JP6204057B2 - Architectural board and method for producing architectural board - Google Patents
Architectural board and method for producing architectural board Download PDFInfo
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- JP6204057B2 JP6204057B2 JP2013096523A JP2013096523A JP6204057B2 JP 6204057 B2 JP6204057 B2 JP 6204057B2 JP 2013096523 A JP2013096523 A JP 2013096523A JP 2013096523 A JP2013096523 A JP 2013096523A JP 6204057 B2 JP6204057 B2 JP 6204057B2
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
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- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 3
- 239000008119 colloidal silica Substances 0.000 description 3
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- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 235000019353 potassium silicate Nutrition 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
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- 238000009835 boiling Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
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- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229920001131 Pulp (paper) Polymers 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
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- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
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- 229910000464 lead oxide Inorganic materials 0.000 description 1
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- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- DYIZHKNUQPHNJY-UHFFFAOYSA-N oxorhenium Chemical compound [Re]=O DYIZHKNUQPHNJY-UHFFFAOYSA-N 0.000 description 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910003449 rhenium oxide Inorganic materials 0.000 description 1
- 229910003450 rhodium oxide Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
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- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229910001935 vanadium oxide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Finishing Walls (AREA)
- Laminated Bodies (AREA)
- Catalysts (AREA)
- Paints Or Removers (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
Description
本発明は、壁材、屋根材等に好適な建築板、及び建築板の製造方法に関するものである。 The present invention relates to a building board suitable for wall materials, roofing materials, and the like, and a method for manufacturing the building board.
従来から、セメント等の水硬性無機粉体と、木質パルプ繊維等の木質補強材とを主成分とする無機質板がある。このような無機質板は、曲げ強度などの物性に優れるので、塗装を施し、住宅の内壁材、外壁材、屋根材等の建築板として使用されている。 Conventionally, there are inorganic boards mainly composed of hydraulic inorganic powder such as cement and wood reinforcing material such as wood pulp fiber. Since such an inorganic board is excellent in physical properties such as bending strength, it is coated and used as a building board for housing inner wall materials, outer wall materials, roofing materials, and the like.
しかし、近年、省エネ等の環境問題の観点から、住宅への断熱効果の向上が求められている。そのために、建築板の表面に断熱塗膜を形成し、住宅の断熱効果を高めることが検討されている。例えば、特許文献１には、断熱効果を備えたセラミック微粉末を塗膜形成材中に分散混合した断熱塗膜を、基材の表面に形成してなる、断熱性壁材が開示されている。 However, in recent years, from the viewpoint of environmental problems such as energy saving, there has been a demand for improvement of the heat insulation effect on the house. For this purpose, it has been studied to form a heat insulating coating on the surface of the building board to enhance the heat insulating effect of the house. For example, Patent Document 1 discloses a heat insulating wall material formed on a surface of a base material by a heat insulating coating film in which ceramic fine powder having a heat insulating effect is dispersed and mixed in a film forming material. .
しかし、特許文献１のようにセラミック微粉末を分散混合した断熱塗膜を形成した建築板は、実際にはその断熱効果が小さいことが、発明者らの実験によってわかった（後述する比較例を参照）。そして、発明者らが鋭意研究した結果、その要因の一つとして、セラミック微粉末はその中空率が低くなりやすく、断熱効果が得られにくいことがわかった。また、建築板の表面に汚れが付着すると外観が悪くなると共に、該汚れが吸熱し、断熱効果が低下することもわかった。そのため、断熱効果を持続することは難しい現状である。 However, it has been found by experiments of the inventors that a building board on which a heat insulating coating film in which ceramic fine powder is dispersed and mixed as in Patent Document 1 has a small heat insulating effect (comparative examples described later). reference). And as a result of the inventors' diligent research, it was found that as one of the factors, the ceramic fine powder tends to have a low hollowness and it is difficult to obtain a heat insulating effect. It was also found that when dirt is attached to the surface of the building board, the appearance deteriorates and the dirt absorbs heat and the heat insulating effect is lowered. Therefore, it is difficult to maintain the heat insulation effect.
したがって、本発明の課題は、汚れによる断熱性の低下を防ぐことができる建築板及びその製造方法を提供するものである。 Therefore, the subject of this invention is providing the building board which can prevent the heat insulation fall by dirt, and its manufacturing method.
本発明は、無機質板の表面に、断熱塗膜と光触媒塗膜とを有する建築板を提供する。本発明において、断熱塗膜は、塗膜形成材と、有機系中空粒子とを含有することを特徴とする。塗膜形成材としては、アクリル樹脂、シリコン樹脂、フッ素樹脂、アクリルシリコン樹脂、ポリウレタン樹脂、エポキシ樹脂、ポリシロキサン樹脂等を用いることができる。有機系中空粒子の材質としては有機化合物であれば良いが、アクリロニトリル、メタクリロニトリル、塩化ビニリデン、アクリル酸エステル、スチレンの少なくとも１種以上により構成されていると、中空率が高い状態を保持できるので好ましい。光触媒塗膜は、光触媒とバインダーとを含有し、最表側に形成されていることを特徴とする。バインダーとしては、メチルシリケート、水ガラス、コロイダルシリカ、ポリ（メタ）アクリル酸、スルフォン酸をグラフト重合したポリテトラフルオロエチレン、オルガノポリシロキサン等があるが、スルフォン酸をグラフト重合したポリテトラフルオロエチレン、オルガノポリシロキサンの少なくとも１種以上により構成されていることが好ましい。なお、断熱塗膜の形成工程において、断熱塗膜を形成する塗料が水溶性溶剤を含有していると形成される塗膜が均質となりやすいので、断熱塗膜は水溶性溶剤を含有していることが好ましい。その場合、水溶性溶剤は、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上からなると、均質化により貢献するので好ましい。無機質板としては、木繊維補強セメント板、繊維補強セメント板、繊維補強セメント・ケイ酸カルシウム板、スラグ石膏板などの窯業系サイディングボードや、金属系サイディングボード、ＡＬＣボードなどあるが、窯業系サイディングボードであると、断熱効果が顕著に向上するので好ましい。更に、断熱塗膜の表面にはクリヤー塗膜が形成されており、該クリヤー塗膜の表面に光触媒塗膜が形成されていると、建築板は耐候性に優れるとともに、該断熱塗膜が光触媒活性により劣化することを防げるので、好ましい。
