. Moreover, silver (Ag) was put into the resistance heating boat made from tungsten, and it attached in the 2nd vacuum chamber. Further, titanium oxide (TiO ₂ ) was placed in a tantalum resistance heating boat and attached in the third vacuum chamber.

Next, after depressurizing the first vacuum tank to 4 × 10 ⁻⁴ Pa, the heating boat containing each compound was energized and heated, and the transparent substrate 101 was deposited at a deposition rate of 0.1 nm / second to 0.2 nm / second. An intermediate layer 13 having a film thickness of 25 nm was provided thereon.

Next, the transparent substrate 101 formed up to the intermediate layer 13 is transferred to the second vacuum chamber while being vacuumed, and after the pressure of the second vacuum chamber is reduced to 4 × 10 ⁻⁴ Pa, a heating boat containing silver is energized. Heated. Thereby, a transparent conductive layer made of silver having a film thickness of 8 nm was formed at a deposition rate of 0.1 nm / second to 0.2 nm / second.

Next, the transparent substrate 101 on which the intermediate layer and the electrode layer were formed was transferred to the third vacuum chamber while maintaining a vacuum, and after the pressure in the third vacuum chamber was reduced to 4 × 10 ⁻⁴ Pa, titanium oxide (TiO ₂ ) was contained. The heating boat was energized and heated. Thereby, a surface protective layer made of titanium oxide (TiO ₂ ) having a film thickness of 30 nm was formed at a deposition rate of 0.1 nm / second to 0.2 nm / second.

Through the above-described steps, a conductive film 201 having a laminated structure of the intermediate layer, the transparent conductive layer above this, and the surface protective layer was obtained.
The vapor deposition film thickness is J. A. Woollam Co. Inc. It measured with the VB-250 type | mold VASE ellipsometer made from.

(Preparation of conductive film 202)
On one side of the transparent substrate 111, the compound Nos. 10 was used to form an intermediate layer 13 (film thickness: 25 nm) by vapor deposition, then taken out from the first vacuum layer, and then an ITO film was formed on the intermediate layer 13 by sputtering. The ITO film thickness was 20 nm.

(Preparation of conductive film 203)
In the production of the conductive film 202, the conductive film 203 was produced in the same manner except that the sputtering time was changed so that the ITO film thickness was 130 nm.

(Preparation of conductive films 204-220)
In the production of the conductive film 201, the conductive films 204 to 220 were produced in the same manner except that the type of the transparent substrate, the compound and film thickness of the intermediate layer, and the film thickness of the electrode layer were changed to the conditions shown in Table 3. did.

(Evaluation of each sample)
About the produced conductive films 201-220, the surface resistivity, the bending resistance, the interference unevenness, and the surface resistivity deterioration after wet heat durability were measured.

(Surface resistivity)
The produced conductive film was allowed to stand for 24 hours in an environment of a temperature of 23 ° C. and a relative humidity of 55% RH, then cut into a 20 cm square and passed through a 25 μm double-sided adhesive tape (substrate-less tape MO-3005C, manufactured by Lintec). The glass plate (thickness 1.2 mm) whose surface was previously washed with ethanol was bonded to the glass surface so that the conductive layer was the front.
Thereafter, using a resistivity meter (MCP-T610 manufactured by Mitsubishi Chemical Corporation), arbitrary 10 points were measured by a four-terminal four-probe method constant current application method, and the average value was taken as the surface resistivity of the sample.

(Transmittance)
The produced conductive film was allowed to stand for 24 hours in an environment of a temperature of 23 ° C. and a relative humidity of 55% RH, and the transmittance was measured using a haze meter (turbidimeter) (model: NDH 2000, manufactured by Nippon Denshoku Co., Ltd.). And measured.

