JP6065638B2 - Signal transmission device and communication module - Google Patents

Description

  The present invention relates to a communication module and a signal transmission device including the communication module.

  In general, a signal transmission device including a communication module is provided with a cooling mechanism for maintaining the operating temperature of the communication module within a predetermined temperature range. Such a cooling mechanism may be provided in a communication module or may be provided in a substrate on which the communication module is mounted.

  Patent Document 1 describes an optical module that is a communication module (optical module) mounted on a substrate (motherboard) and includes a cooling mechanism. In the optical module described in Patent Document 1, an optical element and a control IC are mounted on one surface of a rigid substrate constituting the optical module, and a heat sink is attached to the other surface.

JP2011-128378A (paragraph 0018)

  However, when a plurality of communication modules are mounted on the same substrate, it is desirable that a common cooling mechanism is provided on the substrate for the communication modules. This is because when cooling mechanisms are individually provided for a plurality of communication modules mounted on a board, in order to avoid interference between the cooling mechanisms provided in each communication module, adjacent communication modules are connected to each other. There is a possibility that the interval of the interval needs to be widened. That is, there is a possibility that the densification of the communication module may be inhibited. In addition, if a cooling mechanism is provided for each communication module, the structure and layout of the refrigerant passage becomes complicated when the liquid cooling type cooling mechanism is adopted, and the number of connection points of the refrigerant passage increases, resulting in liquid leakage. There is a risk that the risk will increase.

  On the other hand, when the cooling mechanism is provided on the substrate on which the communication module is mounted, the communication module and the cooling mechanism are not thermally connected until the communication module is mounted on the substrate. Therefore, it is necessary to reliably realize the thermal connection between the communication module mounted on the substrate and the cooling mechanism provided on the substrate.

  An object of the present invention is to reliably realize a thermal connection between a communication module and a cooling mechanism provided on a substrate on which the communication module is mounted.

  The signal transmission device according to the present invention is a signal transmission device in which a communication module is mounted on a board having a cooling mechanism, the slot being adjacent to the cooling mechanism on the board, and the communication module being inserted and removed, and the slot And an elastic piece that protrudes from the inner surface of the device and contacts the communication module inserted into the slot to urge the communication module toward the cooling mechanism. The elastic piece contacts the communication module when the insertion length of the communication module into the slot after the lower end in the insertion direction of the communication module inserted into the slot passes through the elastic piece reaches a predetermined length. To start.

  In one aspect of the signal transmission device of the present invention, a board-side connector provided in the slot and a module-side connector provided in the communication module are provided, and the elastic piece includes the board-side connector and the board-side connector. Contact with the communication module is started before fitting with the module-side connector is started.

  In another aspect of the signal transmission device of the present invention, the sliding distance of the elastic piece in contact with the communication module with respect to the communication module is 1/20 or more of the total length along the insertion direction of the communication module into the slot. And it is 1/3 or less.

  In another aspect of the signal transmission device of the present invention, the communication module is positioned on the first outer surface facing the inner surface of the slot and on the opposite side of the first outer surface, and is in close contact with the cooling mechanism. And a second outer surface. The first outer surface includes a contact surface that comes into contact with the elastic piece, and a flank that recedes toward the second outer surface with respect to the contact surface and does not come into contact with the elastic piece. When the communication module is inserted into the slot, the elastic piece passes over the flank and then passes through a step between the flank and the contact surface to reach the contact surface.

  In another aspect of the present invention, two or more elastic pieces are provided along the insertion direction of the communication module into the slot.

  In another aspect of the signal transmission device of the present invention, the cooling mechanism includes a heat sink to which the communication module is in close contact, and a refrigerant passage through which a refrigerant that performs heat exchange with the heat sink is circulated.

  The communication module of the present invention is a communication module that is inserted into and removed from a slot provided on a substrate having a cooling mechanism, and the lower end in the insertion direction of the slot passes through an elastic piece protruding from the inner surface of the slot. When the insertion length into the slot reaches a predetermined length, it comes into contact with the elastic piece and is brought into close contact with the cooling mechanism by urging by the elastic piece.

