JP6135087B2 - Light source device - Google Patents

Description

  The present invention relates to a light source device, and more particularly to a light source device including a semiconductor laser device.

  In recent years, for example, as a light source for a projector, a light source device in which a plurality of blue-emitting semiconductor laser devices are arranged in a matrix is used (see, for example, Patent Document 1).

JP 2012-8549 A

  However, as described in Patent Document 1, when a plurality of semiconductor laser devices are arranged closely on the same plane, heat generated from each semiconductor laser device tends to accumulate, resulting in a decrease in light output and deterioration in optical characteristics. It is easy to cause. On the other hand, in order to improve this, if the intervals between the semiconductor laser devices are increased, the light source device and the optical system installed in front of the light source device will be enlarged.

  Therefore, the present invention has been made in view of such circumstances, and an object thereof is to provide a light source device that is relatively small and excellent in heat dissipation of each semiconductor laser device while holding a plurality of semiconductor laser devices. To do.

  In order to solve the above problems, a light source device according to the present invention includes a first holding member that holds a first semiconductor laser device having a stem, a second semiconductor laser device having a stem, and the first semiconductor laser device. A second holding member provided on the holding member, wherein the second holding member has a window for emitting light from the first semiconductor laser device, and the light emission The second semiconductor laser device is held so that the stem of the second semiconductor laser device overlaps with a part of the stem of the first semiconductor laser device when viewed from the side.

  The light source device according to the present invention can be configured as follows.

  The first holding member and the second holding member include a recess, and at least a part of the stem of the first semiconductor laser device and at least a part of the stem of the second semiconductor laser device are It is preferable to be accommodated in the recess.

  It is preferable that at least a part of the first semiconductor laser device is inserted into a window portion of the second holding member.

  The window portion of the second holding member preferably includes a narrow portion whose width is smaller than the width of the first semiconductor laser device.

  It is preferable that a heat radiation member having a window portion and connected to the second holding member is provided, and at least a part of the second semiconductor laser device is inserted into the window portion of the heat radiation member.

  The second holding member is a stem of the third semiconductor laser device when the third semiconductor laser device having a stem is separated from the second semiconductor laser device and viewed from the light emitting side. Is preferably held so as to overlap a part of the stem of the first semiconductor laser device.

  The stem includes an element mounting portion on which a semiconductor laser element is mounted, a terminal electrically connected to the semiconductor laser element, the element mounting portion held on the upper surface side, and the terminal exposed on the lower surface side. It is preferable that the lower surface of the base portion of the stem of the semiconductor laser device is bonded to the holding member by an adhesive member.

  The semiconductor laser device preferably includes a collimator lens.

  According to the present invention, it is possible to reduce the size of the light source device while ensuring high heat dissipation of each semiconductor laser device.

It is a schematic perspective view which shows the external appearance of the light source device which concerns on one embodiment of this invention. It is a schematic perspective view which shows the structure of the light source device which concerns on one embodiment of this invention. 1A is a schematic top view showing a semiconductor laser device according to an embodiment of the present invention, and FIG. They are the schematic top view (a) which expands and shows a part of structure of the light source device which concerns on one embodiment of this invention, and the schematic sectional drawing (b) which shows the BB cross section. It is the schematic perspective view (a) which shows the external appearance of the light source device which concerns on one embodiment of this invention, and the schematic perspective view (b) which shows the structure.

  Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light source device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. In addition, the size, positional relationship, and the like of members illustrated in each drawing may be exaggerated for clarity of explanation.

<Embodiment 1>
1 and 2 are schematic perspective views showing the appearance and configuration of the light source device according to Embodiment 1. FIG. FIG. 3A is a schematic top view showing the semiconductor laser device according to the first embodiment, and FIG. 3B is a schematic cross-sectional view showing the AA cross section in FIG. 4A is an enlarged schematic top view showing a partial structure of the light source device according to Embodiment 1, and FIG. 4B shows a BB cross section in FIG. 4A. It is a schematic sectional drawing.

