JP5995488B2 - Plate thickness measuring device in bending machine - Google Patents

Description

  The present invention relates to a plate thickness measuring device for measuring the thickness of a plate material processed by a bending machine.

  A bending machine for bending a plate material places a plate material (hereinafter referred to as a workpiece) on a die having a V-shaped cross section, and lowers the punch to press the workpiece against the die side to bend the workpiece. . In such a bending machine, it is necessary to accurately recognize the thickness of a workpiece to be machined. That is, for example, even if the thickness of the workpiece is set to 3.2 [mm], actually, the entire workpiece is not exactly this thickness, and unevenness of about several tens of microns occurs. There can be many cases. And when thickness differs, there exists a problem that the bending angle at the time of a bending process may not become an exact angle, and the precision of a bending process falls.

  Therefore, for example, a plate thickness detection device disclosed in Patent Document 1 has been proposed. In Patent Document 1, the upper surface of the workpiece is detected in a state where the workpiece is placed on the die, and further, the upper surface of the die is detected in a state where the workpiece is removed, and the thickness of the workpiece is determined based on these differences. Measuring.

JP 2001-300640 A

  However, in the plate thickness measurement method disclosed in Patent Document 1 described above, the thickness of the workpiece is measured using the upper surface of the die as a reference position, and when the upper surface of the die is not accurate due to wear or polishing, There is a problem that the measurement accuracy decreases.

  The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a plate thickness measuring device in a bending machine capable of detecting the thickness of a workpiece with high accuracy. Is to provide.

In order to achieve the above object, the present invention provides a plate thickness measuring apparatus for measuring the thickness of a workpiece to be bent by a bending machine, provided on a die of the bending machine and having the same height as the upper surface of the die. Or a reference position setting member having a desired height with respect to the upper surface, a position sensor for detecting the vertical position of the punch provided in the bending machine, a pressure sensor for detecting the pressure applied to the punch, and a control unit for controlling the vertical movement of the punch, the control unit is configured lowers the punch, the tip portion of the punch into contact with the upper surface of the reference position setting member, the vertical position of the punch when contacted was stored as a reference position, and stores a predetermined pressure applied to the punch, then, when it is installed the workpiece on the die by removing the reference position setting member, before Lowers the punch again, the tip of the punch is brought into contact with the upper surface of the workpiece at the predetermined pressure, and, as a measurement position to measure the vertical position of the punch in this case, the measurement position and the reference position The thickness of the workpiece is calculated based on the difference between the workpiece and the workpiece .

In the thickness measuring apparatus according to the present invention, a reference position setting member is placed on a die to obtain a reference position and a predetermined pressure , and then the upper surface of the workpiece is measured in a state where the workpiece is placed on the die. determined as the position, and obtains the pressure, the reference position and the measured position, and from the relationship between the pressure, measuring the thickness of the workpiece. At this time, the reference position setting member can be immediately replaced with a new one when worn or polished, so measurement errors caused by wear or polishing on the upper surface of the die as before. Can be prevented, and the thickness of the plate can be measured with high accuracy.

It is explanatory drawing which shows typically the structure of the bending machine by which the plate | board thickness measuring apparatus which concerns on embodiment of this invention is mounted. It is a flowchart which shows the process sequence of the plate | board thickness measuring apparatus which concerns on 1st Embodiment of this invention. It is explanatory drawing which shows the measurement procedure of the board thickness by the board thickness measuring apparatus which concerns on 1st Embodiment of this invention. It is a flowchart which shows the process sequence of the plate | board thickness measuring apparatus which concerns on 2nd Embodiment of this invention. It is explanatory drawing which shows the measurement procedure of the board thickness by the board thickness measuring apparatus which concerns on 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view schematically showing a configuration in the vicinity of a processing portion of a bending machine equipped with a plate thickness measuring apparatus according to an embodiment of the present invention.

  As shown in FIG. 1, the bending machine includes a die 12 provided on the lower table 11, a punch 14 provided on the upper table 13, a cylinder 15 that raises and lowers the upper table 13, and an actuator 16 that operates the cylinder 15. It has.

  Further, a position sensor 18 for detecting the vertical position of the punch 14 and a pressure sensor 19 for detecting the pressure applied to the punch 14 are provided. The actuator 16, the position sensor 18, and the pressure sensor 19 are connected to the control unit 17.

  The upper table 13 can be lowered by the control of the control unit 17 and the work W placed on the die 12 can be bent.

  In the present embodiment, when the workpiece W is bent, the thickness of the workpiece W is measured, and the pressure of the punch 14 at the time of bending is adjusted based on the measurement result.

