JP6131228B2 - Circuit board manufacturing method and circuit board manufacturing apparatus - Google Patents

Description

  The present invention relates to a circuit board manufacturing method and a circuit board manufacturing apparatus.

  A screen printing apparatus is known that includes a plurality of actuators that are provided on the peripheral edge of a screen on which alignment marks are formed and that apply a predetermined tensile force toward the outside of the screen (see Patent Document 1).

JP-A-11-240129

  When forming a pattern on a substrate using the above-described screen printing apparatus, after positioning the position of the alignment mark formed in advance on the screen and the position of the alignment mark formed in advance on the substrate, The screen is stretched to form a pattern on the substrate. At this time, since the printing accuracy of the screen printing apparatus is not taken into consideration, there is a problem that the dimensional accuracy of the pattern formed on the substrate may be lowered.

  The problem to be solved by the present invention is to provide a circuit board manufacturing method and a circuit board manufacturing apparatus with high dimensional accuracy.

[1] A method of manufacturing a circuit board according to the present invention includes a first step of forming a first alignment mark on an alignment member by a pattern forming unit, the alignment member, and a second alignment mark formed in advance. A second step of opposing the formed substrate, a third step of detecting a difference between the position of the first alignment mark and the position of the second alignment mark , and the first alignment And a fourth step of extending the substrate so that the mark and the second alignment mark coincide with each other, and a fifth step of forming a predetermined pattern on the substrate by the pattern forming means. And

[2] In the above invention, before the substrate is extended in the fourth step, the first alignment mark may be arranged outside the second alignment mark .

[3] In the above invention, when manufacturing a plurality of substrates, the first step may be performed only for the first time.

[4] In the above invention, the pattern forming means may have a cylindrical body that rotates in a predetermined direction, and the pattern formed on the outer peripheral surface of the cylindrical body may be transferred to the object to be formed.

[5] In the above invention, after the fifth step, a sixth step of holding the stretched state of the substrate using a holding jig may be further included.

[6] A circuit board manufacturing apparatus according to the present invention includes a pattern forming unit that forms a pattern on an object to be formed, a holding unit that holds an alignment member on which a first alignment mark is formed by the pattern forming unit, A stage for holding a substrate on which a second alignment mark is formed in advance so as to face the alignment member held by the holding means, a position of the first alignment mark , and a substrate formed in advance on the substrate. The detection means for detecting the difference between the second alignment mark and the position of the second alignment mark, and the substrate held on the stage is extended so that the first alignment mark and the second alignment mark coincide with each other. comprising a tension applying means, said patterning means, a predetermined pattern on the substrate in a state of being stretched by the tension applying means Formed, characterized in that.

[7] In the above invention, the substrate may further include a holding jig for fixing the substrate to the stage and holding the substrate in a stretched state.

  According to the present invention, the substrate is stretched based on the difference between the position of the first pattern formed on the alignment member and the position of the second pattern previously formed on the substrate. Since this difference includes the influence of the pattern formation accuracy of the pattern forming means, the dimensional error of the pattern formed on the substrate is suppressed. As a result, a circuit board with high dimensional accuracy can be obtained.

FIG. 1 is a plan view showing a schematic configuration of a circuit board manufacturing apparatus according to the first embodiment of the present invention. FIG. 2 is a diagram showing a schematic configuration of the circuit board manufacturing apparatus according to the first embodiment of the present invention, and is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a plan perspective view showing a range that can be observed with a microscope when the observation unit according to the first embodiment of the present invention is arranged on an insulating substrate. FIG. 4 is a plan view showing a state in which the insulating substrate is gripped by the tensioner in the first embodiment of the present invention. FIG. 5 is a perspective view showing a schematic configuration of the gravure roll in the first embodiment of the present invention. 6 is a plan view showing a schematic configuration of the reference workpiece in the first embodiment of the present invention. FIG. 7 is a plan view showing a schematic configuration of the circuit board in the first embodiment of the present invention. FIG. 8 is a flowchart showing a circuit board manufacturing method according to the first embodiment of the present invention. FIG. 9A to FIG. 9C are side views of the circuit board manufacturing apparatus for explaining the method for fixing the reference work to the reference work unit in step S3 in the first embodiment of the present invention. FIG. 10A is a plan view for explaining a method of aligning the reference workpiece and the insulating substrate in step S7 in the first embodiment of the present invention, and FIG. 10B is the first embodiment of the present invention. FIG. 10C is a plan view illustrating a method of detecting a difference in step S8 in the embodiment, and FIG. 10C is a diagram after applying a tensile force to the insulating substrate based on the difference in step S9 in the first embodiment of the present invention. It is a top view which shows the state of. FIG. 11 is a diagram showing a schematic configuration of a circuit board manufacturing apparatus according to the second embodiment of the present invention, and is a cross-sectional view corresponding to a view taken along line II-II in FIG. FIG. 12 is a view for explaining the holding jig in the second embodiment of the present invention, and is an exploded perspective view of the holding jig, the insulating substrate, and the film stage.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< First Embodiment >>
FIG. 1 is a plan view showing a schematic configuration of a circuit board manufacturing apparatus according to the first embodiment of the present invention, and FIG. 2 is a diagram showing a schematic configuration of the circuit board manufacturing apparatus according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line II-II, FIG. 3 is a plan perspective view showing a range that can be observed by a microscope when the observation unit according to the first embodiment of the present invention is arranged on an insulating substrate, and FIG. The top view which shows the state which hold | gripped the insulating board | substrate with the tensioner in 1st Embodiment of this, FIG. 5 is a perspective view which shows schematic structure of the gravure roll in 1st Embodiment of this invention.

  The circuit board manufacturing apparatus 1 according to the present embodiment is an apparatus for manufacturing the circuit board 100 by forming the electronic component 120 on the insulating substrate 110 after correcting the insulating substrate 110 into a predetermined shape according to the reference workpiece 90. It is. In the following description, first, the circuit board manufacturing apparatus 1 will be described in detail. Next, the reference workpiece 90 will be described in detail. Next, the circuit board 100 will be described in detail.

  As shown in FIGS. 1 and 2, the circuit board manufacturing apparatus 1 includes a housing 10, an observation unit 20, a reference work unit 30, a tensioner 40, a film stage 50, an alignment stage 60, and gravure offset printing. Device 70.

