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JP6174402B2 - Firing setter and method for producing ceramic laminated substrate - Google Patents
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JP6174402B2 - Firing setter and method for producing ceramic laminated substrate - Google Patents

Firing setter and method for producing ceramic laminated substrate Download PDF

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JP6174402B2
JP6174402B2 JP2013148786A JP2013148786A JP6174402B2 JP 6174402 B2 JP6174402 B2 JP 6174402B2 JP 2013148786 A JP2013148786 A JP 2013148786A JP 2013148786 A JP2013148786 A JP 2013148786A JP 6174402 B2 JP6174402 B2 JP 6174402B2
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firing
setter
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圭一 森兼
圭一 森兼
翔太朗 井口
翔太朗 井口
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Koa Corp
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Description

本発明は、LTCC基板等のセラミック積層基板を焼成する際に用いられる焼成セッターと、焼成セッターを用いたセラミック積層基板の製造方法に関するものである。   The present invention relates to a firing setter used when firing a ceramic multilayer substrate such as an LTCC substrate, and a method for producing a ceramic multilayer substrate using the firing setter.

LTCC(Low Temperature Co-fired Ceramics)基板は低導通抵抗体であるAgまたはCuを配線パターンやビア等の導体として使用したセラミック積層基板の一種であり、優れた電気的特性を有しているため高周波回路基板や車載用ECU基板等として各種分野で広く採用されている。   The LTCC (Low Temperature Co-fired Ceramics) substrate is a kind of ceramic multilayer substrate that uses Ag or Cu, which is a low conduction resistor, as a conductor such as a wiring pattern or a via, and has excellent electrical characteristics. Widely used in various fields as high-frequency circuit boards, in-vehicle ECU boards, and the like.

このようなLTCC基板は、基板材料であるグリーンシートに超微細配線導体を印刷したりビア用の孔開け加工を施した後、そのグリーンシートを平板状の焼成セッターに複数積層した状態で焼成炉内に搬入し、これを約850℃〜1000℃の温度範囲で焼成することによって製造することができる。その際、焼成工程でグリーンシートのガラス成分が表面に溶け出すため、溶けたガラス成分が焼成セッターの表面に付着し、グリーンシートと焼成セッターが溶融接合してしまうという不具合が発生する。   Such an LTCC substrate is a firing furnace in which a plurality of green sheets are stacked on a flat firing setter after printing an ultra-fine wiring conductor on a green sheet as a substrate material or drilling a via. It can be manufactured by carrying it in and baking it in a temperature range of about 850 ° C. to 1000 ° C. In that case, since the glass component of the green sheet melts on the surface in the firing step, the melted glass component adheres to the surface of the fired setter, causing a problem that the green sheet and the fired setter are melt-bonded.

そこで従来より、グリーンシートと接触する焼成セッターの表面に規則性をもった凹凸を形成し、この凹凸によってグリーンシートと焼成セッターの接触面積を低減するという技術が提案されている(例えば、特許文献1参照)。このような焼成セッターを用いてグリーンシートを焼成すると、焼成時に収縮するグリーンシートの反りや歪みを焼成セッターで抑制しつつ、ガラス成分の溶融に起因するグリーンシートと焼成セッターの接着を凹凸によって防止することができる。   Therefore, conventionally, a technique has been proposed in which irregularities having regularity are formed on the surface of the firing setter that comes into contact with the green sheet, and the contact area between the green sheet and the firing setter is reduced by the irregularities (for example, Patent Documents). 1). When a green sheet is fired using such a firing setter, the warpage and distortion of the green sheet that shrinks during firing is suppressed by the firing setter, while adhesion between the green sheet and the firing setter due to melting of the glass component is prevented by unevenness. can do.

特開2006−225186号公報JP 2006-225186 A

ところで、上述したセラミック積層基板の製造工程において、焼成時にグリーンシートが収縮すると、それに伴ってグリーンシートの外表面に形成された配線パターンやビア等の導体が収縮方向へ移動するため、これら導体が焼成セッターの表面と擦れ合いながら移動することになる。ここで、特許文献1に開示された従来技術のように、焼成セッターの表面に規則性をもった凹凸が設けられていると、グリーンシートと焼成セッターの接着を抑制することは可能であるが、焼成時に収縮する導体の表面に焼成セッターの凸部と擦れ合う擦れ傷や、擦れによる導体の変形が発生し易くなり、このことがキズ不良を含めて製品の歩留まりを低下させる大きな要因となっていた。   By the way, in the manufacturing process of the ceramic laminated substrate described above, when the green sheet contracts during firing, the conductors such as wiring patterns and vias formed on the outer surface of the green sheet move in the contracting direction. It moves while rubbing against the surface of the firing setter. Here, as in the conventional technique disclosed in Patent Document 1, if irregularities having regularity are provided on the surface of the firing setter, it is possible to suppress adhesion between the green sheet and the firing setter. In addition, the surface of the conductor that shrinks during firing is likely to be rubbed against the convex part of the firing setter, and the conductor is likely to be deformed by rubbing, and this is a major factor that reduces the yield of products, including flaws. It was.