  In one aspect of the communication module of the present invention, a module-side connector that is fitted to a board-side connector provided in the slot is provided, and before the module-side connector starts fitting to the board-side connector. Then, contact with the elastic piece is started.

  In another aspect of the communication module of the present invention, the sliding distance of the elastic piece in contact with the communication module with respect to the communication module is 1/20 or more of the total length along the insertion direction of the communication module into the slot. 1/3 or less.

  In another aspect of the communication module of the present invention, a first outer surface facing the inner surface of the slot, and a second outer surface positioned on the opposite side of the first outer surface and in close contact with the cooling mechanism, Is provided. The first outer surface includes a contact surface that comes into contact with the elastic piece, and a flank that recedes toward the second outer surface with respect to the contact surface and does not come into contact with the elastic piece. When the communication module is inserted into the slot, the elastic piece passes over the flank and then passes through a step between the flank and the contact surface to reach the contact surface.

  In another aspect of the communication module of the present invention, the step is formed by partially overlapping the sheet metal constituting the first outer surface and the second outer surface.

  In another aspect of the communication module of the present invention, a part of the first outer surface is cut away to form the step.

  According to the present invention, the thermal connection between the communication module and the cooling mechanism provided on the substrate on which the communication module is mounted is reliably realized.

It is a perspective view of a signal transmission device. It is a perspective view of the signal transmission apparatus from which the communication module was extracted. It is the elements on larger scale of a signal transmission device. It is an expansion perspective view of a communication module. It is an expanded sectional view of the communication module inserted in the slot. It is sectional drawing which shows the insertion process to the slot of a communication module. It is an expanded sectional view of a communication module inserted in a slot provided with two or more leaf springs. It is an expansion perspective view which shows one of the modifications of a communication module. It is an expansion perspective view which shows another one of the modifications of a communication module.

  Hereinafter, an example of an embodiment of the present invention will be described. The signal transmission device 1 shown in FIG. 1 has a substrate (hereinafter referred to as “motherboard 2”). An IC chip 3 is mounted at substantially the center of the mounting surface of the mother board 2, and heat sinks 4 and 5 constituting a cooling mechanism are arranged on both sides of the IC chip 3. Further, slots 6 a and 6 b are provided on both sides of the respective heat sinks 4 and 5 so as to be adjacent to the heat sinks 4 and 5. That is, two slots are provided for one heat sink. A plurality of communication modules 10 are detachably set in the slots 6a and 6b.

  Each communication module 10 inserted into each of the slots 6a and 6b is electrically connected to the IC chip 3 via a wiring (not shown) formed on the mother board 2, and signals are transmitted to and from the IC chip 3. I / O is performed. Specifically, each communication module 10 converts an optical signal input from the outside into an electric signal and outputs the electric signal to the IC chip 3, and converts the electric signal input from the IC chip 3 into an optical signal to the outside. Output. Hereinafter, each of the above components will be described in detail.

  Please refer to FIG. Each of the heat sinks 4 and 5 is a substantially prismatic block formed of a metal having high thermal conductivity (for example, copper or aluminum). The heat sinks 4 and 5 are arranged in parallel with each other with the IC chip 3 interposed therebetween, and both side surfaces of the heat sinks 4 and 5 function as heat absorbing surfaces. Therefore, in the following description, one side surface 4a of the heat sink 4 may be referred to as “endothermic surface 4a” and the other side surface 4b may be referred to as “endothermic surface 4b”. Also, one side surface 5a of the heat sink 5 may be referred to as “endothermic surface 5a” and the other side surface 5b may be referred to as “endothermic surface 5b”.