また、本発明は、無機質板の表面に、塗膜形成材と有機系中空粒子とを含有する断熱塗料を塗布し、断熱塗膜を形成する工程と、該断熱塗膜の上に光触媒とバインダーとを含有する光触媒塗料を塗布し、光触媒塗膜を形成する工程とを備える建築板の製造方法も提供する。塗膜形成材としては、アクリル樹脂、シリコン樹脂、フッ素樹脂、アクリルシリコン樹脂、ポリウレタン樹脂、エポキシ樹脂、ポリシロキサン樹脂等を用いることができる。有機系中空粒子の材質としては有機化合物であれば良いが、アクリロニトリル、メタクリロニトリル、塩化ビニリデン、アクリル酸エステル、スチレンの少なくとも１種以上により構成されていると、中空率が高い状態を保持できるので好ましい。光触媒塗料のバインダーとしては、メチルシリケート、水ガラス、コロイダルシリカ、ポリ（メタ）アクリル酸、スルフォン酸をグラフト重合したポリテトラフルオロエチレン、オルガノポリシロキサン等があるが、スルフォン酸をグラフト重合したポリテトラフルオロエチレン、オルガノポリシロキサンの少なくとも１種以上により構成されていることが好ましい。また、断熱塗料が水溶性溶剤を含有していると、形成される断熱塗膜が均質となりやすいので好ましい。その場合、水溶性溶剤は、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上からなると、均質化により貢献するので好ましい。無機質板としては、木繊維補強セメント板、繊維補強セメント板、繊維補強セメント・ケイ酸カルシウム板、スラグ石膏板などの窯業系サイディングボードや、金属系サイディングボード、ＡＬＣボードなどあるが、窯業系サイディングボードに本発明の製造方法を行うと、断熱効果が顕著に向上するので好ましい。更に、光触媒塗膜を形成する工程は、断熱塗膜を形成した後、クリヤー塗料を塗布してクリヤー塗膜を形成し、該クリヤー塗膜の表面に光触媒塗料を塗布することにより行うと、建築板は耐候性に優れるとともに、該断熱塗膜が光触媒活性により劣化することを防げるので、好ましい。光触媒塗膜を最表側に形成すると、光が照射されたときに親水性を獲得し、防汚機能が発現するので、汚れが付着しにくく、断熱効果が保持されやすいので、好ましい。
This invention provides the building board which has a heat insulation coating film and a photocatalyst coating film on the surface of an inorganic board. In the present invention, the heat insulating coating film contains a coating film forming material and organic hollow particles. As the coating film forming material, acrylic resin, silicon resin, fluorine resin, acrylic silicon resin, polyurethane resin, epoxy resin, polysiloxane resin, or the like can be used. Any organic compound may be used as the material for the organic hollow particles. However, when the material is composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylate ester, and styrene, a high hollow ratio can be maintained. Therefore, it is preferable. The photocatalyst coating film contains a photocatalyst and a binder and is formed on the outermost side. Examples of the binder include methyl silicate, water glass, colloidal silica, poly (meth) acrylic acid, polytetrafluoroethylene obtained by graft polymerization of sulfonic acid, organopolysiloxane, etc., but polytetrafluoroethylene obtained by graft polymerization of sulfonic acid, It is preferably composed of at least one organopolysiloxane. In addition, in the formation process of a heat insulation coating film, since the coating film formed when the coating material which forms a heat insulation coating film contains a water-soluble solvent tends to become homogeneous, the heat insulation coating film contains a water-soluble solvent. It is preferable. In this case, it is preferable that the water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent because it contributes to homogenization. Inorganic boards include wood fiber reinforced cement boards, fiber reinforced cement boards, fiber reinforced cement / calcium silicate boards, slag gypsum boards, ceramic siding boards, metal siding boards, and ALC boards. A board is preferable because the heat insulation effect is remarkably improved. Further, a clear coating film is formed on the surface of the heat insulating coating film. When the photocatalytic coating film is formed on the surface of the clear coating film, the building board is excellent in weather resistance, and the heat insulating coating film is a photocatalyst. Since it can prevent deteriorating by activity, it is preferable.
The present invention also includes a step of applying a heat insulating coating material containing a coating film forming material and organic hollow particles to the surface of the inorganic plate to form a heat insulating coating film, a photocatalyst and a binder on the heat insulating coating film. The manufacturing method of a building board provided with the process of apply | coating the photocatalyst coating material containing these and forming a photocatalyst coating film is also provided. As the coating film forming material, acrylic resin, silicon resin, fluorine resin, acrylic silicon resin, polyurethane resin, epoxy resin, polysiloxane resin, or the like can be used. Any organic compound may be used as the material for the organic hollow particles. However, when the material is composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylate ester, and styrene, a high hollow ratio can be maintained. Therefore, it is preferable. Photocatalyst paint binders include methyl silicate, water glass, colloidal silica, poly (meth) acrylic acid, polytetrafluoroethylene grafted with sulfonic acid, organopolysiloxane, and the like. Polytetrafluoroethylene grafted with sulfonic acid is polytetrafluoroethylene. It is preferably composed of at least one of fluoroethylene and organopolysiloxane. Moreover, it is preferable that the heat-insulating paint contains a water-soluble solvent because the heat-insulating coating film to be formed tends to be homogeneous. In this case, it is preferable that the water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent because it contributes to homogenization. Inorganic boards include wood fiber reinforced cement boards, fiber reinforced cement boards, fiber reinforced cement / calcium silicate boards, slag gypsum boards, ceramic siding boards, metal siding boards, and ALC boards. It is preferable to perform the production method of the present invention on a board because the heat insulation effect is remarkably improved. Further, the step of forming the photocatalytic coating film is performed by forming a heat insulating coating film, applying a clear coating material to form a clear coating film, and applying the photocatalytic coating material to the surface of the clear coating film. The plate is preferable because it has excellent weather resistance and can prevent the heat insulating coating film from being deteriorated by photocatalytic activity. When the photocatalyst coating film is formed on the outermost side, hydrophilicity is obtained when light is irradiated, and an antifouling function is exhibited, so that dirt is difficult to adhere and a heat insulating effect is easily maintained, which is preferable.
本発明によれば、汚れによる断熱性の低下を防ぐことができる建築板及びその製造方法を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the building board which can prevent the heat insulation fall by dirt and its manufacturing method can be provided.
以下、本発明の実施の形態を具体的に説明する。 Hereinafter, embodiments of the present invention will be specifically described.
本発明の建築板は、無機質板の表面が、断熱塗膜と光触媒塗膜とを有することを特徴とする。 The building board of the present invention is characterized in that the surface of the inorganic board has a heat insulating coating and a photocatalytic coating.
