JP6097008B2 - Washing water supply device and method - Google Patents

Description

  The present invention relates to a cleaning water supply device and a supply method, and more particularly, to a cleaning water supply device and a supply method for supplying cleaning water to a workpiece (object to be cleaned) after cutting.

  2. Description of the Related Art Conventionally, a dicing apparatus that performs cutting and grooving processing on a workpiece such as a wafer on which a semiconductor device or an electronic component is formed has at least a blade that is rotated at high speed by a spindle, and the workpiece is supported and fixed (suction-held) And X, Y, Z, and θ movement axes that change the relative positions of the work table and the blade. When machining a workpiece, the workpiece is machined by the movement of each moving shaft while supplying cutting water from the nozzle to the blade and the workpiece machining point.

Particles (contamination, contaminants) such as grinding scraps are generated by cutting on the workpiece cut by the dicing machine. A part of the particles are not flowed even when cutting water or the like is sprayed, but stays on the work as it is, resulting in quality deterioration. Therefore, the workpiece after cutting is generally cleaned by a spin cleaning device .

  Alternatively, the workpiece is moved manually to a spin cleaning device to clean the workpiece.

  The spin cleaning apparatus includes a rotary table on which a work is placed and fixed (adsorbed and held), a nozzle that jets cleaning water such as pure water onto the work surface, and the like. In this spin cleaning apparatus, the workpiece is cleaned with the cleaning water sprayed from the nozzle while rotating together with the rotary table (see Patent Documents 1 and 2).

JP 2010-010267 A JP 2007-194367 A

  However, when pure water with poor repellency is supplied as it is to the workpiece as cleaning water, it is possible to effectively remove particles larger than a predetermined size, but it can be as fine as several μm to several tens of μm. It is impossible to remove particles such as swarf. As a result, there have been problems that the wafer is damaged by long-time cleaning or the like, or the device is electrostatically destroyed to deteriorate the cleaning quality and reliability.

  In particular, in recent years, with the high integration of silicon devices, there has been a demand for improved cleaning quality for workpieces after cutting. Especially for fine particles adhering to the surface of workpieces after cutting. How to remove it effectively is a big issue.

  Therefore, in view of the above circumstances, the present invention is a solution to improve the cleaning quality by effectively removing the deposits on the workpiece surface without damaging the workpiece after cutting, without destroying the device electrostatically. The technical problem which should arise arises, and this invention aims at solving this subject.

The present invention has been proposed to achieve the above object, and the invention according to claim 1 supplies the cleaning water discharged from the nozzle to the workpiece after cutting fixed on the workpiece support. In the cleaning water supply apparatus, the water supply pipe connected to the nozzle is connected to a micro / nano bubble generator for generating micro / nano bubbles in pure water, and the tip of the nozzle is disposed in the vicinity of the part to be cleaned of the workpiece. A mesh-like net is attached to the tip of the nozzle, and configured to supply cleaning water containing micro-nano bubbles divided by the net to the part to be cleaned of the work, in the vicinity of the discharge port of the nozzle, A cleaning water supply device is provided, wherein a pressure maintaining valve is provided to maintain a pressure supersaturation state of the micro-nano bubbles by maintaining a water pressure of the cleaning water.

According to this configuration, the cleaning water containing the micro / nano bubbles is supplied from a very short distance to the part to be cleaned during cleaning. Since the micro-nano bubbles have a very small bubble diameter of several nanometers to several tens of micrometers, they have a high adsorption action and water surface floating action even for fine particles of several nanometers to several tens of micrometers. Therefore, even if fine particles adhere to the workpiece surface, the fine particles are effectively separated and removed from the workpiece surface. Further, since the net divides bubbles of several + μm into bubbles of several μm, bubbles of several μm are stably generated.

Moreover, the water pressure of the washing water is maintained by a pressure maintaining valve provided in the vicinity of the discharge port of the nozzle. Therefore, since the micro / nano bubbles generated by the micro / nano bubble generator are maintained in a pressurized supersaturated state, a large amount of gas components are confined in small bubbles.

The invention according to claim 2 is configured such that the cross-sectional area of the pressure maintaining valve is smaller than the cross-sectional area of the discharge port of the nozzle, and the water pressure of the pressure maintaining valve is higher than the water pressure of the nozzle. The apparatus for supplying washing water according to claim 1 is provided.

