JP5945211B2 - Exposure equipment - Google Patents

Description

  The present invention relates to a technique suitable for use in an exposure apparatus.

Conventionally, touch panels have been widely used in, for example, ATMs, vending machines, portable information terminals, portable game machines, electronic guidance display boards, car navigation systems, mobile phones, and the like.
In contrast to the conventional method of using a touch panel on a liquid crystal panel, research on methods for integrating a touch panel function into a liquid crystal panel has become active. In recent years, for the integration of the touch panel and the liquid crystal panel, as a trend of thinning the touch panel sensor and simplifying the manufacturing process, a method of directly patterning the cover glass along with the in-cell method and the on-cell method has been studied.

  The cover glass currently on the market is tempered after being cut into the final product size and shape. Reversing this process is a technical barrier, and the cut cover glass is patterned. In other words, if multiple large glass substrates that have undergone tempering treatment are cut after exposure and patterning, they cannot be commercialized due to cracks or the like, and the final product shape is not rectangular and is simply cut The current situation is not possible.

  Therefore, there is a demand for an exposure apparatus that performs an exposure process on a glass substrate that has been cut into a product size and shape. However, such an exposure apparatus increases the takt time, which hinders productivity improvement. Yes.

Conventionally, there has been a desire to realize an improvement in productivity that can further reduce the time required for exposure processing at a low cost.
Further, in order to obtain the desired width of the linear portion formed by etching after the exposure process, it is necessary to set an appropriate exposure energy for the line width to a predetermined value as the exposure condition. As specific parameters, exposure time, lamp power such as illuminance, etc. are applied, but if these change, the width of the linear portion will change, so it is necessary to monitor the exposure parameters there were.

JP 2001-297971 A

  The present invention has been devised in view of such conventional circumstances, and in an exposure apparatus that performs exposure processing on a substrate or the like cut into individual shapes, the tact time is shortened and the productivity is improved. An object of the present invention is to provide an exposure apparatus and an exposure method that can be used.

Further, in the exposure apparatus of the present invention, a mask holding unit that holds a mask having a pattern to be exposed;
A work holding unit for holding a work as an exposed material;
A drive unit that relatively drives the mask holding unit and the work holding unit;
An alignment camera capable of detecting a mask side alignment mark formed on the mask and a work side alignment mark formed on the workpiece;
Ready signal output means for outputting that alignment can be started;
A plurality of exposure portions for exposing and transferring the pattern of the mask on the workpiece.
In each of the plurality of exposure units, a control unit for driving the drive unit to execute an alignment operation based on the shift amount of the alignment marks detected by the alignment camera is provided in common. ,
The control unit selects one exposure unit among the exposure units outputting the ready signal and outputs an alignment start signal, so that the deviation amount of the alignment marks is selected in the selected exposure unit. In an exposure apparatus that performs an alignment operation by the drive unit so that is within a desired alignment accuracy range during exposure transfer,
The exposure unit includes a light source for exposure irradiation, a shutter for controlling an exposure time, and detection means for detecting a change in illuminance of the light source for exposure irradiation,
The control unit may employ means for outputting an exposure time corresponding to a change in illuminance of the exposure light source as an exposure condition signal.
Moreover, the said workpiece | work can be made into the glass substrate by which the reinforcement | strengthening process was performed previously.
In the present invention, the control unit outputs the ready signal in the selected exposure unit after outputting the alignment start signal to the driving unit and before outputting the ready signal again. It is desirable to select the exposure portion and output the alignment start signal.
Furthermore, the workpiece holding unit can hold a plurality of workpieces.

  According to the present invention, the control unit selects one exposure unit among the exposure units outputting the ready signal and outputs an alignment start signal. By performing the alignment operation by the drive unit so that the deviation amount of both alignment marks is within the desired alignment accuracy range at the time of exposure transfer, a common control unit controls a plurality of exposure units to perform exposure in parallel. When performing the operation, the exposure unit calculates the drive amount based on the image from the alignment camera and outputs the alignment signal during the alignment by the drive unit in one exposure unit. The exposure unit can be controlled to shorten the tact time and reduce the manufacturing cost of the apparatus.

  According to the present invention, there is provided an exposure apparatus that can efficiently perform an exposure process even on a glass substrate that has been subjected to a strengthening process in advance, can reduce takt time at low cost, and can improve productivity. be able to.

  In the present invention, the control unit outputs the ready signal in the selected exposure unit after outputting the alignment start signal to the driving unit and before outputting the ready signal again. By selecting the exposure unit and outputting the alignment start signal, it is possible to shorten the idle time in the common control unit and efficiently reduce the tact time in the plurality of exposure units.

1 is a schematic diagram showing a first embodiment of an exposure apparatus according to the present invention. It is a time chart which shows the exposure process state in 1st Embodiment of the exposure apparatus which concerns on this invention. It is a time chart which shows the exposure process state in 1st Embodiment of the exposure apparatus which concerns on this invention. It is the perspective view (a) which shows the exposure part in 2nd Embodiment of the exposure apparatus which concerns on this invention, a top view (b), and sectional drawing (c). It is a top view which shows the exposure part in 3rd Embodiment of the exposure apparatus which concerns on this invention. It is a top view which shows the other example in 3rd Embodiment of the exposure apparatus which concerns on this invention. It is a figure which shows typically the example of 1 structure of the irradiation optical system (exposure unit) in 1st Embodiment of the exposure apparatus which concerns on this invention. It is a figure which shows typically the other structural example of the irradiation optical system (exposure unit) in 1st Embodiment of the exposure apparatus which concerns on this invention. It is a figure which shows typically the other structural example of the irradiation optical system (exposure unit) in 1st Embodiment of the exposure apparatus which concerns on this invention.

Hereinafter, a first embodiment of an exposure apparatus according to the present invention will be described with reference to the drawings.
FIG. 1 is a schematic diagram showing an exposure apparatus according to the present embodiment. In the figure, reference numeral 1 denotes an exposure apparatus.

  The exposure apparatus 1 in the present embodiment includes a control unit C and a plurality of exposure units 20, 30, 40, 50... Connected to the control unit C. Although the number of exposure units is not particularly limited, in the present embodiment, description will be made using only four units.

  Since all of the exposure unit 20, the exposure unit 30, the exposure unit 40, and the exposure unit 50 have substantially the same configuration, only the reference numeral 20 will be described. Further, in the following description, the configuration of each exposure unit is the reference numeral 20 and the components in the 20th order derived therefrom, the reference numerals 30, 40 and 50 and the constituent elements in the 30th, 40th and 50th order derived therefrom. It is described as being replaced by

  The exposure unit 20 includes a mask stage (mask holding unit) 21 that holds the mask M, a work stage (work holding unit) 22 that holds a glass substrate (work as an exposed material) W, and the work stage 22 on the X axis. , Y-axis and Z-axis directions and a work stage moving mechanism (drive unit) 23 for adjusting the tilt of the work stage 22, an alignment camera 24, a ready signal output means 25, an irradiation optical system 26, a work And a transport system 27 for loading / unloading W.

  A glass substrate W (hereinafter simply referred to as “work W”) is disposed to face the mask M at the time of exposure, and the surface (opposite surface side of the mask M) for exposing and transferring the mask pattern drawn on the mask M. ) Is coated with a photosensitive agent. The mask M is made of fused quartz and has a rectangular shape.

