JP5954638B2 - タッチパネル用粘着剤組成物 - Google Patents
タッチパネル用粘着剤組成物 Download PDFInfo
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- JP5954638B2 JP5954638B2 JP2014227868A JP2014227868A JP5954638B2 JP 5954638 B2 JP5954638 B2 JP 5954638B2 JP 2014227868 A JP2014227868 A JP 2014227868A JP 2014227868 A JP2014227868 A JP 2014227868A JP 5954638 B2 JP5954638 B2 JP 5954638B2
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C09J2433/00—Presence of (meth)acrylic polymer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
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- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Position Input By Displaying (AREA)
Description
製造例1
窒素ガスが還流され、温度調節が容易となるように冷却システムを設置した1L反応器にn−ブチルアクリレート(nbutylacrylate:BA)69重量部、メチルアクリレート(methylacrylate:MA)30重量部及び2−ヒドロキシエチルメタクリレート(2−hydroxyethyl methacrylate:2−HEMA)1重量部を投入した。溶剤として、エチルアセテート(ethylacetate:EAc)120重量部を投入し、チオール化合物としてn−ドデカンチオールを0.01重量部投入した。
チオール化合物0.03重量部を使用した点を除いて、製造例1に準ずる方法で固形分が30重量%であり、重量平均分子量が80万であり、多分散度(PDI)が2.6であるアクリル重合体溶液を製造した。
チオール化合物0.05重量部を使用した点を除いて、製造例1に準ずる方法で固形分が30重量%であり、重量平均分子量が50万であり、多分散度(PDI)が2.4であるアクリル重合体溶液を製造した。
n−ブチルアクリレート(n−butylacrylate:BA)59重量部、メチルアクリレート(methylacrylate:MA)40重量部及び2−ヒドロキシエチルメタクリレート(2−hydroxyethylmethacrylate:2−HEMA)1重量部で構成される単量体混合物を使用し、チオール化合物0.06重量部を使用したという点を除いて、製造例1に準する方法で固形分が30重量%であり、重量平均分子量が45万であり、多分散度(PDI)が2.4であるアクリル重合体溶液を製造した。
チオール化合物を使用しない点を除いて、製造例1に準ずる方法で固形分が30重量%であり、重量平均分子量が60万であり、多分散度(PDI)が5.2であるアクリル重合体溶液を製造した。
チオール化合物を使用しない点を除いて、製造例4に準ずる方法で固形分が30重量%であり、重量平均分子量が120万であり、多分散度(PDI)が5.6であるアクリル重合体溶液を製造した。
実施例1
製造例1で得られたアクリル重合体溶液の固形分100重量部に対してイソシアネート架橋剤(TDI、トルエンジイソシアネート)0.3重量部を均一に混合し、粘着剤組成物を製造した。
製造例2で得られたアクリル重合体溶液を使用した点を除いて、実施例1と同一の方法で粘着フィルムを製造した。
製造例3で得られたアクリル重合体溶液を使用した点を除いて、実施例1と同一の方法で粘着フィルムを製造した。
製造例4で得られたアクリル重合体溶液を使用した点を除いて、実施例1と同一の方法で粘着フィルムを製造した。
製造例5で得られたアクリル重合体溶液を使用した点を除いて、実施例1と同一の方法で粘着フィルムを製造した。
製造例6で得られたアクリル重合体溶液を使用した点を除いて、実施例1と同一の方法で粘着フィルムを製造した。
両面にハードコーティングが形成されているポリエチレンテレフタレートフィルム(厚さ:100μm)のハードコーティング面とポリカーボネートシート(厚さ:1mm)を粘着剤層を媒介で付着し、横50mm、縦100mmサイズに切断した後、60℃及び5気圧下で、30分間オートクレーブ処理し、サンプルを製造した。
耐久性は、上記各条件で放置後に気泡及び浮き上り/剥離発生有無を観察して評価し、上記各物性の具体的な評価基準は、下記の通りである。
O:粘着界面で、気泡が観察されないか、直径100μm以下の気泡が少量分散して観察される場合
X:粘着界面で、直径100μm以上の気泡が発生あるいは直径100μm以下の気泡が群集して発生した場合
O:粘着界面で浮き上り/剥離がない場合
X:粘着界面で浮き上りまたは剥離が発生した場合
反り特性は、上記耐熱条件で放置されたサンプルを底に配置した場合、底から上記サンプルの最も遠い距離までを測定して反り程度を評価した。
抵抗変化率は、図6に示されたような方式で測定した。一面にITO薄膜20が形成されたPETフィルム10(以下、「導電性PET」)(Oike社ITOフィルム、商品名:KA500PS1−175−UH/P、Crystalline ITO)を30mm×50mm(幅×長さ)のサイズに切断した。次いで、図6のように、フィルム10の両端に10mmの幅で銀ペースト(Silver Paste)30を塗布し、150℃で30分間焼成した。その後、実施例及び比較例などで製造されるもので、両面に離型フィルム50が付着している粘着フィルムを30mm×40mm(幅×長さ)のサイズに切断し、一面の離型フィルムを除去した後、粘着剤層40を焼成されたフィルムに付着した。上記付着は、粘着剤層の中心と導電性PET10、20の中心を合わせて行った。その後、通常の抵抗測定器60を使用してITO薄膜20の初期抵抗Riを測定した。初期抵抗測定後、図6の構造の試験片を60℃及び90%相対湿度で240時間放置し、さらに同一に測定器60でITO薄膜20の抵抗Rを測定し、それぞれの数値を上記一般式1に代入し、抵抗変化率△Rを測定した。
アクリル重合体の重量平均分子量及び多分散度は、GPCを使用して、以下の条件で測定した。検量線の製作には、Agilent systemの標準ポリスチレンを使用して、測定結果を換算した。
測定器:Agilent GPC(Agilent 1200 series、米国)
カラム:PL Mixed B 2個連結
カラム温度:40℃
溶離液:テトラヒドロフラン
流速:1.0mL/min
濃度:〜2mg/mL(100μL injection)
