JP6197992B2 - Lighting device - Google Patents

Description

  Embodiments described herein relate generally to a lighting device using a light emitting element as a light source.

  Conventionally, in a lighting device using a light emitting element such as an LED as a light source, a structure in which a substrate on which the light emitting element is mounted is attached to the front side of the radiator and the heat generated by the light emitting element is naturally radiated by the radiator.

  In a heat radiator, in order to enhance the heat radiation effect, a plurality of heat radiation fins are often provided on the rear side of the heat radiator.

JP 2009-163955 A

  Depending on the shape of the rear portion of the radiator and the shapes of the plurality of heat radiation fins, a corner portion surrounded by them may be formed between the rear portion of the heat radiator and the plurality of heat radiation fins.

  If there is such a corner portion surrounded by the surroundings, dust may accumulate in the corner portion, rainwater or the like may accumulate in the case of outdoor use, and the heat dissipation performance of the radiator may deteriorate.

  The problem to be solved by the present invention is to provide an illuminating device that can prevent a decrease in heat dissipation performance.

An illumination device according to an embodiment includes a substrate on which a light emitting element is mounted, a power supply circuit that supplies power to the light emitting element, and a radiator. The heat radiating body is provided with a board attaching portion for attaching a substrate on the front side in the light irradiation direction, and a circuit accommodating portion for accommodating a power supply circuit is provided on the rear side of the board attaching portion and a plurality of heat radiating fins are provided in a protruding manner. The circuit housing portion is rectangular in cross section and has a tapered surface on the outer surface. The circuit housing portion and the plurality of heat dissipating fins are separated from each other and a gap is provided therebetween.

  According to the present invention, the circuit accommodating portion projecting from the rear side of the board mounting portion of the radiator and the plurality of radiating fins are separated from each other and the gaps are provided therebetween, so that air easily flows. Heat dissipation performance can be improved, water and dust can be prevented from accumulating, and heat dissipation performance can be maintained.Furthermore, the heat radiation generated by the power supply circuit can be achieved by the circuit housing being thermally separated from the heat dissipation fins. It can be expected to improve.

It is a perspective view of the decomposition | disassembly state of the illuminating device which shows one Embodiment. It is a perspective view of the front side of the assembly state of an illuminating device same as the above. It is a perspective view of the back side of the assembly state of an illuminating device same as the above. It is the rear view which made the cylinder of the same illuminating device the cross section. It is a perspective view which shows the cross section of an illuminating device same as the above. It is a table | surface which shows the result of the thermal analysis by the angle of the housing | casing of an illuminating device same as the above. It is a table | surface which shows the result of the thermal analysis by the presence or absence of the coating of an illuminating device same as the above.

  Hereinafter, an embodiment will be described with reference to FIGS. 1 to 7.

  The lighting device 10 is an outdoor projector that projects light, and includes a light emitting module 11, a lens 12 disposed on the front side of the light emitting module 11, a power supply circuit 13 that supplies power to the light emitting module 11, and these A cylindrical housing 14 that houses the light emitting module 11, the lens 12, and the power supply circuit 13, and an installation tool 15 for installing the housing 14 are provided. A circular light emitting portion 16 that emits light is formed on one end side of the housing 14. In the lighting device 10, the light irradiation direction will be described as the front side, and the opposite side to the light irradiation direction will be described as the rear side.

  The light emitting module 11 includes a disk-shaped substrate 18 and a plurality of light emitting devices 19 which are semiconductor light emitting devices or solid light emitting devices mounted on a mounting surface which is the front surface of the substrate 18. The substrate 18 is formed of a material having excellent thermal conductivity such as metal or ceramics, and a pattern for electrically connecting a plurality of light emitting elements 19 is formed on the mounting surface. The light emitting element 19 is, for example, an LED element, and a surface mount type SMD (Surface Mount Device) package is used. The light emitting element 19 may be a COB (Chip On Board) module in which a plurality of LED elements are mounted on a substrate and sealed with a resin containing a phosphor, or an EL element may be used.

