JP5964800B2 - Movable micro chamber system with gas curtain - Google Patents

Description

  The present disclosure relates to a micro chamber, and more particularly to a movable micro chamber system with a gas curtain.

  The entire disclosure of any publication or patent document mentioned in this application is incorporated by reference.

  Traditional process chamber systems used in semiconductor manufacturing are relatively large and fixed, with a much larger amount of reaction than is actually required to perform a particular manufacturing step on the wafer substrate. It is necessary to fill things and gases. In addition, some gas species are corrosive and others are toxic. Therefore, the amount of such gas used is preferably minimized.

  To achieve this goal, a micro chamber system has been developed as disclosed in US Pat. No. 5,997,963. The microchamber system has a relatively small volume chamber (microchamber) and seals process gas in the microchamber for manufacturing.

US Pat. No. 5,997,963

  High temperature semiconductor manufacturing applications such as laser annealing of wafers where micro-chamber systems have proven useful for conventional semiconductor manufacturing at room temperature, but the substrate temperature needs to be increased to activate the annealing process Therefore, the same micro chamber system cannot be used effectively. In particular, air bearings used in microchamber systems will not function due to thermal deformation due to high substrate temperatures.

  A movable microchamber system with a gas curtain is disclosed. The micro chamber system has a lid member and a stage assembly. The lid member has an optical access function unit. The stage assembly supports the substrate to be manufactured. The stage assembly is disposed with respect to the lid member and defines a macro chamber and micro chamber peripheral gap. The stage assembly has an outer peripheral surface. An inert gas flows in the gap around the micro chamber, and a gas curtain is formed just outside the micro chamber, that is, near the outer peripheral surface of the stage assembly. The gas curtain substantially prevents reactive gases in the surrounding environment from entering the microchamber when the stage assembly is moving relative to the lid member.

  One aspect of the present disclosure is a microchamber system for manufacturing a substrate without exposure to a reactive gas from the surrounding environment. The system has a lid member. The lid member has at least one optical access function unit. The system also includes a stage assembly that supports the substrate. The stage assembly is disposed with respect to the lid member and defines a macro chamber and micro chamber peripheral gap. The stage assembly has an outer peripheral surface and is movable with respect to the lid member. The microchamber includes a gas containing a selected amount of reactive gas or a gas substantially free of reactive gas. The system has at least one gas supply system. At least one gas supply system is pneumatically connected to the stage assembly. The at least one gas supply system is configured to support a gas flow flowing from the at least one gas supply system into the microchamber peripheral gap to form a gas curtain in the vicinity of the outer peripheral surface. The gas curtain substantially prevents ambient reactive gases from entering the microchamber as the stage assembly is moved relative to the lid member.

  Another aspect of the present disclosure is the above-described micro chamber system, wherein the at least one optical access function includes at least one of an opening and a window.

  Another aspect of the present disclosure is the above-described micro-chamber system, wherein the at least one optical access function unit is configured to pass at least one laser beam through the lid member onto the substrate.

  Another aspect of the present disclosure is the microchamber system described above, wherein the gas is selected from the group of gases consisting of nitrogen, argon, helium and neon.

  Another aspect of the present disclosure is the microchamber system described above, wherein the reactive gas is oxygen.

  Another aspect of the present disclosure is the microchamber system described above, wherein at least one gas supply system supplies gas to the microchamber.

  Another aspect of the present disclosure is the microchamber system described above, wherein the stage assembly includes a cooling chuck assembly.

  Another aspect of the present disclosure is the microchamber system described above, wherein the lid member is cooled.

  Another aspect of the present disclosure is the microchamber system described above, wherein the stage assembly includes an annular member. The annular member partially defines the microchamber peripheral gap. The stage assembly includes a plurality of openings. The plurality of openings support a flow of gas flowing from at least one gas supply system into the microchamber peripheral gap.

  Another aspect of the disclosure is the microchamber system described above, wherein the microchamber peripheral gap has a width in the range of 0.01 mm to 2 mm.

  Another aspect of the present disclosure is the microchamber system described above, wherein the microchamber peripheral gap has a width in the range of 0.1 mm to 1 mm.

Another aspect of the disclosure is a above microchamber system, stage assembly has a maximum speed V _M against the lid member. Gas flowing into the peripheral microchamber gap has a gas velocity V _G. Then, _{V G} is greater than _{V M.}

  Another aspect of the present disclosure is a method of manufacturing a substrate without exposing the substrate to reactive gases present in the ambient environment outside the microchamber. The method includes supporting a substrate on a movable stage assembly in a microchamber. The micro chamber is defined by a fixed lid member and a movable stage assembly. The movable stage assembly has an annular member. The annular member, together with the fixed lid member, defines a microchamber peripheral gap. The stage assembly has an outer peripheral surface. The method further includes introducing a first gas into the microchamber. The first gas is substantially free of reactive gas or contains a selected amount of reactive gas. The method also includes a step of introducing a second gas through the annular member into the microchamber peripheral gap to form a gas curtain near the outer peripheral surface of the movable stage assembly. The method also includes the step of moving the movable stage assembly relative to the fixed lid member. The gas curtain prevents reactive gases in the surrounding environment from flowing into the microchamber during movement of the movable stage assembly.

  Another aspect of the present disclosure is the method described above, wherein the first and second gases are the same gas.

