JP6207903B2 - Solder printer - Google Patents

Description

  The present invention relates to a solder printing apparatus.

  Patent Document 1 discloses a solder printing apparatus including a screen mask on which a plurality of printing patterns are formed. In this solder printing apparatus, two printing patterns are formed on a single screen mask, and there is no need for an auxiliary facility such as a sorting device, and there is no need for a transfer line with one system and a transfer line with two systems. It can be installed in between.

JP 2011-143640 A

  When a plurality of print patterns are formed on a single screen mask, it is important to appropriately select a print pattern used for solder printing. Even if some print patterns have scratches or clogs, if a healthy print pattern can be selected and used from multiple print patterns, solder printing can be performed without causing printing defects. Can continue. In a solder printing apparatus including a screen mask on which a plurality of printing patterns are formed, a technique that can appropriately select a printing pattern used for solder printing is expected.

  The present specification provides a technique for solving the above problems. The present specification provides a technique capable of appropriately selecting a printing pattern to be used for solder printing in a solder printing apparatus including a screen mask on which a plurality of printing patterns are formed.

  A solder printing apparatus disclosed in the present specification includes a screen mask on which a plurality of printing patterns are formed, and performs solder printing using a printing pattern selected from the plurality of printing patterns. In the solder printing apparatus, use prohibition or use permission can be set for each of the plurality of print patterns. In the solder printing apparatus, a print pattern used for solder printing is selected from print patterns that are not prohibited from being used.

  According to the above-mentioned solder printing apparatus, by setting to prohibit use of a plurality of print patterns that are not suitable for solder printing, it is possible to perform solder printing from among appropriate print patterns. The printing pattern to be used can be selected. The printing pattern may be a whole printing pattern that is solder-printed on a single circuit board, or may be a printing pattern for one time when solder printing is performed in a plurality of times. . In addition, setting of prohibition of use or permission of use of the print pattern may be performed before the start of production, or may be performed during production. Similarly, selection of the printing pattern used for solder printing may be performed before the start of production or may be performed during production.

  The above-described solder printing apparatus is configured to prohibit the use of a printed pattern used for a circuit board in which a defect is detected when a defect is detected in an inspection apparatus downstream from the solder printing apparatus. Can do.

  On the downstream side of the solder printing device, a solder printing inspection device that inspects the state of the solder printed on the circuit board, and a board appearance inspection device that inspects the state of the circuit board on which the solder is printed and electronic components are mounted Etc. are arranged. According to the above-described solder printing apparatus, when a defect such as a solder misalignment or a defect is detected by the downstream inspection apparatus, the print pattern used for the circuit board is set to be prohibited from use. By setting it as such a structure, the printing pattern which is not in the state which can perform solder printing favorably is skipped automatically, and a favorable solder printing operation can be continued. In addition, when a defect in the solder printing state is detected by the inspection device, the printing pattern may be set to be prohibited immediately, or the printing pattern may be set to be disabled when a defect occurs continuously a predetermined number of times. Good. In addition, poor solder printing conditions include excessive amount of solder transfer (bridge, blur, printing height higher than mask thickness, etc.), insufficient amount of solder transfer (fading at the beginning of printing, printing height lower than mask thickness, solder None, air hole generation, blurring at the center of the opening, etc.) and solder shape abnormalities (such as tearing, fluttering, cornering, etc.).

  The solder printing apparatus can be configured such that use prohibition or use permission can be set for each of the plurality of print patterns in accordance with the result of image processing of the screen mask.

  Usually, in the solder printing apparatus, in the solder printing operation, the screen mask and the circuit board are each subjected to image processing, and the both are aligned. According to the solder printing apparatus described above, it is possible to set so as to prohibit the use of a print pattern that is not suitable for use according to the result of the image processing of the screen mask. It is possible to easily set the prohibition of use of the print pattern. The screen mask may be imaged by an imaging device (such as a camera) that images the circuit board and the positioning reference mark of the screen mask, or may be an imaging device provided separately from the imaging device. . Moreover, it may be performed before the start of production (for example, during adjustment work by an operator) or during production. Depending on the image processing result (breakage (scratches, etc.), stretch, dirt, etc.) of each print pattern of the screen mask, the use of the print pattern may be prohibited.

