JP5972032B2 - Polishing tool for high-efficiency precision machining and its manufacturing method - Google Patents
Polishing tool for high-efficiency precision machining and its manufacturing method Download PDFInfo
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- JP5972032B2 JP5972032B2 JP2012104966A JP2012104966A JP5972032B2 JP 5972032 B2 JP5972032 B2 JP 5972032B2 JP 2012104966 A JP2012104966 A JP 2012104966A JP 2012104966 A JP2012104966 A JP 2012104966A JP 5972032 B2 JP5972032 B2 JP 5972032B2
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- 238000005498 polishing Methods 0.000 title claims description 120
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000003754 machining Methods 0.000 title description 2
- 239000006061 abrasive grain Substances 0.000 claims description 234
- 239000000463 material Substances 0.000 claims description 81
- 239000002245 particle Substances 0.000 claims description 17
- 239000010432 diamond Substances 0.000 claims description 16
- 229910003460 diamond Inorganic materials 0.000 claims description 16
- 230000004308 accommodation Effects 0.000 claims description 14
- 239000013078 crystal Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 229910052582 BN Inorganic materials 0.000 claims description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 claims description 2
- 230000003405 preventing effect Effects 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000003750 conditioning effect Effects 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- -1 hard disks Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本発明は、ＣＭＰパッドのコンディショニング、ガラス等、硬くかつ脆性の材料の表面研磨、半導体材料の表面研磨などの広い用途に用いることのできる研磨工具およびその製法に関する。 The present invention relates to a polishing tool that can be used in a wide range of applications such as surface conditioning of CMP pad conditioning, hard and brittle materials such as glass, and semiconductor material, and a method for producing the same.
ダイヤモンドや立方晶窒化硼素、その他の硬質材を砥粒として使用する研磨工具は古くから知られ、各種構成のものが研磨装置に使用されてきている。これらの工具において、砥粒は個々の粒子をロウ付けや電着等により工具基板に固着して使用する単粒構成のもの、及び特に微細な砥粒粒子の集合体を焼結工程等により一体化して使用する焼結体構成のものが知られている。
単粒構成の工具においては一般に、使用する砥粒粒度乃至砥粒寸法と時間当たりの研磨効率は相反し、微小な粒子を使用する精密研磨工程では研磨効率が低く、一方、粗い粒子を使用する研磨工程においては研磨効率は高いが加工面は粗くなる傾向にある。従って高い研磨面精度を高い研磨効率で達成することは困難であった。
この一因は微小粒子においては、小さな砥粒エッジ高さに加えて工具基板への固着強度が充分でないために大きな負荷の下による研磨が行えないこと、粗い粒子による研磨では固着強度が大きく大きな負荷に耐えるものの、砥粒エッジが大きいため、加工面粗さが大きくなることによる。
高い研磨効率と研磨面精度が同時に達成できる工具が望まれていたが、このような目的を同時に達成できるような工具は知られていなかった。
Polishing tools that use diamond, cubic boron nitride, and other hard materials as abrasive grains have been known for a long time, and various configurations have been used in polishing apparatuses. In these tools, the abrasive grains are of a single grain structure in which individual grains are fixed to a tool substrate by brazing or electrodeposition, and particularly an aggregate of fine abrasive grains is integrated by a sintering process or the like. The thing of the sintered compact structure used after forming is known.
In a single-grain tool, the abrasive grain size or grain size to be used and the polishing efficiency per hour are contrary to each other. In the precision polishing process using fine particles, the polishing efficiency is low, while coarse particles are used. In the polishing process, the polishing efficiency is high, but the processed surface tends to be rough. Therefore, it has been difficult to achieve high polishing surface accuracy with high polishing efficiency.
This is due to the fact that fine particles cannot be polished under a large load because of their small edge height in addition to the small abrasive grain edge height. Although it can withstand the load, the abrasive grain edge is large, so that the processed surface roughness increases.
A tool that can simultaneously achieve high polishing efficiency and polished surface accuracy has been desired, but a tool that can simultaneously achieve such an object has not been known.
ＣＭＰパッドの仕上げおよび調整のための工具として、特許文献１に、ダイヤモンドまたは立方晶窒化硼素等の砥粒(研磨材粒子)が、一様なサイズの穴を有するテンプレートを使用することにより、粒子寸法の揃った砥粒が研磨工具基板に鑞付けにより固着された研磨工具構成が開示されている。 By using a template in which abrasive grains (abrasive particles) such as diamond or cubic boron nitride have uniform size holes as a tool for finishing and adjusting a CMP pad, A polishing tool configuration is disclosed in which abrasive grains of uniform dimensions are fixed to a polishing tool substrate by brazing.
特許文献２には、ＣＭＰパッドコンディショナーであって、ダイヤモンド砥粒群が環状の研磨工具表面に、接着剤で固定されているものが開示されている。 Patent Document 2 discloses a CMP pad conditioner in which diamond abrasive grains are fixed to an annular polishing tool surface with an adhesive.
特許文献３には、ＣＭＰパッドコンディショナーであって、ダイヤモンド砥粒が金属めっき層によりコンディショナー面に固着されたものが開示されている。このコンディショナーは、概略正八面体形状を有するダイヤモンド砥粒をハンドセットによりめっきをして仮固定したのち、無電解めっき、ストライクめっき、さらにスルファミン酸Ｎｉメッキにより、砥粒を固着するものである。 Patent Document 3 discloses a CMP pad conditioner in which diamond abrasive grains are fixed to a conditioner surface by a metal plating layer. In this conditioner, diamond abrasive grains having an approximately regular octahedral shape are plated and temporarily fixed by a handset, and thereafter, the abrasive grains are fixed by electroless plating, strike plating, and further Ni plating sulfamate.
特許文献４には、Ｎｉ層上にダイヤモンド砥粒を配置し、下地めっき層および埋め込みめっき層により砥粒を固着する、ＣＭＰコンディショナーが開示されている。 Patent Document 4 discloses a CMP conditioner in which diamond abrasive grains are arranged on a Ni layer, and the abrasive grains are fixed by a base plating layer and an embedded plating layer.
上記のＣＭＰパッドコンディショナーや、高精度の加工面形成に用いられるその他の精密研磨工具における工具面からの砥粒の脱落や欠けは、単に工具の加工効率の低下や寿命の短縮に留まらず、脱落砥粒又は砥粒の破片は加工面に損傷を生じて深刻な結果をもたらし得るので、砥粒の脱落には万全の注意が払われなければならない。 The removal or chipping of abrasive grains from the tool surface in the above CMP pad conditioner or other precision polishing tools used to form a high-precision machined surface is not limited to a reduction in tool machining efficiency or shortening the service life. Because abrasive grains or abrasive fragments can cause damage to the work surface and have serious consequences, great care must be taken in removing the abrasive grains.