本発明は、このような従来技術の実情に鑑みてなされたもので、その第1の目的は、セラミック積層基板の外表面に露出する導体に擦れ傷や擦れに伴う変形等のキズ不良が発生しにくい焼成セッターを提供することにあり、第2の目的は、そうした導体のキズ不良を低減することができるセラミック積層基板の製造方法を提供することにある。   The present invention has been made in view of the actual situation of the prior art, and the first object thereof is that the conductor exposed on the outer surface of the ceramic multilayer substrate has scratches such as scratches and deformation caused by the scratches. A second object of the present invention is to provide a method for manufacturing a ceramic laminated substrate that can reduce the defect of such conductors.

上記第1の目的を達成するために、本発明は、外表面に導体が形成されたセラミック積層基板を載置した状態で該セラミック積層基板の焼成処理を行う焼成セッターにおいて、前記セラミック積層基板との接触面に複数の凸部が設けられており、これら凸部が前記セラミック積層基板の焼成時の収縮に伴う前記導体の移動軌跡と干渉しない位置に配列されているという構成にした。   In order to achieve the first object, the present invention provides a firing setter for firing a ceramic multilayer substrate in a state where a ceramic multilayer substrate having a conductor formed on the outer surface is placed. A plurality of protrusions are provided on the contact surface, and these protrusions are arranged at positions that do not interfere with the movement trajectory of the conductor accompanying shrinkage during firing of the ceramic laminated substrate.

このような構成の焼成セッターを用いてセラミック積層基板の基板材料であるグリーンシートを焼成すると、グリーンシートと焼成セッターの接触面積が凸部によって低減されるため、グリーンシートが焼成セッターの表面に溶融接合してしまうことを防止でき、しかも、グリーンシートの外表面に露出する導体が焼成時の収縮に伴って位置変動しても、焼成セッターの凸部が導体の移動軌跡と干渉しない位置に配列されているため、焼成時に発生する導体の擦れ傷や、擦れによる導体の変形を低減することができる。   When the green sheet, which is the substrate material of the ceramic laminated substrate, is fired using the fired setter having such a configuration, the contact area between the green sheet and the fired setter is reduced by the convex portion, so that the green sheet melts on the surface of the fired setter. Even if the conductor exposed on the outer surface of the green sheet can change its position due to shrinkage during firing, the firing setter's convex part can be arranged at a position where it does not interfere with the movement trajectory of the conductor. For this reason, it is possible to reduce the scratches on the conductor that occur during firing and the deformation of the conductor due to the friction.

この場合において、セラミック積層基板がLTCC基板であると共に、焼成セッターの基材がアルミナ成分とガラス成分を含有する材料で構成されており、このガラス成分の配合比率が10〜20%の範囲に設定されていることが好ましい。このような構成を採用すると、焼成セッターがLTCC基板の基板材料であるグリーンシートと同じアルミナ成分とガラス成分で構成されるため、安価に焼成セッターを作製することが可能になり、しかも、焼成セッターのガラス成分の配合比率が10〜20%とLTCC基板に比べてかなり低く設定されているため、焼成時にLTCC基板側と焼成セッター側のガラス成分が溶融して接着することを防止できる。   In this case, the ceramic laminated substrate is an LTCC substrate, and the base material of the firing setter is made of a material containing an alumina component and a glass component, and the blending ratio of the glass component is set to a range of 10 to 20%. It is preferable that By adopting such a configuration, since the firing setter is composed of the same alumina component and glass component as the green sheet that is the substrate material of the LTCC substrate, it becomes possible to produce the firing setter at low cost, and the firing setter. Since the blending ratio of the glass component is set to be 10 to 20%, which is considerably lower than that of the LTCC substrate, it is possible to prevent the glass components on the LTCC substrate side and the firing setter side from being melted and bonded during firing.

