JP6138003B2 - Electronic component and mounting method thereof - Google Patents

Description

  The present invention relates to an electronic component and a mounting method thereof, and more specifically to an electronic component mounted by mounting and mounting a mounting component such as a semiconductor chip on a substrate and the mounting method thereof.

  As a part of global warming countermeasures, a system that combines an internal combustion engine and an electric motor called HEV / EV (Hybrid Electric Vehicle / Electric Vehicle), developed for the purpose of reducing the carbon dioxide emissions of automobiles, has spread rapidly. ing. Along with this, mounting of electric and electronic circuits in the engine room is being studied. When the engine is started, the temperature suddenly rises from the ambient temperature (below 10 degrees below zero in cold regions) to nearly 100 degrees, so when an electric / electronic circuit is installed in the engine room, a very large heat cycle is generated. Join the electronic circuit. Therefore, the importance of thermal packaging technology that can cope with high temperature operation and heat cycle is increasing. In a high-temperature operating environment, solder cracks due to heat cycles occur in device bonding by conventional solder bonding. For this reason, there is an urgent need to establish a mounting method on a printed circuit board that does not rely on solder bonding.

  A mounting method that does not rely on solder bonding is disclosed in, for example, Patent Document 1. Patent Document 1 uses a pressure head for pressing and fixing a surface-mounted component onto a wiring board when mounting a plurality of surface-mounted components. When the elastic body constituting the pressure head comes into contact with the surface-mounted component, the variation in the thickness of each surface-mounted component is absorbed. Further, in Patent Document 1, by providing a step for absorbing a difference in thickness between a plurality of surface mount components in contact with the surface mount component of the pressure head, a plurality of surface mount components are provided. Therefore, the occurrence of a problem of pressurizing the pressure head so that it is biased toward a part of the surface-mounted components when collectively pressurizing is suppressed. As described above, in Patent Document 1, the surface mount component and the wiring board can be connected without using soldering.

JP 2008-205068 A

  However, the configuration of Patent Document 1 has a problem that the material of the contact portion (elastic body) where the pressure head contacts the surface-mounted component is limited. Generally, a resin softens at a high temperature and its elastic modulus decreases. Therefore, it is required to select a resin having excellent heat resistance as an elastic body that constitutes a contact portion that contacts a surface-mounted component that generates heat at a high temperature during driving. In this sense, the material of the contact portion is limited in Patent Document 1.

  The present invention has been made to solve the above-described problems, and its purpose is to alleviate restrictions on the material such as resin that constitutes a member that presses a mounting component onto a substrate, and solder cracks due to heat cycles. It is an object to provide an electronic component and a mounting method thereof that can eliminate the occurrence of the above.

The electronic component according to the present invention includes a substrate, a mounting component, and a pressing jig. The pressing jig is disposed so as to be in contact with the mounting component. The insulating member has a lower hardness than the substrate, and is disposed on the opposite side of the mounting component of the insulating member. And an elastic member to be pressure-connected on the top. A plurality of mounting parts are arranged on the conductive layer of the substrate. The substrate includes an opening between a pair of mounting components adjacent to each other in the direction along the main surface among the plurality of mounting components. A positioning member is further provided that extends in a direction intersecting the main surface so as to fit into the opening from the insulating member.
The electronic component according to the present invention includes a substrate, a mounting component, and a pressing jig. The pressing jig is disposed so as to be in contact with the mounting component. The insulating member has a lower hardness than the substrate, and is disposed on the opposite side of the mounting component of the insulating member. And an elastic member to be pressure-connected on the top.

In the electronic component mounting method according to the present invention, first, a substrate and a pressing jig are prepared. A mounting component is set on the pressing jig. The mounting component is pressed against the conductive layer using a pressing jig on which the mounting component is set. The step of preparing the pressing jig includes a step of forming an insulating member that constitutes the pressing jig and has a lower hardness than the substrate. In the pressing step, the state in which the mounting component is press-connected on the conductive layer of the substrate is maintained using an elastic member that is disposed on the opposite side of the mounting component of the insulating member and constitutes a pressing jig. . A plurality of mounting parts are arranged on the conductive layer of the substrate. The substrate includes an opening between a pair of mounting components adjacent to each other in the direction along the main surface among the plurality of mounting components. A positioning member is further provided that extends in a direction intersecting the main surface so as to fit into the opening from the insulating member.
In the electronic component mounting method according to the present invention, first, a substrate and a pressing jig are prepared. A mounting component is set on the pressing jig. The mounting component is pressed against the conductive layer using a pressing jig on which the mounting component is set. The step of preparing the pressing jig includes a step of forming an insulating member that constitutes the pressing jig and has a lower hardness than the substrate. In the step of pressing, an elastic member constituting the placed pressing tool on the opposite side, the state in which mounting components are pressurized connected on the conductive layer of the board maintained for mounting components of the insulating member Is done.

  In the electronic component according to the present invention, the elastic member is disposed so as to be in non-contact with the mounted component by interposing the insulating member. For this reason, it is not always necessary to use a heat-resistant material having high elasticity when the mounted component generates heat when the insulating member is in contact with the mounted component, and the range of options for the insulating member material can be widened. In addition, since the mounting component is press-connected on the substrate by a pressing jig including an elastic member, mounting is performed without using solder, and therefore, generation of solder cracks due to heat cycles can be eliminated.