一方、ＣＭＰパッドコンディショナーの性能において、研磨効率及び研磨面粗さは重要な項目であるが、これらの特性において砥粒の研磨に寄与する部分(実効寸法)が細かく一様であることも重要なファクターと考えられる。しかし砥粒を工具基板に固着した工具において、砥粒寸法の細かいものは電着やロウ付けに利用可能な表面が小さく、充分な接合強度を確保することが困難である。この点において、実効寸法の小さな砥粒を脱落しないように工具基板に配置した工具の開発が望まれていた。 On the other hand, in the performance of the CMP pad conditioner, polishing efficiency and polished surface roughness are important items, but in these characteristics, it is also important that the portion (effective dimension) contributing to polishing of the abrasive grains is fine and uniform. It is considered a factor. However, in a tool in which abrasive grains are fixed to a tool substrate, those with fine abrasive grains have a small surface that can be used for electrodeposition and brazing, and it is difficult to ensure sufficient bonding strength. In this respect, it has been desired to develop a tool arranged on a tool substrate so that abrasive grains having a small effective dimension are not dropped off.
したがって本発明の課題は、ダイヤモンドや立方晶窒化硼素、立方晶窒化炭等の硬質砥粒が研磨工具の基体に脱落することのないように固着され、かつより精密な研磨を実現する研磨工具を提供することにある。
別の課題は、上記砥粒を、砥粒の位置管理、配向管理、エッジ突出量の管理が可能な態様で固着した研磨工具を提供することにある。
Therefore, an object of the present invention is to provide a polishing tool that is fixed so that hard abrasive grains such as diamond, cubic boron nitride, and cubic carbonitride do not fall off the base of the polishing tool, and realizes more precise polishing. It is to provide.
Another object is to provide a polishing tool in which the above-mentioned abrasive grains are fixed in a manner capable of managing the position, orientation management, and edge protrusion amount of the abrasive grains.
本発明者は、上記の課題を解決すべく鋭意検討を進める中で、砥粒の最大断面形よりも小さい開口を複数有する保持枠により砥粒を保持することによって、砥粒の脱落が発生しない研磨工具が得られることを見出し、さらに検討を進めた結果、本発明を完成した。 While the present inventor is diligently studying to solve the above problems, the abrasive grains are not dropped by holding the abrasive grains by a holding frame having a plurality of openings smaller than the maximum cross-sectional shape of the abrasive grains. As a result of finding that a polishing tool can be obtained and further studying it, the present invention has been completed.
すなわち本発明は、以下の研磨工具およびその製造方法に関する。
［１］ 工具基板面に、複数の砥粒を固定した研磨部を有する研磨工具であって、各砥粒が、砥粒の前面側を、工具基板面に沿って配置した、砥粒が脱落することのない大きさの、砥粒と少なくとも同数の開口を有する保持枠によって保持され、かつ前記保持枠の背面に画定される砥粒収容空間内に局限(confine)され、前記開口から各砥粒の一部が突き出し、突き出した部分が、保持枠の表面から限られた範囲の高さを有することを特徴とする研磨工具。
［２］ さらに、砥粒の背面側を、砥粒の背面に接触配置した保持枠よりも軟質な材質の第一の砥粒支持材によって保持されている、前記［１］に記載の研磨工具。
［３］ さらに、砥粒の背面側を、砥粒の背面に接触配置した保持枠よりも軟質な材質の第一の砥粒支持材によって保持されると共に、砥粒、保持枠ならびに砥粒支持材間の空間に、砥粒支持材と同等以上に軟質の第二の砥粒支持材が充填されている［２］に記載の研磨工具。
［４］ 前記第一の砥粒支持材及び第二の砥粒支持材が同一材質である前記［３］に記載の研磨工具。
［５］ 砥粒が、形状及び粒度を均質化された整粒された粒子である、前記［１］〜［４］のいずれか一項に記載の研磨工具。
［６］ 砥粒が、ダイヤモンド、立方晶窒化硼素または立方晶窒化炭素である、前記［１］〜［５］のいずれか一項に記載の研磨工具。
［７］ 砥粒の粒径が１００μｍ以上である、前記［６］に記載の研磨工具。
［８］ 砥粒の粒径が２００μｍ以上である、前記［７］に記載の研磨工具。
［９］ 砥粒保持枠が鋼材またはカーボンファイバー、砥粒支持材が有機系合成樹脂材である、前記［１］〜［８］のいずれか一項に記載の研磨工具。
［１０］ 有機系合成樹脂材がシリコンゴム又はエポキシ樹脂で構成される、前記［９］に記載の研磨工具。
That is, the present invention relates to the following polishing tool and a manufacturing method thereof.
[1] A polishing tool having a polishing part in which a plurality of abrasive grains are fixed on a tool substrate surface, each abrasive grain being arranged along the tool substrate surface with the front side of the abrasive grains being removed. Is held by a holding frame having at least the same number of openings as the abrasive grains, and is confined in an abrasive grain containing space defined on the back surface of the holding frame, and each abrasive is passed through the openings. A polishing tool, wherein a part of the grains protrudes, and the protruding part has a limited height from the surface of the holding frame.
[2] The polishing tool according to [1], wherein the back side of the abrasive grains is held by a first abrasive grain support material made of a softer material than the holding frame disposed in contact with the back side of the abrasive grains. .
[3] Further, the back side of the abrasive grains is held by the first abrasive grain support material made of a softer material than the holding frame placed in contact with the back side of the abrasive grains, and the abrasive grains, the holding frame, and the abrasive grain support The polishing tool according to [2], wherein a space between the materials is filled with a second abrasive support material that is softer than or equal to the abrasive support material.
[4] The polishing tool according to [3], wherein the first abrasive grain support material and the second abrasive grain support material are the same material.
[5] The polishing tool according to any one of [1] to [4], wherein the abrasive grains are sized particles having a uniform shape and particle size.
[6] The polishing tool according to any one of [1] to [5], wherein the abrasive grains are diamond, cubic boron nitride, or cubic carbon nitride.
[7] The polishing tool according to [6], wherein the grain size of the abrasive grains is 100 μm or more.
[8] The polishing tool according to [7], wherein the abrasive grain size is 200 μm or more.
[9] The polishing tool according to any one of [1] to [8], wherein the abrasive grain holding frame is a steel material or carbon fiber, and the abrasive grain support material is an organic synthetic resin material.
[10] The polishing tool according to [9], wherein the organic synthetic resin material is composed of silicon rubber or epoxy resin.
