JP6187803B2 - Printed wiring material removing device, printed wiring device, and printed wiring method - Google Patents

Description

  The present invention relates to a printed wiring material removing device, a printed wiring device, and a printed wiring method.

  As a method for supplying a printed wiring material such as solder to a printed wiring board (PWB), a method by screen printing is widely used. The screen printing method is a method of printing a printed wiring material on a printed wiring board. In the screen printing method, first, a mask provided with openings corresponding to the electrodes of the printed wiring board is superimposed on the printed wiring board. Next, the printed wiring material on the mask is printed with a squeegee, and the opening is filled with the printed wiring material. Further, the printed wiring material is printed on the printed wiring board by separating the filled printed wiring material from the metal mask and the printed wiring board.

  In recent years, miniaturization of electronic components has progressed, and mixed mounting of small components and large components on printed wiring boards is increasing. For this reason, there is a demand for a method of printing with a suitable amount of printed wiring material supplied to each size component.

  In the screen printing method, as a technique for controlling the supply amount of the printed wiring material to an appropriate amount, for example, there are techniques described in Patent Documents 1 and 2 below.

  As shown in FIG. 5, the solder supply amount control method disclosed in Patent Document 1 is a mask in which the upper material filling side opening 18 of the mask opening 8 is formed wider than the lower printing surface side opening 28. Is used to control the amount of cream solder (solder paste) discharged. As described above, in the prior art, the amount of solder supply is controlled by changing the shape of the mask opening when supplying solder.

  On the other hand, Patent Document 2 describes a method of controlling the supply amount of the phosphor paste by a screen printing method. In this method, the amount of paste discharged can be controlled more accurately by appropriately adjusting three parameters: the opening area on the printing surface side, the opening area on the squeegee surface side, and the opening area in the vicinity of the center in the thickness direction. it can.

JP-A-11-34291 JP 2004-243575 A

  However, in these technologies, since the amount of printed wiring material supplied is controlled when supplying printed wiring material such as solder, printing defects occur, for example, the solder is not successfully transferred to the printed wiring board at the change point due to the shape of the opening. It is a factor.

  Accordingly, an object of the present invention is to provide a printed wiring that appropriately controls the printed wiring supply amount after the printed wiring material is supplied in order to eliminate the risk of printing defects caused by controlling the printed wiring material supply amount when the printed wiring material is supplied. The object is to provide a material removing device, a printed wiring device, and a printed wiring method.

The printed wiring material removing apparatus of the present invention is
Including printed wiring material separating means and suction nozzle,
The printed wiring material separating means separates a part of the printed wiring material disposed on the printed wiring board,
The suction nozzle sucks and removes a part of the printed wiring material separated by the printed wiring material separating means from the printed wiring board.

The printed wiring device of the present invention is
Printed wiring material separating means for arranging printed wiring material on the printed wiring board;
And a printed wiring material removing device.

The printed wiring board printed wiring method of the present invention,
A printed wiring material placement step for placing printed wiring material on the printed wiring board;
A printed wiring material separation step for separating a part of the printed wiring material disposed on the printed wiring board;
And a step of removing a part of the printed wiring material that is separated from the printed wiring board by suction.

  According to the present invention, it is possible to appropriately control the amount of printed wiring supplied after supplying the printed wiring material. For this reason, according to this invention, the risk of the printing defect which arises by controlling the printed wiring material supply amount at the time of printed wiring material supply can be eliminated.

Fig.1 (a) shows the side view seen from the cross section of the printed wiring material removal apparatus of this invention. FIG.1 (b) shows the front view seen from the cross section of the printed wiring material removal apparatus of this invention. It is sectional drawing which shows an example of embodiment in the printed wiring material removal apparatus of this invention. It is sectional drawing which shows another example of embodiment in the printed wiring material removal apparatus of this invention. It is sectional drawing which shows an example of the printed wiring material separation means which comprises the printed wiring material removal apparatus of this invention. It is sectional drawing which shows an example of the printed wiring method of a prior art.

