JP5953601B2 - Resin molding apparatus and resin molding method - Google Patents

Description

  The present invention relates to a resin molding apparatus and a resin molding method for resin molding a molded product including a lens part by clamping a workpiece having electronic components mounted on a substrate with a mold.

  In recent years, there has been a growing demand for using LEDs with low power consumption and long life as light sources as light sources to replace incandescent bulbs and fluorescent lamps. When resin-molding a workpiece with a light-emitting element mounted on a substrate, for example, a molded product with a high convex aspect ratio of the lens part (the depth of the cavity concave part corresponding to the lens part is deep) is a highly transparent resin. Since it is necessary to resin mold using (silicone resin, epoxy resin, urethane resin, acrylic resin, etc.), if the amount of movement of the mold resin is large, air can easily be caught, and voids are generated by the air that has lost its escape. May occur. In order to solve this problem, the following resin molding apparatus has been proposed.

  That is, a molding recess for sealing electronic components is formed in the upper cavity plate of the mold, and a cavity block is provided in an opening provided at the bottom of the molding recess. A movable pin is provided in a through hole provided in the cavity block so as to be movable up and down. An outer diameter side lens concave portion deeper than the bottom of the molding concave portion is formed on the lower surface side of the cavity block, and an inner diameter side lens concave portion is formed on the lower end surface of the movable pin. The movable pin is raised so that the lens recess is formed at a position where the inner diameter lens recess becomes a continuous surface with the outer diameter lens recess.

  The work placed on the lower mold is clamped with the release film adsorbed and held on the upper clamp surface. At this time, the lower end surface of the movable pin is lowered to the same surface as the lower surface of the cavity block, and the mold resin is filled in the molding recess while supporting the release film so as not to enter the lens recess. When the filled mold resin exceeds the lens recess, the movable pin is raised and the inner lens recess is raised to a position where it is continuous with the outer lens recess to form a lens recess. The mold resin is filled by expanding the release film into the concave portion of the lens, and is thermally cured to mold the lens portion (see Patent Document 1).

Japanese Patent Laid-Open No. 2007-230212

  However, in the upper cavity block described above, the lens concave portion is molded by combining the outer diameter side lens concave portion formed in the molding concave portion and the inner diameter side lens concave portion provided in the movable pin into a continuous surface. Therefore, unevenness due to the gap between the cavity block and the movable pin is likely to occur in the molded product.

  Further, when the molding resin is filled in the molding recess, the mold resin is filled in a state where the movable block is inserted into the outer diameter side lens recess and supported so that the release film does not enter the lens recess. At this time, even if the mold resin is filled with the release film supported while the inner diameter side lens concave portion and the outer diameter side lens concave portion of the cavity block are discontinuous, it is easy to entrain air on the discontinuous surface and the movable block When it rises, wrinkles due to the looseness of the release film are likely to occur, so that the molding quality of the lens part is likely to be lowered. Further, when the number of lens portions increases, the positional accuracy of the plurality of movable pins may become unstable.

  An object of the present invention is to provide a resin molding apparatus and a resin molding method that solve the above-mentioned problems of the prior art and improve mold resin filling properties and molding quality when a molded product including a convex portion is resin-molded. is there.

In order to achieve the above object, the present invention comprises the following arrangement.
A resin molding apparatus that clamps a workpiece with electronic components on a base material with a mold and resin molds a molded product including a convex portion, and a lower die on which the workpiece is placed, and an upper die clamp A first cavity recess is formed on the surface, a second cavity recess that molds the protrusion at the bottom of the first cavity recess, a first vent opening at the cavity bottom of the first cavity recess, and the first cavity A cavity piece having a second vent hole formed in a communicating groove continuous with the second cavity recess at the bottom of the recess, and an upper clamping surface including the bottom of the first cavity recess is covered with a release film; An upper die, and the lower die on which the workpiece is placed and the upper die are closed, and the height is defined at the cavity bottom of the first cavity recess. Leasing film molding resin is filled into the first vent hole remains the first cavity recess held by suction at a predetermined tension by suction, after the molding resin is filled in the first cavity recess, the release A final resin pressure greater than the tension of the film is applied and the release film is stretched into the second cavity recess while allowing air trapped in the second cavity recess to escape to the second vent through the communication groove. The second cavity recess is filled with mold resin.
The base material includes a resin substrate, a metal (for example, aluminum, copper, etc.) substrate, a ceramic substrate, a lead frame, a carrier, and the like on which electronic components are mounted.

