JP6018037B2 - Compression molding apparatus, mold surface parallelism adjustment method, and die height adjustment method - Google Patents

Description

  The present invention relates to a compression molding apparatus for compressing and molding an insert member with a resin material, and a method for adjusting mold surface parallelism and die height in the compression molding apparatus.

  In the case where a semiconductor chip or the like is compression-molded with a resin material, it is required to improve the productivity of the molded product. It is also required to efficiently improve the installation space of the entire compression molding apparatus.

  In order to meet such a demand, in the compression molding apparatus described in Japanese Patent Application Laid-Open No. 2010-94931 (Patent Document 1), two compression molding dies are arranged in a stacked manner, and the top of each of the two dies is arranged. A mold opening / closing means for closing the mold surfaces of the mold and the lower mold is provided. The mold opening / closing means includes a rack and a pinion. In the compression molding apparatus described in Patent Document 1, a thickness adjusting mechanism that can correspond to the thickness of the substrate supplied to each of the molds is further provided.

  Assembling of the molding unit (compression molding apparatus) having a mold mechanism portion in which the two compression molding dies are laminated is performed in a normal temperature atmosphere (cold state). At this time, the die heights 40 (see FIGS. 4 and 14 to be described later) of the two molds are matched (set to the same height). As shown in FIG. 4 (FIG. 14), the die height 40 is the height of each compression mold (the height of both the upper and lower molds in the mold clamped state).

  However, when compression molding is performed using two compression molding dies combined with the die height 40, each of the molds is heated (becomes hot), but the two compression moldings are performed. Since each mechanism and each part of a molding unit (compression molding apparatus) having a mold mechanism part in which a metal mold is laminated are thermally expanded (with different thermal expansion coefficients), two compression molding molds arranged vertically Die height will be different. In particular, in a compression molding apparatus in which a required plurality of molding units are arranged, this tendency is remarkable because the heat of each molding unit affects each other.

JP 2010-94931 A

  However, in the compression molding apparatus described in Patent Document 1, a mold opening / closing mechanism composed of a rack and a pinion is used to adjust the mold surface parallelism of two molds or to adjust the die height described above. Therefore, it is necessary to separate the molding unit and the adjacent unit. As a result, it is not possible to sufficiently improve the productivity of the molded product by the compression molding apparatus.

  The present invention has been made in view of the above problems, and one object of the present invention is a compression molding apparatus in which productivity of a molded product is improved, and a mold surface parallelism in the compression molding apparatus. It is to provide a method of adjusting.

  Another object of the present invention is to provide a compression molding apparatus in which the productivity of a molded product is improved and a method for adjusting the die height in the compression molding apparatus.

  A compression molding apparatus according to the present invention includes a molding unit for compression molding an insert member with a resin material, and a unit adjacent to the molding unit.

  The molding unit described above has a first mold having a first upper mold and a first lower mold, and is stacked in a vertical direction with respect to the first mold, and has a second upper mold and a second lower mold. A second mold, an upper fixed plate for fixing the first upper mold of the first mold, a lower fixed plate provided below the upper fixed plate, a first lower mold and a second mold of the first mold. An intermediate plate provided between the second upper mold and the second upper mold so as to be movable in the vertical direction with respect to the upper fixed plate and the lower fixed plate; A slide plate provided in a state where the second lower mold is fixed and movable in the vertical direction with respect to the upper fixed plate and the lower fixed plate, and a required mold for the first mold and the second mold The mold clamping mechanism that applies the clamping force and the mold clamping force of the mold clamping mechanism are transmitted to the slide plate and the intermediate plate. And a connecting portion for connecting the transmitting mechanism and the intermediate plate, and provided on the connecting portion for adjusting the mold surface parallelism of the first mold and the second mold or adjusting the die height. An adjustment mechanism.

  The adjustment mechanism includes an upper member, a lower member, and a shaft that passes through the upper member and the lower member, and has a first portion located in the upper member and a second portion located in the lower member. A first male screw portion is formed in the first portion of the shaft, and a second male screw portion having at least one of a direction and a pitch different from the first male screw portion is formed in the second portion of the shaft, and the shaft is rotated. The mold surface parallelism can be adjusted by adjusting the gap between the upper member and the lower member, or the die height can be adjusted.

