JP6084004B2 - Semiconductor device and method for manufacturing the same - Google Patents

Description

  The present invention relates to a semiconductor device in which a flexible substrate is mounted on a second main surface opposite to the first main surface of a semiconductor element, and a method for manufacturing the semiconductor device.

  2. Description of the Related Art Conventionally, there are electronic devices such as an electronic endoscope, a camera-equipped mobile phone, and a digital camera provided with an imaging device provided with a solid-state imaging device (hereinafter simply referred to as an imaging device) such as a semiconductor device such as a CCD or a CMOS. It is well known.

  As one of the forms of the imaging device, comprising an imaging element provided with a light receiving portion on the tip surface corresponding to one of the main surfaces, and a cover glass that protects the light receiving portion attached to the tip surface of the imaging device, A configuration in which a flexible board on which electronic components such as a capacitor, a resistor, and a transistor are mounted is electrically connected to a connection terminal provided on the rear end surface corresponding to the other main surface opposite to the front end surface of the image sensor. It is.

  The signal cable is electrically connected to the flexible substrate, so that the electrical signal of the image of the test site received by the light receiving portion of the image sensor is transmitted to the image processing apparatus or the monitor via the flexible substrate and the signal cable. Etc. to an external device.

  Thus, a configuration in which the flexible substrate is electrically connected to the connection terminal on the rear end surface of the semiconductor element is disclosed in Patent Document 1.

  In Patent Document 1, the flexible substrate is electrically connected to the connection terminal on the rear end surface of the semiconductor element, and the flexible substrate is formed in an arc shape behind the rear end surface in the thickness direction of the semiconductor element connecting the front end surface and the rear end surface. In order to reduce the load on the connection terminal due to the bending of the flexible substrate, a configuration of a semiconductor device in which the connection portion of the flexible substrate to the connection terminal is covered with resin is disclosed.

  In addition, in the configuration in which a bent flexible substrate is electrically connected to the connection terminal on the rear end surface of the semiconductor element in Patent Document 1, first, the flexible substrate in an unbent state is electrically connected to the connection terminal on the rear end surface of the semiconductor element. Then, after filling the connecting portion with resin, the flexible substrate is finally bent.

JP 2012-38920 A

  However, in the configuration and the manufacturing method of the semiconductor device disclosed in Patent Document 1, since the flexible substrate is bent after filling the connecting portion of the flexible substrate, the connection of the flexible substrate is performed at the time of bending. When the load applied to the connection part to the terminal and the cured resin is excessive, there is a problem that the connection part is easily disconnected.

  In addition, since the resin and the flexible substrate are located outside the outer shape of the semiconductor element, there is a problem that the semiconductor device is increased in size.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor device capable of firmly fixing a flexible substrate to a semiconductor element, miniaturized, and a method for manufacturing the semiconductor device. .

In order to achieve the above object, a semiconductor element having a first main surface according to one embodiment of the present invention and a second main surface opposite to the first main surface, and the second main surface electrically When the semiconductor element is planarly viewed from the thickness direction of the semiconductor element connecting the first main surface and the second main surface by bending at least one connected portion, the semiconductor element The semiconductor substrate is filled with a flexible substrate that is positioned so as to be entirely overlapped, and at least a space between the second main surface of the semiconductor element and a mounting surface of the flexible substrate on the second main surface. When the substrate is viewed in plan from the thickness direction, the resin is positioned so as to overlap the semiconductor element as a whole, and the resin is separated from the second main surface in the thickness direction than the mounting surface. And the flexible Set from the space along the bent portion of the outer peripheral surface of the mounting surface of the table board is formed and protrudes length, the surface on which the resin of the bent portion is attached, the hydrophilic treatment is applied.

According to another aspect of the present invention, there is provided a method for manufacturing a semiconductor device, comprising: a flexible substrate mounting step of mounting a second main surface opposite to the first main surface of a semiconductor element on a flexible substrate; A jig attaching step of attaching a fixing jig to a surface opposite to the mounting surface on the second main surface, and bending the at least one portion of the flexible substrate, thereby making the semiconductor element the first main surface. When the planar view is taken from the thickness direction of the semiconductor element connecting the surface and the second main surface, the flexible substrate is positioned so as to entirely overlap the semiconductor element, and the flexible substrate is bent by the fixing jig. A flexible substrate bending step for holding the resin, and at least a resin in a space between the second main surface of the semiconductor element and the mounting surface of the flexible substrate By filling, in the space, when the semiconductor element is viewed in plan from the thickness direction, the resin filling step of positioning the resin so as to entirely overlap the semiconductor element and curing the resin, and In the resin filling step, the mounting surface and the second main surface when the mounting surface is expanded to the outer shape of the semiconductor element and the first amount is 100% or more filled with the resin in the space. The resin is filled in the thickness direction from the space to the mounting surface by filling the resin with a filling amount equal to or less than a second amount in which the resin is 100% filled with respect to the set space between in a direction away from said second major surface, said set along the bent portion of the outer peripheral surface of the mounting surface is formed of a flexible substrate is protruding length, after the resin filling step And further comprising a jig removal step of removing said fixture from said flexible substrate.

