JP6068166B2 - Jig for manufacturing electronic device and method for manufacturing electronic device - Google Patents

Description

  The present invention relates to an electronic device manufacturing jig and an electronic device manufacturing method.

  2. Description of the Related Art Conventionally, in an electronic device such as a sensor device in which an electronic component such as a sensor element is sealed, a device in which the amount of gas molecules existing in the sealed space of the sensor element is reduced is known.

  Such an electronic device is manufactured in a high vacuum vacuum chamber. For example, the wiring board and the lid are heated in a state where the wiring board on which electronic components such as sensor elements are mounted and the lid are arranged so as to face each other in the vertical direction. By this heating, the bonding material previously disposed on at least one of the wiring board and the lid is melted. Next, the wiring board and the lid are bonded via a bonding material, and the electronic component is sealed. As described above, an electronic device in which an electronic component is sealed in a sealing space between the wiring board and the lid is manufactured (see Patent Document 1).

  A jig having a portion for holding the wiring board and the lid is used for holding and heating the wiring board and the lid in the vacuum chamber. The jig has, for example, a pair of block-shaped jig main bodies that are vertically opposed to each other, and the main body is provided with a recess for fitting a wiring board or a lid. The block-shaped main body incorporates a heater for heating the block-shaped main body and heating the wiring substrate or the lid by heat conduction.

JP-A-2-108314

  In such a conventional jig and electronic device manufacturing method, there is a problem that it is difficult to uniformly heat the wiring board and the lid. This is because the heat generated by the heater is transferred from the main body to the wiring board or lid by conduction, and the amount of heat transferred to the wiring board etc. is likely to vary depending on the contact area between the wiring board and the jig main body, etc. . The contact area between the wiring board or the like and the jig body varies depending on, for example, the surface roughness of the wiring board or the like and the surface state such as warpage. If the heating to the wiring board or the like is not performed uniformly, the degree of melting of the bonding material varies, and there is a possibility that a defect such as a bonding failure occurs between the wiring board and the lid. When such a bonding failure occurs, the degree of vacuum in the sealed space decreases, and the operation of electronic components such as detection of infrared rays by an infrared sensor element is hindered.

An electronic device manufacturing jig according to an aspect of the present invention is a mounting region in which a wiring board and a first member which is one of a mounting structure and a lid including an electronic component mounted on the wiring board are mounted. Including a first jig plate, and a holding portion for holding a second member that is the other of the mounting structure and the lid, and facing the first jig plate, from the first jig plate A second jig plate disposed apart from the first jig plate, and a plate-like member disposed between the first jig plate and the second jig plate; A through hole through which radiant heat for heating the first member or the second member passes is provided in at least one of the holding portions of the second jig plate.

According to one aspect of the present invention, there is provided a method of manufacturing an electronic device, wherein a first member which is one of a mounting structure including a wiring board and an electronic component mounted on the wiring board and a lid is placed on the first jig plate. And an arrangement step of holding the second member, which is the other of the mounting structure and the lid, on the second jig plate, and arranging the first jig plate and the second jig plate to face each other. The bonding material provided on the first member or the second member is heated by radiant heat from the placement area of the first jig plate or the through hole provided in the holding portion of the second jig plate. A heating step of melting, and a bonding step of bonding the first member and the second member with the molten bonding material. Further, in the heating step, the first jig plate and the second jig plate are spaced apart from each other and arranged vertically, and a plate-like member is arranged between the first jig plate and the second jig plate. .

According to the electronic device manufacturing jig of one aspect of the present invention, the radiant heat that heats the first member or the second member passes through at least one of the placement region of the first member and the holding portion of the second member. Since the holes are included, at least one of the first member and the second member can be heated by radiant heat. Radiant heat passes through the through-hole and irradiates the first member or the second member without deviation. For this reason, the first member or the second member is uniformly heated, and the bonding failure between the wiring board and the lid is effectively suppressed. In addition, since the plate-like member is included, when both the first member and the second member are heated by radiant heat, the heating temperature can be easily controlled between them.

Moreover, according to the method for manufacturing an electronic device of one aspect of the present invention, the above-described steps are included, and the bonding material provided on the first member or the second member is heated and melted by radiant heat from the through hole. Therefore, the variation in heating with respect to the bonding material is reduced. Since the bonding material is melted by heating in this way, variation in the degree of melting of the bonding material can be reduced. In addition, when both the first member and the second member are heated by radiant heat, the heating temperature can be easily controlled between them. Therefore, it is possible to manufacture an electronic device having a good hermetic sealing property between the wiring board and the lid.