  In one embodiment, in the above-described compression molding apparatus, the shaft can be operated and rotated from a direction orthogonal to the direction in which the molding unit and the adjacent unit are arranged, and the molding unit and the adjacent unit are separated. The mold surface parallelism can be adjusted without releasing, or the die height can be adjusted.

  In one embodiment, in the above-described compression molding apparatus, the adjustment mechanism includes a toggle link mechanism, a first link member that moves the slide plate, a second link member that moves the intermediate plate, an upper fixed platen, and a lower platen A first end rotatably connected to a fixed member immovable with respect to the fixed platen, and a second end rotatably connected to the first link member, the first end and the second end; A third link member to which the second link member is pivotably connected at the midpoint position, and a fourth link member that connects the third link member and the mold clamping mechanism.

  In one embodiment, in the above-described compression molding apparatus, adjacent units include an inloader unit that supplies an insert member and a resin material to each of the first mold and the second mold, the first mold, and the second mold. It includes at least one of an outloader unit including a mechanism for taking out a molded product from each of the molding dies and an accommodating portion for accommodating the molded product, and another molding unit.

  In one embodiment, in the above-described compression molding apparatus, a plurality of molding units are provided, and the plurality of molding units are detachably provided.

  The method for adjusting the mold surface parallelism according to the present invention is a method for adjusting the mold surface parallelism of a compression molding apparatus that includes a molding unit and a unit adjacent to the molding unit and compresses the insert member with a resin material. .

  The above-described method includes a first mold having a first upper mold and a first lower mold, and a second mold having a second upper mold and a second lower mold that are stacked below the first mold. A step of supplying an insert member and a resin material to each of the molds, a transmission mechanism for transmitting a mold clamping force of the mold clamping mechanism, the first lower mold of the first mold, and the first of the second mold. Adjusting the mold surface parallelism of the first mold and the second mold using an adjustment mechanism provided on a connecting portion that connects the intermediate plate provided between the two upper molds.

  In the above-described step of adjusting the mold surface parallelism, the shaft having the first male screw portion and the second male screw portion having different directions and pitches from each other is perpendicular to the direction in which the molding unit and the adjacent unit are arranged. Operate and rotate to adjust the mold surface parallelism.

  In one embodiment, in the above-described method for adjusting the mold surface parallelism, the mold surface parallelism is adjusted without separating the molding unit and the adjacent unit.

  The die height adjusting method according to the present invention is a method for adjusting a die height of a compression molding apparatus that includes a molding unit and a unit adjacent to the molding unit and compresses and insert-molds an insert member with a resin material.

  The above-described method includes a first mold having a first upper mold and a first lower mold, and a second mold having a second upper mold and a second lower mold that are stacked below the first mold. A step of supplying an insert member and a resin material to each of the molds, a transmission mechanism for transmitting a mold clamping force of the mold clamping mechanism, a first lower mold of the first mold, and a second upper of the second mold Adjusting the die heights of the first mold and the second mold using an adjustment mechanism provided on a connecting portion that connects an intermediate plate provided between the mold and the intermediate plate.

  In the above-described step of adjusting the die height, the shaft having the first male screw portion and the second male screw portion having different directions and pitches from each other is operated from the direction orthogonal to the direction in which the molding unit and the adjacent unit are arranged. Rotate to adjust die height.

  In one embodiment, in the above-described die height adjustment method, the die height is adjusted without separating the molding unit and the adjacent unit.

  According to the compression molding apparatus and the method of adjusting the mold surface parallelism according to the present invention, the adjustment mechanism can be operated from the direction orthogonal to the direction in which the molding unit and the adjacent unit are arranged. The mold surface parallelism can be adjusted without separating the unit to be operated, and the die height can be adjusted.

