JP6207555B2 - Wiring body, structure with conductor layer, and touch sensor - Google Patents

Description

  The present invention relates to a wiring body, a structure with a conductor layer, and a touch sensor.

  A conductive sheet having an electrode pattern, an electrode terminal electrically connected to an end of the electrode pattern, and an external wiring electrically connected to the electrode pattern via the electrode terminal is known. (For example, refer to Patent Document 1).

JP 2013-127658 A

  In the said electrically conductive sheet, since an electrode pattern and external wiring are connected through an electrode terminal, there exists a problem of inhibiting size reduction of an electrically conductive sheet.

  In addition, due to the difference in rigidity between the electrode pattern and the external wiring, stress concentrates on these connection portions, which may cause breakage between the electrode pattern and the external wiring, resulting in poor connection reliability. There is.

  The problem to be solved by the present invention is to provide a wiring body, a structure with a conductor layer, and a touch sensor capable of reducing the size and improving the connection reliability between the electrode pattern and the lead-out wiring. is there.

[1] A wiring body according to the present invention is interposed between an electrode pattern, a lead wire formed in a mesh shape by a plurality of second conductor wires, and the electrode pattern and the lead wire, and the electrode pattern And a boundary wiring that electrically connects the lead-out wiring, and the lead-out wiring is electrically connected to the boundary wiring at one end, and has at least two branch lines formed in a mesh shape, and all A main line that is electrically connected to the branch line and formed in a mesh shape, and the adjacent branch lines are separated from each other, and between the adjacent branch lines, the A region where the second conductor line is not formed is provided, and the opening ratio of the lead wiring is 10 to 50% .
[2] In the above invention, the second conductor wire constituting the branch line is disposed to be inclined with respect to the extending direction of the branch line, and a side end portion of the branch line is formed of the branch line. In the extending direction of the line, the plurality of second conductor lines constituting the branch line may extend in a zigzag shape.

[ 3 ] In the above invention, the electrode pattern has a plurality of first conductor lines, and the electrode pattern is formed in a mesh shape by the first conductor lines, and satisfies the following formula (1): Good.
W ₁ <W ₂ (1)
However, in the above equation (1), W ₁ is the width of the first conductor line, and W ₂ is the width of the boundary wiring.

[ 4 ] In the above invention, the plurality of first conductor lines intersect each other to define a plurality of openings having the same shape, and may satisfy the following expression (2).
D < L (2)
However, in the above equation (2), D is the maximum value of the width of the opening in the extending direction of the boundary wiring, and L is the distance between the adjacent branch lines in the extending direction of the boundary wiring. .

[5] In the above invention, the following expression (3) may be satisfied.
W ₁ <W ₃ (3)
However, in the above equation (3), W ₁ is the width of the first conductor line, and W ₃ is the width of the second conductor line.

[6] In the above invention, the wiring body may further include a resin layer, and the electrode pattern, the lead-out wiring, and the boundary wiring may be provided on the resin layer.

[7] A structure with a conductor layer according to the present invention is a structure with a conductor layer including the wiring body and a support body provided on at least one main surface of the wiring body.

[8] A touch sensor according to the present invention is a touch sensor including the structure with a conductor layer.

  According to the present invention, since the electrode pattern and the lead-out wiring are electrically connected via the boundary wiring, no electrode terminal is required for these electrical connections. Thereby, size reduction of a wiring body is achieved.

  Further, according to the present invention, the lead-out wiring has at least two branch lines having one end connected to the boundary wiring. For this reason, since the stress applied to the connection portion between the lead-out wiring and the boundary wiring is dispersed, it is possible to suppress breakage of these. Thereby, it is possible to improve the connection reliability between the electrode pattern and the lead wiring via the boundary wiring.

FIG. 1 is a plan view showing a touch sensor according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a plan view showing the wiring body according to the embodiment of the present invention, and is a diagram for explaining the first conductor layer. FIG. 4 is a partially enlarged view of a portion IV in FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. FIG. 7 is an explanatory diagram for explaining the aperture ratio. 8 is a cross-sectional view taken along line VIII-VIII in FIG. FIG. 9A to FIG. 9E are cross-sectional views illustrating a method (part 1) of manufacturing a wiring board according to an embodiment of the present invention. FIG. 10A to FIG. 10C are cross-sectional views showing the recesses formed in the first intaglio. FIG. 11A to FIG. 11F are cross-sectional views illustrating a method (part 2) of manufacturing a wiring board according to an embodiment of the present invention. 12 (a) to 12 (c) are cross-sectional views showing the recesses formed in the second intaglio. FIG. 13 is a plan view showing a first modification of the first conductor layer according to the embodiment of the present invention. FIG. 14 is a plan view showing a second modification of the first conductor layer according to the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in order to make the features of the present invention easier to understand, the drawings used in the following description may show the main parts in an enlarged manner for convenience, and the dimensional ratios of the respective components are the same as the actual ones. Not necessarily.

  1 is a plan view showing a touch sensor according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1, and FIG. 3 is a wiring body according to an embodiment of the present invention. 4 is a plan view for explaining the first conductor layer, FIG. 4 is a partially enlarged view of a portion IV in FIG. 3, FIG. 5 is a sectional view taken along the line VV in FIG. 4, and FIG. 4 is a sectional view taken along line VI-VI in FIG. 4, FIG. 7 is an explanatory view for explaining the aperture ratio, and FIG. 8 is a sectional view taken along line VIII-VIII in FIG.

  The touch panel 1 of the present embodiment is a projected capacitive touch panel sensor, and is used as an input device having a function of detecting a touch position in combination with a display device (not shown), for example. The display device is not particularly limited, and a liquid crystal display, an organic EL display, or the like can be used. The touch panel 1 includes a light-transmitting detection electrode and a drive electrode that are arranged to face each other, and a predetermined voltage is periodically applied between the two electrodes.

  In such a touch panel 1, for example, when an operator's finger (external conductor) approaches the touch panel 1, a capacitor (capacitance) is formed between the external conductor and the touch panel 1, and electricity between two electrodes is formed. Changes. The touch panel 1 can detect the operation position of the operator based on the electrical change between the two electrodes. The “touch panel 1” in the present embodiment corresponds to an example of the “touch sensor” in the present invention.

  As shown in FIGS. 1 and 2, the touch panel 1 of the present embodiment includes a wiring substrate 2. The wiring board 2 includes a base material 3 and a wiring body 4. The “wiring board 2” in the present embodiment corresponds to an example of the “structure with conductor layer” in the present invention. In FIG. 1, in order to facilitate understanding of the structure of the wiring body 4, the third resin layer 15 (described later) is omitted, and the second conductor layer 11 (described later) is indicated by a solid line.

  The substrate 3 is made of a material having transparency (translucency). For example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide resin (PI), polyetherimide resin (PEI), Examples include materials such as polycarbonate (PC), polyetheretherketone (PEEK), liquid crystal polymer (LCP), cycloolefin polymer (COP), silicone resin (SI), acrylic resin, phenol resin, epoxy resin, green sheet, glass, etc. it can. The “base 3” in the present embodiment corresponds to an example of the “support” in the present invention.

