JP6137851B2 - Heating and pressing apparatus and heating and pressing method - Google Patents

Description

  The present invention relates to a heating and pressing apparatus and a heating and pressing method.

  An adhesive is used for mounting an electronic component on a printed circuit board in manufacturing an electronic circuit. After each electronic component is placed and temporarily fixed on a printed circuit board to which an adhesive made of a thermosetting resin is applied, the printed circuit board and the electronic component are heated by heating to the curing temperature of the adhesive and performing the main pressure bonding Bonding is performed. Normally, the heights of the electronic components to be mounted are different, and therefore, if a plurality of electronic components are temporarily fixed together for each printed circuit board and then subjected to final pressure bonding, the applied pressure is not affected by the difference in height of the electronic components. An electronic component that is uniform and does not have sufficient adhesion to the printed circuit board is generated. For this reason, conventionally, the temporary fixing and the main pressure bonding process are performed not for each printed circuit board but for each electronic component.

  However, if the final pressure bonding is performed after temporarily fixing each electronic component, depending on the type of the electronic component mounted on the board, the temporary fixing and the final pressure bonding process are required multiple times. It takes a long time and requires complicated work.

  On the other hand, as the pressurizing device, for example, an isotropic pressure press device can be cited. Further, as the isotropic pressure press device, for example, Patent Document 1 discloses a pressure vessel for enclosing a workpiece to be pressed and a tank containing liquid. And a booster pump for injecting the liquid of the tank into the pressure vessel and isostatically pressing the workpiece to be pressed has been proposed. And the said isotropic pressure press apparatus processes an adhesive etc. by carrying out isotropic pressure press of to-be-processed objects, such as a laminate, using a hot water, oil, etc. as a pressure medium, for example, In the case of pressing an electronic component, isotropic pressure is applied by using an object in which the electronic component is stored in a bag for vacuum sealing in advance as an object to be pressed.

  In Patent Document 2, as a pressurizing device, a pressurizing object is sandwiched between a plurality of pressurizing molds, and an interposing pad is interposed between the pressurizing mold and the pressurizing object to perform pressurization. An apparatus has been proposed and a pressure pad is a pad that is fluid and includes a fluidized layer of a soft gel-like material.

  The isotropic pressure press device described in Patent Document 1 is a so-called “warm water laminator”, and pressurizes an electronic component as a work in a liquid through a vacuum sealing bag. Although having such an advantage that the pressure becomes uniform, a bag for vacuum-sealing containing electronic parts is discarded each time after the press treatment, and thus the manufacturing cost increases. In addition, when water is used as the pressure medium, the temperature at which water does not boil at normal pressure (for example, 90 ° C.) is the upper limit of heating for safety reasons, and when oil is used as the pressure medium, liquid is injected from the tank. In consideration of the difference between the thermal expansion coefficient between the seal portion of the connecting portion and the pressure vessel, the pressurization upper limit temperature was, for example, about 120 ° C.

  In addition, the pressurization device described in Patent Document 2 is a so-called “dry laminator”, which eliminates the need for the vacuum sealing bag used in the above-mentioned “warm water laminator”, thereby improving workability. Although there is an advantage that no waste is generated, the upper limit of the pressure that can be applied is about 20 MPa since a pressure pad including a fluid layer of fluid and flexible gel material is used.

  Along with miniaturization and integration of electronic boards, in addition to miniaturization of components, the number of layers increases, and accordingly, there is a high adhesive strength from the viewpoint of improving the adhesion of each layer, and an adhesive having a high curing temperature, for example, heat A pressure device capable of heating at 200 ° C. or higher corresponding to the curing temperature of an adhesive made of a curable resin is desired.

