JP6038482B2 - Light-emitting element mounting wiring board - Google Patents

Description

  The present invention relates to a wiring board for mounting a light emitting element for mounting a light emitting element such as a light emitting diode on the surface of a substrate body made of an insulating material.

For example, in order to radiate the heat generated by a light emitting element mounted on the surface of a flat insulating substrate made of ceramic to the outside, a large diameter and single penetrating metal that penetrates the central portion between the surface and the back surface of the insulating substrate A wiring board for a light emitting element has been proposed in which a body is disposed and a mounting portion for a light emitting element is provided on the surface of the insulating base, which is the upper end surface of the through metal body (see, for example, Patent Document 1).
In the case of the light emitting element wiring board as described above, the area of the lower end surface of the through conductor exposed on the back surface of the insulating base must be increased in order to effectively radiate the heat generated by the light emitting element. The area of the necessary pair of electrodes (pads) to be disposed on the back side of the element wiring board had to be reduced. As a result, there is a problem that the amount of solder used when mounting on the mother board becomes too small, and the mounting property on the mother board may become unstable.
Further, when a through conductor penetrating between the front surface and the back surface of the insulating substrate is connected to the back surface pad and used as an electrical path between the front surface pad and the back surface pad, a pair of electrodes provided on the back surface of the insulating substrate. The area of the back pad has to be significantly unbalanced between the two. As a result, when mounted on the motherboard, the wiring board for the light emitting element is inadvertently tilted, and there is a problem that the light emitted from the mounted light emitting element may not be emitted in a required direction. .

On the other hand, in order to freely design a pair of backside pads provided on the backside of the insulating base, a bottomed hole that opens only on the surface of the flat insulating base made of ceramic is formed, and the metal body is placed on the surface side of the bottomed hole. There is also proposed a surface mount type light emitting element wiring board in which a light emitting element mounting portion is provided on the surface of the metal body and on the surface of the insulating base (see, for example, Patent Document 2).
However, in the case of the light emitting element wiring board described in Patent Document 2, a pair of back surface pads can be formed in a wide and uniform area on the back surface made of only the insulating material of the insulating base, but from the mounted light emitting element. The generated heat cannot be radiated from the metal body to the back side of the insulating substrate. As a result, there has been a problem that heat dissipation may be insufficient.

Japanese Patent Laying-Open No. 2006-41230 (pages 1 to 14, FIG. 1 (b)) JP 2008-109079 A (pages 1 to 14, FIG. 1)

  The present invention solves the problems described in the background art, and has a mounting portion for a light emitting element on one of a pair of front surface pads formed on the front surface of a substrate body made of an insulating material and having a front surface and a back surface, A pair of back surface pads formed on the back surface of the substrate body and individually conducting with the pair of surface pads; heat from the light emitting element can be sufficiently dissipated from the back surface of the substrate body to the outside; and It is an object of the present invention to provide a light-emitting element mounting wiring board excellent in mountability.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the present invention provides a first through conductor having an area larger than the area of the light emitting element mounting portion in a thick insulating portion from the front surface to the back surface of the substrate body, The second through conductor having an area smaller than the area of the first through conductor is disposed in a thin insulating portion between the substrate body and the back surface of the substrate body.
That is, the wiring board for mounting a light-emitting element according to the present invention (Claim 1) is made of an insulating material, and has a front surface, a back surface, and a substrate body having a side surface located between the front surface and the back surface, and a surface of the insulating substrate. A first surface pad having a light emitting element mounting portion on the top surface, a second surface pad formed on the surface of the insulating substrate and spaced from the first surface pad, and a back surface of the insulating substrate. A first back pad and a second back pad formed apart from each other, a first connection conductor electrically conducting between the first front pad and the first back pad, the second front pad and the second back pad. A wiring board for mounting a light emitting element, comprising: a second connection conductor that is electrically connected to the second back surface pad, and is in contact with the first front surface pad between the front surface and the back surface of the substrate body. A first through conductor disposed in the A first through conductor and a second through conductor connected to the first back pad and having a length in a side view shorter than that of the first through conductor are provided between the first through conductor and the first back surface pad, except for the vicinity of the surface of the substrate body. The area of the first through conductor in plan view includes a light emitting element mounting portion located on the upper surface of the first surface pad and is larger than the area of the mounting portion, and the first through conductor is in plan view. in projection, the first and overlaps the back pad, between the first through conductor and the second through conductors, planar connection wiring layer is formed, the first through-conductor, the substrate A plurality of conductor portions are formed along the thickness direction of the main body, and the conductor portions in the vicinity of the surface of the substrate main body are composed of a plurality of via conductors .

