JP6209832B2 - Manufacturing method of laminate - Google Patents

Description

  The present invention relates to a method for manufacturing a laminate including light-shielding conductive layers provided on both sides of a base film.

  Electronic components such as touch panel sensors and display substrates are generally composed of a plurality of layers such as a layer for realizing optical characteristics and a layer for realizing electrical characteristics. As a method for producing such an electronic component, a laminate including a plurality of layers such as a base film, a transparent conductive layer, and a metal layer is first prepared, and then any layer of the laminate is photolithography. A method of patterning by a method or the like is known.

  As one of the methods for producing a laminate, first, a base film is prepared, and then each layer is laminated on the base film using a film forming method such as a magnetron sputtering method or an EB vapor deposition method. The method is known. For example, Patent Document 1 describes that a niobium oxide layer, a silicon oxide layer, and an ITO layer are sequentially formed on a substrate including PET and a hard coat layer by using a magnetron sputtering method. Patent Document 1 proposes forming an ITO film at a low temperature in order to suppress the occurrence of curling in the resulting laminate.

JP2011-65937A

  In recent years, characteristics required for electronic components such as touch panel sensors have become increasingly sophisticated. For this reason, the structure of the electronic component is complicated, and accordingly, the layer structure of the laminate used for manufacturing the electronic component is also complicated. For example, the touch panel sensor pattern is required to be provided not only on one side of the substrate film but also on the other side. Therefore, in the laminate, various layers are formed not only on one side of the base film but also on the other side.

  As one method for producing a laminate, a so-called roll-to-roll production method is known in which each layer is sequentially laminated on a base film while a long base film is conveyed. In this case, the film forming process such as sputtering is performed on the base film in a state of being wound around the transport drum, for example. By the way, when various layers are formed on both sides of the base film as described above, when performing the film forming process on the other side of the base film, the outermost surface on one side of the base film is formed. The positioned layer is in contact with the surface of the transport drum. For this reason, during the film forming process on the other side of the base film, the layer located on the outermost surface on the one side of the base film is rubbed by the transport drum due to expansion and contraction of the base film. This can cause damage to the layer.

  An object of this invention is to provide the manufacturing method of the laminated body which can solve such a subject effectively.

The present invention provides a step of preparing an intermediate laminate including a base film and a first light-shielding conductive layer that is provided on one side of the base film and has light-shielding properties and conductivity, and the first light-shielding A second light-shielding conductive layer having light shielding properties and conductivity is formed on the other side of the intermediate laminate in a state where the intermediate laminate is wound around the carrier drum so that the conductive layer faces the surface of the carrier drum. The base film is composed of a transparent resin material having a linear expansion coefficient of 2.0 to 2.4 × 10 ⁻⁵ / ° C. within a range of 0 to 90 ° C., and The thickness of the base film is in the range of 100 to 250 μm, and the film forming step irradiates a target made of metal for constituting the second light-shielding conductive layer with charged particles, and configures the target. Element of the intermediate laminate Includes a vacuum deposition step of depositing in a square the side of, in the vacuum deposition step, the surface of the transport drum is heated, a method for producing a laminate.

  In the method for manufacturing a laminate according to the present invention, in the vacuum film forming step, the temperature of the surface of the transport drum may be controlled within a range of 60 to 90 ° C.

  In the manufacturing method of the laminated body by this invention, the said base film of the said intermediate laminated body may be comprised from the cycloolefin polymer.

  In the method for manufacturing a laminate according to the present invention, the first light-shielding conductive layer may be made of a silver alloy containing silver as a main component and copper and palladium.

  In the laminated body manufacturing method according to the present invention, the film forming step may further include a temperature monitoring step of measuring the temperature of the intermediate laminated body. In this case, in the vacuum film forming step, the surface of the transport drum is heated so that the temperature of the surface of the transport drum is substantially the same as the temperature of the intermediate laminate obtained in the monitoring step.

  According to the present invention, the surface of the transport drum is heated during the step of forming the second light-shielding conductive layer on the other side of the base film. For this reason, there is a large difference between the temperature on one side of the base film, which is in contact with the transport drum, and the temperature increased due to irradiation of charged particles on the other side of the base film. It is possible to suppress the occurrence. Thereby, it is possible to reduce the occurrence of wrinkles due to the temperature difference in the base film, and thus it is possible to suppress the first light-shielding conductive layer from being rubbed by the transport drum. This can prevent the first light-shielding conductive layer from being damaged during the film-forming process of the second light-shielding conductive layer.

