JP6107355B2 - Adhesive bonding method and bonding apparatus - Google Patents

Description

  The present invention relates to a bonding method and a bonding apparatus using an adhesive.

  When manufacturing an optical device such as an optical pickup or an optical communication module in an optical drive for recording / reproducing an optical disk, it may be manufactured by adhering fine optical components with an adhesive. Examples of such an adhesive for connecting optical components include those using a thermosetting resin that is cured by heat, and those using an ultraviolet curable resin that is cured by irradiating ultraviolet rays or visible light.

  By the way, miniaturization and high definition are demanded in optical devices and the like, and when adhering optical components and the like, it is required to supply and adhere an adhesive without excess or deficiency. For example, consider a case where a first optical component 911 and a second optical component 912 are bonded using an adhesive 920 as shown in FIG.

In this case, as shown in FIG. 1A, when the supply amount of the adhesive 920 is too large, the adhesive 920 spreads around the second optical component 912 as shown in FIG. Therefore, it is necessary to design, manufacture, etc. in consideration of the spread 920a of the adhesive. That is, compared to the second optical component 912 to be bonded, the width L ₁ of the spread component 920a of the adhesive is very wide, it is necessary to like design and manufacture in consideration of the spread component 920a of the adhesive. Therefore, the demand for miniaturization and high definition cannot be satisfied sufficiently. In addition, when the adhesive 920 is excessively supplied, the bonding position between the first optical component 911 and the second optical component 912 is deviated from a desired position due to the effect of curing shrinkage that occurs during bonding. In some cases, desired functions and characteristics cannot be obtained. On the other hand, if the supply amount of the adhesive 920 is too small, the bonding between the first optical component 911 and the second optical component 912 becomes incomplete, leading to a decrease in reliability. In FIGS. 1A and 1B, the upper diagram is a top view and the lower diagram is a side view.

For this reason, as shown in FIG. 2 (a), if the supply amount of the adhesive 920 can be supplied to an appropriate amount, the spread of the adhesive as shown in FIG. 2 (b). it is possible to suppress the width _{L 2} of 920b to the extent slightly wider than the width of the second optical component 912. As described above, if the supply amount of the adhesive 920 can be appropriately supplied, the demand for downsizing and high definition can be satisfied. In FIGS. 2A and 2B, the upper diagram is a top view and the lower diagram is a side view.

  By the way, in order to stably supply a minute supply amount of adhesive, a low-priced supply device such as an air dispenser cannot stably supply a desired supply amount of adhesive. There is an expensive supply device, for example, a glass microsyringe, but the problem is that the adhesive remaining in the syringe is prone to problems due to curing and is treated as a consumable.

JP 2004-326011 A

  Therefore, even when using a low-priced supply device such as an air-type dispenser, a small amount of adhesive can be stably supplied, and when bonded with an adhesive, the adhesive spreads little. There is a need for a method.

According to one aspect of the present embodiment, in the bonding method of bonding the first component and the second component with an adhesive, an adhesive supply step of supplying an adhesive to the upper surface of the table, and the upper surface of the table A contact step of bringing the second component into contact with the adhesive in step, and an attachment step of separating the second component from the table after the contact step and attaching the adhesive to the second component; An imaging step of imaging the adhesive on the upper surface of the table by an imaging unit, a calculation step of calculating the amount of the adhesive from an image of the adhesive imaged on the upper surface of the table taken by the imaging unit, and the calculation step after, the adhesive adhering to the second part, have a, a bonding step of bonding the said first component second component, said imaging process and the calculating process The adhesive Be those performed between the contacting step and the feeding step, in the calculation step, the amount of adhesive W ₁ is calculated, in the contacting step, the interval of the gap between the said table second component more includes the step of calculating the amount W ₂ of the adhesive, when the value of W ₁ -W ₂ is within a predetermined range, and performs the bonding process.
Further, according to another aspect of the present embodiment, in the bonding method of bonding the first component and the second component with an adhesive, an adhesive supply step of supplying an adhesive to the upper surface of the table; A contact step of bringing the second component into contact with the adhesive on the upper surface of the table, and after the contact step, the second component is separated from the table and the adhesive is attached to the second component. An attaching step, an imaging step of imaging an adhesive on the upper surface of the table by an imaging unit, and a calculating step of calculating an amount of the adhesive from an image of the adhesive on the upper surface of the table imaged by the imaging unit; A bonding step of bonding the first component and the second component with an adhesive adhered to the second component after performing the calculation step, and the imaging step and The calculation step includes Be those performed during the serial deposition step and said bonding step, in the calculation step, the calculated amount W ₂ of the adhesive in the adhesive supplying step, the adhesive supplied to the upper surface of the table The amount W ₁ of the agent is measured or calculated in advance, and the bonding step is performed when the value of W ₁ -W ₂ is within a predetermined range.
Further, according to another aspect of the present embodiment, in the bonding method of bonding the first component and the second component with an adhesive, an adhesive supply step of supplying an adhesive to the upper surface of the table; A contact step of bringing the second component into contact with the adhesive on the upper surface of the table, and after the contact step, the second component is separated from the table and the adhesive is attached to the second component. An attaching step, an imaging step of imaging an adhesive on the upper surface of the table by an imaging unit, and a calculating step of calculating an amount of the adhesive from an image of the adhesive on the upper surface of the table imaged by the imaging unit; A bonding step of bonding the first component and the second component with an adhesive attached to the second component after performing the calculation step, and the imaging step In the first imaging process Furthermore, a second imaging step is included, the calculation step is a first calculation step, and further includes a second calculation step, the first imaging step and the first calculation step. The step is performed between the adhesive supply step and the contact step, and the first calculation step is performed after the first imaging step, and in the first calculation step, the amount of the adhesive W ₁ is calculated, the second imaging step and the second calculation step, there is carried out between the deposition step and the bonding step, the second calculation step The bonding step is performed after the second imaging step, and when the amount of adhesive W ₂ is calculated in the second calculation step and the value of W ₁ -W ₂ is within a predetermined range. It is characterized by performing.