  Through holes are formed in the respective heat sinks 4 and 5 along the longitudinal direction of the heat sinks 4 and 5. Further, the through hole formed in the heat sink 4 and the through hole formed in the heat sink 5 are connected via a pipe 7. In FIG. 1 and FIG. 2, the pipe 7 is broken on the way for the sake of convenience, but in reality, a series of circulation paths (refrigerant passages) are formed by the through holes and the pipe 7. Further, a pump and a tank (not shown) are provided in the middle of the refrigerant passage. A predetermined amount of refrigerant (for example, water) is stored in the tank, and the refrigerant stored in the tank is sent out to the refrigerant passage by a pump. The refrigerant sent out to the refrigerant passage goes around the refrigerant passage, returns to the tank, and is sent out again to the refrigerant passage. That is, the refrigerant circulates through the refrigerant passage. The refrigerant circulating in the refrigerant passage exchanges heat with the heat sinks 4 and 5 when passing through the through holes of the heat sinks 4 and 5. In addition, a radiator etc. can also be provided in the middle of a refrigerant path as needed.

  Here, the slots 6a and 6b provided on both sides of the heat sink 4 shown in FIG. 2 and the slots 6a and 6b provided on both sides of the heat sink 5 have the same shape, structure and dimensions. Therefore, only the slots 6a and 6b provided on both sides of the heat sink 4 will be described below, and description of the slots 6a and 6b provided on both sides of the heat sink 5 will be omitted.

  Cover members 20 a and 20 b made of metal plates are disposed on both sides of the heat sink 4 so as to surround the heat sink 4. Specifically, the cover member 20a is disposed outside the heat absorbing surface 4a of the heat sink 4 with a gap substantially the same as the thickness of the communication module 10 (FIG. 1) between the heat absorbing surface 4a. Similarly, a cover member 20b is disposed outside the heat absorbing surface 4b of the heat sink 4 with a gap substantially the same as the thickness of the communication module 10 (FIG. 1) between the heat absorbing surface 4b. That is, the slot 6a is formed by one endothermic surface 4a of the heat sink 4 and the inner surface of the cover member 20a facing the endothermic surface 4a. A slot 6b is formed by the other heat absorbing surface 4b of the heat sink 4 and the inner surface of the cover member 20b facing the heat absorbing surface 4b. In other words, the heat absorbing surfaces 4a and 4b of the heat sink 4 form one inner surface of the slots 6a and 6b. Moreover, the other inner surface of the slots 6a and 6b is formed by the inner surfaces of the cover members 20a and 20b. In the following description, the inner surface of the slots 6a and 6b formed by the inner surfaces of the cover members 20a and 20b may be particularly referred to as “inner surface 8”. The slots 6a and 6b may be collectively referred to as “slot 6”.

  Each cover member 20a, 20b is provided with a plurality of leaf springs 21 as elastic pieces at regular intervals. The leaf | plate spring 21 provided in the cover member 20a is expanded and shown in FIG. As shown in FIG. 3, the leaf spring 21 is formed by forming a cut at a predetermined position of the cover member 20a and bending a portion surrounded by the formed cut toward the inside of the cover member 20a. . In addition, the leaf | plate spring 21 (FIG. 2) provided in the cover member 20b is formed similarly to the above. Therefore, as shown in FIG. 5, the leaf spring 21 provided on the cover member 20a protrudes from the inner side surface 8 of the slot 6a formed by the inner surface of the cover member 20a. Further, the leaf spring 21 provided on the cover member 20b protrudes from the inner side surface 8 of the slot 6b formed by the inner surface of the cover member 20b.

  As shown in FIGS. 1 and 2, the leaf springs 21 provided in the cover members 20a and 20b are formed at positions corresponding to the insertion positions of the communication modules 10 in the slots 6a and 6b. In this embodiment, five communication modules 10 are inserted into each of the slots 6a and 6b. Therefore, five leaf springs 21 are also provided at equal intervals on the cover members 20a and 20b. Further, each leaf spring 21 is provided at a position facing the substantially center of the communication module 10 when the communication module 10 is inserted into the slots 6a and 6b. The details of the positional relationship between the communication module 10 inserted into the slots 6a and 6b and the leaf spring 21 will be described later.

