JP6179074B2 - Modules and electronics - Google Patents

Description

  The present invention relates to a module configured by connecting a plurality of substrates and an electronic apparatus on which the module is mounted.

  Conventionally, as a module, as disclosed in Patent Documents 1, 2, and 3, for example, a structure in which a sensor is mounted on each of a plurality of substrates and these substrates are coupled to each other is known. Yes. Sensors that detect angular velocity or acceleration are used. The substrates are connected to each other so that the sensors are in an orthogonal relationship. With such a structure structure, the sensor can accurately detect physical quantities such as angular velocity and acceleration around a predetermined axis.

Japanese Patent Laid-Open No. 7-306047 JP 2005-197493 A JP-A-11-211481

  However, in the conventional technology, considering the response of the sensor when vibration is input from the outside of the module, when vibration is input from the outside of the structure on which the sensor is mounted, each substrate constituting the structure In some cases, resonance occurs at a natural frequency determined by the material and shape. In this case, the vibration corresponds to, for example, pressure applied to the structure under the use environment, impact when the structure is dropped, or the like. Due to this resonance, the vibration of the sensor mounted on the substrate is attracted, and there is a risk of causing fluctuations in the sensor output. Furthermore, the higher the Q value of the natural vibration of the substrate, the larger the amplitude of resonance and the greater the influence on the sensor output. Further, when vibration sensors are provided on the respective substrates, there is a problem that vibration interference is caused between the vibration sensors and a stable sensor output cannot be obtained.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples or forms.

  Application Example 1 A module according to this application example includes a first substrate on which a first component is mounted, and a second substrate that is connected to intersect the first substrate and on which a second component is mounted. At least one of the first substrate and the second substrate is provided with a first vibration isolation unit and a second vibration isolation unit, and the first vibration isolation unit is at least one of the first component and the second component. Provided around one side, the second vibration isolation unit is provided around a connection portion of the first substrate and the second substrate.

  According to the module of this application example, the first vibration isolation unit and the second vibration isolation unit are provided in the periphery of the first component of the first substrate and the second component of the second substrate. The first vibration isolation unit is provided around either or both of the first component and the second component. For example, when the first vibration isolation unit is provided at the outer edge of the first component, so-called disturbance vibration or the like is generated in the first substrate. It plays the role of being trapped in. In addition, the second vibration isolation unit is provided around the connection portion between the first substrate and the second substrate, and suppresses the vibration of the first substrate from being transmitted to the second substrate and the vibration of the second substrate. For example, a disturbance vibration confined in the first substrate is suppressed from being transmitted to the second component through the second substrate. As described above, each of the first vibration blocking unit and the second vibration blocking unit blocks disturbance vibration and the like, thereby suppressing the influence of the vibration on the first component and the second component. As a result, the first component and the second component can exhibit the component function with almost no influence of vibration.

  Application Example 2 In the module according to the application example described above, the first vibration isolation unit and the second vibration isolation unit are in the form of a cutout shape, a groove shape, a through hole, and a via. Is preferred.

  According to this configuration, the first vibration isolation unit and the second vibration isolation unit may have various forms. For example, if the first vibration isolation unit is a notched first vibration isolation unit, the first substrate around the first component The second substrate around the second component is cut away and provided. And the 2nd vibration cutoff part is notched and provided around the connection part. The notched first vibration isolating portion and the second vibration isolating portion substantially block vibrations that affect the first component and the second component, and the first component and the second component have sufficient component functions. It is possible to demonstrate. In addition, even if the first vibration isolating portion and the second vibration isolating portion are in the form of a groove, a through hole, or a via, the first component and the second component are affected in the same manner as in the case of the notch shape. It is possible to cut off vibrations and the like.

  Application Example 3 In the module described in the application example, it is preferable that the first vibration isolation unit is provided along an outer edge of at least one of the first component and the second component.