無機質板としては、木繊維補強セメント板、繊維補強セメント板、繊維補強セメント・ケイ酸カルシウム板、スラグ石膏板などの窯業系サイディングボードや、金属系サイディングボード、ＡＬＣボードなどある。本発明においては、無機質板が窯業系サイディングボードであると、断熱塗膜による断熱効果が顕著に向上するので好ましい。なお、断熱塗膜は、無機質板の表面に直接形成されていていても良いが、無機質板の上にシーラー塗膜を形成させ、その上に断熱塗膜が形成されていても良い。シーラー塗膜は、例えば、アクリルエマルション、アクリルウレタン樹脂系塗料、エポキシ樹脂系塗料、溶剤型湿硬ウレタン、水分散型イソシアネート等によって構成することができ、１層でもよいが、２層以上とすることもできる。なお、無機質板としては、表面が平らな板でも、表面に凹凸模様を有する板でも良い。 Examples of the inorganic board include ceramic siding boards such as wood fiber reinforced cement boards, fiber reinforced cement boards, fiber reinforced cement / calcium silicate boards, and slag gypsum boards, metal siding boards, and ALC boards. In the present invention, it is preferable that the inorganic board is a ceramic siding board because the heat insulating effect by the heat insulating coating is remarkably improved. In addition, although the heat insulation coating film may be formed directly on the surface of an inorganic board, a sealer coating film may be formed on an inorganic board and the heat insulation coating film may be formed on it. The sealer coating can be composed of, for example, an acrylic emulsion, an acrylic urethane resin-based paint, an epoxy resin-based paint, a solvent-type wet urethane, a water-dispersed isocyanate, or the like. You can also. The inorganic plate may be a plate having a flat surface or a plate having an uneven pattern on the surface.
そして、断熱塗膜は、塗膜形成材と、有機系中空粒子とを含有し、無機質板の表面を被覆している。塗膜形成材としては、アクリル樹脂、シリコン樹脂、フッ素樹脂、アクリルシリコン樹脂、ポリウレタン樹脂、エポキシ樹脂、ポリシロキサン樹脂等がある。有機系中空粒子としては、高い中空率と小さい粒径であるために、有機化合物であれば良い。詳しくは、有機系材料は柔軟性があるので、中空粒子を形成する際に材料が伸び、平均中空率が高くなるとともに、その状態を保持することができるためである。有機系中空粒子の形状としては、平均粒径５〜５０μｍの範囲で、かつ、平均中空率８０％以上であることが好ましい。有機系中空粒子の平均粒径が５μｍ未満では断熱効果が十分に得られず、５０μｍより大きいと、形成される断熱塗膜の強度が弱くなり、該断熱塗膜が脆い、塗膜密着の不具合が発生しやすい等の懸念が生ずるためである。また、有機系中空粒子の平均中空率が８０％未満では断熱効果が十分に得られない懸念があるためである。有機系中空粒子の平均中空率の好ましい上限値は、有機系中空粒子の中空状態を保持できることを条件に、種々の要因によって異なるが、平均中空率が９０％以上であると、より断熱塗膜が断熱効果を発揮することができるので好ましい。なお、この平均中空率とは体積百分率による値である。有機系中空粒子が、アクリロニトリル、メタクリロニトリル、塩化ビニリデン、アクリル酸エステル、スチレンの少なくとも１種以上により構成されていると、耐久性、断熱性により優れるので好ましい。 And the heat insulation coating film contains the coating-film formation material and organic type hollow particle, and has coat | covered the surface of an inorganic board. Examples of the coating film forming material include acrylic resin, silicon resin, fluororesin, acrylic silicon resin, polyurethane resin, epoxy resin, polysiloxane resin, and the like. As the organic hollow particles, an organic compound may be used since it has a high hollow ratio and a small particle size. Specifically, since the organic material is flexible, the material is stretched when forming the hollow particles, the average hollowness is increased, and the state can be maintained. The shape of the organic hollow particles is preferably in the range of an average particle size of 5 to 50 μm and an average hollowness of 80% or more. If the average particle size of the organic hollow particles is less than 5 μm, a sufficient heat insulation effect cannot be obtained. If the average particle size is greater than 50 μm, the strength of the heat insulating coating formed is weak, the heat insulating coating is brittle, and the coating adhesion is defective. This is because there is a concern that it is likely to occur. Moreover, it is because there exists a concern that the heat insulation effect cannot fully be acquired if the average hollowness of organic hollow particles is less than 80%. The preferable upper limit value of the average hollow ratio of the organic hollow particles varies depending on various factors on the condition that the hollow state of the organic hollow particles can be maintained, but if the average hollow ratio is 90% or more, a more heat insulating coating film Is preferable because it can exert a heat insulating effect. The average hollowness is a value by volume percentage. It is preferable that the organic hollow particles are composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylic acid ester, and styrene because of excellent durability and heat insulation.
断熱塗膜において、塗膜形成材、有機系中空粒子の含有量に特に制限は無いが、断熱塗膜が有機系中空粒子を固形分１００質量部あたり０．０１質量部未満では断熱効果が十分に得られず、５．０質量部より多いと、形成される断熱塗膜の強度が弱くなり、該断熱塗膜が脆い、塗膜密着の不具合が発生しやすい等の懸念があるので、有機系中空粒子を固形分１００質量部あたり０．０１〜５.０質量部含有することが好ましい。また、断熱塗膜の平均塗膜厚が５μｍ未満では断熱効果が十分に得られない、５００μｍを超えると、形成される断熱塗膜の強度が弱くなる、乾燥時間が長くなる、無機質板の表面が意匠柄を有している場合には柄の凹凸が埋もれて外観が変わってしまう等の懸念があるので、断熱塗膜の平均塗膜厚は５〜５００μｍであることが好ましい。 In the heat insulating coating film, the content of the coating film forming material and the organic hollow particles is not particularly limited, but the heat insulating effect is sufficient if the heat insulating coating film is less than 0.01 part by mass of the organic hollow particles per 100 parts by mass of the solid content. When the amount is more than 5.0 parts by mass, the strength of the heat-insulating coating film formed becomes weak, the heat-insulating coating film is brittle, and there is a concern that the coating film is liable to be defective. It is preferable to contain 0.01 to 5.0 parts by mass of the system hollow particles per 100 parts by mass of the solid content. Also, if the average coating thickness of the heat insulating coating is less than 5 μm, a sufficient heat insulating effect cannot be obtained, and if it exceeds 500 μm, the strength of the heat insulating coating to be formed becomes weaker and the drying time becomes longer. When there is a design pattern, there is a concern that the unevenness of the pattern is buried and the appearance is changed, so that the average coating thickness of the heat insulating coating is preferably 5 to 500 μm.
また、本発明では、断熱塗膜の形成工程において、断熱塗膜を形成する塗料が水溶性溶剤を含有していると、断熱塗膜がより均質となるので、断熱塗膜は水溶性溶剤を含有していても良い。その場合、水溶性溶剤がグリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上からなると、均質化により貢献するので好ましい。 In the present invention, in the step of forming the heat insulating coating, if the paint forming the heat insulating coating contains a water-soluble solvent, the heat insulating coating becomes more homogeneous. You may contain. In that case, it is preferable that the water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent because it contributes to homogenization.
