JP6068049B2

JP6068049B2 - Sealing device

Info

Publication number: JP6068049B2
Application number: JP2012181744A
Authority: JP
Inventors: 義志原
Original assignee: Riso Kagaku Corp
Current assignee: Riso Kagaku Corp
Priority date: 2012-08-20
Filing date: 2012-08-20
Publication date: 2017-01-25
Anticipated expiration: 2032-08-20
Also published as: JP2014037267A

Description

本発明は、内容物を封筒に封緘する封緘装置に係り、特に封緘時に封筒の再湿糊部分に塗布される水の水温に応じて塗布時間を可変する封緘装置に関するものである。 The present invention relates to a sealing device that seals contents in an envelope, and more particularly to a sealing device that varies the application time according to the temperature of water applied to a re-moistened paste portion of an envelope during sealing.

従来から、所望の内容物を封入封緘する封入封緘装置において、再湿糊が塗布された封筒内に内容物を挿入した後に再湿糊部分に対する水塗布処理を施し、再湿糊に粘着性を持たせた状態で封筒のフラップ部と接着させ封緘する処理が行われている。 Conventionally, in an enclosing sealing device that encloses and seals desired contents, after the contents are inserted into an envelope coated with re-wet paste, water is applied to the re-wet paste portion to make the re-wet paste sticky. In the state of holding, the sealing is performed by adhering to the flap portion of the envelope.

しかしながら、再湿糊の性質にもよるが、例えば水温が常温（２０〜２５℃）よりも低温（例えば、２０℃未満）の水を再湿糊に塗布した場合、糊が十分に活性化せずに粘着性が弱い状態でフラップ部の接着工程が行われることで封緘不良が起きるという問題があった。 However, depending on the nature of the rewet paste, for example, when water having a water temperature lower than room temperature (20 to 25 ° C.) (for example, less than 20 ° C.) is applied to the rewet paste, the paste is sufficiently activated. In addition, there is a problem that sealing failure occurs due to the bonding process of the flap portion being performed in a state where the tackiness is weak.

また、下記特許文献１に開示される封緘装置では、検出した雰囲気温度が低温下の場合や封筒の紙の厚さ或いは紙の腰が強い場合における封緘作業の際に、封止部の駆動ローラの回転速度や回転方向等を制御してフラップの貼着時間を可変させる封止作業モードを切り替えて封緘不良を低減させている。 Further, in the sealing device disclosed in Patent Document 1 below, when the detected ambient temperature is low, or when the sealing operation is performed when the thickness of the envelope paper or the paper is strong, the driving roller of the sealing unit The sealing speed is reduced by switching the sealing work mode in which the flap sticking time is varied by controlling the rotation speed, the rotation direction, and the like.

特開２０１２−２０７５４号公報JP 2012-20754 A

上述したように、再湿糊は、塗布する水が低温の場合、常温と比べて活性化しにくい傾向がある。そのため、低温の水を塗布しても十分に活性化する前に封緘処理が行われることでフラップ部の接着不良が生じてしまう。従って、このような封緘不良を防止するため、再湿糊に対する水の塗布時間を増やすことで、再湿糊の活性化が促されフラップ部の接着不良を低減することが可能である。 As described above, the re-wet paste tends to be less activated when the water to be applied is at a low temperature than at normal temperature. For this reason, even if low temperature water is applied, a sealing process is performed before it is sufficiently activated, resulting in poor adhesion of the flap portion. Therefore, in order to prevent such sealing failure, it is possible to promote the activation of the rewet paste and reduce the adhesion failure of the flap portion by increasing the application time of water to the rewet paste.

しかしながら、ジョブ実行中に水塗布時間を常時長くすると、ジョブ開始時から水塗布時間を長くする必要のない環境（例えば、水温が常温に戻ったとき）に戻ったとしても水の塗布量は増大したままであるため、余分に塗布された水により後段の封緘部や搬送経路のローラが濡れ、封緘後に排出される封筒が汚れてしまうという問題があった。また、水の塗布時間を長くすることにより、生産性が低下するという問題もあった。 However, if the water application time is always increased during job execution, the amount of water applied will increase even if the water application time does not need to be increased from the start of the job (for example, when the water temperature returns to room temperature). As a result, there is a problem that the encapsulated water and the rollers in the transport path are wetted by the excessively applied water, and the envelope discharged after sealing becomes dirty. Further, there is a problem that productivity is lowered by extending the application time of water.

また、上記方法の他に水タンクに貯留された水自体を加温する方法も考えられるが、この方法では加熱により発生した水蒸気の影響で装置内に結露が生じ、装置の故障や湿気による封書の変形等の製品不良が生じる虞がある。 In addition to the above method, a method of heating the water stored in the water tank is also conceivable, but in this method, condensation occurs in the device due to the influence of water vapor generated by heating, and the sealed letter due to device failure or moisture There is a risk that product defects such as deformation of the product may occur.

さらに、特許文献１の封緘装置は、作製する封書の種類や雰囲気温度に応じて封緘時の貼着時間を可変する封止作業モードを切り替えることで封緘不良を回避しているが、このような制御では常温時における処理時間に比べて低温時における処理時間が長くなる制御であり、再湿糊の活性化は図れるが、やはり生産性が落ちるという問題があった。 Furthermore, the sealing device of Patent Document 1 avoids a sealing failure by switching the sealing work mode in which the sticking time at the time of sealing is changed according to the type and atmosphere temperature of the sealed letter to be produced. In the control, the processing time at a low temperature is longer than the processing time at a normal temperature, and the re-wetting paste can be activated, but there is also a problem that productivity is lowered.

そこで、本発明は上記問題点に鑑みてなされたものであり、生産性を低下させずに水温に適する水塗布処理を行って信頼性の高い封緘処理を実現することのできる封緘装置を提供することを目的とするものである。 Therefore, the present invention has been made in view of the above problems, and provides a sealing device capable of realizing a highly reliable sealing process by performing a water coating process suitable for the water temperature without reducing productivity. It is for the purpose.

上記した目的を達成するため、請求項１記載の封緘装置は、封筒フォームの再湿糊部分と接触する水塗布面を有する水塗布部と、
前記水塗布部に対向して配置され、前記封筒フォームの再湿糊部分に水が塗布されるように前記再湿糊部分を前記水塗布面に押し付ける押付部と、
前記押付部を加温する加温部と、
水塗布処理時に前記押付部による前記水塗布面の加温処理を実行する際の条件温度となる水塗布処理条件温度を検出する温度検出部と、
前記温度検出部で検出された水塗布処理条件温度が所定温度未満か否かの判定結果に基づいて前記押付部及び前記加温部を制御する制御部と、
を備え、
前記制御部は、前記温度検出部で検出された水塗布処理条件温度が所定温度未満であると判定したとき、
前記加温部により前記押付部を加熱するとともに、加熱された前記押付部を前記水塗布部の水塗布面に当接させた後に離間させ、離間後に前記水塗布部と前記押付部との間に前記封筒フォームを挿入した後、前記水塗布部に前記押付部を近付けて前記封筒フォームの再湿糊部分に水を塗布することを特徴とする。 To achieve the above object, sealing apparatus comprising: a water applying section that having a water application surface in contact with the re Shimenori portion of the envelope form,
Said disposed facing the water the coating unit, the envelope pressing portion of water to the re Shimenori portion pressing said re Shimenori portion so that is applied to the water-coated surface of the foam,
A heating section for heating the pressing section;
A temperature detection unit that detects a water application treatment condition temperature that is a condition temperature when performing a heating process of the water application surface by the pressing unit during the water application process;
A control unit for controlling the pressing unit and the heating unit based on a determination result of whether or not the water application treatment condition temperature detected by the temperature detection unit is lower than a predetermined temperature;
Equipped with a,
When the control unit determines that the water application treatment condition temperature detected by the temperature detection unit is less than a predetermined temperature ,
The pressing unit is heated by the heating unit, and the heated pressing unit is separated after being brought into contact with the water application surface of the water application unit, and after the separation, between the water application unit and the pressing unit. After the envelope foam is inserted into the envelope foam, the pressing portion is brought close to the water application portion, and water is applied to the rewet paste portion of the envelope foam .

請求項２記載の封緘装置は、請求項１記載の封緘装置において、前記押付部は、少なくとも前記水塗布面を加温する際に前記水塗布面に当接する第１の部位と、前記再湿糊部分に水を塗布する際に前記封筒フォームを前記水塗布面に押し付ける第２の部位とを有することを特徴とする。 The sealing device according to claim 2 is the sealing device according to claim 1, wherein the pressing portion includes at least a first portion that contacts the water application surface when the water application surface is heated, and the rewet. And a second portion that presses the envelope foam against the water application surface when water is applied to the glue portion .

請求項３記載の封緘装置は、請求項１又は２記載の封緘装置において、前記温度検出部は、
前記水塗布処理条件温度を検出する第１温度検出センサと、
前記押付部の温度を検出する第２温度検出センサとで構成され、
前記制御部は、前記第１温度検出センサで検出された水塗布処理条件温度と、前記第２温度検出センサで検出された前記押付部の温度と、予め設定された加温時間設定情報とを照合して得られた加温時間だけ前記押付部を前記水塗布面と接触させて加温することを特徴とする。 The sealing device according to claim 3 is the sealing device according to claim 1 or 2, wherein the temperature detection unit is
A first temperature detection sensor for detecting the water application treatment condition temperature;
A second temperature detection sensor for detecting the temperature of the pressing portion;
Wherein the control unit includes a water applying treatment conditions temperature detected in the previous SL first temperature sensor, and temperature detected by the second temperature sensor the pressing portion, and the heating time setting information set in advance It said pressing portion by heating time obtained by collating is contacted with the water coated surface characterized in that it warmed.

