JP6155838B2 - Terminal, electronic component and electronic device - Google Patents

Description

  The present application relates to a terminal, an electronic component, and an electronic device.

  In recent years, various electronic components have been steadily increasing in processing capacity and miniaturized. For this reason, for example, electronic components such as CMOS (Complementary Metal Oxide Semiconductor), LSI (Large Scale Integration), memory devices, sensor devices, and MEMS (Micro Electro Mechanical Systems), which are types of semiconductor devices, Terminals for electrical connection are also miniaturized.

  As a technique related to electrical connection of electronic components, for example, there is wire bonding in which a wire is connected to a terminal disposed on an outer peripheral portion of a semiconductor chip. In order to cope with an increase in the number of connection terminals, for example, there is a flip chip connection in which a semiconductor chip having terminals arranged on a circuit surface is mounted on a substrate with the circuit surface facing the substrate side (for example, Patent Document 1). 2).

  Also, in recent years, in flip chip connection, in order to cope with further miniaturization of terminals, it has been proposed to form pillars with copper (Cu) or the like having good electrical characteristics and to bond with solder attached to the pillars. Yes. In the case of bonding using pillars, the terminals can be further miniaturized compared to the case of using solder bumps.

JP 2010-80962 A JP 2009-21431 A

  In joining the terminals with solder, the amount of solder that can be applied to the terminals also decreases with the miniaturization of the terminals. If the amount of solder attached to the terminal is small, bonding failure tends to occur when the solder is pushed out to the side of the terminal by heating or pressurization during bonding. In addition, if the amount of solder attached to the terminal is small, a bonding failure is likely to occur even by a slight misalignment, so that it is required to align the parts with high accuracy.

  Therefore, an object of the present application is to provide a terminal, an electronic component, and an electronic device that are easy to align components even when the terminals are miniaturized and are less likely to cause poor bonding.

The present application discloses the following terminals.
Having a facing surface facing the mating terminal, and a base part joined to the mating terminal across the solder attached to the facing surface;
A wall portion standing next to the facing surface and surrounding at least a portion of the facing surface;
A part of the wall part is cut out, and a cutout part for receiving another wall part standing next to another opposing surface of the counterpart terminal is provided.
Terminal.

Moreover, this application discloses the following electronic components.
It has a facing surface that faces a mating terminal arranged in another electronic component, and a base portion that is joined to the mating terminal across a solder attached to the facing surface, and stands next to the facing surface A wall portion that surrounds at least a part of the facing surface, and another wall portion that is cut out of a part of the wall portion and is erected next to the other facing surface of the counterpart terminal A terminal provided with a notch for receiving
A plurality of the terminals arranged at positions corresponding to the counterpart terminals arranged in the other electronic components, and
Electronic components.

The present application also discloses the following electronic device.
Multiple electronic components,
A plurality of terminals arranged in each electronic component,
Each terminal is
Having a facing surface facing a mating terminal arranged in another electronic component, and a base part joined to the mating terminal across a solder attached to the facing surface;
A wall portion standing next to the facing surface and surrounding at least a portion of the facing surface;
A part of the wall part, and a notch part for receiving the other wall part standing next to the other facing surface of the mating terminal;
Each of the electronic components is joined to the other electronic component in a state where the wall portion surrounds at least a part of the facing surface together with the other wall portion.
Electronic equipment.

  With the above terminals, electronic components, and electronic devices, even if the terminals are miniaturized, the alignment of the components is easy and poor bonding is less likely to occur.

