JP5990894B2 - Semiconductor module, semiconductor module manufacturing method, and card - Google Patents

Description

  The present invention relates to a semiconductor module, a method for manufacturing a semiconductor module, and a card using the semiconductor module.

  An IC (Integrated Circuit) card for exchanging data with a predetermined device is widely used. As such an IC card, in addition to a contact type or non-contact type IC card, a contact / contact non-contact card called a combination card, a dual interface type IC card, a 2-way access card or the like is known.

  For example, for a contact non-contact IC card, a semiconductor module (IC module) having a resin-encapsulated semiconductor element (IC chip) and a terminal (antenna connection terminal) electrically connected thereto is incorporated with an antenna. A structure integrated with a card substrate is known. Here, the IC module is accommodated and accommodated in an indentation provided in the card substrate with an adhesive sheet. The antenna is provided in the concave portion of the card base with its end exposed, and the exposed portion of the antenna and the antenna connection terminal of the IC module are electrically connected using a paste-like conductive adhesive or the like. Connected.

JP 2008-176549 A JP 2002-123808 A

  As in the case of the above contactless / non-contact IC card, the IC module antenna connection terminal and the card base antenna are connected using a conductive member exhibiting fluidity. It may flow out of the antenna connection terminal. If the conductive member that has flowed out in this way further flows out to the surface of the card substrate, the appearance of the IC card is impaired. When such an appearance defect occurs, the yield of IC card manufacturing decreases.

  Such appearance defects and yield reductions are not limited to contact / non-contact IC cards, and even non-contact IC cards exhibit fluidity between the IC module antenna connection terminals and the card base antenna. The same can occur when connecting using a conductive member.

According to one aspect of the present invention, a substrate, a semiconductor element provided on one surface side of the substrate, a bonding terminal provided on the one surface and electrically connected to the semiconductor element, and provided on the one surface. the electrically connected to the bonding terminal, and an antenna connection terminal, located outside the semiconductor element and the bonding terminals in plan view, and a sealing portion for covering the semiconductor element and the bonding terminal, the sealing portion wherein provided along the edge of the antenna connection terminal, said edge portion and a enclose the frame section area inside the upper surface of the frame portion, an upper surface of the sealing portion positioned outside the There is provided a semiconductor module including a sealing resin portion located at a lower position than the upper surface of the antenna connection terminal.

According to another aspect of the present invention, a bonding terminal and a substrate having an antenna connection terminal electrically connected to the bonding terminal and positioned outside the bonding terminal in plan view, A step of providing a semiconductor element on a surface side provided with an antenna connection terminal; a step of electrically connecting the provided semiconductor element to the bonding terminal; and the semiconductor electrically connected to the bonding terminal A sealing portion that covers the element and the bonding terminal; and a frame portion that is provided along an edge of the antenna connection terminal located outside the sealing portion and surrounds a region inside the edge. and, an upper surface of the frame portion is located at a position lower than the upper surface of the sealing portion, and the sealing resin portion in a position higher than the upper surface of the antenna connection terminal The method of manufacturing a semiconductor module and a step of forming is provided.

According to another aspect of the present invention, a card base including an antenna, and a semiconductor module mounted on the card base and electrically connected to the antenna, the semiconductor module includes a substrate, A semiconductor element provided on one surface of the substrate, a bonding terminal provided on the one surface and electrically connected to the semiconductor element, and an antenna provided on the one surface and electrically connected to the bonding terminal and connecting terminals, wherein a sealing portion for covering the semiconductor element and the bonding terminal, and enclose the frame section at least a portion of said antenna connection terminal, an upper surface of the frame portion, the sealing portion in a position lower than the upper surface, and, and a sealing resin portion in a position higher than the upper surface of the antenna connection terminal, wherein the sealing portion is housed in a recess provided in the card substrate Is, the frame portion is the contact with the card substrate person, the antenna connection terminals, the card which is electrically connected to the antenna via a conductive member provided on said part is provided .

  According to the disclosed technology, the outflow of the conductive member provided on the terminal of the semiconductor module can be suppressed by the frame portion provided on the terminal. Using such a semiconductor module, it becomes possible to manufacture a high-quality card with reduced yield and with a high yield.

It is a figure which shows an example of the IC module which concerns on 1st Embodiment. It is a figure which shows an example of the IC card which concerns on 1st Embodiment. It is a figure which shows an example of the wire bonding process which concerns on 1st Embodiment. It is a figure which shows an example of the mold process which concerns on 1st Embodiment. It is a figure which shows an example of the adhesive member arrangement | positioning process which concerns on 1st Embodiment. It is a figure which shows an example of the electrically-conductive member arrangement | positioning process which concerns on 1st Embodiment. It is a figure which shows an example of the card formation process which concerns on 1st Embodiment. It is a figure which shows an example of the IC module of another form. It is explanatory drawing (the 1) of card formation using the IC module of another form. It is explanatory drawing (the 2) of card formation using the IC module of another form. It is explanatory drawing of a dam frame part. It is a figure which shows an example of the relationship between surface roughness and slip resistance. It is a figure which shows an example of the IC module which concerns on 2nd Embodiment. It is a figure which shows an example of the IC module which concerns on 3rd Embodiment. It is a figure which shows an example of the flip-chip connection process which concerns on 4th Embodiment. It is a figure which shows an example of the mold process which concerns on 4th Embodiment. It is a figure which shows an example of the electrically-conductive member arrangement | positioning process which concerns on 4th Embodiment. It is a figure which shows an example of the card formation process which concerns on 4th Embodiment.

