JP6187568B2 - Laminated body for electromagnetic wave shield, electromagnetic wave shield laminated body, electronic device and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electromagnetic wave shielding laminate. In addition, the present invention relates to an electromagnetic wave shielding laminate, an electronic device, and a method for manufacturing the same, using the aforementioned electromagnetic shielding laminate.

  Various electronic devices such as portable terminals, PCs, servers, and the like incorporate a substrate such as a flexible printed wiring board. These substrates are usually provided with an electromagnetic shielding structure in order to prevent malfunctions due to external magnetic fields and radio waves and to reduce unnecessary radiation from electrical signals.

  In patent document 1, the structure which provides the shield layer which laminated | stacked the cover film, the metal thin film layer, and the adhesive bond layer in this order as a shield film used for a flexible printed wiring board is disclosed. One end of this shield film is provided with conductive bumps, protrusions or metal fillers that are pressed against the cover film so as to be electrically connected to the above-mentioned shield layer, and are exposed in the vicinity of the other end. The structure which provides the ground member formed so that connection to the ground part of this is possible is disclosed. Moreover, a window part is provided on the cover film of the shield film by an excimer laser, a ground member is connected to the window part via a conductive adhesive, and the other end of the ground member is connected to a nearby ground part. A structure is disclosed.

  In Patent Document 2, a flexible flat cable in which a signal conductor and a ground conductor are formed on a base film and covered with an insulating film is sandwiched between shield films, and one of the shield films is connected to an external ground member. A structure that is thermocompression bonded to a conductive member has been proposed. The conductive member includes a metal layer (not shown) for connecting to the external ground member and a conductive adhesive layer containing conductive particles in contact. A shield film consists of a laminated body of an adhesive layer, an intervening layer, an adhesive layer, a metal thin film layer, and a cover film. When the conductive member is thermocompression bonded to the shield film, the conductive particles break through the cover film, and the conductive member and the shield film are electrically connected. The ground conductor of the flexible flat cable is connected to an external ground member such as a casing of an electronic device to be incorporated, and the ground conductor and the conductive member have the same ground potential.

Japanese Patent No. 3434021 JP 2011-66329 A

  With the recent increase in signal speed and reduction in the size of devices, the separation distance between wires has become narrower, and the technology and electromagnetic compatibility (Electromagnetic Compatibility) (Electro Magnetic Interference (EMI)) can be more effectively prevented. There is a need for a technique for improving EMC)).

In the shield film of Patent Document 1, since conductive bumps, protrusions, or metal fillers that are pressed against the cover film and penetrate the cover film are provided, the film thickness of the cover film, the size of the metal filler, the bonding conditions, etc. are precise. There was a problem in reliability. Further, in the method using an excimer laser, it is necessary to precisely control the irradiation conditions so as not to cause a window opening defect.
Also, in the shield wiring board of Patent Document 2, it is necessary to make the layer thickness thinner than the average protruding length of the conductive particles, and the particle size of the conductive particles, the thermocompression bonding conditions, the thickness of the cover film, etc. are precisely controlled. There was a problem in reliability. In addition, it is necessary to secure a structure and a region for connecting the ground conductor of the flexible flat cable to the external housing.

  The present invention has been made in view of the above-described background, and the object of the present invention is to provide a ground connection structure in the thickness direction of the electromagnetic wave shielding laminate, and to set an arbitrary position on the surface of the electromagnetic wave shielding laminate. It is constructed so that it can be securely connected to the ground, improving the degree of freedom in circuit design, ensuring the ground connection, the reliability of the ground connection and the insulation reliability of the insulating layer, the electromagnetic shielding laminate, It is an object of the present invention to provide an electronic device excellent in electromagnetic wave shielding properties that can be miniaturized using the laminated body for electromagnetic wave shielding and a method for manufacturing the same.

  As a result of extensive studies by the present inventors, it has been found that the problems of the present invention can be solved in the following modes, and the present invention has been completed.

  The laminate for electromagnetic wave shielding according to the present invention is formed by laminating a conductive adhesive layer (I) and an insulating layer having a through hole, and the conductive adhesive layer (I) is a binder resin that is softened by heat, It contains a conductive filler, and the opening area ratio of the through hole of the insulating layer is 0.001 to 40%.

  An electromagnetic wave shield laminate according to the present invention is an electromagnetic wave shield laminate for grounding a ground circuit formed on a substrate and a grounding part on a housing side, wherein the substrate on which a circuit pattern including the ground circuit is formed is provided. And an opening and an insulating protective film that insulates and protects the circuit pattern, and an electromagnetic wave shielding layer and an insulating layer having a through hole are laminated in this order on the insulating protective film, and the insulating layer penetrates the insulating layer. The opening area ratio of the hole is 0.001 to 40%, and the electromagnetic wave shielding layer and the ground circuit are electrically connected through the opening provided in the insulating protective film, and penetrates the insulating layer. It contains a binder resin that is softened by heat and a conductive filler so that the electromagnetic shielding layer and the grounding portion are electrically connected through a hole, and the electromagnetic shielding layer by thermocompression bonding. A conductive adhesive layer serving Te (I), a laminate obtained by laminating an insulating layer having the through-hole.

  An electronic device according to the present invention is an electronic device in which a substrate with an electromagnetic wave shielding layer is joined to a housing by a ground portion, and a circuit pattern including a ground circuit is insulated and protected on the substrate. An insulating protective film that is laminated on the insulating protective film, is electrically connected to the ground circuit through an opening provided in the insulating protective film, and shields the circuit pattern, and the electromagnetic wave shield An insulating layer formed on the layer, having a through hole and having an opening area ratio of the through hole of 0.001 to 40%, and the casing is electrically connected by thermocompression bonding, and the ground The electromagnetic shielding layer has a grounding portion for grounding a circuit, and the electromagnetic wave shielding layer is formed by thermocompression bonding of a binder resin softened by heat and a conductive adhesive layer (I) containing a conductive filler. Having a layer that forms.

A method for manufacturing an electronic device according to the present invention is a method for manufacturing an electronic device in which a substrate with an electromagnetic wave shielding layer is bonded to a housing,
On the substrate on which a circuit pattern including a ground circuit is formed, the circuit pattern is protected, and an insulating protective film having an opening is formed on at least a part of the ground circuit,
Laminating a binder resin softened by heat, a conductive adhesive layer (I) containing a conductive filler, and an insulating layer having a through hole and an opening area ratio of the through hole of 0.001 to 40% A laminated body for electromagnetic wave shielding,
After the conductive adhesive layer (I) is disposed on the insulating protective film so as to be on the lower layer side, the electromagnetic wave shielding laminate is thermocompression bonded to form an electromagnetic wave shielding layer,
Furthermore, a ground part having a conductive adhesive layer (II) is placed on the insulating layer so that the conductive adhesive layer (II) is on the lower layer side, and is thermally bonded to the through hole of the insulating layer. In a method in which an adhesive layer (II) is introduced and a substrate with an electromagnetic wave shielding layer is joined to a housing so as to electrically connect the electromagnetic wave shielding layer and the ground portion through a through hole of an insulating layer. is there.

