JP6072787B2 - 断熱用多孔質板状フィラー、コーティング組成物、断熱膜、および断熱膜構造 - Google Patents
断熱用多孔質板状フィラー、コーティング組成物、断熱膜、および断熱膜構造 Download PDFInfo
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- JP6072787B2 JP6072787B2 JP2014521515A JP2014521515A JP6072787B2 JP 6072787 B2 JP6072787 B2 JP 6072787B2 JP 2014521515 A JP2014521515 A JP 2014521515A JP 2014521515 A JP2014521515 A JP 2014521515A JP 6072787 B2 JP6072787 B2 JP 6072787B2
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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Description
図1に本発明の多孔質板状フィラー1の一実施形態を示す。本発明の多孔質板状フィラー1は、アスペクト比が3以上の板状で、その最小長が0.1〜50μmであり、気孔率が20〜99%である。本明細書において、気孔率は、次の式により求めたものである。
気孔率(%)=(1−(見かけ粒子密度÷真密度))×100
上記の式において、見かけ粒子密度は、水銀を用いた液浸法により測定する。また、真密度は、多孔質板状フィラーを十分に粉砕した後、ピクノメータ法で測定する。
本発明のコーティング組成物は、上述の多孔質板状フィラー1と、無機バインダー、無機高分子、有機無機ハイブリッド材料、酸化物ゾル、及び水ガラスからなる群より選択される一種以上と、を含む。さらに、緻密質なフィラー、粘性調整剤、溶媒、分散剤等を含んでいてもよい。コーティング組成物を塗布、乾燥及び/又は熱処理することにより、断熱膜3を形成することができる。コーティング組成物に含まれる具体的な物質は、セメント、ベントナイト、リン酸アルミニウム、シリカゾル、アルミナゾル、ベーマイトゾル、ジルコニアゾル、チタニアゾル、オルトケイ酸テトラメチル、オルトケイ酸テトラエチル、ポリシラザン、ポリカルボシラン、ポリビニルシラン、ポリメチルシラン、ポリシロキサン、ポリシルセスキオキサン、シリコーン、ジオポリマー、ケイ酸ナトリウム等である。また、有機無機ハイブリッド材料の場合、アクリル−シリカ系ハイブリッド材料、エボキシ−シリカ系ハイブリッド材料、フェノール−シリカ系ハイブリッド材料、ポリカーボネート−シリカ系ハイブリッド材料、ナイロン−シリカ系ハイブリッド材料、ナイロン−クレイ系ハイブリッド材料、アクリル−アルミナ系ハイブリッド材料、アクリル−ケイ酸カルシウム水和物系ハイブリッド材料などが望ましい。
図3を用いて、断熱膜3を説明する。本発明の断熱膜3は、上述の多孔質板状フィラー1が、多孔質板状フィラー1を結合するためのマトリックス3mに分散して配置されている。マトリックス3mとは、多孔質板状フィラー1の周囲やこれらの粒子間に存在する成分であり、これらの粒子間を結合する成分である。
図3、及び図4を用いて本発明の断熱膜構造を説明する。本発明の断熱膜構造は、図3に示すように、上述の断熱膜3が、基材8上に形成された断熱膜構造である。さらに、図4は、断熱膜構造の一実施形態のエンジン燃焼室構造である。
表面緻密層2は、多孔質な構造の断熱膜3の表面に形成された断熱膜3よりも緻密なセラミックスを含む層である。表面緻密層2は、気孔率が5%以下であり、0.01〜4%であることが好ましく、0.01〜3%であることがより好ましい。このような緻密層により、燃料の燃焼時のガス(燃料)の対流による熱伝達を防止することができる。また緻密なため、燃料の吸収やスス、燃えカスが付着しにくい。
緩衝接合層4は、基材8(エンジン構成部材21)と断熱膜3との間、および/または断熱膜3と表面緻密層2との間にある、厚さが断熱膜3よりも薄い層である。緩衝接合層4により、これに接する両層の熱膨張やヤング率のミスマッチを解消し、熱応力による剥離を抑制することができる。
次に、断熱膜構造(エンジン燃焼室構造)の製造方法について説明する。
まず、イットリア部分安定化ジルコニア粉末に、造孔材(ラテックス粒子あるいはメラミン樹脂粒子)、バインダーとしてのポリビニルブチラール樹脂(PVB)、可塑剤としてのDOP、溶剤としてのキシレンおよび1−ブタノールを加え、ボールミルにて30時間混合し、グリーンシート成形用スラリーを調製した。このスラリーに真空脱泡処理を施すことにより、粘度を4000cpsに調整した後、ドクターブレード装置によって焼成後の厚さが5μmとなるようにグリーンシートを形成し、50mm×50mmの寸法に外形切断を行った。この成形体を1100℃、1時間にて焼成し、焼成後に粉砕して多孔質な薄板状フィラー(多孔質板状フィラー1)を得た。
実施例1と同様に多孔質板状フィラー1を作製した。
実施例1と同様な手順だが、粗粉砕をせず、多孔質な薄板状のテープを得た。このテープの表面にCVD法により酸化亜鉛膜を形成させた。さらに、粗粉砕して、表面に熱抵抗膜(被覆層7)を有する、多孔質板状フィラー1を得た。
実施例1と同様に、イットリア部分安定化ジルコニア粉末に、造孔材(ラテックス粒子あるいはメラミン樹脂粒子)、バインダーとしてのポリビニルブチラール樹脂(PVB)、可塑剤としてのDOP、溶剤としてのキシレンおよび1−ブタノールを加え、ボールミルにて30時間混合し、グリーンシート成形用スラリーを調製した。このスラリーに真空脱泡処理を施すことにより、粘度を4000cpsに調整した後、ドクターブレード装置によって焼成後の厚さが5μmとなるようにグリーンシートを形成し、50mm×50mmの寸法に外形切断を行った。この成形体を1100℃、1時間にて焼成した。得られた焼成体を粗粉砕して多孔質板状フィラー1を得た。
