JP5944866B2 - Compressed resin sealing method and compressed resin sealing device for electronic parts - Google Patents

Description

  The present invention relates to a resin sealing method and a resin sealing in which a large number of electronic components (semiconductor chips) mounted on a large substrate using a so-called compression molding method are collectively sealed (resin mold) with a resin. More particularly, the present invention relates to an apparatus that is improved so as to prevent the bending deformation of the mold due to the clamping pressure of the compression molding mold and to mold the package thickness for resin-sealing electronic components to a uniform thickness.

A compression molding method is known as a method for collectively resin-sealing electronic components on a large substrate.
An apparatus for performing this compression molding method includes, for example, a compression molding die comprising at least an upper die 1 and a lower die 2 as schematically shown in FIG. It arrange | positions so that it may join / separate relatively via a suitable type | mold opening / closing mechanism.
Then, the resin sealing of the electronic components 4 on the large substrate 3 by using such a resin sealing device is performed as follows.
First, as shown in FIG. 7 (1), the large substrate 3 is supplied and set on the upper mold 1 with the mounting surface of the electronic component 4 facing downward, and the resin material 6 is placed in the cavity 5 of the lower mold 2. Supply and heat.
Next, as shown in FIG. 7 (2), the upper and lower molds 1 and 2 are clamped via a mold opening / closing mechanism, whereby the electronic component 4 on the large substrate 3 set on the upper mold 1 is moved to the lower mold. It is immersed in the molten resin material 6a in the cavity 5.
During the mold clamping, the upper surface of the lower mold 2 presses the peripheral edge of the large substrate 3. In this state, the cavity bottom member 5a of the lower mold 2 is moved upward to press the molten resin material 6a in the lower mold cavity 5 with a predetermined resin pressure (compression molding). The electronic components 4 can be collectively resin-sealed in a package molded according to the shape (see Patent Document 1).

  Currently, circular substrates with a diameter of 300 mm, strip-shaped substrates of about 95 mm × 260 mm, etc. are used as large substrates, but substrates that are larger than this, for example, 500 mm square or more It is desired that the electronic components can be collectively encapsulated with a resin using a large-sized substrate.

Further, there has been proposed a resin sealing device 7 which has been improved so as to prevent the upper and lower mold clamping pressures from bending the upper and lower molds.
That is, the resin sealing device shown in FIG. 8 includes an upper platen 9 and a lower platen 10 fixed up and down via tie bars 8, a fixed platen 11 disposed between the upper platen 9 and the lower platen 10, A lower mold base 12 fixed to the upper surface of the fixed platen 11, a plurality of lower molds 13 disposed above the lower mold base 12, and an upper mold base 14 disposed at a position below the upper platen 9 with a predetermined interval A plurality of upper molds 15 arranged below the upper mold base 14, a mold opening / closing mechanism 16 for moving the upper platen 9 up and down to open and close both upper and lower molds 13 and 15, and an upper surface of the upper mold base 14. The provided tray-shaped accommodating portion 17, the shape-deformable member 18 accommodated in the tray-shaped accommodating portion 17, a number of microspheres 18a enclosing the shape-deformable member 18 and a net 18b (porous member) for enclosing the microspheres 18a By moving the microsphere 18a freely within the network 18b, The shape deformable member 18 is provided so as to be deformable.
Accordingly, when the upper platen 9 is bent and deformed at the time of mold clamping, the shape deformable member 18 can be deformed according to the shape of the bent upper platen 9 and abuts along the lower surface of the upper platen 9. Therefore, uniform mold clamping can be performed (see Patent Document 2).

By the way, the resin sealing range in the large substrate has a large area, and correspondingly, the lower mold cavity of the compression molding die also has a large area.
For this reason, in a compression mold having a cavity for a large substrate, the clamping pressure of both the upper and lower molds is large at the periphery of the upper and lower molds and is reduced at the center, so that the upper and lower molds are bent. There is a problem in resin molding that it is easily deformed.
Further, since the resin sealing device described in Patent Document 2 uses a small substrate, it cannot be applied as it is as a resin sealing device for a large substrate, but also has a configuration of wrapping microspheres with a net. There is a problem that the shape deformable member is troublesome to manufacture and maintain.

JP 2003-133352 A (see paragraphs [0002] and paragraphs [0003] on page 2-3, FIG. 24, FIG. 25, etc.) JP 2004-042356 A (refer to paragraph [0008] on page 4 and paragraph [0019] on page 6 and FIGS. 1, 2, and 7).

  The present invention prevents the bending deformation of the mold due to the compression pressure of the mold for compression molding when a large number of electronic components mounted on a large substrate are collectively molded with resin using the compression molding method. Then, it aims at providing the compression resin sealing method for implementing the compression resin sealing method of the electronic component which shape | molds the package thickness which resin-seals an electronic component to uniform thickness, and this method.

In order to achieve the above object, the compression molding method for an electronic component according to the present invention uses at least an upper die 31 surface by using an electronic component compression molding die 30 comprising an upper die 31 and a lower die 32. Supplying the substrate 70 and engaging the mounting surface side of the electronic component 71 downward, covering the lower mold surface including the resin molding portion 33 of the lower mold 32 with the release film 60, and A step of supplying and heating the resin material 80 into the lower mold cavity 33a in the resin molding portion 33 coated with the release film 60, a first mold clamping step for closing both the upper and lower molds (31, 32), and an upper mold 31 The substrate set block 31c in the lower die 32 is moved downward, and the cavity block 32c in the lower die 32 is moved upward to immerse the electronic component 71 of the large substrate 70 in the molten resin material 80a in the lower die cavity 33a. A predetermined resin pressure is applied to the molten resin material 80a in the lower mold cavity 33a. A second mold clamping step and compressing the resin sealing method of an electronic component which performs the electronic component 71 mounted on the substrate 70 for sealing molded together with a resin by addition,
A step of holding the substrate set block 31c in a loosely-fitted (floating fit) state with respect to the upper mold 31;
Further, a step of holding the cavity block 32c in a loosely fitted state (floating fit) with respect to the cavity side member 32d of the lower mold 32 is performed,
Further, at least during the second mold clamping process, an upper mold bending deformation preventing process for preventing the bending deformation of the substrate set block 31c through the upper mold uniform pressure means 41 is performed.
Further, at least during the second mold clamping process, a lower mold bending deformation preventing process for preventing the bending deformation of the cavity block 32c through the lower mold uniform pressure means 42 is performed.
Further, in the second mold clamping step, either one or both of the substrate set block 31c and the cavity block 32c is swung vertically and horizontally, so that the surface of the substrate 70 and the upper surface of the cavity block 32c are brought into contact with each other. It is characterized in that a process of correcting the position or inclination of both is performed so as to be parallel.

Also, in the method for sealing a resin with an electronic component according to the present invention, the upper mold uniform pressurizing means 41 passes the pressure medium 44 adjusted to a required pressurizing force by the pressurizing pressure adjusting mechanism 43 through the working fluid path 41e and the manifold 41a. The piston 41c introduced into each of the cylinders 41b of the manifold 41a is pushed and the lower end portion of each piston rod 41f is placed on the back surface (upper surface) of the substrate set block 31c. It is set to be joined and pressed,
Further, the lower mold uniform pressurizing means 42 introduces the pressure medium 44 adjusted to a required pressurizing force by the pressurizing pressure adjusting mechanism 43 into the working fluid chamber 42d of the manifold 42a through the working fluid path 42e. The piston 42c fitted to each of the cylinders 42b is pushed and the upper end of each piston rod 42f is joined to the back surface (lower surface) of the cavity block 32c and pressed. To do.