It is a top view which shows the whole structure of the compression molding apparatus which concerns on this invention. It is a figure which shows the state which added the molding unit in the compression molding apparatus shown in FIG. It is a front view of the mold mechanism part (mold open state) contained in the compression molding apparatus shown in FIG. It is a front view of the mold mechanism part (clamping state) contained in the compression molding apparatus shown in FIG. It is an enlarged view which shows the structure (mold open state) of the toggle link mechanism in a mold mechanism part. It is an enlarged view which shows the structure (clamping state) of the toggle link mechanism in a mold mechanism part. It is a figure for demonstrating the motion of the link in a toggle link mechanism. It is a figure for demonstrating the motion of the link in the modification of a toggle link mechanism. It is a figure for demonstrating the movement of the link in the further modification of a toggle link mechanism. It is sectional drawing which shows the structure of the parallelism adjustment mechanism used for the adjustment method of the mold surface parallelism which concerns on this invention. It is a parallelism adjustment mechanism shown in FIG. 10, Comprising: It is sectional drawing which shows the state (the 1) which absorbed the difference in the thickness of the member shape | molded by two shaping | molding dies. It is a parallelism adjustment mechanism shown in FIG. 10, Comprising: It is sectional drawing which shows the state (the 2) which absorbed the difference in the thickness of the member shape | molded by two shaping | molding dies. It is a front view which shows the modification of a lamination mold mechanism part. It is a front view which shows the other modification of a lamination mold mechanism part. It is a side view which shows the other modification of a lamination mold mechanism part.

  Embodiments of the present invention will be described below. Note that the same or corresponding portions are denoted by the same reference numerals, and the description thereof may not be repeated.

  Note that in the embodiments described below, when referring to the number, amount, and the like, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. In the following embodiments, each component is not necessarily essential for the present invention unless otherwise specified.

  FIG. 1 is a plan view showing the overall configuration of the compression molding apparatus according to the present embodiment. As shown in FIG. 1, the compression molding apparatus according to the present embodiment includes a molding mechanism 1000 that, for example, compresses (resin-sealing) a substrate (insert member) on which a semiconductor chip is mounted with a resin material. A unit A, an inloader unit B including an inloader 20 for supplying an insert member to the molding die of the molding unit A, an outloader 30 for taking out the molded product from the molding die of the molding unit A, and a housing portion for housing the molded product. Including an outloader unit C. The inloader 20 and the outloader 30 move in the vertical direction in FIG. Each molding unit A is provided with an adjustment mechanism 100 described later in order to adjust the mold surface parallelism of the mold.

  The molding unit A, the inloader unit B, and the outloader unit C are detachably connected to each other via a connection mechanism such as a bolt or a pin. In the example of FIG. 1, two molding units A are provided, but this number can be increased or decreased according to the production amount. The number of molding units A may be one, or may be increased to four as shown in FIG.

  1 and 2, the molding unit A, the inloader unit B, and the outloader unit C are arranged in this order. For example, the molding unit A, the inloader unit B, and the outloader are arranged. The compression molding apparatus may be configured by arranging one master unit in which the unit C is integrated and one or a plurality of slave units including only the molding unit A.

  In the example shown in FIGS. 1 and 2, an insert member and a resin material may be manually supplied to the molding unit A, and a molded product after molding may be taken out.

  Next, the structure of the mold mechanism unit 1000 will be described with reference to FIGS. 3 and 4 are front views showing the mold open state and the mold clamp state of the mold mechanism unit 1000, respectively.

  As shown in FIGS. 3 and 4, the mold mechanism unit 1000 includes two molds 11 and 12 that are stacked in the vertical direction. The mold 11 includes an upper mold 11A and a lower mold 11B, and the mold 12 includes an upper mold 12A and a lower mold 12B.

  The mold mechanism unit 1000 includes an upper fixing plate 13 that fixes the upper mold 11A of the mold 11, an intermediate plate 14 that fixes the upper mold 11B of the mold 11 and the upper mold 12A of the mold 12, and a lower part of the mold 12. The slide plate 15 for fixing the mold 12B, the lower plate 16 provided below the slide plate 15, the lower fixing plate 17 provided below the lower plate 16, the intermediate plate 14 and the lower plate 16 are connected. It further includes a connecting member 18 and a post 19 that connects the upper fixed platen 13 and the lower fixed platen 17.

