JP6007004B2 - Substrate holding device, substrate processing device - Google Patents

Description

  The present invention relates to a substrate holding apparatus and a substrate processing apparatus that hold two substrates.

  In an ion implantation apparatus equipped with a conventional substrate holding device (dual stage device) that holds two substrates, the two substrates are horizontally spaced apart by the substrate holding device, and the ion beam is horizontal. By allocating in the direction, the two substrates were sequentially irradiated with the ion beam.

  For this reason, the incident angle of the ion beam incident on one substrate is different from the incident angle of the ion beam incident on the other substrate, and the parallel beam incident perpendicularly to the surface of the substrate is applied to both substrates. The injection process could not be performed.

  Further, in order to distribute the ion beam in the horizontal direction, it is necessary to increase the length of the passage path from the ion beam generator to the surface of the substrate, which causes a problem that the apparatus becomes large.

Japanese Patent Laid-Open No. 10-106476

The present invention was created to solve the above-mentioned disadvantages of the prior art, and one of its purposes is to place two substrates at the same reference position at different times and to face the same reference direction. An object of the present invention is to provide a substrate holding device that can be used.
Another object of the present invention is to provide a substrate processing apparatus capable of sequentially irradiating two substrates with irradiation rays while the irradiation position of the irradiation rays is stationary.

In order to solve the above-described problems, the present invention provides a first hand and a second hand that respectively hold the first and second substrates, the vertical movement of the first and second hands, and a horizontal plane. Change the direction of the first and second hands, and the first and second hands. Controlling the first and second orientation changing devices for respectively directing the surfaces of the first and second substrates held respectively upward or laterally and the first and second hand moving devices; And a control device that moves the first and second hands, controls the first and second orientation changing devices, and changes the orientations of the first and second hands. Therefore, a reference position and a reference direction are set in the control device, and are stored in the first and second hands. Has been the first, second substrate by said first, second hand, located at the same the reference position at different times, is configured to be oriented in the same the reference direction, the first, second The second hand moving device rotates around a central axis including the center of the swivel movement, and extends in a horizontal plane with the first and second rotation shafts for turning the first and second hands. And first and second linear movement devices that cause the first and second hands to move linearly along the extended direction, and vertically and vertically Along the first and second vertical movement devices that cause the first and second hands to move up and down, and the central axes of the first and second rotating shafts are stationary with respect to a horizontal plane. When the first and second rotating shafts rotate, the first and second linear movement devices are in a horizontal plane. A substrate holding apparatus are moved times.
The present invention is a substrate holding device, which is extended in a direction parallel to the extending direction of the first and second linear movement devices, and the first and second hands are attached to one end. The first hand moving device is located on the left side and the second hand moving device is located on the right side when the first and second hand moving devices are viewed from the reference position. In the state where the first hand is disposed at the reference position, the extending direction of the first linear moving device is directed parallel to the left-right direction, and the first hand is When the second hand is located at the right end of one arm member and the second hand is disposed at the reference position, the extending direction of the second linear moving device is parallel to the left-right direction. The second hand is a substrate holding member located at the left end of the second arm member. It is a device.
The present invention is a substrate holding device between a straight line passing through the center of the first hand parallel to the extending direction of the first linear movement device and a central axis of the first rotation shaft And the distance between the straight line passing through the center of the second hand parallel to the extending direction of the second linear movement device and the central axis of the second rotating shaft, respectively. The substrate holding device has a length that is half the distance between the central axis of the first rotary shaft and the central axis of the second rotary shaft.
The present invention includes the substrate holding device, a vacuum chamber, and an irradiation device that emits irradiation rays into the vacuum chamber, wherein the first and second hands are disposed in the vacuum chamber, The reference position is a substrate processing apparatus that is the irradiation position of the irradiation line.
The present invention is a substrate processing apparatus, and when the first and second hand moving devices are viewed from the reference position, an auxiliary vacuum chamber is disposed behind the first and second hand moving devices. Substrate processing apparatus.
The present invention is a substrate processing apparatus, comprising a plurality of the auxiliary vacuum chambers, wherein each of the auxiliary vacuum chambers is arranged in the vertical direction.
The present invention is a substrate processing apparatus, wherein the control device is configured such that the first substrate is positioned at the irradiation position when the irradiation position is stationary with respect to a reference plane. When the substrate is moved, the irradiation position is moved along the spiral on the spiral set on the first substrate, and when the second substrate is positioned at the irradiation position, The substrate processing apparatus is configured to move the irradiation position along a spiral on the spiral set on the second substrate by moving a second substrate.
The present invention further includes a substrate holding device, a vacuum chamber, and an irradiation device that emits an irradiation beam into the vacuum chamber, wherein the substrate holding device holds the first and second substrates, respectively. First and second hands that cause the first and second hands and the first and second hands to move vertically in the vertical direction, swivel movement in a horizontal plane, and linear movement in a horizontal plane. The direction of the moving device and the first and second hands is changed, and the surfaces of the first and second substrates respectively held by the first and second hands are respectively upward or lateral. Controlling the first and second orientation changing devices and the first and second hand moving devices to move the first and second hands, and the first and second orientation changing devices. And a control device that changes the orientations of the first and second hands. A position and a reference direction are set, and the first and second substrates held by the first and second hands are positioned at the same reference position at different times by the first and second hands. The substrate processing apparatus is configured to be directed in the same reference direction, the first and second hands are disposed in the vacuum chamber, and the reference position is an irradiation position of the irradiation line, The control device moves the first substrate when the first substrate is located at the irradiation position in a state where the irradiation position is stationary with respect to a reference plane, thereby moving the irradiation position. Is moved along the spiral set on the first substrate, and when the second substrate is located at the irradiation position, the second substrate is moved, Vortex the swirl on the swirl set on the second substrate. Is the substrate processing apparatus having the structure as to move along.
The present invention is a substrate processing apparatus, wherein the first and second hand moving devices rotate around a central axis including the center of the swivel movement, and cause the first and second hands to swivel. First and second rotating shafts and first and second linear moving devices that extend in a horizontal plane and cause the first and second hands to move along the extending direction. And a first and second vertical movement device for vertically moving the first and second hands along the vertical direction.
The present invention is a substrate processing apparatus, and when the first and second hand moving devices are viewed from the reference position, an auxiliary vacuum chamber is disposed behind the first and second hand moving devices. Substrate processing apparatus.
The present invention is a substrate processing apparatus, comprising a plurality of the auxiliary vacuum chambers, wherein each of the auxiliary vacuum chambers is arranged in the vertical direction.

<Principle>
The basic principle of moving on the spiral along the spiral at the center of the irradiation area of a certain area will be described.