  In the following, in the direction along the optical axis of the light source device (hereinafter referred to as “optical axis direction”), the side from which light is emitted is mainly the front, the opposite side is the rear, and the direction perpendicular to the optical axis is The horizontal direction. Moreover, mainly the side which becomes the front of a light source device in each member is set as upper, and the side which becomes the back of a light source device is set as the downward direction.

  As shown in FIGS. 1 and 2, the light source device 100 according to the first embodiment is mainly provided with a second holding member 31 on a first holding member 30 that holds a plurality of semiconductor laser devices. The first heat radiating member 50 and the second heat radiating member 51 are connected to the front and rear thereof. As described above, the first heat radiating member 50 and the second heat radiating member 51 are provided on the first holding member 30 side and the second holding member 31 side, respectively. The semiconductor laser device can be pulled in a distributed manner, and the heat dissipation of the semiconductor laser device can be easily improved. As a result, the light source device can be easily downsized.

  Each holding member 30 and 31 may hold at least one semiconductor laser device. Further, from the viewpoint of heat dissipation of the semiconductor laser device and miniaturization of the light source device, the number of holding members is preferably two, but may be three or more. Further, the holding members 30 and 31 and the holding members 30 and 31 and the heat radiating members 50 and 51 are not limited to being provided in contact with each other, and other members such as heat radiating grease, a heat radiating sheet, and an adhesive are interposed therebetween. It may be interposed.

  As shown in FIGS. 3A and 3B, each semiconductor laser device has a stem 20. The stem 20 holds an element mounting portion 21 on which the semiconductor laser element 15 is mounted, a terminal 22 electrically connected to the semiconductor laser element 15, the element mounting portion 21 on the upper surface 24 side, and the terminal 22 on the lower surface 25. And a base portion 23 that is exposed and held on the side. The base part 23 may hold the element mounting part 21 integrally with itself.

  Here, as shown in FIGS. 4A and 4B, one semiconductor laser device held by the first holding member 30 is a first semiconductor laser device 10. One semiconductor laser device held by the second holding member 31 is referred to as a second semiconductor laser device 11. Furthermore, one semiconductor laser device that the second holding member 31 holds away from the second semiconductor laser device 11 is referred to as a third semiconductor laser device 12. Further, one semiconductor laser device that the first holding member 30 holds away from the first semiconductor laser device 10 is referred to as a fourth semiconductor laser device 13. Each semiconductor laser device is fixed to the holding members 30 and 31 by press-fitting into a recess 35 described later, bonding with an adhesive member as described later, or welding.

  As shown in FIGS. 4A and 4B, the second holding member 31 has a window 33 that emits light from the first semiconductor laser device 10, and the first semiconductor Light emitted from the laser device 10 can be efficiently extracted outside the light source device. The window 33 is provided corresponding to all the semiconductor laser devices held by the first holding member 30. The “window portion” is mainly a through hole, but may be a portion that can transmit light emitted from each semiconductor laser device and take it out of the light source device. For example, the window portion may be provided with a translucent member such as resin or glass, and the translucent member may be provided in contact with the semiconductor laser device inserted into the window portion. .

  Further, as shown in FIGS. 4A and 4B, the second holding member 31 is configured such that the second semiconductor laser device 11 is the first semiconductor as viewed from the light emitting side (that is, the front or upper side). The second semiconductor laser device 11 is held so as to overlap a part of the laser device 10. That is, this indicates a state in which a part of the first semiconductor laser device 10 is located immediately behind a part of the second semiconductor laser device 11 when viewed from the front. At this time, the portion that overlaps when viewed from the light emitting side is mainly a portion constituting the outermost portion in the lateral direction of the semiconductor laser device, which is the stem 20 in this example, and more specifically, the base portion 23 thereof. is there.