  The intermediate plate 14 and the slide plate 15 are movable in the vertical direction with respect to the upper fixed platen 13 and the lower fixed platen 17. The lower plate 16 and the slide plate 15 connected to the intermediate plate 14 are driven in the vertical direction by the toggle link mechanism 10 provided below the slide plate 15. As a result, the molds 11 and 12 are switched between the mold open state (FIG. 3) and the mold clamped state (FIG. 4).

  The toggle link mechanism 10 has a link member 10 </ b> A (first link member) that moves the slide plate 15 and a link that has a half length with respect to the link member 10 </ b> A and moves the intermediate plate 14 via the lower plate 16. A member 10B (second link member), a link member 10C (third link member) to which the link members 10A and 10B are connected, a link member 10D (first link) that connects the link member 10C, the crossbar 10E, and the ball screw 10F. 4 link member). The mold clamping force of the molds 11 and 12 is transmitted to the intermediate plate 14 and the slide plate 15 via the ball screw 10F and the link members 10A to 10D. At this time, if the intermediate plate 14 moves a distance L, the slide plate 15 moves a distance 2L. Thereby, the molds 11 and 12 can be simultaneously clamped.

  One end of the link member 10C is rotatably connected to a fixed member 17A that is immovable with respect to the lower fixed platen 17, and the other end of the link member 10C is rotatably connected to the link member 10A. The The link member 10B is rotatably connected to the link member 10C at the midpoint position between the one end and the other end.

  When the insert member is compression-molded with a resin material using the mold mechanism unit 1000 shown in FIGS. 1 to 4, first, the insert member and the resin material are supplied to each of the molds 11 and 12. Next, while the upper mold 11A of the mold 11 is fixed, the intermediate plate 14 is moved by the distance L using the toggle link mechanism 10 provided below the slide plate, and the slide plate 15 is moved by the distance 2L. The required mold clamping force is applied to the molds 11 and 12.

  The assembly of the mold mechanism unit 1000 is performed in a normal temperature atmosphere (cold state). At this time, as shown in FIG. 4, the die heights 40 of the molds 11 and 12 (the heights of the molds 11 and 12) are matched.

  When compression molding is performed using the molds 11 and 12 combined with the die height 40, the molds 11 and 12 are heated (become hot). Here, since each mechanism and each part of the mold mechanism part 1000 are thermally expanded with different thermal expansion coefficients, the die heights of the molds 11 and 12 are different. In the mold mechanism unit 1000, the die height is adjusted using a parallelism adjusting mechanism 100 described later.

  5 and 6 are enlarged views showing the structure of the toggle link mechanism 10 in the mold open state and the mold clamp state of the molds 11 and 12, respectively. In the step of applying a clamping force to the molds 11 and 12, the ball screw 10F is operated from the mold open state of the molds 11 and 12 shown in FIG. 5, and each link member is rotated until the mold clamped state shown in FIG. Move.

  At this time, as shown in FIG. 7, the triangle including the link member 10A for moving the slide plate 15 and the triangle including the link member 10B for moving the intermediate plate 14 via the lower plate 16 share the link member 10C. The shape is deformed while retaining the similar shape with the ratio of 2: 1 as the side. Accordingly, the intermediate plate 14 can be moved by the distance L while the slide plate 15 is moved by the distance 2L.

  In the above-described compression molding apparatus, since the toggle link mechanism 10 is provided by effectively using the space below the slide plate 15, the footprint of the mold mechanism unit 1000 is reduced, and the compression molding apparatus is downsized. Can do.

  As one modified example, as shown in FIG. 8, it is conceivable that the ratio of the length and moving distance of the link member 10A to the length and moving distance of the link member 10B is 3: 1. For example, when the sizes of the molds 11 and 12 are different from each other, or when molded products having different sizes are molded by the molds 11 and 12, the modified example of FIG. 8 can be used.

