JP6239997B2 - Cooler - Google Patents

Description

  The present invention relates to a cooler.

  Conventionally, a flat water-cooled plate has been used to radiate heat from a semiconductor module containing a semiconductor element for controlling electric power equipment. In recent years, heating elements have been arranged on both sides of a flat water-cooled plate in order to increase mounting efficiency. At that time, if the heat generation density or allowable temperature of the elements on both sides are different, a temperature difference will occur between one side and the other side of the water cooling plate, and the opposite side (temperature The heat from the high surface was transmitted. For this reason, the flow path of the flat water-cooled plate is made into two layers, and the flow path which has the cooling performance without the excess and deficiency which met the conditions of the element of both surfaces of a water-cooling plate has been provided. By doing so, the surface on which the semiconductor element having a high allowable temperature is provided can have high cooling performance, and the manufacturing cost can be reduced and labor can be saved.

  However, even if the above-mentioned two-layer structure is provided and a flow path suitable for each surface is provided, a temperature difference may still occur between both surfaces due to a difference in heat generation density or allowable temperature. Then, heat is transferred from the higher temperature side to the lower temperature side, the temperature of the cooling water flowing in the flow path on the lower temperature side is increased, and the temperature of the semiconductor module on the lower allowable temperature side is increased. There was a case.

  In order to improve the way in which the temperature is transmitted between the elements, Patent Documents 1 and 2 have been proposed.

  Patent Document 1 describes a method of shifting so that the arrangement of elements does not overlap, but it has been difficult to apply to a cooler in which the arrangement of elements cannot be changed. Moreover, the method of patent document 1 is an apparatus relevant to natural air cooling, and does not solve the temperature rise of the cooling medium in the flow path.

  In addition, in the radiator of Patent Document 2, it is not a structure in which elements are arranged on both sides of a flat water-cooled plate, but a radiator is required for each element with a different amount of heat generation, so it is difficult to increase the mounting efficiency. Therefore, it has been difficult to cool a large number of heating elements.

JP 2000-124400 A JP 2012-28714 A

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a cooler having high cooling efficiency and space saving.

In order to achieve the above object, a cooler according to the present invention includes:
A lid member;
A first flow path section;
A second flow path section;
With
A first heating element is provided on the outer surface of the lid member, and a second heating element is provided on the outer surface of the second flow path part,
The use temperature of the first heating element is different from the use temperature of the second heating element,
A heat insulating layer was provided between the first flow path part and the second flow path part,
It is characterized by that.

  The heat insulating layer may be a space containing a gas.

The thermal insulation layer comprises a plurality of openings;
The plurality of openings may communicate with each other through the space.

  A wax reservoir may be provided at the outer edge of the heat insulating layer.

  Aluminum fibers may be provided in the wax reservoir.

  A groove may be provided in the wax reservoir.

  According to the present invention, it is possible to provide a cooler having high cooling efficiency and space saving.

It is a perspective view showing typically the appearance shape of a cooler concerning an embodiment of the present invention. It is sectional drawing which shows typically the internal structure of the cooler which concerns on embodiment of this invention, and how to transmit heat. It is a disassembled perspective view which shows typically the internal structure of the cooler provided with the flow path based on embodiment of this invention. It is a disassembled perspective view which shows typically the internal structure of the cooler provided with the flow path provided with the inner fin based on the modification of this invention. It is a top view which shows typically the structure of the intermediate | middle heat insulation layer member provided with the wax reservoir part based on the modification of this invention. It is a top view which shows typically the structure of the intermediate | middle heat insulation layer member by which the aluminum fiber is arrange | positioned at the wax reservoir part based on the modification of this invention. It is a top view which shows typically the structure of the intermediate | middle heat insulation layer member by which the thin groove | channel is arrange | positioned at the wax reservoir part based on the modification of this invention.