  As described above, the light source device 100 of the present embodiment has a configuration in which the holding member that holds the semiconductor laser device is divided into a plurality of members 30 and 31 that hold the semiconductor laser devices 10 and 11, respectively, and these are stacked. doing. Thereby, the horizontal interval between the semiconductor laser devices 10 and 11 can be easily made smaller than the horizontal width of the semiconductor laser devices 10 and 11. Therefore, the plurality of semiconductor laser devices 10 and 11 can be densely arranged in the lateral direction to reduce the size of the light source device. Further, since the first semiconductor laser device 10 and the second semiconductor laser device 11 are held apart from each other in the optical axis direction, high heat dissipation of each of the semiconductor laser devices 10 and 11 can be ensured. . At this time, in many cases, the distance in the optical axis direction between the first semiconductor laser device 10 and the second semiconductor laser device 11 is larger than the distance in the lateral direction. That is, the plurality of semiconductor laser devices 10 and 11 can be arranged in a positional relationship that is dense in the lateral direction and sparse in the optical axis direction. Therefore, since the spread of the light emitted from the light source device 100 can be suppressed, the optical system arranged in front of the light source device can be reduced in size.

  Hereinafter, a preferable configuration of the light source device 100 will be described.

  As shown in FIG. 4B, the first holding member 30 and the second holding member 31 each include a recess 35. At least a part of the stem 20 of the first semiconductor laser device 10 is accommodated in the recess 35. Further, at least a part of the stem 20 of the second semiconductor laser device 11 is accommodated in the recess 35. As a result, the junction area between the semiconductor laser devices 10 and 11 and the holding members 30 and 31 can be easily increased, and the heat dissipation of the semiconductor laser devices 10 and 11 can be easily improved. The concave portion 35 only needs to accommodate at least a part of the base portion 23 of the stem 20 of the semiconductor laser device. However, in order to efficiently conduct the heat generated from the semiconductor laser devices 10 and 11 to the holding members 30 and 31, It is preferable to accommodate the entire base portion 23 of the stem. Further, the recess 35 may accommodate all of the base portion 23 and the cap 28 of the stem of the semiconductor laser device. In addition, it is preferable that the shape of the concave portion 35 substantially follows the shape of the base portion 23 of the stem in order to install the semiconductor laser device 10 with high accuracy. The bottom surface of the recess 35 is preferably a flat surface. The side surface of the recess 35 may be substantially perpendicular to the bottom surface, but may be an inclined surface (for example, an inclination angle of 5 ° or more and 45 ° or less) having a large opening diameter on the upper side. The depth of each recess 35 in one holding member may be substantially the same or different. The recess 35 is not an essential component for the holding members 30 and 31, and the holding members 30 and 31 may hold the semiconductor laser device on a flat upper surface thereof.

  As shown in FIG. 4B, a part of the first semiconductor laser device 10 is inserted into the window portion 33 of the second holding member 31. As a result, the first semiconductor laser device 10 can be easily held close to the second holding member 31, and the light source device can be easily downsized. Further, the heat generated from the first semiconductor laser device 10 can be easily conducted to the second holding member 31 and eventually to the second heat radiating member 51, and the heat radiation performance of the first semiconductor laser device 10 can be easily improved. The portion of the first semiconductor laser device 10 inserted into the window portion 33 of the second holding member is mainly a part of the cap 28, but may be up to the base portion 23 of the stem. The entire semiconductor laser device 10 may be used.

  As shown in FIG. 4B, the window portion 33 of the second holding member 31 includes a narrow portion 37 whose width is smaller than the width of the first semiconductor laser device 10. In the configuration in which the second holding member 31 is provided on the first holding member 30, the first semiconductor laser device 10 is placed on the first holding member 30 without passing through the window portion 33 of the second holding member 31. Can be installed. For this reason, the narrow part 37 can be provided in the window part 33. Therefore, since the heat capacity of the second holding member 31 can be easily maintained, the heat generated from the semiconductor laser devices 10 and 11 can be easily conducted to the second holding member 31 and thus to the second heat radiating member 51. It is easy to improve the heat dissipation of the laser devices 10 and 11. The narrow portion 37 may be a part of the window portion 33 or the entire window portion 33. Here, the “width” can also be referred to as a “diameter” and is a size in the horizontal direction, and mainly refers to its maximum value.