  Therefore, in Patent Document 3, at least one is formed so as to be movable toward the other, and a first pressurizing member and a second pressurizing member that can press-mold an object to be pressed with a mutual clamping pressure. A member, interposed between the first pressure member and the second pressure member, filled with a metal that can be melted at a temperature of at least 200 ° C. and directed toward the object to be pressed There has been proposed a heating and pressurizing device having a pressing force equalizing member having a thin film formed on a surface, and a heating device for heating the object to be pressed, the pressing member and the pressing force equalizing member, and the thin film is a metal It has been proposed that the metal is an alloy having a melting point of 200 ° C to 350 ° C.

Japanese Patent No. 4067232 Japanese Patent No. 3949072 Japanese Patent No. 431873

  The heating and pressurizing device described in Patent Document 3 is interposed between a first pressurizing member and a second pressurizing member that can press-mold an object to be pressed with a mutual clamping pressure. Since the pressing force uniformizing member is filled with metals that can be melted at 200 ° C., there is an advantage that an isostatic pressing of an electronic component can be performed at a temperature of 200 ° C. or higher. However, at the time of heating and pressurizing the electronic component, it has been necessary to maintain the molten metal by heating the filled metal to a predetermined temperature. Therefore, high temperature control is required for the heating device that heats the pressurizing member and the pressurizing member adjacent to the pressurizing member. Furthermore, since metals are used for the pressure equalizing member, it takes time to perform maintenance when the temperature returns to room temperature.

  A hydroforming method for forming a part using a mold is known. However, since the hydroforming method generally uses water as a pressure medium, the pressurization temperature is equal to or lower than the boiling point of water (for example, 90). It is difficult to sufficiently melt and bond an adhesive made of, for example, a thermosetting resin, which is used as an adhesive for electronic components.

  The present invention has been made in view of the situation as described above, and is easier to control the heating temperature than in the prior art, and directly and uniformly heats electronic components without using a vacuum sealing bag. An object is to provide a heating and pressing apparatus and a heating and pressing method capable of applying pressure.

  As a result of intensive studies to solve the above problems, the present inventors have completed the present invention shown below. The present invention has the following features.

(1) At least one is formed so as to be movable toward the other, and a first pressurizing member and a second pressurizing member that press-mold an object to be pressed with a mutual clamping pressure, and the first pressurizing member. A fluid that is interposed between the pressure member and the second pressure member, has fluidity at room temperature, and maintains fluidity at 430 ° C. without any chemical change such as thermal decomposition. pressurized liquid is filled, and a pressure equalizing member in which a thin film is formed on a surface directed to the pressurized圧物, a heating device for the pressurized liquid to a predetermined temperature heating, the pressurizing force uniformizing member A circulation line that circulates the pressurized liquid between the heating device and a control device that controls the heating device to heat the pressurized liquid to a predetermined temperature, and the first pressure member or the first has a seal member provided in one of the second pressure member, wherein the thin film is elastomeric der Ri heating pressurizer der, the first pressure member, said the second pressure member and the sealing member to form a closed space, and an exhaust passage communicating with said enclosed space, provided in the exhaust passage a vacuum pump and a switching valve, further Ru comprising a.

  (2) The heated object is the heating and pressing apparatus according to (1), wherein the object to be pressed is an electronic component.

  (3) The said pressurizing liquid is a heating and pressurizing apparatus as described in said (1) or (2) selected from the group which consists of water, a silicone oil, and an ionic liquid according to heating temperature.

(4) At least one is formed so as to be movable toward the other, and is interposed between a first pressure member and a second pressure member that press-molds an object to be pressed with a mutual clamping pressure. The pressurizing liquid is a fluid that is fluid at room temperature and that fills the inside of the pressurizing pressure uniformizing member, and maintains fluidity without chemical changes such as thermal decomposition even at 430 ° C. Circulating between the heating member and the heating device and heating, placing the object to be pressed between the first pressure member and the second pressure member, and the first At least one of the pressure member and the second pressure member is moved toward the other, and the first pressure member, the second pressure member, and the first pressure member or the second pressure member are moved . the sealing member provided on one of the pressure member of, that form a closed space enclosing the object to be pressurized圧物 Extent and an exhaust passage for the enclosed space and communicating, by a vacuum pump provided in the exhaust passage, a step of degassing said sealed space, said first pressure member and the second pressure have a, a step of the so filled with pressurized liquid to the interior of the interposed by said pressure equalizing member for applying a hydraulic pressure to the target pressure圧物between members, said pressure equalizing member wherein the surface directed to the pressurized圧物of a heat pressurizing method that has a thin film made of an elastomer is formed.

