JP6009782B2 - Contact structure of vibration sensor - Google Patents
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- JP6009782B2 JP6009782B2 JP2012050534A JP2012050534A JP6009782B2 JP 6009782 B2 JP6009782 B2 JP 6009782B2 JP 2012050534 A JP2012050534 A JP 2012050534A JP 2012050534 A JP2012050534 A JP 2012050534A JP 6009782 B2 JP6009782 B2 JP 6009782B2
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- 239000000758 substrate Substances 0.000 claims description 53
- 230000013011 mating Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 description 11
- 238000001514 detection method Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- 238000004458 analytical method Methods 0.000 description 9
- 239000004020 conductor Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000000926 separation method Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Description
本発明は、振動センサの接点構造に関する。 The present invention relates to a contact structure of a vibration sensor.
特許文献１には、光透過口を介して容器の内部空間に光を照射する光源と、検知対象が水平状態にあるとき、上記光透過口を塞ぐように配置されるとともに、検知対象が傾斜されることに伴い、上記容器の内部空間を転がる球体とを備える光学式の傾斜センサが開示されている。この傾斜センサによると、検知対象が水平状態にあるときには、光源からの光が球体によって反射され、これによる反射光が得られるが、検知対象が傾斜されると、当該反射光が得られなくなる。したがって、反射光の有無に基づいて、検知対象となる機器の転倒状態が検知されるようになっている。 In Patent Document 1, a light source that irradiates light into the internal space of a container through a light transmission port and a detection target are arranged so as to close the light transmission port when the detection target is in a horizontal state, and the detection target is inclined. Accordingly, an optical tilt sensor including a sphere that rolls in the internal space of the container is disclosed. According to this tilt sensor, when the detection target is in a horizontal state, the light from the light source is reflected by the sphere, and the reflected light is obtained. However, when the detection target is tilted, the reflected light cannot be obtained. Therefore, the falling state of the device to be detected is detected based on the presence or absence of reflected light.
そして、この技術を振動センサに応用すれば次のようなものが提案される。すなわち、検知対象が振動されることに伴い球体が容器の内部空間を動き回るよう構成すれば、上記と同様の原理により、振動による反射光の変化に基づいて、検知対象となる機器の振動状態が検知されるようになる。 If this technology is applied to a vibration sensor, the following is proposed. In other words, if the sphere is configured to move around the inner space of the container as the detection target is vibrated, the vibration state of the device to be detected is determined based on the change in reflected light due to the vibration based on the same principle as described above. It will be detected.
しかしながら、基板上に容器を配置し、その内部空間を球体が動き回るよう構成すると、振動センサがかさ高になり、それを例えば車両キーとして所持される携帯機に搭載すると、携帯機のかさが増し、持ち運びに不便が生じる。 However, when the container is arranged on the substrate and the sphere moves around the inner space, the vibration sensor becomes bulky, and if it is mounted on a portable device carried as a vehicle key, for example, the portable device will increase in bulk. Inconvenient to carry.
本発明は、このような問題点に着目してなされたものであって、その目的は、かさ高さを抑制することが可能な振動センサの接点構造を提供することにある。 The present invention has been made paying attention to such problems, and an object of the present invention is to provide a contact structure for a vibration sensor capable of suppressing bulkiness.
