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JP6146764B2 - Temperature protection element - Google Patents
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JP6146764B2 - Temperature protection element - Google Patents

Temperature protection element Download PDF

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JP6146764B2
JP6146764B2 JP2013031641A JP2013031641A JP6146764B2 JP 6146764 B2 JP6146764 B2 JP 6146764B2 JP 2013031641 A JP2013031641 A JP 2013031641A JP 2013031641 A JP2013031641 A JP 2013031641A JP 6146764 B2 JP6146764 B2 JP 6146764B2
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movable arm
contact
temperature protection
movable
terminal lead
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JP2013201123A (en
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憲之 前田
憲之 前田
勝之 村田
勝之 村田
剛志 服部
剛志 服部
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NEC Schott Components Corp
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Description

本発明は、バイメタルに代表される熱応動体とPTC素子とを併用して電気回路を開閉する温度保護素子、特に製品の厚みを薄くでき、小型でも大電流に対応可能な温度保護素子に関する。   The present invention relates to a temperature protection element that opens and closes an electric circuit by using a thermal responder typified by a bimetal and a PTC element, and more particularly to a temperature protection element that can reduce the thickness of a product and can cope with a large current even in a small size.

バイメタルとPTC素子とを併用する保護素子は、従来から二次電池などを含めた電源回路の保護装置に利用されている。例えば、特許文献1に記載された安全装置は、ベースターミナル、PTC、バイメタル、アームターミナルに接続された可動アーム、カバー端子がベースとカバーで構成される樹脂ケースに内蔵された安全装置が提案されている。該安全装置のカバー端子は樹脂ケースのカバーと一体化することで、樹脂ケースのカバーと可動アームとの空間を可能な限り、狭くすることができるとしている。樹脂ケースのカバーとカバー端子は別々の部品であってもよいが、インサート成形により、樹脂ケースのカバーとカバー端子とが一体化されている方が好ましいとされる。カバー端子の組込みにより可動アームの動き幅が小さくても電流遮断を助け、また樹脂ケースのカバーとの空間を狭くして、安全装置の小型化、薄型化を図っている。   2. Description of the Related Art A protective element using a bimetal and a PTC element in combination is conventionally used in a power supply circuit protective device including a secondary battery. For example, the safety device described in Patent Document 1 is a base terminal, PTC, bimetal, a movable arm connected to an arm terminal, and a safety device built in a resin case in which a cover terminal is composed of a base and a cover. ing. By integrating the cover terminal of the safety device with the cover of the resin case, the space between the cover of the resin case and the movable arm can be made as narrow as possible. The cover of the resin case and the cover terminal may be separate parts, but it is preferable that the cover of the resin case and the cover terminal are integrated by insert molding. The built-in cover terminal helps cut off the current even when the movable arm has a small movement width, and also narrows the space with the cover of the resin case to make the safety device smaller and thinner.

さらに、特許文献2には、導電性アームの一端、バイメタルの一端及びケース体の端子が溶着されて一体化された構造とし、単に周囲の雰囲気の温度上昇によってバイメタルが反転作動するだけでなく、導電性アームおよび端子に流れる電流により誘起された該導電性アームおよび端子の発熱を効率的に受けて、回路内の素子に過負荷が加えられて電流量が増加した場合に、バイメタルの温度が迅速に上昇して非反転状態から反転状態に遷移するようにして、反転作動を高速化したプロテクタが提案されている。   Further, Patent Document 2 has a structure in which one end of a conductive arm, one end of a bimetal, and a terminal of a case body are welded and integrated, and the bimetal is not only reversed by the temperature rise of the surrounding atmosphere, When the heat generated in the conductive arm and the terminal induced by the current flowing in the conductive arm and the terminal is efficiently received and an overload is applied to the elements in the circuit and the amount of current increases, the temperature of the bimetal increases. A protector has been proposed that speeds up the reversing operation by quickly rising and transitioning from the non-reversing state to the reversing state.

しかしながら、特許文献1に記載された安全装置は、樹脂ケースの開口部はカバー端子を含む樹脂製カバーで覆って封止するため、キャップ状の樹脂製カバーに中間抑えやストッパーの凹凸を有するカバー端子を薄型化に有利なように一体成形してもインサート成形品の低背化に限界があり、製品のより一層の薄型化が困難であった。また、樹脂ケースを樹脂製カバーのみで覆って封止する場合にも封止パッケージ強度を確保する上で樹脂の厚さを低背化するのに限界がある。さらに、樹脂ケースおよびその開口部を覆うカバー材の表面が樹脂で覆われている構成のため、パッケージの熱伝導性や放熱性が悪く、過熱時の迅速な熱応動や、外部温度が低下したときの迅速な復帰作動を妨げていた。   However, in the safety device described in Patent Document 1, since the opening of the resin case is covered and sealed with a resin cover including a cover terminal, the cap-shaped resin cover has an intermediate restraint and stopper irregularities. Even if the terminals are integrally molded so as to be advantageous in reducing the thickness, there is a limit to the reduction in the height of the insert molded product, and it has been difficult to further reduce the thickness of the product. In addition, when the resin case is covered and sealed only with the resin cover, there is a limit to reducing the thickness of the resin in order to secure the sealing package strength. Furthermore, because the surface of the cover material covering the resin case and its opening is covered with resin, the thermal conductivity and heat dissipation of the package are poor, and the rapid thermal response during overheating and the external temperature are reduced. When the quick return operation was hindered.