請求項１記載の封緘装置によれば、水塗布処理条件温度が所定温度未満であると判定した際に、まず加温部により加熱された押付部を水塗布部の水塗布面に当接させた後に一旦離間させ、離間後に水塗布部と押付部との間に挿入された封筒フォームの再湿糊部分を押付部で水塗布面に押し付けて水を塗布するため、水塗布面の加温が必要な場合にのみ再湿糊部分と接触する水塗布面を直に加熱させることができる。よって、生産性を低下させることなく必要に応じて確実に再湿糊の活性化を促すことができ、封緘処理後の封筒におけるフラップ部の浮き上がり等の封緘不良を防止することができる。 According to the sealing device of claim 1 , when it is determined that the water application treatment condition temperature is lower than the predetermined temperature , first, the pressing part heated by the heating part is brought into contact with the water application surface of the water application part. After the separation, the water-applied surface is heated by applying the water by pressing the re-wet paste part of the envelope foam inserted between the water-applying part and the pressing part against the water-applying surface with the pressing part. It is possible to directly heat the water-applied surface that comes into contact with the rewet paste portion only when it is necessary. Therefore, activation of the re-moistening paste can be surely promoted as needed without reducing productivity, and sealing failure such as lifting of the flap portion in the envelope after sealing processing can be prevented.

また、請求項２記載の封緘装置によれば、押付部は、水塗布面を加温するときに水塗布面と当接する第１の部位と、封筒フォームの再湿糊部分に水を塗布するときに封筒フォームを水塗布面に押し付ける第２の部位とを有するため、水塗布面を加温したときに付着した水が、再湿糊部分に対する水塗布処理の際に封筒フォームに転移することを防止することができる。 According to the sealing device of claim 2, the pressing portion applies water to the first portion that comes into contact with the water application surface when the water application surface is heated, and to the re-moistening paste portion of the envelope foam. Since there is a second part that sometimes presses the envelope foam against the water application surface, the water adhering when the water application surface is heated is transferred to the envelope foam during the water application treatment for the re-moistened paste portion. Can be prevented .

また、請求項３記載の封緘装置によれば、第１温度検出センサで検出された水塗布処理条件温度と、第２温度検出センサで検出された押付部の温度と、予め設定された加温時間設定情報とを照合して得られた加温時間だけ押付部を水塗布部の水塗布面と接触させて加温するため、検出した水塗布処理条件温度と加温部温度に適した加温時間で水塗布面を加温することができる。 According to the sealing device of the third aspect , the water application treatment condition temperature detected by the first temperature detection sensor, the temperature of the pressing portion detected by the second temperature detection sensor, and the preset heating only pressing portion heating time obtained by collating the time setting information is contacted with water coated surface of the water applying section heated to order, suitable for detection by the water applying treatment conditions temperature and heating zone temperature The water application surface can be heated in the heating time.

本発明に係る封緘装置が搭載される封入封緘装置の全体構成を示す概略構成図である。It is a schematic block diagram which shows the whole structure of the sealing device by which the sealing device which concerns on this invention is mounted. 同装置の構成を示す概略構成図である。It is a schematic block diagram which shows the structure of the apparatus. 同装置のシステム構成を示す機能ブロック図である。It is a functional block diagram which shows the system configuration | structure of the apparatus. （ａ）水塗布部の詳細な構成を示す側面図であり、（ｂ）は水塗布部の上面図である。(A) It is a side view which shows the detailed structure of a water application part, (b) is a top view of a water application part. 常温モード時における水塗布処理の一連の動作タイミングを示すタイミングチャート図である。It is a timing chart figure which shows a series of operation | movement timings of the water application | coating process at the normal temperature mode. （ａ）〜（ｇ）常温モード時における水塗布処理の動作を示す説明図である。(A)-(g) It is explanatory drawing which shows operation | movement of the water application | coating process at the time of normal temperature mode. 低温モード時における水塗布処理の一連の動作タイミングを示すタイミングチャート図である。It is a timing chart figure which shows a series of operation | movement timings of the water application | coating process at the time of low temperature mode. （ａ）〜（ｈ）は低温モード時における水塗布処理の動作を示す説明図である。(A)-(h) is explanatory drawing which shows operation | movement of the water application | coating process at the time of low temperature mode. 同装置における水塗布処理における一連の処理動作を示すフローチャート図である。It is a flowchart figure which shows a series of process operation | movement in the water application | coating process in the apparatus.

以下、本発明を実施するための形態について、添付した図面を参照しながら詳細に説明する。また、この実施の形態によりこの発明が限定されるものではなく、この形態に基づいて当業者などによりなされる実施可能な他の形態、実施例及び運用技術などはすべて本発明の範疇に含まれる。 Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In addition, the present invention is not limited by this embodiment, and all other forms, examples, operation techniques, and the like that can be implemented by those skilled in the art based on this form are included in the scope of the present invention. .

本例の封緘装置は、既製の封筒又は予め印刷処理された封筒フォームに折り加工を施した封筒に内容物を封入し、この内容物封入後で封緘前の封筒（以下、単に「封筒」という）の所定箇所に予め転写された再湿糊に水塗布処理を施した後、活性化した再湿糊部分にフラップ部を接着させて封緘処理する装置である。 The sealing device of this example encloses the contents in a ready-made envelope or an envelope obtained by folding a pre-printed envelope form. ) Is applied to the re-moistened paste previously transferred to a predetermined portion, and then the flap portion is adhered to the activated re-moistened glue portion to perform sealing.

なお、以下の説明では、本例の封緘装置を封筒に水塗布処理を行う水塗布処理部及びフラップ部の封緘を行う封緘部として封入封緘装置に搭載する実施例で説明するが、これに限定されることはなく、封緘装置単体として使用することもできる。また、本装置が搭載される封入封緘装置は、封入封緘装置単体として使用する構成、又は封筒フォームや内容物に印刷を行う印刷部となる画像形成装置（一例として、インクジェット記録装置、孔版印刷装置、複写機、レーザプリンタ等）と連結した封書作製装置に具備する構成とすることもできる。 In the following description, the sealing device of this example will be described in an embodiment mounted on an encapsulating sealing device as a water coating processing unit that performs water coating processing on an envelope and a sealing unit that seals a flap portion, but is not limited thereto. It can be used as a sealing device alone. In addition, the encapsulating and sealing apparatus on which the apparatus is mounted is configured to be used as a single encapsulating and sealing apparatus, or an image forming apparatus that serves as a printing unit that performs printing on envelope forms and contents (for example, an inkjet recording apparatus and a stencil printing apparatus) , A copier, a laser printer, or the like) may be included in a sealed letter preparation apparatus.

また、水塗布処理の制御モードを選択する際の条件温度として、再湿糊に塗布される水の水温、例えば水塗布処理部４０の周辺温度や装置内における水塗布処理部４０から排出部５０に至るまでの搬送経路近傍における環境温度等、水塗布処理に起因する装置内外の各種温度を「水塗布処理条件温度」と称し、本形態では、水塗布処理条件温度として後述する水塗布部材５ａ周辺の環境温度による処理制御の例について説明する。 Further, as the condition temperature when selecting the control mode of the water application process, the temperature of the water applied to the re-wetting paste, for example, the ambient temperature of the water application processor 40 or the discharge unit 50 from the water application processor 40 in the apparatus. Various temperatures inside and outside the apparatus resulting from the water application process, such as the environmental temperature in the vicinity of the transport path up to the point, are referred to as “water application process condition temperature”, and in this embodiment, the water application member 5a described later as the water application process condition temperature. An example of processing control based on ambient environmental temperature will be described.

さらに、本明細書では、一般的に使用される再湿糊が活性化するのに必要な水塗布処理条件温度の最適温度範囲（例えば、２０〜２５℃）を「常温」として規定し、この常温を下回り再湿糊を活性化するのに不十分な水塗布処理条件温度（例えば、２０℃未満）を「低温」として規定する。 Further, in this specification, the optimum temperature range (for example, 20 to 25 ° C.) of the water coating treatment condition temperature necessary for activating the re-wetting paste generally used is defined as “normal temperature”. A water application treatment condition temperature (eg, less than 20 ° C.) that is below room temperature and is insufficient to activate the re-moistened paste is defined as “low temperature”.

［封入封緘装置］
まず、本発明に係る封緘装置１が搭載される封入封緘装置１００の概略構成について説明する。
図１に示すように、封入封緘装置１００は、内容物となる用紙を搬送しながら必要に応じて所定の折り加工を施す内容物折り部１０と、封筒となる封筒フォームを搬送しながら所定の折り加工を施す封筒フォーム折り部２０と、搬送に伴って封筒フォームで内容物を包み込むように封入する封入部３０と、内容物を封入した封筒に予め転写された再湿糊部分に水を塗布する水塗布処理部４０と、搬送に伴って水塗布後の封筒を封緘する封緘部５０と、封緘処理された封筒を封書として排出台に排出する排出部６０と、を備えて構成されている。 [Encapsulated sealing device]
First, a schematic configuration of the sealing device 100 on which the sealing device 1 according to the present invention is mounted will be described.
As shown in FIG. 1, the encapsulating and sealing apparatus 100 includes a content folding unit 10 that performs a predetermined folding process as needed while conveying a sheet that is a content, and a predetermined content while conveying an envelope foam that is an envelope. Water is applied to the envelope foam folding section 20 that performs folding, the sealing section 30 that encloses the contents with the envelope foam as it is conveyed, and the re-moistened glue portion that has been transferred in advance to the envelope that contains the contents. A water application processing unit 40, a sealing unit 50 that seals the envelope after water application with conveyance, and a discharge unit 60 that discharges the sealed envelope to a discharge table as a sealed letter. .