According to this, the area of the first through conductor in contact with the first surface pad and the second through conductor is larger than the area of the light emitting element mounting portion except for the vicinity of the surface of the substrate body, and The length of the first through conductor in side view is longer than that of the second through conductor. In other words, the first through conductor has a larger diameter (larger area) than the mounting portion of the light emitting element and is close to the rear surface side of the substrate body except for the vicinity of the surface of the substrate body. Between the two. As a result, heat generated by the light emitting element mounted on the first surface pad can be effectively transferred to the vicinity of the back surface of the substrate body through the first through conductor.
Moreover, the first back pad is in contact with the second through conductor and is electrically connected to the first surface pad via the first connection conductor, and the second back pad is electrically connected via the second connection conductor. Since it is connected to the second front surface pad, the first and second back surface pads can be easily designed to have the same area on the back surface of the substrate body.
In addition, since a planar connection wiring layer is formed between the first through conductor and the second through conductor, the relatively large diameter of the substrate body is disposed in the center of the substrate body in plan view. Heat transfer over a wide area is possible between the back surface side of the first through conductor and the second through conductor disposed in contact with the first back surface pad on the back surface side of the substrate body . In particular, in the form in which the second through conductor is constituted by a plurality of via conductors having a relatively small diameter, even when some via conductors do not overlap or partially overlap with the first through conductor in a plan view. The plurality of via conductors and the first through conductor can be reliably brought into contact with each other .
Therefore, the heat from the light emitting element can be efficiently radiated from the back side to the outside through the first through conductor, the second through conductor, and the first back pad, and the first area has the same area. In addition, when mounting on the motherboard via the solder on the second back surface pad, the light emitting element mounting wiring board does not inadvertently tilt, and it is possible to achieve good mountability.
In addition, the first through conductor is formed from a plurality of conductor portions along the thickness direction of the substrate body, the conductor portion near the surface of the substrate body is composed of a plurality of via conductors, The relatively thick conductor portion located inside the substrate body is not exposed on the surface of the substrate body . For this reason, for example, it is possible to suppress a situation in which cracks are large and occur widely in the ceramic located around the first through conductor due to a difference in thermal expansion coefficient with the ceramic of the insulating material .

The insulating material is made of ceramic or resin. Specifically, the form which laminated | stacked the several ceramic layer, the form which laminated | stacked the several resin layer, and the form which laminated | stacked the comparatively thick ceramic layer and the comparatively thin resin layer are mentioned.
Further, the first connection conductor and the second connection conductor are side conductors formed on any side surface of the substrate body, or are via conductors penetrating between the front surface and the back surface of the substrate body. The side conductor includes a form formed in a recess on one side and a form formed in a recess provided in a corner where two side faces intersect.
Further, the surface of the substrate main body includes a form including a cavity having a side surface that rises from the periphery of the bottom surface to a conical shape, a cylindrical shape, or a polygonal column shape of a quadrangle or more from the periphery of the bottom surface.
Further, the light emitting element includes a light emitting diode and a semiconductor laser.
In addition, on the upper surface of the first surface pad, a plurality of light emitting element mounting portions may be arranged in a linear pattern, a lattice pattern, or a checkered pattern. Correspondingly, it is possible to set the area of the second front surface pad, the first back surface pad, the second back surface pad, and the first through conductor, and the total area of the plurality of second through conductors.

