JP6236957B2 - Electronic component conveying device, electronic component inspection device, and cooling system - Google Patents

Description

  The present invention relates to an electronic component conveying device, an electronic component inspection device, and a cooling system.

2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects electrical characteristics of an electronic component such as an IC device is known.
Such an electronic component inspection apparatus supplies an electronic component from a supply tray to an inspection unit, inspects the electrical characteristics of the electronic component supplied to the inspection unit, and after the inspection ends, the electronic component is transferred from the inspection unit. It is comprised so that it may collect | recover to a collection tray. Here, the electronic components accommodated in the supply tray are transferred to the shuttle by the supply device, and conveyed to the vicinity of the inspection unit by the shuttle. The electronic parts are transported from the shuttle to the inspection unit by the inspection apparatus. This inspection apparatus sucks and holds uninspected electronic components accommodated in the shuttle and supplies them to the inspection unit.
In addition, in order to inspect the electrical characteristics of an electronic component in a high temperature environment, some inspection apparatuses include a heating unit that heats the electronic component. Furthermore, in order to maintain the electronic component at a predetermined temperature, there are some equipped with a cooling means for cooling the electronic component (see, for example, Patent Document 1).

JP 2003-28923 A

  For electronic components to be inspected, for example, electrical characteristics can be inspected in a high temperature environment of 60 to 100 ° C., and sufficient temperature control is not necessary, and conversely, for example, in a temperature environment of 80 to 82 ° C. In some cases, electrical characteristics must be inspected and fine temperature control is required. If an electronic component that does not require fine temperature control is inspected, it is sufficient to use an inspection apparatus that includes only a heating means, and an inspection apparatus that includes a heating means and a cooling means is overspec. On the other hand, if an electronic component that requires fine temperature control is to be inspected, an inspection device provided with a heating means and a cooling means must be used, and an inspection device provided with only a heating means will be under spec.

As described above, although there are electronic components to be inspected that may or may not require fine temperature control, conventional electronic component inspection devices can only use the same inspection device, which is convenient. Was bad.
An object of the present invention is to provide an electronic component conveying device, an electronic component inspection device, and a cooling system that are highly convenient.

Such an object is achieved by the present invention described below.
The electronic component transport device of the present invention includes a gas suction unit,
A gas supply unit;
A first adsorption path connected to the gas suction unit and the gas supply unit;
A second adsorption path connected to the gas suction part and the gas supply part and arranged independently of the first adsorption path;
A path connected to the gas supply unit,
When using a first hand having a first suction hole and a second suction hole for sucking an electronic component, the first suction hole and the first suction path are connected, and the second suction hole The second adsorption path is connected,
When a second hand having a third suction hole for sucking an electronic component and a jet part for jetting gas to cool the electronic component is used, the third suction hole and the first suction path are connected. And the injection unit and the path are connected ,
A service path communicating with the second suction hole when the first hand is used, and a communication path communicating with the injection unit when the second hand is used;
And a switching unit that switches between a state in which the service path and the second adsorption path communicate with each other and a state in which the service path and the path communicate with each other.
As a result, the first hand and the second hand can be selectively used depending on the type of electronic device, so that the electronic component transport apparatus is highly convenient. Moreover, the increase in piping can be suppressed and the enlargement and cost increase of an electronic component conveying apparatus can be suppressed.

In the electronic component transport device of the present invention, the flow rate of the gas that passes through the path and is supplied from the gas supply unit to the injection unit passes through the second adsorption path and passes from the gas supply unit to the first. It is preferable that it is larger than the flow volume of the said gas supplied to 2 adsorption holes.
Thereby, the cooling effect of an electronic component can be improved .

In the electronic component transport device of the present invention, the switching unit includes a first switching unit that switches between a state where the service path and the second suction path communicate with each other and a state where the service path and the path communicate with each other. ,
It is preferable to include a second switching unit that switches between a state in which the route is open and a state in which the route is closed in a state where the service route and the route communicate with each other.
By using the first switching unit for switching the path and the second switching unit for controlling the gas injection in this way, the gas injection can be controlled with higher accuracy, so that the cooling control of the electronic component is performed with higher accuracy. Can do.

In the electronic component transport device of the present invention, the electronic component transport device includes a temperature detection unit that detects the temperature of the electronic component sucked by the third suction hole,
It is preferable that the second switching unit is controlled based on a detection result of the temperature detection unit and the gas is injected to cool the electronic component in a state where the service path and the path communicate with each other .
Thereby, an electronic component can be cooled and maintained at a desired temperature with high accuracy.
In the electronic component transport apparatus according to the present invention, the first hand heats the electronic component sucked by the first suction hole and the second heating unit heats the electronic component sucked by the second suction hole. Having a heating section,
The second hand preferably includes a third heating unit that heats the electronic component sucked by the third suction hole.
Thereby, an electronic component can be heated efficiently.

In the electronic component transport device of the present invention, a control unit,
A first electrical path and a second electrical path connected to the control unit;
When using the first hand, the first heating unit and the first electrical path are electrically connected, and the second heating unit and the second electrical path are electrically connected,
When the second hand is used, it is preferable that the third heating unit and the first electric path are electrically connected, and the second switching unit and the second electric path are electrically connected.
Thereby, even if it is a case where any of the 1st and 2nd hand is arrange | positioned, these drives can be controlled by a control part.

In the electronic component transport device of the present invention, when the first hand is used, an electrical path for the first hand that electrically connects the second electrical path and the second heating unit,
A second hand electrical path for electrically connecting the second electrical path and the second switching unit when the second hand is used;
An electrical path switching unit that switches between a state in which the second electrical path and the second heating unit are electrically connected and a state in which the second electrical path and the second switching unit are electrically connected; Is preferred.
Thereby, the increase in electrical wiring can be suppressed and the enlargement and cost increase of an electronic component conveying apparatus can be suppressed.

In the electronic component conveying apparatus of the present invention, a base,
A hand support unit that movably supports the first hand and the second hand with respect to the base;
The service path has flexibility, and an end connected to the second suction hole or the injection unit is fixedly provided on the base, and is connected to the second suction path or the path. It is preferable that an end portion to be provided is fixedly provided on the hand support portion and is bent so as to allow movement of the base.
Thereby, while being able to prevent a failure | damage of a service path | route, a 1st, 2nd hand can be moved smoothly.

The electronic component inspection apparatus of the present invention includes a gas suction unit,
A gas supply unit;
A first adsorption path connected to the gas suction unit and the gas supply unit;
A second adsorption path connected to the gas suction part and the gas supply part and arranged independently of the first adsorption path;
A path connected to the gas supply unit;
An inspection unit for inspecting the electronic component,
When using a first hand having a first suction hole and a second suction hole for sucking an electronic component, the first suction hole and the first suction path are connected, and the second suction hole The second adsorption path is connected,
When using a second hand having a third suction hole for sucking an electronic component and a jet part for jetting gas, the third suction hole and the first suction path are connected, and the jet part Connected to the path ,
A service path communicating with the second suction hole when the first hand is used, and a communication path communicating with the injection unit when the second hand is used;
And a switching unit that switches between a state in which the service path and the second adsorption path communicate with each other and a state in which the service path and the path communicate with each other.
Accordingly, since the first hand and the second hand can be used properly depending on the type of electronic device, the electronic component inspection apparatus is highly convenient.

The cooling system of the present invention includes a first hand having a first suction hole and a second suction hole for sucking an electronic component,
A gas suction part for sucking gas from the first suction hole and the second suction hole;
A gas supply unit for supplying gas to the first adsorption hole and the second adsorption hole;
A first adsorption path connecting the gas suction part and the gas supply part with the first adsorption hole;
In the electronic component transport apparatus having the second suction path, which connects the gas suction part and the gas supply part and the second suction hole, and is disposed independently of the first suction path,
A cooling system used when the first hand is used by replacing it with a second hand having a third suction hole for sucking an electronic component and a jet part for jetting gas,
A path communicating the gas supply unit and the second adsorption path;
A switching unit,
By installing the path, the first hand or the part on the second hand side from the connection part of the second suction path with the path is used as the second suction path and the service path of the path. ,
The switching unit can switch between a state in which the second adsorption route and the service route are connected and a state in which the route and the service route are connected.
According to such a cooling system, a cooling function can be easily added to the conventional electronic component conveying apparatus.

In the cooling system of the present invention, the electronic component transport device is
A first heating unit that is provided in the first hand and heats the electronic component adsorbed by the first adsorption hole; and a second heating unit that heats the electronic component adsorbed by the second adsorption hole;
A control unit for controlling driving of the first heating unit and the second heating unit;
A first electrical path that electrically connects the control unit and the first heating unit;
A second electrical path that electrically connects the control unit and the second heating unit,
The second hand is
It is preferable to have a 3rd heating part which heats the electronic component adsorbed by the 3rd adsorption hole.
Thereby, an electronic component can be heated efficiently.

In the cooling system of the present invention, an electrical path for a switching unit that electrically connects the second electrical path and the switching unit,
An electrical path switching unit that switches electrical paths,
By installing the switching unit electrical path, the second electrical path and the switching unit electrical path are connected to a portion of the second electrical path that is closer to the control unit than the connection unit with the switching unit electrical path. And in-service electrical route
Preferably, the electrical path switching unit switches between a state where the service electrical path and the second electrical path are conducted and a state where the service electrical path and the switch electrical path are conducted.
Thereby, the increase in electrical wiring can be suppressed and the enlargement and cost increase of an electronic component conveying apparatus can be suppressed.
In the cooling system of the present invention further have a second hand,
The second hand is preferably used in exchange for the first hand .
Thereby, it becomes a more convenient cooling system.

It is a top view which shows suitable embodiment of the electronic component inspection apparatus of this invention. It is sectional drawing of the 1st hand unit which a 1st hand has. It is a top view of the 1st hand unit shown in FIG. It is a top view of the 1st connection base of the electronic component inspection apparatus shown in FIG. It is a figure which shows the connection state of a connection port. It is a figure which shows the connection state of a connection terminal. It is a top view which shows the electronic component inspection apparatus which changed the 1st hand into the 2nd hand. It is sectional drawing of the 1st hand unit which a 2nd hand has. It is a top view of the 1st hand unit shown in FIG. It is a top view which shows arrangement | positioning of a 1st hand unit. It is a figure which shows the connection state of a connection port. It is a figure which shows the connection state of a connection terminal. It is a figure which shows the piping which the electronic component inspection apparatus shown in FIG. 1 has. It is a figure which shows the piping which the electronic component inspection apparatus shown in FIG. 1 has. It is a top view which shows a strip | belt-shaped piping body. It is a figure which shows the electrical wiring which the electronic component inspection apparatus shown in FIG. 1 has. It is a figure which shows the electrical wiring which the electronic component inspection apparatus shown in FIG. 1 has. It is a top view explaining the test | inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG. It is sectional drawing of the 1st hand unit which the 1st hand of the electronic component inspection apparatus concerning 2nd Embodiment of this invention has. It is sectional drawing explaining the effect of the rocking | fluctuation mechanism shown in FIG. It is a figure which shows the piping group which the electronic component inspection apparatus concerning 3rd Embodiment of this invention has. It is a figure which shows the piping which the conventional electronic component inspection apparatus has. It is a figure which shows the electrical wiring which the conventional electronic component inspection apparatus has. It is a figure which shows suitable embodiment of the cooling system of this invention integrated in the electronic component inspection apparatus shown in FIG. 30 and FIG. It is a figure which shows suitable embodiment of the cooling system of this invention integrated in the electronic component inspection apparatus shown in FIG. 30 and FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device, an electronic component inspection device, and a cooling system of the present invention will be described in detail based on embodiments shown in the accompanying drawings.
[Electronic component inspection equipment]
<First Embodiment>
First, a first embodiment of an electronic component inspection apparatus will be described.

