JP6155738B2 - Channel unit, liquid ejecting head, liquid ejecting apparatus, and method for manufacturing channel unit - Google Patents

Description

  The present invention relates to a channel unit, a liquid ejecting head, a liquid ejecting apparatus, and a method for manufacturing the channel unit.

  As a flow path unit that constitutes a liquid jet head such as an ink jet head, for example, a unit in which a green sheet in which a liquid flow path space is formed and a green sheet for a diaphragm is integrally fired is known (Patent Document) 1). The liquid flow path includes, for example, a pressure chamber in which pressure is applied to a liquid such as ink by deformation of a diaphragm that is a part of a wall, a liquid supply path to the pressure chamber, and a communication from the pressure chamber to the nozzle. A passage is included. The liquid ejecting head is formed by bonding the above-described flow path substrate and a bonding substrate such as a nozzle plate.

Japanese Patent No. 3144948

  In recent years, the density of nozzles has been increasing toward higher image quality and higher speed of printed matter such as printed matter. There is also a demand for cost reduction contrary to this higher density. In order to increase the density of the nozzles, it is necessary to reduce the nozzle pitch. In order to narrow the nozzle pitch, it is necessary to narrow the width of the pressure chamber. When the width of the pressure chamber is narrowed, the displacement amount of the diaphragm for ejecting ink droplets is reduced. In order to suppress the decrease in the displacement, it is necessary to make the diaphragm thin. However, it has been found that when a ceramic diaphragm is thinned, liquid oozes out from the thin diaphragm.

  The above-described problem of liquid leakage is not limited to the liquid ejecting head, and similarly exists in various flow path units.

  In view of the above, one of the objects of the present invention is to provide a technique capable of suppressing the seepage of liquid from the diaphragm.

As one aspect of the present invention, the present invention is a flow path unit including a deformable diaphragm and a pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is a part of the wall. The diaphragm has translucency, and includes a ceramic base material, and a filler containing a photo-curing resin and filling a gap inside the base material to suppress the passage of liquid. Have
Further, as one aspect of the present invention, the present invention is a flow path unit including a deformable diaphragm, and a pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is a part of the wall. The diaphragm includes a ceramic base material and a filler that fills a gap inside the base material and suppresses passage of liquid, and the diaphragm includes a water absorbing agent, The filler has an aspect in which the filler contains a substance that remains when water in the solution is absorbed by the water-absorbing agent.
Furthermore, as one aspect of the present invention, the present invention is a flow path unit including a deformable diaphragm, and a pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is a part of the wall. The diaphragm includes a ceramic base and a filler that fills a gap in the base and suppresses the passage of liquid, and is on the pressure chamber side of the diaphragm. The abundance ratio of the filler on the first surface side is less than the abundance ratio of the filler on the second surface side opposite to the pressure chamber of the diaphragm.

In addition, the invention includes an aspect of a liquid ejecting head such as an ink jet head that includes the flow path unit and a nozzle that communicates with the pressure chamber.
Furthermore, the invention includes an aspect of a liquid ejecting apparatus such as an ink jet printer on which the liquid ejecting head is mounted.

Furthermore, the present invention is a method of manufacturing a flow path unit comprising a deformable diaphragm, and a pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is a part of a wall,
A forming step of forming the base material by heating a precursor including at least a portion to be a ceramic base material having translucency of the diaphragm;
A filling step of filling a gap formed inside the base material with a filler containing a photocurable resin and suppressing the passage of liquid; and
It has an aspect containing.
Furthermore, the present invention is a method of manufacturing a flow path unit comprising a deformable diaphragm, and a pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is a part of a wall,
The diaphragm includes a water absorbing agent,
Forming a base material by heating a precursor including at least a portion to be a ceramic base material of the diaphragm; and
A filling step of filling a gap formed inside the base material with a filler that contains a substance that remains when the water content of the solution is absorbed by the water-absorbing agent;
It has an aspect containing.
Furthermore, the present invention is a method of manufacturing a flow path unit comprising a deformable diaphragm, and a pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is a part of a wall,
Forming a base material by heating a precursor including at least a portion to be a ceramic base material of the diaphragm; and
A filling step of filling a gap formed inside the base material with a filler for suppressing the passage of liquid;
Including
In the filling step, the abundance ratio of the filler on the first surface side which is the pressure chamber side of the diaphragm is the second surface side of the diaphragm opposite to the pressure chamber. It has a mode in which the filler is filled so as to be less than the abundance ratio.

  Furthermore, the present invention includes aspects such as a method for manufacturing a liquid ejecting head and a method for manufacturing a liquid ejecting apparatus.

In the above-described embodiment, the filler filled in the gap inside the ceramic substrate suppresses the liquid derived from the liquid in the pressure chamber from passing through the gap. Therefore, this aspect can provide a technique capable of suppressing the seepage of the liquid from the diaphragm.
The liquid that oozes out is not limited to the liquid itself in the pressure chamber, but includes a part of the liquid component such as a solvent.
The present invention is not limited to the fact that all of the gaps inside the base material are filled with the filler, and includes filling only a part of the gap with the filler. Further, the present invention is not limited to completely preventing the liquid from passing through the diaphragm, and includes that the liquid passes through the diaphragm more slowly than the case without the filler.

  By the way, a filler should just be able to suppress passage of the liquid in the clearance gap inside the ceramic base materials, and various substances are contained. For example, the filler may include a photocurable resin such as a UV (ultraviolet) curable resin. When the substrate has translucency, a material containing a photocurable resin in the gap inside the substrate when the gap inside the substrate is filled with a liquid photocurable resin and light is applied to the substrate Will be filled. Therefore, this aspect can provide a suitable example capable of suppressing the seepage of the liquid from the diaphragm.

When the diaphragm includes a water-absorbing agent such as a polyhydric alcohol, the filler may include a substance that remains when water in the solution is absorbed by the water-absorbing agent. For example, when at least a part of the solution enters the gap inside the substrate, the water in the solution is absorbed by the water-absorbing agent, and the material containing the remaining substance is filled in the gap inside the substrate. become. Therefore, this aspect can provide a suitable example capable of suppressing the seepage of the liquid from the diaphragm.
Note that the solution includes a liquid such as ink ejected from a nozzle, a dedicated liquid for generating a filler, and the like.

In the case where the diaphragm includes a modifier that generates lumps from the solution, the filler may include lumps generated from the solution by the modifier. For example, when at least a part of the component of the solution enters the gap inside the substrate, a mass is generated from the solution by the modifier, and the material containing this mass is filled in the gap inside the substrate. Become. Therefore, this aspect can provide a suitable example capable of suppressing the seepage of the liquid from the diaphragm.
The mass includes a mass in which a part of the solution such as a precipitation component generated by a reaction between the solute and the denaturant and the denaturant, a mass including the entire solution such as a gel, and the like. The solution includes a liquid such as ink ejected from a nozzle, a dedicated liquid for generating a filler, and the like.

  Further, the filler may include a thermosetting resin. For example, when a liquid thermosetting resin is filled in the gap inside the base material and the base material is heated, the gap inside the base material is filled with a material containing the thermosetting resin. Therefore, this aspect can provide a suitable example capable of suppressing the seepage of the liquid from the diaphragm.

  Further, the filler may contain atoms having a coordination number of 6 or more. When the coordination number of the atoms contained in the filler is as large as 6 or more, the bond between the filler and the substrate can be further strengthened. Therefore, this aspect can provide a suitable example capable of suppressing the seepage of the liquid from the diaphragm.

  By the way, the abundance ratio (R1) of the filler on the first surface side which is the pressure chamber side of the diaphragm is the abundance ratio of the filler on the second surface side opposite to the pressure chamber of the diaphragm. (R2) may be less. For example, a liquid photo-curing resin is filled in the gap inside the substrate, light is irradiated to the second surface side opposite to the pressure chamber of the diaphragm, and cured on the pressure chamber side of the diaphragm. When the photocurable resin that was not present is removed, R1 <R2. Therefore, this aspect can provide a suitable example capable of suppressing the seepage of the liquid from the diaphragm.

  Conversely, R1> R2 may be satisfied. For example, when the diaphragm includes a water-absorbing agent, when a solution is supplied to the pressure chamber, the abundance ratio of substances remaining when the water in the solution is absorbed by the water-absorbing agent is R1> R2. When the diaphragm includes a modifier that generates a mass from the solution, the abundance ratio of the mass is R1> R2. Therefore, this aspect can provide a suitable example capable of suppressing the seepage of the liquid from the diaphragm.

  In addition, the filling process of the manufacturing method of the flow path unit mentioned above is one of depressurizing the environment of the base material, pressurizing the environment of the base material, and vibrating the diaphragm. A permeation step of permeating the liquid that is the basis of the filler into the gap by performing at least the above may be included. This aspect can improve the penetration efficiency of the liquid that is the source of the filler.

Sectional drawing which illustrates typically the flow-path unit U0. FIG. 3 is an exploded perspective view schematically illustrating the configuration of the liquid ejecting head 1. FIG. 3A is a cross-sectional view of the liquid ejecting head 1 at the position A1-A1 in FIG. 2, and FIG. 3B is a cross-sectional view of the liquid ejecting head 1 at the position A2-A2 in FIG. FIGS. 5A to 5C are cross-sectional views for schematically illustrating a manufacturing process of the liquid jet head 1. FIGS. (A) is a figure which illustrates the flow-path unit manufacturing process using liquid thermosetting substance F11, (b) is sectional drawing which illustrates typically the mode in the middle of flow-path unit manufacture. (A)-(e) is a figure which illustrates an organometallic compound, (f) is a figure which illustrates the state after a heating process. The figure which illustrates typically the impregnation apparatus 300. FIG. The figure which illustrates an impregnation process. Sectional drawing which illustrates typically the mode at the time of a diaphragm vibration process. (A) is a figure which illustrates the flow-path unit manufacturing process using liquid photocurable resin F12, (b) is sectional drawing which illustrates typically the mode in the middle of flow-path unit manufacture, (c) is irradiation part L1. FIG. 6D is a diagram schematically illustrating a liquid ejecting apparatus 200 having a shape; FIG. (A) is a figure which illustrates the flow-path unit manufacturing process using the water absorbing agent F13, (b) is sectional drawing which illustrates typically the mode in the middle of flow-path unit manufacture, (c) is the filler in the diaphragm 11 The figure which illustrates density distribution of. (A) is a figure which illustrates the flow-path unit manufacturing process using modifier | denaturant F15 which produces | generates a lump from the solution F16, (b) is sectional drawing which illustrates typically the mode in the middle of flow-path unit manufacture, (c). FIG. 6 is a cross-sectional view schematically illustrating a flow path unit U0 filled with a gap CL1 with gel. (A) is a figure which illustrates the flow-path unit manufacturing process using liquid thermosetting resin F17, (b) is sectional drawing which illustrates typically the mode in the middle of flow-path unit manufacture, (c) is heating part H1. The figure which illustrates typically the liquid ejecting apparatus 200 which has. 2 is a diagram illustrating an outline of a configuration of a liquid ejecting apparatus 200. FIG.