  The wiring body 4 is formed on the main surface 31 of the base material 3 and is supported by the base material 3. As shown in FIG. 2, the wiring body 4 includes a first resin layer 5, a first conductor layer 6, a second resin layer 10, a second conductor layer 11, and a third resin layer. 15. The “wiring body 4” in the present embodiment corresponds to an example of the “wiring body” in the present invention. In FIG. 2, the lower surface of the second conductor layer 11 is shown in a straight line shape, but this is an easy-to-understand illustration, and is actually an uneven surface composed of fine unevenness. .

  The 1st resin layer 5 is comprised with the material which has transparency (translucency), for example, an epoxy resin, an acrylic resin, a polyester resin, a urethane resin, a vinyl resin, a silicone resin, a phenol resin, a polyimide resin etc. UV curable resin, thermosetting resin, or thermoplastic resin can be used. As shown in FIG. 2, the first resin layer 5 includes a flat portion 51 provided with a substantially constant thickness and a support portion 52 formed on the flat portion 51.

  The flat part 51 is uniformly provided so as to cover the main surface 31 of the substrate 3. The support part 52 is formed between the flat part 51 and the first conductor layer 6, and is formed so as to protrude in a direction away from the base material 3 (+ Z direction in FIG. 2). The first resin layer 5 is in contact with the first conductor layer 6 on the upper surface of the support portion 52 (the upper surface in FIG. 2). The support portion 52 has side surfaces that are inclined so as to approach each other as the distance from the base material 3 increases in the short-side cross-sectional view.

  The first conductor layer 6 is composed of conductive powder and a binder resin. Examples of the conductive powder constituting the first conductor layer 6 include metals such as silver, copper, nickel, tin, bismuth, zinc, indium, and palladium, and graphite. In addition to the conductive powder, a metal salt that is a salt of the metal described above may be used. Examples of the binder resin constituting the first conductor layer 6 include acrylic resin, polyester resin, epoxy resin, vinyl resin, urethane resin, phenol resin, and polyimide resin. Note that the binder resin may be omitted from the material constituting the first conductor layer 6.

  As shown in FIG. 3, the first conductor layer 6 includes a first electrode pattern 7, a first lead wiring 8, and a first boundary wiring 9. The first electrode pattern 7 is a detection electrode of the touch panel 1. The first lead wiring 8 is provided for taking out a detection signal from the first electrode pattern 7 to the outside of the touch panel 1. The first boundary wiring 9 is provided to electrically connect the first electrode pattern 7 and the first lead wiring 8. In the present embodiment, the first electrode pattern 7, the first lead wiring 8, and the first boundary wiring 9 are integrally formed. The term “integrally” means that the members are not separated from each other and are formed as an integrated structure of the same material (conductive particles having the same particle diameter, binder resin, etc.). The “first electrode pattern 7” in the present embodiment corresponds to an example of the “electrode pattern” in the present invention, and the “first lead wiring 8” in the present embodiment corresponds to an example of the “leading wiring” in the present invention. The “first boundary wiring 9” in the present embodiment corresponds to an example of the “boundary wiring” in the present invention.

  The first conductor layer 6 of the present embodiment has three first electrode patterns 7 that extend substantially in parallel along the Y direction. The electrodes (drive electrode and detection electrode) of the touch panel 1 need to have translucency so that video information displayed on the display device can be visually recognized. Therefore, as shown in FIG. 4, the first electrode pattern 7 of the present embodiment is formed in a mesh shape formed by intersecting a plurality of conductive first conductor lines 71a and 71b. Sex has been granted. In the following description, “first conductor line 71a” and “first conductor line 71b” are collectively referred to as “first conductor line 71” as necessary. The “first conductor wire 71” in the present embodiment corresponds to an example of the “first conductor wire” in the present invention.

  As shown in FIG. 5, the outer shape of the first conductor wire 71 includes a contact surface 711, a top surface 712 that is the surface opposite to the contact surface 711, and two side surfaces 713. The first conductor wire 71 protrudes toward the side away from the first resin layer 5 in the Z direction. The contact surface 711 is an uneven surface composed of fine unevenness and is in contact with the first resin layer 5. Since the first electrode pattern 7 is supported by the first resin layer 5 (specifically, the support portion 52), the contact surface 711 has the first resin layer 5 with respect to the top surface 712. Will be located on the side. The side surfaces 713 and 713 are substantially flat surfaces that are inclined so as to approach each other as the distance from the first resin layer 5 increases in the short-side cross-sectional view. The side surfaces 713 and 713 are continuous with the side surface of the support portion 52 of the first resin layer 5 in contact therewith.

  The surface roughness of the contact surface 711 of the first conductor wire 71 in the present embodiment is the roughness of the top surface 712 from the viewpoint of firmly fixing the first conductor wire 71 and the first resin layer 5. On the other hand, it is preferably relatively rough. Specifically, the surface roughness Ra of the contact surface 711 is about 0.1 to 3.0 μm, whereas the surface roughness Ra of the top surface 712 is about 0.001 to 1.0 μm. It is more preferable that the surface roughness Ra of the top surface 712 is 0.001 to 0.3 μm. Such surface roughness can be measured by the JIS method (JIS B0601 (revised on March 21, 2013)).

The width W ₁₁ of the first conductor wire 71 is preferably 100 nm to 100 μm, more preferably 500 nm to 10 μm, and even more preferably 500 nm to 5 μm. In addition, the height of the first conductor wire 71 is preferably 100 nm to 300 μm, and more preferably 1 μm to 50 μm.

In the first electrode pattern 7 of the present embodiment, as described below, the first conductor wire 71 described above is disposed. As shown in FIG. 4, the first conductor wire 71 a extends linearly along a direction inclined at + 45 ° with respect to the X direction (hereinafter also simply referred to as “first direction”). cage, the plurality of first conductor line 71a is a direction substantially orthogonal to the first direction (hereinafter, simply referred to as "second direction".) is ordered at equal pitches P ₁₁ Yes.

In contrast, the first conductive line 71b extends in a straight line along the second direction, the plurality of first conductor lines 71b are arranged at equal pitches P ₁₂ in a first direction It has been. The first conductor lines 71a and 71b are orthogonal to each other, so that rectangular (diamond-shaped) openings 72 defined between the first conductor lines 71a and 71b are repeatedly arranged. . In the present specification, the pitch means a center-to-center distance.

Incidentally, the configuration of the first electrode pattern 7 is not particularly limited to the above. For example, in this embodiment, although the pitch _{P 11} of the first conductor line 71a and the pitch _{P 12} of the first conductor line 71b is substantially the same _(P 11 ₌ P _12), limited to It not, may be made different from the pitch _{P 12} between the pitch _{P 11} of the first conductor line 71a first conductor line _{71b (P 11 ≠ P 12)} . Further, the extending direction of the first conductor wire 71 is not particularly limited to the above, and may be arbitrary. In the present embodiment, the first conductor wire 71 is linear, but is not particularly limited thereto, and may be, for example, a curved shape, a horseshoe shape, a zigzag line shape, or the like.