  According to this configuration, if the first vibration isolating portion is provided around either the first component or the second component, or around each of the first component and the second component, the effect of isolating the vibration is provided. However, by providing along the outer edge of one or both of the first part and the second part, it is possible to further increase the effect of blocking vibration. In other words, even if the vibration that has reached the first vibration blocking portion provided along the outer edge is reflected or the like, all of the vibration goes in a direction away from the first component or the second component. The vibration is more reliably isolated from the parts.

  Application Example 4 In the module according to the application example, the second vibration isolation unit is provided in a cutout shape on an end surface of at least one of the connection portions of the first substrate and the second substrate. It is preferable.

  According to this configuration, the second vibration isolating portion is provided at the connection portion on either the first substrate or the second substrate, or on each of the first substrate and the second substrate, and has a notch shape. It is preferable that Due to the notched second vibration isolating portion, transmission of vibration from the first substrate to the second substrate or transmission of vibration from the second substrate to the first substrate is blocked. As a result, the influence of vibration from the second substrate is eliminated from the first component, and the influence of vibration from the first substrate is eliminated from the second component.

  Application Example 5 In the module according to the application example, the second vibration isolation unit is provided with a via or a through hole at a position overlapping the connection portion of the first substrate and the second substrate. It is preferable.

  According to this configuration, the second vibration blocking unit is preferably a via or a through hole. When the direction of the connection portion is viewed from the substrate side where the via or the through hole is provided, the via or the through hole and the connection portion are Is an overlapping form. By arranging the vias or the through holes in this way, the natural frequencies of the first substrate and the second substrate are different in the periphery of the connection portion, and the transmission of vibration from the first substrate to the second substrate or the first substrate Transmission of vibration from the two substrates to the first substrate is blocked. As a result, the influence of vibration from the second substrate is eliminated from the first component, and the influence of vibration from the first substrate is eliminated from the second component.

  Application Example 6 In the module according to the application example, the first vibration cutoff unit and the second vibration cutoff unit are provided on the same substrate, and the first vibration cutoff unit and the second vibration cutoff unit It is preferable that a bent portion is formed and an end surface of the bent portion is connected to the other substrate.

  According to this configuration, the vibration from the first substrate or the second substrate toward the connecting portion is transmitted along a curved path along the bent portion without being transmitted in a straight line. The bent portion refers to a substrate region around the connection portion of the first substrate or the second substrate other than the first vibration blocking portion and the second vibration blocking portion, and the substrate region is bent. It has become. That is, the peripheral shape of the connection portion of the first substrate or the second substrate forms a bent portion, and the end surface of the bent portion is arranged to be connected to the other substrate. Thereby, it is possible to effectively block the vibration from the first substrate or the second substrate toward the connection portion.

  Application Example 7 In the module described in the application example, it is preferable that the first component and the second component are at least one of a gyro sensor and an acceleration sensor.

  According to this configuration, since the module has a configuration that eliminates the influence of vibration on the first component and the second component, a gyro sensor or an acceleration sensor that is susceptible to vibration as the first component and the second component. Can be suitably used. In this case, if the gyro sensor and the acceleration sensor are vibration sensors, it is possible to prevent the vibration from being transmitted to other parts and affecting them.

  Application Example 8 An electronic apparatus according to this application example is characterized by mounting any one of the modules of the application example.

  According to the electronic apparatus of this application example, the above-described module is mounted, and such an electronic apparatus includes the first vibration isolation unit and the second vibration isolation unit on the first substrate and the second substrate, and the first component. And it is possible to suppress the influence of vibration on the second part. Thereby, the electronic device can exhibit the function of the device with almost no influence of vibration.

The perspective view which shows the external appearance of the module which concerns on this invention. The perspective view which shows the structure of the module seen from the connection part side. The perspective view which shows the bending-shaped part in a 2nd board | substrate. The perspective view which shows the via | veer in a connection part. The perspective view which shows the structure of the module seen from the 4th board | substrate side. The perspective view which shows the modification of a 1st vibration interruption part. (A) The perspective view which shows the video camera provided with the module, (b) The perspective view which shows the mobile telephone provided with the module.

