JP6012430B2 - Cable sheath stripping tool and stripping method using the same - Google Patents
Cable sheath stripping tool and stripping method using the same Download PDFInfo
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- JP6012430B2 JP6012430B2 JP2012254429A JP2012254429A JP6012430B2 JP 6012430 B2 JP6012430 B2 JP 6012430B2 JP 2012254429 A JP2012254429 A JP 2012254429A JP 2012254429 A JP2012254429 A JP 2012254429A JP 6012430 B2 JP6012430 B2 JP 6012430B2
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Description
この発明は、高圧ケーブル等の被覆剥ぎ取り工具に関するもので、更に詳しく述べると、ケーブルの銅テープ層や外部半導電層等の薄膜から成る中間層の剥ぎ取りが容易かつ確実に行える剥ぎ取り工具及びこれを用いた剥ぎ取り方法に関するものである。 The present invention relates to a coating stripping tool for high-voltage cables, and more specifically, a stripping tool that can easily and reliably strip intermediate layers made of thin films such as a copper tape layer and an external semiconductive layer of a cable. And a stripping method using the same.
従来、高圧等のケーブル５の銅テープ層４は、図１５に示すように、残しておく銅テープ層４の箇所の端部に針金７等を巻き付けて縛り、これをストッパーとして、外端部から銅テープ層４を剥がしていく。そして、針金７箇所で、カッター８により銅テープ層４に切り込みを入れ、当該切り込み箇所から針金７の円周に沿って、カッター８で銅テープ層４を切りながら剥がしていた。 Conventionally, as shown in FIG. 15, the copper tape layer 4 of the high-voltage cable 5 is tied with a wire 7 or the like wrapped around the end of the copper tape layer 4 to be left, and this is used as a stopper. The copper tape layer 4 is peeled off. Then, the copper tape layer 4 was cut by the cutter 8 at the 7 places of the wire, and the copper tape layer 4 was cut while being cut by the cutter 8 along the circumference of the wire 7 from the cut place.
また、前記銅テープ層４の内側の外部半導電層６についても、図１６に示すように、残しておく外部半導電層６の箇所の端部外周にテープ９を巻いて固定し、これをストッパーとして、外端部から外部半導電層６を剥がしていく。そして、テープ９箇所で、カッター８により切り込みを入れ、当該切り込み箇所からテープ９の外周に沿ってカッター８で外部半導電層６を切りながら剥がしていく。 Also, as shown in FIG. 16, the outer semiconductive layer 6 inside the copper tape layer 4 is fixed by winding tape 9 around the outer periphery of the end portion of the outer semiconductive layer 6 to be left. The outer semiconductive layer 6 is peeled off from the outer end as a stopper. Then, the tape 8 is cut with a cutter 8, and the external semiconductive layer 6 is cut with the cutter 8 along the outer periphery of the tape 9 from the cut position.
これらの工法では、前記ストッパーに沿ってカッター８で剥ぎ取る層を切っていかなければならず、当該カッター８で剥ぎ取る層の内側の層を傷つけてしまう恐れがある。特に、これらの中間層を剥ぎ取る際、ケーブル５を回転させることが出来ない場合もあり、その場合は、ケーブル５の下部にカッター８を当てなければならず、ケーブル８の下部が作業者から見にくい箇所では、なおさらである。この様に剥ぎ取る層の内側の層を傷つけると当該ケーブル５の絶縁等に支障を来す。また、切り口をきれいに切ることが要求されているが、これも前記工法では、螺旋状に巻かれている銅テープ層４や外部半導電層６を、刃先が斜めに横断するように切り剥がすため、作業者の腕によりまちまちである。従って、これらの作業には、熟練を要する。 In these methods, the layer to be peeled off by the cutter 8 must be cut along the stopper, and the inner layer of the layer to be peeled off by the cutter 8 may be damaged. In particular, when the intermediate layer is peeled off, the cable 5 may not be able to be rotated. In this case, the cutter 8 must be applied to the lower part of the cable 5, and the lower part of the cable 8 is removed from the operator. Especially in places that are difficult to see. If the inner layer of the layer to be peeled is damaged in this manner, the insulation of the cable 5 is hindered. In addition, it is required to cut the cut surface neatly. In this method, too, the copper tape layer 4 and the external semiconductive layer 6 wound in a spiral shape are cut off so that the blade edge crosses diagonally. , It varies depending on the skill of the operator. Therefore, these operations require skill.