  The lens 12 is made of a material such as transparent resin or glass, and a plurality of lens portions 22 are integrally formed on the rear side of the disk-shaped front portion 21. The plurality of lens portions 22 correspond to each of the plurality of light emitting elements 19, and each of the light incident from the light emitting elements 19 is dimmed so as to have a predetermined light distribution and is emitted to the front of the front surface portion 21.

  The power supply circuit 13 includes a rectangular circuit board 24 and a plurality of electronic components (not shown) mounted on both surfaces of the circuit board 24. Then, the power supply circuit 13 converts AC power supplied from the outside into predetermined DC power, supplies the converted DC power to the plurality of light emitting elements 19, and turns on the plurality of light emitting elements 19.

  The housing 14 also includes a radiator 26, a front cover 27 attached to the front side of the radiator 26, and a cylinder 28 attached to the rear side of the radiator 26.

  The radiator 26 is integrally formed of a metal material such as aluminum. A cylindrical outer peripheral portion 30 is formed on the front side of the radiator 26, and a cylindrical cover attaching portion 31 to which the front cover 27 is attached is formed on the front side of the outer peripheral portion 30. A male screw for screwing and attaching the front cover 27 is formed on the outer periphery of the cover attaching portion 31.

  Inside the outer peripheral portion 30, a light source accommodating portion 32 that accommodates the light emitting module 11 and the lens 12 is formed. A circular substrate mounting portion 33 is formed on the inner side of the outer peripheral portion 30 and on the back side of the light source housing portion 32, and the substrate 18 is attached to the front side of the substrate mounting portion 33 so as to be capable of conducting heat. The light emitting module 11 and the lens 12 are arranged in the light source housing portion 32, and a plurality of screws are screwed into the substrate mounting portion 33 through the lens 12 and tightened, whereby the substrate 18 is pressed against the substrate mounting portion 33 by the lens 12. It is attached to the state where it is pressed.

  On the rear side of the board mounting part 33, a circuit accommodating part 34 projects from the central part of the board mounting part 33, and a plurality of radiating fins 35 project from the peripheral part of the board mounting part 33.

  The circuit housing portion 34 is formed in a cylindrical shape that opens only on the front side. That is, a cavity portion 36 that opens only to the front side is formed inside the circuit housing portion 34, and the front side of the cavity portion 36 is opened at the center portion of the board mounting portion 33 and communicated with the light source housing portion 32. Yes. The circuit housing part 34 is formed in a rectangular cross section that is vertically long along the radial direction of the light emitting part 16, the upper surface of the circuit housing part 34 is formed in a curved surface, and the side surfaces on both sides of the circuit housing part 34 face upward. It is formed on a tapered surface that tapers off. Then, the power supply circuit 13 is accommodated in the cavity portion 36 of the circuit accommodating portion 34 with the circuit board 24 being vertically oriented. Also, on the lower side of one of the circuit housing portions 34 in the longitudinal direction, a pair of leg portions 37 projecting downward continuously from both side surfaces of the circuit housing portion 34 at the center of the circuit housing portion 34 in the lamp axis direction. Is provided. A wiring hole (not shown) is formed on the rear surface of the circuit housing portion 34, and an electric wire for supplying AC power to the power supply circuit 13 is inserted into the wiring hole and between the wiring hole and the electric wire. A member having a waterproof structure is interposed.

  The plurality of heat radiating fins 35 are arranged radially around the circuit housing portion 34 with the central portion (optical axis) of the heat radiating body 26 as the center. The plurality of radiating fins 35 are separated from the circuit housing part 34, and a gap 38 is formed between the plurality of heat radiation fins 35. The dimension of the gap 38 is preferably in the range of 1 to 6 mm, and if it is smaller than 1 mm, it becomes difficult to manufacture the gap 38, and if it is larger than 6 mm, the surface area of the radiating fin 35 is reduced and the heat dissipation is reduced. Furthermore, in consideration of ease of manufacture and heat dissipation, the dimension of the gap 38 is more preferably in the range of 2 to 5 mm. Further, the projecting dimensions of the plurality of heat radiation fins 35 from the rear side to the rear side of the board mounting portion 33 are shorter than the circuit housing portion 34, but are set according to the necessary heat radiation performance. The radiating fins 35 are not limited to being provided radially, but may be provided along the vertical direction or the horizontal direction around the circuit accommodating portion 34. In this case as well, the plurality of radiating fins 35 are arranged to accommodate the circuit. It is only necessary that a gap 38 is formed between the circuit housing portion 34 and the circuit housing portion 34.

