JP6044153B2 - Electronic components - Google Patents

Description

  The present invention relates to an electronic component.

  As a conventional electronic component, for example, one described in Patent Document 1 is known. In the electronic component described in Patent Document 1, the external electrode is separated into two regions, a region formed on the mounting surface side and a region formed on the end surface side of the element body, by a gap formed in the external electrode. ing. As a result, in this electronic component, when the solder is mounted on the land electrode of the circuit board with the solder, the capacitance between the end electrode side region of the external electrode and the land electrode is measured, and the external electrode on the end surface side of the element body is measured. It is confirmed that a solder fillet is formed in this area, and the mounting failure is suppressed.

JP-A-8-88143

  By the way, when a voltage is applied to the electronic component, a mechanical strain having a magnitude corresponding to the applied voltage is generated in the element body due to the electrostrictive effect. In particular, when an AC voltage is applied, vibration (hereinafter referred to as electrostrictive vibration) occurs in the electronic component due to this mechanical strain. Therefore, when an electronic component is mounted on a substrate and an AC voltage is applied, electrostrictive vibration propagates to the substrate, and so-called noise may occur. This problem of sounding is considered to be particularly noticeable in SMD (Surface Mount Device) mounting where the contact area between the electronic component and the substrate is large.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component that can suppress noise caused by electrostrictive vibration.

  In order to solve the above problem, an electronic component according to the present invention has a pair of end faces facing each other and four side faces connecting the end faces, and an element body in which internal electrodes exposed on the end faces are arranged, An electronic component comprising a terminal electrode disposed on an end surface side of the body, the terminal electrode including a seizure layer disposed on the end surface so as to cover the internal electrode, and a resin containing disposed on at least one of the four side surfaces It consists of a layer and the plating layer arrange | positioned so that a baking layer and a resin content layer may be covered.

  In this electronic component, a resin-containing layer is disposed on at least one side surface of the element body. Thereby, when the electronic component is mounted on the substrate with the one surface as a mounting surface, the electrostrictive vibration can be absorbed by the elastic force of the resin-containing layer, and the propagation of the electrostrictive vibration to the substrate can be suppressed. Therefore, it is possible to suppress the noise due to electrostrictive vibration.

  The resin-containing layer can be a conductive resin electrode layer. With this conductive resin electrode layer, propagation of electrostrictive vibration to the substrate can be suitably suppressed. In addition, since the plating layer can be directly formed on the conductive resin electrode layer, the configuration can be simplified.

  The resin-containing layer may be composed of an insulating resin layer and a conductive resin electrode layer disposed on the insulating resin layer. The conductive resin electrode layer and the insulating resin layer can suitably suppress the propagation of electrostrictive vibration to the substrate.

  The structure by which the insulating resin layer is arrange | positioned over the whole surface of an element | base_body may be sufficient. In this way, by forming the insulating resin layer over the entire surface, the area where the insulating resin layer is disposed increases, so that the amount of resin increases and electrostrictive vibration can be further absorbed in the insulating resin layer. . Therefore, it is possible to further suppress the noise due to electrostrictive vibration.

  The terminal electrode located on one surface of the element body includes a baking layer further disposed on one surface continuously with the baking layer located on the end surface of the element body, a resin-containing layer disposed on the baking layer, and a resin-containing layer The structure which consists of a plating layer arrange | positioned on top may be sufficient. By disposing the baking layer on one surface, it is possible to prevent the plating solution from entering the body during the plating process when forming the plating layer. Therefore, it is possible to suppress the deterioration of the characteristics of the electronic component due to the penetration of the plating solution.

  According to the present invention, it is possible to suppress squealing due to electrostrictive vibration.

It is a perspective view which shows the electronic component which concerns on one Embodiment. It is a figure which shows the cross-sectional structure of the electronic component shown in FIG. FIG. 2 is an exploded perspective view illustrating a configuration of an element body of the electronic component illustrated in FIG. 1. It is a figure which shows the mounting structure of an electronic component. It is a figure which shows the cross-sectional structure of the electronic component which concerns on another form.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.

  FIG. 1 is a perspective view showing an electronic component according to an embodiment. FIG. 2 is a diagram showing a cross-sectional configuration of the electronic component shown in FIG. FIG. 3 is an exploded perspective view showing the configuration of the element body. As shown in FIG. 1, the electronic component 1 includes a substantially rectangular parallelepiped element body 2 and a pair of terminal electrodes 3 and 4 disposed on the element body 2. The electronic component 1 is configured as a multilayer capacitor.

  As shown in FIGS. 1 and 2, the element body 2 includes a pair of end faces 2 a and 2 b facing the longitudinal direction of the element body 2, a pair of side surfaces 2 c and 2 d facing the stacking direction of the element body 2, And a pair of side surfaces 2e and 2f facing each other in a direction perpendicular to the direction and the stacking direction. In the present embodiment, the side surface 2d is a mounting surface (one surface) of the electronic component 1.

