JP5944155B2 - LAMINATED SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING LAMINATED SHEET - Google Patents

Description

  The present invention relates to a laminated sheet and a method for manufacturing a semiconductor device using the laminated sheet.

  In recent years, there has been a further demand for thinner and smaller semiconductor devices and their packages. Therefore, as a semiconductor device and its package, a flip chip type semiconductor device in which a semiconductor element such as a semiconductor chip is mounted on a substrate by flip chip bonding is widely used. In flip chip bonding, the circuit surface of the semiconductor chip is fixed in a form facing the electrode forming surface of the substrate.

  A gap is formed between the semiconductor element after the flip chip bonding and the substrate. Conventionally, the gap is filled with a sealing material (such as a sealing resin) and sealed. However, in general, the gap between the semiconductor element and the substrate is narrow, and it is difficult to impregnate the gap with a liquid sealing material without generating voids, and there is a problem that a process time is required.

  Therefore, conventionally, there has been disclosed a method for easily and reliably sealing a gap between a semiconductor element and a substrate by using an adhesive film as a sealing material and bonding the semiconductor element and the substrate through the adhesive film. (For example, refer to Patent Documents 1 to 3).

  Conventionally, semiconductor devices have been thinly ground in response to demands for thinning and miniaturization of semiconductor devices and their packages. Patent Documents 4 and 5 disclose a manufacturing method including a process of thinly grinding a semiconductor element and a process of sealing a gap between the semiconductor element and the substrate using an adhesive film. Yes.

Japanese Patent Laid-Open No. 9-213741 JP-A-10-242208 JP-A-10-270497 JP 2002-118147 A JP 2008-130588 A

  Patent Document 4 discloses a method of mounting a semiconductor chip on a printed wiring board, including the following steps [a] to [g]. [A] A step of manufacturing a semiconductor chip mounting sheet comprising a thermosetting resin layer provided on one surface of a synthetic resin film. [B] A step of pressure-bonding the thermosetting resin layer of the semiconductor chip mounting sheet to the surface of the semiconductor wafer on which the bump electrodes are provided. [C] A step of grinding the back surface of the semiconductor wafer in a state where the semiconductor chip mounting sheet is pressure-bonded to a desired thickness. [D] A step of dicing the semiconductor wafer whose back surface has been ground into individual semiconductor chips in a state where the semiconductor chip mounting sheet is pressed. [E] A step of peeling off the synthetic resin film of the semiconductor chip mounting sheet that is pressure-bonded to the bump electrode surface of the semiconductor chip obtained by dicing. [F] A step of positioning the bump electrodes of the semiconductor chip so that the bump electrodes of the semiconductor chip correctly face and contact the corresponding terminal portions on the printed wiring board. [G] A step of bonding the bump electrodes of the semiconductor chip to the corresponding terminal portions on the printed wiring board and heating and curing the thermosetting resin.

  In Patent Document 4, the semiconductor chip mounting sheet is diced into individual semiconductor chips while being crimped (see [d] above), and then crimped to the bump electrode surface of the semiconductor chip obtained by dicing. The synthetic resin film of the semiconductor chip mounting sheet is peeled off (see [e] above). However, in such a process, the synthetic resin film is also separated into pieces by dicing, so when peeling the synthetic resin film from the semiconductor chip, it cannot be peeled off from a plurality of semiconductor chips at once. However, there is a problem that it has to be peeled off individually and requires man-hours.

  Further, in Patent Document 5, a plurality of electronic elements that are not electrically connected to each other, an adhesive composition for a semiconductor formed on a surface on which electrodes and electrodes are formed, and a plastic laminated on the adhesive composition for semiconductor An electronic device system manufacturing method using an electronic device substrate having a film is disclosed. In this manufacturing method, a pressure-sensitive adhesive layer is formed on the semiconductor adhesive composition of the electronic device substrate, and then the surface of the electronic device wafer on which the electronic elements are not formed is polished, the plastic film is peeled off, and then the individual pieces are separated by dicing. The electronic device with the adhesive composition for semiconductor is separated and mounted on the circuit board, and the electrode formed on the electronic device and the electrode on the circuit board are directly contacted to make electrical connection ing.

  However, in Patent Document 5, dicing is performed after the plastic film is peeled off. That is, dicing is performed with the semiconductor adhesive composition exposed. Therefore, water at the time of dicing is adsorbed by the adhesive composition for semiconductors, which causes a void or void in the layer of the adhesive composition for semiconductors during flip chip mounting. Moreover, there exists a possibility that cutting waste may adhere. Therefore, there exists a problem of causing the fall of adhesive force and the fall of electrical reliability.

  The present invention has been made in view of the above-described problems, and the object thereof is to prevent a decrease in the adhesive strength and electrical reliability of the resin composition layer, and a back-up after dicing. An object of the present invention is to provide a laminated sheet that can peel a grind tape from a plurality of semiconductor elements at once, and a method for manufacturing a semiconductor device using the laminated sheet.