  In the present embodiment, the first electrode pattern 7 forms the square-shaped opening 72 by making the first conductor lines 71a and 71b orthogonal to each other. A graphic unit can be used as the shape of the opening 72. For example, the shape of the opening 72 may be a triangle such as an equilateral triangle, an isosceles triangle, a right triangle, a rectangle, a square, a rhombus, a parallelogram, a trapezoid, or the like, or a hexagon, an octagon, a dodecagon, a two It may be an n-gon such as a decagon, a circle, an ellipse, or a star. Moreover, in this embodiment, although the several opening 72 has the mutually same shape, it is not limited to this in particular, The opening of a different shape may be mixed according to the shape and arrangement | positioning of a conductor wire. The “opening 72” in the present embodiment corresponds to an example of the “opening” in the present invention.

  As shown in FIG. 3, the first lead wiring 8 is provided corresponding to the first electrode pattern 7, and in the present embodiment, three first electrode patterns 7 are provided for three first electrode patterns 7. Lead-out wiring 8 is formed. The first lead wiring 8 is led out from the −Y direction side in the drawing of the first electrode pattern 7 via the first boundary wiring 9 on one end side.

  As shown in FIG. 4, the first lead wiring 8 includes a plurality of branch lines 83 (three in this embodiment) and one main line 84. The plurality of branch lines 83 are electrically connected to the corresponding first boundary wiring 9 at one end 831. Of the three branch lines 83, the branch line 83a located at the center is drawn from a position substantially corresponding to the center in the X direction of the corresponding first electrode pattern 7 (see FIG. 3). On the other hand, the other branch lines 83b and 83c are drawn from a position separated from the branch line 83a. The aforementioned “branch line 83” is a general term for “branch line 83a”, “branch line 83b”, and “branch line 83c”.

In the present embodiment, as shown in FIG. 4, the branch line 83 a is disposed in a straight line, while the branch lines 83 b and 83 c are disposed while being bent, and the other ends of the plurality of branch lines 83. Portions 832 are assembled at connection portion 85 so as to be electrically connected to each other. Distance L ₃ between the branch lines 83 and adjacent, not limited in particular, may be a distance equal to one another, different distances may be mixed.

The distance L ₃ between the adjacent branch lines 83 is set so as to satisfy the following expression (4) in relation to the maximum value D of the width of the opening 72 of the first electrode pattern 7. It is preferable.
D ≦ L ₃ (4)
However, in the above (4), D is the maximum value of the width of the opening 72 in the extending direction of the first boundary line 9, L ₃ is line branches adjacent in the extending direction of the first boundary line 9 This is the distance between 83.

In the present embodiment, the width W ₃₃ of each branch line 83 is not particularly limited, and may be substantially the same width or different width. For example, from the viewpoint of suppressing the difference in electrical resistance value between the branch lines 83, the width W ₃₃ of the branch line 83 may be set according to the total length of each branch line 83. In this case, for example, in this embodiment, since the total length of the bent branch lines 83b and 83c is larger than the straight branch line 83a, the widths W _33b and W _33c of the branch lines 83b and 83c are set as follows. The width W _33a of the branch line 83a may be increased. Incidentally, the "width _{W 33"} described above, the "width _{W 33a",} the "width _W33b" is a generic term for the "width _{W 33c".}

  The main line 84 is electrically connected to all the branch lines 83 through the connection portion 85. The main line 84 is drawn out from the connection portion 85 and extends until one end portion is located in the vicinity of the outer edge of the wiring body 4 (see FIG. 3). In the present embodiment, in the vicinity of the connecting portion 85, the main line 84 and the branch line 83a extend along the same direction so as to be apparently continuous. The connection portion 85 that connects the branch line 83 and the main line 84 is not particularly limited as long as the connection portion 85 is located until the first electrode pattern 7 is connected to the external circuit.

In the present embodiment, the relationship between the width W ₃₃ of the branch line 83 and the width W _{34 of the} main line 84 is not particularly limited. For example, the width W ₃₃ of the respective branch line 83, the width W ₃₄ of the main line 84, may be substantially the same, these widths may be different. That may be a large width _{W 34} of the main line 84 than the width _{W 33} of any branch line 83 may be smaller width _{W 34} of the main line 84 than the width _{W 33} of any branch line 83. When the width W ₃₄ of the main line 84 is larger than the width W ₃₃ of any branch line 83, a plurality of widths W _{34 of the} main line 84 are used from the viewpoint of suppressing a difference in electrical resistance value between the branch line 83 and the main line 84. Alternatively, the width W ₃₃ of the branch lines 83 may be set to be approximately the same as the total.

  The “branch line 83” in the present embodiment corresponds to an example of the “branch line” in the present invention, and the “main line 84” in the present embodiment corresponds to an example of the “main line” in the present invention.

  As shown in FIG. 4, the first lead wiring 8 including the branch line 83 and the main line 84 includes a plurality of conductive second conductor lines 81 a and 81 b as in the first electrode pattern 7. It is formed in a mesh shape that intersects. In the following description, “second conductor line 81a” and “second conductor line 81b” are collectively referred to as “second conductor line 81” as necessary. The “second conductor wire 81” in the present embodiment corresponds to an example of the “second conductor wire” in the present invention.

  In the touch panel 1, the first lead-out wiring 8 is provided so as not to overlap with the video information displayed on the display device. Therefore, the first electrode pattern 7 does not need to have translucency. In the present embodiment, the first lead wiring 8 is formed in a mesh shape from the viewpoint of easily forming the first lead wiring 8 integrally.

  As shown in FIG. 6, the second conductor wire 81 includes a contact surface 811, a top surface 812 that is a surface opposite to the contact surface 811, and two side surfaces 813. The basic configuration of the outer shape of the second conductor wire 81 is the same as that of the first conductor wire 71 described above. Therefore, in the following description, differences from the first conductor wire 71 will be described in detail. To do.

In the present embodiment, the width W _{31 of} the second conductor line 81 is related to the width W _{11 of} the first conductor line 71 from the viewpoint of reducing the electrical resistance value in the first lead wiring 8. Are set to satisfy the following expression (5) (see FIGS. 4 to 6).
W ₁₁ <W ₃₁ (5)
However, in the above equation (5), W ₁₁ is the width of the first conductor line 71 in the direction orthogonal to the extending direction of the first conductor line 71, and W ₃₁ is the width of the second conductor line 81. This is the width of the second conductor line 81 in the direction orthogonal to the extending direction. Here, the “width” means an average maximum width in a direction orthogonal to the extending direction of the conductor wire.

