JP6148968B2 - LED lighting heat dissipation device - Google Patents

Description

  The present invention relates to a heat radiating device that radiates heat generated from an LED used as a light source or a power source in LED lighting used in a lighting device such as a plant cultivation factory and a construction site searchlight.

  In this specification and the claims, the top and bottom of FIGS. 1 and 2 are the top and bottom.

  LED lighting equipped with a light emitting source having LEDs has excellent characteristics of high luminous efficiency, low power consumption and brighter than conventional incandescent bulbs, etc., but with current technology, about 80% of power consumption Becomes a heat, and the resin material surrounding the LED is deteriorated by the heat, the luminous efficiency is lowered and the life is shortened. In particular, in the high power consumption type LED lighting having a power consumption of 100 W or more, the above-described problem is remarkable.

  As a general heat dissipation device, a heating element mounting plate made of a heat conductive material and having one side as a heating element mounting surface to which the heating element is mounted and the other side as a flat heat transfer surface, and heating element mounting 2. Description of the Related Art A plate having a plurality of heat dissipating fins integrally provided in parallel and spaced apart from each other on a heat transfer surface of a plate (hereinafter referred to as a well-known heat dissipating device) is widely known.

  By the way, the LED illumination is often provided so as to illuminate the lower side. In this case, the heating element mounting plate of the well-known heat dissipating device is in a horizontal posture, and the LED lighting is mounted on the lower surface of the heating element mounting plate. However, when used in this state, depending on natural convection, it becomes difficult for low-temperature air to flow in the longitudinal center of the radiating fin, so the temperature near the longitudinal center of the radiating fin is higher than that of other parts. Become higher. Therefore, the heat dissipation performance from the vicinity of the central portion in the longitudinal direction of the heat dissipating fins is deteriorated, and the heat generated from the entire LED illumination arranged on the heat transfer surface of the heating element mounting plate cannot be effectively dissipated.

  Therefore, a heat radiating device using a heat pipe having excellent heat transport performance has been considered. For example, as a heat radiating device for LED lighting using a heat pipe, a vertical strip integrally formed in a vertically projecting manner over the entire length of one horizontal side of the horizontal strip plate portion to which a plurality of LED illuminations are attached on the upper surface. A heat spreader comprising a plate portion, a vertical heat radiating plate spaced from the outer surface of the vertical band plate portion of the heat spreader, and a heat radiator that thermally connects the vertical belt plate portion and the vertical heat radiating plate of the heat spreader. The heat spreader is fixed to a portion sandwiched between the horizontal strip portion and the vertical strip portion in a state of being in thermal contact with both strip plate portions, and the longitudinal direction thereof is directed to the longitudinal direction of both strip plate portions. 1 heat pipe, and a radiator is arranged in the longitudinal direction of the heat spreader at an interval, and the lower part is sandwiched between the vertical strip and the heat sink of the heat spreader. A second heat pipe, a substantially U-shaped third heat pipe disposed between the adjacent second heat pipes and sandwiched between the vertical band plate portion of the heat spreader and the vertical heat radiating plate; A container of second to fourth heat pipes, comprising a substantially L-shaped fourth heat pipe disposed on the outside of the two heat pipes and having a lower part sandwiched between the vertical strip plate part of the heat spreader and the vertical heat radiating plate Has been proposed (see Patent Document 1).

  According to the heat radiating device described in Patent Literature 1, heat generated from the LED illumination is transmitted to the first heat pipe, and the temperature of the heat spreader is made uniform in the longitudinal direction. Then, the heat transmitted to the heat spreader is transmitted from the vertical strip to the entire heat sink through the second to fourth heat pipes, and is radiated from the heat sink.

  However, according to the heat radiating device described in Patent Document 1, the first to fourth heat pipes are required in addition to the heat spreader and the heat radiating plate, and the heat spreader and the first to fourth heat pipes are fixed and the heat radiating plate and the second heat pipe. It is necessary to fix the fourth heat pipe, and there is a problem that the number of parts increases and the assembly work becomes troublesome.