  As shown in FIGS. 1 and 2, the housing 10 has a bottom portion 11 and side portions 13. The bottom part 11 has a substantially flat plate shape, and side parts 13 are formed at both ends thereof. The bottom 11 has a bottom rail 12. The bottom rail 12 extends on the substantially central axis of the bottom 11 along the Y direction in the figure. The side portions 13 are provided as a pair at both ends of the bottom portion 11, and extend in a direction substantially perpendicular to the bottom portion 11. On each of the side portions 13, side rails 14 are provided extending along the Y direction.

  As shown in FIGS. 1 and 2, the observation unit 20 includes a support unit 21, a guide 22, and a microscope 23. The support portion 21 is bridged between the pair of side rails 14. The support portion 21 has a traveling portion 211 and an opening 212. The traveling part 211 is provided at both ends of the support part 21 and is slidably engaged with the side rail 14. The traveling unit 211 slides along the extending direction of the side rails 14 so that the observation unit 20 can move. By moving the observation unit 20 above the insulating substrate 110, the insulating substrate 110 can be observed with the microscope 23. On the other hand, by retracting the observation unit 20 from above the insulating substrate 110, the insulating substrate 110 can be detached from the tensioner 40. A plurality (four in this embodiment) of openings 212 are formed in the vicinity of the approximate center of the support portion 21 and penetrate the support portion 21 along the Z direction.

  The guide 22 is disposed in each of the four openings 212 provided in the support portion 21. The guide 22 has an X direction moving mechanism and a Y direction moving mechanism. As a specific example of the X direction moving mechanism and the Y direction moving mechanism, for example, a mechanism having a feed screw mechanism can be exemplified. A microscope 23 can be attached to each guide 22. The microscope 23 can be moved in the X direction and the Y direction by operating the X direction moving mechanism and the Y direction moving mechanism described above with the microscope 23 attached to the guide 22. The configuration of the guide 22 is not particularly limited to the above.

  The microscope 23 is arranged so that the objective lens faces downward. The microscope 23 is attached to the guide 22 by attachment means (not shown) corresponding to each of the four guides 22 described above. Thereby, each microscope 23 can be operated independently of each other. The microscope 23 has a function of moving up and down along the Z direction, and can adjust the focal length according to the object to be observed.

  As shown in FIG. 3, the four microscopes 23 can observe the insulating substrate 110 from above in a non-overlapping range (shaded portion in the drawing) in plan view. The four microscopes 23 can visually recognize the insulating substrate 110 through the opening 321a of the reference work unit 30, and in this opening 321a, almost the entire area of the plane of the insulating substrate 110 can be observed. ing. Further, a CCD camera (not shown) is attached to the microscope 23, and each portion can be observed at the same time by projecting the imaged signal on a monitor. In the present embodiment, four openings 212, guides 22, and microscopes 23 are provided, but the number is not particularly limited as long as the plane of the insulating substrate 110 can be observed. The “microscope 23” in the present embodiment corresponds to an example of “detection means” in the present invention.

  As shown in FIGS. 1 and 2, the reference work unit 30 is a unit that fixes the reference work 90 to the housing 10 via the reference work unit 30. The reference work unit 30 includes a reference work holder 31 and a reference work holding unit 32. The “reference work unit 30” in the present embodiment corresponds to an example of the “holding unit” in the present invention.

  The reference work holder 31 is made of a transparent material such as glass. As shown in FIGS. 1 and 2, the reference work holder 31 has a vacuum suction hole 311 formed therein. The vacuum suction hole 311 penetrates the reference work holder 31 along the Z direction. In a state where the reference workpiece 90 is held by the reference workpiece unit 30, one end of the vacuum suction hole 311 faces the upper main surface of the reference workpiece 90. The other end of the vacuum suction hole 311 is connected to one end of a vacuum suction hole 324 (described later) formed in the reference work holder holding portion 323.

  The reference work holding part 32 includes a support 321, a fixing screw 322, a reference work holder holding part 323, and a vacuum pump 325. The support body 321 has an opening 321a at substantially the center. The opening 321a is formed so that the insulating substrate 110 placed on the film stage 50 can be visually recognized from the microscope 23 disposed above. The fixing screw 322 fixes both ends of the support body 321 to the both side portions 13 so as to be detachable.

  The reference work holder holding part 323 is provided on the lower surface side of the support body 321. The reference work holder holding portion 323 is formed along the outer edge portion of the opening 321a. A vacuum suction hole 324 is formed in the reference work holder holding portion 323. One end of the vacuum suction hole 324 is connected to the vacuum suction hole 311 described above. The other end of the vacuum suction hole 324 is open to the outside. The vacuum pump 325 is connected to the end of the vacuum suction hole 324 that is open to the outside via a conduit. By driving the vacuum pump 325, the reference work 90 can be sucked and fixed onto the reference work holder 31 through the vacuum suction holes 311 and 324.

  As shown in FIG. 2, the tensioner 40 is provided in the housing 10, and a plurality of tensioners 40 are arranged along the outer edge portion of the film stage 50. In the present embodiment, as shown in FIG. 4, four tensioners 40 are arranged on each side of the insulating substrate 110. Each tensioner 40 can operate individually and can apply a tensile force to the insulating substrate 110 independently. In addition, it is preferable that these tensioners 40 arrange | position between adjacent tensioners 40 with the pitch (center distance) of 20-150 [mm], and it is more preferable that it is 100 [mm] or less.

  The tensioner 40 includes an actuator 41 and a grip clip 42. The actuator 41 can be exemplified by a motor-driven linear actuator or the like. The actuator 41 has an arm portion 411 extending along the X direction or the Y direction. The arm portion 411 is connected to the above-described linear actuator, and can thereby advance and retreat along the X direction or the Y direction. The maximum tension Tmax of the actuator 41 is preferably 10 to 500 [N] for each tensioner 40, and more preferably 100 [N] to 200 [N]. Further, the moving resolution of the actuator 41 is preferably 10 [μm] or less, and more preferably 1 [μm] or less. This is because the deformation generated in the insulating substrate 110 is often several hundreds [μm].

  The grip clip 42 is provided at the tip of the arm portion 411. The grip clip 42 has a pair of claw portions 421. With the insulating substrate 110 interposed between the pair of claw portions 421, the insulating substrate 110 can be gripped by making the distance between the claw portions 421 closer to each other. Examples of such a gripping mechanism for the gripping clip 42 include a mechanism using a pressure of compressed air, a spring, or a screw. In the present embodiment, the pair of claw parts 421 are close to each other, but the present invention is not particularly limited thereto. For example, one claw part 421 is fixed and the other claw part 421 is relatively close to each other. The insulating substrate 110 may be gripped.