そこで、特許文献1のものが開発された。これは、電線被覆剥ぎ用工具を、シース及び絶縁体の剥ぎ取り用ダイスを２個と、ダイスストッパーと、遮蔽銅テープ切り取りバンドと、テクニックナイフとから構成したもので、シースと絶縁体の剥ぎ取りは、前記剥ぎ取り用ダイスを被覆電線の端部に外挿し、ダイスの円筒形部材を被覆電線の芯線方向に移動させながら回転することで、螺旋状に剥ぎ取る。 Then, the thing of patent document 1 was developed. This is a wire covering stripping tool consisting of two sheath and insulator stripping dies, a die stopper, a shielded copper tape cut-off band, and a technique knife. For removal, the stripping die is extrapolated to the end portion of the covered electric wire, and the cylindrical member of the die is rotated while moving in the direction of the core of the covered electric wire, thereby peeling off in a spiral shape.
外部半導電層の剥ぎ取りは、前記ダイスストッパーにテクニックナイフを固定し、ダイスストッパーを旋回させて外部半導電層を輪切りにし、その後テクニックナイフで二つの輪切りの間を縦切りする。また、遮蔽銅テープの剥ぎ取りは、その露出幅に対応した幅を有する締付けバンドを遮蔽銅テープの外周に取り付け、このバンドをストッパーとして剥ぎ取る。 For peeling off the outer semiconductive layer, a technique knife is fixed to the die stopper, the die stopper is turned to cut the outer semiconductive layer, and then the technique knife is used to vertically cut between the two ring cuts. Further, the shielding copper tape is peeled off by attaching a tightening band having a width corresponding to the exposed width to the outer periphery of the shielding copper tape, and peeling this band as a stopper.
しかしながら、前記特許文献1のものは、銅テープ層の剥ぎ取りにおいては、従来の針金に代えて、締付けバンドを用いたもので、作業者は銅テープ層を前記締付けバンドに沿ってカッター等で切り取っていくのは変わらない。従って、銅テープ層の内側の層をカッター等で傷つける恐れがある。 However, in Patent Document 1, the stripping of the copper tape layer uses a tightening band instead of the conventional wire, and the operator uses a cutter or the like along the tightening band to cut the copper tape layer. The cutting will not change. Accordingly, the inner layer of the copper tape layer may be damaged by a cutter or the like.
また、外部半導電層の剥ぎ取りは、被覆電線の外周を２つの板体で挟み込んで、これらを一体に回しながら一方の板体に設けたテクニックナイフにより当該外部半導電層を輪切りに切り、この様にして被覆電線の一定間隔をあけた２箇所を輪切りにし、これらの輪切り箇所の間を作業者がナイフで縦切りする。従って、中の層をカッター等で傷つける恐れがあり、作業者の熟練を要する作業となっている。それ故、前述の従来工法の問題点が解決されていない。 In addition, the outer semiconductive layer is peeled off by sandwiching the outer periphery of the covered electric wire between two plate bodies, and cutting the outer semiconductive layer in a round shape with a technique knife provided on one plate body while rotating these integrally. In this way, two places with a certain interval between the covered electric wires are cut into circles, and the operator cuts between these cut parts with a knife. Therefore, there is a risk of damaging the inner layer with a cutter or the like, which is an operation that requires the skill of the operator. Therefore, the above-described problems of the conventional method have not been solved.