JP 2012-4126 A

  An object of the present invention is to provide an LED illumination heat dissipation device that solves the above-described problems, has a sufficient heat dissipation performance, and has a reduced number of parts as compared to the heat dissipation device described in Patent Document 1, and is easy to assemble. It is to provide.

  In order to achieve the above object, the present invention comprises the following aspects.

  1) An LED lighting mounting plate made of a heat conductive material and having one surface as a lighting mounting surface on which LED lighting is mounted and the other surface is a flat heat transfer surface; and a heat transfer surface of the LED lighting mounting plate A plurality of heat dissipating fins provided, the heat dissipating fins being fixed to the heat transfer surface of the LED lighting mounting plate and receiving heat transferred from the heat transfer surface, and projecting upward from the heat receiving unit It consists of a heat dissipating part that is integrally provided and dissipates heat transferred from the heat receiving part, and a plurality of heat dissipating fins are fixed to the LED lighting mounting plate so that the heat dissipating parts are spaced from each other, A heat radiating device for LED lighting, wherein a pipe portion is provided, and the heat pipe portion is provided by sealing a working fluid in a hollow working fluid sealing circuit.

  2) The heat receiving part of the heat radiating fin is a vertical rectangle whose surface facing the LED lighting mounting plate is a flat surface, and the heat radiating part is provided on at least one of the two long sides of the heat receiving part, The heat dissipation device for LED lighting according to 1) above, wherein the fin is fixed to the LED lighting mounting plate by a fixture that penetrates the heat receiving portion.

  3) The heat dissipating device for LED lighting according to 2) above, wherein the heat dissipating part of the heat dissipating fin is provided on the two long sides of the heat receiving part, and is U-shaped as a whole.

  4) The heat radiating device for LED lighting according to 3) above, wherein heat pipe portions independent of each other are provided in the two heat radiating portions of the heat radiating fins.

  5) The radiating fin is formed by bending a substrate made by joining two metal plates in a laminated shape into a U-shape, and the hydraulic fluid enclosing circuit of the heat pipe portion of the radiating portion is the substrate 4. The LED illumination heat dissipating device as described in 4) above, wherein at least one of the two metal plates forming the bulge bulges outward.

  6) Heat pipe parts are provided in the two heat dissipating parts of the heat dissipating fins, and the inside of the hydraulic fluid enclosing circuit of the heat pipe parts of both heat dissipating parts are communicated with each other through a hollow communication part provided in the heat receiving part. 3. A heat dissipating device for LED lighting as described in 3) above.

  7) The radiating fin is formed by bending a substrate made by joining two metal plates in a laminated shape into a U shape, and the hydraulic fluid enclosing circuit of the heat pipe portion of the radiating portion is the substrate At least one of the two metal plates forming the swell is provided by bulging outward, and the hollow communication part of the heat receiving part is mounted on the LED lighting only by the one metal plate forming the substrate. The heat dissipating device for LED lighting according to 6) above, which is provided by bulging out on the side opposite to the plate.

  8) The heat radiating device for LED lighting according to any one of 3) to 7) above, wherein an interval between the heat radiating portions of the heat radiating fin is 7 mm or more.

  9) The length of the long side of the heat receiving part of the radiating fin is 200 mm or more, and the heat radiating part is provided over the entire length of the long side of the heat receiving part, and the linear distance from the heat receiving part to the tip of the heat radiating part is 50 mm or more. The heat dissipating device for LED lighting according to any one of 2) to 8) above.

  10) The LED illumination heat dissipating device according to 9) above, wherein the dimension in the direction perpendicular to the longitudinal direction of the heat receiving portion of the heat dissipating fin in the LED illumination mounting plate is 200 mm or more.

  11) The LED illumination heat radiation device according to any one of 1) to 10) above, and an LED illumination that is attached to the illumination attachment surface of the LED illumination attachment plate of the LED illumination device and has a plurality of LEDs as light emission sources And a lighting device.