  Furthermore, the manufacturing method of the semiconductor device according to another aspect of the present invention includes a jig attaching step of attaching a fixing jig to a surface of the flexible substrate opposite to the mounting surface of the flexible substrate, and at least one portion of the flexible substrate. A flexible substrate bending step of bending and holding the bent shape of the flexible substrate by the fixing jig; a resin application step of applying a resin to the mounting surface of the flexible substrate; and the mounting surface of the flexible substrate, By mounting a second main surface opposite to the first main surface of the semiconductor element while crushing the resin, at least the second main surface of the semiconductor element and the mounting surface of the flexible substrate In the space between the semiconductor element and the semiconductor element from the thickness direction of the semiconductor element connecting the first main surface and the second main surface A semiconductor element mounting step for positioning the flexible substrate and the resin bent so as to overlap the semiconductor element as a whole when viewed from above, and curing the resin. With respect to the setting space between the mounting surface and the second main surface when the mounting surface is expanded to the outer shape of the semiconductor element and the first amount is 100% or more filled with the resin By applying the resin so as to have a filling amount equal to or less than a second amount that is 100% filled with the resin, the resin is further removed from the space in the thickness direction than the mounting surface. The set length protrudes along the bent portion of the outer peripheral surface on which the mounting surface of the flexible substrate is formed in a direction away from the mounting surface.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to firmly fix a flexible substrate to a semiconductor element, the semiconductor device reduced in size and the manufacturing method of this semiconductor device can be provided.

The figure which shows schematically the structure of the semiconductor device of 1st Embodiment. Enlarged view of the part surrounded by II in Fig. 1 FIG. 1 is a diagram showing the flexible substrate of FIG. 1 as well as a semiconductor element as viewed from the direction III in FIG. 1 schematically shows a first amount of resin that is 100% filled in the space of FIG. 1 and a second amount of resin that is 100% filled in the space when the mounting surface of the flexible substrate is extended to the outer shape of the semiconductor element. Figure of the semiconductor device shown in The figure which shows the flexible substrate mounting process which electrically connects the board | substrate electrode of a flexible substrate to the connection terminal of a semiconductor element. The figure which shows the jig | tool attachment process which attaches a fixing jig to the flexible substrate of FIG. The figure which shows the flexible substrate bending process which bends the flexible substrate of FIG. The figure which shows the resin filling process of filling resin in the space between the semiconductor element of FIG. 7, and a flexible substrate. The figure which shows the jig attachment process which attaches a fixed jig to a flexible substrate The figure which shows the flexible substrate bending process of bending the flexible substrate of FIG. The figure which shows the resin application | coating process which apply | coats resin to the mounting surface of the flexible substrate of FIG. The figure which shows the semiconductor element mounting process which electrically connects the connection terminal of a semiconductor element to the board | substrate electrode of a flexible substrate The figure of the semiconductor device which shows the modification in which the flexible substrate of FIG. 1 was bent only in one place Exploded perspective view of cross-shaped flexible substrate and semiconductor element The perspective view which shows the state which mounted the semiconductor element in the center of the cross-shaped flexible substrate of FIG. The perspective view which shows the state seen from the XVI direction in FIG. 15 by bending four parts of the flexible substrate of FIG. The figure which shows schematically the structure of the semiconductor device of 2nd Embodiment. The figure which shows the reinforcement resin filling process which fills the space inside the flexible substrate of FIG. 1 with reinforcement resin. The figure which shows schematically the structure of the semiconductor device of 3rd Embodiment. 1 is a diagram illustrating an example in which the semiconductor device in FIG.

  Embodiments of the present invention will be described below with reference to the drawings. The drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of the thickness of each member, and the like are different from the actual ones. Of course, the part from which the relationship and ratio of a mutual dimension differ is contained.