If the resin mold apparatus is used, the mold resin can be filled into a plurality of second cavity recesses having a depth deeper than the cavity bottom of the first cavity recess by utilizing the mold followability due to the elongation of the release film. Even if it is a molded product containing a high convex part (for example, lens part), resin filling property can be improved.
In addition, unevenness of the workpiece thickness and unevenness on the workpiece surface can be absorbed by the thickness of the release film, and the second cavity concave portion corresponding to the convex portion (for example, a lens portion) is a continuous surface. The molding quality can be improved.
Further, by releasing air that is easily trapped in the second cavity recess to the second vent hole through the communication groove, it is possible to prevent unfilling of the mold resin and generation of voids in the second cavity recess.

A final resin pressure may be applied while air is sucked from the second vent hole to extend the release film into the second cavity recess, and the second cavity recess may be filled with mold resin.
Thereby, discharge of the air remaining in the second cavity recess can be promoted.

  The cavity piece is formed with a communication groove that communicates the first cavity recess and the second cavity recess, or a stepped groove that communicates with the first cavity recess is formed around the second cavity recess. By doing so, the escape route of the air from the second cavity recess can be expanded and filled with the mold resin.

Further, as another means, there is provided a resin molding apparatus for clamping a work having an electronic component on a substrate with a mold and resin-molding a molded product including a convex part, wherein the work is placed on the bottom. A cavity piece formed with a mold, a cavity concave part for forming the convex part at the bottom part, and a first vent hole opened at the bottom part, and the upper mold clamping surface including the cavity piece is covered with a release film. An upper mold, and the lower mold on which the workpiece is placed and the upper mold are closed, and the release film has a height defined by the upper mold clamping surface. The mold resin is filled on the workpiece while being sucked and held at a predetermined tension by suction of the air holes, and a final resin pressure larger than the tension of the release film is applied, and the release film is moved forward. It may be the mold resin is filled into the cavities while stretched into the cavity recess.
Thereby, even if it is a case where the molded article containing a convex part is resin-molded by compression molding, resin filling property and molding quality can be improved.

  Further, by clamping the mold, a first cavity recess is formed between the cavity piece and the lower mold, and a second cavity recess corresponding to the protrusion is formed at the bottom of the cavity piece, It is preferable that a second ventilation hole opened in the communication groove that is continuous with the second cavity recess is provided. Thereby, the air remaining in the second cavity recess can be discharged through the second vent hole.

Further, it is a resin molding method in which a workpiece having an electronic component mounted on a base material is clamped with a mold die and a molded product including a lens portion is resin-molded. The workpiece is placed on the upper clamp surface on which the first cavity recess and a plurality of second cavity recesses deeper than the cavity bottom are formed, by suction of the first vent hole that opens to the cavity bottom. A step of adsorbing and holding a release film with a predetermined tension at a height defined by a cavity bottom of the first cavity recess, and a mold resin is closed by the cavity bottom of the first cavity recess by closing the mold a step of filling the first cavity recess while the release film is defined height, the second key from the first cavity recess And the second vent hole is provided which opens the communicating groove leading to Activity recess, after filling the molding resin into the first cavity recess, said release film by adding a large final resin pressure than the tension of the release film Filling the mold cavity with the mold resin by allowing the air trapped in the cavity cavity to escape into the second vent through the communication groove while extending into the cavity cavity. It is characterized by that.

  Also, either the transfer molding obtained with the final resin pressure being pushed up by the mold resin melted by the plunger or the molding resin supplied to the workpiece using either the upper mold or the lower mold at the final clamp position is used. Also, the filling property and molding quality of the mold resin can be improved.

  By using the above-described resin molding apparatus and method, it is possible to provide a resin molding apparatus and a resin molding method that improve the mold resin filling property and the molding quality when a molded product including a convex portion is resin-molded.