  According to the heat radiating device for LED lighting of 1) to 10) above, the LED made of a heat conductive material and having one surface as a lighting mounting surface to which the LED lighting is mounted and the other surface being a flat heat transfer surface. An illumination mounting plate and a plurality of heat radiation fins provided on the heat transfer surface of the LED illumination mounting plate are provided, and the heat radiation fins are fixed to the heat transfer surface of the LED illumination mounting plate and transmitted from the heat transfer surface. A heat receiving portion that receives heat and a heat radiating portion that is integrally provided in the heat receiving portion so as to protrude upward and dissipate heat transmitted from the heat receiving portion, and a plurality of heat radiating fins are arranged so that the heat radiating portions are spaced from each other. Since it is fixed to the illumination mounting plate, a heat pipe portion is provided in the heat radiating portion of the heat radiating fin, and the heat pipe portion is provided by sealing the working fluid in the hollow hydraulic fluid sealing circuit, and will be described below. Yo Comprising the whole of the attached LED illumination to the heat transfer surface of the LED lighting mounting plate can be efficiently cooled.

  That is, the heat generated from the LED illumination is transmitted to the illumination mounting surface of the LED illumination mounting plate, and is transmitted to the heat receiving portion of the radiating fin through the heat transfer surface. The heat transmitted to the heat receiving portion of the heat radiating fin is transmitted to the hydraulic fluid stored in the lower portion of the hydraulic fluid enclosing circuit in the heat pipe portion of the heat radiating portion, and the hydraulic fluid is evaporated to become a gas phase. As a result, the pressure in the lower part in the hydraulic fluid sealing circuit increases, and the gas phase hydraulic fluid spreads throughout the hydraulic fluid sealing circuit. While the vapor phase hydraulic fluid reaches the entire inside of the hydraulic fluid enclosing circuit, the heat of the vapor phase hydraulic fluid is transferred to the heat radiating section, and the heat radiated from the heat radiating section is condensed outside the vapor phase hydraulic fluid. To do. As a result, the entire heat dissipating part of the heat dissipating fins has a uniform temperature, and heat is uniformly dissipated from the entire heat dissipating part. On the other hand, since the recondensed liquid phase hydraulic fluid flows downward due to gravity, a flow of the gas phase hydraulic fluid and a flow of the liquid phase hydraulic fluid are generated in the heat pipe portion, and the circulation of the hydraulic fluid occurs. Therefore, the heat transmitted from the entire LED lighting mounting plate is evenly dissipated, and the entire LED lighting arranged on the lighting mounting surface of the LED lighting mounting plate is efficiently cooled.

  And since the heat pipe part provided in the heat radiating part of the heat radiating fin is formed by sealing the working liquid in the hollow working liquid sealing circuit provided in the heat radiating part, the heat radiation described in Patent Document 1 is provided. Compared to the device, the number of parts is reduced, and the manufacturing work is facilitated.

  According to the LED illumination heat dissipating devices 4) to 7), it is possible to relatively easily make a heat dissipating fin in which a heat pipe portion is provided in the heat dissipating portion.

  When having the dimensions of the LED illumination heat dissipation device of 8) to 10) above, the heat generated from the LED illumination attached to the LED illumination attachment surface of the LED illumination attachment plate when the structure is a well-known heat dissipation device It is difficult to dissipate heat effectively, but even in this case, it is attached to the LED lighting mounting surface of the LED lighting mounting plate when configured as the LED lighting heat dissipation device of 1) above. In addition, the entire LED illumination can be efficiently cooled.

  According to the illumination device of the above 11), it is possible to efficiently cool the entire LED illumination attached to the heat transfer surface of the LED illumination attachment plate.

It is a perspective view which shows the whole structure of the thermal radiation apparatus for LED illumination of this invention. It is the figure seen from the longitudinal direction one end side of the radiation fin which expands and shows a part of the thermal radiation apparatus for LED lighting of this invention. It is a perspective view which shows the thermal radiation fin used for the thermal radiation apparatus for LED illumination of FIG. 1 and FIG. It is a front view which shows the metal substrate which makes the radiation fin of FIG. 2 and FIG. It is a perspective view which shows the usage condition of the illuminating device provided with the thermal radiation apparatus for LED illumination of FIG. It is a figure equivalent to FIG. 2 which shows the modification of the radiation fin used for the heat radiating device for LED illumination of FIG. 1 and FIG. It is a perspective view which shows the modification of the radiation fin used for the heat radiating device for LED illumination of FIG. 1 and FIG. It is a front view which shows the metal plate which makes the radiation fin of FIG. 6 and FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  In the following description, the term “aluminum” includes aluminum alloys in addition to pure aluminum.