また、上記第2の目的を達成するために、本発明によるセラミック積層基板の製造方法は、グリーンシートを焼成するときに外表面の導体が収縮に伴って移動する軌跡を確認する軌跡確認工程と、前記軌跡確認工程で得られたデータに基づいて表面に複数の凸部が設けられた焼成セッターを加工するセッター加工工程と、前記セッター加工工程で得られた焼成セッターにグリーンシートを載置した状態でセラミック積層基板に焼成する基板焼成工程と、を備え、前記焼成セッターに設けられた前記凸部の配列パターンが前記基板焼成工程での収縮に伴って移動する前記導体の軌跡と干渉しない位置に設定されているようにした。   In order to achieve the second object, the method for manufacturing a ceramic laminated substrate according to the present invention includes a locus confirmation step for confirming a locus on which the conductor on the outer surface moves with contraction when the green sheet is fired. A green sheet was placed on the setter processing step for processing the firing setter provided with a plurality of convex portions on the surface based on the data obtained in the locus confirmation step, and the firing setter obtained in the setter processing step. A substrate firing step for firing the ceramic laminated substrate in a state, and an arrangement pattern of the convex portions provided on the firing setter does not interfere with a locus of the conductor that moves with contraction in the substrate firing step It has been set to.

本発明は、自由収縮タイプのグリーンシートは焼成時に中心に向かって放射状に収縮していく特性があることに着目し、例えばCAD(Computer Aided Design)を用いて収縮前後の導体配置を結ぶ軌道の確認データを取得した後、その取得データに基づいて複数の凸部が設けられた焼成セッターを作製するようにしたので、かかる焼成セッターにグリーンシートを載置して焼成するとき、グリーンシートの外表面に露出する導体が焼成時の収縮に伴って位置変動しても、導体は焼成セッターの凸部と接触することなく収縮方向へ移動する。したがって、グリーンシートと焼成セッターの接触面積を凸部によって低減した上で、焼成時に発生する導体の擦れ傷や、擦れによる導体の変形を低減することができ、表面平滑性を確保するために必要とされる最終工程の研磨を省略することができる。このように、導体のキズ不良を低減して歩留まりの良好なセラミック積層基板を製造することができる。   The present invention pays attention to the characteristic that a free contraction type green sheet has a characteristic of contracting radially toward the center during firing. For example, a CAD (Computer Aided Design) is used to connect a conductor arrangement before and after contraction. After obtaining the confirmation data, a firing setter having a plurality of projections was prepared based on the obtained data. When placing and firing a green sheet on the firing setter, Even if the conductor exposed on the surface fluctuates due to shrinkage during firing, the conductor moves in the shrinking direction without contacting the convex portion of the firing setter. Therefore, it is necessary to reduce the contact area between the green sheet and the firing setter with the convex part, and to reduce the scratches on the conductor that occur during firing and the deformation of the conductor due to the rubbing, and to ensure surface smoothness. It is possible to omit polishing in the final step. In this way, it is possible to manufacture a ceramic laminated substrate with a good yield by reducing the defect of conductors.

この場合において、セッター加工工程が、凸部に対応する開口が穿設された金属板を作製する工程と、この金属板と複数のグリーンシートを積層した状態で加圧することにより、該グリーンシートの一部を金属板の開口内に変位させて凸部付きシートを作製する工程と、この凸部付きシートを焼成して焼成セッターを作製する工程とを含んでいると、焼成セッターを簡単かつ安価に作製することができる。   In this case, the setter processing step includes a step of producing a metal plate in which an opening corresponding to the convex portion is formed, and pressurizing in a state where the metal plate and a plurality of green sheets are laminated. It includes a process of producing a sheet with a convex part by displacing a part into the opening of a metal plate and a process of producing a fired setter by firing this sheet with a convex part. Can be produced.

本発明の焼成セッターは、セラミック積層基板との接触面に複数の凸部が設けられているので、セラミック積層基板の基板材料であるグリーンシートが焼成セッターに溶融接合してしまうことを防止でき、しかも、グリーンシートの外表面に露出する導体が焼成時の収縮に伴って位置変動しても、焼成セッターの凸部が導体の移動軌跡と干渉しない位置に配列されているため、焼成時に発生する導体の擦れ傷や、擦れによる導体の変形を低減することができる。   Since the firing setter of the present invention is provided with a plurality of convex portions on the contact surface with the ceramic laminated substrate, the green sheet as the substrate material of the ceramic laminated substrate can be prevented from being melt-bonded to the firing setter, In addition, even if the conductor exposed on the outer surface of the green sheet fluctuates due to shrinkage during firing, the convex portions of the firing setter are arranged at positions that do not interfere with the movement locus of the conductor. It is possible to reduce the abrasion of the conductor and the deformation of the conductor due to the abrasion.