FIG. 1 is a diagram showing a laminated body manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a view showing a film forming apparatus of the laminate manufacturing apparatus shown in FIG. 3 is a cross-sectional view showing a heating means of the film forming apparatus shown in FIG. 4 is a cross-sectional view showing a stacked body including a second light-shielding conductive layer formed by the film forming apparatus shown in FIG. FIG. 5 is a cross-sectional view showing an intermediate laminate supplied to the laminate manufacturing apparatus. FIG. 6 is a diagram schematically illustrating a state where the second light-shielding conductive layer is formed by a sputtering method. FIG. 7A is a diagram schematically showing thermal stress generated in the intermediate laminate when it is assumed that the transport drum is not heated, and FIG. 7B shows the laminate manufacturing method according to the present embodiment. The figure which shows typically the thermal stress which arises in an intermediate | middle laminated body when it uses. FIG. 8 is a plan view showing a touch panel sensor obtained by patterning the laminated body shown in FIG. 9 is a sectional view taken along line IX-IX of the touch panel sensor shown in FIG. FIG. 10 is a diagram illustrating a result of observing wrinkles generated in samples A to C. FIG. 11 is a diagram illustrating a result of counting the number of scratches formed in the first light-shielding conductive layer of the multilayer body when the temperature of the transport drum is controlled to 40 ° C. or 70 ° C. FIG. 12 is a diagram showing a result of plotting the ratio of the (111) plane and the crystal grain size in the light-shielding conductive layer of the laminate against the hardness of the light-shielding conductive layer. FIG. 13 is a graph schematically showing the flaw occurrence frequency based on wrinkles and the flaw occurrence frequency based on hardness, respectively, as a function of the film formation temperature.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. First, with reference to FIG. 4, the laminated body 10 manufactured in this Embodiment is demonstrated.

Laminated Body FIG. 4 is a cross-sectional view showing the laminated body 10. As shown in FIG. 4, the laminate 10 includes a base film 12, a plurality of layers provided on one side of the base film 12, and a plurality of layers provided on the other side of the base film 12. And. The plurality of layers provided on one side of the base film 12 includes a first hard coat layer 13a, a first high refractive index layer 14a, a first layer provided on the surface 12a on one side of the base film 12 in order. 1 includes a low refractive index layer 15a, a first transparent conductive layer 16a, and a first light-shielding conductive layer 17a. The plurality of layers provided on the other side of the base film 12 include a second hard coat layer 13b, a second high refractive index layer 14b, and a second layer provided in order on the surface 12b on the other side of the base film 12. 2 includes a low refractive index layer 15b, a second transparent conductive layer 16b, and a second light-shielding conductive layer 17b.

  Hereinafter, the base film 12, the hard coat layers 13a and 13b, the high refractive index layers 14a and 14b, the first low refractive index layers 15a and 15b, the first transparent conductive layers 16a and 16b, and the first light shielding conductive layers 17a and 17b. Each will be explained.

(Base film)
The base film 12 is made of a transparent resin material that has sufficient translucency and has a linear expansion coefficient of 2.0 to 2.4 × 10 ⁻⁵ / ° C. within a range of 0 to 90 ° C. ing. Examples of the transparent resin material include polyethylene terephthalate (PET), cycloolefin polymer (COP), cyclic olefin copolymer (COC), polycarbonate (PC), triacetyl cellulose (TAC), and (polymethyl methacrylate (PMMA). The thickness of the base film 12 is, for example, in the range of 100 to 250 μm.

(Hard coat layer)
The hard coat layers 13a and 13b are layers provided for the purpose of preventing scratches and for the purpose of preventing the low molecular weight polymer (oligomer) from being precipitated and appearing cloudy in the interface between the layers. As the hard coat layers 13a and 13b, for example, an acrylic resin is used. The thickness of the hard coat layers 13a and 13b is, for example, in the range of 0.1 to 10 μm.

(High refractive index layer and low refractive index layer)
The low refractive index layers 15a and 15b are layers made of a material having a lower refractive index than the material constituting the transparent conductive layers 16a and 16b, while the high refractive index layers 14a and 14b are low refractive index layers. It is a layer composed of a material having a higher refractive index than 15a and 15b. By providing such high refractive index layers 14a and 14b and low refractive index layers 15a and 15b between the base film 12 and the transparent conductive layers 16a and 16b, the light transmittance and reflectance of the laminate 10 can be increased. Can be adjusted. For example, the high refractive index layers 14a and 14b and the low refractive index layers 15a and 15b are transparent conductive materials when the transparent conductive layers 16a and 16b of the laminate 10 are patterned to form a transparent conductive pattern of the touch panel sensor as described later. It can function as an index matching layer for reducing the difference in light transmittance and reflectance between the region where the pattern is provided and the region where the pattern is not provided.

  The material constituting the low refractive index layers 15a and 15b is not particularly limited as long as the material has a lower refractive index than the material constituting the transparent conductive layers 16a and 16b. For example, silicon oxide is used. The material constituting the high refractive index layers 14a and 14b is not particularly limited as long as the material has a higher refractive index than the material constituting the first low refractive index layer 15a. For example, niobium oxide or zirconium is used. . The thicknesses of the high-refractive index layers 14a and 14b and the low-refractive index layers 15a and 15b are appropriately set according to the materials used so that desired transmittance and reflectance are achieved.

  In the present embodiment, an example in which the above-described high refractive index layers 14a and 14b and low refractive index layers 15a and 15b are included in the laminate 10 will be described. However, however, the high refractive index layers 14a and 14b and The low refractive index layers 15a and 15b are not necessarily provided. Similarly, the hard coat layers 13a and 13b are also optionally provided as necessary. Therefore, the 1st transparent conductive layer 16a may be provided so that the surface 12a of one side of the base film 12 and the surface of one side of the 1st hard-coat layer 13a may be contact | connected directly. Similarly, the 2nd transparent conductive layer 16b may be provided so that the surface 12b of the other side of the base film 12 and the surface of the other side of the 2nd hard-coat layer 13b may be contact | connected directly.