It is sectional drawing which shows the principal part of the jig for electronic device manufacture of embodiment of this invention. It is sectional drawing which shows an example of the electronic device manufactured using the jig for electronic device manufacture shown in FIG. The manufacturing method of the electronic device of this invention is shown. (A)-(c) is sectional drawing which shows the manufacturing method of the electronic device of embodiment of this invention in order of a process. It is sectional drawing which shows the modification of the manufacturing method of the electronic device using the jig for electronic device manufacture of embodiment of this invention, and the jig.

  Embodiments of the present invention will be described below with reference to the drawings.

(Jig for electronic device manufacturing)
FIG. 1 is a cross-sectional view showing a main part of an electronic device manufacturing jig according to an embodiment of the present invention. The electronic device manufacturing jig of this embodiment (hereinafter sometimes simply referred to as a jig) is basically composed of a first jig plate 1 and a second jig plate 2.

  The first jig plate 1 is for positioning and placing the first member 3, and the second jig plate 2 is for positioning and holding the second member 4. The first member 3 placed on the first jig plate and the second member 4 held on the second jig plate 2 face each other in a high vacuum and are joined together to produce an electronic device.

  FIG. 2 is a cross-sectional view showing an example of an electronic device manufactured using the jig. The mounting structure 10 includes a wiring board 11 and an electronic component 12 mounted on the wiring board 11. The lid 13 is a member for sealing and hermetically sealing a recess (no symbol) on the wiring board 11 in which the electronic component 12 is mounted. The first member 3 is one of the mounting structure 10 and the lid 13. The second member 4 is the other of the mounting structure 10 and the lid 13.

  The wiring board 11 is provided on an insulating base (not shown) made of an insulating material such as an aluminum oxide sintered body, a glass ceramic sintered body, a mullite sintered body, or an aluminum nitride sintered body, and the insulating base. Wiring conductors (unsigned). A concave portion in which the electronic component 12 is accommodated is provided on the upper surface of the insulating base. A wiring conductor is provided from the inside of the recess to the outer surface of the lower surface of the insulating base. The electronic component 12 and the external electric circuit are electrically connected via the wiring conductor, and an electric signal or the like is transmitted / received between the two.

  The lid 13 is arranged on the wiring board 11 so as to seal the electronic component 12. For example, the lid 13 has the same size and the same shape as the wiring board 11 in a plan view, and in the present embodiment, the lid 13 has a quadrangular shape in the plan view. Note that the outer peripheral portion of the lid 13 and the outer peripheral portion of the wiring board 11 are bonded together via a frame-shaped bonding material 14 surrounding the central portion of the lid 13 in plan view.

  For example, when the electronic component 12 is an infrared sensor element, the lid 13 may be any material that transmits infrared rays, such as germanium (Ge), silicon (Si), zinc sulfide (ZnS), or an alloy containing these. It is produced using. Further, the lid 13 may be formed of another material, for example, a metal material such as an iron-based alloy or a copper-based alloy, or a ceramic material such as an aluminum oxide sintered body depending on the type of the electronic component 12. .

  The wiring board of the mounting structure 10 as an example of the first member 3 and the lid 13 as an example of the second member 4 are joined via a joining material 14 containing a brazing material such as solder. Yes. In the following description, the case where the first member 3 is the lid 13 and the second member 4 is the mounting structure 10 will be described as an example.

  The first jig plate 1 includes a placement area 1a on which the first member 3 is placed. The placement region 1a is a recessed portion in a part of the main surface (upper surface) of the first jig body 1, for example. The recessed portion has the same area as that of the first member 3 in plan view, and has a shape and a dimension that allow the first member 3 to be exactly accommodated.

  The second jig plate 2 includes a holding portion 2 a that holds the first member 4. The holding | maintenance part 2a is a step-shaped part provided in a part of main surface (upper surface) of the 1st jig main body 1, for example. The stepped portion has the same shape and size as the second member 4 in plan view, and the outer peripheral portion of the second member 3 is just fitted into the stepped portion.