  The solder printing apparatus prohibits the use of the print pattern when it is determined by image processing of the screen mask that a mark indicating use prohibition or use permission is attached at a position corresponding to the print pattern. Can be configured to.

  According to the above solder printing apparatus, when an operator finds an unhealthy print pattern in the screen mask, the printing is performed by attaching a mark indicating prohibition of use to a position corresponding to the print pattern. The use of patterns can be prohibited. Alternatively, it is possible to prohibit the use of unhealthy print patterns by placing a mark indicating permission of use at a position corresponding to the print pattern only for a healthy print pattern in the screen mask. . By setting it as such a structure, the printing pattern which is not in the state which can perform solder printing favorably is skipped automatically, and a favorable solder printing operation can be continued. According to the above solder printing apparatus, the operator can set the use prohibition or the use permission of the print pattern without performing a manual input operation. In addition, other workers can easily grasp which print pattern of the plurality of print patterns is prohibited or permitted to be used.

  The solder printing apparatus can be configured to prohibit the use of the print pattern when it is determined by the screen mask image processing that the state of the print pattern is not healthy.

  According to the above-described solder printing apparatus, a print pattern that is not in a state where solder printing can be performed satisfactorily is automatically skipped, and a good solder printing operation can be continued. Note that when the screen mask print pattern opening is imaged, the shape of the opening is compared with the shape immediately after cleaning the screen mask, and when the solder clogging of the opening is detected, the state of the print pattern is healthy. It may be judged that it is not, and use may be prohibited.

  The solder printing apparatus further includes a counting device that counts the number of times of use for each of the plurality of print patterns, and prohibits the use of the print pattern when the number of times of use of the print pattern reaches a predetermined number. Can be configured to.

  Usually, a printed pattern that is frequently used is more likely to be flawed or clogged, and may not be in a state where solder printing can be performed satisfactorily. According to the above-described solder printing apparatus, a print pattern that may not be in a state where solder printing can be satisfactorily performed is automatically skipped, and good solder printing work can be continued. In addition, it is possible to prevent the occurrence of defective solder printing on the circuit board. Note that the threshold value for the number of times of use for determining whether to prohibit the use of a print pattern may be set for each print pattern. Further, it may be set according to the minimum size of the opening of each print pattern. The smaller the opening, the more difficult it is to ensure the print quality, and it is desirable to set a small value for the threshold.

  The solder printing apparatus described above can be configured such that a print pattern used for the solder printing can be manually selected from print patterns that are not prohibited from being used.

  According to the above-described solder printing apparatus, an operator can select an appropriate printing pattern according to the actual situation of the solder printing work from among the printing patterns that are not prohibited from being used.

  The solder printing apparatus can be configured such that use prohibition or use permission can be manually set for each of the plurality of print patterns.

  According to the above-described solder printing apparatus, it is possible to set a print pattern that should be prohibited by an operator according to the actual situation of the solder printing work.

The figure which shows the outline | summary of the mounting line 14 in which the solder printing apparatus 2 of the Example was integrated. The side view which shows the structure of the outline of the solder printing apparatus 2 of an Example. The top view which shows the circuit board holding | maintenance apparatus 24 of the solder printing apparatus 2 of an Example, the receiving conveyance apparatus 80, and the sending conveyance apparatus 82. FIG. The top view which shows the screen mask 28 and the squeegee apparatus 30 of the solder printing apparatus 2 of an Example. The top view which shows the some printing pattern 68a, 68b, 68c, 68d, 68e, 68f formed in the screen mask 28 of an Example. The top view which shows the one aspect | mode of operation | movement of the circuit board holding | maintenance apparatus 24 in the solder printing apparatus 2 of an Example. The top view which shows the some printing pattern 90a, 90b, 90c formed in the screen mask 28 of a modification. The top view which shows the some printing pattern 92a, 92b, 92c formed in the screen mask 28 of a modification. The top view which shows the some printing pattern 94a, 94b, 94c, 94d, 94e, 94f formed in the screen mask 28 of a modification.