First, the first embodiment will be described.
FIG. 1 is a diagram illustrating an example of an IC module (semiconductor module) according to the first embodiment. 1A is a schematic plan view of the external terminal surface side, FIG. 1B is a schematic plan view of the IC chip (semiconductor element) mounting surface side, and FIG. 1C is a schematic L1-L1 cross-sectional view of FIG. is there.

  FIG. 1 shows an example of an IC module 10 used for a contact / contactless IC card. The IC module 10 includes a substrate (module substrate) 11 and an IC chip 12 mounted on the module substrate 11.

  The IC chip 12 is fixed to a predetermined area of the module substrate 11 using an adhesive or the like. The IC chip 12 mounted on the module substrate 11 is provided with a pad to which the bonding wire 13 is connected on the upper surface.

  The module substrate 11 includes an insulating substrate 11a, a terminal (external terminal) 11b provided on one surface of the insulating substrate 11a, and a terminal (antenna connection terminal) 11c provided on the other surface.

The insulating substrate 11a is formed using glass epoxy resin, epoxy resin, polyimide resin, phenol resin, or the like.
The external terminal 11b is a terminal used when an IC card using the IC module 10 contacts and exchanges data with a predetermined device. Here, as an example, a case where eight external terminals 11b having a predetermined shape and arranged at predetermined positions is illustrated. The insulating substrate 11a is provided with an opening 11aa (FIG. 1B) leading to the external terminal 11b, and the IC chip 12 is electrically connected to the external terminal 11b by a bonding wire 13 passing through the opening 11aa. The

  The antenna connection terminal 11c is a terminal that electrically connects the IC chip 12 and an antenna built in the IC card for exchanging data with a predetermined device without contact. Here, as an example, a case where a pair of antenna connection terminals 11c is provided with the IC chip 12 interposed therebetween is illustrated. The IC chip 12 is electrically connected by a bonding wire 13 to a bonding terminal 11ca connected to the antenna connection terminal 11c. The IC chip 12 is electrically connected to the antenna of the IC card through the bonding wire 13, the bonding terminal 11ca, and the antenna connection terminal 11c.

  The IC module 10 further includes a sealing resin portion (mold portion) 14 formed using a sealing resin (mold resin). For the mold resin of the mold part 14, a resin material such as an epoxy resin, a resin material containing a non-conductive filler such as silica, or the like is used. The mold part 14 includes a sealing part (chip sealing part) 14a for sealing the IC chip 12 and the bonding wire 13, and a frame part (dam frame part) 14b provided on the antenna connection terminal 11c. The dam frame portion 14b is provided along the edge of the antenna connection terminal 11c. The chip sealing part 14a and the dam frame part 14b can be simultaneously formed in one molding process (forming process of the molding part 14), for example, as will be described later.

  The chip sealing portion 14a has a function of protecting the region including the bonding wire 13 and its connecting portion in addition to the IC chip 12. The dam frame portion 14b is provided continuously from the side surface of the chip sealing portion 14a, for example, and is provided lower than the chip sealing portion 14a. Here, as an example of the dam frame portion 14b, the dam frame portion 14b is provided on the module substrate 11 from the side surface of the chip sealing portion 14a along the side end surface of the antenna connection terminal 11c, and is thicker (higher) than the antenna connection terminal 11c. Is shown. The details of the function of the dam frame portion 14b will be described later.

  The IC module 10 having the above configuration is mounted on a card base of the IC card and integrated with the card base, whereby an IC card including the IC module 10 is obtained. At this time, the IC module 10 is provided with an adhesive member 15 (FIGS. 1B and 1C) on the module substrate 11 outside the mold portion 14. For the adhesive member 15, for example, an adhesive tape is used.

FIG. 2 is a diagram illustrating an example of an IC card according to the first embodiment. 2A is a schematic plan view of an IC card, and FIG. 2B is a schematic L2-L2 cross-sectional view of FIG.
The IC card 20 shown in FIG. For the card substrate 21, for example, a resin material such as polyethylene terephthalate (PET) is used. The IC module 10 is integrated with the card base 21, whereby an IC card 20 including the IC module 10 is obtained.

  The card base 21 includes a concave portion (accommodating portion) 21a in which the IC module 10 is accommodated and an antenna 21b for performing data communication without contact with a predetermined device. The antenna 21b is provided on the card base 21 so that a part of the antenna 21b is exposed in the accommodating portion 21a.

  The IC module 10 is accommodated in the accommodating portion 21a so that the mold portion 14 side (the mounting surface side of the IC chip 12) faces the card base material 21 and the dam frame portion 14b contacts the card base material 21. . At this time, the IC module 10 is provided with an adhesive member 15 outside the chip sealing portion 14a and the dam frame portion 14b, and the conductive member 16 is provided on the antenna connection terminal 11c inside the dam frame portion 14b. The IC module 10 accommodated in the accommodating portion 21 a is adhered (crimped) to the card base 21 by the adhesive member 15, and the antenna connection terminal 11 c is electrically connected to the antenna 21 b of the card base 21 by the conductive member 16. The

In this way, the IC module 10 and the card base 21 are integrated (made into a card) to form an IC card 20.
Here, an example of a method for forming the IC module 10 and the IC card 20 will be described in more detail with reference to FIGS.