  According to the heating and pressurizing apparatus of the present invention, the heating temperature can be easily controlled as compared with the conventional one, and directly and uniformly without using a vacuum sealing bag for an object to be pressed (for example, an electronic component). Heated and uniformly applied with pressure. As a result, it is possible to use a thermosetting adhesive with a relatively high curing temperature and good fluidity and high adhesive strength, and the adhesive between the laminates can be sufficiently adhered and pressed. The adhesion quality of electronic parts is improved compared to the past.

  According to the heating and pressurizing method of the present invention, the heating temperature can be easily controlled as compared with the conventional method, and directly and uniformly without using a vacuum sealing bag for an object to be pressed (for example, an electronic component). Heated and uniformly pressurized. Thereby, when the object to be pressed is an electronic component, the adhesive between the layers is sufficiently melted and pressed, so that the quality of the obtained electronic component is improved as compared with the conventional one.

It is the schematic which illustrates an example of a structure of the heating-pressing apparatus which concerns on this embodiment. It is sectional drawing of the principal part of the heating-pressing apparatus which concerns on this embodiment. It is a figure explaining an example of the composition of the other principal part of the heating-pressing device in this embodiment. It is a flowchart explaining the heating-pressing method which concerns on this Embodiment.

  The heating and pressing apparatus of the present embodiment includes a first pressing member and a second pressing member, a pressurizing and equalizing member, a heating apparatus, and a control apparatus.

  In the present embodiment, at least one of the first pressure member and the second pressure member is formed so as to be movable toward the other, and is a member that press-molds an object to be pressed with a mutual clamping pressure. The first pressure member and the second pressure member are not particularly limited as long as the first pressure member and the second pressure member are members that can apply mutual clamping pressure to the object to be pressed, and one pressure member is the other pressure member. The first pressure member and the second pressure member may be formed so as to move toward each other.

  The shapes of the first pressure member and the second pressure member are appropriately selected depending on the shape of the apparatus or the shape of the object to be pressed. For example, the shape of the first pressure member may be a cylindrical shape. It may be a prismatic shape and is not particularly limited. Further, appropriately selecting the shapes of the first pressure member and the second pressure member so as to reduce the pressure receiving area as much as possible according to the shape of the object to be pressed can be achieved in terms of production efficiency, downsizing of the apparatus, etc. It is preferable from the point.

  At least one of the first pressure member and the second pressure member is provided with a pressing member that presses the pressure member. This pressing member may be integrated with the first or second pressing member, or may be an independent member. The pressing member is not particularly limited as long as it is formed so that pressure can be applied to the object to be pressurized, and is formed so as to move by the pressure of the fluid press-fitting and pressurize the object to be pressurized. Alternatively, it may be formed so as to be moved by mechanical power or mechanical driving force to pressurize the object to be pressed. Examples of the pressing member include a cylinder device composed of a piston and a hydraulic cylinder, and a gear type device composed of a gear motor and a gear system.