  Embodiments of the present invention will be described below. Of course, the following embodiments are merely examples of the present invention, and all the features shown in the embodiments are not necessarily essential to the means for solving the invention.

(1) Example of outline of flow path unit and liquid jet head:
First, examples of the flow path unit and the liquid jet head will be described. FIG. 1 is a cross-sectional view schematically illustrating the flow path unit U0 provided with the piezoelectric element 3, and shows an enlarged main part of the diaphragm 11 in the lower stage. For easy understanding, the ceramic crystal particles 13 are made larger than the thickness of the diaphragm 11, and the gap CL <b> 1 is made larger than the particles 13. Of course, the size of the ceramic crystal particles relative to the thickness of the diaphragm is not particularly limited, the size of the gap with respect to the particles is not particularly limited, and the shape of the particles is not particularly limited. In the upper part of FIG. 1, the particles 13 are hatched, and in the lower part of FIG. 1, the fillers 14 are hatched. FIG. 2 illustrates an outline of the configuration of the liquid jet head 1 including the flow path unit U0. FIG. 3A shows a cross-sectional view of the liquid jet head 1 at the position A1-A1 in FIG. FIG. 3B is a cross-sectional view of the liquid ejecting head 1 at the position A2-A2 in FIG.

  In the figure mentioned above, the code | symbol D1 has shown the thickness direction of the diaphragm 11 and the flow-path unit U0. Reference sign D3 indicates the longitudinal direction of the flow path unit U0, and is, for example, a side-by-side direction of the elongated pressure chamber 21 and the width direction of the pressure chamber 21. Reference sign D4 indicates the short direction of the flow path unit U0, for example, the longitudinal direction of the pressure chamber 21. The directions D1, D3, and D4 are orthogonal to each other, but may not be orthogonal as long as they intersect each other. For the sake of clarity, the enlargement ratio in each direction D1, D3, D4 may be different, the area ratio of the piezoelectric element 3 may also be different, and the drawings may not be consistent.

  In addition, the positional relationship demonstrated in this specification is only the illustration for demonstrating invention, and does not limit invention. Therefore, it is also included in the present invention that the diaphragm is disposed at a position other than above the pressure chamber, for example, below, left, right, etc. Also, the same direction, position, etc., orthogonal, etc., not only mean exactly the same, orthogonal, etc., but also include errors that occur during manufacturing. Furthermore, contacting and joining include both the presence of an intervening material such as an adhesive and the absence of any intervening material.

  The flow path unit U0 shown in FIG. 1 and the like includes a deformable diaphragm 11 and a pressure chamber 21 in which pressure is applied to the liquid F by deformation of the diaphragm 11 that is a part of the wall. The diaphragm 11 includes a ceramic base 12 and a filler 14 that fills the gap CL1 in the interior 12c of the base 12 and suppresses the passage of the liquid F.

  Here, when there is no filler in the gap CL1, the flow rate of the liquid that exudes from the second surface (surface 11a) opposite to the pressure chamber 21 of the diaphragm 11 when the pressure chamber 21 is filled with the liquid F. (Weight of the liquid per unit time) is Qc (Qc> 0), and when the filler 14 is filled in the gap CL1, the second surface (surface) of the diaphragm 11 is filled with the liquid F in the pressure chamber 21. Let Qs (Qs ≧ 0) be the flow rate of the liquid that exudes from 11a). Suppressing the passage of the liquid F means that Qs <Qc. Of course, Qs = 0 is ideal. Further, it is ideal that all the gap CL1 in the inside 12c of the base material is filled with the filler 14, but only a part of the gap CL1 may be filled with the filler 14. When the filler 14 is filled in the gap CL1 at the intermediate position 11m in the thickness direction D1 between the first surface (back surface 11b) on the pressure chamber 21 side of the diaphragm 11 and the second surface (front surface 11a) opposite to the first surface. The filler 14 is preferable because it tends to remain for a long period of time. That is, a flow path unit having a diaphragm filled with a filler in at least a middle position in the thickness direction has high durability.

  The substrate 12 shown in FIG. 1 is formed by firing from a ceramic precursor such as a green sheet or slurry, and includes a large number of ceramic crystal particles 13. A slight gap CL1 is formed between the particles 13. The base material 12 refers to a portion obtained by removing the gap CL1 from the diaphragm 11. That is, a gap CL1 that leads to the thickness direction D1 is formed in the inside 12c of the base material. When the gap CL1 is not filled with a filler, at least some components such as ink in the pressure chamber ooze out from the back surface 11b (first surface) through the gap CL1 to the front surface (second surface) 11a. End up. In particular, when the substrate vibrates due to the driving of the piezoelectric element, the liquid tends to ooze out.

  With reference to FIG. 3B and the like, a description will be given of coexistence of nozzle density and cost reduction and liquid leakage for higher image quality and higher speed. In order to increase the density of the nozzles 62, it is necessary to narrow the pitch P of the nozzles 62. In order to narrow the nozzle pitch P, it is necessary to narrow the width W of the pressure chamber 21. When the width W of the pressure chamber becomes narrower, the amount of displacement of the diaphragm for discharging droplets decreases. In order to suppress this decrease in displacement, the diaphragm thickness T must be reduced to, for example, about 1 to 3 μm. However, when the ceramic diaphragm is thinned, liquid oozes out from the diaphragm. Precursors of ceramic diaphragms such as green sheets and slurries contain a large amount of binder in order to keep the powder shape. Further, since the powder is fired, the gap CL1 is likely to occur at the grain boundary after firing. Such “liquid leakage” due to the gap CL1 stops when the diaphragm is thick, and the liquid stops midway and has not been manifested. Therefore, the liquid leakage becomes apparent as the thickness of the diaphragm is pursued thinly. It can be said that this is a problem.

In addition, if an Si wafer is used so that liquid leakage does not occur even if the diaphragm is thinned, it is necessary to use an expensive semiconductor manufacturing apparatus, which increases the cost of the liquid jet head. In addition, the method of coating the surface of the diaphragm facing the pressure chamber with a paraxylylene-based polymer has a durability problem that the coating peels off during use, and adhesion of the paraxylylene-based polymer decreases due to adhesion of the paraxylylene-based polymer. There is a problem of doing.
Furthermore, the liquid that oozes out may differ greatly from the stock ink in the dye or pigment concentration. This is because particles in the ink are filtered. Therefore, the gap CL1 that causes liquid leakage is a minute gap and is difficult to suppress, and even if the liquid leakage can be partially suppressed, the yield of the liquid jet head is reduced due to variations.

Therefore, a filler 14 is filled in the gap CL1 in the base material inside 12c of the flow path unit U0. The filler 14 suppresses the liquid F in the pressure chamber 21 from passing through the gap CL1 in the thickness direction D1. Therefore, according to the present technology, it is possible to prevent the liquid derived from the liquid F in the pressure chamber 21 from seeping out from the diaphragm 11.
Whether or not the gap 14 is filled with the filler 14 depends on the cross section EDX (Energy Dispersive X-ray Spectroscopy) mapping analysis, XPS (X-ray Photoelectron Spectroscopy), FT-IR (Fourier Transform Infrared) method, etc. Can be confirmed.

The liquid ejecting head 1 illustrated in FIG. 2 includes a flow path unit U0 having portions 10, 20, and 30 and a nozzle 62 communicating with the pressure chamber 21, and ejects (discharges) ink (liquid). An ink jet recording head. A liquid ejecting apparatus 200 illustrated in FIG. 14 is an ink jet printer (recording apparatus) equipped with the liquid ejecting head as described above.
The liquid ejecting head 1 does not necessarily include the sealing plate 40 and the reservoir plate 50. For example, when there is no sealing plate, the reservoir plate can be a bonding substrate, and when there is no reservoir plate, the nozzle plate can be a bonding substrate. The liquid ejecting head may include another plate such as a so-called compliance plate. For example, the compliance plate may be disposed between the reservoir plate and the nozzle plate. Furthermore, these plates may be composed of a plurality of plates, or a single plate may have the functions of a plurality of plates.

The diaphragm unit 10 is a piezoelectric actuator having the diaphragm 11, the piezoelectric element 3, the lead electrode 84, and the like. The diaphragm 10 is deformed according to the drive signal SG1 and applies pressure to the liquid in the pressure chamber 21.
The diaphragm 11 seals one surface (front surface 20a) of the spacer portion 20, and the piezoelectric element 3, the lead electrode 84, and the like are provided on the surface 11a opposite to the back surface 11b in contact with the spacer portion 20. Yes. The rear surface 11 b of the diaphragm constitutes a part of the wall surface of the pressure chamber 21. That is, the diaphragm 11 which is a part of the wall of the pressure chamber 21 is deformed by the piezoelectric element 3 according to the drive signal SG1. The diaphragm 11 may be a rectangular plate or may not be a rectangular plate.