Hereinafter, preferred examples of the module and electronic apparatus of the present invention will be described with reference to the accompanying drawings.
(Embodiment)

  FIG. 1 is a perspective view showing an external appearance of a module according to the present invention. As shown in FIG. 1, the module 1 is a hexahedron box, and the inside of the box is an accommodation space, and the interface board 7 on the bottom side in FIG. The first board 2, the second board 3, the third board 4 and the fourth board which are arranged between the top board 6 arranged opposite to each other and the interface board 7 and the top board 6 and constitute four side surfaces. 5. The first substrate 2, the second substrate 3, the third substrate 4, the fourth substrate 5, the top plate 6 and the interface substrate 7 can be formed of a ceramic plate or a resin plate in which a glass fiber is impregnated with a resin, Module 1 is formed of a ceramic plate.

  Here, the first substrate 2 and the third substrate 4 are arranged in parallel to face each other. Further, the second substrate 3 and the fourth substrate 5 are arranged in parallel to face each other. The second substrate 3 is sandwiched between the first substrate 2 and the third substrate 4 such that both end surfaces thereof are abutted at right angles to the first substrate 2 and the third substrate 4. Similarly, the fourth substrate 5 is sandwiched between both end surfaces of the first substrate 2 and the third substrate 4. Furthermore, the 1st board | substrate 2 has protruded to the box body outer side from the site | part with which the 2nd board | substrate 3 and the 4th board | substrate 5 contact | abut. Similarly, the third substrate 4 protrudes from the portion where the second substrate 3 and the fourth substrate 5 abut to the outside of the box.

  The top plate 6 and the interface board 7 are arranged in parallel to face each other, and each outline has a substantially rectangular shape with four corners cut out in an arc shape. The top plate 6 and the interface substrate 7 project from the first substrate 2, the second substrate 3, the third substrate 4, and the fourth substrate 5 to the outside of the box body, and the projecting portion has an arc-shaped cutout. Is formed. The overhang of the top plate 6 and the interface substrate 7 and the overhang of the first substrate 2 and the third substrate 4 have the same overhang length.

  Further, five conductive pads 10 are provided along the first substrate 2, the second substrate 3, the third substrate 4, and the fourth substrate 5 in the projecting portion of the interface substrate 7. The first substrate 2 is provided with five conductive pads 11 arranged so as to correspond one-to-one with the conductive pads 10 along the interface substrate 7. Corresponding conductive pads 10 and conductive pads 11 are joined by a conductive material 12. Similarly, the second substrate 3, the third substrate 4, and the fourth substrate 5 are each provided with five conductive pads 11, and the corresponding conductive pads 10 are joined by the conductive material 12.

  Further, the first substrate 2 and the second substrate 3 are each provided with five conductive pads 13 along the top plate 6. Although not shown, the third substrate 4 and the fourth substrate 5 are each 5. Two conductive pads 13 are provided. The conductive pad 13 is joined to a conductive pad (not shown) provided on the top plate 6 and corresponding to the conductive pad 13 by a conductive material (not shown). At the intersection of the second substrate 3 and the third substrate 4, one conductive pad 14 is provided at a substantially central position between the top plate 6 and the interface substrate 7 in the second substrate 3. One conductive pad 15 is provided on the substrate 4 side, and the conductive pad 14 and the conductive pad 15 are joined by the conductive material 12. The conductive pads 14 and 15 and the conductive material 12 are formed at the intersection of the first substrate 2 and the second substrate 3, the intersection of the first substrate 2 and the fourth substrate 5, and the third substrate 4 and the fourth substrate 5. It is provided in the same form at the intersection. The conductive pads 10, 11, 14, and 15 are preferably formed of a conductive metal material or the like. In this case, copper is used. As the conductive material 12, a solder material, a conductive adhesive, or the like is used. Here, a solder material is used.