  In order to solve the conventional problems, the inventors of the present application have studied a laminated sheet and a method for manufacturing a semiconductor device using the laminated sheet. As a result, an adhesive sheet having a back grind tape having a configuration in which a pressure-sensitive adhesive layer is formed on a substrate, and a resin composition layer provided on the pressure-sensitive adhesive layer of the back grind tape, By using a laminated sheet in which the tensile elastic modulus of the pressure-sensitive adhesive layer is within a specific range and the T peel strength between the pressure-sensitive adhesive layer and the resin composition layer is within a specific range, adhesion of the resin composition layer is achieved. In order to complete the present invention, it is possible to prevent a decrease in force and a decrease in electrical reliability and to find that a back grind tape can be peeled from a plurality of semiconductor elements at once after dicing. It came.

  That is, the laminated sheet according to the present invention includes a back grind tape having a configuration in which an adhesive layer is formed on a substrate, and a resin composition layer provided on the adhesive layer of the back grind tape. It is a laminated sheet, and the tensile elastic modulus of the pressure-sensitive adhesive layer is 0.1 to 5.0 MPa at 23 ° C., and the T peel strength between the pressure-sensitive adhesive layer and the resin composition layer is 23 ° C., 300 mm / It is characterized by being 0.1-5 N / 20 mm under the condition of minutes.

  The laminated sheet is obtained by bonding the resin composition layer surface of the laminated sheet to the circuit surface of the semiconductor wafer to obtain a semiconductor wafer with the laminated sheet, and grinding the surface of the laminated wafer with the laminated sheet that is not attached. The dicing tape is laminated to the ground surface of the thinned semiconductor wafer with the laminated sheet to obtain a semiconductor wafer in which the dicing tape and the laminated sheet are laminated, and the dicing tape and the laminated sheet are A step of dicing the bonded semiconductor wafer from the laminated sheet side, a step of attaching an adhesive tape to the laminated sheet after dicing, and peeling the adhesive tape from the resin composition layer together with the back grind tape Used in a method of manufacturing a semiconductor device comprising a step of That.

  According to the laminated sheet, since the dicing is performed in a state where the back grind tape is stuck on the resin composition layer, the resin composition layer absorbs water at the time of dicing, or the cutting waste becomes the resin composition layer. It can suppress adhering to. As a result, it is possible to prevent the adhesive strength of the resin composition layer from being lowered and the electrical reliability from being lowered. Moreover, since the T peel strength between the pressure-sensitive adhesive layer and the resin composition layer is 0.1 N / 20 mm or more under the conditions of 23 ° C. and 300 mm / min, it is possible to suppress flying of the back grind tape during dicing. Can do. Moreover, since the T peel strength is 5 N / 20 mm or less, the adhesive tape can be peeled from the resin composition layer together with the back grind tape. Further, since the tensile elastic modulus of the pressure-sensitive adhesive layer is 0.1 MPa or more at 23 ° C., it is possible to suppress the back grind tape from flying during dicing. Moreover, since the said tensile elasticity modulus of the said adhesive layer is 5.0 Mpa or less, an adhesive tape can be peeled off from a resin composition layer with a back grind tape.

  In the said structure, it is preferable that the said resin composition layer contains a thermosetting resin. When the resin composition layer contains a thermosetting resin, it can be used as a sealing material between the semiconductor element and the adherend when the semiconductor element is flip-chip mounted.

  In the said structure, it is preferable that the said thermosetting resin is an epoxy resin.

  In addition, a method for manufacturing a semiconductor device according to the present invention includes a back grind tape having a configuration in which an adhesive layer is formed on a substrate, and a resin composition layer provided on the adhesive layer of the back grind tape. The tensile elastic modulus of the pressure-sensitive adhesive layer is 0.1 to 5.0 Pa at 23 ° C., and the T peel strength between the pressure-sensitive adhesive layer and the resin composition layer is 23 ° C. and 300 mm / min. A method for manufacturing a semiconductor device using a laminated sheet having a thickness of 0.1 to 5 N / 20 mm under the above conditions, wherein a resin composition layer surface of the laminated sheet is bonded to a circuit surface of a semiconductor wafer, and a semiconductor with a laminated sheet A step of obtaining a wafer, a step of grinding and thinning a surface of the semiconductor wafer with a laminated sheet that is not affixed, and a dicing tape bonded to a ground surface of the thinned semiconductor wafer with a laminated sheet A step of obtaining a semiconductor wafer in which the dicing tape and the laminated sheet are bonded together, a step of dicing the semiconductor wafer in which the dicing tape and the laminated sheet are bonded together from the laminated sheet side, and after the dicing, the lamination The method includes a step of attaching an adhesive tape to a sheet, and a step of peeling the adhesive tape together with the back grind tape from the resin composition layer.

  According to the method for manufacturing a semiconductor device according to the present invention, dicing is performed in a state where the back grind tape is attached to the resin composition layer, so that the resin composition layer absorbs water during dicing or is cut. It can suppress that refuse adheres to a resin composition layer. As a result, it is possible to prevent the adhesive strength of the resin composition layer from being lowered and the electrical reliability from being lowered. Moreover, since the T peel strength between the pressure-sensitive adhesive layer and the resin composition layer is 0.1 N / 20 mm or more under the conditions of 23 ° C. and 300 mm / min, it is possible to suppress flying of the back grind tape during dicing. Can do. Moreover, since the T peel strength is 5 N / 20 mm or less, the adhesive tape can be peeled from the resin composition layer together with the back grind tape. Further, since the tensile elastic modulus of the pressure-sensitive adhesive layer is 0.1 MPa or more at 23 ° C., it is possible to suppress the back grind tape from flying during dicing. Moreover, since the said tensile elasticity modulus of the said adhesive layer is 5.0 Mpa or less, an adhesive tape can be peeled off from a resin composition layer with a back grind tape.