  FIG. 1 is a plan view showing a preferred embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 is a cross-sectional view of the first hand unit included in the first hand. FIG. 3 is a plan view of the first hand unit shown in FIG. FIG. 4 is a plan view of a first connection base of the electronic component inspection apparatus shown in FIG. FIG. 5 is a diagram illustrating a connection state of the connection port. FIG. 6 is a diagram illustrating a connection state of the connection terminals. FIG. 7 is a plan view showing an electronic component inspection apparatus in which the first hand is changed to the second hand. FIG. 8 is a cross-sectional view of the first hand unit of the second hand. FIG. 9 is a plan view of the first hand unit shown in FIG. FIG. 10 is a plan view showing the arrangement of the first hand units. FIG. 11 is a diagram illustrating a connection state of the connection port. FIG. 12 is a diagram illustrating a connection state of the connection terminals. FIG. 13 and FIG. 14 are diagrams showing piping included in the electronic component inspection apparatus shown in FIG. FIG. 15 is a plan view showing a belt-like pipe body. FIG. 16 and FIG. 17 are diagrams each showing an electrical wiring included in the electronic component inspection apparatus shown in FIG. 18 to 26 are plan views for explaining the inspection procedure of the electronic component by the electronic component inspection apparatus shown in FIG.

In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. A direction parallel to the X axis is referred to as an “X direction”, a direction parallel to the Y axis is referred to as a “Y direction”, and a direction parallel to the Z axis is referred to as a “Z direction”.
An electronic component inspection apparatus 100 shown in FIG. 1 is an apparatus for inspecting and testing electrical characteristics of electronic components such as an IC device (IC chip), an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). is there. In the following description, for convenience of explanation, the case where an IC device is used as a test part to be inspected and tested will be described as a representative, and this will be referred to as “IC device 9”.

  The electronic component inspection apparatus 100 includes a supply tray 120, a recovery tray 130, a first shuttle 140, a second shuttle 150, an inspection socket (inspection unit) 160, a supply apparatus 170, a recovery apparatus 180, an inspection It has the apparatus 190 and the control apparatus 110 which controls these each part. The electronic component inspection apparatus 100 is an apparatus that transports the IC device 9 to the inspection socket 160 and inspects and tests the electrical characteristics of the IC device 9 using the inspection socket 160.

  In the electronic component inspection apparatus 100, the configuration excluding the inspection socket 160, that is, the supply tray 120, the recovery tray 130, the first shuttle 140, the second shuttle 150, the supply apparatus 170, the recovery apparatus 180, the inspection apparatus 190, and the control apparatus 110 is provided. Thus, an electronic component transport apparatus (electronic component transport apparatus of the present invention) for transporting the IC device 9 is configured. The electronic component transport apparatus is also called a “handler”.

The configuration of the electronic component inspection apparatus 100 is not limited to that of the present embodiment, and at least one of these units may be omitted as necessary, or other configurations (for example, a heater, a chamber, etc.) ) May be added.
As shown in FIG. 1, the electronic component inspection apparatus 100 includes a base 101 on which the above-described parts are mounted, and a safety cover (not shown) that covers the base 101 so as to accommodate the parts. The first shuttle 140, the second shuttle 150, the inspection socket 160, the supply device 170, the recovery device 180, and the inspection device 190 are disposed in the region S inside the safety cover, and can be moved in and out of the region S. The supply tray 120 and the collection tray 130 are arranged so as to be.

Hereinafter, each of these units will be sequentially described in detail.
(Supply tray)
The supply tray 120 is a tray for transporting the IC device 9 to be inspected from outside the region S into the region S. The supply tray 120 has a plate shape, and a plurality of pockets 121 for holding the IC device 9 are formed in a matrix in the X direction and the Y direction on the upper surface thereof.
The supply tray 120 is placed on a stage (not shown) that moves on a rail 122 extending in the Y direction so as to straddle the inside and outside of the region S. When the stage is moved by a driving means (not shown) using a linear motor or the like as a driving source, the supply tray 120 reciprocates in the ± Y direction along the rail 122.

(Collection tray)
The collection tray 130 is a tray for storing the inspected IC device 9 and transporting it from the area S to the outside of the area S. The collection tray 130 has a plate shape, and a plurality of pockets 131 for holding the IC device 9 are formed in a matrix in the X direction and the Y direction on the upper surface thereof.
The collection tray 130 is placed on a stage (not shown) that moves on a rail 132 that extends in the Y direction so as to straddle the inside and outside of the region S. When the stage is moved by a driving means (not shown) using a linear motor or the like as a driving source, the collection tray 130 reciprocates in the ± Y direction along the rails 132.

In the electronic component inspection apparatus 100, two collection trays 130 having such a configuration are arranged side by side in the X direction. One of the two collection trays 130 is a tray for storing the IC device 9 that is determined as a “non-defective product” that satisfies predetermined electrical characteristics as a result of the inspection, and the other collection tray 130 is used for inspection. As a result, the tray is for accommodating the IC device 9 that is determined to be a “defective product” that does not satisfy the predetermined electrical characteristics. As described above, the separation of the IC device 9 can be easily performed by dividing the tray into the non-defective product and the defective product.
The collection tray 130 is provided to be separated from the supply tray 120 in the + X direction, and the first shuttle 140, the second shuttle 150, and the inspection socket 160 are disposed between the supply tray 120 and the collection tray 130. Has been.

(First shuttle)
The first shuttle 140 further transports the IC device 9 that has been transported into the region S by the supply tray 120 to the vicinity of the inspection socket 160, and further, the inspected IC device that has been inspected by the inspection socket 160. 9 is a shuttle for transporting 9 to the vicinity of the collection tray 130.

  As shown in FIG. 1, the first shuttle 140 includes a base member 141 and two shuttle jigs 142 and 144 that are detachably fixed to the base member 141. These two shuttle jigs 142 and 144 are provided side by side in the X direction. Further, eight pockets 143 and 145 for accommodating the IC devices 9 are formed in a matrix form on the upper surfaces of the shuttle jigs 142 and 144 so that two pockets 143 and 145 are arranged in the X direction and four in the Y direction, respectively. .

Of the shuttle jigs 142 and 144, the shuttle jig 142 located on the supply tray 120 side is a shuttle jig that transfers and accommodates the IC device 9 accommodated in the supply tray 120, and is located on the collection tray 130 side. Reference numeral 144 denotes a shuttle jig for accommodating the IC device 9 that has been inspected by the inspection socket 160. That is, the shuttle jig 142 is a shuttle jig that accommodates an uninspected IC device 9, and the shuttle jig 144 is a shuttle jig that accommodates an inspected IC device 9.
The first shuttle 140 is supported by a rail 146 having a base member 141 extending in the X direction, and can be reciprocated in the ± X direction along the rail 146 by driving means (not shown) using a linear motor or the like as a driving source. ing.

(Second shuttle)
The second shuttle 150 has the same function and configuration as the first shuttle 140 described above. That is, the second shuttle 150 further transports the IC device 9 that has been transported into the region S by the supply tray 120 to the vicinity of the inspection socket 160. Further, the second shuttle 150 is further inspected by the inspection socket 160. This is a shuttle for transporting the IC device 9 to the vicinity of the collection tray 130.

  As shown in FIG. 1, the second shuttle 150 includes a base member 151 and two shuttle jigs 152 and 154 that are detachably fixed to the base member 151. These two shuttle jigs 152 and 154 are provided side by side in the X direction. In addition, on the upper surfaces of the shuttle jigs 152 and 154, eight pockets 153 and 155 for accommodating the IC devices 9 are formed in a matrix so that two pockets 153 and 155 are arranged in the X direction and four in the Y direction, respectively. .

  Of the shuttle jigs 152 and 154, the shuttle jig 152 located on the supply tray 120 side is a shuttle jig that transfers and accommodates the IC device 9 accommodated in the supply tray 120, and is located on the collection tray 130 side. Reference numeral 154 denotes a shuttle jig for accommodating the IC device 9 that has been inspected by the inspection socket 160. That is, the shuttle jig 152 is a shuttle jig that accommodates an uninspected IC device 9, and the shuttle jig 154 is a shuttle jig that accommodates an inspected IC device 9.

The second shuttle 150 is supported by a rail 156 having a base member 151 extending in the X direction, and can be reciprocated in the ± X direction along the rail 156 by a driving means (not shown) using a linear motor or the like as a driving source. ing.
The second shuttle 150 is provided in the −Y direction away from the first shuttle 140 described above, and an inspection socket 160 is disposed between the first shuttle 140 and the second shuttle 150. ing.

(Inspection socket)
The inspection socket (inspection unit) 6 is a socket for inspecting and testing the electrical characteristics of the IC device 9.
The inspection socket 160 has eight individual inspection sockets 161 for arranging the IC devices 9. The eight individual sockets 161 for inspection are arranged in a matrix so that two in the X direction and four in the Y direction are arranged. Further, the arrangement pitch of the eight individual sockets 161 for inspection is substantially equal to the arrangement pitch of the four pockets 143, 145, 153, 155 formed in each of the shuttle jigs 142, 144, 152, 154. Thereby, the IC device 9 can be smoothly transported between the shuttle jigs 142, 144, 152, 154 and the individual socket for inspection 161.

Although not shown, a plurality of probe pins that are electrically connected to the control device 110 protrude from the bottom of each individual inspection socket 161. Each of the plurality of probe pins is biased upward by a spring or the like. When the IC device 9 is arranged in the individual socket for inspection 161, the plurality of probe pins come into contact with external terminals of the arranged IC device 9. Thereby, the IC device 9 and the control device 110 (inspection control unit 111 to be described later) are electrically connected via the probe pin, and the IC device 9 can be inspected and tested.
The inspection socket 160 is preferably detachably fixed to the base 101. Accordingly, the inspection socket 160 can be easily replaced according to the target inspection, or the inspection socket 160 suitable for the size, shape, and number of the IC devices 9 can be replaced.

(Supply device)
The supply device 170 is a robot that conveys the IC device 9 accommodated in the supply tray 120 to the shuttle jigs 142 and 152.
The supply device 170 is supported by the support frame 171 supported by the base 101, a movable frame 173 supported by the support frame 171 and reciprocally movable in the ± Y direction with respect to the support frame 171, and supported by the movable frame 173. It has a hand unit support portion 174 that can reciprocate in the ± X direction with respect to the frame 173 and four hand units 175 supported by the hand unit support portion 174.

  The support frame 171 is formed with a rail 172 extending in the Y direction, and the moving frame 173 reciprocates in the ± Y direction along the rail 172. In addition, a rail (not shown) extending in the X direction is formed on the moving frame 173, and the hand unit support portion 174 reciprocates in the ± X direction along this rail. The movement of the moving frame 173 with respect to the support frame 171 and the movement of the hand unit support 174 with respect to the moving frame 173 are performed by driving means (not shown) using a linear motor or the like as a driving source.

  Also, the four hand units 175 are arranged in a matrix so that two each are arranged in the X direction and the Y direction. Each hand unit 175 includes a holding unit that holds the IC device 9 and a lifting mechanism that lifts and lowers the holding unit in the Z direction. The holding unit has, for example, a suction nozzle and can hold the IC device 9 by suction. The elevating mechanism can use a driving means (not shown) using a linear motor or the like as a driving source.

(Inspection equipment)
The inspection apparatus 190 is a robot that conveys the IC device 9 accommodated in the shuttle jigs 142 and 152 to the inspection socket 160 and also conveys the IC device 9 that has been inspected from the inspection socket 160 to the shuttle jigs 144 and 154. is there. The inspection apparatus 190 has a function of pressing the IC device 9 against the inspection socket 160 (probe pin) and applying a predetermined inspection pressure to the IC device 9 when the IC device 9 is inspected with the inspection socket 160. doing.