It is a schematic perspective view which shows the aspect of the mounting component mounted on a wiring board and a wiring board which comprises the electronic component of Embodiment 1 of this invention. It is a schematic perspective view which shows the external appearance aspect of the electronic component of Embodiment 1 of this invention formed by arrange | positioning a pressing jig on the wiring board of FIG. It is a schematic perspective view which shows the aspect on a wiring board in the area | region III enclosed with the dotted line in FIG. It is a schematic sectional drawing in the part which follows the IV-IV line of FIG. It is a schematic sectional drawing which shows the contact of the mounting component which has a circular cross-sectional shape, and the resin member in the part in alignment with the VV line | wire of FIG. It is a schematic sectional drawing which shows the contact of the mounting component which has a rectangular cross-sectional shape, and the resin member in the part in alignment with the VV line | wire of FIG. It is the schematic which shows the 1st process of the manufacturing method of the resin member of Embodiment 1 of this invention. It is the schematic which shows the 2nd process of the manufacturing method of the resin member of Embodiment 1 of this invention. It is the schematic which shows the 3rd process of the manufacturing method of the resin member of Embodiment 1 of this invention. It is the schematic which shows the 4th process of the manufacturing method of the resin member of Embodiment 1 of this invention. It is the schematic which shows the 1st process of the mounting method of the electronic component of Embodiment 1 of this invention. It is the schematic which shows the 2nd process of the mounting method of the electronic component of Embodiment 1 of this invention. It is the schematic which shows the 3rd process of the mounting method of the electronic component of Embodiment 1 of this invention. FIG. 4 is a schematic perspective view three-dimensionally showing a part shown in the schematic plan view of FIG. 3 as a part of the wiring board. It is a schematic perspective view which shows the aspect of the external appearance of the electronic component of the 1st example of Embodiment 2 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic sectional drawing in the part which follows the XVI-XVI line | wire of FIG. FIG. 17 is a schematic plan view of the electronic component of the first example of the second embodiment of the present invention shown in FIGS. 15 and 16. It is a schematic perspective view which shows the aspect of the external appearance of the electronic component of the 2nd example of Embodiment 2 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic sectional drawing in the part which follows the XIX-XIX line | wire of FIG. FIG. 20 is a schematic plan view of a second example electronic component according to the second embodiment of the present invention shown in FIGS. 18 and 19. It is a schematic perspective view which shows the aspect of the external appearance of the electronic component of the 1st example of Embodiment 3 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic sectional drawing in the part which follows the XXII-XXII line | wire of FIG. It is a schematic sectional drawing in the part which follows the XXIII-XXIII line | wire of FIG. It is a schematic perspective view which shows the aspect of the external appearance of the electronic component of the 2nd example of Embodiment 3 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic sectional drawing in the part which follows the XXV-XXV line | wire of FIG. It is a schematic perspective view which shows the aspect of the external appearance of the electronic component of Embodiment 4 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic sectional drawing in the part which follows the XXVII-XXVII line of FIG. It is a schematic perspective view which shows the aspect of the external appearance of the electronic component of Embodiment 5 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic sectional drawing in the part which follows the XXIX-XXIX line | wire of FIG. It is a schematic sectional drawing of the electronic component of Embodiment 6 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic sectional drawing of the electronic component of Embodiment 7 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic sectional drawing of the electronic component of Embodiment 8 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic perspective view which shows the aspect of the external appearance of the electronic component of Embodiment 9 of this invention formed by arrange | positioning a pressing jig on a wiring board. It is a schematic sectional drawing of the electronic component of the 1st example of Embodiment 9 of this invention. It is a schematic sectional drawing of the electronic component of the 2nd example of Embodiment 9 of this invention. It is a schematic sectional drawing of the electronic component of the 3rd example of Embodiment 9 of this invention. It is a schematic sectional drawing of the electronic component of the 4th example of Embodiment 9 of this invention. It is a schematic sectional drawing of the electronic component of the 5th example of Embodiment 9 of this invention. It is a schematic sectional drawing of the electronic component of the 6th example of Embodiment 9 of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
First, the structure of the electronic component of this embodiment will be described with reference to FIGS.

  With reference to FIG. 1, the electronic component of the present embodiment includes a wiring board 1, a conductive layer 2, and a mounting component 3. The wiring substrate 1 is a substrate having a main surface and a conductive layer 2 patterned on the main surface.

  The wiring board 1 has a role as a base on which the semiconductor chip and the mounting component 3 installed on the main surface thereof are placed, and the placed semiconductor chip and the devices outside the wiring board 1 are connected to each other. It has a role of electrical connection. The conductive layer 2 is formed on one (upper) main surface of the wiring board 1 to electrically connect a semiconductor chip and a mounting component 3 mounted on the wiring board 1 to an external device or the like. Are formed as so-called substrate electrodes. The plurality of conductive layers 2 patterned on the wiring board 1 have different potentials. The wiring substrate 1 is formed of a glass epoxy substrate, a paper phenol substrate, or the like, and can be said to constitute the wiring substrate 1 integrally with the conductive layer 2.

  The mounting component 3 is a so-called surface mounting component, for example, a component on which a plurality of ordinary chip resistors, chip capacitors, surface mounting inductors, diodes, transistors, and the like are mounted. The mounting component 3 has an electrode (not shown), and the mounting component 3 and the conductive layer 2 are electrically connected by arranging the electrode in contact with the conductive layer 2 on the main surface of the wiring board 1. Yes. In this way, the mounting component 3 is mounted on the wiring board 1 by being electrically connected to the conductive layer 2.

  On the wiring board 1, the plurality of mounting components 3 are different in size and thickness in plan view. Each mounting component 3 extends over a plurality of (for example, two) conductive layers 2, that is, overlaps at least a part of the plurality of (for example, two) conductive layers 2 in plan view. It is mounted on the wiring board 1 so as to be electrically connected to each of the conductive layers 2.

  Referring to FIG. 2, in electronic component 100 of the present embodiment, pressing jig 4 is provided above the main surface of one side of wiring board 1 (the upper side where conductive layer 2 is formed and mounting component 3 is mounted). Have. The pressing jig 4 is disposed so as to face the mounting component 3 (see FIG. 1) placed on the wiring substrate 1, in other words, the side opposite to the wiring substrate 1 when viewed from the mounting component 3 (FIG. 2). On the upper side). The pressing jig 4 includes a peripheral jig 5, an elastic member 6 that contacts the peripheral jig 5, and a resin member 14.

  The resin member 14 constituting the pressing jig 4 is arranged so as to face the mounting component 3 (see FIG. 1) placed on the wiring board 1, and the glass epoxy board constituting the wiring board 1 or the like. It is formed as an insulating member (for example, a resin material) having a lower hardness than the above material. The resin member 14 has, for example, a rectangular parallelepiped shape that overlaps the wiring substrate 1 in plan view.

  The elastic member 6 is a component capable of supplying an elastic force by being compressed, and can be a coil spring, a Z-shaped leaf spring, a U-shaped leaf spring, rubber or any other component having an elastic force. can do. The peripheral jig 5 has a role of positioning the resin member 14 by surrounding the periphery of the resin member 14 and contacting the elastic member 6. A plurality of shapes are conceivable as the peripheral jig 5, but in FIG. 2, they are shown in a simplified manner so as to include all of these plural aspects.

  One end (for example, the upper end of FIG. 2) of the elastic member 6 is in contact with the peripheral jig 5, and the other end (for example, the lower end of FIG. 2) is in contact with the resin member 14. Yes. Thereby, since the elastic member 6 can supply elastic force to the resin member 14, the resin member 14 can be displaced according to the expansion and contraction by the elastic force of the elastic member 6 (for example, in the vertical direction in FIG. 2). it can. Further, since the resin member 14 faces the mounting component 3 (see FIG. 1) placed on the wiring board 1, if the resin member 14 is displaced downward in FIG. Can be pressed against the wiring board 1 side (the lower side in FIG. 2) by contacting the mounting part 3 facing this and pressing it against the main surface side of the wiring board 1. By the elastic force of the elastic member 6, pressure connection is performed so that the mounting component 3 is pressed onto the wiring board 1. As a result, the mounting component 3 is fixed so as to be pressed onto, for example, the conductive layer 2 (see FIG. 1) of the wiring board 1.

  With reference to FIG. 3, the following description will be made more concretely using a region III basically surrounded by a dotted line in FIG. 1. In this region III, three mounting components 3 having different sizes are arranged. Each mounting component 3 is disposed so as to straddle the plurality of conductive layers 2.

  Referring to FIG. 4, there is a gap between wiring board 1 (conductive layer 2 on the main surface of wiring board 1) and pressing jig 4 (resin member 14) arranged so as to face this. There is a gap 7 in the vertical direction of 4. By providing the gap 7, for example, when the resin member 14 receives an elastic force and is displaced (creep) in the left-right direction in FIG. 4, the resin member 14 comes into contact with the wiring substrate 1 (conductive layer 2), The possibility that the pressing jig 4 including the resin member 14 weakens the pressing force that presses the mounting component 3 against the wiring board 1 (conductive layer 2) can be reduced.