Here, a point coordinate is defined that passes at a velocity v (t) on a so-called Archimedes spiral path in which the spiral line-to-line pitch is constant.
The general formula of Archimedes spiral is shown by the following formula (1).

  When developed, the radial velocity is expressed by the following mathematical formula (2), and the angular velocity is expressed by the following mathematical formula (3).

  Here, the radial distance R (t) may be calculated as the following formula (5) from the following formula (4).

  Similarly, the movement angle θ (t) may be calculated as the following formula (7) from the following formula (6).

  Each initial value can be arbitrarily determined.

  If the polar coordinate system trajectory calculated as described above is developed into an orthogonal coordinate system, it can be driven with two linear motion axes. For example, the following mathematical formulas (8) and (9) are distributed to the respective linear motion axes.

2. Consider the magnitude of the load on the drive mechanism driven by the linear motion shaft.
When moving at a constant speed (v _sp ) on the spiral path, consider one axis. The orthogonal axis only differs in phase by π / 2.

Assuming that the irradiation object is rotating with a radius R ₀ on the irradiation object by rotating the irradiation object with a constant radius R ₀ by the moving device, the rotation of the spiral path in the small-diameter portion is performed. The horizontal component of the motion is expressed by the following formula (10).

  Here, ω is an angular velocity at the small diameter portion, and is represented by the following mathematical formula (11).

  From the above formulas (10) and (11), the horizontal speed and the horizontal acceleration at the small diameter portion can be expressed by the following formulas (12) and (13), respectively.

Thus, the maximum speed is given by v _sp and the maximum acceleration is given by v _sp ² / R ₀ .

Since the first and second substrates can be positioned at the same reference position at different times and directed in the same reference direction, when irradiating irradiation rays to the first and second substrates, irradiation of irradiation rays With the position being stationary with respect to the reference plane, it becomes possible to irradiate the first and second substrates in order, and irradiate the first and second substrates with the same incident angle. It becomes possible. Therefore, when the irradiation beam is an ion beam, the implantation depths of ions implanted into the first and second substrates can be made equal.
When the irradiation beam is a charged particle beam such as an ion beam or an electron beam, it is not necessary to increase the path length in order to bend the charged particle beam, and the apparatus can be miniaturized.

The internal block diagram of the substrate processing apparatus of this invention Schematic three-dimensional view of the substrate holding device of the present invention Schematic plan view of the substrate holding apparatus of the present invention Schematic front view of the substrate holding apparatus of the present invention The figure for demonstrating when the direction of the front-end | tip of a 1st, 2nd vertical movement member exists in a 1st state. Diagram for explaining movement of irradiation area along spiral (A), (b): The figure for demonstrating the central-axis line of an irradiation line, and the incident angle to an irradiation surface The figure for demonstrating the state which inserted the 1st hand in the carry-out chamber The figure for demonstrating the state which inserted the 1st hand in the carrying-in room Schematic plan view of another example of the substrate processing apparatus of the present invention Schematic front view of another example of the substrate processing apparatus of the present invention

The structure of the substrate processing apparatus 50 provided with the substrate holding apparatus 10 (FIG. 2) of the present invention will be described.
FIG. 1 is an internal configuration diagram of the substrate processing apparatus 50.

The substrate processing apparatus 50 includes a vacuum chamber 56, an irradiation apparatus 40, and a substrate holding apparatus 10.
The irradiation device 40 is an irradiation device that emits charged particles or electromagnetic waves into the vacuum chamber 56. Here, the irradiation device 40 is an ion irradiation device that emits a charged particle beam (ion beam) as an irradiation beam. The apparatus 40 includes an ion source 41 that generates ions, an extraction electrode 47 that extracts ions from the ion source 41, a mass analyzer 42 that extracts ions of a desired type from the ions extracted by the extraction electrode 47, and a mass And a lens unit 46 for shaping the ions extracted by the analysis unit 42 into a beam.

  The mass spectrometer 42 includes first and second electromagnets 42a and 42b arranged to face each other, and a vacuum pipe 42c arranged between the first electromagnet 42a and the second electromagnet 42b. I'm.

  The central axis of the vacuum pipe 42c is bent like a bow in one plane parallel to the surfaces of the first and second electromagnets 42a and 42b, and the first and second auxiliary vacuum pipes 43 are provided at one end and the other end. , 45 are connected to each other.

  The first auxiliary vacuum pipe 43 is connected to the ion source 41, and the extraction electrode 47 is disposed inside the first auxiliary vacuum pipe 43. The lens unit 46 is disposed inside the second auxiliary vacuum pipe 45.

  A gas introduction unit 38 is connected to the ion source 41. When the inside of the vacuum chamber 56 and the inside of the irradiation device 40 are evacuated, the raw material gas is introduced into the ion source 41 from the gas introduction unit 38, and the power is supplied into the ion source 41 from the power source 37a, the introduced raw material is introduced. The gas is ionized and a plasma is generated.

  When a voltage is applied to the extraction electrode 47 from the power source 37b and an electric field is formed between the ion source 41 and the extraction electrode 47, ions in the plasma are accelerated from the ion source 41 toward the extraction electrode 47, and the first It is drawn into one auxiliary vacuum pipe 43, passes through the lead electrode 47, and enters the mass analyzer 42.

  When a current flows from the power source 37c to the first and second electromagnets 42a and 42b of the mass analyzing unit 42, a magnetic field is formed between the first electromagnet 42a and the second electromagnet 42b, and the inside of the vacuum pipe 42c. The flying ions are subjected to Lorentz force and the trajectory is bent. When the amount of current flowing through the first and second electromagnets 42a and 42b is adjusted, the magnitude of the magnetic field is adjusted, and only desired ions pass through the vacuum pipe 42c and are released into the second auxiliary vacuum pipe 45. The

  The lens unit 46 is a quadrupole electromagnet. When a current is supplied from the power source 37d to the lens unit 46, a magnetic field is formed inside the lens unit 46, and ions emitted from the mass analyzing unit 42 are formed by the lens unit 46. It is focused by the magnetic field to be shaped, shaped into a beam, and emitted to the outside from the discharge port 48 which is the end of the second auxiliary vacuum pipe 45.

The discharge port 48 is connected to a vacuum chamber 56, and a vacuum exhaust unit 55 is connected to the vacuum chamber 56. The vacuum exhaust part 55 is operated, and the vacuum chamber 56 is evacuated to form a vacuum atmosphere.
The irradiation line (ion beam) emitted from the emission port 48 travels straight in the evacuated vacuum chamber 56 while being focused here. Reference numeral 49 indicates a beam axis which is the central axis of the irradiation line.