Hereinafter, the present invention will be described in detail with reference to examples. However, the present invention is not limited to the following embodiments. In addition, in the following FIGS. 1-4, the same code | symbol is attached | subjected to the same part. In the drawings, for convenience of explanation, the structure of each part may be simplified as appropriate, and the dimensional ratio of each part may be different from the actual one. 1 to 4, the structure of each part is shown in a cross-sectional view, but the printed wiring material separating means 1 is not shown in a cross-sectional view for easy understanding.

[Embodiment]
In FIG. 1, the structure of the printed wiring material removal apparatus of this embodiment is shown. Fig.1 (a) is the side view seen from the cross section of the printed wiring material removal apparatus of this embodiment. FIG.1 (b) is the front view seen from the cross section of the printed wiring material removal apparatus of this embodiment. The printed wiring material removal device of the present embodiment is not particularly limited, but may be operated via a terminal (device) independent of the material supply device, or an option having the same function as the removal device, for example. The mechanism may be operated by being incorporated in a printing apparatus or a mounting apparatus.

  As shown in FIG. 1, the printed wiring material removing apparatus 10 of this embodiment includes a printed wiring material separating unit 1 and a suction nozzle 2. The positional relationship between the printed wiring material separating means 1 and the suction nozzle 2 is not particularly limited. For example, the printed wiring material separating means 1 may be disposed below the suction nozzle 2 as shown in FIG. The printed wiring material separating means 1 is preferably connected to the suction port 3 of the suction nozzle 2.

  The printed wiring material separating means 1 separates a part of the printed wiring material 5 disposed on the printed wiring board 4 and sucks a portion so that only a desired amount of the printed wiring material 5 can be sucked efficiently. The part to be left on the printed wiring board 4 side is separated. The printed wiring material separating means 1 may be, for example, a mechanism that separates the printed wiring material vertically. Examples of the mechanism for separating the printed wiring material vertically include a means for scraping and separating a part of the paste-like printed wiring material (wire, spatula, etc.), a cutter for cutting out a part of the printed wiring material, and the like. May be. Further, the printed wiring material separating means 1 may move only the printed wiring material separating means 1, but it is preferable to move it together with the suction nozzle. Thereby, for example, the step of separating a part of the printed wiring material 5 and the step of removing the part from the printed wiring board 4 can be performed simultaneously.

  The material of the printed wiring material separating means 1 is not particularly limited as long as it is a material capable of cutting a part of the printed wiring material 5, and examples thereof include metals and plastics. Further, the shape of the printed wiring material separating means 1 is not particularly limited as long as a part of the printed wiring material 5 can be cut, and examples thereof include a wire shape and a spatula shape. The wire shape is a thin shape such as a wire (wire). The spatula shape is, for example, a shape in which the printed wiring material separating means 1 is elongated and flat like a spatula and the edge of the front is slightly sharpened. Further, as shown in FIG. 4, the shape of the printed wiring material separating means 1 is curved toward the suction port (FIG. 4 (a)), arm shape (FIG. 4 (b)), spoon shape. (FIG. 4C) and the like are also included. Furthermore, the shape of the printed wiring material separating means 1 may be a closed shape such as the curved shape, or may be an open shape (a shape that is not connected continuously) such as the arm shape. . Even in the open shape, for example, if both ends of the printed wiring material 5 are partially cut or only one end is partially cut, the suction nozzle 2 can pull the inside of the suction nozzle 2 by the suction force. Can be aspirated.

  The suction nozzle 2 sucks a part of the printed wiring material 5 separated by the printed wiring material separating means 1 and removes the part from the printed wiring board 4. For example, the suction nozzle 2 may be set so that the suction force can be controlled in accordance with the viscosity of the printed wiring material 5 to be suctioned, or the suction amount can be controlled. The shape of the suction port 3 of the suction nozzle 2 is not particularly limited, and is, for example, a circle, an ellipse, a rectangle, a rectangle, a rectangle, or a polygon. Among these, the shape of the suction port 3 of the suction nozzle 2 is preferably circular or square. Further, the suction nozzle 2 may be set so that the tip shape of the suction port 3 can be changed in accordance with the printed wiring material 5 to be sucked, for example.