  The mask stage (mask holding portion) 21 is mounted, for example, on a mask stage base having a rectangular opening at the center, and is movable in the X, Y, and θ directions at the opening of the mask stage base. The mask holding frame (mask holding portion), the chuck portion attached to the mask holding frame and holding the mask M by suction, and the mask holding frame and chuck portion are moved in the X-axis, Y-axis, and θ directions to move the mask. A mask position adjusting mechanism (mask driving unit) that adjusts the position of the mask M held by the holding frame can be provided. The mask stage base is supported by a Z-axis moving device so as to be movable in the Z-axis direction, and is disposed above the work stage. The Z-axis moving device includes, for example, an electric actuator including a motor and a ball screw, a pneumatic cylinder, or the like, and can move the mask stage up and down to a predetermined position by performing a simple vertical movement. The mask position adjusting mechanism includes a Y-axis direction driving device attached to one side along the X-axis direction of the mask holding frame, and two X-axis direction driving devices attached to one side along the Y-axis direction of the mask holding frame. The mask holding frame can be moved in the θ direction (rotated about the Z axis).

  Further, an alignment camera 24 for imaging the alignment mark 21a of the mask M and the alignment mark 22a of the workpiece W is provided above the mask stage 21. The alignment camera 24 is held so as to be movable in the X-axis and Y-axis directions via a moving mechanism, and can be arranged in the mask holding frame in plan view.

  The work stage (work holding unit) 22 is installed on the work stage moving mechanism 23 and includes a work chuck having a suction surface for holding the work W on the work stage 22 on the upper surface. The work chuck can hold the work W by vacuum suction.

  The work stage moving mechanism 23 performs a Y-axis feed mechanism that moves the work stage in the Y-axis direction, an X-axis feed mechanism that moves the work stage 22 in the X-axis direction, a tilt adjustment of the work stage 22, and a work stage. And a Z-tilt adjustment mechanism for finely moving the 22 in the Z-axis direction. Note that the drive unit only needs to be capable of relative movement between the mask M and the glass substrate W, and can include a work stage moving mechanism 23 and a mask position adjusting mechanism (mask drive unit).

  The transport system 27 may have any configuration as long as the work W is loaded at a predetermined position and can be unloaded after completion of exposure. For example, an articulated robot hand or a conveyor flowing in one direction can be adopted. In addition, in FIG. 1, the conveyance system 27 is shown typically.

  The ready signal output means 25 outputs a state in which the workpiece W is positioned at a predetermined position and alignment can be started, and can be a signal output means from the transport system 27, the alignment camera 24, or the like. Alternatively, when the operation of the transport system 27 is controlled by the control unit C, the control unit C can turn the ready signal ON and the control unit C itself can be the ready signal output means 25.

The irradiation optical system 26 is not particularly limited as long as it is a configuration capable of exposure irradiation. For example, a high-pressure mercury lamp (exposure irradiation light source) 26a that is a light source for ultraviolet irradiation, and the irradiation light are controlled. In addition, the optical system element 26b constituting the irradiation optical path, the exposure control shutter 26c for controlling the opening and closing of the irradiation optical path, and the illuminance meter (detection means) 26d may be provided.
The optical system elements include, for example, a concave mirror that collects light emitted from a high-pressure mercury lamp, two types of optical integrators that are switchably arranged near the focal point of the concave mirror, and a plurality of plane mirrors that change the direction of the optical path. In this case, the exposure control shutter 26c can be disposed between the plane mirror and the optical integrator.

The high-pressure mercury lamp 26a is basically always lit while the exposure apparatus 1 is driven.
The exposure control shutter 26c is controlled to be opened and closed by a signal from the control unit C, and starts and ends exposure.
The illuminometer 26d is connected to the control unit C and can output the state of the lamp 26a.

  FIG. 7 is a diagram schematically showing a configuration example of an irradiation optical system (exposure unit). As shown in FIG. 7A, in the exposure unit 90, the light emitted from the light source (exposure irradiation light source) 91 travels toward the first flat mirror 93 disposed below by the condensing mirror 92. The light reflected by the first plane mirror 93 travels toward the second plane mirror 95 after passing through the integrator 94. At that time, part of the light that has passed through the integrator 94 enters the irradiation monitoring device 96. The light reflected by the second plane mirror 95 sequentially passes through the collimator 97 and the mask 98, and then performs an exposure process on the processing surfaces 2α of the plurality of substrates 2 corresponding to the workpiece W in FIG. An exposure control shutter 90 </ b> A can be disposed between the first plane mirror 93 and the integrator 94. In this example, the illuminance meter (detection means) is not shown.

FIG. 7B is an enlarged view showing the relationship between the mask 98 in FIG. 7A and the processing surfaces 2α of the plurality of substrates 2. When the gap d between the mask 98 and the processing surface 2α is set to several μm to several tens μm (d ≠ 0), it is called a proximity method. On the other hand, when the mask 98 is completely brought into contact with the processing surface 2α (d = 0), it is called a contact method. Either method can be applied.
That is, in order to establish the above-described exposure processing, the light to be exposed to the processing surface 2α of the plurality of substrates 2, that is, the light that has passed through the collimator 97 is collimated so as to have an optical path of the same distance. It is necessary to match the relative positions of the meter 97 and the plurality of substrates 2.

  FIG. 8 is a diagram schematically showing another configuration example of the irradiation optical system (exposure unit). As shown in FIG. 8A, in the exposure unit 300, the light source 301, the elliptical mirror 302 that condenses the light emitted from the light source 301, and the light condensed and reflected by the elliptical mirror 302 are converted into parallel light. And a projection lens 305 for condensing the light transmitted through the mask 304 on which the pattern is formed and projecting the light onto the workpiece W. Two shutters 307 and 308 are disposed between the elliptical mirror 302 and the collimator lens 303. The shutters 307 and 308 are controlled by a drive mechanism 312 including a motor and a gear train so as to rotate in opposite directions around the rotation axis X0. Note that the drive mechanism 312 may be provided separately for the shutters 307 and 308. In this example, the illuminance meter (detection means) is not shown.

  FIG. 8B shows the configuration of the shutters 307 and 308. As shown in the figure, the shutters 307 and 308 are composed of shutter blades 309 and 310 each having a notch formed in a part of a disk, and these shutter blades 309 and 310 are rotated in synchronization with each other in opposite directions by a drive mechanism 312. Is done. As shown in FIG. 8B, when the shutters 307 and 308 are closed, the shutter blades 309 and 310 are slightly overlapped so as to block the optical axis X1. On the other hand, when the shutter is opened, the shutter blades 309 and 310 are substantially overlapped with each other rotated from the state shown in FIG. 8B by an angle (corresponding to a quadrant) that is relatively equal to the center angle of the notch. Yes, the optical axis X1 is open. The rotation of the shutter blades 309 and 310 is controlled by a signal output from the control unit C.

  FIG. 9 is a diagram schematically showing another configuration example of the irradiation optical system (exposure unit). As shown in FIG. 9A, in the exposure unit 400, a liquid crystal display element 402 as a shutter and a light shielding partition shield a lamp house 403 in which a light source is installed and external light unnecessary for exposure. The black box 404 is divided into spaces. The liquid crystal display element 402 is used as a control device that transmits or blocks light from the lamp house 403, and a fly-eye lens in which an infinite number of lenses are provided on the black box 404 side of the liquid crystal display element 402. 405 is provided to prevent light spots and light diffusion. The liquid crystal display element 402 only needs to transmit or shield light. The lamp house 403 includes a mercury lamp 406 that is a light source that generates exposure light, an elliptical mirror 407 that condenses the light from the mercury lamp 406, and the light generated from the mercury lamp 406 toward the liquid crystal display element 402. And a reflecting plate 408 for reflecting. The black box 404 is irradiated with light, a Fresnel lens 409 that makes the light controlled by the liquid crystal display element 402 uniform, a reflector 410 that reflects the light transmitted through the liquid crystal display element 402 toward the Fresnel lens 409, and light. Then, a glass substrate W on which a negative resist, which is a film to be insolubilized, is applied, a stage 412 on which the glass substrate W is placed and moved to an exposure position, a light transmitting region and a light shielding shield And a mask 413 whose region is formed in a wiring pattern.