この発明は、この従来技術を踏まえて、作業者の熟練を要せず、中の層を傷つけることなく、極めて容易に銅テープ層や外部半導電層等の中間層の剥ぎ取りが出来るケーブル被覆剥ぎ取り工具及びこれを用いた剥ぎ取り方法を提供するものである。 This invention is based on this prior art, and does not require operator skill, and can easily peel off intermediate layers such as copper tape layers and external semiconductive layers without damaging the inner layers. A stripping tool and a stripping method using the stripping tool are provided.
請求項１の発明は、ケーブル被覆の剥ぎ取る中間層の外周長より長い帯状のコイルバネから成るバネ板を設け、当該バネ板の長手方向に平行する両側縁の一方の一側縁を刃状に尖らせて刃部とし、かつ当該バネ板の一端から離れた位置の前記刃部に、当該刃部の側縁からバネ板の内側に向けて一定幅の切り欠きを設けた、ケーブル被覆剥ぎ取り工具とした。 According to the first aspect of the present invention, there is provided a spring plate made of a strip-shaped coil spring longer than the outer peripheral length of the intermediate layer from which the cable covering is peeled off, and one side edge of both side edges parallel to the longitudinal direction of the spring plate is formed in a blade shape. Stripping the cable sheath, with a sharpened blade part and a notch with a fixed width from the side edge of the blade part toward the inside of the spring plate at the blade part at a position away from one end of the spring plate A tool was used.
また、請求項２の発明は、請求項１の発明において、前記切り欠きの内周縁が鋭利になっていることを特徴とする、ケーブル被覆剥ぎ取り工具とした。 The invention of claim 2 is the cable covering stripping tool according to the invention of claim 1, wherein the inner peripheral edge of the notch is sharp.
また、請求項３の発明は、請求項１又は２のケーブル剥ぎ取り工具を、当該工具の内径より大きい外径を有する銅テープ層又は外部半導電層等の薄膜状中間層の外周に巻き付け、工具の前記切り欠きが剥がそうとする中間層の外周に直に接するようにして当該工具のバネ板を中間層の外周に圧接し、前記中間層を剥がしていき、前記工具の付近まで剥がした前記中間層の一側を前記工具の切り欠きに入れて、工具側に引っ張ることにより前記中間層の一側に切り込みを作り、さらに当該工具側に引っ張りながら、工具の外周に沿って前記中間層を回して、前記工具の刃部により当該中間層を引き剥がしていく、ケーブル被覆剥ぎ取り方法とした。 Further, the invention of claim 3 wraps the cable stripping tool of claim 1 or 2 around the outer periphery of a thin film intermediate layer such as a copper tape layer or an external semiconductive layer having an outer diameter larger than the inner diameter of the tool, The spring plate of the tool was pressed against the outer periphery of the intermediate layer so that the notch of the tool was in direct contact with the outer periphery of the intermediate layer, and the intermediate layer was peeled off to the vicinity of the tool. Putting one side of the intermediate layer into the notch of the tool and pulling it toward the tool side makes a notch on the one side of the intermediate layer, and further pulling toward the tool side, along the outer periphery of the tool, the intermediate layer , And the intermediate layer was peeled off by the blade portion of the tool.
請求項１〜３の各発明によれば、工具のバネ板の一側に刃部を設け、当該刃部に内側に向いて切り欠きを有するため、工具付近まで剥がした銅テープ層又は外部半導電層等の中間層の一側を前記切り欠きに入れて工具側に引っ張れば、容易に中間層に切り込みが入る。また、この切り込みを起点にして、前記中間層を工具側に引っ張りながら工具の外周に沿って前記中間層を回すことにより、前記工具の刃部で前記中間層を剥ぎ取ることが出来る。 According to each invention of Claims 1-3, since the blade part is provided on one side of the spring plate of the tool and the blade part has a notch toward the inside, the copper tape layer or the outer half peeled off to the vicinity of the tool. If one side of the intermediate layer such as a conductive layer is put into the notch and pulled toward the tool side, the intermediate layer is easily cut. Further, the intermediate layer can be peeled off by the blade portion of the tool by turning the intermediate layer along the outer periphery of the tool while pulling the intermediate layer toward the tool starting from the notch.