(Example)
Below, the solder printing apparatus 2 of an Example is demonstrated, referring drawings. FIG. 1 shows a mounting line 14 in which the solder printing apparatus 2 of the embodiment is incorporated. The mounting line 14 includes a solder printing device 2, a solder printing inspection device 4, a component mounting device 6, a board appearance inspection device 8, a reflow furnace 10, and a production management computer 12. The solder printing apparatus 2 screen-prints solder on the circuit board. The solder print inspection apparatus 4 inspects the state of solder printed on the circuit board by image processing. In the component mounting apparatus 6, an electronic component is mounted on a circuit board on which solder is printed. The board appearance inspection apparatus 8 inspects the state of the circuit board on which the solder is printed and the electronic component is mounted by image processing. In the reflow furnace 10, the circuit board is heated to melt the solder, and the electronic component is reflow soldered to the circuit board. The production management computer 12 controls operations of the solder printing device 2, the solder printing inspection device 4, the component mounting device 6, the board appearance inspection device 8, and the reflow furnace 10, and manages the mounting work on the mounting line 14. The circuit board is conveyed along the mounting line 14 from the left side (upstream side) in FIG. 1 toward the right side (downstream side).

  As shown in FIG. 2, the solder printing apparatus 2 mainly includes a control device 20, an interface device 22, a circuit board holding device 24, an imaging device 26, a screen mask 28, and a squeegee device 30. . In the following description, the conveyance direction of the circuit board C is the X direction, the direction orthogonal to the X direction in the horizontal plane is the Y direction, and the direction orthogonal to the X direction and the Y direction is the Z direction.

  The control device 20 can communicate with the production management computer 12. The control device 20 controls the operation of each component of the solder printing apparatus 2 in accordance with instructions from the production management computer 12. In addition, the control device 20 transmits data indicating the state of solder printing work in the solder printing device 2 to the production management computer 12.

  The interface device 22 presents the setting state and working state of the solder printing apparatus 2 to the worker via a monitor or the like, and accepts various inputs from the worker via a switch or the like.

  The circuit board holding device 24 includes a Y direction moving mechanism 40, an X direction moving mechanism 42, a rotating mechanism 44, an elevating mechanism 46, an X direction transport mechanism 48, a clamp mechanism 50, and a support mechanism 52. .

  The Y-direction moving mechanism 40 is supported on the base of the solder printing apparatus 2. The Y-direction moving mechanism 40 can be moved relative to the base of the solder printing apparatus 2 in the Y direction by driving an actuator (not shown).

  The X direction moving mechanism 42 is supported by the Y direction moving mechanism 40. The X-direction moving mechanism 42 can be moved relative to the Y-direction moving mechanism 40 in the X direction by driving an actuator (not shown).

  The rotating mechanism 44 is supported by the X-direction moving mechanism 42. The rotation mechanism 44 can be rotated around the Z axis with respect to the X-direction movement mechanism 42 by driving a motor (not shown).

  The elevating mechanism 46 is supported by the rotating mechanism 44. The lifting mechanism 46 can be moved relative to the rotating mechanism 44 in the Z direction by driving an actuator (not shown).

  The X direction transport mechanism 48, the clamp mechanism 50, and the support mechanism 52 are supported by the elevating mechanism 46. The X-direction transport mechanism 48 includes a pair of conveyor belts 54 arranged along the X direction and servo motors (not shown) that drive the respective conveyor belts 54. As shown in FIG. 3, the X-direction transport mechanism 48 places both ends of the circuit board C in the Y direction on a pair of conveyor belts 54 and drives the servo motor to move the circuit board C in the X direction. It can be transported. Depending on the size of the circuit board C, the distance between the pair of conveyor belts 54 can be adjusted.