  A driving power supply unit is connected to the liquid crystal display element 402. By controlling the voltage applied to the liquid crystal layer of the liquid crystal display element 402, the alignment state of the liquid crystal layer is changed, and the light incident on the liquid crystal display element 402 is changed. Permeated or shielded. The operation of the exposure unit 400 will be described. Light generated from the mercury lamp 406 is collected in one direction by the elliptical mirror 407, and the collected light is reflected by the first reflecting plate 408 and includes a fly-eye lens 405. The liquid crystal display element 402 is incident. In the liquid crystal display element 402, the alignment state of liquid crystal molecules is changed by a control signal from the control unit C, and transmission or shielding of incident light is controlled. When the liquid crystal display element 402 is in the shielding state, the stage 412 is operated to retract the glass substrate W that has already been exposed, or to place the glass substrate W coated with an exposure resist. In the transmissive state of the liquid crystal display element 402 that is an exposure state, the light that has passed through the liquid crystal display element 402 is reflected by the reflector 410 and is incident on the Fresnel lens 409. The light made uniform by the Fresnel lens 409 is incident on the mask 413, and the light processed into the wiring pattern is irradiated onto the glass substrate W on which the exposure resist is applied.

In the irradiation optical system 26, it is necessary to detect the illuminance of the high-pressure mercury lamp (light source for exposure irradiation) 26a and set the irradiation time in the exposure process following the change in the state. In many cases, the high-pressure mercury lamp (light source for exposure irradiation) 26a is always turned on, and the exposure state is set to a desired range by controlling the open / close time of the exposure control shutter 26c. In other words, the exposure time is controlled to increase the exposure time when the illuminance is lowered due to a change over time or the like, and to shorten the exposure time when the illuminance is high. Thereby, it can prevent that the exposure state of the to-be-exposed part which is a photoresist etc. changes due to illumination intensity. In other words, it is possible to maintain the desired exposure results by reducing fluctuations in exposure due to exposure, and to prevent problems such as fluctuations in parameters such as line width formed through post-exposure processing such as etching. It becomes.
At the same time, in a plurality of irradiation optical systems (exposure units), it is possible to reduce the exposure process variation due to the illuminance variation machine difference by feedback. Redundancy for maintaining the relationship between exposure energy and line width can be reduced, and costs can be reduced.

  The control of the opening / closing time change of the exposure control shutter 26c based on the fluctuation of the illuminance (luminance) of the irradiation light by the illuminance meter (detection means) 26d is detected by the control unit C from the illuminance meter 26d at predetermined intervals. The opening / closing time data calculated based on the signal can be output as an exposure condition signal included in an exposure start signal described later, and the exposure control shutter 26c can be operated. Alternatively, the opening / closing time stored in advance can be read from the memory (storage means) and output as the exposure condition signal simultaneously with the exposure start signal.

In addition to the illuminance meter, a power (voltage / current) meter that monitors the amount of power supplied to the high-pressure mercury lamp (light source for exposure irradiation) 26a can also be adopted as the detection means.
In addition, the exposure unit 90, the exposure unit 300, and the exposure unit 400 can achieve the same effects.

  In order to describe an exposure method in the exposure apparatus 1 configured as described above, first, an operation in a state where the exposure unit 20 is single will be described.

  FIG. 2 is a time chart showing an exposure processing state in the exposure apparatus 1 of the present embodiment. In FIG. 2, reference numeral 20 r is a ready signal ON / OFF in the exposure unit 20, 20 A is an alignment drive state ON / OFF in the exposure unit 20, and 20 E is an ON / OFF of post-alignment processing in the exposure unit 20, Cal indicates ON / OFF of the alignment calculation state in the control unit C.

  When performing exposure processing using the exposure apparatus 1 configured in this manner, first, the glass substrate W is transported to the work stage 22 by the transport system 27 and loaded to a position within a predetermined range. The workpiece W is formed with a thin film to be patterned and an alignment mark (work-side alignment mark) 22a.

The ready signal output means 25 that has detected that the glass substrate W is loaded turns on the ready signal 20r.
In this initial state, as shown at time t0 in FIG. 2, the alignment drive 20A that is the alignment operation in the drive unit 23 is OFF, and the exposure processing in the irradiation optical system 26 and the exposure processing by the transport system 27 are performed after the alignment is completed. The post-processing 20E that is a processing state including the unloading of the finished glass substrate W and the loading of the unprocessed glass substrate W to be processed next is also turned off.

When the control unit C starts alignment, after confirming that the ready signal is ON, the control unit C outputs an alignment start signal and outputs the alignment calculation state Cal as shown at time t1 in FIG. Is turned on.
When the alignment calculation state Cal is turned ON, the ready signal is turned OFF, and the image output from the alignment camera 24 is input to the control unit C. The control unit C processes this image and performs alignment marks on the mask M. The positional relationship between 21a and the alignment mark 22a of the glass substrate W is calculated, and from this calculation result, the amount of deviation from the positional relationship set for exposure such as matching these alignment marks 21a, 22a, that is, Vector data for alignment is calculated, and the result is output as drive signal data to the drive unit 23.

  The drive signal to the drive unit 23 is an alignment operation execution signal. By outputting the alignment operation execution signal, the alignment calculation state Cal is turned OFF and the drive unit 23 is aligned as shown at time t2 in FIG. The stage 21 is driven and the alignment driving state 20A is turned on.

When the drive of the drive unit 23 is completed, as shown at time t3 in FIG. 2, the alignment drive state 20A is turned off and the alignment calculation state Cal is turned on again.
When the alignment calculation state Cal is turned ON at time t3, the image output from the alignment camera 24 is input to the control unit C as in time t1, and the control unit C processes this image and performs t2 to t3. The positional relationship between the alignment mark 21a of the mask M and the alignment mark 22a of the glass substrate W after the change due to the alignment operation is calculated, and from these calculation results, the alignment marks 21a and 22a are set for exposure. If it is not within the position range, the amount of deviation, that is, vector data for alignment is calculated, and this result is output as drive data as a retry signal to the drive unit 23.

  The retry signal to the drive unit 23 is again used as an alignment operation execution signal. By outputting the alignment operation execution signal, the alignment calculation state Cal is turned off again as shown at time t4 in FIG. Drives the alignment stage 21, and the alignment driving state 20A is turned ON again.

When the retry drive of the drive unit 23 is finished, as shown at time t5 in FIG. 2, the alignment drive state 20A is turned off and the alignment calculation state Cal is turned on again.
When the alignment calculation state Cal is turned ON at time t5, the image output from the alignment camera 24 is input to the control unit C as in time t3, and the control unit C processes this image and performs t4 to t5. The positional relationship between the alignment mark 21a of the mask M and the alignment mark 22a of the glass substrate W after the change due to the retry operation is calculated, and from these calculation results, these alignment marks 21a and 22a are set for exposure. When the positional relationship is reached, an exposure start signal for starting the exposure process is output to the irradiation optical system 26 together with the exposure condition signal.