封入封緘装置１００は、印刷後の封筒フォーム及び内容物を図中のように同一経路若しくは別経路で搬入し、それぞれ異なる搬送経路で搬送しながら、内容物折り部１０において所定の折り加工を施すとともに、封筒フォーム折り部２０において封筒の形態となるように必要に応じて折り加工を施す。そして、封入部３０において最終的に両者を合流させ、内容物を封筒フォームで包み込むように封入する。その後、水塗布処理部４０で封筒フォームの所定箇所に転写された再湿糊に水を塗布して活性化させ、封緘部５０で活性化させた再湿糊部分に封筒のフラップ部を接着させ封緘処理をして排出部６０から作製した封書を排出している。 The enclosing / sealing apparatus 100 carries the envelope form and contents after printing in the same path or different paths as shown in the figure, and performs a predetermined folding process in the contents folding section 10 while transporting them in different transport paths. At the same time, the envelope foam fold 20 is folded as necessary to form an envelope. Then, in the enclosing unit 30, both are finally merged, and the contents are enclosed so as to be wrapped in an envelope foam. Thereafter, water is applied to the re-wet paste transferred to a predetermined portion of the envelope foam by the water application processing unit 40 to activate it, and the flap portion of the envelope is adhered to the re-wet paste portion activated by the sealing unit 50. The sealed letter produced from the discharge unit 60 is discharged after sealing.

そして、本例の封緘装置１は、上述した封入封緘装置１００における水塗布処理部４０及び封緘部５０として機能し、検出される水塗布処理条件温度が低温であった場合に、後述する水塗布部材５ａを一時的に加温して塗布する水の温度を上昇させることで再湿糊の活性化を図っている。
以下、封緘装置１の装置構成及び処理動作についてそれぞれ詳述する。 And the sealing apparatus 1 of this example functions as the water application | coating process part 40 and the sealing part 50 in the enclosure sealing apparatus 100 mentioned above, and when the water application process condition temperature detected is low temperature, the water application mentioned later The re-wet paste is activated by temporarily warming the member 5a and increasing the temperature of the applied water.
Hereinafter, the device configuration and processing operation of the sealing device 1 will be described in detail.

［封緘装置］
＜装置構成＞
次に、本例の封緘装置１の構成について説明する。図２又は図３に示すように、本例の封緘装置１は、第１搬送部２と、封筒検知部３と、封筒規制部４と、水塗布処理部５と、温度検出部６と、第２搬送部７と、記憶部８と、制御部９とを備えて構成され、封入部３０で内容物が封入された封緘前の封筒の封緘処理を行っている。なお、封入封緘装置１００の「水塗布処理部４０」は、本例の封緘装置１における「水塗布処理部５」として機能するため、以下「水塗布処理部５」として説明する。 [Sealing device]
<Device configuration>
Next, the structure of the sealing apparatus 1 of this example is demonstrated. As shown in FIG. 2 or 3, the sealing device 1 of the present example includes a first transport unit 2, an envelope detection unit 3, an envelope regulation unit 4, a water application processing unit 5, a temperature detection unit 6, The second transport unit 7, the storage unit 8, and the control unit 9 are configured to seal the envelope before sealing in which the contents are sealed by the sealing unit 30. Since the “water application processing unit 40” of the sealing device 100 functions as the “water application processing unit 5” in the sealing device 1 of the present example, the “water application processing unit 5” will be described below.

また、本例の封緘装置１における記憶部８及び制御部９は、説明の便宜上、本装置に独立して搭載する構成として説明するが、本装置が封入封緘装置１００搭載される場合は、封入封緘装置１００に具備される制御部及び記憶部を兼用して使用する構成とすることもできる。 Moreover, although the memory | storage part 8 and the control part 9 in the sealing apparatus 1 of this example are demonstrated as a structure mounted independently in this apparatus for convenience of explanation, when this apparatus is mounted in the sealed sealing apparatus 100, it is enclosed. It can also be set as the structure used combining the control part and memory | storage part with which the sealing apparatus 100 is equipped.

第１搬送部２は、搬送用駆動モータと直結する駆動ローラと、この駆動ローラの駆動に伴って連れ回る従動ローラからなる搬送ローラ対（図２では２対）で構成されている。第１搬送部２は、制御部９からの搬送制御信号に基づき、前段の封入部３０から搬送された内容物を封入した状態の封筒を封筒規制部４に突き当たる位置まで搬送している。また、第１搬送部２は、制御部９からの搬送制御信号に基づき、水塗布処理後の封筒を第２搬送部７まで搬送している。 The first transport unit 2 is composed of a pair of transport rollers (two pairs in FIG. 2) including a drive roller that is directly connected to the transport drive motor and a driven roller that is rotated along with the drive of the drive roller. Based on the transport control signal from the control unit 9, the first transport unit 2 transports the envelope in which the content transported from the previous sealing unit 30 is sealed to a position where it hits the envelope regulating unit 4. The first transport unit 2 transports the envelope after the water application process to the second transport unit 7 based on the transport control signal from the control unit 9.

封筒検知部３は、投光器と受光器からなる投受光センサで構成され、第１搬送部２の後端付近に設置される第１封筒検知センサ３ａと、第２搬送部７の入口付近に設置される第２封筒検知センサ３ｂで構成されている。封筒検知部３は、搬送される封筒の一部を検知すると、封筒の検知状態に応じた信号（ＯＮ／ＯＦＦ信号）を封筒検知信号として制御部９に出力している。 The envelope detection unit 3 includes a light projecting / receiving sensor composed of a projector and a light receiver, and is installed near the first envelope detection sensor 3a installed near the rear end of the first transport unit 2 and the entrance of the second transport unit 7. The second envelope detection sensor 3b is configured. When detecting a part of the envelope to be conveyed, the envelope detection unit 3 outputs a signal (ON / OFF signal) corresponding to the detection state of the envelope to the control unit 9 as an envelope detection signal.

封筒規制部４は、第１搬送部２から搬送される封筒を適正に水塗布処理する位置（以下、「水塗布位置」という）で規制するため、封筒のサイズに応じて所定方向（本形態では封筒の搬送方向）に移動自在に設けられる断面略Ｊ字状の板金で構成されている。封筒規制部４は、制御部９からの規制位置制御信号で実行中のジョブで使用する封筒のサイズに応じた最適な規制位置まで予め移動し、第１搬送部２から搬送される封筒と突き当たることで、封筒を適正な水塗布位置で規制している。なお、封筒規制部４の形状は、封筒のサイズに応じて突き当て位置が可変でき、且つ水塗布処理部５による水塗布処理の邪魔とならない構成であれば、その形状等は特に限定されない。 The envelope regulating unit 4 regulates the envelope conveyed from the first conveying unit 2 at a position where water is appropriately applied (hereinafter referred to as “water application position”), and therefore, in a predetermined direction (this embodiment) according to the size of the envelope. In this case, it is formed of a sheet metal having a substantially J-shaped cross section that is movably provided in the envelope conveyance direction. The envelope restricting unit 4 moves in advance to an optimum restricting position according to the size of the envelope used in the job being executed by the restricting position control signal from the control unit 9 and collides with the envelope conveyed from the first conveying unit 2. Thus, the envelope is regulated at an appropriate water application position. The shape and the like of the envelope restricting portion 4 are not particularly limited as long as the abutting position can be changed according to the size of the envelope and the water applying treatment portion 5 does not interfere with the water applying treatment.

水塗布処理部５は、経路の下方に配置した水タンクの水に浸漬されたフェルト材等からなる水塗布部として機能する水塗布部材５ａと、経路の上方に回動自在に軸支され、水塗布位置に搬送された封筒の再湿糊部分を水塗布部材５ａに押し付けて水を塗布するとともに水塗布部材５ａの水塗布面と接触して加温させる押付部として機能する糊付け板金５ｂと、制御部９からのモータ制御信号に従って糊付け板金５ｂを所定方向に回動させる板金用駆動モータ５ｃとを備えている。 The water application processing unit 5 is supported by a water application member 5a functioning as a water application unit made of a felt material immersed in water in a water tank disposed below the path, and pivotally supported above the path. Gluing sheet metal 5b that functions as a pressing portion that presses the re-wet paste portion of the envelope conveyed to the water application position against the water application member 5a to apply water and heats the water application surface of the water application member 5a. A sheet metal drive motor 5c that rotates the glued sheet metal 5b in a predetermined direction in accordance with a motor control signal from the control unit 9 is provided.