  Another aspect of the present disclosure is a method as described above, the method comprising manufacturing a substrate with at least one laser beam that enters the microchamber from the ambient environment through at least one light access feature of the lid member. Further included.

  Another aspect of the disclosure is the method as described above, wherein the at least one laser beam comprises at least one annealing laser beam.

  Another aspect of the present disclosure is a method as described above, wherein at least one laser beam reacts with a selected amount of reactive gas in a microchamber to modify the substrate.

  Another aspect of the disclosure is the method described above, wherein the at least one optical access function includes at least one of an opening and a window.

Another aspect of the disclosure is the method disclosed above, wherein the movable stage assembly has a maximum speed V _M against the lid member. Further, supplying the gas flowing into the peripheral microchamber gap at a gas velocity V _G. In this case, _{V G} is set to be larger than the _{V M.}

  Another aspect of the disclosure is the method as described above, wherein the microchamber peripheral gap has a width in the range of 0.01 mm to 2 mm.

  Another aspect of the disclosure is the method described above, wherein the microchamber peripheral gap has a width in the range of 0.1 mm to 1 mm.

  Another aspect of the present disclosure is the above-described method, wherein the first and second gases are at least one gas selected from the gas group consisting of nitrogen, argon, helium, and neon.

  Another aspect of the present disclosure is the method described above, wherein the movable stage assembly includes a heated chuck. The method further includes a step of heating the substrate using a heating chuck.

  Another aspect of the present disclosure is the method described above, the method further including cooling the movable stage assembly and the lid member.

  Another aspect of the present disclosure is a method of manufacturing a substrate without exposing the substrate to reactive gases present in the ambient environment outside the microchamber. The method includes supporting a substrate on a movable stage assembly in a microchamber. The micro chamber is defined by a fixed lid member and a movable stage assembly. The movable stage assembly has an outer peripheral surface and an annular member. The outer peripheral surface and the annular member together with the lid member define a microchamber peripheral gap. Further, the method includes a step of depressurizing the inside of the micro chamber. The method also includes the step of introducing a gas through the annular member into the microchamber peripheral gap to form a gas curtain near the outer peripheral surface of the movable stage assembly. The gas used to form the gas curtain is substantially free of reactive gas or contains a selected amount of reactive gas. By decompressing the inside of the micro chamber, a part of the gas from the gap around the micro chamber is drawn into the micro chamber. The method also includes the step of moving the movable stage assembly relative to the fixed lid member. Here, the gas curtain prevents the reactive gas in the surrounding environment from flowing into the micro chamber.

  Additional features and advantages are specified in the detailed description. Some of them will be readily apparent to those skilled in the art from the detailed description, or may be recognized by practicing the invention described herein, including the detailed description, the claims, and the accompanying drawings. The The above description regarding the background art and the following detailed description are merely examples and provide an outline or framework for understanding the nature and characteristics of the present invention described in the claims. Should be understood.

  The accompanying drawings are included to provide a further understanding, and constitute a part of this specification and are incorporated into this specification. The drawings illustrate one or more embodiments, and together with the detailed description serve to explain the principles and operations of the various embodiments. Thus, the present disclosure will become more fully understood from the detailed description set forth below when taken in conjunction with the accompanying drawings.

It is a typical sectional view (XZ plane) of one embodiment of a micro chamber system of this indication. 1B is an exploded cross-sectional view of several main components of the microchamber of the microchamber system of FIG. 1A. FIG. It is a top view of the micro chamber of the example of FIG. 1A. The micro chamber has a light access function part in the form of a single opening in the lid member. It is a top view of the micro chamber of another example shown by FIG. Here, the lid member has an optical access function part in the form of two openings. 1B is a detailed cross-sectional view of the microchamber system of FIG. 1A. It is a top view of an example of 1 composition of a chuck assembly and an annular member. It is a top view of an example of 1 composition of a chuck assembly and an annular member. It is a partial expanded sectional view of a micro chamber. This figure has shown the upper part of the annular member, and has also shown the example of the flow path and opening in the upper surface of an annular member. It is a typical side view of the micro chamber system of FIG. This figure shows the movement of the stage assembly relative to the lid member. The movement is indicated by an arrow AR. It is a typical side view of the micro chamber system of FIG. This figure shows the movement of the stage assembly relative to the lid member. The movement is indicated by an arrow AR. It is a typical side view of the micro chamber system of FIG. This figure shows the movement of the stage assembly relative to the lid member. The movement is indicated by an arrow AR. FIG. 7 is a plot of gas velocity V _{G (} m / s) against gas flow rate (standard liters per minute or SLM) at different widths W _G3, ie 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm and 1 mm. In the plot, an example of the maximum stage assembly speed V _M (m / s) is shown as a broken line at 0.5 m / s. FIG. 4 is a view similar to FIG. 3, showing an embodiment of a micro chamber system. Here, the micro chamber includes an optical access function part in the form of a window part in the lid member instead of one or a plurality of openings.

  Hereinafter, various embodiments of the present disclosure and examples shown in the accompanying drawings will be described in detail. Wherever possible, the same or similar reference numbers and reference numerals are used in the drawings of the same or similar parts. The drawings are not to scale and those skilled in the art will recognize that the drawings have been simplified to illustrate the major portions of the present invention.

