JP6010404B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device including a light emitting element.

  In recent years, development of a light-emitting device having a light-emitting element has been advanced. The light-emitting device has attracted attention with respect to power consumption or product life. As a light emitting device, there is a light emitting device that converts light emitted from a light emitting element into light of a specific wavelength band using a phosphor sheet and takes it out (see Patent Document 1 below).

JP 2007-220737 A

  However, the light emitting device using the sheet-like wavelength conversion member as described in Patent Document 1 is irradiated with the color of light extracted outside depending on the distance between the light emitting element and the wavelength conversion member. There is a possibility that the color of the light varies depending on the location.

  An object of this invention is to provide the light-emitting device which can suppress the change of the color of the light taken out outside.

A light-emitting device according to an embodiment of the present invention includes a substrate, a light-emitting element provided on the substrate, and a frame provided on the substrate and provided with a step inside the upper end and surrounding the light-emitting element. And a sheet-like wavelength conversion member containing a phosphor, provided on the frame so as to cover the light-emitting element, and from above the frame to the wavelength conversion member And a translucent resin that fixes the wavelength conversion member to the frame, and the wavelength conversion member has a recess provided continuously along the outer edge inside the outer edge of the upper surface. And while a part of said translucent resin has penetrated in the said recessed part, the outer edge of the said recessed part is located inside the said level | step difference of the said frame, It is characterized by the above-mentioned.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can suppress the change of the color of the light taken out outside can be provided.

It is a section perspective view showing an outline of a light emitting device concerning one embodiment of the present invention. It is sectional drawing of the light-emitting device which concerns on one Embodiment of this invention. It is the expanded sectional view which expanded a part A of the light-emitting device shown in FIG. It is a permeation | transmission top view of the light-emitting device which concerns on one Embodiment of this invention. It is a permeation | transmission top view of the light-emitting device which concerns on one Embodiment of this invention.

  Embodiments of a light emitting device according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited to the following embodiment.

<Configuration of light emitting device>
FIG. 1 is a schematic perspective view of a light emitting device 1 according to an embodiment of the present invention, and a part thereof is viewed in cross section. FIG. 2 is a cross-sectional view of the light emitting device shown in FIG. FIG. 3 is an enlarged cross-sectional view of a part A of the light emitting device shown in FIG. FIG. 4 is a transmission plan view of the light-emitting device, and shows a state in which the wavelength conversion member, the translucent resin, and the sealing member are removed. FIG. 5 is a transmission plan view of the light-emitting device, and shows the positional relationship between the wavelength conversion member and the frame. In FIG. 5, the translucent resin and the sealing member are removed.

  The light emitting device 1 includes a substrate 2, a light emitting element 3 provided on the substrate 2, a frame 4 surrounding the light emitting element 3 provided on the substrate 2, and covering the light emitting element 3 on the frame 4. The sheet-like wavelength conversion member 6 containing the phosphor 5 is provided between the light-emitting element 3 and the light-emitting element 3, and the wavelength conversion member 6 is provided over the wavelength conversion member 6 from the frame 4. A translucent resin 7 fixed to the substrate. Further, the wavelength conversion member 6 has a concave portion P provided continuously along the outer edge on the inner side of the outer edge on the upper surface, and a part of the translucent resin 7 enters the concave portion P. The light emitting element 3 is, for example, a light emitting diode, and emits light when electrons and holes in a pn junction using a semiconductor are recombined.

  The substrate 2 is an insulating substrate and is made of, for example, a ceramic material such as alumina or mullite, or a glass ceramic material. Or it consists of a composite material which mixed several materials among these materials. The substrate 2 can be made of a polymer resin in which metal oxide fine particles capable of adjusting the thermal expansion of the substrate 2 are dispersed.