更に、本発明の建築板は光触媒塗膜を含有する。光触媒塗膜は、光触媒とバインダーとを含有し、最表側に形成されている。バインダーとしては、メチルシリケート、水ガラス、コロイダルシリカ、ポリ（メタ）アクリル酸、スルフォン酸をグラフト重合したポリテトラフルオロエチレン、オルガノポリシロキサン等があるが、スルフォン酸をグラフト重合したポリテトラフルオロエチレン、オルガノポリシロキサンの少なくとも１種以上により構成されていることが好ましい。光触媒としては、酸化チタンが一般的であるが、酸化チタンの他に、酸化亜鉛、酸化錫、酸化鉄、酸化ジルコニウム、酸化タングステン、酸化クロム、酸化モリブデン、酸化ルテニウム、酸化ゲルマニウム、酸化鉛、酸化カドミウム、酸化銅、酸化バナジウム、酸化ニオブ、酸化タンタル、酸化マンガン、酸化コバルト、酸化ロジウム、酸化レニウム等がある。なお、光触媒は、バインダーの種類によっては塗膜を劣化させる懸念があるので、アパタイト、ゼオライト、シリカ等により被覆された光触媒を用いることができる。光触媒の含有量に特に定めはないが、バインダーの固形分１００質量部に対して１０〜８０質量部であると、防汚機能に優れるとともに、該光触媒が安定的に分散できるので、好ましい。また、光触媒塗膜の膜厚は０．１〜３μｍであると、防汚機能に優れるとともに、塗膜にクラックが発生することが抑えられるので、好ましい。 Furthermore, the building board of the present invention contains a photocatalytic coating film. The photocatalyst coating film contains a photocatalyst and a binder, and is formed on the outermost side. Examples of the binder include methyl silicate, water glass, colloidal silica, poly (meth) acrylic acid, polytetrafluoroethylene obtained by graft polymerization of sulfonic acid, organopolysiloxane, etc., but polytetrafluoroethylene obtained by graft polymerization of sulfonic acid, It is preferably composed of at least one organopolysiloxane. As a photocatalyst, titanium oxide is generally used, but besides titanium oxide, zinc oxide, tin oxide, iron oxide, zirconium oxide, tungsten oxide, chromium oxide, molybdenum oxide, ruthenium oxide, germanium oxide, lead oxide, oxide Examples include cadmium, copper oxide, vanadium oxide, niobium oxide, tantalum oxide, manganese oxide, cobalt oxide, rhodium oxide, and rhenium oxide. In addition, since there exists a possibility that a photocatalyst may deteriorate a coating film depending on the kind of binder, the photocatalyst coat | covered with apatite, zeolite, silica, etc. can be used. The content of the photocatalyst is not particularly defined, but it is preferably 10 to 80 parts by mass with respect to 100 parts by mass of the solid content of the binder because the antifouling function is excellent and the photocatalyst can be stably dispersed. Moreover, it is preferable for the film thickness of the photocatalyst coating film to be 0.1 to 3 μm because the antifouling function is excellent and cracks are prevented from occurring in the coating film.
なお、本発明においては、断熱塗膜の表面にはクリヤー塗膜が形成されており、該クリヤー塗膜の表面に光触媒塗膜が形成されていると、建築板は耐候性に優れるとともに、該断熱塗膜が光触媒活性により劣化することを防げるので、好ましい。クリヤー塗膜は、アクリル樹脂、シリコン樹脂、フッ素樹脂、アクリルシリコン樹脂、ポリウレタン樹脂、エポキシ樹脂、ポリシロキサン樹脂等によって構成することができる。 In the present invention, a clear coating film is formed on the surface of the heat insulating coating film, and when a photocatalytic coating film is formed on the surface of the clear coating film, the building board is excellent in weather resistance, and the It is preferable because the heat insulating coating film can be prevented from being deteriorated by the photocatalytic activity. The clear coating film can be composed of acrylic resin, silicon resin, fluororesin, acrylic silicon resin, polyurethane resin, epoxy resin, polysiloxane resin, or the like.
そして、本発明の建築板の製造方法は、無機質板の表面に、塗膜形成材と有機系中空粒子とを含有する断熱塗料を塗布し、断熱塗膜を形成する工程と、該断熱塗膜の上に、光触媒とバインダーとを含有する光触媒塗料を塗布し、光触媒塗膜を形成する工程とを備える。無機質板、塗膜形成材、有機系中空粒子、バインダー、光触媒については前述したとおりである。 And the manufacturing method of the building board of this invention apply | coats the heat insulation coating material containing a coating-film formation material and an organic type hollow particle on the surface of an inorganic board, and forms the heat insulation coating film, and this heat insulation coating film And a step of applying a photocatalyst paint containing a photocatalyst and a binder to form a photocatalyst coating film. The inorganic plate, the coating film forming material, the organic hollow particles, the binder, and the photocatalyst are as described above.
断熱塗膜を形成する工程において、断熱塗料は、塗膜形成材と有機系中空粒子とを含有した塗料によって形成されている。この塗料としては、例えば、アクリルシリコンエマルション、アクリルエマルション、シリコン樹脂系塗料、アクリルウレタン系塗料、フッ素樹脂系塗料、ポリウレタン樹脂系塗料等によって構成することができる。
断熱塗料において、塗膜形成材、有機系中空粒子の含有量に特に制限は無いが、有機系中空粒子の含有量が塗料固形分１００質量部あたり０．０１質量部未満では形成された断熱塗膜の断熱効果が十分ではない懸念があり、５．０質量部より多いと、形成される断熱塗膜の強度が弱くなり、該断熱塗膜が脆い、塗膜密着が発生しやすい等の懸念があるため、有機系中空粒子を固形分１００質量部あたり０．０１〜５.０質量部含有することが好ましい。なお、有機系中空粒子の含有量は、断熱塗料を構成する固形分１００質量部に対する、有機系中空粒子の膜を形成する有機固形分の割合を表すものである。
また、断熱塗料が水溶性溶剤を含有していると、形成される断熱塗膜が均質となりやすいので好ましい。詳しくは、前述した断熱効果の高い有機系中空粒子が混合されていると、断熱塗料を無機質板に塗布し、乾燥する際に、形成中の塗膜全体に熱が均等に伝わり難いという問題がある。そこで、水溶性溶剤が含有されている断熱塗料を用いることにより、乾燥時に熱が形成中の塗膜全体に伝わりやすくなる。その結果、均質な断熱塗膜を形成することができ、建築板全体にわたって、断熱塗膜によって均質な断熱効果を得ることができ、全体として建築板の断熱性が向上する。水溶性溶剤として、例えば、エチレングリコール、プロピレングリコール、ジエチレングリコール、ジプロピレングリコールＮ−ブチルエーテル、トリプロピレングリコールモノメチルエーテル等、又はこれらの混合物を用いることができる。その場合には、断熱塗料の塗布及び乾燥における塗膜温度は、水溶性溶剤の沸点よりも低くする。それゆえ、乾燥を経た後にも、水溶性溶剤は、充分に残存して、断熱塗膜の均質な成膜に寄与することができる。水溶性溶剤が、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上からなると、沸点が高いので、断熱塗膜の形成工程において最後まで残存しやすく、断熱塗膜の均質化に貢献しやすいので好ましい。なお、水溶性溶剤は、断熱塗料の固形分を１００質量部としたとき、０．１〜１０質量部含有されていると、断熱塗膜全体の均質な成膜を確実に行うことができるので、好ましい。
また、断熱塗料の色調は顔料を用いて調整することができる。すなわち、断熱塗料として顔料が含有されている塗料を用いても良いし、顔料を含有しない塗料を用いても良い。
塗料の塗布方法としては、スプレー塗布、ロールコーター塗布、カーテンコーター塗布、浸漬塗布など様々有るが、いずれでも良い。平均塗膜厚に特に制限はないが、５μｍ未満では、形成される断熱塗膜は断熱効果が十分ではなく、５００μｍを超えると、形成される断熱塗膜の強度が弱くなる、乾燥時間が長くなる、無機質板の表面が意匠柄を有している場合には柄の凹凸が埋もれて外観が変わってしまう等の懸念があるので、断熱塗膜の平均塗膜厚を５〜５００μｍとすることが好ましい。
乾燥は、特に制限は無く、断熱塗膜を形成できれば良いが、有機系中空粒子の中空構造を確実に保持しつつ、断熱塗膜を形成することを考慮すると、乾燥時の塗膜温度を１３０℃以下とすることが好ましい。有機系中空粒子の耐熱性を考慮すると、４０〜１１０℃とすることがより好ましい。
In the step of forming the heat insulating coating, the heat insulating coating is formed of a coating containing a coating film forming material and organic hollow particles. As this paint, for example, an acrylic silicon emulsion, an acrylic emulsion, a silicone resin paint, an acrylic urethane paint, a fluororesin paint, a polyurethane resin paint, and the like can be used.