  Further, according to another aspect of the present embodiment, in the bonding method of bonding the first component and the second component with an adhesive, an adhesive supply step of supplying an adhesive to the upper surface of the table; The second component is brought into contact with the adhesive on the upper surface of the table, and the second component is lowered by lowering until the gap between the table and the second component reaches a predetermined distance. After the contact step and the gap between the table and the second part has reached a predetermined distance, the second part is raised and the second part is separated from the table, thereby the second part. An adhering step for adhering an adhesive to the component, and an adhering step for adhering the first component and the second component with the adhesive adhering to the second component.

According to another aspect of the present embodiment, in a bonding apparatus that bonds the first component and the second component with an adhesive, a table having an upper surface to which the adhesive is supplied, and the table An adhesive supply unit that supplies the adhesive to the upper surface of the table, an imaging unit that images the adhesive supplied to the upper surface of the table, and an operation that calculates the amount of adhesive based on the image captured by the imaging unit And the second component, and the adhesive is attached to the second component by bringing the second component into contact with the adhesive supplied to the upper surface of the table, a moving mechanism for placing the second component on the first component, have a, a light source for irradiating light to cure the adhesive, the calculation of the amount of the adhesive, the table Contact the second part to the adhesive on the top surface And after separating the table and the second part, the amount of adhesive before contacting the second part, and after contacting When the difference between the amount of adhesive after separating the table and the second part is within a predetermined range, control is performed to bond the first part and the second part. characterized in that it have a control unit.

  In the bonding method using the disclosed adhesive, a small amount of adhesive can be stably supplied at low cost, and bonding with a small spread of the adhesive can be performed.

Illustration of adhesion with adhesive (1) Illustration of adhesion with adhesive (2) Structure diagram of bonding apparatus in the present embodiment Flowchart of bonding method using an adhesive in the present embodiment Process drawing (1) of the adhesion | attachment method by the adhesive agent in this Embodiment Process drawing (2) of the adhesion | attachment method by the adhesive agent in this Embodiment Process drawing (3) of the adhesion | attachment method by the adhesive agent in this Embodiment Process drawing (4) of the adhesion | attachment method by the adhesive agent in this Embodiment Process drawing (5) of the adhesion | attachment method by the adhesive agent in this Embodiment Process drawing (6) of the adhesion | attachment method by the adhesive agent in this Embodiment Process drawing (7) of the adhesion | attachment method by the adhesive agent in this Embodiment Process drawing (8) of the adhesion | attachment method by the adhesive agent in this Embodiment Explanatory drawing and photograph on the top surface of the table (1) Illustration and photo on the top of the table (2) Illustration and photo on the top surface of the table (3) Correlation diagram between gap between table and second optical component and wet area of adhesive

  The form for implementing is demonstrated below. In addition, about the same member etc., the same code | symbol is attached | subjected and description is abbreviate | omitted.