  On the outer surface of the radiator 26 including the radiation fins 35, the circuit accommodating portion 34, and the like, a painted surface 26a is formed on which a black paint containing, for example, an organic component such as carbon is applied as a binder. Thereby, the heat radiator 26 has a high radiation heat radiation characteristic that easily radiates infrared rays from the outer surfaces of the heat radiation fins 35, the circuit housing portion 34 and the like. Moreover, as a coating material, the coating material excellent in the radiation heat dissipation characteristic may be sufficient, and the common coating material containing the organic component may be sufficient, for example, should just have the emissivity of 0.8-0.9.

  Further, the front cover 27 is formed in an annular shape by a metal material such as aluminum, and a circular projection opening 40 having a smaller diameter than the lens 12 is formed on the front surface. On the inner periphery of the front cover 27, a female screw that is screwed onto the male screw of the cover mounting portion 31 of the radiator 26 is formed. When the front cover 27 is screwed into the radiator 26 and attached, an annular packing is interposed between the front cover 27 and the radiator 26 to ensure waterproofness, and between the front cover 27 and the lens 12. An annular packing is interposed between the two to ensure waterproofness. The inner region of the light projection opening 40 of the front cover 27 is configured as a circular light emitting portion 16 that emits light.

  The cylinder 28 is made of a metal material such as aluminum. A cylindrical portion 42 that covers the periphery of the circuit accommodating portion 34 and the radiation fin 35 of the radiator 26 and a rear surface portion 43 that covers the rear side of the cylindrical portion 42 are provided. A groove portion 44 through which the pair of leg portions 37 can be inserted is formed in the lower portion of the cylindrical portion 42, and a plurality of vent holes 45 that open along the inner surface of the cylindrical portion 42 are provided in the rear surface portion 43. Then, with the cylinder 28 covering the rear side of the radiator 26, a screw (not shown) is screwed into the lower surface of the circuit housing portion 34 through the lower surface of the cylinder 28, so that the cylinder 28 is attached to the radiator 26. It is attached. In a state where the cylindrical body 28 is attached to the heat radiating body 26, the space between the plurality of radiating fins 35 (ventilation passage 47) communicates between the front end of the cylindrical portion 42 and the rear side of the board mounting portion 33 of the heat radiating body 26. A ventilation portion 46 is formed. Further, a plurality of ventilation passages 47 are formed between the inner surface of the cylindrical portion 42, between the plurality of radiating fins 35, and the circuit housing portion 34, and these ventilation passages 47 are connected to the front ventilation portion 46 and the rear ventilation port 45. It is communicated to.

  On the outer surface and the inner surface of the cylindrical body 28, a painted surface 28a is formed in which, for example, a black paint containing an organic component such as carbon is applied as a binder. The color of the paint is the same as that of the radiator 26, for example, black. Thereby, the cylindrical body 28 can easily absorb infrared rays radiated from the outer surfaces of the heat radiating fins 35, the circuit housing portions 34, and the like from the inner surface of the cylindrical body 28, and can easily radiate infrared rays from the outer surface of the cylindrical body 28. It has heat dissipation characteristics. The coating material may be a coating material having excellent radiation heat dissipation characteristics or a general coating material containing an organic component, and may have an emissivity of, for example, 0.8 to 0.9. Although it is preferable that the entire inner surface of the cylinder 28 is coated with paint, it is preferable that the paint is applied from the radiating fin 35 to the cylinder 28 as long as the paint is coated at least in a region facing the periphery of the radiating fin 35. Heat transfer performance by radiation heat dissipation is obtained.