(First embodiment)
1 is a diagram schematically showing a configuration of a semiconductor device according to the present embodiment, FIG. 2 is an enlarged view of a portion surrounded by II in FIG. 1, and FIG. 3 is a diagram showing a flexible substrate of FIG. FIG. 3 is a diagram illustrating the state as seen from the direction III in FIG. 1 and developed.

  As shown in FIG. 1, the semiconductor device 10 includes a semiconductor element 1. The semiconductor element 1 is connected to the front end surface 1 i and the rear end surface 1 t on the connection terminal 2 provided on the rear end surface 1 t which is the second main surface opposite to the front end surface 1 i which is the first main surface of the semiconductor element 1. When viewed in plan from the connecting thickness direction A, the substrate electrode 3 provided on the mounting surface 5j (described later) of the flexible substrate 5 positioned so as to be entirely overlapped with the semiconductor element 1 by bending at least one portion is electrically connected. Has been.

  Specifically, as shown in FIG. 3, the flexible substrate 5 has two positions along the one-dot chain line C, for example, at a position between the outer shape of the semiconductor element 1 and the substrate electrode 3, as shown in FIG. By bending in a partial arc shape so as to be 90 ° or less, when the semiconductor element 1 is viewed in plan from the thickness direction A, the entire semiconductor element 1 overlaps the semiconductor element 1 from the rear end face 1t in the thickness direction A. It is located in a separating direction (hereinafter referred to as the rear).

  In other words, the flexible substrate 5 has two bent portions 5c. Hereinafter, a surface facing the rear end surface 1t of the semiconductor element 1 located between the two bent portions 5c in the outer peripheral surface 5g of the flexible substrate 5 is referred to as a mounting surface 5j.

  Further, as shown in FIG. 3, on the outer peripheral surface 5 g of the flexible substrate 5, in addition to the substrate electrode 3 described above, a connection electrode 5 r to which a signal cable (not shown) is electrically connected, and the connection electrode 5 r and the substrate electrode 3 are connected. A wiring pattern 5h that electrically connects the two is exposed.

  Note that the angle of each bent portion 5c is set to 90 ° or less when the electronic component is mounted on the outer peripheral surface 5g of the flexible substrate 5 when the bent portion 5c is bent at an angle larger than 90 °. This is because when the signal cable is electrically connected to the electrode 5r, the electronic component or the signal cable protrudes outside the outer shape of the semiconductor element 1, and the semiconductor device 10 is increased in size. Therefore, it is preferable that the bending angle of each bending part 5c is set to an acute angle.

  A resin 8 such as underfill is used to fill the semiconductor element 1 with a thickness so that at least a space K between the rear end face 1t and the mounting surface 5j of the flexible substrate 5 is filled behind the rear end face 1t of the semiconductor element 1. When viewed in plan from the direction A, the semiconductor element 1 is positioned so as to entirely overlap.

  Further, as shown in FIGS. 1 and 2, the resin 8 from the mounting surface 5j from the space K to the extent that it does not protrude outside the outer shape of the semiconductor element 1 in the horizontal direction B orthogonal to the thickness direction A. Also protrudes outward by the set length P1.

  Further, as shown in FIG. 1 and FIG. 2, the resin 8 has a set length P2 from the space K to the rear in the thickness direction A from the mounting surface 5j along the bent portions 5c on the outer peripheral surface 5g of the flexible substrate 5. It is sticking out. That is, the resin 8 protrudes from the space K to the outer peripheral surface 5cg of each bent portion 5c. The resin 8 that protrudes to the outer peripheral surface 5 cg of each bent portion 5 c is also positioned so as not to protrude outward in the horizontal direction B from the outer shape of the semiconductor element 1.

  Further, in order to improve the adhesion of the protruding resin 8 to the outer peripheral surface 5cg of each bent portion 5c, the outer peripheral surface 5cg to which the resin 8 of each bent portion 5c adheres is subjected to a hydrophilic treatment by plasma cleaning or the like. Or the surface roughness of the outer peripheral surface 5cg of each bending part 5c may be formed coarsely.

  The resin 8 may contain carbon particles, pigments, or the like, or may contain fillers or the like. When carbon particles and pigments are contained, light shielding properties can be improved, and when a filler having high thermal conductivity is contained, heat dissipation properties can be improved.

  Next, a method for manufacturing the semiconductor device 10 described above will be described with reference to FIGS. FIG. 4 shows a first amount of resin that is 100% filled in the space of FIG. 1 and a second amount of resin that is 100% filled in the setting space when the mounting surface of the flexible substrate is extended to the outer shape of the semiconductor element. It is a figure of the semiconductor device which shows quantity normally.