ところで、特許文献2に記載されるプロテクタのように、従来のバイメタルとPTCを併用した回路保護素子は、雰囲気温度の上昇によってバイメタルが反転作動するだけでなく、導電性アームや端子に流れる電流によるジュール熱を利用した過電流動作も同時に考えられていた。しかしながら、このような構成を採る以上、電流定格の大きな電源回路の保護にバイメタルとPTCとを併用した保護素子は用いることができない欠点があった。そして、この特許文献2の構成においてもケース体のベースおよびそのカバーは絶縁材で構成され、特許文献1の構成と同様にパッケージの熱伝導性や放熱性に劣り、過熱時の迅速な熱応動や、外部温度が低下したときの迅速な復帰作動を妨げ不利である。   By the way, like the protector described in Patent Document 2, the circuit protection element using the conventional bimetal and PTC is not only reversed by the increase of the ambient temperature, but also by the current flowing through the conductive arm and the terminal. Overcurrent operation using Joule heat was also considered at the same time. However, as long as such a configuration is adopted, there is a drawback that a protection element using a combination of bimetal and PTC cannot be used for protecting a power supply circuit having a large current rating. And also in the structure of this patent document 2, the base of a case body and its cover are comprised with the insulating material, and it is inferior to the heat conductivity and heat dissipation of a package like the structure of patent document 1, and quick thermal response at the time of overheating Moreover, it is disadvantageous because it prevents a quick return operation when the external temperature decreases.

特開2005−203277号公報JP 2005-203277 A 特開2006−269180号公報JP 2006-269180 A

従って、本発明は、熱応動体とPTC素子とを併用して電気回路を開閉する温度保護素子において、製品の厚みを薄くでき、パッケージの熱伝導性や放熱性を高めて温度感応性を向上し、かつ省電力化し、小型でも大電流に対応可能な温度保護素子を提供することを目的とする。   Therefore, according to the present invention, in the temperature protection element that opens and closes the electric circuit by using the thermal responder and the PTC element in combination, the thickness of the product can be reduced, and the thermal conductivity and heat dissipation of the package are improved to improve the temperature sensitivity. However, it is an object of the present invention to provide a temperature protection element that saves power and is small in size and can handle a large current.

本発明によると、前掲の課題を解決するため、固定接点を設けた第1端子リードと、一端に設けた可動接点を弾発力により固定接点に接触させる可動アームと、可動アームに接触させた第2端子リードと、常時可動アームに接触して所定の温度でスナップ反転作動し固定接点と可動接点とを開離させる熱応動体と、この熱応動体と第1端子リードとに接続して通電されるPTC素子と、これらを収納する開口部を設けた絶縁パッケージと、絶縁パッケージの開口部を覆った金属薄板とを備え、さらに絶縁パッケージは、前記両端子リードを一体成形して含み、パッケージ内部に固定接点、可動アーム、熱応動体、PTC素子を収容してパッケージ開口部を金属薄板で覆い、この金属薄板の外縁部に設けた封止樹脂で絶縁パッケージと固着封止した温度保護素子が提供される。さらに、発明に係る温度保護素子の第1および第2端子リードと可動アームは、導電率%IACSが25以上の高導電性金属材を用いることを特徴とする。ここで、IACSとは、銅材の導電率をみるときに、電気抵抗の基準として国際的に採用されている国際焼鈍軟銅標準(International Annealed Copper Standerd)であり、国際焼鈍軟銅標準の体積抵抗率1.7241×10−2μΩmを導電率100%IACSと規定している。 According to the present invention, in order to solve the above-described problems, the first terminal lead provided with the fixed contact, the movable arm provided with the movable contact provided at one end by the elastic force, and the movable arm are contacted. A second terminal lead, a thermally actuated body that always contacts the movable arm and snaps in reverse at a predetermined temperature to disconnect the fixed contact and the movable contact; and the thermal responder and the first terminal lead A PTC element to be energized, an insulating package provided with an opening for storing these, and a metal thin plate covering the opening of the insulating package; and the insulating package includes both the terminal leads formed integrally, A fixed contact, movable arm, thermal responder, and PTC element are housed inside the package, the package opening is covered with a thin metal plate, and the insulation package is fixedly sealed with a sealing resin provided on the outer edge of the thin metal plate. Temperature protection device is provided. Furthermore, the first and second terminal leads and the movable arm of the temperature protection element according to the invention are characterized by using a highly conductive metal material having a conductivity% IACS of 25 or more. Here, IACS is an international annealed copper standard (International Annealed Copper Standard) that has been adopted internationally as a standard for electrical resistance when examining the electrical conductivity of copper materials, and the volume resistivity of the international annealed soft copper standard. 1.7241 × 10 −2 μΩm is defined as 100% conductivity IACS.

本発明に係る温度保護素子は、パッケージの開口部を金属薄板で密閉するため、絶縁パッケージをより小型化、薄型化できる。また、金属薄板の外縁部のみに封止樹脂を塗布して絶縁パッケージと金属薄板とを固着封止するので、金属薄板を表面に露出できパッケージに内蔵する熱応動体およびPTC素子への熱伝導に寄与する。しかも、従来の安全装置のように、予めキャップ状の樹脂製カバーに曲げ加工を施したカバー端子をインサート一体成形または個別組込みする必要が無く、樹脂カバー部材を省略できるので、より経済的な生産が可能となる。さらに、発明に係る温度保護素子は、端子リードに導電率%IACSが25以上の高導電性金属材を用いることでより省電力化でき、小サイズでありながら保護素子の内部抵抗値を低減しスイッチON時の突入電流による誤動作を防ぎ、比較的定常電流の大きな電源にも適用できる。   Since the temperature protection element according to the present invention seals the opening of the package with a thin metal plate, the insulation package can be made smaller and thinner. In addition, since the insulating package and the metal thin plate are fixedly sealed by applying a sealing resin only to the outer edge portion of the metal thin plate, the metal thin plate can be exposed to the surface, and heat conduction to the thermal actuator and the PTC element incorporated in the package Contribute to. In addition, unlike conventional safety devices, there is no need to insert-molded or individually assembled cover terminals that have been previously bent into a cap-shaped resin cover, and the resin cover member can be omitted, resulting in more economical production. Is possible. Furthermore, the temperature protection element according to the invention can save more power by using a highly conductive metal material having a conductivity% IACS of 25 or more for the terminal lead, and can reduce the internal resistance value of the protection element while being small in size. It is possible to prevent malfunction due to inrush current when the switch is ON, and to apply to a power source having a relatively large steady current.