  In addition, the compressed resin sealing method for an electronic component according to the present invention is characterized in that a fluid is used as the pressure medium 44.

  In addition, the compressed resin sealing method for an electronic component according to the present invention is characterized in that silicone oil is used as the pressure medium 44.

  In addition, the compression resin sealing method of the electronic component according to the present invention includes the inside of the working fluid chamber 41d of the manifold 41a in the upper mold uniform pressurizing means 41 and the working fluid chamber 42d of the manifold 42a in the lower mold uniform pressurizing means 42. Each is characterized by introducing a pressure medium 44 adjusted to a required pressure by the same pressure adjustment mechanism 43.

  In addition, the compression resin sealing method of the electronic component according to the present invention includes the inside of the working fluid chamber 41d of the manifold 41a in the upper mold uniform pressurizing means 41 and the working fluid chamber 42d of the manifold 42a in the lower mold uniform pressurizing means 42. Each is characterized by introducing a pressure medium 44 adjusted to a required pressure with a different pressure adjustment mechanism.

In addition, in the method of compressing resin for electronic parts according to the present invention, at the time of the second mold clamping step, either one or both of the substrate set block 31c and the cavity block 32c,
A pressure medium 44 adjusted to a required pressure through the working fluid path 42e by the pressure adjusting mechanism 43 in the upper uniform pressurizing means 41 is introduced into the working fluid chamber 41d of the manifold 41a. Then, the piston 41c fitted to each cylinder 41b of the manifold 41a is pushed and the lower end of each piston rod 41f is joined to the back surface of the substrate set block 31c to supply the upper mold surface. Press the substrate 70 at a predetermined pressure,
Further, the pressure medium 44 adjusted to a required pressure by the pressure adjusting mechanism 43 in the lower mold uniform pressurizing means 42 is introduced into the working fluid chamber 42d of the manifold 42a through the working fluid path 42c. The lower mold cavity 33a is formed by pressing the piston 42c fitted to each cylinder 42b of the manifold 42a with the medium 44 and joining the upper end of each piston rod 42f to the back surface of the cavity block 32c. The inside resin is pressed at a predetermined pressure.

Also, in the method for sealing an electronic component with compressed resin according to the present invention, before the first mold clamping step for closing the upper and lower molds (31, 32), either the substrate set block 31c or the cavity block 32c is used. On one side or both
Holding the substrate set block 31c with a pressure with a predetermined pressure or with a pressure lower than a predetermined pressure by the upper mold equal pressure means 41;
Further, the lower mold uniform pressurizing means 42 holds the cavity block 32c by pressing with a predetermined pressure or by pressing with a pressure lower than a predetermined pressure,
During the second mold clamping step, either one or both of the substrate set block 31c and the cavity block 32c,
The upper mold equal pressure means 41 holds the substrate set block 31c by pressing with a predetermined pressure,
Further, the lower die uniform pressurizing means 42 holds the cavity block 32c by pressing with a predetermined pressure.

In order to achieve the above object, an electronic component compression resin sealing device according to the present invention uses at least an electronic component compression molding die 30 comprising an upper die 31 and a lower die 32 to provide a substrate on the upper die surface. 70 and the mounting surface side of the electronic component 71 is engaged downward, the resin material 80 is supplied into the lower mold cavity 33a coated with the release film 60, and is heated and melted. (31, 32) is closed, and then the substrate set block 31c in the upper die 31 is moved down, and the cavity block 32c in the lower die 32 is moved up, thereby electronic components of the large substrate 70 71 is immersed in the molten resin material 80a in the lower mold cavity 33a, and a predetermined resin pressure is applied to the molten resin material 80a in the lower mold cavity 33a so that the electronic component 71 mounted on the substrate 70 is made of resin. Perform second mold clamping to seal and mold all at once A compression resin sealing apparatus of the child component,
The substrate set block 31c is held in the loose fitting (floating fitting) state with respect to the upper die 31, and the cavity block 32c is held in the loose fitting (floating fitting) state with respect to the cavity side member 32d of the lower die 32. And configure
Furthermore, it is provided with a uniform pressure means 40 that also serves as a bending deformation preventing member of both upper and lower molds (31, 32),
Further, the uniform pressure means 40 includes an upper mold uniform pressure means 41 and a lower mold uniform pressure means 42,
Further, the upper mold uniform pressurizing means 41 introduces the pressure medium 44 adjusted to a required pressure by the pressure adjusting mechanism 43 into the working fluid chamber 41d of the manifold 41a through the working fluid path 41e, and The piston 41c fitted to each cylinder 41b is pushed, and the lower end portion of each piston rod 41f is joined to the back surface (upper surface) of the substrate set block 31c and pressed.
The lower mold uniform pressurizing means 42 introduces the pressure medium 44 adjusted to a required pressure by the pressure adjusting mechanism 43 into the working fluid chamber 42d of the manifold 42a through the working fluid path 42e, and The piston 42c fitted to each cylinder 42b is pushed and the upper end portion of each piston rod 42f is joined to the back surface (lower surface) of the cavity block 32c and pressed. And

  Further, the compressed resin sealing device for electronic parts according to the present invention is characterized in that a fluid is used as the pressure medium 44.

  Further, the compressed resin sealing device for electronic parts according to the present invention is characterized in that silicone oil is used as the pressure medium 44.

  Further, the compression resin sealing device for electronic parts according to the present invention is configured by combining the pressure adjusting mechanism 43 of the upper mold uniform pressurizing means 41 and the pressure adjusting mechanism 43 of the lower mold uniform pressurizing means 42. It is characterized by that.

  In addition, the compression resin sealing device for electronic parts according to the present invention is configured by separately arranging the pressure adjusting mechanism of the upper mold uniform pressurizing means 41 and the pressure adjusting mechanism of the lower mold uniform pressurizing means 42. It is characterized by that.

  According to the compression resin sealing method and the compression resin sealing device for electronic parts according to the present invention, the upper and lower molds (31, 32) are added to the compression molding mold 30 having the cavity (33a) portion for the large substrate 70. ), The uniform pressure means 40 (41, 42) that also serves as a bending deformation preventing member for preventing the bending deformation of both the upper and lower molds is disposed. It is possible to prevent the upper and lower molds from being bent and deformed by the mold clamping pressure during mold clamping.

Further, according to the present invention, the substrate set block 31c is held in a loose fitting (floating fitting) state with respect to the upper die 31, and the cavity block 32c is loosely fitted to the cavity side member 32d of the lower die 32 ( Since it is configured to be held in a (floating fitting) state, either one of the substrate set block 31c or the cavity block 32c or the By swinging both in the vertical and horizontal directions, the position or inclination of both is corrected so that the surface of the large substrate 70 and the upper surface of the cavity block 32c are parallel to each other.
Therefore, the resin sealing molding for the electronic component 71 on the large substrate 70 is performed in a state where the surface of the large substrate 70 and the upper surface of the cavity block 32c are corrected in parallel. The package thickness 33b can be formed to a uniform thickness.