上記の目的を達成するために、請求項１に記載の発明は、振動センサの接点構造において、基板の板厚方向に沿って設けられた貫通孔を当該基板の表裏両側から塞ぐ一対の接点と、前記貫通孔に配置され、前記一対の接点に対し、両接点を導通させる接触位置と、両接点を導通させない離間位置とに亘り前記基板の厚みの範囲内で運動可能な接点球とを備え、前記一対の接点はそれぞれ、対をなす相手側の接点に対し、前記基板の板厚方向に沿って接近と離間を繰り返す波板状に形成され、互いの相手側の接点に対する接近部同士の間隔が前記接点球の大きさ以下に設定されているとともに、対をなす相手側の接点から前記基板の板厚方向に沿って最も離間する頂部が前記基板との接続部に対して面一となっていることをその要旨としている。 To achieve the above object, the invention according to claim 1 is a vibration sensor contact structure comprising: a pair of contacts for closing through holes provided along the thickness direction of the substrate from both sides of the substrate; A contact ball disposed in the through-hole and movable with respect to the pair of contacts within a range of the thickness of the substrate over a contact position where both contacts are conducted and a separated position where both contacts are not conducted. Each of the pair of contacts is formed in a corrugated plate shape that repeats approaching and separating along the thickness direction of the substrate with respect to the mating contacts of the pair, The interval is set to be equal to or smaller than the size of the contact ball, and the top portion that is the farthest along the thickness direction of the substrate from the paired contact is flush with the connection portion with the substrate. and that it is as its gist
同構成によると、検知対象が振動すると、貫通孔内で接点球が運動し、両接点の導通状態と非導通状態とが周期的に繰り返される。このため、後段での解析を経て検知対象の振動が検知される。ここに接点球の運動は基板の厚みの範囲内に抑えられる。従って、かさ高さを抑制することができる。
尚、検知対象が振動すると、接点球は、両接近部間に臨んで両接点を導通させる接触位置とそれ以外の離間位置とに亘り運動する。これにより、後段での解析を経て検知対象の振動が検知される。ここに両接点を同一形状とすることで、部品の共通化を図ることができる。
According to this configuration, when the detection target vibrates, the contact ball moves in the through hole, and the conduction state and the non-conduction state of both contacts are periodically repeated. For this reason, the vibration of the detection target is detected through analysis in the subsequent stage. Here, the movement of the contact ball is suppressed within the thickness range of the substrate. Therefore, the bulk height can be suppressed.
When the object to be detected vibrates, the contact ball moves between a contact position where the contact ball faces between the two approaching portions and the two contact points are brought into conduction, and another separated position. Thereby, the vibration of the detection target is detected through analysis in the subsequent stage. By making both the contacts into the same shape here, it is possible to share the parts.
請求項２に記載の発明は、請求項１に記載の振動センサの接点構造において、前記一対の接点間には、両接点に対し前記接点球が接触されつつ当該接点球の通過を阻む幅狭部が設けられていることをその要旨としている。 According to a second aspect of the present invention, in the contact structure of the vibration sensor according to the first aspect, between the pair of contacts, the contact ball is in contact with both the contacts while the width of the contact ball is blocked. The gist is that the section is provided.
同構成によると、接点球が幅狭部に臨むとき両接点が導通状態となる。この際、幅狭部によって接点球の通過が阻まれるため、その先、すなわち基板の貫通孔を形成する壁面のうち該当の箇所に対する衝突が回避される。従って、基板に対する衝撃を緩和することができる。 According to this configuration, when the contact ball faces the narrow portion, both contacts are in a conductive state. At this time, since the passage of the contact ball is prevented by the narrow portion, the collision with the corresponding portion of the wall surface forming the through hole of the substrate, that is, the substrate through hole is avoided. Therefore, the impact on the substrate can be reduced.
請求項３に記載の発明は、請求項１又は２に記載の振動センサの接点構造において、前記一対の接点間には、前記接点球を抜け出し可能に保持する保持部が設けられていることをその要旨としている。 According to a third aspect of the present invention, in the contact structure of the vibration sensor according to the first or second aspect , a holding portion is provided between the pair of contacts so as to hold the contact ball so as to be pulled out. This is the gist.
同構成によると、検知対象が振動されていないとき、接点球が保持部で保持されることによって、両接点が導通状態又は非導通状態で維持される。このため、後段での解析に際し、振動なしの状態を安定的に検知することができる。 According to this configuration, when the detection target is not vibrated, the contact ball is held by the holding unit, so that both the contacts are maintained in a conductive state or a non-conductive state. For this reason, it is possible to stably detect a state without vibration during analysis in the subsequent stage.
請求項４に記載の発明は、請求項１〜３のいずれか一項に記載の振動センサの接点構造において、前記貫通孔は、前記基板の表裏両側が互いに絶縁されたノンスルーホールであることをその要旨としている。 According to a fourth aspect of the present invention, in the contact structure of the vibration sensor according to any one of the first to third aspects, the through hole is a non-through hole in which both sides of the substrate are insulated from each other. Is the gist.