  Further, since the heat generated by the mounted component 3 is radiated from the gap 7, the efficiency of heat radiation is increased. A part of the side surface of the mounting component 3 is formed by a gap 7 between the wiring board 1 (the conductive layer 2 on the main surface of the wiring board 1) and the pressing jig 4 (resin member 14) disposed so as to face the wiring board 1. Is exposed directly to the outside air. For this reason, since the mounting component 3 can be cooled by forced air cooling, the degree of freedom in the thermal design of the mounting component 3 can be improved.

  For example, when the heat generation amount of the mounting component 3 exceeds a specified amount, if the gap is not present and the entire mounting component 3 is covered with a resin material, as a method of releasing the heat generated by the mounting component 3, It is necessary to further increase the thermal conductivity of the resin member 14. However, in the present embodiment, in addition to the method of increasing the thermal conductivity of the resin member 14, a method of cooling the mounting component 3 by forced air cooling can be selected.

  The resin member 14 includes a contact resin member 11 (second insulating member) and a main body resin member 12 (first insulating member). The main body resin member 12 is a resin member forming the main body of the resin member 14. The contact resin member 11 is formed so as to be in contact with the surface of the main body resin member 12 on the side of the wiring board 1 (the lower side in FIG. 4), and directly contacts the mounting component 3 by facing the mounting component 3. Is possible. Therefore, the contact resin member 11 is a member that presses the mounting component 3 directly to the wiring board 1 side by the elastic force of the elastic member 6.

  The contact resin member 11 preferably has a lower hardness (softer) than the main body resin member 12. The contact resin member 11 and the main body resin member 12 may be different insulating materials (resin materials) or the same insulating material (resin material). For example, the same resin material is used for the contact resin member 11 and the main body resin material 12. For example, by changing only a part of the composition of the main body resin member 12 or by subjecting only the main body resin member 12 to heat treatment. The hardness of the main body resin member 12 may be higher than that of the contact resin member 11. The main body resin member 12 is preferably thicker than the thickness of the contact resin member 11 (the vertical dimension in FIG. 4, that is, the dimension in the direction perpendicular to the main surface of the wiring board 1).

  Since the resin member 14 is divided into two layers of the contact resin member 11 and the main body resin member 12, the roles of the resin members 11 and 12 can be clearly shared. Can be widened, and the most suitable material for the role of the resin members 11 and 12 can be selected.

  Each of the plurality of mounting components 3 is disposed so as to be in contact with the conductive layer 2 on the same surface, but each mounting component 3 has a different size and a different height on the upper surface. For this reason, the contact resin member 11 and the main body resin member 12 have a plurality of recesses CC having different sizes and depths depending on the size of the respective mounting components 3 and the height of the upper surface. The concave portion CC extends in a direction intersecting with the main surface of the wiring substrate 1, that is, in the vertical direction in FIG. When the mounting component 3 is fitted into the recess CC, the side surface and the upper surface thereof can come into contact with the contact resin member 11.

  The mounting component 3 can take any shape as a cross-sectional shape in the direction along the main surface of the wiring board 1 of FIG. For example, referring to FIG. 5, the cross-sectional shape of mounting component 3 may be circular, or the cross-sectional shape of mounting component 3 may be rectangular with reference to FIG.

  It is preferable that the mounting component 3 fitted in the recess CC is in contact (at the side surface) with at least the recess CC of the resin member 11 at three or more points.

  Specifically, with respect to the three points here, referring again to FIG. 5, at least two of the three points A, B, and C are arranged so as to sandwich the center of gravity GR of the circular section of the mounting component 3. Has been. That is, in FIG. 5, the point A exists above the center of gravity GR, and the points B and C exist below the center of gravity GR. Thus, it is preferable that at least two points out of the three points that are not on the same straight line are present on the opposite sides with respect to the center of gravity GR of the cross section of the mounted component 3.

  The case where there are four or more points where the concave portion CC and the mounting component 3 are in contact is the same as the case where there are three points. For example, referring again to FIG. 6, the rectangular cross section of the mounting component 3 and the recess CC are in contact with each other at four points D, E, F, and G, the point D is above the center of gravity GR, and the point E is the center of gravity GR. Present on the underside. The point F exists on the left side of the center of gravity GR, and the point G exists on the right side of the center of gravity GR.

  In this way, the possibility that the mounting component 3 is displaced in the left-right direction in FIG. 4 in the recess CC is reduced, and the recess CC can hold the mounting component 3 more firmly. If some of the above points and other points are arranged so as to sandwich the center of gravity GR of the cross section of the mounting component 3, some points and the other points are in opposite directions with respect to the center of gravity GR. Therefore, the force for holding the mounting component 3 is applied in the direction along the main surface of the wiring board 1, and these resultant forces for holding the mounting component 3 are balanced with each other, so that the displacement of the mounting component 3 can be suppressed. It is.

  The thickness of the resin member 14 in the direction (vertical direction in FIG. 4) perpendicular to the main surface of the wiring board 1 in the region overlapping the concave portion CC in plan view, that is, the region facing the mounting component 3 is the above-described thickness of the mounting component 3. More than the dimensional error in the thickness direction. In particular, in FIG. 4, the resin member 14 includes a contact resin member 11 and a main body resin member 12. For this reason, the thickness in the vertical direction of FIG. 4 of the contact resin member 11 (in contact with the mounting component 3) is greater than or equal to the dimensional error in the thickness direction of the mounting component 3.

  For example, when the dimensional error of the thickness in the vertical direction in FIG. 4 of each mounting component 3 is ± 1 mm at the maximum, the thickness of the mounting component 3 has a dimensional error of 2 mm at the maximum between the maximum value and the minimum value. For this reason, it is preferable that the thickness of the resin member 14 (particularly, the contact resin member 11) in the vertical direction in FIG. 4 is 2 mm or more.

  The pressing jig 4 may have a plate material 13 on the surface of the main body resin member 12 opposite to the wiring board 1 (upper side in FIG. 4). The plate material 13 is a flat plate member made of a material harder (higher hardness) than the resin member 14 (both the contact resin member 11 and the main body resin member 12) such as a metal plate. Here, the pressing force transmitted from the elastic member 6 to the resin member 14 can be evenly transmitted to the resin member 14 by providing the plate member 13 having higher hardness than both the contact resin member 11 and the main body resin member 12. Therefore, for example, when the hardness of the resin member 14 is sufficiently high and the elastic force from the elastic member 6 can be uniformly transmitted to the resin member 14 (main body resin member 12), the plate member 13 need not be provided.

  When a conductive member such as a metal plate is used as the plate member 13, electromagnetic noise emitted from the mounted component 3 toward the plate member 13 is shielded by the plate member 13. For this reason, the rate at which electromagnetic noise leaks to the outside of the electronic component 100 can be reduced.

  Furthermore, if a metal plate having a high thermal conductivity is used as the plate member 13 to be attached on the surface of the resin member 14, the mounting component 3 generates heat from the resin member 14 above the effect as well as the effect of transmitting the pressing force evenly as described above. The heat is efficiently radiated by transmitting to the (elastic member 6 side). The area of the contact surface between the mounting component 3 and the (contact) resin member 14 (11) is larger than the area of the contact surface between the mounting component 3 and the conductive layer 2. For this reason, most of the heat generated by the mounting component 3 is radiated from the plate member 13 through the main body resin member 12 from the contact resin member 11. Therefore, if a metal plate having a high thermal conductivity is used for the plate member 13, the heat dissipation of the mounting component 3 can be increased, and thus the heat dissipation of the electronic component 100 can be increased.