The present invention also includes a light emitting element mounting wiring board (Claim 2) in which the thickness of the second through conductor is 0.10 mm or less.
According to this, since the thickness of the 2nd penetration conductor which touches the 1st penetration conductor and the 1st back pad is 0.10 mm or less, the heat from the light emitting element which conducted the inside of the 1st penetration conductor is short. It passes through the 2nd penetration conductor, and is sent to the 1st back pad, and is radiated outside. In addition, since the first through conductor having a relatively large diameter is not exposed on the back surface of the substrate body, the first and second back pads can be freely designed.
If the thickness of the second through conductor exceeds 0.10 mm, heat from the light emitting element is less likely to pass through the second through conductor quickly, and may be retained inside the first through conductor. This range is excluded.
Moreover, in order to form the 2nd penetration conductor of the said range thickness, among the insulating materials which comprise a board | substrate body, the thickness after a hardening process is 0.10 mm or less on the back surface side, or the thickness after baking A ceramic layer of 0.10 mm or less is disposed.
Further, the second through conductor may have a single rectangular parallelepiped shape in which the horizontal cross section has a rectangular shape in addition to a plurality of relatively small diameter via conductors.

Furthermore, the present invention includes a light emitting element mounting wiring board (Claim 3) in which the first back surface pad and the second back surface pad have the same area in plan view.
According to this, when mounting the light emitting element mounting wiring board on the mother board, the amount of solder used for each of the first and second back pads is balanced, so that it is difficult to inadvertently tilt. Can be guaranteed.
Note that the areas of the first back surface pad and the second back surface pad in the plan view are equivalent to each other because the areas in the bottom view are within the same range (within ± 30%, preferably within the same range (1: 1)). Within ± 20%, more desirably within ± 10%).

Note that the connection wiring layer includes a plan view and a similar shape of the portion in the rear surface side of the first through conductor which will be described next, the form consisting of a moiety such as substantially rectangular or arcuate in plan view.

Incidentally, the first through conductor in the thickness direction of the substrate main body, the form consisting of only the conductive portion of relatively large diameter, form consisting of a plurality of via conductors and the conductor portion of the large diameter, along the thickness direction A form composed of a plurality of large-diameter conductor parts having different cross-sectional areas and a form composed of the plurality of via conductors and a plurality of large-diameter conductor parts are included.
In addition, the large-diameter conductor portion has a form that exhibits a circular shape, an elliptical shape, a rectangular shape (an oblong shape or a square shape), a semicircular shape, or a convex shape in plan view.

The top view which shows the wiring board for light emitting element mounting of one form by this invention. FIG. 2 is a vertical sectional view taken along line XX in FIG. 1. The perspective view which shows the board | substrate body of the said wiring board for light emitting element mounting transparently. Sectional drawing similar to FIG. 2 which shows the wiring board of a reference form . Sectional drawing similar to FIG. 2 which shows the wiring board of a different reference form . Furthermore, sectional drawing similar to FIG. 2 which shows the wiring board of a different reference form . Sectional drawing similar to FIG. 2 which shows the wiring board of another reference form . Sectional drawing similar to FIG. 2 which shows the wiring board of a different reference form . The side view and perspective view which show the deformation | transformation form of a 1st penetration conductor. The side view and perspective view which show the 1st penetration conductor of a different form. Furthermore, the side view and perspective view which show the 1st penetration conductor of a different form.

Hereinafter, modes for carrying out the present invention will be described.
FIG. 1 is a plan view showing a light emitting element mounting wiring board (hereinafter simply referred to as a wiring board) 1 according to an embodiment of the present invention, and FIG. FIG. 3 is a perspective view showing the board body 2 of the wiring board 1 in a perspective manner.
As shown in FIGS. 1 and 2, the wiring substrate 1 includes a substrate body 2 having a front surface 3 and a back surface 4 that are substantially square (rectangular) in plan view, and a side surface 5 located between these four sides, and the substrate body. A first front surface pad 11 and a second front surface pad 12 which are formed apart from each other on the front surface 3 of the second surface, and a first back surface pad 15 and a second back surface pad 16 which are formed apart from each other on the rear surface 4 of the substrate body 2. The first connection conductor 17 that electrically connects the first front surface pad 11 and the first back surface pad 15 and the second connection pad 17 and the second back surface pad 16 are electrically connected. A second connection conductor 18.
The first surface pad 11 has an area several times larger than that of the second surface pad 12. The first back pad 15 and the second back pad 16 have the same area in plan view (the difference in area between the pads 15 and 16 is within ± 10%).