FIG. 1 is an example of a diagram illustrating terminals according to the embodiment. FIG. 2 is an example of a diagram illustrating a state in which a terminal is joined to a mating terminal. FIG. 3 is an example of a diagram showing a state in which the mating terminal is placed on the terminal at an appropriate position. FIG. 4 is an example of a diagram illustrating a state in which the mating terminal is placed on the terminal at an inappropriate position. FIG. 5 shows a first modification of the terminal. FIG. 6 shows a second modification of the terminal. FIG. 7 is an example of a diagram illustrating a state in which a mating terminal having the same form as the terminal according to the second modification is joined to the terminal. FIG. 8A is a first example of a diagram illustrating a state in which a mating terminal having the same form as the terminal according to the second modification is placed on the terminal at an inappropriate position. FIG. 8B is an example of a diagram illustrating a state in which voids are generated in the joint portion of the terminal according to the conventional example. FIG. 9A is a second example of a diagram illustrating a state in which a mating terminal having the same form as the terminal according to the second modification is placed on the terminal at an inappropriate position. FIG. 9B is an example of a diagram illustrating a state in which the joint portions of the terminals according to the conventional example are separated. FIG. 10 shows a third modification of the terminal. FIG. 11 is an example of a diagram showing a silicon wafer on which a plating seed layer is formed. FIG. 12 is an example of a diagram showing a silicon wafer on which a patterned plating resist is formed. FIG. 13 is an example of a diagram illustrating a silicon wafer on which a base is formed. FIG. 14 is an example of a diagram showing a silicon wafer from which the plating resist has been removed. FIG. 15 is an example of a diagram showing a silicon wafer on which a plating resist is formed again. FIG. 16 is an example of a diagram showing a silicon wafer obtained by planarizing a plating resist. FIG. 17A is an example of a diagram showing a silicon wafer obtained by patterning a plating resist. FIG. 17B is an example of a view showing a silicon wafer patterned with a plating resist from an angle different from that in FIG. 17A. FIG. 18 is an example of a diagram showing a silicon wafer on which a wall portion is formed. FIG. 19 is an example of a diagram showing a silicon wafer from which the plating resist has been removed.

  Hereinafter, embodiments will be described. The embodiments described below are merely examples, and the technical scope of what is disclosed in the present application is not limited to the following modes.

  FIG. 1 is an example of a diagram illustrating terminals according to the embodiment. The terminal 1 includes, for example, a base 2, a wall 3, and a notch 4 as shown in FIG.

  The base portion 2 has a facing surface 5 that faces the mating terminal, and is a portion that is joined to the mating terminal with solder attached to the facing surface 5 interposed therebetween. For example, as shown in FIG. 1, the base 2 can also be regarded as a pillar when formed in a columnar shape. However, the base portion 2 is not limited to the columnar shape as shown in FIG. 1. For example, the base portion 2 does not have a three-dimensional shape, and an electronic component on which the terminal 1 is formed. It may be planar so as to define a region of the surface of the surface.

  The wall 3 is erected next to the facing surface 5 and surrounds at least a part of the facing surface 5. The wall portion 3 is formed so as to protrude from the edge of the facing surface 5 toward the mating terminal. The wall portion 3 is formed so as to protrude from the edge of the facing surface 5 toward the mating terminal, thereby suppressing other terminals adjacent to the terminal 1 from being electrically connected to the terminal 1. 5 may be surrounded. However, as long as the wall 3 surrounds at least a part of the facing surface 5, the wall 3 may protrude from the edge of the facing surface 5 toward a direction other than the counterpart terminal. Further, the wall 3 is arranged next to another facing surface of the mating terminal in a state where the base 2 is joined to the mating terminal, and at least a part of the facing surface 5 together with the other wall of the mating terminal. surround. The wall 3 is arranged next to the other facing surface of the mating terminal, and surrounds at least a part of the facing surface 5 together with the other wall, so that the terminal 1 and the mating terminal can be heated and pressurized at the time of joining. Is suppressed from being pushed out from the facing surface 5. For example, as shown in FIG. 1, the wall 3 is formed in a cylindrical shape along the edge of the circular facing surface 5 when the base 2 is formed in a columnar shape.

The notch 4 is a part of the wall 3, and receives another wall that is erected next to the other facing surface of the counterpart terminal. For example, as shown in FIG. 1, the notch portion 4 receives another wall portion of the mating terminal when the mating terminal has the same shape as the terminal 1 by notching half of the wall portion 3. Is possible. For example, as shown in FIG. 1, when the cutout portion 4 cuts out half of the cylindrical wall portion 3, the wall portion 3 is formed in a semicylindrical shape. However, the cutout 4 is not limited to the cutout half of the wall 3 as shown in FIG. The notch 4 may take any form as long as it can accept the other wall by notching the wall 3 so as to correspond to the shape of the other wall of the mating terminal. Good.