(Transparent conductive layer)
As a material constituting the transparent conductive layers 16a and 16b, a material that is conductive and shows translucency is used. For example, a metal oxide such as indium tin oxide (ITO) is used. The thicknesses of the transparent conductive layers 16a and 16b are appropriately set according to the specification of the electrical resistance of the transparent electrode or the transparent conductive pattern produced from the laminate 10, and are, for example, in the range of 18 to 50 nm.

(Light-shielding conductive layer)
As will be described later, the light-shielding conductive layers 17a and 17b are layers used to form extraction patterns and electrodes for extracting signals to the outside in electronic components such as touch panels. That is, the light-shielding conductive layers 17a and 17b are layers used as so-called wiring materials and electrode materials. Therefore, a metal material having high conductivity and light shielding property is used as the material constituting the light shielding conductive layers 17a and 17b. Specifically, an Ag—Pd—Cu based silver alloy, which is mainly composed of silver and contains copper and palladium, a so-called APC alloy is used. The composition of the APC alloy is not particularly limited. For example, the content ratios of silver, palladium, and copper are 96 to 99% by weight, 0.5 to 2.0% by weight, and 0.3 to 1.8% by weight, respectively. It has become. The thickness of the light-shielding conductive layers 17a and 17b is appropriately set according to the electrical resistance specification of the electronic component, and is in the range of 100 to 250 nm, for example. By setting the thickness of the first light-shielding conductive layer 17a to 100 nm or more, it is possible to sufficiently ensure the conductivity of the extraction patterns and electrodes obtained from the first light-shielding conductive layer 17a and the first light-shielding conductive layer 17a. Further, by setting the thickness of the first light-shielding conductive layer 17a to 250 nm or less, it is possible to prevent an excessive load required for the film-forming process of the first light-shielding conductive layer 17a and the patterning process of the first light-shielding conductive layer 17a. it can.

  By the way, the extraction pattern and the electrode composed of the light-shielding conductive layers 17a and 17b are usually arranged on the outermost surface of an electronic component such as a touch panel sensor in order to ensure connection with an external component or device. That is, the light-shielding conductive layers 17a and 17b are exposed in the manufacturing process of the stacked body 10 and the manufacturing process of manufacturing electronic components such as a touch panel sensor using the stacked body 10. Therefore, there are many opportunities to damage the surfaces of the light-shielding conductive layers 17a and 17b. Further, as will be described later, in the present embodiment, a film forming process such as sputtering is performed on the base film 12 in a state of being wound around the transport drum. Therefore, when each layer is first formed on one side of the base film 12 and then each layer is formed on the other side of the base film 12, a film forming process on the other side of the base film 12 is performed. In this case, the layer located on the outermost surface on one side of the base film 12 is in contact with the surface of the transport drum. That is, the first light-shielding conductive layer 17a is in contact with the surface of the transport drum. Accordingly, it can be said that there are more opportunities for the surface of the first light-shielding conductive layer 17a to be damaged than for the surface of the second light-shielding conductive layer 17b to be damaged.

  By the way, the APC alloy is a silver alloy containing silver as a main component as described above. Therefore, the APC alloy is softer than general metals. For this reason, even if the first light-shielding conductive layer 17a is slightly rubbed by the transport drum during the film-forming process of the second light-shielding conductive layer 17b, the first light-shielding conductive layer 17a may be damaged. For this reason, it is preferable to perform the film-forming process of the second light-shielding conductive layer 17b while suppressing the displacement of the first light-shielding conductive layer 17a with respect to the transport drum as much as possible. As a cause of the first light-shielding conductive layer 17a being displaced from the transport drum, it is conceivable that the base film 12 and the first light-shielding conductive layer 17a are wrinkled due to thermal expansion or the like.

  Hereinafter, the laminated body manufacturing apparatus 1 according to the present embodiment that can effectively solve such problems will be described. First, the entire laminate manufacturing apparatus 1 will be described with reference to FIG.

Laminated body manufacturing apparatus As shown in FIG. 1, the laminated body manufacturing apparatus 1 forms an unwinding device 20 including a shaft 21 for unwinding the intermediate laminated body 11, and a second light-shielding conductive layer 17 b on the intermediate laminated body 11. A film forming apparatus 30 and a winding apparatus 50 including a shaft 51 that winds up the laminate 10 made of the base film 12 provided with the second light-shielding conductive layer 17b are provided. The intermediate laminate 11 is the base film 12, the layers provided on one side of the base film 12, and the second light-shielding conductive layer 17b among the layers provided on the other side of the base film 12. And a laminated body including a layer. For example, as shown in FIG. 5, the intermediate laminate 11 includes a base film 12, a first hard coat layer 13 a provided on one side of the base film 12, a first high refractive index layer 14 a, and a first low The refractive index layer 15a, the first transparent conductive layer 16a, the first light-shielding conductive layer 17a, the second hard coat layer 13b, the second high refractive index layer 14b, and the second low low layer provided on the other side of the base film 12. The refractive index layer 15b and the second transparent conductive layer 16 are included.