実施例1と同様に多孔質板状フィラー1を作製した。
実施例1と同様に多孔質板状フィラー1を作製した。
実施例1と同様に多孔質板状フィラー1を作製した。ただし、イットリア部分安定化ジルコニア粉末の代わりに、イットリア完全安定化ジルコニア粉末を用いた。
実施例7と同様に多孔質板状フィラー1を作製した。
実施例7と同様に多孔質板状フィラー1を作製した。
実施例1と同様に多孔質板状フィラー1を作製した。ただし、イットリア部分安定化ジルコニア粉末の代わりに、ランタンジルコネート粉末を用いた。
実施例1と同様に多孔質板状フィラー1を作製した。ただし、イットリア部分安定化ジルコニア粉末の代わりに、イットリウムシリケート粉末を用いた。
実施例1と同様に多孔質板状フィラー1を作製した。ただし、イットリア部分安定化ジルコニア粉末の代わりに、ニオブ酸ストロンチウム粉末を用いた。
イットリア部分安定化ジルコニア粉末に、造孔材(ラテックス粒子あるいはメラミン樹脂粒子)、バインダーとしてのポリビニルアルコール(PVA)、分散剤、水を加え、ボールミルにて30時間混合し、スラリーを調製した。このスラリーをスプレードライにより乾燥し、球状の顆粒を得た。この顆粒を1100℃、1時間にて焼成した。得られた焼成粉体を解砕し、微粉末を取り除いて球状フィラー31を得た。
Claims (19)
- アスペクト比が3以上の板状で、その最小長が0.1〜50μmであり、気孔率が20〜99%であり、
金属酸化物を含み、前記金属酸化物がZr、Y、Al、Si、Ti、Nb、Sr、及びLaからなる群から選ばれる1の元素の酸化物あるいは2以上の元素の複合酸化物である断熱用多孔質板状フィラー。 - 熱伝導率が1W/(m・K)以下である請求項1に記載の断熱用多孔質板状フィラー。
- 熱容量が10〜3000kJ/(m3・K)である請求項1または2に記載の断熱用多孔質板状フィラー。
- ナノオーダーの気孔、またはナノオーダーの粒子もしくは結晶粒を含んで構成される請求項1〜3のいずれか1項に記載の断熱用多孔質板状フィラー。
- 気孔径が10〜500nmの気孔を有する請求項1〜4のいずれか1項に記載の断熱用多孔質板状フィラー。
- 粒径が1nm〜10μmである粒子を含んで構成されている請求項1〜5のいずれか1項に記載の断熱用多孔質板状フィラー。
- 表面の少なくとも一部に、厚さ1nm〜1μmの被覆層を有する請求項1〜6のいずれか1項に記載の断熱用多孔質板状フィラー。
- 前記被覆層は、熱伝達を抑制する及び/または輻射熱を反射する、熱抵抗膜である請求項7に記載の断熱用多孔質板状フィラー。
- 請求項1〜8のいずれか1項に記載の断熱用多孔質板状フィラーと、無機バインダー、無機高分子、有機無機ハイブリッド材料、酸化物ゾル、及び水ガラスからなる群より選択される一種以上と、を含むコーティング組成物。
- 請求項1〜8のいずれか1項に記載の断熱用多孔質板状フィラーが、前記断熱用多孔質板状フィラーを結合するためのマトリックスに分散して配置された断熱膜。
- 前記断熱用多孔質板状フィラーが層状に配置されている請求項10に記載の断熱膜。
- 前記マトリックスとして、セラミックス、ガラス、および樹脂の少なくとも一種を含む請求項10または11に記載の断熱膜。
- 前記マトリックスは、粒径が500nm以下のセラミックスの微粒子の集合体である請求項12に記載の断熱膜。
- 厚さが1μm〜5mmである請求項10〜13のいずれか1項に記載の断熱膜。
- 熱容量が1500kJ/(m3・K)以下である請求項10〜14のいずれか1項に記載の断熱膜。
- 熱伝導率が1.5W/(m・K)以下である請求項10〜15のいずれか1項に記載の断熱膜。
- 請求項10〜16のいずれか1項に記載の断熱膜が、基材上に形成された断熱膜構造。
- 前記断熱膜の表面に、セラミックスおよび/またはガラスを含み、気孔率が5%以下である表面緻密層を有する請求項17に記載の断熱膜構造。
- 前記基材と前記断熱膜との間、および/または前記断熱膜と表面緻密層との間に、厚さが前記断熱膜よりも薄い緩衝接合層を備える請求項18に記載の断熱膜構造。
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- 2013-06-20 JP JP2014521515A patent/JP6072787B2/ja active Active
- 2013-06-20 EP EP13807307.7A patent/EP2865722B1/en not_active Not-in-force
- 2013-06-20 WO PCT/JP2013/067006 patent/WO2013191263A1/ja not_active Ceased
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2014
- 2014-12-18 US US14/574,564 patent/US20150104626A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP2865722B1 (en) | 2019-03-13 |
| US20150104626A1 (en) | 2015-04-16 |
| EP2865722A4 (en) | 2016-03-09 |
| EP2865722A1 (en) | 2015-04-29 |
| WO2013191263A1 (ja) | 2013-12-27 |
| JPWO2013191263A1 (ja) | 2016-05-26 |
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