(Adhesive device)
First, the bonding apparatus used in the bonding method using the adhesive in the present embodiment will be described. As shown in FIG. 3, the bonding apparatus in the present embodiment is an apparatus for bonding the first optical component 10 and the second optical component 20 with an adhesive. The adhesive used in this embodiment is an ultraviolet curable adhesive that can be cured and adhered by irradiation with light such as ultraviolet rays.

  The bonding apparatus in the present embodiment includes a stage 110, a table 120, an adhesive supply unit 130, a first imaging unit 140, a second imaging unit 150, a moving mechanism unit 160, a light source unit 170, a control unit 180, and the like. doing. The first optical component 10 and the table 120 are installed on the stage 110. The table 120 is formed in a substantially trapezoidal shape as an example by a material such as metal or an equivalent product, and a substantially flat flat portion 120a is formed on the upper portion. The adhesive (not shown) is first supplied onto the flat portion 120a of the table 120.

  The adhesive supply unit 130 is formed by a low-priced supply device such as an air-type dispenser that supplies an adhesive by air pressure, for example. The first imaging unit 140 is for observing the table 120, the second optical component 20, and the like from above, and is installed in a movable state by a moving mechanism (not shown). The first imaging unit 140 includes an LED (Light Emitting Diode) illumination 141 and an imaging element 142 such as a CCD (Charge Coupled Device). In the first imaging unit 140, light can be emitted from the LED illumination 141, and reflected light of the emitted light can be imaged by the imaging element 142. The second imaging unit 150 is for imaging and observing the gap between the table 120 and the second optical component 20, and may include an imaging element such as LED illumination or CCD (not shown). It is installed at 120 lateral positions.

  The moving mechanism unit 160 moves the second optical component 20 in the vertical direction and the horizontal direction. The light source unit 170 emits light to cure the adhesive, and is, for example, a light source that emits ultraviolet rays or the like. The control unit 180 controls the entire bonding apparatus and includes a calculation unit 181 and the like. The calculation unit 181 performs various calculations and may include a storage unit (not shown).

(Adhesion method with adhesive)
The bonding method using the adhesive in the present embodiment will be described based on the flowchart shown in FIG. 4, the process diagrams of the bonding method shown in FIGS. 5 to 12, and the explanatory diagrams and photographs shown in FIGS. 13 to 15. Note that the control of the bonding method in the present embodiment is performed by the control unit 180 or the like.

  First, in step 102 (S102), the upper surface 120a of the table 120 is imaged by the first imaging unit 140. Specifically, as shown in FIG. 5, the first imaging unit 140 is moved to above the upper surface 120 a of the table 120, and then the upper surface 120 a of the table 120 is imaged by the first imaging unit 140. The first imaging unit 140 is moved by a moving mechanism (not shown). This imaging is performed by the imaging device 142 capturing an image of the reflected light of the light irradiated on the upper surface 120a of the table 120 by the LED illumination 141 in the first imaging unit 140.

  Next, in step 104 (S104), based on the image of the upper surface 120a of the table 120 captured by the first imaging unit 140 in step 102, it is determined whether or not there is an adhesive on the upper surface 120a of the table 120. The If there is an adhesive on the upper surface 120 a of the table 120, the process proceeds to step 106. If there is no adhesive on the upper surface 120 a of the table 120, the process proceeds to step 108. The case where there is no adhesive on the upper surface 120a of the table 120 is a state where the adhesive 30 does not exist on the upper surface 120a of the table 120, as shown in FIG. FIG. 13B is a photograph in which the upper surface 120a of the table 120 in this state is captured by the first imaging unit 140.

  Next, in step 106 (S106), the adhesive (not shown) adhering to the upper surface 120a of the table 120 is removed. Thereafter, the process proceeds to step 102.

  Next, in step 108 (S108), the adhesive 30 is supplied to the upper surface 120a of the table 120 by the adhesive supply unit 130. Specifically, as shown in FIG. 6, the first imaging unit 140 is moved from above the table 120, and the adhesive supply unit 130 such as an air dispenser is moved above the upper surface 120 a of the table 120. The first imaging unit 140 and the adhesive supply unit 130 are moved by a moving mechanism (not shown). Thereafter, the adhesive 30 is supplied to the upper surface 120 a of the table 120 by the adhesive supply unit 130. As a result, as shown in FIG. 7, the adhesive 30 supplied from the adhesive supply unit 130 has a predetermined amount of the adhesive 30 remaining on the upper surface 120 a of the table 120, and the excess adhesive 30 is removed from the table 120. It flows down from the upper surface 120a and collects in the lower part of the table 120. In this way, the amount of adhesive on the upper surface 120a of the table 120 can be made substantially constant. In the present embodiment, the viscosity of the adhesive 30 used is 1500 cp or less. In addition, the amount of the adhesive 30 in this step can be measured in advance, and can be calculated from the viscosity, surface tension, and gravity values of the adhesive 30. Further, the stage 110 or the table 120 may be provided with an adhesive reservoir (not shown) in which excess adhesive 30 that has flowed down from the upper surface 120a of the table 120 is accumulated.