  The notches (notches) 20, 30, the vias 40, and the connecting portions (connecting portions) 8 other than those described with reference to FIG. 1 will be described with reference to FIG. FIG. 2 is a perspective view showing the configuration of the module as seen from the connection portion side. In FIG. 2, the conductive material 12 is omitted, and the top plate 6 of the module 1 is removed so that the configuration of the housing space inside the box can be seen. As shown in FIG. 2, an electronic component group is housed in the housing space inside the box of the module 1. The electronic component group includes a vibration gyro sensor (first component, gyro sensor) 50 mounted on the storage space side of the first substrate 2 and a vibration gyro sensor (second component) mounted on the storage space side of the second substrate 3. , Gyro sensor) 60 and an arithmetic processing unit 70 mounted on the storage space side of the interface board 7. Although not shown here, electronic components can also be mounted on the top plate 6, the third substrate 4, and the fourth substrate 5.

  The vibration gyro sensors 50 and 60 can detect the angular velocity around the measurement axis from the vibration of the detection piece accompanying the vibration of the crystal vibration piece, as disclosed in, for example, Japanese Patent No. 3999377. That is, the vibration gyro sensors 50 and 60 include a pair of drive vibrating arms extending left and right along the X axis which is one direction from the base, and a pair extending from the base along the Y axis perpendicular to the X axis. And a detection vibrating arm. In the vibration-type gyro sensors 50 and 60 having such a configuration, the driving vibration arm is always driven in the X-axis direction, and is driven when rotation (angular velocity) is applied about the Z-axis orthogonal to the X-axis and the Y-axis. The vibrating arm receives Coriolis force in the Y-axis direction and vibrates along the Y-axis direction. As a result, the detection vibrating arm vibrates in the X-axis direction, and the charge generated by the vibration distortion is detected, whereby the angular velocity around the Z-axis can be detected.

Incidentally, the vibration gyro sensor 50, 60 is used quartz is piezoelectric material, other than quartz lithium niobate (LiNbO _3), it may be used lead zirconate titanate (PZT) or the like, piezoelectric It is also possible to use a non-piezoelectric material such as silicon or germanium instead of the functional material. As the first component and the second component, not only the vibration gyro sensors 50 and 60 but also an acceleration sensor or the like can be used.

  The arithmetic processing unit 70 is electrically connected to the gyro sensors 50, 60 through the conductive pads 10, 11, 13, 14, 15, etc., and supplies control signals to the gyro sensors 50, 60, etc. To control. The arithmetic processing unit 70 can exchange signals with the outside through a conduction hole, a wiring pattern, and a connector (not shown) formed in the interface board 7.

  In addition, the connection portion 8 here intersects the first substrate 2 on which the gyro sensor 50 as the first component is mounted and the second substrate 3 on which the gyro sensor 60 as the second component is abutted. That is, it is the end surface of the second substrate 3 abutted against the first substrate 2.

  In the module 1, in order to block the propagation of vibration from the first substrate 2 or the second substrate 3 to the gyro sensors 50, 60 and to block the vibration of the gyro sensors 50, 60 from propagating to other parts, A first vibration isolating portion is provided around each of the gyro sensors 50 and 60. The first vibration isolating portion around the gyro sensor 50 is located between the position where the first substrate 2 and the second substrate 3 intersect, that is, the connection portion 8 and the gyro sensor 50, and from the end surface in contact with the top plate 6. It has a notch 20a formed toward the interface substrate 7 and a notch 20a formed from the surface in contact with the interface substrate 7 toward the top plate 6. The two notches 20 a and 20 a are formed in pairs with the same length along a virtual straight line orthogonal to the top plate 6 and the interface substrate 7.