  In the said structure, it is preferable that the said resin composition layer contains a thermosetting resin. When the resin composition layer contains a thermosetting resin, it can be used as a sealing material between the semiconductor element and the adherend when the semiconductor element is flip-chip mounted.

  In the said structure, it is preferable that the said thermosetting resin is an epoxy resin.

  ADVANTAGE OF THE INVENTION According to this invention, it can prevent the fall of the adhesive force of a resin composition layer and a fall of electrical reliability, and can peel a back grind tape from several semiconductor elements collectively after dicing. A laminated sheet and a method for manufacturing a semiconductor device using the laminated sheet can be provided.

It is a cross-sectional schematic diagram which shows the lamination sheet which concerns on one Embodiment of this invention. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the semiconductor device using the lamination sheet shown in FIG. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the semiconductor device using the lamination sheet shown in FIG. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the semiconductor device using the lamination sheet shown in FIG. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the semiconductor device using the lamination sheet shown in FIG. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the semiconductor device using the lamination sheet shown in FIG. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the semiconductor device using the lamination sheet shown in FIG. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the semiconductor device using the lamination sheet shown in FIG. It is a cross-sectional schematic diagram which shows an example of the manufacturing method of the semiconductor device using the lamination sheet shown in FIG.

  Embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to these examples. FIG. 1 is a schematic cross-sectional view showing a laminated sheet according to an embodiment of the present invention. In the drawings, parts unnecessary for the description are omitted, and there are parts shown enlarged or reduced for easy explanation.

(Laminated sheet)
The laminated sheet 10 includes a back grind tape 11 having a configuration in which an adhesive layer 14 is formed on a substrate 12, and a resin composition layer 16 provided on the adhesive layer 14 of the back grind tape 11.

The laminated sheet 10 is one in which the pressure-sensitive adhesive layer 14 is formed of a general pressure-sensitive adhesive, and is used in a method for manufacturing a semiconductor device including the following steps.
The step of bonding the resin composition layer 16 surface of the laminated sheet 10 to the circuit surface of the semiconductor wafer 40 to obtain the semiconductor wafer 40 with the laminated sheet 10 (see FIG. 2), the laminated sheet 10 of the semiconductor wafer 40 with the laminated sheet 10 The process of grinding and thinning the surface that is not attached (see FIG. 3), the dicing tape 20 is bonded to the ground surface of the thinned semiconductor wafer 40 with the laminated sheet 10, and the dicing tape 20 and the laminated sheet 10 are A step of obtaining a bonded semiconductor wafer 40 (see FIG. 4), a step of dicing the semiconductor wafer 40 bonded with the dicing tape 20 and the laminated sheet 10 from the laminated sheet 10 side (see FIG. 5), and after dicing , The step of attaching the adhesive tape 30 to the laminated sheet 10 (see FIG. 6), and the backgrinding of the adhesive tape 30 With-loop 11, a method of manufacturing a semiconductor device comprising the step (see FIG. 7) for peeling from the resin composition layer 16.

(Base material)
The substrate 12 is a strength matrix of the laminated sheet 10. Examples of the material of the substrate 12 include low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolyprolene, polybutene, and polymethyl. Polyolefin such as pentene, ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, ethylene-butene copolymer, ethylene-hexene copolymer Polymer, Polyurethane, Polyester such as polyethylene terephthalate, Polyethylene naphthalate, Polycarbonate, Polyimide, Polyetheretherketone, Polyimide, Polyetherimide, Polyamide, Fully aromatic polyamide, Polyphenyl Rufuido, aramid (paper), glass, glass cloth, fluorine resin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, metal (foil), paper, and the like.

  Moreover, as a material of the base material 12, polymers, such as the crosslinked body of the said resin, are mentioned. The plastic film may be used unstretched or may be uniaxially or biaxially stretched as necessary.

  The surface of the substrate 12 is chemically treated by conventional surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high-voltage impact exposure, ionizing radiation treatment, etc., in order to improve adhesion and retention with adjacent layers. Alternatively, a physical treatment or a coating treatment with a primer (for example, an adhesive substance described later) can be performed. As the material of the base material 12, the same kind or different kinds can be appropriately selected and used, and a blend of several kinds can be used as necessary. Further, in order to impart antistatic ability to the base material 12, a deposited layer of a conductive material having a thickness of about 30 to 500 mm made of metal, alloy, oxides thereof and the like is provided on the base material 12. be able to. The substrate 12 may be a single layer or two or more layers. In addition, as a base material 12, when an adhesive layer is a radiation-curing-type adhesive layer, it is suitable to use what transmits at least one part of radiations, such as X-ray | X_line, an ultraviolet-ray, and an electron beam.

  The thickness of the substrate 12 is not particularly limited and can be determined as appropriate, but is generally about 5 to 200 μm.

(Adhesive layer)
As the pressure-sensitive adhesive used for forming the pressure-sensitive adhesive layer 14, a general pressure-sensitive adhesive such as an acrylic pressure-sensitive adhesive or a rubber pressure-sensitive adhesive can be used. As the pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer from the viewpoint of cleanability with an organic solvent such as ultrapure water or alcohol of an electronic component that is difficult to contaminate a semiconductor wafer or glass Is preferred.

  Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester , Octadecyl esters, eicosyl esters, etc., alkyl groups having 1 to 30 carbon atoms, especially 4 to 18 carbon linear or branched alkyl esters, etc.) and Meth) acrylic acid cycloalkyl esters (e.g., cyclopentyl ester, acrylic polymers such as one or more was used as a monomer component of the cyclohexyl ester etc.). In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) of the present invention has the same meaning.

  The acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance and the like. You may go out. Examples of such monomer components include, for example, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl group-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; Styrene Contains sulfonic acid groups such as phonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidepropanesulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalenesulfonic acid Monomers; Phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; acrylamide, acrylonitrile and the like. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less based on the total monomer components.

  Furthermore, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) An acrylate etc. are mentioned. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

  The acrylic polymer can be obtained by subjecting a single monomer or a mixture of two or more monomers to polymerization. The polymerization can be performed by any method such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like. From the viewpoint of preventing contamination of a clean adherend, the content of the low molecular weight substance is preferably small. From this point, the number average molecular weight of the acrylic polymer is preferably 300,000 or more, more preferably about 400,000 to 3,000,000.

  In addition, an external cross-linking agent can be appropriately employed for the pressure-sensitive adhesive in order to increase the number average molecular weight of an acrylic polymer as a base polymer. Specific examples of the external crosslinking method include a method of adding a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, a melamine crosslinking agent, and reacting them. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. Generally, it is preferable to add about 5 parts by weight or less, and further 0.1 to 5 parts by weight with respect to 100 parts by weight of the base polymer. Furthermore, you may use additives, such as conventionally well-known various tackifier and anti-aging agent, other than the said component as needed to an adhesive.

  The thickness of the pressure-sensitive adhesive layer 14 is not particularly limited, but is preferably about 1 to 50 μm from the viewpoint of preventing chipping of the chip cut surface and compatibility of fixing and holding the resin composition layer 16. Preferably it is 2-30 micrometers, Furthermore, 5-25 micrometers is preferable.

  The tensile elastic modulus of the pressure-sensitive adhesive layer 14 is 0.1 to 5.0 MPa and more preferably 0.1 to 1.0 MPa at 23 ° C. Since the tensile elastic modulus of the pressure-sensitive adhesive layer 14 is 0.1 MPa or more at 23 ° C., it is possible to suppress flying of the back grind tape during dicing. Moreover, since the said tensile elasticity modulus of the adhesive layer 14 is 5.0 Mpa or less, an adhesive tape can be peeled off from a resin composition layer with a back grind tape.

  The T peel strength between the pressure-sensitive adhesive layer 14 and the resin composition layer 16 is 0.1 to 5 N / 20 mm and 0.3 to 5.0 N / 20 mm under the conditions of 23 ° C. and 300 mm / min. It is preferably 0.5 to 5.0 N / 20 mm. Since the T peel strength between the pressure-sensitive adhesive layer 14 and the resin composition layer 16 is 0.1 N / 20 mm or more under the conditions of 23 ° C. and 300 mm / min, it is possible to suppress flying of the back grind tape 11 during dicing. it can. Moreover, since the T peel strength is 5 N / 20 mm or less, the adhesive tape can be peeled from the resin composition layer together with the back grind tape.

(Resin composition layer)
The resin composition layer 16 is disposed on the wafer circuit surface when the semiconductor device is manufactured, and has a function as a sealing resin for the circuit surface. The resin composition layer 16 is used to hold and fix the wafer during wafer grinding. The resin composition layer 16 is used for filling the space with the chip mounting substrate and fixing the chips to each other during chip mounting.

  As a resin used for the resin composition layer 16, in the step of bonding the resin composition layer 16 to the circuit surface of the wafer, the resin composition layer 16 exhibits a certain degree of fluidity by heating and pressing force, and follows the unevenness of the circuit surface well, and A resin that exhibits adhesiveness by heating is used. Examples of such resins include B-stage resins and adhesives.

  Examples of the B-stage resin include a semi-cured epoxy resin.

  Examples of the adhesive include a mixture of a binder resin and a thermosetting resin having pressure-sensitive adhesive properties at room temperature. Examples of the binder resin having pressure-sensitive adhesiveness at normal temperature include acrylic resins, polyester resins, polyvinyl ethers, urethane resins, polyamides, and the like. Examples of the thermosetting resins include epoxy resins, polyimide resins, A phenol resin, a urea resin, a melamine resin, a resorcinol resin, etc. are used, Preferably an epoxy resin is mentioned. The thermosetting resin can be used in combination with an appropriate curing accelerator. As the binder resin having pressure-sensitive adhesion at normal temperature, the thermosetting resin, and the curing accelerator, conventionally known ones can be appropriately employed.

  Adhesives having the above components exhibit appropriate fluidity by heating and pressure-bonding force, and can form the resin composition layer 16 that closely follows the unevenness of the circuit surface. In addition, the wafer can be used as an adhesive that adheres to the back grind tape 11 during wafer grinding and contributes to fixing of the wafer, and bonds the chip and the chip mounting substrate during mounting. Finally, a cured product with high impact resistance can be obtained through thermal curing, and it has an excellent balance between shear strength and peel strength, and can maintain sufficient adhesive properties even under severe heat and humidity conditions. .