(Deposition system)
Next, the film forming apparatus 30 of the laminate manufacturing apparatus 1 will be described. As a film forming method in the film forming apparatus 30, various methods such as vacuum deposition, sputtering, CVD, and ion plating can be adopted. Here, an example in which sputtering is used as a film forming method will be described with reference to FIG. explain.

  As shown in FIG. 2, the film forming apparatus 30 guides a film forming chamber 36 in which a film forming process is performed, a transport drum 38 around which the support material 11 is wound and transported, and a transported intermediate laminate 11. Guide roller 39, an exhaust means for exhausting the gas inside the film forming chamber 36 to the outside, and an outer surface of the intermediate laminated body 11 conveyed by the conveying drum 38. And a target 32a as a raw material for the second light-shielding conductive layer 17b provided. As the target 32a, an APC alloy for forming the second light-shielding conductive layer 17b is used.

  The film formation chamber 36 of the film formation apparatus 30 may be partitioned into a plurality of regions by partition walls 36a. For example, as shown in FIG. 2, the film forming chamber 36 is partitioned into a first region 31 in which the target 32 a is disposed and a second region 33 that faces the first region 31 through the third region 35. May be. In this case, the exhaust means 31a, 33a, and 35a may be connected to each of the regions 31, 33, and 35 separately.

  The conveyance drum 38 is provided with a heating unit 37 that heats the surface of the conveyance drum 38 to a desired temperature. The specific configuration of the heating means 37 is not particularly limited. For example, as shown in FIG. 3, when the transport drum 38 includes a surface portion 38 a and a hollow portion 38 b, the heating unit 37 may heat the surface portion 38 a of the transport drum 38 from the inside. The heating means 37 is provided adjacent to the surface portion 38a, for example, and a heating medium circulation path 37a for circulating a heating medium 37b such as oil, and a heating medium heating means (not shown) for heating the heating medium 37b to a desired temperature. Z)). In addition, as the heating unit 37, a heating wire heater or the like provided inside the transport drum 38 may be used.

  Next, the operation and effect of the present embodiment having such a configuration will be described. Here, first, a method of manufacturing the multilayer body 10 by forming the second light-shielding conductive layer 17b on the other side of the intermediate multilayer body 11 will be described. Next, a touch panel sensor obtained by patterning the laminate 10 will be described.

The manufacturing method beginning of the laminate, the unwinding device 20, the intermediate laminate 11 including a first light-shielding conductive layer 17a is prepared a shaft 21 which is wound, then the intermediate laminate toward the film forming apparatus 30 11 Unwind. Although not shown, the laminate manufacturing apparatus 1 forms not only the second light-shielding conductive layer 17b but also the layers other than the second light-shielding conductive layer 17b provided on the other side of the base film 12. May be configured to be performed in a series of vacuum atmospheres of one laminate manufacturing apparatus 1. That is, another film forming apparatus for performing all or a part of each layer other than the second light-shielding conductive layer 17b may be provided between the unwinding apparatus 20 and the film forming apparatus 30. Alternatively, the film forming apparatus 30 may be configured not only to form the second light-shielding conductive layer 17b but also to form other layers.

(Film formation process)
Next, using the film forming apparatus 30, a film forming process for providing the second light-shielding conductive layer 17 b on the other side of the intermediate stacked body 11 is performed. The film forming process is performed in a state where the intermediate laminate 11 is wound around the transport drum 38 so that the first light-shielding conductive layer 17 a faces the surface of the transport drum 38.

  In the film forming step, first, the gas inside the first region 31 is exhausted to the outside by the exhaust means 31a, whereby the inside of the first region 31 is evacuated. At this time, the second region 33 and the third region 35 are also brought into a vacuum state by using the exhaust unit 33a and the exhaust unit 35a. Next, an inert gas such as argon is introduced into the first region 31 by an inert gas supply device (not shown). Further, the surface of the transport drum 38 is heated using the heating unit 37. The degree of heating, that is, the target temperature of the surface of the transport drum 38 is appropriately set according to the temperature on the other side of the intermediate laminate 11. For example, the temperature of the surface of the transport drum 38 is controlled within the range of 60 to 90 ° C. by the heating unit 37.

  Thereafter, discharge power is applied to the target 32a using a discharge device. The second light-shielding conductive layer 17b made of an APC alloy constituting the target 32a can be provided on the other side of the intermediate stacked body 11 by the sputtering phenomenon generated thereby. The conditions such as the discharge power, discharge time, and partial pressure of the inert gas during sputtering are appropriately set according to the desired film thickness, the rotation speed of the transport drum 38, and the like.

  Thereafter, in the winding device 50, the laminated body 10 including the intermediate laminated body 11 and the second light-shielding conductive layer 17 b formed on the other side of the intermediate laminated body 11 is taken up by the shaft 51. Thereby, the wound body of the laminated body 10 is obtained.

  As described above, according to the present embodiment, the film formation step of the second light-shielding conductive layer 17b is performed in a state where the surface of the transport drum 38 is heated. In other words, the second light-shielding conductive layer 17 b is formed on the other side of the intermediate laminate 11 with one side of the intermediate laminate 11 being heated by the transport drum 38. Hereinafter, the advantage of adopting such a film forming method will be described with reference to FIGS.