  Further, according to the present invention, the mold clamping process can be performed in a state in which the upper mold 31 and the lower mold 32 are prevented from being bent, so that the compression action on the molten resin material 80a can be performed at a lower speed and at a lower pressure. By doing so, the flow action of the molten resin material 80a in the lower mold cavity 33a can be prevented or suppressed during the clamping action of the upper and lower molds (31, 32) and the compression action of the molten resin material 80a. Generation | occurrence | production of the wire sweep etc. resulting from the flow effect | action of the molten resin material 80a can be prevented efficiently.

BRIEF DESCRIPTION OF THE DRAWINGS It is a partially notched front view which shows the whole structure of the compression resin sealing apparatus which concerns on this invention, and has shown the mold open state of both upper and lower mold | types schematically. It is a partially cut front view which expands and shows the principal part of the compression resin sealing device at the time of mold opening shown in FIG. FIG. 2 is a partially cutaway front view of the compression resin sealing device corresponding to FIG. 1, schematically showing a first mold clamping state of both upper and lower molds. It is a partially notched front view which expands and shows the principal part of the compression resin sealing device at the time of the 1st mold clamping shown in FIG. FIG. 2 is a partially cutaway front view of the compression resin sealing device corresponding to FIG. 1, schematically showing a second mold clamping state of both upper and lower molds. It is a partially cutaway front view which expands and shows the principal part of the compression resin sealing device at the time of the 2nd mold clamping shown in FIG. FIG. 7 (1) is a vertical cross-sectional view of the resin molding part when the upper and lower molds are opened, and FIG. 7 (2) is the upper and lower parts thereof. It is a longitudinal cross-sectional view of the resin molding part at the time of mold clamping. 8 schematically shows a mold opening / closing mechanism in a conventional resin sealing device. FIG. 8 (1) is a longitudinal sectional view of the upper and lower molds when the mold is clamped, and FIG. 8 (2) is an essential part of the shape deformable member. It is an expanded vertical sectional view which shows a part.

  Examples of the present invention shown in the drawings will be described below.

  1, 3, and 5 show the overall configuration of the compression resin sealing device, and FIGS. 2, 4, and 6 show an enlarged main portion thereof.

In addition, this compression resin sealing device has a configuration in which each constituent member is held by a press frame (hold frame).
That is, an upper die 31 for compression molding is disposed on the lower surface side of the upper end portion of the frame-shaped press frame 20, and provided below the upper die 31 so as to be movable up and down by a die opening / closing mechanism 50 described later. A lower mold 32 for compression molding is disposed, and the upper mold 31 and the lower mold 32 constitute a compression molding mold 30.

The upper mold 31 includes an upper mold base 31a fixed to the lower surface side of the upper end portion of the press frame 20, and an upper mold hold block fixed to the lower surface side of the upper mold base via a required heat insulating member (not shown). 31b, a substrate set block 31c supported by the upper mold hold block 31b, and an upper mold heater 31d provided in the substrate set block 31c.
In addition, the upper mold 31 is disposed on the outer surface of the substrate set block 31c on the mold surface (lower surface), and is bonded to the mold surface of the lower mold 32 to be described later (in the illustrated example, the upper surface of the cavity side member 32d). In addition, a seal member 31e is provided for blocking air flow between the mold surfaces of the upper and lower molds (31, 32) and the outside of the upper and lower molds.
Further, the board set block 31c is loosely fitted (floating fit) to the holding portion 31f provided in the upper mold hold block 31b, and therefore the board set block 31c can be moved in the vertical and horizontal directions. In other words, it is held in a state where it can swing in the vertical and horizontal directions within the range loosely fitted to the holding portion 31f of the upper die 31.
The upper mold 31 is provided with appropriate engaging means (not shown) for supplying the large substrate 70 to the mold surface (lower surface) and engaging the mounting surface side of the electronic component 71 downward. ing.
In addition, the upper mold 31 has a vacuum between the mold surfaces of the upper and lower molds sealed by a sealing member 31e when the upper and lower molds (31, 32) described later (see FIG. 3) are clamped (see FIG. 3). A vacuum evacuation mechanism (not shown) is provided in communication with the pump via an appropriate intake path.

Further, the lower mold 32 is disposed on a movable platen 52 in a mold opening / closing mechanism 50 described later disposed at the lower end portion of the press frame 20.
That is, the lower mold 32 includes a lower mold base 32a fixed on the movable platen 52 of the mold opening / closing mechanism 50 via a required heat insulating member (not shown), and a lower mold heater 32b built in the lower mold base 32a. And a uniform pressurizing means 40, which will be described later, fixed to the upper surface side of the lower mold base 32a, a cavity block 32c disposed on the upper part of the uniform pressurizing means 40, and an outer periphery of the cavity block 32c. A cavity side member 32d, an elastic member 32e that is interposed between the lower mold base 32a and the cavity side member 32d and elastically pushes the cavity side member 32d upward, and for heating the cavity block built in the cavity block 32c And a heater 32f.
Furthermore, the cavity block 32c is loosely fitted (floating fit) to the cavity side member 32d. Therefore, the cavity block 32c can move in the vertical and horizontal directions, that is, the lower mold 32 It is held in a state capable of swinging in the vertical and horizontal directions within the range loosely fitted to the cavity side member 32d.

By the way, in a compression mold having a cavity for a large substrate, the clamping pressure of both the upper and lower molds (31, 32) is large at the periphery of the upper and lower molds and small at the center, and as a result There is a molding problem that the upper and lower molds (31, 32) are bent and deformed.
Accordingly, the compression molding die 30 described above has a uniform pressure means 40 that also serves as a bending deformation preventing member for preventing bending deformation of both the upper and lower molds (31, 32), which will be described later. It has.
As the uniform pressurizing means 40, in the drawing, an upper mold uniform pressurizing means 41 for the upper mold 31 (more specifically, the substrate set block 31c) and a lower mold 32 for the lower mold 32 (more specifically, the cavity block 32c). The case where the mold uniform pressurizing means 42 is provided is illustrated.

Further, the upper mold equal pressure means 41 includes a manifold 41a, a large number of cylinders 41b arranged in parallel in the lower position of the manifold 41a, pistons 41c fitted to the cylinders 41b, A working fluid chamber 41d communicating between the cylinders 41b, a working fluid path 41e for introducing the pressure medium 44 into the working fluid chamber 41d, and a pressure adjusting mechanism for adjusting the pressure applied by the pressure medium 44 And 43.
Further, each of the piston rods 41f fixed to the lower portion of each piston 41c is provided so as to be pushed downward under the pressure of the pressure medium 44 introduced into the working fluid chamber 41d.
And the lower end part of each piston rod 41f is arrange | positioned so that it may join to the back surface (upper surface) of the board | substrate set block 31c.

The lower mold equal pressure means 42 includes a manifold 42a, a number of cylinders 42b arranged in parallel in the horizontal direction at the upper position of the manifold 42a, a piston 42c fitted to each of the cylinders 42b, A working fluid chamber 42d communicating between the cylinders 42b, a working fluid path 42e for introducing the pressure medium 44 into the working fluid chamber 42d, and a pressure adjusting mechanism for adjusting the pressure applied by the pressure medium 44 And 43.
Further, each of the piston rods 42f fixed to the upper portions of the respective pistons 42c is provided so as to be pushed upward under the pressure of the pressure medium 44 introduced into the working fluid chamber 42d.
The upper end of each piston rod 42f is disposed so as to be joined to the back surface (lower surface) of the cavity block 32c.