糊付け板金５ｂは、図４（ａ）、（ｂ）に示すように、糊付け板金５ｂにおける封筒搬入側の端部に封筒の再湿糊部分を水塗布部材５ａに押し付けるための先端押付部５ｄが設けられるとともに、封筒の規制位置側の端部に第２温度検出手段６ｂが設置され水塗布部材５ａの水塗布面と接触して加温させるため先端加温部５ｅが設けられている。また、糊付け板金５ｂは、先端加温部５ｅによる水塗布部材５ａの加温に際し、効率的に加温可能なようにステンレス等の熱伝導率の高く耐水性・耐熱性に優れた材質（保温性が優れていれば尚可）で構成されている。
なお、水塗布処理条件温度に応じて適宜選択される各制御モードにおける制御内容については、追って説明する。 As shown in FIGS. 4 (a) and 4 (b), the glue sheet metal 5b has a tip pressing portion 5d for pressing the rewet glue portion of the envelope against the water application member 5a to the end of the glue sheet metal 5b on the envelope carrying side. In addition to being provided, a second temperature detecting means 6b is provided at the end of the envelope on the regulation position side, and a tip heating portion 5e is provided for heating in contact with the water application surface of the water application member 5a. Further, the glued sheet metal 5b is made of a material having a high thermal conductivity such as stainless steel and having excellent water resistance and heat resistance so that the water application member 5a can be heated efficiently by the tip warming portion 5e. If the property is excellent, it is preferable).
The contents of control in each control mode that is appropriately selected according to the water application treatment condition temperature will be described later.

先端押付部５ｄの形状としては、糊付け板金５ｂの回動に伴って徐々に封筒を水塗布部材５ａに押し付けられるように、回動方向と逆方向に所定曲率で反り返った形状を有している。また、先端加温部５ｅにおける水塗布部材５ａとの接触面は、水塗布部材５ａの水塗布面と接触した際に確実に水塗布面が加温できるように、水塗布面の表面積よりも大きく形成されている。 The tip pressing portion 5d has a shape that warps with a predetermined curvature in a direction opposite to the rotation direction so that the envelope is gradually pressed against the water application member 5a as the gluing sheet metal 5b rotates. . Further, the contact surface of the tip heating portion 5e with the water application member 5a is more than the surface area of the water application surface so that the water application surface can be surely heated when contacting the water application surface of the water application member 5a. Largely formed.

さらに、糊付け板金５ｂを図４（ａ）に示すような略Ｈ字形状とした目的は、封筒を搬入する際に、封筒が水塗布位置まで確実に搬送されるようにガイドするガイド部分（左右側端及び中央部分）を残しつつ、糊付け板金５ｂの回動の邪魔とならない形状とするために封筒規制部４の一部に切欠きを設けたためである。 Furthermore, the purpose of making the glued sheet metal 5b substantially H-shaped as shown in FIG. 4A is to guide the envelope so that the envelope is reliably conveyed to the water application position when the envelope is carried in (left and right). This is because a notch is provided in a part of the envelope regulating portion 4 so as to have a shape that does not interfere with the rotation of the gluing sheet metal 5b while leaving the side edges and the central portion).

これにより、封筒の搬入の際に封筒規制部４が必要なガイド機能を有したまま、糊付け板金５ｂの回動が可能となっている。また、先端押付部５ｄと先端加温部５ｅとを糊付け板金５ｂの各端部に別配置することで、低温モード時に先端加温部５ｅが水塗布部材５ａが接触したことで付着した水で封筒を汚れることを防止する効果を奏している。 As a result, the glued sheet metal 5b can be rotated while the envelope restricting portion 4 has a necessary guide function when the envelope is carried in. Further, by disposing the tip pressing portion 5d and the tip heating portion 5e separately at each end of the glue sheet metal 5b, the tip heating portion 5e is made of water adhering to the water application member 5a in contact in the low temperature mode. It has the effect of preventing the envelope from becoming dirty.

なお、糊付け板金５ｂは、少なくとも先端加温部５ｅが熱伝導率の高く耐水性・耐熱性に優れた材質で構成されていればよい。 It should be noted that at least the tip heating portion 5e of the gluing sheet metal 5b only needs to be made of a material having high thermal conductivity and excellent water resistance and heat resistance.

板金用駆動モータ５ｃは、制御部９からのモータ制御信号（モータ正回転制御信号、モータ逆回転制御信号、モータ停止信号）により正回転、逆回転又は停止して糊付け板金５ｂを所定方向に回動又は所定位置（待機位置や押付位置）で停止している。 The sheet metal drive motor 5c rotates forward, reverse or stops in response to a motor control signal (motor forward rotation control signal, motor reverse rotation control signal, motor stop signal) from the control unit 9 and rotates the glue sheet metal 5b in a predetermined direction. Stops at a predetermined position (standby position or pressing position).

ヒータ５ｆは、制御部９からの加熱制御信号（加熱開始信号、加熱停止信号）により加熱制御されることで糊付け板金５ｂ全体を加熱する加温部として機能する。なお、ヒータ５ｆは、先端加温部５ｅが水塗布部材５ａに接触した際に湿潤した状態を維持しつつ素早く加温できる温度が好ましく、例えば８０℃程度が適当である。 The heater 5f functions as a heating unit that heats the entire gluing sheet metal 5b by being controlled by a heating control signal (heating start signal, heating stop signal) from the control unit 9. The heater 5f is preferably at a temperature that can be quickly heated while maintaining a wet state when the tip heating portion 5e contacts the water application member 5a. For example, about 80 ° C. is appropriate.

温度検出部６は、サーミスタ等の周知の温度検出センサであり、水塗布処理条件温度を検出するため、水塗布部材５ａ近傍に設けられる第１温度検出センサ６ａと、糊付け板金５ｂの加温部５ｅの温度を検出する第２温度検出センサ６ｂとで構成されている。 The temperature detection unit 6 is a well-known temperature detection sensor such as a thermistor, and in order to detect the water application processing condition temperature, the first temperature detection sensor 6a provided in the vicinity of the water application member 5a and the heating unit of the glue sheet metal 5b. And a second temperature detection sensor 6b for detecting the temperature of 5e.

第１温度検出センサ６ａは、所定周期（例えば、１秒毎）で水塗布部材５ａ周辺の水塗布処理条件温度を検出すると、この検出した温度を水塗布処理条件温度情報として制御部９に出力している。 When the first temperature detection sensor 6a detects the water application treatment condition temperature around the water application member 5a at a predetermined cycle (for example, every second), the detected temperature is output to the control unit 9 as water application treatment condition temperature information. doing.

第２温度検出センサ６ｂは、制御部９からの温度検出開始信号により先端加温部５ｅの温度検出を開始し、所定周期（例えば１秒毎）で先端加温部５ｅの温度を検出すると、この検出した先端加温部５ｅの温度を加温部温度情報として制御部９に出力している。また、第２温度検出センサ６ｂは、制御部９からの温度検出停止信号により温度検出処理を停止する。 The second temperature detection sensor 6b starts temperature detection of the tip heating unit 5e by a temperature detection start signal from the control unit 9, and detects the temperature of the tip heating unit 5e at a predetermined cycle (for example, every second) The detected temperature of the tip heating unit 5e is output to the control unit 9 as heating unit temperature information. Further, the second temperature detection sensor 6 b stops the temperature detection process in response to a temperature detection stop signal from the control unit 9.

第２搬送部７は、搬送用駆動モータと直結する駆動ローラと、この駆動ローラの駆動に伴って連れ回る従動ローラからなる搬送ローラ対（図２では１対）で構成されている。第２搬送部７は、制御部９からの搬送制御信号に基づき、水塗布処理後の封筒を受け入れながら再湿糊部分と搬送に伴う折り加工によって形成されるフラップ部とを接着して封緘処理を行い、封緘後の封筒を封書として排出部６０に搬送している。 The second transport unit 7 includes a pair of transport rollers (one pair in FIG. 2) including a drive roller that is directly connected to the transport drive motor and a driven roller that is driven by the drive roller. Based on the transport control signal from the control unit 9, the second transport unit 7 adheres the re-moistened paste portion and the flap portion formed by folding process during transport while receiving the envelope after the water application process, and performs a sealing process. The envelope after sealing is conveyed to the discharge unit 60 as a sealed letter.

記憶部８は、例えばＲＯＭ、ＲＡＭ等の半導体メモリやＨＤＤ等の各種記憶装置で構成され、本装置で使用可能な封筒のサイズ毎に応じた封筒規制部４の移動位置を規定するための規制位置情報、水塗布処理条件温度が再湿糊において常温又は低温であるかを判定するための閾値となる水塗布処理条件温度判定情報、水塗布処理条件温度が常温であるときの水塗布処理部５の制御モードである常温モードで水塗布処理部５を制御するための常温モード制御情報、水塗布処理条件温度が低温であるときの水塗布処理部５の制御モードである低温モードで水塗布処理部５を制御するための低温モード制御情報、ヒータ５ｆにより加熱された先端加温部５ｅの目標設定温度である加温設定温度、先端加温部５ｅによる水塗布部材５ａの加温時間設定情報、実行される封書作製ジョブ情報（例えば、封書の作製数、封筒フォームや内容物、封書等の搬送タイミングや搬送速度、内容物又は封筒フォームの折り回数及び折り位置等が規定された情報）の他、封緘装置１を構成する各部の駆動制御情報を記憶している。 The storage unit 8 includes various storage devices such as a semiconductor memory such as a ROM and a RAM and an HDD, and is a restriction for defining the movement position of the envelope restriction unit 4 according to the size of the envelope usable in the apparatus. Position information, water application processing condition temperature determination information that is a threshold value for determining whether the temperature of the water application processing condition is normal or low in the re-wetting paste, water application processing unit when the water application processing temperature is normal temperature Room temperature mode control information for controlling the water application processing unit 5 in the room temperature mode which is the control mode 5, water application in the low temperature mode which is the control mode of the water application processing unit 5 when the water application processing condition temperature is low Low-temperature mode control information for controlling the processing unit 5, a heating setting temperature that is a target setting temperature of the tip heating unit 5e heated by the heater 5f, and a heating time setting of the water application member 5a by the tip heating unit 5e Information, executed envelope preparation job information (for example, information specifying the number of envelope preparations, envelope form and contents, conveyance timing and conveyance speed of envelopes, the number of folding times and position of the envelope or envelope form, etc.) In addition, the drive control information of each part which comprises the sealing apparatus 1 is memorize | stored.