The piezoelectric element 3 includes a piezoelectric layer 82, a lower electrode (first electrode) 81 provided on the pressure chamber 21 side of the piezoelectric layer, and an upper electrode (second electrode) provided on the other side of the piezoelectric layer 82. Electrode) 83. Each piezoelectric element 3 shown in FIG. 2 is in a position corresponding to each pressure chamber 21. A control circuit board 91 for driving and controlling the piezoelectric element 3 is connected to the upper electrode 83 via cables 92 such as a flexible board, for example. One of the electrodes 81 and 83 may be a common electrode. As the constituent metals of the upper and lower electrodes, for example, one or more of Pt (platinum), Au (gold), Ir (iridium), Ti (titanium), and the like can be used. The piezoelectric layer 82 is made of, for example, a material having a perovskite structure such as a ferroelectric such as PZT (lead zirconate titanate, Pb (Zr _x , Ti _1-x ) O ₃ ), or a lead-free perovskite oxide. Can be used. The lead electrode 84 may be connected to the lower electrode 81 or may be connected to the upper electrode 83. As the constituent metal of the lead electrode, one or more of Au, Pt, Al (aluminum), Cu (copper), Ni (nickel), Cr (chromium), Ti, and the like can be used.

The spacer portion 20 is formed with a pressure chamber 21 penetrating in the thickness direction D1. The spacer portion 20 is sandwiched between the vibration plate 11 and the connection portion 30, whereby the pressure chamber 21 is provided inside the flow path unit U0. The spacer portion 20 may have a rectangular plate shape or may not have a rectangular plate shape.
Each pressure chamber 21 is formed in a long shape whose longitudinal direction is directed to the short direction D4 of the flow path substrate, and a plurality of the pressure chambers 21 are arranged in the longitudinal direction D3 of the flow path substrate. A partition wall 22 is provided between the pressure chambers 21. Pressure is applied to the liquid in the pressure chamber 21 by deformation of the diaphragm 11 that is a part of the wall. As for the width and length of the pressure chamber 21, the length on the back surface 20b side may be shorter than the length on the front surface 20a side. A plurality of rows of pressure chambers 21 arranged in the longitudinal direction D3 of the flow path substrate may be arranged in the short direction D4 of the flow path substrate.

  The connection portion 30 is formed with a liquid supply hole 31 and a nozzle communication hole 32 penetrating in the thickness direction D1 at a position communicating with each pressure chamber 21. That is, the connection part 30 seals the other surface (back surface 20b) opposite to the surface 20a in the spacer part 20 except for the holes 31 and 32. The connection part 30 may be rectangular plate shape, and does not need to be rectangular plate shape. Each supply hole 31 is provided at a position corresponding to one end of each pressure chamber 21 in the longitudinal direction (D4), and each nozzle communication hole 32 is provided at a position corresponding to the other end of each pressure chamber 21 in the longitudinal direction (D4). It has been. The holes 31 and 32 and the pressure chamber 21 become the liquid flow path F1 of the flow path unit U0.

For the diaphragm 11, the spacer portion 20, and the connection portion 30, for example, one or more insulating materials such as ceramics such as zirconia (ZrO _x ), yttrium oxide (YO _x ), and alumina (AlO _x ) are used. Can do.

The sealing plate 40 joined to the back surface 30b of the connecting portion 30 has a liquid common supply hole 41 penetrating in the thickness direction D1, a nozzle communication hole 42, and a liquid introduction hole 43 to the reservoir 51 (FIG. 3A )) Is formed. The common supply hole 41 is formed in a long shape whose longitudinal direction is directed to the longitudinal direction D3 of the sealing plate 40, and is provided at a position communicating with the plurality of supply holes 31 of the connection portion. Each nozzle communication hole 42 is provided at a position communicating with each nozzle communication hole 32 of the connection portion. The liquid introduction hole 43 is provided at a position not in contact with the flow path unit U0. The back surface 40 b of the sealing plate constitutes a part of the wall surface of the reservoir 51.
In the reservoir plate 50, a reservoir 51 and a nozzle communication hole 52 penetrating in the thickness direction D1 are formed. The reservoir 51 is a common ink chamber that communicates with the common supply hole 41 and the liquid introduction hole 43. Each nozzle communication hole 52 is provided at a position communicating with each nozzle communication hole 42 of the sealing plate.

In the nozzle plate 60, nozzles 62 penetrating in the thickness direction D1 are formed at positions communicating with the respective nozzle communication holes 52. The back surface of the nozzle plate 60 is a nozzle surface 60 b that ejects droplets from the nozzles 62. The nozzle plate 60 shown in FIG. 2 has a nozzle row in which nozzles 62 communicating with the pressure chambers 21 are arranged at predetermined intervals in a predetermined direction (D3). The plurality of nozzles may be arranged in a staggered manner.
In addition, as materials for various plates including the plates 40, 50, 60, for example, one or more of metals such as stainless steel and nickel, synthetic resins, ceramics, and the like can be used.

  In the liquid ejecting head 1 described above, the liquid F such as ink is introduced from the liquid introduction hole 43 and fills the reservoir 51, and fills the pressure chamber 21 through the common supply hole 41 and the individual supply holes 31. When the piezoelectric element 3 is deformed so as to expand the diaphragm 11 to the pressure chamber 21 side according to the drive voltage (drive signal SG1) from the control circuit board 91, the diaphragm 11 is also deformed accordingly, and the diaphragm 11 Due to the deformation, the pressure of the liquid F in the pressure chamber 21 is increased, and droplets are ejected from the nozzle 62 through the nozzle communication holes 32, 42 and 52.

(2) An example of an outline of a method of manufacturing a liquid jet head
Next, with reference to FIGS. 1 to 3 together with FIGS. FIG. 4 is a vertical cross-sectional view along the short direction D4 of the flow path substrate.

First, a green sheet having a desired thickness is formed from a paste containing ceramic powder such as zirconia, a binder, and a solvent. For this molding, a general device such as a doctor blade device or a reverse roll coater device can be used. The green sheet for the spacer portion 20 and the green sheet for the connection portion 30 are subjected to machining or laser processing such as cutting, cutting, or punching. Thereby, the sheet-like spacer part precursor 120 having the pressure chamber 21 is obtained, and the sheet-like connection part precursor 130 having the holes 31 and 32 is obtained. If the green sheet for the diaphragm 11 is not necessary, the processing is unnecessary. When the obtained diaphragm precursor 111, spacer part precursor 120, and connection part precursor 130 are laminated, a precursor 100 as shown in FIG.
The above is the precursor forming step S <b> 1 for forming the precursor 100 including at least a portion that becomes the ceramic base material 12 of the vibration plate 11.

Next, the precursor 100 is integrally fired to form the flow path unit main body 101 including the ceramic base 12 as shown in FIG. 4B (heating step S2). The firing temperature is not particularly limited as long as it is a temperature at which an integrated ceramic flow path unit main body is formed, and can be, for example, about 1300 to 1500 ° C. Prior to firing, the precursor 100 may be degreased by heating at a degreasing temperature lower than the firing temperature. Furthermore, before degreasing, the precursor may be dried by heating at a drying temperature lower than the degreasing temperature. The obtained flow path unit main body 101 does not need to be subjected to a special bonding process or the like, and the sealing performance of the overlapping surfaces of the portions 12, 20, and 30 can be obtained.
The flow path unit main body may be formed by a gel casting method using a slurry containing ceramic powder, a binder, and a solvent.

  When the precursor is fired, a large number of ceramic crystal particles are formed. A gap may be formed between these particles. When the diaphragm is thinned to increase the density of the nozzles, a phenomenon occurs that the liquid in the pressure chamber that has passed through the gap formed in the substrate of the diaphragm oozes out to the piezoelectric element side. Therefore, the filler is filled in the gap during the manufacturing process of the liquid jet head. In the example of FIG. 4C, the piezoelectric element 3 is formed after the diaphragm 11 filled with the filler is formed in the gap inside the base material 12, but the filling process of the filler is performed after the piezoelectric element is formed. Is also possible. Details of this filling step will be described later.

  After forming the flow path unit U0 including the vibration plate 11 through the filling process, as shown in FIG. 4C, the lower electrode 81 and the lead electrode 84 (see FIG. 3A) on the vibration plate 11, The piezoelectric layer 82 and the upper electrode 83 are formed (piezoelectric element forming step S3). The electrodes 81, 83, and 84 may be formed by a vapor phase method such as a sputtering method, or may be formed by a method of heating a coating film formed by a liquid phase method such as a spin coating method. When the piezoelectric layer is formed by a liquid phase method such as a spin coating method, for example, a precursor solution coating process in which a metal organic material constituting PZT is dispersed in a dispersion medium, for example, a drying process at about 170 to 180 ° C., for example, What is necessary is just to perform the combination of the degreasing process of about 300-400 degreeC, and the baking process of about 550-800 degreeC several times, for example. Unnecessary electrodes and piezoelectric layers may be removed by patterning. Alternatively, the resist pattern may be formed on the vibration plate, and the electrode and the piezoelectric layer may be removed together with the resist pattern after the electrode and the piezoelectric layer are formed on the entire surface of the vibration plate.

Thereafter, the flow path unit U0, the sealing plate 40, the reservoir plate 50, and the nozzle plate 60 are joined, and the control circuit board 91 is connected to the piezoelectric element 3 by cables 92 (head formation step). The members U0, 40, 50, 60 are joined by a method in which the members are thermocompression bonded with a thermocompression bonding sheet having substantially the same hole as the plate sandwiched between the members, and a liquid adhesive is interposed between the members. The method of apply | coating, the method of thermocompression bonding members using the member which has thermocompression bonding property (self-compression bonding property), etc. are possible. The connection of the control circuit board 91 may be made before joining a part or all of the members U0, 40, 50, 60.
As described above, the liquid jet head 1 as shown in FIGS. 3A and 3B is manufactured.