In the heat insulating paint, the content of the coating film forming material and the organic hollow particles is not particularly limited, but the heat insulating coating formed when the content of the organic hollow particles is less than 0.01 parts by weight per 100 parts by weight of the solid content of the paint. There is a concern that the heat insulating effect of the film is not sufficient, and if it is more than 5.0 parts by mass, the strength of the heat insulating coating film to be formed becomes weak, the heat insulating coating film is brittle, and the film adhesion is likely to occur. Therefore, it is preferable to contain 0.01 to 5.0 parts by mass of organic hollow particles per 100 parts by mass of the solid content. In addition, content of an organic type hollow particle represents the ratio of the organic solid content which forms the film | membrane of an organic type hollow particle with respect to 100 mass parts of solid content which comprises a heat insulation coating material.
Moreover, it is preferable that the heat-insulating paint contains a water-soluble solvent because the heat-insulating coating film to be formed tends to be homogeneous. Specifically, when organic hollow particles having a high heat insulating effect described above are mixed, there is a problem that when the heat insulating coating is applied to the inorganic plate and dried, heat is not easily transmitted to the entire coating film being formed. is there. Therefore, by using a heat insulating paint containing a water-soluble solvent, heat is easily transmitted to the entire coating film being formed during drying. As a result, a uniform heat insulating coating can be formed, and a uniform heat insulating effect can be obtained by the heat insulating coating over the entire building board, so that the heat insulating property of the building board as a whole is improved. As the water-soluble solvent, for example, ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol N-butyl ether, tripropylene glycol monomethyl ether, or a mixture thereof can be used. In that case, the coating film temperature in application and drying of the heat insulating paint is set lower than the boiling point of the water-soluble solvent. Therefore, even after drying, the water-soluble solvent remains sufficiently and can contribute to the uniform film formation of the heat insulating coating film. If the water-soluble solvent is composed of at least one of a glycol-based solvent and a glycol ether-based solvent, the boiling point is high. preferable. In addition, when the solid content of the heat-insulating paint is 100 parts by mass and the water-soluble solvent is contained in an amount of 0.1 to 10 parts by mass, uniform film formation of the entire heat-insulating coating film can be reliably performed. ,preferable.
The color tone of the heat insulating paint can be adjusted using a pigment. That is, a paint containing a pigment may be used as the heat insulating paint, or a paint containing no pigment may be used.
There are various coating methods such as spray coating, roll coater coating, curtain coater coating, and dip coating. Any method may be used. There is no particular limitation on the average coating thickness, but if it is less than 5 μm, the heat insulating coating formed does not have a sufficient heat insulating effect, and if it exceeds 500 μm, the strength of the heat insulating coating formed becomes weak, and the drying time is long. When the surface of the inorganic plate has a design pattern, there is a concern that the unevenness of the pattern is buried and the appearance changes, so the average coating thickness of the heat insulating coating should be 5 to 500 μm. Is preferred.
There is no particular limitation on the drying, and it is sufficient that a heat insulating coating film can be formed. However, considering that the heat insulating coating film is formed while securely holding the hollow structure of the organic hollow particles, the coating film temperature during drying is set to 130. It is preferable to set it as below ℃. Considering the heat resistance of the organic hollow particles, the temperature is more preferably 40 to 110 ° C.
光触媒塗膜を形成させる工程において、光触媒塗料の塗料としては、バインダーに光触媒を分散させた塗料を用いることができる。バインダー、光触媒については、前述したとおりである。光触媒塗料は、断熱塗膜に直接塗布しても良いが、先にクリヤー塗料を塗布し、断熱塗膜の上にクリヤー塗膜を形成させた後、該クリヤー塗膜の上に光触媒塗料を塗布しても良い。クリヤー塗膜の上に光触媒塗膜を形成させると、建築板は耐候性に優れるとともに、該断熱塗膜が光触媒活性により劣化することを防げるので、好ましい。 In the step of forming the photocatalyst coating film, a paint in which the photocatalyst is dispersed in a binder can be used as the paint of the photocatalyst paint. The binder and photocatalyst are as described above. The photocatalyst paint may be applied directly to the heat insulating coating, but after applying the clear coating first, forming the clear coating on the heat insulating coating, the photocatalytic coating is applied on the clear coating. You may do it. It is preferable to form a photocatalytic coating film on the clear coating film because the building board is excellent in weather resistance and the thermal insulation coating film can be prevented from being deteriorated by the photocatalytic activity.
次に、本発明の実施例をあげる。 Next, examples of the present invention will be given.
厚さ１６mmで、無機質板（木繊維補強セメント板）の表面に、アクリル樹脂を主成分とする白色水性塗料を塗布し、約８０℃のドライヤーで約５分乾燥してシーラー層を形成した。次いで、その表面に表１に示す断熱塗料を塗布し、約８０℃のドライヤーで約５分乾燥し、実施例１〜７、比較例１〜４の建築板を製造した。なお、いずれも表面がフラット柄の無機質板を用いた。また、クリヤー塗料を塗布したものについては、約８０℃のドライヤーで約１５分乾燥してクリヤー塗膜を形成した。 A white aqueous paint mainly composed of acrylic resin was applied to the surface of an inorganic board (wood fiber reinforced cement board) with a thickness of 16 mm, and dried for about 5 minutes with a dryer at about 80 ° C. to form a sealer layer. Next, the heat insulating paint shown in Table 1 was applied to the surface and dried for about 5 minutes with a dryer at about 80 ° C. to produce the building boards of Examples 1 to 7 and Comparative Examples 1 to 4. In each case, an inorganic plate having a flat pattern on the surface was used. Moreover, about what apply | coated the clear coating material, it dried with about 80 degreeC dryer for about 15 minutes, and formed the clear coating film.