  As shown in FIG. 1, the inspection apparatus 190 includes a first frame 191 fixed to the base 101 and a second frame supported by the first frame 191 and capable of reciprocating in the ± Y direction with respect to the first frame 191. 192, a first connection base (hand support part) 193 supported by the second frame 192 and reciprocally movable in the ± Z direction with respect to the second frame 192, and supported by the second frame 192, the second frame 192 The second connection base (hand support portion) 194 that can reciprocate in the ± Z direction, the eight first hand units 200 supported by the first connection base 193, and the second connection base 194 Eight second hand units 300 are provided.

Since the first and second connection bases 193 and 194 are both supported by the second frame 192, they move integrally in the ± Y direction. On the other hand, in the ± Z-axis directions, the first and second connection bases 193 and 194 move independently. The movement of the second frame 192 relative to the first frame 191 and the movement of the first and second connection bases 193 and 194 relative to the second frame 192 are performed by a driving means (not shown) using, for example, a linear motor as a driving source. .
In such an inspection apparatus 190, the first frame 191 and the second frame 192 and the driving means constitute a moving mechanism 195 that moves the first and second hand units 200 and 300 in the Y direction and the Z direction. . In addition, the eight first hand units 200 and the eight second hand units 300 constitute the first hand H1.

  Each first hand unit 200 is an apparatus that conveys the IC device 9 between the shuttle jigs 142 and 144 and the inspection socket 160. The eight first hand units 200 are arranged below the first connection base 193 in a matrix form with two in the X direction and four in the Y direction. The arrangement pitch of the first hand unit 200 is equal to the arrangement pitch of the pockets 143 and 145 formed in the shuttle jigs 142 and 144 and the inspection individual socket 161 provided in the inspection socket 160. Thereby, the IC device 9 can be smoothly transported between the shuttle jigs 142 and 144 and the inspection socket 160.

  On the other hand, each second hand unit 300 is an apparatus that conveys the IC device 9 between the shuttle jigs 152 and 154 and the inspection socket 160. The eight second hand units 300 are arranged below the second connection base 194 in a matrix form with two in the X direction and four in the Y direction. The arrangement pitch of the second hand unit 300 is equal to the arrangement pitch of the pockets 153 and 155 formed in the shuttle jigs 152 and 154 and the inspection individual socket 161 provided in the inspection socket 160. Accordingly, the IC device 9 can be smoothly transported between the shuttle jigs 152 and 154 and the inspection socket 160.

  Hereinafter, the configuration of the first and second connection bases 193 and 194 and the first and second hand units 200 and 300 will be described. The first and second connection bases 193 and 194 have the same configuration, and the first Since the second hand units 200 and 300 have the same configuration, the first connection base 193 and one first hand unit 200 will be described as a representative, and the other first hand units 200 and 300 will be described below. The description of the two connection bases and each second hand unit 300 is omitted.

The first hand unit 200 is detachably fixed to the first connection base 193 by, for example, screwing or the like. As shown in FIG. 2, the first hand unit 200 includes an air cylinder 210 fixed to the first connection base 193 and a device chuck 220 connected to the tip of the air cylinder 210.
The air cylinder 210 has a cylinder tube 211 fixed to the first connection base 193. The cylinder tube 211 has a bottomed cylindrical tube main body 212 and a front plate 213 that closes the opening of the tube main body 212. A piston 214 is formed in the Z direction in a cylinder chamber formed by the tube main body 212 and the front plate 213. It is arranged to be movable. The cylinder chamber is partitioned by the piston 214 into a first chamber D1 located on the upper side and a second chamber D2 located on the lower side.

The piston 214 is lifted upward by a spring SP, which will be described later, and when the air cylinder 210 is not in operation, the position where the surface of the piston 214 on the first chamber D1 side comes into contact with the bottom surface of the tube body 212 (hereinafter referred to as this). It is located at the top end position).
An air introduction port 215 is formed at the end of the tube body 212 on the first chamber D1 side, and a connection port P1 is attached to the air introduction port 215. The connection port P1 is connected to an electropneumatic regulator (not shown), and when air is supplied from the electropneumatic regulator to the first chamber D1, the piston 214 moves from the uppermost position to the spring SP by the pressure of the air. It moves downward against the elastic force. By setting the first chamber D1 to a predetermined air pressure, the IC device 9 disposed in the inspection socket 160 can be pressed with a suitable pressure. Therefore, electrical connection between the IC device 9 and the inspection socket 160 can be ensured, and damage to the IC device 9 can be suppressed.
The device chuck 220 disposed on the lower side of the air cylinder 210 as described above includes a connection block 230 fixed to the lower end portion of the piston 214, a heater block 240 disposed on the lower side of the connection block 230, and a heater block. 240 and a contact pusher 250 disposed on the lower side of 240.

  The connection block 230 is connected to the first connection base 193 via the spring SP. That is, the connection block 230 is elastically suspended from the first connection base 193 via the spring SP. As described above, the spring SP pushes the piston 214 up to the uppermost position via the connecting block 230. Further, the connecting block 230 is formed with a through hole that opens to the center and the side surface of the lower surface, and this through hole functions as the vacuum guide path 231. A connection port P <b> 2 is attached to one end of the vacuum guide path 231. Furthermore, the connection port P2 is connected to the gas suction part 610 and the gas supply part 620, as will be described later.

  A heater block 240 is connected and fixed below the connecting block 230, and a contact pusher 250 is detachably connected and fixed below the heater block 240. In the central part of the heater block 240 and the contact pusher 250, an accommodation hole is formed which passes through these and communicates with the vacuum guide path 231. A suction pipe 260 is disposed in the accommodation hole. A suction pad (suction hole) 270 provided is connected and fixed to the tip of the suction tube 260. Then, the IC device 9 can be sucked and held by the suction pad 270 by sucking air with the gas suction unit 610 and bringing the suction pipe 260 into a negative pressure state. On the contrary, the IC device 9 sucked and held by the suction pad 270 can be released by supplying air by the gas supply unit 620 and releasing the negative pressure state in the suction pipe 260.

  The heater block 240 and the contact pusher 250 are each made of a material that is hard and has high thermal conductivity. The material that is hard and has high thermal conductivity is not particularly limited. For example, various metals such as iron, nickel, cobalt, gold, platinum, silver, copper, aluminum, magnesium, titanium, and tungsten, or of these metals Alloys or intermetallic compounds containing at least one kind, and oxides, nitrides, carbides, and the like of these metals can be given.

  Two rod-shaped heaters (heating units) 241 are embedded in the heater block 240. The driving of the heater 241 is controlled by the control device 110. When the heater 241 generates heat, the heat is transmitted to the IC device 9 through the heater block 240 and the contact pusher 250, and the temperature of the IC device 9 rises. Thereby, the electrical characteristics of the IC device 9 in a high temperature environment can be inspected.

  The two heaters 241 extend in the Y direction, and are disposed at both ends in the X direction so as to avoid the suction pipe 260 in the center of the heater block 240. The heater 241 is not particularly limited as long as the IC device 9 can be heated. For example, various ceramic heaters such as an alumina heater, an aluminum nitride heater, a silicon nitride heater, a silicon carbide heater, and a boron nitride heater, nichrome, etc. Various cartridge heaters using a heating wire such as a wire can be used. Moreover, the heater 241 is not limited to a rod-shaped heater, and for example, a planar heater can be used.

  Further, as shown in FIG. 3, a temperature sensor 243 is embedded in the heater block 240. The temperature sensor 243 detects the temperature of the IC device 9 indirectly by detecting the temperature of the heater block 240. As described above, since the heater block 240 and the contact pusher 250 are made of a material having high thermal conductivity, the temperature difference between the IC device 9 and the heater block 240 is small, and the temperature sensor 243 embedded in the heater block 240 is used. Also, the temperature of the IC device 9 can be detected sufficiently accurately.

  In the present embodiment, since the detection unit 243a, which is a part that actually detects the temperature of the temperature sensor 243, is located at the center of the heater block 240, the distance from the IC device is reduced. Therefore, the temperature of the IC device 9 can be detected more accurately. Further, the heater 241 and the temperature sensor 243 can be separated as much as possible by arranging the two heaters 241 in a rod shape and disposing them at both ends of the heater block 240 in the X direction. Therefore, the temperature sensor 243 is hardly affected by the heat from the heater 241.

  The temperature sensor 243 is not particularly limited as long as the temperature of the IC device 9 can be detected. For example, a Pt sensor such as a platinum sensor, a thermocouple, a thermistor, or the like can be used. When the IC device 9 includes a thermal diode or the like, the temperature sensor 243 may be omitted and the temperature of the IC device 9 may be detected by the thermal diode.

  The temperature sensor 243 according to the present embodiment is arranged so as to indirectly detect the temperature of the IC device 9, but the arrangement is not particularly limited as long as the temperature of the IC device 9 can be detected. For example, the temperature of the IC device 9 may be directly detected. Specifically, the temperature sensor 243 may be disposed so as to be exposed on the lower surface of the device chuck 220 and come into contact with the IC device 9 when pressed. In the electronic component inspection apparatus 100, the temperature of the IC device 9 may be a temperature obtained by adding a predetermined correction to the temperature detected by the temperature sensor 243 in consideration of the thermal resistance of the heater block 240 and the contact pusher 250.

  In the present embodiment, the temperature sensor 243 is embedded in the heater block 240. However, the temperature sensor 243 may be embedded in the contact pusher 250, which is closer to the IC device 9, and the temperature detection accuracy is improved. It is thought to improve. However, since the contact pusher 250 is a member that is appropriately selected depending on the type and size of the IC device 9, if the temperature sensor 243 is disposed in the contact pusher 250, the temperature sensor 243 is provided in all the replacement contact pushers 250. It must be placed, which increases costs. Therefore, if the purpose is to reduce the cost, the temperature sensor 243 is preferably arranged in the heater block 240 as in the present embodiment.

  The configuration of the first hand unit 200 has been described above. In the following, for convenience of description, the eight first hand units 200 may be distinguished as the first hand units 200A to 200H. The arrangement of the first hand units 200A to 200H is as shown in FIG. In the present embodiment, the suction holes of the first hand units 200A, 200C, 200E, and 200G correspond to the “first suction holes” recited in the claims, and the first hand units 200B, 200D, 200F, and 200H. Of the first hand units 200A, 200C, 200E, and 200G corresponds to the “first heating unit”, and the first hand units 200B, 200D, 200F, and 200H. The heater 241 corresponds to the “second heating unit”.

  As shown in FIG. 4, eight connection ports P31 to P38 are provided side by side on the upper surface side of the first connection base 193, and eight connection ports P41 to P48 are provided on the side surface. Connection port P31 and connection port P41, connection port P32 and connection port P42, connection port P33 and connection port P43, connection port P34 and connection port P44, connection port P35 and connection port P45, connection port P36 and connection port P46, connection port The connection port P47 and the connection port P47, and the connection port P38 and the connection port P48 are connected through a through hole (not shown) formed in the first connection base 193, respectively.

  Further, as shown in FIG. 5, the connection port P41 is connected to the connection port P2 of the first hand unit 200A via the pipe R11, and the connection port P42 is connected to the connection port of the first hand unit 200B via the pipe R12. The connection port P43 is connected to the connection port P2 of the first hand unit 200C via the pipe R13, and the connection port P44 is connected to the connection port P2 of the first hand unit 200D via the pipe R14. The connection port P45 is connected to the connection port P2 of the first hand unit 200E via the pipe R15, and the connection port P46 is connected to the connection port P2 of the first hand unit 200F via the pipe R16, and the connection port P47. Is connected to the connection port P2 of the first hand unit 200G via the pipe R17. Connection port P48 is connected to the connecting port P2 of the first hand unit 200H via a pipe R18.

