JP5967390B2 - 液浸露光装置及び液浸露光方法、並びにデバイス製造方法 - Google Patents
液浸露光装置及び液浸露光方法、並びにデバイス製造方法 Download PDFInfo
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
- G01D18/002—Automatic recalibration
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- G—PHYSICS
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
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- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/266—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light by interferometric means
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
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- G—PHYSICS
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
- G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
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- Environmental & Geological Engineering (AREA)
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- Health & Medical Sciences (AREA)
- Data Mining & Analysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control Of Position Or Direction (AREA)
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Description
ΔL2≒ΔYo×cosθ+ΔZo×sinθ …(2)
従って、式(1)、(2)からΔZo及びΔYoは次式(3)、(4)で求められる。
ΔYo=(ΔL1+ΔL2)/2cosθ …(4)
Δθy=(ΔZoL−ΔZoR)/D …(6)
従って、主制御装置20は、上記式(1)〜式(6)を用いることで、Z干渉計43A、43Bの計測結果に基づいて、ウエハステージWSTの4自由度の変位ΔZo、ΔYo、Δθz、Δθyを算出することができる。
Sc=(e3−e2)/(i3−i2)
そして、主制御装置20は、算出された補正マップの傾斜成分を、低次成分の補正マップ中の傾斜成分に置き換え、その置き換え後の低次成分の補正マップと、補正マップとして持っている高次成分とに基づいて、低次成分及び高次成分を補正するための新たな補正マップを作成する。
Claims (20)
- 照明光でマスクを照明する照明光学系と、前記照明されたマスクのパターン像を基板上に投影する投影光学系と、を有し、前記投影光学系と液体とを介して前記照明光で前記基板を露光する液浸露光装置であって、
前記投影光学系を囲んで設けられ、前記液体を供給するノズル部材と、
前記投影光学系の上方に配置され、前記マスクを保持する第1移動体と、前記第1移動体を駆動する第1電磁モータと、を有する第1ステージシステムと、
前記マスクのマーク又は前記第1移動体のマークを検出する第1検出系と、
前記投影光学系の光軸と直交する所定面と実質的に平行に配置され、反射型格子を有する第1格子部に対して、それぞれ第1計測ビームを照射する複数の第1ヘッドを有し、前記第1電磁モータによって移動される前記第1移動体の位置情報を計測する第1エンコーダシステムと、
前記投影光学系の下方に配置され、前記基板を保持する第2移動体と、前記第2移動体を駆動する第2電磁モータとを有する第2ステージシステムと、
前記基板のマーク又は前記第2移動体のマークを検出する第2検出系と、
前記所定面と実質的に平行に配置され、反射型格子を有する第2格子部に対して、それぞれ第2計測ビームを照射する複数の第2ヘッドを有し、前記第2電磁モータによって移動される前記第2移動体の位置情報を計測する第2エンコーダシステムと、
前記基板の露光動作において、前記照明光に対して前記マスクと前記基板とをそれぞれ相対移動するために、前記第1エンコーダシステムの計測情報に基づいて前記第1電磁モータによる前記第1移動体の駆動を制御するとともに、前記第2エンコーダシステムの計測情報に基づいて前記第2電磁モータによる前記第2移動体の駆動を制御する制御システムと、を備え、
前記露光動作と、前記第1検出系による前記マークの検出動作とでそれぞれ、前記第1エンコーダシステムによって前記第1移動体の位置情報が計測され、
前記露光動作と、前記第2検出系による前記マークの検出動作とでそれぞれ、前記第2エンコーダシステムによって前記第2移動体の位置情報が計測され、
前記複数の第2ヘッドのうち前記第2格子部と対向する3つ又は4つの第2ヘッドによって前記第2移動体の位置情報が計測されるとともに、前記第2移動体の移動によって、前記第2格子部と対向する第2ヘッドが、前記3つの第2ヘッドと前記4つの第2ヘッドとの一方から他方に変化する液浸露光装置。 - 請求項1に記載の液浸露光装置において、
前記第1移動体に保持されるマスクの交換動作において、前記第1エンコーダシステムによって前記第1移動体の位置情報が計測される液浸露光装置。 - 請求項1又は2に記載の液浸露光装置において、
前記第2移動体に保持される基板の交換動作において、前記第2エンコーダシステムによって前記第2移動体の位置情報が計測される液浸露光装置。 - 請求項1〜3のいずれか一項に記載の液浸露光装置において、
前記制御システムは、前記第2格子部と前記第2ヘッドとの少なくとも一方に起因して生じる前記第2エンコーダシステムの計測誤差を補償しつつ前記第2移動体の駆動を制御する液浸露光装置。 - 請求項4に記載の液浸露光装置において、