本構成とは異なり、スルーホールによる基板の表裏両側を電気的に接続する導電体が貫通孔に設けられる構成では、その導電体によって両接点が導通されることがないように、当該導電体を避けるかたちで接点を設ける必要がある。これに対し、本構成では、元々導電体を有さないノンスルーホールに当該接点構造が設けられるため、接点配置の自由度を高めることができる。 Unlike this configuration, in a configuration in which a through hole is provided with a conductor that electrically connects both the front and back sides of the substrate, the conductor is connected so that both contacts are not conducted by the conductor. It is necessary to provide a contact in a way that avoids it. On the other hand, in this structure, since the said contact structure is provided in the non-through hole which does not originally have a conductor, the freedom degree of contact arrangement can be raised.
本発明によれば、かさ高さを抑制することができる。 According to the present invention, the bulkiness can be suppressed.
以下、本発明を車両キーとして所持される携帯機に搭載される振動センサの接点構造に具体化した一実施の形態について説明する。この携帯機を車両オーナが所持することに伴い、当該振動センサによって振動が検知されると、車両側の通信装置との間で通信を成立させるために、携帯機内蔵の通信部品がスリープ状態から起動される。すなわち、振動が検知されない状況では、上記通信部品のスリープ状態が維持されることで、携帯機の省電力化が図られる。尚、車両側の通信装置との間で通信が成立し、これによる電気的なキー認証を経て当該車両に適合する正規の車両キーが存在すると肯定判断されると、ドア錠の施解錠やエンジンの始動が許容される。 Hereinafter, an embodiment in which the present invention is embodied in a contact structure of a vibration sensor mounted on a portable device carried as a vehicle key will be described. When the vibration is detected by the vehicle owner with the possession of the portable device, the communication component built in the portable device is brought into the sleep state in order to establish communication with the communication device on the vehicle side. It is activated. That is, in a situation where vibration is not detected, the sleep state of the communication component is maintained, so that power saving of the portable device can be achieved. If communication is established with the communication device on the vehicle side, and it is determined that there is a proper vehicle key suitable for the vehicle through electrical key authentication, the door lock and unlocking and engine Is allowed to start.
図１に示すように、上記通信部品等の実装される基板１の所要の位置には、当該基板１の板厚方向に沿って同基板１を貫通するノンスルーホール２が設けられている。ノンスルーホールとは、基板の表裏両側が互いに絶縁された貫通孔を指し、したがってスルーホールによる基板の表裏両側を電気的に接続する導電体が貫通孔に設けられる構成とは異なる。そして、図２に示すように、この基板１には、上記ノンスルーホール２を当該基板１の表裏両側から塞ぐ一対の接点３、４が実装され、両接点３、４間には、金メッキにより導電性を有する接点球５が配置されている。尚、接点３は基板１の表側にパターン化された銅箔６にはんだ付けにより接合され、接点４は基板１の裏側にパターン化された銅箔７にはんだ付けにより接合されている。 As shown in FIG. 1, a non-through hole 2 penetrating the substrate 1 is provided along a thickness direction of the substrate 1 at a required position of the substrate 1 on which the communication component or the like is mounted. The non-through hole refers to a through hole in which both the front and back sides of the substrate are insulated from each other. Accordingly, a conductor that electrically connects the front and back sides of the substrate through the through hole is different from the configuration in which the through hole is provided. As shown in FIG. 2, the substrate 1 is mounted with a pair of contacts 3 and 4 for closing the non-through hole 2 from both the front and back sides of the substrate 1, and gold plating is provided between the contacts 3 and 4. A contact ball 5 having conductivity is arranged. The contact 3 is joined to the copper foil 6 patterned on the front side of the substrate 1 by soldering, and the contact 4 is joined to the copper foil 7 patterned on the back side of the substrate 1 by soldering.