  As shown in FIG. 4, connection ports P41 and P42 are arranged side by side with the first hand units 200A and 200B, and connection ports P43 and P44 are arranged side by side with the first hand units 200C and 200D. The connecting ports P45 and P46 are arranged side by side with the 200F, and the connecting ports P47 and P48 are arranged side by side with the first hand units 200G and 200H, so that the pipes R11 to R14 can be kept short, and air suction is performed. -Supply can be performed efficiently. However, the arrangement of the connection ports P41 to P48 is not particularly limited.

As shown in FIG. 4, the first connection base 193 is provided with eight connection terminals CT11, CT12, CT13, CT14, CT15, CT16, CT17, and CT18. As shown in FIG. 6, the eight connection terminals CT11 to CT18 are electrically connected to the heaters 241 of the first hand units 200A to 200H via electric wiring.
The inspection apparatus 190 shown in FIG. 1 has been described in detail above. In the electronic component inspection apparatus 100, in the inspection apparatus 190 shown in FIG. 1, the first hand H1 (first and second hand units 200 and 300) is replaced with another second hand H2 (first and second hand units 200 ′). , 300 ′).

  As shown in FIG. 7, the second hand H2 is supported by the first connection base 193, and is arranged in four first hand units 200 ′ arranged in rows and columns in the X direction and the Y direction, and the second connection. There are four second hand units 300 ′ supported by the base 194 and arranged in a matrix of two in the X direction and two in the Y direction. As shown in FIG. 7, when the second hand H2 is used, the shuttle jigs 142, 144, 152, 154 are attached to correspond to the number and arrangement of the first and second hand units 200 ′, 300 ′. It is preferable to change to one having four pockets 143, 145, 153, 155, and to change the inspection socket 160 to one having four individual sockets 161 for inspection.

Hereinafter, the configuration of the first and second hand units 200 ′ and 300 ′ will be described. However, since the first and second hand units 200 ′ and 300 ′ have the same configuration as each other, one first unit is described below. One hand unit 200 ′ will be described as a representative, and description of the other first hand unit 200 ′ and each second hand unit 300 ′ will be omitted.
The first hand unit 200 ′ is detachably fixed to the first connection base 193 by, for example, screwing or the like. The first hand unit 200 ′ has a configuration in which a cooling unit 290 ′ for cooling the IC device 9 is added to the first hand unit 200 described above. Accordingly, the following description will focus on the cooling unit 290 ′ that is different from the first hand unit 200, and the description of the same configuration as the first hand unit 200 will be omitted.
As shown in FIGS. 8 and 9, the cooling unit 290 ′ included in the first hand unit 200 ′ includes a heat sink 291 ′ as a heat radiating unit disposed between the connection block 230 and the heater block 240, and a heat sink 291 ′. And an injection nozzle 292 ′ for injecting the cooling gas G.

  The heater block 240 is connected to the connection block 230 via a columnar member 293 ′ having excellent heat insulation, and a space formed by the member 293 ′ (a space between the heater block 240 and the connection block 230). A heat sink 291 ′ is disposed on the surface. The heat sink 291 'is fixed to the heater block 240 using a brazing material such as solder, and is thermally connected. Further, the heat sink 291 ′ is provided in contact with the connecting block 230. In other words, a gap is formed between the heat sink 291 ′ and the connection block 230. Thereby, heat exchange between the heat sink 291 ′ and the connection block 230 is suppressed, and the heat dissipation effect of the heat sink 291 ′ is improved. The size of the gap can be easily controlled by adjusting the height of the member 293 '.

  On the other hand, the injection nozzle 292 ′ is provided alongside the heat sink 291 ′, and is configured to inject the cooling gas G toward the heat sink 291 ′. By blowing the cooling gas G onto the heat sink 291 ′, the IC device 9 can be cooled via the heater block 240 and the contact pusher 250. Further, since the injection nozzle 292 ′ is fixed to the connection block 230 via a fixing tool, the relative position with respect to the heat sink 291 ′ is kept constant. Therefore, the cooling gas G is stably injected to the heat sink 291 ′, and the heat sink 291 ′ can be stably cooled. The injection of the cooling gas G from the injection nozzle 292 ′ is controlled by the control device 110.

  Further, it is preferable that the injection nozzle 292 ′ is configured to perform the diffusion injection (radial injection) of the cooling gas G. Thereby, the cooling gas G can be sprayed over a wider range of the heat sink 291 ′ while reducing the size of the injection nozzle 292 ′. Moreover, it is preferable that the injection cross-sectional shape of the cooling gas G injected from the injection nozzle 292 ′ has a shape in which the spread in the Z direction is suppressed from the spread in the XY plane direction. As a result, the cooling gas G can be efficiently supplied to the heat sink 291 '.

  According to such a first hand unit 200 ′, the temperature of the IC device 9 is set within a predetermined temperature range (for example, about a set temperature ± 2 ° C.) by heating the IC device 9 with the heater 241 and cooling with the cooling gas G. ) Can be maintained. In particular, the temperature G due to self-heating of the IC device 9 can be quickly canceled by the cooling gas G, the temperature of the IC device 9 being inspected can be kept substantially constant, and the IC device 9 can be inspected. This can be done with higher accuracy.

  The configuration of the first hand unit 200 'has been described above. In the present embodiment, the suction hole of each first hand unit 200 ′ corresponds to the “third suction hole” recited in the claims, and the heater 241 of each first hand unit 200 ′ is the “third heating unit”. It corresponds to. In the following, for convenience of explanation, the four first hand units 200 ′ installed on the first connection base 193 may be distinguished as the first hand units 200 </ b> A ′ to 200 </ b> D ′. The arrangement of the first hand units 200A 'to 200D' is as shown in FIG.

  As shown in FIG. 10, between the two first hand units 200A ′ and 200B ′ arranged in the X direction, the injection nozzle 292 ′ included in the first hand unit 200A ′ and the injection included in the first hand unit 200B ′. Nozzle 292 'is located. These two injection nozzles 292 'are located side by side in the Y direction. Similarly, between the first hand units 200C ′ and 200D ′ arranged in the X direction, the injection nozzle 292 ′ included in the first hand unit 200C ′ and the injection nozzle 292 ′ included in the first hand unit 200D ′ are provided. positioned. With this arrangement, for example, the cooling gas G injected from the injection nozzle 292 ′ of the first hand unit 200A ′ is used as the heat sink 291 ′ of the other first hand units 200B ′, 200C ′, and 200D ′. Can be prevented (the same applies to the first hand units 200B ′, 200C ′, and 200D ′). Therefore, unintended cooling of the heat sink 291 ′ is prevented by each first hand unit 200 ′, and the temperature control of the IC device 9 can be performed independently and with high accuracy. Second, the distance between the first hand units 200A 'and 200B' and the distance between the first hand units 200C 'and 200D' can be reduced. Therefore, the pitch of the first hand unit 200 'can be reduced.

  Further, as shown in FIG. 11, the connection port P41 is connected to the connection port P2 of the first hand unit 200A ′ via the pipe R21, and the connection port P42 is connected to the first hand unit 200A ′ via the pipe R22. It is connected to the injection nozzle 292 ′. The connection port P43 is connected to the connection port P2 of the first hand unit 200B ′ via the pipe R23, and the connection port P44 is connected to the injection nozzle 292 ′ of the first hand unit 200B ′ via the pipe R24. ing. The connection port P45 is connected to the connection port P2 of the first hand unit 200C ′ via the pipe R25, and the connection port P46 is connected to the injection nozzle 292 ′ of the first hand unit 200C ′ via the pipe R26. ing. The connection port P47 is connected to the connection port P2 of the first hand unit 200D ′ via the pipe R27, and the connection port P48 is connected to the injection nozzle 292 ′ of the first hand unit 200D ′ via the pipe R28. ing.

  That is, as shown in FIGS. 6 and 11, the connection port P42 is connected to the connection port P2 of the first hand unit 200B when the first hand H1 is installed, and the second hand H2 is installed. Is connected to the injection nozzle 292 ′ of the first hand unit 200A ′. Similarly, the connection port P44 is connected to the connection port P2 of the first hand unit 200D when the first hand H1 is installed, and the connection port P44 of the first hand unit 200B ′ when the second hand H2 is installed. Connected to the injection nozzle 292 '. Similarly, the connection port P46 is connected to the connection port P2 of the first hand unit 200F when the first hand H1 is installed, and the connection port P46 of the first hand unit 200C ′ when the second hand H2 is installed. Connected to the injection nozzle 292 '. Similarly, the connection port P48 is connected to the connection port P2 of the first hand unit 200H when the first hand H1 is installed, and the connection port P48 of the first hand unit 200D ′ when the second hand H2 is installed. Connected to the injection nozzle 292 '.

  In addition, as shown in FIG. 12, the connection terminal CT11 is electrically connected to the heater 241 of the first hand unit 200A ′ via electric wiring, and the connection terminal CT13 is connected to the first hand unit 200B via electric wiring. The connection terminal CT15 is electrically connected to the heater 241 of the first hand unit 200C 'via the electrical wiring, and the connection terminal CT17 is electrically connected to the first hand unit 200D via the electrical wiring. It is electrically connected to the heater 241 '. The other connection terminals CT12, CT14, CT16, CT18 are not electrically connected to the first hand unit 200 '.

(Piping group)
Next, the piping group arranged in the electronic component inspection apparatus 100 will be described based on FIGS. 13 and 14. The electronic component inspection apparatus 100 has eight connection ports P31 to P34 provided on the first connection base 193 and eight connection port pipes provided on the second connection base 194. However, since these are the same configuration as each other, below, the pipes for the connection ports P31 to P38 provided in the first connection base 193 will be described as a representative, and provided in the second connection base 194. Description of the connection port piping is omitted.

The electronic component inspection apparatus 100 includes a gas suction unit (vacuum circuit) 610 that sucks air in the suction pipe 260 to be in a negative pressure state, and a gas that supplies air into the suction pipe 260 to destroy the negative pressure state. And a supply unit 620. Further, the gas supply unit 620 further has a function of supplying air as the cooling gas G to the injection nozzle 292 ′.
By using air (compressed air) as the gas supplied by the gas supply unit 620, handling is simplified and cost reduction can be achieved. Further, the cooling performance of the IC device 9 can be improved by using a refrigeration cooler and using cooled compressed air. However, the gas supplied by the gas supply unit 620 is not limited to air as long as the above effect can be exhibited, and for example, a gas having higher thermal conductivity than air such as hydrogen or helium can be used. In this case, the cooling efficiency of the IC device 9 is improved as compared with the case of air. Further, the apparatus configuration is simplified as compared with the apparatus described above as the background art.

  In addition, the electronic component inspection apparatus 100 includes service pipes (service paths) R32, R34, R36, and R38 having one ends connected to the connection ports P32, P34, P36, and P38, and service pipes R32, R34, R36, and R38. Chucking pipes (second adsorption paths) R42, R44, R46, R48 connecting the ends to the gas suction part 610 and the gas supply part 620, and the other ends of the service pipes R32, R34, R36, R38 and the gas supply Pipes for cooling (routes) R52, R54, R56, R58 for connecting the part 620, pipes for chucking (first) connecting the connection ports P31, P33, P35, P37, the gas suction part 610 and the gas supply part 620 1 adsorption path) R41, R43, R45, R47.