  Hereinafter, the procedure of the thickness measurement process of the workpiece W will be described with reference to the flowchart shown in FIG. First, in step S <b> 11, a plate thickness measurement block (reference position setting member, block member) 21 is placed in the V-shaped groove of the die 12. As shown in FIG. 3A, the block 21 has an inverted triangular cross section, and the upper surface of the block 21 coincides with the upper surface of the die 12 when inserted into the V-shaped groove of the die 12. The size is set so that. Therefore, when the block 21 is inserted into the die 12, the upper surface L1 of the block 21 and the upper surface L2 of the die 12 have the same height.

  In step S12, the control unit 17 lowers the upper table 13. Further, in step S13, the control unit 17 determines whether or not the punch 14 provided in the upper table 13 has contacted the block 21 and has reached a predetermined pressure. To do.

  When the punch 14 comes into contact with the block 21, in step S14, the control unit 17 detects the height of the punch 14 detected by the position sensor 18 and the pressure of the punch 14 detected by the pressure sensor 19. These detection results are stored in a memory (not shown) or the like.

  In step S15, the control unit 17 raises the upper table 13. Thereafter, the block 21 is removed in step S16, and the work W is placed on the die 12 in step S17.

  In step S18, the control unit 17 lowers the upper table 13, and further determines in step S19 whether the punch 14 has contacted the workpiece W and has reached a predetermined pressure (see FIG. 3B). ).

  When the punch 14 comes into contact with the workpiece W, in step S20, the control unit 17 detects the height L3 of the punch 14 detected by the position sensor 18 and the pressure of the punch 14 detected by the pressure sensor 19. These detection results are stored in a memory or the like.

  In step S21, the control unit 17 raises the upper table 13. Thereafter, in step S22, the control unit 17 determines the thickness of the workpiece W based on the detection data by the position sensor 18 when the block 21 is placed and the detection data by the position sensor 18 when the workpiece W is placed. Is calculated. That is, since the upper surface L1 of the block 21 coincides with the upper surface L2 of the die 12, the height of the upper surface of the block 21 (see FIG. 3B) is increased from the height of the upper surface of the workpiece W (L3 in FIG. 3B). By subtracting L1) of 3 (a), the thickness t1 of the workpiece W can be obtained.

  Thereafter, in step S23, the control unit 17 incorporates the plate thickness information of the workpiece W obtained in the process of step S22 into the bending calculation. That is, based on the plate thickness of the workpiece W, it is possible to control so that the processing accuracy of the workpiece W is improved by finely adjusting the pressure when the workpiece W is actually bent.

  Thus, in the plate thickness measuring apparatus according to the first embodiment of the present invention, the block 21 is inserted into the die 12, and the punch 14 is brought into contact with the upper surface of the block 21 in this state to The height L1 is obtained, and then the punch 14 is brought into contact with the upper surface of the workpiece W in a state where the workpiece W is placed on the die 12, and the upper surface height L3 of the workpiece W is obtained. Then, the plate thickness of the workpiece W is measured by subtracting the height L1 of the upper surface of the block 21 from the height L3 of the upper surface of the workpiece W.

  At this time, the block 21 can be designed with high accuracy, and even if the surface of the block 21 is worn or polished, it can be replaced with a new one. Thus, the measurement accuracy of the plate thickness can be improved. As a result, the bending process can be performed with higher accuracy.

  In the first embodiment, the pressure when the punch 14 comes into contact with the upper surface of the block 21 and the pressure when the punch 14 comes into contact with the upper surface of the work W are controlled so as to be the same. Since the thickness is measured, the measurement accuracy of the plate thickness can be further improved.

  Next, a second embodiment of the present invention will be described. Since the configuration of the plate thickness measuring apparatus according to the second embodiment is the same as that of FIG. 1 shown in the first embodiment, description of the configuration is omitted.

  Next, the procedure of the plate thickness measuring apparatus according to the second embodiment will be described with reference to the flowchart shown in FIG.

  First, in step S <b> 31, the reference plate material 31 is placed on the die 12. As shown in FIG. 5A, the reference plate material 31 has a predetermined thickness t <b> 0, and the upper surface thereof is set to have a predetermined height from the upper surface of the die 12. Therefore, when the reference plate material 31 is placed on the upper surface of the die 12, the upper surface L <b> 11 of the reference plate material 31 has a constant height t <b> 0 from the upper surface of the die 12.

  In step S32, the control unit 17 lowers the upper table 13. Further, in step S33, it is determined whether or not the punch 14 provided in the upper table 13 has contacted the reference plate material 31 and has reached a predetermined pressure. judge.

  When the punch 14 comes into contact with the reference plate 31, in step S 34, the control unit 17 detects the height of the punch 14 detected by the position sensor 18 and the pressure of the punch 14 detected by the pressure sensor 19. These detection results are stored in a memory (not shown) or the like.

  In step S35, the control unit 17 raises the upper table 13. Thereafter, in step S36, the reference plate material 31 is removed, and in step S37, the workpiece W is placed on the die 12.