  FIG. 3 is a diagram illustrating an example of a wire bonding process according to the first embodiment. 3A is a schematic plan view of an example of a wire-bonded state, and FIG. 3B is a schematic L3-L3 cross-sectional view of FIG. FIG. 3C is a schematic cross-sectional view of an example of a wire bonded state.

  First, the IC chip 12 is mounted on the module substrate 11 provided with the external terminal 11b on one surface of the insulating substrate 11a and the antenna connection terminal 11c and the bonding terminal 11ca on the other surface.

  An opening 11aa is provided in the insulating substrate 11a of the module substrate 11 so as to surround a region where the IC chip 12 is mounted. The external terminal 11b and the opening 11aa are provided at positions corresponding to each other. The antenna connection terminal 11c and the bonding terminal 11ca are provided so as to sandwich an area where the IC chip 12 is mounted.

  The IC chip 12 is mounted in a region between the antenna connection terminal 11c (bonding terminal 11ca) on the arrangement surface side of the antenna connection terminal 11c and the bonding terminal 11ca of the module substrate 11. The IC chip 12 is bonded and fixed at a predetermined position on the module substrate 11 using, for example, an adhesive.

After mounting the IC chip 12 on the module substrate 11, the IC chip 12 and the module substrate 11 are wire bonded.
Pads are provided on the upper surface of the IC chip 12, and in wire bonding, the pads of the IC chip 12 and the external terminals 11b provided on the surface opposite to the mounting surface side of the IC chip 12 are provided. The bonding wire 13 is connected through the opening 11aa. Further, the pads of the IC chip 12 and the bonding terminals 11 ca provided on the mounting surface side of the IC chip 12 are connected by bonding wires 13. Thereby, the state where the IC chip 12 is electrically connected to the external terminal 11b and the antenna connection terminal 11c can be obtained.

  FIG. 4 is a diagram illustrating an example of a molding process according to the first embodiment. 4A is a schematic cross-sectional view of an example of a molded state, and FIG. 4B is a schematic plan view of an example of a molded state. 4A is a schematic view corresponding to the L4-L4 cross section of FIG.

After wire bonding between the module substrate 11 and the IC chip 12, the IC chip 12 and the like are molded using a molding resin.
For the mold, a mold (mold mold) 30 is used in which a portion corresponding to the mold portion 14, that is, the chip sealing portion 14a and the dam frame portion 14b, is provided with a digging (concave portion) corresponding to them. . The module substrate 11 to which the IC chip 12 is wire-bonded as described above is set in such a mold die 30, and a mold resin is injected, followed by curing and curing. Thereby, the chip sealing portion 14a for sealing the IC chip 12 and the bonding wire 13 and the dam frame portion 14b provided along the side end surface of the antenna connection terminal 11c are formed simultaneously. Thereafter, the mold 30 is released to obtain the IC module 10 as shown in FIG.

  FIG. 5 is a diagram illustrating an example of an adhesive member disposing process according to the first embodiment. 5A is a schematic plan view of an example of a state in which an adhesive member is provided, and FIG. 5B is a schematic L5-L5 cross-sectional view of FIG.

After the molding process, the adhesive member 15 is provided on the module substrate 11 of the IC module 10 obtained by molding.
The adhesive member 15 is provided on the insulating substrate 11a outside the chip sealing portion 14a and the dam frame portion 14b. For example, an adhesive tape is used as the adhesive member 15. The adhesive tape prepared in advance according to the outer shape of the chip sealing portion 14a and the dam frame portion 14b is pasted on the insulating substrate 11a of the module substrate 11, so that the IC with the adhesive tape pasted as shown in FIG. Module 10 is obtained.

  FIG. 6 is a diagram showing an example of the conductive member disposing process according to the first embodiment. 6A is a schematic plan view of an example in which a conductive member is provided, and FIG. 6B is a schematic cross-sectional view taken along line L6-L6 of FIG.

  After the adhesive member 15 is provided on the module substrate 11, the conductive member 16 is provided on the antenna connection terminal 11c inside the dam frame portion 14b. As the conductive member 16, for example, a solder paste having a predetermined composition is used. As the solder paste, for example, a paste containing solder powder, flux, and solvent (for viscosity adjustment) is used.

FIG. 7 is a diagram illustrating an example of a card forming process according to the first embodiment.
After the conductive member 16 is provided on the antenna connection terminal 11c, the IC module 10 provided with the conductive member 16 is integrated with the card substrate 21.

  At that time, the IC module 10 is accommodated in the accommodating portion 21a with the antenna connecting terminal 11c side (conductive member 16 side) facing the card base material 21 side. The card base 21 is provided with an antenna 21b having an exposed portion at a portion corresponding to the antenna connection terminal 11c of the IC module 10 accommodated in the accommodating portion 21a.

  The IC module 10 is pressed until the dam frame portion 14b comes into contact with the card base material 21, and is bonded to the card base material 21 with the adhesive member 15 provided outside the chip sealing portion 14a and the dam frame portion 14b. At that time, since the pressing amount of the IC module 10 toward the card base 21 is regulated by the thickness (height) of the dam frame portion 14b, excessive pressing of the adhesive member 15 and crushing by the pressing are suppressed.