  The terminal 1 can be joined to the mating terminal as follows, for example. FIG. 2 is an example of a diagram illustrating a state in which the terminal 1 is joined to the mating terminal. When joining the terminal 1 to the mating terminal 21, for example, solder 6 is attached to the facing surface 5 in advance (see FIG. 2A). As shown in FIG. 2, the solder 6 may be attached so as to cover the entire facing surface 5, but is not limited to a mode of covering the facing surface 5. The solder 6 may be attached so as to cover a part of the facing surface 5. For example, the solder 6 may have a form in which only the central portion of the facing surface 5 is provided.

  After preparing the terminal 1 to which the solder 6 is attached, for example, the other terminal 21 having the same form as the terminal 1 is received so that the other wall portion 22 of the other terminal 21 is received in the notch portion 4. Mount on the terminal 1 (see FIG. 2B). By placing the mating terminal 21 on the terminal 1 so that the other wall portion 22 of the mating terminal 21 is received by the notch 4, the solder 6 has the wall portion 3 of the terminal 1 and the mating terminal 21. It will be in the state surrounded by the other wall part 22 which has.

  After the mating terminal 21 is placed on the terminal 1 so that the other wall portion 22 of the mating terminal 21 is received by the notch 4, the terminal 1 and the mating terminal 21 are heated or pressurized. . Since the solder 6 is surrounded by the wall 3 of the terminal 1 and the other wall 22 of the mating terminal 21, the solder 6 is separated from the facing surface 5 even if the terminal 1 or the mating terminal 21 is heated or pressurized. Hard to be pushed out. Therefore, even if the terminal 1 or the mating terminal 21 is heated or pressurized, the terminal 1 is joined to the mating terminal 21 while suppressing the solder 6 from being pushed out from the facing surface 5 (FIG. 2). (See (C)). By suppressing the extrusion of the solder 6, a decrease in the solder 6 remaining between the terminal 1 and the mating terminal 21 is suppressed, and it becomes difficult for defective bonding to occur. In addition, since the decrease of the solder 6 is suppressed, even when a large number of terminals 1 are provided in the electronic component, the dimensional tolerance for variations in the height of each terminal 1 and warping of the chip is large. Moreover, the terminal 1 has ensured the contact area wider than before because the wall part 3 contacts the other party terminal 21. FIG. Therefore, the terminal 1 is highly bonded even if voids are mixed in the solder 6 or the opposing surfaces 5 are separated too much from each other, even if electrical conduction between the opposing surfaces 5 is not sufficiently ensured. Reliability can be maintained. Further, since the terminal 1 surrounds the solder 6 by the combination of the wall 3 and the other wall 22, for example, the wall 3 and the other are compared to the case where the solder 6 is completely surrounded by one wall. The decomposition gas of the flux of the solder 6 is likely to diffuse from between the wall portion 22 and the wall portion 22. Therefore, the terminal 1 is less likely to generate voids than, for example, when the solder 6 is completely surrounded by one wall.

  The terminal 1 may be made of any material as long as electrical continuity can be realized. For example, a simple substance such as silver, gold, nickel, copper, or an alloy containing them can be used as a good conductive material. Sex can be obtained. The solder 6 may be any material as long as it can realize electrical continuity while ensuring the bonding strength between the terminal 1 and the counterpart terminal 21. For example, the solder 6 may be a simple substance such as tin or indium, or As long as the alloy contains tin or indium as a main component and contains silver, copper, bismuth or the like, it is possible to ensure bonding strength and to obtain good conductivity.