  In addition, the first vibration isolation unit is located between the position where the first substrate 2 and the fourth substrate 5 intersect with the gyro sensor 50, and from the surface in contact with the top plate 6 to the interface substrate 7 side. And a notch 20b formed toward the top plate 6 from the surface in contact with the interface substrate 7. The two cutouts 20 b and 20 b are formed in pairs with the same length along a virtual straight line orthogonal to the top plate 6 and the interface substrate 7.

  Further, the first vibration isolation unit includes a notch 20 c provided along the top plate 6 between the notch 20 a and the notch 20 b on the top plate 6 side of the first substrate 2, and an interface on the first substrate 2. A notch 20c provided along the interface substrate 7 is provided between the notch 20a and the notch 20b on the substrate 7 side. The two notches 20c and 20c are formed along three pads of the five pads of the conductive pad 11 or the conductive pad 13 except for both ends.

  Similarly, the first vibration isolation unit in the gyro sensor 60 is located between the position where the first substrate 2 and the second substrate 3 intersect, that is, the connection unit 8 and the gyro sensor 60, and is the same as the notch 20a. The two notches 20d formed in the form, the position where the second substrate 3 and the third substrate 4 cross each other, and the gyro sensor 60, are formed in the same form as the notch 20b. The cutouts 20e are provided, and two cutouts 20f are provided on the top board 6 side and the interface board 7 side of the second substrate 3 in the same form as the cutouts 20c. In the first vibration isolating portion having such a configuration, the notches 20a, 20b, 20c, 20d, 20e, and 20f are provided along the outer edge of the gyro sensor 50 that is the first part or the gyro sensor 60 that is the second part. ing. In this case, the vibration gyro sensors 50 and 60 have a rectangular shape when viewed from the first substrate 2 or the second substrate 3, and each side of the rectangle, that is, the outer edge, is parallel to the top plate 6 and the interface substrate 7. Or it is the arrangement which is orthogonal.

  Further, in the module 1, a second vibration blocking unit is provided around the connection unit 8 in order to block the propagation of vibration between the first substrate 2 and the second substrate 3. The second vibration isolating portion has a notch 30a located between the top plate 6 and the conductive pad 14, and a notch 30a located between the interface substrate 7 and the conductive pad 14. Yes. The two notches 30 a and 30 a are formed with the same length in the direction along the top plate 6 or the interface substrate 7 from the connection portion 8 of the second substrate 3. Further, the second vibration isolating part has vias 40 a, 40 a, 40 a that are three holes formed in the direction from the surface of the first substrate 2 to the connection part 8. These vias 40 a are formed with a substantially equal distance between the top plate 6 and the interface substrate 7. As described above, the second vibration isolation unit has the notch 30 a and the via 40 a provided from the first substrate 2 or the second substrate 3 toward the connection unit 8.

  The module 1 includes two notches 30b formed in the same form as the notches 30a on the second substrate 3 side at a portion where the second substrate 3 and the third substrate 4 intersect. In a portion where the first substrate 2 and the fourth substrate 5 intersect, a cutout 30c (partially not shown) is provided on the fourth substrate 5 side in the same form as the cutout 30a. Yes. The fourth substrate 5 is provided with a pair of notches 20g and 20g. Further, the module 1 has three holes formed in the direction from the surface of the first substrate 2 to the end surface of the fourth substrate 5 at a portion where the end surface of the fourth substrate 5 abuts against the first substrate 2 and intersects. Are formed in the direction from the surface of the third substrate 4 to the end surface of the second substrate 3 at a portion where the end surface of the second substrate 3 hits the third substrate 4 and intersects with the vias 40b, 40b, 40b. Vias 40c, 40c and 40c (not shown) which are three holes are provided. These vias 40 b and 40 c are formed with a substantially equal distance between the top plate 6 and the interface substrate 7.