上記接点３、４は同一形状をなし、具体的には外縁の形状が略正方形の薄板状に形成されるとともに、金メッキにより導電性を有している。そのうち接点３には、ノンスルーホール２を基板１の表側から取り囲みつつ銅箔６に接合される接続部１１、当該接点３の中央に位置するとともに、ノンスルーホール２に臨む波板部１２が設けられている。上記波板部１２には、接続部１１から基板１の裏側に向かいつつノンスルーホール２の内部に臨む延出部１３、その延出部１３から当該接点３に対向する接点４に対する接近部１４を経由して基板１の表側に向かう延出部１５が設けられている。また、波板部１２には、上記延出部１５から接点４に対する離間部１６を経由して再び基板１の裏側に向かう延出部１７、その延出部１７から接点４に対する接近部１８を経由して再び基板１の表側に向かいつつ接続部１１に至る延出部１９が設けられている。これにより波板部１２は断面が略Ｗ字形状をなしている。尚、接近部１４、１８は、基板１の裏側に向かって窪むリング状の凹部３ａ（図１参照）の底部を構成し、離間部１６は、その凹部３ａの底部から基板１の表側に向かって隆起する隆起部３ｂの頂部を構成している。離間部１６は接続部１１に対し略面一となっている。 The contacts 3 and 4 have the same shape. Specifically, the shape of the outer edge is formed as a thin plate having a substantially square shape, and is electrically conductive by gold plating. Among them, the contact 3 includes a connection portion 11 that is joined to the copper foil 6 while surrounding the non-through hole 2 from the front side of the substrate 1, and a corrugated plate portion 12 that is located at the center of the contact 3 and faces the non-through hole 2. Is provided. The corrugated plate portion 12 includes an extension portion 13 facing the inside of the non-through hole 2 from the connection portion 11 toward the back side of the substrate 1, and an approach portion 14 for the contact point 4 facing the contact point 3 from the extension portion 13. An extension 15 is provided toward the front side of the substrate 1 via Further, the corrugated plate portion 12 includes an extension portion 17 that extends from the extension portion 15 to the back side of the substrate 1 via a separation portion 16 for the contact point 4, and an approach portion 18 that extends from the extension portion 17 to the contact point 4. An extending portion 19 is provided which reaches the connecting portion 11 while going again to the front side of the substrate 1 via the via. As a result, the corrugated plate portion 12 has a substantially W-shaped cross section. The approaching portions 14 and 18 constitute a bottom portion of a ring-shaped recess 3a (see FIG. 1) that is recessed toward the back side of the substrate 1, and the spacing portion 16 extends from the bottom of the recess 3a to the front side of the substrate 1. The top part of the protruding part 3b which protrudes upward is comprised. The spacing portion 16 is substantially flush with the connection portion 11.
一方、接点４には、ノンスルーホール２を基板１の裏側から取り囲みつつ銅箔７に接合される接続部２１、当該接点４の中央に位置するとともに、ノンスルーホール２に臨む波板部２２が設けられている。上記波板部２２には、接続部２１から基板１の表側に向かいつつノンスルーホール２の内部に臨む延出部２３、その延出部２３から当該接点４に対向する接点３に対する接近部２４を経由して基板１の裏側に向かう延出部２５が設けられている。また、波板部２２には、上記延出部２５から接点３に対する離間部２６を経由して再び基板１の表側に向かう延出部２７、その延出部２７から接点３に対する接近部２８を経由して再び基板１の裏側に向かいつつ接続部２１に至る延出部２９が設けられている。これにより波板部２２は断面が略反転Ｗ字形状をなしている。尚、接近部２４、２８は、基板１の表側に向かって窪むリング状の凹部４ａ（図１参照）の底部を構成し、離間部２６は、その凹部４ａの底部から基板１の裏側に向かって隆起する隆起部４ｂの頂部を構成している。離間部２６は接続部２１に対し略面一となっている。 On the other hand, the contact 4 surrounds the non-through hole 2 from the back side of the substrate 1 and is joined to the copper foil 7. The corrugated plate 22 is located at the center of the contact 4 and faces the non-through hole 2. Is provided. The corrugated plate portion 22 includes an extension portion 23 facing the inside of the non-through hole 2 from the connection portion 21 toward the front side of the substrate 1, and an approach portion 24 for the contact point 3 facing the contact point 4 from the extension portion 23. An extending portion 25 is provided toward the back side of the substrate 1 via the. Further, the corrugated plate portion 22 includes an extending portion 27 that is directed again from the extending portion 25 to the front side of the substrate 1 via a separating portion 26 with respect to the contact 3, and an approaching portion 28 that extends from the extending portion 27 to the contact 3. An extending portion 29 that reaches the connection portion 21 while going to the back side of the substrate 1 again is provided. As a result, the corrugated plate portion 22 has a substantially inverted W-shaped cross section. The approach parts 24 and 28 constitute a bottom part of a ring-shaped recess 4a (see FIG. 1) that is recessed toward the front side of the substrate 1, and the separation part 26 is formed from the bottom part of the recess 4a to the back side of the substrate 1. The top part of the protruding part 4b which protrudes upward is comprised. The separation part 26 is substantially flush with the connection part 21.