FIG. 3 is an example of a diagram illustrating a state where the mating terminal 21 is placed on the terminal 1 at an appropriate position. For example, when the cutout portion 4 cuts out half of the wall portion 3 to form the wall portion 3 in a semicylindrical shape, the mating terminal 21 having the same form as the terminal 1 is placed on the terminal 1 at an appropriate position. Then, the wall 3 and the other wall 22 surround the solder 6 almost completely. Therefore, the solder 6 is not easily pushed out from the facing surface 5 even if the terminal 1 and the mating terminal 21 are heated or pressurized. Further, in the case of the terminal 1 according to the above embodiment, the relative positioning of the terminal 1 and the counterpart terminal 21 can be easily performed by positioning the counterpart terminal 21 so that the counterpart terminal 21 contacts the wall portion 3. Can be realized. Therefore, for example, even when a large number of terminals 1 are arranged on the surface of the electronic component, the wall 3
If the respective terminals 1 are aligned on the surface of the electronic component so that the positional relationship of the cutout portions 4 is the same, the relative positioning of the electronic components can be easily realized. As described above, if the electronic components provided with the terminals 1 are joined together, it is difficult to cause a joining failure. Therefore, an electronic device in which the electronic components are joined with fine terminals can be obtained.

  FIG. 4 is an example of a diagram illustrating a state in which the mating terminal 21 is placed on the terminal 1 at an inappropriate position. For example, when the counterpart terminal 21 is placed on the terminal 1 at a position where the wall portion 3 and the other wall portion 22 are separated from each other, the cutout portion 4 cuts out half of the wall portion 3 so that the wall portion 3 is cut in half. Even if it is formed in a cylindrical shape, the solder 6 is not completely surrounded by the wall 3 and the other wall 22. However, even if the wall 3 and the other wall 22 are slightly separated, it can be said that the solder 6 is almost surrounded by the wall 3 and the other wall 22. Therefore, the solder 6 is less likely to be pushed out from the facing surface 5 even when the terminal 1 and the mating terminal 21 are heated and pressurized as compared with the case where the wall 3 and the other wall 22 are not present. Therefore, in the terminal 1 according to the above embodiment, even if the bonding is performed in a state where the terminal 1 and the counterpart terminal 21 are relatively displaced from each other, the bonding failure occurs due to the solder 6 being pushed out from the facing surface 5. And also tolerate misalignment. That is, in the case of the terminal 1 according to the above-described embodiment, even if the terminal 1 is miniaturized, it is easy to align the components, and it is difficult to cause poor bonding.

  The terminal 1 is applicable to electrical connection between various electronic components. As described above, the terminal 1 is easy to align components even when the terminal is miniaturized, and hardly causes poor bonding. Therefore, the terminal 1 is suitable for electrical connection between semiconductor devices such as CMOS, LSI, memory device, sensor device, MEMS, and the like, and between the semiconductor device and the package substrate.

  FIG. 5 shows a first modification of the terminal 1. For example, the base 2 of the terminal 1 may have a rectangular shape as shown in FIG. In this case, the wall 3 may be formed in a square cylinder shape along the edge of the rectangular opposing surface 5. Moreover, the notch part 4 may cut out two surfaces of the square cylindrical wall part 3, and may form the wall part 3 in the shape of a half square cylinder.

  FIG. 6 shows a second modification of the terminal 1. For example, as shown in FIG. 6, the cutout portion 4 of the terminal 1 may be a cutout portion of half or more of the wall portion 3. In this case, since the wall 3 surrounds a range smaller than half of the facing surface 5, for example, the mating terminal 21 that has the same form as the terminal 1 according to the second modification is joined to the terminal 1. In this case, the following joining state is obtained.

  FIG. 7 is an example of a diagram illustrating a state in which a mating terminal 21 having the same form as the terminal 1 according to the second modification is joined to the terminal 1. The terminal 1 according to the second modified example surrounds a range in which the wall 3 is less than half of the facing surface 5, so that the wall 3 of the terminal 1 can be placed even if the mating terminal 21 is placed on the terminal 1 at an appropriate position. And the other wall portion 22 of the mating terminal 21 are separated from each other. Therefore, the solder 6 is not completely surrounded by the wall 3 and the other wall 22. However, even if the wall 3 and the other wall 22 are slightly separated, it can be said that the solder 6 is almost surrounded by the wall 3 and the other wall 22. Therefore, the solder 6 is less likely to be pushed out from the facing surface 5 even when the terminal 1 and the mating terminal 21 are heated and pressurized as compared with the case where the wall 3 and the other wall 22 are not present. Therefore, the terminal 1 according to the second modification can suppress the occurrence of poor bonding due to the solder 6 being pushed out from the facing surface 5.