  The resin composition layer 16 preferably has high transmittance for visible light in order to improve alignment accuracy during dicing. The visible light transmittance of the resin composition layer 16 is preferably in the range of 70 to 99%.

The thickness of the resin composition layer 16 _{(T A)} is usually a 3～150Mm. When bumps are formed on the wafer surface, the ratio of the average height (H _B ) of the bumps to the thickness (T _A ) of the resin composition layer 16 (in order to suppress the generation of voids and cover the circuit surface) ( H _B / T _A ) is preferably in the range of 1.0 / 0.8 to 1.0 / 1.8, preferably 1.0 / 1.0 to 1.0 / 1.5. The average height (H _B ) of the bumps is the height from the chip surface (circuit surface excluding the bumps) to the top of the bumps, and when there are a plurality of bumps, the average of these is obtained.

  If the bump height is too high with respect to the thickness of the resin composition layer 16, there is a gap between the chip surface (circuit surface excluding the bump) and the chip mounting substrate, which causes voids. On the other hand, if the thickness of the resin composition layer is too thick, the bumps do not penetrate the adhesive layer, which causes conduction failure.

(Laminated sheet manufacturing method)
The laminated sheet 11 according to the present embodiment is produced, for example, as follows.
First, the base material 12 can be formed by a conventionally known film forming method. Examples of the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method.

  Next, after a pressure-sensitive adhesive composition solution, which is a material for forming the pressure-sensitive adhesive layer 14, is applied onto the substrate 12 to form a coating film, the coating film is dried under predetermined conditions (heated as necessary). The pressure-sensitive adhesive layer 14 is formed by crosslinking). It does not specifically limit as a coating method, For example, roll coating, screen coating, gravure coating, etc. are mentioned. As drying conditions, for example, the drying temperature is 80 to 150 ° C. and the drying time is 0.5 to 5 minutes. Moreover, after apply | coating an adhesive composition on a separator and forming a coating film, the coating film may be dried on the said drying conditions, and the adhesive layer 14 may be formed. Then, the adhesive layer 14 is bonded together with the separator on the base material 12. Thereby, the back grind tape 11 is produced.

The resin composition layer 16 is produced as follows, for example.
First, an adhesive composition solution that is a material for forming the resin composition layer 16 is prepared. As described above, the adhesive composition solution contains a binder resin having a pressure-sensitive adhesive property at room temperature, a thermosetting resin, a curing accelerator, and the like.

  Next, the adhesive composition solution is applied on the base separator so as to have a predetermined thickness to form a coating film, and then the coating film is dried under predetermined conditions to obtain the resin composition layer 16 (viscous Adhesive layer). It does not specifically limit as a coating method, For example, roll coating, screen coating, gravure coating, etc. are mentioned. As drying conditions, for example, the drying temperature is 70 to 160 ° C. and the drying time is 1 to 5 minutes. Moreover, after apply | coating an adhesive composition solution on a separator and forming a coating film, the coating film may be dried on the said drying conditions, and the resin composition layer 16 may be formed. Thereafter, the resin composition layer 16 is bonded together with the separator on the substrate separator.

  Subsequently, the separator is peeled off from the back grind tape 11 and the resin composition layer 16 respectively, and the both are bonded so that the resin composition layer 16 and the adhesive layer 14 of the back grind tape 11 become a bonding surface. Examples of a method for bonding the back grind tape 11 and the resin composition layer 16 include a pressing method and a laminating method. A laminator method is preferable in consideration of productivity. At this time, the lamination temperature is not particularly limited, and for example, 30 to 90 ° C is preferable, and 60 to 80 ° C is more preferable. Moreover, a linear pressure is not specifically limited, For example, 0.1-20 kgf / cm is preferable and 1-10 kgf / cm is more preferable. Thereby, the lamination sheet 10 which concerns on this Embodiment is obtained.

(Manufacture of semiconductor devices)
Next, a method for manufacturing a semiconductor device will be described. 2-9 is a cross-sectional schematic diagram which shows an example of the manufacturing method of the semiconductor device using the lamination sheet 10. FIG. First, the resin composition layer 16 surface of the laminated sheet 10 is bonded to the circuit surface of the semiconductor wafer 40 to obtain a semiconductor wafer with a laminated sheet (see FIG. 2). This step is performed while pressing with a pressing means such as a pressure roll. The attaching temperature at the time of mounting is not specifically limited, For example, it is preferable to exist in the range of 20-100 degreeC.

  Next, the surface of the semiconductor wafer 40 with the laminated sheet 10 on which the laminated sheet 10 is not attached is ground and thinned (see FIG. 3). For thin processing, conventional methods can be adopted. Examples of the thin processing machine include a grinding machine (back grind) and a CMP pad. Thin processing is performed until the semiconductor wafer has a desired thickness.