  The claims are incorporated into and constitute a part of the detailed description of the invention.

  In some of the drawings, an orthogonal coordinate system is drawn for reference, but this does not limit the specific direction and orientation.

  FIG. 1A is a schematic cross-sectional view (in the XZ plane) of one embodiment of a micro chamber system (system) 10. FIG. 1B is an exploded view of some major components of the system 10 of FIG. 1A. 2A is a top view (in the XY plane) of the system 10 of FIG. 1A. Line 1-1 shows the cross-sectional location of FIG.

  The system 10 has a Z center line CZ extending in the Z direction and an X center line CX extending in the X direction. The system 10 exists in the surrounding space 8. The surrounding space 8 contains at least one kind of reactive gas such as oxygen. The surrounding space 8 may contain a non-reactive gas such as neon or argon and a stable gas such as nitrogen.

  The system 10 includes a lid member 20. The lid member 20 has an upper surface 22, a lower surface 24 and an outer edge 26. For example, the lid member 20 is substantially rectangular and has a parallel upper surface 22 and lower surface 24. The lid member 20 is cooled, for example, as described in more detail below. The lid member 20 includes, for example, at least one optical access function unit 30. At least one optical access function unit 30 passes at least one laser beam 40 through the lid member 20. The at least one optical access function unit 30 includes, for example, one or a plurality of openings. In other examples described below in connection with FIG. 7, the optical access functionality 30 may include at least one window.

  The system 10 also includes a chuck 60. The chuck 60 has an upper surface 62, a lower surface 64 and an outer edge 66. The chuck 60 has a substantially cylindrical shape and is centered on the Z center line CZ. The chuck 60 has an upper surface 62 parallel to the lower surface 24 in the vicinity of the lower surface 24 of the lid member 20. The upper surface 62 of the chuck 60 and the lower surface 24 of the lid member 20 are separated by a distance D1 within a range of 50 microns to 1 mm, and define a micro chamber 70 having a distance (height) D1.

The upper surface 62 of the chuck 60 is configured to support the semiconductor substrate (substrate) 50. The substrate 50 has an upper surface 52, a lower surface 54 and an outer edge 56. The substrate 50 is, for example, a silicon wafer. The substrate 50 may be a product wafer. The product wafer is processed to produce a semiconductor device and further processed with a laser beam 40. The substrate 50 is shown as a dashed circle in the top view of FIG. 2A. For example, the chuck 60 is heated. In a further example, the chuck 60 is configured to heat the substrate 50 to a wafer temperature T _W of up to about 400 ° C.. For example, the at least one laser beam 40 comprises one or more annealing laser beams, ie, one or more laser beams that can perform an annealing process of the substrate 50 such as, for example, dopant diffusion.

  The system 10 also includes a thermal insulation layer 80. The heat insulating layer 80 has an upper surface 82, a lower surface 84, and an outer edge 86. The heat insulating layer 80 is disposed in the immediate vicinity of the lower surface 64 of the chuck 60. For this reason, the heat insulation layer 80 has heat exchange with it. The heat insulating layer 80 is made of, for example, glass or a ceramic material, or is a gap. For example, the upper surface 82 of the heat insulating layer 80 is in close contact with the lower surface 64 of the chuck 60.

  The system 10 also includes a cooler 90. As described below, the cooler 90 is configured to thermally manage heat generated by the chuck 60 and heat generated by the effectiveness of the laser beam 40 incident on the substrate 50. The cooler 90 has, for example, an upper surface 92, a lower surface 94 and an outer edge 96. The cooler 90 has a recess 98. The recess 98 is defined by the support surface 100 and the inner wall 102. The recess 98 is formed so as to accommodate the heat insulating layer 80 and the chuck 60. For this reason, the heat insulation layer 80 is supported by the support surface 100. For example, the inner wall 102 of the cooler 90, the outer edge 86 of the heat insulating layer 80, and the outer edge 66 of the chuck 60 define a gap G1. In a further example, the cooler 90 includes one or more gas flow paths 104. The one or more gas flow paths 104 form a gas flow path from the support surface 100 to the lower surface 94. For this reason, the gas 202 in the micro chamber 70 flowing into the gap G <b> 1 can flow out of the micro chamber 70 on the lower surface 94 through the cooler 90. The heat insulating layer 80 may be an air gap.

  The system 10 also includes a movable stage 120. The movable stage 120 has an upper surface 122 and a lower surface 124. The system 10 further includes an annular member 150. The annular member 150 is disposed in the vicinity of the outer edge 96 of the cooler 90. The annular member 150 has a main body 151. The annular member 150 has an upper surface 152, a lower surface 154, an inner surface 155 and an outer edge 156. By assembling the chuck 60, the heat insulating layer 80 and the cooler 90, a chuck assembly 68 is configured. The movable stage assembly 128 is configured by assembling the chuck assembly 68, the movable stage 120, and the annular member 150. The lid member 20 is fixed with respect to the movable stage assembly 128. The movable stage assembly 128 has an outer periphery 129. For example, the outer periphery 129 is partially defined by the outer edge 150 of the annular member 150.

  The movable stage 120 supports the cooler 90 on the upper surface 122 of the movable stage 120. The movable stage 120 is operably connected to the retaining device 126. The holding device 126 is configured to move the movable stage 120, stop the movable stage 120 at a specific position, and track the position of the movable stage 120 with respect to the reference position as necessary. The movable stage 120 is operably supported on the mounting plate 130 so that the movable stage 120 can be moved in the XY plane. The mounting board 130 has an upper surface 132.