  In the following description, the left and right in FIG. 2 are referred to as the left and right, and the length direction of the heat dissipating fins (the front and back direction in FIG. 2) is referred to as the front-rear direction.

  In the drawings, the same parts and the same parts are denoted by the same reference numerals.

  FIG. 1 shows the overall configuration of the LED illumination heat dissipation device of the present invention, and FIGS. 2 and 3 show the configuration of the main part thereof. FIG. 4 shows a metal substrate on which heat dissipating fins used in the LED illumination heat dissipating device of FIG. 1 and FIG. 2 are formed. Furthermore, FIG. 5 shows the usage aspect of the illuminating device provided with the heat radiating device for LED illumination of this invention.

  1 and 2, the LED illumination heat dissipation device (1) is made of, for example, a heat conductive material such as aluminum or copper (including a copper alloy; hereinafter the same), and one side (here, the lower side) is an LED. The LED lighting mounting plate (2), which is the lighting mounting surface (3) to which the lighting is mounted and the other surface (here, the upper surface) is a flat heat transfer surface (4), and aluminum, copper (copper alloy) And a plurality of radiating fins (5) fixed to the heat transfer surface (4) of the LED lighting mounting plate (2).

  The LED lighting mounting plate (2) has a rectangular shape that is long in the left-right direction, and is mounted on the lighting mounting surface (3), for example, the circuit board (6a), a plurality of blue LEDs mounted on the circuit board (6a) and mounted with blue LEDs. Package (6b), a plurality of red LED packages (6c) that are also mounted on the circuit board (6a) and mounted with red LEDs, and two switching power supplies for each LED package (6b) (6c) (not shown) The LED illumination (6) having the above is attached, and the LED illumination heat dissipating device (1) and the LED illumination (6) constitute an illumination device (16) used as a cultivation illumination device for plant cultivation factories.

  As shown in FIGS. 2 and 3, the heat dissipating fin (5) is fixed in surface contact with the heat transfer surface (4) of the LED lighting mounting plate (2), and the heat transferred from the heat transfer surface (4). The horizontal horizontal plate-shaped heat receiving portion (7) that is long in the front-rear direction and the left and right side edges that are the two long sides of the heat receiving portion (7) are integrally provided in an upward projecting manner, and the heat receiving portion (7) It consists of a rectangular flat plate-shaped heat radiation part (8) that is long in the front-rear direction to dissipate the heat transferred from it. The heat dissipating part (8) is provided over the entire length of the heat receiving part (7), and the heat dissipating fin (5) has a U-shaped cross section as a whole. The plurality of heat dissipating fins (5) are arranged so that the heat dissipating parts (8) are arranged so that the heat dissipating parts (8) are spaced apart from each other in the left-right direction. It is fixed to the LED lighting mounting plate (2) using it.

  Each heat radiating portion (8) of the heat radiating fin (5) is provided with a heat pipe portion (11) extending almost entirely. The heat pipe part (11) of each heat radiating part (8) is one in which the working fluid is sealed in one hollow endless working liquid sealing circuit (12) bulging on both sides of the heat radiating part (8). . The hydraulic fluid enclosing circuit (12) has a rectangular lattice shape formed in substantially the entire heat dissipating part (8) and extending in the front-rear direction. In addition, in FIG. 1, illustration of a heat pipe part (11) and a hydraulic fluid enclosure circuit (12) is abbreviate | omitted. The heat dissipating fin (5) is formed by bending a substrate (13) made by joining two metal plates made of aluminum, copper, etc. into a U-shape. The hydraulic fluid sealing circuit (12) of 11) is provided by bulging at least one of the two metal plates forming the substrate (13), here both metal plates. .