As shown in FIG. 2, the substrate body 2 has a relatively thin ceramic layer (insulating material) 6, 9 having a front surface 3 and a back surface 4, and a relatively thick wall positioned between the ceramic layers 6, 9. These ceramic layers (insulating materials) 7 and 8 are integrally laminated. Among these, the thickness of the ceramic layer 9 having the back surface 4 is about 0.10 mm or less. The ceramic layers 6 to 9 are made of a high-temperature fired ceramic such as alumina or a low-temperature fired ceramic such as glass-ceramic.
Further, a relatively shallow concave groove 19 is formed symmetrically near the center of the left and right side surfaces 5 in the plan view of FIG. 1, and the first and second connecting conductors (side surfaces) are formed along the inner wall surface of the concave groove 19. Conductors) 17 and 18 are formed.
Further, as shown in FIG. 1, a virtual line for mounting a light emitting element 10 such as a light emitting diode (LED) to be mounted later on the upper surface of the first surface pad 11 in the central portion of the surface 3 of the substrate body 2. The sealing resin 13 is formed in a substantially hemispherical shape in the vicinity of the mounting portion 10a.
The light emitting element 10 mounted on the mounting portion 10a and electrically connected to the first surface pad 11 is electrically connected to the second surface pad 12 via a bonding wire 14 indicated by a broken line in FIG. Connected to.

As shown in FIGS. 2 and 3, between the front surface 3 and the back surface 4 of the substrate body 2, a first through conductor 20 composed of a plurality of conductor portions 21 to 23, a planar connection wiring layer 25, and a first Two through conductors 24 are provided. Of the first through conductor 20, the conductor portion 21 in contact with the first surface pad 11 is composed of a plurality of via conductors (21) having a relatively small diameter and a thickness of about 0.10 mm, and the conductor portions 22 and 23 have a diameter of Are stacked in coaxial cylinders with different cylindrical bodies. The conductor portions 22 and 23 include the mounting portion 10a in a plan view projection and are larger than the area of the mounting portion 10a. Moreover, the conductor portions 22 and 23 overlap with the first back surface pad 15 in the plan view projection.
The second through conductor 24 is composed of a plurality of via conductors having an axial thickness of 0.10 mm or less and a relatively small diameter, and the length in the side view (axial direction) is the length of the first through conductor 20. It is significantly shorter than that. By forming the conductor portion 21 and the second through conductor 24 with a plurality of via conductors, it becomes easy to suppress the occurrence of cracks due to the difference in thermal expansion coefficient between the ceramic layers 6 and 9.
Furthermore, as shown in FIG. 3, the connection wiring layer 25 extends in the front-rear direction on the right side of the semicircular portion 26 having a slightly larger diameter than the bottom surface of the conductor portion 23 on the back surface 4 side in the first through conductor 20. A rectangular portion 29 is formed. The plurality of via conductors (24) constituting the second through conductor 24 are connected to substantially the entire surface of the rectangular portion 29 at equal intervals.

The first back pad 15 is in contact with the second through conductor 24 and is electrically connected to the first front pad 11 through the first connecting conductor 17. The second surface pad 12 is electrically connected through the two connection conductors 18.
The first and second front surface pads 11 and 12, the first and second back surface pads 15 and 16, the first and second connection conductors 17 and 18, the first and second through conductors 20 and 24, and the connection wiring layer 25 is made of, for example, W, Mo, Cu, or Ag.
Further, in FIG. 2, solders 27 and 28 used for mounting the wiring board 1 are arranged on the surface of a mother board such as a printed board (not shown) below the first and second backside pads 15 and 16. Is done. The solders 27 and 28 are made of, for example, Sn—Ag solder, and have the same shape and volume.
The wiring board 1 as described above includes punching processing by punching, W, Mo, Cu, or Ag powder into the obtained holes for the green sheets of the ceramic layers 6 to 9. Filling the conductive paste, printing the conductive paste on at least one of the front and back surfaces of the green sheet, laminating and pressing the multilayer green sheets, firing the obtained green sheet laminate, and Process (including multi-cavity form) of sequentially performing each step of electrolytic metal or electroless metal plating of Ni and Au on the conductor portions (11, 12, 15-18) exposed to the outside of the obtained substrate body 2 ).