  Hereinafter, a cooler according to an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view schematically showing the outer shape of a cooler 100 according to an embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing the internal structure of the cooler 100 according to the embodiment of the present invention. As shown in FIG. 1, the cooler 100 includes a lid member 1, a cooling medium inlet 2, a cooling medium outlet 3, and an opening 4. The external dimensions of the cooler 100 are appropriately selected within the scope of the effects of the present invention, and are not limited to the following. For example, a thickness of 30 mm to 50 mm × width of 200 mm to 300 mm × length of 500 mm to 600 mm is used. It is done. The opening 4 is provided so as to penetrate the depth direction of the cooler 100 (the opening on the depth side is not shown). In the embodiment of the present invention, for example, water, antifreeze, or the like is used as the cooling medium. As shown in FIG. 2, in the flat cooler 100, the outer surface of the lid member 1 (the upper surface of the lid member 1 in FIG. 2) and the outer surface of the second flow path portion 11 (the second in FIG. 2). Heating elements (semiconductor module 5, high-temperature semiconductor module 6 (second heating element), and low-temperature semiconductor module 7 (first heating element)) having different use temperatures are provided on the lower surface of the flow path portion 11. In the embodiment of the present invention, the use temperature of the high temperature semiconductor module 6 is higher than the use temperature of the semiconductor module, and the use temperature of the semiconductor module 5 is higher than the use temperature of the low temperature semiconductor module 7. The dimensions of the semiconductor module 5, the high-temperature semiconductor module 6 and the low-temperature semiconductor module 7 are appropriately selected within the scope of the effects of the present invention, and are not limited to the following, but are, for example, 130 to 150 mm wide × 185 to 195 mm long Etc. are used. Further, the operating temperatures of the semiconductor module 5, the high temperature semiconductor module 6 and the low temperature semiconductor module 7 are appropriately selected within the range where the effects of the present invention are exerted, and are not limited to the following. 75-85 degreeC, 25-35 degreeC, etc. are used. In addition, the cooler 100 includes a two-layered flow path section (first flow path section 9 and second flow path section 11), and the first flow path section 9 and the second flow path section 11 In between, the heat insulation layer 12 arrange | positioned in the intermediate | middle heat insulation layer member 10 is provided. The heat insulation layer 12 is a hollow space having an air layer separated from the first flow path portion 9 and the second flow path portion 11. Moreover, in parts other than the heat insulation layer 12, the 1st flow path part 9 and the 2nd flow path part 11 are thermally joined via the solid-shaped part of the intermediate | middle heat insulation layer member 10. FIG. Note that the outer surface (the lower surface in FIG. 2) of the second flow path portion 11 serves as a lid of the cooler 100.

  The lid member 1, the inlet 2, the outlet 3, the first flow path portion 9, the intermediate heat insulation layer member 10, and the second flow path portion 11 are each made of, for example, an aluminum alloy such as JIS A1050 alloy, copper, stainless steel, etc. Formed of a material having high thermal conductivity.

  FIG. 3 is an exploded perspective view schematically showing the internal structure of the cooler 100 including the flow path 15 according to the embodiment of the present invention. In FIG. 3 and FIG. 4 to be described later, the semiconductor module 5, the high temperature semiconductor module 6, and the low temperature semiconductor module 7 are not shown for simplification of the drawing. As shown in FIG. 3, the first flow path portion 9 includes a flow path 15 and a hole 30 therein, and the second flow path portion 11 includes a flow path 15 therein, Hole 30. The dimensions of the first flow path portion 9 and the second flow path portion 11 are appropriately selected within the range where the effects of the present invention are exhibited, and are not limited to the following, but are, for example, 10 to 20 mm thick × 200 width 200 ˜300 mm × length 500 to 600 mm are adopted. In addition, an inlet 2 and an outlet 3 are provided below the second flow path portion 11 and connected to the hole 30. The flow path 15 and the hole 30 have a function of allowing the cooling medium flowing in from the inlet 2 to flow out of the outlet 3 after flowing through the inside of the cooler 100. Examples of the method for forming the flow path 15 in the first flow path section 9 and the second flow path section 11 include a method of machining a rolled plate by cutting, a method of forming by forging, die casting, or the like. However, it is not limited to these methods. Further, the width and height of the flow path 15 are appropriately selected within the range where the effects of the present invention are exhibited. For example, the flow path 15 may be a narrow groove having a width of about 1 to 2 mm, or has a medium width of about 5 mm. It may be a groove or the like.