  As shown in FIGS. 2 and 3, the element body 2 is configured as a laminated body in which a plurality of rectangular plate-like dielectric layers 6, a plurality of internal electrodes 7, and internal electrodes 8 are stacked. The internal electrode 7 and the internal electrode 8 have a substantially rectangular shape, and are arranged one by one along the stacking direction of the dielectric layers 6 in the element body 2. The internal electrode 7 and the internal electrode 8 are disposed so as to face each other with at least one dielectric layer 6 interposed therebetween. In the actual electronic component 1, the plurality of dielectric layers 6 are integrated to such an extent that the boundary between them cannot be visually recognized.

  The internal electrode 7 is directly connected to the terminal electrode 3 with one side exposed to the end face 2 a of the element body 2 on which the terminal electrode 3 is disposed. Thereby, the internal electrode 7 and the terminal electrode 3 are electrically connected. The internal electrode 8 is exposed to the end surface 2 b of the element body 2 on which the terminal electrode 4 is disposed, and is directly connected to the terminal electrode 4. Thereby, the internal electrode 8 and the terminal electrode 4 are electrically connected.

  The terminal electrode 3 covers the end surface 2a of the element body 2 and is disposed at one end of the side surfaces 2c to 2f on the end surface 2a side. The terminal electrode 3 includes a baking layer 10a, a conductive resin electrode layer (resin-containing layer) 11a, and a plating layer 12a. The baking layer 10a is made of, for example, Cu having conductivity, and is disposed over the end surface 2a and the side surfaces 2c to 2f of the element body 2.

  The conductive resin electrode layer 11a is disposed on the baking layer 10a and an insulating resin layer (resin-containing layer) 15 described later. The conductive resin electrode layer 11a is formed so as to cover the baking layer 10a disposed on the end surface 2a and the side surface 2c of the element body 2 and the insulating resin layer 15 located on the baking layer 10a disposed on the side surface 2d. Has been. The conductive resin electrode layer 11a is, for example, a thermosetting conductive resin layer made of, for example, Ag or Cu as a metal component, and an epoxy-based or phenol-based resin component, for example. The plating layer 12a is disposed on the conductive resin electrode layer 11a so as to cover the conductive resin electrode layer 11a. The plating layer 12a is made of, for example, Ni or Sn.

  The insulating resin layer 15 is disposed between the baking layer 10a and the conductive resin electrode layer 11a. The insulating resin layer 15 is disposed on the baking layer 10 a (baking layer 10 b) disposed on the side surface 2 d of the element body 2 and to cover the entire surface of the side surface 2 d of the element body 2. The insulating resin layer 15 is a thermosetting resin and is formed of an epoxy resin or the like. The thickness of the insulating resin layer 15 is, for example, about 200 to 400 μm.

  The terminal electrode 4 has the same configuration as the terminal electrode 3, covers the end surface 2 b of the element body 2, and is disposed at one end of the side surfaces 2 c to 2 f on the end surface 2 b side. The terminal electrode 4 includes a baking layer 10b, a conductive resin electrode layer 11b, and a plating layer 12b. The baking layer 10b is made of, for example, Cu having conductivity, and is disposed over the end surface 2b and the side surfaces 2c to 2f of the element body 2.

  The conductive resin electrode layer 11 b is disposed on the baking layer 10 b and the insulating resin layer 15. The conductive resin electrode layer 11b is disposed so as to cover the baking layer 10b disposed on the end surface 2b and the side surface 2c of the element body 2 and the insulating resin layer 15 positioned on the baking layer 10b disposed on the side surface 2d. Has been. The plating layer 12b is disposed on the conductive resin electrode layer 11b so as to cover the conductive resin electrode layer 11b.

  Then, the manufacturing method of the electronic component 1 is demonstrated. First, a ceramic green sheet to be the dielectric layer 6 is formed, and then a pattern of the internal electrodes 7 and 8 is printed on the ceramic green sheet with a conductive paste and dried to form an electrode pattern. A plurality of ceramic green sheets on which electrode patterns are formed in this way are stacked, and the laminate of the ceramic green sheets is cut into chips each having the size of the element body 2. Then, binder removal is performed by subjecting the chip to heat treatment at a predetermined temperature for a predetermined time. After the binder removal, the element body 2 is obtained by further baking at a high temperature.

  Next, Cu paste, which is a conductive paste, is applied to the end faces 2a and 2b and the side faces 2c to 2f of the element body 2 by, for example, a dipping method. Then, the Cu paste is baked at a predetermined temperature to form the baking layers 10a and 10b. Next, an insulating paste is applied by dipping (or screen printing) on the side surface 2d and the baking layer 10a located on the side surface 2d of the element body 2. Then, the insulating resin layer 15 is formed by heat-treating (drying) the insulating paste.