FIG. 8A is a first example of a diagram illustrating a state in which a mating terminal 21 having the same form as the terminal 1 according to the second modification is placed on the terminal 1 at an inappropriate position. For example, when the mating terminal 21 is placed on the terminal 1 at a position where the wall 3 and the other wall 22 are further separated from each other, the gap between the wall 3 surrounding the solder 6 and the other wall 22. Will spread further. However, even if the gap between the wall portion 3 and the other wall portion 22 is further widened, the solder 6 is less than the wall portion 3 and other wall portions as compared with the case where the wall portion 3 and the other wall portion 22 are not present. It can be said that it is surrounded to some extent by the portion 22. Therefore, in the terminal 1 according to the second modified example, even if the bonding is performed in an inappropriate positional relationship in which the gap between the wall portion 3 and the other wall portion 22 is further widened, Compared to the case where the wall portion 22 is not present, the solder 6 is less likely to be pushed out from the facing surface 5 when the terminal 1 or the counterpart terminal 21 is heated or pressurized. In addition, even if the void B or the like is generated, the solder 6 spreads so as to fill a gap between the wall 3 and the counterpart terminal 21, so that electrical conduction between the terminal 1 and the counterpart terminal 21 is achieved. Is secured. On the other hand, for example, as shown in FIG. 8B, when there is no member corresponding to the wall portion 3, even when the void B is generated, there is no room for the solder to spread beyond the end face of the terminal. It is difficult to ensure electrical continuity between the terminal and the counterpart terminal. Thus, with the terminal 1 according to the second modified example, even if the mating terminal is joined in an inappropriate position or a void B or the like is generated, it is possible to suppress the occurrence of poor bonding. it can. Such an effect is not limited to the second modified example, and is also exhibited in the embodiment and other modified examples.

  FIG. 9A is a second example of a diagram illustrating a state in which a counterpart terminal 21 having the same form as the terminal 1 according to the second modification is placed on the terminal 1 at an inappropriate position. For example, when the mating terminal 21 is placed on the terminal 1 at a position where the wall 3 and the other wall 22 are in contact with each other, the tip of the wall 3 can be separated from the mating terminal 21. However, even if the tip of the wall 3 is separated from the mating terminal 21, the solder 6 is somewhat affected by the wall 3 and the other wall 22 compared to the case where the wall 3 and the other wall 22 do not exist. It can be said that it is surrounded. Therefore, in the terminal 1 according to the second modification, even if the bonding is performed in an inappropriate positional relationship such that the tip of the wall 3 is separated from the mating terminal 21, the wall 3 and the other wall 22 are Compared to the case where it does not exist, the solder 6 is less likely to be pushed out from the facing surface 5 when the terminal 1 or the counterpart terminal 21 is heated or pressurized. Further, since the solder 6 spreads so as to fill a gap between the tip of the wall 3 and the mating terminal 21, electrical continuity between the terminal 1 and the mating terminal 21 is ensured. On the other hand, for example, as shown in FIG. 9B, when there is no member corresponding to the wall 3, if the terminal and the counterpart terminal are separated from each other, there is room for the solder attached to one terminal to attach to the other terminal. Therefore, it is difficult to ensure electrical continuity between the terminal and the counterpart terminal. Thus, even if the terminal 1 which concerns on a 2nd modification is joined in the state in which the other party terminal was mounted in the improper position, generation | occurrence | production of a joining defect can be suppressed. Such an effect is not limited to the second modified example, and is also exhibited in the embodiment and other modified examples.

  FIG. 10 shows a third modification of the terminal 1. For example, as shown in FIG. 10, the wall portion 3 of the terminal 1 may be disposed apart from the base portion 2. In this case, the wall 3 surrounds the facing surface 5 at a position slightly away from the edge of the facing surface 5. As long as the wall 3 can suppress the extrusion of the solder 6 attached to the opposing surface 5 to the side of the terminal 1, the wall 3 may be disposed away from the base 2.

  The terminal 1 can be formed by the following method, for example.