各建築板の詳細は、表１に記載した通りである。
すなわち、実施例１では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてアクリロニトリルからなり、平均粒径が１５μｍ、平均中空率９８％の粒子を２．０質量部、水溶性溶剤としてエチレングリコールを２．０質量部含有する塗料を用いて、膜厚が５０μｍの断熱塗膜を形成した。そして、その上に、バインダーとしてスルフォン酸をグラフト重合したポリテトラフルオロエチレンを、光触媒としてアパタイトで表面を被覆した酸化チタンを該塗膜形成材の固形分１００質量部に対し１２．５質量部含有する塗料を塗布して、膜厚が０．５μｍの光触媒塗膜を形成した。
実施例２では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子として塩化ビニリデンとアクリロニトリルからなり、平均粒径が２０μｍ、平均中空率９８％の粒子を５．０質量部、水溶性溶剤としてプロピレングリコールを０．２質量部含有する塗料を用いて、膜厚が３０μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、バインダーとしてスルフォン酸をグラフト重合したポリテトラフルオロエチレンを、光触媒としてアパタイトで表面を被覆した酸化チタンを該塗膜形成材の固形分１００質量部に対し１２．５質量部含有する塗料を塗布して、膜厚が１．０μｍの光触媒塗膜を形成した。
実施例３では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてメタクリロニトリルとアクリル酸メチルからなり、平均粒径が４０μｍ、平均中空率９８％の粒子を０．５質量部、水溶性溶剤としてジエチレングリコールを１０質量部含有する塗料を用いて、膜厚が５００μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてポリオルガノシロキサンを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、バインダーとしてポリオルガノシロキサンを、光触媒として酸化チタンを該塗膜形成材の固形分１００質量部に対し５０質量部含有する塗料を塗布して、膜厚が１．０μｍの光触媒塗膜を形成した。
実施例４では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてアクリロニトリルからなり、平均粒径が１５μｍ、平均中空率９８％の粒子を２．０質量部、水溶性溶剤としてエチレングリコールを２．０質量部含有する塗料を用いて、膜厚が５０μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてポリオルガノシロキサンを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、バインダーとしてポリオルガノシロキサンを、光触媒として酸化チタンを該塗膜形成材の固形分１００質量部に対し５０質量部含有する塗料を塗布して、膜厚が１．０μｍの光触媒塗膜を形成した。
実施例５では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてアクリロニトリルからなり、平均粒径が１５μｍ、平均中空率９８％の粒子を２．０質量部含有する塗料を用いて、膜厚が１００μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、バインダーとしてスルフォン酸をグラフト重合したポリテトラフルオロエチレンを、光触媒として酸化チタンを該塗膜形成材の固形分１００質量部に対し５０質量部含有する塗料を塗布して、膜厚が１．０μｍの光触媒塗膜を形成した。
実施例６では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてアクリロニトリルからなり、平均粒径が１５μｍ、平均中空率９８％の粒子を２．０質量部、水溶性溶剤としてトリプロピレングリコールモノブチルエーテルを２．０質量部含有する塗料を用いて、膜厚が１００μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、バインダーとしてスルフォン酸をグラフト重合したポリテトラフルオロエチレンを、光触媒として酸化チタンを該塗膜形成材の固形分１００質量部に対し５０質量部含有する塗料を塗布して、膜厚が３．０μｍの光触媒塗膜を形成した。
実施例７では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてメタクリロニトリルとアクリル酸メチルからなり、平均粒径が４０μｍ、平均中空率９８％の粒子を０．５質量部、水溶性溶剤としてジエチレングリコールを１０質量部含有する塗料を用いて、膜厚が５００μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてフッ素エマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成し、更にその上に、バインダーとしてスルフォン酸をグラフト重合したポリテトラフルオロエチレンを、光触媒として酸化チタンを該塗膜形成材の固形分１００質量部に対し５０質量部含有する塗料を塗布して、膜厚が１．０μｍの光触媒塗膜を形成した。
一方、比較例１では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてアクリロニトリルからなり、平均粒径が１５μｍ、平均中空率９８％の粒子を２．０質量部、水溶性溶剤としてエチレングリコールを２．０質量部含有する塗料を用いて、膜厚が４０μｍの断熱塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成した。しかし、比較例１では、光触媒塗料を塗布せず、光触媒塗膜を形成させなかった。
比較例２では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを含有する塗料を用いて、膜厚が２０μｍの断熱塗膜を形成した。すなわち、比較例２では、中空粒子と水溶性溶剤を含有しない塗料を用いて塗膜を形成した。そして、その上に、塗膜形成材としてアクリルシリコンエマルションを含有するクリヤー塗料を塗布してクリヤー塗膜を形成したが、光触媒塗料は塗布しなかった。
比較例３では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを、中空粒子としてセラミックからなり、平均粒径１５０μｍで、平均中空率３０％の粒子を５．０質量部、水溶性溶剤としてプロピレングリコールを２．０質量部含有する塗料を用いて、膜厚が１００μｍの断熱塗膜を形成した。そして、比較例３では、クリヤー塗料と光触媒塗料は塗布しなかった。
比較例４では、断熱塗料に、塗膜形成材としてアクリルシリコンエマルションを含有するとともに、アクリル酸メチルからなり、平均粒径２０μｍで、平均中空率０％（中実）の粒子を２．０質量部、水溶性溶剤としてエチレングリコールを２．０質量部含有する塗料を用いて、膜厚が１００μｍの断熱塗膜を形成した。そして、比較例４では、クリヤー塗料と光触媒塗料を塗布しなかった。
Details of each building board are as described in Table 1.
That is, in Example 1, the heat insulating coating material was made of acrylic silicon emulsion as a coating film forming material and acrylonitrile as hollow particles, and 2.0 parts by mass of particles having an average particle diameter of 15 μm and an average hollowness ratio of 98%. Using a paint containing 2.0 parts by mass of ethylene glycol as a solvent, a heat insulating coating film having a thickness of 50 μm was formed. On top of that, 12.5 parts by mass of polytetrafluoroethylene graft-polymerized with sulfonic acid as a binder and titanium oxide whose surface is coated with apatite as a photocatalyst with respect to 100 parts by mass of the solid content of the coating film forming material The coating composition was applied to form a photocatalytic coating film having a thickness of 0.5 μm.