  In step S38, the control unit 17 lowers the upper table 13, and further determines in step S39 whether the punch 14 has contacted the workpiece W and has reached a predetermined pressure (see FIG. 5B). ).

  When the punch 14 contacts the workpiece W, in step S40, the control unit 17 detects the height of the punch 14 detected by the position sensor 18 and the pressure of the punch 14 detected by the pressure sensor 19, These detection results are stored in a memory or the like.

  In step S41, the control unit 17 raises the upper table 13. Thereafter, in step S42, the control unit 17 determines the plate of the workpiece W based on the detection data by the position sensor 18 when the reference plate material 31 is placed and the detection data by the position sensor 18 when the workpiece W is placed. Calculate the thickness. That is, since the upper surface L11 of the reference plate 31 shown in FIG. 5A is at a predetermined distance (t0) from the upper surface of the die 12, the height L12 of the upper surface of the workpiece W is compared with the height of the reference plate 31. Thus, the thickness t1 (see FIG. 5B) of the workpiece W can be obtained.

  Thereafter, in step S43, the control unit 17 incorporates the plate thickness information of the workpiece W obtained in the process of step S42 into the bending calculation. That is, based on the plate thickness of the workpiece W, it is possible to control so that the processing accuracy of the workpiece W is improved by finely adjusting the pressure when the workpiece W is actually bent.

  In this way, in the plate thickness measuring apparatus according to the second embodiment of the present invention, the reference plate material 31 is placed on the upper surface of the die 12, and the punch 14 is brought into contact with the upper surface of the reference plate material 31 in this state, thereby the reference plate material. The height L11 of the upper surface of the workpiece 31 is obtained, and then the punch 14 is brought into contact with the upper surface of the workpiece W while the workpiece W is placed on the die 12 to obtain the upper surface height L12 of the workpiece W. Then, based on the height L12 of the upper surface of the workpiece W, the height L11 of the upper surface of the reference plate material 31, and the plate thickness t0 of the reference plate material 31, the plate thickness t1 of the workpiece W is measured.

  At this time, the reference plate material 31 can be designed with high accuracy, and even if the surface of the reference plate material 31 is worn or polished, it can be replaced with a new one. In comparison, the plate thickness measurement accuracy can be improved. As a result, the bending process can be performed with higher accuracy.

  As mentioned above, although the plate | board thickness measuring apparatus of this invention was demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part is replaced with the thing of the arbitrary structures which have the same function. be able to.

  The present invention can be used for measuring the thickness of a workpiece to be bent with high accuracy.

DESCRIPTION OF SYMBOLS 11 Lower table 12 Die 13 Upper table 14 Punch 15 Cylinder 16 Actuator 17 Control part 18 Position sensor 19 Pressure sensor 21 Block (Block member, reference position setting member)
31 Reference plate (reference position setting member)

Claims (4)

In a plate thickness measuring device that measures the thickness of a workpiece to be bent by a bending machine,
A reference position setting member which is provided on the die of the bending machine and has the same height as the upper surface of the die or a desired height with respect to the upper surface;
A position sensor for detecting the vertical position of a punch provided in the bending machine ;
A pressure sensor for detecting pressure applied to the punch;
A control unit for controlling the raising and lowering of the punch,
The controller is
The punch is lowered, the tip of the punch is brought into contact with the upper surface of the reference position setting member, the vertical position of the punch when the punch is in contact is stored as a reference position , and a predetermined pressure applied to the punch is stored And
Then, with the reference position setting member removed and the workpiece placed on the die, the punch is lowered again to bring the tip of the punch into contact with the upper surface of the workpiece with the predetermined pressure , and Then, measure the vertical position of the punch at this time to make the measurement position,
A plate thickness measuring device in a bending machine, wherein the plate thickness of the workpiece is calculated based on a difference between the reference position and the measurement position.   2. The plate thickness measuring apparatus according to claim 1, wherein the reference position setting member is a block member that is inserted into the die and has an upper surface that is flush with the upper surface of the die.   2. The plate thickness measuring device in a bending machine according to claim 1, wherein the reference position setting member is a reference plate material placed on the die and having an upper surface having a predetermined height from the upper surface of the die. . In a plate thickness measuring device that measures the thickness of a workpiece to be bent by a bending machine,
A block member inserted into the die of the bending machine, the upper surface of which is the same height as the upper surface of the die;
The punch provided in the bending machine is lowered, the tip of the punch is brought into contact with the upper surface of the block member, and the height is set as a reference position. Thereafter, the block member is removed and a workpiece is placed on the die. In the mounted state, the punch is lowered again, the tip of the punch is brought into contact with the upper surface of the workpiece, and the height is set as a measurement position. Based on the difference between the reference position and the measurement position, A measuring means for measuring the plate thickness;
A plate thickness measuring device in a bending machine characterized by comprising:

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