［１１］ 次の各工程を有する、研磨工具の製法：
（１）貫通孔を有する円板状の工具胴部を作製する段階、
（２）工具胴部の貫通孔に対応する形に分布した、同一形状の砥粒突出開口を複数設けた板状の保持枠を作成する段階、
（３）工具胴部と保持枠とを接合する段階、
（４）砥粒粒子を整粒して、砥粒突出開口を通過できない揃った寸法の砥粒を準備する段階、
（５）工具胴部と保持枠との接合体に、工具胴部側から整粒した砥粒を、砥粒突出開口１個には砥粒が１個だけ充填されるように挿入する段階、
（６）工具胴部の背面に工具本体基材である工具蓋を重ね、研磨工具として一体化する段階。
［１２］ 段階（５）に先立ち、保持枠の開口と等しい、またはより大きく、かつ該開口と整列した開口を有する砥粒保持具を保持枠に密着配置する、前記［１１］に記載の方法。
［１３］ 段階（５）に続いて、砥粒背面側に保持枠より軟質な砥粒支持材を、砥粒背面に接しておよび／または砥粒周囲に、充填することをさらに含む、前記［１１］または［１２］に記載の方法。
[11] A method for producing a polishing tool having the following steps:
(1) producing a disk-shaped tool body having a through hole;
(2) creating a plate-like holding frame provided with a plurality of identically shaped abrasive grain protruding openings, distributed in a shape corresponding to the through-holes of the tool body,
(3) joining the tool body and the holding frame;
(4) adjusting the size of the abrasive grains to prepare abrasive grains of uniform dimensions that cannot pass through the abrasive protrusion opening;
(5) Inserting the abrasive grains sized from the tool barrel side into the joined body of the tool barrel and the holding frame so that only one abrasive grain is filled in one abrasive protrusion opening;
(6) A step of superimposing a tool lid, which is a tool body base material, on the back of the tool body and integrating the tool lid as a polishing tool.
[12] The method according to [11] above, wherein, prior to step (5), an abrasive holder having an opening equal to or larger than the opening of the holding frame and having an opening aligned with the opening is closely attached to the holding frame. .
[13] Subsequent to the step (5), the method further includes filling an abrasive grain support material softer than the holding frame on the abrasive grain rear surface side in contact with and / or around the abrasive grain rear surface. [11] or [12].
なお、本願において、「前面」「背面」の用語により、円板状研磨工具の研磨面側か、その反対側かを表わし、研磨工具の研磨を行う面の側を「前」としその反対側を「背」と定義する。つまり、本発明の研磨工具の使用時には、「前面側」に被研磨対象が位置するのであり、その反対側が「背面側」である。従って、工具胴部の背面は、工具本体基材である工具蓋の前面と密着し、工具胴部の前面は、保持枠の背面に密着する。 In the present application, the terms “front surface” and “back surface” indicate whether the polishing surface side of the disc-shaped polishing tool or the opposite side, and the side of the surface on which the polishing tool is polished is defined as “front” and the opposite side. Is defined as “back”. That is, when the polishing tool of the present invention is used, the object to be polished is positioned on the “front side”, and the opposite side is the “back side”. Therefore, the back surface of the tool body is in close contact with the front surface of the tool lid, which is the tool body base material, and the front surface of the tool body is in close contact with the back surface of the holding frame.
本発明の研磨工具は、ダイヤモンドや立方晶窒化硼素等の粒子、特に好ましくは比較的大粒の粒子を砥粒として用い、前面の保持枠及び背面の可塑性保持材を効果的に配置構成することにより個々の砥粒が確実に保持され、かつ研磨効率が高く、また、砥粒の位置決めや突出部分の高さ、さらに砥粒の配向姿勢の調整が、個々の砥粒を、同一寸法、同一形状の砥粒突出開口を設けた保持枠で保持するという独特の構成の採用により実現可能となり、砥粒突出高さの設定調整が容易であるため研磨精度が高く、また、加工面粗さが小さいという効果がある。 The polishing tool of the present invention uses particles such as diamond and cubic boron nitride, particularly preferably relatively large particles as abrasive grains, and effectively arranges and configures a front holding frame and a back plastic holding material. Individual abrasive grains are securely held and the polishing efficiency is high. Also, the positioning of the abrasive grains, the height of the protruding parts, and the adjustment of the orientation of the abrasive grains can be adjusted to the same size and shape. It can be realized by adopting a unique configuration of holding with a holding frame provided with an abrasive grain protruding opening, and since the setting of the abrasive grain protruding height is easy to adjust, the polishing accuracy is high and the processing surface roughness is small There is an effect.
すなわち、砥粒を一部分のみ突き出させる開口を有する保持枠によって砥粒を保持し、かつ、開口の寸法と砥粒の形状寸法の相互作用によって、砥粒の突出高さが決定されるため、単に砥粒を電着や接着剤によって工具面に固着したり、めっき層に埋め込んで固着した場合と比較して、突出高さの設定が容易且つ正確となる。
例えば、結晶面が発達したダイヤモンドを砥粒に用いた場合、形状選別された砥粒は、保持枠の開口の形状寸法が同一であれば、ほぼ揃った突出高さをもって保持枠の開口に嵌りこむ。したがって、保持枠の寸法を予め設定することにより、砥粒突出高さの精密な調節が可能となる。結晶面がそれほど明確でなくても、保持枠開口の寸法形状に対応して、砥粒の最大突出高さが決まるため、開口寸法形状の設定及び適切なスペーサーの使用により、単に工具面に固着した場合と比較して、格段に正確に調節することが可能である。
砥粒の突出量はまた、砥粒が収容される空間の形状、寸法および該空間の壁との間に介在する物質の材質、寸法によっても決定される。
That is, the abrasive grains are held by a holding frame having an opening that protrudes only a part of the abrasive grains, and the protrusion height of the abrasive grains is determined by the interaction between the dimensions of the openings and the shape dimensions of the abrasive grains. Compared with the case where the abrasive grains are fixed to the tool surface by electrodeposition or an adhesive or embedded and fixed in the plating layer, the protrusion height can be set easily and accurately.
For example, when diamond with a crystallized surface is used for the abrasive grains, the shape-selected abrasive grains fit into the opening of the holding frame with a substantially uniform projection height if the shape dimensions of the opening of the holding frame are the same. Come on. Accordingly, by setting the dimensions of the holding frame in advance, it is possible to precisely adjust the abrasive grain protrusion height. Even if the crystal plane is not so clear, the maximum protrusion height of the abrasive grains is determined according to the size and shape of the opening of the holding frame, so it is simply fixed to the tool surface by setting the size and shape of the opening and using an appropriate spacer. Compared to the case, it is possible to adjust much more accurately.
The protruding amount of the abrasive grains is also determined by the shape and size of the space in which the abrasive grains are accommodated and the material and size of the substance interposed between the walls of the space.
本発明の研磨工具は、比較的大粒の例えばダイヤモンドの単結晶粒子を砥粒として用い、研磨工具に設けられた、保持具および保持枠と、研磨工具本体の基材である工具蓋とによって画定される、砥粒が１個だけ入った空間がアレイ状に整列して配置された砥粒収容部集合体である研磨部が、円板状の研磨工具の円板面上に複数個、一定幅の円周上に一定間隔で配置された構成を有している。 The polishing tool of the present invention uses relatively large grains of, for example, diamond single crystal particles as abrasive grains, and is defined by a holder and a holding frame provided on the polishing tool, and a tool lid that is a base material of the polishing tool body. A plurality of polishing parts, which are aggregates of abrasive grains containing a single abrasive grain array arranged in an array, are fixed on the disk surface of a disk-shaped polishing tool. It has the structure arrange | positioned at fixed intervals on the circumference of a width | variety.