  As shown in FIG. 3, the clamp mechanism 50 can hold the circuit board C with a desired width by sandwiching the circuit board C from both ends in the Y direction. The support mechanism 52 can support the circuit board C from the lower surface side by bringing the tips of the support pins 56 into contact with the lower surface of the circuit board C held by the clamp mechanism 50.

  The imaging device 26 includes an XY direction moving mechanism 60, a substrate imaging device 62, and a mask imaging device 64. The XY direction moving mechanism 60 can be moved relative to the base of the solder printing apparatus 2 in the X direction and the Y direction by driving an actuator (not shown). The board imaging device 62 and the mask imaging device 64 are held by the XY direction moving mechanism 60. The board imaging device 62 includes illumination and a camera for imaging the circuit board C, and can image the upper surface of the circuit board C. The mask imaging device 64 includes illumination and a camera for imaging the screen mask 28 and can image the lower surface of the screen mask 28.

  As shown in FIG. 4, the screen mask 28 is a plate-like member formed in a rectangular shape, and is supported on four sides by a mask support frame 66 whose position is fixed with respect to the base of the solder printing apparatus 2. ing. As shown in FIG. 5, the screen mask 28 is formed with a plurality of print patterns 68a, 68b, 68c, 68d, 68e, and 68f. In the present embodiment, the plurality of print patterns 68a, 68b, 68c, 68d, 68e, and 68f are all formed in substantially the same shape. In other words, the plurality of printed patterns 68a, 68b, 68c, 68d, 68e, and 68f are formed in the same shape within a tolerance range so that the solder can be transferred in the same shape to the same type of circuit board C. Yes.

  As shown in FIGS. 2 and 4, the squeegee device 30 includes a Y-direction moving mechanism 70, an X-direction moving mechanism 72, a squeegee head 74, and squeegees 76a and 76b.

  The Y-direction moving mechanism 70 is supported on the base of the solder printing apparatus 2. The Y-direction moving mechanism 70 can be moved relative to the base of the solder printing apparatus 2 in the Y direction by driving an actuator (not shown).

  The X direction moving mechanism 72 is supported by the Y direction moving mechanism 70. The X-direction moving mechanism 72 can be moved relative to the Y-direction moving mechanism 70 in the X direction by driving an actuator (not shown).

  The squeegee head 74 is supported by the X-direction moving mechanism 72. The squeegee head 74 can be moved relative to the X-direction moving mechanism 72 in the Z direction by driving an actuator (not shown).

  The squeegees 76 a and 76 b are supported by the squeegee head 74. The squeegees 76a and 76b can be tilted with respect to the squeegee head 74 by driving a servo motor (not shown). The squeegees 76a and 76b squeeze the solder supplied to the upper surface of the screen mask 28 from a solder supply device (not shown) on the target print pattern.

  As shown in FIG. 3, the solder printing apparatus 2 further includes a receiving and conveying device 80 and a sending and conveying device 82. The receiving and conveying device 80 includes a pair of conveyor belts 84 arranged along the X direction, and servo motors (not shown) that drive the respective conveyor belts 84. The receiving and conveying apparatus 80 receives the circuit board C sent from the board conveying apparatus T1 on the upstream side of the solder printing apparatus 2 and sends the circuit board C to the X-direction conveying mechanism 48 of the circuit board holding apparatus 24. The delivery conveying device 82 includes a pair of conveyor belts 86 arranged along the X direction, and servo motors (not shown) that drive the respective conveyor belts 86. The sending / conveying device 82 receives the circuit board C sent from the X-direction carrying mechanism 48 of the circuit board holding device 24, and sends it to the board conveying device T 2 on the downstream side of the solder printing device 2. Similar to the pair of conveyor belts 54 of the X-direction transport mechanism 48, the distance between the pair of conveyor belts 84 of the receiving transport apparatus 80 and the distance between the pair of conveyor belts 86 of the delivery transport apparatus 82 are the size of the circuit board C to be transported. It can be adjusted according to.