  In the present embodiment, the elastic member 6 has the resin member 14 (plate material 13) and the peripheral jig 5 in contact with the resin member 14 (plate material 13 when the plate material 13 is present) and the peripheral jig 5. It arrange | positions so that it may interpose. The elastic member 6 is disposed on the side opposite to the mounting component 3 of the resin member 14 (the upper side of the resin member 14 in FIG. 4). In other words, the elastic member 6 is disposed so that the resin member 14 is interposed between the elastic member 6 and the mounting component 3 (in other words, the elastic member 6 is not in contact with the mounting component 3).

  Next, an electronic component mounting method according to the present embodiment will be described with reference to FIGS. First, the manufacturing method of the resin member 14 is demonstrated using FIGS.

  Referring to FIG. 7, a mold 21 having a shape capable of forming a recess CC into which the mounting component 3 can be fitted is prepared.

  The mold 21 has a resin molded portion 22 in which a shape for forming the resin member 14 (particularly the main body resin member 12) is cut out. The mold 21 is provided with an introduction port 23 for introducing a resin material into the resin molding portion 22.

  Referring to FIG. 8, the heat-melted resin material is introduced and filled into resin molding portion 22 from introduction port 23. The resin material is molded into a desired shape according to the shape of the resin molding portion 22 by normal injection molding. After this is solidified by cooling, it is taken out from the mold 21 to form the main body resin member 12 having the recess CC as a base of the recess for fitting the mounting component 3 as shown in FIG.

  Referring to FIG. 9, a resin molding in which a shape for forming resin member 14 (main body resin member 12 having contact resin member 11) of die 24 different from die 21 shown in FIG. 7 is hollowed out. The main body resin member 12 of FIG.

  Next, the resin material heated and melted from the inlet 26 between the main body resin member 12 and the shape part for forming the recess CC for fitting the mounting component 3 formed in the resin molding part 25 Is introduced and filled. By forming the resin material into a desired shape according to the shape of the resin molding portion 25 (in a thin film shape along the concave portion CC of the main body resin member 12) by normal injection molding, the contact resin member 11 is formed. It is formed so as to form a film.

  Here, the contact resin member 11 and the main body resin member 12 are formed as insulating members having lower hardness than the wiring substrate 1 (see FIG. 4).

  Referring to FIG. 10, main body resin member 12 on which contact resin member 11 of FIG. 9 is formed is taken out from mold 24. If necessary, a plate material 13 is affixed on a plane of the main body resin member 12 opposite to the contact resin member 11. Thereby, the resin member 14 (the board | plate material 13 was affixed) is formed.

  Next, the mounting method of the electronic component 100 (refer FIG. 4) using the resin member 14 is demonstrated using FIGS.

  Referring to FIG. 11, the resin member 14 constituting the pressing jig 4 (see FIG. 4) is fitted to the size of each recess CC in a state where the side where the recess CC is formed faces upward. The mounting component 3 having a size to be mounted is set (fitted) so as to be upside down.

  Referring to FIG. 12, mounting component 3 is set so as to be in contact with conductive layer 2 patterned on one main surface of wiring board 1 prepared in advance (so that mounting component 3 faces downward). Is done. That is, the mounting member 3 is set so as to straddle the surface of the plural (two) conductive layers 2 in a state where the resin member 14 fitted with the mounting component 3 of FIG.

  In this state, for example, a mounting component formed so as to have a thickness larger than a desired thickness (in the vertical direction in FIG. 12) due to a dimensional error during manufacturing, such as the mounting component 3 on the left side in FIG. 3 may exist. Further, for example, like the mounting component 3 in the middle, the mounting component 3 formed so as to have a small thickness with respect to a desired thickness (in the vertical direction in FIG. 12) due to a dimensional error at the time of manufacturing, and a recess CC into which the mounting component 3 is inserted. A gap 15 is formed between the two. As described above, when the dimensions of the mounting components 3 vary, the resin member 14 cannot apply pressure evenly to the mounting components 3 that are in contact therewith, and the resin member 14 is large so as to be biased toward some of the mounting components 3. Failure to apply pressure can occur.

  Referring to FIG. 13, in the state of FIG. 12, the elastic member 6 and the peripheral jig 5 are further set in this order on the surface of the resin member 14 (plate material 13). Thus, the mounting component 3 on the conductive layer 2 is pressed toward the conductive layer 2 by using the elastic force of the pressing jig 4 including the elastic member 6 (see the force F indicated by the arrow in FIG. 13). Is done.

  Due to this pressing force, the resin members 11 and 12 in the region facing the mounting component 3 (immediately above the mounting component 3) are compressed in the vertical direction of the drawing by the amount of the thickness of the left mounting component 3 in FIG. Accordingly, the resin members 11 and 12 in the region facing the mounting component 3 in the middle of FIG. 12 can descend downward to make the gap 15 small (disappear). Thereby, the elastic force from the elastic member 6 can be supplied to each mounting component 3 evenly, and each mounting component 3 can be uniformly contacted with the conductive layer 2.

Next, the effect of this Embodiment is demonstrated.
In the present embodiment, instead of mounting the mounting component 3 on the conductive layer 2 using solder, the mounting component 3 is mounted on the conductive layer 2 using the elastic force of the elastic member 6 constituting the pressing jig 4. Thus, the state in which the mounting component 3 and the conductive layer 2 are energized is maintained. For this reason, it is not necessary to use solder when the mounting component 3 is (electrically) connected to the conductive layer 2. Therefore, in the electronic component 100 that applies a high heat cycle at the time of driving, for example, for in-vehicle use, it is possible to eliminate the possibility that the solder of the mounting component 3 will crack and affect the mounting state of the mounting component 3. As a result, the reliability of the electronic component 100 can be improved.

  Further, in the present embodiment, the elastic member 6 that supplies elastic force does not directly contact the mounting component 3, and the resin member 14 is sandwiched between the elastic member 6 and the mounting component 3. The elastic member 6 provides pressure so that the mounting component 3 below the resin member 14 is in contact with the conductive layer 2. In order to supply this pressure almost uniformly to all of the plurality of mounting components 3, it is preferable that the resin member 14 is pressed in a state of being substantially parallel (horizontal) to the main surface of the wiring board 1. .

  Therefore, by setting the pressing jig 4 so that the mounting component 3 can come into contact with an insulating member (resin member 14) having a lower hardness than that of the wiring board 1, the resin member 14 having flexible properties can be used as necessary. To eliminate the dimensional error in the thickness of the mounted component 3. For this reason, the malfunction that pressing force becomes non-uniform | heterogenous by the dimensional error of the thickness of the mounting component 3 can be suppressed. That is, in the present embodiment, the applied pressure applied from the elastic member 6 to the resin member 14 is not limited to the dimensional error of the thickness of the mounted component 3, and all the mounted components 3 fitted in the resin member 14 (recessed portion CC). On the other hand, a substantially uniform pressing force can be applied. Thereby, each mounting component 3 can maintain the state contact-conductive with the conductive layer 2 with equal force.