本発明に係る温度保護素子10であり、(a)はその部品部材を分解した斜視図を示し、(b)は組立完成後の平面斜視図を示し、(c)は組立完成後の下面斜視図を示す。FIG. 2 is a temperature protection element 10 according to the present invention, in which (a) is an exploded perspective view of its component members, (b) is a plan perspective view after assembly completion, and (c) is a bottom perspective view after assembly completion. The figure is shown. 本発明に係る温度保護素子の可動アームの斜視図を示し、(a)は片方の先端部を凹型に曲げその下側に可動接点を設けた可動アーム、(b)はその変形例で片方の先端部を凹型に曲げその下側に可動接点を設け、さらに先端部に切れ込みを設けて可動接点を二股にした可動アーム、(c)はさらに別の変形例で片方の先端部に段差と窪みとを設けその下側に可動接点を設けた可動アームである。The perspective view of the movable arm of the temperature protection element which concerns on this invention is shown, (a) is the movable arm which bent the front-end | tip part of one side into the concave shape, and provided the movable contact in the lower side, (b) is the modification, and shows one side. A movable arm which is bent at the tip to provide a movable contact on the lower side, and further has a notch in the tip to make the movable contact bifurcated. (C) is another modified example with a step and a depression at one tip. And a movable arm provided with a movable contact on the lower side. 本発明に係る温度保護素子30を示し、(a)はその正面断面図、(b)はその動作後の正面断面図を示す。The temperature protection element 30 which concerns on this invention is shown, (a) is the front sectional drawing, (b) shows the front sectional drawing after the operation | movement. 本発明に係る温度保護素子40を示し、(a)はその正面断面図、(b)はその動作後の正面断面図を示す。The temperature protection element 40 which concerns on this invention is shown, (a) is the front sectional drawing, (b) shows the front sectional drawing after the operation | movement.

本発明の実施形態は、図1に示す温度保護素子10のように、AgまたはAg合金製の固定接点11−1を設けたCuまたはCu合金からなる第1端子リード11と、一端にAgまたはAg合金製の可動接点12−1を設け弾発力により固定接点11−1に接触させるCu合金からなる可動アーム12と、可動アーム12に電気接続させたCuまたはCu合金からなる第2端子リード13と、常時可動アーム12に接触して所定の温度でスナップ反転作動し固定接点11−1と可動接点12−1とを開離させるバイメタル材からなる熱応動体14と、この熱応動体14と第1端子リード11とに接続して通電される正温度係数サーミスタのPTC素子15とを備え、さらに前記両端子リード11および13と一体成形し開口部を設けたプラスチック製絶縁パッケージ16内部に、可動アーム12、熱応動体14およびPTC素子15とを収容し、熱伝導性や放熱性に優れた金属薄板17のみで絶縁パッケージ16の開口部を覆って金属薄板17の外縁部に設けた封止樹脂18により絶縁パッケージ16を固着封止したものである。   The embodiment of the present invention includes a first terminal lead 11 made of Cu or Cu alloy provided with a fixed contact 11-1 made of Ag or an Ag alloy, and Ag or Ag at one end, like the temperature protection element 10 shown in FIG. A movable arm 12 made of a Cu alloy provided with a movable contact 12-1 made of Ag alloy and brought into contact with the fixed contact 11-1 by a resilient force, and a second terminal lead made of Cu or Cu alloy electrically connected to the movable arm 12 13, a thermally actuated body 14 made of a bimetallic material that always contacts the movable arm 12 and snap-inverts at a predetermined temperature to separate the fixed contact 11-1 and the movable contact 12-1, and the thermally actuated body 14. And a positive temperature coefficient thermistor PTC element 15 that is connected to the first terminal lead 11 and energized, and is formed integrally with the terminal leads 11 and 13 and provided with an opening. The movable arm 12, the thermally actuated body 14, and the PTC element 15 are accommodated in the insulating package 16 made of a metal, and the opening of the insulating package 16 is covered only with the thin metal plate 17 having excellent thermal conductivity and heat dissipation. The insulating package 16 is fixedly sealed with a sealing resin 18 provided on the outer edge of the thin plate 17.

さらに、好ましくは、図1(c)に示すように絶縁パッケージ16の底部は第1端子リードの一部11−4を露出させ絶縁パッケージ16の内部への熱伝導を向上させてもよい。この温度保護素子10の第1端子リード11および第2端子リード13と、可動アーム12は、導電率%IACSが25以上の高導電性金属材を用い、より好ましくはCu−Sn合金材、Cu−Ti合金材、Cu−Be合金材の群から選択した少なくとも1種の合金材を用いて高導電性を維持しながら所望の弾性反発力を兼備させる。   Further, preferably, as shown in FIG. 1C, the bottom portion of the insulating package 16 may expose a portion 11-4 of the first terminal lead to improve the heat conduction to the inside of the insulating package 16. The first terminal lead 11 and the second terminal lead 13 of the temperature protection element 10 and the movable arm 12 are made of a highly conductive metal material having a conductivity% IACS of 25 or more, more preferably a Cu—Sn alloy material, Cu Using at least one alloy material selected from the group consisting of a Ti alloy material and a Cu—Be alloy material, a desired elastic repulsion force is provided while maintaining high conductivity.