  FIG. 11 is an example of a diagram showing a silicon wafer on which a plating seed layer is formed. When the terminal 1 is to be formed, as shown in FIG. 11, sputtering is performed on the surface of the silicon wafer 7 as an example of the electronic component on which the terminal 1 for electrical connection with other electronic components is to be formed. Layer 8 and seed layer 9 are formed. The adhesion layer 8 can be formed by, for example, a Ti layer having a thickness of about 100 nm. The seed layer 9 can be formed by a Cu layer having a thickness of about 500 nm, for example.

FIG. 12 is an example of a diagram showing a silicon wafer 7 on which a patterned plating resist R is formed. After the seed layer 9 is formed on the surface of the silicon wafer 7, a plating resist R is formed. Then, the plating resist R is exposed and patterned so that a portion where the terminal 1 is to be formed is opened. For example, when it is desired to form the base 2 in a columnar shape, a round hole is formed in the plating resist R by patterning. The round hole formed in the plating resist R can have a diameter of 15 μm, for example.

  FIG. 13 is an example of a diagram showing the silicon wafer 7 on which the base 2 is formed. After the patterned plating resist R is formed on the surface of the silicon wafer 7, a metal material is embedded in the opening portion of the plating resist R by a plating process, and the base 2 is formed together with the solder 6. Examples of the metal material embedded in the opening portion of the plating resist R include alloys containing Cu having a thickness of about 20 μm as the base 2 and Sn having a thickness of about 5 μm as the solder 6.

  FIG. 14 is an example of a diagram illustrating the silicon wafer 7 from which the plating resist R has been removed. After the base 2 and the solder 6 are formed, the plating resist R is removed. As a result, the seed layer 9 is exposed around the base 2.

  FIG. 15 is an example of a diagram showing the silicon wafer 7 on which the plating resist R is formed again. After removing the plating resist R, the plating resist R is formed again. As a result, the surface of the silicon wafer 7 is covered with the plating resist R including the base 2 and the solder 6.

  FIG. 16 is an example of a diagram illustrating the silicon wafer 7 in which the plating resist R is planarized. After the plating resist R is formed again, the plating resist R is flattened. Thereby, the surface of the plating resist R becomes flat regardless of whether it is the base 2 or the solder 6 portion.

  FIG. 17A is an example of a diagram showing a silicon wafer 7 on which a plating resist R is patterned. After the plating resist R is formed again on the surface of the silicon wafer 7 and flattened, the plating resist R is exposed and patterned so that a portion where the wall 3 is to be formed is opened. FIG. 17B is an example of a diagram showing the silicon wafer 7 patterned with the plating resist R from an angle different from FIG. 17A. For example, when it is desired to form the wall 3 in a semicylindrical shape, a semicircular opening is patterned in the plating resist R as shown in FIG. 17B. When patterning a semicircular opening with respect to the plating resist R, for example, a semicircular opening having an outer diameter of about 20 μm and an inner diameter of about 10 μm can be formed by patterning.

  FIG. 18 is an example of a diagram showing the silicon wafer 7 on which the wall 3 is formed. After the plating resist R patterned so that the portion where the wall portion 3 is to be formed is opened on the surface of the silicon wafer 7, Cu is embedded in the opening portion of the plating resist R by plating to form the wall portion 3. . The wall 3 can be formed with a height of about 40 μm, for example.

  FIG. 19 is an example of a diagram illustrating the silicon wafer 7 from which the plating resist R has been removed. After the wall portion 3 is formed, the plating resist R is peeled off, and the seed layer 9 and the adhesion layer 8 around the base portion 2 are etched. Thereby, the terminal 1 to which the solder 6 is attached is completed on the surface of the silicon wafer 7.

  In addition, the manufacturing method of the terminal 1 which concerns on the said embodiment and each modification is not limited to the method mentioned above. You may manufacture the terminal 1 which concerns on the said embodiment and each modification by other various methods.

  Moreover, the modification of the terminal 1 which concerns on the said embodiment is not limited to the modification mentioned above. For example, the terminal 1 according to the above-described embodiment may be modified into a mode in which the above-described modifications are appropriately combined, or may be subjected to various other modifications.