  Here, the insulating substrate 110 of the present embodiment may be subjected to a smoothing process on the upper main surface and a smoothing process on the lower main surface. In this case, the pair of claw portions 421 of the grip clip 42 may correspond to the surface treatment of the insulating substrate 110. For example, the surface roughness of the contact surface of the upper claw portion 421 that contacts the insulating substrate 110 may be different from the surface roughness of the contact surface of the lower claw portion 421 that contacts the insulating substrate 110. In this way, by making the surface roughness of each contact surface of the claw portion 421 correspond to the surface roughness of the insulating substrate 110 in contact, the displacement due to slipping or the like is suppressed when a tensile force is applied. The “tensioner 40” in the present embodiment corresponds to an example of the “tension applying unit” in the present invention.

  The film stage 50 is provided in the housing 10 as shown in FIG. The insulating substrate 110 and the reference workpiece 90 can be placed on the upper surface of the film stage 50. The film stage 50 is detachably attached to a moving stage 61 (described later) of the alignment stage 60 by a method not particularly shown. The film stage 50 may have a fixing unit that fixes the placed insulating substrate 110 and the reference workpiece 90. Such a fixing means is not particularly limited, and examples thereof include a porous chuck and a vacuum suction mechanism provided with a vacuum suction opening or groove. By fixing the insulating substrate 110 and the reference workpiece 90, positional deviation due to slipping or the like is suppressed. The “film stage 50” in the present embodiment corresponds to an example of the “stage” in the present invention.

  The alignment stage 60 is provided in the housing 10 as shown in FIG. The alignment stage 60 includes a moving stage 61, a moving mechanism 62, and a traveling unit 63. A tensioner 40 is provided on the moving stage 61. A film stage 50 can be mounted on the moving stage 61. As will be described later, when the first alignment mark 91 is formed on the reference work 90, the reference work 90 is fixed on the film stage 50 attached to the moving stage 61.

  The moving mechanism 62 includes an X direction moving mechanism, a Y direction moving mechanism, a rotating mechanism, and a height moving mechanism. Examples of the X direction moving mechanism, the Y direction moving mechanism, and the height moving mechanism include those having a feed screw mechanism. As a rotation mechanism, what is comprised from the rotating plate and the rotating shaft provided in the approximate center of the rotating plate can be illustrated, for example. A moving stage 61 is provided on the moving mechanism 62, and the moving stage 61 can be moved by operating the moving mechanism 62. The configuration of the moving mechanism 62 is not particularly limited to the above.

  The traveling portion 63 is formed on the bottom surface side of the alignment stage 60 and is slidably engaged with the bottom rail 12 formed on the bottom portion 11. The running stage 63 slides along the extending direction of the bottom rail 12 so that the alignment stage 60 can move. By making the alignment stage 60 face the reference work unit 30, the insulating substrate 110 placed on the alignment stage 60 can be aligned. In addition, by making the alignment stage 60 face the gravure offset printing apparatus 70, a predetermined pattern can be formed on the object to be formed. In the present specification, the “formation object” is a general term for the reference workpiece 90 and the insulating substrate 110.

  The gravure offset printing apparatus 70 is an apparatus that forms a predetermined pattern by transferring the conductive ink M to a forming body by a gravure offset printing method. In the present embodiment, the first alignment mark 91 is formed on the reference workpiece 90 using the gravure offset printing apparatus 70. In addition, the electronic component 120 is formed on the insulating substrate 110 using the gravure offset printing apparatus 70. The “predetermined pattern” is a generic name for the first alignment mark 91 and the electronic component 120. The “gravure offset printing apparatus 70” in the present embodiment corresponds to an example of the “pattern forming unit” in the present invention.

  The gravure offset printing apparatus 70 includes a gravure roll 71, a doctor blade 72, an ink storage unit 73, and a transfer roll 74. The gravure roll 71 is supported by the both side portions 13 through bearing portions (not shown) provided on the both side portions 13. The gravure roll 71 has a plate cylinder 711 and a gravure plate 712. The plate cylinder 711 has a cylindrical shape, and can be driven to rotate around its axis by a motor (not shown). The gravure plate 712 is wound around the outer peripheral surface of the plate cylinder 711. On the surface of the gravure plate 712, a concave pattern 712a corresponding to a predetermined pattern to be formed on the object is formed. The concave pattern 712a is filled with the conductive ink M and transferred to the object to be formed, whereby a predetermined pattern is formed.

  As shown in FIG. 5, the concave pattern 712a in the present embodiment has a first region Z1 and a second region Z2. The first region Z1 corresponds to the first alignment mark 91 formed on the reference workpiece 90. The second region Z2 corresponds to the electronic component 120 formed on the insulating substrate 110. The first region Z1 and the second region Z2 are arranged on the surface of the gravure plate 712 so as not to interfere with each other. When the first alignment mark 91 is formed on the reference workpiece 90 using the gravure roll 71 having the concave pattern 712a, a pattern corresponding to the second region Z2 may be formed on the reference workpiece 90 together. There is no problem in the function of the reference workpiece 90 as an alignment member.

  The doctor blade 72 is disposed around the gravure roll 71. The doctor blade 72 is provided such that the tip thereof is in sliding contact with the gravure plate 712. The ink storage unit 73 is provided so that the conductive ink M adheres to the surface of the gravure plate 712. The material of the conductive ink M is not particularly limited, but for example, a material containing nanoparticles such as gold (Au), silver (Ag), copper (Cu), carbon (C), or CNT (carbon nanotube). It can be illustrated.

  The transfer roll 74 is supported on the both side portions 13 via bearing portions (not shown) provided on the both side portions 13. Further, the transfer roll 74 has a vertical movement mechanism (not shown) and can come into contact with the gravure plate 712 of the gravure roll 71. The transfer roll 74 has a blanket cylinder 741, an adhesive layer 742, and a blanket 743. The blanket cylinder 741 is a cylindrical body having a cylindrical shape. The blanket cylinder 741 can be driven to rotate around its axis by a motor (not shown). The adhesive layer 742 is formed between the blanket cylinder 741 and the blanket 743, and the blanket 743 is fixed on the outer peripheral surface of the blanket cylinder 741 by the adhesive layer 742.

  The blanket 743 has a function of receiving the conductive ink M from the gravure plate 712 and transferring it to the object to be formed, and is wound around the outer peripheral surface of the blanket cylinder 741. The blanket 743 is generally made of a material such as silicone rubber, fluorine rubber, fluorosilicone rubber, urethane rubber, acrylonitrile-butadiene copolymer rubber (NBR), acrylic rubber, or chloroprene rubber. However, it is preferable to use silicone rubber from the viewpoint of excellent ink releasability.