  FIG. 6 is a diagram schematically illustrating a state in which the second light-shielding conductive layer 17b is formed on the other side of the intermediate stacked body 11 by a sputtering method. In FIG. 6, reference numeral 11 a represents a surface on one side of the intermediate stacked body 11, that is, the surface of the first light-shielding conductive layer 17 a, and reference numeral 11 b represents a surface on the other side of the intermediate stacked body 11, that is, the first surface. 2 represents the surface of the transparent conductive layer 16b.

  In the sputtering method or the EB vapor deposition method, charged particles such as ionized argon are irradiated onto the target 32a made of an APC alloy for forming the second light-shielding conductive layer 17b. As a result, silver, palladium and copper, which are constituent elements of the target 32a, are deposited on the surface 11b on the other side of the intermediate laminate 11 (vacuum film forming step). In this case, in the space between the intermediate stacked body 11 and the target 32a, as shown by the reference numeral 32b in FIG. 6, there are negative ions and secondary electrons resulting from irradiating the target 32a with charged particles. ing. Further, some of these negative ions and secondary electrons are incident on the intermediate laminate 11 from one side of the intermediate laminate 11. As a result, it is known that the temperature of the intermediate stacked body 11 rises due to the energy of negative ions and secondary electrons.

  The increase in the temperature of the intermediate laminate 11 causes the thermal expansion of the intermediate laminate 11. When the intermediate laminate 11 is thermally expanded, the intermediate laminate 11 is locally warped or distorted, and as a result, the intermediate laminate 11 is expected to be partially separated from the surface of the transport drum 38. . In order to prevent such a phenomenon, conventionally, a measure has been taken to suppress the temperature rise of the intermediate laminate 11 by cooling the transport drum 38. For example, in the above-mentioned Patent Document 1, it is proposed that the film forming temperature is in the range of −10 to + 50 ° C.

  However, when the present inventors conducted extensive experiments, as supported by the experimental results in the examples described later, the intermediate laminate 11 including the base film 12 having the above-described thermal expansion coefficient and thickness. It has been found that it is not effective to cool the transfer drum 38 in the film forming process. That is, when the transport drum 38 is cooled during the film formation process of the second light-shielding conductive layer 17b, a large number of scratches due to rubbing with the surface of the transport drum 38 are formed in the first light-shielding conductive layer 17a. I understood. Then, without being bound by the conventional common sense of “cooling”, the present inventors conducted further experiments and as a result, as supported by the experimental results in Examples described later, the second light-shielding conductive layer 17b. It was found that the deviation of the first light-shielding conductive layer 17a with respect to the conveyance drum 38 can be suppressed by heating the conveyance drum 38 during the film forming process. As a result, it was possible to suppress the formation of scratches on the first light-shielding conductive layer 17a. Such an approach is contrary to conventional common sense, and therefore cannot be easily conceived. Moreover, the effect obtained by such a novel approach is a remarkable effect exceeding the range anticipated from the prior art level, as supported by the experimental results in Examples described later. It can be said.

  Hereinafter, the reason why it is possible to suppress the formation of scratches on the second light-shielding conductive layer 17b by heating the transport drum 38 will be described with reference to FIGS. In addition, the description described below is only an example, and the reason why the scratch on the second light-shielding conductive layer 17b can be suppressed is not limited to the following description.

  FIG. 7A is a diagram schematically showing the thermal stress generated in the intermediate laminate 11 when it is assumed that the transport drum 38 is not heated, and FIG. 7B is a diagram showing the laminate according to the present embodiment. It is a figure which shows typically the thermal stress which arises in the intermediate | middle laminated body 11 when a body manufacturing method is used.

As mentioned above, in this Embodiment, as the base film 12, the linear expansion coefficient in the range of 0-90 degreeC is 2.0-2.4 * 10 < ^-5 > / degreeC, and thickness is 100. Films in the range of ~ 250 μm are used. In this case, assuming that the transport drum 38 is not heated, the temperature of the surface 11b on the other side of the intermediate laminate 11 is considered to be significantly higher than the temperature of the surface 11a on the one side. This is because in consideration of the film thickness and the film formation speed of the second light-shielding conductive layer 17b, the time during which the surface 11b on the other side of the intermediate stacked body 11 faces the target 32a is about 3 minutes. This is because the heat on the surface 11b on the other side is not sufficiently transferred to the surface 11a on the other side. Therefore, when the transport drum 38 is not heated, as shown in FIG. 7A, the thermal stress σb generated on the surface 11b on the other side is larger than the thermal stress σa generated on the surface 11a on the other side. It seems that it is extremely large. As a result, warpage or distortion caused by the temperature difference between the surface 11a on one side and the surface 11b on the other side is generated, and it is considered that many scratches are formed in the first light-shielding conductive layer 17a. .

  On the other hand, according to the present embodiment, the surface of the transport drum 38 is heated during the film forming process of the second light-shielding conductive layer 17b, and thereby the surface 11a on one side of the intermediate laminate 11 is heated. . For this reason, it can suppress that the difference of the temperature of the surface 11a of one side and the temperature of the surface 11b of the other side becomes large. As a result, as shown in FIG. 7B, the thermal stress σb generated on the surface 11b on the other side is substantially balanced with the thermal stress σa generated on the surface 11a on the other side. As a result, it is possible to suppress the occurrence of wrinkles in the intermediate laminated body 11 and the displacement of the intermediate laminated body 11 with respect to the transport drum 38, which makes it possible to form the second light-shielding conductive layer 17 b during the film forming process. It is possible to prevent the first light-shielding conductive layer 17a from being damaged.