It is sectional explanatory drawing which shows the resin mold operation | movement of a resin mold apparatus. FIG. 2 is a cross-sectional explanatory view showing a resin molding operation of the resin molding apparatus following FIG. 1. FIG. 3 is a cross-sectional explanatory view showing a resin molding operation of the resin molding apparatus following FIG. 2. FIG. 4 is a cross-sectional explanatory view showing a resin molding operation of the resin molding apparatus following FIG. 3. FIG. 5 is a cross-sectional explanatory view showing a resin molding operation of the resin molding apparatus following FIG. 4. It is a top view of an upper mold clamping surface. It is sectional explanatory drawing which shows the resin mold operation | movement of the resin mold apparatus which concerns on another example. FIG. 8 is a cross-sectional explanatory view showing a resin molding operation of the resin molding apparatus following FIG. 7. FIG. 9 is a cross-sectional explanatory view showing a resin molding operation of the resin molding apparatus following FIG. 8. FIG. 10 is a cross-sectional explanatory view showing a resin molding operation of the resin molding apparatus following FIG. 9.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a resin molding apparatus and method according to the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, a resin mold in which a light emitting device (LED device) including a lens portion as a workpiece is resin-molded by transfer molding and compression molding using a transparent resin (silicone resin, epoxy resin, urethane resin, acrylic resin, etc.) The configuration of the apparatus will be described. The thermosetting resin can be mixed with at least one substance selected from a filler, a diffusing agent, a pigment, a fluorescent substance, a reflective substance, and the like in order to cope with high luminance.

  The LED in the present embodiment includes a light emitting element, a substrate on which the light emitting element is placed, and a lens portion (convex portion) that covers the light emitting element 1, and is formed as, for example, a surface-mounted light emitting device. In FIG. 1, a work W in which the light emitting elements 1 are flip-chip connected (or wire bonded connected) in a matrix on the substrate 2 is used. As the substrate 2 used as a base material, various plate-like members such as a resin substrate, a metal (for example, aluminum, copper, etc.) substrate, a ceramic substrate, a lead frame, and a carrier are used. Further, as the workpiece W, a wafer on which bumps are formed, a carrier on which an electronic component is fixed by adhesion, and the like may be used. In addition, as the mold resin, various types of resins such as a liquid resin, a granular resin, a granular resin, a sheet resin, and a tablet resin can be used, but an example using a liquid resin will be described below. In addition, you may provide the reflector (not shown) which prevents the spreading | diffusion of the irradiated light irradiated from the light emitting element 1. FIG.

Next, the configuration of the mold will be described.
In FIG. 1, the mold 3 includes a lower mold 4 on which the work W is placed and an upper mold 5 that clamps the work W together with the lower mold 4. In the present embodiment, the upper mold 5 is described as a fixed mold, and the lower mold 4 is described as a movable mold. As the mold opening / closing mechanism, a known mechanism is used in which the lower mold 4 supported by the platen is moved up and down by a tie bar using a drive transmission mechanism (such as a toggle link) by a drive source (servo motor or the like). A first cavity recess 7 is formed on the upper clamp surface of the cavity piece (cavity insert) 6 provided in the upper mold 5.

  The first cavity recess 7 comprehensively accommodates and molds the work W on which the light emitting elements 1 are mounted in a matrix on the substrate 2. A plurality of second cavity recesses 8 having a depth deeper than the bottom of the cavity are formed at a portion facing the light emitting element 1 at the bottom of the first cavity recess 7. At the bottom of the first cavity recess 7, the second cavity recess 8 is formed as a hemispherical recess corresponding to the outer shape of the lens portion. In addition, an upper runner gate 9 that continues to the first cavity recess 7 is formed. Further, an upper die 11 connected to the upper runner gate 9 is formed on the clamp surface of the center insert 10 of the upper die 5.

  The upper mold clamping surface including the first cavity recess 7, the upper mold runner gate 9, and the upper mold cull 11 is covered with a release film 12. The release film 12 is held by suction on the upper mold clamping surface. The release film 12 has heat resistance and is easily peeled off from the mold surface and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, Polypropylene film, polyvinylidine chloride and the like are preferably used.