  Furthermore, an example of the heating and pressing apparatus of the present embodiment will be described with reference to FIG. The heating and pressing apparatus 1000 according to the present embodiment includes an upper mold 10 that is a first pressing member, a lower mold 12 that is a second pressing member, a radiating fin 90, and a cylinder that drives the lower mold 12 to move up and down. Device 92. In addition, the upper mold 10 and the lower mold 12 of the heating and pressing apparatus 1000 of the present embodiment are provided with heaters 40 and 64, respectively, and the upper mold 10 is provided with a pressurizing pressure equalizing member 6. Furthermore, the heating and pressurizing apparatus 1000 of the present embodiment is a heating apparatus that heats the tank 200 in which the pressurizing liquid 34 used for the pressurizing pressure equalizing member 6 is stored and the pressurizing liquid 34 fed from the tank 200. There is a heater 300, and open / close valves 102, 104, and 204 provided in circulation lines through which the pressurized liquid 34 circulates between the pressurizing pressure equalizing member 6, the tank 200, and the heater 300, respectively. The pressurized pump 208 that pressurizes the pressurized liquid 34 in the pressure equalizing member 6 when the liquid is fed and pressure is applied to the object to be pressurized, and the pressurized liquid that is pressurized by the booster pump 208 and heated by the heater 300 And an on-off valve 106 provided in a line for feeding 34 to the pressurizing pressure equalizing member 6. Further, the tank 200 is provided with a chiller 202 for cooling the pressurized liquid 34 to a constant temperature, and a heat exchanger 306 is provided in a line for returning the pressurized liquid 34 from the pressurizing pressure equalizing member 6 to the tank 200. The heat of the heat exchanger 306 is reused in the heater 300.

  Further, the heating and pressurizing apparatus 1000 according to the present embodiment includes a cylinder device 92 that moves the lower mold 12 up and down via a cylinder 91 (shown in FIG. 2) provided with heat radiating fins 90. The cylinder device 92 employs a hydraulic type, and on-off valves 112, 114, and 116 are provided in a tank 400 in which water is stored and a water circulation line between the tank 400 and the cylinder device 92. Furthermore, the heating and pressurizing apparatus 1000 according to the present embodiment is provided with a pump 406 and an on-off valve 120 in a line that supplies liquid to the cylinder apparatus 92 when the cylinder is raised. When pressurizing the pressurized material, the cylinder 91 (shown in FIG. 2) of the cylinder device 92 is raised to pressurize the lower mold 12, and water pressurized by the pressure pump 408 is supplied to the cylinder device 92. And an on-off valve 118 provided in a line for feeding liquid. Here, the hydraulic type example has been described, but the invention is not limited to this, and the hydraulic type may be used. In this case, oil is stored in the tank 400.

  Further, as will be described later, the lower mold 12 sucks volatile components contained in the object to be pressurized and other gas generated by the heating reaction, and water vapor existing in the space when held. A pipe communicating with the decompression pump 130 is provided, and an open / close valve 110 is provided in this pipe.

  Further, the heating and pressurizing apparatus 1000 of the present embodiment is provided with a control unit 100, which controls the heaters 40 and 64 and the on-off valves 102, 104, 106, 108, 110, 112, 114, 116, 118, 120, 204, heater 300, temperature sensors 302, 304, pumps 206, 406 and boost pumps 208, 408 are controlled. Furthermore, the control unit 100 stores in advance a decomposition temperature of the pressurized liquid 34 and a heating temperature of the object to be pressed, which will be described later, and based on this, heating is performed using the heaters 40 and 64 and the heater 300 described above. At the same time, the heaters 40 and 64 and the heater 300 are controlled in accordance with feedback from the temperature sensors 302 and 304.

  Here, the pressure equalizing member 6 in the present embodiment is interposed between the upper mold 10 and the lower mold 12, is a fluid having fluidity at room temperature therein, and is thermally decomposed at 430 ° C. The pressurizing liquid 34 that maintains fluidity without being chemically changed is filled, and a thin film is formed on the surface facing the object to be pressed. When the object to be pressed is sandwiched between the pressure member and the second pressure member while being heated, a uniform pressure can be applied to the surface to be pressed in the object to be pressed.