Next, in step 110 (S110), the upper surface 120a of the table 120 is imaged by the first imaging unit 140. Specifically, as shown in FIG. 8, after the adhesive supply unit 130 is moved from above the table 120 and the first imaging unit 140 is moved to above the upper surface 120 a of the table 120, the first imaging is performed. The upper surface 120a of the table 120 is imaged by the unit 140. The first imaging unit 140 and the adhesive supply unit 130 are moved by a moving mechanism (not shown). Accordingly, the first imaging unit 140 irradiates the adhesive 30 on the upper surface 120a of the table 120 to capture an image. At this time, in the adhesive 30 on the upper surface 120a of the table 120, a highlight portion that is brighter than the other regions is observed at substantially the center. This highlight part is imaged when light regularly reflected on the surface of the adhesive 30 out of the light irradiated by the LED illumination 141 in the first imaging part 140 enters the imaging element 142. Yes, the amount of light is stronger than that of other adhesive regions, so it is observed brightly. In this step, as shown in FIG. 14A, the adhesive 30 is supplied on the upper surface 120a of the table 120, and FIG. 14B shows the state of the upper surface 120a of the table 120 in this step. Is a photograph taken by the first imaging unit 140. In this process, it is possible to confirm the highlighted portion H ₁ as shown in FIG. 14 (b). In the present embodiment, the process in step 110 may be described as a first imaging process.

Next, In step 112 (S112), calculates the amount _{W 1} of the adhesive 30 on the upper surface 120a of the table 120. Specifically, the amount W ₁ of the adhesive 30 is calculated from the area of the highlight portion H ₁ imaged by the imaging unit 140 in step 110. This step is performed in the calculation unit 181 and the like in the control unit 180. Note that the relationship between the area of the highlight portion of the adhesive 30 on the upper surface 120a of the table 120 and the amount of the adhesive 30 is measured in advance, and this relationship is stored in a storage unit (not shown) in the arithmetic unit 181 or the like. It may be memorized. In this case, the height of the adhesive 30 confirmed by the first imaging unit 140 based on the relationship between the area of the highlight portion of the adhesive 30 stored in the calculation unit 181 and the like and the amount of the adhesive 30. Based on the area of the light portion H ₁ , the amount W ₁ of the corresponding adhesive 30 can be calculated. In the present embodiment, the process in step 112 may be referred to as a first calculation process.

Then, At step 114 (S114), the amount _{W 1} of the adhesive 30 which is calculated in step 112 whether within a predetermined range is determined. When the amount W ₁ of the adhesive 30 calculated in step 112 is within a predetermined range, the process proceeds to step 116. The amount W ₁ of the adhesive 30 which is calculated in step 112 is when not within the predetermined range, the process proceeds to step 106, after removing the adhesive, application of an adhesive is made again.

  Next, in step 116 (S116), as shown in FIG. 9, the second optical component 20 is moved to above the upper surface 120a of the table 120 and then lowered. Specifically, after the second optical component 20 is moved above the upper surface 120a of the table 120 by the moving mechanism unit 160, the second optical component 20 is lowered. As a result, the adhesive 30 and the second optical component 20 on the upper surface 120 a of the table 120 come into contact with each other, and the adhesive 30 wets and spreads on the surface of the second optical component 20. In the present embodiment, it is assumed that the second optical component 20 has a smaller area on the bonding surface than the first optical component 10.

  Next, in step 118 (S118), it is determined whether or not the gap g between the table 120 and the second optical component 20 has reached a predetermined interval. Specifically, the relationship between the gap g and the wetting area S where the adhesive 30 in the second optical component 20 spreads out is as shown in FIG. The wetting area S where the adhesive 30 in 20 spreads out has a relationship of becoming wide. That is, when the gap g is large, the force acting between the objects (meniscus) is small and the wetting area S is narrow, but when the gap g is gradually narrowed, the force acting between the objects (meniscus) gradually increases and the wetting area is increased. S also gradually increases. Further, the amount of the adhesive 30 attached to the second optical component 20 also changes depending on the wet area S where the adhesive 30 spreads. Therefore, the amount of the adhesive 30 attached to the second optical component 20 can be set to a predetermined amount by performing control such that the gap g becomes a predetermined interval. Therefore, as shown in FIG. 9, the second imaging unit 150 captures an image between the table 120 and the second optical component 20, and thereby the table based on the image captured by the second imaging unit 150. The gap g between 120 and the second optical component 20 is measured. When the gap g between the table 120 and the second optical component 20 becomes a predetermined interval, the process proceeds to step 120. If the gap g between the table 120 and the second optical component 20 is not a predetermined interval, the process proceeds to step 116, and the second optical component 20 is further lowered.