  According to this configuration, since the water pressure of the pressure maintaining valve is higher than the water pressure of the nozzle, when the cleaning water is discharged from the nozzle, the pressure of the cleaning water decreases rapidly, and the gas solubility suddenly increases. Due to the decrease, the solute in the pressure supersaturated state precipitates at a stretch.

According to a third aspect of the present invention, there is provided a cleaning water supply method for supplying cleaning water discharged from a nozzle to a workpiece after cutting fixed on a workpiece support. During washing, cleaning water containing micro-nano bubbles divided by a mesh-like net attached to the nozzle tip is maintained from the nozzle while maintaining the pressurized supersaturated state of the micro-nano bubbles. A cleaning water supply method is provided, characterized in that the cleaning water is supplied to a portion to be cleaned from a short distance.

According to this method, during cleaning, cleaning water containing micro-nano bubbles is supplied from a nozzle to a portion to be cleaned of a workpiece from a very short distance. In this case, since the bubble diameter of the micro / nano bubble is as small as several nanometers to several tens of micrometers, it has a high adsorption action and water surface floating action even for fine particles. Therefore, even if fine particles adhere to the workpiece surface, the fine particles are effectively separated and removed from the workpiece surface. Further, since the net divides bubbles of several + μm into bubbles of several μm, bubbles of several μm are stably generated. Furthermore, by maintaining a good pressure supersaturation state of the micro / nano bubbles generated by the micro / nano bubble generator, a large amount of gas components are confined in small bubbles, adsorbing action on particles, surface floating action and electrostatic attraction. The action as well as the cavitation action are increased.

Invention according to claim 4, wherein said workpiece is fixed on a rotating table, the washing water according to claim 3, wherein the cleaning the workpiece while the nozzle is scanned radially outward from a center of the rotary table A supply method is provided.

  According to this method, when the workpiece is cleaned with the cleaning water discharged from the nozzle, the nozzle moves radially outward from the center of the rotary table. Therefore, the entire surface of the workpiece is thoroughly cleaned.

According to the first aspect of the present invention, even if fine particles are adhered to the surface of the workpiece by the cleaning water containing micro-nano bubbles, the particles can be effectively separated and removed from the surface of the workpiece. Can be improved. Further, it is possible to stably generate bubbles of several μm by dividing bubbles of several + μm into bubbles of several μm using a net.

  In addition, because the zeta potential generated in the bubble and the generation of free radicals when the bubble disappears, the bubble surface is charged to a negative potential and charged to a negative charge. Also increases.

Also, to maintain pressurization process saturation micro-nano bubbles, since a large amount of gas components in a small bubble is trapped, adsorbed effect on fine fine a particle, a water surface floating action and electrostatic attractive force acting large high concentrations of Micro-nano bubbles can be easily and stably produced.

In the invention according to claim 2, when washing water is discharged from the nozzle, the solute in the pressure supersaturated state precipitates at a stretch due to a rapid decrease in gas solubility, and a higher concentration of micro-nano bubbles is generated. In addition to the effect of the invention of claim 1 , the adsorption action on the particles, the water surface floating action and the electrostatic attraction force action and the cavitation action are synergistically promoted, and the concentration of micro-nano bubbles can be further increased. The effect of removing / suppressing particles is further enhanced. Moreover, the straightness of the cutting water discharged from the nozzle is improved by attaching a pressure maintaining valve having a small cross-sectional area in the vicinity of the discharge port portion of the nozzle.

The invention according to claim 3 is capable of effectively separating and removing particles from the work surface even if fine particles are adhered to the work surface by the washing water containing micro-nano bubbles. Can be improved. Further, it is possible to stably generate bubbles of several μm by dividing bubbles of several + μm into bubbles of several μm using a net. Furthermore, by maintaining a good pressure supersaturation state of the micro / nano bubbles generated by the micro / nano bubble generator, a large amount of gas components are confined in small bubbles, adsorbing action on particles, surface floating action and electrostatic attraction. The action as well as the cavitation action are increased.

  Also, due to the zeta potential generated on the bubble surface, the bubble surface is charged to a minus potential, and the reaction and decomposition of radicals generated when the bubble disappears, the bubble surface is charged to a minus potential (about −30 mV to −40 mV). Thus, since the negative charge is charged, the effect of removing the deposit is increased from the viewpoint of electrostatic action.

