JP6116276B2 - Electric equipment and induction heating cooker - Google Patents

Description

  The present invention relates to an electric device and an induction heating cooker.

  Conventionally, in an induction heating cooker which is one of electric devices, for example, a plurality of heating means for heating an object to be heated, a control means for controlling the operation of the cooker, and an operation of the cooker in the control means Operation means for inputting setting information and the like, and rated power setting means for setting the rated power as the upper limit value of the total power consumed by the entire cooking device, and the rated power can be changed by the rated power setting means. Have been proposed (see, for example, Patent Document 1).

JP 2005-76997 A (summary)

Conventionally, a silicon semiconductor is generally used for a power control semiconductor element (power semiconductor element) mounted on an electric device such as an induction heating cooker because of its low price.
On the other hand, there are wide band gap semiconductors that have higher withstand voltage and allowable current density and lower power loss than silicon semiconductors. By using the power semiconductor element formed of this wide band gap semiconductor, it becomes possible to cope with high output driving and the like.
For this reason, silicon semiconductors are used when economics are required, and wide band gap semiconductors are used when performance is required. Therefore, it is desired to be able to use it.

  However, in a conventional electric appliance such as an induction heating cooker, since there is no technical idea that the power semiconductor element can be replaced with a different type of element, the type of the power semiconductor element can be selectively selected using the same device. It is difficult to make it usable. For example, although the technique of Patent Document 1 changes the rated power, it does not assume that the type of the power semiconductor element is exchanged, and according to the purpose and application of the user, the power semiconductor element There was a problem that it was not possible to selectively use the type of the.

  Further, when the type of power semiconductor element can be selectively used, there is a problem that the mounting state of the electronic substrate inside the apparatus cannot be grasped unless the electric device is disassembled. For example, a user who uses an electric device cannot grasp the type of power semiconductor element mounted on the electric device, and does not know whether it is an electric device compatible with high-power driving, so that it is easy to use. There was a problem of being bad. In addition, for example, when a service person, a device installer, etc. performs maintenance and installation work on electrical equipment, there is a problem that the type of power semiconductor element mounted in the device is unknown and workability deteriorates. It was.

  The present invention has been made to solve the above-described problems, and can selectively mount different types of power semiconductor elements, and informs the types of power semiconductor elements mounted on the main body. An object is to provide an electric device and an induction heating cooker that can be used.

An electrical apparatus according to the present invention is a main body on which a first substrate on which a power semiconductor element formed of a silicon semiconductor is mounted or a second substrate on which a power semiconductor element formed of a wide band gap semiconductor is mounted. And a load circuit, a drive circuit that drives the load circuit, a notification unit, a notification unit, a control unit that controls driving of the drive circuit, and various operations are input. Operating means , wherein the control means identifies which of the first substrate and the second substrate is mounted on the main body, and determines the identification result according to an input from the operating means. It is determined whether or not to notify the notification means, and when it is determined to notify, the notification result is notified to the notification means.

  According to the present invention, different types of power semiconductor elements can be selectively mounted, and the types of power semiconductor elements mounted on the main body can be notified.

It is a perspective view which shows the external appearance of the induction heating cooking appliance 100 which concerns on Embodiment 1. FIG. It is a figure which shows the drive circuit of the induction heating cooking appliance 100 which concerns on Embodiment 1. FIG. It is a block diagram explaining the electronic substrate 11 mounted in the induction heating cooking appliance 100 which concerns on Embodiment 1. FIG. It is a block diagram which shows the state by which the 1st electronic substrate 11a was mounted in the induction heating cooking appliance 100 which concerns on Embodiment 1. FIG. It is a block diagram which shows the state by which the 2nd electronic substrate 11b was mounted in the induction heating cooking appliance 100 which concerns on Embodiment 1. FIG. It is a flowchart which shows the operation | movement of the automatic alerting | reporting of the induction heating cooking appliance 100 which concerns on Embodiment 1. FIG. It is a flowchart which shows the operation | movement of the special alert | report of the induction heating cooking appliance 100 which concerns on Embodiment 1. FIG. FIG. 6 is a diagram illustrating a circuit of a motor drive device according to a third embodiment.

