JP6089753B2 - Manufacturing method of physical quantity detection sensor, physical quantity detection sensor, physical quantity detection device, electronic apparatus, and moving body - Google Patents

Description

  The present invention relates to a manufacturing method of a physical quantity detection sensor capable of accurately positioning an element for detecting a physical quantity, a physical quantity detection sensor manufactured by the manufacturing method, a physical quantity detection device using the physical quantity detection sensor, and a physical quantity The present invention relates to an electronic device equipped with a detection sensor and a moving object.

  Conventionally, as a physical quantity detection sensor, a vibration type sensor as disclosed in Patent Document 1 is known. The vibration type sensor includes a vibrating arm that extends in a beam shape and bends and vibrates in a plane direction at a predetermined resonance frequency, and a first base portion, a first constricted portion formed in order from one end portion of the vibrating arm, A vibration piece having a first support portion, a second base portion, a second constriction portion, and a second support portion formed in order from the other end portion; and a base for supporting the vibration piece; As for the piece, the main surface side of the 1st support part and the 2nd support part is connected to the base. The vibration type sensor configured as described above has a mechanism for detecting a physical quantity by utilizing the fact that when the base is displaced by a physical quantity such as an applied acceleration, the frequency of the vibrating arm changes with the displacement. Yes. In addition, the vibration type sensor has the first constricted portion and the second constricted portion, so that it can prevent stress concentration on the vibrating piece due to an impact or the like, and has excellent performance in impact resistance. Yes.

JP 2010-71714 A

  In the physical quantity detection sensor (vibration type sensor) disclosed in Patent Document 1, the physical quantity can be detected by the vibrating piece by connecting the base and the vibrating piece in a predetermined positional relationship. However, in recent years, with the increase in performance and size of the physical quantity detection sensor, it has become necessary to dispose the base and the resonator element in a more precise positional relationship. On the other hand, in addition to the positioning of the base and the vibrating piece in plan view, the positioning of the base and the vibrating piece in a parallel state with no inclination or the like, as disclosed in the related art, There is a problem that it is difficult to cope with the manufacturing method by placing the base plate on the base and joining them.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples or forms.

  Application Example 1 A manufacturing method of a physical quantity detection sensor according to this application example includes a fixed portion, a movable portion, a joint portion connecting the fixed portion and the movable portion, and a frame extending from the fixed portion. A pressure sensitive element portion having a vibrating arm sandwiched between two base portions, a connection portion extending from the base portion, and a joint portion connected to the base portion through the connection portion, And a step of preparing an element piece having a bonding material, the pressure-sensitive element portion straddling the joint portion, one base portion overlapping the fixed portion, and the other base portion overlapping the movable portion. As described above, the step of disposing the element piece on the base portion, the one base portion as the fixed portion, the other base portion as the movable portion, and the joint portion as the frame portion, respectively. The step of joining via Characterized in that it comprises the steps of to, a.

  According to the manufacturing method of the physical quantity detection sensor of this application example, in the placing step, the element piece and the base portion are configured such that the pressure-sensitive element portion of the element piece has one base portion opposed to the fixing portion of the base portion, and the joint portion. The other base part is arranged so as to face the movable part of the base part across the part. With this arrangement, the element piece and the base portion are arranged in a predetermined positional relationship with each other in a plan view as viewed from the direction in which the element piece and the base portion overlap. In addition, the joint portion of the element piece is connected to the pressure-sensitive element portion through the connection portion. In this case, the bonding material may be disposed on either the base portion and the connection portion of the element piece, or the portion of the base portion facing the base portion and the connection portion. That is, the pressure sensitive element portion is disposed in contact with the base portion at the two base portions and the connection portion. As a result, the pressure-sensitive element portion can be arranged in a parallel state in which the inclination and the like are further suppressed compared to the conventional manufacturing method in which the pressure-sensitive element portion is arranged at the base portion only at the two base portions. It is. In the step of joining the element piece and the base portion arranged in this manner, one base portion and the fixed portion, the other base portion and the movable portion, and the joint portion and the frame portion are joined by a joining material. In the bonding step, the element piece and the base portion can be bonded to each other while maintaining an accurate positional relationship at the positions of the base portion and the bonding portion through the arrangement step. If the connecting portion is removed in the removing step, the pressure-sensitive element portion is disposed at a predetermined position of the base portion as a single unit. Further, the joint portion remaining in the frame portion has an effect of suppressing unnecessary vibrations and the like other than operations such as bending of the movable portion. Here, the pressure-sensitive element portion corresponds to a vibrating piece in the background art, and the base portion including a movable portion corresponds to a base.

  Application Example 2 In the method of manufacturing a physical quantity detection sensor according to the application example described above, in the step of preparing, it is preferable that the element piece has two joint portions sandwiching the pressure sensitive element portion.

  According to this method, the element piece has two joint portions, and these joint portions are arranged with the pressure-sensitive element portion interposed therebetween. By preparing such an element piece, when the pressure-sensitive element portion is joined to the base portion through the placing step and the joining step, the inclination in the direction orthogonal to the direction connecting the two base portions is ensured. It is in a suppressed state. This has the same effect as that in which the inclination in the direction connecting the two bases is suppressed by being joined at both bases. As a result, the pressure-sensitive element portion is disposed at a predetermined position in plan view with respect to the base portion, and is disposed with a substantially parallel interval with respect to the base portion.