In this case, the specific value of the width W ₃₁ of the second conductor wire 81 is preferably 1 μm to 500 μm, more preferably 3 μm to 100 μm, and even more preferably 3 to 20 μm. Note that the height of the second conductor wire 81 is preferably 100 nm to 300 μm, and more preferably 1 μm to 50 μm.

Further, the surface obtained by leveling the uneven shape of the contact surface 811 in the second conductor wire 81 of the present embodiment is farther from the base material 3 than the surface obtained by leveling the uneven shape of the contact surface 711 in the first conductor wire 71. The curve is gently curved in the direction (see FIGS. 5 and 6), and the relationship between the first and second conductor wires 71 and 81 is set so as to satisfy the following equations (6) and (7) It is preferable that
S ₁ <S ₂ (6)
R ₁ <R ₂ (7)
However, in the above (6), S ₁ is the average maximum in adhesion portion thickness (in-plane entire cross section of the first resin layer 5 in the (adhesive surface) of the contact surface 711 of the first conductor wire 71 S ₂ is the thickness of the first resin layer 5 at the bonding portion (bonding surface) with the contact surface 811 of the second conductor wire 81 (average maximum thickness in cross-sectional view of the entire surface). It is. In the above equation (7), R ₁ is the curvature of the surface of the first conductor wire 71 that levels the contact surface 711, and R ₂ is the surface of the second conductor wire 81 that levels the contact surface 811. Curvature.

  In addition, “average maximum thickness in a cross-sectional view of the entire in-plane” means that a plurality of cross sections along the width direction of each conductor wire are sampled over the entire extending direction of the conductor wire, and each cross section is taken. Is the average of the maximum thickness required. Incidentally, the conductor lines include first and second conductor lines 71 and 81.

In the first lead wiring 8 of the present embodiment, as described below, the above-described second conductor line 81 is provided. As shown in FIG. 4, the second conductor lines 81 a extend linearly along the first direction, and the plurality of second conductor lines 81 a have a constant pitch P in the second direction. ₂₁ .

In contrast, the second conductor line 81b extends in a straight line along the second direction, the plurality of second conductor lines 81b are arranged at equal pitches P ₂₂ in the first direction It has been. The second conductor lines 81a and 81b are orthogonal to each other, so that rectangular (rhombus-shaped) openings 82 defined between the second conductor lines 81a and 81b are repeatedly arranged. .

Further, the configuration of the first lead wiring 8 is not particularly limited to the above. For example, in the present embodiment, the pitch _{P 21} of the second conductor line 81a is substantially the same and the pitch _{P 22} of the second conductor line _{81b (P 21 = P 22)} , limited to It not, may be made different from the pitch _{P 22} between the pitch _{P 21} of the second conductor line 81a the second conductor line _{81b (P 21 ≠ P 22)} .

In this case, the pitch P ₁ between the adjacent first conductor lines 71 in the first electrode pattern 7 (collectively referring to the pitches P ₁₁ and P ₁₂ ) and the first lead-out wiring 8 corresponding to the pitch P ₁ . The relationship between the adjacent second conductor wires 81 in the pitch P ₂ (collectively referring to the pitches P ₂₁ and P ₂₂ ) is set to satisfy the following expressions (8) and (9). preferable.
P ₁₁ > P ₂₁ (8)
P ₁₂ > P ₂₂ (9)
However, as the relationship between the pitch P ₁ and the pitch P _2, are those relative to the extending direction of the first and second conductor lines 71 and 81, specifically, adjacent the first conductor the pitch _{P 11} of the lines 71a between the pitch _{P 21} between the second conductor line 81a adjacent corresponds, the pitch _{P 12} between the first conductor line 71b adjacent, adjacent second conductor line 81b to each other and the pitch _{P 22} of correspond.

As a result, in the present embodiment, the (5), in view of the (8) and (9), the opening ratio A ₁ of the first electrode pattern 7, the opening ratio A ₂ of the first extraction conductive layer 8 Is preferably set so as to satisfy the following expression (10).
A ₁ > A ₂ (10)

Specifically, the aperture ratio A1 of the _first electrode pattern 7 is preferably 85% or more and less than 100% from the viewpoint of improving the translucency in the first electrode pattern 7. More preferably, it is 90% or more and less than 100%. On the other hand, the aperture ratio A ₂ of the first extraction conductive layer 8, the viewpoint and the durability of the first extraction conductive layer 8 to reduce the difference in rigidity between the first electrode pattern 7 and the first lead-out wiring 8 From the viewpoint of improving the content, it is preferably 50% or less, and more preferably 10% or more.

The “aperture ratio” means a ratio represented by the following formula (11) (see FIG. 7).
(Aperture ratio) = b × b / (a × a) (11)
However, in the above formula (11), a is a pitch (distance between the center lines CL) between an arbitrary conductor line 20 and another conductor line 20 adjacent to the conductor line 20, and b is an arbitrary The distance between the conductor line 20 and another conductor line 20 adjacent to the conductor line 20 is represented.

  The extending direction of the second conductor wire 81 of the present embodiment is not particularly limited to the above as in the case of the first conductor wire 71 and can be arbitrary. Further, in the present embodiment, the second conductor wire 81 is linear, but is not particularly limited thereto, and may be, for example, a curved shape, a horseshoe shape, a zigzag line shape, or the like.

  In the first lead wiring 8, the shape of the opening 82 can use various graphic units as the shape of the opening 82 as in the case of the first electrode pattern 7. Moreover, in this embodiment, although the some opening 82 has the mutually same shape, it is not limited to this in particular, The opening of a different shape may be mixed by the shape and arrangement | positioning of a conductor wire.

  As shown in FIG. 3 and FIG. 4, the first boundary wiring 9 is provided corresponding to the first electrode pattern 7. In the present embodiment, three first boundary wirings 9 are provided for three first electrode patterns. A first boundary wiring 9 is formed. The first boundary wiring 9 is disposed along the outer edge of the first electrode pattern 7.

As shown in FIG. 8, the first boundary wiring 9 includes a contact surface 91, a top surface 92 that is a surface opposite to the contact surface 91, and two side surfaces 93. The basic configuration of the outer shape of the first boundary wiring 9 is the same as that of the second conductor line 81 described above. In other words, the relationship between the width W _{11 of} the first conductor line 71 constituting the first electrode pattern 7 and the width W _{2 of} the first boundary wiring 9 is set so as to satisfy the following expression (12). Yes.
W ₁₁ <W ₂ (12)
However, in the above equation (12), W ₂ is the width of the first boundary wiring 9 in the direction orthogonal to the extending direction of the first boundary wiring 9.

As shown in FIGS. 3 and 4, the first boundary wiring 9 extends along the X direction. In the present embodiment, the first boundary wiring 9 is substantially equal to the width W _{12 of} the first electrode pattern 7. to are those having a length L ₂ that match, as a result, constituting the first electrode pattern 7 is electrically connected to the first conductor wire 71 of more than at least two. The length L ₂ of the first boundary wiring 9 is not particularly limited to the above, but the length L _{2 of} the first boundary wiring 9 is larger than the width W _{12 of} the first electrode pattern 7. If the length is longer, the adjacent first boundary wirings 9 may come into contact with each other, and the touch panel 1 may be deteriorated in quality. Therefore, the length L ₂ of the first boundary wiring 9 is preferably equal to or less than the width W _{12 of} the first electrode pattern 7 (W ₁₂ ≧ L ₂ ).