  The lower surface 24 of the lid member 20, the outer edge 156 of the annular member 150, and the upper surface 132 of the mounting plate 130 define a gas curtain region 158.

  The movable stage 120 and the chuck 60 are integrated, for example, to form a single or two-part movable chuck. This movable chuck is operably connected to the retaining device 126. The lid member 20 is sufficiently long in the X direction with respect to the chuck 60 that moves relative to the lid member 20. For this reason, the laser beam 40 can expose the entire upper surface 52 of the substrate 50.

FIG. 4 is a top view of the substrate 50, the chuck 60 and the annular member 150. The annular member 150 is disposed with respect to the cooler 90 so that the inner surface 155 of the annular member 150 is positioned in the vicinity of the outer edge 96 of the cooler 90 and an annular gap G2 is formed therebetween. For example, the annular gap G2 is ventilated to the outside (that is, to the surrounding environment 8). The width W _G2 of the annular gap G2 is, for example, in the range of 0.5 mm to 2 mm. As best seen in FIG. 4C, the upper surface 152 of the annular member 150 and the lower surface 24 of the lid member 20 define a microchamber peripheral gap G3. The micro chamber peripheral gap G3 has a width _WG3 . The width W _G3 is, for example, in the range of 0.01 mm to 2 mm, but in another example, in the range of 0.1 mm to 1 mm. The microchamber peripheral gap G3 is designed to be located around the outer periphery of the microchamber 70.

  The system 10 also includes at least one gas supply system 200 and at least one coolant supply system 250. For example, the first gas supply system 200 is configured to supply the gas 202 to the micro chamber 70, and the other gas supply system 200 is configured to supply the gas 202 to the annular member 150. In one embodiment, different gas supply systems 200 supply different gases 202. In other embodiments they also supply the same gas.

  In other embodiments, a single gas supply system 200 is employed to supply gas to the microchamber 70 and the annular member 150. The microchamber 70 includes, for example, a gas 202, but there is substantially no reactive gas in the ambient environment 8. As used herein, the expression “substantially no reactive gas” means that there is no reactive gas that substantially affects the process performed on the substrate 50 in the microchamber 70. To do. The gas 202 may include one or more inert gases such as, for example, neon, argon, helium and nitrogen. The gas 202 is composed of, for example, one or a plurality of inert gases. In other examples, the gas 202 includes a selected amount of at least one reactive gas, such as oxygen.

  In order to include only a selected amount of a reactive gas such as oxygen in the gas 202, the same reactive gas present in the surrounding environment 8 is microscopic so that the amount of the reactive gas in the micro chamber 70 does not change. It is necessary to prevent entry into the chamber 70. For example, a selected amount of reactive gas in the gas 202 reacts with at least one laser beam 40 to modify the substrate 50.

  As shown in FIGS. 5A to 5C and as described in more detail below, the annular member 150 controls the flow rate of the gas 202 to the microchamber peripheral gap G3 to provide a gas near the outer edge 156 of the annular member 150. The curtain 202C is formed. Each coolant supply system 250 is configured to control the flow of coolant 252 such as water or a water-glycerin mixture.

  The system 10 also includes a control unit 300. The control unit 300 is operably connected to the gas supply system 200 and the coolant supply system 250, and is configured to control these systems 200, 250 to form a gas curtain 202C as described below. Yes. The system 10 also includes a decompression system 260. The decompression system 260 is pneumatically connected to the microchamber 70 through, for example, at least one gas flow path 104. The decompression system 260 can be used to decompress the interior of the microchamber 70.

  FIG. 3 is a more detailed schematic diagram of one embodiment of the system 10. The system 10 of FIG. 3 includes first and second optical access functions 30A, 30B in the form of an opening in the lid member 20. 2B is a top view of the system 10 of FIG. 3 that is similar to FIG. 2A. This figure shows the first and second optical access function units 30A and 30B. For example, the first and second optical access function units 30A and 30B are centered on the X center line CX of any size of the Z center line CZ.

  For example, the first and second optical access function units 30A and 30B have a square cross-sectional shape and are inclined inward from the upper surface 22 to the lower surface 24 of the lid member 20 in the XZ plane. The first and second optical access function units 30A and 30B are sized to allow the first and second laser beams 40A and 40B passing through the lid member 20 to pass through. When the first and second laser beams 40A and 40B are incident on the lid member 20 at an angle with respect to the Z center line CZ, the inclination angles of the first and second optical access function units 30A and 30B are as follows. The incident angles of the first and second laser beams 40A and 40B may be substantially matched. The first and second optical access function units 30A and 30B may be configured such that the first and second laser beams 40A and 40B overlap on the substrate 50.

  The annular member 150 includes a channel 162 in the main body 151. The main body 151 is pneumatically connected to the plurality of openings 164 on the upper surface 152 of the annular member 150. For example, the opening 164 is disposed near the outer edge 156 of the annular member 150. FIG. 4A is a top view of a configuration example of the chuck assembly 68. The chuck assembly 68 has an annular member 150. The annular member 150 surrounds the outer edge 96 of the cooler 90. Here, the cooler 90 and the annular member 150 have a circular shape. 4B is a drawing similar to FIG. 4A and shows another configuration example in which the cooler 90 and the annular member 150 have a more square shape (for example, a rounded square shape). In the example shown in FIGS. 4A and 4B, the opening 164 in the annular member 150 is disposed closer to the outer edge 156 than the inner surface 155 of the annular member 150.