The cylinders (41b, 42b), pistons (41c, 42c), etc., in the above-mentioned uniform pressurizing means 40 (the upper mold uniform pressurizing means 41 and the lower mold uniform pressurizing means 42) have the same number and arrangement. The position is set, and both have the same configuration.
Each piston rod 41f of the upper mold uniform pressurizing means 41 is provided so as to press the back surface of the substrate set block 31c disposed below it with uniform pressure by receiving the pressure of the pressure medium 44. ing.
Further, each piston rod 42f of the lower mold uniform pressurizing means 42 is provided so as to press the back surface of the cavity block 32c disposed above with equal pressure by receiving the pressure of the pressure medium 44. Yes.

Further, as the pressure medium described above, a fluid (for example, a gas such as air or an inert gas, or an inert aqueous solution such as water or a liquid such as oil) can be used.
For example, when a liquid such as silicone oil or water is used as the pressure medium, there is an advantage that the heating efficiency of the mold can be increased because the temperature transmission function is excellent.

  In the illustrated example, the case where the pressurizing force adjusting mechanism 43 of the upper mold uniform pressurizing means 41 and the lower mold uniform pressurizing means 42 is combined is illustrated. A dedicated pressure adjusting mechanism corresponding to each of the mold uniform pressurizing means 42 may be provided.

A mold opening / closing mechanism 50 for opening / closing (mold clamping or mold opening) the upper mold 31 and the lower mold 32 by moving the lower mold 32 up and down is configured as follows.
That is, the base 51 is fixed to the lower part of the press frame 20 which is the lower position of the compression molding die 30, and the base 51 and the movable platen 52 provided at the upper position of the base are connected by a link mechanism (toggle mechanism). Furthermore, the link is driven by a servo motor 53 so that the upper and lower molds (31, 32) are opened and closed.
More specifically, the servo shaft 53 and the screw shaft 54 installed so as to be rotatable at the center position of the base 51 are a belt 53c installed between the output shaft 53a of the servo motor 53 and the lower end pulley 53b of the screw shaft 54. It is connected via.
Further, a nut member 55 is screwed on the screw shaft 54, and the nut member 55 is provided so as to move in the vertical direction by rotating the screw shaft 54. Then, by engaging the nut member 55 with a link that connects the base 51 and the movable platen 52, the movable platen 52 is moved up and down as the nut member 55 moves up and down.
The link connecting the base 51 and the movable platen 52 includes a first link plate 56a, a second link plate 56b, and a third link plate 56c.
The base 51 and the lower end of the second link plate 56b are pivotally supported via the shaft 51a, and the movable platen 52 and the upper end of the third link plate 56c are pivotally supported via the shaft 52a. The upper end of the second link plate 56b and the lower end of the third link plate 56c are pivotally supported via 52b.
Further, one end of the first link plate 56a is pivotally supported by the nut member 55, and the other end of the first link plate 56a is pivotally supported by an intermediate position (intermediate position between the shaft 51a and the shaft 52b) of the second link plate 56b. I am letting. For this reason, the first link plate 56a acts as a drive link for transmitting the driving force generated by the vertical movement of the nut member 55 to the second link plate 56b and the third link plate 56c.
Therefore, by rotating the screw shaft 54 by the servo motor 53, the movable platen 52 is moved up and down via the nut member 55, the first link plate 56a, the second link plate 56b, and the third link plate 56c. The upper and lower molds (31, 32) can be opened and closed.

  In the illustrated example, the above-described mold opening / closing mechanism 50 is exemplified by using a toggle mechanism, but instead of this, a mold opening / closing mechanism employing an electric motor and screw jack means and a mold employing a hydraulic means. Obviously, an opening / closing mechanism or the like can be used.

Further, as shown in an enlarged view in FIG. 2, a resin molding portion 33 is formed between the upper and lower molds (31, 32).
That is, a recess formed by the upper surface of the cavity block 32c and the upper surface opening of the cavity side member 32d is provided as a lower mold cavity 33a for resin molding.

Further, the compression resin sealing device includes a release film supply set mechanism (a release film supply set mechanism for stretching a roll-like release film 60 on a lower mold surface including a lower mold cavity 33a provided in the lower mold 32). (Not shown).
Furthermore, in the lower mold cavity 33a portion in which the release film 60 is stretched by the release film supply set mechanism, a granular resin material, a powder resin material, a liquid resin material, a paste resin material, a sheet shape A resin supply mechanism (not shown) for supplying a resin material 80 that can be appropriately selected as necessary from transparent resin material, translucent resin material, opaque resin material, etc. ing.
The supply amount of the resin material 80 is an amount necessary to collectively compress and mold the electronic components 71 on the large substrate 70 to a predetermined thickness in the lower mold cavity 33a.
More specifically, for example, when the electronic components 71 on the large substrate are collectively molded into a package having a thickness of 0.3 mm by compression resin sealing, a thickness of 0.5 mm in the lower mold cavity 33a is formed. It is preferable to supply an amount of resin material corresponding to the thickness (depth).

  Hereinafter, a case where the electronic component 71 mounted on the large substrate 70 is collectively compressed and sealed with resin using this compression resin sealing device will be described.

First, the upper and lower molds (31, 32) are opened through the mold opening / closing mechanism 50 (see FIG. 1).
Next, when the mold is opened, the large substrate 70 is supplied to the mold surface of the upper mold 31 (that is, the lower surface of the substrate set block 31c) via an appropriate engaging means (not shown), and the electron The component 71 is engaged with the mounting surface side facing downward.
Further, a release film 60 is stretched on the mold surface of the lower mold 32 including the lower mold cavity 33a (that is, the upper surfaces of the cavity block 32c and the cavity side member 32d) via a release film supply set mechanism (not shown). Set up.
Further, the resin material 80 is supplied to the lower mold cavity 33a portion on which the release film 60 is stretched via a resin supply mechanism (not shown).
The resin material 80 is heated by a cavity block heating heater 32f built in the cavity block 32c, and becomes a molten resin material 80a in the lower mold cavity 33a (see FIG. 4).

Next, as shown in FIGS. 3 and 4, the lower mold 32 is moved upward by the mold opening / closing mechanism 50 to perform the first mold clamping process for both the upper and lower molds (31, 32).
At the time of the first mold clamping of both the upper and lower molds (31, 32), the mold surface of the upper mold 31 (the lower surface of the substrate set block 31c) and the mold of the lower mold 32 through the release film 60 and the large substrate 70. The surface (the upper surface of the cavity side member 32d) is in pressure contact.
Further, the resin material 80 supplied to the resin molding part 33 (lower mold cavity 33a part) via the release film 60 is heated and melted by the cavity block heating heater 32f built in the cavity block 32c (for example, , A molten resin material 80a, or a resin material having fluidity).