  The major diameter (longest diameter) of the suction port 3 of the suction nozzle 2 is not particularly limited, but is, for example, in the range of 50 μm to 70 mm. More specifically, when the printed wiring material 5 to be sucked is controlled one by one as shown in FIG. 1, the major diameter of the suction port 3 is in the range of 50 μm to 300 μm, for example. Moreover, when controlling several printed wiring materials 5 collectively according to component size, the long diameter of a suction opening may be about 70 mm at the maximum, for example.

  The printed wiring material 5 to be sucked is not particularly limited, but is preferably a paste-like material. Examples of the paste material include solder and conductive paste.

  Next, an embodiment of the printed wiring method of the present invention using the printed wiring device of the present invention will be described in detail with reference to FIG.

  First, as shown in FIGS. 2A to 2C, a printing apparatus (printed wiring material placement means in the printed wiring apparatus of the present invention) including a squeegee 7, a metal mask 6, a stage (not shown), and the like is provided. A printed wiring material arrangement process is performed using the same. That is, first, as shown in FIG. 2A, a metal mask 6 having a mask opening 8 is brought into contact with the printed wiring board 4. Next, the printed wiring material 5 supplied onto the metal mask 6 is squeezed (printed) by the squeegee 7. As a result, as shown in FIG. 2A, the printed wiring material 5 is filled in the mask opening 8. Next, as shown in FIGS. 2B and 2C, the metal mask 6 is detached from the printed wiring board 4. As a result, the printed wiring material 5 is disposed on the printed wiring board 4. In addition, the printed wiring material arrangement | positioning means in the printed wiring apparatus of this invention is not limited to the printing apparatus of this embodiment (FIG. 2), For example, the application | coating apparatus etc. of a paste are mentioned.

  Next, as shown in FIGS. 2D to 2E, a printed wiring material separation step and a printed wiring material partial removal step are performed. That is, first, as shown in FIG. 2 (d), the printed wiring material separating means 1 is lowered to a desired separation surface of the printed wiring material 5, moved from one end of the printed wiring material 5 to the other end, and this movement. A part of the printed wiring material 5 is separated along the direction. The separated printed wiring material 5 is sucked by the suction port 3 of the suction nozzle 2, for example, as shown in FIG. Thereby, as shown in FIG.2 (e), it is possible to control to the desired amount of printed wiring materials.

  Next, another example of the printed wiring method of the printed wiring board according to the present embodiment will be described in detail with reference to FIGS.

  As shown in FIG. 3, in the printed wiring method of the printed wiring board of the present embodiment, the printed wiring material removing apparatus 10 of the present embodiment selects a certain area and sucks a plurality of printed wiring materials 5 at a time. Except for this, the printed wiring method shown in the steps of FIGS. After the printed wiring material 5 is arranged on the printed wiring board 4, the printed wiring material separating means 1 descends to a desired separation surface of the printed wiring material 5, for example, as shown in FIG. A part of the printed wiring material 5 is separated. The suction nozzle 2 sucks the separated printed wiring materials 5 together. Thereby, as shown in FIG. 3, it is possible to collectively control a desired amount of printed wiring material.

  The printed wiring method of the present invention is not particularly limited and may be performed using any method. For example, as described with reference to FIG. 2, the printed wiring method is performed using the printed wiring device of the present invention. It is preferable.

  While the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.

  A part or all of the above embodiment can be described as in the following supplementary notes, but is not limited to the following.

(Appendix 1)
Including printed wiring material separating means and suction nozzle,
The printed wiring material separating means separates a part of the printed wiring material disposed on the printed wiring board,
The suction nozzle removes a part of the printed wiring material separated by the printed wiring material separation means from the printed wiring board.

(Appendix 2)
The printed wiring material removal apparatus according to appendix 1, wherein the printed wiring material is a paste-like material.

(Appendix 3)
The printed wiring material removal apparatus according to appendix 2, wherein the paste-like material is a solder paste or a conductive paste.