  Further, the installation tool 15 includes a fixing portion 49 that is fixed to the installation location, and a pair of arm portions 50 that are raised from both sides of the fixing portion 49. A pair of leg portions 37 of the heat radiating body 26 are rotatably connected to the pair of arm portions 50 using bolts and nuts.

  The illumination device 10 configured in this manner is installed at a predetermined installation location by the installation tool 15, and the light irradiation of the housing 14 is performed so that light is emitted from the installation location toward the predetermined light irradiation direction. The direction is adjusted. Depending on the installation situation, the direction of the casing 14 may be horizontal, downward, upward, or the like.

  When AC power is supplied to the power supply circuit 13, predetermined DC power obtained by converting the AC power by the power supply circuit 13 is supplied to the plurality of light emitting elements 19, and the plurality of light emitting elements 19 are turned on. Light generated by the plurality of light emitting elements 19 is irradiated forward through the lens 12.

  The heat generated when the plurality of light emitting elements 19 are turned on is thermally conducted from the substrate 18 to the substrate attachment portion 33 of the radiator 26, and is thermally conducted from the substrate attachment portion 33 mainly to the plurality of radiation fins 35. Further, heat generated during operation of the power supply circuit 13 is transmitted to the circuit housing portion 34. When the temperature of the plurality of heat radiation fins 35 and the circuit housing portion 34 disposed inside the cylinder 28 rises, the air outside the cylinder 28 flows into the cylinder 28 from the vent 46 or the vent 45. The air flows through the ventilation passage 47 to cool the plurality of heat dissipating fins 35 and the circuit housing portion 34, and the air heated through the ventilation passage 47 is exhausted from the ventilation hole 45 or the ventilation portion 46 to the outside of the cylindrical body 28. Is done.

  At this time, the flow velocity of the air flowing through the ventilation passage 47 is increased by the chimney effect, and a high heat dissipation effect is obtained.

  Furthermore, since the circuit accommodating portion 34 protruding from the rear side of the board mounting portion 33 of the radiator 26 and the plurality of radiating fins 35 are separated from each other and a gap 38 is provided between them, the gap 38 is cooled. Air flows for improving heat dissipation effect. In particular, since the circuit housing portion 34 is thermally separated from the plurality of heat radiating fins 35, heat radiation generated by the power supply circuit 13 can be improved.

  By the way, in the natural heat radiation using the heat radiation fins 35, the heat radiation effect is likely to be influenced by the orientation of the housing 14. In FIG. 6, a case of the comparative example in which the radiating fin 35 and the circuit accommodating portion 34 are continuous and a case of the present embodiment in which the radiating fin 35 and the circuit accommodating portion 34 are separated are shown. The result of having measured the temperature of the board | substrate 18 according to direction is shown. The direction of the casing 14 is horizontal, downward, and upward, and the heat generation amount of the light emitting element 19, the heat generation amount of the power supply circuit 13, the total heat generation amount, and the ambient temperature are the same.

  In the case of the comparative example in which the radiating fins 35 and the circuit accommodating portion 34 are continuous, a temperature difference of about 6 ° C. at maximum occurs depending on the orientation of the housing 14, and the change in the radiating performance is large. This is because air hardly flows between the radiating fins 35 depending on a change in the direction of the casing 14.

  In the case of the present embodiment in which the radiating fins 35 and the circuit accommodating portion 34 are separated, the temperature difference is suppressed to about 4 ° C. at the maximum due to the change in the orientation of the housing 14, and the change in the radiating performance may be reduced. it can. This is because air flows through the gap 38 between the heat radiating fin 35 and the circuit accommodating portion 34 regardless of the orientation of the casing 14.

  The heat generated when the plurality of light emitting elements 19 are turned on is conducted from the board mounting portion 33 of the radiator 26 to the plurality of radiation fins 35, and also to the outer peripheral portion 30 exposed to the outside, the front cover 27, etc. The heat is conducted, and heat is radiated from the outer peripheral portion 30 and the front cover 27 to the outside air.