  For example, when a reference plane 51 is a reference plane such as a floor surface of a building on which the substrate processing apparatus 50 is disposed, the irradiation device 40 and the vacuum chamber 56 are stationary with respect to the reference plane 51. The irradiation position 59 is a predetermined position in the vacuum chamber 56 and is stationary with respect to the reference plane 51. The irradiation line travels toward the irradiation position 59 so that the beam axis 49 passes through the irradiation position 59.

  The substrate holding device 10 of the present invention is disposed in a vacuum chamber 56, and a part of the substrate holding device 10 is stationary with respect to the reference surface 51, and the other part is configured to move with respect to the reference surface 51. ing.

  2 is a schematic three-dimensional view of the substrate holding device 10, FIG. 3 is a schematic plan view thereof, and FIG. 4 is a schematic front view thereof.

  The substrate holding device 10 vertically moves the first and second hands 18a and 18b and the first and second hands 18a and 18b, which hold the first and second substrates 28a and 28b, respectively, in the vertical direction. And changing the orientation of the first and second hand moving devices 17a and 17b and the first and second hands 18a and 18b for making a pivotal movement in the horizontal plane and a linear movement in the horizontal plane, First and second orientation changing devices 14a and 14b for directing the surfaces of the first and second substrates 28a and 28b respectively held by the first and second hands 18a and 18b upward or laterally, respectively. The first and second hand moving devices 17a and 17b are controlled to move the first and second hands 18a and 18b, the first and second orientation changing devices 14a and 14b are controlled, Direction of the first and second hands 18a and 18b And a control unit 19 for changing.

  In the present embodiment, the first and second hand moving devices 17a and 17b rotate around a central axis including the center of the turning movement, and the first and second hands 18a and 18b are turned and moved. Second rotary shafts 11a and 11b and first and second linear movement devices that extend in a horizontal plane and cause the first and second hands 18a and 18b to linearly move along the extended direction. 12a, 12b, and first and second up-and-down moving devices 13a, 13b that are vertically erected and cause the first and second hands 18a, 18b to move up and down along the up-down direction 63 have.

  The first and second rotary shafts 11a and 11b are disposed apart from each other in the horizontal direction and are stationary with respect to the reference plane 51. The central axes of the first and second rotary shafts 11a and 11b are in the vertical direction. It is directed parallel to.

  First and second rotating members 15a and 15b are fixed to upper ends of the first and second rotating shafts 11a and 11b, and motors 35a and 35b disposed outside the vacuum chamber 56 are fixed to lower ends. Are connected to each other. When the motors 35a and 35b are operated, the first and second rotating shafts 11a and 11b are moved to the center of the first and second rotating shafts 11a and 11b together with the first and second rotating members 15a and 15b. Rotate around the axis.

The first and second linear movement devices 12a and 12b have an elongated shape, and are arranged on the first and second rotating members 15a and 15b with the longitudinal direction thereof being parallel to the horizontal plane. The rotating members 15a and 15b are fixed.
Here, the first and second linear movement devices 12a and 12b are linear motors, and a plurality of electromagnets (not shown) are provided side by side along the longitudinal direction. The first and second linear movement members 22a and 22b are arranged on the first and second linear movement devices 12a and 12b, respectively, and are not attached to the first and second linear movement members 22a and 22b. The illustrated fixed magnet is provided.

  When the magnetic poles of the electromagnets provided in the first and second linear moving devices 12a and 12b are alternately changed along the longitudinal direction, the first and second magnetic forces are generated by the magnetic force generated between the electromagnet and the fixed magnet. The linear moving members 22a and 22b linearly move along the direction extending on the first and second linear moving devices 12a and 12b.

  The first and second linear moving devices 12a and 12b are extended from the first and second linear moving members 22a and 22b arranged on the first and second linear moving devices 12a and 12b. The linear motor is not limited to the above-described linear motor as long as it can move linearly along the other direction. For example, a rack and pinion or a ball screw may be used.

The first and second up-and-down moving devices 13a and 13b have an elongated shape, and are arranged on the first and second linear moving members 22a and 22b with their longitudinal directions parallel to the vertical direction. The second linear moving members 22a and 22b are fixed respectively.
First and second vertical movement members 23a and 23b are arranged on the first and second vertical movement devices 13a and 13b, respectively.

Here, the first and second vertically moving members 23a and 23b have an elongated shape, and the longitudinal direction is oriented in a horizontal direction perpendicular to the extending direction of the first and second linear moving devices 12a and 12b. It has been.
The structures of the first and second vertical movement devices 13a and 13b and the first and second vertical movement members 23a and 23b are the same as the first and second linear movement devices 12a and 12b. The structure is the same as that of the members 22a and 22b, and a description thereof will be omitted.

  When the first and second vertical movement devices 13a and 13b are operated, the first and second vertical movement members 23a and 23b are erected on the first and second vertical movement devices 13a and 13b. That is, it moves linearly along the up-down direction 63.

In the present embodiment, the substrate holding device 10 includes first and second arm members 16a and 16b that are extended in a direction parallel to the extending direction of the first and second linear movement devices 12a and 12b. Yes.
One end of the first and second arm members 16a and 16b is attached to the tip of the first and second vertically moving members 23a and 23b, and the first and second hands 18a and 18b are attached to the other ends. .

  A plane including the central axis of the first rotary shaft 11a and the central axis of the second rotary shaft 11b is defined as a rotary axis plane, and the first of the two surfaces of the rotary axis plane is opposed to the surface on the discharge port 48 side. When the second rotary shafts 11a and 11b are viewed, the first rotary shaft 11a is located on the left side, the second rotary shaft 11b is located on the right side, and the tip of the first vertical movement member 23a Is oriented in the same direction as the surface of the rotation axis plane (that is, forward), the first hand 18a is positioned at the right end of the first arm member 16a and the tip of the second vertical movement member 23b. In a state in which is directed forward, the second hand 18b is located at the left end of the second arm member 16b.

  Referring to FIG. 5, the first vertical movement member 23 a has a tip that is directed in the same direction as the surface of the rotation axis plane (that is, forward), and a tip of the second vertical movement member 23 b that is directed to the left. In the second state in which the tip of the first vertical movement member 23a is directed rightward and the tip of the second vertical movement member 23b is directed forward, referring to the state or FIG. The hands 18a and 18b are spaced apart in the horizontal direction. When the first and second vertical movement devices 13a and 13b are operated, the first and second hands 18a and 18b do not collide with each other. Move in a straight line in direction 63.