  Application Example 3 In the method of manufacturing a physical quantity detection sensor according to the application example, it is preferable that in the step of preparing, the bonding material is glass.

  According to this method, the bonding material disposed on at least one of the element piece and the base portion is preferably glass, and if it is glass, it may be preliminarily disposed in the preparing step, or may be altered. A stable state is maintained without fear of And if it heats at the process of joining, joining of an element piece and a base part is possible easily. The bonding material is preferably low-melting glass in order to suppress the thermal effect on the element piece and the base portion.

  Application Example 4 In the method of manufacturing a physical quantity detection sensor according to the application example described above, in the preparing step, it is preferable that the pressure-sensitive element portion and the base portion are made of the same material.

  According to this method, in the step of joining, when joining by heating or ultraviolet irradiation, the base part and the pressure-sensitive element part do not behave differently due to thermal expansion or alteration, so the pressure-sensitive element part is There is no problem such as distortion caused by bonding. In addition, when heat is applied to the base part and the pressure-sensitive element part joined to the base part, the thermal expansion of the base part and the pressure-sensitive element part is the same. There is no restriction due to the difference in thermal expansion. For this reason, the pressure-sensitive element section can maintain its detection performance even under different temperature environments.

  Application Example 5 In the physical quantity detection sensor manufacturing method according to the application example described above, in the placing step, an abutting jig is prepared, and the base portion and the element piece are brought into contact with the abutting jig. It is preferable to perform positioning.

  According to this method, the base portion and the element piece prepared in the preparing step are positioned and arranged on the abutting jig. As described above, when the abutting jig is used, it is not necessary to further provide an alignment portion or the like on the base portion or the element piece. Further, the abutting jig can be used as it is in the process after the arranging process, and it is possible to contribute to maintaining the accurate positions of the base part and the element piece.

  Application Example 6 A physical quantity detection sensor according to this application example includes a fixed portion, a movable portion, a joint portion connecting the fixed portion and the movable portion, and a thick portion extending from the fixed portion. A pressure sensitive element portion having a base portion having a frame portion, two base portions joined to the fixed portion or the movable portion across the joint portion, and a vibrating arm sandwiched between the base portions And.

  According to the physical quantity detection sensor of this application example, the pressure-sensitive element unit detects the operation of the movable part due to the addition of the physical quantity. This physical quantity detection sensor has a thick part in the frame part that extends from the fixed part that supports the movable part, and the thick part is an unnecessary vibration other than an operation such as bending of the movable part. It plays the role of suppressing The physical quantity detection sensor having such a thick part is a sensor having a high detection performance because the movable part accurately operates according to the physical quantity.

  Application Example 7 In the physical quantity detection sensor according to the application example, the thick part includes the pressure-sensitive element part, a joint part for joining the pressure-sensitive element part to the base part, and the pressure-sensitive element. An element piece having an element portion and a connecting portion connecting the joining portion, and being aligned with the base portion, and joining one base portion of the pressure-sensitive element portion to the fixing portion, It is preferable that the base portion is joined to the movable portion, the joint portion is joined to the frame portion, the connection portion is removed after joining, and the joining portion remaining in the frame portion is formed.

  According to this configuration, in the formation of the thick portion, the element piece and the base portion having the joint portion to be the thick portion are configured such that one base portion of the pressure sensitive element portion of the element piece is a fixed portion of the base portion. Further, the other base portion is joined to the movable portion of the base portion so as to straddle the joint portion. Further, the joint portion of the element piece is connected to the pressure-sensitive element portion via the connection portion, and the pressure-sensitive element portion is joined to the base portion at the two base portions and the connection portion. If the connecting portion is removed from the element piece and the base portion joined in this manner, the pressure-sensitive element portion is disposed at a predetermined position of the base portion as a single unit. That is, the pressure-sensitive element portions are arranged in a predetermined positional relationship with each other in a plan view as viewed from the direction in which the element piece and the base portion overlap with each other, and are substantially parallel to the base portion. It is arranged with a proper interval. And the junction part which remained in the frame part by removal of a connection part functions as a thick part which plays the role which suppresses unnecessary vibrations other than operation | movements, such as a movable part bending. Thereby, the physical quantity detection sensor has a high-performance detection function.

  Application Example 8 A physical quantity detection device according to this application example includes the physical quantity detection sensor according to the application example described above and a package that accommodates the physical quantity detection sensor.

  According to the physical quantity detection device of this application example, it is possible to detect the physical quantity by suppressing the influence of disturbance factors such as the atmosphere and temperature outside the package by housing the physical quantity detection sensor in the package. . It is also possible to maintain stable detection of the physical quantity detection sensor by setting the inside of the package to a reduced pressure atmosphere, an inert gas atmosphere, or the like.

  Application Example 9 An electronic apparatus according to this application example includes the physical quantity detection sensor described in the application example.