  As shown in FIGS. 4A and 4B, the light source device 100 includes a second heat radiating member 51 connected to the second holding member 31. The second heat radiating member 51 has a window portion 53 and can efficiently extract the light emitted from the second semiconductor laser device 11 to the outside of the light source device. A part of the second semiconductor laser device 11 is inserted into the window 53 of the second heat radiating member. As a result, the second semiconductor laser device 11 can be easily held close to the second heat radiating member 51, and the light source device can be easily downsized. In addition, heat generated from the second semiconductor laser device 11 can be easily conducted to the second heat radiating member 51, and heat dissipation of the second semiconductor laser device 11 can be easily improved. The portion of the second semiconductor laser device 11 inserted into the window portion 53 of the second heat radiation member is mainly a part of the cap 28, but may be up to the base portion 23 of the stem. The entire semiconductor laser device 11 may be used. The window 53 is provided corresponding to all the semiconductor laser devices held by the second holding member 31. Further, the second heat radiating member 51 also has another window portion provided corresponding to all the semiconductor laser devices held by the first holding member 30.

  As shown in FIG. 4B, the light source device 100 includes an adhesive member 40 provided corresponding to each semiconductor laser device. The lower surface 25 of the base portion 23 of the stem 20 of each semiconductor laser device is bonded to the holding members 30 and 31 by an adhesive member 40. In this way, the adhesion between the semiconductor laser devices 10 and 11 and the holding members 30 and 31 is improved by passing the adhesive member 40, and heat generated from the semiconductor laser devices 10 and 11 is efficiently supplied to the holding members 30 and 31. Therefore, the heat radiation of the semiconductor laser devices 10 and 11 can be improved. Further, in addition to the lower surface 25 of the base portion of the stem of each semiconductor laser device, the side surface 26 is also bonded to the holding members 30 and 31 by an adhesive member 40. Thereby, the heat generated from the semiconductor laser devices 10 and 11 can be easily conducted efficiently by the holding members 30 and 31 via the adhesive member 40, and the heat dissipation of the semiconductor laser devices 10 and 11 can be further improved. Further, the upper surface 24 of the base portion of the stem of the semiconductor laser device 11 may be bonded to the second heat radiating member 51 by the bonding member 40. Thereby, the base portion 23 of the stem of the semiconductor laser device 11 is sandwiched between the second holding member 31 and the second heat radiating member 51 and bonded to both members. Therefore, the heat generated from the semiconductor laser device 11 can be more efficiently conducted by the second heat radiating member 51 via the adhesive member 40, and the heat radiation property of the semiconductor laser device 11 can be further enhanced.

  Furthermore, as described above, the semiconductor laser devices 10 and 11 can be firmly bonded to the holding members 30 and 31 by the bonding member 40, making it difficult to remove the semiconductor laser devices 10 and 11. It is possible to prevent 10 and 11 from being removed and diverted to another light source device. The stem may be provided with a recess on the lower surface and / or side surface of the base portion, and an adhesive member may be provided in the recess. The semiconductor laser device can be firmly bonded to the holding member by the anchor effect of the bonding member that has entered the recess of the stem. Therefore, the removal of the semiconductor laser device can be made more difficult.