By outputting the exposure start signal to the irradiation optical system 26, as shown at time t6 in FIG. 2, the alignment calculation state Cal is turned off and the post-processing 20E is turned on.
When the post-processing 20E is turned ON, the irradiation optical system 26 controls the opening of the exposure control shutter so that the light irradiated from the high-pressure mercury lamp is held on the mask stage 21, and further the work stage 22 Irradiated as parallel light for pattern exposure perpendicularly to the surface of the workpiece W held on the surface. As a result, the mask pattern of the mask M is exposed and transferred onto the workpiece W. If necessary, multiple shots are taken and exposure transfer is repeated to complete the exposure, and then the transport system 27 is driven to unload the glass substrate W after the exposure processing and load the untreated glass substrate W. To do.

  The ready signal output means 25 that has confirmed that loading of the unprocessed glass substrate W has been completed turns on the ready signal 20r as shown at time t7 in FIG. At the same time, the post-processing 20E is turned off, and the exposure unit 20 enters a ready state in which it waits for an alignment start signal from the control unit C.

  As described above, when only the single exposure unit 20 is driven, the time t2 to the time t3 during the alignment operation, the time t4 to the time t5 during the retry operation, and the time t6 during the post-processing including the exposure processing. From time t7, the control unit C is not performing calculations.

  Next, the operation of the exposure apparatus 1 in a state where the plurality of exposure units 20, 30, 40, 50 are processed in parallel will be described.

FIG. 3 is a time chart showing the exposure processing state in the exposure apparatus 1 of the present embodiment. In FIG. 3, reference numerals 30, 40, and 50 and elements derived therefrom are described as being replaced with the ready signal 20r derived from reference numeral 20, the alignment driving state 20A, and the post-alignment processing 20E as described above.
Further, in the portion related to each ON / OFF in each exposure unit 30, 40, 50 at each time, the same part as the operation in the exposure unit 20 shown in FIG. The description is omitted.

For the sake of explanation, each of the exposure units 20, 30, 40, 50 has the ready signal turned on as shown at time t00 in FIG.
As shown at time t01 in FIG. 3, the control unit C selects the exposure unit 20 from the plurality of exposure units for which these ready signals are ON, outputs an alignment start signal, turns off the ready signal 20r, The alignment calculation state Cal is set to ON, and calculation processing for the exposure unit 20 is started.
As shown at time t02 in FIG. 3, when the calculation process for the exposure unit 20 is completed, the alignment calculation state Cal is turned off and the alignment drive state 20A is turned on.

After outputting the alignment operation execution signal to the exposure unit 20, the control unit C, after the drive unit 23 is executing the alignment operation, as shown at time t03 in FIG. 3, the exposure unit 30 whose ready signal is ON. Is selected, an alignment start signal is output, the ready signal 30r is turned OFF, the alignment calculation state Cal is turned ON, and calculation processing for the exposure unit 30 is started.
As shown at time t04 in FIG. 3, when the calculation process for the exposure unit 30 ends, the alignment calculation state Cal is turned off and the alignment drive state 30A is turned on.

After outputting the alignment operation execution signal to the exposure unit 30, the control unit C turns on the ready signal as shown at time t05 in FIG. 3 where the drive unit 23 and the drive unit 33 are executing the alignment operation. The exposure unit 40 is selected, an alignment start signal is output, the ready signal 40r is turned OFF, the alignment calculation state Cal is turned ON, and calculation processing for the exposure unit 40 is started.
As shown at time t06 in FIG. 3, when the calculation process for the exposure unit 40 is completed, the alignment calculation state Cal is turned off and the alignment drive state 40A is turned on.

After outputting the alignment operation execution signal to the exposure unit 40, the control unit C outputs the ready signal as shown at time t07 in FIG. 3 in which the drive unit 23, the drive unit 33, and the drive unit 43 are executing the alignment operation. The exposure unit 50 that is ON is selected, an alignment start signal is output, the ready signal 50r is turned OFF, the alignment calculation state Cal is turned ON, and calculation processing for the exposure unit 50 is started.
As shown at time t08 in FIG. 3, when the calculation process for the exposure unit 50 is completed, the alignment calculation state Cal is turned off and the alignment drive state 50A is turned on.

  When the driving of the driving unit 23 is completed, the driving unit 33, the driving unit 43, and the driving unit 53 are executing the alignment operation. As shown at time t09 in FIG. 3, the alignment driving state 20A is OFF and the alignment calculation state Cal is ON. become. The control unit C starts arithmetic processing for the exposure unit 20 after the alignment operation from t02 to t09.

  As shown at time t10 in FIG. 3, when the alignment marks 21a and 22a are not in the position range set for exposure, the control unit C outputs the calculation result as a retry signal to the drive unit 23. Then, the alignment calculation state Cal is turned off again, and the alignment driving state 20A is turned on again.

  When the driving of the driving unit 33 is finished, the driving unit 23, the driving unit 43, and the driving unit 53 are executing the alignment operation. As shown at time t11 in FIG. 3, the alignment driving state 30A is OFF and the alignment calculation state Cal is ON. become. The control unit C starts arithmetic processing for the exposure unit 30 after the alignment operation from t04 to t11.

  As shown at time t12 in FIG. 3, when the alignment marks 31a and 32a are in the position range set for exposure, the control unit C turns off the alignment calculation state Cal and turns on the post-processing 30E. The exposure start signal is output to the irradiation optical system irradiation optical system 36 and the transport system 37 together with the exposure condition signal, and the exposure process for the exposure unit 30, the unloading of the processed glass substrate W, and the loading of the unprocessed glass substrate W are performed. A series of processing is continued.

  When the driving of the driving unit 43 is completed, the driving unit 23 and the driving unit 53 are performing the alignment operation, and the irradiation optical system 36 or the transport system 37 is performing the post-processing, as shown at time t13 in FIG. 40A is OFF and the alignment calculation state Cal is ON. The control unit C starts arithmetic processing for the exposure unit 40 after the alignment operation from t06 to t13.

  As shown at time t14 in FIG. 3, when the alignment marks 41a and 42a are not in the position range set for exposure, the control unit C outputs the calculation result as a retry signal to the drive unit 43. Then, the alignment calculation state Cal is turned off again, and the alignment drive state 40A is turned on again.

  When the driving of the driving unit 53 is finished, the driving unit 23 and the driving unit 43 are performing the alignment operation and the irradiation optical system 36 or the transport system 37 is performing the post-processing, as shown at time t15 in FIG. 50A is OFF and the alignment calculation state Cal is ON. The control unit C starts arithmetic processing for the exposure unit 50 after the alignment operation from t08 to t15.

  As shown at time t <b> 16 in FIG. 3, when the alignment marks 51 a and 52 a are not in the position range set for exposure, the control unit C outputs the calculation result as a retry signal to the drive unit 53. Then, the alignment calculation state Cal is turned off again, and the alignment drive state 50A is turned on again.

  When the post-processing of the irradiation optical system 36 or the transport system 37 is completed, the post-processing 30E is turned off and ready as shown at time t17 in FIG. 3 in which the driving unit 23, the driving unit 43, and the driving unit 53 are executing the alignment operation. When the signal 30r is turned ON, the exposure unit 30 enters a standby state.

  When the drive of drive unit 23 is completed, as shown at time t18 in FIG. 3 where drive unit 43 and drive unit 53 are executing the alignment operation, alignment drive state 20A is turned OFF and alignment calculation state Cal is turned ON. The control unit C starts arithmetic processing on the exposure unit 20 after the retry operation from t10 to t18.

  As shown at time t19 in FIG. 3, when the alignment marks 21a and 22a are in the position range set for exposure, the controller C turns off the alignment calculation state Cal and turns on the post-processing 20E. The exposure start signal is output to the irradiation optical system irradiation optical system 26 and the transport system 27 together with the exposure condition signal, and the exposure process to the exposure unit 20, the unloading of the processed glass substrate W, and the loading of the unprocessed glass substrate W are performed. A series of processing is continued.

