JP6192530B2 - Socket for electrical parts - Google Patents

Description

  The present invention relates to an electrical component socket that accommodates electrical components such as semiconductor devices (hereinafter referred to as “IC packages”).

  Conventionally, as this kind of socket for electric parts, there are those described in Patent Documents 1 and 2. Such an electrical component socket is used in a test apparatus that performs a continuity test such as a burn-in test on an IC package, for example.

  In the socket for electric parts of Patent Document 1, the peripheral edge of the floating plate is urged upward by a spring. In addition, a large number of insertion holes through which contact pins are inserted are provided in the accommodation surface of the floating plate. When the IC package is accommodated in this accommodating surface, solder balls as terminals of the IC package are inserted into these insertion holes. When the central portion of the upper surface of the IC package is pressed downward by a pressing member (the pusher of the cover member in Patent Document 1), the floating plate descends against the urging force of the spring, and the solder ball is pressed against the contact pin. It is done. Thereby, a solder ball and a contact pin can be made to contact with an appropriate contact pressure.

  In the socket for electric parts of Patent Document 2, as shown in FIG. 4 of the same document, a ball guide is formed on the accommodation surface of the floating plate. Solder balls as terminals of the IC package are inserted into the ball guide. An insertion hole for inserting the contact pin is provided at the bottom of the ball guide. When the floating plate is lowered, the contact pin lifts the solder ball, so that the IC package is pressed against the pressing member.

JP 2010-153201 A JP 2007-317365 A

  As described above, the electrical component socket of Patent Document 1 accommodates the IC package in a state in which the peripheral portion of the floating plate is biased upward by the spring and the central portion is pressed downward by the pressing member. For this reason, when this electrical component socket is accommodated at a high temperature for a long time (for example, when a burn-in test is performed), the floating plate may be warped. If the floating plate warps, it becomes difficult to remove the IC package after use, or when the floating plate is raised, the upper end of the contact pin reaches the vicinity of the upper end of the insertion hole. There is a possibility that the ball cannot be inserted.

  On the other hand, in the socket for electric parts of Patent Document 2, there is no need to press the IC package downward, so that no pressing force is applied to the floating plate, and therefore no warpage occurs in the floating plate. However, in the socket for electric parts of Patent Document 2, the solder ball of the IC package rides on the tip of the contact pin after the IC package is lifted by the contact pin until it is pressed against the pressing member. It is only held by its own weight. For this reason, there is a possibility that the position of the IC package may be shifted from when the IC package starts to rise until it is pressed against the pressing member.

  Accordingly, an object of the present invention is to provide an electrical component socket that does not cause a positional shift when the electrical component is accommodated and that does not cause the floating plate to warp during the electrical component accommodation.

  In order to solve this problem, the invention of claim 1 is arranged on a wiring board provided with an electrode, accommodates an electric component provided with a terminal, and the electrode of the wiring board and the electric component A plurality of electrical component sockets for electrically connecting the terminals of the electrical component, wherein the lower contact portion is in contact with the electrode of the wiring board, and the upper contact portion is in contact with the terminal of the electrical component. Contact pins, a socket body that is installed on the wiring board and has a plurality of lower insertion holes through which the lower contact portions of the plurality of contact pins are inserted, and can be moved up and down above the socket body A floating plate having a plurality of upper insertion holes through which the electrical component is accommodated on an upper surface and through which the upper contact portion of the contact pin is inserted, and the float is formed by pressing the electrical component. A load generating mechanism that generates a load against the lowering when the plate is lowered, and the load generating mechanism moves the floating plate when the floating plate is lowered to the lowest position and stopped. It is characterized by not being pressed.

  According to a second aspect of the present invention, in addition to the configuration according to the first aspect, the load generating mechanism is provided on the floating plate, and includes a first moving surface having a first inclined surface and a first vertical surface, and the socket. A second inclined surface provided on the main body and sliding in contact with the first inclined surface when the floating plate is lowered from the highest position to a predetermined position; and the floating plate is lowest from the predetermined position A horizontal movement portion having a second vertical surface that contacts the first vertical surface when lowered to a position; and a biasing member that biases the horizontal movement portion against the vertical movement portion. It is characterized by that.

  According to the first aspect of the present invention, since the load generating mechanism generates a load against the lowering of the floating plate, the floating plate is lowered from the highest position to the lowest position in a state where the electric component is pressed against the floating plate. Therefore, it is possible to prevent the occurrence of displacement when the electrical component is accommodated.

  Furthermore, according to the first aspect of the present invention, when the floating plate is stopped in the state where it is lowered to the lowest position, the load generating mechanism does not press the floating plate. In doing so, it is possible to prevent the floating plate from warping.