Invention of claim 4, wherein, the nozzle that is scanned radially outward from the center of the rotary table, the entire surface of the workpiece is cleaned without thoroughly, in addition to the effect of the invention of claim 3, wherein, work Even if it has a micro uneven surface, it is possible to more efficiently remove deposits on the entire surface to be cleaned of the workpiece including the micro uneven surface.

1 is a perspective view of a dicing apparatus to which an embodiment of the present invention is applied. The perspective view explaining the process part of the dicing apparatus of FIG. The perspective view explaining the supply device of washing water concerning one example. Explanatory drawing explaining the installation example of the micro nano bubble generator connected to the washing water nozzle. An explanatory diagram for explaining an example of attaching a pressure maintaining valve to a washing water nozzle, (a) an explanatory diagram of a bubbling nozzle, and (b) an explanatory diagram of a rinse nozzle. The state of the ion and electric potential in the gas-liquid interface of a micro nano bubble is shown, (a) is explanatory drawing explaining ion distribution, (b) is explanatory drawing explaining electric potential change. The graph explaining the zeta potential of the micro-nano bubble in distilled water. The graph explaining the rise of the zeta potential of micro-nano bubbles and the generation of free radicals. The graph explaining the zeta potential of micro nano bubble, and pH.

The present invention achieves the purpose of effectively removing the deposits on the workpiece surface and improving the cleaning quality without damaging the workpiece after cutting. In the cleaning water supply apparatus for supplying the cleaning water discharged from the nozzle to the workpiece, a water supply pipe connected to the nozzle is connected to a micro / nano bubble generator for generating micro / nano bubbles in pure water, The tip is arranged in the vicinity of the part to be cleaned of the workpiece, and a mesh-like net is attached to the tip of the nozzle, so that cleaning water containing micro-nano bubbles divided by the net can be supplied to the part to be cleaned of the workpiece and, the discharge port portion near the nozzle, to a pressure-maintaining valve maintains a pressurizing process saturation of the holding water pressure of the washing water micro-nano bubbles provided Ri was achieved.

  In the present invention, the cleaning water is supplied into the water supply pipe from the cleaning water supply source, and the cleaning water is sprayed from the nozzle onto the portion to be cleaned of the workpiece, but the cleaning water contains micro / nano bubbles by the micro / nano bubble generator. The surface area is increased, the surface tension of the washing water is lowered, and the washing water coverage is improved. Thereby, the cleaning water can penetrate into the details of the portion to be cleaned of the workpiece, promotes the detaching action for fine particles during cleaning, and improves the cleaning capability on the workpiece surface.

In addition, since cleaning water containing micro-nano bubbles is supplied to a portion to be cleaned from a close distance, an adsorption surrounding effect, a water surface floating effect, a cavitation effect, and an electrical suction effect on fine particles are synergistically exhibited. As a result, the washing water penetrates further into the details of the workpiece and the washing ability is greatly improved. Furthermore, bubbles of several μm can be divided into bubbles of several μm with a net, and bubbles of several μm can be stably generated. Furthermore, by maintaining a good pressure supersaturation state of the micro / nano bubbles generated by the micro / nano bubble generator, a large amount of gas components are confined in small bubbles, adsorbing action on particles, surface floating action and electrostatic attraction. The action as well as the cavitation action are increased.

  A preferred embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view showing a dicing apparatus 10 according to the present embodiment. As shown in the figure, the dicing apparatus 10 mainly includes a supply / recovery unit 12 for supplying / recovering the wafer W, a processing unit 14 for processing the wafer W, and a cleaning unit 16 for cleaning the processed wafer W. , A transfer unit 18 for transferring the wafer W, an operation panel 20 for performing various operations, and a control unit 21 for controlling the overall operation.

  The supply / collection unit 12 includes a load port 22 in which a cassette in which a large number of wafers W are stored is set. The wafer W is stored in a cassette while being mounted on a predetermined frame (work support) F via a dicing tape T.

As shown in FIG. 2, the processing unit 14 includes a work table 24 that sucks and holds (places and fixes) the wafer W, a pair of blades 26A and 26B that cut the wafer W held on the work table 24, and a blade 26A. , 26B are attached to the spindles 28A, 28B and a camera unit ( not shown) for photographing the surface of the wafer W.

  The work table 24 is provided on the horizontal X-axis table 30 and the θ-axis table 38, is driven by the θ-axis table 38, and rotates around the central axis θ. The X-axis table 30 is driven by the linear motor 36 and slides on the X-axis guides 34 and 34 in the X direction.