In the first mold clamping process of both the upper and lower molds (31, 32), the sealing member 31e causes the gap between the upper and lower mold surfaces (in the illustrated example, the lower surface of the upper mold hold block 31b and the cavity side member 32d Can be sealed).
Further, during the period from the mold open state shown in FIG. 1 to the first mold clamped state shown in FIG. 3, a vacuum pump of a vacuum drawing mechanism (not shown) is operated to vacuum the space between the mold surfaces (resin molding part 33). Can be pulled (reduced pressure).
Therefore, at the time of resin molding, which will be described later, a so-called vacuum molding (decompression) is performed in which the pressure between the upper and lower mold surfaces (resin molding portion 33) is reduced by a vacuum drawing mechanism and air and gases are discharged outside Molding).

  Next, as shown in FIG. 5 and FIG. 6, resin molding is performed by moving the substrate set block 31 c of the upper mold 31 downward and the cavity block 32 c of the lower mold 32 upward by the uniform pressure means 40. In the part 33, a second mold clamping step of resin-sealing the electronic component 71 on the large substrate 70 is performed.

In other words, the pressure medium 44 adjusted to a required pressure by the pressure adjusting mechanism 43 via the upper mold pressure means 41 in the uniform pressure means 40 passes through the working fluid path 41e in the working fluid chamber 41d of the manifold 41a. In addition, the piston 41c fitted to each cylinder 41b of the manifold 41a is pushed and the lower end of each piston rod 41f is placed at the lower position. And press to join.
At this time, the substrate set block 31c is loosely fitted to the holding portion 31f of the upper mold hold block 31b, and the back surface of the substrate set block 31c is provided with a number of pistons that receive an equal applied pressure by the pressure medium 44. It is pressed by the rod 41f.
Accordingly, in the first mold clamping process of the upper and lower molds (31, 32) described above, even if a mold clamping pressure is applied that causes the upper mold 31 to bend upward, the substrate set block 31c is fixed to each piston rod 41f. Therefore, the substrate set block 31c can be efficiently and surely prevented from being bent and deformed by being pressed in a state of receiving a uniform downward pressing force.

In addition, the pressure medium 44 adjusted to a required pressure by the pressure adjusting mechanism 43 through the lower mold uniform pressure means 42 in the uniform pressure means 40 is passed through the working fluid path 42e in the working fluid chamber 42d of the manifold 42a. In addition, the piston 42c fitted to each cylinder 42b of the manifold 42a is pushed, and the upper end of each piston rod 42f is placed on the back surface (lower surface) of the cavity block 32c arranged at the upper position. Bond and press.
At this time, the cavity block 32c is loosely fitted to the cavity side member 32d, and the back surface of the cavity block 32c is pressed by a large number of piston rods 41f that receive an equal applied pressure by the pressure medium 44. .
Accordingly, in the first mold clamping process of the upper and lower molds (31, 32) described above, even if a mold clamping pressure that causes the lower mold 32 to bend downward is applied, the cavity block 32c is held by each piston rod 42f. By being pressed in a state of receiving a uniform upward pressing force, the cavity block 32c can be efficiently and reliably prevented from being bent and deformed downward.

In the second mold clamping process, the upward and downward bending deformation action applied to the upper mold 31 (substrate set block 31c) and the lower mold 32 (cavity block 32c) during the first mold clamping process is efficiently and reliably performed. Can be absorbed.
That is, it is possible to prevent the upper mold 31 (substrate set block 31c) and the lower mold 32 (cavity block 32c) from being bent, and the parallelism between the mold surfaces of the upper and lower molds (31, 32) (illustration example). Then, it is possible to maintain levelness.
Accordingly, at this time, the large substrate 70 is engaged in parallel with the surface of the substrate set block 31c of the upper die 31, and the upper surface of the cavity block 32c of the lower die 32 is also a surface parallel to the surface of the substrate set block 31c. It will move up in the state.
As a result, the bottom surface of the lower mold cavity 33a formed on the upper surface of the cavity block 32c of the lower mold 32 moves up in a state in which it is parallel to the surface of the large substrate 70.
At this time, the electronic component 71 on the surface of the large substrate 70 moves relatively downward and is immersed in the molten resin material 80a in the lower mold cavity 33a. Then, by moving the cavity block 32c of the lower mold 32 to a predetermined height position, the molten resin material 80a can be compressed with a predetermined molding pressure, and the electron mounted on the large substrate 70 can be compressed. The components 71 can be collectively sealed with the resin material 80 and formed into a uniform package thickness 33b (see FIG. 5).

  Further, as described above, the second mold clamping step of compressing the molten resin material 80a of the resin molding portion 33 (lower mold cavity 33a) in a state in which the upper mold 31 and the lower mold 32 are prevented from being bent is further reduced. By performing at a low speed and a low pressure, not only can the thickness 33b of the package for resin-sealing the electronic component 71 be formed to a uniform thickness, but also when the upper and lower molds (31, 32) are clamped. In addition, since the flow of the molten resin material 80a in the lower mold cavity 33a can be prevented or suppressed during the compression of the molten resin material 80a, a wire sweep or the like caused by the flow of the molten resin material 80a can be generated. It can prevent efficiently.

In addition, the setting of the final position of the lower mold cavity 33a at the time of the first mold clamping process and the bottom position of the lower mold cavity 33a at the time of the second mold clamping process is performed as necessary. It can be selected arbitrarily and appropriately.
For example, the final mold clamping position in the first mold clamping process may be matched with the position of the upper limit (top dead center) where the lower mold 32 is moved upward by the mold opening / closing mechanism 50 (see FIG. 5 and the like).
Further, the final mold clamping position in the second mold clamping process may be set with reference to the thickness 33b of the package for resin-sealing the electronic component 71 on the large substrate 70.

  Further, the final clamping position of the upper and lower molds (31, 32) or the final position of the bottom surface of the lower mold cavity 33a is detected by an appropriate detection mechanism (not shown), and the mold opening / closing mechanism 50, or May be provided with an appropriate position control mechanism (not shown) for stopping the cavity block 32c at a predetermined height position.

The above description is based on the case where the large substrate 70 has a uniform thickness.
By the way, when the thickness of the large substrate 70 is not uniform (not formed in parallel), for example, when one surface side is formed as a taper surface, the electronic component 71 on the large substrate 70 is made of resin. Since the thickness 33b of the package to be sealed is molded corresponding to the tapered surface, a uniform package thickness cannot be obtained.
However, in the present embodiment, even when there is a slight variation in the thickness of the large substrate 70, the package thickness 33b can be efficiently and reliably formed into a uniform thickness.

That is, as described above, the substrate set block 31c and the cavity block 32c in this embodiment are loosely fitted to the upper mold 31 and the lower mold 32, and the upper mold equal pressure means 41 and Since the lower mold uniform pressurizing means 42 is provided with a bending deformation preventing function, the substrate set block 31c and the cavity block 32c are swung in the vertical and horizontal directions within the range in which the upper mold 31 and the lower mold 32 are loosely fitted. It is configured to be able to move.
Therefore, since the thickness of the large substrate 70 is not parallel, the surface of the large substrate 70 (the mounting surface of the electronic component 71) attached to the substrate set block 31c and the upper surface of the cavity block 32c are not arranged in parallel. Even in this case, at the time of the second mold clamping process, either the substrate set block 31c or the cavity block 32c, or both of them swings in the vertical and horizontal directions, so that the large substrate 70 The position or inclination of both is corrected so that the surface of the cavity and the upper surface of the cavity block 32c are parallel to each other.
For this reason, the resin sealing molding for the electronic component 71 on the large substrate 70 is performed in a state in which the surface of the large substrate 70 and the upper surface of the cavity block 32c are modified so as to maintain parallelism. Therefore, the thickness 33b of the molded package can be formed to a uniform thickness.