Embodiment 1 FIG.
In Embodiment 1, an induction heating cooker that performs cooking by induction heating will be described as an example of the electric device of the present invention. Note that the electrical device of the present invention is not limited to this, and can be applied to any electrical device such as an air conditioner, a washing machine, a household appliance such as a refrigerator, an elevator, and a motor drive device for a railway vehicle. Can do.

FIG. 1 is a perspective view showing an appearance of induction heating cooker 100 according to Embodiment 1. FIG.
In FIG. 1, a top plate on which an object to be heated (a pan or the like) is placed is provided on the upper portion of the main body 1 of the induction heating cooker 100. For example, three circular left heating ports HL, right heating ports HR, and central heating ports HC (hereinafter referred to as “heating ports”) indicating the placement position of the object to be heated are printed on the top plate. Is displayed. Three heating coils are arranged in the main body 1 corresponding to each heating port.

  At the lower center of the main body 1, there is provided a grill box G whose front surface is open so that heated objects such as fish can be taken in and out. In the grill cabinet G, a heat source such as a heater is provided to heat the object to be heated.

An operation unit 2 is provided on the front side of the top plate and on the front surface of the main body 1. The operation unit 2 includes, for example, a heating power setting operation unit provided corresponding to each heating port and a grill operation unit that operates heating of the grill.
Moreover, the display part 12 is provided in the front part side of the top plate. The display unit 12 displays, for example, each heating port, the heating power of the grill cabinet G, and the operation state. The display unit 12 is configured by, for example, a liquid crystal display panel, an LED, or the like. In addition, inside the main body 1, a notification unit 13 configured by a buzzer or a speaker and informing by sound is provided.

  An intake port 21 and an exhaust port 22 are formed on the rear side of the main body 1. A cooling fan 20 provided inside the main body 1 sucks air outside the main body 1 from an intake port 21 and supplies cooling air into the main body 1. The cooling air supplied into the main body 1 cools components inside the main body 1 and then is exhausted from the exhaust port 22 to the outside of the main body 1.

FIG. 2 is a diagram showing a drive circuit of induction heating cooker 100 according to the first embodiment. A drive circuit is provided for each heating port. FIG. 2 shows only one drive circuit.
As shown in FIG. 2, the drive circuit includes a DC power supply circuit 3 and an inverter circuit 4, and supplies power to the load circuit 7.

  The DC power supply circuit 3 includes a diode bridge 3a, a reactor 3b, and a smoothing capacitor 3c, converts an AC voltage input from the AC power supply into a DC voltage, and outputs the DC voltage to the inverter circuit 4.

The inverter circuit 4 is a half-bridge type inverter in which switching elements 4 a and 4 b configured by power semiconductor elements are connected in series to the output of the DC power supply circuit 3. The inverter circuit 4 converts the DC power output from the DC power supply circuit 3 into high-frequency AC power and supplies it to the load circuit 7. The inverter circuit 4 is not limited to the half-bridge type, and may be a configuration using a full-bridge type or a single-voltage resonance type inverter. In addition, the structure of the inverter circuit 4 of each heating port may differ. For example, the inverter circuit 4 of the left heating port HL may be a full bridge type, and the inverter circuit 4 of the right heating port HR may be a half bridge type.
The load circuit 7 is constituted by a resonance circuit including a heating coil 5a and a resonance capacitor 5b.

The control main microcomputer 9 transmits a thermal power command (power command) input from the operation unit 2 according to the heating port selection operation and the thermal power setting operation to the control secondary microcomputer 8.
The control sub-microcomputer 8 controls the switching elements 4a and 4b of the inverter circuit 4 to be turned on and off based on a command from the control main microcomputer 9 so that the output power of the inverter circuit 4 becomes the set thermal power. .

  The control main microcomputer 9 operates when a control power supply is supplied. The control main microcomputer 9 has a calendar function for counting time and a clock function for counting time zones. The control main microcomputer 9 stores notification timing information corresponding to at least one of time, date, and day of the week. Details will be described later.