  The gravure offset printing apparatus 70 according to the present embodiment rotates a transfer roll 74 that is a cylindrical body, and transfers a pattern formed on the surface of the transfer roll 74 to an object to be formed, thereby forming a predetermined pattern. . Such a gravure offset printing apparatus 70 has high dimensional accuracy in the TD direction (Transverse Direction). On the other hand, in the MD direction (Machine Direction), the dimensional accuracy is inferior to that in the TD direction due to the influence of the mechanical accuracy of the gravure offset printing apparatus 70. The TD direction is the axial direction of the transfer roll 74. Further, the MD direction is a direction perpendicular to the TD direction, and in the present embodiment, is the feed direction of the body to be formed (that is, the extending direction of the bottom rail 12).

  Here, the gravure roll 71 and the transfer roll 74 can be rotated by different motors. Thereby, the rotation speed of the gravure roll 71 and the rotation speed of the transfer roll 74 can be set independently of each other. In the gravure offset printing apparatus 70 of the present embodiment, the dimensional accuracy can be improved by controlling the speed difference between the rotation speed of the gravure roll 71 and the rotation speed of the transfer roll 74.

  Specifically, when the conductive ink M is transferred from the gravure roll 71 to the transfer roll 74, the speed difference between the rotation speed of the gravure roll 71 and the rotation speed of the transfer roll 74 is controlled. The pattern is expanded or contracted according to the difference, and the ink is transferred to the target position. Thereby, the improvement of the dimensional accuracy of MD direction is achieved. The dimensional correction method in the MD direction is not particularly limited to the above, and the pressure (so-called nip pressure) at the contact surface between the gravure roll 71 and the transfer roll 74 may be controlled. Alternatively, the speed difference between the rotation speed of the transfer roll 74 and the feed speed of the object to be formed may be controlled. The “transfer roll 74” in the present embodiment corresponds to an example of the “cylindrical body” in the present invention.

  In the present embodiment, the predetermined pattern is formed on the object to be formed by the gravure offset printing method, but is not particularly limited to the above. For example, although not particularly limited, a gravure printing method using a plate cylinder having a concave pattern, a flexographic printing method using a plate cylinder having a convex pattern, or a transfer roll having a plate cylinder having a convex pattern and a blanket is used. A predetermined pattern may be formed on the object by a flexographic offset printing method or the like. In the case of the gravure printing method, the plate cylinder having a concave pattern corresponds to an example of the “cylindrical body” in the present invention. In the case of the flexographic printing method, the plate cylinder having a convex pattern corresponds to an example of the “cylindrical body” in the present invention. In the case of the flexo offset printing method, the transfer roll having a blanket corresponds to an example of the “cylindrical body” in the present invention.

  Next, the reference workpiece 90 will be described in detail with reference to FIGS. 6 (a) and 6 (b).

  FIG. 6 is a plan view showing a schematic configuration of the reference workpiece in the first embodiment of the present invention.

  The reference workpiece 90 is made of a transparent material, and has a substantially rectangular plate shape in the present embodiment. As a specific example of the material constituting the reference workpiece 90, the same material as that of the insulating substrate 110 described later can be exemplified. By aligning the material of the reference workpiece 90 and the material of the insulating substrate 110, there is a difference in the material to be configured between the patterns (the first alignment mark 91 and the electronic component 120 in this embodiment) formed in each. The resulting dimensional error is reduced. The shape of the reference workpiece 90 and the material constituting the reference workpiece 90 are not particularly limited to the above. As shown in FIG. 6, a first alignment mark 91 is formed on the reference workpiece 90 by the gravure offset printing apparatus 70 described above. The first alignment marks 91 are arranged at four locations on each long side along the longitudinal direction (X direction in the drawing) of the reference workpiece 90. In addition, the first alignment marks 91 are arranged at three locations on each short side along the short direction (Y direction in the drawing) of the reference workpiece 90. Accordingly, a total of ten first alignment marks 91 are formed for one reference workpiece 90.

Here, the first alignment mark 91 is displaced outward from a target position (hereinafter, also simply referred to as “design position P”) due to, for example, the mechanical accuracy of the gravure offset printing apparatus 70 itself. May be formed at different positions. In the present embodiment, as shown in FIG. 6, each first alignment mark 91 is shifted to the outside by a first shift amount B (B1 to B10) with respect to each corresponding design position P. Is formed. The design position P is a design theoretical position of the first alignment mark 91. "Reference work 90" in this embodiment corresponds to an example of "positioning member" in the present invention, an example of the "first alignment mark" of the "first alignment mark 91" is the present invention in this embodiment Equivalent to.

  Next, the structure of the circuit board 100 corrected by the above-described circuit board manufacturing apparatus 1 will be described with reference to FIGS. 7 (a) and 7 (b).

  FIG. 7 is a plan view showing a schematic configuration of the circuit board in the first embodiment of the present invention.

  The circuit board 100 is a so-called flexible printed wiring board (FPC), and includes an insulating substrate 110 and an electronic component 120 as shown in FIG. The insulating substrate 110 has a substantially rectangular flat plate shape. The material constituting the insulating substrate 110 may be any material having electrical insulation properties, but more preferably has transparency and a low thermal shrinkage rate. Specific examples of the material constituting the insulating substrate 110 include polystyrene, ABS resin, vinyl chloride resin, methyl methacrylate resin, nylon, fluororesin, polycarbonate, polyimide, and polyethylene terephthalate (PET). And polyester resins such as polyethylene naphthalate (PEN). The thickness of the insulating substrate 110 is not particularly limited, but is preferably 10 [μm] to 200 [μm], and more preferably 30 [μm] to 150 [μm]. The “circuit board 100” in the present embodiment corresponds to an example of the “circuit board” in the present invention, and the “insulating substrate 110” in the present embodiment corresponds to an example of the “substrate” in the present invention.

  A plurality of second alignment marks 111 are formed on the upper main surface of the insulating substrate 110 along the outer edge of the insulating substrate 110. In the present embodiment, four second alignment marks 111 are formed at substantially equal intervals on each long side along the longitudinal direction of the insulating substrate 110. In addition, three second alignment marks are formed at substantially equal intervals along the short side of the insulating substrate 110. Therefore, a total of ten second alignment marks 111 are formed on one insulating substrate 110.