  The substrate 2 is formed with a wiring conductor that electrically connects the inside and outside of the substrate 2. The wiring conductor is made of a conductive material such as tungsten, molybdenum, manganese, or copper. For the wiring conductor, for example, a metal paste obtained by adding an organic solvent to a powder of tungsten or the like is printed in a predetermined pattern on a ceramic green sheet to be the substrate 2, and a plurality of ceramic green sheets are laminated and fired. Is obtained. For example, a plating layer such as nickel or gold is formed on the surface of the wiring conductor to prevent oxidation. Further, on the upper surface of the substrate 2, in order to reflect light efficiently above the substrate 2, a metal reflective layer such as aluminum, silver, gold, copper, or platinum is provided with a space between the wiring conductor and the plating layer. It may be formed.

  The light emitting element 3 is mounted on the substrate 2. The light emitting element 3 is electrically connected to, for example, a brazing material or solder on a plating layer that adheres to the surface of the wiring conductor formed on the substrate 2.

  The light emitting element 3 has a translucent base and an optical semiconductor layer formed on the translucent base. The translucent substrate may be any substrate that can grow an optical semiconductor layer using a chemical vapor deposition method such as a metal organic chemical vapor deposition method or a molecular beam epitaxial growth method. As a material used for the light-transmitting substrate, for example, sapphire, gallium nitride, aluminum nitride, zinc oxide, zinc selenide, silicon carbide, silicon, or zirconium diboride can be used. In addition, the thickness of a translucent base | substrate is 50 micrometers or more and 1000 micrometers or less, for example.

The optical semiconductor layer includes a first semiconductor layer formed on the translucent substrate, a light emitting layer formed on the first semiconductor layer, and a second semiconductor layer formed on the light emitting layer. . The first semiconductor layer, the light emitting layer, and the second semiconductor layer are, for example, a group III nitride semiconductor, a group III-V semiconductor such as gallium phosphide or gallium arsenide, or a group III nitride such as gallium nitride, aluminum nitride, or indium nitride. A physical semiconductor or the like can be used. The thickness of the first semiconductor layer is, for example, 1 μm to 5 μm, the thickness of the light emitting layer is, for example, 25 nm to 150 nm, and the thickness of the second semiconductor layer is, for example, 50 nm to 600 nm. Moreover, in the light emitting element 3 configured as described above, an element that emits excitation light in a wavelength range from ultraviolet light to blue light of 370 nm to 430 nm, for example, can be used.

  The frame 4 is made of a ceramic material like the substrate 2, is laminated on the upper surface of the substrate 2, and is connected via, for example, a resin. The frame 4 is provided so as to surround the light emitting element 3 on the substrate 2. Note that when the shape of the inner wall surface of the frame 4 is circular in plan view, the light emitted from the light emitting element 3 can be reflected in all directions and emitted to the outside. Further, the frame body 4 may be integrally fired on the upper surface of the substrate 2 so as to be integrated with the substrate 2.

  The frame 4 may be made of a porous material formed by sintering a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide or yttrium oxide in a desired shape. In the case where the frame body 4 is made of a porous material, the frame body 4 is prevented from being reduced in reflectivity due to light energy emitted from the light emitting element 3 and mechanical strength deterioration. Furthermore, the light from the light emitting element 3 is diffused and reflected on the surface of the frame 4 made of a porous material. Therefore, the light emitted from the light emitting element 3 enters the wavelength conversion member 6 without being concentrated on a part of the wavelength conversion member 6. As a result, the wavelength conversion member 6 has a decrease in wavelength conversion efficiency due to a temperature increase in a part of the wavelength conversion member 6, and a decrease in transmittance and mechanical strength due to a temperature increase in a part of the wavelength conversion member 6. Is suppressed.

  Further, the region surrounded by the frame body 4 is broadly inclined from the lower part toward the upper part, and a step 4 a is provided inside the upper end of the frame body 4. For example, a metal layer made of tungsten, molybdenum, copper, silver, or the like and a plated metal layer made of nickel, gold, or the like covering the metal layer may be formed on the inclined inner wall surface of the frame 4. The plated metal layer has a function of reflecting light emitted from the light emitting element 3.

  In addition, the inclination angle of the inner wall surface of the frame 4 is set to an angle of, for example, 55 degrees or more and 70 degrees or less with respect to the upper surface of the substrate 2. Further, the surface roughness of the inner wall surface of the frame 4 is set such that the arithmetic average roughness Ra is, for example, 1 μm or more and 3 μm or less.