  Here, the length L1 of the LED illumination mounting plate (2) in the left-right direction (the direction perpendicular to the longitudinal direction of the heat receiving portion (7) of the heat radiating fin (5)) is 200 mm or more, and the heat receiving portion of the heat radiating fin (5) ( 7) and the length L2 in the front-rear direction of the long side of the heat radiating part (8) is 200 mm or more, the linear distance L3 from the heat receiving part (7) to the tip of the heat radiating part (8) is 50 mm or more, and each radiating fin (5) It is preferable that the space | interval S between both the thermal radiation parts (8) is 7 mm or more. In addition, the upper limit of the space | interval S between both the thermal radiation parts (8) of each thermal radiation fin (5) is about 20 mm. Moreover, it is preferable that the space | interval between the adjacent thermal radiation parts (8) of the adjacent radiation fin (5) is equal to or more than the said space | interval S. FIG.

  As shown in FIG. 4, the substrate 13 before being bent into a U-shape has a first part (14) of a rectangular shape forming the heat receiving part (7) and both long sides of the first part (14). It consists of two vertical rectangular second parts (15) that are provided integrally with each other and form a heat radiating part (8). The two second parts (15) have independent heat pipe parts (11). Is provided. The heat pipe part (11) of the second part (15) is provided by bulging at least one of the two metal plates forming the substrate (13), here both metal plates. The hydraulic fluid is sealed in one hollow endless hydraulic fluid sealing circuit (12). And the radiation fin (5) is formed by bending both the 2nd parts (15) of a board | substrate (13) with respect to the 1st part (14).

  For example, the substrate 13 before being bent into a U-shape is printed with an anti-bonding agent on a required pattern on at least one of the mating surfaces of two aluminum plates. Two hydraulic fluid enclosing circuits (12) swelled on both sides of the laminated plate by a so-called roll bond method, in which a laminated plate is made by crimping the plate and fluid pressure is introduced into the non-crimped portion of the laminated plate, Then, the hydraulic fluid is manufactured by enclosing the hydraulic fluid in the hydraulic fluid sealing circuit (12). The non-crimped portion of the laminated plate extends from the two non-crimped portions for the hydraulic fluid-filled circuit having a shape corresponding to the two hydraulic fluid-filled circuits (22) and the non-crimped portion for both hydraulic fluid-filled circuits to the periphery of the laminated plate. It consists of one non-crimp part for fluid pressure introduction. When fluid pressure is introduced from the non-crimping part for introducing fluid pressure, the non-crimping part for hydraulic fluid enclosing circuit becomes a hydraulic fluid enclosing circuit (12) that bulges on both sides of the laminated plate. It becomes a hydraulic fluid injecting portion that bulges on both sides of the laminated plate and that has one end connected to one hydraulic fluid enclosing circuit (12) and the other end opened to the periphery of the laminated plate. Then, after injecting the operating fluid into the operating fluid sealing circuit (12) through the operating fluid injection section, the substrate (13) is produced by sealing the operating fluid injection section. The sealed hydraulic fluid injection part is indicated by a chain line A in FIG.

  The substrate (13) may be formed by brazing, for example, two aluminum plates having an outward bulging portion for forming the hydraulic fluid sealing circuit (12) and the hydraulic fluid injection portion. Good.

  As shown in FIG. 5, a cover (17) that covers the entire illumination device (16) is attached to the illumination device (16), and a suspension member (18) provided on the cover (17) is used. For example, it is used suspended from a mounting bar provided above a cultivation shelf in a plant cultivation factory. On the lower wall of the cover (17), there is formed an irradiation port (not shown) for irradiating light emitted from the LED packages (6b) and (6c) of the LED lighting (6) downward. An opening (17a) for exposing all the heat radiating fins (5) to the outside is formed. In addition, vent holes (17b) are formed on both side walls in the longitudinal direction of the heat dissipating fin (5) among all the side walls of the cover (16), and the inside of the cover (17) passes through one vent hole (17b). After the air flowing into the air flows between the heat dissipating parts (8) of each heat dissipating fin (5) and between the heat dissipating parts (8) adjacent to the adjacent heat dissipating fins (5), the air flows through the other vent (17b). It is designed to flow out of the cover (17).