  In FIG. 6, a first ventilation hole 13 is opened at the cavity bottom of the first cavity recess 7 of the cavity piece 6. The first vent hole 13 is used when the release film 12 is sucked and held on the upper mold clamping surface including the first cavity recess 7. In addition, a communication groove 14 that is continuous with the second cavity recess 8 is formed in the bottom of the first cavity recess 7. A second ventilation hole 15 is provided in the communication groove 14 so as to open.

  In FIG. 6, adjacent second cavity recesses 8 communicate with each other vertically and laterally through communication grooves 14 connected to the outer periphery thereof, and second ventilation holes 15 are connected to the respective communication grooves 14. As will be described later, the second vent hole 15 is used for releasing or sucking air that is easily trapped when the second cavity recess 8 is filled with mold resin. The first vent hole 13 and the second vent hole 15 are connected to air intake / exhaust devices 27a and 27b (see FIGS. 2 and 5). By the air suction / discharge devices 27a and 27b, not only air suction but also compressed air is ejected as necessary from the first vent hole 13 and the second vent hole 15 to release the release film 12 from the mold surface. It is also possible to accelerate the curing of the package surface.

  In FIG. 6, a stepped groove 16 that is continuous with the communication groove 14 is formed on the outer peripheral edge of the second cavity recess 8. Air can be released from the stepped concave groove 16 to the second vent hole 15 via the communication groove 14 (see FIG. 1). The step groove 16 may be omitted, and the communication groove 14 may be in direct communication with the second cavity recess 8. The air vent 22 is provided so that the upper runner gate 9 is connected to the side opposite to the side connected to the first cavity recess 7 (opposite side).

  In FIG. 1, the lower die 4 has a lower die insert 18 supported on a lower die chase 17. The upper surface of the lower mold insert 18 serves as a work W mounting surface. The lower mold center insert 19 is provided with a pot 20. A plunger 21 is inserted into the pot 20 so as to be movable up and down. The plunger 21 is provided so as to be lifted and lowered by a known transfer mechanism.

  Next, the resin molding operation of the resin molding apparatus will be described with reference to FIGS. First, in FIG. 1, the workpiece W is placed on the lower mold insert 18 of the lower mold 4 of the mold mold 3 that has been opened, and the liquid mold resin R is supplied to the pot 20 with a syringe or the like.

  Also, as shown in FIG. 2, the air suction / discharge device 27a is operated to start air suction from the first vent hole 13 (see FIG. 6) of the cavity piece 6 of the upper mold 5 facing the lower mold 4. The release film 12 is sucked and held on the upper mold clamping surface including the first and second cavity recesses 7 and 8, the upper mold runner gate 9, and the upper mold cull 11. The broken line shown in the figure is arranged at the same position as the second ventilation hole 15 in the right and left direction of the drawing, and the air intake / exhaust device 27a from the first ventilation hole 13 (see FIG. 6) not shown in this section. This means that the air is sucked (the same applies to FIGS. 3, 4, 8, and 9). At this time, the release film 12 adsorbed and held following the upper clamp surface is adsorbed and held with a predetermined tension following the cavity bottom of the first cavity recess 7, and the second cavity recess deeper than that. 8 is not entering.

  Next, in FIG. 3, the mold 3 is closed. The lower mold platen is raised through a known mold opening / closing mechanism, and the workpiece W is clamped by the lower mold 4 and the upper mold 5. The mold space including the first and second cavity recesses 7 and 8 formed between the upper mold 5 and the lower mold 4 is sealed by a movable clamper (not shown) so as to form a decompression space. Also good.

Next, as shown in FIG. 4, the mold resin R heated in the pot 20 is actuated by a transfer mechanism (not shown) to push up the plunger 21 so that the height of the release film 12 is defined by the bottom of the cavity of the first cavity recess 7. The entire first cavity recess 7 is filled as it is. In this case, the mold resin R is filled with a first resin pressure that is lower than the tension of the release film 12 and low enough not to stretch the release film 12 greatly. In the figure, the release film 12 is shown to be flush with the first cavity recess 7 in the second cavity recess 8 as well, but in actuality, the release film 12 is somewhat pushed into the second cavity recess 8. It may be.
At this time, since the release film 12 is not attached to the surface of the second cavity recess 8, the mold resin R is smoothly filled along the release film 12 with small unevenness. Moreover, since the air in the 1st cavity recessed part 7 is released from the air vent 22 provided in the opposite side to the upper mold | type runner gate 9, air is not confined in a metal mold | die (refer FIG. 6).