  The step 4 a of the frame body 4 has a function of supporting the wavelength conversion member 6. The step 4 a is formed by cutting out a part of the upper part of the frame body 4 toward the inside, and is provided continuously so as to go around the inner peripheral surface of the frame body 4. The part can be supported.

  The inner surface of the frame 4 at the level difference 4 a has a support surface 4 x that comes into contact with the lower surface of the wavelength conversion member 6, and an inner wall surface 4 y provided so as to be spaced from the side surface of the wavelength conversion member 6. And between the side surface of the wavelength conversion member 6 and the inner wall surface 4 y of the frame body 4, the translucent resin 7 that connects the wavelength conversion member 6 and the frame body 4 to a position lower than the upper surface of the wavelength conversion member 6. Filled.

  As shown in FIG. 3, the inner surface of the frame body 4 at the level difference 4 a is located on the support surface 4 x where the wavelength conversion member 6 is supported by the frame body 4 and the end portion of the lower surface of the wavelength conversion member 6 is opposed to the support surface 4 x. Equivalent to. The length of the support surface 4x in the planar direction is set to, for example, 0.2 mm or more and 2 mm or less. Further, in a state where the wavelength conversion member 6 is supported on the frame body 4, a portion facing the side surface of the wavelength conversion member 6 corresponds to the inner wall surface 4 y. And the length of the up-down direction of the inner wall surface 4y is set to 0.2 mm or more and 2 mm or less, for example.

A region surrounded by the frame body 4 is filled with a light-transmitting sealing member 8. The sealing member 8 has a function of sealing the light emitting element 3 and transmitting light emitted from the light emitting element 3. The sealing member 8 is a region surrounded by the frame body 4 in a state in which the light emitting element 3 is accommodated inside the frame body 4, and the wavelength conversion member 6 is attached to the frame body 4 by thermal expansion of the sealing member 8. It is filled up to a position lower than the height position of the step 4a so as not to be inclined and joined or deformed. Note that the sealing member 8 is made of a translucent insulating resin such as a silicone resin, an acrylic resin, or an epoxy resin. The thermal conductivity of the sealing member 8 is set to, for example, 0.14 W / (m · K) or more and 0.21 W / (m · K) or less.

  The wavelength conversion member 6 has a function of converting the wavelength of light emitted from the light emitting element 3. The wavelength conversion member 6 emits light when the light emitted from the light emitting element 3 enters the inside and the phosphor 5 contained therein is excited.

  The wavelength conversion member 6 is made of, for example, a light-transmitting insulating resin such as a fluororesin, a silicone resin, an acrylic resin, or an epoxy resin, or a light-transmitting glass, and the insulating resin or glass has a wavelength of, for example, 460 nm to 485 nm. Contains a blue phosphor that emits fluorescence, for example, a green phosphor that emits fluorescence of 495 nm to 550 nm, for example, a yellow phosphor that emits fluorescence of 570 nm to 585 nm, for example, a red phosphor that emits fluorescence of 610 nm to 700 nm . When translucent glass is used as the wavelength conversion member 6, the air tightness of the light emitting device 1 can be improved.

The phosphor 5 is uniformly dispersed in the wavelength conversion member 6. The thermal conductivity of the wavelength conversion member 6 is set to, for example, 0.1 W / (m · K) or more and 0.8 W / (m · K) or less. The coefficient of thermal expansion of the wavelength conversion member 6 is set to, for example, 0.8 × 10 ⁻⁵ / K or more and 8 × 10 ⁻⁵ / K or less. The refractive index of the wavelength conversion member 6 is set to, for example, 1.3 or more and 1.6 or less. For example, the refractive index of the wavelength conversion member 6 can be adjusted by adjusting the composition ratio of the material of the wavelength conversion member 6.

  The wavelength conversion member 6 is in the form of a sheet, is supported on the frame body 4, and is provided so as to be spaced from the light emitting element 3. Further, the end portion of the wavelength conversion member 6 is located on the support surface 4 x of the frame body 4, and the side surface of the wavelength conversion section 5 is surrounded by the inner wall surface 4 y of the frame body 4.