  When a solder paste is used for the conductive member 16, heating is performed at a temperature at which the solder contained in the solder paste melts during or after the bonding by the bonding member 15. The solder melted by heating flows on the antenna connection terminal 11c and spreads on the antenna connection terminal 11c. At this time, the flow of the solder paste is restricted to a region inside the dam frame portion 14b, so that the outflow of the solder paste (conductive member 16) to the adhesive member 15 side and the outflow of the IC module 10 to the outside can be suppressed. . In other words, the dam frame portion 14b functions as a dam that prevents the conductive member 16 exhibiting fluidity from flowing out from the antenna connection terminal 11c to the outside of the IC module 10.

  Thereafter, by cooling (stopping heating), the solder (conductive member 16) is solidified, and the antenna connection terminal 11c of the IC module 10 and the antenna 21b of the card base 21 are fixed by the conductive member 16. And electrically connected.

  Thus, the IC module 10 accommodated in the accommodating portion 21 a is adhered to the card base 21 by the adhesive member 15, and the antenna connection terminal 11 c is electrically connected to the antenna 21 b of the card base 21 by the conductive member 16. Then, it is integrated (carded) with the card substrate 21. Thereby, the IC card 20 as shown in FIG. 2 is obtained.

  As described above, when the IC card 20 is formed, the conductive member 16 that electrically connects the antenna connection terminal 11c of the IC module 10 and the antenna 21b of the card base 21 is made of a solder paste or the like. Those showing fluidity are used. The dam frame portion 14 b functions as a dam that suppresses the flow of the conductive member 16 exhibiting such fluidity from the antenna connection terminal 11 c toward the outside of the IC module 10.

Here, for comparison, an example of forming a card when using an IC module having no dam frame portion 14b as described above will be described.
FIG. 8 is a diagram showing an example of an IC module of another form. 8A is a schematic plan view of the IC chip mounting surface side, and FIG. 8B is a schematic L8-L8 cross-sectional view of FIG.

  The IC module 1000 shown in FIG. 8 includes a chip sealing portion 14 a provided as a mold portion in a region including the IC chip 12, the bonding wire 13, and the connection portion of the bonding wire 13. The dam frame as described above is not provided around the antenna connection terminal 11c. The adhesive member 15 is provided on the module substrate 11 outside the chip sealing portion 14a and the antenna connection terminal 11c. The IC module 1000 is different from the above IC module 10 in this respect.

FIG. 9 and FIG. 10 are explanatory diagrams of card formation using an IC module of another form.
When forming a card, as shown in FIG. 9, an adhesive tape is provided as an adhesive member 15 on the module substrate 11, and a solder paste is provided as a conductive member 16 on the antenna connection terminal 11c. Then, the IC module 1000 provided with the adhesive member 15 and the conductive member 16 is accommodated in the accommodating portion 21 a of the card base 21. At the time of accommodation, the IC module 1000 is pressed toward the card base 21 and heated at a temperature at which the solder contained in the solder paste of the conductive member 16 melts at or after the pressing.

  However, at the time of this accommodation, the adhesive member 15 may be crushed due to excessive pressing, or the adhesive member 15 may be thermally deteriorated due to contact with the conductive member 16 melted by heating. When such crushing and thermal degradation occur and a gap is formed between the adhesive member 15 and the card substrate 21, the conductive member 16 provided on the antenna connection terminal 11c is bonded as shown in FIG. It will flow out of the IC module 10 beyond the member 15. If the conductive member 16 that has flowed out in this manner flows out to the gap with the card base 21 on the side of the IC module 10 and further to the surface of the card base 21, the appearance of the resulting IC card 1020 is impaired. If such an appearance defect occurs, the manufacturing yield of the IC card 1020 decreases.

  The outflow of the conductive member 16 that can occur in the IC module 1000 can be avoided if the amount of the conductive member 16 provided on the antenna connection terminal 11c can be adjusted in advance with high accuracy.

  However, when the solder paste as described above is used for the conductive member 16, since the solder paste usually contains a solvent for adjusting the viscosity in addition to the solder, a change in viscosity with time due to the volatilization of the solvent occurs. easy. Therefore, in the process of manufacturing a large number of IC cards 1020, it may be difficult to accurately adjust the amount of the conductive member 16 provided on the antenna connection terminal 11c.

  If the conductive member 16 is provided more than necessary on the antenna connection terminal 11c, the above-described outflow, the appearance defect of the IC card 1020, and the yield may be reduced. Also, if the conductive member 16 provided on the antenna connection terminal 11c is reduced, the amount of solder is reduced, making it impossible to secure a good electrical connection between the antenna connection terminal 11c and the antenna 21b, or sufficient mechanical properties. Connection strength may not be secured.

  In order to avoid the outflow of the conductive member 16 that may occur in the IC module 1000, in addition to adjusting the amount, a method of forming a dam with a solder resist around the antenna connection terminal 11c is also conceivable.

  However, in this method, the number of steps for forming a dam with a solder resist increases, and in order to form a dam with a height that can prevent the conductive member 16 from flowing out, the application and drying of the solder resist must be repeated a plurality of times. there is a possibility. Also, the solder resist spreads out during application, and a dam having a desired shape may not be formed. Thus, in the method of forming a dam with a solder resist, there is a risk of increasing the man-hours and costs for manufacturing an IC card.