研磨部は、円形の研磨工具の円周に沿って複数個設けられ、それぞれの研磨部は、扇形、長方形等、任意の平面形を有し、同形のものが複数円周上に並んでもよいし、異なった平面形状の研磨部が複数組配置されるようにしてもよい。 A plurality of polishing parts are provided along the circumference of a circular polishing tool, and each polishing part has an arbitrary planar shape such as a fan shape or a rectangle, and the same shape may be arranged on a plurality of circumferences. In addition, a plurality of sets of polishing parts having different planar shapes may be arranged.
研磨部に収容される砥粒の収容空間を画定し収容部の深さを確保する、研磨工具と同じ外形・寸法を有し、収容部深さに相当する厚みを有する、収容空間部分がくり抜かれた工具胴部と、研磨工具の本体をなす基板である工具蓋とが積み重ねられ、工具胴部の工具蓋則と反対側の面には、砥粒の脱落が起きない寸法の砥粒突出開口の列を研磨部に設けた保持枠が積層される。
開口の形状は説明を容易にするために矩形のものを図示しているが、本発明の開口はこの形状に限定されない。最も好ましいのは円形であるが、保持枠加工条件によって、六角形や八角形に形成することも可能である。
The housing space portion is cut with the same outer shape and dimensions as the polishing tool, which defines the accommodation space for the abrasive grains accommodated in the polishing portion and secures the depth of the accommodation portion, and has a thickness corresponding to the depth of the accommodation portion. The removed tool body and the tool lid, which is the substrate that forms the main body of the polishing tool, are stacked, and on the surface opposite to the tool lid rule of the tool body, the abrasive grains protruded so that no abrasive grains fall off. A holding frame having a row of openings provided in the polishing section is laminated.
The shape of the opening is rectangular for ease of explanation, but the opening of the present invention is not limited to this shape. The most preferable is a circular shape, but it may be formed in a hexagonal shape or an octagonal shape depending on the holding frame processing conditions.
この保持枠の、砥粒収容部側には、砥粒の位置決めをより確実にするための砥粒保持具の使用も可能である。砥粒保持具としては例えば保持枠の開口列と同一ピッチの開口列を有する板状、典型的には保持枠と等しい、またはより大きい開口列を有する網を用いることができ、これらは保持枠の内側に隣接して配置される。保持枠の突出開口列の作用のみでも、砥粒の位置決めは可能であるが、保持具の使用により、砥粒のがたつきが減少し、砥粒の位置、配向、突出高さの精度が向上する。 An abrasive holder can be used on the holding frame side of the holding frame in order to make the positioning of the abrasive more reliable. As the abrasive grain holder, for example, a plate having an opening row having the same pitch as the opening row of the holding frame, typically a net having an opening row equal to or larger than the holding frame, these can be used. It is arranged adjacent to the inside. Although it is possible to position the abrasive grains only by the action of the protruding opening row of the holding frame, the use of the holder reduces the wobbling of the abrasive grains, and the accuracy of the position, orientation, and protruding height of the abrasive grains is reduced. improves.
砥粒が収容される空間を画定する、保持枠に対向する面である工具蓋の底面と砥粒との間には、保持枠よりも軟質の第一の砥粒支持材が介在しており、工具蓋が砥粒支持材を背後から支持する。砥粒支持材はその軟質性によって砥粒のがたつきを吸収し、保持枠面に沿った、或いは垂直な砥粒の移動を抑制し、より確実な保持が達成される。また保持枠からの突出高さが他の砥粒よりも大きなが砥粒があっても、本発明においては背後の支持材により、これらの砥粒が過負荷を受けて後退することが許容されているので、突出高さが自動的に揃えられる機能を有する。
上記の観点から、第一の砥粒支持材の材質としては比較的硬質のゴム、シリコーン、ウレタン、エポキシなどの有機質材料、銅、スズなどの軟質金属材料が適している。砥粒が押し込まれる量は僅かであることから、支持材の厚さは用いられる砥粒の見掛け直径の1/3以下の厚さとするのが必要かつ十分で好適である。
工具への砥粒の保持をより強固にするために、砥粒収容空間の砥粒、保持枠ならびに砥粒支持材の間の空間には、第一の砥粒支持材と同等以上に軟質の軟質材を、第二の砥粒支持材として充填するのがより好ましい。材質としては作業性の観点から上記の有機質材料が適している。この場合には第一の砥粒支持材と第二の砥粒支持材とを一体成型することもできる。
A first abrasive grain support material softer than the holding frame is interposed between the bottom surface of the tool lid, which is a surface facing the holding frame, and defines the space in which the abrasive grains are accommodated, and the abrasive grains. The tool lid supports the abrasive grain support material from behind. The abrasive support material absorbs the rattling of the abrasive grains due to its softness and suppresses the movement of the abrasive grains along or perpendicular to the holding frame surface, thereby achieving more reliable holding. In addition, even if there is an abrasive grain with a protruding height from the holding frame that is larger than other abrasive grains, the backing material in the present invention allows these abrasive grains to retreat due to overload. Therefore, it has a function of automatically aligning the protruding height.
From the above viewpoint, as the material of the first abrasive grain support material, relatively hard rubber, organic materials such as silicone, urethane, and epoxy, and soft metal materials such as copper and tin are suitable. Since the amount of the abrasive grains to be pushed in is small, it is necessary, sufficient and preferable that the thickness of the support material is 1/3 or less of the apparent diameter of the abrasive grains used.
In order to strengthen the holding of the abrasive grains to the tool, the space between the abrasive grains, the holding frame and the abrasive grain support material in the abrasive grain accommodation space is softer than the first abrasive grain support material. More preferably, a soft material is filled as the second abrasive grain support material. From the viewpoint of workability, the above organic material is suitable as the material. In this case, the first abrasive grain support material and the second abrasive grain support material can be integrally formed.
本発明に利用可能な砥粒としては、とくに限定されないが、ダイヤモンド単結晶、立方晶窒化硼素結晶などの、結晶面が発達しているものが好ましい。一般的に突出高さ管理、結晶姿勢調整の点からは、結晶面が良く発達していると共に、粒子形状及び粒度管理(分級)精度の高いものほど好ましい。粒度については従来のドレッサーよりも粗い、広範囲の粒度が利用可能である。最適の粒度は用途によっても異なるが、ダイヤモンドの場合、作業性の点から１００μｍ以上、特に２００μｍ以上の粒子が好ましい。 The abrasive grains usable in the present invention are not particularly limited, but those having a crystal plane such as a diamond single crystal and a cubic boron nitride crystal are preferred. In general, from the viewpoint of protrusion height management and crystal orientation adjustment, it is preferable that the crystal plane is well developed and that the particle shape and particle size management (classification) accuracy is high. A wide range of particle sizes that are coarser than conventional dressers are available. The optimum particle size varies depending on the application, but in the case of diamond, particles of 100 μm or more, particularly 200 μm or more are preferable from the viewpoint of workability.