Finally, as shown in FIG. 5, the plunger 21 is further pushed up to apply a final resin pressure larger than the tension of the release film 12, and the release film 12 is stretched into the second cavity recess 8 while being molded in the second cavity recess 8. Resin R is filled. At this time, the air remaining in the second cavity recess 8 escapes to the second vent hole 15 through the communication groove 14 (or the stepped recess groove 16 and the communication groove 14), and the mold resin R is discharged into the second cavity recess 8. Filled.
Alternatively, the release film 12 is placed in the second cavity recess 8 while the second cavity recess 8 is filled with the mold resin R and air is sucked from the air suction / discharge device 27b through the second vent 15 connected to the second cavity recess 8. The mold resin may be filled while being stretched.

According to the resin molding apparatus and the resin molding method, the mold resin R is transferred to the plurality of second cavity recesses 8 having a depth deeper than the cavity bottom of the first cavity recess 7 by utilizing the mold followability due to the extension of the release film 12. Therefore, even in the case of a molded product including a lens portion having a high aspect ratio, the resin filling property can be improved. In addition, the variation in the thickness of the workpiece W and the irregularities on the workpiece surface can be absorbed by the thickness of the release film 12, and the second cavity concave portion 8 corresponding to the lens portion is a continuous surface, so that irregularities are formed on the molded product. The molding quality can be improved.
In addition, air that is easily trapped in the second cavity recess 8 is surely released to the second vent hole 15 through the communication groove 14, thereby preventing unfilling of the mold resin R and generation of voids in the second cavity recess 8. it can.
In addition, when the final resin pressure is applied while air is sucked from the second vent hole 15 to extend the release film 12 into the second cavity recess 8 and the second cavity recess 8 is filled with the mold resin R, The discharge of air remaining in the second cavity recess 8 can be promoted. In addition, since the mold cavity R is filled in all of the plurality of second cavity recesses 8 after the first cavity recess 7 is filled, the heating of the mold resin R in the second cavity recess 8 can be made uniform. The lens can be molded so that the cured state becomes uniform.

Next, another example of the resin molding apparatus will be described.
The resin mold apparatus described above uses a mold for transfer molding, but a mold for compression molding may be used. In addition, the same number is attached | subjected to the member similar to the resin mold apparatus mentioned above, and description shall be used. In FIG. 7, the upper mold 5 is provided with an upper mold movable clamper 23 surrounding the cavity piece 24. The upper mold movable clamper 23 is suspended and supported by a coil spring or the like on an upper mold base (not shown). The cavity piece 24 is fixed to an upper mold base (not shown). The cavity piece 24 is formed with a second cavity concave portion 8 and a communication groove 14 (including a stepped concave groove 16) that communicates the second cavity concave portion 8.

  The cavity piece 24 opens to a communication groove 14 that communicates the first vent hole 13 (see FIG. 6) that opens to the bottom (corresponding to the cavity bottom of the first cavity recess 7) and the second cavity recess 8. Second vent holes 15 are provided.

  In FIG. 7, the lower mold 4 has the lower mold insert 18 supported by the lower mold base 25. A lower mold block 26 is provided on the lower mold base 25 so as to surround the lower mold insert 18 and face the upper mold movable clamper 23. Although the cavity piece 24 is not formed with a recess corresponding to the first cavity recess 7, the mold die 6 is clamped to clamp the inner wall surface of the lower mold block 26 and the bottom (lower end surface) of the cavity piece 24. The concave portion formed in (1) corresponds to the first cavity concave portion 7. That is, the lower end surface of the cavity piece 24 corresponds to the cavity bottom of the first cavity recess 7.

