JP6037544B2 - LED package and its manufacturing method - Google Patents

Description

The present invention relates to an LED package having improved connection reliability of wiring connecting between an electrode portion on the LED element side mounted on a mounting member and an electrode portion on the mounting member side, and a method for manufacturing the same.

Conventionally, in the mounting process of a semiconductor element, after the semiconductor element is die-bonded to a mounting member (circuit board, lead frame, etc.), wiring is performed between the electrode portion on the semiconductor element side and the electrode portion on the mounting member side by wire bonding. It is common to do.

However, as described in Patent Document 1 (Japanese Patent No. 3992038), defects may occur due to mechanical stress during wire bonding, so that connection reliability is high instead of wire bonding. For the purpose of realizing a mounting structure at low cost, a liquid of a resin material is discharged from a dispenser around a semiconductor element mounted on a wiring board and cured, and between the upper surface of the semiconductor element and the surface of the wiring board. After forming a resin slope that connects the above with an inclined surface, conductive ink is ejected by a droplet ejection method such as inkjet along the wiring path connecting the electrode portion on the upper surface of the semiconductor element and the electrode portion of the wiring board. It has been proposed to form a wiring.

Japanese Patent No. 3992038

In the structure of Patent Document 1, when the liquid of the resin material is discharged by the dispenser around the semiconductor element mounted on the wiring board to form the resin slope, the liquid of the discharged resin material is the electrode portion on the upper surface of the semiconductor element. It may wet and spread on the top or on the electrode portion of the wiring board, and a part or all of the electrode portion may be covered with a resin material, so that sufficient conductivity between the electrode portion and the wiring may not be ensured. ..

As a countermeasure, it is necessary to reduce the discharge amount of the resin material to prevent the resin material from spreading on the electrode portion, and as a result, the electrode portion of the semiconductor element and the electrode portion of the wiring substrate are connected. The step of the wiring path cannot be sufficiently reduced by the resin slope, and the wiring formed on the wiring path may be broken at the corner of the step due to thermal stress or the like.

Therefore, the problem to be solved by the present invention is an LED package capable of improving the connection reliability of the wiring connecting between the electrode portion on the LED element side mounted on the mounting member and the electrode portion on the mounting member side, and an LED package thereof. To provide a manufacturing method.

In order to solve the above problems, the present invention mounts an LED element on a mounting member, and both a recess and a step in the wiring path between the electrode portion on the LED element side and the electrode portion on the mounting member side. Alternatively, an LED package in which one of them is filled with an insulating resin to make it smooth, and wiring for connecting the electrode portion on the LED element side and the electrode portion on the mounting member side is formed on the wiring path and the LED package thereof. In the manufacturing method, both the surface of the electrode portion on the LED element side and the surface of the electrode portion on the mounting member side before filling both or one of the recess and the step of the wiring path with the insulating resin. Or both an LED element having a conductive protrusion formed on one of them or a conductive protrusion formed on the surface of the electrode portion in advance and a mounting member having a conductive protrusion formed on the surface of the electrode portion in advance. Alternatively, one of them is used, and after filling both or one of the recess and the step of the wiring path with the insulating resin, the electrode portion on the LED element side and the mounting member side are placed on the wiring path. wiring the conductive protrusions by forming the wiring on the primer resin layer primer resin layer straddling the electrode portion formed in a linear or strip-shaped so as to conduct to the conductive protrusions It is characterized in that it is conducted to the electrode portion through the portion.

In the present invention, a conductive protrusion is formed on the surface of the electrode portion before filling both or one of the recess and the step of the wiring path with the insulating resin. Therefore, the recess and the step of the wiring path are formed. When filling both or one of the above with the insulating resin, the discharge amount of the insulating resin is appropriately increased, and even if the insulating resin liquid wets and spreads to the surface of the electrode portion, the surface of the electrode portion is covered. The formed conductive protrusions are exposed from the insulating resin, and the wiring can be conducted to the electrode portion via the conductive protrusions. As a result, while ensuring the conductivity between the wiring and the electrode portion by the conductive protrusion, the recesses and steps of the wiring path that cause the wiring breakage are sufficiently filled with the insulating resin to sufficiently fill the wiring path. It is possible to make the wiring gentle, prevent the wiring from being broken due to the step of the wiring path, and improve the connection reliability of the wiring.
Further, after filling both or one of the concave portion and the step of the wiring path with the insulating resin, the primer resin straddles the electrode portion on the LED element side and the electrode portion on the mounting member side on the wiring path. Since the layer is formed in a linear or strip shape so that the wiring is conducted on the prima resin layer so as to be conductive to the conductive protrusions , the prima resin layer can make the wiring path even smoother. Therefore, it becomes easy to form the wiring on the primer resin layer by the thick film method (droplet ejection method, printing method, etc.), and the adhesion with the wiring can be improved.