According to the present invention, the ground connection structure is provided in the thickness direction of the substrate with the electromagnetic wave shielding layer, and the ground between the ground circuit in the substrate with the electromagnetic wave shielding layer and the ground portion provided at an arbitrary position on the surface of the substrate with the electromagnetic wave shielding layer is provided. Since the path is realized by the above-described ground connection structure, it is possible to realize downsizing and increase the degree of design freedom in the arrangement of the ground circuit of the substrate with the electromagnetic wave shielding layer. In addition, a large number of ground circuits can be formed inside the electromagnetic wave shield laminate, and the electromagnetic wave shielding effect can be improved more effectively.
According to the present invention, the ground connection structure is provided in the thickness direction of the substrate with the electromagnetic wave shield layer, and the ground connection can be made at an arbitrary position on the surface of the substrate with the electromagnetic wave shield layer. , Ground connection reliability, and insulation layer having a high insulation reliability, and an electromagnetic wave shielding laminate with excellent electromagnetic shielding properties that can be miniaturized using this electromagnetic shielding layered body The electronic device and its manufacturing method can be provided.

The typical sectional view of the important section of the electronic equipment with an electromagnetic wave shield layer concerning a 1st embodiment. The typical sectional view of each component of the electronic equipment with an electromagnetic wave shield layer concerning a 1st embodiment. The top view of the insulating layer which shows the formation form of a through hole. Manufacturing process sectional drawing of the electronic device with an electromagnetic wave shield layer which concerns on 1st Embodiment. The typical sectional view of the important section of the electronic equipment with an electromagnetic wave shield layer concerning a 2nd embodiment. Typical sectional drawing of the principal part of the electronic device with an electromagnetic wave shield layer which concerns on 3rd Embodiment. Typical sectional drawing of the principal part of the electronic device with an electromagnetic wave shield layer which concerns on 4th Embodiment.

  Hereinafter, an example of an embodiment to which the present invention is applied will be described. In addition, the size and ratio of each member in the following drawings are for convenience of explanation, and are not limited to this.

  The electronic device of the present invention is an electronic device in which a substrate with an electromagnetic wave shielding layer is bonded to a housing by a ground portion, and a circuit pattern including a ground circuit is insulated and protected on the substrate. An electromagnetic wave shielding layer that is laminated on the insulating protective film, is electrically connected to the ground circuit through an opening provided in the insulating protective film, and shields the circuit pattern; and And an insulating layer having a through hole and an opening area ratio of the through hole of 0.001 to 40%, and the casing is electrically connected by thermocompression bonding, and the ground circuit The electromagnetic wave shielding layer is formed by thermocompression bonding of a binder resin softened by heat and a conductive adhesive layer (I) containing a conductive filler. It characterized by having a layer.

[First Embodiment]
FIG. 1 is a schematic cross-sectional view of a main part of the electronic device according to the first embodiment. The electronic device 1 is obtained by bonding a substrate 30 with an electromagnetic wave shielding layer of an electronic device to a housing 40. As shown in FIG. 1, the circuit board 10, the electromagnetic wave shielding laminate 20, and a ground connected to the housing 40 are provided. Part 50 and the like.

<Circuit board>
As shown in FIG. 2C, the circuit board 10 includes a substrate 11 on which a circuit pattern 14 such as a signal circuit 12 and a ground circuit 13 is formed, an insulating protective film (cover lay) 15 covering these upper layers, and the like. Consists of. The substrate 11 is not particularly limited as long as it conforms to the gist of the present invention, and can be widely applied to a rigid substrate, a flexible substrate, a rigid flexible substrate, and the like. The formation method of the circuit pattern 14 is not specifically limited, A well-known method can be utilized.

  When a flexible printed circuit board is used as the substrate 11, for example, a structure in which an insulating base film having a thickness of about 5 to 100 μm and a circuit pattern 14 having a thickness of about 5 to 100 μm are bonded via an adhesive layer can be used. The material of the insulating base film is not particularly limited, and examples thereof include resins such as polyimide, polyamide, polyamideimide, polyetherimide, polybenzoxazole, polyethylene terephthalate, polyethylene naphthalate, polypropylene, and polyphenylene sulfide. The substrate 11 may be used in a bent state or the like.

  When a rigid substrate is used as the substrate 11, for example, a glass epoxy substrate, a glass composite substrate, a Teflon (registered trademark) substrate, a ceramic substrate, and the like can be given. An electronic element including an active element connected to the signal circuit 12 may be mounted on the substrate 11.

  The material of the circuit pattern 14 is not particularly limited, and examples thereof include metals such as Cu, Al, Au, Ag, Ni, Pd, Sn, Cr, W, Fe, Ti, and SUS materials, and conductive materials such as alloys thereof. The ground circuit 13 may be formed as long as an earth contact can be made to the conductive layer formed of the electromagnetic wave shielding laminate 20 and the conductive adhesive layer (II) 51 of the earth portion 50 provided on the surface of the electromagnetic shielding laminate. In addition to the surface of the substrate 11, the inside of the substrate or the back surface of the substrate may be used. The same applies to the formation position of the signal circuit 12.

  The insulating protective film 15 is not particularly limited as long as it has a role of protecting the circuit pattern 14, has an insulating property, and can withstand a thermocompression bonding process described later. Preferable examples include inorganic material films such as silicon oxide, silicon nitride, and nitrogen-containing silicon oxide, or organic material films such as polyimide resin and polybenzoxazole resin. A photosensitive resin composition containing a resin such as a polyimide precursor or a polybenzoxazole precursor, a photopolymerizable compound, a photopolymerization initiator, or the like may be used. The insulating protective film 15 may be a single layer, or a plurality of the same or different layers may be laminated. The insulating protective film 15 is provided with an opening 16 as an opening pattern in an upper layer of the ground circuit 13.