  The first jig plate 1 and the second jig plate 2 are arranged to face each other as described above. The first jig plate 1 and the second jig plate 2 are arranged so as to face each other, and the first member 3 placed on the placement region 1a of the first jig plate 1 and the second jig plate 2 The 2nd member 4 hold | maintained at the holding | maintenance part 2a mutually opposes.

  The first and second jig plates 1 and 2 are made of, for example, stainless steel, and are manufactured by performing various metal processing such as cutting, grinding, polishing, and drilling. In the electronic device manufacturing jig according to the embodiment, since the jig itself does not need to conduct heat, it is advantageous in terms of mechanical strength of the first jig plate 1 and the second jig plate 2. . That is, in the prior art in which the jig body conducts heat, the jig body needs to be made of a metal material (aluminum or the like) having high thermal conductivity. However, since aluminum has a relatively low mechanical strength, it is difficult to ensure the strength as a jig. On the other hand, there is no such concern in the jig of the embodiment.

  At least one of the placement area 1a of the first jig plate 1 and the holding portion 2a of the second jig plate 2 is provided with a through hole 5 through which radiant heat for heating the first member 3 or the second member 4 passes. . The through hole 5 is provided, for example, so as to penetrate the first jig plate 1 or the second jig plate 2 in the thickness direction in the center of the placement region 1a or the holding portion 2a in plan view.

  According to such a jig for manufacturing an electronic device, radiant heat for heating the first member 3 or the second member 4 passes through at least one of the placement region 1a of the first member 3 and the holding portion 2a of the second member 4. Since the through hole 5 is included, at least one of the first member 3 and the second member 4 can be heated by radiant heat. Radiant heat passes through the through hole 5 and irradiates the first member 3 or the second member 4 with no bias. Therefore, the first member 3 or the second member 4 is heated uniformly, and the bonding failure between the first member 3 (wiring board 11 of the mounting structure 10) and the second member (lid body 13) is effectively performed. It is suppressed.

  In the example of this embodiment, both the first jig plate 1 and the second jig plate 2 have through holes 5. In this case, both the first member 3 and the second member 4 can be more effectively heated by radiant heat.

  The through hole 5 in the second jig plate 2 has a size (the size and shape of the opening) that allows the second member 4 to pass when the second member 4 is held by the holding portion 2a. If the through hole 5 is too small in plan view, it is difficult to hold (for example, fit) the second member 4 through the through hole 5 to the holding portion 2a.

(Electronic device manufacturing method)
FIG. 3 is a cross-sectional view illustrating the method of manufacturing the electronic device according to the embodiment of the invention in the order of steps. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

(Arrangement process)
First, as shown in FIG. 4 (a), first a one first member 3 and the other is the mounting structure 10 and the lid 13 including the electronic component 12 mounted on the wiring board 11 and the wiring board 11 A bonding material 14 is provided on at least one of the two members 4. In the example shown in FIG. 4 (a), a first member 3 is the mounting structure 10 as described above, the second member 4 is lid 13. Further, a bonding material 14 is provided on the first member 3.

  Examples of the bonding material 14 include a brazing material having a relatively low melting point other than the above-described solder (so-called low melting point brazing material), glass, a resin adhesive, and the like. For example, if the bonding material 14 is a solder, the bonding material 14 is provided by attaching a layered member containing solder to a predetermined portion of the lid 13 (first member 3). The bonding material 14 is not limited to the metal material containing solder (low melting point brazing material) as described above, but it is desirable that the bonding material 14 is made of a metal material in consideration of the reliability of vacuum sealing. In consideration of workability, it is more desirable that the solder is mainly composed of tin. The solder as the bonding material 14 is not limited to tin-lead solder (eutectic solder or the like), but may be so-called lead-free solder such as tin-silver or tin-silver-copper.

Next, the first member 3 is placed on the first jig plate 1 including the placement area 1a on which the first member 3 is placed, and a holding portion 2a for holding the second member 4 is included. The second member 4 is held by the second jig plate 2 disposed to face the one jig plate 1. Thereby, as shown in FIG.4 (b), the 1st member 3 and the 2nd member 4 are arrange | positioned at a jig (the 1st jig board 1 and the 2nd jig board 2).