  5 is a diagram showing a flexible substrate mounting process for electrically connecting the substrate electrode of the flexible substrate to the connection terminal of the semiconductor element, and FIG. 6 is a jig attachment for attaching a fixing jig to the flexible substrate of FIG. FIG. 7 is a diagram showing a flexible substrate bending step for bending the flexible substrate of FIG. 6, and FIG. 8 is a resin filling step for filling the space between the semiconductor element and the flexible substrate of FIG. FIG.

  First, as shown in FIG. 5, a flexible substrate mounting step is performed in which the substrate electrode 3 of the flexible substrate 5 in an unbent state is electrically connected to the connection terminals 2 provided on the rear end surface 1 t of the semiconductor element 1. The electrical connection of the substrate electrode 3 to the connection terminal 2 is performed by applying heat N from the flexible substrate 5 side.

  Note that the heat N is applied from the flexible substrate 5 side when the cover glass 60 (see FIG. 20), which will be described later, is attached to the front end surface 1i of the semiconductor element 1, from the semiconductor element 1 side to the connection portion. This is because it becomes difficult to add N.

  Next, as shown in FIG. 6, when the semiconductor element 1 is viewed from the thickness direction A with respect to the inner peripheral surface 5 n opposite to the mounting surface 5 j of the flexible substrate 5, the semiconductor element 1 is positioned so as to overlap the semiconductor element 1. Then, a jig attaching step for attaching the fixing jig 20 is performed.

  Next, as shown in FIG. 7, the flexible substrate 5 is bent at two locations, specifically, 90 ° or less along the line C as shown in FIG. When viewed from above, the flexible substrate 5 is positioned so that the flexible substrate 5 entirely overlaps the semiconductor element 1, and a flexible substrate bending step of mechanically holding the bent shape of the flexible substrate 5 by the fixing jig 20 is performed. After bending, the inner peripheral surface 5 n of the flexible substrate 5 comes into contact with the outer peripheral surface of the fixing jig 20.

  Thereafter, as shown in FIG. 8, at least the space K between the rear end surface 1t of the semiconductor element 1 and the mounting surface 5j of the flexible substrate 5 is filled with the resin 8, so that the semiconductor element 1 is viewed from the thickness direction A in plan view. In this case, a resin filling step is performed in which the resin 8 is positioned behind the rear end face 1t so that the resin 8 is entirely overlapped with the semiconductor element 1, and the resin 8 is cured by an oven or the like.

  Specifically, in the resin filling step, as shown in FIG. 4, the space 8 is filled with 100% of the resin 8 at a first amount α or more, and the mounting surface 5j is a two-dot chain line in FIG. As shown, a filling amount equal to or less than a second amount α ′ that is 100% filled with the resin 8 in the set space K ′ between the mounting surface 5j and the rear end surface 1t when expanded to the outer shape of the semiconductor element 1; As shown in FIG. 8, the resin 8 to be formed is filled from below the mounting surface 5j, specifically, into at least the space K from the vicinity of the bent portion 5c using, for example, a dispenser 25.

  Of course, after the space M is filled with the first amount α, the resin 8 is separately applied to the outer peripheral surface 5cg of each bent portion 5c, whereby the set length of the resin 8 along each bent portion 5c is set. The protrusion of P2 may be formed.

  As a result, as shown in FIGS. 1 and 2, the resin 8 protrudes from the space K rearward in the thickness direction A from the mounting surface 5 j along the bent portions 5 c of the flexible substrate 5.

  Finally, after the resin filling step shown in FIG. 8, a jig removing step for removing the fixing jig 20 from the flexible substrate 5 is performed, whereby the semiconductor device 10 shown in FIG. 1 is manufactured.

  As described above, in the present embodiment, the flexible substrate 5 is positioned behind the semiconductor element 1 by electrically connecting the substrate electrode 3 to the connection terminal 2 on the rear end face 1t of the semiconductor element 1. It was shown that when the semiconductor element 1 was viewed in plan from the thickness direction A, the entire semiconductor element 1 was positioned by being bent at two locations.

  Further, at least the resin 8 filled in the space K between the mounting surface 5j of the flexible substrate 5 and the rear end surface 1t of the semiconductor element 1 is located so as to protrude from the space K to the outer peripheral surface 5cg of each bent portion 5c. In both cases, the resin 8 is shown to be filled so as to entirely overlap the semiconductor element 1 when the semiconductor element 1 is viewed in plan from the thickness direction A.