(Appendix 4)
The printed wiring material removal apparatus according to any one of appendices 1 to 3, wherein the printed wiring material separating means has a wire shape or a spatula shape.

(Appendix 5)
The printed wiring material separating means is connected to a suction port of the suction nozzle;
The printed wiring material removing apparatus according to any one of appendices 1 to 4, wherein the printed wiring material separating means can be moved together with the suction nozzle to separate a part of the printed wiring material.

(Appendix 6)
The printed wiring material removal apparatus according to any one of appendices 1 to 5, wherein a major axis of the suction port of the suction nozzle is in a range of 50 μm to 70 mm.

(Appendix 7)
The printed wiring material removal apparatus according to any one of appendices 1 to 6, wherein the suction port of the suction nozzle has a circular shape, an elliptical shape, a rectangular shape, a rectangular shape, a rectangular shape, or a polygonal shape.

(Appendix 8)
Printed wiring material placement means for placing printed wiring material on the printed wiring board;
A printed wiring device comprising the printed wiring material removing device according to any one of appendices 1 to 7.

(Appendix 9)
A printed wiring material placement step for placing printed wiring material on the printed wiring board;
A printed wiring material separation step for separating a part of the printed wiring material disposed on the printed wiring board;
A printed wiring board printed wiring method comprising: a step of removing a part of the printed wiring material that has been separated and removing the printed wiring material from the printed wiring board.

(Appendix 10)
Using the printed wiring device according to appendix 8,
Performing the printed wiring material placement step by the printed wiring material separating means;
Performing the printed wiring material separating step by the printed wiring material separating means;
The printed wiring method according to appendix 9, wherein a part of the printed wiring material is removed by the suction nozzle.

DESCRIPTION OF SYMBOLS 1 Printed wiring material separation means 2 Suction nozzle 3 Suction port 4 Printed wiring board 5 Printed wiring material 6 Metal mask 7 Squeegee 8 Mask opening (part)
DESCRIPTION OF SYMBOLS 10 Printed wiring material removal apparatus 18 Upper material filling side opening 28 Lower printing surface side opening

Claims (9)

Including printed wiring material separating means and suction nozzle,
The printed wiring material separating means separates a part of the printed wiring material disposed on the printed wiring board,
The suction nozzle sucks a portion of the printed wiring material the printed wiring material separating means is separated to remove from the printed circuit board,
The printed wiring material removing device, wherein the printed wiring material separating means has a wire shape or a spatula shape .   The printed wiring material removing apparatus according to claim 1, wherein the printed wiring material is a paste-like material.   The printed wiring material removing apparatus according to claim 2, wherein the paste-like material is a solder paste or a conductive paste. The printed wiring material separating means is connected to a suction port of the suction nozzle;
The printed wiring material printed wiring material removal device according to claim 1 it is possible to separate in any one of the 3 part of the separating means and the printed wiring material by moving together with the suction nozzle. The printed wiring material removal apparatus according to any one of claims 1 to 4 , wherein a major axis of the suction port of the suction nozzle is in a range of 50 µm to 70 mm. The printed wiring material removing apparatus according to any one of claims 1 to 5 , wherein a shape of the suction port of the suction nozzle is a circle, an ellipse, a rectangle, a rectangle, a rectangle, or a polygon. Printed wiring material placement means for placing printed wiring material on the printed wiring board;
Printed circuit device which comprises a printed wiring material removing device according to any one of claims 1 to 6. A printed wiring material placement step for placing printed wiring material on the printed wiring board;
A printed wiring material separation step of separating a part of the printed wiring material arranged on the printed wiring board using a wire-shaped or spatula-shaped printed wiring material separating means ;
A printed wiring board printed wiring method comprising: a step of removing a part of the printed wiring material that has been separated and removing the printed wiring material from the printed wiring board. Using the printed wiring device according to claim 7 ,
Performing the printed wiring material placement step by the printed wiring material placement means;
Performing the printed wiring material separating step by the printed wiring material separating means;
The printed wiring method according to claim 8, wherein the printed wiring material part removing step is performed by the suction nozzle.

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