(Heating process)
Then, heating the first member 3 and the second member 4 disposed jig as shown in FIG. 4 (b) in a high vacuum. Specifically, for example, the degree of vacuum is 10 ⁻⁵ to 10 ⁻⁵ in the vacuum chamber by discharging gas by a vacuum exhaust pump (not shown) connected to a vacuum chamber (portion schematically shown by a broken line). A high vacuum state of 10 ⁻⁴ Pa is set. The jig in which the first and second members 3 and 4 are set is positioned and set in the vacuum chamber. Thereafter, at least one of the first member 3 and the second member 4 is heated by radiant heat from the through hole 5 of the first jig plate 1 or the second jig plate 2. The heating temperature is a temperature at which the bonding material 14 melts, and is, for example, about 185 ° C. to 350 ° C.

  Radiant heat is electromagnetic waves such as infrared rays, and is radiated, for example, from a heat source provided in the upper part (ceiling part) or the lower part (bottom part) in the vacuum chamber. The heat source is a heater (electric heater) that generates resistance. A conductive portion (not shown) such as a conducting wire for supplying a current to the heater is provided from the outside to the inside of the vacuum chamber. A current is supplied from an external power source (not shown) to the heat source via the conductive portion. The amount of heat generated in the heat source is appropriately set according to conditions such as the heating temperature of the first member 3 and the second member 4 and the distance from the heat source to the first member 3 or the second member 4.

In the example shown in FIG. 4 , since the bonding material 14 is disposed on the first member 3, at least the first member 4 needs to be heated. When the through hole 5 is provided only in one of the placement area 1a of the first jig plate 1 and the holding portion 2a of the second jig plate 2, the placement is performed on the side where the through hole 5 is provided. Alternatively, the bonding material 14 is preferably provided on the first member 3 or the second member 4 to be held. As a result, the bonding material 14 is effectively heated.

  By this heating, the bonding material 14 is melted. The molten bonding material 14 is interposed between the first member 3 and the second member 4 and can bond (braze or the like) them together. If the bonding material is made of a metal material such as a brazing material, the portions of the wiring board 11 and the lid 13 that are bonded to face each other include a metal material (metallized layer, plating layer, etc.). ).

(Joining process)
Next, as shown in FIG. 4 (c), at least one of the first jig plate 1 and the second jig plate 2 is moved, and the first member 3 and the second member 4 are joined by the molten joining material 14. Let The alignment of the first jig plate 1 and the second jig plate 2 is performed, for example, on a concave portion (not indicated) provided on the upper surface of the first jig plate 1 and a convex shape provided on the lower surface of the second jig plate 2. This can be done by inserting the part (without the sign). The concave portion and the convex portion are respectively provided at positions that have a predetermined positional relationship with respect to the through-hole 5.

  Through the above steps, the first member 3 (lid 13) and the second member 4 (mounting structure 10) are joined together, and the mounting structure that is the second member 4 by the lid 13 that is the first member 3. Ten electronic components 12 are hermetically sealed, and, for example, an electronic device as shown in FIG. 2 is manufactured. In the manufactured electronic device, the electronic component 12 is hermetically sealed in a sealing space including the wiring substrate 11 (concave portion) and the lid 13. Since the sealing operation is performed in a high vacuum as described above, the sealed space in which the electronic component 12 is hermetically sealed is in a high vacuum. Therefore, for example, when the electronic component 12 is an infrared sensor element, an infrared sensor device with high infrared detection accuracy by the infrared sensor element can be manufactured.

In the above heating step, when arranged one above each other by separating the first jig plate 1 and the second jig plate 2 as shown in FIG. 4 (b), the first jig plate 1 and the second jig plate 2 You may make it arrange | position the plate-shaped member 6 between. The plate-like member 6 is for reducing heat transfer (radiation) between the first jig plate 1 and the second jig plate 2. Thereby, when both the 1st member 3 mounted in the mounting area | region 1a of the 1st jig board 1 and the 2nd member hold | maintained at the holding | maintenance part 2b of the 2nd jig board 2 are heated by radiant heat, both The temperature of the heating is more easily controlled, and the accuracy of temperature control is improved.

Therefore, for example, it becomes easier to heat the first member 3 and the second member 4 to temperatures suitable for each, and the occurrence of poor bonding between the first member 3 and the second member 4 is more effectively reduced. be able to.

  The plate-like member 4 can be produced by using a metal material such as stainless steel and performing predetermined metal processing such as cutting and polishing. The plate-like member 4 has a shape and dimensions so as to cover both the first and second members 3 and 4 in a plan view, for example.