  The operation of the solder printing apparatus 2 will be described. When the circuit board C is sent from the upstream board transfer device T1, the control device 20 drives the receiving transfer device 80 to receive the circuit board C. Then, the control device 20 controls the Y-direction moving mechanism 40, the X-direction moving mechanism 42, the rotating mechanism 44, and the raising / lowering so that the X-direction conveying mechanism 48 is in a position where the circuit board C can be received from the receiving and conveying device 80. The mechanism 46 is driven. Then, the control device 20 drives the receiving and conveying device 80 and the X-direction conveying mechanism 48 to deliver the circuit board C from the receiving and conveying device 80 to the X-direction conveying mechanism 48.

  When the circuit board C is transferred to the X-direction transport mechanism 48, the control device 20 drives the Y-direction moving mechanism 40 as shown in FIG. 6 to select a selected print pattern (for example, print pattern) on the screen mask 28. The circuit board holding device 24 is moved to the position in the Y direction corresponding to 68f). Further, the control device 20 drives the X-direction transport mechanism 48 to transport the circuit board C to the X-direction position corresponding to the selected print pattern 68f. Then, the control device 20 drives the clamp mechanism 50 and the support mechanism 52 to hold the circuit board C, and drives the imaging device 26 of FIG. 3 to image the printed pattern 68f of the circuit board C and the screen mask 28. Then, the positional deviation between the two is detected by image processing. When the positional deviation is detected, the control device 20 drives the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44 to finely adjust the position of the circuit board C. Then, the control device 20 drives the lifting mechanism 46 to bring the circuit board C into contact with the lower surface of the screen mask 28.

  Further, the control device 20 drives the Y-direction moving mechanism 70 and the X-direction moving mechanism 72 to move the squeegee head 74 to the Y-direction position and the X-direction position corresponding to the selected print pattern 68f. Solder is supplied to the upper surface of the screen mask 28 by a supply device. The control device 20 drives the squeegee head 74 to bring one squeegee (for example, the squeegee 76a) into contact with the upper surface of the screen mask 28, and then drives the Y-direction moving mechanism 70 to select the selected printing. Squeezing is performed on the pattern 68f. As a result, solder is printed in a pattern corresponding to the selected print pattern 68f on the circuit board C held in contact with the lower surface of the screen mask 28.

  When the printing of the solder on the circuit board C is completed, the control device 20 drives the Y-direction moving mechanism 70, the X-direction moving mechanism 72, and the squeegee head 74 to return the squeegee head 74 to the standby position. In addition, the control device 20 drives the lifting mechanism 46, the clamp mechanism 50, and the support mechanism 52 to transfer the circuit board C to the X-direction transport mechanism 48 again. Further, the control device 20 sets the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44 so that the X-direction conveying mechanism 48 is at a position where the circuit board C can be delivered to the delivery conveying device 82. To drive.

  Then, the control device 20 drives the X-direction transport mechanism 48 and the send-out transport device 82 to deliver the circuit board C from the X-direction transport mechanism 48 to the send-out transport device 82. Thereafter, the control device 20 drives the delivery / conveyance device 82 to deliver the circuit board C to the downstream substrate conveyance device T2.

  Hereinafter, selection of the print patterns 68a, 68b, 68c, 68d, 68e, and 68f of the screen mask 28 will be described. Each of the plurality of print patterns 68a, 68b, 68c, 68d, 68e, 68f is assigned an identification number. The control device 20 stores an identification number, a print pattern type, an offset coordinate, and a use prohibition flag in association with each of the print patterns 68a, 68b, 68c, 68d, 68e, and 68f. The offset coordinates indicate the X-direction position and the Y-direction position of each print pattern 68a, 68b, 68c, 68d, 68e, 68f on the screen mask 28. The use prohibition flag indicates whether the print pattern is set to use prohibition.