The second alignment mark 111 is formed by patterning a metal film by photolithography, for example, and has high dimensional accuracy. Note that the method of forming the second alignment mark 111 is not particularly limited as long as it has higher accuracy than the gravure offset printing method, the gravure printing method, the flexographic printing method, or the flexographic offset printing method. For example, the second alignment mark 111 may be formed using a laser marking method such as a CO ₂ laser or an excimer laser. Alternatively, the second alignment mark 111 may be formed using a printing method such as reverse printing. The “second alignment mark 111” in the present embodiment corresponds to an example of the “second alignment mark ” in the present invention.

The electronic component 120 in this embodiment is formed on the upper main surface of the insulating substrate 110. Examples of the electronic component 120 include an organic transistor such as a thin film transistor (TFT). The thin film transistor includes a gate electrode, a gate insulating layer, and a semiconductor on an insulating substrate 110. A layer, a source electrode, and a drain electrode can be exemplified by sequentially forming them. Although not particularly shown, a wiring pattern may be formed on the insulating substrate 110. With this wiring pattern, the electronic components 120 can be conductively connected to obtain a predetermined function. The “electronic component 120” in the present embodiment corresponds to an example of the “ predetermined pattern” in the present invention.

  For example, when the electronic component 120 is a thin film transistor having a bottom gate structure, all the elements constituting the thin film transistor may be formed by the circuit board manufacturing apparatus 1 of the present embodiment, but the source electrode and the drain electrode are implemented in the present embodiment. It is preferable to form by the circuit board manufacturing apparatus 1 of the form. A predetermined gap (hereinafter also simply referred to as “channel portion”) is formed between the source electrode and the drain electrode of the thin film transistor. The channel portion is formed corresponding to a position substantially overlapping with the gate electrode in plan view. However, if a dimensional error occurs between the position of the channel portion and the position of the gate electrode, the quality of the thin film transistor is reduced. May decrease. Thus, when forming the source electrode and the drain electrode, high dimensional accuracy is required. The thin film transistor has a top gate structure in addition to the above-described bottom gate structure. In this case, the circuit board manufacturing apparatus 1 of the present embodiment uses a gate electrode corresponding to a channel portion formed in advance. Form.

  Next, a method for manufacturing the circuit board 100 in the present embodiment will be described.

  FIG. 8 is a flowchart showing a method of manufacturing a circuit board according to the first embodiment of the present invention. FIGS. 9A to 9C show a reference work unit as a reference work unit at step S3 in the first embodiment of the present invention. FIG. 10A is a side view of the circuit board manufacturing apparatus for explaining the fixing method, FIG. 10A is a plan view for explaining the method for aligning the reference workpiece and the insulating substrate in step S7 in the first embodiment of the present invention, FIG. 10B is a plan view for explaining a method for detecting a difference in step S8 in the first embodiment of the present invention. FIG. 10C is an insulating diagram based on the difference in step S9 in the first embodiment of the present invention. It is a top view which shows the state after applying a tensile force to a board | substrate. In the following description, FIGS. 1 and 2 are referred to as appropriate.

  In step S <b> 1, the reference workpiece 90 is placed on the film stage 50. Then, the reference workpiece 90 is fixed to the film stage 50. In step S <b> 2, the first alignment mark 91 is formed on the reference work 90 fixed to the film stage 50 by the gravure offset printing apparatus 70.

  Specifically, first, the alignment stage 60 to which the reference workpiece 90 is fixed is moved along the bottom rail 12 so that the transfer roll 74 of the gravure offset printing apparatus 70 and the reference workpiece 90 are opposed to each other. Then, the gravure roll 71 is rotated about the axis, and the conductive ink M is filled in the first region Z1 of the concave pattern 712a of the gravure plate 712. Then, while filling the concave pattern 712 a of the gravure plate 712 with the conductive ink M by the doctor blade 72, excess conductive ink M attached to the surface of the gravure plate 712 is scraped off from the gravure plate 712.

  Then, the gravure roll 71 and the transfer roll 74 are rotated together with the transfer roll 74 approaching the gravure roll 71 and the gravure plate 712 and the blanket 743 being in contact with each other. As a result, the conductive ink M filled in the gravure plate 712 is received by the blanket 743. Then, the reference work 90 is brought close to the transfer roll 74, and the reference work 90 is pressed against the transfer roll 74. Then, by operating the alignment stage 60, the reference workpiece 90 is advanced along the MD direction (feed direction of the forming body (extending direction of the bottom rail 12)) at a speed corresponding to the rotational speed of the transfer roll 74. Then, the conductive ink M is transferred from the transfer roll 74 to the reference workpiece 90. Thereby, the first alignment mark 91 is formed on the reference workpiece 90.

  At this time, the first alignment mark 91 may be formed at a position shifted outward from the design position P due to, for example, the influence of the mechanical accuracy of the gravure offset printing apparatus 70 itself. In the present embodiment, each first alignment mark 91 is formed so that its position is shifted outward by a first shift amount B with respect to each corresponding design position P. In addition, when forming the circuit board 100 continuously over multiple times, step S1 and step S2 which were demonstrated above are implemented only the first time. “Step S2” in the present embodiment corresponds to an example of “first step” in the present invention.

  In step S <b> 3, the reference work 90 is fixed to the reference work unit 30. First, as shown in FIG. 9A, the reference workpiece 90 on which the first alignment mark 91 is formed is moved by the alignment stage 60 and is opposed to the reference workpiece holder 31 fixed to the housing 10 in advance. Then, as shown in FIG. 9B, the moving stage 61 is raised by the moving mechanism 62 (specifically, the height moving mechanism), and the lower surface of the reference work holder 31 and the upper main surface of the reference work 90 are moved. Make contact. The first alignment mark 91 formed in step S1 is formed on the upper main surface of the reference workpiece 90. Here, when the reference work 90 is fixed to the reference work holder 31 so that the surface on which the first alignment mark 91 is formed faces the insulating substrate 110, the reference work 90 and the insulating substrate 110 are overlapped. When observing from above with the microscope 23, the position of the first alignment mark 91 is mirror-reversed, so that the influence of the mechanical accuracy of the gravure offset printing apparatus 70 itself may not be maintained. In order to prevent this, in this embodiment, the reference workpiece 90 is fixed so that the first alignment mark 91 is in contact with the lower surface of the reference workpiece holder 31.