In Example 2, the heat-insulating coating material is made of acrylic silicon emulsion as a coating film forming material, made of vinylidene chloride and acrylonitrile as hollow particles, 5.0 parts by mass of particles having an average particle diameter of 20 μm and an average hollowness ratio of 98%, water-soluble A heat-insulating coating film having a film thickness of 30 μm was formed using a paint containing 0.2 parts by mass of propylene glycol as a reactive solvent. Then, a clear paint containing an acrylic silicon emulsion is applied as a coating film forming material to form a clear paint film, and polytetrafluoroethylene obtained by graft polymerization of sulfonic acid as a binder is further formed on the photocatalyst. A coating containing 12.5 parts by mass of titanium oxide whose surface was coated with apatite with respect to 100 parts by mass of the solid content of the coating film forming material was applied to form a photocatalytic coating film having a thickness of 1.0 μm.
In Example 3, the heat insulating paint is made of acrylic silicon emulsion as a coating film forming material, methacrylonitrile and methyl acrylate as hollow particles, and 0.5 mass of particles having an average particle diameter of 40 μm and an average hollowness ratio of 98%. Using a paint containing 10 parts by mass of diethylene glycol as a water-soluble solvent, a heat insulating coating film having a film thickness of 500 μm was formed. Then, a clear coating containing polyorganosiloxane is applied as a coating film forming material to form a clear coating, and further, polyorganosiloxane is used as a binder, and titanium oxide is used as a photocatalyst. A coating material containing 50 parts by mass with respect to 100 parts by mass of the solid content of the forming material was applied to form a photocatalyst coating film having a film thickness of 1.0 μm.
In Example 4, the heat insulating coating material is made of acrylic silicon emulsion as a coating film forming material and acrylonitrile as hollow particles, and the average particle size is 15 μm and the average hollowness ratio is 98% of particles as 2.0 parts by weight as a water-soluble solvent. A heat-insulating coating film having a thickness of 50 μm was formed using a paint containing 2.0 parts by mass of ethylene glycol. Then, a clear coating containing polyorganosiloxane is applied as a coating film forming material to form a clear coating, and further, polyorganosiloxane is used as a binder, and titanium oxide is used as a photocatalyst. A coating material containing 50 parts by mass with respect to 100 parts by mass of the solid content of the forming material was applied to form a photocatalyst coating film having a film thickness of 1.0 μm.
In Example 5, as the heat insulating paint, a paint containing acrylic silicon emulsion as the coating film forming material and acrylonitrile as the hollow particles, and containing 2.0 parts by mass of particles having an average particle diameter of 15 μm and an average hollowness ratio of 98% is used. Thus, a heat insulating coating film having a thickness of 100 μm was formed. Then, a clear paint containing an acrylic silicon emulsion is applied as a coating film forming material to form a clear paint film, and polytetrafluoroethylene obtained by graft polymerization of sulfonic acid as a binder is further formed on the photocatalyst. A coating containing 50 parts by mass of titanium oxide with respect to 100 parts by mass of the solid content of the coating film forming material was applied to form a photocatalytic coating film having a film thickness of 1.0 μm.
In Example 6, the heat insulating coating material is made of acrylic silicon emulsion as a coating film forming material and acrylonitrile as hollow particles, and 2.0 parts by mass of particles having an average particle diameter of 15 μm and an average hollowness ratio of 98% as a water-soluble solvent. A heat-insulating coating film having a film thickness of 100 μm was formed using a paint containing 2.0 parts by mass of tripropylene glycol monobutyl ether. Then, a clear paint containing an acrylic silicon emulsion is applied as a coating film forming material to form a clear paint film, and polytetrafluoroethylene obtained by graft polymerization of sulfonic acid as a binder is further formed on the photocatalyst. A coating containing 50 parts by mass of titanium oxide with respect to 100 parts by mass of the solid content of the coating film forming material was applied to form a photocatalytic coating film having a thickness of 3.0 μm.
In Example 7, the heat insulating coating material was made of acrylic silicon emulsion as a coating film forming material, methacrylonitrile and methyl acrylate as hollow particles, and 0.5 mass of particles having an average particle diameter of 40 μm and an average hollowness ratio of 98%. Using a paint containing 10 parts by mass of diethylene glycol as a water-soluble solvent, a heat insulating coating film having a film thickness of 500 μm was formed. Then, a clear coating containing a fluorine emulsion is applied as a coating film forming material to form a clear coating, and further, polytetrafluoroethylene obtained by graft polymerization of sulfonic acid as a binder is used as a photocatalyst. A coating containing 50 parts by mass of titanium oxide with respect to 100 parts by mass of the solid content of the coating film forming material was applied to form a photocatalytic coating film having a film thickness of 1.0 μm.
On the other hand, in Comparative Example 1, the heat insulating paint was made of acrylic silicon emulsion as a coating film forming material and acrylonitrile as hollow particles, and 2.0 parts by mass of particles having an average particle diameter of 15 μm and an average hollowness ratio of 98%. Using a paint containing 2.0 parts by mass of ethylene glycol as a solvent, a heat insulating coating film having a thickness of 40 μm was formed. Then, a clear paint containing an acrylic silicon emulsion was applied as a coating film forming material to form a clear paint film. However, in Comparative Example 1, the photocatalyst paint was not applied and the photocatalyst coating film was not formed.
In Comparative Example 2, a heat insulating paint film having a thickness of 20 μm was formed using a paint containing an acrylic silicon emulsion as a paint film forming material. That is, in Comparative Example 2, a coating film was formed using a paint that did not contain hollow particles and a water-soluble solvent. A clear coating containing an acrylic silicon emulsion was applied as a coating film forming material thereon to form a clear coating, but no photocatalytic coating was applied.
In Comparative Example 3, acrylic resin emulsion as a coating film forming material, ceramic as hollow particles, and 5.0 parts by mass of particles having an average particle size of 150 μm and an average hollowness of 30% as a water-soluble solvent are used as the heat insulating paint. A heat-insulating coating film having a thickness of 100 μm was formed using a paint containing 2.0 parts by mass of propylene glycol. In Comparative Example 3, the clear paint and the photocatalyst paint were not applied.
In Comparative Example 4, the heat insulating paint contains an acrylic silicon emulsion as a coating film forming material, is made of methyl acrylate, has an average particle diameter of 20 μm, and has an average hollowness of 0% (solid) of 2.0 mass. A heat-insulating coating film having a film thickness of 100 μm was formed using a paint containing 2.0 parts by mass of ethylene glycol as a water-soluble solvent. In Comparative Example 4, the clear paint and the photocatalyst paint were not applied.