  With this configuration, a high-frequency current flows through the heating coil 5a, and the object to be heated placed on the top plate directly above the heating coil 5a is induction-heated by the high-frequency magnetic flux generated by the flowing high-frequency current.

The control main microcomputer 9 and the control sub-microcomputer 8 correspond to “control means”.
The display unit 12 and the notification unit 13 correspond to “notification unit”.

  At least the DC power supply circuit 3, the inverter circuit 4, and the control slave microcomputer 8 are mounted on the electronic board 11. The electronic board 11 is mounted in the main body 1 and detachably connected to a main board 14 (described later) on which a control main microcomputer 9 is mounted. The electronic substrate 11 has a pull-up resistor 10a or a pull-down resistor 10b as a circuit component for identifying the type of power semiconductor element (hereinafter also referred to as “type of the electronic substrate 11”) mounted on the substrate. It is installed. In FIG. 2, both the pull-up resistor 10a and the pull-down resistor 10b are shown for explanation.

Here, types of power semiconductor elements (switching elements 4a and 4b) mounted on the electronic substrate 11 will be described.
As a power semiconductor element, for example, there is a silicon-based semiconductor (hereinafter referred to as a silicon semiconductor).
As the power semiconductor element, there is a wide band gap semiconductor such as silicon carbide (SiC), a gallium nitride-based material (gallium nitride; GaN), or diamond.

A power semiconductor element formed of a silicon semiconductor is less expensive than a wide band gap semiconductor.
On the other hand, a power semiconductor element formed of a wide bandgap semiconductor has high withstand voltage and allowable current density, and low power loss. Therefore, it can be driven at higher power than a silicon semiconductor. In addition, since the power loss is lower than that of a silicon semiconductor, the amount of heat generated is small, and the heat resistance is high. Therefore, it is possible to reduce or omit the cooling device and the radiating fin and reduce the cooling capacity.

  The induction heating cooker 100 according to the first embodiment is formed of an electronic substrate 11 (hereinafter referred to as “first electronic substrate 11a”) mounted with a power semiconductor element formed of a silicon semiconductor, or a wide band gap semiconductor. Any one of the electronic substrates 11 (hereinafter referred to as “second electronic substrate 11b”) on which the power semiconductor elements are mounted can be selectively mounted.

  For example, in the induction heating cooker 100, the second electronic board 11b is mounted for a user who desires high-heat power cooking, and the first electronic board 11a is provided for a user who does not need high-heat cooking and requires low cost. The induction heating cooker 100 that can selectively use the power semiconductor element in the same device without the need to replace (replace) the entire device according to the purpose and application of the user. It becomes possible to provide.

  In the first embodiment, the switching elements 4a and 4b constituting the inverter circuit 4 are made of either a wide band gap semiconductor or a silicon semiconductor. However, the present invention is not limited to this. For example, a diode bridge 3a of the DC power supply circuit 3 mounted on the second electronic substrate 11b, and a diode (not shown) connected in reverse parallel to the switching elements 4a and 4b, etc., are made of a wide bandgap semiconductor or silicon semiconductor. You may make it comprise either.

  Next, the details of the circuit configuration of the induction heating cooker 100 will be described.

FIG. 3 is a block diagram for explaining the electronic substrate 11 mounted on the induction heating cooker 100 according to the first embodiment.
FIG. 4 is a block diagram showing a state where the first electronic board 11a is mounted on the induction heating cooker 100 according to the first embodiment.
FIG. 5 is a block diagram showing a state where the second electronic substrate 11b is mounted on the induction heating cooker 100 according to the first embodiment.
As shown in FIG. 3, either the first electronic board 11 a or the second electronic board 11 b is selectively connected to the main board 14 on which the control main microcomputer 9 is mounted by a harness 16.
As shown in FIG. 4, when the first electronic board 11a is mounted on the main body 1, the harness 16 and the connector 15a of the first electronic board 11a are connected.
As shown in FIG. 5, when the second electronic board 11b is mounted on the main body 1, the harness 16 and the connector 15b of the second electronic board 11b are connected.