  Then, by operating the vacuum pump 325, the end exposed to the lower surface side of the vacuum suction hole 311 through the vacuum suction hole 324 is set to a negative pressure, and the reference workpiece 90 is vacuum suctioned. Then, as shown in FIG. 9C, the moving stage 61 is lowered, and the alignment stage 60 is put on standby at a position where the insulating substrate 110 is placed on the film stage 50 in order to prepare for the next process. According to the above-described method, the position of the reference workpiece 90 fixed to the housing 10 and the position of the reference workpiece 90 fixed to the film stage 50 in Step S1 are the feed direction of the reference workpiece 90 (that is, the bottom portion). In the direction of extension of the rail 12).

  In step S4, the insulating substrate 110 is placed on the film stage 50. In step S <b> 5, the outer edge portion of the insulating substrate 110 placed on the film stage 50 is gripped by the plurality of tensioners 40. Thus, the insulating substrate 110 is attached to the tensioner 40, and the insulating substrate 110 and the actuator 41 of the tensioner 40 are connected.

  After the insulating substrate 110 and the tensioner 40 are connected, the actuator 41 may slightly retract the arm portion 411 in a direction away from the insulating substrate 110 in order to remove the bending generated in the insulating substrate 110. Good. At this time, the tensile force applied to the insulating substrate 110 is not particularly limited. For example, the tensile force is set to a value of about 1 [N] for each connected tensioner 40.

  In step S6, the reference workpiece 90 and the insulating substrate 110 are opposed to each other. In step S3 described above, the reference work 90 is fixed to the reference work unit 30, and in steps S4 and S5, the insulating substrate 110 placed on the film stage 50 is connected to the tensioner 40, whereby the reference work unit 30 is fixed. The workpiece 90 and the insulating substrate 110 face each other. “Step S6” in the present embodiment corresponds to an example of “second step” in the present invention.

  In step S7, the position of the reference workpiece 90 and the position of the insulating substrate 110 are aligned. Specifically, first, the observation unit 20 is moved above the film stage 50 (specifically, above the reference workpiece 90 and the insulating substrate 110). Then, the position of the first alignment mark 91 and the position of the second alignment mark 111 formed on the insulating substrate 110 are observed with the microscope 23, and the insulating substrate 110 is changed according to the position of the reference workpiece 90. Adjust the position.

  In adjusting the position of the insulating substrate 110, the focal length is adjusted by moving the height of the insulating substrate 110 up and down by the moving mechanism 62, and the first and second alignment marks 91 and 111 are accurately detected by the microscope 23. To be able to observe. Since the microscope 23 has a function of moving up and down along the Z direction, the focal length is adjusted by adjusting the height of the microscope 23 and the height of the insulating substrate 110 using this function. You may combine them.

  In step S7, the position of the insulating substrate 110 is adjusted so that the distance between the first and second alignment marks 91 and 111 is minimized in plan view. Specifically, first, as shown in FIG. 10A, between the first alignment mark 91 and the second alignment mark 111 corresponding to the first alignment mark 91 in plan view. The distance (L1 to L10) is measured from the image captured by the microscope 23. Then, the moving mechanism 62 of the alignment stage 60 is operated so that the total of the measured distances (L1 to L10) is minimized, and the insulating substrate 110 is moved relative to the reference workpiece 90. In addition, the position alignment method of the position of the reference | standard workpiece | work 90 and the position of the insulating board | substrate 110 is not specifically limited above, You may employ | adopt a well-known method.

  In step S8, the difference A between the position of the first alignment mark 91 and the position of the second alignment mark 111 is detected in plan view. The first alignment mark 91 is formed at a position shifted outward from the design position P (see FIG. 6) due to the influence of the mechanical accuracy of the gravure offset printing apparatus 70. On the other hand, the second alignment mark 111 is formed in advance on the insulating substrate 110 and has high dimensional accuracy. As described above, in the present embodiment, the distance generated between the position of the first alignment mark 91 with relatively low dimensional accuracy and the position of the second alignment mark 111 with high dimensional accuracy, that is, the difference A is calculated. To detect. As a result, the difference A in the present embodiment matches the first deviation amount B (A = B).

  Specifically, in step S8, as shown in FIG. 10B, after the position of the reference workpiece 90 and the position of the insulating substrate 110 are adjusted, the first alignment mark 91 in plan view is displayed. Then, the distance between the second alignment mark 111 corresponding to the first alignment mark 91 is measured from the image picked up by the microscope 23, and the difference (A1 to A10) is detected. “Step S7” in the present embodiment corresponds to an example of “third step” in the present invention.

  In step S <b> 9, as shown in FIG. 10C, a tensile force is applied to the insulating substrate 110 to extend the insulating substrate 110. Specifically, in a state where the insulating substrate 110 and the tensioner 40 are connected, the arm portion 411 is moved backward in a direction away from the insulating substrate 110 by the actuator 41. At this time, the insulating substrate 110 is stretched by an amount based on the difference A. The difference A includes the influence of the machine accuracy of the gravure offset printing apparatus 70 itself, and when the electronic component 120 is formed on the insulating substrate 110 later, a dimensional error is suppressed.

  In the present embodiment, in order to prevent excessive correction of the shape of the insulating substrate 110, the insulating substrate 110 is stretched within an elastic deformation range. In this case, the difference A is preferably set to 1% or less with respect to the outer diameter dimension of the insulating substrate 110. “Step S9” in the present embodiment corresponds to an example of “fourth step” in the present invention.

  In step S <b> 10, the electronic component 120 is formed on the insulating substrate 110 by the gravure offset printing apparatus 70. Specifically, first, the alignment stage 60 on which the insulating substrate 110 is placed is moved along the bottom rail 12 so that the transfer roll 74 of the gravure offset printing apparatus 70 and the insulating substrate 110 face each other. Then, the gravure roll 71 is rotated about the axis, and the conductive ink M is filled in the second region Z2 of the concave pattern 712a of the gravure plate 712. Then, while filling the concave pattern 712 a of the gravure plate 712 with the conductive ink M by the doctor blade 72, excess conductive ink M attached to the surface of the gravure plate 712 is scraped off from the gravure plate 712.

  Then, the gravure roll 71 and the transfer roll 74 are rotated together with the transfer roll 74 approaching the gravure roll 71 and the gravure plate 712 and the blanket 743 being in contact with each other. As a result, the conductive ink M filled in the gravure plate 712 is received by the blanket 743. Then, the insulating substrate 110 is brought close to the transfer roll 74, and the insulating substrate 110 is pressed against the transfer roll 74. Then, by operating the alignment stage 60, the insulating substrate 110 is moved along the MD direction (the feeding direction of the object to be formed (the extending direction of the bottom rail 12)) at a speed corresponding to the rotational speed of the transfer roll 74. Then, the conductive ink M is transferred from the transfer roll 74 to the insulating substrate 110. Thereby, the electronic component 120 is formed on the insulating substrate 110. Thus, the circuit board 100 can be obtained. “Step S10” in the present embodiment corresponds to an example of “fifth step” in the present invention.