水塗布部材５ａの加温時間を設定する加温時間設定情報は、生産性を考慮しつつ、封書作製装置２０における封筒フォーム及び内容物の搬送速度や折り加工速度や搬送路長等の装置仕様に応じた適切な時間幅（例えば、１〜９秒程度）を有しており、第１温度検出センサ６ａで検出された水塗布処理条件温度と、第２温度検出センサ６ｂで検出された加温部温度とを基に実験等により得られた適切な加温時間をテーブル化した情報である。なお、水塗布部材５ａの加温時間は、水塗布処理条件温度や加温部温度が低いほど長くなる傾向にある。 The warming time setting information for setting the warming time of the water application member 5a is an apparatus specification such as the transport speed, folding speed, and transport path length of the envelope foam and contents in the sealed letter preparation apparatus 20 in consideration of productivity. The water application treatment condition temperature detected by the first temperature detection sensor 6a and the temperature detected by the second temperature detection sensor 6b are appropriate. It is the information which tabulated the appropriate heating time obtained by experiment etc. based on warm part temperature. In addition, the heating time of the water application member 5a tends to become longer as the water application treatment condition temperature and the heating part temperature are lower.

制御部９は、例えばＣＰＵやＲＯＭ、ＲＡＭ等を搭載するマイクロコンピュータで構成され、記憶部８に記憶される駆動制御情報に応じて、封緘装置１を構成する各部の駆動制御を行っている。具体的には、実行される封書作製ジョブのジョブ内容に応じて使用する封筒のサイズに応じた規制位置情報を記憶部８から読み出し、この情報に応じた規制位置制御信号を封筒規制部４に出力している。また、制御部９は、実行される封書作製ジョブのジョブ内容に応じた搬送制御信号を、第１搬送部２及び第２搬送部７にそれぞれ出力している。 The control unit 9 is composed of, for example, a microcomputer equipped with a CPU, ROM, RAM, and the like, and performs drive control of each unit constituting the sealing device 1 according to drive control information stored in the storage unit 8. Specifically, the restriction position information corresponding to the size of the envelope to be used is read from the storage unit 8 according to the job content of the envelope preparation job to be executed, and the restriction position control signal according to this information is sent to the envelope restriction unit 4. Output. Further, the control unit 9 outputs a conveyance control signal corresponding to the job content of the sealed letter preparation job to be executed to the first conveyance unit 2 and the second conveyance unit 7, respectively.

さらに、制御部９は、温度検出部６で検出された水塗布処理条件温度情報と、記憶部８に記憶された水塗布処理条件温度判定情報とを比較して水塗布処理条件温度が常温か低温かを判定する。そして、判定結果に適する制御モード（常温モード又は低温モード）に応じたモード制御情報（常温モード制御情報、低温モード制御情報）を記憶部８から読み出し、この読み出したモード制御情報に従って水塗布処理部５を制御している。 Further, the control unit 9 compares the water application process condition temperature information detected by the temperature detection unit 6 with the water application process condition temperature determination information stored in the storage unit 8 to determine whether the water application process condition temperature is normal. Determine if the temperature is low. Then, mode control information (room temperature mode control information, low temperature mode control information) corresponding to the control mode (room temperature mode or low temperature mode) suitable for the determination result is read from the storage unit 8, and the water application processing unit is read according to the read mode control information. 5 is controlled.

また、制御部９は、ジョブ実行中に所定間隔で温度検出部６からの水塗布処理条件温度情報を判定しており、ジョブ実行中に水塗布処理条件温度が常温から低温又は低温から常温へと変化したときは、現在行っている水塗布処理後に行う次の水塗布処理の際に、変化した水塗布処理条件温度に対応するモード制御情報を記憶部８から読み出す。そして、読み出したモード制御情報に従って水塗布処理部５を制御する。例えば、ジョブ開始時に水温が低温であったとしても、ジョブ実行中に水温が常温まで上昇したときは、現在低温モードで実行した水塗布処理の次に処理される封筒から常温モードで水塗布処理部５を制御する。 Further, the control unit 9 determines the water application processing condition temperature information from the temperature detection unit 6 at predetermined intervals during job execution, and the water application processing condition temperature is changed from room temperature to low temperature or from low temperature to room temperature during job execution. Is changed, the mode control information corresponding to the changed water application process condition temperature is read from the storage unit 8 at the time of the next water application process performed after the current water application process. And the water application | coating process part 5 is controlled according to the read mode control information. For example, even if the water temperature is low at the start of the job, if the water temperature rises to room temperature during job execution, the water application process is performed in the room temperature mode from the envelope that is processed next to the water application process currently executed in the low temperature mode. The unit 5 is controlled.

モード制御情報による制御として、制御部９は、読み出したモード制御情報に従って板金用駆動モータ５ｃの回動方向を制御するモータ制御信号（モータ正回転制御信号、モータ逆回転制御信号、モータ停止信号）を水塗布処理部５に出力し、板金用駆動モータ５ｃの制御を行っている。 As control by the mode control information, the control unit 9 controls a motor control signal (motor forward rotation control signal, motor reverse rotation control signal, motor stop signal) for controlling the rotation direction of the sheet metal drive motor 5c according to the read mode control information. Is output to the water application processing unit 5 to control the sheet metal drive motor 5c.

また、制御部９は、低温モードによる制御を開始すると、ヒータ５ｆを加熱するための加熱制御信号である加熱開始信号と、第２温度検出センサ６ｂの温度検出開始を行うための温度検出開始信号とを水塗布処理部５に出力している。さらに、制御部９は、第２温度検出センサ６ｂからの加温部温度情報に基づく先端加温部５ｅの温度が記憶部８に記憶される加温設定温度に達したか否かの判定を行っている。そして、先端加温部５ｅの温度が、加温設定温度に達したときは、ヒータ５ｆの駆動を停止する加熱制御信号である加熱停止信号を出力している。なお、水塗布処理条件温度の変化により低温モードから常温モードに切り換わったときは、第２温度検出センサ６ｂに温度検出停止信号を出力し、再度低温モードに移行したときは温度検出開始信号が出力される。 Moreover, when the control part 9 starts control by low temperature mode, the heating start signal which is a heating control signal for heating the heater 5f, and the temperature detection start signal for starting the temperature detection of the 2nd temperature detection sensor 6b Are output to the water application processing unit 5. Further, the control unit 9 determines whether or not the temperature of the tip heating unit 5e based on the heating unit temperature information from the second temperature detection sensor 6b has reached the heating set temperature stored in the storage unit 8. Is going. When the temperature of the tip heating portion 5e reaches the heating set temperature, a heating stop signal that is a heating control signal for stopping the driving of the heater 5f is output. When the low temperature mode is switched to the normal temperature mode due to a change in the water application treatment condition temperature, a temperature detection stop signal is output to the second temperature detection sensor 6b, and when the mode is shifted to the low temperature mode again, the temperature detection start signal is output. Is output.

さらに、制御部９は、低温モード制御情報による水塗布処理の際に、第１温度検出センサ６ａで検出された水塗布処理条件温度と、第２温度検出センサ６ｂで検出された加温部温度と、記憶部８に記憶された加温時間設定情報とを照合して加温時間を取得し、この加温時間で水塗布部材５ａが加温されるように板金用駆動モータ５ｃの駆動タイミングを制御している。 Further, the control unit 9 performs the water application process condition temperature detected by the first temperature detection sensor 6a and the heating part temperature detected by the second temperature detection sensor 6b during the water application process by the low temperature mode control information. And the warming time setting information stored in the storage unit 8 to obtain the warming time, and the drive timing of the sheet metal drive motor 5c so that the water application member 5a is warmed during this warming time. Is controlling.

次に、各モード制御情報に基づく水塗布処理部５における水塗布処理内容とその制御タイミングについて、図５〜８を参照しながらそれぞれ説明する。本装置における水塗布処理の制御モードとしては、上述したように水塗布処理条件温度が常温であるときの制御モードである「常温モード」と、水塗布処理条件温度が低温であるときの制御モードである「低温モード」が設定されている。 Next, the water application processing content and its control timing in the water application processing unit 5 based on each mode control information will be described with reference to FIGS. As described above, the control mode of the water application process in this apparatus includes a “normal temperature mode” which is a control mode when the water application process temperature is normal temperature, and a control mode when the water application process temperature is low. “Low temperature mode” is set.

また、図５、７における「糊付け板金位置」とは、糊付け板金５ｂにおける先端押付部５ｄと先端加温部５ｅの位置状態を示している。従って、糊付け動作の際は、先端押付部５ｄを待機位置から押付位置まで移動させるため、板金用駆動モータ５ｃを正回転（図６、８では反時計回り）させている。また、水塗布部材５ａの加温動作の際は、先端加温部５ｅを待機位置から加温位置まで移動させるため、板金用駆動モータ５ｃを逆回転（図６、８では時計回り）させている。 In addition, the “glue sheet metal position” in FIGS. 5 and 7 indicates the position state of the tip pressing part 5d and the tip warming part 5e in the glue sheet metal 5b. Accordingly, during the gluing operation, the sheet metal drive motor 5c is rotated forward (counterclockwise in FIGS. 6 and 8) in order to move the tip pressing portion 5d from the standby position to the pressing position. Further, during the heating operation of the water application member 5a, the sheet metal drive motor 5c is rotated in the reverse direction (clockwise in FIGS. 6 and 8) in order to move the tip heating portion 5e from the standby position to the heating position. Yes.