  Next, the dicing tape 20 is bonded to the ground surface of the thinned semiconductor wafer 40 with the laminated sheet 10 to obtain the semiconductor wafer 40 in which the dicing tape 20 and the laminated sheet 10 are bonded (see FIG. 4). Examples of a method for bonding the ground surface of the semiconductor wafer 40 and the dicing tape 20 include a pressing method and a laminating method. A laminator method is preferable in consideration of productivity. At this time, the lamination temperature is not particularly limited, and is preferably 30 to 50 ° C., for example, and more preferably 35 to 45 ° C. Moreover, a linear pressure is not specifically limited, For example, 0.1-20 kgf / cm is preferable and 1-10 kgf / cm is more preferable. As the dicing tape 20, for example, a conventionally known tape having a base material and an adhesive layer can be adopted. As the pressure-sensitive adhesive layer constituting the dicing tape 20, for example, a general pressure-sensitive pressure-sensitive adhesive such as an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive may be employed, or an ultraviolet curable pressure-sensitive adhesive layer may be employed. Also good.

  Next, the semiconductor wafer 40 to which the dicing tape 20 and the laminated sheet 10 are bonded is diced from the laminated sheet 10 side using, for example, a dicing blade 62 (see FIG. 5). Thereby, the semiconductor wafer 40 is cut into a predetermined size and separated into individual pieces, and the semiconductor chip 42 is obtained. In this step, for example, a cutting method called full cut that cuts up to the dicing tape 20 can be adopted. It does not specifically limit as a dicing apparatus used at this process, A conventionally well-known thing can be used. In this embodiment, since dicing is performed in a state where the back grind tape 11 is affixed on the resin composition layer 16, the resin composition layer 16 absorbs water at the time of dicing, or cutting scraps are resin composition. Adhering to the layer 16 can be suppressed. As a result, it is possible to prevent a decrease in the adhesive strength of the resin composition layer 16 and a decrease in electrical reliability. In this step, the laminated sheet 10 is separated into chips together with the semiconductor wafer 40.

  Next, the adhesive tape 30 is affixed on the laminated sheet 10 (see FIG. 6). Under the present circumstances, the adhesive tape 30 is affixed in the form which covers the some laminated sheet 10 separated into chip shape. As the pressure-sensitive adhesive tape 30, a conventionally known one may be adopted as long as the adhesive force between the pressure-sensitive adhesive tape 30 and the substrate 12 is larger than the adhesive force between the pressure-sensitive adhesive layer 14 and the resin composition layer 16. Can do.

  Next, the adhesive tape 30 is peeled from the resin composition layer 16 together with the back grind tape 11 (see FIG. 7). At this time, since the back grind tape 11 is separated into pieces by the dicing, the plurality of separated back grind tapes 11 are peeled from the resin composition layer 16 together with the adhesive tape 30. .

  Next, when the pressure-sensitive adhesive layer of the dicing tape 20 is of an ultraviolet curable type, the dicing tape 20 is irradiated with ultraviolet rays to reduce the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer.

  Next, in order to peel the semiconductor chip obtained by dicing from the dicing tape 20, the semiconductor chip 42 is picked up (peeled) (see FIG. 8). The pickup method is not particularly limited, and various conventionally known methods can be employed. For example, there is a method of pushing up each semiconductor chip 42 from the dicing tape 20 side with a needle and picking up the pushed semiconductor chip 42 with a pickup device.

  As shown in FIG. 9, the picked-up semiconductor chip 42 is bonded and fixed to the adherend 44 by the flip chip bonding method (flip chip mounting method) via the resin composition layer 16 (flip chip bonding step). Specifically, the semiconductor chip 42 is always placed on the adherend 44 in a form in which the circuit surface (also referred to as a surface, a circuit pattern formation surface, an electrode formation surface, etc.) of the semiconductor chip 42 faces the adherend 44. Fix according to law. For example, a bump (not shown) formed on the circuit surface side of the semiconductor chip 42 is brought into contact with a bonding conductive material (not shown) attached to the connection pad of the adherend 44 and pressed. However, by melting the conductive material, electrical conduction between the semiconductor chip 42 and the adherend 44 can be ensured, and the semiconductor chip 42 can be fixed to the adherend 44. Further, the resin composition layer 16 is disposed in the gap between the semiconductor chip 42 and the adherend 44. That is, when the semiconductor chip 42 is mounted, the resin composition layer 16 can fill the space between the semiconductor chip 42 and the adherend 44 and fix them to each other.

  As the adherend 44, various substrates such as a lead frame and a circuit substrate (such as a wiring circuit substrate) can be used. The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate and a plastic substrate. Examples of the plastic substrate include an epoxy substrate, a bismaleimide triazine substrate, and a polyimide substrate.

  The material of the bump or the conductive material is not particularly limited. For example, a tin-lead metal material, a tin-silver metal material, a tin-silver-copper metal material, a tin-zinc metal material, tin- Examples thereof include solders (alloys) such as zinc-bismuth metal materials, gold metal materials, and copper metal materials.

  Next, the resin composition layer 16 disposed between the flip-chip bonded semiconductor chip 42 and the adherend 44 is thermally cured. For example, it can be cured at 165 ° C. to 185 ° C. for several minutes to 1 hour.

  Hereinafter, preferred embodiments of the present invention will be described in detail by way of example. However, the materials, blending amounts, and the like described in this example are not intended to limit the gist of the present invention only to those unless otherwise limited. The term “parts” means parts by weight.

[Production of resin composition layer]
The following epoxy resin, phenol resin, acrylic resin, and curing accelerator were prepared.