  Next, the operation of the circuit board 100 manufacturing method and the circuit board manufacturing apparatus 1 according to the present embodiment will be described.

  In the present embodiment, the difference A between the position of the first alignment mark 91 formed on the reference workpiece 90 by the gravure offset printing apparatus 70 and the position of the second alignment mark 111 formed in advance on the insulating substrate 110. The insulating substrate 110 is stretched based on the above. Since the difference A includes the influence of the machine accuracy of the gravure offset printing apparatus 70 itself, the dimensional error of the electronic component 120 formed on the insulating substrate 110 is suppressed. As a result, the circuit board 100 with high dimensional accuracy can be obtained.

  Moreover, in this embodiment, when forming the circuit board 100 continuously over multiple times, step S1 and step S2 are implemented only the first time. Thereby, while shortening the manufacturing process of a circuit board, the circuit board 100 with high dimensional accuracy can be obtained.

  Note that the position of the first alignment mark 91 is shifted inward from the design position P due to the influence of the machine accuracy of the gravure offset printing apparatus 70 itself, so that the first alignment mark 91 becomes the second alignment mark. It may be formed inside the mark 111. In consideration of such a case, the first region Z1 of the concave pattern 712a of the gravure plate 712 may be formed in advance in a pattern in which the first alignment mark 91 is outside the second alignment mark 111. In this case, in the concave pattern 712a of the gravure plate 712, the position of the second area is corrected along with the correction of the position of the first area Z1. Thus, before extending the insulating substrate 110, the position of the first alignment mark 91 is arranged outside the position of the second alignment mark 111, so that the insulating substrate 110 is expanded. Positioning can be performed more reliably.

  In this case, in step S1, the first alignment mark 91 is formed so that the position of the first alignment mark 91 is arranged outside the position of the second alignment mark 111. Of course, the same arrangement is used in S6 and step S10. That is, also in step S6 and step S10, the first alignment mark 91 is formed outside the second alignment mark 111.

<< Second Embodiment >>
FIG. 10 is a diagram showing a schematic configuration of a circuit board manufacturing apparatus according to the second embodiment of the present invention. FIG. 10 is a cross-sectional view corresponding to the view along the line II-II in FIG. 1, and FIG. It is a figure for demonstrating the holding jig in a form, and is an exploded perspective view of a holding jig, an insulating substrate, and a film stage.

  As shown in FIG. 10, the circuit board manufacturing apparatus 1 </ b> B according to the second embodiment of the present invention includes a housing 10, an observation unit 20, a reference work unit 30, a tensioner 40, a film stage 50 </ b> B, and an alignment stage 60. And a gravure offset printing apparatus 70 and a holding jig 80. Since the housing 10, the observation unit 20, the reference work unit 30, the tensioner 40, the alignment stage 60, and the gravure offset printing apparatus 70 in the present embodiment are the same as those in the first embodiment, the same reference numerals are used. The description is omitted. In addition, the circuit board 100B manufactured by the circuit board manufacturing apparatus 1B of the present embodiment includes an insulating substrate 110B and an electronic component 120. Since the electronic component 120 in the present embodiment is the same as that in the first embodiment, the same reference numerals are given and description thereof is omitted. In the following description, first, the film stage 50B and the holding jig 80 will be described in detail. Next, the insulating substrate 110B will be described in detail.

  The film stage 50B of the present embodiment is different from the film stage 50 of the first embodiment in that a holding jig 80 can be attached to the upper main surface. A plurality of bolt holes 51 are formed in the main surface above the film stage 50B along the outer edge of the film stage 50B. The bolt hole 51 is formed along the Z direction on the film stage 50B. An internal thread is formed on the inner surface of the bolt hole 51. In the present embodiment, three bolt holes 51 are formed at substantially equal intervals along the long side of the film stage 50B. In addition, two bolt holes 51 are formed at substantially equal intervals along the short side of the film stage 50B. Accordingly, a total of ten bolt holes 51 are formed for one film stage 50B. These bolt holes 51 are arranged outside the first alignment mark 91 in plan view.

  As shown in FIG. 11, the holding jig 80 is a jig for holding the state where the insulating substrate 110 is extended by the tensioner 40. The holding jig 80 includes a pressing member 81 and a fixing bolt 82. The pressing member 81 has an opening 811 and a through hole 812. The opening 811 is formed at substantially the center of the pressing member 81 so as to penetrate the pressing member 81 along the Z direction. The edge of the opening 811 is disposed outside the first alignment mark 91. The first and second alignment marks 91 and 111 are visible from the microscope 23 disposed above in the region within the opening 811. The shape of the opening 811 is not particularly limited, but is preferably formed along the outer shape of the insulating substrate 110B.

  The through hole 812 is formed so as to penetrate the pressing member 81 along the Z direction. In the present embodiment, three through holes 812 are formed at substantially equal intervals along the long side of the pressing member 81 along the longitudinal direction. In addition, two through holes 812 are formed at substantially equal intervals along the short side of the pressing member 81. Therefore, a total of ten through holes 812 are formed for one pressing member 81. The position of the through hole 812 substantially coincides with the position of the bolt hole 51 of the film stage 50B described above in plan view.

  The fixing bolt 82 can be screwed into the bolt hole 51 described above. The holding jig 80 is placed on the film stage 50B, the position of the bolt hole 51 is aligned with the position of the through hole 812 in plan view, and the fixing bolt 82 is inserted, whereby the holding jig 80 is inserted. It can be attached to the film stage 50B.

  Next, the insulating substrate 110B will be described with reference to FIG.

  The insulating substrate 110B of this embodiment is different from the insulating substrate 110 of the first embodiment in that a plurality of through holes 112 are formed. The through hole 112 is formed so as to penetrate the insulating substrate 110B along the Z direction. In the present embodiment, three through holes 112 are formed at substantially equal intervals along the long side of the insulating substrate 110B. Also, two through holes 112 are formed at substantially equal intervals along the short side of the insulating substrate 110B. Therefore, a total of ten through holes 112 are formed for one insulating substrate 110B. These through holes 112 are arranged outside the second alignment mark 111 in plan view. Further, these through holes 112 are arranged inside the above-described bolt holes 51 and the through holes 812 before the insulating substrate 110B is extended.