  As another modification, as shown in FIG. 9, two lower plates 161 and 162 and link members 10B1 and 10B2 connected to the lower plates 161 and 162 may be provided, and three molds may be stacked together with the slide plate 15. . In the example of FIG. 9, while the lower plate 161 moves by a distance L, the lower plate 162 moves by a distance 3L, and the slide plate 15 moves by a distance 4L. In this way, in an apparatus in which an arbitrary required number of compression molding dies are stacked and arranged, the link member 10C is divided into the required number, and a link obtained by pin-linking the link member to a point selected from the division points is used. In addition, a configuration in which each mold is clamped can be employed.

  3 to 9, for convenience of illustration and description, the link members 10A to 10D are drawn with a single line, but the link members 10A to 10D are actually plate-like members.

  Incidentally, in the mold mechanism unit 1000 according to the present embodiment, the parallelism adjusting mechanism 100 is provided in each of the four connecting members 18 in order to adjust the parallelism of the mold surfaces of the molds 11 and 12.

  FIG. 10 is a cross-sectional view showing the structure of the parallelism adjusting mechanism. As shown in FIG. 10, the parallelism adjusting mechanism 100 includes an adjusting member 100A, 100B attached to each of the two connecting members 18A, 18B, and a shaft 100C provided across the adjusting members 100A, 100B. including. The adjustment members 100A and 100B include box bodies 110A and 110B, lid bodies 120A and 120B, lock nuts 130A and 130B, vertical moving bodies 140A and 140B, springs 150A and 150B, and screw portions 160A and 160B, respectively. including. A hexagon hole 170 is formed in the shaft 100C.

  The lock nuts 130A and 130B and the vertical moving bodies 140A and 140B are screwed to the screw portions 160A and 160B. The threaded portions 160A and 160B are configured by male screws in the same direction with different pitches. For example, the screw portion 160A is an M10 male screw, and the screw portion 160B is an M16 male screw. Thus, by forming male screws in the same direction with different pitches, the gap (G shown in FIG. 10) between the adjusting members 100A and 100B can be adjusted when the shaft 100C is rotated. The shaft 100 </ b> C can be rotated by inserting a hexagon wrench into the hexagon hole 170. This operation can be performed, for example, from the direction of the arrow indicated as “fine adjustment” in FIG. 2, that is, from the direction orthogonal to the direction in which the plurality of molding units A are arranged, so that molding unit A and inloader unit B , And the outloader unit C can be performed without separation.

  As another configuration, the screw portions 160A and 160B can be configured with male screws of the same diameter (for example, M10) and in the reverse direction. However, by utilizing the pitch difference between the male threads in the same direction, the “adjustment amount of the gap G” per rotation of the shaft 100C can be made minute, so that the gap G can be minutely adjusted. Become.

  By adjusting the gap between the adjusting members 100A and 100B in the plurality of parallelism adjusting mechanisms 100, it is possible to adjust the mold surface parallelism in the molds 11 and 12. In the compression molding apparatus according to the present embodiment, the mold surface parallelism can be adjusted without separating the molding unit A, the inloader unit B, and the outloader unit C. It is possible to sufficiently improve.

  1 to 4, the adjustment mechanism 100 is provided for each of the four posts 19, and four adjustment mechanisms 100 are provided.

  In addition, when there is a difference in the thickness of the insert parts in the molds 11 and 12 (for example, when different parts are molded, or even if the parts are the same type, there are variations in the thickness of each board), The adjustment members 100A and 100B are provided with springs 150A and 150B. 11 and 12 show a state in which a difference in thickness of members molded by the molds 11 and 12 is absorbed. Due to the elastic deformation of the springs 150 </ b> A and 150 </ b> B, a difference in the thickness of the insert parts in the molds 11 and 12 can be absorbed and a desired mold clamping force can be applied to the molds 11 and 12.