  A method of providing a metal sheet, a metal spring or the like on the antenna connection terminal 11c instead of the conductive member 16 such as the solder paste is also conceivable. However, these members may be more expensive than solder paste. In that case, there is a risk of increasing the cost of manufacturing the IC card.

  On the other hand, in the IC module 10 described above, the dam frame portion 14b is provided in the antenna connection terminal 11c together with the chip sealing portion 14a. The dam frame portion 14b suppresses the outflow of the conductive member 16 exhibiting fluidity such as solder paste from the antenna connection terminal 11c and the outflow of the IC module 10 to the outside. As a result, the occurrence of poor appearance and a decrease in yield when the IC card 20 is formed can be effectively suppressed. In addition, the dam frame portion 14b can prevent the adhesive member 15 from being crushed by excessive pressing. Furthermore, the contact between the conductive member 16 melted by heating and the adhesive member 15 is suppressed by the dam frame portion 14b, and thermal deterioration of the adhesive member 15 is suppressed.

  The dam frame portion 14b uses the same molding resin as the chip sealing portion 14a, and the dam frame portion 14b itself can realize a desired height and shape in a single molding process. Furthermore, the dam frame portion 14b and the chip sealing portion 14a can be simultaneously formed by one molding process. Therefore, the IC module 10 that can suppress the outflow of the conductive member 16 is formed without requiring a separate step for forming a dam for suppressing the outflow of the conductive member 16 exhibiting fluidity such as solder paste. The increase in man-hours can be suppressed.

  Further, in addition to suppressing the increase in man-hours in this way, a relatively inexpensive solder paste can be used for the conductive member 16 without using an expensive member, so that the cost for forming the IC card 20 is increased. Can be suppressed.

  As described above, the dam frame portion 14b that can be molded simultaneously with the chip sealing portion 14a can have various shapes depending on the shape of the mold 30 (FIG. 4A) to be used.

FIG. 11 is an explanatory diagram of a dam frame. In addition, in FIG. 11, the site | part corresponded to the X section of FIG. 2 is shown typically.
As shown in FIG. 11A, the surface of the dam frame portion 14b can be made into a satin finish (unevenness). The dam frame portion 14b having a textured surface can be formed in a single molding step simultaneously with the chip sealing portion 14a, using a mold die 30 having an inner surface shape corresponding to the surface shape.

  Thus, by making the surface of the dam frame portion 14b satin, the contact resistance between the solder paste used as the conductive member 16 and the dam frame portion 14b can be increased. FIG. 12 shows an example of the relationship between surface roughness and slip resistance. As shown in FIG. 12, as the surface roughness of a certain surface increases, the slip resistance of a member that contacts the surface tends to increase. Based on such a relationship, here, the surface of the dam frame portion 14b is textured to roughen the surface roughness and increase the contact resistance between the flowing solder paste and the dam frame portion 14b. This makes it possible to more effectively suppress the solder paste from flowing beyond the dam frame portion 14b.

  Further, as shown in FIG. 11B, the dam frame portion 14b is, for example, a vertical wall with respect to the antenna connection terminal 11c so as to suppress the outflow of the solder paste used as the conductive member 16. Can be formed.

  FIG. 11 illustrates the case where a gap is provided between the antenna connection terminal 11c and the conductive member 16 and the dam frame portion 14b, and between the adhesive member 15 and the dam frame portion 14b. Such a gap does not necessarily need to be provided. When the gap is provided, the gap may be formed in the manufacturing process or may be intentionally formed.

  The dam frame portion 14b is formed thicker (higher) than the thickness of the antenna connection terminal 11c so that the flowing out of the flowing conductive member 16 such as solder paste can be suppressed. As described above, the dam frame portion 14b is brought into contact with the accommodating portion 21a of the card base material 21 when the IC module 10 and the card base material 21 are integrated (FIG. 2). Accordingly, the dam frame portion 14b may have a function as a member for adjusting the position (height) of the IC module 10 with respect to the card base 21 in addition to the function as a dam for suppressing the outflow of the conductive member 16. it can. Thus, when using the dam frame part 14b for height adjustment of the IC module 10, the thickness (height) of the dam frame part 14b may be set in consideration of the height.

  Although the IC module 10 and the IC card 20 using the IC module 10 according to the first embodiment have been described above, the configurations of the IC module and the IC card are not limited to the above example.

Next, a second embodiment will be described.
FIG. 13 is a diagram illustrating an example of an IC module according to the second embodiment. 13A is a schematic plan view on the IC chip mounting surface side, and FIG. 13B is a schematic cross-sectional view taken along line L13-L13 in FIG.

  The IC module 10A shown in FIG. 13 is the IC module 10 according to the first embodiment in that the dam frame portion 14b is provided on the upper surface of the antenna connection terminal 11c along the edge thereof. Is different. Even in such an IC module 10A, the dam frame portion 14b can be formed in a single molding process simultaneously with the chip sealing portion 14a by using a molding die 30 having a predetermined shape.

  When the IC module 10A is integrated (carded) with the card substrate 21, the conductive member 16 such as solder paste is provided on the antenna connection terminal 11c inside the dam frame portion 14b. And like the above, the arrangement surface side of the conductive member 16 is directed to the accommodating portion 21a side of the card base material 21, the IC module 10A is accommodated in the accommodating portion 21a, adhesion by the adhesive member 15, and antenna connection by the conductive member 16 The terminal 11c and the antenna 21b are electrically connected. Thereby, an IC card using the IC module 10A is obtained.