従って、従来工法や特許文献１のように、カッターやナイフを用いる必要がない。当該工具の、切り欠き及び刃部により前記中間層の端部をきれいに剥ぎ取ることが出来る。しかも、前記工具の切り欠き及び刃部は、前記中間層の外周に固定されているため、どのような作業者でも中間層の内側の層を傷つけることがなく、剥ぎ取り作業ができる。 Therefore, it is not necessary to use a cutter or a knife as in the conventional construction method and Patent Document 1. The end portion of the intermediate layer can be cleanly removed by the notch and the blade portion of the tool. In addition, since the notch and the blade portion of the tool are fixed to the outer periphery of the intermediate layer, any operator can perform the stripping operation without damaging the inner layer of the intermediate layer.
また、この工具はコイルバネから成るバネ板で構成されているため、当該工具で被覆を剥がすケーブルの外周に装着する際、バネ板を端部からその弾性に抗して剥がしながら、ケーブルの外周側面にこれを掛けて巻くことにより装着することが出来るとともに、ケーブルの端部からコイルバネの中心孔を挿入し、所定の位置まで、ケーブルの長手方向に沿って工具をずらして装着することもできる。従って、ケーブルの中間部でも当該工具を装着でき、当該工具のケーブルへの装着は極めて容易である。 In addition, since this tool is composed of a spring plate made of a coil spring, the outer peripheral side surface of the cable is peeled off against the elasticity of the spring plate against the elasticity when the cable is peeled off with the tool. The coil spring can be mounted by being wound around the cable, and the center hole of the coil spring can be inserted from the end of the cable, and the tool can be mounted by shifting the tool along the longitudinal direction of the cable up to a predetermined position. Therefore, the tool can be mounted even at the middle portion of the cable, and mounting of the tool to the cable is extremely easy.
また、当該工具は、帯状のコイルバネから成るため、当該工具の自然状態での内径より大きな外径を有する銅テープ層層及び外部半導電層のケーブルであれば、種々の径のケーブルに使用できる。 Further, since the tool is composed of a strip-shaped coil spring, it can be used for cables of various diameters as long as it is a copper tape layer layer and an external semiconductive layer cable having an outer diameter larger than the inner diameter in the natural state of the tool. .
以下、この発明の実施の形態例１を図に基づいて説明する。この発明の方法に使用するケーブル被覆剥ぎ取り工具Ａは、図１及び図２に示すように、帯状のコイルバネから成るバネ板１を設ける。 Embodiment 1 of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 and 2, the cable covering stripping tool A used in the method of the present invention is provided with a spring plate 1 made of a strip-shaped coil spring.
このバネ板１の長さは、剥ぎ取る中間層の外周長より長いものとする。そして、当該当該バネ板１の長手方向に平行する両側縁の一方の一側縁を刃状に尖らせて刃部２とし、かつ当該バネ板１の長手方向の一端からやや離れた位置の前記刃部２に、当該刃部２の側縁２ａからバネ板１の内側に向けて一定幅の略Ｕ字型の切り欠き３を設けたものである。この切り欠きは、矩形でも良い。また、この切り欠き３の内周縁は刃状に鋭利になっているものが良い。 The length of the spring plate 1 is longer than the outer peripheral length of the intermediate layer to be peeled off. Then, one side edge of both side edges parallel to the longitudinal direction of the spring plate 1 is sharpened in a blade shape to form the blade portion 2, and the position at a position slightly away from one end in the longitudinal direction of the spring plate 1. The blade portion 2 is provided with a substantially U-shaped cutout 3 having a constant width from the side edge 2a of the blade portion 2 toward the inside of the spring plate 1. This notch may be rectangular. Further, the inner peripheral edge of the notch 3 is preferably sharpened like a blade.
従って、この工具Ａは、自然状態では、図１に示す如くコイル状に丸まっており、弾性に抗して図２に示すように広げると、バネ板１の一側の刃部２に前記切り欠き３が設けられていることが分かる。 Therefore, in the natural state, this tool A is rounded in a coil shape as shown in FIG. 1, and when the tool A is spread as shown in FIG. It can be seen that the notch 3 is provided.