  In addition, each LED package (6b) (6c) arranged on the board (6a) of the LED lighting (6) attached to the lighting mounting surface (3) of the heat radiating device (1) for the LED lighting device of the lighting device (16). ), A current of 0 to 700 mA is supplied. For example, when a current of 500 mA is supplied, the LED input power per unit area of the substrate (6a) is about 6000 W / m 2.

  In the heat dissipation device for LED lighting (1) described above, the heat generated from the LED lighting (6) of the lighting device (16) is transferred to the lighting mounting surface (3) of the LED lighting mounting plate (2), and the heat transfer surface It is transmitted to the heat receiving part (7) of the radiating fin (5) via (4). The heat transferred to the heat receiving part (7) of the heat dissipating fin (5) is transferred to the working fluid accumulated in the lower part of the hydraulic fluid sealing circuit (12) in the heat pipe part (11) of the heat dissipating part (8). The liquid evaporates into a gas phase. As a result, the pressure in the lower part of the hydraulic fluid sealing circuit (12) increases, and the vapor phase hydraulic fluid spreads throughout the hydraulic fluid sealing circuit (12). While the vapor phase hydraulic fluid reaches the entire inside of the hydraulic fluid sealing circuit (12), the heat of the vapor phase hydraulic fluid is transferred to the heat radiating section (8) and flows from the heat radiating section (8) to the inside of the cover (17). The gas phase hydraulic fluid that has been radiated to the air and deprived of heat condenses. As a result, the entire heat dissipating part (8) of the heat dissipating fin (5) has a uniform temperature, and heat is uniformly dissipated from the entire heat dissipating part (8).

  On the other hand, since the re-condensed liquid-phase working fluid flows downward due to gravity, a gas-phase working fluid flow and a liquid-phase working fluid flow are generated in the heat pipe portion (11), and the working fluid is circulated. Therefore, the heat transmitted from the entire LED lighting mounting plate (2) is evenly dissipated, and the entire LED lighting (6) disposed on the lighting mounting surface (4) of the LED lighting mounting plate (2) is efficiently cooled. Is done.

  In the LED lighting heat dissipation device (1) described above, the hydraulic fluid sealing circuit (12) of the heat pipe portion (11) provided in the heat dissipation portion (8) of the heat dissipation fin (5) shown in FIGS. It is formed by expanding both metal plates of the substrate (13) outward, but instead, it is formed by expanding only one metal plate constituting the substrate (13). May be.

  6-8 shows the modification of the radiation fin used for the heat radiating device for LED illumination.

  6 and 7, the heat pipe portions (21) provided on the heat radiating portions (8) of the heat radiating fin (20) and extending over almost the entire heat radiating portion (8) are disposed on both sides of the heat radiating portion (8). The hydraulic fluid is sealed in one swelled hollow endless hydraulic fluid sealing circuit (22). The hydraulic fluid sealing circuit (22) has a rectangular lattice shape formed in almost the entire heat radiation portion (8) and extending in the front-rear direction. The inside of the hydraulic fluid sealing circuit (22) of the heat pipe part (21) provided in both heat radiation parts (8) is a hollow provided in the heat receiving part (7) and bulging only on the upper surface side of the heat receiving part (7) Are communicated with each other via the communication section (23). The lower surface of the heat receiving portion (7) is a flat surface. The heat radiating fin (20) is formed by bending a substrate (25) made by joining two metal plates made of aluminum, copper, etc. into a U-shape, and heat pipe ( The hydraulic fluid sealing circuit (22) of 21) is provided by bulging at least one of the two metal plates forming the substrate (25), here both metal plates, and is hollow. The communication portion (23) is provided by expanding only one (upper) metal plate of the two metal plates forming the substrate (25) upward. The heat radiating fin (20) is fixed to the LED illumination mounting plate (2) using a fixture (9) penetrating a portion of the heat receiving portion (7) that avoids the hollow communication portion (23).