  Even in the case where the dam frame portion 14b is provided on the upper surface edge of the antenna connection terminal 11c together with the chip sealing portion 14a as in the IC module 10A, the fluidity on the antenna connection terminal 11c can be reduced when the card is formed. It is possible to prevent the conductive member 16 shown from flowing out of the IC module 10A. Accordingly, it is possible to form an IC card while suppressing the occurrence of poor appearance and a decrease in yield, and it is possible to form such an IC card while suppressing an increase in cost.

Next, a third embodiment will be described.
In the above description, the contact non-contact IC module and the IC card using the same are described as an example. However, the dam frame portion 14b as described above is also applied to the non-contact IC module and the IC card. Applicable.

  FIG. 14 is a diagram illustrating an example of an IC module according to the third embodiment. 14A is a schematic plan view on the side opposite to the IC chip mounting surface, FIG. 14B is a schematic plan view on the IC chip mounting surface side, and FIG. 14C is a schematic cross-sectional view taken along line L14-L14 in FIG. It is.

  An IC module 10B shown in FIG. 14 is an IC module used for a non-contact type IC card. The IC module 10B is different from the IC module 10 according to the first embodiment in that the module substrate 11 is not provided with the external terminal 11b and the opening 11aa for wire bonding thereto. To do. The IC module 10B used for such a non-contact type IC card can be provided with the adhesive member 15 as described above, but can also be configured as shown in FIG.

  As described above, such an IC module 10B is accommodated in the accommodating portion 21a of the card base 21 in a predetermined orientation, and the antenna connection terminal 11c and the antenna 21b are electrically connected by the conductive member 16. Thereby, the IC module 10B is integrated (carded) with the card substrate 21, and a non-contact type IC card is obtained. During card formation, the dam frame portion 14b formed together with the chip sealing portion 14a prevents the conductive member 16 having fluidity provided on the antenna connection terminal 11c from flowing out of the IC module 10B. be able to. Accordingly, it is possible to form a non-contact type IC card while suppressing occurrence of poor appearance, a decrease in yield, and an increase in cost.

  Also in the IC module 10B used for such a non-contact type IC card, the dam frame portion 14b is provided on the upper edge of the antenna connection terminal 11c as described in FIG. Is possible.

Next, a fourth embodiment will be described.
In the third embodiment, as the IC module 10B used for the non-contact type IC card, the IC chip 12 is wire-bonded to the bonding terminal 11ca and electrically connected to the antenna connection terminal 11c. In addition, it is also possible to obtain a non-contact type IC card by using a surface mount type IC chip and an IC module in which the chip chip is flip-chip connected. Hereinafter, such an IC module and a non-contact type IC card using the IC module will be described in detail together with an example of a forming method.

  FIG. 15 is a diagram illustrating an example of a flip chip connection process according to the fourth embodiment. In FIG. 15, (A) is a schematic plan view of the surface opposite to the IC chip mounting surface, (B) is a schematic plan view of an example of flip chip connection on the IC chip mounting surface side, and (C) is (B) It is L15-L15 cross-sectional schematic diagram of).

  First, the surface mount type IC chip 12C is mounted on the module substrate 11 provided with the antenna connection terminal 11c and the bonding terminal 11ca on one surface of the insulating substrate 11a. The antenna connection terminal 11c and the bonding terminal 11ca are provided so as to sandwich the area where the IC chip 12C is mounted, and the IC chip 12C is placed in the area between the antenna connection terminal 11c (bonding terminal 11ca). Flip chip connection is performed using the bumps 12a.

  FIG. 16 is a diagram illustrating an example of a molding process according to the fourth embodiment. 16A is a schematic cross-sectional view of an example of a molded state, and FIG. 16B is a schematic plan view of an example of a molded state. 16A is a schematic view corresponding to the L16-L16 cross section of FIG.

  After the IC chip 12C is flip-chip connected to the module substrate 11, the IC chip 12C and the like are molded using a molding resin. At the time of molding, the chip sealing part 14a and the dam frame part 14b of the mold part 14 are simultaneously formed using a mold 30 having a predetermined shape. Here, as an example, the dam frame portion 14b along the side end surface of the antenna connection terminal 11c is formed simultaneously with the chip sealing portion 14a. The IC module 10 </ b> C as shown in FIG. 16 is obtained by curing the chip sealing portion 14 a and the dam frame portion 14 b and releasing the mold 30.

  FIG. 17 is a diagram illustrating an example of a conductive member disposing process according to the fourth embodiment. 17A is a schematic plan view of an example of a state in which a conductive member is provided, and FIG. 17B is a schematic cross-sectional view taken along line L17-L17 in FIG.

  After the molding step, the conductive member 16 is provided on the antenna connection terminal 11c inside the dam frame portion 14b. As the conductive member 16, for example, a solder paste having a predetermined composition is used.

  FIG. 18 is a diagram illustrating an example of a card forming process according to the fourth embodiment. 18A is a schematic cross-sectional view of an essential part of an example of an IC module housing process, and FIG.