In addition, the electronic component inspection apparatus 100 includes solenoid valves (first switching units) 512, 514, 516, and 518, and chucking pipes R42, R44, and R46 by the solenoid valves 512, 514, 516, and 518, respectively. , R48 and the service pipes R32, R34, R36, and R38 can be switched to each other, and the cooling pipes R52, R54, R56, and R58 can be switched to the service pipes R32, R34, R36, and R38. .
Further, the electronic component inspection apparatus 100 includes electromagnetic valves (second switching units) 522, 524, 526, and 528 arranged in the middle of the cooling pipes R52, R54, R56, and R58. By 524, 526, and 528, the cooling pipes R52, R54, R56, and R58 can be switched between the opened state and the closed state.

  In addition, the electronic component inspection apparatus 100 includes electromagnetic valves 531 and 541 disposed in the middle of the chucking pipe R41, electromagnetic valves 532 and 542 disposed in the middle of the chucking pipe R42, and a chucking pipe R43. Solenoid valves 533 and 543 arranged in the middle of the chuck, solenoid valves 534 and 544 arranged in the middle of the chucking pipe R44, solenoid valves 535 and 545 arranged in the middle of the chucking pipe R45, Electromagnetic valves 536 and 546 arranged in the middle of the king pipe R46, electromagnetic valves 537 and 547 arranged in the middle of the chucking pipe R47, and electromagnetic valves 538 arranged in the middle of the chucking pipe R48, 548. And by these solenoid valves 531-538, 541-548, in each chucking piping R41-R48, the state where the gas suction part 610 was opened and the gas supply part 620 was closed, and the gas suction part 610 were closed. The state in which the gas supply unit 620 is opened can be switched.

  Note that these solenoid valves 512 to 518, 522 to 528, 531 to 538, and 541 to 548 are connected to the control device 110, and the drive thereof is controlled by the control device 110. In addition, each of the solenoid valves 512 to 518, 522 to 528, 531 to 538, and 541 to 548 can be changed to another switching mechanism as long as it can play its role, or different types of solenoid valves ( For example, normally open electromagnetic) can be used as the electromagnetic valves 531 to 538 and 541 to 548.

  The service pipes R32, R34, R36, and R38 and the chucking pipes R41, R43, R45, and R47 along with the service pipes R32, R34, R36, and R38 (side-by-side parts) R411, R431, R451, and R471 As shown in FIG. 4 and FIG. 15, the belts are bundled in a band shape having a width in the X direction, thereby forming a band-shaped pipe body R6. One end of the strip-shaped pipe body R6 is fixed to the first connection base 193 (connected to the connection ports P31 to P38), and the other end is directly or indirectly fixed to the base 101. And strip | belt-shaped piping body R6 has flexibility, and is arrange | positioned in the bent state as shown in FIG. The strip-shaped piping body R6 is deformed as the first hand H1 (second hand H2) moves in the ± Y direction, thereby causing the gas suction unit 610, the gas supply unit 620, and the first hand H1 (second hand H2). ) Is maintained.

  In particular, since the strip-shaped pipe body R6 has a width in the X direction, the stress applied to the service pipes R32, R34, R36, R38 and the portions R411, R431, R451, R471 is reduced by bending the strip-shaped pipe body R6. It is possible to suppress the damage (for example, generation of cracks) of the strip-shaped pipe body R6. Further, since the cooling pipes R52, R54, R56, and R58 and the chucking pipes R42, R44, R46, and R48 are collected by the service pipes R32, R34, R36, and R38, the pipes included in the belt-like pipe body R6 The number can be kept small. Therefore, the weight of the strip-shaped piping body R6 can be suppressed, and the stress applied to the strip-shaped piping body R6 can be reduced.

Next, control of the solenoid valves 512, 514, 516, 518, 522, 524, 526, 528, 531 to 538, and 541 to 548 will be described.
When the first hand H1 is arranged in the inspection apparatus 190, as shown in FIG. 13, the electromagnetic valves 512, 514, 516, and 518 are turned off (non-energized state). As a result, the chucking pipes R41 to R48 are connected to the connection ports P31 to P38. For example, with regard to the first hand unit 200A, negative pressure is generated in the suction pipe 260 by the gas suction unit 610 by setting the electromagnetic valve 531 to the ON state (energized state) and the electromagnetic valve 541 to the OFF state (non-energized state). The IC device 9 can be sucked and held by the suction pad 270, and conversely, the electromagnetic valve 531 is turned off and the electromagnetic valve 541 is turned on, so that the gas supply unit 620 creates a negative pressure in the suction pipe 260. The IC device 9 that is broken and sucked and held by the suction pad 270 can be released. The same applies to the other first hand units 200B to 200H.

  On the other hand, when the second hand H2 is arranged in the inspection device 190, as shown in FIG. 14, the electromagnetic valves 512, 514, 516, and 518 are turned on (energized state). As a result, the cooling pipes R52, R54, R56, and R58 are connected to the connection ports P32, P34, P36, and P38 via the service pipes R32, R34, R36, and R38. For example, regarding the first hand unit 200A ′, the IC device 9 can be sucked and held by the suction pad 270 by setting the electromagnetic valve 531 to the ON state and the electromagnetic valve 541 to the OFF state. The IC device 9 sucked and held by the suction pad 270 can be released by setting the 531 to the OFF state and the electromagnetic valve 541 to the ON state. On the other hand, by setting the electromagnetic valve 522 to the ON state (energized state), air can be injected from the injection nozzle 292 ′ to cool the IC device 9, and conversely, the electromagnetic valve 522 is in the OFF state (non-energized state). Thus, the injection of air from the injection nozzle 292 ′ can be stopped and the cooling of the IC device 9 can be stopped. ON / OFF of the electromagnetic valve 522 is controlled by the control device 110 based on a signal (temperature information of the IC device 9) from the temperature sensor 243 included in the first hand unit 200A '. Thereby, the temperature of the IC device 9 can be effectively kept within a predetermined range. In particular, as in this embodiment, not only the electromagnetic valve 512 for switching the path but also the electromagnetic valve 522 for opening and closing the path is arranged, and the cooling gas G is injected from the injection nozzle 292 ′ by the control of the electromagnetic valve 522. By switching between the state and the state in which the injection is stopped, the temperature control of the IC device 9 can be performed with higher accuracy. The same applies to the other first hand units 200B 'to 200D'.

  Here, in the electronic component inspection apparatus 100, when the second hand H2 is used, the flow rate of the air supplied from the gas supply unit 620 is set high in order to ensure sufficient cooling characteristics of the IC device 9. On the other hand, if the air supplied from the gas supply unit 620 is supplied to the suction pipe 260 at the same flow rate and destroyed by negative pressure, excessive pressure is applied to the IC device 9 and the IC device 9 is ejected vigorously. Or the IC device 9 may be destroyed. Therefore, a throttle valve 590 is arranged in the middle of the chucking pipes R41 to R48 to suppress the flow rate of air supplied to the suction pipe 260 through the chucking pipes R41 to R48. That is, the flow rate of air supplied to the injection nozzle 292 ′ through the cooling pipes R52 to R58 is larger than the flow rate of air supplied to the suction pipe 260 via the chucking pipes R41 to R48. Yes. Thereby, it is possible to prevent the IC device 9 from being unintentionally damaged while increasing the cooling efficiency of the IC device 9.

  The flow rate of the air supplied to the injection nozzle 292 ′ through the cooling pipes R52, R54, R56, R58 is not particularly limited, but is about 20 liter / min or more and 100 liter / min or less. Is preferred. The flow rate of air supplied to the suction pipe 260 through the chucking pipes R41 to R48 is not particularly limited, but is preferably about 0.5 liter / min or more and 5 liter / min or less. .

  According to such a configuration of the piping group, the air flow path can be easily changed, the case where the first hand H1 having only the heating system without the cooling system is installed, and the cooling system and the heating system. It is possible to easily cope with both of the cases where the second hand H2 having both is installed. In addition, since the first and second hands H1 and H2 can be properly used according to the inspection conditions of the IC device 9 to be inspected, it is possible to perform an inspection suitable for the IC device 9.

(Electrical wiring group)
Next, an electrical wiring group disposed in the electronic component inspection apparatus 100 will be described with reference to FIGS. 16 and 17. The electronic component inspection apparatus 100 is for the first hand units 200 and 200 ′ arranged on the first connection base 193 and the second hand units 300 and 300 ′ arranged on the second connection base 194. However, in the following, the electrical wiring for the first hand units 200 and 200 ′ arranged on the first connection base 193 will be described as a representative. The description of the electrical wiring for the second hand units 300 and 300 ′ arranged on the second connection base 194 is omitted.

  As shown in FIGS. 16 and 17, the electronic component inspection apparatus 100 includes first electrical wires (first electrical paths) L11, L12, L13, which connect the control device 110 and connection terminals CT11, CT13, CT15, CT17. Second electrical wiring (second electrical path) connecting L14, four relays (electrical path switching unit) Ry1, Ry2, Ry3, Ry4 and control device 110 and the common terminals of relays Ry1, Ry2, Ry3, Ry4 L21, L22, L23, L24, third electric wires L31, L32, L33, L34 connecting one terminal of the relays Ry1, Ry2, Ry3, Ry4 and the connection terminals CT12, CT14, CT16, CT18, and the relay Ry1 , Ry2, Ry3, Ry4 and the fourth electric wiring L41 for connecting the solenoid valves 522, 524, 526, 528 to the other terminals. 42, L43, and a L44. The control of the relays Ry1 to Ry4 is performed by the control device 110. Note that the relays Ry1, Ry2, Ry3, and Ry4 can be changed to other switching mechanisms as long as they can play their roles.

  And when using the 1st hand H1, as shown in FIG. 16, the control apparatus 110 and connection terminal CT12, CT14, CT16, CT18 are electrically connected via relay Ry1-Ry4. On the other hand, when the second hand H2 is used, as shown in FIG. 17, the relays Ry1 to Ry4 are switched, and the control device 110 and the electromagnetic valves 522, 524, 526, and 528 are connected via the relays Ry1 to Ry4. Electrically connected.

  Thus, when the first hand H1 is used, the control device 110 can control the driving of the heaters 241 of the first hand units 200. When the second hand H2 is used, the control device 110 The injection of the cooling gas G from the heater 241 and the injection nozzle 292 ′ of each first hand unit 200 ′ can be controlled. In particular, as in the present embodiment, one of wiring connecting the connection terminals CT12, CT14, CT16, CT18 and the control device 110 and wiring connecting the electromagnetic valves 522, 524, 526, and 528 and the control device 110 are provided. By using the part with the second electric wires L21, L22, L23, and L24, the electric wires can be reduced.

(Recovery device)
The recovery device 180 is a robot for transporting the inspected IC device 9 accommodated in the shuttle jigs 144 and 154 to the recovery tray 130.
The collection device 180 has the same configuration as the supply device 170. That is, the collection device 180 is supported by the support frame 181 supported by the base 101, the movable frame 183 supported by the support frame 181 and reciprocally movable in the Y direction with respect to the support frame 181, and the movable frame 183. It has a hand unit support portion 184 that can reciprocate in the X direction with respect to the moving frame 183, and a plurality of hand units 185 supported by the hand unit support portion 184. Since the configuration of each unit is the same as the configuration of each corresponding unit of the supply device 170, description thereof is omitted.
Here, in the inspected IC devices 9 accommodated in the shuttle jig 144 (154), there are non-defective products that have passed the inspection and defective products that have failed. Therefore, as described above, non-defective products are stored in one collection tray 130, and defective products are stored in the other collection tray 130.