また、本発明によるセラミック積層基板の製造方法は、グリーンシートの外表面の導体が焼成に伴って収縮する前後の移動軌跡を予めデータとして取得しておき、このデータに基づいて複数の凸部が設けられた焼成セッターを作製するようにしたので、かかる焼成セッターを用いて実際にグリーンシートを焼成するとき、導体が焼成時の収縮に伴って位置変動しても、導体は焼成セッターの凸部と接触することなく収縮方向へ移動する。したがって、グリーンシートと焼成セッターの接触面積を凸部によって低減した上で、焼成時に発生する導体の擦れ傷や、擦れによる導体の変形を低減することができ、導体のキズ不良を低減して歩留まりの良好なセラミック積層基板を製造することができる。   Further, in the method for manufacturing a ceramic laminated substrate according to the present invention, the movement trajectory before and after the conductor on the outer surface of the green sheet contracts as it is fired is acquired as data in advance, and a plurality of convex portions are formed based on this data. Since the firing setter provided was prepared, when the green sheet was actually fired using such a firing setter, even if the conductor was displaced due to shrinkage during firing, the conductor was a convex part of the firing setter. It moves in the contraction direction without touching. Therefore, the contact area between the green sheet and the firing setter can be reduced by the convex portion, and the conductor can be scratched during firing and the deformation of the conductor due to rubbing can be reduced. Can be manufactured.

実施形態例に係るセラミック積層基板の焼成工程を示す説明図である。It is explanatory drawing which shows the baking process of the ceramic laminated substrate which concerns on the example of embodiment. 図1の焼成工程におけるグリーンシートの収縮状態を示す説明図である。It is explanatory drawing which shows the contraction state of the green sheet in the baking process of FIG. 実施形態例に係るセラミック積層基板の製造工程を示すフローチャートである。It is a flowchart which shows the manufacturing process of the ceramic laminated substrate which concerns on the embodiment. 図3中のセッタ加工工程における焼成セッターの作製工程を示す説明図である。It is explanatory drawing which shows the preparation process of the baking setter in the setter processing process in FIG.

発明の実施の形態について図面を参照して説明すると、図1に示すように、本実施形態例に係る焼成セッター1は、セラミック積層基板であるLTCC基板2との接触面に複数の凸部3が設けられており、この焼成セッター1を用いてLTCC基板2が製造されるようになっている。   DESCRIPTION OF EMBODIMENTS An embodiment of the invention will be described with reference to the drawings. As shown in FIG. 1, a fired setter 1 according to this embodiment example has a plurality of convex portions 3 on a contact surface with an LTCC substrate 2 that is a ceramic laminated substrate. The LTCC substrate 2 is manufactured using the firing setter 1.

LTCC基板2の基板材料であるグリーンシート4は、アルミナ成分とガラス成分を含む原料粉末にバインダーや溶剤等を混練してスラリーを作り、これをドクターブレード成形機を用いてシート状に成形したものであり、アルミナ成分とガラス成分の配分比率は5対5となっている。そして、このグリーンシート4にAgペーストの印刷や孔開け加工をして導体5を形成した後、そのグリーンシート4を焼成セッター1に複数積層した状態で焼成炉内に搬入し、これを約830℃〜870℃で焼成することによってLTCC基板2が製造される。   The green sheet 4 which is a substrate material of the LTCC substrate 2 is a material obtained by kneading a binder or a solvent with raw material powder containing an alumina component and a glass component, and forming this into a sheet using a doctor blade molding machine. The distribution ratio of the alumina component and the glass component is 5 to 5. The conductor 5 is formed by printing or punching Ag paste on the green sheet 4, and then loaded into a firing furnace in a state where a plurality of the green sheets 4 are stacked on the firing setter 1. The LTCC substrate 2 is manufactured by baking at a temperature of 870C to 870C.

焼成セッター1はアルミナ成分とガラス成分を含有する複数のグリーンシートを積層して焼成したものであり、そのグリーンシートにおけるアルミナ成分とガラス成分の配分比率は9対1〜8対2の範囲、つまりアルミナ成分に対するガラス成分の配合比率が10〜20%の範囲に設定されている。このように焼成セッター1はLTCC基板2と同様のグリーンシートを焼成して構成されたものであるが、そのグリーンシートにおけるガラス成分の配合比率がLTCC基板2のグリーンシート4に比べてかなり小さい値に設定されている。   The firing setter 1 is obtained by laminating and firing a plurality of green sheets containing an alumina component and a glass component, and the distribution ratio of the alumina component and the glass component in the green sheet is in the range of 9: 1 to 8: 2, that is, The compounding ratio of the glass component to the alumina component is set in the range of 10 to 20%. In this way, the firing setter 1 is configured by firing the same green sheet as the LTCC substrate 2, but the mixing ratio of the glass components in the green sheet is considerably smaller than the green sheet 4 of the LTCC substrate 2. Is set to