  After the conductive member 16 is provided on the antenna connection terminal 11c, the IC module 10C provided with the conductive member 16 is integrated with the card substrate 21. As shown in FIG. 18A, the IC module 10C is housed in the housing portion 21a with the conductive member 16 side facing the card base material 21, and the electrical connection between the antenna connection terminal 11c and the antenna 21b by the conductive member 16 is performed. Connection is made and integrated with the card substrate 21.

  After the integration of the IC module 10C with such a card base 21, the second card base 22 is pasted so as to cover the IC module 10C and the card base 21 as shown in FIG. Match. Thereby, a non-contact type IC card 20C using the IC module 10C is obtained.

  Even when such an IC card 20C is obtained, the conductive member 16 showing the fluidity on the antenna connection terminal 11c flows out of the IC module 10C by the dam frame portion 14b formed together with the chip sealing portion 14a. Can be suppressed. Therefore, it is possible to form the IC card 20C while suppressing the appearance defects, the yield reduction, and the cost increase.

  Although the IC module 10C that does not use the adhesive member 15 is illustrated here, the adhesive member 15 is provided outside the dam frame portion 14b and the chip sealing portion 14a in the same manner as the IC module 10 and the like described above, and is non-contact type. The IC card 20C may be formed.

  Also, in the IC module 10C used for the IC card 20C, the dam frame portion 14b may be provided on the upper edge of the antenna connection terminal 11c in the same manner as described in FIG.

  As described above, the IC module used for the IC card is provided with the dam frame portion on the antenna connection terminal to which the IC chip is electrically connected together with the chip sealing portion for sealing the IC chip and the like. By providing such a dam frame portion, even when a conductive member having fluidity such as a solder paste is used on the antenna connection terminal, when the card is formed, the conductive member is removed from above the antenna connection terminal. Outflow and outflow to the outside of the IC module can be suppressed. Also, by providing the dam frame part, even when an adhesive member such as an adhesive tape is provided outside the dam frame part and the chip sealing part, the contact between the adhesive member and the conductive member is suppressed, and the adhesive member is thermally deteriorated. Can be suppressed. As described above, since the outflow of the conductive member can be suppressed and the thermal deterioration of the adhesive member can be suppressed, it is possible to effectively suppress the appearance failure and the yield reduction, thereby forming a high quality IC card. It becomes possible to do.

  Further, the dam frame portion can be formed simultaneously with the chip sealing portion in the molding process. Therefore, it becomes possible to form an IC module and an IC card having a dam frame portion that suppresses the outflow of the conductive member and the like while suppressing an increase in man-hours and an increase in cost.

  In the above description, the case where the dam frame portion is provided along the side end surface of the antenna connection terminal and the case where the dam frame portion is provided along the upper surface edge of the antenna connection terminal have been described as examples. In addition, the dam frame portion is not limited to the arrangement as in the above example as long as the conductive member provided on the antenna connection terminal can be prevented from flowing out within a predetermined region. For example, the dam frame portion can be formed across the side end surface and the upper surface edge portion of the antenna connection terminal. The dam frame portion can also be formed so as to surround the antenna connection terminal and be separated from the chip sealing portion.

  In the above description, the solder paste is exemplified as an example of the conductive member exhibiting fluidity. However, the dam frame portion is also used when other conductive paste, for example, a conductive paste containing a conductive material such as silver is used. By providing the above, it is possible to obtain the same effect as described above.

Regarding the embodiment described above, the following additional notes are further disclosed.
(Appendix 1) a substrate,
A semiconductor element provided on one surface of the substrate;
A terminal provided on the one surface and electrically connected to the semiconductor element;
A semiconductor module, comprising: a sealing portion that covers the semiconductor element; and a sealing resin portion that includes a frame portion provided on the terminal.

(Additional remark 2) The semiconductor module of Additional remark 1 characterized by the inner surface of the said frame part being a satin finish.
(Additional remark 3) The semiconductor module of Additional remark 1 or 2 characterized by the inner surface of the said frame part being perpendicular | vertical with respect to the said terminal.

(Additional remark 4) The height of the said frame part is lower than the height of the said sealing part, The semiconductor module in any one of Additional remark 1 thru | or 3 characterized by the above-mentioned.
(Additional remark 5) The semiconductor module in any one of additional remark 1 thru | or 4 further including the adhesive member provided in the outer side of the said sealing part and the said frame part above the said board | substrate.

(Additional remark 6) The said semiconductor element is connected to the said terminal with the bonding wire, The semiconductor module in any one of Additional remark 1 thru | or 5 characterized by the above-mentioned.
(Supplementary note 7) The semiconductor module according to any one of supplementary notes 1 to 5, wherein the semiconductor element is flip-chip connected to the terminal via a bump.

(Additional remark 8) The process of providing a semiconductor element in the surface in which the said terminal of the board | substrate which has a terminal was provided,
Electrically connecting the provided semiconductor element to the terminal;
Forming a sealing resin portion having a sealing portion that covers the semiconductor element that is electrically connected to the terminal and a frame portion provided on the terminal. .

(Additional remark 9) The manufacturing method of the semiconductor module of Additional remark 8 characterized by forming the said sealing part and the said frame part simultaneously in the process of forming the said sealing resin part.
(Additional remark 10) The process of forming the said sealing resin part includes the process of making the inner surface of the said frame part into a satin finish, The manufacturing method of the semiconductor module of Additional remark 8 or 9 characterized by the above-mentioned.