The method for setting the target temperature for heating the transport drum 38 is not particularly limited. For example, based on the film thickness of the second light-shielding conductive layer 17b and the rotation speed of the transport drum 38, a temperature rise on the surface 11b on the other side of the intermediate laminate 11 is predicted in advance, and based on this prediction, the intermediate laminate The target temperature of the surface of the transport drum 38 may be set so that the difference between the temperature of the surface 11a on one side of 11 and the temperature of the surface 11b on the other side becomes small.
Alternatively, as shown in FIG. 6, a temperature monitor 31 c for monitoring the temperature of the surface 11 b on the other side of the intermediate laminate 11 may be provided in the vicinity of the transport drum 38. In this case, in the film forming step of forming the second light-shielding conductive layer 17b on the surface 11b on the other side of the intermediate laminate 11, the temperature of the surface 11b on the other side of the intermediate laminate 11 is measured using the temperature monitor 31c. And a temperature monitoring step. In the vacuum film forming step, the surface of the transfer drum 38 is such that the temperature of the surface of the transfer drum 38 is substantially the same as the temperature of the surface 11b on the other side of the intermediate laminate 11 obtained in the monitoring step. Heated. Thereby, the difference between the temperature of the surface 11a on one side of the intermediate laminate 11 and the temperature of the surface 11b on the other side can be further reduced. The specific configuration of the temperature monitor 31c is not particularly limited, and various means capable of measuring the temperature of the object in contact or non-contact can be used. For example, an infrared thermometer or a sheet-like thermocouple can be used.

Manufacturing method for a touch panel sensor Next, as an example of the application of the laminate 10, will be described touch panel sensor obtained by patterning a laminate 10. The touch panel sensor 60 is a sensor that is provided on the viewer side of a display panel such as a liquid crystal display panel or an organic EL display panel, and includes a transparent conductive pattern for detecting a contact position of a detection target such as a human body. As the touch panel sensor 60, a resistive touch panel sensor that detects a touch location based on a pressure from a detection target, or a capacitance type touch detection that detects a touch location based on static electricity from a detection target such as a human body. Various types of touch panel sensors and the like are known. Here, an example in which the capacitive touch panel sensor 60 is formed by patterning the laminate 10 will be described with reference to FIGS. 8 and 9. To do. FIG. 8 is a plan view showing the touch panel sensor 60, and FIG. 9 is a cross-sectional view taken along the line IX-IX of the touch panel sensor 60 shown in FIG.

  As shown in FIG. 8, the touch panel sensor 60 includes transparent conductive patterns 62a and 62b for detecting a change in capacitance due to the approach of an external conductor such as a finger. The transparent conductive patterns 62a and 62b are arranged on one side of the base film 12, and are arranged on the other side of the first transparent conductive pattern 62a extending in the lateral direction of FIG. 8 and the base film 12, as shown in FIG. And a second transparent conductive pattern 62b extending in the vertical direction. The touch panel sensor 60 further includes a first extraction pattern 64a connected to the first transparent conductive pattern 62a and a second extraction pattern 64b connected to the second transparent conductive pattern 62b. Further, terminal portions 65a and 65b connected to the extraction patterns 64a and 64b and for extracting signals from the transparent conductive patterns 62a and 62b to the outside may be further provided.

  As shown in FIG. 9, the transparent conductive patterns 62 a and 62 b are obtained by patterning the transparent conductive layers 16 a and 16 b of the laminate 10. Similarly, the first extraction pattern 64a is obtained by patterning the first light-shielding conductive layer 17a of the stacked body 10. Although not shown in FIG. 9, the first terminal portion 65a is also obtained by patterning the first light-shielding conductive layer 17a of the laminate 10, and the second extraction pattern 64b and the second terminal portion are also obtained. 65b is obtained by patterning the second light-shielding conductive layer 17b of the laminate 10. As a method for patterning the transparent conductive layers 16a and 16b and the light-shielding conductive layers 17a and 17b, for example, a photolithography method is used.

  According to this Embodiment, the laminated body 10 is produced using the laminated body manufacturing apparatus 1 and the laminated body manufacturing method which were improved so that damage to the surface of one side of the laminated body 10 might be suppressed. For this reason, the touch panel sensor 60 having stable characteristics and high reliability can be manufactured from the laminate 10.

Modifications Various modifications can be made to the above-described embodiment. Hereinafter, an example of modification will be described.

  In the above-described embodiment, an example in which an APC alloy is used as the metal material constituting the light-shielding conductive layers 17a and 17b is shown. However, the present invention is not limited to this, and the light shielding conductive layers 17a and 17b may be configured using other metal materials.

  In the present embodiment, a light-shielding and conductive metal layer may be further disposed between the transparent conductive layers 16a and 16b and the light-shielding conductive layers 17a and 17b. The metal layer can be formed by, for example, a sputtering method performed in the second region 33 of the film forming apparatus 30.