  FIG. 4C is a partial enlarged cross-sectional view of the system 10 and shows the upper portion of the annular member 150 together with an example of the flow path 162. The channel 162 is stretched around at least a part of the annular member 150. One of the plurality of openings 164 connecting the channel 162 to the upper surface 152 of the annular member 150 is shown in FIG. 4C.

  For example, in one configuration example of the annular member 150, there are 5 to 50 openings per inch. The size (diameter) of the opening 164 is, for example, in the range of 0.02 inch to 0.05 inch.

  In one embodiment, each gas supply system 200 includes a gas source 204. The gas source 204 is pneumatically connected to the flow control device 210. The flow control device 210 is pneumatically connected to the micro chamber 70. In the example shown in FIG. 3, the flow control device 210 is disposed on the opposite side of the first and second optical access function units 30A and 30B. The first and second gas sources 204 are pressurized and supply a gas 202 such as nitrogen, argon or helium, for example. The flow control device 210 is, for example, a mass flow control device or an adjustment valve.

  For example, two gas supply systems 200 are used to supply gas 202 to microchamber 70 and a third gas supply system is pneumatically connected to annular member 150. In particular, the third gas supply system 200 has a third gas source 204. The third gas source 204 is pneumatically connected to the third flow control device 210. Similarly, the third flow control device 210 is pneumatically connected to the outlet-side channel 162 of the annular member 150. For example, the third gas source 204 is pressurized to supply the gas 202. Further, for example, the same gas may be supplied by another gas supply system 200.

  In one embodiment, system 10 also includes a gas detector 270. The gas detector 270 includes a gas detection head 272. The gas detection head 270 is located in the micro chamber 70. The gas detector 270 is configured to detect the presence of a reactive gas (eg, oxygen). The system 10 is designed to substantially prevent reactive gases from entering the micro chamber 70 from the ambient environment 8.

  For example, the control unit 300 includes a digital / analog (D / A) converter 304. The D / A converter 304 is electrically connected to a microprocessor control device (microcontrol device) 310. The D / A converter 304 is electrically connected to the flow control device 210 of the system 10. The microcontroller 310 is also electrically connected to the gas detector 270 and receives a gas detection signal SG. The gas detection signal SG indicates one or more gases 202 detected by the gas detector 270.

  In one embodiment, the lid member 20 includes one or more coolant flow paths 256. One or more coolant channels 256 are fluidly connected to the coolant supply system 250. The one or more coolant channels 256 are configured to cool the lid member 20 by circulating the coolant 252 through the lid member 20. The annular member 150 and the cooler 90 include a plurality of coolant flow paths 256. The plurality of coolant flow paths 256 are fluidly connected to each coolant supply system 250. The plurality of coolant flow paths 256 support the flow of the coolant 252 that passes through the annular member 150 and the cooler 90.

  When the system 10 is activated, the microcontroller 310 starts flowing gas 202 from each gas supply system 200 to the microchamber 70 and the microchamber peripheral gap G3. In one example, this is accomplished by the microcontroller 310 sending a first digital control signal S1D to the D / A converter 304. The D / A converter 304 converts the first digital control signal S1D into the first analog control signal S1A. The first analog control signal S1A is transmitted to the first and second flow control devices 210. The first and second flow control devices 210 adjust the flow rate of the gas 202 flowing from the first and second gas supply systems 200 to the micro chamber 70. As a result, the micro chamber 70 is filled with the gas 202. The gas detector 270 is used to confirm that the atmosphere in the micro chamber 70 is composed of the gas 202 and is substantially free of undesirable reactive gases such as oxygen.

  On the other hand, the microcontroller 310 transmits the second digital control signal S2D to the D / A converter 304. Then, the D / A converter 304 converts the second digital control signal S2D into a second analog control signal S2A. The second analog control signal S2A is transmitted to the third flow control device 210. The third flow control device 210 is pneumatically connected to the annular member 150. Accordingly, the flow rate of the gas 202 flowing from the corresponding gas source 204 to the micro flow path 162 and flowing out from the opening 164 of the annular member 150 is adjusted. The gas 202 flowing out from the opening 164 flows into the microchamber peripheral gap G3. Most of the gas 202 flowing out of the opening 164 and flowing into the microchamber peripheral gap G3 flows out of the macro chamber 70 and overflows into the gas curtain region 158. Thereby, as shown in FIGS. 5A to 5C, a gas curtain 202C is formed.

Here, the range of the width W _G3 of the microchamber peripheral gap G3 is larger than the width of the air bearing gap of the conventional microchamber as disclosed in the aforementioned US Pat. No. 5,997,963. Much wider. The width of the air bearing gap is about 5 microns. As described above, the air bearing of the '963 patent supports the lid member 20 in a considerably close state by canceling the force caused by the air pressure and the force caused by the reduced pressure. The air bearing gap is effective in isolating the micro chamber from the surrounding environment, but its main function is to form a slide gap using air pressure. The air bearing gap is formed by balancing the pneumatic force and the decompression force. Usually, the gap is very narrow and can be made even smaller to account for surface defects and pressure frustration.