<Electromagnetic wave shield laminate>
The electromagnetic wave shield laminate 20 of the present invention is an electromagnetic wave shield laminate that grounds a ground circuit formed on a substrate and a grounding part on a housing side, and the substrate on which a circuit pattern including the ground circuit is formed is provided. And an opening and an insulating protective film that insulates and protects the circuit pattern, and an electromagnetic wave shielding layer and an insulating layer having a through hole are laminated in this order on the insulating protective film, and the insulating layer penetrates the insulating layer. The opening area ratio of the hole is 0.001 to 40%, and the electromagnetic wave shielding layer and the ground circuit are electrically connected through the opening provided in the insulating protective film, and penetrates the insulating layer. It contains a binder resin that is softened by heat and a conductive filler so that the electromagnetic shielding layer and the grounding portion are electrically connected through a hole, and the electromagnetic shielding layer by thermocompression bonding. A conductive adhesive layer serving Te (I), a laminate of an insulating layer having the through-hole.

Specifically, the electromagnetic wave shielding laminate 20 having the electromagnetic wave shielding layer 21 formed by thermocompression bonding of the conductive adhesive layer (I) 25 includes the electromagnetic wave shielding layer 21 and the insulating layer 22 having the through hole 24. As shown in FIG. 2 (b), it is formed using an electromagnetic wave shielding laminate 28 in which at least an electrically conductive adhesive layer (I) 25 and an insulating layer 22 having a through hole 24 are laminated.
The electromagnetic wave shielding layer 21 may be formed by laminating a single layer or multiple layers of a metal layer 21b such as a metal foil on the electromagnetic wave shielding layer 21a formed from the conductive adhesive layer (I) as shown in FIG. Good. By having the metal layer 21b which is a conductive layer such as a metal foil, the electromagnetic wave shielding property and the transmission characteristic against a high frequency signal of, for example, 100 MHz to 20 GHz are improved. The metal layer is preferably subjected to rust prevention treatment in order to suppress a decrease in conductivity due to oxidation. The rust prevention treatment can form an organic film with a benzotriazole reagent or the like, or can be plated with metal such as nickel, chromium or zinc, but metal plating is preferred from the viewpoint of oxidation resistance.

  Further, as will be described later, when the conductive adhesive layer (II) is caused to flow into the through hole of the insulating layer to be electrically connected to the ground portion 50 and electrically connected, the metal layer 21b is connected to the base of the insulating layer 22. In this case, the pressure at the time of thermocompression bonding is easily transmitted to the conductive adhesive layer (II), the inflow is promoted, and the electrical connection with the ground portion 50 can be ensured more reliably. In this case, the conductive adhesive layer (I) 25 may be anisotropic conductive that exhibits conductivity anisotropically in the Z-axis direction.

<Electromagnetic wave shielding layer>
The electromagnetic wave shielding layer 21 of the first embodiment has at least an electromagnetic wave shielding layer in which a binder resin softened by heat and a conductive adhesive layer (I) 25 containing a conductive filler are formed by thermocompression bonding.

  The electromagnetic wave shielding layer 21 serves to prevent electromagnetic waves generated from the circuit pattern 14 from leaking to the outside and to shield electromagnetic waves (noise) from the outside to the circuit. The electromagnetic wave shielding layer 21 is electrically connected to the ground circuit 13 through the opening 16 of the insulating protective film 15.

  The electromagnetic wave shielding layer 21 of the first embodiment is composed of a layer having a shielding effect obtained by thermocompression bonding of the conductive adhesive layer (I) 25. By the thermocompression bonding, the conductive adhesive layer (I) 25 can form the electromagnetic wave shielding layer 21, adhere to the ground circuit 13 and the insulating protective film 15, and make the ground circuit 13 and the electromagnetic wave shielding layer 21 conductive. The formation position of the electromagnetic wave shielding layer 21 is preferably disposed opposite the formation area of the circuit pattern 14 from the viewpoint of effectively exhibiting the shielding characteristics. From the viewpoint of preventing radiation and intrusion of electromagnetic waves from the end direction of the circuit pattern 14, it is more preferable to form the electromagnetic wave shielding layer 21 in a range wider than the formation area of the circuit pattern 14. However, the electromagnetic wave shielding layer 21 may not be disposed so as to face the entire formation region of the circuit pattern 14 depending on the application.

The conductive adhesive layer (I) 25 preferably has a flow amount of 0.005 mm or more and 2 mm or less when thermocompression bonding is performed at 150 ° C. and a pressure of 20 kg / cm ² for 30 minutes, 0.05 mm or more, 1 mm or less is more preferable, and 0.05 mm or more and 0.5 mm or less is more preferable. By setting it in the range of 0.005 mm or more and 2 mm or less, moderate fluidity is obtained to fill the opening 16. The flow amount refers to a length that protrudes from the side surface with respect to the original size of the conductive adhesive layer (I) 25 when the conductive adhesive layer (I) is pressure-bonded under the above conditions.

The temperature and pressure in the thermocompression bonding process of this manufacturing process do not need to be performed under the conditions of 150 ° C., 20 kg / cm ² , 30 minutes, depending on the heat resistance of components such as circuits, manufacturing equipment or needs, Each of the electromagnetic shielding layers 21 can be set independently and arbitrarily within a range in which the coverage of the electromagnetic shielding layer 21 can be ensured. It is preferable to set the temperature and pressure conditions so that a flow amount of 0.005 mm or more and 2 mm or less is obtained. The pressure range, the flow amount but is not limited, it is preferably a pressure to be obtained, preferably about 1 to 50 kg / cm ^2, about 5~30kg / cm ² is more preferable. The crimping time is preferably not limited to the time for obtaining the flow amount, but is preferably about 1 to 30 minutes.

  The thickness of the conductive adhesive layer (I) 25 is set so that the opening 16 can be filled with the conductive adhesive layer 25 and can be covered on the insulating protective film 15 in the thermocompression bonding step described later. . The thickness of the conductive adhesive layer (I) 25 is usually preferably about 1 to 100 μm, more preferably about 3 to 50 μm, although it may vary depending on the fluidity of the binder resin used and the size of the opening 16. More preferably, it is about 20 μm. As a result, it is possible to effectively exhibit electromagnetic wave shielding properties and achieve thinning while improving the covering property to the insulating protective film 15.

(Binder resin)
The binder resin constituting the conductive adhesive layer (I) 25 is a resin that is softened by heat, and Tg is preferably −20 ° C. or higher and 100 ° C. or lower, and more preferably −10 ° C. or higher and 80 ° C. or lower. One type of binder resin may be used or a plurality of types may be used in combination. In the case of using a plurality of types, it is preferable that the main component is Tg before mixing included in the above range. The material of the conductive adhesive layer (I) 25 is not particularly limited as long as it has a flowability that softens during thermocompression bonding and follows the surface of the opening 16, and has a conductive property that can exhibit electromagnetic shielding properties. .