焼成セッター1にグリーンシート4を載置して焼成すると、グリーンシート4は図1の矢印方向に移動して破線で示す状態に収縮する。ここで、図2に示すように、焼成前のグリーンシート2の実線で示す位置にそれぞれ導体5a,5b,5cが形成されていると、焼成後のグリーンシート2は中心Oに向かって破線で示すように収縮し、それに伴って各導体5a,5b,5cもそれぞれ中心Oに向かって破線で示す位置まで移動する。なお、図2では導体5(5a,5b,5c)としてAgビアを例示して説明したが、配線パターンやランド等の他の導体5についても同様に収縮する。そして、これら導体5(5a,5b,5c)の収縮前後の移動軌跡を見越して、焼成セッター1に導体の軌跡を避けた位置に複数の凸部3が形成されており、具体的には、導体5a,5b,5cが収縮前後で図2の実線位置から破線位置まで移動する線上に凸部3は形成されておらず、それ以外の領域に複数の凸部3がバランス良く配列されている。   When the green sheet 4 is placed on the firing setter 1 and fired, the green sheet 4 moves in the direction of the arrow in FIG. Here, as shown in FIG. 2, when the conductors 5a, 5b, and 5c are formed at the positions indicated by the solid lines of the green sheet 2 before firing, the green sheet 2 after firing is indicated by a broken line toward the center O. As shown, the conductors 5a, 5b, and 5c move toward the center O to the positions indicated by broken lines. In FIG. 2, the Ag via is exemplified as the conductor 5 (5a, 5b, 5c), but the other conductor 5 such as a wiring pattern or a land contracts similarly. And in anticipation of the movement trajectory before and after the contraction of these conductors 5 (5a, 5b, 5c), a plurality of convex portions 3 are formed at positions avoiding the conductor trajectory on the firing setter 1, specifically, The convex portions 3 are not formed on the line where the conductors 5a, 5b, and 5c move from the solid line position to the broken line position in FIG. 2 before and after contraction, and a plurality of convex portions 3 are arranged in a balanced manner in other regions. .

次に、本実施形態例に係るLTCC基板2(セラミック積層基板)の製造方法を図3と図4を参照しつつ説明する。   Next, a manufacturing method of the LTCC substrate 2 (ceramic multilayer substrate) according to this embodiment will be described with reference to FIGS.

まず、図3のステップS−1で示すように、LTCC基板2の基板材料であるグリーンシート4を焼成するときに外表面の導体5が収縮に伴って移動する軌跡を確認する(軌跡確認工程)。この軌跡確認工程では、例えばCADの同一画面上に収縮前と収縮後の導体位置を表示し、収縮前後の導体配置を直線で結ぶことによって軌道の確認データを取得する。   First, as shown in step S-1 of FIG. 3, when the green sheet 4 that is the substrate material of the LTCC substrate 2 is baked, the locus on which the conductor 5 on the outer surface moves as the shrinkage is confirmed (trajectory confirmation step). ). In this trajectory confirmation step, for example, the conductor positions before and after contraction are displayed on the same CAD screen, and the confirmation data of the trajectory is obtained by connecting the conductor arrangement before and after contraction with a straight line.

次に、図3のステップS−2で示すように、ステップS−1で取得されたCADデータに基づいて、表面に複数の凸部3が設けられた焼成セッター1を作製する(セッター加工工程)。このセッター加工工程では、図4(a)に示すように、CADデータに基づいて凸部3の形成位置や形状(円形、四角形、三角形等)あるいは大きさ等を導体5の収縮軌道に合わせて最適に設定した加工データを作成し、この加工データを用いて凸部3に対応する開口が穿設された樹脂フィルム6と、凸部3に対応する開口が穿設された金属板7とをそれぞれ作製する。ここで、樹脂フィルム6にはPET,PP,PE等の剥離性に富んだ材質が用いられ、金属板7にはSUS等の耐食性に優れた材料が用いられ、両者の加工方法には金型、ドリル、レーザー、エッチング等が適宜用いられる。   Next, as shown in step S-2 of FIG. 3, based on the CAD data acquired in step S-1, a firing setter 1 having a plurality of convex portions 3 provided on the surface is prepared (setter processing step). ). In this setter processing step, as shown in FIG. 4A, the formation position, shape (circular, square, triangular, etc.) or size of the convex portion 3 is adjusted to the contraction trajectory of the conductor 5 based on CAD data. The processing data set optimally is created, and using this processing data, the resin film 6 having an opening corresponding to the convex portion 3 and the metal plate 7 having an opening corresponding to the convex portion 3 are formed. Make each. Here, the resin film 6 is made of a material having excellent releasability such as PET, PP, and PE, and the metal plate 7 is made of a material having excellent corrosion resistance such as SUS. Drill, laser, etching, etc. are used as appropriate.