そして、ノンスルーホール２の内部空間のうち、上記接点３の隆起部３ｂと上記接点４の隆起部４ｂとの間のスペースに上記接点球５が運動可能に収容されている。ここに接点３の凹部３ａと接点４の凹部４ａとの間隔、図２を援用すると、両接近部１４、２４同士の間隔は接点球５の径未満に設定され、すなわち両凹部３ａ、４ａの協働により、両接点３、４に対し接点球５が接触されつつ当該接点球５の通過を阻む幅狭部が構成されている。また、接点４の隆起部４ｂの内周壁、図２を援用すると、各延出部２５、２７を含む内周壁により、接点球５を抜け出し可能に保持する保持部が構成されている。 The contact ball 5 is movably accommodated in a space between the raised portion 3 b of the contact 3 and the raised portion 4 b of the contact 4 in the internal space of the non-through hole 2. Here, the distance between the concave portion 3a of the contact 3 and the concave portion 4a of the contact 4, that is, the distance between the two approaching portions 14 and 24 is set to be smaller than the diameter of the contact ball 5, that is, the two concave portions 3a and 4a. As a result of the cooperation, a narrow portion that prevents the contact ball 5 from passing through while the contact ball 5 is in contact with both the contacts 3 and 4 is formed. Further, when the inner peripheral wall of the raised portion 4b of the contact 4 and FIG. 2 are used, the inner peripheral wall including the extending portions 25 and 27 constitutes a holding portion that holds the contact ball 5 so as to be pulled out.
次に、振動センサの接点構造の製造方法について説明する。
図３（ａ）に示すように、基板１の表側の面に対する実装工程では、所要の電気部品と共に接点３が実装される。このとき、波板部１２が所定の向きでノンスルーホール２に臨まれつつ、接続部１１が銅箔６にはんだ付けされる。そして、基板１が表裏反転された後、基板１の裏側の面に対する実装工程が行われる。この裏面実装工程では、図３（ｂ）に示すように、まず接点球５が隆起部３ｂに対し内側から投入される。その後、図３（ｃ）に示すように、所要の電気部品と共に接点４が実装される。このとき、波板部２２が所定の向きでノンスルーホール２に臨まれつつ、接続部２１が銅箔７にはんだ付けされる。
Next, a method for manufacturing the contact structure of the vibration sensor will be described.
As shown in FIG. 3A, in the mounting process on the front surface of the substrate 1, the contact 3 is mounted together with required electrical components. At this time, the connecting portion 11 is soldered to the copper foil 6 while the corrugated plate portion 12 faces the non-through hole 2 in a predetermined direction. And after the board | substrate 1 is turned upside down, the mounting process with respect to the surface of the back side of the board | substrate 1 is performed. In this back surface mounting step, as shown in FIG. 3B, first, the contact ball 5 is thrown into the raised portion 3b from the inside. Thereafter, as shown in FIG. 3C, the contacts 4 are mounted together with required electrical components. At this time, the connecting portion 21 is soldered to the copper foil 7 while the corrugated plate portion 22 faces the non-through hole 2 in a predetermined direction.
次に、振動センサの接点構造の作用について説明する。
振動センサの搭載された携帯機が静止状態にあるとき、接点球５は図４に実線で示すように、基板１の裏側からノンスルーホール２を塞ぐ接点４の隆起部４ｂの内周壁によって静止状態で保持される。このとき、両接点３、４は非導通状態で維持されるため、後段での解析を経て検知対象である携帯機について、振動なしの状態が検知される。したがって、この場合、携帯機内蔵の通信部品のスリープ状態が維持され、当該携帯機の省電力化が図られる。
Next, the operation of the contact structure of the vibration sensor will be described.