  The binder resin in the composition for forming the conductive adhesive layer (I) 25 is not particularly limited as long as it does not depart from the gist of the present invention, but a thermosetting resin is preferable. In applications where there is no heating step such as a reflow step in the subsequent step, a thermoplastic resin is preferred. As the thermosetting resin, a self-crosslinking type and a curing agent reaction type can be used. As the curing agent reaction type binder resin, a thermosetting resin to which a reactive functional group capable of reacting with the curing agent is bonded is preferable.

  The thermosetting resin is preferably epoxy, acrylic, urethane, polystyrene, polycarbonate, polyamide, polyamideimide, polyesteramide, polyetherester, urethane urea, polyimide, or the like. The thermosetting resin usually has a functional group capable of self-crosslinking or a functional group capable of reacting with a curing agent. Among these, in consideration of severe conditions when manufacturing the electronic device 1 with an electromagnetic wave shielding layer (for example, at the time of reflow), the thermosetting resin is at least one of epoxy, epoxy ester, urethane, urethane urea, and polyamide. Preferably one is included. Moreover, if it is the range which can endure a heating process, a thermosetting resin and a thermoplastic resin can be used together.

(Curing agent)
The curing agent has a plurality of functional groups capable of reacting with the curable functional group. The curing agent is preferably an epoxy compound, an acid anhydride group-containing compound, an isocyanate compound, an aziridine compound, an amine compound such as dicyandiamide, an aromatic diamine, or a phenol compound such as a phenol novolac resin. It is preferable that 1-50 mass parts is contained with respect to 100 mass parts of thermosetting resins, 3-30 mass parts is more preferable, and 3-20 mass parts is further more preferable.

  The thermoplastic resin is preferably polyester, acrylic, polyether, urethane, styrene elastomer, polycarbonate, butadiene, polyamide, ester amide, isoprene, cellulose, or the like. Binder resins can be used alone or in combination.

(Conductive filler)
The conductive filler in the composition forming the conductive adhesive layer (I) 25 is not particularly limited as long as it has conductive properties and can exhibit electromagnetic wave shielding properties, but gold, silver, copper, aluminum, nickel, solder, etc. Examples thereof include metals and alloys thereof, conductive polymers, and carbon. Also suitable are silver-coated silver-coated copper fillers, particles obtained by subjecting resin particles or the like to metal plating, and the like. The conductive filler can be used alone or in combination. The shape of the conductive filler is not particularly limited, and examples thereof include a spherical shape, a flake shape, and a dendritic shape.

  The average particle diameter of the conductive filler is preferably designed as appropriate according to the thickness of the electromagnetic wave shielding layer 21 after thermocompression bonding. Preferably, a conductive filler having an average particle diameter of 0.05 to 2 times the thickness of the electromagnetic wave shielding layer 21 is preferably used. In addition, an average particle diameter is a numerical value which averaged about 10-20 from the enlarged image (for example, 1000 times-10,000 times) of the scanning electron microscope. When the length of the conductive filler is greatly different between the length direction and the lateral direction (when the aspect ratio is 1.5 or more), the average particle diameter is calculated in the length direction.

  The content of the conductive filler is only required to ensure the conductivity of the electromagnetic wave shielding layer 21, and may vary depending on the shape and type of the conductive filler to be used. Is preferable, and 40-90 mass parts is more preferable. By setting it as this range, the effect that it becomes easy to make electromagnetic shielding property and flow property compatible is acquired.

Furthermore, the composition constituting the conductive adhesive layer (I) 25 may contain a colorant, a flame retardant, an inorganic additive, a lubricant, an antiblocking agent, and the like.
Examples of the colorant include organic pigments, carbon black, ultramarine blue, petals, zinc white, titanium oxide, and graphite.
Examples of the flame retardant include a halogen-containing flame retardant, a phosphorus-containing flame retardant, a nitrogen-containing flame retardant, and an inorganic flame retardant.
Examples of the inorganic additive include glass fiber, silica, talc, and ceramic.

<Insulating layer>
By providing the insulating layer 22 on the surface of the electromagnetic wave shielding layer 21, the electromagnetic wave shielding layer 21 can be insulated and protected, and a short circuit at the time of contact with another conductive member can be prevented. The insulating layer 22 has a through hole 24 for electrically connecting the ground portion 50 to the electromagnetic wave shield layer 21, and the opening area ratio of the through hole is 0.001 to 40%. By setting the opening area ratio of the insulating layer to 0.001 to 40%, the ground connection reliability and the insulation reliability of the insulating layer can be improved. Preferably, it is 0.01 to 30%.
The opening area ratio can be adjusted from the area and the number of through holes. Further, the opening area ratio is obtained from the following formula 1.
(Formula 1)
Open area ratio (%)
= Through hole area per unit area / Non-penetrating area per unit area × 100

  Moreover, it is preferable to have a plurality of through holes. At this time, the opening area ratio of the insulating layer is preferably 0.1% or more, more preferably 1% or more, and further preferably 2% or more.

  FIG. 3 is a plan view of an insulating layer showing an example of a form of forming a through hole. FIG. 3A is a through hole 24a having a round plan shape, and FIG. 3B is a through hole having a mesh shape in a plan view. FIG. 24B and FIG. 3C show a through hole 24c having a rectangular planar shape. In the through hole 24a, the shape of the through hole is not limited to a circle, and any shape such as a square system, a triangle, an ellipse, and a star can be selected. Of the forms of the through holes, a round shape is preferable.

Through hole, if a round shape or the like, such as 24a, the number per unit area is preferably 1 to 10000 pieces / cm ^2, and more preferably 10 to 7,000 pieces / cm ^2.
Further, the average area value per through hole is preferably 0.001 to ³ mm2, and preferably 0.01 to
2 mm ² is more preferable.

In the case of the mesh-shaped through hole 24b and the rectangular through hole 24c, the width of the through hole is preferably 0.01 to 2 mm, and more preferably 0.1 to 1.5 mm.
By setting the number and area of the through holes in the above range, the insulation reliability of the insulating layer and the connection reliability of the ground portion can be further improved.

  As the binder resin and the curing agent constituting the insulating layer 22, the same ones as described in the electromagnetic wave shielding laminate can be used.