  The blades 26A and 26B are attached to the tips of the spindles 28A and 28B so that the cutting direction is parallel to the moving direction X of the work table 24, and are driven and rotated by the spindles 28A and 28B. A cutting nozzle (not shown) is provided in the vicinity of the blades 26A and 26B, and cutting water is supplied from the cutting water nozzle to a processing point of the wafer W during the cutting process.

  The spindles 28A and 28B are arranged opposite to each other above the work table 24 so as to be orthogonal to the moving direction of the work table 24, and are rotated at a high speed of 6,000 rpm to 80,000 rpm.

  The spindles 28A and 28B are attached to the Z-axis tables 40A and 40B for blades installed vertically. The Z-axis tables 40A and 40B are slidably driven on Z-axis guides 44 and 44 provided on the blade Y-axis tables 42A and 42B, respectively. The Y-axis tables 42A and 42B are slidably driven on a pair of Y-axis guides 48 provided on the mounting surface 46a of the Y-axis base 46.

  Next, a dicing method will be described. When a cassette containing a large number of wafers W is placed on the load port 22, the wafers W are pulled out of the cassette by the transfer unit 18 and placed on the work table 24. Thereafter, the wafer W is sucked and held on the work table 24.

  Subsequently, the work table 24 moves to a position immediately below the camera unit 20, and when the alignment by the control unit 21 or the like is completed, the camera unit 20 is disposed above the Y-axis tables 42A and 42B. Next, after the precision alignment operation between the street and the blades 26A and 26B is performed, the blades 26A and 26B are cut and fed in the Z direction and rotated, and the work table 24 is moved in the cutting feed direction X. The wafer W is cut along the streets by the blades 26A and 26B (cutting process).

  Thereafter, the work table 24 is indexed and fed in the Y direction, and the cutting operation is performed again. When the cutting work is performed along all the streets, the work table 24 is rotated 90 degrees, and the cutting work is executed, whereby the wafer W is divided into individual chips.

  Then, the wafer W is transferred to the cleaning unit 16 by the transfer unit 18 including the handling robot 18A. The cleaning unit 16 includes a spin cleaning device 16A, and the wafer W is spin cleaned and dried by the spin cleaning device 16A. Thereafter, the wafer W is transferred to the temporary placement table 15 by the transfer unit 18 and stored in the cassette of the supply / recovery unit 12.

  Here, the spin cleaning device 16A will be described. The spin cleaning device 16A has a spin rotating unit 43 that rotates at a high speed from 100 rpm to 2500 rpm by a motor (not shown). A spinner suction disk 52 made of a porous material for adsorbing the portion of the wafer W adhered to the dicing tape T is provided on the upper portion of the spin rotating portion 43, and the portion of the frame F is further placed thereon. A spinner frame receiver 54 is provided.

  The dicing tape T to which the wafer is attached is made of vinyl chloride, polyolefin, pet material, etc., and it is easy to generate static electricity due to friction caused by rotation. The spinner suction disk 52 made of a porous material is made of ceramic and has electrical conductivity. The degree is low.

  In addition, the spinner frame receiver 54 is provided with centrifugal force clamps 56, 56,... That are rotatable about a rotation center 56A at four positions on the circumference so that the frame F can be fixed to the rotation. It has become. The centrifugal force clamper 56 has a clamp part 56B for fixing the frame F on the tip side, and a weight part 56C on the opposite side across the rotation center 56A. The centrifugal force clamper 56 is configured such that when the spinner table (rotary table) 59 rotates at a high speed, the weight portion 56C is lifted by the centrifugal force, and the frame F is fixed by the clamp portion 56B.

  Further, the spin cleaning device 16A is provided with a cleaning nozzle 41 that supplies cleaning water C from above the wafer W, and an arm 55 that supports the cleaning nozzle 41 is an arm that reciprocally rotates (swings) by a motor (not shown). The cleaning water C can be uniformly supplied to the upper surface of the wafer W by being connected to the rotating portion 47A.

  Next, the washing water supply system will be described in detail. As described above, the cleaning nozzle 41 is provided above the wafer W, and the tip of the cleaning nozzle 41 is arranged so that it can be set near the portion to be cleaned of the wafer W. A flexible water supply pipe 45 is connected to the cleaning nozzle 41. The water supply pipe 45 is connected to a cleaning water supply source 47 shown in FIG. 4, and the cleaning water supply source 47 includes a pure water tank and a pressure pump.