(3) First example of flow path unit and manufacturing method thereof:
Next, a first example of the flow path unit U0 and its manufacturing method will be described with reference to FIGS.
FIG. 5A shows a flow path unit manufacturing process using the liquid thermosetting substance F11. First, for example, a green sheet is formed by forming a paste in which a powder obtained by adding 4 to 8% by mole of yttrium oxide (YO _x ) to zirconia (ZrO _x ) in a binder is formed into a sheet shape. Accordingly, the green sheet is processed to form and laminate the precursors 111, 120, and 130 (precursor forming step S11). Next, the precursors 111, 120, and 130 are integrally degreased (degreasing step S12) and, for example, integrally fired at about 1300 to 1500 ° C. (baking step S13). The state of the cross section of the integrally fired product (101) in which the base material 12, the spacer part 20, and the connection part 30 are joined is shown in the uppermost part of FIG. A large number of crystal particles 13 are formed in the integrally fired product, and gaps CL <b> 1 are formed between the particles 13.
The above steps S11 to S13 are examples of forming steps for forming the substrate 12.

Next, the liquid thermosetting substance F11 is impregnated in the base material 12 at least in the part of the integrally fired product that becomes the diaphragm (liquid thermosetting substance impregnation step S14). The situation at this time is shown in the second row from the top in FIG. Bonding reactions such as condensation and crosslinking of the liquid thermosetting substance are preferably after penetration into the micro part of the gap CL1.
As the liquid thermosetting substance F11, one or more of a metal halide solution such as an organometallic compound solution and a metal chloride solution, an organic solution, and the like can be used. The organometallic compound includes a metal alkoxide illustrated in FIG. 6A, a metal chelate illustrated in FIGS. 6B and 6C, a metal acylate illustrated in FIG. 6D, and illustrated in FIG. 6E. Carboxylic acid salts such as metal acetates, metal ammonium carbonates, and the like. In FIGS. 6A to 6D, “R” represents a hydrocarbon. Each “R” may be a different hydrocarbon. In FIGS. 6A to 6E, “M” represents a metal.

  Examples of the metal alkoxide include tetraisopropyl titanate, tetranormal butyl titanate, normal propyl zirconate, and normal butyl zirconate. Examples of the metal chelate include titanium triethanolamate, titanium lactate, titanium acetylacetonate, titanium ethyl acetoacetate, zirconium lactate ammonium salt, zirconium tetraacetylacetonate, zirconium ethyl acetoacetate, and the like. Examples of the metal acylate include titanium isostearate, zirconium octylate compound, zirconium stearate, and the like.

  The organometallic compound preferably has a functional group such as an unsaturated bond such as a hydroxyl group, a carbonyl group, a carboxyl group or a carbon double bond, an ether bond or an ester bond. When such an organometallic compound is used, the fired base material and the filler can be firmly bonded.

  The metal constituting the organometallic compound is preferably an atom having a coordination number of 6 or more, such as Ti, Zr (zirconium), and Hf (hafnium). For example, Ti is a tetravalent hexacoordinate metal atom, and Zr is a tetravalent octacoordinate metal atom. When the coordination number of the atoms contained in the filler is as large as 6 or more, the bond between the filler and the base material can be further strengthened, which is suitable for suppressing the seepage of the liquid from the diaphragm. .

The liquid thermosetting substance can be produced, for example, by dispersing (including dissolving) a dispersoid (including a solute) such as the above-described organometallic compound in a dispersion medium (including a solvent). The liquid thermosetting substance in which the thermosetting dispersoid is dispersed in the dispersion medium is particularly preferably a solution in which the solute is dispersed at a molecular level in the solvent, that is, the solute is dissolved in the solvent. Since such a solution easily enters the gap CL1, the base material 12 can be easily impregnated. Further, the liquid thermosetting substance in which a thermosetting dispersoid is dispersed in a dispersion medium is preferably a dispersion system in which a dispersoid having a nano level, for example, a diameter of 10 to 50 nm is dispersed in the dispersion medium. Since the dispersion system including such dispersoids can easily enter the gap CL1, the base material 12 can be easily impregnated. In an aqueous metal chloride solution, fine particles of 10 to 50 nm can be obtained by hydrolysis reaction.
The important point here is to ensure that the dispersoid is dispersed in the dispersion medium at the molecular or nano level.

  The dispersoid (solute) is particularly preferably an organic zirconium compound such as zirconium alkoxide, zirconium chelate or zirconium acylate, or a Zr-containing substance such as zirconium chloride or ammonium zirconium carbonate. This is because Zr has a high coordination number such as 8-coordination, is compatible with zirconia, which is the main composition of the diaphragm, and can be firmly bonded to the substrate. In addition, even a Ti-containing substance or a Hf-containing substance can be dispersed at the molecular level or nano level, and has a high coordination number, so that it can be firmly bonded to the substrate.

As the dispersion medium (solvent), one or more of water, ethanol, isopropanol, butyl glycol, methoxypropanol, acetone, and the like can be used. A suitable combination of the dispersion medium (solvent) and the dispersoid (solute) may be selected depending on the combination of the finished fired body and the impregnation process. When ammonium zirconium carbonate is used, tartaric acid may be added to adjust the reaction.
Further, in order to firmly bond the filler to the substrate, hydrolysis and polycondensation can be performed as necessary. In this case, a combination of water and metal alkoxide may be selected.

  The impregnation treatment with the liquid thermosetting substance may be performed by simply dipping the flow path unit body 101 into the liquid thermosetting substance placed in the solution tank 380 under atmospheric pressure (see FIG. 7). You may combine at least one of these. The reason why the impregnation treatment is performed by a combination of these treatments and dipping is to obtain a relatively effective effect by a relatively easy process. When a stronger effect and further optimization are promoted, an impregnation treatment as shown in Examples 1 to 5 in FIG. 8 is possible using an impregnation apparatus 300 as shown in FIG.

  FIG. 7 schematically illustrates an impregnation apparatus 300 that can perform the above-described processing. The impregnation apparatus 300 includes a decompression chamber 310 to which a decompression pump 320 is connected via a pressure adjustment valve 322, and a pressurization chamber 330 to which a pressurization nitrogen cylinder 340 is connected via a pressure adjustment valve 342. The decompression chamber 310 is provided with a moving port / open / close valve 312 through which the flow path unit main body 101 or the solution tank 380 can be taken in and out. The pressurizing chamber 330 is provided with a moving port / open / close valve 332 through which the flow path unit main body 101 or the solution tank 380 can be taken in and out. Between the decompression chamber 310 and the pressurization chamber 330, a moving port / open / close valve 334 capable of moving the flow path unit main body 101 or the solution tank 380 between the chambers 310 and 330 is provided.

FIG. 8 shows Examples 1 to 7 of the impregnation treatment. Of course, the impregnation treatment is not limited to these seven examples. In Example 1, the flow path unit main body 101 is put into the solution tank 380 under atmospheric pressure for a predetermined time, and then the flow path unit main body 101 is taken out from the solution tank 380 and subjected to a depressurization treatment (for example, absolute pressure) in the depressurization chamber 310 for a predetermined time. The impregnation treatment is performed in a range of about 0.1 to 0.5 atm. The step of performing the decompression process is a step of allowing the liquid serving as the filler to penetrate into the gap by decompressing the environment of the base material. Example 2 shows an impregnation process in which the flow path unit body 101 is moved from the decompression chamber 310 into the pressurization chamber 330 after the process of Example 1 and subjected to a pressurization process (for example, an absolute pressure of about 2 to 9 atm) for a predetermined time. ing. The step of performing the pressurizing process is a process of infiltrating the liquid as the filler into the gap by pressurizing the environment of the base material, and can be combined with the depressurizing process. Example 3 shows an impregnation process in which a flow path unit main body is taken out from the solution tank after a predetermined time from putting the flow path unit main body into the solution tank under atmospheric pressure, and subjected to a pressure treatment in the pressure chamber for a predetermined time. Yes. Thereby, the penetration efficiency is improved. Example 4 shows an impregnation process in which a pressure reduction process is performed for a predetermined time after the flow path unit main body is placed in a solution tank placed in a vacuum chamber. Example 5 shows an impregnation treatment in which a pressure treatment is performed for a predetermined time after the flow path unit main body is placed in a solution tank placed in a pressure chamber. Example 6 is a drive voltage (drive signal SG1) for repeatedly driving the piezoelectric element 3 after assembling the liquid jet head using the flow path unit body 101 and supplying the liquid thermosetting substance F11 into the pressure chamber 21. Shows an impregnation process in which a vibration process is performed by vibrating the diaphragm out of the control circuit board 91. The step of performing the vibration treatment is a step of causing the liquid serving as the filler to penetrate into the gap by vibrating the vibration plate, and can be combined with a pressure reduction treatment or a pressure treatment. Example 7 shows an impregnation process in which a channel unit body is placed in a solution tank under atmospheric pressure and a dipping process is performed for a predetermined time.
If the filling step includes a permeation step that permeates the liquid that is the source of the filler into the gap by performing at least one of the decompression treatment, the pressure treatment, and the vibration treatment, the source of the filler The penetration efficiency of the resulting liquid is improved.

FIG. 9 schematically illustrates the state of the diaphragm vibration processing of Example 6 described above. The piezoelectric element 3 in this example is in a state of little bending when the driving voltage from the control circuit board 91 is “L” (low), and has a lot of bending when the driving voltage is “H” (high). It is in a state. When the base material 12 is bent toward the pressure chamber 21 due to the deformation of the piezoelectric element 3, the gap CL1 on the back surface 11b side is slightly expanded. When the driving voltage “H” is repeatedly supplied and the substrate 12 is repeatedly bent, the gap CL1 expands or narrows, so that the liquid thermosetting substance F11 can easily enter the gap CL1. Repeated bending also causes repeated pressurization and decompression in the pressure chamber 21. Therefore, in Example 6 in which the liquid in the solution tank is infiltrated while vibrating the diaphragm, the infiltration efficiency is improved. Even if the application of the DC voltage “H” is maintained and the state shown in the lower part of FIG. 9 is maintained, the clearance CL1 is widened, so that the permeation efficiency is improved.
Note that the impregnation step may be after firing, and the later step is better if processing is possible even after other components are incorporated.
Further, when the liquid penetrates into the gaps of the diaphragm, the state of the diaphragm changes depending on the state of penetration of the liquid and the state of the liquid itself. Therefore, when a drive signal is supplied from the control circuit board 91 to the piezoelectric element 3 to vibrate the diaphragm, the drive signal may be adjusted according to the state of the diaphragm. This process can be performed, for example, by adjusting the voltage or frequency of the drive signal based on the number of permeation, the permeation time, the electrical state of the diaphragm, the electrical state such as residual vibration or natural vibration period, and the like. An example in which the drive signal is adjusted according to the state of the diaphragm is also a suitable example in which liquid leakage is suppressed.