When the portable device on which the vibration sensor is mounted is in a stationary state, the contact ball 5 is stationary by the inner peripheral wall of the raised portion 4b of the contact 4 that closes the non-through hole 2 from the back side of the substrate 1, as shown by a solid line in FIG. Held in a state. At this time, since both the contacts 3 and 4 are maintained in a non-conducting state, a state without vibration is detected for the portable device that is the detection target through analysis in the subsequent stage. Therefore, in this case, the sleep state of the communication component built in the portable device is maintained, and power saving of the portable device can be achieved.
そして、この携帯機が所持されることに伴い振動すると、接点球５が運動し、両接点３、４は、図４に一点鎖線で示す導通状態と、図４に実線で示す非導通状態とが周期的に繰り返される。このとき、後段での解析を経て携帯機の振動が検知される。したがって、この場合、携帯機内蔵の通信部品がスリープ状態から起動され、車両側の通信装置との間で通信が成立されるようになる。 When the portable device vibrates as it is carried, the contact ball 5 moves, and both the contacts 3 and 4 are in a conductive state indicated by a one-dot chain line in FIG. 4 and a non-conductive state indicated by a solid line in FIG. Is repeated periodically. At this time, the vibration of the portable device is detected through analysis at a later stage. Therefore, in this case, the communication component built in the portable device is activated from the sleep state, and communication is established with the communication device on the vehicle side.
以上説明したように、本実施の形態によれば、以下の効果を奏することができる。
（１）検知対象となる携帯機が振動すると、ノンスルーホール２内で接点球５が運動し、両接点３、４の導通状態と非導通状態とが周期的に繰り返される。このため、後段での解析を経て携帯機の振動が検知される。ここに接点球５の運動は基板１の厚みの範囲内に抑えられる。従って、かさ高さを抑制することができる。
As described above, according to the present embodiment, the following effects can be obtained.
(1) When the portable device to be detected vibrates, the contact ball 5 moves in the non-through hole 2, and the conduction state and the non-conduction state of both the contacts 3, 4 are periodically repeated. For this reason, the vibration of the portable device is detected through an analysis at a later stage. Here, the movement of the contact ball 5 is suppressed within the thickness range of the substrate 1. Therefore, the bulk height can be suppressed.
（２）接点球５が両凹部３ａ、４ａによる幅狭部に臨むとき両接点３、４が導通状態となる。この際、幅狭部によって接点球５の通過が阻まれるため、その先、すなわち基板１のノンスルーホール２を形成する壁面のうち該当の箇所に対する衝突が回避される。従って、基板１に対する衝撃を緩和することができる。 (2) When the contact ball 5 faces the narrow portion formed by the two concave portions 3a and 4a, the both contacts 3 and 4 are in a conductive state. At this time, since the passage of the contact ball 5 is prevented by the narrow portion, the collision with the corresponding portion of the wall surface forming the non-through hole 2 of the substrate 1 is avoided. Therefore, the impact on the substrate 1 can be reduced.
（３）携帯機が振動されていないとき、接点球５が隆起部４ｂの内周壁による保持部で保持されることによって、両接点３、４が非導通状態で維持される。このため、後段での解析に際し、振動なしの状態を安定的に検知することができる。尚、接点球５が両凹部３ａ、４ａによる幅狭部に臨む位置で携帯機の静止状態が保たれているとき、両接点３、４は導通状態で維持されるため、この場合も、後段での解析を経て振動なしの状態が検知される。すなわち、この場合、両凹部３ａ、４ａが保持部として機能することで、上記と同様、振動なしの状態を安定的に検知することができる。 (3) When the portable device is not vibrated, the contact ball 5 is held by the holding portion formed by the inner peripheral wall of the raised portion 4b, so that both the contacts 3 and 4 are maintained in a non-conductive state. For this reason, it is possible to stably detect a state without vibration during analysis in the subsequent stage. Note that when the portable device is kept stationary at a position where the contact ball 5 faces the narrow portion formed by the two concave portions 3a and 4a, both the contacts 3 and 4 are maintained in a conductive state. The state without vibration is detected through the analysis at. That is, in this case, since both the concave portions 3a and 4a function as the holding portions, the state without vibration can be stably detected as described above.