次に、工具Ａを用いてケーブル被覆の剥ぎ取り方法のうち、銅テープ層４の剥ぎ取りについて説明する。 Next, stripping of the copper tape layer 4 among the stripping methods of the cable coating using the tool A will be described.
まず、図３に示すように、銅テープ層４を剥ぎ取るケーブル５の当該銅テープ層４の外周に工具Ａを装着する。その際、工具Ａの刃部２を剥ぎ取る銅テープ層４の端部側に位置させる。また、工具Ａの切り欠き３が銅テープ層４の外周に直に接するように、工具Ａのバネ板１を調整する。具体的には図４に示すように、バネ板１の端部を銅テープ層４の外周から外して自体の端部で巻き玉を設ける。また、工具Ａはコイルバネから成る板バネ１であるため、銅テープ層４の外周に圧接される。 First, as shown in FIG. 3, the tool A is mounted on the outer periphery of the copper tape layer 4 of the cable 5 that peels off the copper tape layer 4. In that case, it positions on the edge part side of the copper tape layer 4 which strips off the blade part 2 of the tool A. FIG. Further, the spring plate 1 of the tool A is adjusted so that the notch 3 of the tool A is in direct contact with the outer periphery of the copper tape layer 4. Specifically, as shown in FIG. 4, the end of the spring plate 1 is removed from the outer periphery of the copper tape layer 4, and a wound ball is provided at the end of itself. Further, since the tool A is a leaf spring 1 composed of a coil spring, it is pressed against the outer periphery of the copper tape layer 4.
また、工具Ａの銅テープ層４の外周への装着方法については、バネ板１を端部からその弾性に抗して剥がしながら、銅テープ層４の外周側面にこれを掛けて巻くことにより装着することが出来る。また、銅テープ層４又はケーブル５の端部からコイルバネの中心孔を挿入し、所定の位置まで、銅テープ層４又はケーブル５の長手方向に沿って工具Ａをずらして装着することもできる。これらは、その場の状況に応じて選択できる。 As for the mounting method of the tool A on the outer periphery of the copper tape layer 4, the spring plate 1 is mounted on the outer peripheral side surface of the copper tape layer 4 while winding the spring plate 1 against its elasticity while being peeled off. I can do it. Moreover, the center hole of a coil spring can be inserted from the edge part of the copper tape layer 4 or the cable 5, and the tool A can also be mounted | worn by shifting along the longitudinal direction of the copper tape layer 4 or the cable 5 to a predetermined position. These can be selected according to the situation of the spot.
そして、銅テープ層４をその外端部からケーブル５の周囲で回しながら剥がしていく。当該銅テープ層４が工具Ａ付近まで剥がれると、図５に示すように、工具Ａの切り欠き３に銅テープ層４の一側を引っ掛けて、銅テープ層４を工具Ａ側に引っ張り、銅テープ層４の一側に切り込みを入れる。 Then, the copper tape layer 4 is peeled off while rotating around the cable 5 from the outer end portion. When the copper tape layer 4 is peeled to the vicinity of the tool A, as shown in FIG. 5, one side of the copper tape layer 4 is hooked on the notch 3 of the tool A, and the copper tape layer 4 is pulled to the tool A side. A cut is made on one side of the tape layer 4.