As shown at time t20 in FIG. 3, the control unit C selects the exposure unit 30 whose ready signal is ON, outputs an alignment start signal, turns off the ready signal 30r, and turns on the alignment calculation state Cal. The arithmetic processing for the exposure unit 30 is started.
As shown at time t21 in FIG. 3, when the calculation process for the exposure unit 30 ends, the alignment calculation state Cal is turned off and the alignment drive state 30A is turned on.

  When the driving of the driving unit 43 is finished, the driving unit 33 and the driving unit 53 are executing the alignment operation and the irradiation optical system 26 or the transport system 27 is performing the post-processing, as shown at time t22 in FIG. 40A is OFF and the alignment calculation state Cal is ON. The control unit C starts arithmetic processing for the exposure unit 40 after the retry operation from t14 to t22.

  As shown at time t23 in FIG. 3, when the alignment marks 41a and 42a are in the position range set for exposure, the controller C turns off the alignment calculation state Cal and turns on the post-processing 40E. The exposure start signal is output to the irradiation optical system irradiation optical system 46 and the transport system 47 together with the exposure condition signal, and the exposure process for the exposure unit 40, the unloading of the processed glass substrate W, and the loading of the unprocessed glass substrate W are performed. A series of processing is continued.

  When the driving of the driving unit 53 is completed, the driving unit 33 is executing the alignment operation and the irradiation optical system 26 or the conveyance system 27, and the irradiation optical system 46 or the conveyance system 47 is performing the post-processing as shown at time t24 in FIG. In addition, the alignment drive state 50A is turned OFF and the alignment calculation state Cal is turned ON. The control unit C starts arithmetic processing for the exposure unit 50 after the retry operation from t16 to t24.

  When the post-process of the irradiation optical system 26 or the transport system 27 is completed, as shown at time t25 in FIG. 3 in which the drive unit 33 is performing the alignment operation and the irradiation optical system 46 or the transport system 47 is performing the post-process. The processing unit 20E is turned off and the ready signal 20r is turned on, and the exposure unit 20 enters a standby state.

  As shown at time t26 in FIG. 3, when the alignment marks 51a and 52a are in the position range set for exposure, the control unit C turns off the alignment calculation state Cal and turns on the post-processing 50E. The exposure start signal is output to the irradiation optical system irradiation optical system 56 and the transport system 57 together with the exposure condition signal, and the exposure process for the exposure unit 50, the unloading of the processed glass substrate W, and the loading of the unprocessed glass substrate W are performed. A series of processing is continued.

As shown at time t27 in FIG. 3, the control unit C selects the exposure unit 20 whose ready signal is ON, outputs an alignment start signal, turns off the ready signal 20r, and turns on the alignment calculation state Cal. Then, the arithmetic processing for the exposure unit 20 is started.
As shown at time t28 in FIG. 3, when the calculation process for the exposure unit 20 is completed, the alignment calculation state Cal is turned off and the alignment drive state 20A is turned on.

  When the post-processing of the irradiation optical system 46 or the transport system 47 is completed, the drive unit 23 and the drive unit 33 are executing the alignment operation, and the irradiation optical system 56 or the transport system 57 is executing the post-processing, as shown at time t29 in FIG. As described above, the post-processing 40E is turned OFF and the ready signal 40r is turned ON, and the exposure unit 40 enters a standby state.

  When the drive of the drive unit 33 is completed, the alignment drive state 30A is OFF, as shown at time t30 in FIG. 3 in which the drive unit 23 is executing the alignment operation and the irradiation optical system 56 or the transport system 57 is performing post-processing. The alignment calculation state Cal is turned ON. The control unit C starts arithmetic processing on the exposure unit 30 after the alignment operation from t21 to t30.

  When the post-processing of the irradiation optical system 56 or the transport system 57 is completed, as shown at time t31 in FIG. 3 in which the drive unit 23 is executing the alignment operation, the post-processing 50E is turned off and the ready signal 50r is turned on, thereby exposing the exposure unit. 50 enters a standby state.

  As shown at time t32 in FIG. 3, when the alignment marks 31a and 32a are in the position range set for exposure, the control unit C turns off the alignment calculation state Cal and turns on the post-processing 30E. The exposure start signal is output to the irradiation optical system irradiation optical system 36 and the transport system 37 together with the exposure condition signal, and the exposure process for the exposure unit 30, the unloading of the processed glass substrate W, and the loading of the unprocessed glass substrate W are performed. A series of processing is continued.

As shown at time t33 in FIG. 3 in which the drive unit 23 is executing the alignment operation and the irradiation optical system 36 or the transport system 37 is performing post-processing, the control unit C is the exposure unit 40 whose ready signal is ON. Is selected, an alignment start signal is output, the ready signal 40r is turned OFF, the alignment calculation state Cal is turned ON, and calculation processing for the exposure unit 40 is started.
As shown at time t34 in FIG. 3, when the calculation process for the exposure unit 40 is completed, the alignment calculation state Cal is turned off and the alignment drive state 40A is turned on.

As shown at time t35 in FIG. 3 in which the drive unit 23 and the drive unit 43 are executing the alignment operation and the irradiation optical system 36 or the transport system 37 is performing post-processing, the control unit C turns on the ready signal. The exposure unit 50 is selected, an alignment start signal is output, the ready signal 50r is turned OFF, the alignment calculation state Cal is turned ON, and calculation processing for the exposure unit 50 is started.
As shown at time t36 in FIG. 3, when the calculation process for the exposure unit 50 is completed, the alignment calculation state Cal is turned off and the alignment drive state 50A is turned on.

  When the driving of the driving unit 23 is finished, the driving unit 43 and the driving unit 53 are executing the alignment operation and the irradiation optical system 36 or the transport system 37 is performing the post-processing, as shown at time t37 in FIG. 20A is OFF and the alignment calculation state Cal is ON. The control unit C starts arithmetic processing for the exposure unit 20 after the alignment operation from t28 to t37.

  When the post-processing of the irradiation optical system 36 or the transport system 37 is completed, the post-processing 30E is turned off and the ready signal 30r is turned on as shown at time t38 in FIG. As a result, the exposure unit 30 enters a standby state.

  As shown at time t39 in FIG. 3, when the alignment marks 21a and 22a are not in the position range set for exposure, the control unit C outputs the calculation result as a retry signal to the drive unit 23. Then, the alignment calculation state Cal is turned off again, and the alignment driving state 20A is turned on again.

As shown at time t40 in FIG. 3, the control unit C selects the exposure unit 30 whose ready signal is ON, outputs an alignment start signal, turns off the ready signal 30r, and turns on the alignment calculation state Cal. The arithmetic processing for the exposure unit 30 is started.
As shown at time t41 in FIG. 3, when the calculation process for the exposure unit 30 is completed, the alignment calculation state Cal is turned off and the alignment drive state 30A is turned on.

  When the driving of the driving unit 43 is completed, the driving unit 23, the driving unit 33, and the driving unit 53 are executing the alignment operation. As shown at time t42 in FIG. 3, the alignment driving state 40A is OFF and the alignment calculation state Cal is ON. become. The control unit C starts arithmetic processing for the exposure unit 40 after the alignment operation from t34 to t42.

  As shown at time t43 in FIG. 3, when the alignment marks 41a and 42a are not in the position range set for exposure, the control unit C outputs the calculation result as a retry signal to the drive unit 43. Then, the alignment calculation state Cal is turned off again, and the alignment drive state 40A is turned on again.