（常温モードによる水塗布処理）
常温モードのときの水塗布処理について、図５、図６を参照しながら説明する。本装置における常温モードは、水塗布部材５ａ周辺の環境温度である水塗布処理条件温度が活性化に適した温度のとき、すなわち通常時の水塗布処理部５の制御モードである。 (Water application treatment in normal temperature mode)
The water application process in the room temperature mode will be described with reference to FIGS. The room temperature mode in the present apparatus is a control mode of the water application processing unit 5 when the water application processing condition temperature, which is the ambient temperature around the water application member 5a, is a temperature suitable for activation, that is, in a normal state.

図５に示すように、常温モードでは、まず封入部３０で内容物が封入された封筒が第１搬送部２を介して搬送されると、図６（ａ）に示すように第２封筒検知センサ３ｂによって封筒の端部が検知され、このタイミングｔ１で制御部９に封筒検知信号（ＯＮ信号）が出力される。そして、タイミングｔ１からタイミングｔ２に達するまでの間は、第１搬送部２によって封筒が封筒規制部４に向かって徐々に搬送され、図６（ｂ）に示すように、搬送される封筒が封筒規制部４に突き当たった状態、すなわち、封筒が水塗布位置まで搬送されたタイミングｔ２で第１搬送部２の搬送動作を停止する。 As shown in FIG. 5, in the normal temperature mode, when the envelope in which the contents are enclosed in the enclosure 30 is first conveyed through the first conveyance unit 2, the second envelope detection is performed as shown in FIG. The end of the envelope is detected by the sensor 3b, and an envelope detection signal (ON signal) is output to the control unit 9 at this timing t1. And until it reaches timing t2 from timing t1, an envelope is gradually conveyed toward envelope regulation part 4 by the 1st conveyance part 2, and as shown in Drawing 6 (b), an envelope conveyed is an envelope. The transport operation of the first transport unit 2 is stopped in a state where it hits the restricting unit 4, that is, at a timing t2 when the envelope is transported to the water application position.

次に、封筒の再湿糊部分に水を塗布するため、図６（ｃ）に示すように、封筒搬送停止後のタイミングｔ３でモータ正回転制御信号を出力して板金用駆動モータ５ｃを正回転させ、糊付け板金５ｂを反時計回りに回動する。このとき、糊付け板金５ｂの回動に伴って移動する先端押付部５ｄは、封筒を押し付けながら再湿糊部分を徐々に水塗布部材５ａに近接させ、最終的に図６（ｄ）に示すように封筒を水塗布部材５ａに押し付けることで再湿糊部分に水が塗布される。 Next, in order to apply water to the re-moistened glue portion of the envelope, as shown in FIG. 6C, a motor normal rotation control signal is output at timing t3 after the envelope conveyance is stopped, and the sheet metal drive motor 5c is set to be The glue sheet metal 5b is rotated counterclockwise by rotating. At this time, the tip pressing portion 5d that moves in accordance with the rotation of the gluing sheet metal 5b gradually brings the rewet paste portion closer to the water application member 5a while pressing the envelope, and finally, as shown in FIG. 6 (d). By pressing the envelope against the water application member 5a, water is applied to the rewet paste portion.

次に、図６（ｅ）に示すように、先端押付部５ｄが押付位置まで到達したタイミングｔ４でモータ逆回転制御信号を出力して板金用駆動モータ５ｃを逆回転させ、先端押付部５ｄを徐々に封筒から離間させて待機位置まで移動させる。そして、先端押付部５ｄが待機位置まで到達したタイミングｔ５でモータ停止信号を出力して板金用駆動モータ５ｃの駆動を停止させる。その後、封筒が水塗布部材５ａから完全に離間したタイミングｔ６で第１搬送部２の駆動を開始し、図６（ｆ）に示すように、封筒が第２搬送部７に到達するまで封筒規制部４に押し付ける。 Next, as shown in FIG. 6 (e), at the timing t4 when the tip pressing portion 5d reaches the pressing position, a motor reverse rotation control signal is output to reversely rotate the sheet metal drive motor 5c, so that the tip pressing portion 5d Gradually move away from the envelope and move to the standby position. Then, at the timing t5 when the tip pressing portion 5d reaches the standby position, a motor stop signal is output to stop the driving of the sheet metal drive motor 5c. After that, at the timing t6 when the envelope is completely separated from the water application member 5a, the driving of the first transport unit 2 is started, and the envelope regulation is performed until the envelope reaches the second transport unit 7 as shown in FIG. Press against part 4.

次に、フラップ部の折り位置が第２搬送部７まで到達すると、第２搬送部７の搬送に伴ってフラップ部を折りながら再湿糊部分とフラップ部とを接着する封緘処理が行われ、図６（ｇ）に示すように、第２搬送部７まで完全に搬送されるタイミングｔ７で第２封筒検知センサ３ｂからの封筒検知信号がＯＮ信号からＯＦＦ信号に切り換わり、次の封筒に対する水塗布処理へと移行する。 Next, when the folding position of the flap part reaches the second transport part 7, a sealing process is performed to bond the re-moistened glue part and the flap part while folding the flap part with the transport of the second transport part 7, As shown in FIG. 6 (g), the envelope detection signal from the second envelope detection sensor 3b is switched from the ON signal to the OFF signal at the timing t7 when it is completely conveyed to the second conveyance unit 7, and the water for the next envelope is changed. Shift to coating process.

（低温モードによる水塗布処理）
次に、低温モードのときの水塗布処理について、図７、図８を参照しながら説明する。本装置における低温モードは、水塗布部材５ａ周辺の環境温度である水塗布処理条件温度が糊の活性化に不十分の温度であるときに、ヒータ５ｆで加熱した先端加温部５ｅで水塗布部材５ａの水塗布面を設定された加温時間に従って加温し、水塗布面の水温を一時的に上昇させることで再湿糊の活性化を図る水塗布処理部５の制御モードである。 (Water application treatment in low temperature mode)
Next, the water application process in the low temperature mode will be described with reference to FIGS. The low temperature mode in this apparatus is that water is applied by the tip heating section 5e heated by the heater 5f when the water application processing condition temperature, which is the ambient temperature around the water application member 5a, is insufficient for activation of the glue. This is a control mode of the water application processing unit 5 that heats the water application surface of the member 5a according to a set heating time and activates the re-wetting paste by temporarily raising the water temperature of the water application surface.

なお、以下の説明において、先端加温部５ｅによる加温時間は、第１温度検出センサ６ａで検出された水塗布処理条件温度と、第２温度検出センサ６ｂで検出された加温部温度と、記憶部８に記憶された加温時間設定情報とから得られた加温時間によって加温制御するものとする。 In the following description, the heating time by the tip heating unit 5e is the water application processing condition temperature detected by the first temperature detection sensor 6a and the heating unit temperature detected by the second temperature detection sensor 6b. The heating control is performed based on the heating time obtained from the heating time setting information stored in the storage unit 8.

図７に示すように、低温モードでは、まず封入部３０で内容物が封入された封筒が第１搬送部２を介して搬送される際に第１封筒検知センサ３ａが封筒の端部を検知したタイミングｔ１１で制御部９に封筒検知信号（ＯＮ信号）が出力される。また、このタイミングｔ１１でモータ逆回転制御信号を出力して板金用駆動モータ５ｃを逆回転させ、先端加温部５ｅが水塗布部材５ａの水塗布面に徐々に近接するように糊付け板金５ｂを時計回りに回動させる。そして、図８（ａ）に示すように、先端加温部５ｅが加温位置まで移動して水塗布面に接触するタイミングｔ１２でモータ停止信号を出力して板金用駆動モータ５ｃの駆動を停止し、先端加温部５ｅで水塗布部材５ａを設定された加温時間だけ加温する。また、このタイミングｔ１２で第１搬送部２を駆動させて封筒の搬送を開始する。 As shown in FIG. 7, in the low temperature mode, the first envelope detection sensor 3 a detects the end of the envelope when the envelope in which the contents are sealed in the sealing portion 30 is first transported via the first transport portion 2. At the timing t11, an envelope detection signal (ON signal) is output to the control unit 9. Also, at this timing t11, a motor reverse rotation control signal is output to reversely rotate the sheet metal drive motor 5c, and the glue sheet metal 5b is moved so that the tip heating portion 5e gradually approaches the water application surface of the water application member 5a. Rotate clockwise. Then, as shown in FIG. 8A, the driving of the sheet metal drive motor 5c is stopped by outputting a motor stop signal at a timing t12 when the tip heating portion 5e moves to the heating position and contacts the water application surface. Then, the water application member 5a is heated by the tip heating unit 5e for the set heating time. Further, at the timing t12, the first transport unit 2 is driven to start transporting the envelope.