  Further, the first member 3 and the second member 4 may be heated by radiant heat radiated from different heat sources. Also in this case, for example, it becomes easier to heat the first member 3 and the second member 4 to temperatures suitable for each, and the occurrence of poor bonding between the first member 3 and the second member 4 is more effective. Can be reduced.

  It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. For example, as shown in FIG. 5, the first member 3 </ b> A may be the mounting structure 10, and the second member 4 </ b> A may be the lid 13. Further, the bonding material 14 may be provided only on the second member 4A, or the bonding material 14 may be provided on both the first member 3A and the second member 4A. Moreover, the through hole 5 may be provided in only one of the first jig plate 1 and the second jig plate 2 (only the second jig plate 2 in the example of FIG. 5). The number of through holes 5 may be adjusted as appropriate according to the number, size, etc. of the electronic device to be manufactured, or may be one. FIG. 5 is a cross-sectional view showing a modification of the electronic device manufacturing jig and the electronic device manufacturing method using the jig according to the embodiment of the present invention. 5, parts similar to those in FIGS. 1 and 4 are denoted by the same reference numerals.

  In this case, the second member 4 </ b> A is heated from above the second jig plate 2 provided with the through hole 5 by radiant heat passing through the through hole 5. The second member 4 </ b> A in this modification is a lid 13. The bonding material 14 is provided in a portion where both the first member 3A and the second member 4A face each other and are bonded together. The bonding material 14 provided on the first member 3A can be melted by heat applied to the second member 4A and the bonding material 14 provided on the second member 4A.

  When the bonding material 14 is provided on both the first member 3A and the second member 4A, it is more preferable to heat both the first and second members 3A and 4A. In this case, for example, it is necessary to use a jig as shown in FIG. 2 (the first and second jig plates 1 and 2 are provided with through holes 5). In this case, as described above, the first member 3 </ b> A and the second member 4 </ b> A are heated by different heat sources, and the plate-like member 6 (between the first jig plate 1 and the second jig plate 2 ( (Not shown in FIG. 5) may be arranged. Thereby, the bonding material 14 of the first member 3A and the bonding material 14 of the second member 4A can be melted under optimum conditions, respectively, which is more preferable in terms of more effectively suppressing the bonding failure.

  The bonding material 14 provided on the first member 3A and the bonding material 14 provided on the second member 4A may be different types of bonding materials. Also in this case, the bonding material 14 of the first member 3A and the bonding material 14 of the second member 4A can be melted under optimum conditions, respectively, and defective bonding can be more effectively suppressed.

DESCRIPTION OF SYMBOLS 1 ...... 1st jig plate 2 ...... 2nd jig plate 1a ... Placement area 2a ... Holding part 3, 3A ... First member 4, 4A ... Second member 5 ... ..Through hole 6 ... Plate-like member
10 .... Mounting structure
11 ... Wiring board
12 ... Electronic components
13 ... lid
14 ・ ・ ・ ・ Joint material

Claims (3)

A first jig plate including a mounting area on which a first member which is one of a wiring board and a mounting structure including an electronic component mounted on the wiring board and a lid is mounted;
A second holding member that holds a second member that is the other of the mounting structure and the lid, and is disposed opposite to the first jig plate and spaced apart from the first jig plate; A jig board ,
A plate-like member disposed between the first jig plate and the second jig plate ;
At least one of the placement area of the first jig plate and the holding portion of the second jig plate is provided with a through-hole through which radiant heat for heating the first member or the second member passes. A jig for manufacturing electronic devices. A first member which is one of a mounting structure including a wiring board and an electronic component mounted on the wiring board and a lid is placed on a first jig plate, and the other of the mounting structure and the lid An arrangement step of holding the second member being a second jig plate and arranging the first jig plate and the second jig plate to face each other,
Heating by which the bonding material provided on the first member or the second member is heated and melted by radiant heat from the through-hole provided in the mounting region of the first jig plate or the holding portion of the second jig plate. Process,
A bonding step of bonding the first member and the second member with the molten bonding material ,
In the heating step, Rukoto to place the plate-like member between said first jig plate second one another to separate the jig plate is arranged vertically, the second jig plate and the first jig plate A method for manufacturing an electronic device. The method of manufacturing an electronic device according to claim 2, wherein the first member and the two members are heated by radiant heat radiated from different heat sources.

Images