  When driving of the drive unit 53 is completed, the drive unit 23, the drive unit 33, and the drive unit 43 are executing the alignment operation. As shown at time t44 in FIG. 3, the alignment drive state 50A is OFF and the alignment calculation state Cal is ON. become. The control unit C starts arithmetic processing for the exposure unit 50 after the alignment operation from t08 to t15.

  As shown at time t <b> 45 in FIG. 3, when the alignment marks 51 a and 52 a are not in the position range set for exposure, the control unit C outputs the calculation result as a retry signal to the drive unit 53. Then, the alignment calculation state Cal is turned off again, and the alignment drive state 50A is turned on again.

  When the drive of the drive unit 23 is completed, the alignment drive state 20A is OFF and the alignment calculation state Cal is ON as shown at time t46 in FIG. 3 in which the drive unit 33, the drive unit 43, and the drive unit 53 are executing the alignment operation. become. The control unit C starts arithmetic processing for the exposure unit 20 after the retry operation from t39 to t46.

  As shown at time t47 in FIG. 3, when the alignment marks 21a and 22a are in the position range set for exposure, the control unit C turns off the alignment calculation state Cal and turns on the post-processing 20E. The exposure start signal is output to the irradiation optical system irradiation optical system 26 and the transport system 27 together with the exposure condition signal, and the exposure process to the exposure unit 20, the unloading of the processed glass substrate W, and the loading of the unprocessed glass substrate W are performed. A series of processing is continued.

  When driving of the drive unit 33 is completed, the drive unit 23, the drive unit 43, and the drive unit 53 are executing the alignment operation. As shown at time t48 in FIG. 3, the alignment drive state 30A is OFF, and the alignment calculation state Cal is ON. become. The control unit C starts arithmetic processing for the exposure unit 30 after the alignment operation from t41 to t48.

  As shown at time t49 in FIG. 3, when the alignment marks 31a and 32a are in the position range set for exposure, the control unit C turns off the alignment calculation state Cal and turns on the post-processing 30E. The exposure start signal is output to the irradiation optical system irradiation optical system 36 and the transport system 37 together with the exposure condition signal, and the exposure process for the exposure unit 30, the unloading of the processed glass substrate W, and the loading of the unprocessed glass substrate W are performed. A series of processing is continued.

  When the driving of the driving unit 43 is completed, the driving unit 53 is executing the alignment operation and the irradiation optical system 26 or the conveyance system 27, and the irradiation optical system 36 or the conveyance system 37 is executing the post-processing as shown at time t50 in FIG. In addition, the alignment drive state 40A is turned OFF and the alignment calculation state Cal is turned ON. The control unit C starts arithmetic processing for the exposure unit 40 after the retry operation from t43 to t50.

  When the post-processing of the irradiation optical system 26 or the transport system 27 is completed, as shown at time t51 in FIG. 3 in which the drive unit 33 is performing the alignment operation and the irradiation optical system 46 or the transport system 47 is performing the post-processing. The processing unit 20E is turned off and the ready signal 20r is turned on, and the exposure unit 20 enters a standby state.

  As shown at time t52 in FIG. 3, when the alignment marks 41a and 42a are in the position range set for exposure, the control unit C turns off the alignment calculation state Cal and turns on the post-processing 40E. The exposure start signal is output to the irradiation optical system irradiation optical system 46 and the transport system 47 together with the exposure condition signal, and the exposure process for the exposure unit 40, the unloading of the processed glass substrate W, and the loading of the unprocessed glass substrate W are performed. A series of processing is continued.

  When the driving of the driving unit 53 is completed, the driving unit 33 is executing the alignment operation and the irradiation optical system 26 or the conveyance system 27, and the irradiation optical system 46 or the conveyance system 47 is performing the post-processing as shown at time t53 in FIG. In addition, the alignment drive state 50A is turned OFF and the alignment calculation state Cal is turned ON. The control unit C starts arithmetic processing for the exposure unit 50 after the retry operation from t45 to t53.

  When the post-processing of the irradiation optical system 36 or the transport system 37 is completed, as shown at time t54 in FIG. 3 where the irradiation optical system 46 or the transport system 47 is executing the post-processing, the post-processing 30E is turned off and the ready signal 30r is turned on. When ON, the exposure unit 30 enters a standby state.

  As shown at time t55 in FIG. 3, when the alignment marks 51a and 52a are in the position range set for exposure, the controller C turns off the alignment calculation state Cal and turns on the post-processing 50E. The exposure start signal is output to the irradiation optical system irradiation optical system 56 and the transport system 57 together with the exposure condition signal, and the exposure process for the exposure unit 50, the unloading of the processed glass substrate W, and the loading of the unprocessed glass substrate W are performed. A series of processing is continued.

As shown at time t56 in FIG. 3, the control unit C selects the exposure unit 20 whose ready signal is ON, outputs an alignment start signal, turns off the ready signal 20r, and turns on the alignment calculation state Cal. Then, the arithmetic processing for the exposure unit 20 is started.
As shown at time t57 in FIG. 3, when the calculation process for the exposure unit 20 is completed, the alignment calculation state Cal is turned off and the alignment drive state 20A is turned on.

  As shown at time t58 in FIG. 3, the control unit C selects the exposure unit 30 whose ready signal is ON, outputs an alignment start signal, turns off the ready signal 30r, and turns on the alignment calculation state Cal. The arithmetic processing for the exposure unit 30 is started.

  When the post-processing of the irradiation optical system 46 or the transport system 47 is finished, the post-processing 40E is turned off and the ready signal 40r is turned on as shown at time t59 in FIG. As a result, the exposure unit 40 enters a standby state.

Thereafter, the control unit C controls each of the exposure units 20, 30, 40, and 50, and selects an exposure unit for which the ready signal is ON from among the exposure units, and sequentially starts processing. Thereby, in this embodiment, in the exposure apparatus 1 which has these some exposure parts, the exposure process of a glass substrate can be performed in parallel and sequentially.
In particular, as shown in FIG. 2, when processing is performed with only the single exposure unit 20, there is a time that the control unit C does not do at times t <b> 2 to t <b> 3 and time t <b> 4 to t <b> 5. In addition, in an exposure apparatus provided with a plurality of sets of such control units and exposure units, the control unit has a time during which most of the apparatus drive time is not operating. On the other hand, in the present embodiment, as shown in FIG. 3, since the time during which the control unit C is not operating can be shortened, each exposure is performed with the control unit C being shared and the apparatus cost being reduced. It is possible to reduce the loss time when the units 20, 30, 40, and 50 are not driven, and consequently shorten the tact time and improve the production efficiency.

In the present invention, when the control unit C controls the plurality of exposure units 20,..., When the exposure conditions are diverted to the other exposure units 30,. It is possible to shorten the alignment time. For example, in the second and subsequent exposure units 30,..., The alignment time can be reduced to about half or less.
Here, if an attempt is made to perform alignment in the processing based on the refined design rule, it cannot be performed at once, so processing is performed in multiple stages, which is called retry. Alignment goes crazy in the surroundings. For example, there are many things due to environmental factors such as temperature and humidity. When retrying, it takes more than twice the processing time. If the desired state is not obtained in the first alignment, the second and subsequent alignments require the same processing time as the first alignment. Accordingly, the processing time is required as the number of times increases.
Also, the exposure process itself may vary due to variations in lamp illuminance.