  According to the electronic device of this application example, the physical quantity detection sensor manufactured by the manufacturing method of the physical quantity detection sensor of the application example is mounted, and the physical quantity detection sensor has a pressure-sensitive element portion with respect to the base portion. In addition to being arranged at a predetermined position in a plan view, it is arranged with an interval substantially parallel to the base portion, so that stable detection characteristics can be maintained. Such an electronic device can improve characteristics and reliability as a device.

  Application Example 10 A moving object according to this application example includes the physical quantity detection sensor described in the application example.

  According to the moving body of this application example, the physical quantity detection sensor manufactured by the manufacturing method of the physical quantity detection sensor of the application example is mounted, and the physical quantity detection sensor has a pressure-sensitive element portion with respect to the base portion. In addition to being arranged at a predetermined position in a plan view, it is arranged with an interval substantially parallel to the base portion, so that stable detection characteristics can be maintained. Such a moving body can surely grasp the moving state, posture, and the like by the detection function of the physical quantity detection sensor, and can move safely and stably.

(A) The top view which shows the structure of the physical quantity detection apparatus in Embodiment 1 which concerns on this invention, (b) Sectional drawing which shows the structure of a physical quantity detection apparatus. The perspective view which shows the structure of a physical quantity detection sensor. (A) (b) Sectional drawing which shows operation | movement of a physical quantity detection sensor. The flowchart which shows the manufacturing method of a physical quantity detection sensor. (A) The top view which shows the form of a base part, (b) The top view which shows the form of an element piece. The perspective view which shows the joining method of a base part and an element piece. The perspective view which shows the removal method of a connection part. FIG. 6 is a plan view showing a form of an element piece in Embodiment 2. (A) A perspective view showing a video camera equipped with a physical quantity detection sensor, (b) a perspective view showing a mobile phone equipped with a physical quantity detection sensor, and (c) a mobile object equipped with a physical quantity detection sensor. FIG.

Preferred embodiments of the physical quantity detection sensor manufacturing method, physical quantity detection sensor, physical quantity detection device, electronic apparatus, and mobile body of the present invention will be described below with reference to the accompanying drawings.
(Embodiment 1)
(Physical quantity detector)

  FIG. 1A is a plan view showing the configuration of the physical quantity detection device according to the first embodiment of the present invention. FIG.1 (b) is sectional drawing which shows the structure of a physical quantity detection apparatus, and represents the cross section along the II line in Fig.1 (a). In FIG. 1, the x axis, the y axis, and the z axis are illustrated as three axes orthogonal to each other.

  As shown in FIG. 1, the physical quantity detection device 1 includes a package 10 and a physical quantity detection sensor 20 having a base portion 21 and a pressure sensitive element portion 22. First, the package 10 includes a package base 101 and a lid 102. The package base 101 is a flat plate having a quadrangular shape when viewed from the z-axis direction. The package base 101 has a step portion 103 for fixing the base portion 21 of the physical quantity detection sensor 20, and these steps are provided along one end portion in the y-axis direction along the x-axis. A portion 103a and step portions 103b and 103c provided in the vicinity of two corners at the other end in the y-axis direction. Further, the package base 101 has a hole passing through the flat plate and a sealing portion 104 made of a sealing material for closing the hole, and a surface opposite to the surface on which the step portions 103a, 103b, and 103c are provided. And an external terminal 107 to be connected to an external oscillation circuit or the like. The package base 101 is formed of an aluminum oxide sintered body obtained by firing a ceramic green sheet. Ceramic aluminum oxide sintered bodies are excellent materials for packages, but are difficult to process. However, in this case, since the package base 101 has a flat plate shape, it can be easily formed as compared with the case where the package base 101 is formed in a shape other than the flat plate. Note that the package base 101 can also be formed using a material such as quartz, glass, or silicon.

  The lid 102 has an accommodating portion 106 formed in a concave shape on the inner side, and is disposed so as to cover the pressure sensitive element portion 22 with the stepped portions 103a, 103b, 103c of the package base 101 as a guide. Fixed to. The lid 102 can be made of the same material as the package base 101, a metal such as Kovar or stainless steel, and here, the Kovar is used in which the housing portion 106 can be formed more easily than ceramic. When the lid 102 is joined to the package base 101 via the seam ring 105, the accommodating portion 106 can be sealed in a hermetically sealed state or the like.

Here, the sealing of the housing portion 106 is performed after the package base 101 and the lid 102 are joined, and the air in the housing portion 106 is extracted from the hole of the sealing portion 104 to reduce the pressure, and the hole is brazed (sealing material). It is done in a way to close with. Thereby, the physical quantity detection sensor 20 is depressurized and sealed in the airtight container 106. Note that the inside of the housing portion 106 may be filled with an inert gas such as nitrogen, helium, or argon. The physical quantity detection device 1 has the pressure-sensitive element portion 22 provided on the lid 102 side with respect to the base portion 21, but a configuration in which the pressure detection element portion 22 is provided on the package base 101 side with respect to the base portion 21 is also considered. It is done. Further, the package base 101 may be formed in a concave shape, and the lid 102 may be a flat plate.
(Physical quantity detection sensor)

  Next, the physical quantity detection sensor 20 will be described with reference to FIG. 2 in addition to FIG. FIG. 2 is a perspective view showing the configuration of the physical quantity detection sensor, and is a perspective view of the physical quantity detection sensor 20 provided in the physical quantity detection device 1 of FIG.