Microchamber magnitude near the gap G3 (width) W _G3 is determined by the mechanical clearance of the annular member 150 and the cover member 20. Microchamber magnitude near the gap G3 (width) W _G3 is much wider than the air bearing gap, for example, is about 100 times that of air bearing gap. Further, the microchamber peripheral gap G3 does not substantially depend on a change in smoothness of the lid member 20 or a surface defect. This is because the change in smoothness or surface defects is only a small part of the width W _G3 of the microchamber peripheral gap G3.

  Air bearings therefore require a pair of opposing surfaces that are extremely smooth and uniform to avoid surface contact and mutual damage. When a macrochamber with an air bearing is exposed to a significant amount of heat or a strong temperature gradient, the opposing surfaces of the air bearing can no longer maintain the smoothness required for thermal deformation.

  On the other hand, in one embodiment, the microcontroller 310 starts flowing the coolant 252 through the lid member 20 and the cooler 90 by operating two fluid supply systems 250 that are fluidly connected. Such operation is achieved by using the third and fourth digital signals S3D and S4D. If necessary, these digital signals may be transmitted to the D / A converter 304 to be analog signals.

  In one embodiment, a depressurization system 260 is used to depressurize the interior of the microchamber 70, and the gas 202 flows through the microchamber peripheral gap G3. When the pressure in the micro chamber 70 is reduced, a part of the gas 202 is drawn into the micro chamber 70. This eliminates the need for gas 202 to flow from different gas supply systems 200 to microchamber 70.

  When the flow of the gas 202 to the micro chamber 70 and the micro chamber peripheral gap G3 is established, and the circulation of the coolant 252 in the lid member 20 and the cooler 90 is established, the holding device 126 is activated by the control signal S5D. As a result, the movable stage 120 moves. The first and second laser beams 40A and 40B pass through the corresponding optical access function units 30A and 30B. Then, the first and second laser beams 40A and 40B scan on the surface 52 of the substrate 50 by moving the substrate 50 with respect to the first and second laser beams 40A and 40B. 5A-5C are schematic side views of the system 10 showing the movement of the movable stage assembly 128 relative to the lid member. The movement is indicated by an arrow AR.

  The movable stage assembly 128 and the substrate 50 supported on the chuck 60 move in the front-rear direction with respect to the lid member 20. Therefore, the gas 202 flows from the opening 164 into the microchamber peripheral gap G3 and flows out from the microchamber 70. The flow of the gas 202 becomes turbulent when the gas flows out of the microchamber peripheral gap G3 and flows into the gas curtain region 158. In the gas curtain region 158, the gas 202 forms the gas curtain 202C. The gas curtain 202 </ b> C prevents the entry of the reactive gas or the plurality of reactive gases in the surrounding environment 8. On the other hand, some of the gas 202 in the microchamber 70 flows into the gaps G1, G2. Note that the gaps G1 and G2 communicate with the surrounding environment 8 by one or more gas flow paths 104 shown as being pneumatically connected to the annular gap G2, as schematically shown. .

FIG. 5A shows the movable stage assembly 128 at position P1. The movable stage assembly 128 has moved in the −X direction. At this time, the laser beams 40 </ b> A and 40 </ b> B are incident near the left edge of the upper surface 52 of the substrate 50. FIG. 5B shows the movable stage assembly 128 at position P2. Position P2 is approximately the center of the scan. The movable stage assembly 128 is still moving in the −X direction. At this time, the laser beams 40 </ b> A and 40 </ b> B are incident on the upper surface 52 of the substrate 50 at approximately the center of the substrate 50. FIG. 5C shows the movable stage assembly 128 at position P3. The position P3 is the end of scanning. Here, the movable stage assembly 128, when moving in the opposite direction (i.e. in the + X direction), or deceleration, or stop, or accelerated to the maximum speed V _M. This process is also repeated at opposite positions.

The movable stage 120 is configured to move the chuck 60 in the Y direction, for example. For this reason, the laser beams 40A and 40B can scan the unscanned portion of the substrate 50 in advance. Movable stage assembly 128 is moved back and forth, or to accelerate or decelerate at the end position P1, P3, in addition arbitrary scanning, reaches a maximum speed V _M of the foregoing.

The ability of the system 10 to form the gas curtain 202C is a function of the maximum velocity V _M of the movable stage 128, the velocity V _{G of the} gas 202 exiting the opening 164, and the width W _G3 of the microchamber peripheral gap G3. The gas curtain 202 </ b> C prevents one or more reactive gases in the surrounding environment 8 from entering the micro chamber 70. FIG. 6 is a plot of gas velocity V _G (m / s) against gas flow rate (standard liters per minute or SLM) at different widths W _G3, ie 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm and 1 mm. It is. The maximum speed V _M (m / s) of movable stage assembly 128 is plotted as a dashed line at 0.5 m / s.

For one or more reactive gases present in the ambient environment 8 is prevented from entering the microchamber 70, the gas velocity V _G should be higher than the maximum speed V _M of the movable stage assembly 128 . Plot of Figure 6, at the maximum speed _{V M} of 0.5 m / s, is not able to be made longer than about 0.6mm width _{W G3} of peripheral microchamber gap G3.