  Here, the mechanism in which the resin member 14 reduces the influence of the dimensional error of the mounted component 3 will be described more specifically. Referring to FIG. 12 again, for example, when the thickness of the mounting component 3 is larger than the median value of the dimensional standard, the thickness of the resin member 14 facing the upper side of the mounting component 3 is at most the thickness D1 of the resin member 14. Can only shrink. In other words, since the resin member 14 has the thickness D1 equal to or larger than the dimensional error of the thickness of the mounting component 3, even when the thickness of the mounting component 3 becomes the maximum value (allowable) due to the error, The excessive thickness of the mounting component 3 can be eliminated by the compression.

  In the case of the present embodiment, the resin member 14 has two types of resin members, that is, the contact resin member 11 and the main body resin member 12, and the contact resin member 11 has a lower hardness than the main body resin member 12 ( That is, it is soft and easily deformed by pressing). Conversely, the main body resin member 12 has a higher hardness than the contact resin member 11 and may not be easily deformed. For this reason, if it is considered that the thickness D2 of the contact resin member 11 facing the mounting component 3 is the maximum compressible thickness due to variations in the thickness of the mounting component 3, the thickness D2 is greater than the dimensional error of the thickness of the mounting component 3. It is preferable that

  In this way, the contact resin member 11 (resin member 14) that can shrink by its own size can be compressed to eliminate the dimensional error (variation) in the thickness of the mounted component 3. However, it does not need to have such a large elastic force as to supply an elastic force to the mounting component 3. This is because an elastic member 6 capable of supplying an elastic force is separately installed. For this reason, it is not always necessary to use a material having excellent heat resistance (for supplying a large elastic force) as the material used for the contact resin member 11 (resin member 14) that generates a large amount of heat during driving. From this, the range of choices of materials used for the contact resin member 11 (resin member 14) can be expanded.

  In addition, since the (contact) resin member 14 (11) and the mounting component 3 are arranged so as to be in contact with each other, the heat of the mounting component 3 can be transmitted through the (contact) resin member 14 (11). Heat can be dissipated and the cooling performance of the mounting component 3 is improved.

  Finally, as a function and effect of the present embodiment, as described above, the mounting method of the electronic component 100 of the present embodiment is the mounting component 3 fitted in the recess CC of the resin member 14 constituting the pressing jig 4. Is mounted on the conductive layer 2 of the wiring board 1 and the mounting component 3 is pressed. Thus, since the conductive layer 2 and the mounting component 3 are connected only by the pressurization of the pressing jig 4, for example, the mounting process can be greatly simplified as compared with the connection using solder. Also, the resin member 14 can be easily formed by an injection molding process using the molds 21 and 24.

(Embodiment 2)
Referring to FIG. 14, this is basically a wiring board 1 added to the embodiment of FIG. Each of the following embodiments will be described using the region III surrounded by the round dotted line in FIG. 1, which is basically the same as that of the first embodiment.

  With reference to FIG. 15 and FIG. 16, here, an example of a specific shape of the peripheral jig 5 shown in FIG. 2 and FIG. 4 (Embodiment 1) is shown. Specifically, in electronic component 200, peripheral jig 5A (corresponding to peripheral jig 5 of the first embodiment) has first component 5A1 and second component 5A2. The first component 5A1 is a component that extends in a direction (horizontal direction) along the main surface of the wiring board 1 so as to cover at least a part of the wiring board 1 and the resin member 14 in a plan view from the outside of the wiring board 1 and the resin member 14. It is. The second component 5A2 is a component that extends in a direction (vertical direction) perpendicular to the main surface of the wiring board 1 outside the wiring board 1 and the resin member 14 in plan view.

  The two first components 5A1 and one second component 5A2 extend in directions perpendicular to each other, and they are connected to each other to form an integrated peripheral jig 5A. Specifically, one end of one second component 5A2 and the other end thereof are connected to one end of each of the two first components 5A1 (the left end in FIGS. 15 and 16). The integrated peripheral jig 5A. The integrated peripheral jig 5A is disposed so as to surround the wiring board 1 and the resin member 14 from the outside.

  Referring to FIGS. 15 to 17, here, the two first components 5 </ b> A <b> 1 have a long and narrow planar shape as compared with the planar shape of wiring substrate 1 so that only a part of wiring substrate 1 and resin member 14 overlaps in plan view. have. In FIG. 15, the first component 5 </ b> A <b> 1 is arranged so as to overlap with the central portion of the wiring board 1 and the resin member 14 in the depth direction in the drawing. 15 and 16, the first component 5A1 is arranged so as to overlap the wiring board 1 and the resin member 14 in plan view in the left-right direction of the figure, but the first component 5A1 is the wiring board 1 in the left-right direction. Alternatively, it may be arranged so as to overlap a part of the resin member 14 in plan view. For example, the first component 5A1 may be arranged so as to cover only about a half region on the left side of the wiring board 1 and the resin member 14 of FIGS. 15 and 16.

  The elastic member 6 is interposed between the first component 5A1 on the resin member 14 side (upper side) and the resin member 14, and the elastic member 6 is in contact with both the first component 5A1 and the resin member 14. . For this reason, there is a gap between the first component 5A1 on the resin member 14 side and the resin member 14. On the other hand, the first component 5A1 on the wiring board 1 side (lower side) is disposed so as to be in contact with the lower main surface (opposite side of the main surface on which the conductive layer 2 is formed) of the wiring substrate 1. . In other words, the first component 5A1 on the wiring board 1 side supports the wiring board 1 from below by mounting the wiring board 1.

  The second component 5A2 present in the left region in FIGS. 15 and 16 has a slight gap between the wiring board 1 and the resin member 14.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  Next, the effect of this Embodiment is demonstrated. In the present embodiment, in addition to the main operational effects of the first embodiment, the following operational effects are provided.

  In the electronic component 200 of the present embodiment, the peripheral jig 5 is formed so as to mount and support the wiring board 1 on the wiring board 1 side. That is, the first component 5A1 on the lower side of the peripheral jig 5 is fixed so as to be in contact with the wiring board 1 and supports the wiring board 1 as a base plate of the wiring board 1. For this reason, the heat generation of the wiring board 1 can be dissipated from the lower part so as to be transmitted through the first component, and the cooling performance of the wiring board 1 can be improved.

  In the first example of FIGS. 15 to 17, the pressing jig 4 presses the mounting component 3 against the wiring board 1 by one peripheral jig 5 </ b> A and the elastic member 6. However, referring to the electronic component 201 of the second example of FIGS. 18 to 20, the pressing jig 4 presses the mounting component 3 against the wiring board 1 by two (or more) surrounding jigs 5 </ b> A and the elastic member 6. It is good. Here, the two peripheral jigs 5A and the elastic member 6 are arranged with a space therebetween in the depth direction of FIG. In this way, it is possible to supply a more uniform pressing force to each implementation component 3 than when only one peripheral jig 5A and one elastic member 6 are provided.

(Embodiment 3)
Referring to FIGS. 21 to 23, the peripheral jig 5B (corresponding to the peripheral jig 5 of the first embodiment) of the electronic component 300 in the first example of the present embodiment is the peripheral jig of the second embodiment. Similar to 5A, it has a first component 5B1 and a second component 5B2. Similar to the first component 5A1 of the second embodiment, the first component 5B1 covers at least a part of the wiring substrate 1 and the resin member 14 in a plan view from the outside of the wiring substrate 1 and the resin member 14. It is a component extended in the direction along the main surface. Similarly to the second component 5A2 of the second embodiment, the second component 5B2 is a component that extends in a direction perpendicular to the main surface of the wiring board 1 outside the wiring board 1 and the resin member 14 in plan view.