  Next, the vibration blocking action and the effects of the first vibration blocking unit and the second vibration blocking unit will be described. First, vibration isolation around the vibration gyro sensors 50 and 60 by the first vibration isolation unit will be described. As described above, the first substrate 2 on which the vibration gyro sensor 50 is mounted is provided with the notches 20a, 20b, and 20c so as to surround the vibration gyro sensor 50. Thereby, the vibration and disturbance vibration of the vibration gyro sensor 50 are almost confined in the first substrate 2. Similarly, the second substrate 3 on which the vibration gyro sensor 60 is mounted is provided with notches 20d, 20e, and 20f, and the vibration and disturbance vibration of the vibration gyro sensor 60 are substantially confined in the second substrate 3. Will be.

  And the vibration interruption | blocking in the connection part 8 periphery is demonstrated. FIG. 3 is a perspective view showing a bent portion in the second substrate. FIG. 4 is a perspective view showing a via in the connection portion. 3 and 4, the top plate 6 is omitted. First, as shown in FIG. 3, the second substrate 3 has a notch 30 a that is a second vibration isolating portion formed along the direction parallel to the top plate 6 and the interface substrate 7 from the connection portion 8. Is provided. This notch 30a changes the natural frequency of the second substrate 3, makes it difficult for the first substrate 2 to resonate, reduces the contact area between the first substrate 2 and the second substrate 3, and reduces mutual vibration. Is difficult to communicate.

  In addition to the notch 30 a, the second substrate 3 around the connecting portion 8 has a notch 20 d that is a first vibration blocking portion formed along a direction orthogonal to the top plate 6 and the interface substrate 7. Is provided. Thereby, the area | region in the top plate 6 side of the 2nd board | substrate 3 is notched by the notch 20d and the notch 30a, and becomes the bending part 2a which is a bending area as shown with a broken line. Similarly, a region of the second substrate 3 on the interface substrate 7 side is cut out by a notch 20d and a notch 30a, and has a bent portion 2b as indicated by a broken line. In both of these bent portions 2a and 2b, vibration is less likely to be transmitted than in the linear region, and therefore vibration propagation between the first substrate 2 and the second substrate 3 is more effectively blocked. Thereby, the mutual vibrations of the vibration gyro sensor 50 and the vibration gyro sensor 60 are also prevented from interfering with each other, and a stable sensor output can be obtained.

  Further, as shown in FIG. 4, the connection portion 8 is provided with three vias 40a, 40a, and 40a as second vibration isolation portions. These vias 40a are cylindrical hole portions, and the vias 40a and the connection portions 8 appear to overlap each other when viewed in the direction of the connection portion 8 from the first substrate 2 side. In this case, the via 40 a has a form that penetrates the first substrate 2 and reaches the connection portion 8, but may be a form that is formed even in the second substrate 3. In this way, by forming the via 40a in the connection portion 8, the natural frequency of the first substrate 2 changes, and resonance with the second substrate 3 does not occur more, and the mutual relationship between the first substrate 2 and the second substrate 3 occurs. Vibration is difficult to be transmitted. Here, the via 40a serves only to cut off the vibration. However, the via 40a also serves as a conductive portion for connecting electronic components such as the vibration gyro sensors 50 and 60 and the arithmetic processing unit 70 in the housing space to the outside. May be.

  On the other hand, the portion where the first substrate 2 and the fourth substrate 5 other than the connecting portion 8 intersect and the periphery of the portion where the second substrate 3 and the third substrate 4 intersect also block the propagation of vibration. Yes. FIG. 5 is a perspective view showing the configuration of the module as viewed from the fourth substrate side. As shown in FIGS. 5 and 2, at the periphery where the first substrate 2 and the fourth substrate 5 intersect, the first substrate 2 has three vias 40b, 40b, 40b and a pair of cutouts 20b. , 20b, and notches 20g, 20g and notches 30c, 30c, which are paired with the fourth substrate 5, are provided. Further, in the periphery where the second substrate 3 and the third substrate 4 intersect, notches 20e and 20e and notches 30b and 30b that are paired with the second substrate 3 are provided. Two vias 40c (not shown) are provided. With such a configuration, vibration propagation is blocked between the first substrate 2 and the fourth substrate 5 and between the second substrate 3 and the third substrate 4 in substantially the same manner as the connecting portion 8, and the vibration gyro sensor. 50 and the vibration gyro sensor 60 are also prevented from interfering with each other, and a stable sensor output can be obtained.