本発明に係るPTC素子15は、正温度係数サーミスタであれば良く、好ましくは酸化物半導体からなるセラミックPTC素子が使用できる。そして、導電率%IACSが25以上の高導電性金属材からなる第1および第2端子リードと可動アームを用いて両端子リードと可動アーム自体の電気抵抗値を低減することにより、PTC素子15に施す電極材をオーミック電極のみに簡略化する。すなわち、該PTC素子15の表面電極は、該素子の上に設けたオーミック電極のみで構成して、従来、PTC素子の電極材の最表面に施されてきたAgなど貴金属良導体層からなるカバー電極を省略する。本発明に係るPTC素子15のオーミック電極は、例えばAl材、Cr材、Ni材、Ni−Cr合金材、Ag−In合金材、Ag−Zn合金材、Ag−Sb合金材、Ag−Zn−Sb合金材などの金属材が使用でき、特にAl材またはAg−Zn合金材が好適に利用できる。この場合、PTC素子19は、カバー電極の貴金属電極材を必要としないので必須材料を削減でき製造コストを低減できる。   The PTC element 15 according to the present invention may be a positive temperature coefficient thermistor, and a ceramic PTC element preferably made of an oxide semiconductor can be used. Then, by using the first and second terminal leads and the movable arm made of a highly conductive metal material having a conductivity% IACS of 25 or more, the electric resistance value of both the terminal leads and the movable arm itself is reduced, whereby the PTC element 15 The electrode material applied to is simplified to only ohmic electrodes. That is, the surface electrode of the PTC element 15 is composed only of an ohmic electrode provided on the element, and is conventionally a cover electrode made of a noble metal good conductor layer such as Ag applied to the outermost surface of the electrode material of the PTC element. Is omitted. The ohmic electrode of the PTC element 15 according to the present invention includes, for example, Al material, Cr material, Ni material, Ni—Cr alloy material, Ag—In alloy material, Ag—Zn alloy material, Ag—Sb alloy material, Ag—Zn—. A metal material such as an Sb alloy material can be used, and in particular, an Al material or an Ag—Zn alloy material can be suitably used. In this case, since the PTC element 19 does not require the noble metal electrode material of the cover electrode, the essential material can be reduced and the manufacturing cost can be reduced.

本発明に係るPTC素子15は、前述した酸化物半導体からなるセラミックPTC素子に替えて正の温度係数の抵抗値を持つ導電性ポリマー(結晶性の有機重合体を含み、さらにその重合体に導電性微粒子フィラーを分散又は散布したもの)からなるポリマーPTC素子を用いても良い。ポリマーPTC素子を使用することで、絶縁パッケージ16の厚みをより一層薄くする。   The PTC element 15 according to the present invention includes a conductive polymer (including a crystalline organic polymer having a positive temperature coefficient resistance value) instead of the above-described ceramic PTC element made of an oxide semiconductor. Polymer PTC elements made of dispersed or dispersed fine particle fillers may be used. By using the polymer PTC element, the thickness of the insulating package 16 is further reduced.

本発明に係る可動アーム12の先端形状は、図2に示すように変形しても良い。すなわち、図2(a)に示す可動アーム12は、アーム屈曲点12−4で鈍角に屈曲され先端部をU字形ないしV字形に加工することで、可動接点12−1のバネ押圧を高め、固定接点の水平面に対して接続可能な可動接点12−1の接触範囲を拡張し、可動接点12−1の固定接点への電気接続を確実にするが、これを図2(b)に示すように、先端部をU字形ないしV字形に加工し、さらに先端部に切込み22−5を設けて独立した複数の可動接点22−1を形成させた可動アーム22に変形でき、これにより可動アーム22の短辺左右の差動や局部磨耗によって生じた固定接点の凹凸によるバラツキを矯正して固定接点への接触信頼性を高める。さらに可動アーム12は、図2(c)に示すような可動アーム52に変形できる。この可動アーム52は、可動アームの端部に段差52−5と窪み52−6を設けて可動アームの先端部下面を凸形に加工することで、図2(a)と同様に可動接点52−1のバネ押圧を高め、固定接点の水平面に対して接続可能な可動接点52−1の接触範囲を拡張し、可動接点52−1の固定接点への電気接続を確実にする効果を得ることができる。可動アームの先端部下面の凸形部の表面にはAgまたはAg合金を固着して可動接点52−1とする。可動アーム52のもう一方の端部は、可動アーム52を絶縁パッケージの所定位置に装着するのを助ける目的でノッチ52−7を設けてもよい。なお、図2中の12−2、12−3、22−2、22−3および52−2、52−3は、下面に設けた接続突起の位置を示す。   The tip shape of the movable arm 12 according to the present invention may be modified as shown in FIG. That is, the movable arm 12 shown in FIG. 2 (a) is bent at an obtuse angle at the arm bending point 12-4, and the tip is processed into a U-shape or V-shape, thereby increasing the spring pressure of the movable contact 12-1. As shown in FIG. 2B, the contact range of the movable contact 12-1 that can be connected to the horizontal plane of the fixed contact is expanded to ensure the electrical connection of the movable contact 12-1 to the fixed contact. Further, the distal end portion can be processed into a U-shape or V-shape, and further, the movable arm 22 can be deformed by forming a plurality of independent movable contacts 22-1 by providing notches 22-5 at the distal end portion. This improves the contact reliability of the fixed contacts by correcting the unevenness of the fixed contacts caused by the left and right differentials and the local wear. Furthermore, the movable arm 12 can be transformed into a movable arm 52 as shown in FIG. The movable arm 52 is provided with a step 52-5 and a depression 52-6 at the end of the movable arm, and the lower surface of the distal end of the movable arm is processed into a convex shape, so that the movable contact 52 is similar to FIG. -1 is increased, the contact range of the movable contact 52-1 that can be connected to the horizontal surface of the fixed contact is expanded, and the effect of ensuring the electrical connection of the movable contact 52-1 to the fixed contact is obtained. Can do. Ag or an Ag alloy is fixed to the surface of the convex portion on the lower surface of the distal end portion of the movable arm to form a movable contact 52-1. The other end of the movable arm 52 may be provided with a notch 52-7 for the purpose of helping to attach the movable arm 52 to a predetermined position of the insulating package. In addition, 12-2, 12-3, 22-2, 22-3 and 52-2, 52-3 in FIG. 2 show the positions of the connection protrusions provided on the lower surface.