  Next, in step 120 (S120), the second optical component 20 is raised. Specifically, the second optical component 20 is raised by the moving mechanism unit 160. Accordingly, a predetermined amount of the adhesive 30 can be attached to the second optical component 20 from the adhesive 30 on the upper surface 120a of the table 120.

Next, in step 122 (S122), the upper surface 120a of the table 120 is imaged by the first imaging unit 140. Specifically, as shown in FIG. 10, after the second optical component 20 is moved laterally from above the table 120 by the moving mechanism unit 160, the upper surface 120 a of the table 120 is moved by the first imaging unit 140. Take an image. Accordingly, the first imaging unit 140 irradiates the adhesive 30 on the upper surface 120a of the table 120 to capture an image. At this time, in the adhesive 30 on the upper surface 120a of the table 120, the adhesive is reduced and flattened by the transfer, but the highlight portion is observed without any problem. In this step, as shown in FIG. 15A, the adhesive 30 is present on the upper surface 120a of the table 120. FIG. 15B shows the state of the upper surface 120a of the table 120 in this step. Is a photograph taken by the first imaging unit 140. In this step, it has been flattened adhesive as shown in FIG. 15 (b), it is possible to confirm the highlighted portion H _2. In the present embodiment, the process in step 122 may be described as a second imaging process.

Next, in step 124 (S124), the amount _{W 2} of the adhesive 30 on the upper surface 120a of the table 120 is calculated. Specifically, the amount W ₂ of the adhesive 30 is calculated from the area of the highlight portion H ₂ imaged by the imaging unit 140 in step 122. This step is performed in the calculation unit 181 and the like in the control unit 180. As described above, the relationship between the area of the highlight portion of the adhesive 30 on the upper surface 120a of the table 120 and the amount of the adhesive 30 is measured in advance, and this relationship is measured in the interior of the calculation unit 181. You may memorize | store in the memory | storage part of illustration. In this case, the height of the adhesive 30 confirmed by the first imaging unit 140 based on the relationship between the area of the highlight portion of the adhesive 30 stored in the calculation unit 181 and the like and the amount of the adhesive 30. based on the area of the light section H _2, the amount W ₂ of the corresponding adhesive 30 can be calculated and the like. In the present embodiment, the process in step 124 may be referred to as a second calculation process.

Next, in step 126 (S126), it is determined whether or not the value of W ₁ −W ₂ is within a predetermined range. That is, since the value of W ₁ -W ₂ is the adhesive 30 attached to the second optical component 20, the adhesion attached to the second optical component 20 is determined by the value of W ₁ -W ₂ . It can be determined whether or not the agent 30 is in an appropriate amount. If the value of W ₁ -W ₂ is within the predetermined range, the amount of the adhesive 30 adhering to the second optical component 20 is an appropriate amount, and the routine proceeds to step 130. If the value of W ₁ -W ₂ is not within the predetermined range, the amount of the adhesive 30 adhering to the second optical component 20 is not an appropriate amount, and the routine proceeds to step 128.

  Next, in step 128 (S128), since the adhesive 30 that is not an appropriate amount is adhered to the second optical component 20, the second optical component 20 is discarded.

  Next, in step 130 (S130), the first optical component 10 and the second optical component 20 are bonded to each other with the adhesive 30 attached to the second optical component 20. Specifically, as shown in FIG. 11, the second optical component 20 to which an appropriate amount of the adhesive 30 is attached is moved above the first optical component 10 by the moving mechanism 160. Thereafter, the second optical component 20 is lowered by the moving mechanism unit 160. As a result, the second optical component 20 is placed on the first optical component 10 via the adhesive 30. Thereafter, as shown in FIG. 12, the adhesive 30 is cured by irradiating the adhesive 30 with ultraviolet rays from the light source unit 170. At this time, in order to suppress the influence of curing shrinkage and the like, the holding mechanism (not shown) attached to the moving mechanism unit 160 is fixedly supported until the end of irradiation. Thereby, the 1st optical component 10 and the 2nd optical component 20 can be adhere | attached.