According to this embodiment, the thickness 33b of the package for resin-sealing the electronic component 71 can be formed to a uniform thickness.
Further, in the case where a large number of electronic components 71 mounted on the large substrate 70 are collectively encapsulated with resin, the compression action on the molten resin material 80a in the lower mold cavity 33a is performed at a lower speed and lower pressure. By performing the above, it is possible to efficiently prevent the occurrence of a wire sweep or the like due to the flow action of the molten resin material 80a.

  Further, since the uniform pressure means 41 for the upper mold 31 and the uniform pressure means 42 for the lower mold 32 are provided, it is possible to prevent the upper and lower molds (31, 32) from being bent. This is useful when the electronic components 71 on the shaped substrate 70 are collectively encapsulated with resin.

In the above-described embodiment, the following can be performed on either one or both of the substrate set block 31c and the cavity block 32c during the second mold clamping step.
That is, the pressure medium 44 adjusted to a required pressure through the working fluid path 42e is introduced into the working fluid chamber 41d of the manifold 41a by the pressure adjusting mechanism 43 in the upper mold uniform pressurizing means 41. By pressing the piston 41c fitted to each cylinder 41b of the manifold 41a with the pressure medium 44 and joining the lower end of each piston rod 41f to the back surface of the substrate set block 31c, The substrate 70 supplied to the mold surface can be pressed at a predetermined uniform pressure, and the substrate 70 can be held (held) by pressing with the predetermined uniform pressure.
Further, the pressure medium 44 adjusted to a required pressure through the working fluid path 42c is introduced into the working fluid chamber 42d of the manifold 42a by the pressure adjusting mechanism 43 in the lower mold uniform pressurizing means 42. By pressing the piston 42c fitted to each cylinder 42b of the manifold 42a with the pressure medium 44 and joining the upper end of each piston rod 42f to the back surface of the cavity block 32c, the lower mold The resin in the cavity 33a can be pressed with a predetermined uniform pressure, and the press with the predetermined uniform pressure can be maintained (pressure holding).
Accordingly, during the second mold clamping step, the upper mold uniform pressurizing means 41 (pressurizing force adjusting mechanism 43) is operated, whereby the substrate 70 is set at a predetermined uniform pressure (molding pressure) in the substrate set block 31c. It is possible to hold pressure.
In addition, by operating the lower mold uniform pressurizing means 42 (pressure adjusting mechanism 43) during the second mold clamping step, the resin in the lower mold cavity 33a is given a predetermined uniform by the cavity block 32c. The pressure can be maintained (by molding pressure).

Further, in the embodiment, regarding either the substrate set block 31c or the cavity block 32c before the first mold clamping process for closing both the upper and lower molds (31, 32) and during the second mold clamping process. On either side or both, the following can be performed.
That is, in the embodiment, first, before the first mold clamping step for closing both the upper and lower molds (31, 32), by operating the pressure adjusting mechanism 43, the upper mold uniform pressurizing means 41 is operated. The substrate set block 31c can be pressed, and the cavity block 32c can be pressed by the lower mold uniform pressurizing means 42.
At this time, the substrate set block 31c or the cavity block 32c can be held by pressing with a predetermined uniform pressure or by pressing with a pressure lower than the predetermined uniform pressure.
For example, the substrate set block 31c (or the cavity block 32c) is pressed by an equal pressure applied to the substrate set block 31c (or the cavity block 32c) during the second mold clamping process, or the It can be held by pressing with an equal pressure lower than the equal pressure applied to the substrate set block 31c (or the cavity block 32c) during the second mold clamping step.
Next, by operating the pressure adjusting mechanism 43 during the second mold clamping step, the upper mold uniform pressurizing means 41 presses the substrate set block 31c (substrate 70) with a predetermined uniform pressure. The cavity block 32c (resin in the lower mold cavity 33a) can be held by the lower mold uniform pressurizing means 42 by pressing with a predetermined uniform pressure.
Therefore, by operating the pressure adjusting mechanism 43, the upper mold uniform pressurizing means 41 can always hold the substrate set block 31c by pressing with a predetermined uniform pressure, and the lower mold The cavity block 32c can be held by the uniform pressure means 42 by pressing with a predetermined uniform pressure.

20 Press frame
30 Mold for compression molding
31 Upper mold
31a Upper mold base
31b Upper hold block
31c Board set block
31d Heater for upper die heating
31e Seal member
31f Holding part
32 Lower mold
32a Lower mold base
32b Lower die heater
32c cavity block
32d cavity side member
32e Elastic member
32f Cavity block heater
33 Plastic molding part
33a Lower mold cavity
33b Package thickness
40 Uniform pressure means
41 Upper mold uniform pressure means
41a Manifold
41b cylinder
41c piston
41d Working fluid chamber
41e Working fluid path
41f Piston rod
42 Lower mold uniform pressure means
42a Manifold
42b cylinder
42c piston
42d Working fluid chamber
42e Working fluid path
42f Piston rod
43 Pressure adjustment mechanism
44 Pressure medium
50-type opening / closing mechanism (toggle mechanism)
51 base
51a axis
52 Movable platen
52a axis
53 Servo motor
53a Output shaft
53b Pulley
53c belt
54 Screw shaft
55 Nut member
56a First link
56b Second link
56c 3rd link
60 Release film
70 Large board
71 Electronic components
80 Resin material
80a Molten resin material

Claims (16)