形状及び粒度で選別された砥粒であっても、ある程度の変動幅を有すること、また配置される向きによっても、砥粒断面の保持枠の開口に対する相対的な大きさが変動し得る。突出高さの変動を一定範囲に限定する場合に、砥粒配置時に保持枠の外方にスペーサーを用いるのが有効である。 Even if the abrasive grains are sorted by shape and grain size, the relative size of the abrasive grain cross-section with respect to the opening of the holding frame may vary depending on the degree of variation and the orientation of the abrasive grains. When the variation in the protruding height is limited to a certain range, it is effective to use a spacer outside the holding frame when the abrasive grains are arranged.
研磨部の砥粒突出開口列は、同一寸法同一形状のものが直線状、格子状等に配置され、収容される砥粒の寸法も、一組の通過篩及び保留篩等を用いての篩分け等により、一定の範囲のものを選択して使用する。開口の寸法は、収容された砥粒の最小投影寸法よりも小さい寸法を有したものでなければならない。このような保持枠の開口、砥粒の粒度、及び特殊な組み立て法の使用により、比較的大粒の砥粒を使用しながら、所望加工精度に応じた、小さく揃った突出高さを有する研磨工具が達成される。また、研磨部砥粒突出開口の形状は、ダイヤモンド結晶や立方晶窒化ホウ素結晶を砥粒として使用する場合は正方形とするのが簡便であるが、後述のように他の形状も利用可能である。 The abrasive grain protruding opening rows of the polishing part are of the same size and the same shape are arranged in a linear shape, a lattice shape, etc., and the size of the abrasive grains to be accommodated is also a sieve using a set of passing sieves and retaining sieves. A certain range is selected and used by dividing. The size of the opening must have a size that is less than the minimum projected size of the contained abrasive grains. A polishing tool having a small and uniform projection height according to the desired processing accuracy while using relatively large abrasive grains by using such holding frame openings, abrasive grain sizes, and special assembly methods. Is achieved. In addition, the shape of the abrasive grain protrusion opening of the polishing part is simple to be square when diamond crystal or cubic boron nitride crystal is used as the abrasive grain, but other shapes can be used as described later. .
砥粒は寸法によって選別し、砥粒突出開口の寸法に適合した寸法に揃った砥粒のみを使用し、各開口あたり一粒の砥粒が嵌め込まれる。 Abrasive grains are selected according to the size, and only abrasive grains having a size matching the size of the abrasive grain protruding opening are used, and one abrasive grain is fitted into each opening.
保持枠は、ステンレス、鉄、銅、真鍮、チタン等の金属材料でもよいし、カーボンファイバー、コンポジット材料等の非金属でもよいが、砥粒の保持、位置決めをするに足るだけの強度を有する薄板から作成されるものである。厚みは砥粒の突出量が実用に足るものとなる程度とする必要があること、薄すぎると強度不足となることから、例えばステンレス薄板を使用した場合、0.2〜0.8mm程度が好適であるが、所望の突出量に応じた厚みとするべきである。 The holding frame may be a metal material such as stainless steel, iron, copper, brass, or titanium, or a non-metal such as carbon fiber or composite material, but a thin plate having sufficient strength to hold and position abrasive grains. It is created from. The thickness needs to be such that the protruding amount of abrasive grains is sufficient for practical use, and if it is too thin, the strength will be insufficient, so when using a stainless steel thin plate, for example, about 0.2 to 0.8 mm is suitable. The thickness should correspond to the desired amount of protrusion.
嵌め込んだ砥粒を、背後から支持固定するための砥粒支持材は、砥粒突出開口を設けた保持枠よりも軟質の材料から成っている。例えば保持枠としてはステンレスやカーボンファイバーのシートが適しているので、砥粒支持材としては合成樹脂材、特にシリコンゴム、エポキシ樹脂等の有機材料が利用可能である。 The abrasive grain support material for supporting and fixing the fitted abrasive grains from the back is made of a material softer than the holding frame provided with the abrasive grain protruding openings. For example, since a stainless steel or carbon fiber sheet is suitable as the holding frame, synthetic resin materials, particularly organic materials such as silicon rubber and epoxy resin can be used as the abrasive support material.
砥粒支持材を砥粒の背後に充填または設置し、工具胴部の開放端に、研磨工具本体をなす基部である工具蓋が重ね固定されると、砥粒の特に工具軸方向の動きは、砥粒支持材および工具蓋によって制限され、これによって砥粒の位置が安定する。また、砥粒支持材の分量や寸法は、砥粒周囲に間隙のないように充填するのが効果的であるが、工具の用途によっては多少の隙間は許容される。 When the abrasive grain support material is filled or placed behind the abrasive grains, and the tool lid, which is the base that forms the polishing tool body, is overlaid and fixed to the open end of the tool barrel, the movement of the abrasive grains, particularly in the tool axis direction, is reduced. Limited by the abrasive support and tool lid, this stabilizes the position of the abrasive. In addition, it is effective to fill the abrasive grain support material so that there is no gap around the abrasive grains, but some gaps are allowed depending on the application of the tool.
工具胴部および研磨工具本体の基部をなす工具蓋の材質は、たとえばステンレス、鉄、銅などの金属材料が好適である。また、工具胴部の外形・寸法は研磨工具本体と同一であるのが好適であるが、必ずしも同一でなくてもよい。 The material of the tool lid that forms the base of the tool body and the polishing tool body is preferably a metal material such as stainless steel, iron, or copper. In addition, the outer shape and dimensions of the tool body are preferably the same as those of the polishing tool body, but they are not necessarily the same.
本発明の研磨工具の製法は、次の通りである。
（１）貫通孔を有する円板状の工具胴部を作製する段階、
（２）工具胴部の貫通孔に対応する形に分布した、同一形状の砥粒突出開口を複数設けた板状の保持枠を作成する段階、
（３）工具胴部と保持枠とを接合する段階、
（４）砥粒粒子を整粒して、砥粒突出開口を通過できない揃った寸法の砥粒を準備する段階、
（５）工具胴部と保持枠との接合体に、工具胴部側から整粒した砥粒を、砥粒突出開口１個には砥粒が１個だけ充填されるように挿入する段階、
（６）工具胴部の背面に工具本体基材である工具蓋を重ね、研磨工具として一体化する段階。
The manufacturing method of the polishing tool of the present invention is as follows.