The present application includes the following supplementary matters.
(Appendix 1)
Having a facing surface facing the mating terminal, and a base part joined to the mating terminal across the solder attached to the facing surface;
A wall portion standing next to the facing surface and surrounding at least a portion of the facing surface;
A part of the wall part is cut out, and a cutout part for receiving another wall part standing next to another opposing surface of the counterpart terminal is provided.
Terminal. (1, Fig. 1)
(Appendix 2)
The wall portion is located next to the other facing surface of the mating terminal in a state where the base is joined to the mating terminal.
The terminal according to appendix 1. (2)
(Appendix 3)
The wall portion surrounds at least a part of the facing surface together with the other wall portion in a state where the base portion is joined to the mating terminal.
The terminal according to appendix 1 or 2. (3)
(Appendix 4)
The wall portion protrudes from the edge of the facing surface toward the mating terminal.
The terminal according to any one of appendices 1 to 3. (4)
(Appendix 5)
The notch has a notch half of the wall,
The terminal according to any one of appendices 1 to 4. (5)
(Appendix 6)
The base is formed in a cylindrical shape that forms the circular opposed surface,
The wall portion is formed in a cylindrical shape along the edge of the circular facing surface,
The cutout part is formed by cutting out half of the wall part and forming the wall part into a semi-cylindrical shape.
The terminal according to any one of appendices 1 to 5.
(Appendix 7)
The base is formed in a rectangular shape that forms the opposing surface of the square,
The wall portion is formed in a rectangular tube shape along the edge of the opposing surface of the square,
The cutout portion is formed by cutting out two surfaces of the square tubular wall portion to form the wall portion in a semi-square tube shape.
The terminal according to any one of appendices 1 to 5. (Fig. 5)
(Appendix 8)
It has a facing surface that faces a mating terminal arranged in another electronic component, and a base portion that is joined to the mating terminal across a solder attached to the facing surface, and stands next to the facing surface A wall portion that surrounds at least a part of the facing surface, and another wall portion that is cut out of a part of the wall portion and is erected next to the other facing surface of the counterpart terminal A terminal provided with a notch for receiving
A plurality of the terminals arranged at positions corresponding to the counterpart terminals arranged in the other electronic components, and
Electronic components. (6)
(Appendix 9)
The wall portion is located next to the other facing surface of the mating terminal in a state where the base is joined to the mating terminal.
The electronic component according to appendix 8.
(Appendix 10)
The wall portion surrounds at least a part of the facing surface together with the other wall portion in a state where the base portion is joined to the mating terminal.
The electronic component according to appendix 8 or 9.
(Appendix 11)
The wall portion protrudes from the edge of the facing surface toward the mating terminal.
The electronic component according to any one of appendices 8 to 10.
(Appendix 12)
The notch has a notch half of the wall,
The electronic component according to any one of appendices 8 to 11.
(Appendix 13)
The base is formed in a cylindrical shape that forms the circular opposed surface,
The wall portion is formed in a cylindrical shape along the edge of the circular facing surface,
The cutout part is formed by cutting out half of the wall part and forming the wall part into a semi-cylindrical shape.
The electronic component according to any one of appendices 8 to 12.
(Appendix 14)
The base is formed in a rectangular shape that forms the opposing surface of the square,
The wall portion is formed in a rectangular tube shape along the edge of the opposing surface of the square,
The cutout portion is formed by cutting out two surfaces of the square tubular wall portion to form the wall portion in a semi-square tube shape.
The electronic component according to any one of appendices 8 to 12.
(Appendix 15)
Multiple electronic components,
A plurality of terminals arranged in each electronic component,
Each terminal is
Having a facing surface facing a mating terminal arranged in another electronic component, and a base part joined to the mating terminal across a solder attached to the facing surface;
A wall portion standing next to the facing surface and surrounding at least a portion of the facing surface;
A part of the wall part, and a notch part for receiving the other wall part standing next to the other facing surface of the mating terminal;
Each of the electronic components is joined to the other electronic component in a state where the wall portion surrounds at least a part of the facing surface together with the other wall portion.
Electronic equipment. (7)
(Appendix 16)
The wall portion is located next to the other facing surface of the mating terminal in a state where the base is joined to the mating terminal.
The electronic device according to attachment 15.
(Appendix 17)
The wall portion surrounds at least a part of the facing surface together with the other wall portion in a state where the base portion is joined to the mating terminal.
The electronic device according to appendix 15 or 16.
(Appendix 18)
The wall portion protrudes from the edge of the facing surface toward the mating terminal.
The electronic device according to any one of appendices 15 to 17.
(Appendix 19)
The notch has a notch half of the wall,
The electronic device according to any one of appendices 15 to 18.
(Appendix 20)
The base is formed in a cylindrical shape that forms the circular opposed surface,
The wall portion is formed in a cylindrical shape along the edge of the circular facing surface,
The cutout part is formed by cutting out half of the wall part and forming the wall part into a semi-cylindrical shape.
20. The electronic device according to any one of appendices 15 to 19.
(Appendix 21)
The base is formed in a rectangular shape that forms the opposing surface of the square,
The wall portion is formed in a rectangular tube shape along the edge of the opposing surface of the square,
The cutout portion is formed by cutting out two surfaces of the square tubular wall portion to form the wall portion in a semi-square tube shape.
20. The electronic device according to any one of appendices 15 to 19.