  As described above, the bonding method using the adhesive according to the present embodiment can be performed. In the present embodiment, since the first optical component 10 and the second optical component 20 can be bonded with a predetermined amount of adhesive 30, a stable coating amount can be secured and the spread of the adhesive is small. Gluing can be performed. In the present embodiment, the first optical component 10 and the second optical component 20 can be accurately bonded at a desired position. Therefore, in the bonding method in this embodiment, a stable coating amount can be secured, and a miniaturized and high-definition optical device or the like can be manufactured with a high yield.

In the present embodiment, the number of times that the first imaging unit 140 images the upper surface 120a of the table 120 may be one. Specifically, in the flowchart shown in FIG. 4, the bonding with the adhesive 30 may be performed without performing the steps from Step 110 to Step 114. In this case, since the amount of the adhesive 30 supplied to the upper surface 120a of the table 120 is substantially constant in step 108, the same effects as those in the present embodiment can be obtained without performing the processes in steps 110 to 114. Can be obtained. In this case, by regarding the amount of the adhesive 30 on the upper surface 120a of the table 120 which is previously measured, such as the amount _{W 1} of the adhesive 30, it performs step 126.

Further, in the flowchart shown in FIG. 4, bonding with an adhesive may be performed without performing the steps from step 122 to step 128. In this case, in step 118, the amount of the adhesive 30 attached to the second optical component 20 can be made substantially constant by controlling the gap g to be a predetermined gap. Therefore, the same effects as those in the present embodiment can be obtained without performing the processes from step 122 to step 128. In this case, since the amount of the adhesive 30 remaining on the upper surface 120a of the table 120 can be made substantially constant by setting the interval of the gap g to a predetermined interval, the adhesive calculated from the interval of the gap g is used. Considering the amount of 30 as the amount W ₂ of the adhesive 30, step 126 is performed.

  In this embodiment, in order to know the amount of the adhesive adhering to the second optical component more accurately, the first imaging step and the second imaging are performed as shown in FIG. It is more preferable to perform both of the steps.

  Although the embodiment has been described in detail above, it is not limited to the specific embodiment, and various modifications and changes can be made within the scope described in the claims.