（４）携帯機が振動すると、接点球５は、両凹部３ａ、４ａ間に臨んで両接点３、４を導通させる接触位置とそれ以外の離間位置とに亘り運動する。これにより、後段での解析を経て携帯機の振動が検知される。ここに両接点３、４が同一形状であるため、部品の共通化を図ることができる。 (4) When the portable device vibrates, the contact ball 5 moves between a contact position where the contact points 3 and 4 a are brought into conduction between the recesses 3 a and 4 a and other spaced positions. Thereby, the vibration of the portable device is detected through the analysis in the subsequent stage. Here, since both the contacts 3 and 4 have the same shape, the parts can be shared.
（５）本構成とは異なり、スルーホールによる基板の表裏両側を電気的に接続する導電体が貫通孔に設けられる構成では、その導電体によって両接点が導通されることがないように、当該導電体を避けるかたちで接点を設ける必要がある。これに対し、本構成では、元々導電体を有さないノンスルーホール２に当該接点構造が設けられるため、接点３、４の配置の自由度を高めることができる。 (5) Unlike the present configuration, in a configuration in which a conductor that electrically connects the front and back sides of the substrate by through holes is provided in the through hole, the contact is prevented from being conducted by the conductor. It is necessary to provide contacts in a way that avoids electrical conductors. On the other hand, in this structure, since the said contact structure is provided in the non-through-hole 2 which originally does not have a conductor, the freedom degree of arrangement | positioning of the contacts 3 and 4 can be raised.
（６）本構成とは異なり、片持ち支持される可動マスに接点を設け、その接点が検知対象の振動に伴い固定接点に対し導通と非導通とを繰り返す構成では、可動マスの支持部分に応力がかかることで疲労の蓄積が懸念される。これに対し、本構成では、疲労の蓄積が軽減されるとともに、感度を向上するにあたり複雑な構造を必要としないため、コストの低減を図ることができる。 (6) Unlike this configuration, a contact is provided on a movable mass supported in a cantilever manner, and the contact repeats conduction and non-conduction with respect to the fixed contact in response to vibration to be detected. There is concern about the accumulation of fatigue due to stress. On the other hand, in this configuration, accumulation of fatigue is reduced, and a complicated structure is not required to improve sensitivity, so that cost can be reduced.
（７）本構成とは異なり、光学式の振動センサでは、光源から光を照射することに伴い消費電流が増大する懸念があるが、本構成では、両接点３、４の導通状態を監視するために暗電流が必要ではあるが、上記光源による消費電流に比べ僅かで済む。従って、省電力化に貢献できるようになる。 (7) Unlike this configuration, in the optical vibration sensor, there is a concern that the current consumption increases as light is emitted from the light source. In this configuration, the conduction state of both contacts 3 and 4 is monitored. For this reason, a dark current is required, but the current consumption is small compared to the current consumption by the light source. Therefore, it becomes possible to contribute to power saving.
尚、上記実施の形態は、次のように変更して具体化することも可能である。
・上記実施の形態では、両凹部３ａ、４ａ同士の間隔が接点球５の径未満に設定されていたが、この間隔は接点球５の径以下に設定されてもよい。上記間隔が接点球５の径と同じに設定される場合、接点球５は両接点３、４に接触しつつ両凹部３ａ、４ａ間を通過可能となり、この通過に伴って両接点３、４の導通が図られる。
In addition, the said embodiment can also be changed and actualized as follows.
In the above embodiment, the interval between the concave portions 3 a and 4 a is set to be less than the diameter of the contact ball 5, but this interval may be set to be equal to or less than the diameter of the contact ball 5. When the distance is set to be the same as the diameter of the contact ball 5, the contact ball 5 can pass between the recesses 3 a and 4 a while being in contact with both the contacts 3 and 4. Continuity is achieved.
・上記実施の形態では、一対の接点３、４の双方が波板状に形成されていたが、少なくとも一方が平板状に形成されてもよい。尚、波板状或いは平板状に限らず、例えば、ノンスルーホール２の径方向に沿って互いの間隔が線形に狭くなる傾斜部の設けられた接点３、４であってもよい。いずれにせよ、両接点間には、接点球５の径以下の間隔を有する箇所が設けられる。 In the above embodiment, both the pair of contacts 3 and 4 are formed in a corrugated plate shape, but at least one of them may be formed in a flat plate shape. Note that the contact points 3 and 4 are not limited to the corrugated plate shape or the flat plate shape. For example, the contact points 3 and 4 may be provided with inclined portions in which the distance between the non-through holes 2 is linearly narrowed along the radial direction. In any case, a portion having an interval equal to or smaller than the diameter of the contact ball 5 is provided between both the contacts.