  According to the second aspect of the present invention, the load generating mechanism having a simple configuration allows the pressing force as a load against the lowering by the biasing force of the biasing member while the floating plate is lowered from the highest position to the predetermined position. While the pressure is generated, the floating plate can be prevented from being pressed by the biasing force in a state where the pressure is lowered from the predetermined position.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of IC socket concerning Embodiment 1 of this invention, (a) is a top view, (b) is a side view, (c) is a fragmentary sectional view which follows the AA line of (a). It is. It is a figure which shows the structure of the IC socket which concerns on the same Embodiment 1, and is a fragmentary sectional view which follows the BB line of Fig.1 (a). It is a figure which shows the structure of the IC socket which concerns on the same Embodiment 1, (a) is the elements on larger scale of FIG. 2, (b) is the fragmentary top view which shows an insertion hole. It is a figure which shows the effect | action of the IC socket which concerns on the same Embodiment 1, (a) is sectional drawing which follows the BB line of Fig.1 (a), (b) is the elements on larger scale of (a). It is a figure which shows the effect | action of the IC socket which concerns on the same Embodiment 1, (a) is sectional drawing which follows the BB line of Fig.1 (a), (b) is the elements on larger scale of (a). It is a figure which shows the effect | action of the IC socket which concerns on the same Embodiment 1, (a) is sectional drawing which follows the BB line of Fig.1 (a), (b) is the elements on larger scale of (a). It is a figure which shows the effect | action of the IC socket which concerns on the same Embodiment 1, (a) is sectional drawing which follows the BB line of Fig.1 (a), (b) is the elements on larger scale of (a).

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention
In this embodiment, an IC socket 12 as an “electrical component socket” is disposed on the wiring board 10 and accommodates an IC package 11 as an “electrical component”. Then, the electrodes 10 a of the wiring substrate 10 and the solder balls 11 a as “terminals” of the IC package 11 are electrically connected via the IC socket 12.

  The IC socket 12 includes a plurality of contact pins 13, a socket body 14, a floating plate 15, and a load generation mechanism 16.

  As shown in FIGS. 2 and 3, the contact pin 13 includes a lower contact portion 13a, an upper contact portion 13b, a curved portion 13c formed between the contact portions 13a and 13b, and a lower contact portion. The engaging portion 13d is formed in the vicinity of the upper end of 13a and protrudes in the lateral direction, and the engaging portion 13e is formed in the vicinity of the lower end of the upper contact portion 13b and protrudes in the lateral direction. The lower contact portion 13 a contacts the electrode 10 a of the wiring substrate 10, and the upper contact portion 13 b contacts the solder ball 11 a of the IC package 11. The curved portion 13c is formed so as to urge the lower contact portion 13a and the upper contact portion 13b to contact the electrode 10a of the wiring substrate 10 and the solder ball 11a of the IC package 11 with an appropriate contact pressure. The engaging portion 13d regulates the amount of protrusion of the lower contact portion 13a from the lower insertion hole 14a (described later) of the socket body 14. The engaging portion 13e is used to engage the outer edge portion 15c of the lower opening of the upper insertion hole 15a provided in the floating plate 15 and raise the floating plate 15 (described later).

  The socket body 14 has a plurality of lower insertion holes 14a. The lower contact portion 12a of the contact pin 12 is inserted through these lower insertion holes 14a.

  The floating plate 15 is disposed above the socket body 14. The floating plate 15 is held by the socket body 14 so as to be movable up and down by a mechanism (not shown).

  The floating plate 15 is formed with a plurality of upper insertion holes 15a. These upper insertion holes 15a are formed in a substantially rectangular horizontal section, and are provided with spherical recesses 15b for receiving the solder balls 11a of the IC package 11 in the upper openings.

  The load generating mechanism 16 generates a load against the lowering when the floating plate 15 is lowered by pushing down the IC package 11. For this purpose, the load generating mechanism 16 includes a vertical moving unit 17, a horizontal moving unit 18, and an urging member 19.

  The vertical moving portion 17 is formed to project downward from the lower surface of the peripheral edge of the floating plate 15 and moves vertically as the floating plate 15 moves up and down. The vertical moving unit 17 includes an inclined surface 17a as a “first inclined surface” and a vertical surface 17b as a “first vertical surface”.

  The horizontal moving part 18 is provided in the socket body 14. The horizontal moving unit 18 can be moved horizontally by a mechanism (not shown). In addition, the horizontal moving unit 18 includes an inclined surface 18a as a “second inclined surface” and a vertical surface 18b as a “second vertical surface”. The horizontal moving portion 18 is pressed toward the vertical moving portion 17 by the biasing member 19. Thereby, while the floating plate 15 is lowered from the highest position to the predetermined position, the inclined surface 18 a slides in contact with the inclined surface 17 a of the vertical moving portion 17. Further, while the floating plate 15 is lowered from the predetermined position to the lowest position, the vertical surface 18b abuts on the vertical surface 17b of the vertical moving portion 17 (details will be described later).