Examples of the pressurized liquid 34 include water, silicone oil, and ionic liquid, and examples of the ionic liquid include trade name “EMI-BF ₄ ” (CAS. No. 143314-16-3, melting point: 13). C., decomposition temperature 354.degree. C.), trade name "EMI-TF" (CAS. No. 145022-44-2, melting point: -10.degree. C., decomposition temperature: 375.degree. C.), trade name "EMI-TFSI" (CAS. No. 174899-82-2, melting point: −15 ° C., decomposition temperature: 428 ° C., trade name “BMI-BF ₄ ” (CAS. No. 174501-65-6, melting point: −85 ° C., decomposition temperature: 361 ° C.) ), the trade name of "BMI-PF _4" (CAS.No.174501-64-5, melting point: 10 ℃, decomposition temperature: 315 ℃), the trade name of "BMI-TFSI" (CAS.No.174899 83-3, mp: -5 ° C., decomposition temperature: 422 ° C.) and the like. In addition, since a part of the ionic liquid is soluble in water, the heating temperature may be controlled by mixing with water.

  Examples of the thin film include an elastomer. Examples of the elastomer include NBR rubber, fluorine rubber, and perfluoroelastomer. Examples of the fluorine rubber include vinylidene fluoride (FKM) rubber and perfluoroelastomer. For example, a trade name “Kalrez (registered trademark)” may be mentioned.

  The main part which pressurizes the to-be-pressurized object in the heating and pressing apparatus of the present embodiment will be described with reference to FIG. The configuration shown in FIG. 2 is an example of the present invention and is not limited to this. As shown in FIG. 2, the main part of the heating and pressurizing apparatus of the present embodiment includes an upper mold 10, a lower mold 12, and a side mold 14 attached to the lower mold 12. The mold 12 is moved toward the upper mold 10, and the seal member 36 of the side mold 14 and the upper mold 10 are pressed against each other, whereby the object to be pressed 20 placed on the table 62 of the lower mold 12 is added. Pressed. Here, in the case where the object to be pressurized 20 is a product in which an electronic component is temporarily fixed on a printed circuit board coated with an adhesive, the adhesive is heated by the pressurization, and the adhesive is thermally cured. Then, the electronic component is fixed to the printed circuit board by pressure bonding.

  The upper die 10 is filled with a pressurizing liquid 34 and filled with a pressurizing liquid 34, and the pressurizing liquid inflow is communicated with the pressurizing uniformizing member 6 and flows into the pressurizing liquid uniformizing member 6. The passage 42, the pressurized liquid outlet passage 44 that communicates with the pressurized pressure uniformizing member 6 and allows the pressurized liquid 34 to flow out of the pressurized pressure uniformized member 6, and the pressurized liquid 34 in the pressurized pressure uniformized member 6 are kept at a predetermined temperature. And a heater 40 for heating. The pressurizing pressure equalizing member 6 accommodates the pressurized liquid 34 and is connected to the pressurized liquid inflow path 42 and the pressurized liquid outflow path 44, a thin film 32 covering the opening of the container, and the thin film 32. And a fixing member (not shown) for fixing the end of the container to the side surface of the container. Furthermore, in the present embodiment, the sheet member 30 is provided on the surface of the upper mold 10 that contacts the pressed object 20, and the end of the sheet member 30 is fixed by the sheet fixing member 46. Thus, even if the pressurized liquid 34 leaks from the thin film 32, the sheet member 30 prevents the pressurized liquid 34 from coming into contact with the pressurized object 20. In the present embodiment, the pressurized liquid inflow path 42 is provided on the side surface of the container of the pressure equalizing member 6, while the pressurized liquid outflow path 44 is provided on the upper surface of the container of the pressure equalizing member 6. It is preferable to provide it. Thereby, the pressure of the pressurized liquid 34 in the pressurizing pressure equalizing member 6 with respect to the pressurized object 20 is kept more uniform.