  Further, a micro / nano bubble generator 49 is connected in the middle of the water supply pipe 45. The micro / nano bubble generator 49 generates micro / nano bubbles B in pure water. As a result, during the cleaning, the cleaning water C including the micro / nano bubbles B is supplied to the cleaning nozzle 41 via the water supply pipe 45 and discharged toward the cleaned portion.

As shown in FIG. 5, a pressure maintaining valve 51, which is an electromagnetic valve, is provided at the discharge port on the distal end side of the cleaning nozzle 41. The pressure maintaining valve 51 holds the water pressure of the cleaning water C that passes through the water supply pipe 45 and the cleaning nozzle 41. The opening / closing operation of the pressure maintaining valve 51 is controlled by the control device 21. The cross-sectional area d of the outlet of the pressure maintaining valve 51 is smaller than the cross-sectional areas D1 and D2 on the inflow side and the discharge port side of the cleaning nozzle 41, and the water pressure of the pressure maintaining valve 51 is higher than the water pressure of the cleaning nozzle 41. Thus, the discharge pressure of the cleaning water from the pressure maintaining valve 51 is set higher than the discharge pressure of the cleaning water from the discharge port of the cutting water nozzle 41 . Since the cleaning water is injected from the high pressure side pressure maintenance valve 51 toward the discharge port of the low pressure side cutting nozzle 41, the jet of this cleaning water entrains the surrounding air, and the cutting water nozzle 41 and the pressure maintenance valve. Air flows into the gap with 51.

  As shown in FIGS. 6 to 8, the washing water C containing the micro-nano bubbles B has a zeta potential generated at the gas-liquid interface, and the generation of free radicals when the bubbles disappear, causing the bubble surface to be charged to a negative potential. The bubble interface is charged with a negative charge. Accordingly, even when the work support members such as the dicing tape T and the spinner suction disk 42 are positively charged, the negative charge and the positive charge are electrically neutralized, so that the removal / effect on the deposits on the wafer W is eliminated. However, the electrostatic charge increases significantly.

  FIG. 6 shows ion distribution and potential change at the gas-liquid interface of micro-nano bubbles B, and FIG. 7 shows generation of zeta potential of micro-nano bubbles B in distilled water. Further, FIG. 8 explains the relationship between the increase in the zeta potential of the micro-nano bubble B and the generation of free radicals. However, as the charge density in the bubbles increases in proportion to the disappearance number of the bubbles, the concentration is increased. An electric field of zeta potential is formed, and free radicals are generated due to this. The generated free radicals such as OH (hydroxyl radical) can decompose various chemical substances present in the aqueous solution and react with metal ions and the like.

  In addition, as shown in FIG. 9, the zeta potential of microbubbles tends to be strongly influenced by the pH of water. Alkaline has a value exceeding −100 mV, and when the acidic pH is 4 or less, the potential on the plus side is slightly positive. Show. The charge value can be changed to an arbitrary value depending on the pH of water.

  As shown in FIGS. 7, 8, and 9, when the bubble diameter is about 10 μm to about 30 μm with a liquid in the vicinity of pH 7, it is charged from about −30 mV to about −40 mV.

  In the present invention, the surface of the micro / nano bubble B is charged with a negative charge, so that fine particles P such as contaminants including cutting waste, ions (counter ions) having an electrolyte opposite to the bubbles and metal ions, and the like. It causes an action of attracting to the bubble surface by electrostatic attraction.

  Since the cleaning water C containing the micro / nano bubbles B is ionized, the surface tension of the liquid is lowered, the cleaning speed is improved, and the cleaning quality is improved. In addition, by controlling the charge value, there is an effect of improving electrostatic breakdown caused by bubbling cleaning or the like.

  In the cleaning water supply system, when the cleaning process is started, a valve opening command signal is transmitted from the control device 21 to the pressure maintaining valve 51, whereby the pressure maintaining valve 51 is opened. Is discharged from the washing water nozzle 41 at once. Therefore, the cleaning water C is supplied to the cleaned part of the wafer W, and the cleaned part is cleaned. During this cleaning, the cleaning nozzle 41 swings around the arm rotating portion 47A and is scanned outward in the radial direction of the wafer W, so that the entire surface of the wafer W is thoroughly cleaned.