  As shown in FIGS. 4 and 5, the communication module 10 accommodates a module substrate 11, an optical package 12 mounted on the module substrate 11, an optical fiber 13 as a communication cable extending from the optical package 12, and these. A module case 14 is provided. In FIG. 1, the optical fiber 13 is drawn out from only one communication module 10, but actually the same optical fiber is drawn out from all the communication modules 10.

  The upper and lower sides of the module case 14 are opened, and the upper opening is closed by a plastic lid 15. On the other hand, the opening below the module case 14 is closed by a male connector 16 as a module-side connector. A part of the male connector 16 protrudes below the module case 14 to form a fitting portion 16a that fits with a female connector 17 serving as a board-side connector provided at the bottom of the slots 6a and 6b. As shown in FIG. 4, the surface of the fitting portion 16 a of the male connector 16 has a large number of connections electrically connected to the optical package 12 through a wiring (not shown) formed on the module substrate 11. Terminals are formed. On the other hand, on the inner surface of the female connector 17 shown in FIG. 5, a large number of connection terminals that are electrically connected to the connection terminals formed on the male connector 16 are formed. The connection terminals formed on the female connector 17 are electrically connected to the IC chip 3 via wiring (not shown) formed on the mother board 2 (FIGS. 1 and 2).

  As shown in FIGS. 4 and 5, the communication module 10 (module case 14) has a first outer surface 31 and a second outer surface 32. As shown in FIG. 5, the communication module 10 inserted into the slot 6 a has a first outer surface 31 facing the inner surface 8 of the slot 6 a and a second outer surface 32 facing the heat absorbing surface 4 a of the heat sink 4. Is inserted into the slot 6a in such a direction. The communication module 10 inserted into the slot 6b has a first outer surface 31 facing the inner surface 8 of the slot 6b and a second outer surface 32 facing the heat absorbing surface 4b of the heat sink 4 in the slot 6b. Inserted. In other words, of the two outer surfaces of the communication module 10, the outer surface facing the inner surface 8 of the slot 6 when inserted into the slot 6 is the first outer surface 31. The outer surface located on the opposite side is the second outer surface 32.

  As shown in FIG. 5, the first outer surface 31 of the communication module 10 includes a contact surface 31 a that comes into contact with the leaf spring 21 after the insertion of the communication module 10 into the slot 6 and the leaf spring 21. Is constituted by a flank 31b which does not contact from beginning to end. That is, as shown in FIG. 4, the first outer surface 31 of the communication module 10 is provided with a contact surface 31 a and a clearance surface 31 b in this order along the insertion direction into the slot 6 (FIG. 5). Yes. The contact surface 31a and the flank 31b are parallel to each other but have different heights. Specifically, the flank 31b recedes toward the second outer surface 32 with respect to the contact surface 31a. That is, the flank 31b is lower than the contact surface 31a. As a result, there is a step 31c perpendicular to both surfaces between the contact surface 31a and the flank 31b.

  Taking the communication module 10 inserted into the slot 6a shown in FIG. 1 as an example, the process of inserting the communication module 10 into the slot 6 will be described. When the insertion of the communication module 10 into the slot 6a is started, the lower end of the communication module 10 in the insertion direction passes through the leaf spring 21 as shown in FIG. In other words, the leaf spring 21 that moves relative to the communication module 10 passes through the lower end of the communication module 10 in the insertion direction. Further, the leaf spring 21 that has passed the lower end in the insertion direction of the communication module 10 passes over the flank 31 b of the first outer surface 31 as the communication module 10 is inserted. During this time, the communication module 10 and the leaf spring 21 are not in contact with each other.