そして、SUS等からなる下部平滑板8上に離型のためのPETフィルム9を重ね、その上に焼成セッター1の基材である前述のグリーンシート10を所定の枚数重ね、さらに最上層のグリーンシート10に樹脂フィルム6と金属板7を順次重ね合わせる。最後に、金属板7の上に離型のためのPETフィルム11とSUS等からなる上部平滑板12を重ねた状態で、図4(b)に示すように、上部平滑板12を下部平滑板8側に向けて所定の圧力(例えば50MPa)で加圧すると、図4(c)に示すように、グリーンシート10の一部が金属板7と樹脂フィルムの開口内に変位する。しかる後、図4(d)に示すように、上下の平滑板8,12とPETフィルム9,11を離型して凸部付きシート13を作製し、この凸部付きシート13を850℃〜900℃で焼成することにより、表面に複数の凸部3が設けられた前述の焼成セッター1を作製する。なお、金属板7と下部平滑板8および上部平滑板12に離型剤を塗布等の手段を用いて付着しておけば、樹脂フィルム6や上下のPETフィルム9,11を省略することができる。   Then, a PET film 9 for mold release is overlaid on the lower smooth plate 8 made of SUS or the like, and a predetermined number of the above-mentioned green sheets 10 that are the base material of the firing setter 1 are overlaid thereon. The resin film 6 and the metal plate 7 are sequentially stacked on the sheet 10. Finally, with the upper smooth plate 12 made of SUS or the like overlaid on the metal plate 7 with the PET film 11 for release, the upper smooth plate 12 is replaced with the lower smooth plate as shown in FIG. When a pressure is applied toward the side 8 at a predetermined pressure (for example, 50 MPa), as shown in FIG. 4C, a part of the green sheet 10 is displaced into the opening of the metal plate 7 and the resin film. Thereafter, as shown in FIG. 4 (d), the upper and lower smooth plates 8 and 12 and the PET films 9 and 11 are released to produce a sheet 13 with a convex portion. By baking at 900 degreeC, the above-mentioned baking setter 1 in which the some convex part 3 was provided in the surface is produced. The resin film 6 and the upper and lower PET films 9 and 11 can be omitted if the metal plate 7, the lower smooth plate 8 and the upper smooth plate 12 are attached by means such as applying a release agent. .

このようにしてセッター加工工程で焼成セッター1を作製した後、図3のステップS−3で示すように、この焼成セッター1にLTCC基板2の基板材料であるグリーンシート4を載置して焼成する(基板焼成工程)。この基板焼成工程において、凸部3が設けられた焼成セッター1の接触面に複数のグリーンシート4を積層載置し、この状態で約830℃〜870℃で焼成することによってLTCC基板2が製造される。その際、グリーンシート4の外表面に露出する導体5は焼成時の収縮に伴って位置変動するが、焼成セッター1の凸部3が導体5の移動軌跡と干渉しない位置に配列されているため、導体5は焼成セッター1の凸部3と接触することなく収縮方向へ移動する。したがって、グリーンシート4と焼成セッター1の接触面積を凸部3によって低減した上で、焼成時に発生する導体5の擦れ傷や、擦れによる導体の変形を低減することができ、導体5のキズ不良を低減して歩留まりの良好なLTCC基板2を製造することができる。   After producing the firing setter 1 in the setter processing step in this manner, as shown in step S-3 of FIG. 3, the green sheet 4 that is the substrate material of the LTCC substrate 2 is placed on the firing setter 1 and fired. (Substrate firing step). In this substrate firing step, a plurality of green sheets 4 are stacked on the contact surface of the firing setter 1 provided with the convex portions 3, and the LTCC substrate 2 is manufactured by firing at about 830 ° C. to 870 ° C. in this state. Is done. At that time, the conductor 5 exposed on the outer surface of the green sheet 4 changes in position with shrinkage during firing, but the convex portions 3 of the firing setter 1 are arranged at positions that do not interfere with the movement locus of the conductor 5. The conductor 5 moves in the shrinking direction without coming into contact with the convex portion 3 of the firing setter 1. Accordingly, the contact area between the green sheet 4 and the firing setter 1 can be reduced by the convex portion 3, and the scratches on the conductor 5 generated during firing and the deformation of the conductor due to the rubbing can be reduced. Thus, the LTCC substrate 2 having a good yield can be manufactured.