  As shown in FIGS. 4A and 4B, the second holding member 31 has the stem 20 of the third semiconductor laser device 12 in the first position when the third semiconductor laser device 12 is viewed from the light emitting side. It is held so as to overlap a part of the stem 20 of one semiconductor laser device 10. Thereby, the plurality of semiconductor laser devices 10, 11, and 12 are arranged more densely in the lateral direction, and the light source device can be further miniaturized. Further, the first holding member 30 is configured such that the stem 20 of the fourth semiconductor laser device 13 is a part of the stem 20 of the second semiconductor laser device 11 when the fourth semiconductor laser device 13 is viewed from the light emitting side. It is held so as to overlap. Thereby, the plurality of semiconductor laser devices 10, 11, 12, and 13 are arranged more densely in the lateral direction, and the light source device can be further miniaturized. Furthermore, it is preferable that the semiconductor laser devices are regularly arranged in order to equalize heat dissipation. For example, the semiconductor laser devices can be arranged at substantially equidistant lattice points or radially when viewed from the light emitting side. Specifically, as shown in the drawing, the semiconductor laser device held by the first holding member 30 and the semiconductor laser device held by the second holding member 31 are vertically and horizontally viewed from the light emitting side. Are alternately arranged.

  Further, as shown in FIGS. 3A and 3B and FIGS. 4A and 4B, the semiconductor laser devices 10 and 11 include an optical component 27 into which light is incident from the semiconductor laser element 15, A cap 28 for holding the optical component 27 and sealing the semiconductor laser element 15. Such semiconductor laser devices 10 and 11 maintain the relative positional relationship between the semiconductor laser element 15 and the optical component 27 by improving the heat dissipation, and easily maintain excellent optical characteristics. In particular, when the semiconductor laser devices 10 and 11 include a collimator lens, that is, the optical component 27 is or includes a collimator lens, parallel light can be emitted and the optical characteristics of the light source device 100 are hardly affected. The installation positions of the semiconductor laser devices 10 and 11 in the optical axis direction can be changed, and the semiconductor laser devices 10 and 11 can easily be arranged with excellent heat dissipation.

<Embodiment 2>
FIG. 5A is a schematic perspective view showing the appearance of the light source device according to Embodiment 2, and FIG. 5B is a schematic perspective view showing the configuration thereof. As shown in FIGS. 5A and 5B, the light source device 150 according to the second embodiment is substantially the same as the light source device 100 according to the first embodiment, except that the heat radiating members 50 and 51 are not provided. Have the same configuration. Like the light source device 150, the heat radiating members 50 and 51 may be omitted, or a smaller light source device may be used. In this case, the rear surface (lower surface) of the first holding member 30 and the front surface (upper surface) of the second holding member 31 respectively constitute the outer surface of the light source device 150. Therefore, other heat radiating members can be directly connected by providing screw holes on the rear surface side of the first holding member 30 or the front surface side of the second holding member 31.

  Hereinafter, each component of the light source device of the present invention will be described.

(Semiconductor laser element 15)
The semiconductor laser element may include an element structure composed of various semiconductors. Among these, nitride semiconductors capable of emitting ultraviolet light and short-wavelength visible light (mainly general formula In _x Al _y Ga _1-xy N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, x + y ≦ 1) The laser element using ()) is excellent in directivity, but is particularly suitable for the present invention because heat is relatively easy to accumulate. In the case of a light source device including a plurality of semiconductor laser elements (or semiconductor laser devices), the emission wavelengths (emission colors) of the semiconductor laser elements (or semiconductor laser devices) may be substantially the same, for example, They may be different from each other such as red, green, and blue.

(Stem 20)
The stem is a member to which the semiconductor laser element is bonded. The element mounting part and base part of the stem are made of metal such as copper, steel (carbon steel, etc.), aluminum, gold, or alloys thereof, except for the part that electrically insulates the terminal from the viewpoint of thermal conductivity. It is preferable to be configured as a main component. The stem is preferably plated with gold on the outermost surface. As the stem, a shape in which the shape of the base portion when viewed from above is substantially circular or a portion of which is cut (referred to as “I-cut stem” or “D-cut stem”) can be used. The terminals are mainly rod-shaped lead terminals, but may be film-like or columnar electrodes formed through through holes or vias in the base portion.