  When performing solder printing on the circuit board C, the control device 20 uses a printing pattern to be used from among the printing patterns 68a, 68b, 68c, 68d, 68e, and 68f of the screen mask 28 that are not set to be prohibited from use. Select. For this selection, for example, the one with the smallest identification number may be selected or may be selected at random. Alternatively, this selection may be performed manually by an operator. Alternatively, in this selection, the control device 20 receives an inspection result in the solder printing inspection device 4 or the board appearance inspection device 8 arranged on the downstream side of the solder printing device 2 via the production management computer 12, and the soldering is performed. You may make it select the printing pattern with a favorable printing state. Alternatively, in this selection, the control device 20 may select a print pattern for which cleaning has been completed, a print pattern with a small number of uses, or a print pattern with good image processing results.

  The control device 20 may be configured such that the operator manually sets the use prohibition or use permission for each of the print patterns 68a, 68b, 68c, 68d, 68e, and 68f, or automatically. It may be configured. When the control device 20 automatically sets use prohibition or use permission for each of the print patterns 68a, 68b, 68c, 68d, 68e, and 68f, the use prohibition or use permission can be determined from various viewpoints. it can.

  For example, the control device 20 receives the inspection results in the solder printing inspection device 4 and the board appearance inspection device 8 arranged on the downstream side of the solder printing device 2 via the production management computer 12, and in these inspection devices. When a defect is detected, the print pattern used for the circuit board in which the defect is detected may be set to prohibit use. For example, when the solder printing inspection apparatus 4 or the board appearance inspection apparatus 8 detects a misalignment or a defect of the solder, the control device 20 uses the printed pattern used for the circuit board in which the defect is detected. Set to prohibited. By setting it as such a structure, the printing pattern which is not in the state which can perform solder printing favorably is skipped automatically, and a favorable solder printing operation can be continued.

  Alternatively, when an operator finds an unhealthy print pattern in the screen mask 28, a mark indicating prohibition of use is attached to a position corresponding to the print pattern, and the print pattern with the use prohibition mark is attached. You may make it set to use prohibition. In this case, in the image processing of the screen mask 28 using the imaging device 26, the control device 20 adds a mark indicating prohibition of use to positions corresponding to the respective print patterns 68a, 68b, 68c, 68d, 68e, and 68f. Whether the print pattern is marked for use prohibition or not is set to use prohibition. By setting it as such a structure, the printing pattern which is not in the state which can perform solder printing favorably is skipped automatically, and a favorable solder printing operation can be continued. It should be noted that the operator may mark only a healthy print pattern in the screen mask 28 at a position corresponding to the print pattern indicating use permission.

  Alternatively, in the image processing of the screen mask 28, the soundness of the respective print patterns 68a, 68b, 68c, 68d, 68e, 68f may be diagnosed, and the unhealthy print patterns may be set to be prohibited. Here, the soundness refers to the presence or absence of scratches or dirt on the print patterns 68a, 68b, 68c, 68d, 68e, 68f. In this case, the control device 20 determines whether each print pattern 68a, 68b, 68c, 68d, 68e, 68f is healthy in the image processing of the screen mask 28 using the imaging device 26, and is not healthy. The print pattern determined to be used is prohibited. The determination as to whether the print pattern is healthy can be made, for example, by comparing the image of the actual print pattern with a pattern image that is assumed to be healthy. By setting it as such a structure, the printing pattern which is not in the state which can perform solder printing favorably is skipped automatically, and a favorable solder printing operation can be continued.

  Alternatively, the number of uses of each print pattern 68a, 68b, 68c, 68d, 68e, 68f may be counted, and a print pattern with a large number of use may be set to be prohibited from use. In this case, the control device 20 counts the number of times each print pattern 68a, 68b, 68c, 68d, 68e, 68f is used by the built-in counter, and sets the print pattern that has reached the predetermined number of times to use prohibition. To do. With such a configuration, a print pattern that may not be in a state where solder printing can be performed satisfactorily is automatically skipped, and a good solder printing operation can be continued. In addition, it is possible to prevent the occurrence of defective solder printing on the circuit board. Note that identification information may be attached to each screen mask, and use permission or use prohibition setting information for each print pattern may be stored in combination with the identification information. In this case, even if the solder printing apparatus 2 that uses the screen mask 28 is changed, it is possible to prevent an inappropriate printing pattern from being used for solder printing.