On the other hand, the first boundary wiring 9 is also electrically connected to each of the plurality of branch lines 83 constituting the first lead wiring 8. In this case, the width W ₃₂ of the first lead-out wiring 8 (that is, the other end on both sides of the first lead-out wiring 8 from the outer end portion of the branch line constituting one of the both end sides of the first lead-out wiring 8 is It is preferable that the length L _{2 of} the first boundary wiring 9 is longer than the distance to the outer end portion of the branch line constituting the structure (W ₃₂ ≦ L ₂ ).

  As shown in FIG. 2, the second resin layer 10 is formed on the first resin layer 5 so as to cover the first conductor layer 6. A second conductor layer 11 is formed on the second resin layer 10. As a result, the second resin layer 10 is interposed between the first conductor layer 6 and the second conductor layer 11 and has a function of ensuring the insulation thereof. In the touch panel 1, the second resin layer 10 interposed between the detection electrode and the drive electrode (that is, the first and second electrode patterns 7 and 12) acts as a dielectric, and this second resin layer. The sensitivity of the touch panel 1 is adjusted according to the thickness of 10.

  The second resin layer 10 includes a main part 101 that covers the first conductor layer 6 and a support part 102 that is formed on the main part 101. The support portion 102 is formed between the main portion 101 and the second conductor layer 11, and is formed so as to protrude in a direction away from the first resin layer 5 (upward direction in FIG. 3). Yes. The material constituting the second resin layer 10 can be exemplified by the same material as that constituting the first resin layer 5.

  As shown in FIGS. 1 and 2, the second conductor layer 11 has a second electrode pattern 12, a second lead wiring 13, and a second boundary wiring 14. The second electrode pattern 12 is a drive electrode of the touch panel 1. The second lead wiring 13 is provided to transmit a drive signal (apply a predetermined voltage) for detecting the touch position to the second electrode pattern 12. The second boundary wiring 14 is provided to electrically connect the second electrode pattern 12 and the second lead wiring 13 corresponding to the second electrode pattern 12.

  The basic configuration of the second conductor layer 11 of this embodiment is the same as that of the first conductor layer 6 described above. Therefore, in the following description, the difference between the second conductor layer 11 and the first conductor layer 6 will be described in detail, and the other basic configurations are the same as those of the first conductor layer 6. Therefore, detailed description is omitted.

  As shown in FIG. 1, the second conductor layer 11 of the present embodiment has four second electrode patterns 12 extending substantially in parallel along the X direction. The plurality of second electrode patterns 12 are arranged so as to face the first electrode pattern 7 through the second resin layer 10 in plan view.

  As shown in FIG. 1, the second lead-out wiring 13 is provided corresponding to the second electrode pattern 12, and in the present embodiment, four second electrode patterns 12 are provided for the four second electrode patterns 12. Lead-out wiring 13 is formed.

  In the present embodiment, the second lead wirings 13 corresponding to the two second electrode patterns 12 located on the + Y direction side are drawn from the −X direction side of the second electrode pattern 12. On the other hand, the second lead wires 13 corresponding to the remaining second electrode patterns 12 (that is, two located on the −Y direction side) are drawn from the + X direction side of the second electrode patterns 12. . These second lead wirings 13 extend to the vicinity of the main line 84 of the first lead wiring 8 while avoiding overlapping with regions where the first and second electrode patterns 7 and 12 are formed in a plan view. It is installed.

  Similarly to the first lead-out wiring 8, the second lead-out wiring 13 includes a plurality of branch lines 133 (three in this embodiment) and one main line 134. The plurality of branch lines 133 arranged along the Y direction are arranged such that the distances between adjacent branch lines 133 are the same, and each branch line 133 is connected to the corresponding second boundary wiring 14. Electrically connected. The plurality of branch lines 133 are gathered so as to be electrically connected to each other at the connection portion 135, and the main line 134 is drawn from the connection portion 135. Note that the shapes of the branch line 133 and the main line 134 in the second lead-out wiring 13 are substantially the same as the shapes of the branch line 83 and the main line 84 in the first lead-out wiring 8 described above. The positional relationship between the branch line 133 and the main line 134 in the wiring 13 is substantially the same as the positional relationship between the branch line 83 and the main line 84 in the first lead wiring 8 described above. Therefore, in this specification, detailed description of the branch line 133 and the main line 134 in the second lead-out wiring 13 is omitted.

  As shown in FIG. 1, the second boundary wiring 14 is provided corresponding to the second electrode pattern 12, and in the present embodiment, four second electrodes are provided for the four second electrode patterns 12. Boundary wiring 14 is formed. Each second boundary wiring 14 extends along the Y direction along the outer edge of the second electrode pattern 12. In the present embodiment, since the second lead wiring 13 is drawn from the −X direction side for the two second electrode patterns 12 on the + Y direction side, the second electrode pattern 12 corresponding to the second electrode pattern 12 is drawn. The boundary wiring 14 is located on the outer edge of the second electrode pattern 12 on the −X direction side. On the other hand, for the two second electrode patterns 12 on the −Y direction side, the second lead wirings 13 are drawn from the + X direction side, and therefore the second electrode patterns 12 corresponding to the second electrode patterns 12 are extracted. The boundary wiring 14 is located on the outer edge of the second electrode pattern 12 on the + X direction side.

  Similar to the first conductor layer 6, the second electrode pattern 12, the second lead-out wiring 13, and the second boundary wiring 14 constituting the second conductor layer 11 are integrally formed. . Similarly to the first conductor layer 6, the second electrode pattern 12 and the second lead-out wiring 13 are formed in a mesh shape formed by intersecting a plurality of conductive lines. In the present embodiment, a mesh structure constituting the first conductor layer 6 (specifically, the first electrode pattern 7 and the first lead wiring 8) and the second structure corresponding to the first conductor layer 6 are provided. The network structure constituting the conductor layer 11 (specifically, the second electrode pattern 12 and the second lead-out wiring 13) is substantially the same mode (that is, the shape of the conductor wire constituting them and The arrangement is substantially the same).

  However, the relationship between the network structure forming the first conductor layer 6 and the network structure forming the second conductor layer 11 is not particularly limited to the above. That is, the network structure of the first conductor layer 6 and the network structure of the second conductor layer 11 may be different. For example, the mesh in the second electrode pattern 12 of the second conductor layer 11 may be coarser or finer than the mesh in the first electrode pattern 7 of the first conductor layer 6. Further, the mesh in the second lead-out wiring 13 of the second conductor layer 11 may be coarser or finer than the mesh in the first lead-out wiring 8 of the first conductor layer 6. The density of the meshes in the first and second conductor layers 6 and 11 is adjusted by adjusting the shape of the conductor lines (for example, the width of the conductor lines) and the arrangement of the plurality of conductor lines (for example, adjacent to each other). This can be done by changing the pitch between the conductor wires.