(Optical component 27)
Optical components include optical elements such as lenses, mirrors, prisms, optical filters, diffusers, and cover glasses, as well as wavelength conversion members in which fluorescent materials are blended with these optical elements or translucent members, or laser rods and wavelength conversions. An optical crystal such as a non-linear optical crystal or an optical fiber can be used alone or in combination. The optical component is brought into contact with a positioning projection provided on the inner surface of the cap, and is fixed to the cap by application of an adhesive member (second adhesive member), thermocompression bonding, press fitting, or the like.

The fluorescent substance is activated with cerium-activated yttrium, aluminum, garnet (YAG), europium and / or chromium-activated nitrogen-containing calcium aluminosilicate (CaO—Al ₂ O ₃ —SiO ₂ ), and europium. Silicate ((Sr, Ba) ₂ SiO ₄ ) or the like can be used. For example, a light source device that emits white light can be obtained by combining a semiconductor laser element that emits blue light and a fluorescent material that absorbs part of the blue light and emits yellow light.

(Cap 28)
The cap is a member that is connected to the base portion of the stem, holds the optical component, and seals and protects the semiconductor laser element, but can be omitted depending on the configuration and use of the light source device. The cap should just have the structure which can permeate | transmit the emitted light from an optical component in an optical axis direction. A cap can be comprised using the material similar to the below-mentioned holding member. The shape of the cap is preferably cylindrical or box-like, and it is preferable that the top edge of the base portion of the stem is exposed and substantially conforms to the shape of the base portion of the stem when viewed from above.

(Holding members 30, 31)
The holding member is a member that holds the semiconductor laser device. The holding member may have various shapes, and examples thereof include a plate shape, a block shape, a box shape, a cylindrical shape, an L shape, and a T shape. Base material of holding member is aluminum, aluminum alloy, copper, copper alloy, stainless steel (austenite, ferrite, martensite), steel (carbon steel for mechanical structure, rolled steel for general structure), super invar, kovar Etc. can be used. In particular, the holding member is preferably aluminum or an aluminum alloy that is excellent in thermal conductivity. Then copper or copper alloys are also preferred. When the holding member uses aluminum, an aluminum alloy, or steel as a base material, it is preferable that the surface in contact with the adhesive member is plated in order to improve the bondability with the adhesive member. The plating can be composed of a single layer film such as gold, tin, nickel, silver, palladium, copper, or a multilayer film thereof. In particular, at least the outermost surface preferably has tin or silver from the viewpoint of bondability. A ceramic such as aluminum oxide, aluminum nitride, or silicon carbide can also be used. Furthermore, resin materials such as polycarbonate resin, acrylic resin, polyamide resin, epoxy resin, ABS, ASA, and PBT can be used. Magnesium oxide, aluminum oxide, aluminum nitride, silicon carbide, graphite, titanium oxide can be used for these resin materials. You may use what added fillers, such as. The holding member may have a fin formed on the outer surface thereof.

(Adhesive member 40)
The adhesive member is a member that adheres the semiconductor laser device to the holding member. The bonding member is heated and softened by a heating device or the like, and then cooled and solidified (hereinafter, sometimes referred to as “softening-solidification”), whereby the semiconductor laser device can be bonded to the holding member. . The adhesive member may be either solid or pasty before being softened. The adhesive member preferably includes a metal. For example, gold, tin, silver, bismuth, copper, indium, antimony, and the like can be given. Further, the adhesive member may contain a resin or an organic solvent at least before being softened, but preferably contains the above metal as a main component after softening and solidification. Specific examples include various solders and metal pastes such as tin-bismuth, tin-copper, tin-silver, and gold-tin. Alternatively, a resin to which a filler such as magnesium oxide, aluminum oxide, aluminum nitride, silicon carbide, or graphite is added may be used. The adhesive member is preferably one that, once heated and softened-solidified, has a softening point (softening temperature) higher than that before softening. In particular, the difference in softening point is preferably 30 ° C. or higher, more preferably 50 ° C. or higher, and even more preferably 100 ° C. or higher. As such an adhesive member (before softening), a tin-based solder added with copper powder (for example, RAM series manufactured by Senju Metal Industry Co., Ltd.), or a sintered paste (solidified) containing silver particles and an organic solvent such as alcohol. Thereafter, a sintered body of mainly porous silver particles is used; for example, see WO2009 / 090915). As used herein, “softening” means that the adhesive member before softening is solid or pasty, causing liquefaction or a decrease in viscosity due to melting of the constituent materials, glass transition, etc. Can be defined. Depending on the constituent material of the adhesive member, it may be the melting point.