  The wavelength converting member 6 has a circular shape as shown in FIG. 5 and is adjusted so that the issuing element 3 is positioned at the center portion thereof as seen through the plane. The outer diameter of the wavelength conversion component 6 is set to, for example, 5 mm or more and 19 mm or less. The entire thickness of the wavelength conversion member 6 is set to, for example, 0.3 mm or more and 3 mm or less, and the thickness is set to be constant. Here, the constant thickness includes a thickness error of 0.5 μm or less. By making the thickness of the wavelength conversion member 6 constant, the amount of light excited in the wavelength conversion member 6 can be adjusted to be uniform, and luminance unevenness in the wavelength conversion member 6 can be suppressed. it can.

  In the wavelength conversion member 6, a concave portion P continuous along the outer edge of the wavelength conversion member 6 is formed inside the outer edge of the wavelength conversion member 6 on the upper surface of the wavelength conversion member 6. The recess P is for pouring a part of the translucent resin 7. A part of the translucent resin 7 is filled in the recess P. As shown in FIG. 5, the recess P is formed in a ring shape formed along the end of the circular wavelength conversion member 6 in plan view. The outer edge of the recess P is located inside the step 4 a of the frame body 4. Here, as shown in FIG. 5, the light from the light emitting element 3 is easily incident on the wavelength conversion member 6 outside the concave portion P by providing the concave portion P so as to be located inside the step 4 a. The light whose wavelength is converted by the wavelength conversion member 6 outside the recess P increases, and the light output of the light emitting device 1 increases.

  As shown in FIG. 3, the recess P has a width in the plane direction along the upper surface of the wavelength conversion member 6 of, for example, 0.5 mm or more and 2 mm or less, and a vertical length of, for example, 0.1 mm or more and 2 .8mm or less. Further, as shown in FIG. 5, the recess P has an outer diameter of, for example, 4 mm to 19 mm and an inner diameter of, for example, 3 mm to 18 mm.

On the step 4 a of the frame 4, the end of the wavelength conversion member 6 is fixed via a translucent resin 7. The translucent resin 7 is for fixing the wavelength conversion member 6 to the frame body 4. The translucent resin 7 is provided from the end portion of the wavelength conversion member 6 to the step 4 a portion of the frame body 4. Further, the translucent resin 7 is provided up to the recess P of the wavelength conversion member 6, and a part of the translucent resin 7 is filled in the recess P.

As the translucent resin 7, for example, a translucent insulating resin such as silicone resin, acrylic resin, or epoxy resin, or translucent glass is used. The thermal conductivity of the translucent resin 7 is set to, for example, 0.1 W / (m · K) or more and 0.8 W / (m · K) or less. The coefficient of thermal expansion of the translucent resin 7 is set to, for example, 0.8 × 10 ⁻⁵ / K or more and 8 × 10 ⁻⁵ / K or less. The translucent resin 7 may have a refractive index of, for example, 1.41 or more and 1.55 or less, and a refractive index smaller than that of the material constituting the wavelength conversion member 6.

  Further, when the thermal conductivity of the translucent resin 7 is set to be larger than the thermal conductivity of the wavelength conversion member 6, the heat transmitted from the wavelength conversion member 6 to the frame body 4 is transmitted through the translucent resin 7. Can be easier. The wavelength conversion member 6 generates heat due to conversion loss when the light emitted from the light emitting element 3 is wavelength-converted by the phosphor 5, and the temperature of the wavelength conversion member 6 rises due to this heat. By making it easy to transfer the heat from the wavelength conversion member 6 to the translucent resin 7, it is possible to suppress the wavelength conversion member 6 from becoming high temperature. It is possible to suppress the wavelength conversion member 6 from being peeled off from the frame body 4 due to deterioration, thermal expansion, and stress caused by the deterioration. Moreover, when the wavelength conversion member 6 becomes high temperature, the wavelength of the light excited by the excitation light emitted from the light emitting element 3 changes, and it becomes difficult to obtain a light color of a desired wavelength, but the temperature of the wavelength conversion member 6 becomes high temperature. By suppressing this, light having a desired wavelength can be extracted. And the light-emitting device 1 which can continue fixing the wavelength conversion member 6 favorably with respect to a connection location can be provided.