(Control device)
The control device 10 includes an inspection control unit 111, a drive control unit 112, and a temperature control unit 113. The inspection control unit 111 inspects the electrical characteristics of the IC device 9 disposed in the inspection socket 160 (inspection individual socket 161) based on, for example, a program stored in a memory (not shown). Further, the drive control unit 112 includes, for example, the supply tray 120, the recovery tray 130, the first and second shuttles 140 and 150, the supply device 170, the recovery device 180, the inspection device 190, the electromagnetic valves 512, 514, 516, 518, The drive of 531-538, 541-548, etc. is controlled, and the IC device 9 is conveyed. Further, the temperature control unit 113 controls the driving of the heater 241, the electromagnetic valves 522, 524, 526, and 528 and adjusts the temperature of the IC device 9.

Next, temperature control of the IC device 9 by the temperature control unit 113 will be described.
In a state where the IC device 9 is pressed against the individual inspection socket 161 by the first hand unit 200, the temperature control unit 113 drives the heater 241 and feeds back the temperature of the IC device 9 detected by the temperature sensor 243. Then, the IC device 9 is heated. Then, after the IC device 9 reaches a predetermined temperature or higher, the IC device 9 is driven by the inspection control unit 111, and inspection of its electrical characteristics is started.

  For example, when the IC device 9 must be inspected at 100 ° C. (inspection temperature T1) or higher, the temperature control unit 113 sets the heating set temperature T2 of the IC device 9 to 100 ° C. equal to the inspection temperature T1 or the heater block 240. In consideration of the thermal resistance of the contact pusher 250, the IC device 9 is started to be heated to 105 ° C. slightly higher than the inspection temperature T1. When the temperature of the IC device 9 exceeds the heating set temperature T2 and the inspection of the IC device 9 is started by the inspection control unit 111, the heating set temperature T2 is set to 100 ° C. in consideration of the self-heating of the IC device 9 ( It is set to less than the inspection temperature T1), for example, 95 ° C. Thereby, the excessive temperature rise of the IC device 9 due to the heater 241 and self-heating is suppressed, and the inspection of the IC device 9 can be performed in a temperature stable state.

  On the other hand, in a state where the IC device 9 is pressed against the individual inspection socket 161 by the first hand unit 200 ′, the temperature control unit 113 drives the heater 241 and detects the temperature of the IC device 9 detected by the temperature sensor 243. The IC device 9 is heated while feeding back. Then, after the IC device 9 is stabilized within the set temperature range, the inspection control unit 111 starts the inspection of the IC device 9. When the inspection is started, the IC device 9 is heated by self-heating. When the temperature of the IC device 9 exceeds (or is likely to exceed) the predetermined temperature range, the temperature control unit 113 stops driving the heater 241 and injects the cooling gas G from the injection nozzle 292 ′. The IC device 9 is cooled. On the other hand, when the temperature of the IC device 9 falls below the set temperature by cooling with the cooling gas G (or when it is likely to drop below), the temperature control unit 113 stops the injection of the cooling gas G and drives the heater 241. To do. By performing such control, the temperature of the IC device 9 under inspection can be stabilized within the set temperature range.

  The method for controlling the heater 241 and the injection nozzle 292 ′ by the temperature control unit 113 is not limited to the method for switching between the driving of the heater 241 and the injection of the cooling gas G as described above. For example, the control may be such that the cooling gas G is injected when the IC device 9 exceeds the set temperature range while the heater 241 is always driven during the inspection. Further, during the inspection, the heater 241 is always driven and the cooling gas G is injected, and the output of the heater 241 and the injection amount of the cooling gas G are changed according to the temperature of the IC device 9, specifically, The control may be such that the temperature of the IC device 9 rises, the output of the heater 241 is reduced, and the injection amount of the cooling gas G is increased. Thus, by simultaneously driving the heater 241 and injecting the cooling gas G, it is possible to prevent an excessive and steep temperature change of the IC device 9 and to suppress the temperature fluctuation of the IC device 9 to be small. There are cases where it is possible.

  The configuration of the electronic component inspection apparatus 100 has been described in detail above. According to such an electronic component inspection apparatus 100, the first hand H1 and the second hand H2 can be selected and used. Therefore, if the IC device 9 that does not need to be finely controlled can be inspected in a high-temperature environment, the first hand H1 is used to inspect the IC device 9 under a high-temperature environment and at a set temperature. When inspecting the IC device 9 that must be performed, the second hand H2 can be used. As described above, the electronic component inspection apparatus 100 can use a hand suitable for the IC device 9 to be inspected, is excellent in convenience, and can accurately inspect the IC device 9.

In the electronic component inspection apparatus 100, the IC device 9 includes cooling pipes (paths) R52, R54, R56, and R58, electromagnetic valves 512, 514, 516, and 518, and electromagnetic valves 522, 524, 526, and 528. Constitutes a cooling system for cooling. According to such a cooling system, it is excellent in maintainability. For example, when the replacement is necessary, the system can be easily replaced.
Next, a method for inspecting the IC device 9 by the electronic component inspection apparatus 100 will be described with reference to FIGS. The inspection method described below, in particular, the transport procedure of the IC device 9 is an example, and the present invention is not limited to this. In the following, for convenience of explanation, a case where the second hand H2 is used will be described.

(Step 1)
First, as shown in FIG. 18, the supply tray 120 in which the IC device 9 is accommodated in each pocket 121 is transported into the region S, and the first and second shuttles 140 and 150 are moved to the −X direction side.
(Step 2)
Next, as shown in FIG. 19, the IC device 9 accommodated in the supply tray 120 is transferred to the shuttle jigs 142 and 152 by the supply device 170, and the IC devices 9 are stored in the pockets 143 and 153 of the shuttle jigs 142 and 152. To accommodate.

(Step 3)
Next, as shown in FIG. 20, both the first and second shuttles 140 and 150 are moved to the + X direction side, the shuttle jig 142 is on the + Y direction side with respect to the inspection socket 160, and the shuttle jig 152 is for inspection. The socket 160 is arranged in the −Y direction side.
(Step 4)
Next, as shown in FIG. 21, the second frame 192 is moved so that the first connection base 193 is positioned immediately above the shuttle jig 142 and the second connection base 194 is positioned directly above the inspection socket 160. And Thereafter, the IC device 9 accommodated in the shuttle jig 142 is held by each first hand unit 200 ′.
(Step 5)
Next, as shown in FIG. 22, the second frame 192 is moved to the −Y direction side, the first connection base 193 is positioned immediately above the inspection socket 160, and the second connection base 194 is connected to the shuttle jig 152. It is in a state of being directly above.

  In parallel with the movement of the second frame 192, the following work is also performed. First, the first shuttle 140 is moved to the −X direction side so that the shuttle jig 144 is aligned in the + Y direction with respect to the supply tray 120. Next, the IC device 9 accommodated in the supply tray 120 is transferred to the shuttle jig 142 by the supply device 170, and the IC device 9 is accommodated in each pocket 143 of the shuttle jig 142.

(Step 6)
Next, the first connection base 193 is lowered, and the IC device 9 held by each first hand unit 200 ′ is arranged in the individual socket 161 for inspection. At this time, each first hand unit 200 ′ presses the IC device 9 against the individual socket 161 for inspection with a predetermined inspection pressure. As a result, the external terminals of the IC device 9 and the probe pins provided in the individual inspection socket 161 are electrically connected. Then, after the IC device 9 is set to a predetermined temperature by temperature control by the control device 110, the inspection control unit 111 performs inspection on each IC device 9. When the inspection is completed, the IC device 9 is re-adsorbed, the first connection base 193 is raised, and the IC device 9 is taken out from the individual inspection socket 161.
In parallel with this operation, each second hand unit 300 ′ holds the IC device 9 accommodated in the shuttle jig 152 and takes out the IC device 9 from the shuttle jig 152.

(Step 7)
Next, as shown in FIG. 23, the second frame 192 is moved to the + Y direction side, the first connection base 193 is positioned immediately above the shuttle jig 144 of the first shuttle 140, and the second connection base 194 is inspected. The socket 160 is positioned directly above.
In parallel with the movement of the second frame 192, the following work is also performed. First, the second shuttle 150 is moved to the −X direction side so that the shuttle jig 152 is aligned with the supply tray 120 in the + Y direction. Next, the IC device 9 accommodated in the supply tray 120 is transferred to the shuttle jig 152 by the supply device 170, and the IC device 9 is accommodated in each pocket 153 of the shuttle jig 152.

(Step 8)
Next, as shown in FIG. 24, the second connection base 194 is lowered, and the IC device 9 held by each second hand unit 300 ′ is placed in the individual socket 161 for inspection. Then, after setting the IC device 9 to a predetermined temperature, the IC device 9 is inspected while applying an inspection pressure. When the inspection is completed, the IC device 9 is sucked again, the second connection base 194 is raised, and the IC device 9 is taken out from the individual inspection socket 161.

  In parallel with this work, the following work is performed. First, the inspected IC device 9 held by each first hand unit 200 ′ is accommodated in each pocket 145 of the shuttle jig 144. Next, the first shuttle 140 is moved to the + X direction side so that the shuttle jig 142 is positioned directly below the first hand unit 200 '. Next, the IC device 9 accommodated in the shuttle jig 142 is held by each first hand unit 200 ′, and the inspected IC device 9 accommodated in the shuttle jig 144 is moved to the recovery tray 130 by the recovery device 180. Change.

(Step 9)
Next, as shown in FIG. 25, the second frame 192 is moved to the −Y direction side, the first connection base 193 is positioned immediately above the inspection socket 160, and the second connection base 194 is connected to the shuttle jig 154. It is in a state of being directly above.
In parallel with the movement of the second frame 192, the following operation is also performed. First, the first shuttle 140 is moved to the −X direction side so that the shuttle jig 144 is aligned with the inspection socket 160 in the + Y direction. Next, the IC device 9 accommodated in the supply tray 120 is transferred to the shuttle jig 142 by the supply device 170, and the IC device 9 is accommodated in each pocket 143 of the shuttle jig 142.

(Step 10)
Next, as shown in FIG. 26, the first connection base 193 is lowered, and the IC devices 9 held by the first hand units 20 ′ are arranged in the individual sockets 161 for inspection. Then, after setting the IC device 9 to a predetermined temperature, the inspection control unit 111 performs an inspection of the IC device 9. When the inspection is completed, the IC device 9 is attracted again, the first connection base 193 is raised, and the IC device 9 is taken out from the individual inspection socket 161.

  In parallel with this work, the following work is performed. First, the inspected IC device 9 held by each second hand unit 300 ′ is accommodated in each pocket 155 of the shuttle jig 154. Next, the second shuttle 150 is moved to the + X direction side so that the shuttle jig 152 is positioned directly below the second hand unit 300 '. Next, the IC device 9 accommodated in the shuttle jig 152 is held by each second hand unit 300 ′, and the inspected IC device 9 accommodated in the shuttle jig 154 is moved to the collection tray 130 by the collection device 180. Change.

(Step 11)
Thereafter, Step 7 to Step 10 described above are repeated. In the middle of this repetition, when all of the IC devices 9 accommodated in the supply tray 120 have been moved to the first shuttle 140, the supply tray 120 moves out of the region S. Then, after supplying a new IC device 9 to the supply tray 120 or exchanging it with another supply tray 120 in which the IC device 9 is already accommodated, the supply tray 120 moves into the region S again.

Similarly, when the IC device 9 is accommodated in all the pockets 131 of the collection tray 130 during the repetition, the collection tray 130 moves out of the area S. Then, after removing the IC device 9 accommodated in the recovery tray 130 or replacing the recovery tray 130 with another empty recovery tray 130, the recovery tray 130 moves into the region S again.
According to such a method, the IC device 9 can be efficiently inspected. Specifically, the inspection apparatus 190 includes a first hand unit 200 ′ and a second hand unit 300 ′, and for example, the IC device 9 held by the first hand unit 200 ′ is in an inspected state. In parallel with this, the IC device 9 that has been inspected by the second hand unit 300 ′ is accommodated in the shuttle jig 154, and the IC device 9 to be inspected next is held and is in standby. As described above, by performing different operations using the two hand units, useless time can be reduced and the IC device 9 can be inspected efficiently.