  Next, the resin molding operation of the resin molding apparatus will be described with reference to FIGS. In FIG. 7, an air suction hole (not shown) provided in the lower mold insert 18 is loaded with the work W loaded with resin on the lower mold insert 18 of the lower mold 4 of the mold mold 3 opened. ) To attract the workpiece W. It is also possible to supply mold resin R (liquid resin) to the central portion of the substrate 2 after the work W is carried into the mold 3. Further, as shown in FIG. 8, the air suction / discharge device 27a is operated to start air suction from the first vent hole 13 (see FIG. 6) of the cavity piece 24 of the upper mold 5 facing the lower mold 4. The release film 12 is sucked and held with a predetermined tension applied to the upper clamp surface.

  Next, the mold 3 is closed. A lower mold platen (not shown) is raised through a known mold opening / closing mechanism to form a first cavity recess 7 above the workpiece W by the lower mold 4 and the upper mold 5, and as shown in FIG. Clamp the mold resin R with the workpiece W. At this time, the release film 12 sucked and held following the upper clamp surface is sucked and held by a predetermined tension following the bottom of the cavity piece 24 (corresponding to the cavity bottom of the first cavity recess 7). It is in a state where it does not enter the two-cavity recess 8. The release film 12 does not extend the release film 12 over the entire first cavity recess 7 while the height is defined by the bottom of the cavity piece 24 (corresponding to the cavity bottom of the first cavity recess 7). Fill with low first resin pressure. Also in this embodiment, since the release film 12 is not attached to the surface of the second cavity concave portion 8, the mold resin R is smoothly filled along the release film 12 having small irregularities. The mold space (first cavity recess 7 and second cavity recess 8) formed by the upper mold movable clamper 23 contacting the lower mold block 26 may be sealed to form a decompression space.

Finally, as shown in FIG. 10, the lower mold 4 is further pushed up from the state in which the upper mold movable clamper 23 is in contact with the lower mold block 26 to apply a final resin pressure larger than the tension of the release film 12, thereby releasing the release film 12. The mold resin R is filled into the second cavity recess 8 while extending into the second cavity recess 8. At this time, the air remaining in the second cavity recess 8 escapes to the second vent hole 15 through the communication groove 14 (or the stepped recess groove 16 and the communication groove 14), and the mold resin R is discharged into the second cavity recess 8. Filled.
Alternatively, the air suction / discharging device 27b is operated while filling the second cavity recess 8 with the mold resin R, and the release film 12 is removed from the second cavity recess 8 while sucking air from the second vent hole 15 connected to the second cavity recess 8. You may make it fill with mold resin, extending inside.

  The final resin pressure is maintained at the final clamp position where the upper mold 5 and the lower mold 4 are in contact with the work W, with the upper mold movable clamper 23 being in contact with the lower mold block 26. Thus, even if compression molding is used, for example, a molded product including a lens portion having a high aspect ratio can improve mold resin filling properties and molding quality.

  After the mold resin R is heated and cured in the mold, the air suction / discharge devices 27a and 27b are operated to blow air from the first vent hole 13 and the second vent hole 15, thereby opening the mold. The release film 12 may be released at the time of release, or the surface of the lens portion may be cured to promote release.

  The present invention relates to a resin molding apparatus and a resin molding method for manufacturing an LED light emitting device in which it is difficult to provide an air escape path in which LED lens portions are densely arranged on a substrate 2 with a pitch of 0.2 mm, for example, as a workpiece W. It is valid. The workpiece W is not limited to a light emitting device such as an LED, but may be used when, for example, a light receiving device or a lens of a camera module (MEMS product) is resin-molded.

  W Work R Mold resin 1 Light emitting element 2 Substrate 3 Mold 4 Lower mold 5 Upper mold 6, 24 Cavity piece 7 First cavity recess 8 Second cavity recess 9 Upper mold runner gate 10 Upper mold center insert 11 Upper mold 12 Release film 13 First vent hole 14 Communication path 15 Second vent hole 16 Stepped groove 17 Lower die chase 18 Lower die insert 19 Lower die center insert 20 Pot 21 Plunger 22 Air vent 23 Upper die movable clamper 25 Lower die Base 26 Lower mold block 27a, 27b Air intake / exhaust device

Claims (10)