According to the wiring board 1 as described above, the first through conductor 20 is larger in diameter than the mounting portion 10a of the light emitting element 10 and close to the back surface 4 side of the board body 2 except for the vicinity of the surface 3 of the board body 2. As described above, since the substrate body 2 is disposed between the front surface 3 and the back surface 4, the heat generated by the light emitting element 10 mounted on the mounting portion 10a of the first front surface pad 11 is generated by the first through conductor. Since heat can be quickly transferred to the back surface 4 side of the substrate body 2 through 20, it can be effectively radiated from the first back surface pad 15 to the outside through the second through conductor 24.
In addition, since the first through conductor 20 is not exposed on the back surface 4 of the substrate body 1, the first and second back surface pads 15 and 16 on the back surface 4 of the substrate body 2 have a relatively large area equivalent to each other. Can be formed.
Therefore, the heat from the light emitting element 10 can be efficiently radiated from the back side to the outside through the first through conductor 20, the connection wiring layer 25, the second through conductor 24, and the first back pad 15. In addition, since the wiring board 1 is not inadvertently tilted when mounted on the mother board via the solders 27 and 28 respectively on the first and second backside pads 15 and 16 having the same area, good mountability is achieved. It is also possible to play.

FIG. 4 is a vertical sectional view similar to the above showing a wiring board 1a of a reference form .
As shown in FIG. 4, the wiring substrate 1a includes a substrate body 2a in which a relatively thick ceramic layer 7 including a front surface 3 and a relatively thin ceramic layer 9 including a back surface 4 are laminated, and the substrate body 2a. The same first and second front surface pads 11 and 12 formed on the front surface 3, the same first and second back surface pads 15 and 16 formed on the rear surface 4 of the substrate body 2a, and left and right side surfaces. The first and second connection conductors 17 and 18 are formed along the five concave grooves 19.
As shown in FIG. 4, only the large-diameter cylindrical conductor portion 22 that penetrates the ceramic layer 7 and is in wide contact with the first surface pad 11 is provided between the front surface 3 and the back surface 4 of the substrate body 2a. And a second through conductor 24 similar to the above (a plurality of via conductors having a thickness of 0.10 mm or less) that connects between the first through conductor 20 and the first back surface pad 15. It is arranged. The conductor portion 22 of the first through conductor 20 has a large area including the mounting portion 10a of the light emitting element 10 in plan view, is longer in side view than the second through conductor 24, and is first in plan view. It overlaps with the back pad 15.

FIG. 5 is a vertical sectional view similar to the above showing a wiring board 1b of a different reference form . As shown in FIG. 5, the wiring board 1b includes the same substrate body 2a, the same first and second front surface pads 11 and 12, the same first and second back surface pads 15 and 16, the first A through conductor 20 (22) and a second through conductor 24 are provided. The wiring board 1b is different from the wiring board 1a in that the first connection conductor 30 made of a via conductor that electrically connects the first front surface pad 11 and the first back surface pad 15 is the surface of the substrate body 2a. 2 and the back surface 4 and the second connection conductor 31 made of a via conductor that electrically connects the second surface pad 12 and the second back surface pad 16 is formed on the front surface 3 and the back surface of the substrate body 2a. It is a point which penetrates between 4 points.
Also with the wiring boards 1a and 1b as described above, the heat of the light emitting element 10 mounted on the mounting portion 10a can be radiated from the first back pad 15 to the outside in the same manner as the wiring board 1, and the same area can be obtained. The first and second back surface pads 15 and 16 do not inadvertently tilt when mounted on the mother board, and good mountability is obtained.

FIG. 6 is a vertical sectional view similar to the above, but showing a wiring board 1c of a different reference form . The wiring board 1c is different from the wiring board 1a in that the relatively thick ceramic layer 7 including the front surface 3, the relatively thin ceramic layer 9 including the back surface 4, and the front surface 3, as shown in FIG. The substrate body 2b is further laminated with a ceramic layer 32 laminated above the peripheral portion and having a conical side surface 34 inside. The side surface 34 forms a conical cavity 33 together with the surface 3 exposed on the bottom surface, and a light reflecting layer 35 in which a surface of a conductor layer such as W is coated with an Ag plating film is formed on the surface 34. Has been.
After the light emitting element 10 is mounted on the mounting portion 10a, the cavity 33 is filled with the sealing resin 13 as illustrated. Further, the side surface 34 of the cavity 33 may have a polygonal pyramid shape such as a quadrangular pyramid shape or a hexagonal pyramid shape, for example.