  The peripheral jig 5B has two first components 5B1 and two second components 5B2, which are connected to each other so as to be perpendicular to each other to form a ring-shaped rectangle. . In FIG. 21, a peripheral jig 5B is arranged at the center of the resin member 14 and the wiring board 1 in the depth direction. The peripheral jig 5 is arranged in the horizontal direction of FIG. It is arranged at a position that is line-symmetric with respect to the center line.

  As described above, in the peripheral jig 5B of the present embodiment, the second component 5B2 is arranged on both the left side and the right side of the drawing, forming a closed loop. In this respect, the second component 5A2 is arranged only on the left side of the drawing, and is different from the peripheral jig 5A of the second embodiment that forms an open loop in which the right side of the drawing is opened.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 2, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  Next, the effect of this Embodiment is demonstrated. In the present embodiment, in addition to the main operational effects of the second embodiment, the following operational effects are provided.

  As shown in FIGS. 21 to 23, when the peripheral jig 5B forms a closed loop, particularly when the peripheral jig 5B is formed of a conductive material such as a metal, it is discharged from the mounting component 3 toward the peripheral jig 5B. The electromagnetic noise is shielded by the surrounding jig 5B. For this reason, the rate at which electromagnetic noise leaks outside the electronic component 300 can be reduced.

  In the first example of FIGS. 21 to 23, the pressing jig 4 presses the mounting component 3 against the wiring board 1 by one peripheral jig 5 </ b> B and the elastic member 6. However, referring to the electronic component 301 of the second example of FIGS. 24 to 25, the pressing jig 4 presses the mounting component 3 against the wiring board 1 by two (or more) surrounding jigs 5 </ b> B and the elastic member 6. It is good. Here, the two peripheral jigs 5B and the elastic member 6 are arranged at intervals from each other in the depth direction of FIG. In this way, it is possible to supply a more uniform pressing force to each implementation component 3 than when only one peripheral jig 5B and only one elastic member 6 are provided.

  Note that a housing-like peripheral jig 5 that overlaps the entire resin member 14 and the wiring substrate 1 in a plan view and stores the entire wiring substrate 1 and the resin member 14 may be used.

(Embodiment 4)
Referring to FIGS. 26 and 27, peripheral jig 5C of electronic component 400 (corresponding to peripheral jig 5 of the first embodiment) is two second jigs (similar to peripheral jig 5A of the second embodiment). One component 5C1 and one third component 5C3 are included. However, the first component 5C1 extends only to the central portion of the resin member 14 in the left-right direction in the figure, and is not formed to cover the entire left-right direction of the resin member 14. The first component 5C1 extends in an oblique direction with respect to the direction along the main surfaces of the wiring board 1 and the resin member 14, and specifically, the central portion of the main surfaces of the wiring board 1 and the resin member 14. As it approaches, the first component 5C1 extends in an oblique direction while curving so that the distance between the wiring substrate 1 and the like is reduced. The third component 5 </ b> C <b> 3 extends in the vertical direction while curving so as to be closer to the resin member 14 and the wiring board 1 than the upper and lower ends at the center in the extending vertical direction.

  Each of the pair of first components 5 </ b> C <b> 1 has a gripping portion 16 at each distal end portion (a portion overlapping a central portion such as the resin member 14 in a plan view). The pair of gripping portions 16 are in contact with the upper main surface of the resin member 14 (the main body resin member 12 or the plate member 13 thereon) and the lower main surface of the wiring board 1. As a result, the pair of gripping portions 16 are configured so that a part of the surface along the main surface of the wiring board 1 and the resin member 14 (or the surface along the main surface of the plate member 13) is viewed from the outside of the wiring board 1 and the resin member 14. It is sandwiched so as to apply force in the vertical direction. The force with which the peripheral jig 5C sandwiches the wiring board 1 and the resin member 14 corresponds to the elastic force of the elastic member 6 of the electronic component 100 of the first embodiment, and is a force that press-connects the mounting component 3 to the conductive layer 2. Works.

  The peripheral jig 5C has an aspect in which the first component 5C1 and the third component 5C3 extend while being curved, and has an elastic force by having the gripping portion 16, so that the material constituting this is, for example, the peripheral jig It is preferable that the material is stronger than the material constituting 5A and 5B.

  Therefore, the peripheral jig 5C has a function like a clip, and functions as a single piece of the peripheral jig 5 of Embodiment 1 (contacts the wiring board 1 and the resin member 14 to determine their positions) and elasticity. It can be said that it also has the function of member 6 (supplying elastic force). Therefore, in the present embodiment, by integrating the peripheral jig 5 and the elastic member 6 with the peripheral jig 5C, the number of parts can be reduced, and the cost of the electronic component 400 can be reduced. it can.

  The third component 5C3 is a component that extends in a direction perpendicular to the main surface of the wiring board 1 outside the wiring board 1 and the resin member 14 in plan view, like the second component 5A2 of the peripheral jig 5A of the second embodiment. And disposed on the left side of the wiring board 1 and the resin member 14. In the peripheral jig 5C, similarly to the peripheral jig 5A, the first component 5C1 and the third component 5C3 are connected to each other at the left end in FIGS.

(Embodiment 5)
Referring to FIGS. 28 to 29, electronic component 500 has a peripheral jig 5D having a clip-like function, such as peripheral jig 5C of the fourth embodiment. The peripheral jig 5D is different from the peripheral jig 5C forming an open loop in that a closed loop is formed in the same manner as the peripheral jig 5B of the third embodiment.

  The peripheral jig 5D has two first components 5D1 and two third components 5D3. The first component 5D1 extends in a direction along the main surface of the wiring board 1 or the like, and the third component 5D3 extends in a direction perpendicular thereto. Each of the first components 5 </ b> D <b> 1 is in contact with the upper main surface of the resin member 14 and the lower main surface of the wiring board 1, and this contacting portion is a grip portion 16. That is, each gripping portion 16 of the pair of first components 5D1 has a part of the surface along the main surface of the wiring substrate 1 and the resin member 14 (or the surface along the main surface of the plate member 13) of the wiring substrate 1 and the resin. It is sandwiched from the outside of the member 14. This clamping force corresponds to an elastic force as in the fourth embodiment.

  The first component 5D1 extends in a direction along the main surfaces of the wiring board 1 and the resin member 14. For this reason, the gripping portion 16 in which the first component 5D1 is in contact with the wiring board 1 or the like may be formed as substantially the entire region where the first component 5D1 and the wiring board 1 or the like overlap in plan view.

  Since the peripheral jig 5D having the grip portion 16 of the present embodiment has both the function as the peripheral jig 5 and the function as the elastic member 6 in the same manner as the peripheral jig 5C of the fourth embodiment, The number of parts can be reduced. Also, as shown in FIGS. 28 to 29, when the peripheral jig 5D forms a closed loop, particularly when the peripheral jig 5D is formed of a conductive material such as metal, the mounting component 3 moves toward the peripheral jig 5D. The emitted electromagnetic noise is shielded by the surrounding jig 5D. For this reason, the rate at which electromagnetic noise leaks to the outside of the electronic component 500 can be reduced. Furthermore, since the upper first component 5D1 is in contact with the resin member 14 and the lower first component 5D1 is in contact with the wiring board 1, heat generated by the mounting component 3 can be radiated from both the upper and lower first components 5D1 with high efficiency. Can do.