  The biasing member 19 presses the horizontal movement unit 18 against the vertical movement unit 17 as described above. As the urging member 19, for example, a coil spring can be used.

  Next, a method for using the IC socket 12 will be described.

  When the IC package 11 is not accommodated in the IC socket 12, in the load generation mechanism 16, the urging member 19 urges the vertical moving portion 17 via the horizontal moving portion 18. At this time, as shown in FIG. 2, the horizontal moving unit 18 and the vertical moving unit 17 are in contact with each other at the inclined surfaces 18a and 17a. Therefore, the biasing force received by the vertical moving unit 17 has a vertical component. Due to this vertical component, the floating plate 15 is maintained at the highest position.

  When accommodating the IC package 11 in the IC socket 12, first, the IC package 11 is accommodated on the upper surface of the floating plate 15, as shown in FIG. At this time, as shown in FIG. 4B, each solder ball 11 a of the IC package 11 is inserted into a recess 15 b provided in the upper through hole 15 a of the floating plate 15. Thereby, the IC package 11 is positioned.

  Subsequently, the pressing member 20 is pressed against the IC package 11 and the IC package 11 starts to descend. The pressing member 20 may be provided in an automatic machine that conveys the IC package 11 or may be provided in the IC socket 12.

  When the IC package 11 starts to descend, each solder ball 11a of the IC package 11 presses the depression 15b of the floating plate 15 downward by the pressing force. Thereby, the lowering of the floating plate 15 is started, and the inclined surface 17a of the vertical moving portion 17 of the load generating mechanism 16 presses the inclined surface 18a of the horizontal moving portion 18. Due to the horizontal component of the pressing force, the horizontal movement unit 18 overcomes the urging force of the urging member 19 and starts moving in the right direction (see reference numeral C) in FIG.

  At this time, due to the urging force of the urging member 19, the solder ball 11 a of the IC package 11 receives a sufficiently large load from the recess 15 b of the floating plate 15. As a result, the state in which the solder balls 11a of the IC package 11 are inserted into the recesses 15b can be maintained, so that the displacement of the IC package 11 can be prevented.

  When the floating plate 15 is lowered to a predetermined position, the inclined surface 17a of the vertical moving unit 17 and the inclined surface 18a of the horizontal moving unit 18 are separated from each other as shown in FIG. The horizontal moving unit 18 comes into contact with the vertical surfaces 17b and 18b. As a result, the urging force received by the vertical movement unit 17 from the urging member 19 is only the horizontal component, and no vertical component is generated. That is, the load generating mechanism 16 does not press the floating plate 15 upward. At this time, the load generated by the load generating mechanism 16 is only weak vertical frictional force generated on the contact surface between the vertical surface 17 a of the vertical moving unit 17 and the vertical surface 18 a of the horizontal moving unit 18.

  Also at this time, since the solder balls 11a of the IC package 11 are inserted into the recesses 15b of the floating plate 15, it is possible to prevent displacement of the IC package 11 (see FIG. 5B).

  Thereafter, the floating plate 15 descends to the lowest position and stops. Thereby, the frictional force of the contact surface between the vertical surface 17a of the vertical moving unit 17 and the vertical surface 18a of the horizontal moving unit 18 does not occur. As a result, the load generating mechanism 16 does not generate a load on the floating plate 15.

  Thus, the operation of housing the IC package 11 in the IC socket 12 is completed.

  In this state, a burn-in test or the like is performed on the IC package.

  At this time, since the curved portion 13c of the contact pin 13 is bent sufficiently large (see FIGS. 5A and 5B), the urging force causes the solder ball 11a of the IC package 11 and the upper side of the contact pin 13 to be bent. The contact portion 13b is in pressure contact with a predetermined contact pressure by the urging force of the bending portion 13c. Similarly, by this urging force, the electrode 10a of the wiring board 10 and the lower contact portion 13a of the contact pin 13 are also brought into pressure contact with a predetermined contact pressure. Therefore, the electrical resistance between the IC package 11 and the contact pin 13 can be sufficiently reduced, and a highly reliable burn-in test or the like can be performed.

  At this time, the urging force received by the urging member 19 from the urging member 19 is only the horizontal component and does not generate the vertical component. Therefore, the floating plate 15 is not pressed by the load generating mechanism 16. Furthermore, since the urging force by the curved portion 13 c of the contact pin 13 is directly transmitted to the solder ball 11 a of the IC package 11, it does not become a pressing force against the floating plate 15. Therefore, even if the IC socket 12 is exposed to a high temperature for a long time by a burn-in test or the like, the floating plate 15 is unlikely to warp.