  Thereafter, when the insertion length of the communication module 10 into the slot 6a after the lower end in the insertion direction of the communication module 10 has passed through the leaf spring 21 reaches a predetermined length, as shown in FIG. Hits a step 31c between the flank 31b and the contact surface 31a. That is, the leaf spring 21 hits the corner of the contact surface 31a. At this time, the male connector 16 provided in the communication module 10 is very close to the female connector 17 but does not reach the female connector 17. That is, the contact between the communication module 10 and the leaf spring 21 is started before the fitting between the male connector 16 and the female connector 17 is started. The insertion length of the communication module 10 into the slot 6a after the lower end of the communication module 10 in the insertion direction passes through the leaf spring 21 is along the insertion direction from the lower end of the leaf spring 21 to the lower end of the communication module 10. It means straight line distance. In the following description, such insertion length (linear distance) is referred to as “insertion length (L)”.

  The leaf spring 21 hitting the step 31c between the flank 31b and the contact surface 31a passes (over) the step 31c as the communication module 10 is inserted, and reaches the contact surface 31a. The leaf spring 21 that has reached the contact surface 31 a slides on the contact surface 31 a as the communication module 10 is further inserted. As shown in FIG. 6C, when the insertion of the communication module 10 into the slot 6 a is completed, the leaf spring 21 is located at the approximate center of the first outer surface 31. Therefore, the entire second outer side surface 32 of the communication module 10 is pressed almost uniformly against the heat absorbing surface 4a (FIG. 5) of the heat sink 4. When the insertion of the communication module 10 into the slot 6a is completed, the fitting of the male connector 16 and the female connector 17 is also completed. In other words, when the male connector 16 and the female connector 17 are completely fitted, the insertion of the communication module 10 into the slot 6a is completed. Here, the completion of fitting of the male connector 16 and the female connector 17 means that the male connector 16 is inserted into the female connector 17 until it is electrically connected to the female connector 17. That is, it means that the insertion length of the male connector 16 into the female connector 17 has reached the effective fitting length. In addition, the fitting length of the male connector 16 and the female connector 17 in this embodiment is 1.0 mm, and the effective fitting length is 0.7 mm.

  As described above, the leaf spring 21 comes into contact with the first outer surface 31 (contact surface 31a) of the communication module 10 when the insertion length (L) reaches a predetermined length. Then, the leaf spring 21 in contact with the first outer surface 31 urges the communication module 10 toward the heat sink 4. In other words, the leaf spring 21 does not contact the communication module 10 until the insertion length (L) reaches a predetermined length, and the communication module 10 is not biased. The insertion length of the communication module 10 into the slot 6 after the leaf spring 21 contacts the communication module 10 corresponds to the sliding distance of the leaf spring 21 with respect to the communication module 10. That is, the difference between the insertion length (L) shown in FIG. 6B and the insertion length (L) shown in FIG. 6C corresponds to the contact length (sliding distance) of the leaf spring 21 with respect to the communication module 10. To do.

  Refer to FIG. 5 again. The communication module 10 inserted into the slot 6 as described above is urged toward the heat sink 4 by the leaf spring 21 that contacts the first outer surface 31. Therefore, the contact pressure of the communication module 10 with respect to the heat sink 4 increases. As a result, the second outer surfaces 32 and 32 of the two communication modules 10 facing each other across the heat sink 4 are in close contact with the heat absorbing surfaces 4a and 4b of the heat sink 4, respectively, and the thermal connection between the communication module 10 and the heat sink 4 is ensured. To be realized. However, as shown in FIG. 6, the leaf spring 21 is in contact with the communication module 10 before the communication module 10 is completely inserted into the slot 6. That is, the communication module 10 starts to be biased by the leaf spring 21 from the time when the insertion length (L) reaches a predetermined length. Here, the urging direction by the leaf spring 21 intersects the insertion direction and the extraction direction of the communication module 10 into the slot 6. Therefore, the bias in the process of inserting the communication module 10 into the slot 6 becomes a resistance to the insertion of the communication module 10 into the slot 6. This is the same when the communication module 10 is pulled out from the slot 6. That is, the urging force in the process in which the communication module 10 is pulled out from the slot 6 becomes resistance to the pulling out of the communication module 10 from the slot 6.