The through hole 24 is preferably formed on the entire surface of the insulating layer 22 or at least in the attachment region of the ground portion 50. The through hole 24 can be formed by, for example, punching, laser processing, or screen printing. Moreover, the through-hole 24 can be formed also by forming the coating film by coating using the insulating resin composition created with the photosensitive raw material, and exposing and developing.
Further, a protrusion having the same shape as the through hole is formed on the peelable film in advance, and the insulating resin composition is coated on the surface thereof, and the conductive adhesive layer (I) and the laminate for electromagnetic wave shielding are produced. Thereafter, when the peelable film on the insulating layer side is peeled off by bonding to the FPC, a through hole can be formed only in the protruding portion.
Regardless of the above method, for example, when coating a peelable film with an insulating resin composition to form a coating film, the surface tension of the peelable film and the surface tension and viscosity of the insulating resin composition are appropriately set. By adjusting, a plurality of through holes can be automatically formed on the coating film after coating.

  The thickness of the insulating layer 22 can be appropriately designed depending on the application, but from the viewpoint of insulation and thinning, the range of 3 to 50 μm is preferable, the range of 5 to 30 μm is more preferable, and the range of 7 to 20 μm is more preferable. By setting the thickness of the insulating layer in the range of 3 to 50 μm, the insulation reliability can be improved and the FPC can be made thin.

<Method for Producing Laminate for Electromagnetic Wave Shielding>
Although the formation method of the laminated body 28 for electromagnetic wave shields is not specifically limited, The following method can be mentioned as a preferable method.

FIG.2 (b) shows the manufacturing process sectional drawing for manufacturing the laminated body 28 for electromagnetic wave shields which concerns on 1st Embodiment.
As an example of the manufacturing method for manufacturing the electromagnetic wave shielding laminate 28 according to the first embodiment, first, a composition containing a binder resin that is softened by heat and a conductive filler on the release film 26. Coating is performed to form the conductive adhesive layer (I) 25 before thermocompression bonding. The conductive adhesive layer (I) 25 may be a single layer or a plurality of layers. In the case of forming with a plurality of layers, the outermost layer on the release film 26 side is preferably composed of a layer having higher fluidity. Separately, a composition containing an insulating resin and a curing agent is applied on the conductive adhesive layer (I) 25 to form the insulating layer 22 having the through holes 24.

  Next, a release film 27 is provided on the surface of the insulating layer 22 to obtain an electromagnetic wave shielding laminate 28. The material of the release films 26 and 27 is not particularly limited as long as it has releasability. For example, silicone or alkyd-treated PET film can be used.

  In addition, as an example of the manufacturing method of the electromagnetic wave shielding laminate (not shown) according to the second embodiment, first, the conductive adhesive layer (I) is formed on the release film, and the electrolytic copper foil with a copper carrier is formed. After laminating the conductive adhesive layer on the electrolytic copper foil surface side, the copper carrier is peeled off. There is a method of laminating the surface from which the copper carrier has been peeled and an insulating layer separately formed on the release film. In addition, a conductive adhesive layer (I) is formed on the release film, a metal layer is formed on the surface thereof by electroless plating, and the insulating layer separately formed on the release film and the metal layer are stacked. The method of laminating etc. is mentioned.

  The laminated body for electromagnetic wave shielding has the thermosetting resin and the curing agent contained in the conductive adhesive layer (I) in an uncured state (B stage) and is fully cured (C stage) by thermocompression bonding with the substrate. A desired adhesive strength can be obtained. The uncured state includes a semi-cured state in which a part of the curing agent is cured.

The thickness of the electromagnetic wave shielding layer 21 obtained using the electromagnetic wave shielding laminate 28 can be appropriately designed depending on the application. In the case of applications where thinning is required, for example, about 1 to 20 μm is preferable, and about 1 to 15 μm is more preferable.
In addition, when shielding high-frequency noise with high accuracy, it is possible to use a thick film of, for example, 50 to 1000 μm, but it is usually about 5 to 200 μm. The electromagnetic wave shielding layer 21 can be appropriately selected from isotropic conductivity and anisotropic conductivity. However, when the electromagnetic wave shielding layer is constituted only by the conductive adhesive layer (I), the electromagnetic wave shielding layer 21 exhibits isotropic conductivity. preferable.

《Earth part》
The ground part 50 is a conductor part for installing the ground circuit 13 in the housing 40 and has a ground potential. In the electronic device 1, the ground portion 50 in the present invention has a conductive adhesive layer (II) that flows into the through hole 24 of the insulating layer 22 and is electrically connected to the electromagnetic wave shielding layer 21 through the through hole. To play a role. Moreover, as shown to Fig.2 (a), what laminated | stacked the metal layer 52 further is preferable from a viewpoint of the connection reliability of electroconductive contact bonding layer (II).
The conductive adhesive layer (II) 51 contains a binder resin that is softened by heat and a conductive filler, and both can be the same as those described for the laminate 28 for electromagnetic wave shielding. The metal layer 52 is preferably a copper foil or a stainless steel plate. If necessary, the surface may be nickel-plated and gold-plated.

  The size and thickness of the conductive adhesive layer (II) 51 forming the ground portion 50 can be arbitrarily determined according to the intended use. At least, the conductive adhesive layer (II) 51 is softened by heat and filled into the through-hole 24 to be shielded from electromagnetic waves. Even when conducting with the layer 21, it is necessary to be able to cover the contact area between the insulating layer surface and the ground portion 50.

  In order to connect the ground circuit 13 of the substrate 30 with the electromagnetic wave shielding layer to the earth circuit of the housing 40 of the electronic device, the ground part 50 is electrically connected to the surface of the insulating layer 22 having the through hole 24 of the substrate 30 with the electromagnetic wave shielding layer. After placing so that the adhesive layer (II) 51 is in contact, a thermal pressure is applied to the ground portion 50. At this time, the conductive adhesive layer (II) 51 softened by heating flows into and fills the through-holes by the pressure applied at the same time and comes into contact with the electromagnetic wave shielding layer 21, and the ground part 50 is electromagnetic waves in the substrate 30 with the electromagnetic wave shielding layer. Conductive with the shield layer 21.

  Thereafter, the ground circuit 13 in the substrate 30 with the electromagnetic wave shielding layer can be connected to the ground circuit of the housing 40 by connecting the ground portion 50 to the conductor portion of the housing 40.