Further, in the present invention, the conductive protrusions may be formed of a conductive material having liquid repellency. In this way, the liquid of the insulating resin can be prevented from wetting and spreading on the conductive protrusions of the electrode portion due to the liquid repellency of the conductive protrusions, and the connection reliability of the wiring can be further improved.

FIG. 1 is a vertical cross-sectional view showing an element mounting process of Example 1 as a reference example related to the present invention. FIG. 2 is a vertical cross-sectional view showing the liquid repellent film forming step of Example 1. FIG. 3 is a vertical cross-sectional view showing the insulating resin embedding step of Example 1. FIG. 4 is a vertical cross-sectional view showing the wiring forming step of the first embodiment. FIG. 5 is a vertical cross-sectional view showing the structure of the LED package according to the second embodiment of the present invention. FIG. 6 is a vertical cross-sectional view showing the structure of the LED package of Example 3 as a reference example related to the present invention.

Hereinafter will be described with reference three examples 1 to 3 embodiments of the present invention.

Example 1 as a reference example related to the present invention will be described with reference to FIGS. 1 to 4.
First, the structure of the LED package will be described with reference to FIG.

The mounting member 10 is formed by molding a package body 13 having an element mounting recess 12 in a lead frame 11 with an insulating resin. An LED element 14 (light emitting element), which is a semiconductor element, is die-bonded to the central portion of the bottom surface of the element mounting recess 12 of the package body 13. The depth dimension (height dimension) of the element mounting recess 12 is set to be substantially the same as the height dimension of the LED element 14, and the electrode portion 15 on the upper surface of the LED element 14 mounted in the element mounting recess 12 is the upper surface of the package body 13. The height is substantially the same as the electrode portion 11a of the lead frame 11 of the above.

On the surfaces of the electrode portion 15 on the upper surface of the LED element 14 and the electrode portion 11a on the upper surface of the package body 13, conductive protrusions 17 having liquid repellency to the liquid of the insulating resin 16 described later are formed. In the method of forming the conductive protrusion 17, for example, a conductive material such as metal nanoparticle ink is applied (discharged) by a dispenser, an inkjet or the like, or screen-printed and dried to form a conductive layer for one layer. By repeating the process of forming the next conductive layer on top of it a predetermined number of times, the conductive protrusions 17 having a predetermined height are formed. Alternatively, a solid conductive member may be adhered to the electrode portions 15 and 11a with a conductive adhesive or the like, or solder may be applied to the electrode portions 15 and 11a to form the conductive protrusion portion 17. Alternatively, in the manufacturing process of the LED element 14, the conductive protrusion 17 may be formed on the surface of the electrode portion 11a by photolithography, plating, or the like.

When imparting liquid repellency to the conductive protrusion 17, a liquid-repellent material such as a silane compound or a fluororesin may be mixed with the conductive material such as metal nanoparticle ink, or the conductive protrusion 17 may be provided with a liquid repellency. After the formation, a liquid-repellent material may be applied to the surface of the conductive protrusion 17.

A transparent insulating resin 16 is filled in a gap (recess) around the LED element 14 in the element mounting recess 12 of the package body 13 to form a transparent embedded resin layer. As a result, the wiring path connecting the electrode portion 15 on the upper surface of the LED element 14 and the electrode portion 11a on the upper surface of the package body 13 is provided by the insulating resin 16 filled in the gap around the LED element 14 in the element mounting recess 12. The steps (unevenness) are small and smooth.

A wiring 18 is formed in the wiring path between the conductive protrusion 17 on the electrode portion 15 on the upper surface of the LED element 14 and the conductive protrusion 17 on the electrode portion 11a on the upper surface of the package body 13, and the wiring 18 is formed. It is in a state of being electrically connected to the electrode portions 15 and 11a via the conductive protrusion portion 17. The wiring 18 is formed by ejecting or printing conductive ink (ink containing conductor particles such as Ag) by a droplet ejection method such as an inkjet or a dispenser or a printing method to draw a pattern of the wiring 18. Can be dried and fired.
The upper portion of the mounting member 10 is molded with a transparent insulating sealing material that seals the LED element 14 and the wiring 18.