  The physical quantity detection sensor 20 includes a base portion 21 fixed to the package base 101 and a pressure-sensitive element portion 22 that is fixed to the base portion 21 and detects a physical quantity such as acceleration. The base portion 21 is formed from a quartz plate by etching or the like, and has a plate-like form located along the xy plane. The base portion 21 includes a fixed portion 211 (211a to 211f) having a substantially quadrangular ring shape in plan view, and a movable portion 212 (212a and 212b) disposed on the inner side (inside the ring shape) of the fixed portion 211. ), And a joint portion 213 that connects the fixed portion 211 and the movable portion 212.

  The fixed portion 211 includes a ring-shaped frame portion 211a along the x-axis and the y-axis, and an element mounting portion 211b protruding outward from the center of one frame portion 211a along the x-axis along the y-axis. An arm portion 211c that branches off from one frame portion 211a along the y-axis and extends in an L shape along the outer periphery of the frame portion 211a to the vicinity of the element mounting portion 211b, and the other frame along the y-axis An arm portion 211d that branches off from the portion 211a and extends in an L shape along the outer periphery of the frame portion 211a to the vicinity of the element mounting portion 211b and a frame portion that branches off from one end of the other frame portion 211a along the x-axis An arm part 211e extending in an L shape along the outer periphery of the arm part 211d to the vicinity of the branch of the arm part 211d, and an arm branching from the other end of the other frame part 211a along the x axis and extending along the outer periphery of the frame part 211a An arm extending in an L shape to the vicinity of the branch of the portion 211c And 211f, the has.

  The arm portions 211c, 211d, 211e, and 211f are portions for fixing the base portion 21 to the package base 101, and the tip portion of the arm portion 211c is a stepped portion 103a via a support portion 217 (217a) (FIG. 1). The tip of the arm 211d is fixed to the step 103a via the support 217 (217b), and the tip of the arm 211e is fixed to the step 103b via the support 217 (217c). The distal end portion of the arm portion 211f is fixed to the step portion 103c via the support portion 217 (217d). In this case, the support portion 217 is an adhesive, and fixes the entire fixing portion 211 to the step portion 103 with a predetermined gap therebetween via the arm portions 211c, 211d, 211e, and 211f.

  The movable part 212 is surrounded by the frame part 211a and is connected via a joint part 213 to the frame part 211a in which the element mounting part 211b is formed. That is, the movable part 212 is cantilevered by the frame part 211a by the joint part 213. The movable portion 212 extends in the direction opposite to the joint portion 213 along the y axis, and is provided on both sides of the element placement portion 212a and extends along the y axis. Mass body placing portions 212b and 212b.

  The two mass body mounting portions 212b and 212b of the movable portion 212 are respectively provided with mass bodies 215 serving as weights. The mass body 215 is provided on a surface opposite to the main surface so as to overlap the mass body 215a provided on the main surface side of the one mass body mounting portion 212b and the mass body 215a in plan view. The mass body 215c, the mass body 215b provided on the main surface side of the other mass body mounting portion 212b, and the mass body 215b are provided on the surface opposite to the main surface so as to overlap with the mass body 215b in plan view. A mass body 215d. These mass bodies 215 are fixed to the movable portion 212 via the bonding portion 216. In this case, the bonding portion 216 is an adhesive provided at the center of gravity of the mass body 215, and The movable part 212 is fixed with a predetermined gap.

  The joint portion 213 is provided between the fixed portion 211 and the movable portion 212, and connects the fixed portion 211 and the movable portion 212. In this case, the joint portion 213 is set to have a width in the x-axis direction smaller than a width of the movable portion 212 in the x-axis direction. Further, the movable portion 212 and the joint portion 213 are arranged such that the center lines orthogonal to the respective width directions coincide with each other.

  The pressure-sensitive element unit 22 is fixed to the element mounting unit 211b of the fixed unit 211 with the bonding material 223 and the base unit 221a fixed to the element mounting unit 212a of the movable unit 212 with the bonding material 223. The other base 221b, and the vibrating beam portions (vibrating arms) 222 (222a, 222b) for detecting a physical quantity between the base 221a and the base 221b. That is, the pressure-sensitive element part 22 is connected to the fixed part 211 and the movable part 212 and is disposed so as to straddle the joint part 213. In this case, the vibrating beam portion 222 has a prismatic shape, and when a drive signal (AC voltage) is applied to excitation electrodes (not shown) provided in the vibrating beam portions 222a and 222b, x Bending vibration is performed along the axis so as to be separated from or close to each other. The excitation electrode is electrically connected to the external terminal 107 by a wiring (not shown) for applying a drive signal.

  The pressure-sensitive element portion 22 is formed by patterning a quartz substrate cut out at a predetermined angle from a quartz crystal or the like by a photolithography technique and an etching technique. As described above, it is preferable to form the pressure-sensitive element portion 22 with quartz that is the same material as the base portion 21 because the difference in linear expansion coefficient between the pressure-sensitive element portion 22 and the base portion 21 can be reduced. This is also true when the pressure-sensitive element portion 22 and the base portion 21 are formed of a material other than quartz.

