JP6133093B2 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
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- JP6133093B2 JP6133093B2 JP2013061255A JP2013061255A JP6133093B2 JP 6133093 B2 JP6133093 B2 JP 6133093B2 JP 2013061255 A JP2013061255 A JP 2013061255A JP 2013061255 A JP2013061255 A JP 2013061255A JP 6133093 B2 JP6133093 B2 JP 6133093B2
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- H10W72/00—Interconnections or connectors in packages
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- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
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- H—ELECTRICITY
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/076—Connecting or disconnecting of strap connectors
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/076—Connecting or disconnecting of strap connectors
- H10W72/07621—Aligning
- H10W72/07627—Aligning involving guiding structures, e.g. spacers or supporting members
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
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- H10W72/07631—Techniques
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- H—ELECTRICITY
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- H10W72/076—Connecting or disconnecting of strap connectors
- H10W72/07631—Techniques
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/076—Connecting or disconnecting of strap connectors
- H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
- H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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- H—ELECTRICITY
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- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W72/631—Shapes of strap connectors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W72/631—Shapes of strap connectors
- H10W72/634—Cross-sectional shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W72/651—Materials of strap connectors
- H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/871—Bond wires and strap connectors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/886—Die-attach connectors and strap connectors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
- H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
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Description
前記リードの一部には、前記バスバーに対して所定間隔離間し、鉛直方向に所定角度傾斜した屈曲部を有し、前記屈曲部に臨んで鉛直方向に延在し前記電力変換装置のケーシングに固定される前記バスバーの鉛直壁と該屈曲部とが半田によって互いに接合されると共に、前記鉛直壁と直交する断面において、前記屈曲部と前記鉛直壁とのなす接合角度が鋭角に設定されることを特徴とする。
14…ヒートシンク 16…回路基板
18a、18b…半導体チップ 20…第1バスバー
22…第2バスバー 24…接続リード
26…絶縁部 30…鉛直壁
38a、38b…水平部 40a、40b…チップ接続部
42…屈曲部 46…空間
48…接合部 52a、52b…フィレット
Claims (10)
- 一部がバスバー及び半導体素子に接続されるリードを有し、該リードを通じて前記バスバーから前記半導体素子の電極へと電力供給を行う電力変換装置であって、
前記リードの一部には、前記バスバーに対して所定間隔離間し、鉛直方向に所定角度傾斜した屈曲部を有し、前記屈曲部に臨んで鉛直方向に延在し前記電力変換装置のケーシングに固定される前記バスバーの鉛直壁と該屈曲部とが半田によって互いに接合されると共に、前記鉛直壁と直交する断面において、前記屈曲部と前記鉛直壁とのなす接合角度が鋭角に設定されることを特徴とする電力変換装置。 - 一端部がバスバーに接続され、他端部が半導体素子に接続されるリードを有し、該リードを通じて前記バスバーから前記半導体素子の電極へと電力供給を行う電力変換装置であって、
前記リードの一端部には、前記バスバーに対して所定間隔離間し、鉛直下方向に所定角度傾斜した屈曲部を有し、前記屈曲部に臨んで鉛直方向に延在する前記バスバーの鉛直壁と該屈曲部とが半田によって互いに接合されると共に、前記鉛直壁と直交する断面において、前記屈曲部と前記鉛直壁とのなす接合角度が鋭角に設定され、前記屈曲部の先端が前記鉛直壁に最も近い位置に配置されていることを特徴とする電力変換装置。 - 一部がバスバー及び半導体素子に接続されるリードを有し、該リードを通じて前記バスバーから前記半導体素子の電極へと電力供給を行う電力変換装置であって、
前記リードの一部には、前記バスバーに対して所定間隔離間し、鉛直方向に所定角度傾斜した略平面状の屈曲部を有し、前記屈曲部に臨んで鉛直方向に延在する前記バスバーの鉛直壁と該屈曲部とが半田によって互いに接合されると共に、前記鉛直壁と直交する断面において、前記屈曲部と前記鉛直壁とのなす接合角度が鋭角に設定されることを特徴とする電力変換装置。 - 請求項1又は2記載の電力変換装置において、
前記屈曲部が略平面状に形成されることを特徴とする電力変換装置。 - 請求項1又は3記載の電力変換装置において、
前記屈曲部の先端が前記鉛直壁に最も近い位置に配置されることを特徴とする電力変換装置。 - 請求項2又は3記載の電力変換装置において、
前記バスバーの鉛直壁が前記電力変換装置のケーシングに固定されることを特徴とする電力変換装置。 - 請求項1〜3のいずれか1項に記載の電力変換装置において、