  In addition, referring to FIG. 3, when the first and second hands 18 a and 18 b are arranged at different heights with respect to the vertical direction 63, the first and second rotating shafts 11 a and 11 b are rotated. And the first and second hands 18a, 18b do not collide with each other and rotate around the central axes of the first and second rotating shafts 11a, 11b, and the first, second up / down moving members 23a, The direction of the tip of 23b is changed between the first state and the second state.

  The first and second rotary shafts 11a and 11b, the first and second linear movement devices 12a and 12b, and the first and second vertical movement devices 13a and 13b were stacked in this order. For example, the first and second rotary shafts 11a and 11b are arranged on the first and second vertical movement devices 13a and 13b, and the first and second rotary shafts 11a and 11b are arranged. The first and second linear moving devices 12a and 12b are arranged, or the first and second vertical moving devices 13a and 13b are arranged on the first and second rotating shafts 11a and 11b. First and second linear movement devices 12a and 12b are arranged on the first and second vertical movement devices 13a and 13b, and the first and second arm members 16a and 16b are the first and second linear movement members. It may be attached to 22a, 22b.

The first and second orientation changing devices 14a and 14b are disposed at the connection portions between the first and second arm members 16a and 16b and the first and second vertical movement members 23a and 23b.
The first and second orientation changing devices 14a and 14b include motors. When the motors are operated, the first and second arm members 16a and 16b rotate about the central axis, respectively.

The first and second hands 18a and 18b have a disk shape, and their surfaces are directed parallel to the central axes of the first and second arm members 16a and 16b.
Here, the first and second hands 18a and 18b are electrostatic chucks, and suction electrodes (not shown) are embedded therein. When a voltage is applied to the suction electrode, an electric field is formed on the surfaces of the first and second hands 18a and 18b, and the first and second hands disposed on the surfaces of the first and second hands 18a and 18b. The substrates 28a and 28b are electrostatically attracted to the surfaces of the first and second hands 18a and 18b.

  When the first and second orientation changing devices 14a and 14b are operated, the first and second hands 18a and 18b are moved together with the first and second arm members 16a and 16b to the first and second arm members 16a. The first and second substrates are rotated about the central axis of 16b, the orientations of the first and second hands 18a and 18b are changed, and are electrostatically attracted to the first and second hands 18a and 18b. The surfaces of 28a and 28b are directed upward or laterally, respectively.

  A reference position and a reference direction are set in the control device 19, and the first and second substrates 28a and 28b held by the first and second hands 18a and 18b are the first and second hands. 18a and 18b are configured to be located at the same reference position at different times and directed in the same reference direction.

  Here, when the surface of the first substrate 28a is oriented in the lateral direction, the distance between the plane on which the first substrate 28a is located and the central axis of the first rotating shaft 11a is the second substrate 28b. Is equal to the distance between the plane on which the second substrate 28b is located and the central axis of the second rotating shaft 11b when the surface of the second substrate 28b is oriented in the lateral direction.

  Therefore, the first and second vertical movement members 23a and 23b are oriented in the first state (see FIG. 5) and the first substrate 28a is oriented in the lateral direction. When the surface of the substrate 28a and the first and second vertically moving members 23a, 23b are oriented in the second state (see FIG. 2), the surface of the second substrate 28b is oriented laterally. The surface of the second substrate 28b is disposed in the same moving plane.

The reference position is a determined position in the moving plane, and the reference direction is a determined direction that is perpendicular to the moving plane and parallel to one vertical plane.
When the first and second hand moving devices 17a and 17b are viewed from the reference position, the first hand moving device 17a is located on the left side and the second hand moving device 17b is located on the right side.

In the present embodiment, the irradiation position 59 is set as the reference position, and the direction parallel to the beam axis 49 is set as the reference direction.
An operation in which the first and second substrates 28a and 28b are positioned at the same irradiation position 59 at different times and directed in the direction parallel to the same beam axis 49 will be described.

  Referring to FIG. 5, in the first state, the first and second hands 18 a and 18 b are moved in the front-rear direction 62 perpendicular to the moving plane when the front ends of the first and second vertically moving members 23 a and 23 b are in the first state. When the surface of the first substrate 28a is oriented in the lateral direction, the surface of the first substrate 28a is disposed in the moving plane and is directed in a direction parallel to the beam axis 49.

  When the first linear movement device 12a and the first vertical movement device 13a are operated, the first hand 18a is linearly moved in the left-right direction 61 and the vertical direction 63 without colliding with the second hand 18b. The surface of the first substrate 28a moves in the moving plane, and the irradiation position 59 is arranged on the surface of the first substrate 28a.

  Next, after the first and second vertical movement devices 13a and 13b are operated to arrange the first and second hands 18a and 18b at different heights, the first and second rotary shafts 11a and 11b are moved. Referring to FIG. 2, the first and second hands 18a and 18b turn without colliding with each other, and the first and second up and down moving members 23a and 23b are oriented in the first direction. The state is changed to the second state.

  In the second state where the tip ends of the first and second vertically moving members 23a and 23b are in the second state, the first and second hands 18a and 18b are spaced apart in the front-rear direction 62, and the second substrate When the surface of 28b is directed laterally, the surface of the second substrate 28b is disposed in the movement plane and is directed in a direction parallel to the beam axis 49.

  When the second linear movement device 12b and the second vertical movement device 13b are operated, the second hand 18b is linearly moved in the left-right direction 61 and the vertical direction 63 without colliding with the first hand 18a. The surface of the second substrate 28b moves in the moving plane, and the irradiation position 59 is arranged on the surface of the second substrate 28b.

  The same irradiation position 59 is positioned on the surfaces of the first and second substrates 28a and 28b at different times by the first and second hands 18a and 18b, and the surfaces of the first and second substrates 28a and 28b are moved. By directing in the direction parallel to the same beam axis 49, when the irradiation line is emitted from the irradiation device 40, the irradiation lines are sequentially irradiated on the surfaces of the first and second substrates 28 a and 28 b at different times. The Therefore, it is not necessary to lengthen the path length of the irradiation line in order to bend the irradiation line, and the substrate processing apparatus 50 is downsized.

The irradiation of the irradiation rays on the surfaces of the first and second substrates 28a and 28b will be described.
The operation of the first hand moving device 17a in a state where the irradiation position 59 is arranged on the surface of the first substrate 28a on the first hand 18a, and the irradiation position 59 is the second position on the second hand 18b. The operation of the second hand moving device 17b in the state where it is arranged on the surface of the substrate 28b is the same, and the following description will be made representatively by the operation of the first hand moving device 17a.

  When an irradiation line is irradiated from the irradiation device 40 in a state where the surface of the first substrate 28a where the irradiation position 59 is disposed is an irradiation surface and the irradiation position 59 is positioned on the irradiation surface, the irradiation line is applied to the irradiation surface. The irradiation position 59 becomes the center of the irradiation area.