  Although not shown, in the fourth and fifth embodiments, for example, as shown in FIGS. 18 and 24, two or more peripheral jigs 5C and 5D may be provided. In this way, a more uniform elastic force can be applied to the mounting component 3.

(Embodiment 6)
Referring to FIG. 30, in electronic component 600 of the present embodiment, mounting component 3 and conductive layer 2 of wiring substrate 1 are joined by solder 30 in addition to the configuration of electronic component 100 of the first embodiment. It is different in point.

  That is, in the present embodiment, the mounting component 3 and the conductive layer 2 are connected by both the pressing force by the elastic member 6 of the pressing jig 4 and the joining force of the solder 30.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  Next, the effect of this Embodiment is demonstrated. In the present embodiment, in addition to the main operational effects of the first embodiment, the following operational effects are provided.

  In the present embodiment, since the mounting component 3 and the conductive layer 2 are pressure-connected by the pressing force of the elastic member 6, both are further joined by the solder 30, and the solder 30 forms a crack by the heat cycle. Even so, contact failure due to peeling of the solder 30 does not occur. As described above, since the conductive state between the mounting component 3 and the conductive layer 2 can be maintained, even when the electronic component 600 is used in an environment where a large heat cycle is applied, the crack of the solder can be achieved without making a design change. It is possible to suppress the contact failure due to.

(Embodiment 7)
Referring to FIG. 31, in electronic component 700 of the present embodiment, a plurality of mounted components 3 are arranged on conductive layer 2 of wiring board 1, as in the other embodiments described above. Among the plurality of mounting components 3, an opening 31 is formed in the wiring substrate 1 between a pair of mounting components 3 adjacent to each other along the main surface of the wiring substrate 1 (the mounting components 3 on the left side and the center in FIG. 31). Is formed. The opening 31 is, for example, a hole formed so as to penetrate the wiring substrate 1 from one (upper) main surface of the wiring substrate 1 to the other (lower) main surface opposite to the main surface.

  For example, a positioning member 32 is formed from the main body resin member 12 of the resin member 14 toward the wiring substrate 1. The positioning member 32 is a part of the main body resin member 12 and is integrally connected to the main body resin member 12 and intersects the main surface of the wiring board 1 from the main body resin member 12 (for example, on the main surface of the wiring board 1). It is an elongate member extending in a (vertical) direction and is fitted inside the opening 31. The positioning member 32 is a part of the contact resin member 11 instead of the main body resin member 12, and may be integrally connected to the contact resin member 11.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  Next, the effect of this Embodiment is demonstrated. In the present embodiment, in addition to the main operational effects of the first embodiment, the following operational effects are provided.

  An opening 31 is formed at a desired location on the wiring board 1, and the resin member 14 is set so that a positioning member 32 integrated with the resin member 14 is fitted into the opening 31. In this way, in a state where the positioning member 32 is fitted in the opening 31, the resin member 14 is disposed at a correct position with respect to the wiring board 1 in the direction along the main surface of the wiring board 1 (in plan view). It can be said that. In the present embodiment, the resin member 14 can be accurately positioned with respect to the wiring board 1 in such a manner.

  Note that a plurality (two or more) of the openings 31 and the positioning members 32 may be formed in the electronic component 700. In this way, since positioning is performed at two or more locations, the resin member 14 can be positioned more precisely with respect to the wiring board 1.

(Embodiment 8)
Referring to FIG. 32, in electronic component 800 of the present embodiment, positioning member 33 connected to resin member 14 is formed separately from resin member 14. In this respect, the positioning member 32 is different from the positioning member 32 of the seventh embodiment which is formed integrally with the resin member 14 (the main body resin member 12 or the contact resin member 11).

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  The positioning member 33 is formed by a metal pin, for example. In the present embodiment, it is preferable that the positioning member 33 is mounted on the wiring board 1 in advance so as to be fitted into the opening 31 before the resin member 14 is set. Also, it is preferable that an opening is provided in the resin member 14 at a position facing the opening 31 and the positioning member 33 and the positioning member 33 is fitted in advance, and the resin is formed after the positioning member 33 is mounted inside the opening 31. The member 14 is set, and the resin member 14 is aligned so that the positioning member 33 is fitted into an opening formed in the resin member 14 in advance. In this way, the resin member 14 can be accurately positioned with respect to the wiring board 1 as in the seventh embodiment.

  Note that a plurality (two or more) of the openings 31 and the positioning members 32 may be formed in the electronic component 700. In this way, since positioning is performed at two or more locations, the resin member 14 can be positioned more precisely with respect to the wiring board 1.

(Embodiment 9)
Referring to FIG. 33, electronic component 900 according to the present embodiment has an upper surface of one main surface (upper side of FIG. 33) of wiring substrate 1 and a main surface of the other surface (lower side of FIG. 33) of wiring substrate 1. The pressing jig 4 is provided on both lower sides. In this respect, the present embodiment is different from the configuration of the electronic component 100 of the first embodiment shown in FIG. Hereinafter, a specific example of the present embodiment will be described with reference to FIGS. 34 to 39.

  Referring to FIG. 34, in electronic component 900 of the present embodiment, mounting component 3 is mounted on both the upper and lower main surfaces of wiring board 1 as an example, and peripheral jig 5, elastic member 6 and resin are mounted. The structure fixed so that it might press on the conductive layer 2 with the surrounding jig | tool 4 which has the member 14 can be considered. In the configuration of FIG. 34, the configuration of the mounting component 3 and the peripheral jig 4 above the wiring board 1 in the first embodiment of FIG. 4 is also provided below the wiring board 1 (although the top and bottom are inverted). Arranged in the same manner as above the substrate 1. In other words, the mounting component 3 on the upper main surface of the wiring board 1 and the mounting component 3 on the lower main surface of the wiring board 1 are arranged so as to be line-symmetric with respect to the wiring board 1. Has been.

  In this way, since the mounting components 3 can be mounted in the same plane area twice as many as the above embodiments, the mounting density of the mounting components 3 is increased and the electronic components are further highly integrated. Can be

  Referring to FIG. 35, this is another example of the present embodiment. The configuration including mounting component 3, resin member 14 and elastic member 6 above wiring substrate 1 in the third embodiment (FIG. 22) is a wiring. It is arranged below the substrate 1 (upside down) as well as above the wiring substrate 1. In other words, the mounting component 3 on the upper main surface of the wiring board 1 and the mounting component 3 on the lower main surface of the wiring board 1 are arranged so as to be line-symmetric with respect to the wiring board 1. Has been. Then, one peripheral jig 5B collects both the mounting component 3, the resin member 14 and the elastic member 6 above the wiring substrate 1, and the mounting component 3, the resin member 14 and the elastic member 6 below the wiring substrate 1. It is a surrounding aspect.

  In this way, as in FIG. 34, since the mounting components 3 can be mounted in the same plane area by twice as many as the above embodiments, the mounting density of the mounting components 3 is increased, Electronic components can be further highly integrated. Further, since the peripheral jig 5B is arranged on both the upper and lower sides of the wiring board 1, it is possible to enhance the effect of radiating heat from the mounted component 3 to the peripheral jig 5B through the resin member 14.