After the impregnation step, the flow path unit main body is dried after cleaning to remove excess adhesion of the liquid thermosetting substance in the flow channel (cleaning step S15). The situation at this time is shown in the third row from the top in FIG. Thereafter, in order to stabilize the impregnated liquid and prevent movement, heat treatment is performed using a heating device (heating step S16), and the liquid thermosetting substance F11 in the gap CL1 is changed to a solid thermosetting substance. Then, the flow path unit U0 is completed. This thermosetting substance (14) closes the gap CL1 inside the substrate as shown in the lowermost part of FIG. 5 (b). Therefore, the filler 14 filled in the gap CL1 formed inside the substrate 12 by the heating step suppresses the passage of the liquid F in the thickness direction D1.
The above steps S14 to S16 are examples of a filling step for filling the filler 14.

When an organometallic compound solution or a metal halide solution is used as the liquid thermosetting substance, for example, heat treatment is performed at about 300 to 600 ° C. in order to obtain a covalent bond via oxygen, that is, a stronger bond. Thereby, as illustrated in FIG. 6F, the filler 14 containing the metal oxide that is a thermosetting material is formed from the liquid thermosetting substance F11 and is filled in the gap CL1. In addition, the base plate 12 side metal (for example, Zr) and the filler 14 side metal M are covalently bonded via oxygen to form the diaphragm 11 in which the base member 12 and the filler 14 are firmly bonded. .
When a liquid thermosetting substance other than the above is used, the liquid thermosetting substance may be heated at a temperature corresponding to the thermosetting characteristics of the liquid thermosetting substance.

  If the liquid jet head is not assembled after the flow path unit is formed, the piezoelectric element 3 is formed on the vibration plate 11 as shown in FIG. 4C, and the nozzle plate as shown in FIG. Etc., a liquid jet head is formed.

Here, using a zirconium alkoxide solution as the liquid thermosetting material, the impregnation treatment of Examples 1 to 7 in FIG. 8 was performed to produce each flow path unit, and each liquid jet head sample was produced from each flow path unit. . For Example 6, the heat treatment after the impregnation treatment was performed at 100 ° C. Further, a liquid jet head sample of Comparative Example 1 was produced from the flow path unit main body that was not subjected to the impregnation treatment. Furthermore, the pressure chamber surface of the flow path unit main body not subjected to the impregnation treatment was coated with a paraxylylene polymer, and a liquid jet head sample of Comparative Example 2 was produced from the obtained flow path unit.
For each sample, by repeatedly ejecting ink droplets, 10 ^twice, 10 ⁴ times, 10 ⁶ times, 10 ⁸ times, and conditions were examined exudation of the liquid when the jetted 10 ¹¹ times. In addition, the yield when a plurality of samples were produced was also examined. There are many defects that do not immediately occur even when ink droplet ejection starts. In particular, liquid leakage due to fine defects, which is one of the main points of the present application, occurs more than 10 ² times. Therefore adhesion failure, large cracks, the non-defective / number total number of samples when 10 ^twice in order to separate the defective due to defective and minute defects generated in large defects and earlier time points was the initial yield.

ここで、白丸、白抜きの三角、黒の三角、バツ印は、それぞれ、顕微鏡観察で液漏れが見られないこと、顕微鏡観察で液漏れの痕跡は見られるが止まっておりインク滴が正常に噴射されること、顕微鏡観察で僅かに液漏れが見られるがインク滴が正常に噴射されること、液漏れが見られ且つインク滴が正常に噴射されないことを表す。 The results are shown in Table 1.

Here, white circles, white triangles, black triangles, and crosses indicate that liquid leakage is not observed by microscopic observation, and traces of liquid leakage are observed by microscopic observation, but ink drops are normal. This means that the ink droplets are ejected normally, but the ink droplets are ejected normally, and the liquid leakage is observed and the ink droplets are not ejected normally.

  Moreover, about the flow-path unit sample of Examples 1-7, it was confirmed by the cross-sectional EDX mapping analysis that the solution osmose | permeated the inside of a diaphragm. On the other hand, as shown in Table 1, the comparative example has no leakage stop phenomenon and a low yield. Therefore, according to the present technology, it is found that ink leakage is suppressed and a highly durable liquid ejecting head can be obtained with a high yield.

  Furthermore, compared with Example 7 of the atmospheric pressure impregnation treatment, Examples 2 to 5 of the impregnation treatment involving at least one of decompression and pressurization have higher durability and yield. This is considered to be because the solution can be efficiently infiltrated into the fired body by the impregnation treatment accompanied by decompression or pressurization.

  Furthermore, Example 6 of the impregnation process involving the process of vibrating the diaphragm has the highest yield. This is presumably because the permeation of the solution is promoted by moving the diaphragm, and various gaps are reinforced by the flow of ink due to the impregnation treatment near the final process. However, the durability is inferior to Examples 2 to 5 of the impregnation treatment involving at least one of decompression and pressurization. This is presumably because the curing temperature is as low as 100 ° C. and a strong bond as shown in FIG. 6 (f) cannot be obtained. However, Example 6 is superior to the comparative example.

As additional examples 8 to 11, ammonium zirconium carbonate solution, titanium acetate solution, hafnium chloride (stoichiometry HfCl ₄ ) solution, commercially available silane coupling agent instead of zirconium alkoxide solution in impregnation treatment example 1 with reduced pressure A flow path unit using each of these solutions was prepared, and each liquid jet head sample was prepared from each of the flow path units.

また、例８〜１１の流路ユニットサンプルについて、振動板の内部に溶液が浸透していることを断面ＥＤＸマッピング分析により確認した。 The results are shown in Table 2.

Moreover, about the flow-path unit sample of Examples 8-11, it was confirmed by the cross-sectional EDX mapping analysis that the solution osmose | permeated the inside of a diaphragm.

From Table 2, it can be seen that Examples 8 to 11 have the same effect as Example 1. It is considered that the solution penetrates into fine gaps and disperses the gaps by dispersing them in the dispersion medium (solvent) at the molecular level or at the nano level. In the aqueous hafnium chloride solution, fine particles of 10 to 50 nm are obtained by hydrolysis reaction, and this fine particle dispersion system is considered to have an effect of filling the gap because the diameter is generally much smaller than dye or pigment particles used in ink. It is done. When using a silane coupling agent, it is superior to the comparative example, but durability is lower than when using a solution containing Ti, Zr, and Hf. This is considered because the siloxane bond is changed to silanol having a weak bond by H ₂ O.

  As described above, the filler 14 filled in the gap CL1 in the base material inside 12c of the flow path unit U0 suppresses the liquid F in the pressure chamber 21 from passing through the gap CL1 in the thickness direction D1. Therefore, according to the present technology, it is possible to prevent the liquid derived from the liquid F in the pressure chamber 21 from seeping out from the thin diaphragm 11.

Further, by suppressing the liquid leakage from the thin diaphragm, it is possible to increase the density of the nozzles, and consequently to improve the image quality and speed of the output material such as a printed material. In addition, since the liquid ejecting head can be manufactured by a simple process, it is possible to achieve both low cost, which is a conflicting factor, and high nozzle density. Furthermore, since the strength of the diaphragm can be reinforced by the filler, it is possible to improve reliability such as durability and solvent resistance.
Furthermore, even if a solution such as a liquid thermosetting substance adheres to the joint surface with other parts of the flow path unit, the adhesive force is unlikely to decrease as in the case of paraxylylene-based polymers. Therefore, the yield of the liquid jet head can be improved.
Furthermore, when an organometallic compound containing a metal having a functional group and a high coordination number is used, it is firmly bonded to a material such as a metal or a wafer. Therefore, the impregnation process from various processes is possible, and the joint part with each component and the reinforcement of the gap part can be achieved.

  Since durability and reliability can be improved by suppressing liquid leakage, which is the main purpose, it is expected to develop not only consumer printers but also commercial and industrial liquid ejecting apparatuses.

(4) Second example of flow path unit and manufacturing method thereof:
FIG. 10A shows a flow path unit manufacturing process using the liquid photocurable resin F12. The base material 12 has translucency, and when the gap CL1 inside the base material 12 is filled with the liquid photocurable resin F12 and light is applied to the base material 12, the photocuring is performed in the gap CL1 inside the base material. The filler 14A containing the resin is filled. Here, translucency refers to the property of transmitting light having a wavelength that can cure the liquid photocurable resin F12 (may be electromagnetic waves other than visible light). As long as the light having a wavelength capable of curing the liquid photocurable resin F12 can be transmitted, light having other wavelengths may or may not be transmitted. Here, the term “transmission” is not limited to transmitting 100% light, but includes transmitting part of the light and absorbing or reflecting the rest.

As the light-transmitting substrate, one or more light-transmitting insulating materials such as ceramics such as zirconia, yttrium oxide, and alumina can be used.
The liquid photocurable resin F12 includes a dedicated liquid for generating the filler 14A, a liquid F such as ink, and the like. For example, liquid photocurable resins include UV curable resins curable by UV irradiation, such as UV curable imide resins, UV curable silicone resins, and UV curable acrylic resins, photocurable resins curable by visible light irradiation, etc. One or more of the above can be used.