  EXAMPLES Next, although an Example demonstrates this invention further more concretely, this invention is not limited to description of a following example, unless the summary is exceeded.

(Sample A)
A laminate including a light-shielding conductive layer disposed on each of one side and the other side of the base film was produced. First, a first light-shielding conductive layer was formed on one side of the base film by a sputtering method. Thereafter, a second light-shielding conductive layer was formed by sputtering on the other side of the base film while the base film was wound around the transport drum so that the first light-shielding conductive layer was in contact with the surface of the transport drum. At this time, the conveyance drum was cooled so that the temperature of the surface of the conveyance drum was −10 ° C. In the following description, the surface temperature of the transport drum when the second light-shielding conductive layer is formed by sputtering is referred to as “film formation temperature”.

  An APC alloy was used as the metal material constituting the light shielding conductive layer. The content ratios of silver, palladium and copper in the APC alloy were 98% by weight, 1.2% by weight and 0.8% by weight, respectively. As the substrate film, a film made of polyethylene terephthalate and having a thickness of 180 μm was used.

(Sample B)
A laminate was produced in the same manner as in Sample A except that the film formation temperature was 40 ° C.
(Sample C)
A laminate was produced in the same manner as in Sample A, except that the film formation temperature was 80 ° C.
(Sample D)
A laminate was produced in the same manner as in Sample A except that the film formation temperature was 70 ° C.

〔Evaluation method〕
(Evaluation method 1 wrinkles)
Samples A to C were observed to confirm the degree of wrinkles occurring in samples A to C. The result of having photographed each of samples A to C is shown in FIG. FIG. 10 shows the result of photographing each sample placed on a flat table and the result of photographing the state in which each sample is wound around the transport drum.

  As shown in FIG. 10, in the sample A where the film forming temperature is −10 ° C., many wrinkles were generated. In the sample B where the film formation temperature is 40 ° C., the wrinkle density was reduced as compared with the sample A. It was confirmed that the wrinkle density was remarkably reduced in Sample C where the film formation temperature was 80 ° C. as compared with Samples A and B.

(Evaluation method 2 Scratch frequency)
For Samples B and D, the number of scratches generated on the surface of the second light-shielding conductive layer was counted. The count result is shown in FIG. In FIG. 11, the vertical axis indicates the position on the second light-shielding conductive layer in the transport direction (MD direction) of the base film, and the horizontal axis is the direction (TD direction) orthogonal to the transport direction of the base film. The position on the 2nd light-shielding conductive layer in is shown. In FIG. 11, points are plotted at positions where scratches are observed.

  As shown in FIG. 11, in the sample B where the film forming temperature is 40 ° C., many scratches were observed. Specifically, 400 scratches were observed within a range of about 60 mm in the MD direction and about 600 mm in the TD direction. On the other hand, the number of scratches confirmed in Sample D where the film formation temperature was 70 ° C. was significantly reduced as compared with Sample B. Specifically, 92 scratches were observed within a range of about 60 mm in the MD direction and about 600 mm in the TD direction. It was confirmed that the number of scratches was remarkably reduced by increasing the deposition temperature.

  Within the temperature range adopted in the above evaluation, it can be said that the higher the film formation temperature can suppress the damage of the first light-shielding conductive layer. On the other hand, if the film formation temperature is too high, another problem arises, which may increase damage to the first light-shielding conductive layer. Considering this point, the results of studying the upper limit of the film formation temperature are shown below. Here, a description will be given of the results of manufacturing a laminate with the film formation temperatures of 40 ° C., 60 ° C., 80 ° C., 100 ° C., and 120 ° C. and measuring the hardness and the like.

  FIG. 12 is a bar graph showing the hardness of the light-shielding conductive layer of the laminate obtained at each film formation temperature, the ratio of crystal grains having the (111) crystal axis in the light-shielding conductive layer, and the light-shielding conductive layer It is a figure which shows the result of having plotted the size of the crystal grain of. As shown in FIG. 12, it was found that the hardness of the light-shielding conductive layer decreases as the film formation temperature increases. Further, it was found that as the film forming temperature increases, the size of the crystal grains increases, and the ratio of the (111) crystal grains increases substantially. The “crystal grains having the (111) crystal axis” are crystal grains in which the (111) crystal axis is parallel to the normal direction of the stacked body including the light-shielding conductive layer. The crystal grain size is the average size of each crystal grain calculated based on the average of the major axis and the minor axis of each crystal grain. The major axis and minor axis of each crystal grain were measured by acquiring an image of the surface shape of each grain using a Toyo Technica 5420 Model AFM / SPM system and judging the boundary between crystal grains from the density of the image.

  From FIG. 12, it can be seen that increasing the film forming temperature causes a decrease in hardness, and that there is a correlation between the hardness and the ratio of the crystal grains of (111) and the crystal grain size. Recognize. Hereinafter, the reason why the ratio of the crystal grains having the (111) crystal axis and the size of the crystal grains affects the hardness of the APC alloy will be examined.

Generally, there are the following two methods for increasing the hardness of a film.
(1) To reduce the size of crystal grains.
(2) Reduce slippery crystal planes.