この銅テープ層４の切り込みから、図６に示すように、工具Ａの刃部２に銅テープ層４の一側を当てながら、かつ工具Ａ側に銅テープ層４を引っ張りながら、工具Ａの外周に沿って銅テープ層４を引き剥がしていく。この際、工具Ａの刃部２は鋭利になっており、また、銅テープ層４の外周に圧接されているため、容易に剥がれる。また、当該銅テープ層４を工具Ａの刃部２に沿って引きはがす際、前記バネ板１の端部を巻き付けた巻き玉が邪魔な場合は、当該巻き玉を他の箇所にずらしながら作業をすることもできる。 As shown in FIG. 6, while cutting one side of the copper tape layer 4 against the blade 2 of the tool A and pulling the copper tape layer 4 toward the tool A, as shown in FIG. The copper tape layer 4 is peeled off along the outer periphery. At this time, the blade portion 2 of the tool A is sharp and is easily peeled off because it is pressed against the outer periphery of the copper tape layer 4. When the copper tape layer 4 is peeled off along the blade 2 of the tool A, if the wound ball around the end of the spring plate 1 is in the way, work while shifting the wound ball to another location. You can also
これにより、図７に示すように、銅テープ層４の端部は、工具Ａの一側の刃部２に沿って切断され、工具Ａを外すと、図８に示すように、その切り口が一直線状に形成される。 Thereby, as shown in FIG. 7, the edge part of the copper tape layer 4 is cut | disconnected along the blade part 2 of the one side of the tool A, and when the tool A is removed, as shown in FIG. It is formed in a straight line.
さらに次に、工具Ａを用いて半導電層６の剥ぎ取りについて説明する。 Next, the stripping of the semiconductive layer 6 using the tool A will be described.
まず、図９に示すように、外部半導電層６を剥ぎ取るケーブル５の当該外部半導電層６の外周に工具Ａを装着する。その際、工具Ａの刃部２を剥ぎ取る外部半導電層６の端部側に位置させる。また、工具Ａの切り欠き３が外部半導電層６の外周に直に接するように、工具Ａのバネ板１を調整する。具体的には図１０に示すように、バネ板１の端部を外部半導電層６の外周から外して自体の端部で巻き玉を設ける。なお、工具Ａの前記外部半導電層６の外周への装着方法は、前記銅テープ層４の場合と同じである。 First, as shown in FIG. 9, the tool A is mounted on the outer periphery of the external semiconductive layer 6 of the cable 5 for stripping the external semiconductive layer 6. At that time, the tool 2 is positioned on the end side of the external semiconductive layer 6 from which the blade 2 is peeled off. Further, the spring plate 1 of the tool A is adjusted so that the notch 3 of the tool A is in direct contact with the outer periphery of the external semiconductive layer 6. Specifically, as shown in FIG. 10, the end of the spring plate 1 is removed from the outer periphery of the external semiconductive layer 6, and a wound ball is provided at the end of itself. The method for attaching the tool A to the outer periphery of the outer semiconductive layer 6 is the same as that for the copper tape layer 4.
そして、外部半導電層６をその端部からケーブル５の周囲で回しながら剥がしていく。当該外部半導電層６が工具Ａ付近まで剥がれると、図１１に示すように、工具Ａの切り欠き３に外部半導電層６の一側を引っ掛けて、外部半導電層６を工具Ａ側に引っ張り、外部半導電層６の一側に切り込みを入れる。 Then, the outer semiconductive layer 6 is peeled off while rotating around the cable 5 from the end thereof. When the external semiconductive layer 6 is peeled to the vicinity of the tool A, as shown in FIG. 11, one side of the external semiconductive layer 6 is hooked on the notch 3 of the tool A, and the external semiconductive layer 6 is moved to the tool A side. Pull and cut into one side of the outer semiconductive layer 6.
この外部半導電層６の切り込みから、図１２に示すように、工具Ａの刃部２に外部半導電層６の一側を当てながら、かつ工具Ａ側に外部半導電層６を引っ張りながら、工具Ａの外周に沿って外部半導電層６を引き剥がしていく。この際、工具Ａの刃部２は鋭利になっており、また、外部半導電層６に圧接されているため、外部半導電層６は容易に剥がれる。また、当該外部半導電層６を工具Ａの刃部２に沿って引きはがす際、前記バネ板１の端部を巻き付けた巻き玉が邪魔な場合は、当該巻き玉を他の箇所にずらしながら作業をすることもできる。 From the cut of the external semiconductive layer 6, as shown in FIG. 12, while applying one side of the external semiconductive layer 6 to the blade portion 2 of the tool A and pulling the external semiconductive layer 6 to the tool A side, The outer semiconductive layer 6 is peeled off along the outer periphery of the tool A. At this time, the blade portion 2 of the tool A is sharp and is pressed against the external semiconductive layer 6, so that the external semiconductive layer 6 is easily peeled off. Further, when the outer semiconductive layer 6 is peeled off along the blade part 2 of the tool A, when the wound ball around the end of the spring plate 1 is obstructive, the wound ball is shifted to another place. You can also work.