  Moreover, as shown in FIG. 3, the intermediate | middle heat insulation layer member 10 is equipped with the heat insulation layer 12, the hole 30, and the some opening part 4 in the inside. As described above, the heat insulating layer 12 is a space having an air layer separated from the first flow path portion 9 and the second flow path portion 11. The plurality of openings 4 are provided so as to penetrate through the space inside the heat insulation layer 12 made of an air layer (that is, so as to penetrate the space inside the heat insulation layer 12 in the depth direction in FIG. 2). In addition, it has the effect of facilitating the discharge of the warmed air inside the heat insulating layer 12 to the outside of the cooler 100 and maintaining the heat insulating effect by the heat insulating layer 12. The dimensions and the number of the openings 4 are appropriately selected within the range having the effects of the present invention. For example, the depth is 1 to 3 mm, the width is 5 to 15 mm, and the length is 20 to 40 mm. In FIG. 3 and FIG. 4 described later, the number of the openings 4 is two, but may be three, four, or more. Further, the opening 4 may not be provided.

  Hereinafter, the manufacturing method (assembly method) of the cooler 100 will be described. The manufacturing method (assembly method) of the cooler 100 is appropriately selected within the scope of the effects of the present invention, and is not limited to the following. For example, an NB (Nocolok Blazing) brazing method or the like can be used. Hereinafter, a method for manufacturing the cooler 100 using the NB brazing method will be described.

  First, the lid member 1 is created by, for example, rolling. Moreover, the 1st flow-path part 9 and the 2nd flow-path part 11 are produced by the method of machining by a cutting etc. from a rolled plate, the method of forming by forging, die-casting, etc. as mentioned above. Further, the intermediate heat insulating layer member 10 is also formed by, for example, a method of machining from a rolled plate by cutting or the like, a method of forming by forging, die casting or the like, like the first flow path portion 9 and the second flow path portion 11. create. Further, the inlet 2 and the outlet 3 for the cooling medium are created by a method of forming by cutting, forging, die casting or the like, for example.

  Next, in order from the bottom, the second flow path part 11, the intermediate heat insulation layer member 10, the first flow path part 9, and the lid member 1 are laminated, and the inlet 2 and the second flow path part 11 are An outlet 3 is provided. When laminating, for example, a brazing sheet coated with a flux such as a fluorine-based compound is disposed between these constituent members. Moreover, when laminating | stacking, each position is adjusted so that a cooling medium may pass the inflow port 2, the outflow port 3, and the hole 30. FIG. The material and dimensions of the brazing sheet are appropriately selected within the scope of the effects of the present invention, and are not limited to the following. For example, the brazing sheet has a thickness of 0.1 mm to 0.2 mm and can be brazed. A material obtained by cladding 10% of JIS A4045 alloy on both sides of the core material of A1000 alloy or JIS A3000 alloy is used. In addition, the brazing material for joining is appropriately selected within the scope of the effects of the present invention, and is not limited to the brazing sheet, but may be paste wax (for example, a mixture of powder brazing material, binder, and flux). .

  Next, the above-described component members stacked are heated in a brazing furnace heated to a temperature of, for example, 580 ° C. or more and 630 ° C. or less in a nitrogen atmosphere environment, for example, and held for 1 minute or more and 5 minutes or less, The brazing material of the brazing sheet is melted and the above-described components are joined together.

  The cooler 100 is manufactured through the above steps.

  As described above, by manufacturing the cooler 100 using the brazing method, the above-described constituent members can be joined together in an inexpensive and efficient manner so that the cooling medium does not leak. In addition, since surface bonding is used in the manufacturing process of the cooler 100, sufficient strength is obtained for bonding between the constituent members, and a fillet is not necessarily required at the bonding portion, and the amount of brazing material necessary for bonding is reduced. can do.