  Next, a method for maintaining the stretched state of the insulating substrate 110B will be described.

  The step of maintaining the stretched state of the insulating substrate 110B of the present embodiment is performed after the process up to step S9 is completed in the method of manufacturing a circuit board described in the first embodiment. The “step of maintaining the stretched state of the insulating substrate 110B” in the present embodiment corresponds to an example of the “sixth step” in the present invention.

  As described in step S9 of the first embodiment, after the electronic component 120 is formed on the insulating substrate 110B, the circuit board 100B is moved to a position facing the reference work unit 30 by the alignment stage 60. Then, the observation unit 20 is retracted, and the reference work unit 30 fixed to the housing is removed.

  Here, the circuit board 100B (that is, the insulating substrate 110B) is placed in an extended state on the film stage 50B. A plurality of through holes 112 are formed in the insulating substrate 110B as described above, and the insulating substrate 110B is extended so that the position of the through holes 112 and the film stage are viewed in plan view. The position of the bolt hole 51 of 50B substantially coincides.

  Then, the pressing member 81 of the holding jig 80 is placed on the insulating substrate 110B. As a result, the insulating substrate 110B is interposed between the pressing member 81 and the film stage 50B. Then, as shown in FIG. 11, the fixing bolt 82 is inserted from above in the figure in a state where the position of the through hole 812, the position of the through hole 112, and the position of the bolt hole 51 are substantially coincident with each other. To do. Then, the fixing bolt 82 is screwed into the bolt hole 51 so that the head of the fixing bolt 82 presses the pressing member 81. Thereby, the insulating substrate 110B interposed between the pressing member 81 and the film stage 50B is pressed against the film stage 50B, and the insulating substrate 110B is fixed to the film stage 50B while maintaining the stretched state. The film stage 50B can be detached from the alignment stage 60. As a result, the insulating substrate 110B can be removed from the film stage 50B while being stretched to the film stage 50B, and the process can proceed to the next step in the circuit board manufacturing process.

  Next, the operation of the circuit board 100B manufacturing method and the circuit board manufacturing apparatus 1B according to the present embodiment will be described.

  The circuit board manufacturing apparatus 1B in the present embodiment can also obtain the same operations and effects as the circuit board manufacturing apparatus 1 in the first embodiment.

  Further, by holding the insulating substrate 110B by the holding jig 80 of the present embodiment, it is possible to move to the next step in the circuit board manufacturing process while maintaining the state where the insulating substrate 110B is stretched. . Thereby, when laminating | stacking an electronic component in the next process, the position shift between each layer is suppressed. As a result, it is possible to obtain the circuit board 100 with higher dimensional accuracy and to perform highly accurate overlay printing by using the circuit board manufacturing apparatus 1 of the present embodiment.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1, 1B ... Circuit board manufacturing apparatus 10 ... Housing 11 ... Bottom part 12 ... Bottom rail 13 ... Side part 14 ... Side part rail 20 ... Observation part 21 ... Supporting part 211 ... Traveling part 212 ... Opening 22 ... Guide 23 ... Microscope 30 ... Reference work unit 31 ... Reference work holder 311 ... Vacuum suction hole 32 ... Reference work Holding unit 321... Support 321 a... Opening 322... Fixing screw 323... Reference work holder holding unit 324... Vacuum suction hole 325 ... Vacuum pump 40. Actuator 411 ... Arm part 42 ... Grip clip 421 ... Claw part 50, 50B ... Film stage 51 ... Bolt hole 60 ... Alignment stage 61 ... Moving slider 62 ... Movement mechanism 63 ... Traveling unit 70 ... Gravure printing device 71 ... Gravure roll 711 ... Plate cylinder 712 ... Gravure plate 712a ... Concave pattern 72 ... Doctor Blade 73 ... Ink storage section 74 ... Transfer roll 741 ... Blanket cylinder 742 ... Adhesive layer 743 ... Blanket 80 ... Holding jig 81 ... Holding member 811 ... Opening 812 ... through hole 82 ... fixing bolt 90 ... reference work 91 ... first alignment mark 100, 100B ... circuit board 110,110B ... insulating board 111 ... second Alignment mark 112 ... through hole 120 ... electronic component A ... difference B ... first deviation P ... design position M ... conductive ink Z1 ... first Area Z2 ... second area

Claims (7)

A first step of forming a first alignment mark on the alignment member by the pattern forming means;
A second step of causing the alignment member and a substrate on which a second alignment mark has been previously formed to face each other;
A third step of detecting a difference between the position of the first alignment mark and the position of the second alignment mark ;
A fourth step of extending the substrate so that the first alignment mark and the second alignment mark coincide ;
And a fifth step of forming a predetermined pattern on the substrate by the pattern forming means. It is a manufacturing method of the circuit board according to claim 1, Comprising:
Wherein prior to stretching said substrate in the fourth step, the first alignment mark, the production method of the circuit board, characterized in that it is arranged outside the second alignment mark. A method of manufacturing a circuit board according to claim 1 or 2,
A method of manufacturing a circuit board, wherein the first step is performed only for the first time when a plurality of boards are manufactured. A method for manufacturing a circuit board according to any one of claims 1 to 3,
The pattern forming means includes
A cylindrical body that rotates in a predetermined direction;
A method of manufacturing a circuit board, comprising: transferring a pattern formed on an outer peripheral surface of the cylindrical body to a body to be formed. A method for manufacturing a circuit board according to any one of claims 1 to 4,
After the fifth step, the circuit board manufacturing method further includes a sixth step of holding the substrate in a stretched state using a holding jig. Pattern forming means for forming a pattern on the object to be formed;
Holding means for holding the alignment member on which the first alignment mark is formed by the pattern forming means;
A stage for holding a substrate on which a second alignment mark is formed in advance so as to face the alignment member held by the holding means;
The position of the first alignment mark, the position of the second alignment mark which is previously formed on the substrate, a detecting means for detecting a difference,
Tension applying means for extending the substrate held on the stage so that the first alignment mark and the second alignment mark coincide with each other, and
The circuit board manufacturing apparatus, wherein the pattern forming unit forms a predetermined pattern on the substrate in a state of being stretched by the tension applying unit. The circuit board manufacturing apparatus according to claim 6,
An apparatus for manufacturing a circuit board, further comprising a holding jig for fixing the board to the stage and holding the extended state of the board.

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