  The lower mold 12 is provided with a table 62 on which the object to be pressed 20 is placed, a heater 64 that heats the lower mold 12 to a predetermined temperature, and a recess that engages with the cylinder 91. Further, the lower mold 12 is provided with a pin 52 that can be brought into contact with a contact frame 58 provided at the lower part of the side mold 14 and a spring 56 that is attached to the lower part of the pin 52. Here, the cylinder 91 that is moved up and down by the cylinder device 92 (shown in FIG. 1) is provided with a radiation fin 90 (shown in FIG. 1), and further, on the upper surface of the cylinder 91 that contacts the recess of the lower mold 12, A heat insulating plate 66 is provided. Therefore, the cylinder 91 engages with the lower mold 12 via the heat insulating plate 66, so that the thermal efficiency of the lower mold 12 is improved.

  On the other hand, the side mold 14 has a contact frame 58 provided so as to be able to contact the pin 52 of the lower mold 12, a seal member 38 provided so as to be in close contact with the side surface of the lower mold 12, and the upper mold 10. A seal member 36 is provided so as to be in close contact with the lower surface of the upper mold 10 when the lower mold 12 is moved. Here, as the sealing members 36 and 38, for example, O-rings are used. Further, the side mold 14 is used for discharging the volatile component contained in the pressurized object 20 and other gas generated by the heating reaction and the water vapor existing in the space at the time of holding out of the system. An exhaust path 54 and an on-off valve 110 connected to a pipe that is provided in the exhaust path 54 and communicates with the pressure reducing pump 130 are provided.

  Therefore, when the lower mold 12 is moved toward the upper mold 10 by the cylinder 91 and the seal member 36 on the upper surface of the side mold 14 is pressed against the upper mold 10, the pin 52 of the lower mold 12 is moved to the side. As the advancing in the contact frame 58 of the mold 14 is performed, the spring 56 of the lower mold 12 is contracted, and the pressed object 20 and the pressure equalizing member 6 are in close contact with each other via the sheet member 30 and the thin film 32. A sealed space is formed between the lower surface of the mold 10, the seal members 36 and 38, and the side surface of the lower mold 12. The above-described gas and water vapor in the sealed space are discharged out of the system via the on-off valve 110 via the exhaust passage 54 communicating with the space by driving the decompression pump 130.

  The principal part of the other heating and pressing apparatus of the present embodiment will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the structure shown in FIG. 2, and description here is abbreviate | omitted. As shown in FIG. 3, the table 62 of the lower mold 12 is provided with a recess in which the object to be pressed 20 can be placed. Thereby, the to-be-pressurized object 20 becomes high in the sealing property when applying heat and pressure.

  The operation of pressurizing the article to be pressurized 20 with the above apparatus will be described below with reference to FIGS. In the initial state, the lower mold 12 is in a position retracted downward with respect to the upper mold 10. First, the control unit 100 opens the on-off valves 120 and 112, opens the electromagnetic valve 402, closes the on-off valves 114, 116, and 118, drives the pump 406, and supplies water from the tank 400 via the on / off valve 120. Liquid is sent to the cylinder device 92. Accordingly, the cylinder 91 is raised by the cylinder device 92, and the lower mold 12 is raised. And the upper mold | type 10 and the lower mold | type 12 are made to contact, and the surface of the thin film 32 of the pressurization equalization member 6 is maintained in a planar state. Next, the control unit 100 sets the heater 300 to a predetermined temperature, opens the on-off valves 102 and 104, closes the on-off valves 106 and 108, and drives the pump 206 to supply the pressurized liquid fed from the tank 200. Heating is performed by the heater 300, and the liquid is supplied to the container of the pressure equalizing member 6 via the on-off valve 104 and the pressurized liquid inflow path 42, and further, inside the container of the pressure equalizing member 6. The pressurized liquid 34 is heated to a predetermined temperature again by passing the pressurized liquid 34 through the pressurized liquid outlet passage 44 and the heat exchanger 306 through the on-off valve 102 and returning to the heater 300. Then, the liquid is circulated so as to be sent to the container of the pressurizing pressure equalizing member 6 through the on-off valve 104 and the pressurized liquid inflow path 42 (S500). Next, the control unit 100 closes the on-off valves 120, 112, 118, opens the electromagnetic valve 404, opens the on-off valves 114, 116, drives the pump 406 to supply water from the cylinder device 92, and turns on the on-off valve 114. To the tank 400. Thereby, the cylinder 91 of the cylinder device 92 is lowered, and the lower mold 12 is lowered. Next, the object to be pressed 20 is placed on the table 62 of the lower mold 12 that has been lowered (S502). Next, the control unit 100 opens the on-off valves 120 and 112, opens the electromagnetic valve 402, closes the on-off valves 114, 116, and 118, drives the pump 406, and supplies water from the tank 400 via the on / off valve 120. Then, the liquid is fed to the cylinder device 92. As a result, the cylinder 91 of the cylinder device 92 is raised and the lower mold 12 is raised (S504).