  The leaf spring 21 slides on the communication module 10 when the communication module 10 is inserted into the slot 6 and when the communication module 10 is pulled out from the slot 6. Therefore, the leaf spring 21 may damage the surface of the communication module 10 (the contact surface 31a of the first outer surface 31).

  Therefore, it is preferable that the dynamic friction distance between the communication module 10 and the leaf spring 21 is as short as possible when the communication module 10 is inserted into the slot 6 and when the communication module 10 is pulled out from the slot 6. That is, the contact length (sliding distance) of the leaf spring 21 with respect to the communication module 10 is preferably as short as possible. From this point of view, the contact length is preferably in the range of 1/20 or more and 1/3 or less of the total length along the insertion direction of the communication module 10 into the slot 6, and is about 1/10. Further preferred. The contact length is determined by the relative positional relationship between the step 31 c provided on the first outer surface 31 of the communication module 10 and the leaf spring 21 provided on the slot 6. Therefore, a desired contact length can be obtained by appropriately changing the relative positional relationship between the step 31c and the leaf spring 21. Note that the module case 14 (FIG. 4) of the communication module 10 in the present embodiment is formed of a bent sheet metal, and a step 31c is formed by partially overlapping the sheet metal. In this case, the height of the step 31c matches the thickness of the sheet metal. Further, the relative positional relationship between the step 31c and the leaf spring 21 can be changed by changing the shape, position, size, etc., of the portions of the sheet metal that are overlapped with each other. However, the step 31c may be formed by partially shaving the surface of the module case 14. Further, the step 31 c may be formed by overlapping a sheet metal or the like on the surface of the module case 14. That is, the step 31c may be formed by forming a convex portion on the surface of the module case 14, or the step 31c may be formed by forming a concave portion.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention. For example, an embodiment in which two or more elastic pieces are provided for one communication module is also included in the present invention. In this case, as shown in FIG. 7, two or more leaf springs 21 may be arranged in a line along the insertion direction of the communication module 10, or may be arranged in a staggered manner. When two or more elastic pieces are provided for one communication module, it is preferable to devise the arrangement of the elastic pieces so that the communication module is biased as uniformly as possible. For example, when two elastic pieces are provided for one communication module, it is preferable to arrange the elastic pieces at a position equidistant from the center of the communication module.

  Further, it is preferable to devise the shape of the elastic piece so that the surface of the communication module is not damaged by the elastic piece sliding on the communication module. For example, in the embodiment shown in FIGS. 5 and 7, the portion of the leaf spring 21 that contacts the communication module 10 is a curved surface.

  The shape and arrangement of the contact surface and the flank that constitute the first outer surface of the communication module are appropriately changed according to the number and arrangement of the elastic pieces provided in the slot. 8 and 9 show modifications of the contact surface 31a and the flank 31b. Of course, the shape and arrangement of the contact surface and the flank are not limited to the illustrated shape and arrangement.

  Further, an embodiment in which the optical fiber 13 shown in FIG. 4 and the like is drawn from the side surface of the module case 14 is also included in the present invention.

  An embodiment in which the communication module is in close contact with the cooling mechanism via a heat conductive sheet or a heat conductive rubber is also included in the present invention. For example, an embodiment in which a heat conductive sheet, a heat conductive rubber, or the like is disposed between the heat absorbing surface 4a of the heat sink 4 shown in FIG. include.

  An embodiment in which an optical signal is input / output between the IC chip 3 and the communication module 10 shown in FIG. 1 is also included in the present invention. In addition, an embodiment in which a signal input from the outside to the communication module 10 and a signal output from the communication module 10 to the outside are electric signals is also included in the present invention. An embodiment in which the communication module 10 is inserted and removed in parallel with the mother board 2 is also included in the present invention.