  Hereinafter, effects of the structure of the cooler 100 will be described.

  In the conventional cooler, for example, when the temperature of the semiconductor module on the high temperature side is 80 ° C. and the temperature of the semiconductor module on the low temperature side is 30 ° C., the temperature on both sides is not uniform, Heat may be transferred between one surface of the cooler and the other surface so that the temperature rises to, for example, 50 ° C. and the temperature on the high temperature side decreases to, for example, 60 ° C. It was. In addition, the structure of the cooler to suppress such heat transfer requires mounting the elements such as semiconductor modules, or requires a radiator for each element that generates a different amount of heat. It is difficult to increase the temperature and it is difficult to cool a large number of heating elements.

  On the other hand, as shown in FIG. 2, the cooler 100 is adiabatic between a two-layer flow path composed of the flow path 15 of the first flow path section 9 and the flow path 15 of the second flow path section 11. The intermediate heat insulation layer member 10 provided with the layer 12 is provided. Therefore, the cooler 100 includes a heat insulating layer 12 composed of a space at a location where heat insulation is desired at a substantially central portion in the thickness direction of the flat plate cooler 100, and the first flow path portion 9 and the air flow inside the heat insulating layer 12. By insulating heat from the second flow path portion 11, the high temperature semiconductor module 6 is cooled by the second flow path portion 11 without providing a special member, and the low temperature semiconductor module 7 is moved to the first flow path. Each part 9 can be cooled. That is, the cooler 100 has a flat plate member (intermediate heat insulating layer member 10) in which only a portion to be insulated is thinly sandwiched between the first flow path portion 9 and the second flow path portion 11, so Heat transfer in the direction indicated by the arrow 14 in FIG. 2 can be suppressed between the first flow paths (the flow path 15 of the first flow path section 9 and the flow path 15 of the second flow path section 11). .

  In addition, the cooler 100 includes the heat insulating layer 12 in the substantially central portion in the plate thickness direction, so that even when a portion that wants to transfer heat and a portion that wants to transfer heat are mixed in the plane of the cooler 100, Desired heat insulation and heat transfer effects can be obtained. That is, as shown in FIG. 2, the heat insulating layer 12 is not provided at the place where the normal temperature semiconductor module 5 is arranged, and the heat insulating layer 12 is provided at the place where the high temperature semiconductor module 6 and the low temperature semiconductor module 7 are arranged. Therefore, heat can be transferred in the direction of the arrow 14 at the place where the semiconductor module 5 is arranged, and heat transfer in the direction of the arrow 14 is suppressed at the place where the high temperature semiconductor module 6 and the low temperature semiconductor module 7 are arranged. be able to.

  As described above, according to the embodiment of the present invention, even when a plurality of heating elements (for example, power semiconductor modules) having different operating temperatures are arranged on both surfaces, the power is transmitted from the opposite surface. The cooler 100 can be efficiently cooled without increasing the temperature due to heat, and has excellent mounting efficiency. That is, according to the embodiment of the present invention, it is possible to realize the cooler 100 that can cope with an increase in the amount of heat generated from the element and that can save space.

  The present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the embodiment of the present invention, the form using water or antifreeze as the cooling medium has been described, but a gas such as air or carbon dioxide may be used.

  Moreover, in the said embodiment, although the form which heat-insulates by the space of the heat insulation layer 12 containing air was demonstrated, you may heat-insulate other than air and is suitably selected in the range with the effect of this invention, and is as follows. Although it is not limited, for example, it may be insulated with a gas such as oxygen or carbon dioxide, or a plastic insulation such as polystyrene foam or a mineral insulation such as glass wool is filled in the space. You may insulate. Moreover, in the said embodiment, although the form which the opening part 4 penetrated through the space was demonstrated, the heat insulation layer 12 has a heat insulation effect also in the form where the opening part 4 does not penetrate through the space. The cooler 100 can achieve the effects of the present invention.