  When the burn-in test or the like is completed, the pressing member 20 is raised. Then, the curved portion 13c of the contact pin 13 tries to return to a state when the IC package 11 is not accommodated (that is, a state without bending). As a result, as shown in FIGS. 6A and 6B, the engaging portion 13d of the contact pin 13 is engaged with the outer edge portion 15c of the lower opening of the upper insertion hole 15a formed in the floating plate 15. In combination, the floating plate 15 is raised.

  When the floating plate 15 rises to a predetermined position, as shown in FIGS. 7A and 7B, the vertical surface 17b of the vertical moving unit 17 and the vertical surface 18b of the horizontal moving unit 18 are separated from each other, and these The vertical moving unit 17 and the horizontal moving unit 18 come into contact with each other at the inclined surfaces 17a and 18a. As a result, the urging force received by the vertical movement unit 17 from the urging member 19 has a vertical component and presses the vertical movement unit 17 upward.

  The floating plate 15 is further raised by this pressing force. Thereby, the engaging portion 13d of the contact pin 13 is separated from the outer edge portion 15c of the lower opening of the upper insertion hole 15a formed in the floating plate 15, and returns to the state shown in FIG.

  As described above, according to the first embodiment, since the load generating mechanism 16 generates a load against the lowering of the floating plate 15, the pressing member 20 is placed in the recess 15 b of the floating plate 15 in the solder ball 11 a of the IC package 11. In a state where is pressed, the floating plate 15 can be lowered from the highest position to the lowest position, thereby preventing the occurrence of displacement when the IC package 11 is accommodated.

  Furthermore, according to the first embodiment, when the floating plate 15 is stopped in the state where it is lowered to the lowest position, the floating plate 15 is not pressed. Even when the IC package 11 is accommodated, the warpage of the floating plate 15 can be prevented.

  Further, according to the first embodiment, while the floating plate 15 is lowered from the highest position to the predetermined position by the load generating mechanism 16 having a simple configuration, the load against the lowering is applied by the urging force of the urging member 16. While the pressing force is generated as described above, the floating plate 15 can be prevented from being pressed by the biasing force in a state where the pressing plate is lowered from the predetermined position.

  In the first embodiment, the vertical moving portion 17 is fixed to the floating plate 15, and the movable horizontal moving portion 18 and the urging member 19 are disposed on the socket body 14. As the load generating mechanism, any structure can be adopted as long as the structure is not pressed when the floating plate 15 is stopped at the lowest position. For example, the socket main body 14 may be provided with a protrusion corresponding to the vertical movement portion 17 and a movable protrusion corresponding to the horizontal movement portion 18 and a biasing member may be provided on the lower surface of the floating plate 15. Good.

  In the first embodiment, the present invention is applied to the IC socket 12 as an electrical component socket. However, the present invention is not limited to this and can be applied to other types.

10 Wiring board 10a Electrode 11 IC package (Electrical component)
11a Solder ball (terminal)
12 IC socket (Socket for electrical parts)
13 Contact pin 13a Lower contact portion 13b Upper contact portion 13c Bending portion 13d, 15e Engaging portion 14 Socket body 14a Lower insertion hole 15 Floating plate 15a Upper insertion hole 15b Depression 15c Outer edge portion of lower opening 16 Load generating mechanism 17 Vertical moving part 17a inclined surface (first inclined surface)
17b Vertical plane (first vertical plane)
18 Horizontal moving part 18a Inclined surface (second inclined surface)
18b Vertical plane (second vertical plane)
19 Biasing member

Claims (2)

An electrical component socket disposed on a wiring board provided with an electrode, for accommodating an electrical component provided with a terminal, and electrically connecting the electrode of the wiring board and the terminal of the electrical component. There,
A plurality of contact pins in which a lower contact portion is in contact with the electrode of the wiring board, and an upper contact portion is in contact with the terminal of the electrical component;
A socket body that is installed on the wiring board and has a plurality of lower insertion holes through which the lower contact portions of the plurality of contact pins are inserted;
A floating plate provided above the socket body so as to be movable up and down, wherein the electrical component is housed on an upper surface, and has a plurality of upper insertion holes through which the upper contact portions of the contact pins are inserted;
A load generating mechanism for generating a load for the lowering when the floating plate is lowered by pressing the electrical component;
With
The electrical component socket is configured such that the load generating mechanism is configured not to press the floating plate when the floating plate is lowered to the lowest position and stopped. The load generating mechanism is
A vertical moving part provided on the floating plate and having a first inclined surface and a first vertical surface;
A second inclined surface that is provided in the socket body and slides in contact with the first inclined surface when the floating plate is lowered from the highest position to a predetermined position; and the floating plate is moved from the predetermined position. A horizontal moving part having a second vertical surface that comes into contact with the first vertical surface when descending to the lowest position;
An urging member that urges the horizontal moving part and presses it against the vertical moving part;
The socket for electrical parts according to claim 1, comprising:

Images