  In the manufacturing process shown in FIG. 10A, steps S14 and S16 are replaced with processes S21 and S22, respectively, as compared with the manufacturing process shown in FIG. First, for example, a green sheet is formed by forming a paste in which a powder in which 4 to 8% of yttrium oxide is added to zirconia in a molar ratio is dispersed in a binder or the like is formed into a sheet shape, and the green sheet is processed as necessary. Each of the precursors 111, 120, and 130 is formed and laminated (precursor forming step S11). Next, the flow path unit main body 101 as shown in the uppermost stage of FIG. 5B is formed in steps S12 and S13.

Next, at least the base material 12 of the integrally fired product (101) is impregnated with the liquid photocurable resin F12 (liquid photocurable resin impregnation step S21). The situation at this time is shown in the uppermost part of FIG. Also in this impregnation step S21, the impregnation treatment of Examples 1 to 7 shown in FIG. 8 can be performed. After the impregnation step, the flow path unit main body is dried after cleaning to remove excess adhesion of the liquid photocurable resin in the flow channel (cleaning step S15). Thereafter, in order to prevent the impregnating liquid from moving, the light transmitting channel unit body 101 is irradiated with light from the irradiation unit L1 to change the liquid photocurable resin F12 to a solid photocurable resin (light irradiation step S22). ), The flow path unit U0 is completed. This photo-curing resin (14A) closes the gap CL1 inside the base material and suppresses the flow of the liquid F as shown in the lowermost stage of FIG. In addition, although it is suitable if the irradiation part L1 is arrange | positioned at the surface 11a side of a diaphragm since it is close to a diaphragm, you may arrange | position at the back surface 11b side of a diaphragm, etc. When the liquid photocurable resin F12 is UV curable, light having a wavelength that allows the liquid photocurable resin F12 to be cured by passing through the vibration plate, for example, may be irradiated with ultraviolet rays from the irradiation unit L1.
The filler 14A filled in the gap CL1 formed inside the base material by the light irradiation step includes a photo-curing resin and suppresses the passage of the liquid in the vibration plate thickness direction D1. Therefore, this example is a suitable example that can suppress the seepage of the liquid from the diaphragm.

  The irradiation unit L1 may be an irradiation device installed in a liquid jet head manufacturing factory, or may be installed in the liquid ejection device. FIG. 10C schematically illustrates a liquid ejecting apparatus 200 having an irradiation unit L1 such as a light source. The liquid ejecting apparatus 200 includes a liquid ejecting head 1, an irradiation unit L1 on the second surface (surface 11a) side opposite to the pressure chamber 21 of the diaphragm 11, a control circuit board 91, an irradiation unit L1, and the like. The control part 201 which controls is provided. However, at least the substrate 12 of the liquid jet head 1 before light irradiation is in a state of being impregnated with a liquid photocurable resin. In this case, when the control unit 201 performs control to irradiate light to the irradiation unit L1, light is irradiated to the translucent diaphragm from the surface 11a side, and the liquid photocurable resin F12 in the gap CL1 is cured and light is emitted. The solid filler 14A containing the cured resin is changed. Further, the irradiation unit L1 may emit light by using a mirror, an optical fiber or the like to guide light from what emits light in addition to the light emitted by itself.

From the above, after the use of the liquid ejecting apparatus 200 is started, the liquid F such as ink in the pressure chamber 21 is replaced with the liquid photocurable resin F12, and at least the diaphragm 11 is impregnated with the liquid photocurable resin F12. When light is irradiated from the irradiation part L1 to the surface 11a side of the diaphragm 11, the liquid leakage resistance is improved. Further, if the liquid F itself such as ink is made photocurable, if the control unit 201 performs control to irradiate light from the irradiation unit L1 to the diaphragm surface 11a side as needed, the liquid leakage resistance is improved. improves.
As described above, the light irradiation may be performed while supplying a drive signal from the control circuit board 91 to the piezoelectric element 3 to vibrate the diaphragm 11.
When light irradiation is performed, the hardness of the diaphragm changes due to the hardening of the liquid component that has entered the diaphragm 11. Therefore, when a drive signal is supplied from the control circuit board 91 to the piezoelectric element 3 to vibrate the vibration plate 11, the vibration is driven according to the hardening state of the infiltrated liquid component by the specific processing described in the first example. The signal may be adjusted. The example in which the drive signal is adjusted according to the curing state is a preferable example in which liquid leakage is suppressed.

  By the way, when light is irradiated from the surface 11a side of the diaphragm, the liquid photocurable resin on the surface 11a side of the diaphragm is sufficiently cured, while the liquid photocurable resin on the back surface 11b side of the diaphragm is sufficiently May not cure. In this case, the liquid photocurable resin on the back surface 11b side flows out into the pressure chamber 21, and the concentration distribution of the filler 14A containing the photocurable resin may be biased toward the front surface 11a side as illustrated in FIG. . In FIG. 10D, the horizontal axis represents the position in the thickness direction D1 of the diaphragm, and the vertical axis represents the concentration of the filler 14A depending on the position. The density distribution is merely an example and does not necessarily have such characteristics. For example, the back surface 11b side of the diaphragm may not be cured, and the concentration of the filler 14A may become zero in the middle of the diaphragm (between 11b and 11a).

The concentration of the filler is represented by the weight of the filler per unit volume of the diaphragm. Here, the arithmetic mean of the filler concentration from the midpoint of the front surface 11a and the back surface 11b to the back surface (first surface) 11b is the average concentration Cb, and the filler from the midpoint to the surface (second surface) 11a. The arithmetic average of concentration is defined as average concentration Ca. The abundance ratio R1 of the filler on the first surface (11b) side is R1 = Cb / (Ca + Cb). The abundance ratio R2 of the filler on the second surface (11a) side is R2 = Ca / (Ca + Cb). The arithmetic average of the filler concentration from the position closer to the back surface 11b to the back surface 11b than the middle point is defined as the average concentration Cb, and the arithmetic average of the filler concentration from the position closer to the surface 11a than the middle point to the surface 11a. May be the average concentration Ca.
In these cases, R1 <R2. This example is also a suitable example capable of suppressing liquid leakage.

(5) Third example of flow path unit and its manufacturing method:
Fig.11 (a) has shown the flow-path unit manufacturing process using the water absorbing agent F13. When the diaphragm includes a water-absorbing agent F13 such as a polyhydric alcohol, when at least a part of the solution F14 enters the gap CL1 inside the base material, the water in the solution is absorbed by the water-absorbing agent F13. As a result, the filler 14B containing the substance remaining when the water in the solution F14 is absorbed by the water absorbing agent F13 is filled in the gap CL1 inside the base material.

As the water absorbing agent F13, one containing one or more kinds of polyhydric alcohols such as glycerin and diethylene glycol, saccharides such as polysaccharides, water absorbing resins such as alkali metal salts of polyacrylic acid, inorganic water absorbing agents such as calcium chloride and silica gel, and the like is used. it can. When diluting the soluble absorbent for impregnation, the solvent for dilution may or may not be water. For example, polyhydric alcohols have the property of absorbing (embracing) moisture, and exhibit the ability to prevent clogging of fine nozzle openings when used as an ink solvent as a humectant. For example, when an ink containing about 9 to 20% by weight of glycerin and diethylene glycol is used, the polyvalent content of the ink can absorb water (for example, about 1.5 times the polyhydric alcohol content ratio of the ink). Alcohol may be included in the water-absorbing agent F13.
The solution F14 includes a liquid F such as ink, a liquid dedicated for generating the filler 14B, and the like. For example, the solution F14 includes alkaline earth metal salts such as Ca (calcium), Mg (magnesium) and Ba (barium), alkali metal salts such as K (potassium), metals such as Cu (copper) and Zn (zinc). An aqueous solution containing one or more of these salts can be used. Aqueous solutions containing these salts are also used for liquids such as ink. When such an aqueous solution is used, substances remaining when the water in the solution F14 is absorbed by the water absorbing agent F13 are alkaline earth metal salts such as Ca salts, alkali metal salts such as K salts, metal salts such as Cu salts, and the like. It becomes a precipitate or concentrated liquid.

In the manufacturing process shown in FIG. 11A, processes S14 and S16 are replaced with processes S23 and S24, respectively, as compared with the manufacturing process shown in FIG. First, the flow path unit main body 101 as shown in the uppermost stage of FIG. 5B is formed in steps S11 to S13.
Next, at least the base material 12 of the integrally fired product (101) is impregnated with the water absorbent F13 (water absorbent impregnation step S23). The situation at this time is shown in the uppermost part of FIG. Also in the impregnation step S23, the impregnation treatment such as Examples 1 to 7 shown in FIG. 8 can be performed.
In addition, when the base material 12 is impregnated with the water absorbing agent F13, the hardness or the like of the diaphragm 11 changes due to the change (curing or the like) of the component of the impregnated liquid. Therefore, when a drive signal is supplied from the control circuit board 91 to the piezoelectric element 3 to vibrate the diaphragm 11, driving is performed according to the change state of the impregnated liquid component by the specific processing described in the first example. The signal may be adjusted. An example in which the drive signal is adjusted according to the change state is a preferable example in which liquid leakage is suppressed.

After the impregnation step, the flow path unit main body is dried after washing to remove excessive adhesion of the water-absorbing agent in the flow channel (cleaning step S15). Thereafter, the solution F14 is supplied into the pressure chamber 21 (solution supply step S24). When at least a part of the component of the solution F14 enters the gap CL1 inside the base material, the water in the solution F14 is absorbed by the water absorbing agent F13 and includes the remaining substance as shown in the lowermost part of FIG. The material (14B) is in a state of being filled in the gap CL1 inside the base material. For example, when the solution F14 in which the solvent is water is an ink containing an alkaline earth metal salt, an alkali metal salt, or a metal salt, the salt contained in the ink is precipitated when moisture is absorbed from the ink into the water absorbing agent F13. . The precipitate, which is the ink residue, closes the gap CL1 and suppresses the flow of the liquid F.
Further, the water absorbent F13 contained in the gap CL1 inside the ceramic substrate 12 draws water from the liquid F in the pressure chamber 21 when the water is not saturated with respect to the water absorbent, but the water is saturated. In this state, moisture is not drawn from the liquid F in the pressure chamber 21. As a result, seepage through the liquid gap CL1 derived from the liquid F in the pressure chamber 21 is suppressed.