  Furthermore, the pressed object 20 placed on the lower mold 12 and the sheet member 30 are in close contact with each other, and a sealed space is formed between the lower surface of the upper mold 10, the sealing members 36 and 38, and the side surface of the lower mold 12. Then, water vapor, volatile components contained in the pressurized object 20 and other gas generated by the heating reaction in this space are sucked out by the decompression pump 130 connected to the exhaust passage 54 and sealed. The inside of the space is depressurized and deaerated.

  At this time, since the pressurized liquid 34 is filled in the container of the pressure uniformizing member 6 and the thin film 32 is flexible and has an elastic force, the pressurized object 20 has a uniform force on all its surfaces. Thus, pressure is applied by the pressurizing and equalizing member 6. Even if the upper surface of the object to be pressed 20 has a complicated shape, the thin film 32 adheres along the upper surface of the object to be pressed 20, so that pressure and heat are applied to the object to be pressed 20 almost uniformly. . Here, the heater 40 of the upper mold 10 mainly functions so that the pressurized liquid 34 is maintained at a predetermined temperature.

  Next, the control unit 100 closes the on-off valves 102 and 104, opens the on-off valves 106 and 108, further drives the booster pump 208, feeds the pressurized liquid 34 from the tank 200, and heats the heater 300 to a predetermined temperature. The pressure of the pressurized liquid 34 that has been heated is increased and fed to the container of the pressure equalizing member 6. As a result, the object 20 is pressurized simultaneously with heating from above (S506).

  Further, the control unit 100 closes the on-off valves 114, 116, 120, opens the on-off valves 112, 118, opens the electromagnetic valve 402, drives the booster pump 408, feeds water from the tank 400, and further boosts the pressure. Then, the liquid is fed to the cylinder device 92. On the other hand, the heater 64 of the lower mold 12 functions to keep the lower mold 12 at a temperature applied to the object to be pressed 20. As a result, the object to be pressurized 20 is pressurized simultaneously with heating from below.

  By this series of operations, uniform pressure is applied to all surfaces of the surface to be pressed of the object to be pressed 20, so that there is no possibility of causing poor press bonding. Even if the substrate to be pressed 20 adheres a plurality of electronic components having different heights, there is no possibility of insufficient press contact.

  After pressurization for a predetermined time, the control unit 100 closes the on-off valves 102, 104, 106, opens the on-off valve 108, stops the circulation of the pressurized liquid 34, and closes the on-off valves 112, 118, 120. Then, the on-off valves 114 and 116 are opened, the water sent to the cylinder device 92 is allowed to flow out, and the lower mold 12 is retracted downward.