・上記実施の形態では、銅箔６に対し接点３が、また、銅箔７に対し接点４がそれぞれはんだ付けにより接合されていたが、その接合方法ははんだ付けに限定されない。例えば、導電性の接着材による接着又は加圧を伴うかしめ等による接合が行われてもよい。 In the above embodiment, the contact 3 is bonded to the copper foil 6 and the contact 4 is bonded to the copper foil 7 by soldering, but the bonding method is not limited to soldering. For example, bonding by a conductive adhesive or caulking with pressure may be performed.
・本発明は傾斜センサの接点構造に適用されてもよい。 The present invention may be applied to a contact structure of a tilt sensor.
１…基板、２…ノンスルーホール（貫通孔）、３…接点、４…接点、５…接点球、６…銅箔、７…銅箔、１１…接続部、１２…波板部、１３…延出部、１４…接近部、１５…延出部、１６…離間部、１７…延出部、１８…接近部、１９…延出部、２１…接続部、２２…波板部、２３…延出部、２４…接近部、２５…延出部、２６…離間部、２７…延出部、２８…接近部、２９…延出部。 DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Non-through hole (through-hole), 3 ... Contact, 4 ... Contact, 5 ... Contact ball | bowl, 6 ... Copper foil, 7 ... Copper foil, 11 ... Connection part, 12 ... Corrugated board part, 13 ... Extension part, 14 ... Approach part, 15 ... Extension part, 16 ... Separation part, 17 ... Extension part, 18 ... Access part, 19 ... Extension part, 21 ... Connection part, 22 ... Corrugated plate part, 23 ... An extension part, 24 ... an approach part, 25 ... an extension part, 26 ... a separation part, 27 ... an extension part, 28 ... an approach part, 29 ... an extension part.
Claims (4)
基板の板厚方向に沿って設けられた貫通孔を当該基板の表裏両側から塞ぐ一対の接点と、
前記貫通孔に配置され、前記一対の接点に対し、両接点を導通させる接触位置と、両接点を導通させない離間位置とに亘り前記基板の厚みの範囲内で運動可能な接点球とを備え、
前記一対の接点はそれぞれ、対をなす相手側の接点に対し、前記基板の板厚方向に沿って接近と離間を繰り返す波板状に形成され、互いの相手側の接点に対する接近部同士の間隔が前記接点球の大きさ以下に設定されているとともに、対をなす相手側の接点から前記基板の板厚方向に沿って最も離間する頂部が前記基板との接続部に対して面一となっている
ことを特徴とする振動センサの接点構造。 In the contact structure of the vibration sensor,
A pair of contacts for closing through holes provided along the thickness direction of the substrate from both the front and back sides of the substrate;
A contact ball disposed in the through-hole and capable of moving within the range of the thickness of the substrate over a contact position where the two contacts are conducted with respect to the pair of contacts and a separated position where the both contacts are not conducted ;
Each of the pair of contacts is formed in a corrugated shape that repeats approaching and separating along the thickness direction of the substrate with respect to the mating contact of the pair, and the distance between the proximity portions with respect to the mating contact of each other Is set to be equal to or smaller than the size of the contact sphere, and the top portion that is the farthest along the thickness direction of the substrate from the paired contact is flush with the connection portion with the substrate. contact structure of a vibration sensor, characterized by that.
請求項１に記載の振動センサの接点構造。 The contact structure of the vibration sensor according to claim 1, wherein a narrow portion is provided between the pair of contacts so that the contact ball is in contact with both contacts while preventing the contact ball from passing therethrough.
請求項１又は２に記載の振動センサの接点構造。 Wherein the pair of contacts, the contact structure of the vibration sensor according to claim 1 or 2 holding portion is provided for holding and exit the contact sphere.
請求項１〜３のいずれか一項に記載の振動センサの接点構造。 The through hole, the contact structure of the vibration sensor according to any one of claims 1 to 3 the front and back sides of the substrate is a non-through holes are insulated from each other.
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