  More specifically, when there is a difference in the thickness of the members supplied to the molds 11 and 12, the connecting member 18B is fixed to the toggle link mechanism 10, and therefore the intermediate plate 14 connected to the connecting member 18A. Moves up and down to absorb the difference in thickness. When shifting to the mold-clamping state, the thicker member is fixed first, and the thinner member is fixed later, so that a gap 41 is generated in the adjustment members 100A and 100B having the thinner member. It will be. In the case of the example shown in FIG. 11, since the thickness of the insert part is thinner on the lower adjustment member 100B side, a gap 41 is generated on the lower adjustment member 100B side. In the case of the example shown in FIG. 12, the gap 41 is generated on the lower adjustment member 100A side because the thickness of the insert part is thinner on the upper adjustment member 100A side.

  Further, the die height can be adjusted using the adjusting mechanism 100 in the same manner as the adjustment of the mold surface parallelism. According to the compression molding apparatus according to the present embodiment, since the die height can be adjusted without separating the molding unit A, the inloader unit B, and the outloader unit C, the productivity of the molded product can be improved. It becomes possible to plan sufficiently.

  FIG. 13 is a diagram illustrating a modification of the mold mechanism unit. A structure including a pressure mechanism 200, a pinion 18α, and racks 18β1 and 18β2 may be used instead of the toggle link mechanism 10 as in the mold mechanism unit 2000 shown in FIG. The pressurizing mechanism 200 moves the intermediate plate 14 and the pinion 18α connected thereto by the distance L, and accordingly, the rack 18β2 and the slide plate 15 move by the distance 2L.

  Also in this modification, by providing the adjustment mechanism 100, it is possible to adjust the mold surface parallelism of the molds 11 and 12 or the die height.

  In the above-described example, the compression molding apparatus including the four posts 19 and the four adjustment mechanisms 100 has been described. However, the scope of the present invention is not limited to this. For example, the number of adjustment mechanisms 100 can be arbitrarily changed. Further, the structure of the post 19 is not limited to the above-described structure. For example, the structure is provided with two side frames 19A on both sides of the molds 11 and 12 as in the mold mechanism unit 3000 shown in FIGS. May be. Also in this case, the adjustment mechanism 100 includes adjustment members 100A and 100B that are attached to the connection members 18A and 18B divided into two parts, and a shaft 100C that is provided across the adjustment members 100A and 100B.

  Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  10 toggle link mechanism, 10A to 10D link member, 10E cross bar, 10F ball screw, 11, 12 mold, 11A, 12A upper mold, 11B, 12B lower mold, 13 upper fixed platen, 14 intermediate plate, 15 slide plate, 16, 161, 162 Lower plate, 17 Lower fixed plate, 17A Fixed member, 18 Connecting member, 18α Pinion, 18β1, 18β2 Rack, 19 Post, 19A Side frame, 20 Inloader, 30 Outloader, 100 Parallelism adjustment mechanism, 100A , 100B adjustment member, 110A, 110B box, 120A, 120B lid, 130A, 130B lock nut, 140A, 140B vertical moving body, 150A, 150B spring, 160A, 160B threaded part, 170 hexagonal hole part, 200 additional Mechanism, 1000, 2000, 3000 mold mechanism, A molding unit, B inloader unit, C-out loader unit.

Claims (9)