  (Additional remark 11) The process of forming the said sealing resin part includes the process of making the inner surface of the said frame part perpendicular | vertical with respect to the said terminal, The semiconductor module in any one of Additional remark 8 thru | or 10 characterized by the above-mentioned. Production method.

(Supplementary note 12) a card substrate provided with an antenna;
A semiconductor module mounted on the card base and electrically connected to the antenna;
The semiconductor module is
A substrate,
A semiconductor element provided on one surface of the substrate;
A terminal provided on the one surface and electrically connected to the semiconductor element;
A sealing resin portion having a sealing portion that covers the semiconductor element and a frame portion provided on the terminal;
The card, wherein the terminal is electrically connected to the antenna through a conductive member provided on the terminal inside the frame.

(Additional remark 13) The said card | curd base material has a recessed part which a part of said antenna exposes,
The card according to appendix 12, wherein the semiconductor module is mounted in the recess, and the terminal is electrically connected to the part of the antenna through the conductive member.

(Additional remark 14) The adhesive member provided in the outer side of the said sealing part and the said frame part above the said board | substrate is further included,
The card according to appendix 12 or 13, wherein the semiconductor module is bonded to the card substrate through the adhesive member.

(Additional remark 15) The process of forming a card base material provided with an antenna,
Forming a semiconductor module comprising a semiconductor element;
Mounting the semiconductor module on the card substrate,
The step of forming the semiconductor module includes:
Providing the semiconductor element on a terminal arrangement surface of the substrate;
Electrically connecting the provided semiconductor element to the terminal;
Forming a sealing resin portion having a sealing portion covering the semiconductor element electrically connected to the terminal and a frame portion provided on the terminal, and
The step of mounting the semiconductor module on the card substrate includes:
Providing a conductive member on the terminal inside the frame; and
Electrically connecting the terminal to the antenna via the conductive member. A method for manufacturing a card, comprising:

10, 10A, 10B, 10C, 1000 IC module 11 Module substrate 11a Insulating substrate 11aa Opening portion 11b External terminal 11c Antenna connection terminal 11ca Bonding terminal 12, 12C IC chip 12a Bump 13 Bonding wire 14 Mold portion 14a Chip sealing portion 14b Dam frame portion 15 Adhesive member 16 Conductive member 20, 20C, 1020 IC card 21, 22 Card base 21a Housing portion 21b Antenna 30 Mold

Claims (9)

A substrate,
A semiconductor element provided on one side of the substrate;
A bonding terminal provided on the one surface and electrically connected to the semiconductor element;
Provided on the one surface, the is electrically connected to the bonding terminal, and an antenna connection terminal, located outside the semiconductor element and the bonding terminals in plan view,
Wherein a sealing portion for covering the semiconductor element and the bonding terminal, wherein located outside of the sealing portion is provided along the edge of the antenna connection terminal, wherein enclose the frame section area inside the edges And a sealing resin portion in which the upper surface of the frame portion is at a position lower than the upper surface of the sealing portion and higher than the upper surface of the antenna connection terminal. A semiconductor module. The semiconductor module according to claim 1, wherein an inner surface of the frame portion facing the edge side of the antenna connection terminal is a satin finish. The semiconductor module according to claim 1, wherein an inner surface of the frame portion facing the edge side of the antenna connection terminal is perpendicular to the edge portion .   The semiconductor module according to claim 1, wherein the sealing portion and the frame portion are formed of the same material. A bonding terminal and a substrate that is electrically connected to the bonding terminal and has an antenna connection terminal located outside the bonding terminal in a plan view, on a surface side where the bonding terminal and the antenna connection terminal are provided. Providing a semiconductor element;
Electrically connecting the provided semiconductor element to the bonding terminal;
A sealing portion that covers the semiconductor element and the bonding terminal electrically connected to the bonding terminal, and an edge portion of the antenna connection terminal that is located outside the sealing portion, and the edge portion A frame that surrounds the inner region, and the upper surface of the frame is lower than the upper surface of the sealing portion, and is higher than the upper surface of the antenna connection terminal. Forming a stop resin portion. A method for manufacturing a semiconductor module, comprising:
  The method for manufacturing a semiconductor module according to claim 5, wherein in the step of forming the sealing resin portion, the sealing portion and the frame portion are formed simultaneously.   The method for manufacturing a semiconductor module according to claim 5, wherein the sealing portion and the frame portion are formed of the same material. A card substrate provided with an antenna;
A semiconductor module mounted on the card base and electrically connected to the antenna;
The semiconductor module is
A substrate,
A semiconductor element provided on one side of the substrate;
A bonding terminal provided on the one surface and electrically connected to the semiconductor element;
An antenna connection terminal provided on the one surface and electrically connected to the bonding terminal;
And a sealing portion for covering the semiconductor element and the bonding terminal, at least a portion of said antenna connection terminal and a enclose the frame section, the upper surface of the frame portion is positioned lower than the upper surface of the sealing portion And a sealing resin portion located at a position higher than the upper surface of the antenna connection terminal,
The sealing portion is accommodated in a recess provided in the card base,
The frame portion abuts against the card substrate;
The card, wherein the antenna connection terminal is electrically connected to the antenna through a conductive member provided on the part. The card according to claim 8, wherein the sealing portion and the frame portion are formed of the same material.

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