  In the module 1, the portion where the first substrate 2 on which the vibration gyro sensor 50 is mounted and the second substrate 3 on which the vibration gyro sensor 60 is mounted is connected as the connection portion 8. If the intersecting board mounts a component at one intersection and can be read as the first board and the second board, it can be said that the three intersections function as a connecting portion. The notches 20a, 20b, and 20c provided around the vibration gyro sensor (first component) 50 and the notches 20d, 20e, and 20f provided around the vibration gyro sensor (second component) 60 are also described. It can be said that it functions as the first vibration blocking unit and is provided between the vibration gyro sensor 50 and the vibration gyro sensor 60.

  The main effects of the module 1 described above will be described. The module 1 includes a notch 20 (20a to 20g), a notch 30 (30a, 30b, 30c) and a via 40 between the vibration gyro sensor 50 of the first substrate 2 and the vibration gyro sensor 60 of the second substrate 3. (40a, 40b, 40c). The notch 20 is provided around the vibration gyro sensors 50, 60 and serves to block vibrations generated by the vibration gyro sensors 50, 60, vibrations transmitted to the vibration gyro sensors 50, 60, and the like. Further, the notch 30 and the via 40 serve to block vibration propagation between the first substrate 2 and the second substrate 3 and further serve to block vibration propagation to the first substrate 2 or the second substrate 3. . As a result, the module 1 can block the influence of vibration on the vibration gyro sensors 50 and 60, and the vibration gyro sensors 50 and 60 can function as a sensor with almost no influence of vibration. Is possible.

  Next, an electronic apparatus having a configuration using the module 1 will be described. FIG. 7A is a perspective view illustrating a video camera including a module, and FIG. 7B is a perspective view illustrating a mobile phone including the module. These electronic devices are equipped with a module 1. First, as shown in FIG. 7A, the video camera 300 includes an image receiving unit 301, an operation unit 302, an audio input unit 303, and a display unit 304. The video camera 300 includes the module 1, and can detect, for example, angular velocities around the X-axis and the Y-axis, exhibit a camera shake correction function, and can record a clear moving image.

  As shown in FIG. 7B, the mobile phone 400 includes a plurality of operation buttons 401, a display unit 402, a camera mechanism 403, and a shutter button 404. The cellular phone 400 includes the module 1 and can detect, for example, angular velocities around the X-axis and the Y-axis, so that the camera mechanism 403 can exhibit a camera shake correction function and can record a clear image. .

  Note that the electronic device including the module 1 is not limited to the video camera 300 and the mobile phone 400, and includes a navigation device, a vehicle body posture detection device, a game controller, a head mountain display, a pointing device, a cleaning robot, and the like.

  The module 1 and the electronic device described above are not limited to the form in each embodiment, and the same effect as the embodiment can be obtained even in the form of the following modification.

  (Modification 1) The notches 20 and 30 in the module 1 are not limited to the embodiment, and for example, have a form as shown in a perspective view of a modification of the first vibration isolation unit of FIG. May be. For example, the cutout 20d (FIGS. 2 and 3) formed in the second substrate 3 may be a bent cutout (first vibration blocking portion) 21 having a bent shape as shown in FIG. Further, a blocking hole (first vibration blocking portion) 22 that penetrates the second substrate 3 may be provided between the pair of bent notches 21 and 21. Thereby, the bent portions 2a and 2b described with reference to FIG. 3 are bent in a more complicated manner, and vibration propagation can be more reliably blocked. This can also be applied to other notches.