At least using a compression mold for electronic parts consisting of an upper mold and a lower mold,
Supplying the substrate to the upper mold surface and engaging the electronic component mounting surface side downward;
Coating the release film on the lower mold surface including the resin molding portion of the lower mold;
Supplying and heating a resin material into a lower mold cavity in a resin molded portion coated with the release film; and
A first mold clamping step for closing the upper and lower molds;
The substrate set block in the upper mold is moved downward, and the cavity block in the lower mold is moved upward to immerse the electronic components of the substrate in the resin in the lower mold cavity, and then in the lower mold cavity A compression resin sealing method of an electronic component that performs a second mold clamping step of collectively sealing and molding electronic components mounted on the substrate by applying a predetermined resin pressure to the resin,
Performing a step of holding the substrate set block in a loosely fitted state with respect to the upper mold,
Further, a step of holding the cavity block in a loosely fitted state with respect to the cavity side surface member of the lower mold is performed,
In addition, at least during the second mold clamping step described above, an upper mold bending deformation preventing step of preventing the substrate set block from bending deformation through the upper mold uniform pressure unit,
In addition, at least during the second mold clamping step described above, a lower mold bending deformation preventing process for preventing bending deformation of the cavity block through the lower mold uniform pressurizing means is performed.
Further, during the second mold clamping step, by swinging either one or both of the substrate set block and / or the cavity block in the vertical and horizontal directions, the surface of the substrate and the upper surface of the cavity block so it is parallel, have a position or line of slope of the correction process of the two,
The upper mold uniform pressurizing means introduces the pressure medium adjusted to a required pressurizing force by the pressurizing pressure adjusting mechanism into the working fluid chamber of the manifold through the working fluid path, and is fitted into each cylinder of the manifold. It is set so that the piston is pushed and the lower end of each piston rod is joined to the back of the substrate set block and pressed.
Further, the lower mold uniform pressurizing means introduces the pressure medium adjusted to a required pressurizing force by the pressurizing pressure adjusting mechanism into the working fluid chamber of the manifold through the working fluid path, and is fitted in each cylinder of the manifold. A compression resin sealing method for an electronic component, wherein the piston is configured to push and move the piston rod so that the upper end portion of each piston rod is bonded to the back surface of the cavity block . At least using a compression mold for electronic parts consisting of an upper mold and a lower mold,
Supplying the substrate to the upper mold surface and engaging the electronic component mounting surface side downward;
Coating the release film on the lower mold surface including the resin molding portion of the lower mold;
Supplying and heating a resin material into a lower mold cavity in a resin molded portion coated with the release film; and
A first mold clamping step for closing the upper and lower molds;
The substrate set block in the upper mold is moved downward, and the cavity block in the lower mold is moved upward to immerse the electronic components of the substrate in the resin in the lower mold cavity, and then in the lower mold cavity A compression resin sealing method of an electronic component that performs a second mold clamping step of collectively sealing and molding electronic components mounted on the substrate by applying a predetermined resin pressure to the resin,
Performing a step of holding the substrate set block in a loosely fitted state with respect to the upper mold,
Further, a step of holding the cavity block in a loosely fitted state with respect to the cavity side surface member of the lower mold is performed,
In addition, at least during the second mold clamping step described above, an upper mold bending deformation preventing step of preventing the substrate set block from bending deformation through the upper mold uniform pressure unit,
In addition, at least during the second mold clamping step described above, a lower mold bending deformation preventing process for preventing bending deformation of the cavity block through the lower mold uniform pressurizing means is performed.
Further, during the second mold clamping step, by swinging either one or both of the substrate set block and / or the cavity block in the vertical and horizontal directions, the surface of the substrate and the upper surface of the cavity block so it is parallel, have a position or line of slope of the correction process of the two,
The upper mold uniform pressurizing means introduces the pressure medium adjusted to a required pressurizing force by the pressurizing pressure adjusting mechanism into the working fluid chamber of the manifold through the working fluid path, and is fitted into each cylinder of the manifold. A compression resin sealing method for an electronic component, wherein the piston is configured to push and to press the piston rod by joining the lower end portion of each piston rod to the back surface of the substrate set block . At least using a compression mold for electronic parts consisting of an upper mold and a lower mold,
Supplying the substrate to the upper mold surface and engaging the electronic component mounting surface side downward;
Coating the release film on the lower mold surface including the resin molding portion of the lower mold;
Supplying and heating a resin material into a lower mold cavity in a resin molded portion coated with the release film; and
A first mold clamping step for closing the upper and lower molds;
The substrate set block in the upper mold is moved downward, and the cavity block in the lower mold is moved upward to immerse the electronic components of the substrate in the resin in the lower mold cavity, and then in the lower mold cavity A compression resin sealing method of an electronic component that performs a second mold clamping step of collectively sealing and molding electronic components mounted on the substrate by applying a predetermined resin pressure to the resin,
Performing a step of holding the substrate set block in a loosely fitted state with respect to the upper mold,
Further, a step of holding the cavity block in a loosely fitted state with respect to the cavity side surface member of the lower mold is performed,
In addition, at least during the second mold clamping step described above, an upper mold bending deformation preventing step of preventing the substrate set block from bending deformation through the upper mold uniform pressure unit,
In addition, at least during the second mold clamping step described above, a lower mold bending deformation preventing process for preventing bending deformation of the cavity block through the lower mold uniform pressurizing means is performed.
Further, during the second mold clamping step, by swinging either one or both of the substrate set block and / or the cavity block in the vertical and horizontal directions, the surface of the substrate and the upper surface of the cavity block so it is parallel, have a position or line of slope of the correction process of the two,
The lower mold uniform pressurizing means introduces the pressure medium adjusted to a required pressurizing force by the pressurizing pressure adjusting mechanism into the working fluid chamber of the manifold through the working fluid path, and is fitted to each cylinder of the manifold. A compression resin sealing method for an electronic component, wherein the piston is pushed and the upper end of each piston rod is joined to the back of the cavity block and pressed . The method for compressing an electronic component with compressed resin according to any one of claims 1 to 3, wherein a fluid is used as the pressure medium. Compression resin sealing method for an electronic component according to any one of claims 1 to 3, characterized in that a silicone oil as the pressure medium. A pressure medium adjusted to a required pressure by the same pressure adjusting mechanism is introduced into each of the working fluid chamber of the manifold in the upper uniform pressurizing unit and the working fluid chamber of the manifold in the lower uniform pressurizing unit. The method for compressing a resin of an electronic component according to claim 1 . A pressure medium adjusted to a required pressure by a different pressure adjusting mechanism is introduced into each of the working fluid chamber of the manifold in the upper uniform pressurizing means and the working fluid chamber of the manifold in the lower uniform pressurizing means. The method for compressing a resin of an electronic component according to claim 1 . At least using a compression mold for electronic parts consisting of an upper mold and a lower mold,
Supplying the substrate to the upper mold surface and engaging the electronic component mounting surface side downward;
Coating the release film on the lower mold surface including the resin molding portion of the lower mold;
Supplying and heating a resin material into a lower mold cavity in a resin molded portion coated with the release film; and
A first mold clamping step for closing the upper and lower molds;
The substrate set block in the upper mold is moved downward, and the cavity block in the lower mold is moved upward to immerse the electronic components of the substrate in the resin in the lower mold cavity, and then in the lower mold cavity A compression resin sealing method of an electronic component that performs a second mold clamping step of collectively sealing and molding electronic components mounted on the substrate by applying a predetermined resin pressure to the resin,
Performing a step of holding the substrate set block in a loosely fitted state with respect to the upper mold,
Further, a step of holding the cavity block in a loosely fitted state with respect to the cavity side surface member of the lower mold is performed,
In addition, at least during the second mold clamping step described above, an upper mold bending deformation preventing step of preventing the substrate set block from bending deformation through the upper mold uniform pressure unit,
In addition, at least during the second mold clamping step described above, a lower mold bending deformation preventing process for preventing bending deformation of the cavity block through the lower mold uniform pressurizing means is performed.
Further, during the second mold clamping step, by swinging either one or both of the substrate set block and / or the cavity block in the vertical and horizontal directions, the surface of the substrate and the upper surface of the cavity block so it is parallel, have a position or line of slope of the correction process of the two,