1 .. Terminal; 2 .. Base part; 3 .. Wall part; 4 .. Notch part; 5 .. Opposite surface; 6 ... Solder; 7 ... Silicon wafer; Layer: 21 ... Mating terminal: 22. Other wall part: R ... Plating resist

Claims (7)

Terminals arranged on the main surface of the electronic component in a state of projecting from the main surface of the electronic component facing the main surface of the other electronic component toward the main surface of the other electronic component,
Having a facing surface facing the mating terminal, and a base part joined to the mating terminal across the solder attached to the facing surface;
Are erected next to the base, and the wall portion surrounding at least a portion of the base,
A part of the wall part is cut out, and a cutout part for receiving another wall part standing next to another base part of the mating terminal is provided.
Terminal. The wall portion is located next to the other base portion of the counterpart terminal in a state where the base portion is joined to the counterpart terminal.
The terminal according to claim 1. The wall portion surrounds at least a part of the base portion and the other base portion together with the other wall portion in a state where the base portion is joined to the counterpart terminal.
The terminal according to claim 1 or 2. The wall portion protrudes from an edge of the base portion toward the mating terminal.
The terminal according to any one of claims 1 to 3. The notch has a notch half of the wall,
The terminal according to any one of claims 1 to 4. Electronic components electrically connected to other electronic components,
A base portion facing the mating terminal arranged on the main surface of the other electronic component ; a base portion joined to the mating terminal across a solder attached to the facing surface; and adjacent to the base portion A wall portion that surrounds at least a part of the base portion, and a wall that is cut out of a portion of the wall portion and that stands next to another base portion of the mating terminal A terminal provided with a notch for receiving the part,
Said terminal, said other state projecting from the main surface of the electronic part opposite to the main surface of the electronic component toward the other major surface of the electronic component, is arranged on the main surface of the other electronic components A plurality of members arranged at positions corresponding to the mating terminals respectively,
Electronic components. Multiple electronic components,
A plurality of terminals arranged on the main surface of each electronic component,
Each terminal is connected to the other electronic component from the main surface of the electronic component facing the main surface of another electronic component electrically connected to the electronic component of any one of the plurality of electronic components. A terminal arranged on the main surface of the electronic component in a state of protruding toward the main surface,
Has a facing surface that faces the mating terminal which is arranged on the main surface of the other electronic components, a base which is joined to the mating terminals across the solder attached to the facing surface,
Are erected next to the base, and the wall portion surrounding at least a portion of the base,
A part of the wall part is cut out, and each of the other terminals has a notch part for receiving another wall part standing next to the other base part,
Each electronic component is joined to the other electronic component in a state in which the wall portion surrounds at least a part of the base portion of the electronic component and the base portion of the other electronic component together with the other wall portion,
Electronic equipment.

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