  The filler 14B filled in the gap CL1 formed inside the base material by the solution supply step contains a residual substance when the water in the solution F14 is absorbed by the water absorbing agent F13, and the filler 14B enters the diaphragm thickness direction D1. Suppresses the passage of liquid. Therefore, this example is a suitable example that can suppress the seepage of the liquid from the diaphragm.

In addition, when supplying the solution F14 in the pressure chamber 21, as illustrated in FIG. 11C, the concentration distribution of the filler 14B containing the residual material may be biased toward the back surface 11b. Note that the concentration distribution is merely an example and does not necessarily have a linear characteristic. Here, similarly to FIG. 10D, the average concentration Cb on the back surface (first surface) 11b side and the average concentration Ca on the front surface (second surface) 11a side are used, and the first surface (11b) side is used. The abundance ratio is R1 = Cb / (Ca + Cb), and the abundance ratio on the second surface (11a) side is R2 = Ca / (Ca + Cb).
In the above case, R1> R2. This example is also a suitable example capable of suppressing liquid leakage.

(6) Fourth example of flow path unit and manufacturing method thereof:
FIG. 12A shows a flow path unit manufacturing process that uses a denaturant F15 that forms a lump from the solution F16. When the diaphragm includes the modifying agent F15, if at least part of the component of the solution F16 enters the gap CL1 inside the base material, a lump is generated from the solution F16 by the modifying agent F15. Thereby, as shown in FIGS. 12B and 12C, the fillers 14C and 14D including the lump are filled in the gap CL1 inside the base material 12.

  The modifier F15 includes a substance that reacts with at least one of the solute and the dispersoid of the solution F16 and precipitates (changes to a lump), a flocculant that agglomerates (changes to a lump) the dispersoid of the solution F16, and a dispersion medium of the solution F16 Or what contains 1 or more types of the substance etc. which gelatinize a solvent (it changes into a lump), etc. can be used. Substances that react with the solute and precipitate include phosphates, carbonates, sulfates, and the like. For example, in the case where alkaline earth metal ions such as Ca ions are contained in the solution F16, a hardly soluble salt (solid) such as calcium phosphate is precipitated from a water-soluble phosphate such as sodium phosphate. The flocculant includes aluminum sulfate, alum, polyaluminum chloride, sodium alginate, organic polymer flocculant, and the like. For example, when the solution F16 includes agglomerated colloidal particles such as pigment particles, the colloidal particles are agglomerated by the aggregating agent to generate a lump. The substance that gels the dispersion medium includes a gelling agent such as glucose polysaccharide. The generated mass includes the substantial mass of the entire solution due to the solidification of the solvent and the dispersion medium.

  The solution F16 includes a liquid F such as ink, a dedicated liquid for generating a filler, and the like. For example, the solution F16 includes an aqueous solution containing one or more of alkaline earth metal salts such as Ca (calcium), Mg (magnesium), and Ba (barium), and metal salts such as Cu (copper) and Zn (zinc). Can be used. Aqueous solutions containing these salts are also used for liquids such as ink. When such an aqueous solution is used, if a substance that reacts with the solute described above and precipitates is used as the modifier F15, a hardly soluble salt is precipitated from this substance and alkaline earth metal or the like.

In the manufacturing process shown in FIG. 12A, steps S14 and S16 are replaced with steps S25 and S26, respectively, as compared with the manufacturing process shown in FIG. First, the flow path unit main body 101 as shown in the uppermost stage of FIG. 5B is formed in steps S11 to S13.
Next, at least the substrate 12 of the integrally fired product (101) is impregnated with the modifier F15 (modifier impregnation step S25). The situation at this time is shown in the uppermost part of FIG. Also in the main impregnation step S25, the impregnation treatment such as Examples 1 to 7 shown in FIG. 8 can be performed.
In addition, when the base material 12 is impregnated with the modifier F15, the hardness or the like of the diaphragm 11 changes due to the change (curing or the like) of the components of the impregnated liquid. Therefore, when a drive signal is supplied from the control circuit board 91 to the piezoelectric element 3 to vibrate the diaphragm 11, driving is performed according to the change state of the impregnated liquid component by the specific processing described in the first example. The signal may be adjusted. An example in which the drive signal is adjusted according to the change state is a preferable example in which liquid leakage is suppressed.

After the impregnation step, the flow channel unit main body is dried after washing to remove excessive adhesion of the modifier in the flow channel (cleaning step S15). Thereafter, the solution F16 is supplied into the pressure chamber 21 (solution supply step S26). When at least a part of the component of the solution F16 enters the gap CL1 inside the base material, a mass is generated from the solution F16 by the modifying agent F15, and the material (14C, 14D) containing this mass enters the gap CL1 inside the base material. Filled. For example, when the solution F16 in which the solvent is water is an ink containing an alkaline earth metal salt or a metal salt, and the modifier F15 is a material that generates a hardly soluble salt such as a phosphate, this material and the alkaline earth metal are used. A lump of sparingly soluble salt precipitates from the metal or the like. The precipitate, which is the ink reactant, closes the gap CL1 as the filler 14C as shown in FIG. Further, when the modifying agent F15 is a gelling agent, the solution F16 in the gap CL1 gels, and this gel closes the gap CL1 as a filler 14D as shown in FIG. Suppress.
The fillers 14C and 14D filled in the gap CL1 formed inside the base material by the solution supply step include a mass generated from the solution F16 by the modifier F15, and the liquid passes in the diaphragm thickness direction D1. Suppress. Therefore, this example is a suitable example that can suppress the seepage of the liquid from the diaphragm.

  In addition, when supplying the solution F16 in the pressure chamber 21, as illustrated in FIG. 11C, the concentration distribution of the fillers 14C and 14D including the mass may be biased toward the back surface 11b. In this case, R1> R2. This example is also a suitable example capable of suppressing liquid leakage.

(7) A fifth example of the flow path unit and its manufacturing method:
FIG. 13A shows a flow path unit manufacturing process using the liquid thermosetting resin F17. When a liquid thermosetting resin is filled in the gap CL1 inside the base material 12 and the base material 12 is heated, the gap CL1 inside the base material is filled with a filler 14E containing a thermosetting resin.

  The liquid thermosetting resin F17 includes a dedicated liquid for generating the filler 14E, a liquid F such as ink, and the like. For example, one or more of epoxy resin, phenol resin, unsaturated polyester resin, urea resin, silicon resin, and the like can be used for the liquid thermosetting resin.

In the manufacturing process shown in FIG. 13A, processes S14 and S16 are replaced with processes S27 and S28, respectively, as compared with the manufacturing process shown in FIG. First, the flow path unit main body 101 as shown in the uppermost stage of FIG. 5B is formed in steps S11 to S13.
Next, at least the base material 12 of the integrally fired product (101) is impregnated with the liquid thermosetting resin F17 (liquid thermosetting resin impregnation step S27). The situation at this time is shown in the uppermost part of FIG. Also in this impregnation step S27, the impregnation treatment of Examples 1 to 7 shown in FIG. 8 can be performed.

After the impregnation step, the flow path unit main body is dried after cleaning to remove excess adhesion of the liquid thermosetting resin in the flow channel (cleaning step S15). Thereafter, the flow path unit main body 101 is heated by a heating device to change the liquid thermosetting resin F17 to a solid thermosetting resin (heating step S28), and the flow path unit U0 is completed. This thermosetting resin (14) closes the gap CL1 inside the substrate and suppresses the flow of the liquid F as shown in the lowermost stage of FIG.
The filler 14E filled in the gap CL1 formed inside the base material by the heating process contains a thermosetting resin and suppresses the passage of the liquid in the diaphragm thickness direction D1. Therefore, this example is a suitable example that can suppress the seepage of the liquid from the diaphragm.

  The heating device may be installed in the liquid jet head manufacturing factory, but may be installed in the liquid jet device. FIG. 13C schematically illustrates a liquid ejecting apparatus 200 having a heating unit H1 such as a heater. The liquid ejecting apparatus 200 includes a liquid ejecting head 1, a heating unit H1 on the second surface (surface 11a) side opposite to the pressure chamber 21 of the diaphragm 11, a control circuit board 91, and a heating unit H1. The control part 201 which controls is provided. However, at least the base 12 of the liquid jet head 1 before heating is impregnated with a liquid thermosetting resin. In this case, when the control unit 201 controls energization of the heating unit H1, the diaphragm is heated from the surface 11a side, the liquid thermosetting resin F17 in the gap CL1 is cured, and the solid filler 14E containing the thermosetting resin is formed. Change.

  From the above, after the use of the liquid ejecting apparatus 200 is started, the liquid F such as ink in the pressure chamber 21 is replaced with the liquid thermosetting resin F17, and at least the diaphragm 11 is impregnated with the liquid thermosetting resin F17. When the diaphragm 11 is heated from the surface 11a side by the heating unit H1, the liquid leakage resistance is improved. Further, when the liquid F itself such as ink is thermosetting, if the control unit 201 performs control such that the diaphragm 11 is heated by the heating unit H1 periodically or as necessary, the liquid leakage resistance is improved.

Even without the heating unit H1, the piezoelectric element 3 generates heat by repeatedly switching the driving voltage of the piezoelectric element 3 between “H” and “L”, and the diaphragm 11 is heated. Therefore, if the liquid thermosetting resin F17 is supplied into the pressure chamber 21 or the liquid F itself such as ink is made thermosetting, the drive voltage of the piezoelectric element 3 is set to “H” periodically as necessary. The diaphragm 11 is heated by the control unit 201 performing control to repeatedly switch to “L”. Thereby, the liquid thermosetting resin F17 in the gap CL1 or the thermosetting liquid F is cured, and the liquid leakage resistance is improved.
When the diaphragm is heated, the hardness or the like of the diaphragm changes due to thermosetting of the liquid component that has entered the diaphragm. Therefore, when a drive signal is supplied from the control circuit board 91 to the piezoelectric element 3 to vibrate the diaphragm 11, the specific processing described in the first example and the like are performed in accordance with the thermosetting state of the liquid component that has entered. The drive signal may be adjusted. An example in which the drive signal is adjusted according to the thermosetting state is also a suitable example in which liquid leakage is suppressed.