During the second mold clamping step, either one or both of the substrate set block and the cavity block,
A pressure medium adjusted to a required pressure through a working fluid path by a pressure adjusting mechanism in the upper uniform pressurizing means is introduced into the working fluid chamber of the manifold, and each cylinder of the manifold is supplied with this pressure medium. The substrate supplied to the upper mold surface is pressed at a predetermined pressure by pressing the piston fitted to the piston rod and joining the lower end of each piston rod to the back surface of the substrate set block.
Further, a pressure medium adjusted to a required pressure through a working fluid path by a pressure adjusting mechanism in the lower mold uniform pressurizing means is introduced into the working fluid chamber of the manifold, and each cylinder of the manifold is supplied with the pressure medium. Each of the piston rods is pushed and the upper end of each piston rod is joined to the back surface of the cavity block to press the resin in the lower mold cavity with a predetermined pressure. Compressed resin sealing method for electronic parts. At least using a compression mold for electronic parts consisting of an upper mold and a lower mold,
Supplying the substrate to the upper mold surface and engaging the electronic component mounting surface side downward;
Coating the release film on the lower mold surface including the resin molding portion of the lower mold;
Supplying and heating a resin material into a lower mold cavity in a resin molded portion coated with the release film; and
A first mold clamping step for closing the upper and lower molds;
The substrate set block in the upper mold is moved downward, and the cavity block in the lower mold is moved upward to immerse the electronic components of the substrate in the resin in the lower mold cavity, and then in the lower mold cavity A compression resin sealing method of an electronic component that performs a second mold clamping step of collectively sealing and molding electronic components mounted on the substrate by applying a predetermined resin pressure to the resin,
Performing a step of holding the substrate set block in a loosely fitted state with respect to the upper mold,
Further, a step of holding the cavity block in a loosely fitted state with respect to the cavity side surface member of the lower mold is performed,
In addition, at least during the second mold clamping step described above, an upper mold bending deformation preventing step of preventing the substrate set block from bending deformation through the upper mold uniform pressure unit,
In addition, at least during the second mold clamping step described above, a lower mold bending deformation preventing process for preventing bending deformation of the cavity block through the lower mold uniform pressurizing means is performed.
Further, during the second mold clamping step, by swinging either one or both of the substrate set block and / or the cavity block in the vertical and horizontal directions, the surface of the substrate and the upper surface of the cavity block so it is parallel, have a position or line of slope of the correction process of the two,
Before the first mold clamping process for closing both the upper and lower molds, either one or both of the substrate set block and the cavity block,
Holding the substrate set block by pressing with a predetermined pressure or pressing with a pressure lower than a predetermined pressure by the upper mold uniform pressing means;
Further, the lower die uniform pressurizing means holds the cavity block by pressing with a predetermined pressure or by pressing with a pressure lower than a predetermined pressure,
During the second mold clamping step, either one or both of the substrate set block and the cavity block,
Holding the substrate set block by pressing with a predetermined pressure by the upper mold uniform pressure means,
Further, the method for compressing an electronic component with a compressed resin , wherein the lower block uniform pressure means holds the cavity block by pressing with a predetermined pressure . Using at least an electronic component compression molding die composed of an upper die and a lower die, a substrate is supplied to the upper die surface and the mounting surface side of the electronic component is engaged downward to cover the release film. The resin material is supplied into the lower mold cavity and heated, and then the first mold closing is performed to close both the upper and lower molds. Next, the substrate set block in the upper mold is moved down, The electronic component of the substrate was immersed in the resin in the lower mold cavity by moving the cavity block upward, and further mounted on the substrate by applying a predetermined resin pressure to the resin in the lower mold cavity. A compression resin sealing device for electronic parts that performs second mold clamping to collectively seal and mold electronic parts with resin,
The substrate set block is held in a loosely fitted state with respect to the upper mold, and the cavity block is held in a loosely fitted state with respect to the cavity side member of the lower mold,
Furthermore, it comprises a uniform pressurizing means that also serves as a bending deformation preventing member of both the upper and lower types,
Further, the uniform pressure means includes an upper mold uniform pressure means and a lower mold uniform pressure means,
Further, the upper mold uniform pressurizing means introduces the pressure medium adjusted to a required pressurizing force by the pressurizing control mechanism into the working fluid chamber of the manifold through the working fluid path, and is fitted into each cylinder of the manifold. The piston is made to push, and the bottom end of each piston rod is joined to the back of the substrate set block and pressed,
The lower mold uniform pressurizing means introduces a pressure medium adjusted to a required pressurizing force by a pressurizing pressure adjusting mechanism into a working fluid chamber of the manifold through a working fluid path, and is fitted in each cylinder of the manifold. A compression resin sealing device for an electronic component, wherein the piston is pushed and the upper end portion of each piston rod is joined to and pressed against the back surface of the cavity block. Using at least an electronic component compression molding die composed of an upper die and a lower die, a substrate is supplied to the upper die surface and the mounting surface side of the electronic component is engaged downward to cover the release film. The resin material is supplied into the lower mold cavity and heated, and then the first mold closing is performed to close both the upper and lower molds. Next, the substrate set block in the upper mold is moved down, The electronic component of the substrate was immersed in the resin in the lower mold cavity by moving the cavity block upward, and further mounted on the substrate by applying a predetermined resin pressure to the resin in the lower mold cavity. A compression resin sealing device for electronic parts that performs second mold clamping to collectively seal and mold electronic parts with resin,
The substrate set block is held in a loosely fitted state with respect to the upper mold, and the cavity block is held in a loosely fitted state with respect to the cavity side member of the lower mold,
Furthermore, it comprises a uniform pressurizing means that also serves as a bending deformation preventing member of both the upper and lower types,
Further, the uniform pressure means includes an upper mold uniform pressure means and a lower mold uniform pressure means,
Further, the upper mold uniform pressurizing means introduces the pressure medium adjusted to a required pressurizing force by the pressurizing control mechanism into the working fluid chamber of the manifold through the working fluid path, and is fitted into each cylinder of the manifold. A compressed resin sealing device for an electronic component, wherein the piston is pushed and the lower end portion of each piston rod is joined to and pressed against the back surface of the substrate set block. Using at least an electronic component compression molding die composed of an upper die and a lower die, a substrate is supplied to the upper die surface and the mounting surface side of the electronic component is engaged downward to cover the release film. The resin material is supplied into the lower mold cavity and heated, and then the first mold closing is performed to close both the upper and lower molds. Next, the substrate set block in the upper mold is moved down, The electronic component of the substrate was immersed in the resin in the lower mold cavity by moving the cavity block upward, and further mounted on the substrate by applying a predetermined resin pressure to the resin in the lower mold cavity. A compression resin sealing device for electronic parts that performs second mold clamping to collectively seal and mold electronic parts with resin,
The substrate set block is held in a loosely fitted state with respect to the upper mold, and the cavity block is held in a loosely fitted state with respect to the cavity side member of the lower mold,
Furthermore, it comprises a uniform pressurizing means that also serves as a bending deformation preventing member of both the upper and lower types,
Further, the uniform pressure means includes an upper mold uniform pressure means and a lower mold uniform pressure means,
The lower mold uniform pressurizing means introduces a pressure medium adjusted to a required pressurizing force by a pressurizing pressure adjusting mechanism into a working fluid chamber of the manifold through a working fluid path, and is fitted in each cylinder of the manifold. A compression resin sealing device for an electronic component, wherein the piston is pushed and the upper end portion of each piston rod is joined to and pressed against the back surface of the cavity block. 13. The compressed resin sealing device for electronic parts according to claim 10, wherein a fluid is used as the pressure medium. 13. The compressed resin sealing device for electronic parts according to claim 10, wherein silicone oil is used as the pressure medium. 11. The compressed resin sealing of an electronic component according to claim 10 , wherein the pressure adjusting mechanism of the upper uniform pressure means and the pressure adjusting mechanism of the lower uniform pressure means are combined. Stop device. 11. The compression of an electronic component according to claim 10 , wherein the pressing force adjusting mechanism of the upper uniform pressing means and the pressing force adjusting mechanism of the lower uniform pressing means are separately arranged. Resin sealing device.

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