In addition to the above description, the following additional notes are disclosed.
(Appendix 1)
In the bonding method of bonding the first component and the second component with an adhesive,
An adhesive supply process for supplying an adhesive to the upper surface of the table;
A contact step of bringing the second component into contact with the adhesive on the upper surface of the table;
After the contacting step, the attaching step of separating the second component from the table and attaching an adhesive to the second component;
An imaging step of imaging the adhesive on the upper surface of the table by an imaging unit;
From the image of the adhesive on the upper surface of the table imaged by the imaging unit, a calculation step of calculating the amount of the adhesive,
After performing the calculation step, an adhesive step of bonding the first component and the second component with an adhesive attached to the second component;
A bonding method using an adhesive, comprising:
(Appendix 2)
It said imaging step and the calculating step, there is performed between the contacting step and the adhesive supplying step, in the calculation step, the amount of adhesive W ₁ is calculated,
In the contacting step, than the distance of the gap between the second component and the table includes the step of calculating the amount W ₂ of the adhesive,
The adhesive bonding method according to appendix 1, wherein the bonding step is performed when the value of W ₁ -W ₂ is within a predetermined range.
(Appendix 3)
The imaging step and the calculation step are performed between the adhesion step and the adhesion step, and in the calculation step, the amount of adhesive W ₂ is calculated,
In the adhesive supplying step, the amount W _{1 of the} adhesive supplied to the upper surface of the table is measured or calculated in advance,
The adhesive bonding method according to appendix 1, wherein the bonding step is performed when the value of W ₁ -W ₂ is within a predetermined range.
(Appendix 4)
The imaging step is a first imaging step, and further includes a second imaging step,
The calculation step is a first calculation step, and further includes a second calculation step,
The first imaging step and the first calculation step are performed between the adhesive supply step and the contact step, and the first calculation step is the same as the first imaging step. Performed later, in the first calculation step, the amount of adhesive W ₁ is calculated,
The second imaging step and the second calculating step are performed between the attaching step and the adhering step, and the second calculating step is performed after the second imaging step. In the second calculation step, the amount of adhesive W ₂ is calculated,
The adhesive bonding method according to appendix 1, wherein the bonding step is performed when a value of W ₁ -W ₂ is within a predetermined range.
(Appendix 5)
5. The method for bonding with an adhesive according to any one of appendices 1 to 4, wherein the imaging step is to image the adhesive by irradiating the adhesive with light from the upper surface of the table.
(Appendix 6)
6. The adhesive bonding according to appendix 5, wherein the calculating step calculates the amount of the adhesive based on the area of the highlight portion where the amount of reflected light is strong in the image captured in the imaging step. Method.
(Appendix 7)
In the contact step, the second part is moved downward to approach until the gap between the table and the second part reaches a predetermined interval,
After the gap between the table and the second part reaches a predetermined distance, the second part is raised and the second part is separated from the table to perform the attaching step. An adhesion method using an adhesive according to any one of appendices 1 to 6, wherein
(Appendix 8)
In the bonding method of bonding the first component and the second component with an adhesive,
An adhesive supply process for supplying an adhesive to the upper surface of the table;
The second component is brought into contact with the adhesive on the upper surface of the table, and the second component is lowered by lowering until the gap between the table and the second component reaches a predetermined distance. A contact process;
After the gap between the table and the second part reaches a predetermined distance, the second part is lifted, and the second part is separated from the table to adhere to the second part. An adhesion process for adhering the agent;
A bonding step of bonding the first component and the second component with an adhesive adhering to the second component;
A bonding method using an adhesive, comprising:
(Appendix 9)
The adhesive is cured by irradiating with ultraviolet rays,
The bonding method using an adhesive according to any one of appendices 1 to 8, wherein the bonding step includes a step of irradiating the adhesive with the ultraviolet rays.
(Appendix 10)
The adhesive method according to any one of appendices 1 to 9, wherein the adhesive has a viscosity of 1500 cp or less.
(Appendix 11)
The first component is a first optical component;
11. The bonding method using an adhesive according to any one of appendices 1 to 10, wherein the second component is a second optical component.
(Appendix 12)
In a bonding apparatus that bonds the first component and the second component with an adhesive,
A table having an upper surface to which the adhesive is supplied;
An adhesive supply section for supplying the adhesive to the upper surface of the table;
An imaging unit that images the adhesive supplied to the upper surface of the table;
An arithmetic unit that calculates the amount of adhesive based on the image captured by the imaging unit;
The second component is transported, and the adhesive is attached to the second component by bringing the second component into contact with the adhesive supplied to the upper surface of the table. A moving mechanism for placing the second component on the component;
A light source that emits light for curing the adhesive;
A bonding apparatus comprising:
(Appendix 13)
The imaging unit captures an image of reflected light of light irradiated on the adhesive,
The adhesive device according to appendix 12, wherein the arithmetic unit calculates the amount of the adhesive based on an area of a highlight portion having a strong light amount in the image.
(Appendix 14)
The imaging unit is a first imaging unit,
The bonding apparatus according to appendix 12 or 13, further comprising a second imaging unit that observes a gap between the table to which the adhesive is supplied and the second component.
(Appendix 15)
The amount of the adhesive is calculated before the second component is brought into contact with the adhesive on the upper surface of the table and after the table is separated from the second component after the contact. And
The difference between the amount of the adhesive before contacting the second part and the amount of the adhesive after separating the table and the second part after the contact is within a predetermined range. In this case, the bonding apparatus according to any one of appendices 12 to 14, further comprising a control unit that controls the bonding between the first component and the second component.
(Appendix 16)
The adhesive is cured by irradiating with ultraviolet rays,
The bonding apparatus according to any one of appendices 12 to 15, wherein the light source irradiates the adhesive with ultraviolet rays.
(Appendix 17)
The adhesive device according to any one of appendices 12 to 16, wherein the adhesive has a viscosity of 1500 cp or less.
(Appendix 18)
The first component is a first optical component;
The bonding apparatus according to any one of appendices 12 to 17, wherein the second component is a second optical component.