A resin molding apparatus for resin molding a molded product including a convex portion by clamping a work with electronic parts mounted on a substrate with a mold.
A lower mold on which the workpiece is placed;
The first cavity recess is formed in the upper tool clamp surface, wherein the first vent hole opened to the cavity bottom of the first cavity recess and the second cavities for molding the projections on the bottom of the first cavity recess A cavity piece formed with a second vent hole that opens in a communication groove connected to the second cavity recess at the bottom of the first cavity recess, and an upper mold clamping surface including the bottom of the first cavity recess is released; An upper mold covered with a film,
The lower mold on which the work is placed and the upper mold are closed, and the release film is predetermined by suction of the first vent hole at a height defined by the cavity bottom of the first cavity recess. The mold resin is filled into the first cavity recess while adsorbed and held at the tension of, and after the mold resin is filled into the first cavity recess, a final resin pressure larger than the tension of the release film is applied to the first cavity recess. While the release film is stretched into the second cavity recess, the air trapped in the second cavity recess is released to the second vent through the communication groove, and the mold resin is filled into the second cavity recess. A resin molding apparatus characterized by the above. 2. The resin molding apparatus according to claim 1 , wherein a final resin pressure is applied while air is sucked from the second ventilation hole to extend the release film into the second cavity recess, and the second cavity recess is filled with mold resin. . The resin mold apparatus according to claim 1, wherein the cavity piece is formed with a communication groove that communicates the first cavity recess and the second cavity recess . The resin mold apparatus according to claim 1, wherein a stepped groove that communicates with the first cavity recess is formed around the second cavity recess . A resin molding apparatus for resin molding a molded product including a convex portion by clamping a work with electronic parts mounted on a substrate with a mold.
A lower mold on which the workpiece is placed;
A cavity piece formed with a cavity concave part for forming the convex part at the bottom part and a first ventilation hole opened at the bottom part, and an upper mold clamping surface including the cavity piece is covered with a release film; A mold, and
The lower mold on which the work is placed and the upper mold are closed, and the release film is pulled at a predetermined tension by the suction of the first vent hole at a height defined by the upper mold clamping surface. The mold resin is filled onto the workpiece while being held by suction, and a final resin pressure larger than the tension of the release film is applied to fill the cavity recess with the mold resin while the release film is extended into the cavity recess. Resin mold apparatus characterized by being made. A first cavity recess is formed between the cavity piece and the lower mold by clamping the mold, and a second cavity recess corresponding to the protrusion is formed at the bottom of the cavity piece. The resin mold apparatus according to claim 5, wherein a second ventilation hole is provided in the communication groove that is continuous with the two-cavity recess . A resin molding method for resin molding a molded product including a lens part by clamping a work with electronic parts mounted on a substrate with a mold die,
The workpiece is placed on the lower mold clamping surface of the mold mold that has been opened, and the cavity is formed on the upper mold clamping surface on which the first cavity concave portion and a plurality of second cavity concave portions deeper than the cavity bottom portion are formed. A step of adsorbing and holding the release film with a predetermined tension at a height defined by the cavity bottom of the first cavity recess by suction of the first air hole opening in the bottom;
Filling the mold cavity with the mold cavity closed and filling the mold cavity with the release film while the height of the release film is regulated by the cavity bottom of the cavity cavity;
A second ventilation hole is provided that opens from the first cavity recess to a communication groove continuous to the second cavity recess, and after filling the mold resin into the first cavity recess, the final larger than the tension of the release film. While applying a resin pressure to extend the release film into the second cavity recess, the air trapped in the second cavity recess is released to the second vent through the communication groove to release the mold resin into the second cavity. A resin mold method comprising: filling the recess. The resin molding method according to claim 7, wherein a final resin pressure is applied while air is sucked from the second vent hole to fill the second cavity recess with mold resin while extending the release film into the second cavity recess . The resin molding method according to claim 7 or 8 , wherein the final resin pressure is transfer molding obtained in a state in which a mold resin melted by a plunger is pushed up . 9. The resin molding method according to claim 7, wherein the final resin pressure is compression molding in which an upper mold and a lower mold are obtained at a final clamp position of the mold resin supplied to the workpiece .

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