  The mass of gas 202 is significantly less than the mass of the transfer mechanism included in system 10. For this reason, the inertial effect due to acceleration / deceleration is negligible, and no significant difference is observed in the gas flow pattern when the system 10 is started and stopped.

  FIG. 7 is a schematic diagram of the system 10 as in FIG. This figure is the same as FIG. 3 except that instead of the optical access function parts 30A, 30B being defined by the first and second openings, the lid member 20 has a single opening sealed by the window part 32. is there. The window part 32 is substantially transmissive at the light wavelengths of the laser beams 40A and 40B. The window 32 is made of, for example, quartz glass. When the lid member 20 is cooled, the window 32 is also cooled. The lid member 20 may include, for example, different types of optical access function units 30, for example, one opening and one window 32.

  The window 32 of the system 10 in FIG. 7 is designed to be suitable for low laser power applications and has the advantage of highly protecting the substrate 50 and reducing gas consumption. The window 32 that limits the amount of gas 202 that can leak from the micro chamber 70 and flow into the surrounding environment 8 is also beneficial for applications where the gas 202 introduced into the macro chamber 70 is harmful to the human body. .

It will be apparent to those skilled in the art that various modifications may be made to the preferred embodiment of the disclosure described herein without departing from the spirit and scope of the disclosure as set forth in the appended claims. be able to. Accordingly, this disclosure includes modifications and variations of this disclosure within the scope of the appended claims and their equivalents.

Claims (40)