  According to this, since the flexible substrate 5 and the resin 8 do not protrude outward from the outer shape of the semiconductor element 1 in the horizontal direction B, the semiconductor device 10 can be reduced in size.

  Further, the resin 8 that protrudes from the space K to the outer peripheral surface 5cg of each bent portion 5c firmly fixes the flexible substrate 5, and the flexible substrate 5 tries to return to an unbent state (sometimes called a springback). ) Can be maintained, the bent shape of the flexible substrate 5 can be maintained, so that the connection reliability of the substrate electrode 3 with respect to the connection terminal 2 is improved.

  Furthermore, in the present embodiment, in the manufacturing method of the semiconductor device 10, the flexible substrate 5 is bent and then the space 8 is filled with the resin 8. In addition to the load being applied to the resin 8, the flexible substrate 5 is easily positioned so as to overlap the semiconductor element 1 when the semiconductor element 1 is viewed in plan from the thickness direction A. Can do.

  Further, the connection of the connection terminal 2 of the semiconductor element 1 to the substrate electrode 3 of the flexible substrate 5 can be easily performed by a general mounting method such as known SMT (Surface Mount Technology).

  From the above, the flexible substrate 5 can be firmly fixed to the semiconductor element 1 and the flexible flexible substrate 5 is positioned within the outer shape of the semiconductor element 1, so that the semiconductor device 10 can be miniaturized and the semiconductor device 10 can be manufactured. A method can be provided.

  Hereinafter, modified examples of the method for manufacturing the semiconductor device 10 of the present embodiment will be described with reference to FIGS.

  9 is a diagram illustrating a jig attaching process for attaching a fixing jig to the flexible substrate, FIG. 10 is a diagram illustrating a flexible substrate bending process for bending the flexible substrate in FIG. 9, and FIG. 11 is a diagram of the flexible substrate in FIG. The figure which shows the resin application | coating process which apply | coats resin to a mounting surface, FIG. 12 is a figure which shows the semiconductor element mounting process which electrically connects the connection terminal of a semiconductor element to the board | substrate electrode of a flexible substrate.

  First, as shown in FIG. 9, a jig attaching step for attaching the fixing jig 20 to the inner peripheral surface 5n opposite to the mounting surface 5j of the flexible substrate 5 is performed.

  Next, as shown in FIG. 10, the flexible substrate 5 is bent at two places, specifically, 90 ° or less along the line C as shown in FIG. A flexible substrate bending step is performed to mechanically hold the bent shape of No. 5. After bending, the inner peripheral surface 5 n of the flexible substrate 5 comes into contact with the outer peripheral surface of the fixing jig 20.

  Next, as shown in FIG. 11, a resin application step of applying resin 8 to the mounting surface 5 j of the flexible substrate 5 is performed.

  Thereafter, as shown in FIG. 12, the connection terminal 2 of the semiconductor element 1 is electrically applied to the substrate electrode 3 provided on the mounting surface 5j of the flexible substrate 5 while the resin 8 is crushed by applying a load on the semiconductor element 1. When the semiconductor element 1 is viewed in a plan view from the thickness direction A at least in the space K, the resin 8 and the flexible substrate 5 are positioned so as to overlap the semiconductor element 1 as a whole behind the rear end face 1t. Then, a semiconductor element mounting step is performed in which the resin 8 is cured by heating means before or after the mounting on the flexible substrate 5 is completed.

  Here, in the resin filling step, as shown in FIG. 4, the space 8 is filled with the resin 8 by 100% or more, and the mounting surface 5j is shown by a two-dot chain line in FIG. The filling amount is equal to or less than the second amount α ′ ′ that is 100% filled with the resin 8 in the setting space K ′ between the mounting surface 5j and the rear end surface 1t when the outer shape of the semiconductor element 1 is expanded. As shown in FIG. 11, the resin 8 is applied to the mounting surface 5j.

  As a result, after the semiconductor element mounting process, as shown in FIGS. 1 and 2, the resin 8 is set along the bent portions 5 c of the flexible substrate 5 behind the mounting surface 5 j in the thickness direction A from the space K. The length P2 protrudes.

  Of course, after the first amount α is applied to the mounting surface 5j, the substrate electrode 3 is electrically connected to the connection terminal 2 as described above, and then the outer peripheral surface 5cg of each bent portion 5c is connected. By applying the resin 8 separately, the protrusion of the set length P2 along each bent portion 5c of the resin 8 may be formed.