  Further, as shown in FIG. 4, the third flow path portion 17 (high temperature side) and the fourth flow path portion 18 (low temperature side) of the cooler 110 are provided with inner fins 16 in the flow path portion through which the cooling medium passes. You may have. By providing the inner fins 16, the heat transfer performance inside the third flow path portion 17 and the fourth flow path portion 18 when the cooling medium passes through the inside of the cooler 110 can be improved. Examples of a method for forming the space 19 (high temperature side) and the space 20 (low temperature side) in which the inner fin 16 is provided include a method of machining from a rolled plate by cutting, a method of forming by forging, die casting, and the like. It is not limited to these methods. Further, examples of the fins used for the inner fins 16 include corrugated fins, comb fins by extrusion, and pin fins by forging, but are not limited thereto.

  Further, as shown in FIG. 5, a wax reservoir 21 may be provided on the outer edge portion of the heat insulating layer 12 of the intermediate heat insulating layer member 10. By doing so, it is possible to suppress the portion of the heat insulating layer 12 and the opening 4 from being clogged with the molten excessive wax, and the cooling efficiency of the cooler can be further enhanced.

  In addition, as shown in FIG. 6, aluminum fibers 22 having a length of, for example, several tens to several hundreds of μm may be provided in the brazing reservoir portion 21 of the intermediate heat insulation layer member 10 so that the melted wax tends to accumulate. In this way, when the molten excessive wax is generated, the aluminum fiber 22 is adsorbed by the capillary phenomenon, so that the heat insulating layer 12 and the opening 4 are further prevented from being blocked by the excessive wax. The cooling efficiency of the cooler can be further increased.

  Further, as shown in FIG. 7, for example, a large number of fine grooves 23 having a groove width of 1 to 3 mm and a length of 10 mm are formed so that excessive wax can be easily accumulated in the wax accumulation portion 21 of the intermediate heat insulating layer member 10. It may be provided. In this way, when a molten excess wax is generated, the wax is adsorbed to the fine groove portion by capillary action, so that the heat insulating layer 12 and the opening 4 are further blocked by the excess wax. Therefore, the cooling efficiency of the cooler can be further increased.

  Moreover, in the said embodiment, although the form which the some opening part 4 penetrated was demonstrated, the connection form of the some opening part 4 is not limited to penetration, For example, the some opening part 4 connects. Thus, the heat inside the heat insulating layer 12 may be discharged out of the cooler.

DESCRIPTION OF SYMBOLS 1 Lid member 2 Inlet 3 Outlet 4 Opening part 5 Semiconductor module 6 High temperature semiconductor module 7 Low temperature semiconductor module 9 First flow path part 10 Intermediate heat insulation layer member 11 Second flow path part 12 Heat insulation layer 14 Heat by heat transfer Movement direction 15 Flow path 16 Inner fin 17 Third flow path portion 18 Fourth flow path portion 19 Space 20 Space 21 Wax pool portion 22 Aluminum fiber 23 Fine groove 30 Hole 100 Cooler 110 Cooler

Claims (6)

A lid member;
A first flow path section;
A second flow path section;
With
A first heating element is provided on the outer surface of the lid member, and a second heating element is provided on the outer surface of the second flow path part,
The use temperature of the first heating element is different from the use temperature of the second heating element,
A heat insulating layer was provided between the first flow path part and the second flow path part,
A cooler characterized by that. The heat insulating layer is a space containing gas,
The cooler according to claim 1. The thermal insulation layer comprises a plurality of openings;
The plurality of openings communicate with each other through the space;
The cooler according to claim 2. A wax reservoir is provided at the outer edge of the heat insulating layer,
The cooler according to any one of claims 1 to 3. Aluminum fibers are provided in the wax reservoir,
The cooler according to claim 4. A groove is provided in the wax reservoir,
The cooler according to claim 4.