  Embodiments having an air-cooled cooling mechanism are also included in the present invention. For example, an embodiment in which the heat sinks 4 and 5 shown in FIG. 2 and the like are provided with integral or separate radiating fins is also included in the present invention.

DESCRIPTION OF SYMBOLS 1 Signal transmission apparatus 2 Mother board 3 IC chip 4,5 Heat sink 4a, 4b, 5a, 5b Heat absorption surface 6, 6a, 6b Slot 8 (inside of slot) 10 Communication module 16 Male connector 17 Female connector 20a, 20b Cover Member 21 Leaf spring 31 First outer surface 31a Contact surface 31b Flank 31c Step 32 Second outer surface

Claims (10)

A signal transmission device in which a communication module is mounted on a substrate having a cooling mechanism,
A slot adjacent to the cooling mechanism on the substrate and into which the communication module is inserted and removed;
A board-side connector provided in the slot; a module-side connector provided in the communication module;
An elastic piece that protrudes from the inner surface of the slot and contacts the communication module inserted into the slot and biases the communication module toward the cooling mechanism;
Wherein said resilient piece, the insertion length into the slot of the communication module after insertion direction lower end of the communication module to be inserted into the slot has passed the resilient piece reaches a predetermined length, said substrate-side connector and A signal transmission device that starts contact with the communication module before the fitting with the module-side connector is started . The signal transmission device according to claim 1 ,
The signal transmission device, wherein a sliding distance of the elastic piece in contact with the communication module with respect to the communication module is 1/20 or more and 1/3 or less of a total length along an insertion direction of the communication module into the slot. In the signal transmission device according to claim 1 or 2 ,
The communication module has a first outer surface facing the inner surface of the slot, and a second outer surface located on the opposite side of the first outer surface and in close contact with the cooling mechanism,
The first outer surface includes a contact surface that contacts the elastic piece, and a flank that recedes toward the second outer surface with respect to the contact surface and does not contact the elastic piece,
When the communication module is inserted into the slot, the elastic piece passes over the flank and then passes through a step between the flank and the contact surface to reach the contact surface. Transmission equipment. In the signal transmission device according to any one of claims 1 to 3 ,
The signal transmission device, wherein two or more elastic pieces are provided along an insertion direction of the communication module into the slot. In the signal transmission device according to any one of claims 1 to 4 ,
The said cooling mechanism is a signal transmission apparatus containing the heat sink with which the said communication module is closely_contact | adhered, and the refrigerant path through which the refrigerant | coolant which performs heat exchange between this heat sink is circulated. A communication module that is inserted into and removed from a slot provided on a substrate having a cooling mechanism,
A module-side connector that fits with a board-side connector provided in the slot;
When the insertion length into the slot after the lower end in the insertion direction into the slot passes through the elastic piece protruding from the inner surface of the slot reaches the predetermined length, the module-side connector is fitted into the board-side connector. Before starting , the communication module is in contact with the elastic piece and is in close contact with the cooling mechanism by urging by the elastic piece. The communication module according to claim 6 .
The communication module, wherein a sliding distance of the elastic piece in contact with the communication module with respect to the communication module is 1/20 or more and 1/3 or less of a total length along the insertion direction of the communication module into the slot. The communication module according to claim 6 or 7 ,
A first outer surface facing the inner surface of the slot, and a second outer surface located on the opposite side of the first outer surface and in close contact with the cooling mechanism,
The first outer surface includes a contact surface that contacts the elastic piece, and a flank that recedes toward the second outer surface with respect to the contact surface and does not contact the elastic piece,
When the communication module is inserted into the slot, the elastic piece passes over the clearance surface and then passes through a step between the clearance surface and the contact surface to reach the contact surface. module. The communication module according to claim 8 , wherein the step is formed by partially overlapping sheet metals constituting the first outer surface and the second outer surface. In the communication module according to claim 8, wherein step a portion of the first outer surface is formed, the communication module.

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