Next, a method of manufacturing the LED package having the above configuration will be described.
After the mounting member 10 is formed, the process proceeds to the element mounting process, and as shown in FIG. 1, the LED element 14 is die-bonded (bonded) to the center of the bottom surface of the element mounting recess 12 of the package body 13.

After that, the process proceeds to the process of forming the conductive protrusions, and as shown in FIG. 2, the thick film method (inkprint, dispenser) is applied to the surface of the electrode portion 15 on the upper surface of the LED element 14 and the surface of the electrode portion 11a on the upper surface of the package body 13. The conductive material such as metal nanoparticle ink is ejected or printed by the droplet ejection method or the printing method), and the pattern of the conductive protrusion 17 is drawn on the surface of each of the electrode portions 15 and 11a and dried. The process of forming a conductive layer for one layer and superimposing it on the conductive layer to form the next conductive layer is repeated a predetermined number of times to form the conductive protrusion 17.

The step of forming the conductive protrusion 17 on the surface of the electrode portion 15 on the upper surface of the LED element 14 may be performed before the LED element 14 is die-bonded to the element mounting recess 12 of the package body 13.

Further, the conductive protrusions 17 may be formed on the surfaces of the electrode portions 15 and 11a in the manufacturing process of the LED element 14 and the manufacturing process of the mounting member 10. That is, the step of forming the conductive protrusions 17 on the surfaces of the electrode portions 15 and 11a may be performed by the manufacturer of the LED element 14 or the manufacturer of the mounting member 10, and the LED with the conductive protrusions 17 may be performed from these manufacturers. The element 14 and the mounting member 10 may be obtained and the following steps may be executed.

After that, the process proceeds to the step of embedding the insulating resin, and as shown in FIG. 3, the transparent insulating resin 16 is formed in the gap (recess) around the LED element 14 in the element mounting recess 12 of the package body 13. The liquid is filled by a droplet ejection method such as an inkjet or a dispenser, dried and cured to form an embedded layer of a transparent insulating resin 16. At this time, the discharge amount of the insulating resin 16 is adjusted so that a part of the liquid of the insulating resin 16 filled in the element mounting recess 12 overflows from the element mounting recess 12 and spreads to the edges of the electrode portions 15 and 11a. By setting, the step of the wiring path between the electrode portion 15 on the upper surface of the LED element 14 and the electrode portion 11a on the upper surface of the package body 13 is made as small as possible to make the entire wiring path smooth.

At this time, even if the liquid of the insulating resin 16 overflowing from the element mounting recess 12 wets and spreads to the surfaces of the electrode portions 15 and 11a, the conductive protrusions 17 are formed on the surfaces of the electrode portions 15 and 11a. Therefore, the conductive protrusion 17 is exposed from the liquid of the insulating resin 16. Further, in the first embodiment, since the conductive protrusion 17 is imparted with liquid repellency, the liquid of the insulating resin 16 gets wet and spreads on the conductive protrusion 17, which causes the conductive protrusion 17 to repel. It is prevented by the liquid property, and the conductive protrusion 17 is surely kept exposed from the liquid of the insulating resin 16.

After that, the process proceeds to the wiring forming step, and as shown in FIG. 4, the conductive protrusion 17 on the electrode portion 15 on the upper surface of the LED element 14 and the conductive protrusion 17 on the electrode portion 11a on the upper surface of the package body 13 Conductive ink (ink containing conductor particles such as Ag) is ejected or printed on the wiring path between them (the upper surface of the embedded layer of the insulating resin 16) by a droplet ejection method such as an inkjet or a dispenser or a printing method. Eighteen patterns are drawn, dried and fired. At this time, the firing temperature of the wiring 18 may be about 200 ° C. (for example, 180 ° C. or higher), and the firing time may be about 30 minutes to 60 minutes.

After that, the process proceeds to the sealing step, in which the upper portion of the mounting member 10 is molded with a transparent insulating sealing material, and the LED element 14 and the wiring 18 are sealed with the transparent insulating sealing material.