  The third resin layer 15 has a function as a protective layer for protecting the second conductor layer 11 from the outside. As shown in FIG. 2, the third resin layer 15 is provided on the second resin layer 10. The second conductor layer 15 is provided between the second and third resin layers 10 and 15. Layer 11 is interposed. If the second conductor layer 11 is covered with the third resin layer 15, the occurrence of light scattering or the like on the surface of the wiring body 4 can be suppressed. Such a third resin layer 15 can be made of the same material as that of the first resin layer 5.

  Next, a method for manufacturing a wiring board in the present embodiment will be described. 9 (a) to 9 (e) and FIGS. 11 (a) to 11 (f) are cross-sectional views showing a method for manufacturing a wiring board according to an embodiment of the present invention, and FIG. 10 (a). FIG. 10C is a cross-sectional view showing the recess formed in the first intaglio, and FIGS. 12A to 12C are cross-sectional views showing the recess formed in the second intaglio.

  First, as shown to Fig.9 (a), the 1st intaglio 400 which has the recessed part 401 of the shape corresponding to the shape of the 1st conductor layer 6 is prepared. As shown in FIGS. 10A to 10C, the recess 401 formed in the first intaglio 400 includes a first recess 401 a having a shape corresponding to the first electrode pattern 7, and a first recess 401 a. The second concave portion 401b having a shape corresponding to the lead wiring 8 and the third concave portion 401c having a shape corresponding to the first boundary wiring 9 are included. Examples of the material constituting the first intaglio 400 include glass such as nickel, silicon, and silicon dioxide, organic silica, glassy carbon, thermoplastic resin, and photocurable resin. In the following description, “concave portion 401a”, “concave portion 401b”, and “concave portion 401c” are collectively referred to as “concave portion 401” as necessary.

  The width of the first recess 401a is preferably 100 nm to 100 μm, more preferably 500 nm to 10 μm, and further preferably 500 nm to 5 μm. On the other hand, the width of the second recess 401b and the third recess 401c is preferably 1 μm to 500 μm, more preferably 3 μm to 100 μm, and even more preferably 3 to 20 μm. Further, the depth of the first to third recesses 401a, 401b, 401c is preferably 100 nm to 300 μm, and more preferably 1 μm to 50 μm. In this embodiment, the cross-sectional shape of the recess 401 is formed with a tapered shape that becomes narrower toward the bottom.

  Note that a release layer (not shown) made of a graphite material, a silicone material, a fluorine material, a ceramic material, an aluminum material, or the like is formed in advance on the surface of the recess 401 in order to improve releasability. It is preferable to do.

  The conductive material 410 is filled into the concave portion 401 of the first intaglio 400. As such a conductive material 410, a conductive paste or conductive ink configured by mixing conductive powder or metal salt, binder resin, water or solvent, and various additives can be exemplified. Examples of the conductive powder include metals such as silver, copper, nickel, tin, bismuth, zinc, indium, and palladium, graphite, and the like. Examples of the metal salt include salts of the above metals. As the conductive particles contained in the conductive material 410, for example, conductive particles having a diameter φ (0.5 μm ≦ φ ≦ 2 μm) of 0.5 μm or more and 2 μm or less are used according to the width of the conductor pattern to be formed. be able to. In addition, it is preferable to use conductive particles having an average diameter φ that is not more than half the width of the conductor pattern to be formed.

  Examples of the binder resin included in the conductive material 410 include acrylic resin, polyester resin, epoxy resin, vinyl resin, urethane resin, phenol resin, polyimide resin, silicone resin, and fluorine resin.

  Examples of the solvent contained in the conductive material 410 include α-terpineol, butyl carbitol acetate, butyl carbitol, 1-decanol, butyl cellosolve, diethylene glycol monoethyl ether acetate, and tetradecane.

  Examples of the method of filling the conductive material 410 into the concave portion 401 of the first intaglio 400 include a dispensing method, an inkjet method, and a screen printing method. Or, after coating by the slit coating method, bar coating method, blade coating method, dip coating method, spray coating method, and spin coating method, the conductive material coated other than the concave portion 401 is wiped or scraped, blotted, or pasted. Take, wash, and blow away. It can be properly used depending on the composition of the conductive material, the shape of the intaglio, and the like.

  Next, as shown in FIG. 9B, the first conductive layer 6 is formed by heating the conductive material 410 filled in the concave portion 401 of the first intaglio 400. The heating condition of the conductive material 410 can be appropriately set according to the composition of the conductive material and the like. By this heat treatment, the conductive material 410 shrinks in volume. As shown in FIG. 10, curved shapes are formed on the surfaces 411b and 411c of the conductive material 410 filled in the second and third recesses 401b and 401c. Further, a slightly uneven shape is formed on the surface 411 of the conductive material 410 (the surfaces 411a, 411b, and 411c are generically named). The outer surface excluding the surface 411 of the conductive material 410 is formed in a shape along the recess 401.

  Note that the treatment method of the conductive material 410 is not limited to heating. Energy rays such as infrared rays, ultraviolet rays, and laser beams may be irradiated, or only drying may be performed. Moreover, you may combine these 2 or more types of processing methods. Due to the presence of the uneven shape or curved shape of the surface 411, the contact area between the first conductor layer 6 and the first resin layer 5 increases, and these can be bonded more firmly.

  Subsequently, as shown in FIG. 9C, the resin material 420 is placed on the first intaglio 400 on which the first conductor layer 6 is formed (the first intaglio 400 in the state shown in FIG. 9B). Apply. Examples of the resin material 420 include epoxy resins, acrylic resins, polyester resins, urethane resins, vinyl resins, silicone resins, phenol resins, polyimide resins, and other UV curable resins, thermosetting resins, and thermoplastic resins. can do. Examples of a method for applying the resin material 420 onto the first intaglio 400 include a screen printing method, a spray coating method, a bar coating method, a dip method, an ink jet method, and a casting method.

  Next, as shown in FIG. 9 (d), the base material 3 is placed on the first intaglio plate 400 so that the resin material 420 enters the concave portion 401 of the first intaglio plate 400, and the base material 3 is placed in the first intaglio plate 400. The resin material 420 is cured by pressing against the intaglio 400. Examples of the method for curing the resin material 420 include irradiation with energy rays such as ultraviolet rays and infrared laser light, heating, heating and cooling, and drying. Thereby, the first resin layer 5 is formed.

  Incidentally, the formation method of the 1st resin layer 5 is not specifically limited above. For example, a material in which a resin material 420 for forming the first resin layer 5 is applied substantially uniformly on the base 3 is prepared so that the resin material 420 enters the recess 401 of the first intaglio 400. Alternatively, the first resin layer 5 may be formed by curing the resin material 420 in a state where the substrate 3 is pressed against the first intaglio 400.