  In addition, because the outer surface of the radiator 26 and the inner surface of the cylindrical body 28 are each coated with a paint containing an organic component, infrared rays are easily radiated from the radiator fins 35 of the radiator 26. It becomes easy to absorb the radiated infrared rays from the inner surface of the cylinder 28, and heat transfer from the radiation fins 35 to the cylinder 28 by good radiation heat dissipation is performed.

  Normally, the inner surface of the cylindrical body 28 that is not exposed to the outside is often unpainted from the viewpoint of cost, but by applying a paint containing an organic component, a good connection from the heat radiation fin 35 to the cylindrical body 28 is achieved. A heat transfer effect by radiation heat radiation can be obtained.

  FIG. 7 shows the results of measuring the temperature of the substrate 18 when there is no coating, when only the radiation fins 35 are painted, and when the inner surfaces of the radiation fins 35 and the cylinder 28 are painted. The temperature is lower when the paint is applied. When the inner surfaces of the heat dissipating fins 35 and the cylindrical body 28 are applied, the heat dissipating performance is improved by a maximum of 6 ° C compared to the case without the paint. . This can be said to be a result of heat transfer from the radiating fins 35 to the cylindrical body 28 by good radiation heat dissipation.

  Such radiation heat radiation is less affected by external conditions than heat transfer heat radiation by air convection, for example, less affected by the orientation of the housing 14, and stable heat radiation performance can be obtained.

  Further, since the circuit housing portion 34 protruding from the rear side of the board mounting portion 33 of the radiator 26 and the plurality of heat radiation fins 35 are separated from each other and a gap 38 is provided between them, the board mounting portion 33 A corner portion surrounded by the rear side, the circuit accommodating portion 34, and the heat radiating fin 35 is not formed. Therefore, it is possible to prevent rainwater and dust from accumulating between the circuit housing portion 34 and the plurality of heat radiating fins 35 regardless of the orientation of the housing 14, and the heat radiating performance of the heat radiating body 26 can be maintained for a long time. Can be maintained.

  Further, since the circuit housing part 34 is provided vertically, the change in the center of gravity of the radiator 26 in the left-right direction is small, the installation posture of the lighting device 10 can be stabilized, and the upper surface of the circuit housing part 34 Therefore, it is difficult for rainwater to collect and rainwater adhering to the side surface of the circuit housing portion 34 can be easily flowed. Further, since the tapered surface is provided on the side surface of the circuit housing portion 34, it is possible to prevent rainwater from accumulating on the side surface of the circuit housing portion 34 even when the side surface of the circuit housing portion 34 faces upward.

  Although the appearance of the lighting device 10 can be improved by using the cylindrical body 28, the cylindrical body 28 may not be used.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10 Lighting equipment
13 power circuits
18 Board
19 Light emitting element
26 Heat sink
28 cylinder
33 Board mounting part
34 Circuit housing
35 Heat dissipation fin
37 legs
38 Clearance
46 Vent

Claims (5)

A substrate mounted with a light emitting element;
A power supply circuit for supplying power to the light emitting element;
Yes substrate mounting portion for mounting the substrate on the front side of the light irradiation direction, circuit housing for housing the power circuit projecting from the rear side of the substrate attachment portion, and a plurality of radiating fins projecting from the rear side of the substrate attachment portion The circuit housing portion is rectangular in cross section and has a tapered surface on its outer surface , the circuit housing portion and the plurality of heat dissipating fins are separated from each other, and a gap is provided between them;
An illumination device comprising: The lighting device according to claim 1, wherein the circuit housing portion is disposed at a central portion of the heat radiating body, and the plurality of heat radiating fins are disposed radially around the circuit housing portion. The lighting device according to claim 1 , wherein the heat dissipating body includes an installation leg portion protruding from the circuit housing portion . Covering the periphery of the circuit housing portion of the radiator and the radiation fin, and forming a ventilation portion that opens between the plurality of radiator fins between the substrate mounting portion of the radiator and includes a cylindrical body attached to the radiator. The lighting device according to any one of claims 1 to 3, wherein The lighting device according to claim 4, wherein the inner surface of the cylindrical body is coated with a paint containing an organic component.

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