DESCRIPTION OF SYMBOLS 10 1st optical component 20 2nd optical component 110 Stage 120 Table 120a Upper surface 130 Adhesive supply part 140 1st imaging part 150 2nd imaging part 160 Movement mechanism part 170 Light source part 180 Control part 181 Calculation part

Claims (7)

In the bonding method of bonding the first component and the second component with an adhesive,
An adhesive supply process for supplying an adhesive to the upper surface of the table;
A contact step of bringing the second component into contact with the adhesive on the upper surface of the table;
After the contacting step, the attaching step of separating the second component from the table and attaching an adhesive to the second component;
An imaging step of imaging the adhesive on the upper surface of the table by an imaging unit;
From the image of the adhesive on the upper surface of the table imaged by the imaging unit, a calculation step of calculating the amount of the adhesive,
After performing the calculation step, an adhesive step of bonding the first component and the second component with an adhesive attached to the second component;
I have a,
It said imaging step and the calculating step, there is performed between the contacting step and the adhesive supplying step, in the calculation step, the amount of adhesive W ₁ is calculated,
In the contacting step, than the distance of the gap between the second component and the table includes the step of calculating the amount W ₂ of the adhesive,
When the value of W ₁ -W ₂ is within a predetermined range, the bonding step is performed, wherein the bonding step is performed . In the bonding method of bonding the first component and the second component with an adhesive,
An adhesive supply process for supplying an adhesive to the upper surface of the table;
A contact step of bringing the second component into contact with the adhesive on the upper surface of the table;
After the contacting step, the attaching step of separating the second component from the table and attaching an adhesive to the second component;
An imaging step of imaging the adhesive on the upper surface of the table by an imaging unit;
From the image of the adhesive on the upper surface of the table imaged by the imaging unit, a calculation step of calculating the amount of the adhesive,
After performing the calculation step, an adhesive step of bonding the first component and the second component with an adhesive attached to the second component;
Have
The imaging step and the calculating step are performed between the attaching step and the adhering step. In the calculating step, the amount of adhesive W ₂ Is calculated,
In the adhesive supplying step, the amount W of the adhesive supplied to the upper surface of the table ₁ Is measured or calculated in advance,
W ₁ -W ₂ When the value of is within a predetermined range, the bonding step is performed, wherein the bonding step is performed. In the bonding method of bonding the first component and the second component with an adhesive,
An adhesive supply process for supplying an adhesive to the upper surface of the table;
A contact step of bringing the second component into contact with the adhesive on the upper surface of the table;
After the contacting step, the attaching step of separating the second component from the table and attaching an adhesive to the second component;
An imaging step of imaging the adhesive on the upper surface of the table by an imaging unit;
From the image of the adhesive on the upper surface of the table imaged by the imaging unit, a calculation step of calculating the amount of the adhesive,
After performing the calculation step, an adhesive step of bonding the first component and the second component with an adhesive attached to the second component;
Have
The imaging step is a first imaging step, and further includes a second imaging step,
The calculation step is a first calculation step, and further includes a second calculation step,
The first imaging step and the first calculation step are performed between the adhesive supply step and the contact step, and the first calculation step is the same as the first imaging step. Performed later, in the first calculation step, the amount of adhesive W ₁ is calculated,
The second imaging step and the second calculating step are performed between the attaching step and the adhering step, and the second calculating step is performed after the second imaging step. In the second calculation step, the amount of adhesive W ₂ is calculated,
When the value of W ₁ -W ₂ is within a predetermined range, the adhesion method according adhesives you and performing the bonding process. The bonding method using an adhesive according to any one of claims 1 to 3, wherein in the imaging step, the adhesive is imaged by irradiating the adhesive with light from an upper surface of the table. In the contact step, the second part is moved downward to approach until the gap between the table and the second part reaches a predetermined interval,
After the gap between the table and the second part reaches a predetermined distance, the second part is raised and the second part is separated from the table to perform the attaching step. The bonding method using an adhesive according to any one of claims 1 to 4 , wherein the bonding method is performed. In a bonding apparatus that bonds the first component and the second component with an adhesive,
A table having an upper surface to which the adhesive is supplied;
An adhesive supply section for supplying the adhesive to the upper surface of the table;
An imaging unit that images the adhesive supplied to the upper surface of the table;
An arithmetic unit that calculates the amount of adhesive based on the image captured by the imaging unit;
The second component is transported, and the adhesive is attached to the second component by bringing the second component into contact with the adhesive supplied to the upper surface of the table. A moving mechanism for placing the second component on the component;
A light source that emits light for curing the adhesive;
I have a,
The amount of the adhesive is calculated before the second component is brought into contact with the adhesive on the upper surface of the table and after the table is separated from the second component after the contact. And
The difference between the amount of the adhesive before contacting the second part and the amount of the adhesive after separating the table and the second part after the contact is within a predetermined range. case, bonding apparatus characterized by have a control unit which controls performing the adhesion between the second component and the first component. The imaging unit captures an image of reflected light of light irradiated on the adhesive,
The bonding apparatus according to claim 6, wherein the calculation unit calculates the amount of the adhesive based on an area of a highlight portion having a strong light amount in the image.