A pull-up resistor 10a is mounted on the first electronic board 11a, and a predetermined potential (for example, + 5V) is applied to the input port for identifying the electronic board type of the main microcomputer 9 for control via the connector 15a and the harness 16. Entered.
In addition, a pull-down resistor 10b is mounted on the second electronic board 11b, and a predetermined potential (for example, GND) is input via the connector 15b and the harness 16 to an electronic board type identification input port of the main microcomputer 9 for control. Is input.
The main microcomputer 9 for control identifies the type of the electronic board 11 mounted on the main body 1 from the Hi logic or Lo logic determined by the potential input to the electronic board type identification input port. For example, if the input port is Hi, it is identified that the first electronic board 11a is mounted, and if the input port is Lo, it is identified that the second electronic board 11b is mounted.

  In this way, by making the mounting state of the circuit components mounted on the first electronic board 11a and the second electronic board 11b different, the control main microcomputer 9 can select either the first electronic board 11a or the second electronic board 11b. Identify whether is installed.

  Here, the case where the type of the mounted electronic substrate 11 is identified by the pull-up resistor 10a and the pull-down resistor 10b has been described, but the present invention is not limited to this. For example, the type may be identified by mounting a dip switch on the first electronic board 11a and the second electronic board 11b and changing the switching state. Further, for example, the type may be identified by making the mounting state different by a jumper wire or the like. That is, the type may be identified based on the attachment state or connection switching state of the circuit components mounted on the first electronic substrate 11a and the second electronic substrate 11b.

The first electronic substrate 11a corresponds to the “first substrate” in the present invention.
The second electronic substrate 11b corresponds to the “second substrate” in the present invention.

(Notification operation)
Next, the alerting | reporting operation | movement of the induction heating cooking appliance 100 in this Embodiment 1 is demonstrated.
As described above, the control main microcomputer 9 identifies which of the first electronic board 11a and the second electronic board 11b is mounted. Then, the identification result is notified by at least one of the display unit 12 and the notification unit 13.
As the notification operation, there are automatic notification for performing notification according to the notification timing information, and special notification for performing notification by a predetermined operation performed by, for example, a serviceman and an apparatus installer. Hereinafter, each notification operation will be described.

(Automatic notification)
FIG. 6 is a flowchart showing an automatic notification operation of induction heating cooker 100 according to the first embodiment.
Hereinafter, description will be given based on each step of FIG.

(S101)
The control main microcomputer 9 determines whether or not the control power source has been started or restarted. For example, when the power cord for supplying power to the induction heating cooker 100 is disconnected and the control power is turned off, and then the power cord is connected and the control power is activated, it is determined that the control power is activated. Further, for example, when a restart (reset operation or the like) is performed by a predetermined operation from the operation unit 2, the restart is determined.

(S102)
The control main microcomputer 9 counts the date and time by a clock function (microcomputer clock). This count is based on the startup or restart of the control power supply, and the elapsed time and elapsed days are counted.

(S103)
The control main microcomputer 9 causes the display unit 12 to display information for confirming whether or not to display information regarding the type of the electronic substrate 11. For example, “Display mode?” Is displayed, and the input of the operation unit 2 by the user is awaited.

(S104)
When an operation for displaying information is performed in S103, the control main microcomputer 9 uses the display unit 12 to display information on the result of identifying the type of the electronic board 11 based on the notification timing information. Is notified by at least one of sounds (sound or ringing sound).
Here, the notification timing information includes an arbitrary timing set in advance such as “3 days” and “Morning first (for example, 5: 30-)” as the elapsed days based on starting or restarting of the control power supply. can do.
The notification timing information is not limited to this. The notification timing information may be set according to at least one of time, date, and day of the week. Moreover, the reference | standard which counts elapsed time and elapsed days is not restricted to starting or restarting of a control power supply, but can be based on arbitrary timing. For example, when the operation is started after the operation stop state of the electric device continues for a certain period, the start time may be used as a reference for counting.