次に、図８（ｂ）に示すように、加温時間経過後のタイミングｔ１３で第２封筒検知センサ３ｂが搬送される封筒を検知すると、水塗布処理部５にモータ正回転制御信号を出力して板金用駆動モータ５ｃを正回転させ、加温位置にいる先端加温部５ｅを水塗布部材５ａから徐々に離間させる。そして、先端加温部５ｅが待機位置まで移動したタイミングｔ１４でモータ停止信号を出力して板金用駆動モータ５ｃの駆動を停止させる。なお、糊付け板金５ｂが正回転して先端加温部５ｅが加温位置から待機位置に移動するまでの間（すなわち、タイミングｔ１３からタイミングｔ１４の間）は、第１搬送部２によって封筒の搬送が行われている。また、図８（ｃ）に示すように、板金用駆動モータ５ｃの駆動停止後、封筒が封筒規制部４に突き当たり水塗布位置まで搬送されるタイミングｔ１５で第１搬送部２の搬送動作を停止する。 Next, as shown in FIG. 8 (b), when the envelope conveyed by the second envelope detection sensor 3 b is detected at timing t 13 after the heating time has elapsed, a motor forward rotation control signal is output to the water application processing unit 5. Then, the sheet metal drive motor 5c is rotated forward to gradually separate the tip heating portion 5e at the heating position from the water application member 5a. Then, a motor stop signal is output at a timing t14 when the tip heating unit 5e moves to the standby position, and the driving of the sheet metal drive motor 5c is stopped. Note that the envelope is transported by the first transport unit 2 until the glue sheet metal 5b rotates forward and the tip warming unit 5e moves from the warming position to the standby position (that is, from timing t13 to timing t14). Has been done. Further, as shown in FIG. 8C, after the drive of the sheet metal drive motor 5c is stopped, the conveyance operation of the first conveyance unit 2 is stopped at a timing t15 when the envelope hits the envelope regulation unit 4 and is conveyed to the water application position. To do.

次に、封筒の再湿糊部分に水を塗布するため、図８（ｄ）に示すように、封筒搬送停止後のタイミングｔ１６でモータ正回転制御信号を出力して板金用駆動モータ５ｃを正回転させ、糊付け板金５ｂを反時計回りに回動させる。このとき、糊付け板金５ｂの回動に伴って移動する先端押付部５ｄは、封筒を押し付けながら徐々に水塗布部材５ａに近接させ、最終的に図８（ｅ）に示すように封筒を水塗布部材５ａに押し付けることで再湿糊部分に水が塗布される。 Next, in order to apply water to the re-wet paste portion of the envelope, as shown in FIG. 8D, a motor normal rotation control signal is output at timing t16 after the envelope conveyance is stopped, so that the sheet metal drive motor 5c is set to the normal position. The paste sheet metal 5b is rotated counterclockwise. At this time, the tip pressing portion 5d that moves as the gluing sheet metal 5b rotates gradually approaches the water application member 5a while pressing the envelope, and finally the water is applied to the envelope as shown in FIG. 8 (e). Water is applied to the re-wet paste portion by pressing against the member 5a.

次に、先端押付部５ｄが押付位置まで到達したタイミングｔ１７でモータ逆回転制御信号を出力して板金用駆動モータ５ｃを逆回転させ、図８（ｆ）に示すように先端押付部５ｄを徐々に封筒から離間させて待機位置まで移動させる。このとき、先端押付部５ｄが待機位置方向に移動するに連れて封筒の再湿糊部も水塗布部材５ａから徐々に離間し始め、先端押付部５ｄが待機位置に戻ったときに封筒が水塗布部材５ａから完全に離間する。 Next, at a timing t17 when the tip pressing portion 5d reaches the pressing position, a motor reverse rotation control signal is output to reversely rotate the sheet metal drive motor 5c, and the tip pressing portion 5d is gradually moved as shown in FIG. 8 (f). And move to the standby position away from the envelope. At this time, as the leading end pressing portion 5d moves toward the standby position, the re-wetting paste portion of the envelope begins to gradually move away from the water application member 5a, and when the leading end pressing portion 5d returns to the standby position, the envelope It is completely separated from the application member 5a.

次に、先端押付部５ｄが待機位置まで到達したタイミングｔ１８で板金用駆動モータ５ｃの駆動を停止させる。そして、封筒が水塗布部材５ａから完全に離間したタイミングｔ１９で第１搬送部２の駆動を開始し、図８（ｇ）に示すように、封筒が第２搬送部７に到達するまで封筒規制部４に押し付ける。次に、フラップ部の折り位置が第２搬送部７まで到達すると、第２搬送部７の搬送に伴ってフラップ部を折りながら再湿糊部分とフラップ部とを接着する封緘処理が行われる。 Next, the driving of the sheet metal drive motor 5c is stopped at the timing t18 when the tip pressing portion 5d reaches the standby position. Then, at the timing t19 when the envelope is completely separated from the water application member 5a, the driving of the first transport unit 2 is started, and the envelope regulation is performed until the envelope reaches the second transport unit 7 as shown in FIG. Press against part 4. Next, when the folding position of the flap part reaches the second transport part 7, a sealing process for bonding the re-moistened glue part and the flap part while folding the flap part as the second transport part 7 is transported is performed.

そして、第２搬送部７まで完全に搬送されるタイミングｔ２０で第２封筒検知センサ３ｂからの封筒検知信号がＯＮ信号からＯＦＦ信号に切り換わる。また、次の封筒に対する水塗布処理が低温モードであった場合は、次の封筒が第１封筒センサ３ａで検知されたタイミングｔ２１でモータ逆回転制御信号が水塗布処理部５に出力され、板金用駆動モータ５ｃを逆回転させて先端加温部５ｅが水塗布部材５ａの水塗布面に徐々に近接するように糊付け板金５ｂを時計回りに回動させる。 The envelope detection signal from the second envelope detection sensor 3b is switched from the ON signal to the OFF signal at the timing t20 when the sheet is completely conveyed to the second conveyance unit 7. When the water application process for the next envelope is in the low temperature mode, the motor reverse rotation control signal is output to the water application processing unit 5 at the timing t21 when the next envelope is detected by the first envelope sensor 3a, and the sheet metal The drive motor 5c is rotated in the reverse direction to rotate the gluing sheet metal 5b clockwise so that the tip heating portion 5e gradually approaches the water application surface of the water application member 5a.

そして、図８（ｈ）に示すように、先端加温部５ｅが水塗布面に接触するタイミングｔ２２でモータ停止信号を出力して板金用駆動モータ５ｃの駆動を停止し、先端加温部５ｅで水塗布面を所定時間加温しながら次の水塗布処理へと移行する。 Then, as shown in FIG. 8 (h), a motor stop signal is output at a timing t22 when the tip warming part 5e contacts the water application surface to stop the driving of the sheet metal drive motor 5c, and the tip warming part 5e. Then, the process proceeds to the next water application process while heating the water application surface for a predetermined time.

なお、水塗布処理として低温モードが選択されたときにヒータ５ｆの駆動を開始するが、このとき先端加温部５ｅが記憶部８に記憶される加温設定温度に達したか否かを所定周期（例えば１秒毎）監視しており、加温設定温度に達したときは加熱停止信号を出力してヒータ５ｆの駆動を停止する。また、ヒータ５ｆの加熱停止後に再度先端加温部５ｅの温度が加温設定温度を下回った場合は、加熱開始信号を出力してヒータ５ｆの加熱を再開させる。 When the low temperature mode is selected as the water application process, the heater 5f starts to be driven. At this time, it is predetermined whether or not the leading end heating unit 5e has reached the heating set temperature stored in the storage unit 8. The cycle (for example, every 1 second) is monitored, and when the heating set temperature is reached, a heating stop signal is output to stop driving the heater 5f. Further, when the temperature of the tip warming portion 5e falls below the warming set temperature again after the heating of the heater 5f is stopped, a heating start signal is output to resume the heating of the heater 5f.

［処理動作］
次に、上述した封緘装置１における水塗布処理の動作について、図９を参照しながら説明する。 [Processing operation]
Next, the operation | movement of the water application | coating process in the sealing apparatus 1 mentioned above is demonstrated, referring FIG.

まず、所望の封書作製ジョブを入力して封書作製ジョブが開始されると（ＳＴ１）、第１温度検出センサ６ａで水塗布処理条件温度の検出を開始し（ＳＴ２）、現在の水塗布処理条件温度が常温であるか否かの判定を行う（ＳＴ３）。 First, when a desired sealed letter preparation job is input and a sealed letter preparation job is started (ST1), detection of water application process condition temperature is started by the first temperature detection sensor 6a (ST2), and the current water application process condition is set. It is determined whether or not the temperature is normal temperature (ST3).

このとき、検出した水塗布処理条件温度が常温であったときは（ＳＴ３−Ｙｅｓ）、制御部９から常温モードによる水塗布処理を開始し（ＳＴ４）、搬送される封筒に対して常温モードによる水塗布処理を実行する（ＳＴ５）。
一方、検出した水塗布処理条件温度が常温でなかったときは（ＳＴ３−Ｎｏ）、上述した低温モードによる水塗布処理を開始するため第２温度検出センサ６ｂとヒータ５ｆを駆動させ（ＳＴ６）、先端加温部５ｅが予め設定された加温設定温度に達したか否かの判定を行う（ＳＴ７）。 At this time, when the detected water application process condition temperature is normal temperature (ST3-Yes), the controller 9 starts the water application process in the normal temperature mode (ST4), and the normal temperature mode is applied to the envelope to be conveyed. A water application process is executed (ST5).
On the other hand, when the detected water application treatment condition temperature is not room temperature (ST3-No), the second temperature detection sensor 6b and the heater 5f are driven to start the water application treatment in the low temperature mode described above (ST6), It is determined whether or not the tip heating unit 5e has reached a preset heating set temperature (ST7).