On the other hand, in the present invention, in the control unit C, the state of the mechanical element is taken into consideration from the alignment result in the first exposure unit 20, and this state is stored in the memory of the control unit C. For the second and subsequent exposure units 30,..., The state of mechanical elements in the alignment is predicted based on this stored data. As a result, the drive unit 33,... Is driven so as to cancel the shift in the same manner as the retry from the initial alignment. This deviation is a habit that occurs in the transport system, and means, for example, a habit of shifting or tilting in one direction when the glass substrate W is placed with a jig.
Further, the variation in the illuminance of the lamp is read to similarly predict the state of the exposure process. As a result, the exposure time is controlled to tend to cancel the illuminance change.

That is, by reading the habit with the first exposure unit 20, the direction of fine adjustment of the relative deviation can be known, so that the habit is canceled with respect to the second and subsequent exposure units 30,. Corresponding to this. Alternatively, the exposure unit 20 corresponds to cancel the habit of the glass substrate W after the next time. This is very effective when the control unit C processes the signals in a lump so that each exposure unit has a common transport system, robot or jig system, or a common handling mechanism. . By such feedforward with respect to the habit, it is possible to reduce the influence of habit caused by the processing atmosphere such as temperature and humidity, reduce the processing time, and improve the productivity.
At the same time, machine differences caused by exposure conditions can be reduced as well.

In the present invention, a mask holding part that holds a mask having a pattern to be exposed, a work holding part that holds a work as an exposed material, and the mask holding part and the work holding part are driven relatively. A driving unit; a mask-side alignment mark formed on the mask; an alignment camera capable of detecting the workpiece-side alignment mark formed on the workpiece; and a ready signal output means for outputting that alignment can be started. A plurality of exposure units for exposing and transferring the mask pattern on the workpiece are provided, and the driving unit is driven based on the shift amounts of the alignment marks detected by the alignment camera in each of the plurality of exposure units. Exposure with a common control unit for controlling and executing alignment operations In the exposure method, the control unit selects one exposure unit among the exposure units outputting the ready signal and outputs an alignment start signal, and in the selected exposure unit In addition, an exposure method including a step of performing an alignment operation by the driving unit so that a deviation amount between the alignment marks is within a desired alignment accuracy range at the time of exposure transfer can be employed.
The workpiece may be a glass substrate that has been pre-strengthened.
Further, after the step of outputting the alignment start signal to the drive unit in the selected exposure unit, the control unit outputs the ready signal before the ready signal is output again. The exposure method may include a step of selecting an exposure unit and outputting the alignment start signal.
The workpiece holding unit can hold a plurality of workpieces.
In the present invention, a mask holding part that holds a mask having a pattern to be exposed, a work holding part that holds a work as an exposed material, and the mask holding part and the work holding part are driven relatively. A driving unit; a mask-side alignment mark formed on the mask; an alignment camera capable of detecting the workpiece-side alignment mark formed on the workpiece; and a ready signal output means for outputting that alignment can be started. A plurality of exposure units for exposing and transferring the mask pattern on the workpiece are provided, and the driving unit is driven based on the shift amounts of the alignment marks detected by the alignment camera in each of the plurality of exposure units. Exposure with a common control unit for controlling and executing alignment operations The control unit selects one exposure unit from among the exposure units outputting the ready signal and outputs an alignment start signal. An exposure apparatus that performs an alignment operation by the drive unit so that the amount of alignment mark displacement is within a desired alignment accuracy range during exposure transfer can be employed.
The workpiece may be a glass substrate that has been pre-strengthened.
The control unit selects another exposure unit that outputs the ready signal after the alignment start signal is output to the drive unit and before the ready signal is output again in the selected exposure unit. Thus, the alignment start signal can be output.
The workpiece holding unit can hold a plurality of workpieces.

A second embodiment of the exposure apparatus according to the present invention will be described below with reference to the drawings.
The exposure apparatus 1 in the present embodiment is different from the first embodiment in the portion related to the exposure unit, and the corresponding components other than those are denoted by the same reference numerals and description thereof is omitted. FIG. 4 is a perspective view (a), a top view (b), and a sectional view (c) showing an exposure unit in the exposure apparatus of the present embodiment.

The exposure unit 100 in the present embodiment corresponds to the exposure units 20, 30, 40, and 50 in the first embodiment.
The exposure unit 100 performs an exposure process on the substrate W cut into individual shapes of the finally obtained product. The exposure unit 110, the substrate holding unit 120 on which the substrate W is placed, And a leg unit 130 that supports the exposure unit 110 above the substrate holding unit 120 and moves the exposure unit 110 at least in the vertical direction.

  The substrate W is a glass substrate that is cut into individual shapes of a finally obtained product and subjected to a strengthening process in advance. In the present embodiment, the substrate W is made of, for example, chemically strengthened glass. Such chemically strengthened glass is glass that has been subjected to chemical strengthening treatment by being immersed in a potassium salt molten bath having a temperature of about 400 ° C., and sodium ions of the glass substrate W are ion-exchanged with potassium ions. Here, the ionic radius of sodium is 95 nm, whereas the ionic radius of potassium ions is 133 nm. The ionic radius of potassium ions is larger than that of sodium ions. For this reason, the glass substrate is in a state where the strength is enhanced by the compressive stress resulting from the chemical strengthening layer on the surface.

  In the present embodiment, the substrate is reinforced after cutting a large glass substrate. For this reason, since it is not necessary to cut | disconnect a large tempered glass substrate, the glass substrate of a product size can be produced efficiently. Note that a thin film to be patterned may be formed on the surface of the substrate W, and a photoresist film may be formed in advance on the thin film surface.

The exposure unit 110 can adjust the position of the light source 111, the frame member 112 disposed below the light source 111, the mask 113 (photomask) attached to the frame member 112, and the frame member 112 (in the vertical direction). A moving mechanism (actuator 114) is provided.
As the light source 111, for example, an ultrahigh pressure mercury lamp having a wavelength of 365 nm as a reference wavelength is preferable. When this lamp is used, it is not realistic to frequently perform the lighting / extinguishing control, so that it is used in a continuous lighting state. Therefore, a secondary device is required to perform the light emission / shielding operation from the light source. As this secondary device, a motor-driven mechanical shutter is usually mounted. A mirror device to be described later is an example of an alternative element of the shutter.

  The frame member 112 positions and holds the mask 113. The mask 113 is configured, for example, by forming a light shielding film having a predetermined pattern on a transparent substrate such as glass. The actuator 114 can move the frame member 112 holding the mask 113 at least in the Y-axis direction (vertical direction). Thereby, the shape or position of the illumination area formed on the substrate W placed on the substrate holding unit 120 can be adjusted.

  The exposure unit 100 in the present embodiment has been studied mainly for a so-called “proximity exposure” apparatus. Here, “proximity exposure” is a non-contact exposure method in which exposure is performed with a gap between a mask (reticle) and a work (sample, substrate) set to several μm to several hundred μm corresponding to the required resolution. Means. “Proximity exposure” can avoid the risk that the resist material spreads on the mask surface, for example, compared to “contact exposure” in which the mask is brought into contact with the workpiece, but light that passes through the mask opening (mask opening). Due to the radiation component of the passing light (completely parallel light cannot be produced), the resist material outside the mask pattern is slightly exposed and the resolution deteriorates. Since this resolution degradation proceeds in proportion to the gap amount, for example, in the case of a touch panel, the gap amount is preferably about 150 μm.

The actuator 114 can precisely control the gap between the mask 113 and the substrate W.
In the exposure unit 110, a condenser lens (not shown) may be disposed between the light source 111 and the mask 113. The condenser lens is made up of, for example, a pair of aspheric lenses, and irradiates light from the light source 111 into substantially parallel light. Further, a reduction projection lens (not shown) may be disposed between the mask 113 and the substrate holding unit 120. The reduction projection lens reduces and projects the pattern on the mask 113 onto the substrate W placed on the substrate holding unit 120.