以上説明したように、本実施形態例に係る焼成セッター1は、LTCC基板2との接触面に複数の凸部3が設けられているので、焼成時にLTCC基板2の基板材料であるグリーンシート4が焼成セッター1の接触面に溶融接合してしまうことを防止でき、しかも、グリーンシート4の外表面に露出する導体5が焼成時の収縮に伴って位置変動しても、焼成セッター1の凸部3が導体5の移動軌跡と干渉しない位置に配列されているため、焼成時に発生する導体5の擦れ傷や、擦れによる導体の変形を低減もしくは完全になくすことができる。   As described above, the firing setter 1 according to the present embodiment has the plurality of convex portions 3 on the contact surface with the LTCC substrate 2, so that the green sheet 4 that is the substrate material of the LTCC substrate 2 at the time of firing. Can be prevented from being melt-bonded to the contact surface of the firing setter 1, and even if the conductor 5 exposed on the outer surface of the green sheet 4 fluctuates due to shrinkage during firing, the convexity of the firing setter 1 can be prevented. Since the portions 3 are arranged at positions where they do not interfere with the movement locus of the conductor 5, it is possible to reduce or completely eliminate the scratches on the conductor 5 that occur during firing and the deformation of the conductor due to rubbing.

また、本実施形態例に係る焼成セッター1では、焼成セッター1の基材がLTCC基板2と同様のグリーンシートを用いて構成され、そのグリーンシート10のアルミナ成分に対するガラス成分の配合比率が10〜20%の範囲に設定されているため、焼成セッター1を安価に作製することが可能になり、しかも、焼成セッター1のガラス成分の配合比率がLTCC基板2に比べてかなり低く設定されているため、焼成時にLTCC基板2側と焼成セッター1側のガラス成分が溶融して接着することを防止できる。   Moreover, in the firing setter 1 according to this embodiment, the base material of the firing setter 1 is configured using the same green sheet as the LTCC substrate 2, and the blending ratio of the glass component to the alumina component of the green sheet 10 is 10 to 10. Since it is set in the range of 20%, it becomes possible to produce the firing setter 1 at a low cost, and the blending ratio of the glass components of the firing setter 1 is set to be considerably lower than that of the LTCC substrate 2. The glass components on the LTCC substrate 2 side and the firing setter 1 side can be prevented from melting and adhering during firing.

また、本実施形態例に係るLTCC基板2の製造方法は、予めグリーンシート4の外表面の導体5が焼成に伴って収縮する前後の移動軌跡を確認データとして取得しておき、このデータに基づいて複数の凸部3が設けられた焼成セッター1を作製するようにしたので、かかる焼成セッター1を用いて実際にグリーンシート4を焼成するとき、導体5は焼成セッター1の凸部3と接触することなく収縮方向へ移動する。したがって、グリーンシート4と焼成セッター1の接触面積を凸部3によって低減した上で、焼成時に発生する導体4の擦れ傷や、擦れによる導体の変形を低減もしくは完全になくすことができ、導体5のキズ不良を低減して歩留まりの良好なLTCC基板2を製造することができる。   Moreover, the manufacturing method of the LTCC board | substrate 2 which concerns on this example embodiment acquires the movement locus | trajectory before and after the conductor 5 of the outer surface of the green sheet 4 shrink | contracts with baking as confirmation data beforehand, and is based on this data Since the firing setter 1 provided with a plurality of projections 3 is prepared, when the green sheet 4 is actually fired using the firing setter 1, the conductor 5 contacts the projections 3 of the firing setter 1. It moves in the contraction direction without doing. Accordingly, the contact area between the green sheet 4 and the firing setter 1 can be reduced by the convex portion 3, and the scratches on the conductor 4 generated during firing and the deformation of the conductor due to the rubbing can be reduced or completely eliminated. Thus, the LTCC substrate 2 having a good yield can be manufactured by reducing the scratch defects.

しかも、本実施形態例に係るLTCC基板2の製造方法では、焼成セッター1を加工するセッター加工工程が、凸部3に対応する開口が穿設された金属板7を作製する工程と、この金属板7と複数のグリーンシート10を積層した状態で加圧することにより、該グリーンシート10の一部を金属板7の開口内に変位させて凸部付きシート13を作製する工程と、この凸部付きシート13を焼成して焼成セッター1を作製する工程とを含んでいるため、焼成セッター1を簡単かつ安価に作製することができる。   And in the manufacturing method of the LTCC board | substrate 2 which concerns on this example of an embodiment, the setter processing process which processes the baking setter 1 produces the metal plate 7 in which the opening corresponding to the convex part 3 was pierced, and this metal. A step of producing a sheet 13 having a convex portion by displacing a part of the green sheet 10 into the opening of the metal plate 7 by pressurizing the plate 7 and the plurality of green sheets 10, and the convex portion. And the step of producing the fired setter 1 by firing the attached sheet 13, the fired setter 1 can be produced easily and inexpensively.