(S105)
When the operation for displaying the information is not performed in S103, the control main microcomputer 9 does not perform the notification by the display unit 12 and the notification unit 13, and ends the operation. In this way, by selecting display or non-display of information by an operation from the operation unit 2, notification may be omitted when the user does not need to grasp and notify the type of the electronic substrate 11. It becomes possible, and usability improves. Note that S103 and S105 may be omitted and the notification timing information may be always notified.

(Special notification)
FIG. 7 is a flowchart showing the special notification operation of induction heating cooker 100 according to the first embodiment.
This special notification operation is, for example, an operation for displaying information related to the type of the electronic substrate 11 by a person who performs maintenance or installation work on electrical equipment, such as a service person and an apparatus installer, that is not performed in a normal operation. It is.
Hereinafter, description will be given based on each step of FIG.

(S201)
For example, a service person or the like performs an operation for shifting to the special mode by the operation unit 2. This operation is an operation that is not performed in a normal operation, for example, by operating a certain operation button while pressing and holding a certain operation button.
The control main microcomputer 9 shifts to the special mode when the operation unit 2 is operated to shift to the special mode.

(S202)
The control main microcomputer 9 causes the display unit 12 to display information for confirming whether or not to display information regarding the type of the electronic substrate 11. For example, “display mode?” Is displayed, and the input of the operation unit 2 by a serviceman or the like is waited for.

(S203)
When an operation for displaying information is performed in S202, the main microcomputer 9 for control uses the information obtained as a result of identifying the type of the electronic board 11 to display information on the display unit 12 and sound (voice or ringing) from the notification unit 13. Notification by at least one of sound and the like.

(S204)
When the operation for displaying the information is not performed in S202, the control main microcomputer 9 does not perform the notification by the display unit 12 and the notification unit 13, and ends the operation. It should be noted that S202 and S204 may be omitted, and the notification may always be performed when the mode is shifted to the special mode.

  Note that both the above-described automatic notification and special notification operations may be performed, or only one of them may be performed.

  As described above, in the present embodiment, the first electronic substrate 11a on which the power semiconductor element formed of the silicon semiconductor is mounted, or the second electron on which the power semiconductor element formed of the wide band gap semiconductor is mounted. The substrate 11b can be selectively mounted. For this reason, it is possible to provide the induction heating cooker 100 that can be selectively used in the same device without the need to replace the entire device according to the purpose and application of the user.

  Further, in the present embodiment, the control main microcomputer 9 identifies whether the first electronic board 11a or the second electronic board 11b is mounted on the main body 1, and displays the identification result on the display unit 12 and the notification. The unit 13 is informed. For this reason, the kind of power semiconductor element mounted in the main body 1 can be notified. Therefore, the user, the serviceman, and the like can grasp the type of the power semiconductor element mounted on the main body 1 and can improve the usability or workability.

Embodiment 2. FIG.
In the second embodiment, a mode in which the upper limit of the thermal power (electric power) set in the heating port is set according to the type of the mounted electronic substrate 11 will be described.
In addition, the structure of the induction heating cooking appliance 100 in this Embodiment 2 is the same as that of the said Embodiment 1, and attaches | subjects the same code | symbol to the same part.

The heating operation of induction heating cooker 100 in the second embodiment will be described.
When the heating port is selected and the thermal power is set by the operation from the operation unit 2, the control main microcomputer 9 transmits a thermal power command to the control slave microcomputer 8 corresponding to the selected heating port.
The control slave microcomputer 8 drives the switching elements 4a and 4b of the inverter circuit 4 based on a command from the control main microcomputer 9, and performs control so that the output power of the inverter circuit 4 becomes a desired set heating power.
The control main microcomputer 9 transmits the changed thermal power command value to the control slave microcomputer 8 when the operation section 2 is operated to change the thermal power setting, and the control slave microcomputer 8 In accordance with the command value, the output of the inverter circuit 4 is controlled so as to obtain a desired set thermal power.