  Finally, after the semiconductor element mounting step of FIG. 12, a jig removing step for removing the fixing jig 20 from the flexible substrate 5 is performed, whereby the semiconductor device 10 of FIG. 1 is manufactured.

  Even with such a manufacturing method, since the substrate electrode 3 of the flexible substrate is electrically connected to the connection terminal 2 of the semiconductor element 1 after the flexible substrate 5 is bent, the bending stress applied to the flexible substrate is reduced. In addition, it is possible to obtain the same effects as those of the present embodiment, such that the load is not applied to the resin 8 as the flexible substrate 5 is bent.

  Hereinafter, another modification will be described with reference to FIG. FIG. 13 is a diagram of a semiconductor device showing a modification in which the flexible substrate of FIG. 1 is bent at only one position.

  In the present embodiment described above, it has been shown that the flexible substrate 5 is bent at two points, that is, two bent portions 5c are formed.

  Not limited to this, as shown in FIG. 13, when the bent portion 5 c is formed only at one place, the flexible substrate 5 is formed when the semiconductor element 1 is viewed in plan from the thickness direction A behind the semiconductor element 1. It may be positioned so as to entirely overlap the semiconductor element 1.

  In the configuration shown in FIG. 13 as well, the resin 8 does not protrude outward in the horizontal direction B from the outer shape of the semiconductor element 1, and only the set length P2 from the space K to the outer peripheral surface 5cg of one bent portion 5c. It is located overhanging.

  Hereinafter, another modification will be described with reference to FIGS. 14 is an exploded perspective view of the cross-shaped flexible substrate and the semiconductor element, FIG. 15 is a perspective view showing a state in which the semiconductor element is mounted at the center of the cross-shaped flexible substrate of FIG. 14, and FIG. FIG. 16 is a perspective view illustrating a state in which four portions of the flexible substrate are bent and viewed from the XVI direction in FIG. 15.

  Also, as shown in FIG. 16, the flexible substrate 5 may have bent portions 5c formed at four locations.

  Specifically, as shown in FIG. 14, the substrate electrode 3 exposed on the outer peripheral surface 5g of the cross-shaped flexible substrate 5 having four portions 5v, 5w, 5x, and 5y is shown in FIG. After the connection terminal 2 of the element 1 is electrically connected at the center where the four portions 5v, 5w, 5x, and 5y of the cross-shaped flexible substrate 5 intersect, as shown in FIG. 16, each portion 5v, 5w Bending portions 5c may be formed at four locations by bending 5x and 5y to 90 ° or less, respectively.

  In the configuration shown in FIG. 16 as well, the flexible substrate 5 is positioned behind the semiconductor element 1 so as to overlap the semiconductor element 1 when the semiconductor element 1 is viewed from the thickness direction A in plan view. 8 does not protrude outward from the outer shape of the semiconductor element 1 in the horizontal direction B, and is positioned so as to protrude from the space K to the outer peripheral surface 5cg of the four bent portions 5c by the set length P2.

(Second Embodiment)
FIG. 17 schematically shows a configuration of the semiconductor device of the present embodiment.

  The configuration of the semiconductor device of the second embodiment is different from that of the semiconductor device of the first embodiment shown in FIGS. 1 and 2 and the method of manufacturing the semiconductor device shown in FIGS. The difference is that the reinforcing resin is fixed to the inner peripheral surface of the flexible substrate and the step of filling the inner peripheral surface of the flexible substrate with the reinforcing resin.

  Therefore, only these differences will be described, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted.

  As shown in FIG. 17, in the semiconductor device 10 of the present embodiment, the reinforcing resin 30 that fixes the bent shape of the flexible substrate 5 is fixed to the inner peripheral surface 5 n of the flexible substrate 5. That is, the reinforcing resin 30 is provided in the space M inside the flexible substrate 5. The reinforcing resin 30 may be the same material as the resin 8 or a different material.

  Other configurations are the same as those of the semiconductor device 10 according to the first embodiment described above.

  In addition, a method for manufacturing the semiconductor device of this embodiment will be described with reference to FIGS. FIG. 18 is a diagram showing a reinforcing resin filling process in which the space inside the flexible substrate of FIG. 1 is filled with the reinforcing resin.

  In the present embodiment, after the semiconductor device 10 shown in FIG. 1 formed after the jig removing step described above is inverted (in the opposite direction in the thickness direction A), as shown in FIG. Then, a reinforcing resin filling step is performed in which the reinforcing resin 30 that fixes the bent shape of the flexible substrate 5 is filled in the internal space M by the dispenser 35 or the like.