前記制御システムは、前記第2格子部に形成される格子のピッチと変形との少なくとも一方に関する補正情報を用いて前記第2移動体の駆動を制御する液浸露光装置。 - 請求項4又は5に記載の液浸露光装置において、
前記制御システムは、前記第2ヘッドの倒れと光学特性との少なくとも一方に関する補正情報を用いて前記第2移動体の駆動を制御する液浸露光装置。 - 請求項1〜6のいずれか一項に記載の液浸露光装置において、
前記第2ステージシステムは、それぞれ基板を保持する、前記第2移動体を含む複数の第2移動体を有し、
前記第2エンコーダシステムはその一部が前記第2検出系の周囲に配置されるとともに、前記複数の第2移動体の位置情報を計測する液浸露光装置。 - 請求項1〜7のいずれか一項に記載の液浸露光装置において、
前記第2格子部は、それぞれ格子が形成される複数のスケールを含み、
前記複数の第2ヘッドのうち前記複数のスケールにそれぞれ対向する第2ヘッドによって前記第2移動体の位置情報が計測される液浸露光装置。 - 請求項8に記載の液浸露光装置において、
前記第2格子部は、前記スケールを4つ含み、
前記4つのスケールの少なくとも3つとそれぞれ対向する第2ヘッドによって前記第2移動体の位置情報が計測される液浸露光装置。 - 照明光でマスクを照明するとともに、投影光学系と液体とを介して前記照明光で基板を露光する液浸露光方法であって、
前記投影光学系を囲んで設けられるノズル部材によって、前記投影光学系と前記基板との間に前記液体を供給することと、
前記投影光学系の上方に配置され、前記マスクを保持する第1移動体と、前記第1移動体を駆動する第1電磁モータと、を有する第1ステージシステムによって、前記マスクのマーク又は前記第1移動体のマークが第1検出系で検出されるように前記第1移動体を移動することと、
前記投影光学系の光軸と直交する所定面と実質的に平行に配置され、反射型格子を有する第1格子部に対して、それぞれ第1計測ビームを照射する複数の第1ヘッドを有する第1エンコーダシステムによって、前記第1電磁モータで駆動される前記第1移動体の位置情報を計測することと、
前記投影光学系の下方に配置され、前記基板を保持する第2移動体と、前記第2移動体を駆動する第2電磁モータとを有する第2ステージシステムによって、前記基板のマーク又は前記第2移動体のマークが第2検出系で検出されるように前記第2移動体を移動することと、
前記所定面と実質的に平行に配置され、反射型格子を有する第2格子部に対して、それぞれ第2計測ビームを照射する複数の第2ヘッドを有する第2エンコーダシステムによって、前記第2電磁モータで駆動される前記第2移動体の位置情報を計測することと、
前記基板の露光動作において、前記照明光に対して前記マスクと前記基板とをそれぞれ相対移動するために、前記第1エンコーダシステムの計測情報に基づいて前記第1電磁モータによる前記第1移動体の駆動を制御するとともに、前記第2エンコーダシステムの計測情報に基づいて前記第2電磁モータによる前記第2移動体の駆動を制御することと、を含み、
前記露光動作と、前記第1検出系による前記マークの検出動作とでそれぞれ、前記第1エンコーダシステムによって前記第1移動体の位置情報が計測され、
前記露光動作と、前記第2検出系による前記マークの検出動作とでそれぞれ、前記第2エンコーダシステムによって前記第2移動体の位置情報が計測され、
前記複数の第2ヘッドのうち前記第2格子部と対向する3つ又は4つの第2ヘッドによって前記第2移動体の位置情報が計測されるとともに、前記第2移動体の移動によって、前記第2格子部と対向する第2ヘッドが、前記3つの第2ヘッドと前記4つの第2ヘッドとの一方から他方に変化する液浸露光方法。 - 請求項10に記載の液浸露光方法において、
前記第1移動体に保持されるマスクの交換動作において、前記第1エンコーダシステムによって前記第1移動体の位置情報が計測される液浸露光方法。 - 請求項10又は11に記載の液浸露光方法において、
前記第2移動体に保持される基板の交換動作において、前記第2エンコーダシステムによって前記第2移動体の位置情報が計測される液浸露光方法。 - 請求項10〜12のいずれか一項に記載の液浸露光方法において、
前記第2格子部と前記第2ヘッドとの少なくとも一方に起因して生じる前記第2エンコーダシステムの計測誤差が補償されつつ前記第2移動体の駆動が制御される液浸露光方法。 - 請求項13に記載の液浸露光方法において、
前記第2格子部に形成される格子のピッチと変形との少なくとも一方に関する補正情報を用いて前記第2移動体の駆動が制御される液浸露光方法。 - 請求項13又は14に記載の液浸露光方法において、
前記第2ヘッドの倒れと光学特性との少なくとも一方に関する補正情報を用いて前記第2移動体の駆動が制御される液浸露光方法。 - 請求項10〜15のいずれか一項に記載の液浸露光方法において、
前記第2移動体を含む複数の第2移動体によってそれぞれ基板が保持されるとともに、前記第2検出系の周囲に一部が配置される前記第2エンコーダシステムによって、前記複数の第2移動体の位置情報が計測される液浸露光方法。 - 請求項10〜16のいずれか一項に記載の液浸露光方法において、
前記第2格子部は、それぞれ格子が形成される複数のスケールを含み、
前記複数の第2ヘッドのうち前記複数のスケールにそれぞれ対向する第2ヘッドによって前記第2移動体の位置情報が計測される液浸露光方法。 - 請求項17に記載の液浸露光方法において、
前記第2格子部は、前記スケールを4つ含み、
前記4つのスケールの少なくとも3つとそれぞれ対向する第2ヘッドによって前記第2移動体の位置情報が計測される液浸露光方法。 - デバイス製造方法であって、
請求項1〜9のいずれか一項に記載の液浸露光装置を用いて基板にパターンを転写するリソグラフィ工程を含むデバイス製造方法。 - デバイス製造方法であって、
請求項10〜18のいずれか一項に記載の液浸露光方法を用いて基板にパターンを転写するリソグラフィ工程を含むデバイス製造方法。
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018013806A (ja) * | 2006-01-19 | 2018-01-25 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
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