《Electronic device manufacturing method》
The method for manufacturing an electronic device according to the present invention is a method for manufacturing an electronic device in which a substrate with an electromagnetic wave shielding layer is bonded to a housing, wherein the circuit pattern is formed on a substrate on which a circuit pattern including a ground circuit is formed. An insulating protective film having an opening is formed on at least a part of the ground circuit, and has a binder resin that is softened by heat, a conductive adhesive layer (I) containing a conductive filler, and a through hole. In addition, the insulation protection is performed so that the conductive adhesive layer (I) is on the lower layer side of the laminated body for electromagnetic wave shielding obtained by laminating an insulating layer having a through hole opening ratio of 0.001 to 40%. After being placed on the film, the electromagnetic wave shielding laminate is thermocompression bonded to form an electromagnetic wave shielding layer, and further, the grounding portion having the conductive adhesive layer (II) is disposed on the lower side of the conductive adhesive layer (II). On the insulating layer to be Place the conductive adhesive layer (II) into the through hole of the insulating layer by thermocompression bonding, and electrically connect the electromagnetic shielding layer and the grounding part through the through hole of the insulating layer In this way, the substrate with the electromagnetic wave shielding layer is joined to the housing.

An example of the manufacturing method of the electronic device with an electromagnetic wave shielding layer according to the first embodiment will be described.
First, as shown in FIG. 4A, the circuit pattern 14 is protected on the substrate 11 on which the circuit pattern 14 including the ground circuit 13 is formed, and an insulating portion having an opening 16 disposed on the ground circuit 13 is provided. A protective film 15 is formed. The opening 16 can be formed by, for example, a photolithography method. As another method, an insulating protective film in which the opening 16 is previously formed may be laminated.

  Next, as shown in FIG. 4 (b), the release film 26 of the electromagnetic wave shielding laminate 28 shown in FIG. 2 (b) is peeled off, and the conductive adhesive layer (I) 25 is formed on the insulating protective film 15. Place them so that the sides are in contact, and perform thermocompression bonding. The thermocompression bonding is performed by, for example, applying pressure while heating the electromagnetic shielding laminate 28 using a press machine. By performing this thermocompression bonding, the electromagnetic wave shielding layer 21 that covers the insulating protective layer 15 with the conductive adhesive layer (I) after thermocompression bonding is formed. Then, the conductive adhesive layer (I) 25 is softened by heating, and flows into the opening 16 by pressurization. By controlling the thickness, pressure, temperature, and thermocompression bonding time of the conductive adhesive layer (I), the electromagnetic wave shielding layer 21 can have a desired thickness.

From the viewpoint of smoothness and production efficiency, the pressure range is preferably 1 kg / cm ² or more, more preferably 3 kg / cm ² or more, and still more preferably 5 kg / cm ² or more. Further, the upper limit value is preferably 100 kg / cm ² or less, more preferably 80 kg / cm ² or less, and 50 kg / cm ² or less from the viewpoint of pressure resistance of the circuit pattern 14 and the substrate 11. More preferably.

  The thermocompression bonding time can be set according to the heat resistance of the electronic component, the binder resin used for the conductive sheet, the production process, and the like. When a thermosetting resin is used as the binder resin, a range of about 1 minute to 2 hours is preferable. The thermocompression bonding time is more preferably about 1 minute to 1 hour. The thermosetting resin is cured by this thermocompression bonding. However, the thermosetting resin may be cured before thermocompression bonding as long as it can flow.

  The temperature of thermocompression bonding can be appropriately set according to the binder resin used for the conductive sheet and the curing agent. When a thermosetting resin is used as the binder resin, a range of 140 to 180 ° C. is suitable.

  Next, as shown in FIG. 4C, the ground portion 50 is cut into a predetermined size, and the surface of the conductive adhesive layer (II) 51 of the ground portion 50 is formed on the insulating layer 22 from which the release film 27 is peeled off. A laminated body is produced by temporarily attaching to an arbitrary surface. Temporary pasting is performed by a heated roll laminator or iron heated to 50 ° C to 130 ° C.

  Thereafter, as shown in FIG. 4D, the conductive adhesive layer (II) 52 that forms the conductive layer 50 softened by heating is bonded to the through-hole 24 by the pressure applied simultaneously. In contact with the conductive adhesive layer (I) forming the electromagnetic wave shielding layer 21 by inflowing and filling the inside, electrical connection between the ground portion 50 and the electromagnetic wave shielding layer 21 in the substrate 30 with the electromagnetic wave shielding layer is ensured.

  The time for the thermocompression bonding of the ground portion is preferably in the range of about 1 minute to 2 hours. The thermocompression bonding time is more preferably about 1 minute to 1 hour.

The pressure range of the thermocompression bonding of the ground portion is preferably 1 kg / cm ² or more, more preferably 3 kg / cm ² or more from the viewpoint of smoothness and production efficiency, and 5 kg / cm ² or more. More preferably. Further, the upper limit value is preferably 100 kg / cm ² or less, more preferably 80 kg / cm ² or less, and 50 kg / cm ² or less from the viewpoint of pressure resistance of the circuit pattern 14 and the substrate 11. More preferably.

  140-180 degreeC is preferable and the temperature of the thermocompression bonding of an earth | ground part has more preferable 150-180 degreeC.

  By controlling the time, pressure, and temperature of the thermocompression bonding of the ground part within the above ranges, the deformation and breakage of the electromagnetic wave shield laminate can be suppressed, and the inflow of the conductive adhesive layer (II) into the through hole can be efficiently promoted. A highly reliable conduction path can be obtained between the electromagnetic wave shielding layer and the metal layer 52.

  The substrate 30 with an electromagnetic wave shield to which the earth part 50 is attached is assembled based on the design, connected to the housing 40 through the metal plate 52 of the earth part 50, and a ground is installed. The metal plate 52 and the housing 40 are connected by a gasket and a conductive adhesive tape (not shown).

  The other manufacturing method is to peel off the release film 26 of the electromagnetic wave shielding laminate 28 on the insulating protective film 15 of the circuit board 10 and temporarily attach the conductive adhesive layer (I) 25 with a heating laminate roll. There is a method in which the release sheet 27 on the insulating layer 22 side is peeled off, and the ground portion 50 cut into a predetermined shape is further temporarily attached to produce a laminate, and the laminate is thermocompression bonded. At the time of thermocompression bonding in this manufacturing method, the insulating layer 22 may stick to the cushioning agent, and thus it is necessary to sandwich the insulating layer 22 with a sheet treated with a release agent. The conditions for thermocompression bonding are the same as above.

  The housing 40 is a member constituting the electronic device 1 and may be any member that is at least larger than the circuit board 10 and can be attached to the board. Preferable examples include a housing, a board constituting the housing disposed inside, a member such as a lid configured to be detachable, and the like.

  The earth part 50 connected to the housing 40 side of the electronic device 1 is a conductor part for grounding the ground circuit 13 to the housing 40 and has a ground potential.