According to the first embodiment described above, the surface of the electrode portion 15 on the upper surface of the LED element 14 and the upper surface of the package body 13 are before the recesses and steps of the wiring path between the electrode portions 15 and 11a are filled with the insulating resin 16. Since the conductive protrusion 17 is formed on the surface of the electrode portion 11a of the above, when the recesses and steps of the wiring path between the two electrode portions 15 and 11a are filled with the insulating resin 16, the insulating resin 16 is used. Even if the discharge amount is appropriately increased and the liquid of the insulating resin 16 wets and spreads to the surfaces of the electrode portions 15 and 11a, the conductive protrusions 17 formed on the surfaces of the electrode portions 15 and 11a are formed from the insulating resin 16. In the exposed state, the wiring 18 can be conducted to both the electrode portions 15 and 11a via the conductive protrusion portion 17. As a result, while ensuring the conductivity between the wiring 18 and the electrode portions 15 and 11a by the conductive protrusions 17, the recesses and steps of the wiring path that cause the wiring 18 to be disconnected are sufficiently provided with the insulating resin 16. It is possible to fill the wiring path so that it is sufficiently smooth, prevent disconnection of the wiring 18 due to a step in the wiring path, and improve the connection reliability of the wiring 18.

Moreover, in the first embodiment, since the conductive protrusion 17 is imparted with liquid repellency, the conductive resin 16 wets and spreads on the conductive protrusions 17 of the electrodes 15 and 11a. It can be prevented by the liquid repellency of the sex protrusion 17, and the connection reliability of the wiring 18 can be further improved.

Next, Example 2 of the present invention will be described with reference to FIG. However, substantially the same parts as those in the first embodiment are designated by the same reference numerals to omit or simplify the description, and mainly different parts will be described.

In the first embodiment, the wiring 18 is directly formed on the embedded layer of the insulating resin 16 filled in the element mounting recess 12 of the package main body 13, but the LED element is used only by the embedded layer of the insulating resin 16. The step in the wiring path between the electrode portion 15 on the upper surface of the 14 and the electrode portion 11a on the upper surface of the package body 13 may not be completely filled, and a slight step may remain.

Therefore, in the second embodiment of the present invention shown in FIG. 5, after the insulation resin embedding step is completed and before the wiring 18 is formed , the electrode portion 15 on the upper surface of the LED element 14 and the package are placed on the embedding layer of the insulating resin 16. The primer resin layer 21 is formed in a linear or strip shape straddling the electrode portion 11a on the upper surface of the main body 13, and a wiring path between the electrode portion 15 on the upper surface of the LED element 14 and the electrode portion 11a on the upper surface of the package main body 13. The step is further reduced by the prima resin layer 21 to make the wiring path more gentle, and then the wiring 18 is formed on the prima resin layer 21 so as to be conductive to the conductive protrusion 17 .

At this time, in the second embodiment, the primer resin layer 21 is formed in a linear or strip shape only in the portion forming the wiring 18 . Needed may be formed a primer resin layer 21 to the underlying portion forming at least a wiring 18. When the primer resin layer 21 is formed over a wide range, it is desirable to form the primer resin layer 21 with a transparent material so that the primer resin layer 21 does not block the radiation of the LED element 14.

The method for forming the prime resin layer 21 is to eject or print the ink of the insulating material on the wiring path by a droplet ejection method or a printing method such as an inkjet or a dispenser, and route the pattern of the prime resin layer 21 on the wiring path. The primer resin layer 21 is formed by drawing on the electrode portion 15 on the upper surface of the LED element 14 and the electrode portion 11a on the upper surface of the package body 13 in a linear or strip shape and drying and curing. At this time, even if the liquid of the primer resin layer 21 wets and spreads to the surfaces of the electrode portions 15 and 11a, the conductive protrusions 17 are formed on the surfaces of the electrode portions 15 and 11a. The protrusion 17 is exposed from the liquid of the primer resin layer 21.

Here, as the material of the prima resin layer 21, for example, _{there are insulating materials such as epoxy resin type, polyimide resin type, and glass (SiO 2} ) type, and among these insulating materials, light transmission and moisture resistance are obtained. The selection may be made in consideration of properties, adhesion of the insulating resin 16 to the embedded layer and the wiring 18, and the like.

Then, after the prima resin layer 21 is dried and cured, conductive ink (ink containing conductor particles such as Ag) is ejected or printed on the prima resin layer 21 by a droplet ejection method such as an inkjet or a dispenser or a printing method. The pattern of the wiring 18 is spread over the conductive protrusion 17 on the electrode portion 15 on the upper surface of the LED element 14 and the conductive protrusion 17 on the electrode portion 11a on the upper surface of the package body 13 on the primer resin layer 21. The drawing is drawn, dried and fired, and the electrode portion 15 on the upper surface of the LED element 14 and the electrode portion 11a on the upper surface of the package body 13 are connected by a wiring 18 via a conductive protrusion 17.