  Here, the irradiation line is focused from a spread state, and the focal point is a point-like irradiation point having an area less than or equal to the irradiation range, and is connected within the irradiation region including the irradiation position 59 on the irradiation surface. Yes. Since the irradiation position 59 is located on the irradiation surface, the irradiation point is located on the irradiation surface.

  Here, when the irradiation point is stationary with respect to the reference plane 51, the size of the irradiation point is equal to the size of the irradiation region, but the lens unit 46 oscillates the magnetic field to change the position of the irradiation point. When it is configured to vibrate with a minute constant amplitude, the region of the irradiation surface in the range where the irradiation point vibrates becomes the irradiation region. This irradiation area is stationary with respect to the reference plane 51.

  When the irradiation point vibrates, it is vibrated at a speed faster than the moving speed of the first substrate 28a described later, and the irradiation line is irradiated almost simultaneously in a range in which the amplitude of the vibration is added to the diameter of the irradiation point. The irradiation region has a width that is the diameter of the irradiation point, and a length that is a size obtained by adding the amplitude of the vibration at the center of the irradiation point to the diameter of the irradiation point, and has a larger area than the irradiation point.

  The direction of vibration can be rotated. For example, by vibrating the irradiation point in the direction perpendicular to the moving direction of the first substrate 28a with the irradiation position as the center, it is possible to vibrate in a direction perpendicular to the spiral. .

  Whether the irradiation point vibrates or the irradiation point is stationary with respect to the reference plane 51, the irradiation region is formed in a range of a certain area centered on the irradiation position 59 on the irradiation surface. One hand moving device 17a moves the first substrate 28a relative to the reference surface 51 and the irradiation position 59, thereby moving the irradiation region and the irradiation surface relatively. In the present embodiment, the first hand moving device 17a allows the irradiation area to move within a certain range (effective area) of the irradiation surface.

  In the present embodiment, the control device 19 is provided with a storage device, and in the storage device, the moving direction, the moving speed, and the irradiation line of the first hand 18a having the irradiation position 59 arranged on the surface thereof are applied. The tilt is stored. This inclination is equal to the incident angle φ described later.

  Based on the stored contents, the control device 19 outputs a control signal to the first hand moving device 17a, controls the first hand moving device 17a, and the first linear moving device 12a and the first vertical moving device 12a. Referring to FIG. 6, the moving device 13a moves the center of the irradiation region 71 along the stored spiral 72 on the irradiation surface 77 of the first substrate 28a. Even during this movement, the irradiation position 59 is positioned on the irradiation surface 77.

When the length of the line segment 73 connecting the center of the spiral 72 and the point on the spiral 72 is a radial distance R, the radial distance R is between the reference line passing through the center of the spiral 72 and the line segment 73. It is proportional to the movement angle θ, which is an angle, and has a relationship represented by the equation R = aθ (a is a constant other than zero).
In the present invention, the “reference line” is a half line starting from the center of the spiral 72 among the tangent lines at the center of the spiral 72 and intersecting the spiral 72 when the movement angle θ is 360 °.

  The spiral 72 may be counterclockwise and clockwise, or clockwise and counterclockwise, with one being 0 ≦ θ and the other being θ ≦ 0. In either case, when the absolute value of the movement angle θ increases, the radial distance R increases, and when the absolute value of the movement angle θ decreases, the radial distance R decreases. When the center of the irradiation region 71 moves relatively between two points on the spiral 72, when the amount of change of the radial distance R is proportional to the amount of change of the movement angle θ, the center of the irradiation region 71 moves. The shape is an Archimedean spiral with a constant line pitch. The “inter-line pitch” refers to a distance between two intersections adjacent to each other on the half line among intersections where the half line extending in the radial direction starting from the center of the spiral 72 and the spiral 72 intersect.

When the diameter of the irradiation region 71 is the same length as the pitch between the lines of the spiral 72 or longer than the pitch between the lines, the center of the irradiation region 71 moves on the spiral 72 along the spiral 72, so Irradiation rays are evenly irradiated without any gaps.
By moving on the spiral 72 along the spiral 72 to the center of the irradiation region 71, it becomes unnecessary to protrude the irradiation line outside the irradiation surface 77, and the tact time is shortened.

  The control device 19 is not limited to the configuration in which the center of the irradiation region 71 is moved along the spiral 72, and the horizontal movement for moving the center of the irradiation region 71 in the horizontal direction and the same length as the diameter of the irradiation region 71. Alternatively, it may be configured to alternately irradiate up and down movements that move in the up and down direction, and to irradiate irradiation rays uniformly within the irradiation surface 77 without any gap (raster scan method).

  However, in the configuration in which the center of the irradiation region 71 is moved on the spiral 72 along the spiral 72, the maximum acceleration along the horizontal direction and the vertical direction of the first substrate 28a is reduced compared to the raster scan method. It is preferable because the load on the first linear moving device 12a and the first vertical moving device 13a is reduced.

  In the present embodiment, the control device 19 transmits a control signal to the first hand moving device 17a based on the stored contents, and moves the center of the irradiation area 71 along the stored spiral 72 at a constant speed. It is configured as follows. Here, since the irradiation beam is an ion beam, the total irradiation amount of the irradiation beam on the first substrate 28a can be detected by the total amount of current flowing through the first substrate 28a, and the current per unit time can be detected. If the total amount (hereinafter referred to as current amount) is kept constant, the irradiation region 71 moves at a constant speed along the spiral 72, thereby reducing unevenness of ion implantation density within the irradiation surface 77.

  In this example, the current amount by irradiation of the irradiation line is set to a constant value, and the irradiation area 71 is moved at a constant speed on the irradiation surface 77 so that the density becomes uniform. Since the moving speed of 28a is changed and the moving speed of the irradiation area 71 on the irradiation surface 77 is changed, the control device 19 measures the amount of current of the irradiation line and performs irradiation according to the measured value. The moving speed of the region 71 may be changed so that the total irradiation amount (irradiation density) per unit area of the irradiation line becomes uniform within the irradiation surface 77.

  For example, when the current amount of the irradiation line increases, an increase speed corresponding to the increase amount is added to the moving speed of the irradiation region 71, and when the current amount of the irradiation line decreases, a decrease speed corresponding to the decrease amount is added to the irradiation region 71. What is necessary is just to subtract from movement speed.