Epoxy resin A: a naphthalene type epoxy resin having an epoxy group equivalent of 142 g / eq (product name: HP4032D, manufactured by DIC Corporation)
Epoxy resin B: trisphenol methane type epoxy resin having an epoxy group equivalent of 169 g / eq (product name: EPPN501HY, manufactured by Nippon Kayaku Co., Ltd.)
Phenol novolac resin: Aralkyl-type phenol resin with phenol equivalent of 175 g / eq (Product name: MEH-7800M / MEH-7800SS, manufactured by Meiwa Kasei Co., Ltd.)
Acrylic resin: Copolymer of ethyl acrylate, butyl acrylate and acrylonitrile having a weight average molecular weight of 450,000 (product name: Teisan resin SG-P3, manufactured by Nagase ChemteX Corporation)
Curing accelerator: Triphenylphosphine (Product name: TPP-K, manufactured by Hokuko Chemical Co., Ltd.)

  60 parts of the epoxy resin A, 15 parts of the epoxy resin B, 90 parts of the phenol novolac resin, 115 parts of the acrylic resin, and 2 parts of the curing accelerator were mixed to obtain a resin composition. Next, the resin composition is applied to the release-treated surface of a release film (Mitsubishi Chemical Co., Ltd., MRA, thickness 50 μm) so that the applied thickness after drying is 100 μm, and dried at 110 ° C. for 5 minutes. did. Thereby, a resin composition layer was obtained.

Example 1
In a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer, and a stirring device, 100 parts of 2-ethylhexyl acrylate and 20 parts by weight of 2-hydroxyethyl acrylate are placed, and 60 parts in a toluene solution in a nitrogen stream. Polymerization was performed at 0 ° C. for 8 hours to obtain an acrylic polymer A.

  Next, 15 parts of a polyisocyanate crosslinking agent (trade name “Coronate X”, manufactured by Nippon Polyurethane Industry Co., Ltd.) was added to 100 parts of the acrylic polymer B to obtain a pressure-sensitive adhesive composition solution A.

  The pressure-sensitive adhesive composition solution A was applied onto a PET film having a thickness of 50 μm, and heat-dried at 120 ° C. for 3 minutes to form a pressure-sensitive adhesive layer B having a thickness of 30 μm. The tape on which the pressure-sensitive adhesive layer A was formed on the PET film was used as the back grind tape A.

(Comparative Example 1)
100 parts of butyl acrylate, 80 parts of ethyl acrylate, and 40 parts of 2-hydroxyethyl acrylate are placed in a reaction vessel equipped with a cooling pipe, a nitrogen introduction pipe, a thermometer, and a stirrer, and a nitrogen stream in a toluene solution. Polymerization treatment was carried out at 60 ° C. for 8 hours to obtain an acrylic polymer B.

  To acrylic polymer B, 45 parts of 2-methacryloyloxyethyl isocyanate was added and subjected to an addition reaction at 50 ° C. for 12 hours in an air stream to obtain acrylic polymer B ′.

  Next, 0.2 part of a polyisocyanate-based crosslinking agent (trade name “Coronate L”, manufactured by Nippon Polyurethane Industry Co., Ltd.) was added to 100 parts of the acrylic polymer B ′ to obtain an adhesive composition solution B. .

  The pressure-sensitive adhesive composition solution B was applied on a PET film having a thickness of 50 μm and dried by heating at 120 ° C. for 3 minutes to form a pressure-sensitive adhesive layer B having a thickness of 30 μm. The tape on which the pressure-sensitive adhesive layer B was formed on the PET film was used as the back grind tape B.

(Comparative Example 2)
In a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer, and a stirring device, 100 parts of 2-ethylhexyl acrylate and 20 parts by weight of 2-hydroxyethyl acrylate are placed, and 60 parts in a toluene solution in a nitrogen stream. Polymerization was performed at 0 ° C. for 8 hours to obtain an acrylic polymer C.

  Next, 30 parts of a polyisocyanate-based crosslinking agent (trade name “Coronate X”, manufactured by Nippon Polyurethane Industry Co., Ltd.) was added to 100 parts of the acrylic polymer C to obtain an adhesive composition solution C.

The pressure-sensitive adhesive composition solution C was applied onto a PET film having a thickness of 50 μm and dried by heating at 120 ° C. for 3 minutes to form a pressure-sensitive adhesive layer C having a thickness of 30 μm. Thereafter, the pressure-sensitive adhesive layer C was irradiated with 400 mJ / cm ² of ultraviolet rays. This was designated as back grind tape C.

(Measurement of tensile modulus of adhesive layer)
The tensile modulus of the adhesive layers A to C was determined. Specifically, using a Tensilon type tensile tester (Shimadzu Corporation, AGS-J), the tensile modulus was obtained from the calculated value of the tangent of the measured load-elongation curve. The measurement conditions were 10 mm between chucks and 50 mm / min tensile speed. The results are shown in Table 1.