なお、上記実施形態例では、セラミック積層基板としてLTCC基板2を例示して説明したが、本発明による焼成セッターとセラミック積層基板の製造方法をHTCC(High Temperature Co-fired Ceramics)基板に適用することも可能である。   In the above embodiment, the LTCC substrate 2 is exemplified as the ceramic multilayer substrate. However, the firing setter and the method for manufacturing the ceramic multilayer substrate according to the present invention are applied to an HTCC (High Temperature Co-fired Ceramics) substrate. Is also possible.

1 焼成セッター
2 LTCC基板(セラミック積層基板)
3 凸部
4 グリーンシート
5,5a,5b,5c 導体
6 樹脂フィルム
7 金属板
8 下部平滑板
9,11 PETフィルム
10 グリーンシート
12 上部平滑板
13 凸部付きシート
1 Firing setter 2 LTCC substrate (ceramic laminated substrate)
DESCRIPTION OF SYMBOLS 3 Convex part 4 Green sheet 5, 5a, 5b, 5c Conductor 6 Resin film 7 Metal plate 8 Lower smooth plate 9,11 PET film 10 Green sheet 12 Upper smooth plate 13 Sheet with convex part

Claims (4)

外表面に導体が形成されたセラミック積層基板を載置した状態で該セラミック積層基板の焼成処理を行う焼成セッターにおいて、
前記セラミック積層基板との接触面に複数の凸部が設けられており、これら凸部が前記セラミック積層基板の焼成時の収縮に伴う前記導体の移動軌跡と干渉しない位置に配列されていることを特徴とする焼成セッター。
In a firing setter that performs firing treatment of the ceramic multilayer substrate in a state where the ceramic multilayer substrate having a conductor formed on the outer surface is placed,
A plurality of convex portions are provided on the contact surface with the ceramic multilayer substrate, and the convex portions are arranged at positions that do not interfere with the movement trajectory of the conductor accompanying shrinkage during firing of the ceramic multilayer substrate. Characteristic firing setter.
請求項1の記載において、セラミック積層基板がLTCC基板であると共に、前記焼成セッターの基材がアルミナ成分とガラス成分を含有する材料で構成されており、このガラス成分の配合比率が10〜20%の範囲に設定されていることを特徴とする焼成セッター。   2. The ceramic laminated substrate according to claim 1, wherein the ceramic laminated substrate is an LTCC substrate, the base material of the fired setter is made of a material containing an alumina component and a glass component, and the blending ratio of the glass component is 10 to 20%. A firing setter characterized by being set in a range of. グリーンシートを焼成するときに外表面の導体が収縮に伴って移動する軌跡を確認する軌跡確認工程と、
前記軌跡確認工程で得られたデータに基づいて表面に複数の凸部が設けられた焼成セッターを加工するセッター加工工程と、
前記セッター加工工程で得られた焼成セッターにグリーンシートを載置した状態でセラミック積層基板に焼成する基板焼成工程と、
を備え、前記焼成セッターに設けられた前記凸部の配列パターンが前記基板焼成工程での収縮に伴って移動する前記導体の軌跡と干渉しない位置に設定されていることを特徴とするセラミック積層基板の製造方法。
A locus confirmation step for confirming a locus where the conductor on the outer surface moves with contraction when firing the green sheet,
A setter processing step of processing a firing setter provided with a plurality of convex portions on the surface based on the data obtained in the locus confirmation step;
A substrate firing step for firing the ceramic laminated substrate in a state where a green sheet is placed on the firing setter obtained in the setter processing step;
The ceramic laminated substrate is characterized in that the arrangement pattern of the convex portions provided on the firing setter is set at a position that does not interfere with the locus of the conductor that moves with contraction in the substrate firing step. Manufacturing method.
請求項3の記載において、前記セッター加工工程が、前記凸部に対応する開口が穿設された金属板を作製する工程と、前記金属板と複数のグリーンシートを積層した状態で加圧することにより、該グリーンシートの一部を前記金属板の前記開口内に変位させて凸部付きシートを作製する工程と、前記凸部付きシートを焼成して前記焼成セッターを作製する工程とを含んでいることを特徴とするセラミック積層基板の製造方法。   4. The method according to claim 3, wherein the setter processing step includes a step of producing a metal plate in which an opening corresponding to the convex portion is formed, and pressurizing in a state where the metal plate and a plurality of green sheets are laminated. A step of displacing a part of the green sheet into the opening of the metal plate to produce a sheet with convex portions, and a step of firing the sheet with convex portions to produce the fired setter. A method for manufacturing a ceramic laminated substrate.
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