  (Modification 2) The crossing portions of the substrates in the module 1 cross at a right angle including the connecting portion 8, but may cross at an angle other than a right angle. Moreover, the both ends of the 1st board | substrate 2 and the 3rd board | substrate 4 do not need to overhang.

  (Modification 3) The first vibration cutoff unit and the second vibration cutoff unit are not limited to a notch shape or a via shape, and may be a groove shape, a through hole, or the like. The first vibration cutoff unit and the second vibration cutoff unit may be provided on either the first substrate 2 or the second substrate 3.

  (Modification 4) In FIG. 2, the vibration gyro sensor is mounted only on the first substrate 2 and the second substrate 3, but the vibration gyro is also disposed on any of the third substrate 4, the fourth substrate 5, and the top plate 6. A sensor may be mounted. Moreover, the structure which mounts an acceleration sensor instead of a vibration gyro sensor, and the mounting which mixed the vibration gyro sensor and the acceleration sensor may be sufficient.

  DESCRIPTION OF SYMBOLS 1 ... Module, 2 ... 1st board | substrate, 2a ... Bending-shaped part, 2b ... Bending-shaped part, 3 ... 2nd board | substrate, 4 ... 3rd board | substrate, 5 ... 4th board | substrate, 6 ... Top plate, 7 ... Interface board | substrate, 8 ... Connection part, 20a-20f ... Notch as first vibration isolation part, 20g ... Notch, 30a ... Notch as second vibration isolation part, 30b, 30c ... Notch, 40a ... Second vibration isolation part Vias, 40b, 40c ... vias, 50 ... vibrating gyro sensors as first components, 60 ... vibrating gyro sensors as second components, 70 ... arithmetic processing units, 300 ... video cameras as electronic devices, 400 ... electronics Mobile phone as a device.

Claims (9)

A first substrate on which a rectangular first component having a first side and a second side in contact with each other is mounted;
A second substrate on which a rectangular second component having a third side and a fourth side connected to the first substrate and in contact with each other is mounted;
A third substrate connected to the first substrate and the second substrate,
A first vibration isolating portion is provided along the first side and the second side or the third side and the fourth side;
A second vibration isolating portion is provided at a connection portion between the second substrate and the first substrate of the first substrate or a connection portion between the first substrate and the second substrate of the second substrate; A module characterized by that. The module of claim 1, comprising:
The first vibration isolating portion provided on the first side or the third side is a connection portion between the third substrate and the first substrate of the first substrate or the third substrate of the second substrate. And a module connected to the second substrate. A module according to claim 1 or 2, wherein
The module, wherein the first vibration isolation unit and the second vibration isolation unit are in the form of a notch, a groove, a through hole, or a via. The module according to any one of claims 1 to 3,
The module, wherein the first vibration isolation unit is provided along a part of an outer edge of at least one of a region where the first component is mounted and a region where the second component is mounted. A module according to any one of claims 1-4,
The second vibration isolation unit includes an end surface of the first substrate at a connection portion between the first substrate and the second substrate and an end surface of the second substrate at a connection portion between the second substrate and the first substrate. A module characterized in that it is provided in a cutout shape on at least one side. A module according to any one of claims 1-4,
The second vibration isolating portion is provided with a via or a through hole at a contact position of a connection portion where either one of the first substrate and the second substrate is abutted against the other, and is connected. A module characterized by that. The module according to any one of claims 1 to 6,
At least one of the first substrate and the second substrate has a bent portion constituted by the first vibration blocking portion and the second vibration blocking portion, and an end surface of the bent portion is connected to the other substrate. A module characterized by that. A module according to any one of claims 1 to 7,
The module, wherein the first part and the second part are at least one of a gyro sensor and an acceleration sensor.   An electronic apparatus comprising the module according to any one of claims 1 to 8.

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