これにより、図１３に示すように、外部半導電層６の端部は、工具Ａの一側の刃部２に沿って切断され、工具Ａを外すと、図１４に示すように、その切り口が一直線状に形成される。 Thus, as shown in FIG. 13, the end of the outer semiconductive layer 6 is cut along the blade 2 on one side of the tool A, and when the tool A is removed, as shown in FIG. Are formed in a straight line.
以上の説明は、銅テープ層と外部半導電層の剥ぎ取りについて説明したが、この工具Ａはこれらの層にかぎらず、薄膜状の中間層であれば、用いることが出来る。 In the above description, the copper tape layer and the external semiconductive layer have been peeled off. However, the tool A is not limited to these layers, and any thin film-like intermediate layer can be used.
Ａ ケーブル被覆剥ぎ取り工具
１ バネ板 ２ 刃部
２ａ 側縁 ３ 切り欠き
４ 銅テープ層 ５ ケーブル
６ 外部半導電層 ７ 針金
８ カッター ９ テープ
A Cable sheath stripping tool 1 Spring plate 2 Blade 2a Side edge 3 Notch 4 Copper tape layer 5 Cable 6 External semiconductive layer 7 Wire 8 Cutter 9 Tape
Claims (3)
ケーブル被覆の剥ぎ取る中間層の外周長より長い帯状のコイルバネから成るバネ板を設け、
当該バネ板の長手方向に平行する両側縁の一方の一側縁を刃状に尖らせて刃部とし、
かつ当該バネ板の一端から離れた位置の前記刃部に、当該刃部の側縁からバネ板の内側に向けて一定幅の切り欠きを設けたことを特徴とする、ケーブル被覆剥ぎ取り工具。 In the tool to strip off the middle layer of the cable sheath,
A spring plate made of a strip-shaped coil spring longer than the outer peripheral length of the intermediate layer from which the cable covering is peeled off is provided.
One side edge of both side edges parallel to the longitudinal direction of the spring plate is sharpened into a blade shape as a blade part,
A cable covering stripping tool, wherein a notch having a constant width is provided in the blade portion at a position away from one end of the spring plate from the side edge of the blade portion toward the inside of the spring plate.
請求項１又は２のケーブル剥ぎ取り工具を、当該工具の内径より大きい外形を有する中間層の外周に巻き付け、
剥がそうとする中間層の外周に当該工具の前記切り欠きが直に接するようにして当該工具のバネ板を中間層の外周に圧接し、
前記中間層を剥がしていき、前記工具の付近まで剥がした前記中間層の一側を前記工具の切り欠きに入れて、工具側に引っ張ることにより前記中間層の一側に切り込みを作り、
さらに前記中間層を当該工具側に引っ張りながら、工具の外周に沿って前記中間層を回して、前記工具の刃部により当該中間層を引き剥がしていくことを特徴とする、ケーブル被覆剥ぎ取り方法。 In the method of stripping the intermediate layer of the cable covering,
The cable stripping tool according to claim 1 or 2 is wound around the outer periphery of an intermediate layer having an outer shape larger than the inner diameter of the tool,
The spring plate of the tool is pressed against the outer periphery of the intermediate layer so that the notch of the tool is in direct contact with the outer periphery of the intermediate layer to be peeled off,
Peel off the intermediate layer, put one side of the intermediate layer peeled to the vicinity of the tool into the notch of the tool, make a cut on one side of the intermediate layer by pulling to the tool side,
Further, the cable covering stripping method, wherein the intermediate layer is rotated along the outer periphery of the tool while the intermediate layer is pulled toward the tool, and the intermediate layer is peeled off by the blade portion of the tool. .
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