  As shown in FIG. 8, the substrate 25 before being bent into a U-shape has a first part (26) of a vertical rectangle forming the heat receiving part (7) and both long sides of the first part (26). And the two vertical rectangular second parts (27) forming the heat radiating part (8), and the two second parts (27) are provided with the heat pipe part (21). The hollow portion (23) is provided in the first portion (26). The heat pipe part (21) of the second part (27) is formed by bulging at least one of the two metal plates constituting the substrate (25), here both metal plates. The hydraulic fluid is sealed in one hollow endless hydraulic fluid sealing circuit (22). The hollow communication part (23) of the first part (26) is formed by bulging two metal plates constituting the substrate (25) outward and then crushing one metal plate so as to be flat. Is formed. The hydraulic fluid sealing circuit (22) of the second part (27) has a rectangular lattice shape that is long in the longitudinal direction of the second part (27) and is formed over substantially the entire second part (27). A plurality of hollow communication portions (23) of (26) are formed at intervals in the longitudinal direction of the first portion (26). And the radiation fin (5) is formed by bending both the 2nd parts (27) of a board | substrate (25) with respect to the 1st part (26).

  The substrate (25) before being bent into a U-shape is printed with, for example, an anti-bonding agent on a required pattern on at least one of the mating surfaces of two aluminum plates. Two hydraulic fluid encapsulated circuits (22) swelled on both sides of the laminated plate by the so-called roll bond method, which makes a laminated plate by crimping the plate and introduces fluid pressure to the non-crimped portion of the laminated plate, and the laminated plate After forming the hollow communication part (23) that bulges on both sides of the fluid, and then enclosing the hydraulic fluid in the hydraulic fluid sealing circuit (22), flatten one metal plate at the hollow communication part (23). Manufactured by crushing. The non-crimping part of the laminated plate has two communicating parts that connect the two non-crimping parts for the hydraulic fluid sealing circuit and the two non-crimping parts for the hydraulic fluid sealing circuit that have shapes corresponding to the two hydraulic fluid sealing circuits (22). The non-crimping portion for forming and one non-crimping portion for introducing fluid pressure extending from one non-crimping portion for hydraulic fluid sealing circuit to the periphery of the laminated plate. When fluid pressure is introduced from the non-crimping part for introducing fluid pressure, the non-crimping part for hydraulic fluid sealing circuit becomes a hydraulic fluid sealing circuit (22) that bulges on both sides of the laminated plate, and the non-crimping part for forming the communication part Becomes the hollow communication part (23) bulging on both sides of the laminated plate, the non-crimping part for introducing fluid pressure bulges on both sides of the laminated plate, and one end is connected to one hydraulic fluid sealing circuit (22) At the same time, the other end serves as a hydraulic fluid injection part having an opening at the periphery of the laminated plate. Then, after injecting the working fluid into the working fluid sealing circuit (22) through the working fluid injecting portion, the working fluid injecting portion is sealed, and one side of the mating plate is crushed flatly on one side of the mating plate A substrate (25) is produced by forming a hollow communication part (23) that bulges only on the side. The sealed hydraulic fluid injection part is indicated by a chain line B in FIG.

  The substrate (25) includes a hydraulic fluid sealing circuit (22), a hollow communication portion (23), a single aluminum plate having an outward bulging portion for forming a hydraulic fluid injection portion, and a hydraulic fluid sealing circuit. (22) and one aluminum plate having an outward bulging portion for forming the hydraulic fluid injection portion may be formed by brazing, for example.

  6 to 8, in the heat dissipating fin (20), the hydraulic fluid sealing circuit (22) of the heat pipe part (21) of the heat dissipating part (8) bulges only on the mutually opposing surface sides of the heat dissipating part (8). The hollow communication part (23) may bulge to the upper surface side of the heat receiving part (7). In this case, when making a laminated board by the roll-bonding method mentioned above, it is only necessary to bulge only one metal plate to the outside.

  In addition, although the illuminating device used as a construction site searchlight may be constituted by the LED illumination heat dissipation device (1) and the LED illumination of the present invention, in this case, the LED illumination is white or light bulb color. Of light.