(T peel strength measurement between adhesive layer and resin composition layer)
Adhesive for the above back grind tape A with a rubber laminating roller using a sticking device (Taisho Laminator Co., Ltd.) under the conditions of sticking speed 0.6 m / min, roller temperature 25 ° C., load 0.5 MPa. The surface and the resin composition layer were bonded together to produce a laminated sheet A. The laminated sheet A was used as the laminated sheet according to Example 1. Moreover, also about the back grind tapes B-C, the said resin composition layer was bonded together similarly, and laminated sheet B-C was produced. The laminated sheet B was a laminated sheet according to Comparative Example 1. The laminated sheet C was a laminated sheet according to Comparative Example 2.
The T peel strength measurement of the adhesive layers and the resin composition layers of the laminated sheets A to C was measured with a Tensilon type tensile tester (Shimadzu Corporation, AGS-J). The peeling condition was a speed of 300 mm / min. The results are shown in Table 1.

(Evaluation of flying back grinding tape during dicing)
Laminated sheets A to C were produced in the same manner as described above. Next, using a sticking device (Taisho Laminator Co., Ltd.), with a rubber laminating roller, the resin composition of the laminated sheet under the conditions of sticking speed 0.6 m / min, roller temperature 70 ° C., load 0.5 MPa. The physical layer surface and the mirror surface of the wafer were bonded together. A single-sided mirror wafer (manufactured by Synergy Tech, 8 inches) was used as the wafer.

  Next, the laminated sheet bonded was cut into a wafer shape, and the wafer surface of the wafer with the laminated sheet was ground to a thickness of 200 μm using a back grinding apparatus (manufactured by Disco Corporation).

  Next, using a sticking device (Taisho Laminator Co., Ltd.), a laminated sheet made of rubber is used with a rubber laminating roller under the conditions of sticking speed 0.6 m / min, roller temperature 25 ° C., load 0.5 MPa. The ground surface and the adhesive surface of a dicing tape (manufactured by Nitto Denko Corporation, DU-300) were bonded together.

  Next, using Dicer (manufactured by DISCO Corporation), from the back grind tape side, the spindle rotation speed is 40,000 rpm, the cutting speed is 30 mm / sec. Dicing was performed into the dicing tape base film. The case where there was no flying of the back grind tape during dicing was evaluated as ◯, and the case where it was present was evaluated as ×. The results are shown in Table 1.

(Evaluation of peelability of back grind tape after dicing)
After dicing, using a sticking device (Taisho Laminator Co., Ltd.), with a rubber laminating roller, under the conditions of sticking speed 0.6 m / min, roller temperature 25 ° C., load 0.5 MPa, wafers with dicing tape An adhesive tape (manufactured by Nitto Denko Corporation, BT-315) was bonded to the back grind tape surface. Next, using a Tensilon type tensile tester (Shimadzu Corp., AGS-J), the pressure-sensitive adhesive tape was pulled at a peeling rate of 300 mm / min by a T peeling method. When the back grind tape is bonded to the adhesive tape and can be peeled off from the resin composition layer ○, when the back grind tape is bonded to the adhesive tape and not peeled from the resin composition layer × As evaluated. However, the laminated sheet C was not evaluated because jumping occurred in the back grind tape during dicing. The results are shown in Table 1.

DESCRIPTION OF SYMBOLS 10 Laminated sheet 11 Back grind tape 12 Base material 14 Adhesive layer 16 Resin composition layer 20 Dicing tape 30 Adhesive tape 40 Semiconductor wafer 42 Semiconductor chip

Claims (6)

A laminated sheet having a back grind tape having a configuration in which an adhesive layer is formed on a substrate, and a resin composition layer provided on the adhesive layer of the back grind tape,
The tensile elastic modulus of the pressure-sensitive adhesive layer is 0.1 to 5.0 MPa at 23 ° C.,
A laminate sheet, wherein a T peel strength between the pressure-sensitive adhesive layer and the resin composition layer is 0.1 to 5 N / 20 mm under conditions of 23 ° C. and 300 mm / min.   The laminated sheet according to claim 1, wherein the resin composition layer contains a thermosetting resin. The laminated sheet according to claim 2 , wherein the thermosetting resin is an epoxy resin. A back-grind tape having a configuration in which an adhesive layer is formed on a substrate; and a resin composition layer provided on the adhesive layer of the back-grind tape, the tensile elastic modulus of the adhesive layer Is 0.1 to 5.0 MPa at 23 ° C., and T peel strength between the pressure-sensitive adhesive layer and the resin composition layer is 0.1 to 5 N / 20 mm at 23 ° C. and 300 mm / min. A method for manufacturing a semiconductor device using a laminated sheet,
Bonding the resin composition layer surface of the laminate sheet to the circuit surface of the semiconductor wafer to obtain a semiconductor wafer with a laminate sheet;
A step of grinding and thinning the surface of the semiconductor wafer with the laminated sheet to which the laminated sheet is not attached,
A step of bonding a dicing tape to the ground surface of the thinned semiconductor wafer with a laminated sheet to obtain a semiconductor wafer in which the dicing tape and the laminated sheet are bonded;
A step of dicing the semiconductor wafer on which the dicing tape and the laminated sheet are bonded together from the laminated sheet side;
After dicing, a step of attaching an adhesive tape to the laminated sheet, and
A method for producing a semiconductor device, comprising a step of peeling the adhesive tape together with the back grind tape from the resin composition layer.   The method for manufacturing a semiconductor device according to claim 4, wherein the resin composition layer includes a thermosetting resin. The method for manufacturing a semiconductor device according to claim 5 , wherein the thermosetting resin is an epoxy resin.

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