A micro chamber system for manufacturing a substrate using at least one laser beam without exposure to a reactive gas from the surrounding environment,
A fixed lid member having at least one optical access function unit;
A stage assembly for supporting the substrate;
And at least one gas supply system pneumatically connected to the stage assembly;
The stage assembly has an outer peripheral surface, is disposed with respect to the fixed lid member, defines a micro chamber and a micro chamber peripheral gap, and is movable with respect to the fixed lid member;
The micro chamber includes a gas containing a selected amount of the reactive gas or a gas substantially free of the reactive gas,
The stage assembly supports the flow of the gas flowing from the at least one gas supply system into the microchamber peripheral gap so that the at least one laser beam scans on the substrate. Is configured to form a gas curtain near the outer peripheral surface of the stage assembly when moving relative to the fixed lid member ,
Gas curtain microchamber system wherein the reactive gas before Symbol ambient environment is substantially prevented from entering the microchamber. The micro chamber system according to claim 1, wherein the at least one optical access function part includes at least one of an opening and a window part. 3. The micro chamber system according to claim 1, wherein the at least one optical access function unit is configured to pass the at least one laser beam through the fixed lid member and hit the substrate. 4. The micro chamber system according to claim 1, wherein the gas is selected from a gas group consisting of nitrogen, argon, helium and neon. The micro chamber system according to claim 1, wherein the reactive gas is oxygen. The micro chamber system according to claim 1, wherein the at least one gas supply system supplies the gas to the micro chamber. The microchamber system according to claim 1, wherein the stage assembly includes a cooling chuck assembly. The micro chamber system according to claim 7, wherein the fixed lid member is cooled. The stage assembly includes an annular member,
The annular member partially defines a gap around the micro chamber;
The annular member includes a plurality of openings,
The microchamber system according to any one of claims 1 to 8, wherein the plurality of openings support the flow of the gas flowing into the microchamber peripheral gap from the at least one gas supply system.   The stage assembly includes an annular member,
  The annular member partially defines a gap around the micro chamber;
  The annular member includes a plurality of openings and a flow path,
  The plurality of openings are respectively disposed along the outer edge of the annular member,
  The plurality of openings are respectively connected to flow paths passing through the inside of the annular member,
  The gas supplied from the gas supply system flows into the microchamber peripheral gap from each of the openings through the flow path.
  The micro chamber system according to any one of claims 1 to 8. The micro chamber system according to any one of claims 1 to 10 , wherein the micro chamber peripheral gap has a width in a range of 0.01 mm to 2 mm. The micro chamber system according to claim 11 , wherein the gap around the micro chamber has a width in a range of 0.1 mm to 1 mm. The stage assembly has a maximum speed V _M with respect to the fixed cover member,
The gas flowing into the peripheral microchamber gap has a gas velocity V _G,
Microchamber system V _G is according to any one of claims 1 greater than V _M 12 of. The substrate is applied to the reactive gas existing in the ambient environment outside the microchamber defined by the fixed lid member, and a movable stage assembly having an annular member and an outer peripheral surface defining the microchamber peripheral gap together with the fixed lid member. A method of manufacturing the substrate using at least one laser beam without exposure,
Supporting the substrate on the movable stage assembly in the microchamber;
Introducing a first gas into the micro chamber;
Introducing a second gas into the microchamber peripheral gap through the annular member ;
The movable stage assembly is moved with respect to the fixed lid member so that the at least one laser beam scans on the substrate, and a gas curtain is formed near the outer peripheral surface of the movable stage assembly by the second gas. And forming a process,
The first gas is substantially free of the reactive gas or includes a selected amount of the reactive gas;
The gas curtain prevents the reactive gas in the surrounding environment from flowing into the micro chamber during the movement of the movable stage assembly. The method of claim 14 , wherein the first and second gases are the same gas. The method of claim 14 or 15 further comprising the step of manufacturing the substrate with at least one of said at least one laser beam through the optical access function unit entering the microchamber of the fixed cover member from the surrounding environment . The method of claim 16 , wherein the at least one laser beam includes at least one annealing laser beam. The method of claim 16 or 17 , wherein the at least one laser beam reacts with the selected amount of reactive gas in the microchamber to modify the substrate. 19. A method according to any of claims 16 to 18 , wherein the at least one optical access function includes at least one of an opening and a window. The movable stage assembly has a maximum speed V _M with respect to the fixed cover member,
Further, the gas flowing into the peripheral microchamber gap was supplied at a gas velocity V _G,
V _G A method according to any one of claims 14 to 19, is set to be larger than the _{V M.} 21. A method according to any one of claims 14 to 20 , wherein the microchamber peripheral gap has a width in the range of 0.01 mm to 2 mm. The method of claim 21 , wherein the microchamber peripheral gap has a width in the range of 0.1 mm to 1 mm. The method according to any one of claims 14 to 22 , wherein the first and second gases are at least one gas selected from a gas group consisting of nitrogen, argon, helium and neon. The movable stage assembly includes a heating chuck,
The method according to any one of claims 14 to 23 , wherein the method further comprises a step of heating the substrate using the heating chuck. The method according to any one of claims 14 to 24 , further comprising cooling the movable stage assembly and the fixed lid member. The first gas present in the ambient environment using a first laser beam without exposing the substrate to a method for producing the substrate,
The substrate is supported on the movable stage assembly in a microchamber defined by a fixed lid member, and a movable stage assembly having an annular member and an outer peripheral surface defining a microchamber peripheral gap together with the fixed lid member. Process,
Depressurizing the inside of the micro chamber;
Introducing a second gas into the microchamber peripheral gap through the annular member ;
Introducing a third gas containing at least one reactive gas into the micro chamber;
The movable stage assembly is moved with respect to the fixed lid member so that the first laser beam scans on the substrate, and a gas curtain is formed in the vicinity of the outer peripheral surface of the movable stage assembly by the second gas. a step of causing,
The first laser beam is passed through the microchamber from the optical access function part of the fixed lid member, and the substrate is modified by irradiating the substrate and the reactive gas in the microchamber. Quality process and
With
The gas curtain prevents the first gas in the surrounding environment from flowing into the micro chamber.   27. The method of claim 26, wherein the third gas includes oxygen.   27. The method of claim 26, wherein the first gas includes oxygen and the third gas includes oxygen.   The second gas is at least one gas selected from the gas group consisting of nitrogen, argon, helium and neon.
29. A method according to any of claims 26 to 28.   The gap around the micro chamber has a width in the range of 0.01 mm to 2 mm.
30. A method according to any of claims 26 to 29.   The gap around the micro chamber has a width in the range of 0.1 mm to 1 mm.
The method of claim 30.   Passing a second laser beam from at least one light access function part of the fixed lid member to the micro chamber, irradiating the second laser beam to the substrate and the third gas in the micro chamber; The second laser beam further includes modifying the substrate by reacting with the third gas in the micro chamber.
32. A method according to any one of claims 26 to 31. In a microchamber defined by a fixed lid member, and a movable stage assembly having an annular member and an outer peripheral surface defining a microchamber peripheral gap together with the fixed lid member, the reactive first gas in the microchamber A method of manufacturing a substrate using at least one laser beam without changing a selection amount,
  The microchamber is present in an ambient environment containing a reactive first gas;
  Supporting the substrate on the movable stage assembly in the microchamber;
  Introducing a selected amount of the reactive first gas into the microchamber;
  Introducing a second gas into the microchamber peripheral gap through the annular member;
  The movable stage assembly is moved with respect to the fixed lid member so that the at least one laser beam scans on the substrate, whereby the second gas brings the movable stage assembly near the outer peripheral surface of the movable stage assembly. A process of forming a gas curtain;
With
  The gas curtain prevents the reactive first gas in the surrounding environment from flowing into the micro chamber and changing a selection amount of the reactive first gas introduced into the micro chamber.
Method.   34. The method of claim 33, wherein the reactive first gas comprises oxygen.   35. A method according to claim 33 or 34, wherein the second gas comprises at least one inert gas.   The gap around the micro chamber has a width in the range of 0.01 mm to 2 mm.
36. A method according to any one of claims 33 to 35.   The gap around the micro chamber has a width in the range of 0.1 mm to 1 mm.
37. A method according to claim 36.   The at least one laser beam is passed through the micro chamber from at least one light access function part of the fixed lid member, and the reactive first gas in the substrate and the micro chamber is irradiated with the laser beam. The method further includes a step of modifying the substrate.
38. A method according to any of claims 33 to 37.   The movable stage assembly has a maximum speed V with respect to the fixed lid member. _M Have
  The second gas introduced into the microchamber peripheral gap is gas velocity V _G Supply in
  V _G Is V _M Set to be larger than
39. A method according to any one of claims 33 to 38.   The annular member includes a plurality of openings and a flow path,
  The plurality of openings are respectively disposed along the outer edge of the annular member,
  The plurality of openings are respectively connected to flow paths passing through the inside of the annular member,
  The second gas flows through the flow path from each of the openings into the microchamber peripheral gap.
  40. A method according to any of claims 14 to 39.

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