  The LED illumination heat dissipation device according to the present invention is used to efficiently dissipate heat generated from the LED in the high power consumption type LED illumination.

(1): Radiator for LED lighting
(2): LED lighting mounting plate
(3): Lighting mounting surface
(4): Heat transfer surface
(5) (20): Radiation fin
(6): LED lighting
(7): Heat receiving part
(8): Heat radiation part
(9): Fixture
(11) (21): Heat pipe section
(12) (22): Hydraulic fluid sealing circuit
(13) (25): Board
(16): Lighting device
(23): Hollow communication part

Claims (11)

An LED lighting mounting plate made of a heat conductive material and having one surface as a lighting mounting surface to which LED lighting is mounted and the other surface is a flat heat transfer surface, and a heat transfer surface of the LED lighting mounting plate. A plurality of heat radiating fins, and the heat radiating fins are fixed to the heat transfer surface of the LED lighting mounting plate and receive heat transferred from the heat transfer surface, and integrally projecting upward from the heat receiving portion The heat radiating part is provided and radiates heat transferred from the heat receiving part, and a plurality of heat radiating fins are fixed to the LED lighting mounting plate so that the heat radiating parts are spaced from each other, and the heat pipe part is connected to the heat radiating part of the heat radiating fins. Is provided, and the heat pipe portion is provided by sealing the working fluid in a hollow working fluid sealing circuit. The heat receiving portion of the heat radiating fin is a vertical rectangle whose surface facing the LED lighting mounting plate is a flat surface, the heat radiating portion is provided on at least one of the two long sides of the heat receiving portion, The heat dissipation device for LED lighting according to claim 1, which is fixed to the LED lighting mounting plate by a fixing tool penetrating the heat receiving portion. The heat radiating device for LED lighting according to claim 2, wherein the heat radiating portion of the heat radiating fin is provided on two long sides of the heat receiving portion, and has a U shape as a whole. The heat radiating device for LED lighting according to claim 3, wherein heat pipe portions independent of each other are provided in the two heat radiating portions of the heat radiating fins. The heat dissipating fin is formed by bending a substrate made by joining two metal plates in a laminated shape into a U shape, and the hydraulic fluid enclosing circuit of the heat pipe part of the heat dissipating part forms the substrate The heat dissipating device for LED lighting according to claim 4, wherein at least one of the two metal plates is provided by bulging outward. A heat pipe portion is provided in two heat radiating portions of the heat radiating fins, and the inside of the hydraulic fluid sealing circuit of the heat pipe portions of both heat radiating portions is communicated through a hollow communication portion provided in the heat receiving portion. 3. A heat dissipation device for LED illumination according to 3. The heat dissipating fin is formed by bending a substrate made by joining two metal plates in a laminated shape into a U shape, and the hydraulic fluid enclosing circuit of the heat pipe part of the heat dissipating part forms the substrate At least one of the two metal plates is provided by bulging outward, and the hollow communication portion of the heat receiving portion is the only one of the metal plates forming the substrate and the LED illumination mounting plate. The heat dissipating device for LED lighting according to claim 6, which is provided by expanding to the opposite side. The space | interval between both the thermal radiation parts of a thermal radiation fin is 7 mm or more, The thermal radiation apparatus for LED lighting in any one of Claims 3-7. The length of the long side of the heat receiving part of the radiating fin is 200 mm or more, the heat radiating part is provided over the entire length of the long side of the heat receiving part, and the linear distance from the heat receiving part to the tip of the heat radiating part is 50 mm or more. Item 9. A heat dissipation device for LED illumination according to any one of Items 2 to 8. The LED illumination heat dissipating device according to claim 9, wherein the LED illumination mounting plate has a dimension in a direction orthogonal to the longitudinal direction of the heat receiving portion of the heat radiation fin of 200 mm or more. The LED illumination heat dissipation device according to any one of claims 1 to 10, and an LED illumination that is attached to an illumination attachment surface of an LED illumination attachment plate of the LED illumination heat dissipation device and has a plurality of LEDs as a light source. A lighting device comprising:

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