  Further, in one frame portion 211a along the y-axis, a thick portion 218 (218b) also shown in FIG. 1 is fixed with a bonding material 223 at a portion located between the joint portion 213 and the arm portion 211c. In the other frame portion 211a along the y-axis, a thick portion 218 (218a) is fixed with a bonding material 223 at a portion located between the joint portion 213 and the arm portion 211d. In this case, the bonding material 223 is a low-melting glass.

  Next, the operation of the physical quantity detection sensor 20 will be described. 3A and 3B are cross-sectional views showing the operation of the physical quantity detection sensor. 3A and 3B, the thick portion 218 is omitted. As shown in FIG. 3A, when acceleration, which is a physical quantity, is applied to the physical quantity detection sensor 20, for example, in the direction of the arrow α1 in the + z direction, a force is applied to the movable part 212 in the −z direction so that the movable part 212 is movable. The part 212 is displaced in the −z direction with the joint part 213 as a fulcrum. As a result, a force in a direction in which the base portion 221a and the base portion 221b are separated from each other along the y-axis is applied to the pressure sensitive element portion 22, and a tensile stress is generated in the vibration beam portion 222 of the pressure sensitive element portion 22. Therefore, the resonance frequency, which is the frequency at which the vibrating beam portion 222 vibrates, increases.

  On the other hand, as shown in FIG. 3B, when an acceleration is applied to the physical quantity detection sensor 20, for example, in the direction of the arrow α2 in the −z direction, a force acts on the movable portion 212 in the + z direction. 212 is displaced in the + z direction with the joint portion 213 as a fulcrum. As a result, a force in a direction in which the base portion 221a and the base portion 221b approach each other along the y-axis is applied to the pressure sensitive element portion 22, and a compressive stress is generated in the vibrating beam portion 222 of the pressure sensitive element portion 22. Therefore, the resonance frequency of the vibrating beam portion 222 is lowered.

  The physical quantity detection sensor 20 detects the change in the resonance frequency of the pressure-sensitive element unit 22 as described above. That is, the acceleration applied to the physical quantity detection sensor 20 is derived by converting it into a numerical value determined by a look-up table or the like in accordance with the detected change rate of the resonance frequency.

The physical quantity detection sensor 20 can be used as an inclination sensor in addition to the acceleration sensor described above. In the physical quantity detection sensor 20 as the tilt sensor, the movable portion 212 bends due to a change in the direction in which the gravitational acceleration is applied to the physical quantity detection sensor 20 according to the change in posture due to the tilt, and the vibration beam portion 222 of the pressure-sensitive element portion 22. Tensile stress or compressive stress is generated in the substrate. Then, the resonance frequency of the vibrating beam portion 222 changes, and the posture state due to the inclination is derived based on the change.
(Physical quantity detection sensor manufacturing method)

  Next, a method for manufacturing the physical quantity detection sensor 20 will be described. FIG. 4 is a flowchart showing a method for manufacturing the physical quantity detection sensor. FIG. 5A is a plan view showing the form of the base portion, and FIG. 5B is a plan view showing the form of the element piece. FIG. 6 is a perspective view showing a method for joining the base portion and the element piece, and FIG. 7 is a perspective view showing a method for removing the connection portion.

  First, in step S1, a base portion and an element piece are prepared. As shown in FIG. 5A, the base portion 21 includes a fixed portion 211, a movable portion 212, and a joint portion 213. Further, as shown in FIG. 5B, the element piece 30 sandwiches the pressure-sensitive element part 22 and the pressure-sensitive element part 22 having the base part 221a and the base part 221b arranged along the y-axis. As described above, the joint portion 31a and the joint portion 31b disposed at symmetrical positions in the x-axis direction with respect to the pressure-sensitive element portion 22 and the one end portion of the base portion 221a extend in the x-axis direction and L in the y-axis direction. It bends in the shape of a letter and is connected to the joint 31a, and further extends from the other end of the base 221a in the x-axis direction to the connection 32a extending to the removal end 33a along the y-axis. A connecting portion 32b that is bent in an L-shape in the axial direction and connected to the joint portion 31b, and extends to the removal end portion 33b along the y-axis. In this case, the removal end portions 33a and 33b are provided at symmetrical positions in the x-axis direction with respect to the base portion 221b. Further, the bonding material 223 is provided on the side of the bases 221a and 221b and the surfaces of the bonding portions 31a and 31b facing the base portion 21. This process S1 corresponds to the process to prepare. After the preparation of the base portion and the element piece is completed, the process proceeds to step S2.

  In step S2, the base part is positioned and arranged with an abutting jig. In this arrangement, the base portion 21 is placed on the abutting jig 40 as shown in FIG. The abutting jig 40 has a rectangular shape larger than the base portion 21 in a plan view, and a protruding guide portion 41 extending in an L shape along one of the corners along the x-axis and the y-axis. And a protruding guide portion 42 provided along the x-axis at a position away from the guide portion 41 in the x-axis direction. The base portion 21 is placed on the abutting jig 40 by abutting the arm portion 211c against the guide portion 42 while abutting the L-shaped portion of the arm portion 211d along the guide portion 41. Thereby, it mounts in the state in which the base part 21 was positioned with respect to the abutting jig 40. After placing the base portion 21, the process proceeds to step S3.