On the surface of the substrate holding unit 120, a substrate W to be processed is placed. The substrate holding unit 120 may have means for fixing the substrate 2 by, for example, vacuum chucking, electrostatic chucking, mechanical clamping, or the like. In the present embodiment, the substrate holding unit 120 is a part of a conveyor 121 that continuously transports a plurality of substrates W.
The conveyor 121 includes, for example, a driving rotation roller, a rotation roller, and a conveyor belt. The motor is rotated in a predetermined direction, and the conveyor belt is rotated in a predetermined direction. As a result, a plurality of substrates W placed on the conveyor belt are continuously transported and a light irradiation position (of the exposure unit 110) is In the lower position), the substrate W to be exposed is held in a stopped state.

  The leg unit 130 supports the exposure unit 110 above the substrate holding unit 120 and moves the exposure unit 110 at least in the vertical direction. The leg unit 130 includes an elevating leg 131 that is connected to an elevating motor (not shown) and extends in the vertical direction, and an exposure unit 110 is attached to an upper end portion of the elevating leg 131. The number of lifting legs 131 is not particularly limited, but is preferably a plurality, for example, three.

  In order to pattern the thin film formed on the surface of the substrate W made of glass using the exposure unit 100 having such a configuration, first, the plurality of substrates 2 are placed on the conveyor 121 (substrate holding unit 120). Note that a thin film to be patterned is formed on the surface of the substrate W, and a photoresist film is formed in advance on the thin film surface.

  At this time, the elevating unit is raised, and the exposure unit 110 is supported and raised by the elevating legs 131. The conveyor 121 conveys the substrate W to be processed to a predetermined position (a position below the exposure unit 110) where the processing is performed, and holds the substrate W in a stopped state at the light irradiation position. Until this state, the ready signal is ON.

  Next, the exposure unit 110 is lowered by lowering the elevating leg 131 of the elevating unit, which is the driving unit, in response to the output of the alignment start signal. Alignment is performed with the alignment calculation state Cal set to OFF and the alignment drive state 100A set to ON. At this time, the position of the exposure unit 110 in the vertical direction may be adjusted by the leg unit 130. Further, the position of at least the Y-axis direction (vertical direction) of the frame member 112 holding the mask 113 may be adjusted by the actuator 114.

  Thereafter, the alignment calculation state Cal is turned off, the post-processing 100E is turned on, an exposure start signal is output, and the substrate W is exposed. In this state, when light is emitted from the light source 111, the light is applied to the condenser lens, and is condensed by the condenser lens to form a parallel light beam, which is applied to the mask 113.

  The parallel light beam applied to the mask 113 passes through the mask 113, is reduced by the reduction projection lens 115, and is applied to the substrate surface placed on the substrate holding unit 120. As a result, a partial area of the photoresist film is exposed to form a latent image so that a reduced image is formed in the same pattern as the mask 113 on a partial area of the photoresist film on the surface of the substrate W. Is done. After completion of the exposure processing, the exposure unit 110 is raised by raising the elevating legs 131 of the elevating unit, and the processed substrate W is transported by operating the conveyor 121 again. Are conveyed to a predetermined position (a position below the exposure unit 110), and the ready signal 100r is turned ON.

  As described above, according to the exposure unit 100 of the present invention, it is possible to quickly perform an exposure process on a plurality of substrates W cut into individual shapes. Thereby, tact time can be shortened and productivity can be improved.

In the exposure apparatus of the present embodiment, a plurality of the conveyors 121 arranged in parallel,
A plurality of the exposure units 110 and the leg units 130 arranged corresponding to each of the plurality of conveyors 121 may be provided. Thereby, it is possible to perform an exposure process on a larger number of substrates W, thereby further improving productivity.

Hereinafter, a third embodiment of an exposure apparatus and an exposure method according to the present invention will be described with reference to the drawings.
The exposure apparatus 1 in the present embodiment is different from the first embodiment in the portion related to the exposure unit, and the corresponding components other than those are denoted by the same reference numerals and description thereof is omitted. FIG. 5 is a schematic plan view showing an exposure unit in the exposure apparatus of the present embodiment.

The exposure unit 200 in the present embodiment corresponds to the exposure units 20, 30, 40, and 50 in the first embodiment, and has an alignment stage under the irradiation optical system 226.
In the exposure unit 200, as shown in FIG. 5, the transport unit 227 includes a loading robot hand 227a and an unloading robot hand 227b. The exposure unit 200 loads the unprocessed substrate of the stocker 227c to a predetermined position below the irradiation optical system 226 by the loading robot hand 227a, and the ready signal is turned ON. Further, the exposure unit 200 turns on the post-processing 200E to end the exposure processing, and then unloads the processed substrate under the irradiation optical system 226 to the stocker 227d by the unloading robot hand 227b.
In the present embodiment, the exposure unit 200 can sequentially expose the substrate W as in the first embodiment.

Further, in the present embodiment, the exposure unit 200 can perform exposure processing on a plurality of substrates W in the same process.
In this case, as shown in FIG. 6, the plurality of substrates W placed on the tray T are transported by the sending unit 227, or the plurality of substrates are placed on the tray T shown in FIG. 6. W can be aligned and placed at a predetermined position on the alignment stage under the irradiation optical system 226, and exposure processing can be performed in a lump.
Thereby, in the present embodiment, the processing time can be shortened, the exposure processing can be performed on more substrates W, and the productivity can be further improved.

DESCRIPTION OF SYMBOLS 1 ... Exposure apparatus C ... Control part 20, 30, 40, 50 ... Exposure part M ... Mask 21 ... Mask stage (mask holding | maintenance part)
W ... Glass substrate (workpiece)
22 ... Work stage (work holding part)
23. Work stage moving mechanism (drive unit)
24 ... Alignment camera 25 ... Ready signal output means 26 ... Irradiation optical system 27 ... Conveyance system

Claims (4)

A mask holding unit for holding a mask having a pattern to be exposed;
A work holding unit for holding a work as an exposed material;
A drive unit that relatively drives the mask holding unit and the work holding unit;
An alignment camera capable of detecting a mask side alignment mark formed on the mask and a work side alignment mark formed on the workpiece;
Ready signal output means for outputting that alignment can be started;
A plurality of exposure portions for exposing and transferring the pattern of the mask on the workpiece.
In each of the plurality of exposure units, a control unit for driving the drive unit to execute an alignment operation based on the shift amount of the alignment marks detected by the alignment camera is provided in common. ,
The control unit selects one exposure unit among the exposure units outputting the ready signal and outputs an alignment start signal, so that the deviation amount of the alignment marks is selected in the selected exposure unit. In an exposure apparatus that performs an alignment operation by the drive unit so that is within a desired alignment accuracy range during exposure transfer,
The exposure unit includes a light source for exposure irradiation, a shutter for controlling an exposure time, and detection means for detecting a change in illuminance of the light source for exposure irradiation,
The exposure apparatus, wherein the control unit outputs an exposure time corresponding to a change in illuminance of the exposure light source as an exposure condition signal.   2. An exposure apparatus according to claim 1, wherein the workpiece is a glass substrate that has been subjected to a strengthening process in advance.   The control unit selects another exposure unit that outputs the ready signal after the alignment start signal is output to the drive unit and before the ready signal is output again in the selected exposure unit. 3. The exposure apparatus according to claim 2, wherein the alignment start signal is output.   The exposure apparatus according to claim 3, wherein the work holding unit is capable of holding a plurality of works.

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