(1) producing a disk-shaped tool body having a through hole;
(2) creating a plate-like holding frame provided with a plurality of identically shaped abrasive grain protruding openings, distributed in a shape corresponding to the through-holes of the tool body,
(3) joining the tool body and the holding frame;
(4) adjusting the size of the abrasive grains to prepare abrasive grains of uniform dimensions that cannot pass through the abrasive protrusion opening;
(5) Inserting the abrasive grains sized from the tool barrel side into the joined body of the tool barrel and the holding frame so that only one abrasive grain is filled in one abrasive protrusion opening;
(6) A step of superimposing a tool lid, which is a tool body base material, on the back of the tool body and integrating the tool lid as a polishing tool.
本願発明の研磨工具における砥粒の、工具本体への固着は、保持枠による機械的な保持によりなされており、保持枠の開口は砥粒が通過しない大きさに設定されているため、砥粒の脱落は、きわめて有効に防止される。 The abrasive grains in the polishing tool of the present invention are fixed to the tool body by mechanical holding by the holding frame, and the opening of the holding frame is set to a size that does not allow the abrasive grains to pass. The drop-out of is prevented very effectively.
砥粒が配置される研磨部は、円形の研磨工具の研磨面において、円周上に等間隔に配置されるが、研磨部の形状は、いろいろな形状が可能である。扇形、長方形、台形、楕円形、円形等が可能であるが、いずれの場合でも、砥粒突出開口は整然と列を成して配置される。 The polishing parts on which the abrasive grains are arranged are arranged at equal intervals on the circumference of the polishing surface of the circular polishing tool, but the polishing part can have various shapes. A sector shape, a rectangular shape, a trapezoidal shape, an elliptical shape, a circular shape, and the like are possible, but in any case, the abrasive grain protruding openings are arranged in an orderly manner.
本発明の研磨工具は、種々の用途に用いることができ、特に加工面の精度が要求されるものの研磨において優れている。本発明の研磨工具の用途は、とくに限定されないが、例えば、ＣＭＰパッド用、シリコンウェハ用、液晶用ガラス用、ハードディスク用、金属研磨用、その他、硬質砥粒による研磨を必要とするいかなるものであっても、本願発明の研磨工具は有効に使用可能であり、研磨対象として多種多様のものが考えられる。
以下、本発明について図面を用いて詳細に説明するが、図面は一態様を示すものであり、本発明はこれら図面に限定されるものではない。
The polishing tool of the present invention can be used for various applications, and is particularly excellent in polishing that requires accuracy of the processed surface. The use of the polishing tool of the present invention is not particularly limited. For example, it is used for CMP pads, silicon wafers, liquid crystal glass, hard disks, metal polishing, and anything that requires polishing with hard abrasive grains. Even if it exists, the grinding | polishing tool of this invention can be used effectively, and various things can be considered as grinding | polishing object.
Hereinafter, the present invention will be described in detail with reference to the drawings. However, the drawings show one embodiment, and the present invention is not limited to these drawings.
本発明の研磨工具は、一態様において、図１に示すような断面図で表される断面構造を有している。
砥粒（１）は、工具胴部（９）の内径・外径間に区画され該胴部器壁によって限定された砥粒収容空間に、一部を保持枠（４）の開口（５）から外方に突き出した姿勢で配置される。砥粒収容空間内への移動は工具蓋(２)によって直接、或いはより好ましくは砥粒（１）の背面と工具蓋（２）の内面との間に隣接配置した第一の砥粒支持材（３）によって限定される。
In one aspect, the polishing tool of the present invention has a cross-sectional structure represented by a cross-sectional view as shown in FIG.
The abrasive grains (1) are partly opened in the holding frame (4) in the abrasive grain accommodation space defined by the inner and outer diameters of the tool body (9) and limited by the body wall. It is arranged in a posture that protrudes outward. Movement into the abrasive grain storage space is performed directly by the tool lid (2), or more preferably, the first abrasive grain support material disposed adjacently between the back surface of the abrasive grain (1) and the inner surface of the tool lid (2). Limited by (3).
上記砥粒収容空間には砥粒周囲にも同様に、保持枠材よりも軟質の第二の砥粒支持材（１０）を充填配置することができる。この第二の支持材としては砥粒背面の第一の支持材と同等或いはそれ以上に軟質材が利用可能であり、両支持材を例えば可塑性の同一材で一体成型して、図８のようにすることも可能である。
砥粒支持材は、保持枠（４）及び工具蓋（２）、並びに工具胴（９）壁面よりも軟質であるので、研磨作業時に、砥粒（１）は適切な押圧力をもって開口（５）の縁により保持される。砥粒の形状、寸法が一定であるため、開口の寸法により砥粒の突出高さが限られた範囲内において均等化される。この保持材はまた、個々の粒子間の形状、寸法の変動によって生じ得る保持枠との係合状態の違いを吸収するクッションとしての作用もする。
保持枠の機能は、第一義的には砥粒を上記収容空間内に閉じ込めることである。このことはＣＭＰパッドのコンディショニング等では重要になり、極く微細な砥粒の破片の混入も許されないが、形状及び粒子寸法が高度に制御をされた砥粒を、限定された収容空間に収容し、制御された開口から突き出した砥粒の部分によって研磨作業を行う本発明の工具においては、工具表面から脱落が本質的に防止され、かかる脱落砥粒によるワーク表面の損傷が根本的に排除される。
Similarly, a second abrasive grain support material (10) softer than the holding frame material can be filled and disposed in the abrasive grain accommodating space around the abrasive grains. As this second support material, a soft material equivalent to or more than the first support material on the back side of the abrasive grains can be used, and both the support materials are integrally formed of the same plastic material, for example, as shown in FIG. It is also possible to make it.
Since the abrasive grain support material is softer than the holding frame (4), the tool lid (2), and the tool barrel (9) wall surface, the abrasive grain (1) is opened with an appropriate pressing force (5 ). Since the shape and dimensions of the abrasive grains are constant, the protrusion height of the abrasive grains is equalized within a limited range depending on the dimensions of the openings. This holding material also acts as a cushion that absorbs the difference in engagement state with the holding frame that may be caused by variations in the shape and size between individual particles.
The function of the holding frame is primarily to confine the abrasive grains in the accommodation space. This is important in CMP pad conditioning, etc., and mixing of extremely fine abrasive particles is not permitted, but abrasive particles whose shape and particle size are highly controlled are stored in a limited storage space. However, in the tool of the present invention in which the polishing operation is performed by the part of the abrasive grain protruding from the controlled opening, the falling off from the tool surface is essentially prevented, and the damage of the workpiece surface due to the falling abrasive grain is basically eliminated. Is done.