FIG. 7 is a vertical sectional view similar to the above showing a wiring substrate 1d of another reference form . The wiring board 1d is different from the wiring board 1a in that the relatively thick ceramic layer 7 including the front surface 3, the relatively thin ceramic layer 9 including the back surface 4, and the front surface 3, as shown in FIG. The substrate main body 2c is further laminated with a cylindrical ceramic layer 36 which is laminated above the peripheral portion and has a columnar side surface 38 on the inner side. The side surface 38 forms a cylindrical cavity 37 together with the surface 3 exposed on the bottom surface, and the surface is covered with the same light reflecting layer 39 as described above. The side surface 38 of the cavity 37 may have a polygonal column shape such as a quadrangular column shape or a hexagonal column shape.

FIG. 8 is a vertical sectional view similar to the above showing a wiring board 1e of another reference form . The wiring board 1e is different from the wiring board 1c as shown in FIG. 8 in that a first via conductor (first connection conductor) that electrically connects the first front surface pad 11 and the first back surface pad 15 is used. ) 30 penetrates between the front surface 3 and the back surface 4 of the substrate body 2a and electrically connects the second front surface pad 12 and the second back surface pad 16 (second connection conductor). The point 31 penetrates between the front surface 3 and the back surface 4 of the substrate body 2a. Incidentally, for arranging the first via conductor 30, by the cross-sectional area of the first through conductor 20 (22) in the via conductor 30 near the becomes partially reduced, that the cross-section in plan view other than circular, It is possible to ensure contact with the second through conductor 24 composed of a plurality of via conductors without reducing the cross-sectional area at other portions.
The board body 2b of the wiring board 1e may be the board body 2c.
The wiring boards 1c to 1e as described above can achieve the same effects as the wiring boards 1, 1a, and 1b.

FIG. 9A is a side view showing a first through conductor 20a, which is a modified form of the first through conductor 20, in which the axial centers of the cylindrical conductor portions 22 and 23 are shifted, A part is overlapped on the second surface pad 12 side.
FIG. 9B is a perspective view showing a first through conductor 20b, which is an applied form of the first through conductor 20 of FIG. 9A, and has a semicircular shape in plan view on the back surface 4 side. By providing the conductor portion 23a, the connection with the second through conductor 24 composed of a plurality of via conductors (24) can be secured.
The first through conductors 20a and 20b as described above can also be applied to the wiring boards 1 to 1e in the same manner as described above, and can achieve the same effects as described above.

FIG. 10A is a side view showing a first through conductor 20c, which is a different modification of the first through conductor 20, and the axial centers of the cylindrical conductor portions 22 and 23 are further shifted so that the surface 3 The conductor portion 22 on the side is positioned on the opposite side of the mounting portion 10a of the first front surface pad 11, and the conductor portion 23 on the back surface 4 side is positioned on the first back surface pad 15 side.
FIG. 10B is a perspective view showing a first through conductor 20d, which is an applied form of the first through conductor 20c. The conductor portion 22 has a square shape in plan view on the back surface 4 side. The conductor portion 23b to be presented is positioned on the first backside pad 15 side while shifting the axis.
Further, FIG. 10C is a perspective view showing a first through conductor 20e which is a modified form of the first through conductors 20c and 20d, and the conductor portion 22 on the surface 3 side also has a rectangular shape in plan view. A portion 22a is provided, and the conductor portion 22a and the conductor portion 23b are arranged with their axes shifted.
The first through conductors 20c to 20e having the above-described application forms and modifications can also be applied to the wiring boards 1 to 1e in the same manner as described above, and can provide the same effects as described above .

FIGS. 11A and 11B are a side view and a perspective view showing the first through conductor 20f in a further different form. As shown in the figure, a conductor portion 23c having a convex shape in plan view is disposed on the back surface 4 side of the conductor portion 22 having a cylindrical shape, and the protruding portion of the conductor portion 23c is in contact with the conductor portion 22. By doing so, it is possible to ensure the connection with the second through conductor 24 composed of a plurality of via conductors.
The conductor portion 22a and the conductor portion 23c may be different types of first through conductors 20 arranged in the same manner as described above.
The first through conductors 20f having different forms as described above can also be applied to the wiring boards 1 to 1e in the same manner as described above, and can provide the same effects as described above.