  Referring to FIG. 36, this is another example of the present embodiment. The configuration including mounting component 3 and resin member 14 above wiring substrate 1 in the fifth embodiment (FIG. 29) is arranged below wiring substrate 1. Are arranged in the same manner as above the wiring substrate 1 (although upside down). In other words, the mounting component 3 on the upper main surface of the wiring board 1 and the mounting component 3 on the lower main surface of the wiring board 1 are arranged so as to be line-symmetric with respect to the wiring board 1. Has been. Then, one peripheral jig 5D collectively surrounds both the mounting component 3 and the resin member 14 above the wiring substrate 1 and the mounting component 3 and the resin member 14 below the wiring substrate 1, and this is held by the gripping portion 16. It is a mode to hold. In this way, similarly to the fifth embodiment, the number of parts can be reduced by the clip-shaped peripheral jig 5D.

  Referring to FIG. 37, in FIG. 35, one elastic member 6 is disposed for each peripheral jig 5B (in reality, two are present above and below wiring board 1). Two elastic members 6 may be arranged for each of the peripheral jigs 5B (four are actually present above and below the wiring board 1). In this way, it is possible to supply a pressing force to each mounting component 3 more evenly.

  Referring to FIGS. 38 and 39, the configuration in which mounting component 3 is mounted both above and below wiring board 1 as described above may be supported by peripheral jigs 5A and 5C.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Wiring board, 2 Conductive layer, 3 Mounting parts, 4 Pressing jig, 5, 5A, 5B Surrounding jig, 5A1, 5B1, 5C1, 5D1 1st component, 5A2, 5B2 2nd component, 5C3, 5D3 3rd component , 6 Elastic member, 7, 15 Gap, 11 Contact resin member, 12 Main body resin member, 14 Resin member, 21, 24 Mold, 22, 25 Resin molding part, 23, 26 Inlet, 30 Solder, 31 Opening, 32 33 Positioning member 100, 200, 201, 300, 301, 400, 500, 600, 700, 800, 900 Electronic component, CC recess.

Claims (14)

A substrate having a main surface and a conductive layer patterned on the main surface;
A mounting component disposed so as to be in contact with the conductive layer of the substrate;
A pressing jig that is disposed on the opposite side of the mounting component with respect to the substrate and presses the mounting component toward the substrate;
The pressing jig is disposed so as to be in contact with the mounting component, and an insulating member having a lower hardness than the substrate,
Wherein arranged on the opposite side with respect to the mounting part of the insulating member, viewed contains an elastic member for pressing connected to the mounting part of the conductive layer of the substrate by an elastic force,
A plurality of the mounting components are disposed on the conductive layer of the substrate,
The substrate includes an opening between a pair of mounting components adjacent to each other in a direction along the main surface among the plurality of mounting components,
An electronic component further comprising a positioning member extending in a direction intersecting the main surface so as to be fitted into the opening from the insulating member . The insulating member has a recess extending in a direction intersecting the main surface;
The mounting component is in contact with the recess at three or more points,
2. The electronic component according to claim 1, wherein at least two of the three or more points are arranged so as to sandwich a center of gravity of a cross section along the main surface of the concave portion.   The thickness of the insulating member in a direction perpendicular to the main surface in a region facing the mounting component in a direction perpendicular to the main surface is greater than or equal to a dimensional error in a direction perpendicular to the main surface of the mounting component. Item 3. The electronic component according to Item 1 or 2. Wherein between the insulating and member and the substrate there is a gap, the electronic component according to any one of claims 1-3. The pressing jig, the insulating member, on the surface opposite to the substrate, comprising said rigid plate of an insulating member, an electronic component according to any one of claims 1-4. The pressing jig includes a first component extending in a direction along the main surface so as to cover at least a part of the substrate and the insulating member in a plan view from outside the substrate and the insulating member, and the substrate in a plan view. And a peripheral jig integrated with a second component extending in a direction perpendicular to the main surface outside the insulating member,
The first component of the substrate constituting the peripheral jig supports the substrate by mounting the substrate, an electronic component according to any one of claims 1-5. The elastic member includes a grip portion that sandwiches at least part of the main surface and the surface of the insulating member along the main surface from the outside of the substrate and the insulating member, and the outside of the substrate and the insulating member in a plan view. the main is at least part of the periphery jig together first 3 ingredients and is connected which extends in a direction perpendicular to the surface, the electronic component according to any one of claims 1-5. Wherein the substrate and the mounting part are joined by soldering, the electronic component according to any of claims 1-7. The insulating member includes a first insulating member, and a second insulating member that is in contact with the substrate side of the first insulating member and is disposed so as to be in contact with the mounting component.
It said second insulating member having a lower hardness than said first insulating member, an electronic component according to any one of claims 1-8. The thickness of the second insulating member in the direction perpendicular to the main surface in the region facing the mounting component in the direction perpendicular to the main surface is greater than the dimensional error in the direction perpendicular to the main surface of the mounting component. The electronic component according to claim 9 . A substrate having a main surface and a conductive layer patterned on the main surface;
A mounting component disposed so as to be in contact with the conductive layer of the substrate;
A pressing jig that is disposed on the opposite side of the mounting component with respect to the substrate and presses the mounting component toward the substrate;
The pressing jig is
A first insulating member;
A second insulating member having a lower hardness than the substrate and the first insulating member, disposed so as to be in contact with the mounting component;
Wherein arranged on the opposite side with respect to the mounting component of the first insulating member, viewed contains an elastic member for pressing connecting the mounting part on the conductive layer of the substrate by an elastic force,
A plurality of the mounting components are disposed on the conductive layer of the substrate,
The substrate includes an opening between a pair of mounting components adjacent to each other in a direction along the main surface among the plurality of mounting components,
An electronic component further comprising a positioning member extending in a direction intersecting the main surface so as to be fitted into the opening from the insulating member . The thickness of the second insulating member in the direction perpendicular to the main surface in the region facing the mounting component in the direction perpendicular to the main surface is greater than the dimensional error in the direction perpendicular to the main surface of the mounting component. The electronic component according to claim 11 . Preparing a substrate having a main surface and a conductive layer patterned on the main surface;
A step of preparing a pressing jig capable of pressing a mounting component disposed so as to be in contact with the conductive layer of the substrate toward the substrate;
Setting the mounting component on the pressing jig;
A step of pressing the mounting component against the conductive layer using the pressing jig on which the mounting component is set,
The step of preparing the pressing jig includes the step of forming an insulating member that constitutes the pressing jig and has a lower hardness than the substrate,
In the pressing step, the mounting component is press-connected on the conductive layer of the substrate by using an elastic member that is disposed on the opposite side of the insulating member with respect to the mounting component and constitutes the pressing jig. Maintained ,
A plurality of the mounting components are disposed on the conductive layer of the substrate,
The substrate includes an opening between a pair of mounting components adjacent to each other in a direction along the main surface among the plurality of mounting components,
The electronic component mounting method further comprising a positioning member extending in a direction intersecting the main surface so as to be fitted into the opening from the insulating member . The step of forming the insulating member includes
Preparing a mold having a shape capable of forming a recess into which the mounting component can be fitted in the step of setting the mounting component;
The method for mounting an electronic component according to claim 13 , further comprising a step of filling a resin material into the mold.

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