(Flexibility)
The produced conductive film was evaluated for bending resistance according to a method defined in JIS K 5400. In evaluating the bending resistance, a stainless steel rod having a diameter of 10 mm was used for winding the optical film sample.
As for the state of the electrode layer, rank evaluation was performed as follows.
◎: No change ○: Slightly deformed but no problem in practical use △: Fine cracks occurred in the electrode layer ×: Cracks occurred in the electrode layer

(Color unevenness)
The touch panel of New iPad (9.7-inch IPS liquid crystal tablet computer manufactured by Apple) is removed, and the conductive film thus produced is subjected to a conductive layer via a 25 μm double-sided adhesive tape (substrate-less tape MO-3005C manufactured by Lintec). It was pasted to face the display surface. White color was displayed on the display, and the display surface was observed through polarized sunglasses from 45 ° obliquely.
As a result of the test, rank evaluation was performed as follows.
◎: Color unevenness was not observed at all ○: Color unevenness was slightly observed, but there was no problem in practical use △: Color unevenness was observed ×: Very dark rainbow-shaped color unevenness was observed

(Surface resistance degradation due to wet heat durability)
The sample whose surface resistivity was measured was allowed to stand for 300 hours in an environment of a temperature of 60 ° C. and a relative humidity of 90% RH, and then the surface specific resistance value at any 10 points was measured, and the average value after the wet heat durability of the sample was measured. The surface resistivity was used.
As a result of the test, rank evaluation was performed as follows.
When [surface resistance deterioration] = [(surface resistivity after wet heat durability) − (surface resistivity before wet heat durability)] / [surface resistivity before wet heat durability]
◎: Surface resistance degradation is less than ± 10% ○: Surface resistance degradation is ± 10% or more and less than ± 20% △: Surface resistance degradation is ± 20% or more and less than ± 30% × : Surface resistance degradation is ± 30%

Table 3 shows the configuration of the conductive film and the evaluation results.
No. The conductive films 204 to 220 are excellent in surface resistivity, transmittance, and flexibility, and have little deterioration in surface resistance due to wet heat durability, and are excellent in color unevenness when bonded to a display panel.
No. In the conductive films of 204 to 220, there is a tendency that the evaluation of the color unevenness is different due to the R0 value of the base material of each sample and the influence of the base material film thickness. In each sample, the smaller the R0 value of the base material, the higher the evaluation of the uneven color of the conductive film. Furthermore, the smaller the substrate film thickness, the higher the evaluation of color unevenness. Further, it is considered that the bending resistance is influenced by the material of the base material.

[Example 2]
<Production of roll-shaped conductive film>
(Preparation of roll-shaped conductive film 301)
While continuously running between rolls in a roll-to-roll manner under vacuum on one side of a roll-shaped transparent substrate 101 having a width of 1000 mm and a length of 500 m, the compound Nos. 10 was used to form an intermediate layer 13 (film thickness of 25 nm) by a vapor deposition method, and subsequently, an electrode layer 5 (film thickness of 8 nm) made of silver (Ag) was formed by a vapor deposition method. Subsequently, a surface protective layer (thickness 30 nm) made of titanium oxide (TiO ₂ ) was formed by vapor deposition. This produced the roll-shaped conductive film 301 which has the transparent electrode of the three-layer structure of an intermediate | middle layer and a transparent conductive layer.

  At this time, first, the transparent substrate 101 was set on the feeding shaft of the feeding portion. In addition, Compound No. 1 in Table 1 was used. 10 is the compound No. of the vapor deposition source of the first forming part. 10 was placed in a resistance heating boat made of tantalum. Moreover, silver (Ag) was put into the resistance heating boat made from tungsten, and it attached in the 2nd formation part.

Next, after reducing the pressure in the first forming portion to 4 × 10 ⁻⁴ Pa, the heating boat containing each compound was energized and heated, and the top of the roll was applied at a deposition rate of 0.1 nm / second to 0.2 nm / second. An intermediate layer having a film thickness of 25 nm was provided on the traveling transparent substrate 101.

Next, the transparent substrate 101 that has been formed up to the intermediate layer is run to the second forming portion in a vacuum, the second forming portion is depressurized to 4 × 10 ⁻⁴ Pa, and then a heating boat containing silver is energized. Heated. As a result, an electrode layer made of silver having a film thickness of 8 nm and a deposition rate of 0.1 nm / second to 0.2 nm / second was formed on the transparent substrate 101 running on the roll.