(Heat dissipation member 50, 51)
The heat dissipating member is a member that is connected to the holding member and that can promote heat dissipation from the holding member and thus the semiconductor laser device. The heat dissipating member is a heat radiator or a heat dissipating plate, and preferably has fins to effectively dissipate heat. Examples of the shape of the fin include a plate shape, a sword mountain shape, a cylindrical shape, and a spiral shape. The heat dissipating member can be configured using the same material as the holding member described above. Note that the heat dissipating member can dissipate heat more effectively by providing a fan in the vicinity thereof. The heat dissipation member is not an essential component and can be omitted.

  Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

<Example 1>
The light source device according to the first embodiment is a light source for a projector having the configuration shown in FIGS. 1 and 2 and is configured as follows.

  The light source device according to the first embodiment includes two holding members (LD holders) which are overlapped with each other and fixed with screws. Each of the two holding members has a tin plating applied to the outer surface of an aluminum alloy base material.

  The rear holding member is a substantially plate-like member having a thickness of 12.5 mm, for passing a circular opening having a diameter of 9.1 mm, a recess having a depth of 7 mm, and a lead terminal provided on the bottom surface of the recess. There are eight holes made of pairs of through-holes of the oval opening. The holes are arranged in 4 rows and 4 columns, the distance between the centers of the two holes in each row is 15 mm, the interval between each row is 7.5 mm, and the hole arrangement is the same in the odd and even rows. The holes in the rows and even rows are shifted by 7.5 mm in the horizontal direction. In addition, the rear holding member has eight elliptical through holes for passing a lead wire connected to the lead terminal of the semiconductor laser device held by the front holding member. The rear holding member extends and holds the circuit board electrically connected to the lead terminal of each semiconductor laser device in the lateral direction.

  The front holding member is a substantially plate-shaped member having a thickness of 8.5 mm, for passing a lead terminal provided on a circular opening having a diameter of 9.1 mm, a recess having a depth of 2 mm, and a bottom surface of the recess. There are eight holes made of pairs of through-holes of the oval opening. The holes are arranged in 4 rows and 4 columns so as to alternate with the holes of the rear holding member. The front holding member has a through hole (window) with a circular opening through which a part of the cap of the semiconductor laser device held by the rear holding member is inserted and light from the semiconductor laser device passes therethrough. Eight. This through-hole is composed of a narrow portion having a diameter of 5.3 mm on the front (upper) side and a length (depth) of 3.5 mm and a wide portion having a diameter of 7.5 mm on the rear (lower) side. .

  The semiconductor laser device is configured by mounting a semiconductor laser element on a stem and fixing a cap holding an optical component. The stem is composed of a block-shaped element mounting portion, two lead terminals, a disk-shaped base portion having a diameter of 9 mm, and a thickness of 1.5 mm, each of which is plated with gold on the surface of a copper alloy base material. Have. A nitride semiconductor laser element having an emission center wavelength of 455 nm and a rated output of 3 W is bonded to the element mounting portion of the stem through a submount. The cap is a cylindrical member made of stainless steel and having a diameter of 6.85 mm, and a hook-like portion at the lower end thereof is welded to the upper surface of the base portion of the stem. An optical component, which is a BK7 collimator lens having an NA of 0.5, is fixed to the upper portion of the cap by press-fitting. In addition, a substantially triangular recess (notch) is provided on the side surface of the base portion of the stem so as to penetrate from the upper surface to the lower surface in a top view.