3、4 タッチパネル構造
11、21 粘着剤層
12、23、33、43 基材
32、44 基板
22、41、42 導電層
31 ハードコーティング層
5 粘着フィルム
51、52 離型フィルム
10 PETフィルム
20 ITO薄膜
30 銀ペースト
40 粘着剤層
50 離型フィルム
60 抵抗測定器
Claims (9)
- 上記(メタ)アクリル酸エステル単量体が炭素数1〜20のアルキル基を有するアルキル(メタ)アクリレートである、請求項1に記載の導電性フィルム。
- 上記アクリル重合体は、(メタ)アクリル酸エステル系単量体97〜99.999重量部及びチオール系化合物0.001重量部〜3重量部を含む、請求項1に記載の導電性フィルム。
- 上記架橋性官能基がカルボキシル基、ヒドロキシ基、窒素含有基、エポキシ基またはイソシアネート基である、請求項1に記載の導電性フィルム。
- 上記粘着剤組成物が、上記アクリル重合体を架橋させる多官能性架橋剤をさらに含む、請求項1に記載の導電性フィルム。
- 上記多官能性架橋剤は、イソシアネート架橋剤、エポキシ架橋剤、アジリジン架橋剤または金属キレート架橋剤である、請求項5に記載の導電性フィルム。
- 上記基材はプラスチック基材である、請求項1に記載の導電性フィルム。
- 上記基材上に形成された導電層をさらに含み、基板上に形成された導電層と基材上に形成された導電層が粘着剤層によって互いに付着している、請求項1に記載の導電性フィルム。
- 請求項1に記載の導電性フィルムを含むタッチパネル。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2010-0102237 | 2010-10-20 | ||
| KR20100102237 | 2010-10-20 | ||
| KR1020110106917A KR101385844B1 (ko) | 2010-10-20 | 2011-10-19 | 터치 패널용 점착제 조성물 |
| KR10-2011-0106917 | 2011-10-19 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013534822A Division JP5757670B2 (ja) | 2010-10-20 | 2011-10-20 | タッチパネル用粘着剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015045022A JP2015045022A (ja) | 2015-03-12 |
| JP5954638B2 true JP5954638B2 (ja) | 2016-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013534822A Active JP5757670B2 (ja) | 2010-10-20 | 2011-10-20 | タッチパネル用粘着剤組成物 |
| JP2014227868A Active JP5954638B2 (ja) | 2010-10-20 | 2014-11-10 | タッチパネル用粘着剤組成物 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2013534822A Active JP5757670B2 (ja) | 2010-10-20 | 2011-10-20 | タッチパネル用粘着剤組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9556364B2 (ja) |
| EP (1) | EP2631279B1 (ja) |
| JP (2) | JP5757670B2 (ja) |
| KR (1) | KR101385844B1 (ja) |
| CN (1) | CN103270127B (ja) |
| TW (1) | TWI527868B (ja) |
| WO (1) | WO2012053830A2 (ja) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2914209B2 (ja) | 1995-03-06 | 1999-06-28 | 日本電気株式会社 | パルス検出回路 |
| KR101191117B1 (ko) * | 2009-09-28 | 2012-10-15 | 주식회사 엘지화학 | 터치 패널 |
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2011
- 2011-10-19 KR KR1020110106917A patent/KR101385844B1/ko active Active
- 2011-10-20 TW TW100138159A patent/TWI527868B/zh active
- 2011-10-20 EP EP11834630.3A patent/EP2631279B1/en active Active
- 2011-10-20 US US13/880,611 patent/US9556364B2/en active Active
- 2011-10-20 WO PCT/KR2011/007812 patent/WO2012053830A2/ko not_active Ceased
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| TW201231600A (en) | 2012-08-01 |
| JP2015045022A (ja) | 2015-03-12 |
| CN103270127B (zh) | 2016-06-08 |
| JP5757670B2 (ja) | 2015-07-29 |
| JP2014501796A (ja) | 2014-01-23 |
| TWI527868B (zh) | 2016-04-01 |
| KR101385844B1 (ko) | 2014-04-21 |
| EP2631279B1 (en) | 2018-03-28 |
| US9556364B2 (en) | 2017-01-31 |
| KR20120041134A (ko) | 2012-04-30 |
| US20130201145A1 (en) | 2013-08-08 |
| WO2012053830A2 (ko) | 2012-04-26 |
| EP2631279A2 (en) | 2013-08-28 |
| EP2631279A4 (en) | 2014-08-27 |
| CN103270127A (zh) | 2013-08-28 |
| WO2012053830A3 (ko) | 2012-07-26 |
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