  According to the first embodiment, a conductive path is formed in the thickness direction of the insulating layer through the through hole by the ground portion arranged on the surface of the insulating layer using the electromagnetic shielding laminate having the insulating layer having the through hole. Therefore, it is possible to manufacture an electronic device having a high connection reliability between the shield layer and the ground portion as compared with the conventional method in which a metal bump or the like is pierced into the insulating protective film. In addition, the manufacturing yield of electronic devices and circuit boards can be increased as compared with a conventional method in which an opening is formed in the insulating protective film using an excimer laser. In addition, even if the grounding portion is arranged at any position on the surface of the insulating layer, a conductive path can be formed in the thickness direction of the insulating layer through the through hole in the same manner as described above. The conductive path between the ground circuit of the circuit board and the housing can be formed without being affected by the above.

  In addition, according to the electronic apparatus with an electromagnetic wave shielding layer according to the first embodiment, a route is formed to escape the ground potential in the thickness direction of the substrate, so that the grounding area is not secured at the end portion of the substrate. And miniaturization can be realized. It should be noted that the ground circuit is not intended to eliminate the structure of conducting at the edge of the substrate, but can be used in combination with the present invention. By using in combination with a structure in which a ground connection structure is provided at the end of the substrate, the electromagnetic wave shielding effect can be realized more effectively.

  In addition, according to the electronic device with an electromagnetic wave shielding layer according to the first embodiment, the circuit pattern, the electromagnetic wave shielding layer, and the conductive layer constituting the ground portion have a structure in which they are arranged to face each other, and a ground potential is provided. Therefore, EMI can be more effectively suppressed and EMC can be improved more effectively.

[Second Embodiment]
Next, an example of an electronic device with an electromagnetic wave shielding layer different from the first embodiment will be described. The electronic device 2 with an electromagnetic wave shielding layer according to the second embodiment has the same basic structure and manufacturing method as the first embodiment except for the following points. That is, the electromagnetic wave shielding laminate 28 of the second embodiment has a conductive adhesive layer (I) and a metal layer, and the electromagnetic wave shielding layer 21 after thermocompression bonding is formed of the conductive adhesive layer (I). The electromagnetic wave shielding layer and the metal layer are different from the first embodiment in which only the layer obtained by thermocompression bonding of the conductive adhesive layer (I) is used as the electromagnetic wave shielding layer 21. In the following drawings, the same element members are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  In FIG. 5, the typical sectional drawing of the principal part of the electronic device 2 with an electromagnetic wave shield layer which concerns on 2nd Embodiment is shown. The electromagnetic wave shielding laminate 20 used in the electronic device 2 includes an electromagnetic wave shielding layer between a conductive adhesive layer 21 a for electrically connecting the electromagnetic wave shielding layer 21 and the ground circuit 16 and an insulating layer 22 having a through hole 24. A metal layer 21b is also provided. For the metal layer 21b, the material and thickness of the metal layer can be appropriately selected according to the required shield characteristics. For example, it can be formed with a thickness of about 0.1 to 40 μm using a material such as aluminum, copper, silver, or gold. From the viewpoint of bending resistance, it is preferably in the range of 0.1 to 20 μm, and more preferably in the range of 0.1 to 10. Although the formation method of the metal layer 21b is not specifically limited, It can form by vacuum evaporation, sputtering, CVD method, and a plating process.

  According to the electronic device 2 with an electromagnetic wave shielding layer according to the second embodiment, since the electromagnetic wave shielding layer is laminated using the electromagnetic wave shielding laminate 20, the same effect as that of the first embodiment can be obtained. Further, by providing the metal layer 21b forming the second electromagnetic wave shielding layer between the conductive adhesive layer 21a forming the first electromagnetic wave shielding layer and the insulating layer 22 having the through hole 24, the shielding effect is more effectively achieved. Can be demonstrated. Moreover, since an impedance countermeasure can be exhibited more effectively, it is particularly suitable for high frequency applications.

[Third Embodiment]
Next, an example of the electronic device 3 with the electromagnetic wave shielding layer different from the first embodiment will be described. The electronic device 3 with an electromagnetic wave shielding layer according to the third embodiment has the same basic structure and manufacturing method as the first embodiment except for the following points. That is, in the third embodiment, the signal circuit 12, the ground circuit 13, and the insulating protective layer 15 covering the upper layers of these are provided on both surfaces of the substrate 11, and the electromagnetic wave shield laminate 20 is bonded to the surface of each insulating protective layer In the point which is carrying out, it differs from 1st Embodiment joined to the electromagnetic wave shield laminated body 20 only on one side.

  FIG. 6 is a schematic cross-sectional view of the main part of the electronic device 3 with an electromagnetic wave shielding layer according to the third embodiment. The substrate 30 with an electromagnetic wave shielding layer used in the electronic device 3 is formed by laminating an electromagnetic wave shielding laminate 20 including an electromagnetic wave shielding layer 21 and an insulating layer 22 having a through hole 24 on each surface of the circuit boards 10 and 10. The ground circuits 13 provided on both surfaces of the substrate 11 are connected through via holes 17 formed through the substrate 11. And the earth | ground part 50 is connected to the surface of the insulating layer 22 which forms the board | substrate 30 with an electromagnetic wave shield layer of both surfaces of the circuit board 10, respectively.

  According to the electronic device with an electromagnetic wave shielding layer according to the third embodiment, since the electromagnetic wave shielding layer is laminated using the laminated body for electromagnetic wave shielding, the same effect as that of the first embodiment can be obtained. Moreover, by laminating electromagnetic wave shielding layers on both surfaces of the substrate, EMI can be more effectively suppressed and EMC can be improved more effectively.

[Fourth Embodiment]
The substrate 30 with an electromagnetic wave shield layer used in the electronic device with an electromagnetic wave shield layer according to the fourth embodiment is the same as the substrate 30 with an electromagnetic wave shield layer used in the first embodiment by the basic structure and manufacturing method except the following points. It is the same. That is, in the fourth embodiment, the metal thin film 18 is provided on the upper surface of the circuit board 10, that is, the insulating protective film 15, and the conductive filler contained in the electromagnetic wave shielding layer 21 is prevented from entering the insulating protective film 15. This is different from the first embodiment in which the metal thin film is not provided.