(Upper limit thermal power setting)
As described above, the thermal power set for each heating port, that is, the power (thermal power) input from the inverter circuit 4 to the heating coil 5a is set by a thermal power command, but an upper limit is set for this power (thermal power). Is done.
When the main microcomputer 9 for control identifies that the first electronic board 11a is mounted, the upper limit of power input to one heating coil 5a is identified as the second electronic board 11b is mounted. Set smaller. Hereinafter, this state is referred to as an energy saving mode state.
Further, when the main microcomputer 9 for control identifies that the second electronic board 11b is mounted, the upper limit of the electric power input to one heating coil 5a is identified as the first electronic board 11a is mounted. Set a larger value than you did. Hereinafter, this state is referred to as a high thermal power mode state.

For example, when the first electronic substrate 11a is mounted, the upper limit of the power input to one heating coil 5a is set to 2000W. On the other hand, in the case where the second electronic board 11b is mounted, the upper limit of the power input to one heating coil 5a is set to 3000W.
As a result, when the second electronic substrate 11b on which the power semiconductor element formed of the wide band gap semiconductor is mounted is mounted, high-heat cooking is possible, and the power semiconductor element formed of the silicon semiconductor is When the mounted first electronic substrate 11a is mounted, energy saving use of the cooking device is possible. Further, the control main microcomputer 9 holds control information (program etc.) of the control main microcomputer 9 so that the upper limit of the power can be set according to the identification result of the mounted board type. Even when 11 types are changed, control according to the type of the electronic board 11 is possible without changing the control information (program etc.) of the control main microcomputer 9.

(Notification operation)
The induction heating cooker 100 according to the second embodiment performs automatic notification and special notification operations by the same operation as that of the first embodiment.
At this time, in S104 of the automatic notification operation and S203 of the special notification operation, at least one of the display unit 12 and the notification unit 13 notifies whether the energy saving mode or the high output mode is set.

  As described above, in the present embodiment, the first electronic substrate 11a on which the power semiconductor element formed of the silicon semiconductor is mounted, or the second electron on which the power semiconductor element formed of the wide band gap semiconductor is mounted. The substrate 11b can be selectively mounted. For this reason, it is possible to provide the induction heating cooker 100 that can be selectively used in the same device without the need to replace the entire device according to the purpose and application of the user.

  The main microcomputer 9 for control identifies whether the first electronic board 11a or the second electronic board 11b is mounted on the main body 1, and controls at least the drive of the inverter circuit 4 according to the identification result. . For this reason, control according to the type of the electronic board 11 is possible without changing the control information (program etc.) of the main microcomputer 9 for control.

  Further, when it is identified that the first electronic board 11a is mounted, the upper limit of the power output from the inverter circuit 4 is made smaller than when the second electronic board 11b is identified, and the energy saving mode state is set. Is notified to the display unit 12 and the notification unit 13. For this reason, it becomes easy for the user to grasp that the induction heating cooker 100 is in the energy saving mode, and usability can be improved.

  Further, when it is identified that the second electronic board 11b is mounted, the upper limit of the power output from the inverter circuit 4 is made larger than that when it is identified that the first electronic board 11a is mounted. The display unit 12 and the notification unit 13 are informed of the state. For this reason, it becomes easy for the user to grasp that the induction heating cooker 100 is in the high heating power mode state, and usability can be improved.

Embodiment 3 FIG.
In the third embodiment, as an example of the electric device of the present invention, an air conditioner, a washing machine, a household appliance such as a refrigerator, and a motor driving device that drives a motor mounted on an elevator, a railcar, etc. An embodiment to which the present invention is applied will be described.

FIG. 8 is a diagram illustrating a circuit of the motor drive device according to the third embodiment.
In FIG. 8, the inverter circuit 4 is configured by bridge-connecting switching elements 4a to 4f each composed of a power semiconductor element. The inverter circuit 4 receives the DC voltage output rectified by the DC power supply circuit 3 and converts the input DC voltage into a three-phase AC having an arbitrary voltage and an arbitrary frequency by, for example, PWM control.
The load circuit 7 is configured by, for example, a three-phase motor 70 and is rotationally driven by a three-phase alternating current from the inverter circuit 4. The three-phase motor 70 is used as a motor mounted on home appliances such as an air conditioner, a motor that drives a fan and a compressor of a refrigerator, and a motor that drives a washing tub of a washing machine. The three-phase motor 70 is used as an elevator drive motor for an elevator and a power motor for a railway vehicle.
Other configurations are the same as those of the first embodiment, and the same reference numerals are given to the same portions.