前記バスバーと前記半田の接触端部とのなす濡れ角が鋭角に設定されることを特徴とする電力変換装置。 - 請求項7記載の電力変換装置において、
前記接合角度と前記濡れ角とは、該接合角度の鋭角が大きくなるに従って前記濡れ角の角度が小さくなる相関関係を有することを特徴とする電力変換装置。 - 請求項1〜3のいずれか1項に記載の電力変換装置において、
前記リードには、前記屈曲部に対して他端部側となる一端部の一部に、該リードの延在方向に沿った水平部を有することを特徴とする電力変換装置。 - 請求項1〜3のいずれか1項に記載の電力変換装置において、
前記屈曲部と前記鉛直壁との間には、該鉛直壁の延在方向と直交する水平方向に沿って所定間隔の間隙が設けられることを特徴とする電力変換装置。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013061255A JP6133093B2 (ja) | 2013-03-25 | 2013-03-25 | 電力変換装置 |
| CN201410072526.0A CN104078455B (zh) | 2013-03-25 | 2014-02-28 | 电力转换装置 |
| US14/223,994 US9455238B2 (en) | 2013-03-25 | 2014-03-24 | Power converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013061255A JP6133093B2 (ja) | 2013-03-25 | 2013-03-25 | 電力変換装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014187818A JP2014187818A (ja) | 2014-10-02 |
| JP6133093B2 true JP6133093B2 (ja) | 2017-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013061255A Active JP6133093B2 (ja) | 2013-03-25 | 2013-03-25 | 電力変換装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9455238B2 (ja) |
| JP (1) | JP6133093B2 (ja) |
| CN (1) | CN104078455B (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6239840B2 (ja) * | 2013-03-27 | 2017-11-29 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6293030B2 (ja) * | 2014-10-09 | 2018-03-14 | 三菱電機株式会社 | 電力用半導体装置 |
| CN107240581A (zh) * | 2016-03-29 | 2017-10-10 | 株式会社京浜 | 电力转换装置及电力转换装置的制造方法 |
| JP7318402B2 (ja) * | 2018-08-02 | 2023-08-01 | 東レ株式会社 | 欠点検査方法および欠点検査装置 |
| JP2020141443A (ja) | 2019-02-26 | 2020-09-03 | 本田技研工業株式会社 | パワーコントロールユニット |
| JP6803442B1 (ja) * | 2019-10-17 | 2020-12-23 | 株式会社ケーヒン | 電力変換装置の製造方法 |
| US12525567B2 (en) * | 2020-12-31 | 2026-01-13 | UTAC Headquarters Pte. Ltd. | Semiconductor device and method of forming clip bond having multiple bond line thicknesses |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
| US5029529A (en) * | 1989-09-25 | 1991-07-09 | Olin Corporation | Semiconductor bridge (SCB) packaging system |
| JPH0521683A (ja) * | 1991-07-12 | 1993-01-29 | Seiko Epson Corp | 半導体素子 |
| KR100214561B1 (ko) * | 1997-03-14 | 1999-08-02 | 구본준 | 버틈 리드 패키지 |
| JP3937265B2 (ja) * | 1997-09-29 | 2007-06-27 | エルピーダメモリ株式会社 | 半導体装置 |
| US6557253B1 (en) * | 1998-02-09 | 2003-05-06 | Tessera, Inc. | Method of making components with releasable leads |
| JP2002503038A (ja) * | 1998-02-09 | 2002-01-29 | テッセラ・インコーポレーテッド | 分離自在のリードを備えた構成素子 |
| JP2001332580A (ja) * | 2000-05-23 | 2001-11-30 | Nec Corp | 半導体装置及びその製造方法 |
| JP3813098B2 (ja) * | 2002-02-14 | 2006-08-23 | 三菱電機株式会社 | 電力用半導体モジュール |
| US7135761B2 (en) * | 2004-09-16 | 2006-11-14 | Semiconductor Components Industries, L.Lc | Robust power semiconductor package |
| JP4720756B2 (ja) * | 2007-02-22 | 2011-07-13 | トヨタ自動車株式会社 | 半導体電力変換装置およびその製造方法 |
| JP2009194279A (ja) * | 2008-02-18 | 2009-08-27 | Panasonic Corp | 積層電子部品 |
| US8283766B2 (en) * | 2010-09-02 | 2012-10-09 | Oracle America, Inc | Ramp-stack chip package with static bends |
| US8686288B2 (en) * | 2011-05-31 | 2014-04-01 | Tesla Motors, Inc. | Power electronics interconnection for electric motor drives |
| JP2013033901A (ja) * | 2011-06-29 | 2013-02-14 | Nissan Motor Co Ltd | 半導体装置 |
-
2013
- 2013-03-25 JP JP2013061255A patent/JP6133093B2/ja active Active
-
2014
- 2014-02-28 CN CN201410072526.0A patent/CN104078455B/zh active Active
- 2014-03-24 US US14/223,994 patent/US9455238B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20140284809A1 (en) | 2014-09-25 |
| CN104078455B (zh) | 2017-08-15 |
| US9455238B2 (en) | 2016-09-27 |
| JP2014187818A (ja) | 2014-10-02 |
| CN104078455A (zh) | 2014-10-01 |
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