Next, the center axis of the irradiation line (the optical axis if light) and the incident angle to the irradiation surface 77 will be described.
With reference to FIGS. 7A and 7B, when the direction of the first hand 18a is changed by the first direction changing device 14a, the irradiation region of the normal line of the irradiation surface 77 of the first substrate 28a is changed. The incident angle φ formed by the normal line 79 passing through the center 71 and the beam axis 49 which is the central axis of the irradiation line is changed. In this embodiment, the irradiation line is an ion beam, and when ions in the ion beam are implanted into the first substrate 28a from the irradiation surface 77, the ion implantation depth is changed by changing the incident angle φ. Is done.

  Assuming that a plane perpendicular to the beam axis 49 and including the center of the irradiation region 71 is a moving plane and the first substrate 28a moves in the moving plane, the irradiation is performed when the incident angle φ is not zero. The position of the region relative to the reference plane 51 moves along the beam axis 49.

  The movement amount of the first substrate 28a can be decomposed into a movement component in the up and down direction 63 and a movement component in the left and right direction 61 in the movement plane, and the irradiation region 71 is used for the movement of the first substrate 28a. Along with this, the reference surface 51 and the irradiation position 59 move in a direction parallel to the beam axis 49, that is, in the front-rear direction 62. The movement is the amount of moving component in the vertical direction 63 × tan θ.

  Then, even if the irradiation position 59 is positioned on the irradiation surface 77 before the movement of the first substrate 28a, when the first substrate 28a moves, the irradiation position 59 is separated from the irradiation surface 77, and the irradiation surface is located at the focal position. 77 will not be located.

  Here, the first hand moving device 17a is provided with an auxiliary moving device for moving the first hand 18a in the front-rear direction 62 parallel to the beam axis 49 (forward movement and backward movement). The hand 18a is configured to move forward and backward in the front-rear direction 62 parallel to the beam axis 49 with respect to the reference plane 51, and the control device 19 tilts when the first hand 18a is tilted. Or the incident angle φ, the amount of movement of the first hand 18 a in the vertical direction 63 is obtained, and the value is multiplied by tan φ so that the irradiation position 59 is positioned on the irradiation surface 77. It is moved in the front-rear direction 62 along the beam axis 49.

  If the auxiliary moving device moves the first hand 18a so as to cancel the movement amount obtained by multiplying the movement amount Δ in the vertical direction 63 by tanφ, the state where the irradiation position 59 is positioned on the irradiation surface 77 is maintained. .

  With the irradiation position 59 positioned on the irradiation surface 77, the first hand 18a is moved in the up-down direction 63 and the left-right direction 61 while the first hand 18a is moved in the front-rear direction 62 parallel to the beam axis 49. When moved in proportion, the focal point of the irradiation line is maintained on the irradiation surface 77, and it is possible to prevent a decrease in ion implantation efficiency and non-uniform implantation distribution.

In addition, even if the diameter of the irradiation line is constant and the area of the irradiation region does not change even if the irradiation position 59 is separated from the irradiation surface 77, the auxiliary movement device may not be operated.
In the present embodiment, referring to FIG. 2, auxiliary vacuum chambers 31 and 32 are arranged behind the first and second hand moving devices 17a and 17b when viewed from the reference position (irradiation position 59). Yes.

  In the present embodiment, the distance between the first straight line passing through the center of the first hand 18a parallel to the extending direction of the first linear movement device 12a and the central axis of the first rotating shaft 11a. And the distance between the second straight line passing through the center of the second hand 18b parallel to the extending direction of the second linear movement device 12b and the central axis of the second rotating shaft 11b, Each of the lengths is half the distance between the central axis of the first rotary shaft 11a and the central axis of the second rotary shaft 11b.

Therefore, the direction of the tip of the first and second vertically moving members 23a and 23b is the first straight line in the first state (see FIG. 5) and the second straight line in the second state (see FIG. 2). The space | interval of the left-right direction 61 between straight lines is zero, and the center of the auxiliary | assistant vacuum chambers 31 and 32 is arrange | positioned here in one perpendicular | vertical plane containing a 1st straight line and a 2nd straight line. .
The number of auxiliary vacuum chambers 31 and 32 is two here, but may be one or three or more. The auxiliary vacuum chambers 31 and 32 are arranged in the vertical direction 63.

  Referring to FIG. 1, each auxiliary vacuum chamber 31, 32 is arranged outside vacuum chamber 56, and each auxiliary vacuum chamber 31, 32 and vacuum chamber 56 are connected by a vacuum valve (not shown). The auxiliary vacuum chambers 31 and 32 are connected to vacuum exhaust parts 36a and 36b, respectively. The vacuum exhaust parts 36a and 36b are operated, and the auxiliary vacuum tanks 31 and 32 are evacuated to form a vacuum atmosphere.

  Here, the auxiliary vacuum chamber 31 is a carry-out chamber in which processed substrates are carried out to the outside, and the auxiliary vacuum chamber 32 is a carry-in chamber in which untreated substrates are carried in from the outside. Below, the auxiliary | assistant vacuum chamber of the codes | symbols 31 and 32 is called a carrying-out chamber and a carrying-in chamber, respectively.

A substrate processing method using the above-described substrate processing apparatus 50 will be described.
Referring to FIG. 1, the insides of the vacuum chamber 56, the carry-out chamber 31, and the carry-in chamber 32 are evacuated to form a vacuum atmosphere. Thereafter, evacuation is continued to maintain the vacuum atmosphere.
The emission of irradiation rays from the irradiation device 40 is stopped.

  Referring to FIG. 2, the first and second rotary shafts 11a and 11b are rotated so that the tips of the first and second vertical movement members 23a and 23b are in the second state. The extending direction of the first linear moving device 12a is oriented parallel to the front-rear direction 62 perpendicular to the moving plane. The surface of the first hand 18a is directed upward by the first orientation changing device 14a.

  After the first vertical movement device 13a is operated and the first hand 18a is arranged at the same height as the carry-in chamber 32, the first hand 18a is moved by the first linear movement device 12a with reference to FIG. When linearly moving in the front-rear direction 62, the first hand 18 a is inserted into the carry-in chamber 32.

  An unprocessed first substrate 28a is previously carried into the carry-in chamber 32, and the first substrate 28a is placed on the surface of the first hand 18a inserted into the carry-in chamber 32 and electrostatically adsorbed. Next, the first hand 18 a is linearly moved in the front-rear direction 62 together with the first substrate 28 a by the first linear moving device 12 a and is carried out from the loading chamber 32.

  After the first and second vertical movement devices 13a and 13b are operated and the first hand 18a and the second hand 18b are arranged at different heights, the first and second rotary shafts 11a and 11b are moved. By rotating, the first and second hands 18a and 18b are swiveled, and referring to FIG. 5, the directions of the tips of the first and second vertically moving members 23a and 23b are set to the first state. The extending direction of the second linear moving device 12 b is directed parallel to the front-rear direction 62. The surface of the second hand 18b is directed upward by the second orientation changing device 14b.