本発明の実施例1は、図3に示す温度保護素子30ように、Ag−Cuクラッド材の固定接点31−1および素子接続電極31−2を設けたCu−Sn合金製第1端子リード31と、先端にAg−Cuクラッド材の可動接点32−1を設けたCu−Sn合金製可動アーム32と、可動アーム32と接触するアーム接続電極33−1を設けたCu−Sn合金製第2端子リード33と、Ni−Fe合金/Cu−Mn−Ni合金のバイメタル材からなり固定接点31−1と可動接点32−1とを開離させる熱応動体34と、この熱応動体34と素子接続電極31−2に接続して通電されるチタン酸バリウム系酸化物半導体のPTC素子35と、これらを収める開口部を設けた液晶ポリマー製絶縁パッケージ36と、絶縁パッケージ36の開口部を被覆するステンレス鋼材の金属薄板37とを備え、さらに絶縁パッケージ36は、インサート成形により前記両端子リード31および33と一体成形され、パッケージ内部に可動アーム32、熱応動体34、PTC素子35を収容してパッケージ開口部を金属薄板37で覆い、金属薄板37の外縁部に沿って塗布したUV硬化性樹脂38で絶縁パッケージ36に固着させ封止したものである。   Example 1 of the present invention is a Cu-Sn alloy first terminal lead 31 provided with a fixed contact 31-1 of Ag-Cu clad material and an element connection electrode 31-2, as in the temperature protection element 30 shown in FIG. A Cu-Sn alloy movable arm 32 provided with a movable contact 32-1 made of an Ag-Cu clad material at the tip, and a Cu-Sn alloy second product provided with an arm connection electrode 33-1 in contact with the movable arm 32. A terminal lead 33, a thermally actuated body 34 made of a bimetallic material of Ni-Fe alloy / Cu-Mn-Ni alloy and separating the fixed contact 31-1 and the movable contact 32-1, and the thermally actuated body 34 and the element A barium titanate-based oxide semiconductor PTC element 35 connected to the connection electrode 31-2 and energized, a liquid crystal polymer insulating package 36 provided with an opening for accommodating these, and an opening of the insulating package 36 are covered. The insulating package 36 is integrally formed with both the terminal leads 31 and 33 by insert molding, and the movable arm 32, the thermal actuator 34, and the PTC element 35 are accommodated inside the package. Then, the package opening is covered with a thin metal plate 37 and fixed to the insulating package 36 with a UV curable resin 38 applied along the outer edge of the thin metal plate 37 and sealed.

なお、特に図示しないが、実施例1の温度保護素子30は、内蔵する熱応動体34およびPTC素子35を電気回路と接続しない状態で設置するように変形できる。すなわち、温度保護素子30の変形例において熱応動体34は、初期状態で可動アーム32と隔離して配置され、過熱を検知し固定接点31−1と可動接点32−1とを開離して反転作動したときに可動アーム32と接触し、同時に熱応動体34に当接するPTC素子35は、熱応動体34と素子接続電極31−2とに接続され通電するように変形できる。   Although not particularly illustrated, the temperature protection element 30 according to the first embodiment can be modified so that the built-in thermal responder 34 and the PTC element 35 are installed without being connected to an electric circuit. That is, in the modified example of the temperature protection element 30, the thermal responder 34 is disposed separately from the movable arm 32 in the initial state, detects overheating, separates the fixed contact 31-1 and the movable contact 32-1, and reverses it. The PTC element 35 that comes into contact with the movable arm 32 when it is operated and simultaneously contacts the thermal responder 34 can be deformed so as to be connected to the thermal responder 34 and the element connection electrode 31-2 and to be energized.