  Subsequently, the conductive resin electrode layer so as to cover the baking layers 10a and 10b formed on the end surfaces 2a and 2b of the element body 2 and the insulating resin layer 15 formed on the baking layer 10a formed on the side surface 2d. 11a is formed. The conductive resin electrode layer 11a is formed by applying a conductive resin paste by, for example, a dipping method and performing a heat treatment. Finally, plating layers 12a and 11b are formed on the conductive resin electrode layer 11a by plating. Thereby, the terminal electrodes 3 and 4 are formed on the element body 2.

  As described above, in the present embodiment, the insulating resin layer 15 is disposed on the side surface 2d of the element body 2 serving as a mounting surface. Thereby, as shown in FIG. 4, when the electronic component 1 is arranged on the land electrodes 21 and 22 of the substrate 20 and mounted by the solder S, a voltage is applied to the electronic component 1 and electrostrictive vibration is generated. In the electronic component 1, electrostrictive vibration is absorbed by the elastic force of the insulating resin layer 15, and propagation of the electrostrictive vibration to the substrate 20 can be suppressed. As a result, noise can be suppressed.

  The insulating resin layer 15 is disposed on the entire side surface 2d of the element body 2. As described above, by disposing the insulating resin layer 15 over the entire surface of the side surface 2d, the amount of resin increases, so that the insulating resin layer 15 can further absorb electrostrictive vibration. Therefore, it is possible to further suppress the noise due to electrostrictive vibration. Further, since the insulating resin layer 15 is a thermosetting resin, the insulating resin layer 15 is prevented from being melted by heat during solder mounting.

  In the present embodiment, the baking layer 10a is also disposed on the side surface 2d. Thereby, it is possible to prevent the plating solution from entering the element body 2 during the plating process when forming the plating layers 12a and 12b. Therefore, it is possible to suppress the deterioration of the characteristics of the electronic component 1 due to the penetration of the plating solution.

  The present invention is not limited to the above embodiment. For example, in the above embodiment, the insulating resin layer 15 is disposed on the entire side surface 2d of the element body 2, but the insulating resin layer 15 may not be disposed on the entire side surface 2d. FIG. 5 is a diagram illustrating a cross-sectional configuration of an electronic component according to another embodiment. As shown in FIG. 5, in the electronic component 1 </ b> A, the insulating resin layer 15 a is disposed at one end of the side surface 2 d of the element body 2 on the end surface 2 a side, and is located on the baking layer 10 a. Similarly, the insulating resin layer 15b is disposed at one end of the side surface 2d of the element body 2 on the end surface 2b side, and is located on the baking layer 10b.

  With such a configuration, in the electronic component 1A, when a voltage is applied and electrostrictive vibration is generated, the electrostrictive vibration is absorbed by the elastic force of the insulating resin layers 15a and 15b, and the electrostrictive vibration substrate 20 is obtained. Propagation to can be suppressed. As a result, noise can be suppressed.

  In addition, although the resin-containing layers are the insulating resin layers 15a and 15b, the resin-containing layer may be formed only of the conductive resin electrode layer. In this case, a conductive resin electrode layer having a predetermined thickness is arranged on the baking layers 10a and 10b arranged on the side surface 2d of the element body 2, and plating is performed so as to cover the conductive resin electrodes and the baking layers 10a and 10b. Layers are placed. In such a configuration, electrostrictive vibration is absorbed by the elastic force of the conductive resin electrode layer, and propagation of the electrostrictive vibration to the substrate 20 can be suppressed. As a result, noise can be suppressed.

  Moreover, in the said embodiment, although the baking layers 10a and 10b are arrange | positioned over the end surfaces 2a and 2b and the side surfaces 2c and 2d of the element body 2, the baking layers 10a and 10b are at least the end surface 2a of the element body 2. , 2b.

  DESCRIPTION OF SYMBOLS 1, 1A ... Electronic component, 2 ... Element body, 2a, 2b ... Side surface, 2c-2f ... Side surface, 3, 4 ... Terminal electrode, 10a, 10b ... Baking layer, 11a, 11b ... Conductive resin electrode layer (resin containing Layer), 12a, 12b ... plating layer, 15 ... insulating resin layer (resin-containing layer).

Claims (2)

An element body having a pair of end faces opposed to each other and four side faces connecting the end faces, and an internal electrode exposed on the end faces;
An electronic component comprising a terminal electrode disposed on the end face side of the element body,
The terminal electrode is
A seizure layer disposed on the end surface so as to cover the internal electrode, and disposed on at least a mounting surface of the four side surfaces, and
A resin-containing layer disposed on the baking layer;
A plating layer disposed on the resin-containing layer ,
On the end face of the element body, the baking layer, the resin-containing layer that is a conductive resin electrode layer, and the plating layer are disposed,
On the mounting surface of the element body, the resin-containing layer comprising the baking layer, an insulating resin layer disposed on the baking layer, and the conductive resin electrode layer disposed on the insulating resin layer. And an electronic component in which the plating layer is disposed . Electronic component according to claim 1 Symbol placement, wherein the insulating resin layer is disposed over the entirety of the mounting surface of the element body.

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