Next, the transparent substrate 101 on which the intermediate layer and the electrode layer are formed is allowed to travel to the third forming portion while being vacuumed. After the third forming portion is depressurized to 4 × 10 ⁻⁴ Pa, titanium oxide (TiO ₂ ) is contained. The heated boat was energized and heated. Thereby, a surface protective layer made of titanium oxide (TiO ₂ ) having a film thickness of 30 nm and a deposition rate of 0.1 nm / second to 0.2 nm / second was formed on the transparent substrate 101 running on the roll.

Through the above steps, a roll-shaped conductive film 301 having a laminated structure of the intermediate layer, the upper transparent conductive layer, and the surface protective layer was obtained.
The vapor deposition film thickness is J. A. Woollam Co. Inc. It measured with the VB-250 type | mold VASE ellipsometer made from.

(Production of roll-shaped conductive films 302 to 309)
In the production of the roll-shaped conductive film 301, the roll-shaped conductive film 302 was similarly obtained except that the type of the transparent substrate, the compound and film thickness of the intermediate layer, and the film thickness of the electrode layer were changed to the materials shown in Table 4. -309 were produced.

(Durability evaluation: Unevenness of surface resistivity after storage of roll body under high temperature and high humidity)
The produced roll-shaped conductive film was left for 1000 hours in a high-temperature and high-humidity environment at a temperature of 60 ° C. and a relative humidity of 90%. Then, about the surface resistivity of the outermost periphery side of the obtained roll body, the surface resistivity in the point of 25% of the full width, the point of 50%, and the point of 75% was measured from the one end part in the width direction, respectively. . Next, in the longitudinal direction of the conductive film, the same measurement is repeated every 10 m for a range of 500 m from the roll outer side of the roll body to the core side, and the total surface resistivity of 150 points (3 points × 50) is obtained. It was measured. Then, the ratio (%) of the difference between the maximum value and the minimum value of the surface resistivity at all measurement points when the average value of all measurement points was 100 was determined as “variability of the conductive film 1”.

Similarly, the surface resistivity of a total of 150 points was also measured for the rolls immediately after production that were not stored under high temperature and high humidity. Then, the ratio (%) of the difference between the maximum value and the minimum value of the surface resistivity at all the measurement points when the average value of all the measurement points was 100 was determined as “variation of surface resistivity 2”.
Then, the obtained variation in the surface resistivity 1 and the variation in the surface resistivity 2 were applied to the following equation to obtain an increase in the variation in the surface resistivity.
Increase width of variation (%) = variation of surface resistivity 1 (%)-variation of surface resistivity 2 (%)
And the nonuniformity of the surface resistivity after preservation | save of a roll body under high temperature and humidity was evaluated in accordance with the following reference | standard.
A: Increase in variation is less than 1.0% B: Increase in variation is 1.0% or more and less than 2.0% Δ: Increase in variation is 2.0% or more and less than 5.0% X: Increase in variation is 5.0% or more

Table 4 shows the configuration of the roll-shaped conductive film and the evaluation results.
No. The roll-shaped conductive films of 304 to 309 are good with little change in surface resistivity even when stored in a roll body.

[Example 3]
<Production of LCD with touch panel>
(Production of liquid crystal display devices 401 to 409 with a touch panel)
As a VA mode type liquid crystal display device (image display device), a Sony BRAVIAV1, 40 inch type was prepared.
Two roll-shaped conductive films 301 to 309 prepared in Example 2 were cut into a size of 900 mm long side × 500 mm short side. One side of a glass plate (long side 900 mm × short side 500 mm, thickness 1.2 mm) that is patterned by photoetching so that one side is conductive in the long side direction and one side is conductive in the short side direction, and the surface is previously washed with ethanol In addition, the film was laminated so as to be glass, double-sided tape, conductive film, double-sided tape, and conductive film via a 25 μm double-sided adhesive tape (substrate-less tape MO-3005C, manufactured by Lintec Corporation). The VA mode type liquid crystal display devices 401 to 409 with a simple touch panel were manufactured by connecting to the extraction electrode and the driver IC and overlapping the display surface of the VA mode type liquid crystal display device with a gap of 1.5 mm.