実施例1の絶縁パッケージ36は、開口部を金属薄板37で覆い、さらに絶縁パッケージ36の底部に、絶縁パッケージ36の内側に延在する第1端子リード31の一部を露出させて設けた端子リード露出面31−4を形成することで、絶縁パッケージ36の熱伝導を向上させ、温度感応性をさらに高めている。なお、絶縁パッケージ36は、開口部周縁に沿って堤状の周壁39を設けて金属薄板37の位置決めを補助するとともにUV硬化性樹脂38のディスペンサー・ニードルのガイド部を形成して液状樹脂の塗布を助け、かつ該周壁内面と金属薄板37の外縁上面とで断面がL字型の塗布代を形成して、該塗布代と封止樹脂との界面張力により樹脂ダレを防止している。   In the insulating package 36 of the first embodiment, the opening is covered with a thin metal plate 37, and the first terminal lead 31 extending inside the insulating package 36 is exposed at the bottom of the insulating package 36. By forming the lead exposed surface 31-4, the heat conduction of the insulating package 36 is improved and the temperature sensitivity is further enhanced. The insulating package 36 is provided with a bank-shaped peripheral wall 39 along the periphery of the opening to assist the positioning of the thin metal plate 37 and to form a guide portion for the dispenser needle of the UV curable resin 38 to apply the liquid resin. In addition, an application margin having an L-shaped cross section is formed between the inner surface of the peripheral wall and the upper surface of the outer edge of the metal thin plate 37, and resin sagging is prevented by the interfacial tension between the application margin and the sealing resin.

実施例1のPTC素子35に施す表面電極35−1は、Ag−Zn合金材のオーミック電極のみで構成され、PTC素子35上部の表面電極は熱応動体34に当接され、PTC素子35下部の表面電極は素子接続電極31−2の表面に形成された素子接続突起31−3と当接される。この素子接続突起31−3の当接表面は、AgまたはAg合金材の被覆層を設けても良く、特に好ましくはAg−Cuクラッド材としても良い。実施例1の熱応動体34は、77℃以上の温度になると図3(b)に示す形状にスナップ反転作動し回路を遮断し、40℃以下の温度で再び反転して図3(a)に示す初期の接続状態に復帰し、温度検知による回路のON/OFF作動を可能とする。図3(a)の初期の接続状態において熱応動体34は、湾曲面頂部で直に可動アーム32に当接されているが、図3(b)の回路遮断時においては、熱応動体34の外縁部で可動アーム32の下部に設けた接続突起32−2と接続突起32−3とに当接される。その際、片側の接続突起32−2の高さをもう一方の接続突起32−3の高さより低くすることで、可動アーム32先端部の持上高を増幅して可動接点32−1が固定接点31−1から開離する動作を補助する。   The surface electrode 35-1 applied to the PTC element 35 of Example 1 is composed of only an ohmic electrode made of an Ag—Zn alloy material, and the surface electrode on the PTC element 35 is in contact with the thermal responder 34, and the lower part of the PTC element 35. The surface electrode is in contact with an element connection protrusion 31-3 formed on the surface of the element connection electrode 31-2. The contact surface of the element connection protrusion 31-3 may be provided with a coating layer of Ag or an Ag alloy material, and particularly preferably an Ag—Cu clad material. When the temperature of the thermal actuator 34 of the first embodiment reaches 77 ° C. or higher, the snap inversion operation is performed in the shape shown in FIG. 3B, the circuit is cut off, and the circuit is turned off again at a temperature of 40 ° C. or lower. The circuit is restored to the initial connection state shown in Fig. 5 and enables the circuit ON / OFF operation by temperature detection. In the initial connection state of FIG. 3A, the thermal responder 34 is in direct contact with the movable arm 32 at the top of the curved surface. However, when the circuit is interrupted in FIG. The contact protrusion 32-2 and the connection protrusion 32-3 provided at the lower part of the movable arm 32 are brought into contact with each other at the outer edge portion. At that time, by making the height of the connection projection 32-2 on one side lower than the height of the other connection projection 32-3, the lifting height of the tip of the movable arm 32 is amplified and the movable contact 32-1 is fixed. The operation of separating from the contact 31-1 is assisted.

本発明の実施例2は、図4に示す温度保護素子40ように、Agクラッド材の固定接点41−1と素子接続電極41−2を設けたCu−Sn合金製の第1端子リード41と、先端にAgクラッド材からなる可動接点42−1を設けたCu−Be合金製の可動アーム42と、この可動アーム42と接触するアーム接続電極43−1を設けたCu−Sn合金製の第2端子リード43と、Ni−Fe合金/Cu−Mn−Ni合金のバイメタル材からなり固定接点41−1と可動接点42−1とを開離させる熱応動体44と、この熱応動体44と素子接続電極41−2とに接続して通電されるポリマーPTC素子45(結晶性の有機重合体を含み、さらにその重合体にカーボンブラック導電性フィラーを分散したもの)と、これらを収める開口部を設けたエポキシ樹脂製絶縁パッケージ46と、絶縁パッケージ46の開口部を被覆するNiめっき銅板の金属薄板47とを備え、さらに絶縁パッケージ46は、インサート成形により前記両端子リード41および43と一体成形され、パッケージ内に可動アーム42、熱応動体44、ポリマーPTC素子45を収容してパッケージ開口部を金属薄板47のみで覆い、金属薄板47の外縁部に沿って塗布したエポキシ樹脂48で絶縁パッケージ46に固着させて封止したものである。   Example 2 of the present invention includes a first terminal lead 41 made of a Cu-Sn alloy provided with a fixed contact 41-1 of Ag clad material and an element connection electrode 41-2, as in the temperature protection element 40 shown in FIG. A Cu—Be alloy movable arm 42 provided with a movable contact 42-1 made of an Ag clad material at the tip, and a Cu—Sn alloy first arm provided with an arm connection electrode 43-1 in contact with the movable arm 42. A two-terminal lead 43; a thermal responder 44 made of a Ni-Fe alloy / Cu-Mn-Ni alloy bimetal material that separates the fixed contact 41-1 and the movable contact 42-1, and the thermal responder 44; Polymer PTC element 45 (which includes a crystalline organic polymer and carbon black conductive filler is dispersed in the polymer) that is connected to the element connection electrode 41-2 and energized, and an opening for accommodating these Set up An insulating package 46 made of epoxy resin, and a metal thin plate 47 of a Ni-plated copper plate covering the opening of the insulating package 46, and the insulating package 46 is integrally formed with the both terminal leads 41 and 43 by insert molding, The movable arm 42, the thermal actuator 44, and the polymer PTC element 45 are accommodated in the package, the package opening is covered only with the metal thin plate 47, and the insulating package 46 is coated with the epoxy resin 48 applied along the outer edge of the metal thin plate 47. It is fixed and sealed.