  Each of the recesses of the two holding members accommodates the base portion of the stem of the semiconductor laser device described above. The bottom surface and the side surface of the base portion of the semiconductor laser device, and the bottom surface and the side surface of the recess facing each of them. Are bonded by an adhesive member interposed therebetween. Further, the adhesive member also enters a recess on the side surface of the base portion of the stem. The adhesive member is tin-bismuth solder.

  Two heat dissipating members are provided so as to sandwich two stacked holding members from the front and the rear. Each of the two heat dissipating members is made of an aluminum alloy, and is a heat dissipating plate in which plate-like fins protruding outward are arranged, and are fixed to the holding member with screws. The central portion of the front heat dissipating member has no fins and is provided with 16 circular opening through holes for emitting light from each semiconductor laser device to the outside of the device. In addition, a part of the cap of the semiconductor laser device held by the front holding member is inserted into half of the through holes.

  Even when the light source device as described above is driven for a long time, the temperature rise of the semiconductor laser device can be suppressed and stable optical characteristics such as light output and optical axis can be maintained.

  The light source device according to the present invention is preferably used for light sources such as projectors, laser processing machines, optical recording / reproducing devices, displays, printers, optical communication devices, and various illumination light sources such as automobile headlights. Can do.

DESCRIPTION OF SYMBOLS 10, 11, 12, 13 ... Semiconductor laser device (10 ... 1st semiconductor laser device, 11 ... 2nd semiconductor laser device, 12 ... 3rd semiconductor laser device, 13 ... 4th semiconductor laser device, 15 ... Semiconductor laser element, 20 ... stem (21 ... element mounting portion, 22 ... terminal, 23 ... base portion (24 ... upper surface, 25 ... lower surface, 26 ... side surface), 27 ... optical component, 28 ... cap)
30, 31 ... holding member (30 ... first holding member, 31 ... second holding member, 33 ... window portion (37 ... narrow portion), 35 ... concave portion)
40 ... Adhesive member 50, 51 ... Heat radiating member (50 ... First heat radiating member, 51 ... Second heat radiating member (53 ... Window))
100, 150 ... Light source device

Claims (6)

A first holding member for holding a first semiconductor laser device having a stem;
Holding a second semiconductor laser device having a stem, and a second holding member provided on the first holding member,
The first holding member has a recess that accommodates at least a part of the stem of the first semiconductor laser device,
The second holding member has a recess for accommodating at least a part of the stem of the second semiconductor laser device, and has a window for emitting light from the first semiconductor laser device, and , Holding the second semiconductor laser device so that the stem of the second semiconductor laser device overlaps a part of the stem of the first semiconductor laser device when viewed from the light emitting side ,
The window portion of the second holding member is a light source device including a narrow portion whose width is smaller than that of the first semiconductor laser device.   The light source device according to claim 1, wherein at least a part of the first semiconductor laser device is inserted into a window portion of the second holding member. A heat dissipating member having a window and connected to the second holding member;
The light source device according to claim 1 , wherein at least a part of the second semiconductor laser device is inserted into a window portion of the heat dissipation member. The second holding member is a stem of the third semiconductor laser device when the third semiconductor laser device having a stem is separated from the second semiconductor laser device and viewed from the light emitting side. The light source device according to claim 1 , wherein the light source device is held so as to overlap a part of a stem of the first semiconductor laser device. The stem includes an element mounting portion on which a semiconductor laser element is mounted, a terminal electrically connected to the semiconductor laser element, the element mounting portion held on the upper surface side, and the terminal exposed on the lower surface side. A base portion to hold,
5. The light source device according to claim 1, wherein a lower surface of a base portion of a stem of the semiconductor laser device is bonded to the holding member by an adhesive member. The light source device according to claim 1 , wherein the semiconductor laser device includes a collimator lens.

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