このとき、先端加温部５ｅが加熱設定温度に達したときは（ＳＴ７−Ｙｅｓ）、次に第１温度検出センサ６ａで検出された水塗布処理条件温度と、第２温度検出センサ６ｂで検出された加温部温度と、記憶部８に記憶された加温時間設定情報とを照合して加温時間を設定する（ＳＴ８）。そして、設定された加温時間に従って、搬送される封筒に対して上述した低温モードによる水塗布処理を実行する（ＳＴ９）。
一方、先端加温部５ｅが加熱設定温度に達していないときは（ＳＴ７−Ｎｏ）、再度ＳＴ７に戻って先端加温部５ｅの温度監視を行う。 At this time, when the tip heating unit 5e reaches the heating set temperature (ST7-Yes), the water application treatment condition temperature detected by the first temperature detection sensor 6a and the second temperature detection sensor 6b are detected. The warming time is set by comparing the warming temperature thus set with the warming time setting information stored in the memory 8 (ST8). And according to the set warming time, the water application process by the low temperature mode mentioned above is performed with respect to the envelope conveyed (ST9).
On the other hand, when the tip warming part 5e has not reached the heating set temperature (ST7-No), the process returns to ST7 again to monitor the temperature of the tip warming part 5e.

そして、ＳＴ５及びＳＴ９において、水塗布処理が終了すると、現在実行中のジョブが終了か否かを判別する（ＳＴ１０）。 In ST5 and ST9, when the water application process is completed, it is determined whether or not the job currently being executed is completed (ST10).

このとき、ジョブが終了であれば（ＳＴ１０−Ｙｅｓ）、第１温度検出センサ６ａによる水塗布処理条件温度の温度検出処理を終了して（ＳＴ１１）、処理を終了する。
一方、ジョブが終了していない場合は（ＳＴ１０−Ｎｏ）、第１温度検出センサ６ａで水塗布処理条件温度を再検出するため、ＳＴ２に戻って現在の水塗布処理条件温度に応じて常温モード又は低温モードによる水塗布処理を実行する。 At this time, if the job is finished (ST10-Yes), the temperature detection process of the water application process condition temperature by the first temperature detection sensor 6a is finished (ST11), and the process is finished.
On the other hand, if the job has not ended (ST10-No), the first temperature detection sensor 6a re-detects the water application process condition temperature, so the process returns to ST2 and the normal temperature mode is set according to the current water application process condition temperature. Alternatively, the water application process in the low temperature mode is executed.

以上説明したように、上述した封緘装置１は、水塗布部材５ａ近傍に設けられた第１温度検出センサ６ａによって検出封書作製ジョブ開始後に現在の水塗布処理条件温度を検出し、この検出した水塗布処理条件温度が再湿糊に対して常温か低温かを判定する。そして、判定した結果、水塗布処理条件温度が常温のときは、記憶部８に記憶される常温モード制御情報に従って、搬入した封筒の再湿糊部分を水塗布部材５ａに押し付ける水塗布処理を実行する。 As described above, the sealing device 1 described above detects the current water application processing condition temperature after the start of the detection letter preparation job by the first temperature detection sensor 6a provided in the vicinity of the water application member 5a. It is determined whether the temperature of the coating process is normal or low with respect to the re-moistened paste. Then, as a result of the determination, when the water application processing condition temperature is normal temperature, a water application process is performed in which the rewet paste portion of the envelope that has been loaded is pressed against the water application member 5a according to the normal temperature mode control information stored in the storage unit 8. To do.

また、水塗布処理条件温度が低温のときは、記憶部８に記憶される低温モード制御情報に従って、第１温度検出センサ６ａで検出した水塗布処理条件温度と、第２温度検出センサ６ｂで検出した加温部温度と、記憶部８に記憶された加温時間設定情報とを照合して得られた加温時間で先端加温部５ｅによる水塗布部材５ａの加温制御を行った後、押付部５ｄで搬送される封筒の再湿糊部分を水塗布部材５ａに押し付ける水塗布処理を実行する。 When the water application treatment condition temperature is low, the water application treatment condition temperature detected by the first temperature detection sensor 6a and the second temperature detection sensor 6b are detected according to the low temperature mode control information stored in the storage unit 8. After performing the heating control of the water application member 5a by the tip heating unit 5e with the heating time obtained by comparing the heating unit temperature and the heating time setting information stored in the storage unit 8, A water application process is performed in which the rewet paste portion of the envelope conveyed by the pressing unit 5d is pressed against the water application member 5a.

これにより、水塗布処理条件温度が再湿糊の低温であっても、水塗布部材５ａの水を一時的に加温させることができるため、生産性を低下させることなく再湿糊の活性化を促すことができ、封緘処理後のフラップ部の浮き上がり等による封緘不良を防止することができる。 Thereby, even if the water application treatment condition temperature is the low temperature of the re-wetting paste, the water of the water application member 5a can be temporarily heated, so that the re-wetting paste can be activated without reducing the productivity. Can be prevented, and sealing failure due to floating of the flap after the sealing process can be prevented.

また、低温モード時に第１温度検出センサで検出された水塗布処理条件温度と、第２温度検出センサで検出された押付部の温度と、予め設定された加温時間設定情報とを照合して得られた加温時間で加温部による水塗布部材の加温制御をするため、検出した水塗布処理条件温度と加温部温度に適した加温時間で水塗布部材を加温することができる。 Further, the water application treatment condition temperature detected by the first temperature detection sensor in the low temperature mode, the temperature of the pressing portion detected by the second temperature detection sensor, and the preset heating time setting information are collated. In order to control the heating of the water application member by the heating unit with the obtained heating time, the water application member can be heated with a heating time suitable for the detected water application processing condition temperature and the heating unit temperature. it can.

さらに、ジョブ実行中に所定間隔で水塗布処理条件温度の温度検出及び温度判定を行い、水塗布処理条件温度の上昇又は低下によって水塗布処理条件温度が常温から低温又は低温から常温に変化したときは、現在実行中の水塗布処理の次の水塗布処理から新たな制御モードで水塗布処理制御をしているため、常に水塗布処理条件温度に応じた最適な水塗布処理を行うことができる。 Furthermore, when the temperature of the water application process condition is detected and determined at predetermined intervals during job execution, and the water application process temperature changes from room temperature to low temperature or from low temperature to room temperature due to an increase or decrease in the water application process temperature. Since the water application process is controlled in a new control mode from the water application process next to the water application process currently being executed, the optimum water application process according to the temperature of the water application process can always be performed. .

１…封緘装置
２…第１搬送部
３…封筒検知部（３ａ…第１封筒検知センサ、３ｂ…第２封筒検知センサ）
４…封筒規制部
５、４０…水塗布処理部（５ａ…水塗布部材（水塗布部）、５ｂ…糊付け板金（押付部）、５ｃ…板金用駆動モータ、５ｄ…先端押付部、５ｅ…先端加温部、５ｆ…ヒータ（加温部））
６…温度検出部（６ａ…第１温度検出センサ、６ｂ…第２温度検出センサ）
７…第２搬送部
８…記憶部
９…制御部
１０…内容物折り部
２０…封筒フォーム折り部
３０…封入部
５０…封緘部
６０…排出部
１００…封入封緘装置 DESCRIPTION OF SYMBOLS 1 ... Sealing apparatus 2 ... 1st conveyance part 3 ... Envelope detection part (3a ... 1st envelope detection sensor, 3b ... 2nd envelope detection sensor)
4 ... Envelope regulating part 5, 40 ... Water application processing part (5a ... Water application member (water application part), 5b ... Glued sheet metal (pressing part), 5c ... Sheet metal drive motor, 5d ... Tip pressing part, 5e ... Tip Heating part, 5f ... heater (heating part))
6 ... temperature detection part (6a ... 1st temperature detection sensor, 6b ... 2nd temperature detection sensor)
DESCRIPTION OF SYMBOLS 7 ... 2nd conveyance part 8 ... Memory | storage part 9 ... Control part 10 ... Contents folding part 20 ... Envelope foam folding part 30 ... Encapsulation part 50 ... Sealing part 60 ... Discharge part 100 ... Encapsulation sealing apparatus

Claims

A water applying section that having a water application surface in contact with the re Shimenori portion of the envelope form,
Said disposed facing the water the coating unit, the envelope pressing portion of water to the re Shimenori portion pressing said re Shimenori portion so that is applied to the water-coated surface of the foam,
A heating section for heating the pressing section;
A temperature detection unit that detects a water application treatment condition temperature that is a condition temperature when performing a heating process of the water application surface by the pressing unit during the water application process;
A control unit for controlling the pressing unit and the heating unit based on a determination result of whether or not the water application treatment condition temperature detected by the temperature detection unit is lower than a predetermined temperature;
Equipped with a,
When the control unit determines that the water application treatment condition temperature detected by the temperature detection unit is less than a predetermined temperature ,
The pressing unit is heated by the heating unit, and the heated pressing unit is separated after being brought into contact with the water application surface of the water application unit, and after the separation, between the water application unit and the pressing unit. After the envelope foam is inserted into the envelope foaming device, the pressing portion is brought close to the water application portion and water is applied to the re-moistened paste portion of the envelope foam .

The pressing portion includes at least a first portion that contacts the water application surface when heating the water application surface, and the envelope foam on the water application surface when applying water to the rewet paste portion. The sealing device according to claim 1 , further comprising a second portion to be pressed .

The temperature detector is
A first temperature detection sensor for detecting the water application treatment condition temperature;
A second temperature detection sensor for detecting the temperature of the pressing portion;
Wherein the control unit includes a water applying treatment conditions temperature detected in the previous SL first temperature sensor, and temperature detected by the second temperature sensor the pressing portion, and the heating time setting information set in advance and sealing apparatus according to claim 1, wherein the warming in contact with the water coated surface the pressing portion by heating time obtained by matching.