  Here, since the cleaning water C contains the micro-nano bubbles B, a higher cleaning effect can be obtained as compared with the conventional cleaning using pure water alone. In particular, the pressure of the cleaning water C is maintained by the pressure maintaining valve 51 provided in the vicinity of the discharge port of the cleaning water nozzle 41. Therefore, the pressurized supersaturated state of the micro / nano bubbles B generated by the micro / nano bubble generator 49 is well maintained. Therefore, a large amount of gas components are confined in small bubbles. Thereby, the adsorption action with respect to the particle P, the water surface floating action, the electrostatic attraction force action, and the cavitation action are increased.

  Incidentally, in the present invention, the pressure supersaturation state of the micro / nano bubbles B can be maintained for about 100 seconds by providing the pressure maintaining valve 51. On the other hand, when the pressure maintaining valve 51 was not provided, the micro-nano bubble concentration was reduced, and the pressurized supersaturated state of the micro-nano bubble B disappeared in about 10 seconds.

  Actually, the wafer W was diced and cleaned using the micro-nano bubbles B. Table 1 shows the processing conditions.

  With the above processing conditions in common, the cleaning quality of the wafer W was evaluated in an example including the micro-nano bubble generator 49 of the present invention and a comparative example including a conventional two-fluid cleaning mechanism. As a result, in the comparative example, a certain amount of fine particles P of several μm to several tens of μm adhered to the surface of the wafer W, whereas in the example, there was almost no amount of adhesion.

Further, particles P remaining on the surface of the wafer W were counted in the example provided with the micro / nano bubble generator 49 and the comparative example not provided with the micro / nano bubble generator 49. Specifically, no bubbling + without rinsing + drying only, no bubbling + rinse (with) + Drying, bubbling (present) + no rinsing + drying, bubbling (present) + rinse (with) + dry each Evaluated on a case by case basis. As a result, the cleaning quality in the example was significantly improved as compared with the comparative example. Table 2 shows the results of cleaning quality.

  As described above, according to the present invention, the cleaning water containing the micro / nano bubbles generated by the micro / nano bubble generator is supplied to the object to be cleaned during the cleaning. And since the bubble diameter of this micro-nano bubble is as very small as several nanometers to several tens of micrometers, even fine particles of several nanometers to several tens of micrometers are adsorbed and floated on the water surface, The cleaning effect by impact force and cavitation action at the time of micro-nano bubble collision is also synergistically exhibited.

  As a result, fine particles attached to the object to be cleaned are levitated, and the fine particles are effectively separated and removed from the object to be cleaned. Thus, the action of removing the deposits on the object to be cleaned is effectively exhibited, and the cleaning quality of the object to be cleaned can be improved.

  In addition, the zeta potential is generated in the bubble, the interface of the bubble is charged with a negative charge, and the reaction and decomposition of free radicals generated when the bubble disappears, the removal effect on the adhering matter is significantly increased electrostatically. .

  This means that fine particles such as contaminants including cutting scraps, ions with the opposite sign of electrolyte (counter ions), and metal ions are attracted to the surface of the bubbles by electrostatic attraction. To do. Accordingly, the electric double layer is formed, the bubbles are stabilized, and the effect of removing fine particles adhering to the object to be cleaned is further increased. For example, even if minute irregularities exist on the surface of the object to be cleaned, the deposit removing effect in the minute irregularities is significantly improved as compared with the conventional case.

  Furthermore, cleaning water containing micro-nano bubbles in a pressurized supersaturated state is discharged from the nozzle at a stroke during cleaning and is supplied to the surface of the object to be cleaned. The bubbles in the washing water are saturated by 90% or more of Henry's law, and the pressure of the bubbles is higher than the water pressure at the washing water discharge port.

When the pressure supersaturated wash water passes through the pressure maintenance valve and is discharged from the nozzle outlet toward the part to be cleaned, the pressure maintenance valve increases the pressure of the wash water. A large amount of gas molecules can be confined in a minute gas body. Further, the flexible water supply pipe provides a degree of freedom for the mounting position of the cleaning nozzle, and the entire cleaning water supply device can be reduced in size. Moreover, since a kind of rectifying action is formed by attaching the pressure maintaining valve in the vicinity of the discharge port of the cleaning nozzle, the straightness of the cleaning water discharged from the cleaning nozzle is improved.