なお、特に図示しないが、実施例2の温度保護素子40は、内蔵する熱応動体44およびポリマーPTC素子45を電気回路と接続しない状態で設置するように変形してもよい。すなわち、温度保護素子40の変形例における熱応動体44は、初期状態で可動アーム42と隔離して配置され、過熱を検知して反転作動し固定接点41−1と可動接点42−1とを開離したときに可動アーム42と接触し、同時に熱応動体44に当接するポリマーPTC素子45は、熱応動体44と素子接続電極41−2とに接続されて通電するように変形できる。   Although not particularly illustrated, the temperature protection element 40 according to the second embodiment may be modified so that the built-in thermal actuator 44 and the polymer PTC element 45 are not connected to the electric circuit. In other words, the thermally responsive body 44 in the modified example of the temperature protection element 40 is disposed separately from the movable arm 42 in the initial state, detects the overheating, and reversely operates to connect the fixed contact 41-1 and the movable contact 42-1. The polymer PTC element 45 that comes into contact with the movable arm 42 when it is separated and simultaneously abuts on the thermal responder 44 can be deformed so as to be connected to the thermal responder 44 and the element connection electrode 41-2 and to be energized.

実施例2の絶縁パッケージ46は、開口部を金属薄板47で覆い、さらに絶縁パッケージ46の底部に、絶縁パッケージ46の内側に延在する第1端子リード41の一部を露出させて設けた端子リード露出面41−4を形成することで、絶縁パッケージ36の熱伝導性や放熱性を向上し、温度感応性をさらに高めている。なお、前記絶縁パッケージ46は、開口部周縁に沿って堤状の周壁49を設けて金属薄板47の位置決めを補助するとともにエポキシ樹脂48のディスペンサー・ニードルのガイド部を形成して液状樹脂の塗布を助け、かつ該周壁内面と金属薄板47の外縁上面とで断面がL字型の塗布代を形成して、該塗布代と封止樹脂との界面張力により樹脂ダレを防止している。   In the insulating package 46 of the second embodiment, the opening is covered with a thin metal plate 47, and the first terminal lead 41 that extends inside the insulating package 46 is exposed at the bottom of the insulating package 46. By forming the lead exposed surface 41-4, the thermal conductivity and heat dissipation of the insulating package 36 are improved, and the temperature sensitivity is further enhanced. The insulating package 46 is provided with a bank-shaped peripheral wall 49 along the periphery of the opening to assist the positioning of the thin metal plate 47 and to form a guide portion for the dispenser needle of the epoxy resin 48 to apply the liquid resin. In addition, a coating allowance having an L-shaped cross section is formed between the inner surface of the peripheral wall and the upper surface of the outer edge of the thin metal plate 47, and resin sagging is prevented by the interfacial tension between the coating allowance and the sealing resin.

実施例2は、ポリマーPTC素子45を使用することで、より一層絶縁パッケージ46の厚みを薄くできる。前記ポリマーPTC素子45に施す表面電極45−1は、Cu母材Niめっき材で構成する。ポリマーPTC素子45上部の表面電極45−1は熱応動体44に当接され、ポリマーPTC素子45下部の表面電極45−1は素子接続電極41−2と当接される。この素子接続電極41−2の当接表面は、AgまたはAg合金材の被覆層を設けても良く、特に好ましくはAg−Cuクラッド材としても良い。実施例2の熱応動体44は、77℃以上の温度になると図4(b)に示す形状にスナップ反転作動し回路を遮断し、40℃以下の温度で再び反転して図4(a)に示す初期の接続状態に復帰し、温度検知による回路のON/OFF作動を可能とする。図4(a)の初期の接続状態において熱応動体44は、湾曲面頂部で直に可動アーム42に当接されているが、図4(b)の回路遮断時においては、熱応動体44の外縁部で可動アーム42の下部に設けた接続突起42−2と接続突起42−3とに当接される。その際、片側の接続突起42−2の高さをもう一方の接続突起42−3の高さより低くすることで、可動アーム42先端部の持上高を増幅して可動接点42−1が固定接点41−1から開離する動作を補助する。   In the second embodiment, the use of the polymer PTC element 45 can further reduce the thickness of the insulating package 46. The surface electrode 45-1 applied to the polymer PTC element 45 is composed of a Cu base material Ni plating material. The surface electrode 45-1 above the polymer PTC element 45 is in contact with the thermal actuator 44, and the surface electrode 45-1 below the polymer PTC element 45 is in contact with the element connection electrode 41-2. The contact surface of the element connection electrode 41-2 may be provided with a coating layer of Ag or an Ag alloy material, particularly preferably an Ag-Cu clad material. When the temperature of the heat-responsive body 44 of Example 2 reaches 77 ° C. or higher, the snap inversion operation is performed in the shape shown in FIG. The circuit is restored to the initial connection state shown in Fig. 5 and enables the circuit ON / OFF operation by temperature detection. In the initial connection state of FIG. 4A, the thermal responder 44 is in direct contact with the movable arm 42 at the top of the curved surface. However, when the circuit is interrupted in FIG. The contact protrusion 42-2 and the connection protrusion 42-3 provided at the lower part of the movable arm 42 are brought into contact with each other at the outer edge. At that time, by making the height of the connection projection 42-2 on one side lower than the height of the other connection projection 42-3, the lifting height of the tip of the movable arm 42 is amplified and the movable contact 42-1 is fixed. The operation of separating from the contact 41-1 is assisted.