  In step S3, the element piece is placed on the base portion. As shown in FIG. 6, the element pieces 30 are arranged so that the L-shaped portion of the connection portion 32 a is abutted along the guide portion 41 while the connection portion 32 b is abutted against the guide portion 42 and overlapped with the base portion 21. . Thereby, one base 221 a of the pressure-sensitive element part 22 is arranged on the element mounting part 211 b of the base part 21, and the other base part 221 b is arranged on the element mounting part 212 a of the movable part 212. Further, the joint portion 31a of the element piece 30 is disposed at a portion located between the joint portion 213 and the arm portion 211d of the frame portion 211a, and the joint portion 31b is formed by connecting the joint portion 213 and the arm portion 211c of the frame portion 211a. It arrange | positions in the site | part located between. Thus, the element piece 30 is positioned and arranged on the base portion 21 by the abutting jig 40. After the positioning and arrangement of the element piece 30, the process proceeds to step S4.

  In step S4, a weight is placed on the element piece and pressed toward the base portion. That is, with respect to the base part 21 and the element piece 30 that are respectively positioned and arranged on the abutting jig 40, the element piece 30 is pressed against the base part 21 with substantially equal pressure. A flat plate-like weight 50 is placed on the element piece 30. These processes S2, S3, and S4 correspond to the process of arranging. After pressing by the weight 50, the process proceeds to step S5.

  In step S5, the base portion 21 and the element piece 30 are heated and joined. When the base portion 21 and the element piece 30 are heated, the bonding material 223 provided on the side of the base portions 221a and 221b and the bonding portions 31a and 31b facing the base portion 21 is melted, and the base portion 21 and the element piece 30 Join. In this case, the base portion 21 and the element piece 30 are positioned in the x-axis direction and the y-axis direction at two locations of the base portions 221a and 221b and two locations of the joint portions 31a and 31b, for a total of four locations. Is joined to the correct placement. This process S5 corresponds to the process of joining. It progresses to process S6 after joining.

  In step S6, the connecting portion is removed. FIG. 7 shows a state where the connection portion 32a is removed, while the connection portion 32b is in a state before removal. As shown in FIG. 7, the connection portion 32a is removed by first inserting a blade-shaped tool between the removal end portion 33a and the frame portion 211a to separate the removal end portion 33a from the frame portion 211a. The connection portion 32a connected to the removal end portion 33a is separated from the frame portion 211a. Thereby, the joining part 31a joined to the frame part 211a is cut off from the connection part 32a and remains on the frame part 211a side, and functions as the thick part 218a. Further, when the connection portion 32a is moved away from the frame portion 211a, the connection portion 32a is also disconnected from the base portion 221a, and the removal is completed. The connection portion 32b is removed in the same manner as the connection portion 32a, and the connection portion 32b is disconnected from the joint portion 31b and the base portion 221a to complete the removal. The joining portion 31b remaining on the frame portion 211a side functions as the thick portion 218b (FIGS. 1 and 2). Here, the setting is such that the connection portions 32a and 32b are completely removed. This step S6 corresponds to a removing step. Thus, the flow relating to the manufacturing method of the physical quantity detection sensor 20 is completed.

  Here, the characteristics of the manufacturing method of the physical quantity detection sensor 20 as described above will be described together. In the manufacturing method of the physical quantity detection sensor 20, the element piece 30 includes two joint portions 31a and 31b that are arranged symmetrically with respect to the pressure sensitive element portion 22 and are connected to the pressure sensitive element portion 22 and the connection portions 32a and 32b. Have. When this element piece 30 is joined to the base portion 21, the pressure-sensitive element portion is suppressed in a state in which the inclination in the direction orthogonal to the direction connecting the two base portions 221a and 221b, that is, rotation around the y-axis (FIG. 7), is suppressed. 22 can be fixed. Accordingly, the pressure-sensitive element portion 22 has a substantially parallel interval in all directions with respect to the base portion 21 together with the state in which the inclination in the direction connecting the two base portions 221a and 221b is suppressed. It is held and securely arranged at a predetermined position even in plan view. In addition, after the connection portions 32a and 32b are removed, the joint portions 31a and 31b remaining on the base portion 21 serve as thick portions 218a and 218b to suppress unnecessary vibrations and the like other than operations such as bending of the movable portion 212. Work. The physical quantity detection sensor 20 manufactured in this way is a sensor with high detection performance that allows the movable part 212 to operate accurately according to the physical quantity and the pressure-sensitive element part 22 to detect the operation.

In addition, according to the physical quantity detection device 1 in which the physical quantity detection sensor 20 is housed in a package, the physical quantity can be detected while suppressing the influence of disturbance factors such as the atmosphere and temperature outside the package 10, and is stable as a detection sensor. Detection performance can be maintained.
(Embodiment 2)

  Next, another preferred example in the method for manufacturing the physical quantity detection sensor 20 will be described. FIG. 8 is a plan view showing the form of the element piece in the second embodiment. In the manufacturing method of the physical quantity detection sensor in the second embodiment, the element piece 30A is different from the element piece 30 in the first embodiment. Therefore, the portions other than the different portions are described with the same reference numerals as the element pieces 30.