In the second embodiment described above, after filling the recesses and steps of the wiring path between the two electrode portions 15 and 11a with the insulating resin 16, the prima resin layer 21 is formed on the wiring path and the prima resin layer is formed. Since the wiring 18 is formed on the prima resin layer 21, the wiring path can be made smoother by the primer resin layer 21, and the wiring 18 can be easily formed on the prima resin layer 21 by the droplet ejection method or the printing method. At the same time, it is possible to more reliably prevent disconnection of the wiring 18 due to a step in the wiring path. In addition, the same effect as in Example 1 can be obtained.

Next, Example 3 as a reference example related to the present invention will be described with reference to FIG. However, substantially the same parts as those in the first embodiment are designated by the same reference numerals to omit or simplify the description, and mainly different parts will be described.

In the third embodiment, the LED element 14 is die-bonded on the wiring board 31 which is a mounting member in the element mounting process. After that, the process proceeds to the process of forming the conductive protrusions, and the conductive protrusions 17 are formed on the surfaces of the electrode portion 15 on the upper surface of the LED element 14 and the electrode portion 32 on the upper surface of the wiring board 31 in the same manner as in the first embodiment. Form. The step of forming the conductive protrusion 17 on the surface of the electrode portion 15 on the upper surface of the LED element 14 may be performed before the LED element 14 is die-bonded to the element mounting recess 12 of the package body 13. Further, the conductive protrusions 17 may be formed on the surfaces of the electrode portions 15 and 32 in the manufacturing process of the LED element 14 and the manufacturing process of the wiring board 31. That is, the step of forming the conductive protrusions 17 on the surfaces of the electrode portions 15 and 32 may be performed by the manufacturer of the LED element 14 or the manufacturer of the wiring board 31.

After that, the process proceeds to the insulating resin slope forming step, and the liquid of the transparent insulating resin 33 is discharged around the LED element 14 by a dispenser, and the electrode portion 15 on the upper surface of the LED element 14 and the electrode on the upper surface of the wiring board 31 are discharged. The step of the wiring path between the portion 32 and the portion 32 is filled with the insulating resin 33 to form a slope of the transparent insulating resin 33 that gently connects the wiring path with an inclined surface. At this time, even if the liquid of the insulating resin 33 wets and spreads to the surfaces of the electrode portions 15 and 32, the conductive protrusions 17 are formed on the surfaces of the electrode portions 15 and 11a, so that the conductive protrusions 17 are formed. The protrusion 17 is exposed from the liquid of the insulating resin 33.

After that, the process proceeds to the wiring forming step, the wiring 18 is formed on the wiring path between the electrode portions 15 and 32 (on the slope of the insulating resin 33), and the wiring 18 is passed through the conductive protrusions 17 on both electrodes. It is connected to the electrode portions 15 and 32. After that, the process proceeds to the sealing step, in which the upper portion of the wiring board 31 is molded with a transparent insulating sealing material, and the LED element 14 and the wiring 18 are sealed with the transparent insulating sealing material.

In the third embodiment described above, the same effect as that of the first embodiment can be obtained.
In each of the above Examples 1 to 3, the wiring 17 was formed by a thick film method (droplet ejection method, printing method, etc.), but the present invention is not limited to this, and the thin film method or solid conductivity is used. It may be formed by sticking a member. The thin film method includes, for example, physical vapor deposition "PVD" (blasting, vacuum vapor deposition, ion plating, etc.), chemical vapor deposition "CVD" (plasma CVD, thermal CVD, etc.), thermal spraying (plasma CVD, thermal CVD, etc.) using a transparent conductive material such as ITO. The pattern of the wiring 18 may be formed by any of plasma spraying, arc spraying, etc.) and a plating method. When the wiring 18 is formed of a transparent conductive material, it may be formed in a linear or band shape or in a planar shape, in short, within a range that does not come into contact with other conductive materials and cause a short circuit. Therefore, the line width of the wiring 18 may be widened in consideration of the positional deviation of the wiring 18.

Further, in the above Examples 1 to 3, the conductive protrusions 17 were formed on both the electrode portion 15 on the upper surface of the LED element 14 and the electrode portion 11a (32) on the upper surface of the package body 13 (wiring substrate 31). When the structure is such that the liquid of the insulating resin 16 (33) easily wets and spreads only on one of the electrodes, the liquid of the insulating resin 16 (33) is conductive only on the electrode part which is easy to wet and spread. The protrusion 17 may be formed.