  As a result, the reinforcing resin 30 is fixed to the inner peripheral surface 5n of the flexible substrate 5 as shown in FIG.

  According to such a configuration and manufacturing method, in addition to the effects of the first embodiment described above, the bent shape of the flexible substrate 5 is further reinforced by the reinforcing resin 30, thereby further improving the strength of the semiconductor device 10. be able to.

(Third embodiment)
FIG. 19 is a diagram schematically showing a configuration of the semiconductor device of the present embodiment.

  The configuration of the semiconductor device of the third embodiment is different from that of the semiconductor device of the first embodiment shown in FIGS. 1 and 2 and the method of manufacturing the semiconductor device shown in FIGS. The difference is that the heat dissipation member is fixed to the inner peripheral surface of the flexible substrate and the step of fixing the heat dissipation member to the inner peripheral surface of the flexible substrate.

  Therefore, only these differences will be described, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted.

  As shown in FIG. 19, in the semiconductor device 10 of the present embodiment, the bent shape of the flexible substrate 5 is fixed to the inner peripheral surface 5 n of the flexible substrate 5 and is transmitted from the semiconductor element 1 through the flexible substrate 5. A heat radiating member 40 that radiates the heated heat is fixed. That is, the heat dissipation member 40 is provided in the space M inside the flexible substrate 5. Examples of the heat radiating member 40 include inorganic materials such as SUS, aluminum, and ceramics, and resin materials.

  Other configurations are the same as those of the semiconductor device 10 according to the first embodiment described above.

  As a manufacturing method of the present embodiment, heat dissipation having the same shape as the fixing jig 20 is used instead of the fixing jig 20 in the jig attaching step shown in FIG. 6 or 9 of the first embodiment. The member 40 may be used.

  In the present embodiment, since the heat radiating member 40 is left in the space M, the jig removing step shown in the first embodiment described above becomes unnecessary.

  Other manufacturing methods are the same as those in the first embodiment described above.

  As described above, according to the configuration and the manufacturing method of the present embodiment, since the jig removing step shown in the first and second embodiments described above is not necessary, the number of manufacturing steps can be reduced. Similar to the second embodiment, the bent shape of the flexible substrate 5 is further reinforced, and the heat dissipation of the semiconductor device 10 can be improved by the heat dissipation member 40.

  Other effects are the same as those of the first embodiment described above.

  Moreover, the semiconductor device of the first to third embodiments described above is used as, for example, an imaging device. FIG. 20 is a diagram illustrating an example in which the semiconductor device of FIG. 1 is used as an imaging device.

  As shown in FIG. 20, the semiconductor device 10 according to the first to third embodiments described above is used as an imaging device, for example. That is, the semiconductor element 1 is used as an imaging element.

  In this case, a cover glass 60 is attached to the front end surface 1 i of the image sensor 1 so as to cover the light receiving portion 1 e.

  Thus, when applied to an imaging device, since the flexible substrate 5 and the resin 8 are located within the outer shape of the semiconductor device 10, the imaging device can also be reduced in size, so that downsizing and diameter reduction are required. This is suitable for an imaging device mounted at the distal end of the insertion portion of the endoscope.

  Further, the imaging device may be provided in a medical capsule endoscope, for example, in addition to a medical or industrial endoscope, and is not limited to an endoscope. Needless to say, it may be applied to a digital camera. Furthermore, the semiconductor device 10 can be applied to other devices different from the imaging device.

DESCRIPTION OF SYMBOLS 1 ... Semiconductor element 1i ... The front end surface (1st main surface) of a semiconductor element
1t: Rear end surface of semiconductor element (second main surface)
5 ... Flexible substrate 5c ... Bending portion 5cg of flexible substrate ... Outer peripheral surface of bending portion (surface to which resin adheres)
5 g: outer peripheral surface of flexible substrate 5 j: mounting surface of flexible substrate 5 n: inner peripheral surface of flexible substrate (surface opposite to mounting surface)
DESCRIPTION OF SYMBOLS 8 ... Resin 10 ... Semiconductor device 20 ... Fixing jig 30 ... Reinforcement resin 40 ... Heat radiation member A ... Thickness direction K ... Space K '... Setting space alpha ... First quantity alpha' ... Second quantity

Claims (8)