  As shown in FIG. 8, the element piece 30 </ b> A includes a base 221 a and a base 221 b disposed along the y-axis, a pressure-sensitive element 22 having a base 221 a, and a base 221 b. The joint part 31a and the joint part 31b arranged at symmetrical positions, and extends from one end of the base part 221a in the x-axis direction, bends in an L-shape in the y-axis direction, and is connected to the joint part 31a. A connection portion 32a extending along the axis to the removal end portion 33a, and a connection portion 32c extending from the removal end portion 33a in the x-axis direction and connecting the removal end portion 33a and the base portion 221b. ,have. The element piece 30A extends from the other end of the base portion 221a in the x-axis direction, is bent in an L shape in the y-axis direction, is connected to the joining portion 31b, and is further removed along the y-axis 33b. And a connection portion 32d extending from the removal end portion 33b in the x-axis direction and connecting the removal end portion 33b and the base portion 221b. In this case, the removal end portions 33a and 33b are provided at symmetrical positions in the x-axis direction with respect to the base portion 221b. Further, the bonding material 223 is provided on the side of the bases 221a and 221b and the surfaces of the bonding portions 31a and 31b facing the base portion 21. That is, the element piece 30 </ b> A has a configuration in which the connection part 32 c and the connection part 32 d are added to the element piece 30.

As described above, the element piece 30A includes the connection part 32c and the connection part 32d in addition to the connection part 32a and the connection part 32b. In addition to the connecting portions 32a and 32b, the places are also connected by the connecting portions 32c and 32d, and are joined to the base portion 21 in a state where distortion and the like are restricted. As a result, the bases 221a and 221b of the pressure-sensitive element part 22 are more reliably restrained from tilting than the case of the element piece 30 with respect to the base part 21, and are joined to a more accurate position. A physical quantity detection sensor (not shown) manufactured by preparing the element piece 30A is a sensor with high detection performance that can detect the physical quantity more precisely.
(Electronics)

  Next, an electronic device using the physical quantity detection sensor 20 will be described. FIG. 9A is a perspective view showing a video camera equipped with a physical quantity detection sensor, and FIG. 9B is a perspective view showing a mobile phone equipped with a physical quantity detection sensor. The video camera 500 and the mobile phone 600 as these electronic devices are equipped with the physical quantity detection sensor 20 according to the present invention. First, the video camera 500 shown in FIG. 9A includes an image receiving unit 501, an operation unit 502, an audio input unit 503, and a display unit 504. The video camera 500 includes a physical quantity detection sensor 20. For example, if the three physical quantity detection sensors 20 are provided, the video camera 500 detects acceleration in three directions of the X axis, the Y axis, and the Z axis (not shown). The function of correcting camera shake and the like can be exhibited. Thereby, the video camera 500 can record a clear moving image.

A cellular phone 600 shown in FIG. 9B includes a plurality of operation buttons 601, a display unit 602, a camera mechanism 603, and a shutter button 604, and functions as a telephone and a camera. The mobile phone 600 includes a physical quantity detection sensor 20. For example, if the mobile phone 600 includes three physical quantity detection sensors 20, the mobile phone 600 detects acceleration in three directions of the X axis, the Y axis, and the Z axis (not shown). Thus, the function of correcting camera shake or the like of the camera mechanism 603 can be exhibited. Thereby, the mobile phone 600 can record a clear image by the camera mechanism 603.
(Moving body)

  Next, a moving body using the physical quantity detection sensor 20 will be described. FIG. 9C is a perspective view showing a moving body equipped with a physical quantity detection sensor. As shown in FIG. 9C, the moving body 700 in this case is an automobile and is provided with a physical quantity detection sensor 20. In the moving body 700, the physical quantity detection sensor 20 is built in an electronic control unit (ECU) 703 mounted on the vehicle body 701. The electronic control unit 703, for example, detects the state of the vehicle body 701 as an accelerometer or an inclinometer by the physical quantity detection sensor 20, and grasps the posture, movement status, etc. of the moving body 700 and accurately controls the tire 702 and the like. It can be carried out. Thereby, the moving body 700 can move safely and stably.

  The manufacturing method of the physical quantity detection sensor, the physical quantity detection sensor, the physical quantity detection device, the electronic device, and the moving body described above are not limited to the forms in each embodiment, and are in forms such as the following modifications. Also, the same effect as the embodiment can be obtained.

  (Modification 1) In step S1 (preparing step) of the manufacturing method of the physical quantity detection sensor 20, two joint portions 31 (joint portions 31a and 31b) of the element piece 30 are provided. Is not to be done. For example, the element piece 30 may have one or three or more joint portions 31. In that case, it is preferable that the joint portion 31 is arranged in a balanced manner with respect to the pressure-sensitive element portion 22 in each of the x-axis direction and the y-axis direction.