Second Embodiment
Next, a second embodiment of the electronic component inspection apparatus of the present invention will be described.
FIG. 27 is a cross-sectional view of the first hand unit included in the first hand of the electronic component inspection apparatus according to the second embodiment of the present invention. FIG. 28 is a cross-sectional view for explaining the effect of the swing mechanism shown in FIG.

Hereinafter, the electronic component inspection apparatus according to the second embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted.
The electronic component inspection apparatus according to the second embodiment of the present invention is the same as that of the first embodiment described above except that the configuration of the hand unit is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 27, the first hand unit 200 of the present embodiment is provided with a swing mechanism 400 in place of the air cylinder 210 of the first embodiment described above. The swing mechanism 400 enables the IC device 9 held by the device chuck 220 to follow the inclination of the bottom surface of the individual socket 161 for inspection by making the device chuck 220 swingable with respect to the first connection base 193. Mechanism. By providing such a mechanism, the IC device 9 can be uniformly pressed against the surface of the individual socket for inspection 161. Therefore, breakage of the IC device 9 can be suppressed, and electrical connection between the IC device 9 and the individual inspection socket 161 can be more reliably performed.

The rocking mechanism 400 includes a rocking body 410 and a floating body 430 suspended from the rocking body 410 via floating means 420.
The swinging body 410 includes a swinging part main body 411 that swings, a rubber film (film-like elastic member) 412 that adheres to the surface of the swinging part main body 411 and swings the swinging part main body 411, and a rubber film. And a support member 413 for supporting 412. In the present embodiment, the support member 413 is divided into two parts. The rubber film 412 is sandwiched between the two parts, and the two parts are coupled with screws or the like, thereby supporting the rubber film 412. .

Furthermore, the rocking body 410 has a locking portion 414 that regulates the rocking range of the rocking portion main body 411 so that the rocking portion main body 411 is rocked more than necessary and the rubber film 412 is not excessively stressed. have. The locking portion 414 is a member for locking the swinging portion main body 411 to the support member 413. Moreover, the latching | locking part 414 has a rocking | fluctuation control part.
As shown in FIG. 27, a space S <b> 1 is formed between the inner peripheral surface of the locking portion 414 and the outer peripheral surface of the swinging portion main body 411. The space S1 is a space for enabling the swinging part main body 411 to swing. The space S1 is designed so that the swinging part main body 411 swings by 0.5 degrees at the maximum. Thereby, excessive rocking | swiveling can be prevented, ensuring the rocking | swiveling range sufficient for the test | inspection of the rocking | swiveling part main body 411. FIG.

A concave portion 411 a extending in the vertical direction is formed on the outer peripheral surface of the swinging portion main body 411, and a convex portion 414 a that engages with the concave portion 411 a is formed on the inner peripheral surface of the locking portion 414. Thereby, rotation of the rocking | swiveling part main body 411 is prevented.
In addition, a sealed space S <b> 3 is formed in the rocking body 410 by the rubber film 412 and the support member 413. An air hole 413a for air to enter and exit from the pressure adjusting means 490 is provided on the upper surface of the sealed space S3. When a positive pressure is supplied from the pressure adjusting means 490 to the sealed space S3, the rubber film 412 bends downward so that the sealed space S3 widens, and as a result, the swinging part main body 411 is biased downward. The swinging portion main body 411 biased downward is locked by the locking portion 414.

  A force larger than the pressure applied by the pressure adjusting means 490 when the first hand unit 200 is lowered while the swinging part main body 411 is locked to the locking part 414 (the sealed space S3 is pressurized). Then, as shown in FIG. 28, the swing part main body 411 moves away from the locking part 414 and follows the inclination of the test individual socket 161 while swinging. Thereby, the IC device 9 can be uniformly pressed against the surface of the individual socket for inspection 161.

  A floating body 430 is arranged below the swinging part main body 411 via a floating means 420. The idler means 420 is composed of a plurality of steel balls 421 such as bearings. The steel ball 421 is disposed in a space S2 that allows the steel ball 421 to move in a plane (moving and rotating in the X and Y directions). The floating body 430 can move in the X and Y directions with respect to the swinging portion main body 411 or rotate around the Z axis (θ direction) by rolling the steel ball 421 in the space S2. Therefore, even when the IC device 9 held on the device chuck 220 is displaced in the X, Y, and θ directions with respect to the individual inspection socket 161, the IC device 9 can be more accurately attached to the individual inspection socket 161. Can be pressed.

Further, the swing mechanism 400 includes a leaf spring 417 fixed to the floating body 430 as a restoring means for returning the position of the floating body 430 moved with respect to the swing portion main body 411 to the original position (natural state). The swinging portion main body 411 is in contact with the leaf spring 417 in four directions. For example, when the floating body 430 moves in the X direction, the leaf spring 417 in the Y direction bends in the X direction, and tries to return the floating body 430 to the original position by the stress of the leaf spring 417. Similarly, even if the floating body 430 moves in the Y direction or the θ direction, the floating body 430 tries to return to the original position by the stress of the leaf spring 417. As a result, the floating body 430 is restored to the original position after the test of the IC device 9 is completed, and the IC device 9 to be tested next is easily attracted. In the present embodiment, a plate spring is used as the restoring means, but a coil spring (compression spring, tension spring), an elastic body such as rubber, or the like may be used.
According to the second embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

<Third Embodiment>
Next, a third embodiment of the electronic component inspection apparatus of the present invention will be described.
FIG. 29 is a diagram illustrating a piping group included in the electronic component inspection apparatus according to the third embodiment of the present invention.
Hereinafter, the electronic component inspection apparatus according to the third embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted.

The electronic component inspection apparatus according to the third embodiment of the present invention is the same as that of the first embodiment described above except that the configuration of the electromagnetic valves installed in the piping group is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.
As shown in FIG. 29, the electronic component inspection apparatus 100 ′ of this embodiment includes a state in which the chucking pipes R42, R44, R46, R48 and the service pipes R32, R34, R36, R38 communicate with each other, and the cooling pipe. Electromagnetic valves (switching units) 552, 554, 556, and 558 for switching between a state where R52, R54, R56, and R58 and the service pipes R32, R34, R36, and R38 communicate with each other are provided. The electromagnetic valve 552 is provided instead of the electromagnetic valves 512 and 522 of the first embodiment, and also functions as these two electromagnetic valves. Similarly, the electromagnetic valve 554 is provided in place of the electromagnetic valves 514 and 524 of the first embodiment, and also functions as these two electromagnetic valves. The electromagnetic valve 556 is provided in place of the electromagnetic valves 516 and 526 of the first embodiment, and also functions as these two electromagnetic valves. The electromagnetic valve 558 is provided in place of the electromagnetic valves 518 and 528 of the first embodiment, and also functions as these two electromagnetic valves. The driving of these solenoid valves 552, 554, 556, and 558 is controlled by the control device 110 (temperature control unit 113), respectively. These electromagnetic valves 552, 554, 556, and 558 can be changed to other switching mechanisms as long as they can play their roles, or different types of electromagnetic valves can be used.

Next, control of the electromagnetic valves 552, 554, 556, and 558 will be described.
When the first hand H1 is disposed in the inspection device 190, the electromagnetic valves 552, 554, 556, and 558 are respectively in the state shown in FIG. Accordingly, the chucking pipes R41 to R48 are connected to the connection ports P31 to P38, and the IC device 9 can be sucked and released by each first hand unit 200.

On the other hand, when the second hand H2 is arranged in the inspection apparatus 190, the temperature control unit 113 drives the electromagnetic valves 552, 554, 556, and 558 based on information from the temperature sensor 243 (temperature of the IC device 9). By controlling and switching the injection / stop of the cooling gas G from the injection nozzle 292 ′, the IC device 9 is maintained in a predetermined temperature range.
According to the third embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

[Cooling system]
Next, the cooling system of the present invention will be described.
FIG. 30 is a diagram illustrating piping included in a conventional electronic component inspection apparatus. FIG. 31 is a diagram showing electric wirings of a conventional electronic component inspection apparatus. 32 and 33 are views showing a preferred embodiment of the cooling system of the present invention incorporated in the electronic component inspection apparatus shown in FIGS. 30 and 31, respectively.
The conventional electronic component inspection apparatus 100 "does not have the second hand H2 with respect to the electronic component inspection apparatus 100 described above. Therefore, the electronic component inspection apparatus 100" is for the second hand H2. There is no piping or electrical wiring.

  That is, as shown in FIG. 30, the conventional electronic component inspection apparatus 100 ″ has a chucking pipe (first adsorption) that connects the connection ports P31, P33, P35, and P37 to the gas suction unit 610 and the gas supply unit 620. Chucking pipes (second adsorption paths) R42, R44, which connect R41, R43, R45, R47 and the connection ports P32, P34, P36, P38, the gas suction part 610 and the gas supply part 620, R46 and R48, and electromagnetic valves 531 to 538 and 541 to 548 arranged in the middle of the chucking pipes R41 to R48, as shown in FIG. "Is the first electrical wiring (first electrical path) L11, L12 that connects the control device 110 to the connection terminals CT11, CT13, CT15, CT17. And L13, L14, and has a control unit 110 and the connection terminal CT12, CT14, CT16, second electrical wiring L21 connecting the CT18, L22, L23, L24.

  The cooling system 800 is a system that can be configured in the same manner as the electronic component inspection apparatus 100 described above by being incorporated in such an electronic component inspection apparatus 100 ″. The electronic component inspection apparatus 100 ″ can be used, and the cost can be reduced by not purchasing a new electronic component inspection apparatus with a cooling function.

  As shown in FIGS. 32 and 33, the cooling system 800 includes electromagnetic valves 512, 514, 516, and 518, electromagnetic valves 522, 524, 526, and 528 that are incorporated in the electronic component inspection apparatus 100 described above. , Cooling pipes R52, R54, R56, R58, relays Ry1, Ry2, Ry3, Ry4, and fourth electric wires L41, 42, 43, 44, and further, if necessary, a second hand H2.

  As a method of installing the cooling system 800, for example, first, the solenoid valves 512, 514, 516, and 518 are arranged in the middle of the chucking pipes R42, R44, R46, and R48. Next, cooling pipes R52, R54, R56, R58 are installed so as to connect the solenoid valves 512, 514, 516, 518 and the gas supply unit 620, and further, the cooling pipes R52, R54, R56, R58 are connected. Solenoid valves 522, 524, 526, and 528 are installed on the way. Then, the solenoid valves 512 to 518 and 522 to 528 are connected to the control device 110. In such a configuration, the chucking pipes R42, R44, R46, R48 are located on the first and second hands H1, H2 side of the electromagnetic valves 512, 514, 516, 518, and the chucking pipes R42, R44. , R46, R48 and the cooling pipes R52, R54, R56, R58 are service pipes R32, R34, R36, R38. Therefore, an increase in piping can be suppressed.

For example, first, relays Ry1, Ry2, Ry3, and Ry4 are arranged in the middle of the second electric wires L21, L22, L23, and L24. Next, the solenoid valves 522, 524, 526, and 528 are connected to the relays Ry1, Ry2, Ry3, and Ry4 via the fourth electric wires L41, L42, L43, and L44. In such a configuration, the part of the second electric wires L21, L22, L23, L24 closer to the control device 110 than the relays Ry1, Ry2, Ry3, Ry4 is connected to the control device 110 and the connection terminals CT12, CT14, CT16, CT18. And the electrical wiring that connects the control device 110 and the electromagnetic valves 522, 524, 526, and 528 to the service electrical wiring (service electrical path). Therefore, an increase in electrical wiring can be suppressed.
Thus, the installation of the cooling system 800 to the electronic component inspection apparatus 100 ″ is completed, and the configuration is the same as that of the electronic component inspection apparatus 100 described above, and the first hand H1 and the second hand H2 are selected and used. Will be able to.