A semiconductor element having a first main surface and a second main surface opposite to the first main surface;
A thickness direction of the semiconductor element that connects the first main surface and the second main surface by bending at least one portion electrically connected to the second main surface. When viewed from above, a flexible substrate positioned so as to overlap the semiconductor element as a whole,
When filling the space between at least the second main surface of the semiconductor element and the mounting surface of the flexible substrate on the second main surface, and when the semiconductor element is viewed in plan from the thickness direction, A resin positioned so as to entirely overlap the semiconductor element;
Comprising
The resin has a set length from the space along the bent portion of the outer peripheral surface where the mounting surface of the flexible substrate is formed in a direction away from the second main surface in the thickness direction than the mounting surface. It is sticking out
A surface of the bent portion to which the resin adheres is subjected to a hydrophilic treatment . Wherein the inner peripheral surface opposite to the outer peripheral surface of the flexible substrate, a semiconductor device according to claim 1, reinforcing resin for fixing the bent shape of the flexible substrate is characterized in that it is fixed. A heat radiating member that fixes the bent shape of the flexible substrate to the inner peripheral surface of the flexible substrate opposite to the outer peripheral surface and radiates heat transferred from the semiconductor element through the flexible substrate is fixed. The semiconductor device according to claim 1 , wherein: A flexible substrate mounting step of mounting a second main surface opposite to the first main surface of the semiconductor element on the flexible substrate;
A jig attaching step of attaching a fixing jig to a surface opposite to the mounting surface of the flexible substrate on the second main surface;
By bending at least one portion of the flexible substrate, the semiconductor substrate is planarly viewed from the thickness direction of the semiconductor element connecting the first main surface and the second main surface. A flexible substrate bending step of positioning the semiconductor device so as to overlap the whole and holding the bent shape of the flexible substrate by the fixing jig;
When filling the space between at least the second main surface of the semiconductor element and the mounting surface of the flexible substrate with a resin, when the semiconductor element is viewed in plan from the thickness direction in the space, the A resin filling step of positioning the resin so as to entirely overlap the semiconductor element and curing the resin;
Comprising
In the resin filling step, the mounting surface and the second main surface when the mounting surface is expanded to the outer shape of the semiconductor element and the first amount is 100% or more filled with the resin in the space. The resin is filled in the thickness direction from the space to the mounting surface by filling the resin with a filling amount equal to or less than a second amount in which the resin is 100% filled with respect to the set space between in a direction away from said second major surface, along the bent portion is protruded set length of the outer peripheral surface of the mounting surface is formed of the flexible substrate,
A method for manufacturing a semiconductor device, further comprising a jig removing step of removing the fixing jig from the flexible substrate after the resin filling step . A jig attaching step for attaching a fixing jig to the surface opposite to the mounting surface of the flexible substrate to the semiconductor element;
A flexible substrate bending step of bending at least one portion of the flexible substrate and holding the bent shape of the flexible substrate by the fixing jig;
A resin application step of applying a resin to the mounting surface of the flexible substrate;
By mounting the second main surface opposite to the first main surface of the semiconductor element on the mounting surface of the flexible substrate while crushing the resin, at least the second of the semiconductor element is mounted. In the space between the main surface and the mounting surface of the flexible substrate, when the semiconductor element is viewed in plan from the thickness direction of the semiconductor element connecting the first main surface and the second main surface, A semiconductor element mounting step for positioning the flexible substrate and the resin bent so as to entirely overlap with a semiconductor element, and curing the resin;
Comprising
In the resin coating step, the mounting surface and the second main surface when the mounting surface is expanded to the outer shape of the semiconductor element and the first amount is 100% or more filled with the resin in the space. By applying the resin so that the filling amount is equal to or less than a second amount in which the resin is 100% filled with respect to the set space between the resin and the mounting surface, the resin is more thicker than the mounting surface. A method of manufacturing a semiconductor device, wherein a set length protrudes along a bent portion of an outer peripheral surface of the flexible substrate on which the mounting surface is formed in a direction away from the second main surface in a direction. The semiconductor device manufacturing method according to claim 5 , further comprising a jig removing step of removing the fixing jig from the flexible substrate after the resin coating step. The method further comprises a reinforcing resin filling step of filling a reinforcing resin for fixing a bent shape of the flexible substrate on an inner peripheral surface of the flexible substrate opposite to the outer peripheral surface after the jig removing step. A method for manufacturing a semiconductor device according to claim 4 or 6 . The fixture, according to claim 4 or 5, wherein the a heat radiating member for radiating heat transfer thermal through said flexible substrate from said semiconductor element is fixed a bent shape of the flexible substrate Semiconductor device manufacturing method.

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