砥粒（１）の収容姿勢を一定のものとし、また砥粒のがたつきを抑制するためには、砥粒収容空間をさらに区画する砥粒保持具（６）を保持枠に近接して配置することが好ましいが、保持具（６）がなくても、砥粒支持材（３）と保持枠（４）の開口とによって、作業に必要な砥粒の姿勢と突出高さとを確保することができる。 In order to make the accommodation posture of the abrasive grains (1) constant and to suppress the rattling of the abrasive grains, the abrasive grain holder (6) further dividing the abrasive grain accommodation space is placed close to the holding frame. Although it is preferable to arrange them, the posture of the abrasive grains and the protrusion height necessary for the work are secured by the abrasive grain support material (3) and the opening of the holding frame (4) without the holder (6). be able to.
図２は、本発明の研磨工具に用いる研磨工具構成の一例を、研磨対象の側から見た斜視図である。(簡便のため砥粒は省略している。)保持枠の開口が集合してひと纏まりの開口群を形成しており、この開口群を研磨部（８）と称する。砥粒が一定突出高さをもって突出している開口が多数整列して集合した研磨部（８）は、円形の研磨工具の研磨面に、円周上に複数個が配置される。
研磨部の平面形状は、図２のような扇形でも、矩形でも、また、円形や楕円形、三角形等の各種形状が考えられるが、砥粒の分布、配置を研磨結果と対応させて、最適な形状を選定すればよい。いずれの場合も、開口の形状寸法を揃えて、砥粒の抜け落ちを防止し、また砥粒の突出高さを揃えることが重要である。
FIG. 2 is a perspective view of an example of the configuration of the polishing tool used in the polishing tool of the present invention as viewed from the polishing target side. (Abrasive grains are omitted for the sake of simplicity.) The openings of the holding frame gather together to form a group of openings, and this opening group is referred to as a polishing section (8). A plurality of polishing portions (8) in which a large number of openings in which abrasive grains protrude with a certain protruding height are aligned and gathered are arranged on the periphery of a polishing surface of a circular polishing tool.
The planar shape of the polishing part may be fan-shaped as shown in FIG. 2, rectangular, or various shapes such as a circle, an ellipse, and a triangle. A simple shape may be selected. In any case, it is important to align the shape of the opening to prevent the abrasive grains from falling off and to align the protruding height of the abrasive grains.
図３は、矩形の研磨部が８個、円周上に配置された本願発明の研磨工具を、工具胴部（９）、保持枠（４）および保持具（６）だけにした状態で、工具蓋（２）側からみた平面図であり、砥粒の寸法よりも小さい正方形の開口（５）が見えている状態を示す。これらの開口に砥粒をはめ込み、さらにその上から、砥粒支持材を充填し、その上から工具蓋（２）をかぶせて、研磨工具が完成する。 FIG. 3 shows a state where the polishing tool of the present invention in which eight rectangular polishing parts are arranged on the circumference is only the tool body (9), the holding frame (4), and the holding tool (6). It is a top view seen from the tool lid (2) side, and shows the state where the square opening (5) smaller than the dimension of an abrasive grain is visible. Abrasive grains are fitted into these openings, and further, an abrasive grain support material is filled thereon, and a tool lid (2) is placed thereon to complete the polishing tool.
図４は、本願発明の研磨工具の別の一例の、保持枠（４）、工具胴部（９）および工具蓋（２）を重ね合わせた状態、すなわち砥粒と砥粒支持材とを欠いた状態を、前面側から見た平面図(上図)および断面図(下図)であり、断面図における凹部の一つ一つに、砥粒がひとつずつ収容されることになる。
この例においては、保持具が工具胴部と同一の高さを有しており、保持具は工具蓋と接している。この場合は、砥粒支持材は、それぞれの砥粒収容空間において、砥粒の背後に位置することになる。
FIG. 4 shows a state in which the holding frame (4), the tool body (9), and the tool lid (2) are overlapped, that is, the abrasive grains and the abrasive grain support material are missing, as another example of the polishing tool of the present invention. FIG. 2 is a plan view (upper view) and a sectional view (lower view) as seen from the front side, and each abrasive grain is accommodated in each of the recesses in the sectional view.
In this example, the holder has the same height as the tool body, and the holder is in contact with the tool lid. In this case, the abrasive grain support material is located behind the abrasive grains in each abrasive grain accommodation space.
図５は、扇型の研磨部（８）を有する本願発明の研磨工具の、砥粒を備えた完成状態の研磨工具の一部を、研磨面側からみた状態の図である。砥粒（１）は、ほぼ同一の突出高さをもって整列しており、開口の整列作用によって、さらに砥粒の結晶面の方向を揃えことも可能である。しかしながら、前述のように、開口形状は、特定の形状である必要はなく、確実な脱落防止効果のためには、砥粒の最小断面よりも小さい開口であれば足りる。 FIG. 5 is a view of a state of a part of a polishing tool in a completed state provided with abrasive grains, as viewed from the polishing surface side, of the polishing tool of the present invention having a fan-shaped polishing section (8). The abrasive grains (1) are aligned with approximately the same protruding height, and the crystal plane direction of the abrasive grains can be further aligned by the alignment action of the openings. However, as described above, the opening shape does not need to be a specific shape, and an opening smaller than the minimum cross section of the abrasive grains is sufficient for a sure drop-off preventing effect.
以上の説明において、開口の形状は矩形のものを例示したが、本発明の開口はこの形状に限定されない。最も好ましいのは円形であるが、保持枠加工条件によって、六角形や八角形に形成することも可能である。
保持枠の開口の形状が砥粒粒子の形状に良好に適さないと思われる場合にも、開口寸法の調整により、形状及び粒度が適切に揃えられた砥粒を使用すればある程度の突出量調整が可能であるため、比較的正確な突出量の管理が可能である。
In the above description, the shape of the opening is a rectangular shape, but the opening of the present invention is not limited to this shape. The most preferable is a circular shape, but it may be formed in a hexagonal shape or an octagonal shape depending on the holding frame processing conditions.
Even if it seems that the shape of the opening of the holding frame is not well suited to the shape of the abrasive grains, adjusting the size of the opening will adjust the amount of protrusion to some extent by using abrasive grains that are properly aligned in shape and grain size. Therefore, it is possible to manage the protrusion amount relatively accurately.
本発明の研磨工具は、各種半導体材料の表面、ハードディスクのディスク面等を研磨する、主に硬質ウレタンや不織布で構成された化学的機械的研磨(chemical-mechanical polishing：ＣＭＰ)パッドのコンディショニングにも、或いはより精密な研磨作業にも使用可能である。例えば、液晶ディスプレイ用のガラス表面の加工(研磨)などの用途にも効果的に用いることができる。
本発明の研磨工具は、ダイヤモンド等の大粒の結晶粒子からなる砥粒を、砥粒より小さい寸法の開口を多数設けた保持枠により固着保持する研磨工具、およびその製造方法であって、砥粒は、保持枠の開口から研磨面側に突出し、砥粒の背面側には保持枠よりも軟質の、砥粒支持材により保持固定される。砥粒収容空間は、保持枠とスペーサーまたは保持具と保持枠に対向する工具蓋とにより画定され、確定された一つの収容空間に１個ずつの砥粒が収容される。砥粒は予め選別して寸法および形状を揃えられたものを用意し、保持枠の開口に１個ずつ挿入され、砥粒支持材を施したのちに、研磨工具本体の基材でもある工具蓋を被せることにより、一定の突出量をもって固着される。
The polishing tool of the present invention is also used for conditioning chemical-mechanical polishing (CMP) pads mainly composed of hard urethane or non-woven fabric to polish the surface of various semiconductor materials and the disk surface of hard disks. Alternatively, it can be used for more precise polishing operations. For example, it can be effectively used for applications such as processing (polishing) of glass surfaces for liquid crystal displays.