  (1) can be explained by the fact that the smaller the size of the crystal grains, the larger the ratio of crystal grain boundaries existing per unit volume of the film, and as a result, the movement of dislocations tends to be hindered. In general, when the film forming temperature is increased, crystallization and crystal growth are promoted, and as a result, the size of the crystals constituting the light-shielding conductive layer is increased. For this reason, as shown in FIG. 12, it can be said that the higher the film formation temperature, the lower the hardness.

  Regarding (2), the APC alloy is an alloy containing silver as a main component and thus has a face-centered cubic lattice (FCC) structure. For this reason, the slip surface of the APC alloy is (111). Accordingly, a reduction in the ratio of crystal grains having the (111) crystal axis means that the ratio of crystal grains having a slip plane parallel to the plane of the laminate is reduced. As shown in FIG. 12, the higher the film formation temperature, the higher the ratio of (111) crystal grains. In this respect, it can be said that the higher the film formation temperature, the lower the hardness.

  From the above results, as a factor for determining the number of scratches formed in the first light-shielding conductive layer, as shown in FIG. 13, it is based on wrinkles that act to suppress the generation of scratches as the film formation temperature increases. It can be said that there are a factor and a factor based on hardness that works to promote the generation of scratches as the deposition temperature increases. Therefore, in order to effectively suppress damage to the first light-shielding conductive layer, the temperature at which wrinkles are suppressed and crystallization and crystal growth of the first light-shielding conductive layer can be suppressed. It can be said that the second light-shielding conductive layer is preferably formed within the range.

  A specific film forming temperature will be examined. As shown in FIG. 12, the ratio of (111) crystal grains has a minimum value at a film forming temperature of 60 ° C. From this, it can be said that the lower limit of the film formation temperature is preferably about 50 to 70 ° C., for example, 60 ° C. Further, since the ratio of the crystal grains of (111) is remarkably increased when the film forming temperature is changed from 100 ° C. to 120 ° C., the upper limit of the film forming temperature is about 80 to 100 ° C. It can be said that it is preferable.

DESCRIPTION OF SYMBOLS 1 Laminated body manufacturing apparatus 10 Laminated body 10 'Intermediate laminated body 12 Base film 13a, 13b Hard coat layer 14a, 14b High refractive index layer 15a, 15b Low refractive index layer 16a, 16b Transparent conductive layer 17a, 17b Light shielding conductive layer 20 Unwinding device 21 Shaft 30 Film forming device 31 First region 31a Exhaust means 31c Temperature monitor 32a Target 33 Second region 33a Exhaust means 50 Winding device 51 Shaft 60 Touch panel sensor 62a, 62b Transparent conductive pattern 64a, 64b Extraction pattern 65a, 65b terminal

Claims (4)

A step of preparing an intermediate laminate including a base film and a first light-shielding conductive layer that is provided on one side of the base film and has light shielding properties and conductivity;
In a state where the intermediate laminate is wound around the transport drum so that the first light-shielding conductive layer faces the surface of the transport drum, a second light-shielding conductive layer having light shielding properties and conductivity is provided on the other side of the intermediate stack. And a film forming process for forming
The said base film is comprised from the transparent resin material whose linear expansion coefficient in the range of 0-90 degreeC is 2.0-2.4 * 10 < ^-5 > / degreeC, The thickness of the said base film is 100. Within the range of ~ 250μm,
The film forming step is a vacuum film forming step of irradiating a target made of a metal for forming the second light-shielding conductive layer with charged particles and attaching a constituent element of the target to the other side of the intermediate laminate. Including
The film forming step further includes a temperature monitoring step of measuring the temperature of the intermediate laminate,
In the vacuum film forming step, the surface of the transport drum is within a range of 60 to 90 ° C. so that the temperature of the surface of the transport drum is substantially the same as the temperature of the intermediate laminate obtained in the monitoring step. The manufacturing method of the laminated body currently controlled. A step of preparing an intermediate laminate including a base film and a first light-shielding conductive layer that is provided on one side of the base film and has light shielding properties and conductivity;
In a state where the intermediate laminate is wound around the transport drum so that the first light-shielding conductive layer faces the surface of the transport drum, a second light-shielding conductive layer having light shielding properties and conductivity is provided on the other side of the intermediate stack. And a film forming process for forming
The said base film is comprised from the transparent resin material whose linear expansion coefficient in the range of 0-90 degreeC is 2.0-2.4 * 10 < ^-5 > / degreeC, The thickness of the said base film is 100. Within the range of ~ 250μm,
The film forming step is a vacuum film forming step of irradiating a target made of a metal for forming the second light-shielding conductive layer with charged particles and attaching a constituent element of the target to the other side of the intermediate laminate. And a temperature monitoring step for measuring the temperature of the intermediate laminate,
In the vacuum film forming step, the surface of the transfer drum is heated so that the temperature of the surface of the transfer drum is substantially the same as the temperature of the intermediate laminate obtained in the monitoring step. . The said base film of the said intermediate | middle laminated body is a manufacturing method of the laminated body of Claim 1 or 2 comprised from the cycloolefin polymer. The said 1st light-shielding conductive layer is a manufacturing method of the laminated body as described in any one of Claims 1 thru | or 3 comprised from the silver alloy which has silver and copper and palladium as a main component.