Also in the third embodiment, the first electronic substrate 11a on which the power semiconductor element formed of the silicon semiconductor is mounted or the second electronic substrate 11b on which the power semiconductor element formed of the wide band gap semiconductor is mounted is provided. , Can be selectively mounted. For this reason, it is not necessary to replace the entire electric device in order to change the power semiconductor element, and it is possible to provide an electric device that can selectively use the power semiconductor element in the same device.
Further, the type of power semiconductor element mounted on the main body 1 can be notified, and the user, service person, etc. can grasp the type of power semiconductor element mounted on the main body 1 and are easy to use. Improvement or workability can be improved.

  DESCRIPTION OF SYMBOLS 1 Main body, 2 Operation part, 3 DC power supply circuit, 3a Diode bridge, 3b Reactor, 3c Smoothing capacitor, 4 Inverter circuit, 4a-4f Switching element, 5a Heating coil, 5b Resonance capacitor, 7 Load circuit, 8 Control sub microcomputer , 9 Control main microcomputer, 10a Pull-up resistor, 10b Pull-down resistor, 11 Electronic board, 11a First electronic board, 11b Second electronic board, 12 Display section, 13 Notification section, 14 Main board, 15a connector, 15b connector, 16 Harness, 20 Cooling fan, 21 Intake port, 22 Exhaust port, 70 Three-phase motor, 100 Induction heating cooker, G Grill box, HC center heating port, HL Left heating port, HR Right heating port

Claims (6)

A main body on which a first substrate on which a power semiconductor element formed of a silicon semiconductor is mounted or a second substrate on which a power semiconductor element formed of a wide band gap semiconductor is mounted;
A load circuit;
A drive circuit configured by the power semiconductor element and driving the load circuit;
Notification means;
Control means for controlling the notification means and driving of the drive circuit;
An operation means for inputting various operations ;
The control means includes
Identifying whether the first substrate or the second substrate is mounted on the main body,
In response to an input from the operation means, it is determined whether or not to notify the notification means of the identification result,
An electrical apparatus characterized by causing the notification means to notify the identification result when it is determined to be notified. The control means includes
Notification timing information corresponding to at least one of time, date, and day of the week is set,
The electrical device according to claim 1, wherein the notification unit is notified of the identification result in accordance with the notification timing information. The control means includes
Identifying whether the first substrate or the second substrate is mounted on the main body based on an attachment state or a connection switching state of circuit components mounted on the first substrate and the second substrate. The electrical apparatus according to claim 1 or 2 , characterized by the above. A main body on which a first substrate on which a power semiconductor element formed of a silicon semiconductor is mounted or a second substrate on which a power semiconductor element formed of a wide band gap semiconductor is mounted;
A heating coil for inductively heating an object to be heated;
A drive circuit configured by the power semiconductor element and driving the heating coil;
Notification means;
Control means for controlling the notification means and driving of the drive circuit;
An operation means for inputting various operations ;
The control means includes
Identifying whether the first substrate or the second substrate is mounted on the main body,
In response to an input from the operation means, it is determined whether or not to notify the notification means of the identification result,
An induction heating cooker characterized by causing the notification means to notify the identification result when it is determined to be notified. The control means includes
When identifying that the second substrate is mounted, the upper limit of the power output from the drive circuit is larger than when identifying that the first substrate is mounted;
The induction heating cooker according to claim 4 , wherein the informing means is informed that it is in a high thermal power mode state. The control means includes
When identifying that the first substrate is mounted, lower the upper limit of the power output from the drive circuit than when identifying that the second substrate is mounted;
The induction heating cooker according to claim 4 or 5 , wherein the informing means is informed that it is in an energy saving mode state.

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