  The arrangement of the plurality of print patterns on the screen mask 28 is not limited to the above example. For example, as shown in FIG. 7, a plurality of print patterns 90a, 90b, 90c of the screen mask 28 may be arranged in a line in the Y direction, or a plurality of screen masks 28 as shown in FIG. The print patterns 92a, 92b, and 92c may be arranged in a line in the X direction. Further, as shown in FIG. 9, the plurality of print patterns 94a, 94b, 94c, 94d, 94e, and 94f on the screen mask 28 are not the same and may be different from each other.

  As mentioned above, although the Example of this invention was described in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

  The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

2 Solder printing device 4 Print inspection device 6 Component mounting device 8 Substrate appearance inspection device 10 Reflow furnace 12 Production management computer 14 Mounting line 20 Control device 22 Interface device 24 Circuit board holding device 26 Imaging device 28 Screen mask 30 Squeegee device 40 Y direction Moving mechanism 42 X-direction moving mechanism 44 Rotating mechanism 46 Elevating mechanism 48 X-direction transport mechanism 50 Clamp mechanism 52 Support mechanism 54 Conveyor belt 56 Support pin 60 XY direction moving mechanism 62 Substrate imaging device 64 Mask imaging device 66 Mask support frames 68a and 68b , 68c, 68d, 68e, 68f Print pattern 70 Y-direction moving mechanism 72 X-direction moving mechanism 74 Squeegee heads 76a, 76b Squeegee 80 Accepting and conveying device 82 Sending and conveying device 84 Conveyor belt 86 Conveyor belt 0a, 90b, 90c printed patterns 92a, 92b, 92c printed patterns 94a, 94b, 94c, 94d, 94e, 94f printing pattern

Claims (8)

A solder printing apparatus comprising a screen mask on which a plurality of printing patterns are formed, and performing solder printing using a printing pattern selected from the plurality of printing patterns,
Use prohibition or use permission can be set for each of the plurality of print patterns,
A solder printing apparatus , wherein a print pattern used for solder printing is selected from print patterns that are not prohibited based on an inspection result of an inspection apparatus arranged downstream of the solder printing apparatus. 2. The solder printing apparatus according to claim 1, wherein when a defect is detected in the inspection apparatus on the downstream side of the solder printing apparatus, use of a printed pattern used for the circuit board in which the defect is detected is prohibited. An imaging device for imaging the positioning reference mark of the screen mask;
Based on the image processing result of the screen mask using the imaging device , use prohibition or use permission can be set for each of the plurality of print patterns depending on the presence or absence of scratches or dirt in the print pattern. The solder printing apparatus according to claim 1 or 2. The image processing of the screen mask, when the mark indicating the use prohibition at a position corresponding to the printing pattern is determined to have been given, and prohibit the use of the print pattern,
The solder printing apparatus according to claim 3, wherein the mark indicating the prohibition of use is attached to a position corresponding to the print pattern when an operator finds the unhealthy print pattern in the screen mask .   5. The solder printing apparatus according to claim 3, wherein use of the print pattern is prohibited when it is determined by the image processing of the screen mask that the state of the print pattern is not healthy. For each of the plurality of print patterns, further comprising a counting device for counting the number of times used,
The solder printing apparatus according to any one of claims 1 to 5, wherein when the number of times of use of a print pattern reaches a predetermined number, the use of the print pattern is prohibited.   The solder printing apparatus according to any one of claims 1 to 6, wherein a print pattern used for the solder printing can be manually selected from print patterns that are not prohibited from being used.   The solder printing apparatus according to claim 1, wherein use prohibition or use permission can be manually set for each of the plurality of print patterns.