  Furthermore, since the cross-sectional area of the outflow part of the pressure maintaining valve is smaller than the cross-sectional area of the washing nozzle, the micro / nano bubble generator generates high-concentration bubbles in the same manner as the circulation type though it is an open type. The discharge stability of cleaning water can be ensured. As a result, the discharge pressure from the cleaning nozzle increases, and the pressure decrease when the cleaning water is discharged from the cleaning nozzle becomes abrupt. Thus, a higher concentration of micro / nano bubbles is generated.

That is, the pressurized supersaturated state of the micro-nano bubbles generated by the micro-nano bubble generator is maintained well , the dissolved gas in the pressurized super-saturated state is precipitated all at once, and high-concentration micro-nano bubbles are discharged toward the blade and the object to be cleaned. The Therefore, the floating effect and cavitation effect on fine particles can be further enhanced.

  Further, if a mesh net of about several μm is attached to the tip of the nozzle, bubbles of several + μm are divided into bubbles of several μm, and bubbles of several μm are stably generated.

  In the cleaning method in which the nozzle is moved radially outward from the center of the rotary table, the entire surface of the workpiece is thoroughly cleaned, so even if the object to be cleaned has a micro uneven surface, the object to be cleaned including this micro uneven surface It is possible to more efficiently remove deposits on the entire surface.

  Furthermore, in the cleaning method in which the object to be cleaned is attached to the dicing tape, the dicing tape is fixed by vacuum suction, rotated at a high speed of 100 rpm to 25000 rpm, and the cleaning nozzle is moved radially outward from the center of the rotary table. Rotation and bubbling from the cleaning nozzle can cause electrostatic damage to electrically weak devices.

  By generating an arbitrary zeta potential in the bubbles at the pH and the size of the microbubbles, it is possible to remove charges more efficiently than the object to be cleaned and efficiently improve electrostatic breakdown.

  The present invention is not limited to the contents of the above embodiments, and various modifications can be made without departing from the spirit of the present invention, and the present invention naturally extends to the modifications. It is. For example, the angle and position of the cleaning nozzle can be variously modified according to the cleaning conditions of the workpiece.

  The present invention can be applied to any system that supplies cleaning water from a nozzle when cleaning a workpiece, regardless of the type and model of an object to be cleaned and a cleaning device.

DESCRIPTION OF SYMBOLS 10 Dicing apparatus 14 Processing part 16 Cleaning part 16A Spin cleaning apparatus 21 Control part (control apparatus)
41 Washing nozzle 45 Water supply pipe 49 Micro / nano bubble generator 51 Pressure maintenance valve 55 Arm 59 Spinner table (rotary table)
W Workpiece (object to be cleaned)
F frame (work support)
T Dicing tape (adhesive tape)

Claims (4)

In the cleaning water supply device that supplies the cleaning water discharged from the nozzle to the workpiece after cutting fixed on the workpiece support,
The water supply pipe connected to the nozzle is connected to a micro / nano bubble generator for generating micro / nano bubbles in pure water, and the tip of the nozzle is arranged in the vicinity of the portion to be cleaned of the work and is meshed at the tip of the nozzle Is constructed so that cleaning water containing micro-nano bubbles divided by the net can be supplied to the workpiece to be cleaned ,
An apparatus for supplying cleaning water, characterized in that a pressure maintaining valve is provided in the vicinity of the discharge port of the nozzle to maintain the pressure of the cleaning water and maintain a pressurized supersaturated state of the micro / nano bubbles . The cross-sectional area of the pressure-maintaining valve is smaller than the cross-sectional area of the discharge port of the nozzle, according to claim 1, wherein water pressure of the pressure maintenance valve is characterized by being configured to be higher than the water pressure of the nozzle Washing water supply device. In the cleaning water supply method of supplying the cleaning water discharged from the nozzle to the workpiece after cutting fixed on the workpiece support,
As the washing water, pure water containing micro-nano bubbles is used, and washing water containing micro-nano bubbles divided by a mesh-like net attached to the nozzle tip is added to the micro-nano bubbles during washing. A method for supplying cleaning water, wherein a pressure oversaturated state is maintained and the workpiece is supplied from the nozzle to a portion to be cleaned. 4. The cleaning water supply method according to claim 3 , wherein the workpiece is fixed on a rotary table, and the workpiece is cleaned while the nozzle is scanned radially outward from the center of the rotary table.