A molding unit for compression-molding the insert member with a resin material;
A unit adjacent to the molding unit;
The molding unit is
A first mold having a first upper mold and a first lower mold;
A second mold having a second upper mold and a second lower mold, which are stacked in the vertical direction with respect to the first mold;
An upper fixed platen for fixing the first upper mold of the first mold;
A lower fixed plate provided below the upper fixed plate;
Between the first lower mold of the first molding die and the second upper mold of the second molding die in a state in which both are fixed, and with respect to the upper fixing plate and the lower fixing plate An intermediate plate provided so as to be movable in the vertical direction,
A slide plate provided in a state where the second lower mold of the second molding die is fixed, and slidable in a vertical direction with respect to the upper fixed plate and the lower fixed plate;
A mold clamping mechanism for applying a required mold clamping force to the first mold and the second mold;
A transmission mechanism for transmitting a clamping force of the clamping mechanism to the slide plate and the intermediate plate;
A connecting portion for connecting the transmission mechanism and the intermediate plate;
An adjustment mechanism provided on the connecting portion, for adjusting mold surface parallelism of the first mold and the second mold, or for adjusting a die height;
The adjustment mechanism includes an upper member, a lower member, a shaft that passes through the upper member and the lower member, and has a first portion located in the upper member and a second portion located in the lower member. Including
A first male threaded portion is formed on the first portion of the shaft, and a second male threaded portion is formed on the second portion of the shaft that differs in at least one of direction and pitch with respect to the first male threaded portion;
A compression molding apparatus configured to adjust a gap between the upper member and the lower member by rotating the shaft so as to adjust the mold surface parallelism or to adjust the die height.   The shaft can be operated and rotated from a direction orthogonal to the direction in which the molding unit and the adjacent unit are aligned, and the mold surface parallelism can be obtained without separating the molding unit and the adjacent unit. The compression molding apparatus according to claim 1, wherein adjustment is possible, or the die height is adjustable. The transmission mechanism is composed of a toggle link mechanism,
A first link member for moving the slide plate;
A second link member for moving the intermediate plate;
A first end pivotally connected to a stationary member immovable relative to the upper fixed platen and the lower fixed platen, and a second end pivotally connected to the first link member; A third link member to which the second link member is rotatably connected at a midpoint position between the first end and the second end;
The compression molding apparatus according to claim 1, comprising a fourth link member that connects the third link member and the mold clamping mechanism. The adjacent unit is
An inload unit for supplying an insert member and a resin material to each of the first mold and the second mold;
An outload unit including a mechanism for taking out a molded product from each of the first mold and the second mold, and an accommodating portion for accommodating the molded product, and
The compression molding apparatus according to any one of claims 1 to 3, comprising at least one of the other molding units. A plurality of the molding units are provided,
The compression molding apparatus according to any one of claims 1 to 3, wherein a plurality of the molding units are detachably provided. A method comprising adjusting a mold surface parallelism of a compression molding apparatus comprising a molding unit and a unit adjacent to the molding unit, wherein the insert member is compression molded with a resin material,
Each of a first mold having a first upper mold and a first lower mold, and a second mold having a second upper mold and a second lower mold, which are stacked below the first mold. Supplying an insert member and a resin material;
A transmission mechanism for transmitting a mold clamping force of the mold clamping mechanism, and an intermediate plate provided between the first lower mold of the first mold and the second upper mold of the second mold. and a step of adjusting the mold surface parallelism of the first mold and the second mold with the adjusting mechanism provided on the connection portion to be connected,
In the step of adjusting the parallelism of the mold surface, a shaft having a first male screw portion and a second male screw portion having different directions and pitches from each other is orthogonal to the direction in which the molding unit and the adjacent unit are arranged. A method of adjusting the mold surface parallelism, wherein the mold surface parallelism is adjusted by rotating from a direction.   The method for adjusting the mold surface parallelism according to claim 6, wherein the mold surface parallelism is adjusted without separating the molding unit and the adjacent unit. A method of adjusting a die height of a compression molding apparatus comprising a molding unit and a unit adjacent to the molding unit, wherein the insert member is compression molded with a resin material,
Each of a first mold having a first upper mold and a first lower mold, and a second mold having a second upper mold and a second lower mold, which are stacked below the first mold. Supplying an insert member and a resin material;
A transmission mechanism for transmitting a mold clamping force of the mold clamping mechanism, and an intermediate plate provided between the first lower mold of the first mold and the second upper mold of the second mold. Adjusting the die height of the first mold and the second mold using an adjustment mechanism provided on the connecting portion to be connected,
In the step of adjusting the die height, a shaft having a first male screw portion and a second male screw portion having different directions and pitches from each other is operated from a direction orthogonal to the direction in which the molding unit and the adjacent unit are arranged. And adjusting the die height by rotating the die.   The die height adjustment method according to claim 8, wherein the die height is adjusted without separating the molding unit and the adjacent unit.

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