The following evaluation was performed about the produced liquid crystal display device.
(Touch panel performance)
In the operation of the touch panel,
○: Good operation ×: Touch panel does not respond

(Uneven interference)
A color bar was displayed on the display, and the display surface was observed visually at an angle of 45 °. As a result of the test, rank evaluation was performed as follows.
◎: Interference unevenness was not observed at all ○: Interference unevenness was slightly observed, but there was no problem in practical use △: Interference unevenness was observed ×: Very dark rainbow-shaped interference unevenness was observed

  Table 5 shows the configuration of the liquid crystal display device and the evaluation results.

  From the results shown in Table 5, the touch panels 404 to 409 using the conductive films 304 to 309 are preferable because they have good operability and no interference unevenness even in a large television.

  The present invention is not limited to the configuration described in the above-described embodiment, and various modifications and changes can be made without departing from the configuration of the present invention.

  10 conductive film, 11 transparent substrate, 11, 21, 21A substrate, 12 transparent electrode, 13 intermediate layer, 14 transparent conductive layer, 20, 30, 32, 40, 51 touch panel, 21A first substrate, 21B second Substrate, 22 First transparent electrode, 23 Second transparent electrode, 24 Front plate, 25 First nitrogen-containing layer, 26 First transparent conductive layer, 27 Second nitrogen-containing layer, 28 Second transparent conductive Layer, 29x x wiring, 29y y wiring, 31 adhesive layer, 41 interlayer insulating film, 42 connection electrode, 50 display device, 52 display panel, 53 case member, x1, x2, x3 x electrode pattern, y1, y2, y3 y Electrode pattern

Claims (11)

A substrate made of a thermoplastic resin having a surface direction retardation (R0 value) satisfying +50 nm ≧ R0 ≧ −50 nm;
A conductive film comprising: a transparent conductive layer mainly composed of silver formed on the substrate.   2. The conductive film according to claim 1, wherein the transparent conductive layer has a thickness of 1 nm to 20 nm and a total light transmittance of 80% or more.   The conductive film according to claim 1, wherein the thermoplastic resin is at least one selected from a cellulose acylate resin, a cyclic olefin resin, a polycarbonate resin, and a (meth) acrylic resin. Said conductive film is the size of the width direction more than 0.3 m, the longitudinal dimension is at least 200 meters, according to claim 1 which is rolled wound longitudinally Conductive film. The conductive film according to claim 1, wherein the transparent conductive layer is provided adjacent to the nitrogen-containing layer. In the nitrogen-containing layer, the relationship between the molecular weight M and the number n of effective unshared electron pairs is 2.0 × 10 ^-3 The conductive film according to claim 5, comprising a compound satisfying ≦ [n / M]. The conductive film according to claim 5, wherein the nitrogen-containing layer contains a compound represented by the general formula (1).
[In the formula of the general formula (1), E101 to E108 each represent -C (R12) = or -N =, and at least one of E101 to E108 is -N =. Moreover, R11 in General formula (1) and said R12 represent a hydrogen atom or a substituent. ] The conductive film according to claim 5, wherein the nitrogen-containing layer contains a compound represented by the general formula (5).
[In the formula (5), at least one of E501 and E502 is a nitrogen atom, at least one of E511 to E515 is a nitrogen atom, and at least one of E521 to E525 is Nitrogen atom. R51 represents a substituent. ] The conductive film according to claim 5, wherein the nitrogen-containing layer contains a compound represented by the general formula (6).
[In the formula of the general formula (6), E601 to E612 each represent —C (R61) ═ or —N═, and R61 represents a hydrogen atom or a substituent. Ar61 represents a substituted or unsubstituted aromatic hydrocarbon ring or aromatic heterocyclic ring. ] A touch panel provided with the conductive film according to claim 1 as an electrode. A display device comprising: the touch panel according to claim 10; and a display panel disposed on the touch panel.