For example, in the structure of the third embodiment (FIG. 6), since the electrode portion 32 on the upper surface of the wiring board 31 exists at a position lower than the electrode portion 15 on the upper surface of the LED element 14, the electrode portion 15 on the upper surface of the higher LED element 14 As compared with the above, the liquid of the insulating resin 33 easily flows toward the electrode portion 32 on the upper surface of the lower wiring board 31 and spreads easily. In consideration of this point, the conductive protrusion 17 may be formed only on the electrode portion 32 on the upper surface of the wiring board 31.

Further, the present invention is not limited to a configuration in which the conductive protrusion 17 is imparted with liquid repellency, and a configuration in which liquid repellency is not imparted may be used. Even if the liquid repellency is not imparted, if the height dimension of the conductive protrusion 17 is increased, it is possible to prevent the liquid of the insulating resin 16 (33) from getting wet and spreading on the conductive protrusion 17.

In addition, the present invention is, of course, can be variously modified without departing from the Abstract.

10 ... Mounting member, 11 ... Lead frame, 11a ... Electrode part, 12 ... Element mounting recess, 13 ... Package body, 14 ... LED element (semiconductor element), 15 ... Electrode part, 16 ... Insulating resin, 17 ... Conductive Protrusions, 18 ... Wiring, 21 ... Prima resin layer, 31 ... Wiring substrate (mounting member) 32 ... Electrode part, 33 ... Insulating resin

Claims (4)

Are LED elements mounted on the mounting member, both or either the recess and the step of the wiring path between the electrode portion of the LED element side and the mounting member side of the electrode portion is filled with an insulating resin with wiring path becomes gentle, the LED package wiring is formed on the wiring path connecting between the electrode portion of the LED element side and the mounting member side of the electrode portion,
Conductive protrusions both or either one of the previous SL LED element side of the electrode portion surface and the mounting member side of the electrode portion of the surface of formed,
A prima resin layer is formed in a linear or strip shape straddling the electrode portion on the LED element side and the electrode portion on the mounting member side on the wiring path, and the wiring is conductive on the prima resin layer. An LED package characterized in that it is formed so as to be conductive to the electrode portion via a protrusion portion. The LED package according to claim 1, wherein the conductive protrusion is formed of a conductive material having liquid repellency. An LED element is mounted on a mounting member, and both or one of a recess and a step in the wiring path between the electrode portion on the LED element side and the electrode portion on the mounting member side is filled with an insulating resin. In a method for manufacturing an LED package in which a wiring connecting between an electrode portion on the LED element side and an electrode portion on the mounting member side is formed on the wiring path.
A step of forming a conductive protrusion on both or one of the surface of the electrode portion on the LED element side and the surface of the electrode portion on the mounting member side.
A step of filling both or one of the recessed portion of the wiring path and the step after forming the conductive protrusion with the insulating resin to smooth the wiring path.
After filling both or one of the concave portion and the step of the wiring path with the insulating resin, the electrode portion on the LED element side and the electrode portion on the mounting member side straddle the wiring path. to the electrode portion through the conductive protrusion of the wiring by the primer resin layer formed in a linear or band is formed so as to turn the wire on the primer resin layer on said conductive projections A method for manufacturing an LED package, which comprises a step of conducting conduction. An LED element is mounted on a mounting member, and both or one of a recess and a step in the wiring path between the electrode portion on the LED element side and the electrode portion on the mounting member side is filled with an insulating resin. In a method for manufacturing an LED package in which a wiring connecting between an electrode portion on the LED element side and an electrode portion on the mounting member side is formed on the wiring path.
An LED element having a conductive protrusion formed on the surface of the electrode portion in advance and a mounting member having a conductive protrusion formed on the surface of the electrode portion in advance are used, or either one of them is used.
A step of filling both or one of the recessed portion of the wiring path and the step with the insulating resin to smooth the wiring path.
After filling both or one of the concave portion and the step of the wiring path with the insulating resin, the electrode portion on the LED element side and the electrode portion on the mounting member side straddle the wiring path. to the electrode portion through the conductive protrusion of the wiring by the primer resin layer formed in a linear or band is formed so as to turn the wire on the primer resin layer on said conductive projections A method for manufacturing an LED package, which comprises a step of conducting conduction.

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