  In this series of operations, a cycle of 6 to 10 seconds is possible as the pressure treatment time. Therefore, the production efficiency can be increased as compared with the conventional method of crimping individual electronic components with a press plate. In addition, even if strict adjustment and management regarding the parallelism as in the prior art is not performed, it is possible to uniformly pressurize the object to be pressed, and there is no possibility of causing poor press bonding. Moreover, the heating and pressurizing apparatus 1000 of the present embodiment has a maximum working pressure of, for example, 120 MPa, and can pressurize at a higher pressure than in the past. Moreover, since the heating and pressurizing apparatus 1000 of this embodiment can select a pressurizing liquid according to the temperature at the time of pressurization, it is rich in versatility and the pressurizing liquid is fluid at normal temperature. Therefore, as compared with the case where it is solid at room temperature, there is an advantage that maintenance when the apparatus is stopped is easy.

  6 Pressurizing equalizing member, 10 Upper mold, 12 Lower mold, 14 Side mold, 20 Pressurized object, 30 Sheet member, 32 Thin film, 34 Pressurized liquid, 36, 38 Seal member, 40, 64 Heating heater, 42 Pressurized liquid inflow path, 44 Pressurized liquid outflow path, 46 Seat fixing member, 52 pins, 54 Exhaust path, 56 Spring, 58 Contact frame, 62 Table, 66 Thermal insulation plate, 90 Radiation fin, 91 cylinder, 92 cylinder device , 100 control unit, 102, 104, 106, 108, 110, 112, 114, 116, 118, 120, 204 on-off valve, 130 vacuum pump, 200, 400 tank, 202 chiller, 206, 406 pump, 208, 408 pressure increase Pump, 300 Heater, 302, 304 Temperature sensor, 306 Heat exchanger, 402, 404 Solenoid valve, 10 0 heating and pressing device.

Claims (4)

A first pressure member and a second pressure member that are formed so that at least one of them is movable toward the other, and pressurizes the object to be pressed with a mutual clamping pressure;
A fluid which is interposed between the first pressure member and the second pressure member and has fluidity at room temperature therein and maintains fluidity without being thermally decomposed at 430 ° C. A pressurizing pressure equalizing member that is filled with the pressure liquid and in which a thin film is formed on the surface toward the object to be pressed;
A heating device for heating the pressurized liquid at a predetermined temperature;
A circulation line for circulating the pressurized liquid between the heating device and the pressure force uniformizing member,
A control device for controlling the heating device so as to heat the pressurized liquid to a predetermined temperature;
A seal member provided on either the first pressure member or the second pressure member;
Have
Wherein Ri thin elastomer der,
A sealed space is formed by the first pressure member, the second pressure member, and the seal member,
It said enclosed space and an exhaust passage communicating, heat and pressure and wherein further comprising a Rukoto and a vacuum pump provided in the exhaust passage.   The heating and pressing apparatus according to claim 1, wherein the object to be pressed is an electronic component.   The heating and pressing apparatus according to claim 1 or 2, wherein the pressurizing liquid is selected from the group consisting of water, silicone oil, and ionic liquid according to the heating temperature. Pressure applied between a first pressure member and a second pressure member that is formed so that at least one of them can move toward the other, and pressurizes the object to be pressed with a mutual clamping pressure. A fluid that is fluid at room temperature and that fills the inside of the homogenizing member and maintains fluidity at 430 ° C. is maintained between the pressurizing homogenizing member and the heating device. Circulating and heating;
Placing an object to be pressed between the first pressure member and the second pressure member;
At least one of the first pressure member and the second pressure member is moved toward the other, and the first pressure member, the second pressure member, and the first pressure member or the sealing member provided on one of the second pressure member, a step that form a closed space enclosing the object to be pressurized圧物,
Degassing the sealed space by an exhaust path communicating with the sealed space, and a decompression pump provided in the exhaust path;
The pressurizing liquid is filled inside the pressurizing pressure equalizing member interposed between the first pressurizing member and the second pressurizing member, and a hydraulic pressure is applied to the object to be pressurized. And a process of
I have a,
Heat pressurizing method, wherein that you have been formed a thin film made of elastomer on the surface directed to the pressurized圧物of the pressure equalizing member.

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