(8) Example of liquid ejecting apparatus:
FIG. 14 shows the appearance of a liquid ejecting apparatus 200 that is an ink jet recording apparatus having the above-described liquid ejecting head 1 as a recording head. When the liquid ejecting head 1 is incorporated in the recording head units 211 and 212, the liquid ejecting apparatus 200 can be manufactured. In the liquid ejecting apparatus 200 illustrated in FIG. 14, the liquid ejecting head 1 is provided in each of the recording head units 211 and 212, and ink cartridges 221 and 222 serving as external ink supply units are detachably provided. A carriage 203 on which the recording head units 211 and 212 are mounted is provided so as to be able to reciprocate along a carriage shaft 205 attached to the apparatus main body 204. When the driving force of the driving motor 206 is transmitted to the carriage 203 via a plurality of gears and a timing belt 207 (not shown), the carriage 203 moves along the carriage shaft 205. A recording sheet 290 fed by a sheet feeding roller (not shown) is conveyed onto the platen 208 and printed by ink droplets supplied from the ink cartridges 221 and 222 and ejected from the liquid ejecting head 1.

(9) Application and others:
Various modifications can be considered for the present invention.
For example, the recording apparatus may be a so-called line head type printer that is fixed so that the liquid ejecting head does not move during printing and performs printing only by moving the recording sheet.
The liquid ejected from the fluid ejecting head may be any material that can be ejected from the liquid ejecting head, such as a solution in which a dye or the like is dissolved in a solvent, or a sol in which solid particles such as pigments or metal particles are dispersed in a dispersion medium. Is included. Such fluids include ink, liquid crystal, and the like. In addition to image recording devices such as printers, liquid ejecting heads can be mounted on color filter manufacturing devices such as liquid crystal displays, electrode manufacturing devices such as organic EL displays and FEDs (electrolytic emission displays), biochip manufacturing devices, etc. is there.
The piezoelectric element for applying pressure to the pressure chamber is not limited to the thin film type as shown in FIGS. 3A and 3B, but a laminated type in which piezoelectric materials and electrode materials are alternately laminated, and longitudinal vibration. A longitudinal vibration type that gives a pressure change to each pressure chamber may be used. In addition, the piezoelectric actuator is an actuator that ejects droplets from the nozzle by bubbles generated by heat generated by the heat generating element, so-called a droplet that is ejected from the nozzle by deforming the diaphragm by static electricity generated between the diaphragm and the electrode. An electrostatic actuator or the like may be used. Furthermore, the present invention can be applied to various other flow path units.

The diaphragm may be formed by firing separately from the spacer part and the connection part that form the liquid flow path, and then joined to the spacer part. The spacer part and the connection part may not be made of ceramic such as metal, synthetic resin, or the like. The present invention can be applied to any flow path unit having a diaphragm in which a filler is filled in a gap inside a ceramic substrate.
The fillers described above can also be used in combination.

Various methods for forming the filler are also conceivable.
For example, a curable resin that does not require heating may be used as a solution to be impregnated inside the substrate. In this case, the heating step S28 shown in FIG. 13A can be omitted.
The filler forming solutions F14 and F16 may be supplied not to the inside of the pressure chamber 21 but to the surface 11a side of the substrate.
The filler forming step may be performed immediately after firing the precursor, after forming the liquid jet head, or immediately after joining the flow path unit main body and the plate before forming the liquid jet head. In the case where the heating process is accompanied with the filler forming process, after the liquid ejecting head is formed, for example, heating of only about 100 ° C. or less is possible, but high temperature heating of about 500 to 600 ° C. is possible in the initial stage of the liquid ejecting head manufacturing process. .

  Moreover, the substance for fillers may be contained in the precursor before baking. For example, when the water-absorbing agent F13 or the modifier F15 is a heat-resistant substance such as an inorganic metal salt, the water-absorbing agent F13 or the modifier F15 is added to the fired substrate 12 if the heat-resistant substance is mixed in the precursor. Will exist. When the water absorbing agent F13 exists, when the solution F14 is supplied into the pressure chamber 21, the water in the solution F14 is absorbed by the water absorbing agent F13 on the surface of the base material, and the filler 14B containing the residual substance is filled in the gap CL1. When the modifying agent F15 is present in the base material 12, if the solution F16 is supplied into the pressure chamber 21, a lump is generated from the solution F16 by the modifying agent F15 on the surface of the base material, and the fillers 14C and 14D containing this lump are gaps. Filled in CL1.

(10) Conclusion:
As described above, according to the present invention, it is possible to provide, for example, a technique that can suppress the seepage of liquid from the diaphragm by various aspects. Needless to say, the above-described basic actions and effects can be obtained even with a technique that does not have the constituent requirements according to the dependent claims but includes only the constituent requirements according to the independent claims.
In addition, the configurations disclosed in the embodiments and modifications described above are mutually replaced, the combinations are changed, the known technology, and the configurations disclosed in the embodiments and modifications described above are mutually connected. It is possible to implement a configuration in which replacement or combination is changed. The present invention includes these configurations and the like.

DESCRIPTION OF SYMBOLS 1 ... Liquid ejecting head, 3 ... Piezoelectric element, 10 ... Vibration plate part, 11 ... Vibration plate, 11a ... Front surface (second surface), 11b ... Back surface (first surface), 12 ... Base material, 12c ... Inside , 13 ... particles, 14 ... filler, 14A ... filler containing photocurable resin, 14B ... filler containing residual material, 14C, 14D ... filler containing mass, 14E ... filler containing thermosetting resin, 20 DESCRIPTION OF SYMBOLS ... Spacer part, 21 ... Pressure chamber, 30 ... Connection part, 31 ... Supply hole, 32 ... Nozzle communication hole, 40 ... Sealing plate, 50 ... Reservoir plate, 51 ... Reservoir, 60 ... Nozzle plate, 62 ... Nozzle, 100 ... Precursor, 101 ... Flow path unit main body, 111 ... Diaphragm precursor, 120 ... Spacer part precursor, 130 ... Connection part precursor, 200 ... Liquid injection device, 300 ... Impregnation device, CL1 ... Gap, D1 ... Thickness Direction, F Liquid, F1 ... Liquid flow path, F11 ... Liquid thermosetting substance, F12 ... Liquid photocurable resin, F13 ... Water absorbing agent, F14 ... Solution, F15 ... Modifier, F16 ... Solution, F17 ... Liquid thermosetting resin, SG1 ... drive signal, U0 ... channel unit.

Claims (12)

A deformable diaphragm,
A pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is part of the wall;
A flow path unit comprising:
The diaphragm is
A translucent, ceramic substrate;
A filler containing a photo-curing resin, filling a gap inside the substrate and suppressing the passage of liquid;
A flow path unit. A deformable diaphragm,
A pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is part of the wall;
A flow path unit comprising:
The diaphragm is
A ceramic substrate;
A filler that fills the gaps inside the substrate and suppresses the passage of liquid;
Have
The diaphragm includes a water absorbing agent,
The flow path unit , wherein the filler includes a substance that remains when water in the solution is absorbed by the water absorbent. A deformable diaphragm,
A pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is part of the wall;
A flow path unit comprising:
The diaphragm is
A ceramic substrate;
A filler that fills the gaps inside the substrate and suppresses the passage of liquid;
Have
The abundance ratio of the filler on the first surface side that is the pressure chamber side of the diaphragm is greater than the abundance ratio of the filler on the second surface side of the diaphragm opposite to the pressure chamber. less, the channel unit. The abundance ratio of the filler on the first surface side that is the pressure chamber side of the diaphragm is greater than the abundance ratio of the filler on the second surface side of the diaphragm opposite to the pressure chamber. The flow path unit according to claim 1 or claim 2 , wherein there are many.   The flow path unit according to any one of claims 1 to 4, wherein the filler includes a thermosetting resin.   The flow path unit according to any one of claims 1 to 5, wherein the filler includes an atom having a coordination number of 6 or more. The flow path unit according to any one of claims 1 to 6 ,
A nozzle communicating with the pressure chamber;
A liquid ejecting head. A liquid ejecting apparatus including the liquid ejecting head according to claim 7 . A flow path unit manufacturing method comprising: a deformable diaphragm; and a pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is a part of a wall,
A forming step of forming the base material by heating a precursor including at least a portion to be a ceramic base material having translucency of the diaphragm;
A filling step of filling a gap formed inside the base material with a filler containing a photocurable resin and suppressing the passage of liquid; and
A method for manufacturing a flow path unit.   A flow path unit manufacturing method comprising: a deformable diaphragm; and a pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is a part of a wall,
  The diaphragm includes a water absorbing agent,
  Forming a base material by heating a precursor including at least a portion to be a ceramic base material of the diaphragm; and
  A filling step of filling a gap formed inside the base material with a filler that contains a substance that remains when the water content of the solution is absorbed by the water-absorbing agent;
A method for manufacturing a flow path unit.   A flow path unit manufacturing method comprising: a deformable diaphragm; and a pressure chamber in which pressure is applied to the liquid by deformation of the diaphragm that is a part of a wall,
  Forming a base material by heating a precursor including at least a portion to be a ceramic base material of the diaphragm; and
  A filling step of filling a gap formed inside the base material with a filler for suppressing the passage of liquid;
Including
  In the filling step, the abundance ratio of the filler on the first surface side which is the pressure chamber side of the diaphragm is the second surface side of the diaphragm opposite to the pressure chamber. A method for manufacturing a flow path unit, wherein the filler is filled so as to be less than the abundance ratio. The filling step includes at least one of depressurizing the environment of the base material, pressurizing the environment of the base material, and vibrating the vibration plate, thereby performing the filling of the filler. Including a permeation step of permeating the original liquid into the gap,
The manufacturing method of the flow-path unit as described in any one of Claims 9-11 .

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