  Next, as shown in FIG. 9 (e), the base material 3, the first resin layer 5, and the first conductor layer 6 are integrally released from the first intaglio 400. Hereinafter, a combination of the base material 3, the first resin layer 5, and the first conductor layer 6 is also referred to as an intermediate body 430.

  Next, as illustrated in FIG. 11A, a resin material 440 that forms the second resin layer 10 is applied on the intermediate 430. As such a resin material 440, the same material as the resin material 420 described above can be used. Moreover, as a method of apply | coating the resin material 440, the method similar to the resin material 420 mentioned above can be illustrated.

  Next, as shown in FIG. 11B, a second intaglio plate 450 in which a concave portion 451 having a shape corresponding to the shape of the second conductor layer 11 is formed is prepared. As a material constituting the second intaglio 450, the same material as that constituting the first intaglio 400 can be used. The concave portion 451 includes first to third concave portions 451a, 451b, and 451c as shown in FIGS. 12A to 12C. However, the first and second conductor layers 6 and 11 are not formed. Since these are basically the same configuration, the first to third recesses 451a, 451b, 451c have the same shape as the corresponding first to third recesses 401a, 401b, 401c of the above-described recesses 401. Have.

  Then, the conductive material 460 is filled into the recesses 451 of the second intaglio 450. As such a conductive material 460, a material similar to the above-described conductive material 410 can be used. Further, as a method of filling the conductive material 460 into the concave portion 451 of the second intaglio plate 450, a method similar to the method of filling the conductive material 410 into the concave portion 401 of the first intaglio plate 400 can be used. .

  Next, as shown in FIG. 11C, the second conductor layer 11 is formed by heating the conductive material 460 filled in the recesses 451 of the second intaglio 450. The heating conditions of the conductive material 460 can be set as appropriate depending on the composition and the like. By this heat treatment, the volume of the conductive material 460 contracts, and a slightly uneven shape is formed on the surface 461 of the conductive material 460. At this time, the outer surface excluding the surface 461 of the conductive material 460 is formed into a shape along the recess 451. Similar to the surface 411 of the conductive material 410, the surface 461 includes the surfaces 461a, 461b, and 461c as shown in FIG. 12, and the conductive material 460 filled in the second and third recesses 451b and 451c. The surfaces 461b and 461c are formed in a curved shape. The contact area between the second conductor layer 11 and the second resin layer 10 is increased by the uneven shape or the curved shape of the surface 461, and the second conductor layer 11 is more firmly fixed to the second resin layer 10. can do. Note that as a method for treating the conductive material 460, various methods exemplified as the method for treating the conductive material 410 can be used.

  Next, as shown in FIG. 11 (d), the intermediate body 430 is arranged on the second intaglio plate 450 so that the resin material 440 enters the concave portion 451 of the second intaglio plate 450, and the intermediate body 430 is moved to the second intaglio plate 450. Press against the intaglio 450. Then, the resin material 440 is cured to form the second resin layer 10. As a method of curing the resin material 440, a method similar to the method of curing the resin material 420 described above can be used.

  Next, as shown in FIG. 11E, the second resin layer 10, the second conductor layer 11, and the intermediate body 430 are integrally released from the second intaglio plate 450. Next, as shown in FIG. 11 (f), a resin material 470 is applied on the second conductor layer 11. Examples of the resin material 470 include epoxy resins, acrylic resins, polyester resins, urethane resins, vinyl resins, silicone resins, phenol resins, polyimide resins, and other UV curable resins, thermosetting resins, and thermoplastic resins. can do.

The viscosity of the resin material 470 is preferably 1 mPa · s to 10,000 mPa · s from the viewpoint of ensuring sufficient fluidity during application. In addition, the storage elastic modulus of the cured resin is preferably 10 ⁶ Pa to 10 ⁹ Pa from the viewpoint of durability of the second conductor layer 11. As a method of applying the resin material 470, the same method as the resin material 420 described above can be exemplified. Then, the resin material 470 is cured to form the third resin layer 15. As a method for curing the resin material 470, a method similar to the method for curing the resin material 420 described above can be used. As described above, the wiring board 2 including the wiring body 4 can be obtained.

  The wiring body 4, the wiring board 2, and the touch panel 1 according to the present embodiment have the following effects.

  In the present embodiment, since the first electrode pattern 7 and the first lead wiring 8 are electrically connected via the first boundary wiring 9, an electrode terminal is required for these electrical connections. And not. Thereby, size reduction of the wiring body 4 can be achieved.

  In the present embodiment, the first lead-out wiring 8 has three branch lines 83 with one end 831 connected to the first boundary wiring 9. For this reason, since the stress applied to the connection portion (that is, the vicinity of the end portion 831) between the first lead-out wiring 8 and the first boundary wiring 9 is dispersed, it is possible to suppress breakage of these. Thereby, the connection reliability between the first electrode pattern 7 and the first lead-out wiring 8 through the first boundary wiring 9 can be improved.

  In addition, since the first lead-out wiring 8 has a plurality of branch lines 83, there are many conduction paths between the first electrode pattern 7 and an external circuit or the like. The resistance value can be reduced.

Further, in the present embodiment, the first electrode pattern 7 is formed in a mesh shape by the plurality of first conductor lines 71, and the width of the first conductor line 71 constituting the first electrode pattern 7. and W _11, the relationship between the width W ₂ of the first boundary line 9, that is set so as to satisfy the equation (12), a first electrode pattern through the first boundary line 9 7 and the first lead-out wiring 8 can be reduced in electrical resistance value.

In the first electrode pattern 7 of the present embodiment, a plurality of first conductor lines 71 intersect with each other to define a plurality of openings 72 having the same shape. and the maximum value D, the relationship between the distance L ₃ between the branch line 83 adjacent, are set so as to satisfy the above equation (4). Thereby, the stress applied to the connection portion between the first lead-out wiring 8 and the first boundary wiring 9 is more easily dispersed, and the rigidity of the first lead-out wiring 8 is prevented from becoming locally high, A difference in rigidity between the first electrode pattern 7 and the first lead wiring 8 can be suppressed. As a result, the breakage between the first electrode pattern 7 and the first lead wiring 8 is suppressed, and as a result, the first electrode pattern 7 and the first lead wiring 8 via the first boundary wiring 9 are prevented. The connection reliability can be further improved.

In the present embodiment, the first lead-out wiring 8 is also formed in a mesh shape by the plurality of second conductor lines 81, so that the rigidity between the first electrode pattern 7 and the first lead-out wiring 8 is achieved. This difference can be further suppressed. Thereby, the connection reliability between the first electrode pattern 7 and the first lead-out wiring 8 through the first boundary wiring 9 can be further improved. Further, the relationship between the width W _{11 of} the first conductor wire 71 and the width of the second conductor wire 81 and W ₃₁ is set so as to satisfy the above expression (5). It becomes more prominent.