The cooling system 800 of the present embodiment includes solenoid valves 512, 514, 516, and 518 and solenoid valves 522, 524, 526, and 528. These solenoid valves 512, 514, 516, and 518, In place of 522, 524, 526, and 528, electromagnetic valves 552, 554, 556, and 558 may be provided. By incorporating the cooling system 800 having such a configuration into the conventional electronic component inspection apparatus 100 ″, the configuration is the same as that of the electronic component inspection apparatus 100 ′ described above.
As mentioned above, although the electronic component conveying apparatus, the electronic component inspection apparatus, and the cooling system of the present invention have been described based on the illustrated embodiment, the present invention is not limited to this, and the configuration of each part is the same. Any structure having a function can be substituted. In addition, any other component may be added to the present invention.

  In the embodiment described above, the first hand H1 having the eight first hand units 200 in total in the X direction × Y direction = 2 × 4 has been described. However, the number of the first hand units 200 is 2 for the first hand H1. The number of the first hand units 200 is not particularly limited as long as it has two or more suction holes, and may be one or two, for example, a total of four first hand units 200 of X direction × Y direction = 2 × 2. May be configured, or a total of 16 first hand units 200 of X direction × Y direction = 4 × 4 may be disposed. The same applies to the second hand unit 300.

In the above-described embodiment, the second hand H2 having a total of four first hand units 200 ′ (X direction × Y direction = 2 × 4) has been described. However, the number of first hand units 200 ′ is the number of suction holes. Is not particularly limited as long as the total number of the first hand H1 is equal to or less than half the number of the suction holes of the first hand H1, and may be one or two, or a total of X direction × Y direction = 2 × 4. The configuration may be such that eight first hand units 200 ′ are arranged. The same applies to the second hand unit 300 ′.
In the above-described embodiment, each hand unit has one suction hole and is configured to suck one IC device. However, the configuration of the hand unit is not limited to this, and a plurality of suction units are configured. It may have a hole and be configured to adsorb a plurality of IC devices.

  100, 100 ', 100 "... Electronic component inspection device 101 ... Base 110 ... Control device 111 ... Inspection control unit 112 ... Drive control unit 113 ... Temperature control unit 120 ... Supply tray 121 ... Pocket 122 …… Rail 130 …… Collection tray 131 …… Pocket 132 …… Rail 140 …… First shuttle 141 …… Base member 142 …… Shuttle jig 143 …… Pocket 144 …… Shuttle jig 145 …… Pocket 146 …… Rail 150 …… Second shuttle 151 …… Base member 152 …… Shuttle jig 153 …… Pocket 154 …… Shuttle jig 155 …… Pocket 156 …… Rail 160 …… Inspection socket 161 …… Individual socket for inspection 170 …… Supply device 171 …… Support frame 172 …… 173 …… Moving frame 174 …… Hand unit supporting portion 175 …… Hand unit 180 …… Recovery device 181 …… Supporting frame 183 …… Moving frame 184 …… Hand unit supporting portion 185 …… Hand unit 190 …… Inspection Device 191 ... 1st frame 192 ... 2nd frame 193 ... 1st connection base 194 ... 2nd connection base 195 ... Movement mechanism 200, 200 ', 200A-200H, 200A'-200D' ... 1st Hand unit 210 ... Air cylinder 211 ... Cylinder tube 212 ... Tube body 213 ... Front plate 214 ... Piston 215 ... Air inlet 220 ... Device chuck 230 ... Connecting block 231 ... Vacuum guide path 240 ... ... Heater Lock 241 ... Heater 243 ... Temperature sensor 243a ... Detection unit 250 ... Contact pusher 260 ... Suction pipe 270 ... Suction pad 290 '... Cooling part 291' ... Heat sink 292 '... Injection nozzle 293' ... ... member 300, 300 '... second hand unit 400 ... swing mechanism 410 ... swing body 411 ... swing body 411a ... recess 412 ... rubber film 413 ... support member 413a ... air hole 414 ...... Locking part 414 a ...... Protruding part 417 ...... Plate spring 420 ...... Free moving means 421 ...... Steel ball 430 ...... Free moving body 490 ...... Pressure adjusting means 512 514 516 518 ...... Solenoid valve 522 524 526, 528 ... Solenoid valve 531-538 ... Solenoid valve 541-548 ... Solenoid valve 590 ... Valve 610 ... Gas suction part 620 ... Gas supply part 800 ... Cooling system 9 ... IC devices CT11 to CT18 ... Connection terminals D1 ... First chamber D2 ... Second chamber L11 to L14 ... First Electrical wiring L21-L24 ...... Second electrical wiring L31-L34 ...... Third electrical wiring L41-L44 ...... Fourth electrical wiring G ... Cooling gas H1 ... First hand H2 ... Second hand P1, P2 ...... Connection port P31 to P38 ...... Connection port P41 to P48 ...... Connection port R11 to R18 ...... Piping R21 to R28 ...... Piping R32, R34, R36, R38 ...... Service piping R41 to R48 ...... Chucking piping R411, R431, R451, R471 ... Parallel parts R52, R54, R56, R58 ... Cooling pipe R6 ... Strip-like pipe body Ry 1 to Ry8 ... Relay S ... Area S1, S2 ... Space S3 ... Sealed space SP ... Spring

Claims (13)

A gas suction part;
A gas supply unit;
A first adsorption path connected to the gas suction unit and the gas supply unit;
A second adsorption path connected to the gas suction part and the gas supply part and arranged independently of the first adsorption path;
A path connected to the gas supply unit,
When using a first hand having a first suction hole and a second suction hole for sucking an electronic component, the first suction hole and the first suction path are connected, and the second suction hole The second adsorption path is connected,
When a second hand having a third suction hole for sucking an electronic component and a jet part for jetting gas to cool the electronic component is used, the third suction hole and the first suction path are connected. And the injection unit and the path are connected ,
A service path communicating with the second suction hole when the first hand is used, and a communication path communicating with the injection unit when the second hand is used;
An electronic component transport apparatus comprising: a switching unit that switches between a state in which the service path and the second suction path communicate with each other and a state in which the service path and the path communicate with each other .   The flow rate of the gas that passes through the path and is supplied from the gas supply unit to the injection unit is the gas that passes through the second adsorption path and is supplied from the gas supply unit to the second adsorption hole. The electronic component conveying device according to claim 1, wherein the electronic component conveying device is larger than a flow rate of the electronic component. The switching unit includes a first switching unit that switches between a state where the service route and the second adsorption route communicate with each other and a state where the service route and the route communicate with each other;
3. The electronic component transport device according to claim 1, further comprising: a second switching unit that switches between an open state and a closed state in a state where the service route and the route communicate with each other. . A temperature detection unit for detecting the temperature of the electronic component adsorbed by the third adsorption hole;
4. The electronic device according to claim 3 , wherein the second switching unit is controlled based on a detection result of the temperature detection unit and the gas is injected to cool the electronic component in a state where the service path and the path communicate with each other. Electronic component transfer device. The first hand has a first heating unit that heats the electronic component sucked by the first suction hole and a second heating unit that heats the electronic component sucked by the second suction hole,
5. The electronic component transport device according to claim 4 , wherein the second hand includes a third heating unit that heats the electronic component sucked by the third suction hole. A control unit;
A first electrical path and a second electrical path connected to the control unit;
When using the first hand, the first heating unit and the first electrical path are electrically connected, and the second heating unit and the second electrical path are electrically connected,
Wherein in the case of using the second hand, the with the third heating section and the first electrical path is electrically connected to claim 5 and wherein the second switching unit the second electric path are electrically connected The electronic component conveying apparatus as described. An electrical path for a first hand that electrically connects the second electrical path and the second heating unit when using the first hand;
A second hand electrical path for electrically connecting the second electrical path and the second switching unit when the second hand is used;
An electrical path switching unit that switches between a state in which the second electrical path and the second heating unit are electrically connected and a state in which the second electrical path and the second switching unit are electrically connected. Item 7. The electronic component carrying device according to Item 6 . Base and
A hand support unit that movably supports the first hand and the second hand with respect to the base;
The service path has flexibility, and an end connected to the second suction hole or the injection unit is fixedly provided on the base, and is connected to the second suction path or the path. The electronic component carrying device according to any one of claims 1 to 7 , wherein an end portion to be mounted is fixedly provided on the hand support portion and is bent so as to allow movement of the base. . A gas suction part;
A gas supply unit;
A first adsorption path connected to the gas suction unit and the gas supply unit;
A second adsorption path connected to the gas suction part and the gas supply part and arranged independently of the first adsorption path;
A path connected to the gas supply unit;
An inspection unit for inspecting the electronic component,
When using a first hand having a first suction hole and a second suction hole for sucking an electronic component, the first suction hole and the first suction path are connected, and the second suction hole The second adsorption path is connected,
When using a second hand having a third suction hole for sucking an electronic component and a jet part for jetting gas, the third suction hole and the first suction path are connected, and the jet part Connected to the path ,
A service path communicating with the second suction hole when the first hand is used, and a communication path communicating with the injection unit when the second hand is used;
An electronic component inspection apparatus comprising: a switching unit that switches between a state where the service path and the second suction path communicate with each other and a state where the service path and the path communicate with each other . A first hand having a first suction hole and a second suction hole for sucking an electronic component;
A gas suction part for sucking gas from the first suction hole and the second suction hole;
A gas supply unit for supplying gas to the first adsorption hole and the second adsorption hole;
A first adsorption path connecting the gas suction part and the gas supply part with the first adsorption hole;
In the electronic component transport apparatus having the second suction path, which connects the gas suction part and the gas supply part and the second suction hole, and is disposed independently of the first suction path,
A cooling system used when the first hand is used by replacing it with a second hand having a third suction hole for sucking an electronic component and a jet part for jetting gas,
A path communicating the gas supply unit and the second adsorption path;
A switching unit,
By installing the path, the first hand or the part on the second hand side from the connection part of the second suction path with the path is used as the second suction path and the service path of the path. ,
The cooling system, wherein the switching unit can switch between a state in which the second adsorption route and the service route are connected and a state in which the route and the service route are connected. The electronic component conveying apparatus is
A first heating unit that is provided in the first hand and heats the electronic component adsorbed by the first adsorption hole; and a second heating unit that heats the electronic component adsorbed by the second adsorption hole;
A control unit for controlling driving of the first heating unit and the second heating unit;
A first electrical path that electrically connects the control unit and the first heating unit;
A second electrical path that electrically connects the control unit and the second heating unit,
The second hand is
The cooling system according to claim 10 , further comprising a third heating unit that heats the electronic component sucked by the third suction hole. An electrical path for a switching unit that electrically connects the second electrical path and the switching unit;
An electrical path switching unit that switches electrical paths,
By installing the switching unit electrical path, the second electrical path and the switching unit electrical path are connected to a portion of the second electrical path that is closer to the control unit than the connection unit with the switching unit electrical path. And in-service electrical route
The cooling according to claim 11 , wherein the electrical path switching unit switches between a state where the service electrical path and the second electrical path are conducted and a state where the service electrical path and the switch electrical path are conducted. system. Further have a second hand,
The cooling system according to any one of claims 10 to 12 , wherein the second hand is used in exchange for the first hand .

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