本発明は、電源装置などの温度保護装置に用いられ、特にLiイオン電池などの大容量の2次電池の保護装置に有効である。   The present invention is used for a temperature protection device such as a power supply device, and is particularly effective for a protection device for a large-capacity secondary battery such as a Li-ion battery.

10,30,40・・・温度保護素子、
11,31,41・・・第1端子リード、
11−1,31−1,41−1・・・固定接点、
11−2,31−2,41−2・・・素子接続電極、
11−3,31−3・・・素子接続突起、
11−4,21−4,31−4・・・端子リード露出面、
12,22,32,42・・・可動アーム、
12−1,22−1,32−1,42−1,52−1・・・可動接点、
12−2,22−2,32−2,42−2,52−2・・・接続突起(低)、
12−3,22−3,32−3,42−3,52−3・・・接続突起(高)、
12−4,22−4, 52−4・・・アーム屈曲点、 22−5・・・切込み、
52−5・・・段差、 52−6・・・窪み、 52−7・・・ノッチ、
13,33,43・・・第2端子リード、
13−1,33−1,43−1・・・アーム接続電極、
14,34,44・・・熱応動体、
15,35・・・PTC素子、 45・・・ポリマーPTC素子
15−1,35−1,45−1・・・表面電極、
16,36,46・・・絶縁パッケージ、 17,37,47・・・金属薄板、
18,38,48・・・封止樹脂、 39,49・・・周壁。
10, 30, 40 ... temperature protection element,
11, 31, 41 ... first terminal lead,
11-1, 31-1, 41-1 ... fixed contact,
11-2, 31-2, 41-2 ... element connection electrode,
11-3, 31-3 ... element connection protrusions,
11-4, 21-4, 31-4 ... Terminal lead exposed surface,
12, 22, 32, 42 ... movable arm,
12-1, 22-1, 32-1, 42-1, 52-1 ... movable contacts,
12-2, 22-2, 32-2, 42-2, 52-2 ... connection protrusion (low),
12-3, 22-3, 32-3, 42-3, 52-3 ... connection protrusion (high),
12-4, 22-4, 52-4 ... arm bending point, 22-5 ... notch,
52-5 ... step, 52-6 ... depression, 52-7 ... notch,
13, 33, 43 ... second terminal lead,
13-1, 33-1, 43-1 ... arm connection electrodes,
14, 34, 44 ... heat-responsive body,
15, 35 ... PTC element, 45 ... Polymer PTC element 15-1, 35-1, 45-1 ... Surface electrode,
16, 36, 46 ... insulating package, 17, 37, 47 ... metal thin plate,
18, 38, 48 ... sealing resin, 39, 49 ... peripheral wall.

Claims (3)

固定接点を設けた第1端子リードと、一端に可動接点を設け弾発力により前記固定接点に接触させる可動アームと、この可動アームに電気接続させた第2端子リードと、常時前記可動アームに接触して所定の温度でスナップ反転作動し前記固定接点と前記可動接点とを開離させる熱応動体と、この熱応動体と前記第1端子リードとに接続して通電されるPTC素子とを備え、さらに前記第1端子リードおよび前記第2端子リードと一体成形し開口部を設けた絶縁パッケージの内部に、前記可動アームと、前記熱応動体および前記PTC素子とを収容し、前記絶縁パッケージの開口部を蓋体で覆って固着封止した温度保護素子において、前記蓋体は、金属薄板のみからなり、この金属薄板の外縁部のみを周回して設けた封止樹脂により前記絶縁パッケージを固着封止したことを特徴とする温度保護素子。 A first terminal lead provided with a fixed contact ; a movable arm provided with a movable contact at one end thereof; and a second terminal lead electrically connected to the movable arm; A thermal responder that contacts and snaps in reverse at a predetermined temperature to separate the fixed contact and the movable contact; and a PTC element that is connected to the thermal responder and the first terminal lead and is energized. The movable arm, the thermally actuated body and the PTC element are housed in an insulating package integrally formed with the first terminal lead and the second terminal lead and provided with an opening. It said insulating openings in the temperature protection device seals affixed sealing covered with a lid member, the lid is made of only a metal sheet, a sealing resin provided around the only outer edges of the sheet metal Temperature protection device, characterized in that it seals the fixed seal package. 前記絶縁パッケージは、開口部周縁の全周に堤状の周壁を設けたことを特徴とする請求項1に記載の温度保護素子。 The temperature protection element according to claim 1, wherein the insulating package is provided with a bank-like peripheral wall around the entire periphery of the opening. 前記可動アームは、端部に段差と窪みを設けて前記可動アームの先端部下面を一文字状の凸形に加工し、前記可動アームの先端部下面の凸形部の表面に可動接点を形成したことを特徴とする請求項1または請求項2に記載の温度保護素子。 The movable arm is provided with a step and a depression at the end, and the lower surface of the distal end portion of the movable arm is processed into a letter-like convex shape, and a movable contact is formed on the surface of the convex portion on the lower surface of the distal end portion of the movable arm. The temperature protection element according to claim 1, wherein the temperature protection element is provided.
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