The polishing tool of the present invention is a polishing tool for fixing and holding abrasive grains made of large crystal grains such as diamond by a holding frame having a large number of openings having dimensions smaller than the abrasive grains, and a method for manufacturing the same. Protrudes from the opening of the holding frame toward the polishing surface and is held and fixed on the back side of the abrasive grains by an abrasive support material that is softer than the holding frame. The abrasive grain accommodation space is defined by a holding frame and a spacer or a holder and a tool lid facing the holding frame, and each abrasive grain is accommodated in one determined accommodation space. Abrasive grains that have been pre-screened and aligned in size and shape are prepared, one by one inserted into the opening of the holding frame, and after applying the abrasive grain support material, the tool lid that is also the base material of the polishing tool body By covering, it is fixed with a certain amount of protrusion.
１ 砥粒
２ 工具蓋
３ 第一の砥粒支持材
４ 保持枠
５ 開口
６ 砥粒保持具
７ スペーサー
８ 研磨部
９ 工具胴部
１０ 第二の砥粒支持材
DESCRIPTION OF SYMBOLS 1 Abrasive grain 2 Tool lid 3 1st abrasive grain support material 4 Holding frame 5 Opening 6 Abrasive grain holder 7 Spacer 8 Polishing part 9 Tool trunk | drum 10 Second abrasive grain support material
Claims (9)
貫通孔を有する円板状の工具胴部と、
工具胴部の貫通孔に対応する形に分布した、同一形状の砥粒突出開口を複数設けた板状の保持枠と、
工具胴部の背面に工具本体基材である工具蓋とを有し、
各砥粒が、砥粒の前面側を、工具基板面に沿って配置した、砥粒が脱落することのない大きさの、砥粒と少なくとも同数の開口を有する保持枠によって保持され、かつ前記保持枠の背面に画定される砥粒収容空間内に局限(confine)され、前記開口から各砥粒の一部が突き出し、突き出した部分が、保持枠の表面から限られた範囲の高さを有し、また、
砥粒の背面側および砥粒周囲に、上記保持枠よりも軟質な材質からなり砥粒の背面に接触配置した砥粒の見掛け直径の３分の１以下の厚さの第一の砥粒支持材と、第一の砥粒支持材と同等またはより軟質な材質からなり砥粒収容空間の砥粒、保持枠および第一の砥粒支持材の間の空間に充填された第二の砥粒支持材とが充填配置され、工具蓋が第一の砥粒支持材を背面側から支持しており、
保持枠の開口は、集合してひと纏まりの開口群を形成しており、
開口の形状寸法が揃えられており、砥粒の抜け落ちを防止し、また砥粒の突出高さを揃え、開口の整列作用によって、砥粒の結晶面の方向を揃えるものであり、
砥粒支持材と保持枠の開口とによって、作業に必要な砥粒の姿勢と突出高さとを確保することができることを特徴とする研磨工具。 A polishing tool having a polishing portion with a plurality of abrasive grains fixed on the tool substrate surface,
A disk-shaped tool body having a through hole;
A plate-shaped holding frame provided with a plurality of abrasive protrusion openings of the same shape distributed in a shape corresponding to the through holes of the tool body,
It has a tool lid that is a tool body base material on the back of the tool body,
Each abrasive grain is held by a holding frame that is arranged on the front surface side of the abrasive grain along the tool substrate surface and has a size that prevents the abrasive grains from falling off, and has at least the same number of openings as the abrasive grains, and It is confined in the abrasive grain accommodation space defined on the back surface of the holding frame, a part of each abrasive grain protrudes from the opening, and the protruding part has a limited height from the surface of the holding frame. Yes, and also,
A first abrasive grain support having a thickness of 1/3 or less of the apparent diameter of the abrasive grains made of a softer material than the holding frame on the back side of the abrasive grains and around the abrasive grains. Second abrasive grains that are made of a material equivalent to or softer than the first abrasive grain support material and filled in the space between the abrasive grains in the abrasive grain storage space, the holding frame, and the first abrasive grain support material The support material is filled and arranged, and the tool lid supports the first abrasive grain support material from the back side,
The opening of the holding frame gathers to form a group of openings,
The shape of the opening is aligned, preventing the abrasive grains from falling off, aligning the protruding height of the abrasive grains, and aligning the crystal plane direction of the abrasive grains by aligning the openings,
A polishing tool characterized in that the posture of the abrasive grains and the protrusion height necessary for the work can be ensured by the abrasive support material and the opening of the holding frame .
（１）貫通孔を有する円板状の工具胴部を作製する段階、
（２）工具胴部の貫通孔に対応する形に分布した、同一形状の砥粒突出開口を複数設けた板状の保持枠を作成する段階、
（３）工具胴部と保持枠とを接合する段階、
（４）砥粒粒子を整粒して、砥粒突出開口を通過できない揃った寸法の砥粒を準備する段階、
（５）工具胴部と保持枠との接合体に、工具胴部側から整粒した砥粒を、砥粒突出開口１個には砥粒が１個だけ充填されるように挿入する段階、
（６）工具胴部の背面および周囲に、一体成型されたまたは個別の第一および第二の砥粒支持材を砥粒に接して、および砥粒周囲に、充填配置し、さらに工具本体基材である工具蓋を重ね、研磨工具として一体化する段階。 The manufacturing method of the polishing tool as described in any one of Claims 1-7 which has each following process:
(1) producing a disk-shaped tool body having a through hole;
(2) creating a plate-like holding frame provided with a plurality of identically shaped abrasive grain protruding openings, distributed in a shape corresponding to the through-holes of the tool body,
(3) joining the tool body and the holding frame;
(4) adjusting the size of the abrasive grains to prepare abrasive grains of uniform dimensions that cannot pass through the abrasive protrusion opening;
(5) Inserting the abrasive grains sized from the tool barrel side into the joined body of the tool barrel and the holding frame so that only one abrasive grain is filled in one abrasive protrusion opening;
(6) On the back and periphery of the tool body , integrally formed or individual first and second abrasive grain support materials are placed in contact with and around the abrasive grains, and are further arranged around the abrasive grains. A stage in which tool covers, which are materials, are stacked and integrated as a polishing tool.
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