  Moreover, when the thermal expansion coefficient of the translucent resin 7 is set to be smaller than the thermal expansion coefficient of the wavelength conversion member 6, the wavelength conversion member 6 tries to cause thermal expansion. Since the translucent resin 7 that hardly thermally expands is formed on the side surface, the stress applied from the translucent resin 7 to the wavelength conversion member 6 due to the thermal expansion of the translucent resin 7 can be suppressed. And since it can suppress effectively that stress is added to the wavelength conversion member 6 more than necessary, the deformation | transformation of the wavelength conversion member 6 resulting from those stress, or peeling from the translucent resin 7 is carried out. Can be suppressed.

  The translucent resin 7 is continuously formed along the outer periphery of the wavelength conversion member 6 in plan view. Then, the translucent resin 7 is adhered to the support surface 4x and the inner wall surface 4y of the frame body 4 from the side surface of the wavelength conversion member 6 in a cross-sectional view, whereby the translucent resin 7 is deposited. The wavelength conversion member 6 and the frame body 4 can be firmly connected through the translucent resin 7. As a result, the connection strength between the wavelength conversion member 6 and the frame 4 can be improved, and the bending of the wavelength conversion member 6 is suppressed. And it can suppress effectively that the optical distance between the light emitting element 3 and the wavelength conversion member 6 fluctuates.

  The translucent resin 7 is provided from the side surface of the wavelength conversion member 6 to the upper surface of the wavelength conversion member 6. The translucent resin 7 covers the upper end of the side surface of the wavelength conversion member 6. Further, a part of the translucent resin 7 is filled in the recess P of the wavelength conversion member 6. The translucent resin 7 attached to the upper surface of the wavelength conversion member 6 is provided with a resin pool that protrudes upward and swells, and is thicker than the surroundings, so that the wavelength conversion member 6 and the translucent resin are formed. The stress generated due to the difference in thermal expansion with respect to 7 is absorbed and relaxed by the resin pool by the translucent resin 7, and by the resin pool by the translucent resin 7 attached to the upper surface of the wavelength conversion member 6. As the surface area of the translucent resin 7 increases, the light extracted from the wavelength conversion member 6 to the outside of the light emitting device 1 through the surface of the translucent resin 7 increases, and the light output of the light emitting device 1 is improved. be able to.

  The light emitted from the light emitting element 3 has a strong directivity and has a property of increasing luminance in a specific direction. That is, the luminance is high immediately above the light emitting element 3, that is, on the so-called optical axis, and the luminance decreases as the distance from the optical axis increases. Therefore, the location of the wavelength conversion member 6 where the distance from the light emitting element 3 is short on the optical axis of the light emitting element 3 increases the amount of light from the light emitting element 3 that passes through the wavelength converting member 6. A portion of the wavelength conversion member 6 where the distance from the light emitting element 3 is long at a position away from the optical axis tends to reduce the amount of light from the light emitting element 3 that passes through the wavelength conversion member 6. On the other hand, the phosphor 5 that is excited by the light of the light emitting element 3 and emits light at a wavelength different from that of the light emitting element 3 emits light in all directions inside the wavelength conversion member 6 and diffuses the wavelength. It is taken out of the conversion member 6.