  In FIG. 7, the typical sectional drawing of the principal part of the board | substrate 30 with an electromagnetic wave shield layer which concerns on 4th Embodiment is shown. In the substrate 30 with an electromagnetic wave shielding layer according to the fourth embodiment, the metal thin film 18 is laminated on the uppermost surface of the circuit board 10. The metal thin film 18 can effectively prevent the conductive filler contained in the electromagnetic wave shielding layer 21 from entering the insulating protective film 15. The metal thin film 18 can be formed on the surface of the insulating protective film 15 by, for example, vacuum deposition, sputtering, CVD, or plating. A metal thin film is formed before the opening 16 is formed, and the metal thin film 18 can be formed on the uppermost surface of the circuit board 10 as shown in FIG. It is also possible to form the metal thin film 18 in the uppermost surface of the circuit board 10 and in the opening 16 after the opening 16 is formed.

  According to the substrate 30 with an electromagnetic wave shielding layer according to the fourth embodiment, since the electromagnetic wave shielding layer 21 is laminated using the laminated body 20 for electromagnetic wave shielding, the same effect as that of the first embodiment can be obtained. Further, by providing the metal thin film 18, the metal thin film 18 can be given an electromagnetic wave shielding function, and the conductive filler contained in the electromagnetic wave shield layer 21 can be effectively prevented from entering the insulating protective film 15. . As a result, it is possible to reduce the thickness of the insulating protective film 15. Moreover, it has the merit that the choice of a conductive filler can be increased. For this reason, it is also possible to use a conductive filler that is easier to obtain conductive characteristics.

  As another embodiment, the ground portion 50 may be replaced with an insulating film and a conductive adhesive layer (II). That is, an insulating film such as a polyimide film is used instead of the metal layer 52. In this case, the insulating film functions as a reinforcing plate, and the conductive adhesive layer (II) functions as an electromagnetic wave shielding layer. At this time, since the casing of the electronic device and the ground circuit do not conduct, the electromagnetic shielding property is better when the ground portion is provided, but the reinforcing plate and the electromagnetic wave can be used as needed at any location on the upper surface of the electromagnetic shielding laminate 20. Shielding properties can be imparted.

  That is, an electronic device in which a substrate with an electromagnetic wave shielding layer is joined by an insulating film and a conductive adhesive layer (II), and on the substrate, a circuit pattern including a ground circuit and the circuit pattern are insulated and protected An electromagnetic wave shielding layer that is laminated on the insulating protective film, is joined to the ground circuit through an opening provided in the insulating protective film, and shields the circuit pattern; An insulating layer formed on the shield layer, having a through hole and having an opening area ratio of 0.001 to 40% of the through hole, and through the opening provided in the insulating protective film An electromagnetic wave shielding layer and the ground circuit are electrically connected, and the conductive adhesive layer (II) is joined to the ground circuit through a through hole of the insulating layer, and has an insulating film as a reinforcing plate. The electromagnetic wave shielding layer is an electronic device having a layer formed by thermocompression bonding of a binder resin softened by heat and a conductive adhesive layer (I) containing a conductive filler.

  It goes without saying that other embodiments may belong to the category of the present invention as long as they match the gist of the present invention. Moreover, the said embodiment is mutually combined suitably.

1-3 Electronic equipment 10 Circuit board 11 Board 12 Signal circuit 13 Ground circuit 14 Circuit pattern 15 Insulating protective film (cover lay)
16 Opening 17 Via hole 18 Metal thin film 20 Electromagnetic wave shield laminate 21 Electromagnetic wave shield layer 21a Conductive adhesive layer (I)
21b Metal layer 22 Insulating layer 24 (24a, 24b, 24c) Through hole 25 Conductive adhesive layer (I)
26, 27 Release film 28 Laminated body 30 for electromagnetic shielding 30 Substrate with electromagnetic shielding layer 40 Case 50 Grounding portion 51 Conductive adhesive layer (II)
52 metal layers

Claims (5)

An electronic device in which a substrate with an electromagnetic wave shielding layer is joined to a housing by a ground part,
On the substrate, a circuit pattern including a ground circuit,
An insulating protective film for insulating and protecting the circuit pattern;
An electromagnetic wave shielding layer that is laminated on the insulating protective film, is electrically connected to the ground circuit via an opening provided in the insulating protective film, and shields the circuit pattern;
An insulating layer formed on the electromagnetic shielding layer, having a through hole, and having an opening area ratio of the through hole of 0.001 to 40%;
The case has a grounding part that is electrically connected by thermocompression bonding and grounds the ground circuit,
The electromagnetic wave shielding layer has a layer formed by thermocompression bonding of a conductive adhesive layer (I) containing a binder resin and a conductive filler that is softened by heat ,
The earth portion has a layer formed by thermocompression bonding of a conductive adhesive layer (II) containing a binder resin and a conductive filler that is softened by heat,
The electromagnetic wave shielding layer and the grounding portion are electrically connected by the conductive adhesive layer (II) flowing into the through hole of the insulating layer by thermocompression bonding,
The conductive adhesive layer (II) has a flow amount of 0.005 mm or more and 2 mm or less when thermocompression bonding is performed at 150 ° C. and a pressure of 20 kg / cm ² for 30 minutes.
Electronics. The electronic device according to claim 1, wherein the insulating layer has a thickness of 3 to 50 μm. 3. The electronic apparatus according to claim 1, wherein the through hole is formed on the entire surface of the insulating layer or at least in the attachment region of the ground portion. The metal layer is further laminated | stacked on the said electromagnetic wave shielding layer on the layer formed by thermocompression-bonding the said electroconductive contact bonding layer (I), The any one of Claims 1-3 characterized by the above-mentioned. Electronics. A method for manufacturing an electronic device in which a substrate with an electromagnetic wave shielding layer is bonded to a housing,
On the substrate on which a circuit pattern including a ground circuit is formed, the circuit pattern is protected, and an insulating protective film having an opening is formed on at least a part of the ground circuit,
A conductive adhesive layer (I) containing a binder resin softened by heat and a conductive filler; an insulating layer having a through hole and an opening area ratio of the through hole of 0.001 to 40% ;
A laminated body for electromagnetic wave shielding formed by laminating
After the conductive adhesive layer (I) is disposed on the insulating protective film so as to be on the lower layer side, the electromagnetic wave shielding laminate is thermocompression bonded to form an electromagnetic wave shielding layer,
Furthermore, a ground part having a conductive adhesive layer (II) having a flow amount of 0.005 mm or more and 2 mm or less when thermocompression bonding is performed at 150 ° C. and a pressure of 20 kg / cm ² for 30 minutes , (II) is placed on the insulating layer so that it is on the lower layer side, thermocompression-bonded, and the conductive adhesive layer (II) flows into the through hole of the insulating layer, through the through hole of the insulating layer. The manufacturing method of the electronic device which joins the board | substrate with an electromagnetic wave shielding layer to a housing | casing so that the said electromagnetic wave shielding layer and the said earth | ground part may be electrically connected.