  (Modification 2) The bonding material 223 is provided in advance on the base portions 221a and 221b and the bonding portions 31a and 31b of the element piece 30, but the part side of the base portion 21 facing the base portions 221a and 221b and the bonding portions 31a and 31b. The setting may be provided. In addition, in the base portions 221a and 221b, the bonding material 223 is provided on the element piece 30 side, and in the bonding portions 31a and 31b, the bonding material 223 is provided on the base portion 21 side, and bonding is performed on both sides of the element piece 30 and the base portion 21. The setting etc. which provide the material 223 may be sufficient.

  (Modification 3) In steps S2, S3, and S4 (placement step), the base portion 21 and the element piece 30 are aligned with the outermost shapes by the guide portions 41 and 42 of the abutting jig 40, respectively. However, the guide portion may be in the form of a pin or the like, and the base portion 21 and the element piece 30 may be aligned at an arbitrary position. Further, the base portion 21 and the element piece 30 may be aligned while recognizing an image with a robot hand or the like without using the abutting jig 40. According to this, it is possible to quickly cope with the shape change of the base portion 21 and the element piece 30.

  (Modification 4) In step S6 (removing step), the connection portion 32 of the element piece 30 is completely removed. However, for example, it may be set so that a predetermined shape remains in the joint portion 31. According to this, even if the area where the bonding material 223 is provided is small, the bonding portion 31 having a sufficient mass can be left as the thick portion 218.

(Modification 5) The material of the element piece 30 including the pressure-sensitive element portion 22 is, for example, lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), niobium in addition to the crystal described above. Piezoelectric materials such as lithium oxide (LiNbO ₃ ), lead zirconate titanate (PZT), zinc oxide (ZnO), and aluminum nitride (AlN) can be used. In addition, the element piece 30 may be made of a non-piezoelectric material such as silicon or germanium as long as the pressure-sensitive element portion 22 includes a piezoelectric material film.

  (Modification 6) In addition to the video camera 500, the mobile phone 600, and the moving body 700, the physical quantity detection sensor 20 includes, for example, an ink jet ejection device (for example, an ink jet printer), a laptop personal computer, a television, a video camera, Car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical devices (eg electronic thermometers, blood pressure) Applicable to meter, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring instruments, instruments (eg, vehicle, aircraft, ship instruments), flight simulator, etc. Can do. The present invention can also be applied to an oscillator that uses the physical quantity detection sensor 20 as an oscillation source.

  DESCRIPTION OF SYMBOLS 1 ... Physical quantity detection apparatus, 10 ... Package, 20 ... Physical quantity detection sensor, 21 ... Base part, 22 ... Pressure-sensitive element part, 30 ... Element piece, 31 ... Joint part, 32 ... Connection part, 40 ... Butting jig | tool, 41, 42 ... guide portion, 211 ... fixed portion, 211a ... frame portion, 212 ... movable portion, 213 ... joint portion, 218 ... thick portion, 221 ... base portion, 222 ... vibrating beam portion as a vibrating arm, 223 ... joint Material (low melting glass).

Claims (10)

The movable portion, the fixed portion comprising a frame portion disposed along said movable portion, and a base portion having a joint portion, which is connected to the fixed portion and said movable portion, disposed between the two bases A pressure sensitive element portion having a vibrating arm, a connection portion connected to at least one of the two base portions, and a joint portion connected to the connection portion , and a bonding material, A process to prepare;
The element piece is disposed on the base portion so that one of the two base portions of the pressure-sensitive element portion overlaps the fixed portion, the other overlaps the movable portion, and the joining portion overlaps the frame portion. And a process of
Joining the one of the two bases to the fixed part, the other to the movable part, and the joining part to the frame part via the joining material;
Removing the connecting portion;
A method of manufacturing a physical quantity detection sensor comprising: 2. The method of manufacturing a physical quantity detection sensor according to claim 1, wherein, in the preparing step, the element piece includes two joint portions arranged at positions sandwiching the pressure-sensitive element portion.   The method for manufacturing a physical quantity detection sensor according to claim 1, wherein, in the preparing step, the bonding material is glass.   4. The method of manufacturing a physical quantity detection sensor according to claim 1, wherein in the preparing step, the pressure-sensitive element portion and the base portion are made of the same material. 5. In the step of the arrangement, it is brought into contact with the base portion and the element piece in a jig abutting the positioning of the element pieces and the base portion, any one of claims 1 to 4, characterized in that one The manufacturing method of the physical quantity detection sensor of description. Movable portion, a base portion having a fixed portion comprising a frame portion disposed along said movable portion has a thick portion, and a joint portion, which connects the said fixed part and said movable part,
A pressure-sensitive element portion having two base portions, one of which is joined to the fixed portion and the other of which is joined to the movable portion , and a vibrating arm disposed between the two base portions. A physical quantity detection sensor. The physical quantity detection sensor according to claim 6, wherein the thick portion is bonded by a bonding material and includes a portion made of the same material as the pressure-sensitive element portion . The physical quantity detection sensor according to claim 6 or 7,
A physical quantity detection device comprising: a package for housing the physical quantity detection sensor.   An electronic apparatus comprising the physical quantity detection sensor according to claim 6.   A moving body comprising the physical quantity detection sensor according to claim 6.

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