  If the light emitting element 3 is simply arranged at a position overlapping the central portion of the wavelength conversion member 6 where the concave portion P does not exist, the light and wavelength from the light emitting element 3 extracted from the central portion of the wavelength conversion member 6 to the outside. The mixing ratio of the light that is wavelength-converted by the conversion member 6 and the mixing ratio of the light from the light-emitting element 3 and the light that is wavelength-converted by the wavelength conversion member 6 that are extracted from the end of the wavelength conversion member 6 To be different. That is, since the blue light from the light emitting element 3 does not easily reach the end of the wavelength conversion member 6, the light from the light emitting element 3 extracted from the end of the wavelength conversion member 6 is extracted from the wavelength conversion member 6. The light emitted from the fluorescent material 5 becomes smaller, and on the irradiation surface of the light emitting device 1, the color of the irradiation light is uneven from the central part to the outer peripheral part, or color differences such as ring-like bleeding occur. . For example, in the case of the light emitting device 1 in which the blue light from the light emitting element 3 and the yellow light from the phosphor 5 excited by the light from the light emitting element 3 are mixed to produce white light, the light on the irradiation surface Although it looks white light on the axis, it becomes yellow light as it moves away from the optical axis.

  Therefore, by providing the recess P at the end of the wavelength conversion member 6, the light whose wavelength is converted by the phosphor 5 in the central portion of the wavelength conversion member 6 is reflected by the recess P or the outer periphery of the wavelength conversion member 6. By blocking the diffusion while propagating toward the light, the wavelength-converted light by the phosphor 5 taken out from the end of the wavelength conversion member 6 can be reduced. This is because the light of the phosphor 5 that is excited by the light of the light emitting element 3 emits light in all directions without emitting light in one direction, and is compared with the light emitted from the light emitting element 3. This is because it easily proceeds from the central portion of the wavelength conversion member 6 to the end of the wavelength conversion member 6. Therefore, since the light of the phosphor 5 traveling from the central portion of the wavelength conversion member 6 to the end can be suppressed by the concave portion P, the light of the phosphor 5 taken out from the end of the wavelength conversion member 6 is separated from the optical axis. It becomes small according to the light from the light emitting element 3 taken out from the edge part of the wavelength conversion member 6. As a result, the color of the light extracted outside from the central portion of the wavelength conversion member 6 and the color of the light extracted outside from the end of the wavelength conversion member 6 can be made the same color. It is possible to suppress a phenomenon in which a color difference such as ring-like bleeding is emphasized in the light irradiated to the object.

  The translucent resin 7 is filled between the side surface of the wavelength conversion member 6 and the inner wall surface 4 y of the frame body 4 to a position lower than the upper surface of the wavelength conversion member 6. The wavelength conversion member 6 causes thermal expansion of the wavelength conversion member 6 due to heat generated due to light emitted from the light emitting element 3 or heat generated during wavelength conversion by the phosphor 5 in the wavelength conversion member 6. is there. By providing a distance between the side surfaces of the wavelength conversion member 6 without contacting the inner wall surface 4y of the frame 4, the side surface of the wavelength conversion member 6 can be easily deformed obliquely upward. Thermal stress applied to the conversion member 6 can be relaxed. As a result, it is possible to reduce the possibility that the wavelength conversion member 6 undergoes thermal expansion, and the wavelength conversion member 6 is peeled off from the frame body 4 that is the connection portion thereof. Can continue to stick to.

Further, the height position of the upper end of the inner wall surface 4 y of the frame body 4 is located at a position lower than the height position of the upper end of the side surface of the wavelength conversion member 6. Since the height position of the upper end of the inner wall surface 4 y is set lower than the height position of the upper end of the side surface of the wavelength conversion member 6, the light is emitted from the upper end of the side surface of the wavelength conversion member 6 through the translucent resin 7. As a result, it becomes difficult for the light to be blocked by the inner wall surface 4y of the frame 4 and the light is easily extracted from the wavelength conversion member 6 to the outside of the light emitting device 1. The difference between the height position of the upper end of the inner wall surface 4y and the height position of the upper end of the side surface of the wavelength conversion member 6 is set to, for example, 0.1 mm or more and 2.8 mm or less. The height position of the upper end of the inner wall surface 4y of the frame body 4 may be positioned higher than the height position of the upper end of the side surface of the wavelength conversion member 6. Since the height position of the upper end of the inner wall surface 4 y is set higher than the height position of the upper end of the side surface of the wavelength conversion member 6, the translucent resin 7 extends from the inner wall surface 4 y of the frame body 4 to the outside of the step 4 a. Therefore, it is easy to provide a desired amount of translucent resin 7 between the wavelength conversion member 6 and the step 4a.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

<Method for manufacturing light emitting device>
Here, a method of manufacturing the light emitting device 1 shown in FIG. 1 will be described. First, the substrate 2 is prepared. If the substrate 2 is made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to obtain a mixture. obtain. And a some green sheet is produced from a mixture.

  Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. Then, a metallized pattern serving as a wiring conductor and a metallized pattern for joining the frame body 4 as necessary are printed in a predetermined pattern on the ceramic green sheet serving as the substrate 2 and fired in a state where a plurality of ceramic green sheets are laminated. By doing so, the board | substrate 2 can be prepared.

  A frame 4 is prepared. For the frame 4, a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide, or yttrium oxide is prepared. And after filling the formwork of the frame 4 with a ceramic material and making it dry, the frame 4 which has the level | step difference 4a can be prepared by baking. A metallized pattern is also formed on the frame 4 as necessary on the surface to which the substrate 2 is bonded.

  Next, after the light emitting element 3 is mounted on the wiring conductor via the Au—Sn solder on the upper surface of the substrate 2 and surrounded by the frame body 4, the light emitting element 3 is surrounded on the substrate 2. The frame body 4 is provided by bonding with a silicone resin.

  And the area | region enclosed with the frame 4 on the board | substrate 2 is filled with the silicone resin as the sealing member 8, for example. Then, the silicone resin is heated to cure the silicone resin, thereby forming the sealing member 8 and sealing the light emitting element 3.

  Next, the wavelength conversion member 6 is prepared. The wavelength conversion member 6 can be produced by mixing a phosphor with an uncured resin and using a sheet forming technique such as a doctor blade method, a die coater method, an extrusion method, a spin coating method, or a dip method. The wavelength conversion member 6 can also be obtained by filling the mold with the uncured wavelength conversion member 6 and curing it. Note that a convex portion for forming the concave portion P is formed on the mold.

Then, the prepared wavelength conversion member 6 is positioned on the step 4 a of the frame body 4 and bonded through a silicone resin as the translucent resin 7. And it can stop by the recessed part P that a silicone resin tends to flow inside the recessed part P of the wavelength conversion member 6. FIG. And after filling a part of silicone resin in the recessed part P, a silicone resin can be hardened and the wavelength conversion member 7 can be fixed to the frame 4. FIG. In this way, the light emitting device 1 can be manufactured.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Board | substrate 3 Light-emitting element 4 Frame 4a Level | step difference 4x Support surface 4y Inner wall surface 5 Phosphor 6 Wavelength conversion member 7 Translucent resin 8 Sealing member P Concavity

Claims (5)

A substrate,
A light emitting device provided on the substrate;
Provided on the substrate , a step is provided inside the upper end, and a frame surrounding the light emitting element;
A sheet-like wavelength conversion member containing a phosphor, provided on the frame so as to cover the light-emitting element and spaced apart from the light-emitting element;
A translucent resin provided on the wavelength conversion member from the frame, and having the wavelength conversion member fixed to the frame;
The wavelength conversion member has a recess continuously provided along the outer edge on the inner side of the outer edge of the upper surface, and a part of the translucent resin enters the recess, An outer edge is located inside the step of the frame, and the light emitting device. The light-emitting device according to claim 1,
The light-emitting device, wherein the wavelength conversion member has a circular shape in plan view, and a central portion thereof overlaps with the light-emitting element in plan view. The light-emitting device according to claim 1 or 2,
The light emitting device, wherein the wavelength conversion member has a refractive index greater than that of the translucent resin. The light-emitting device according to any one of claims 1 to 3,
The phosphor is a light-emitting device that converts blue light into yellow light. The light-emitting device according to any one of claims 1 to 4,
The inner surface of the frame body has an inner wall surface provided with a support surface in contact with the lower surface of the wavelength conversion member and a side surface of the wavelength conversion member,
A light emitting device characterized in that a part of the translucent resin enters a position lower than an upper surface of the wavelength conversion member between an inner wall surface of the frame and a side surface of the wavelength conversion member.

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