When the surface of the first substrate 28a is turned sideways by the first direction changing device 14a, the surface of the first substrate 28a is disposed in the moving plane. The first linear movement device 12a and the first vertical movement device 13a are operated to place the irradiation position 59 on the surface of the first substrate 28a.
When an irradiation beam is emitted from the irradiation device 40, the irradiation beam is irradiated to a portion of the surface of the first substrate 28a that overlaps the irradiation position 59.

  The first hand 18a is moved in the left-right direction 61 and the up-down direction 63 while operating the first linear moving device 12a and the first up-and-down moving device 13a to make the irradiation position 59 stationary with respect to the reference plane 51. Then, the surface of the first substrate 28a is irradiated with irradiation rays without any loss.

  The second vertical movement device 13b is operated while irradiating the surface of the first substrate 28a, and the second hand 18b is arranged at the same height as the loading chamber 32, and then the second linear movement device. When the second hand 18 b is linearly moved in the front-rear direction 62 by 12 b, the second hand 18 b is inserted into the carry-in chamber 32.

An unprocessed second substrate 28b is previously loaded into the carry-in chamber 32, and the second substrate 28b is placed on the surface of the second hand 18b inserted into the carry-in chamber 32 and electrostatically adsorbed. Next, the second hand 18 b is linearly moved in the front-rear direction 62 together with the second substrate 28 b by the second linear moving device 12 b and is carried out from the loading chamber 32.
After irradiating the surface of the first substrate 28a with irradiation rays, the emission of irradiation rays from the irradiation device 40 is stopped.

  After the first and second vertical movement devices 13a and 13b are operated and the first hand 18a and the second hand 18b are arranged at different heights, the first and second rotary shafts 11a and 11b are moved. By rotating, the first and second hands 18a and 18b are pivoted, and referring to FIG. 2, the directions of the tips of the first and second vertical movement members 23a and 23b are set to the second state. The surface of the first hand 18a is directed upward by the first orientation changing device 14a.

  When the surface of the second substrate 28b is turned sideways by the second orientation changing device 14b, the surface of the second substrate 28b is disposed in the moving plane. The second linear movement device 12b and the second vertical movement device 13b are operated to place the irradiation position 59 on the surface of the second substrate 28b.

When the irradiation beam is emitted from the irradiation device 40, the irradiation beam is irradiated on a portion of the surface of the second substrate 28b that overlaps the irradiation position 59.
The second linear movement device 12b and the second vertical movement device 13b are operated to move the second hand 18b in the horizontal direction 61 and the vertical direction 63 while the irradiation position 59 is stationary with respect to the reference plane 51. Then, the surface of the second substrate 28b is irradiated with irradiation rays without any loss.

  The first vertical movement device 13a is operated while irradiating the surface of the second substrate 28b, and the first hand 18a is disposed at the same height as the carry-out chamber 31. When the first hand 18 a is linearly moved in the front-rear direction 62 by the first linear moving device 12 a, the first hand 18 a is inserted into the carry-out chamber 31.

  In the carry-out chamber 31, the electrostatic adsorption between the first hand 18a and the first substrate 28a is eliminated, and the processed first substrate 28a is separated from the surface of the first hand 18a. Next, the first hand 18 a is linearly moved in the front-rear direction 62 by the first linear moving device 12 a and carried out from the carry-out chamber 31.

The above-described steps are repeated in order, and a plurality of substrates are placed one by one at different times and sequentially at the reference position 59 for surface treatment.
Of the first and second hands 18a and 18b, the irradiation position 59 is arranged on the surface of the substrate held by one of the hands and the other is put into and out of the carry-out chamber 31 and the carry-in chamber 32 while irradiating the irradiation line. By replacing the substrate, the tact time of the substrate processing is shortened.

In the above description, the irradiation beam is an ion beam. However, the irradiation beam is not limited to an ion beam as long as it is a charged particle beam, and may be an electron beam.
Further, the irradiation beam is not limited to a charged particle beam, and may be, for example, a laser beam, an ultraviolet ray, or an X-ray. In the case of a charged particle beam, the deflection magnet can be omitted from the substrate processing apparatus 50, and there is an advantage that the apparatus volume can be reduced in size.

  The first and second linear moving devices 12a and 12b and the first and second vertical moving devices 13a and 13b are linear motors, but the first and second linear moving devices 12a, 12b and the first and second vertical movement devices 13a and 13b are provided with motors arranged outside the vacuum chamber 56, and the first and second linear moving members 22a and 22b are moved to the first by the driving force of the motors. The first and second vertical movement members 23a and 23b are reciprocated along the first and second vertical movement devices 13a and 13b by reciprocating along the first and second linear movement devices 12a and 12b. You may comprise.

  In the above example, the control device 19 stores the formula of the spiral 72, and controls the first and second hand moving devices 17a and 17b so that the center of the irradiation area moves on the spiral 72. The coordinates of the position of each point of the vortex 72 and the order of movement may be stored, and the center of the irradiation area may be moved between the coordinates to move on the vortex 72.

  In the above description, the central axes of the first and second rotating shafts 11a and 11b are stationary with respect to the horizontal plane, and when the first and second rotating shafts 11a and 11b rotate, the first and second rotating shafts 11a and 11b rotate. The linear movement devices 12a and 12b are configured to be swiveled in a horizontal plane. However, referring to FIGS. 10 and 11, the first and second linear movement devices 12a and 12b are stationary with respect to the horizontal plane. The first and second rotary shafts 11a and 11b may be configured to be linearly moved along the extending direction of the first and second linear movement devices 12a and 12b.

  10 and 11, the first and second rotary shafts 11a and 11b are fixed on the first and second linear movement members 22a and 22b. The moving devices 13a and 13b are fixed on the first and second linear moving members 22a and 22b, and the first and second rotating shafts 11a and 11b are fixed on the first and second vertical moving members 23a and 23b. May be.

  10 and 11, the first and second linear movement devices 12a and 12b are oriented in a direction parallel to the movement plane (a direction parallel to the left-right direction 61). First and second loading / unloading chambers 33a and 33b are arranged on the left side and the right side of the second linear movement device 12b, respectively. The first and second linear movement devices 12a and 12b and the first and second vertical movement devices 13a and 13b are operated in a state where the irradiation position 59 is located on the surfaces of the first and second substrates 28a and 28b. As a result, the first and second hands 18a, 18b are moved in the left-right direction 61 and the up-down direction 63, and the surfaces of the first and second substrates 28a, 28b are irradiated with sufficient radiation.