  In addition, although the effect | action and effect mentioned above were demonstrated about the 1st conductor layer 6, in this embodiment, the 1st conductor layer 6 and the 2nd conductor layer 11 have the same structure. Therefore, the second conductor layer 11 can obtain the same actions and effects as those described above. In this case, the “second electrode pattern 12” in the present embodiment corresponds to an example of the “electrode pattern” in the present invention, and the “second lead wiring 13” in the present embodiment is the “leading wiring” in the present invention. It corresponds to an example, “second boundary wiring 14” in the present embodiment corresponds to an example of “boundary wiring” in the present invention, and “branch line 133” in the present embodiment corresponds to an example of “branch line” in the present invention. The “main line 134” in the present embodiment corresponds to an example of the “main line” in the present invention.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  FIG. 13 is a plan view showing a first modification of the first conductor layer according to one embodiment of the present invention, and FIG. 14 is a second modification of the first conductor layer according to one embodiment of the present invention. FIG.

  For example, in the present embodiment, the first lead-out wiring 8 has a straight branch line 83a and bent branch lines 83b and 83c arranged on both sides of the branch line 83a. However, the present invention is not particularly limited to the above, and as illustrated in FIG. 13, the lead-out wiring 8 </ b> B may have three branch lines 83 </ b> B that are linear. In this example, each branch line 83B is connected to the boundary wiring 9B at one end portion 831B, the other end portion 832B is connected to each other at the connection portion 85B, and the end portions 831B and 832B are linearly connected. It is formed as follows.

  In addition, one lead wiring 8C may include a plurality of connection portions 85C. In the lead-out wiring 8C of this example shown in FIG. 14, the branch lines 83Ca, 83Cb, 83Cc are electrically connected to each other at the connection portion 85Ca. On the other hand, the branch lines 83Cd and 83Ce are electrically connected to each other at the connection portion 85Cb. The connection portions 85Ca and 85Cb are electrically connected by a branch line 83Cf. A main line 84C is drawn from the connection portion 85Cb.

  In FIGS. 13 and 14, only the outer shape is shown for easy understanding of the characteristics of the lead-out wirings 8B and 8C. However, in actuality, they are formed in a mesh shape by a plurality of conductor lines.

  In the present embodiment, the electrode patterns 7 and 12 and the lead-out wirings 8 and 13 are formed in a mesh shape with a plurality of conductor lines, but are not particularly limited thereto, and may be formed in a solid pattern. . In this case, light-transmitting ITO (indium tin oxide) or a conductive polymer may be used as a material constituting the electrode pattern. In the modification described above, similarly, the electrode pattern and the lead-out wiring can be formed as a solid pattern.

  Further, the touch panel 1 of the present embodiment is a projected capacitive touch panel sensor composed of two conductor layers, but is not particularly limited thereto, and is a surface type (capacitive coupling) composed of one conductor layer. The present invention can also be applied to a capacitive touch panel sensor.

  Moreover, although the above-mentioned embodiment demonstrated that the wiring body with a conductor layer was used for a touch panel, the use of the wiring body with a conductor layer is not specifically limited to this. For example, the wiring body may be used as a heater by energizing the wiring body and generating heat by resistance heating or the like. Further, the wiring body may be used as an electromagnetic shielding shield by grounding a part of the conductor layer of the wiring body. Moreover, you may use a wiring body as an antenna. In this case, the mounting target for mounting the wiring body corresponds to an example of the “support” of the present invention, and the heater, the electromagnetic shielding shield, and the antenna including these correspond to an example of the “structure with a conductor layer” in the present invention. To do.

DESCRIPTION OF SYMBOLS 1 ... Touch sensor 2 ... Wiring board 3 ... Base material 31 ... Main surface 4 ... Wiring body 5 ... 1st resin layer 51 ... Flat part 52 ... Support Part 6: First conductor layer 7: First electrode pattern
71: First conductor wire
711 ... Contact surface
712 ... Top surface
713 ... Side
72... Opening 8... First lead wiring
81: Second conductor wire
811 ... Contact surface
812 ... Top surface
813 ... Side
82 ... Opening
83 ... branch line
831,832 ... end
84 ... Main line
85... Connection portion 9... First boundary wiring
91 ... Contact surface
92 ... top surface
93 ... side surface 10 ... second resin layer 101 ... main part 102 ... support part 11 ... second conductor layer 12 ... second electrode pattern 13 ... second Lead wiring layer
133 ... branch line
134 ... main line
135: connecting portion 14: second boundary wiring 15 ... third resin layer 400 ... first intaglio plate 401 ... concave portion 410 ... conductive material (first conductor layer) )
411 ... surface 420 ... resin material (first resin layer)
430 ... Intermediate 440 ... Resin material (second resin layer)
450 ... second intaglio 451 ... recess 460 ... conductive material (second conductor layer)
461 ... surface 470 ... resin material (third resin layer)

Claims (8)

An electrode pattern;
A lead wire formed in a mesh shape by a plurality of second conductor wires;
A boundary wiring that is interposed between the electrode pattern and the lead wiring and electrically connects the electrode pattern and the lead wiring; and
The lead wiring is
One end is electrically connected to the boundary wiring, and at least two branch lines formed in a mesh shape;
A main line electrically connected to all the branch lines and formed in a mesh shape,
The adjacent branch lines are separated from each other,
A region where the second conductor line is not formed is provided between the adjacent branch lines ,
A wiring body having an aperture ratio of 10 to 50% of the lead wiring. The wiring body according to claim 1,
The second conductor wire constituting the branch line is arranged to be inclined with respect to the extending direction of the branch line,
A wiring body in which a side end portion of the branch line extends in a zigzag manner by the plurality of second conductor lines constituting the branch line in the extending direction of the branch line. The wiring body according to claim 1 or 2,
The electrode pattern has a plurality of first conductor lines,
The electrode pattern is formed in a mesh shape by the first conductor wire,
A wiring body that satisfies the following formula (1).
W ₁ <W ₂ (1)
However, in the above equation (1), W ₁ is the width of the first conductor line, and W ₂ is the width of the boundary wiring. The wiring body according to claim 3,
The plurality of first conductor lines intersect each other to define a plurality of openings having the same shape,
A wiring body that satisfies the following formula (2).
D <L (2)
However, in the above equation (2), D is the maximum value of the width of the opening in the extending direction of the boundary wiring, and L is the distance between the adjacent branch lines in the extending direction of the boundary wiring. . The wiring body according to claim 3 or 4,
A wiring body that satisfies the following formula (3).
W ₁ <W ₃ (3)
However, in the above equation (3), W ₁ is the width of the first conductor line, and W ₃ is the width of the second conductor line. The wiring body according to any one of claims 1 to 5,
The wiring body further includes a resin layer,
The electrode pattern, the lead-out wiring, and the boundary wiring are wiring bodies provided on the resin layer. The wiring body according to claim 6,
And a support provided on at least one main surface of the wiring body.   A touch sensor comprising the conductor layered structure according to claim 7.

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