The present invention is not limited to the embodiments described above.
For example, as the insulating material constituting the substrate body, for example, a required number of resin insulating layers made of epoxy resin or the like are applied, or a ceramic layer and a resin insulating layer are used in combination at each position to be laminated. It is also possible to use it as a form.
Further, in each of the first through conductors 20 shown in FIGS. 9 to 11, it is possible to omit the conductor portions 21 made of a plurality of via conductors in contact with the first surface pad 11. .

Further, the conductor portions 22 and 23 located in the middle of the first through conductor 20 in the thickness direction or on the second through conductor 24 side are not limited to the cylindrical shape or the prismatic shape, and are, for example, from the surface 3 side of the substrate body 2. Alternatively, it may have a conical shape or a pyramid shape in which the horizontal cross section on the back surface 4 side gradually increases.
Further, the first and second connection conductors may be a combination of both side conductors and via conductors on the same wiring board.
In addition, the wiring board 1 of the present invention also includes a multi-cavity configuration including a product region in which a plurality of the wiring substrate 1 are adjacently arranged vertically and horizontally in a plan view and a frame-shaped ear portion surrounding the periphery of the region. It is a waste.

  According to the present invention, the light emitting element mounting portion is provided on one of the pair of front surface pads formed on the front surface of the substrate body made of an insulating material and having the front surface and the back surface, The light emitting device has a pair of back pads that are individually connected to the pair of front surface pads, can sufficiently dissipate heat generated from the light emitting device to the outside from the back surface of the substrate body, and is excellent in mountability with the motherboard. A wiring board can be provided.

1 ……………………… Wiring board for mounting light emitting element 2, 2a to 2c ………… Board body 3 ………………………… Surface 4 ……………………… ... Back 5 ………………………… Side 6-9 …………………… Ceramic layer (insulating material)
10 ... …………………… Light-emitting element 10a …………………… Mounting part 11 ………………………… First surface pad 12 ……………………… Second surface Pad 15 ……………………… First backside pad 16 ……………………… Second backside pad 17,30 ……………… First connecting conductor 18,31 …………… ... 2nd connection conductor 20, 20a-20f ... 1st penetration conductor 21-23 ............. Conductor part 24 ........................... 2nd penetration conductor 25 ..................... …… Connection wiring layer

Claims (3)

A substrate body made of an insulating material, having a front surface, a back surface, and a side surface located between the front surface and the back surface;
A first surface pad formed on the surface of the insulating substrate and having a light emitting element mounting portion on the upper surface;
A second surface pad formed on the surface of the insulating substrate and separated from the first surface pad;
A first back surface pad and a second back surface pad that are formed apart from each other on the back surface of the insulating substrate and at least partially overlap with the first front surface pad in a plan view projection;
A first connection conductor electrically conducting between the first front surface pad and the first back surface pad;
A light emitting element mounting wiring board comprising: a second connection conductor that electrically conducts between the second front surface pad and the second back surface pad;
Between the front surface and the back surface of the substrate body, connected to the first through conductor disposed in contact with the first front pad, and between the first through conductor and the first back pad, And the 2nd penetration conductor shorter than the 1st penetration conductor in the length of the side view is provided,
The area in plan view of the first through conductor excluding the vicinity of the surface of the substrate body includes a mounting portion of the light emitting element located on the upper surface of the first surface pad and is larger than the area of the mounting portion.
The first through-conductor, in the projection in plan view, at least a portion with said first rear surface pad and the second back surface pad is duplicated,
A planar connection wiring layer is formed between the first through conductor and the second through conductor,
The first through conductor is formed from a plurality of conductor portions along the thickness direction of the substrate body, and the conductor portions near the surface of the substrate body are composed of a plurality of via conductors .
A wiring board for mounting a light-emitting element. The thickness of the second through conductor is 0.10 mm or less.
The wiring board for mounting a light-emitting element according to claim 1. The first back pad and the second back pad have the same area in plan view.
The wiring board for mounting a light-emitting element according to claim 1 or 2.

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