実施例１〜７、比較例１〜４の建築板に対して、断熱効果の試験を行った。試験方法としてはランプ照射法を用いた。すなわち、建築板表面から１０ｃｍ離れた位置に配置した１００Ｖ、１５０Ｗのハロゲンランプによって、建築板の表面に光を照射した。そして、１０分間連続照射した時点において、建築板表面の温度を放射温度計を用いて測定し、初期の表面温度とした。初期の表面温度を測定した後、経年使用による汚れを想定してカーボン粉を３％含むケイ砂を各建築板の表面に散布し、その後、雨水を想定して霧吹きで水を散布し、粉体を除去した後、再度、各建築板の表面の温度を測定したので、その結果も表１に示す。 The heat insulation effect was tested on the building boards of Examples 1 to 7 and Comparative Examples 1 to 4. A lamp irradiation method was used as a test method. That is, the surface of the building board was irradiated with light by a 100 V, 150 W halogen lamp placed 10 cm away from the building board surface. And at the time of continuous irradiation for 10 minutes, the temperature of the building board surface was measured using the radiation thermometer, and it was set as the initial surface temperature. After measuring the initial surface temperature, spraying silica sand containing 3% carbon powder on the surface of each building board, assuming dirt due to aging, and then spraying water with a spray sprayer assuming rainwater. Since the temperature of the surface of each building board was measured again after removing the body, the results are also shown in Table 1.
なお、表１において、中空粒子（中実粒子）の含有量、及び水溶性溶剤の含有量は、塗料固形分１００質量部に対する質量部にて表されている。また、中空粒子（中実粒子）の平均中空率は、中空粒子（中実粒子）に対する体積百分率により表されている。 In Table 1, the content of the hollow particles (solid particles) and the content of the water-soluble solvent are expressed in parts by mass with respect to 100 parts by mass of the solid content of the paint. In addition, the average hollowness of the hollow particles (solid particles) is represented by a volume percentage with respect to the hollow particles (solid particles).
表１から分かるように、比較例２〜４の初期表面温度は、６０〜６５℃に達したのに対し、実施例１〜７の初期表面温度は、５０〜５６℃に収まった。
また、経時変化をみると、光触媒塗膜を形成していない比較例１〜４は、５〜８℃温度が上昇したのに対し、光触媒塗膜を形成した実施例１〜７は、１℃以下に温度上昇が抑えられていた。
すなわち、実施例１〜７では、確実に建築板の温度上昇を抑制することができ、その断熱性を維持することができると言える。
As can be seen from Table 1, the initial surface temperatures of Comparative Examples 2 to 4 reached 60 to 65 ° C, whereas the initial surface temperatures of Examples 1 to 7 were within 50 to 56 ° C.
Moreover, when the time-dependent change is seen, while Comparative Examples 1-4 which has not formed the photocatalyst coating film rose 5-8 degreeC temperature, Examples 1-7 which formed the photocatalyst film were 1 degreeC. The temperature rise was suppressed below.
That is, in Examples 1-7, it can be said that the temperature rise of a building board can be suppressed reliably and the heat insulation can be maintained.
以上に本発明の一実施形態について説明したが、本発明はこれに限定されず、特許請求の範囲に記載の発明の範囲において種々の変形態を取り得る。例えば、断熱塗料、クリヤー塗料、光触媒塗料として、更に、炭酸カルシウム、クレー、アクリルビーズなどの充填剤、艶消しビーズ、光安定剤、紫外線吸収剤を含む塗料を用いても良い。 Although one embodiment of the present invention has been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the invention described in the claims. For example, as a heat insulating paint, a clear paint, and a photocatalyst paint, a paint containing a filler such as calcium carbonate, clay, and acrylic beads, matte beads, a light stabilizer, and an ultraviolet absorber may be used.
以上説明したように、本発明によれば、汚れによる断熱性の低下を防ぐことができる建築板及びその製造方法を提供することができる。 As described above, according to the present invention, it is possible to provide a building board capable of preventing a decrease in heat insulation due to dirt and a method for manufacturing the same.
Claims (10)
前記断熱塗膜は、塗膜形成材と、有機系中空粒子と、水溶性溶剤とを含有し、
前記光触媒塗膜は、光触媒とバインダーとを含有し、
前記光触媒塗膜は最表側に形成されており、
前記有機系中空粒子の平均中空率は９０％以上であり、
前記水溶性溶剤は、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上により構成されている
ことを特徴とする建築板。 A building board having a heat insulating coating and a photocatalytic coating on the surface of the inorganic board,
The heat insulating coating film contains a coating film forming material, organic hollow particles, and a water-soluble solvent .
The photocatalyst coating film contains a photocatalyst and a binder,
The photocatalyst coating film is formed on the outermost side ,
The average hollowness of the organic hollow particles is 90% or more,
The building board , wherein the water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent .
ことを特徴とする請求項１に記載の建築板。 The building board according to claim 1, wherein the organic hollow particles are composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, and acrylate.
ことを特徴とする請求項１に記載の建築板。 The thermal insulation coating, the water-soluble solvent, when said solids adiabatic coating is 100 parts by mass, building of claim 1, characterized by containing 0.1 to 10 parts by weight Board.
前記クリヤー塗膜の表面には前記光触媒塗膜が形成されている
ことを特徴とする請求項１に記載の建築板。 A clear coating is formed on the surface of the heat insulating coating,
The building board according to claim 1 , wherein the photocatalytic coating film is formed on a surface of the clear coating film .
ことを特徴とする請求項１に記載の建築板。 The building board according to claim 1, wherein the binder is composed of at least one of polytetrafluoroethylene and organopolysiloxane obtained by graft polymerization of sulfonic acid .
前記断熱塗膜の上に、光触媒とバインダーとを含有する光触媒塗料を塗布し、光触媒塗膜を形成する工程とを備え、A step of applying a photocatalyst paint containing a photocatalyst and a binder on the heat insulating coating, and forming a photocatalytic coating,
前記有機系中空粒子の平均中空率は９０％以上であり、The average hollowness of the organic hollow particles is 90% or more,
前記水溶性溶剤は、グリコール系溶剤及びグリコールエーテル系溶剤の少なくとも１種以上により構成されており、The water-soluble solvent is composed of at least one of a glycol solvent and a glycol ether solvent,
前記光触媒塗膜を最表側に形成するThe photocatalyst coating film is formed on the outermost side
ことを特徴とする建築板の製造方法。The manufacturing method of the building board characterized by the above-mentioned.
ことを特徴とする請求項６に記載の建築板の製造方法。 The organic hollow particles are composed of at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, and acrylate.
The manufacturing method of the building board of Claim 6 characterized by the above-mentioned .
ことを特徴とする請求項６に記載の建築板の製造方法。 The building board according to claim 6 , wherein the heat-insulating paint contains 0.1 to 10 parts by mass of the water-soluble solvent when the solid content of the heat-insulating paint is 100 parts by mass. Manufacturing method.
ことを特徴とする請求項６に記載の建築板の製造方法。 The step of forming the photocatalyst coating is performed by forming the heat insulating coating, then applying a clear coating to form a clear coating, and applying the photocatalytic coating to the surface of the clear coating. The manufacturing method of the building board of Claim 6 characterized by the above-mentioned.
ことを特徴とする請求項６に記載の建築板の製造方法。 The method for producing a building board according to claim 6 , wherein the binder of the photocatalyst coating film is composed of at least one of polytetrafluoroethylene and organopolysiloxane obtained by graft polymerization of sulfonic acid .
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