  Further, in a state where the irradiation position 59 is located on the surface of the first and second substrates 28a and 28b, the first and second hands 18a and 18b are placed on the first and second rotary shafts 11a and 11b with the central axis line being taken. When the first hand and the second hand 18a, 18b are moved linearly along the extending direction of the first and second linear moving devices 12a, 12b after being turned 180 degrees to the center, the first, second hands 18a, 18b are first, The first and second substrates 28a and 28b are exchanged in the first and second loading / unloading chambers 33a and 33b, respectively.

DESCRIPTION OF SYMBOLS 10 ... Substrate holding device 11a, 11b ... 1st, 2nd rotating shaft 12a, 12b ... 1st, 2nd linear movement apparatus 13a, 13b ... 1st, 2nd vertical movement apparatus 14a, 14b ... 1st, 2nd direction change apparatus 16a, 16b ... 1st, 2nd arm member 17a, 17b ... 1st, 2nd hand moving apparatus 18a, 18b ... 1st, 2nd hand 19 ... ... Control devices 28a, 28b ... First and second substrates 31, 32 ... Auxiliary vacuum chamber 40 ... Irradiation device 56 ... Vacuum chamber 59 ... Irradiation position (reference position)
72 …… Swirl

Claims (11)

First and second hands for holding the first and second substrates, respectively;
First and second hand moving devices that cause the first and second hands to move up and down in the vertical direction, swivel movement in a horizontal plane, and linear movement in a horizontal plane,
The first and second hands are changed in direction so that the surfaces of the first and second substrates respectively held in the first and second hands are directed upward or laterally, respectively. A second orientation change device;
Controlling the first and second hand moving devices, moving the first and second hands, controlling the first and second direction changing devices, A control device for changing the orientation;
A substrate holding device comprising:
In the control device, a reference position and a reference direction are set,
The first and second substrates held by the first and second hands are located at the same reference position at different times and directed in the same reference direction by the first and second hands. is configured to,
The first and second hand moving devices are:
First and second rotating shafts that rotate around a central axis that includes the center of the swivel movement, and that swivel the first and second hands,
A first and second linear movement device extending in a horizontal plane and causing the first and second hands to perform the linear movement along the extended direction;
The first and second up-and-down movement devices that are vertically installed and cause the first and second hands to move up and down along the up-and-down direction.
The central axes of the first and second rotation axes are stationary with respect to a horizontal plane,
When the first and second rotating shafts are rotated, the first and second linear moving devices are pivoted in a horizontal plane. The first and second arm members are extended in a direction parallel to the extending direction of the first and second linear movement devices, and the first and second arm members are attached to the first and second hands at one end,
When viewing the first and second hand moving devices from the reference position, the first hand moving device is located on the left side, the second hand moving device is located on the right side,
In the state where the first hand is disposed at the reference position, the extending direction of the first linear moving device is directed parallel to the left-right direction, and the first hand is the first arm member. Located at the right end of
In the state where the second hand is arranged at the reference position, the extending direction of the second linear movement device is directed parallel to the left-right direction, and the second hand is the second arm member. The substrate holding device according to claim 1 , wherein the substrate holding device is located at a left end. An interval between a straight line passing through the center of the first hand parallel to the extending direction of the first linear movement device, and the central axis of the first rotation axis;
The distance between the straight line passing through the center of the second hand parallel to the extending direction of the second linear movement device and the central axis of the second rotating shaft is:
3. The substrate holding apparatus according to claim 2 , wherein each of the lengths is half of a distance between a central axis of the first rotary shaft and a central axis of the second rotary shaft. A substrate holding device according to any one of claims 1 to 3 ,
A vacuum chamber;
An irradiation device for emitting an irradiation beam into the vacuum chamber;
Have
The first and second hands are disposed in the vacuum chamber,
The substrate processing apparatus, wherein the reference position is an irradiation position of the irradiation line. The substrate processing apparatus according to claim 4 , wherein an auxiliary vacuum chamber is disposed behind the first and second hand moving devices when the first and second hand moving devices are viewed from the reference position. A plurality of auxiliary vacuum chambers;
The substrate processing apparatus according to claim 5, wherein the auxiliary vacuum chambers are arranged side by side in the vertical direction. The control device moves the first substrate when the first substrate is located at the irradiation position in a state where the irradiation position is stationary with respect to a reference plane, thereby moving the irradiation position. Is moved along the spiral set on the first substrate, and when the second substrate is located at the irradiation position, the second substrate is moved, The substrate processing apparatus of any one of Claims 4 thru | or 6 comprised so that an irradiation position might be moved along the spiral on the spiral set on the said 2nd substrate. A board holding device,
A vacuum chamber ;
An irradiation device for emitting an irradiation beam into the vacuum chamber;
Have
The substrate holding device is
First and second hands for holding the first and second substrates, respectively;
First and second hand moving devices that cause the first and second hands to move up and down in the vertical direction, swivel movement in a horizontal plane, and linear movement in a horizontal plane,
The first and second hands are changed in direction so that the surfaces of the first and second substrates respectively held in the first and second hands are directed upward or laterally, respectively. A second orientation change device;
Controlling the first and second hand moving devices, moving the first and second hands, controlling the first and second direction changing devices, A control device for changing the orientation;
Have
In the control device, a reference position and a reference direction are set,
The first and second substrates held by the first and second hands are located at the same reference position at different times and directed in the same reference direction by the first and second hands. Configured as
The first and second hands are disposed in the vacuum chamber,
The reference position is a substrate processing apparatus that is an irradiation position of the irradiation line,
The control device moves the first substrate when the first substrate is located at the irradiation position in a state where the irradiation position is stationary with respect to a reference plane, thereby moving the irradiation position. Is moved along the spiral set on the first substrate, and when the second substrate is located at the irradiation position, the second substrate is moved, irradiation position, the second configured board processor to move the set spiral upward on the substrate along the spiral. The first and second hand moving devices are:
First and second rotating shafts that rotate around a central axis that includes the center of the swivel movement, and that swivel the first and second hands,
A first and second linear movement device extending in a horizontal plane and causing the first and second hands to perform the linear movement along the extended direction;
The substrate processing apparatus according to claim 8 , further comprising: a first and a second vertical movement device that are vertically arranged and cause the first and second hands to move up and down along the vertical direction. . The first from the reference position, when viewed second hand moving device, any one of the first, second hand moving at the rear of the apparatus is arranged an auxiliary vacuum chamber claims 8 or 9 1 The substrate processing apparatus according to the item . A plurality of auxiliary vacuum chambers;
The substrate processing apparatus according to claim 10, wherein the auxiliary vacuum chambers are arranged side by side in the vertical direction.

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